WO2024070699A1 - Élément de couvercle et son procédé de fabrication - Google Patents

Élément de couvercle et son procédé de fabrication Download PDF

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Publication number
WO2024070699A1
WO2024070699A1 PCT/JP2023/033377 JP2023033377W WO2024070699A1 WO 2024070699 A1 WO2024070699 A1 WO 2024070699A1 JP 2023033377 W JP2023033377 W JP 2023033377W WO 2024070699 A1 WO2024070699 A1 WO 2024070699A1
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WO
WIPO (PCT)
Prior art keywords
protrusion
frame
lid member
frame portion
glass
Prior art date
Application number
PCT/JP2023/033377
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English (en)
Japanese (ja)
Inventor
亮太 間嶌
景 寺田
Original Assignee
日本電気硝子株式会社
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Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Publication of WO2024070699A1 publication Critical patent/WO2024070699A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass

Definitions

  • the present invention relates to a lid member for a package and a method for manufacturing the lid member.
  • Patent Document 1 discloses an airtight package that includes a base (substrate) on which a light-emitting element (LED element) is mounted, and a lid member (transparent body) that is fixed to the base so as to cover the light-emitting element.
  • a base substrate
  • a lid member transparent body
  • the lid member in this package has a plate-shaped frame portion (brim portion) and a dome-shaped protrusion portion (convex lid portion) that protrudes from the frame portion.
  • a first bonding pattern made of a metal layer is formed on the base.
  • a second bonding pattern made of a metal layer is formed on the frame of the lid member.
  • the lid member is joined to the base by joining the first bonding pattern and the second bonding pattern with solder. This hermetically seals the space for accommodating the light-emitting element formed between the base and the protruding portion of the lid member (see claim 1 in the same document).
  • One method for forming a metal layer as the second bonding pattern on the frame of the lid member is, for example, a film formation process using physical vapor deposition.
  • the cover member is formed, for example, by heating a flat glass plate (forming process).
  • forming process a portion of the glass plate is heated and softened to form a protrusion, and the remaining plate-like portion that surrounds the periphery of the protrusion becomes the frame.
  • metal particles may penetrate into the inside of the protrusion and adhere to the inner surface of the protrusion.
  • metal particles adhere to the inner surface of the protrusion the light extraction efficiency of the lid member decreases, which is undesirable.
  • the present invention was made in consideration of the above circumstances, and its technical objective is to prevent metal particles from adhering to the inner surface of the protruding portion of the lid member when a metal layer is formed on the lid member by physical vapor deposition.
  • the present invention is intended to solve the above problems, and is a method for manufacturing a glass lid member used in a package including a light-emitting element, the lid member having a plate-shaped frame and a protrusion protruding from the frame, and a molding process for forming the protrusion by sucking a part of the glass plate while the glass plate is fixed to a support base, the support base having a fixing part for fixing the frame, and the fixing part sucking the frame in the same direction as the part of the glass plate in the molding process.
  • the molding process causes warping of the frame of the lid member, which creates a gap between the frame and the masking member, allowing metal particles for forming the metal layer to penetrate into the protruding portion.
  • warping of the frame can be prevented by sucking the frame with the fixed portion of the support stand during the molding process. This allows the masking member to be in good contact with the frame. Therefore, when a metal layer is formed on the lid member by physical vapor deposition, it is possible to prevent metal particles from adhering to the inner surface of the protruding portion of the lid member.
  • the suction of the portion of the glass sheet and the suction of the frame portion by the fixing portion may be performed by a common suction device. This can simplify the device configuration for carrying out this method.
  • the suction of the portion of the glass sheet and the suction of the frame by the fixing part may be performed simultaneously. This allows the forming step to be performed efficiently.
  • the protrusion and the frame may be formed by heating the glass plate.
  • the support base may have a plurality of spaces for forming a plurality of the protrusions on the glass sheet, the plurality of spaces being arranged in multiple rows and columns
  • the fixing portion may have a plurality of suction portions for sucking the glass sheet, and the plurality of suction portions may be arranged in multiple rows and columns to correspond to the plurality of spaces.
  • This configuration allows multiple protrusions to be efficiently formed on the glass sheet.
  • the present invention is directed to solving the above problems, and is a method for manufacturing a glass lid member used in a package including a light-emitting element, the lid member comprising a plate-shaped frame portion and a protrusion portion protruding from the frame portion, the protrusion portion having an inner surface and an outer surface, the frame portion having a first main surface connected to the inner surface of the protrusion portion and a second main surface connected to the outer surface of the protrusion portion, the method comprising: a forming step of forming the protrusion portion by sucking a part of the glass plate while the glass plate is fixed to a support; a processing step of processing the frame portion after the forming step; and a film-forming step of forming a metal layer on the frame portion by physical vapor deposition after the processing step, the processing step being characterized in that a processing treatment is performed to flatten the first main surface of the frame portion.
  • the first main surface of the frame portion can be flattened in the processing process, making it possible to bring the masking member into contact with this first main surface without forming a gap between the first main surface and the masking member.
  • the processing step may involve physical polishing of the first main surface of the frame.
  • the processing step may be configured to press the frame against the grinding tool with a pressing member, and the pressing member may have a housing portion for housing the protruding portion. With this configuration, it is possible to prevent the pressing member from coming into contact with the protruding portion during the processing step.
  • the present invention is directed to solving the above problems, and is a glass lid member used for a package including a light-emitting element, the lid member having a plate-shaped frame and a protrusion protruding from the frame, the protrusion having an inner surface and an outer surface, the frame having a first main surface connected to the inner surface of the protrusion and a second main surface connected to the outer surface of the protrusion, and the first main surface having a polished surface.
  • the masking member can be brought into contact with the polished surface without any gaps. This makes it possible to prevent metal particles from adhering to the inner surface of the protruding portion of the lid member when forming a metal layer on the lid member by physical vapor deposition.
  • the present invention is directed to solving the above problems, and is a glass lid member used for a package including a light-emitting element, the lid member having a plate-shaped frame and a protrusion protruding from the frame, the protrusion having a top and a base integrally formed with the frame, and the frame being thinner than the base.
  • the protrusion may have a top, and the top of the protrusion may be thinner than the frame. This can improve the light extraction efficiency of the lid member used in the package.
  • the frame portion may be thicker than the top of the protrusion.
  • the present invention when a metal layer is formed on a lid member by physical vapor deposition, it is possible to prevent metal particles from adhering to the inner surface of the protruding portion of the lid member.
  • FIG. FIG. FIG. FIG. FIG. FIG. FIG. FIG. FIG. 4A to 4C are cross-sectional views showing a preparation step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a preparation step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a film forming step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a film forming step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a film forming step in the method of manufacturing the package.
  • 11 is a cross-sectional view showing a state in which contact between the cover member and the masking member is poor.
  • FIG. 4A to 4C are cross-sectional views showing a bonding step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a bonding step in the method of manufacturing the package.
  • 1 is a cross-sectional view showing a glass substrate for manufacturing a lid member for a package.
  • FIG. 11 is a cross-sectional view showing another example of the cover member.
  • FIG. 11 is a cross-sectional view showing another example of the cover member.
  • FIG. 11 is a plan view showing another example of the cover member.
  • FIG. 19 is a plan view showing a molding device for molding the lid member shown in FIG. 18 .
  • FIG. 11 is a plan view showing another example of the cover member.
  • FIG. 11 is a bottom view showing another example of the lid member.
  • FIG. 11 is a cross-sectional view showing another example of a package.
  • FIG. 11 is a cross-sectional view showing another example of the cover member.
  • FIG. 11 is a cross-sectional view showing another example of a package.
  • FIG. 11A and 11B are cross-sectional views showing another example of a preparation step in the method of manufacturing a package.
  • 4A to 4C are cross-sectional views showing a preparation step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a preparation step in the method of manufacturing the package.
  • 4A to 4C are cross-sectional views showing a preparation step in the method of manufacturing the package.
  • FIG. 11A and 11B are cross-sectional views showing another example of a preparation step in the method of manufacturing a package.
  • 4A to 4C are cross-sectional views showing a preparation step in the method of manufacturing the package.
  • 1A to 1C are cross-sectional views showing a processing step in a preparation step of a method of manufacturing a package.
  • 4A to 4C are cross-sectional views showing a film forming step in the method of manufacturing the package.
  • Figures 1 to 15 show one embodiment of a package with a lid member according to the present invention and a method for manufacturing the package.
  • the package 1 includes a base 2, a light-emitting element 3 supported by the base 2, a lid member 4 that covers the base 2 and the light-emitting element 3, and a sealing portion 5 that hermetically bonds the base 2 and the lid member 4.
  • Figures 3 and 4 show the base 2 before the lid member 4 is bonded.
  • the base 2 has a first main surface 2a that supports the light-emitting element 3, a second main surface 2b located on the opposite side of the first main surface 2a, and a metal layer 6 formed on the first main surface 2a.
  • Examples of materials for the substrate 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics made by mixing and sintering these ceramics with glass powder, and alloys such as Fe-Ni-Co alloys, Cu-W alloys, and Kovar (registered trademark).
  • ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride
  • glass ceramics made by mixing and sintering these ceramics with glass powder
  • alloys such as Fe-Ni-Co alloys, Cu-W alloys, and Kovar (registered trademark).
  • the metal layer 6 has a frame shape that surrounds the light-emitting element 3.
  • the metal layer 6 is rectangular in shape, but is not limited to this shape.
  • the metal layer 6 may be configured, for example, in a circular shape so as to surround the light-emitting element 3.
  • the metal layer 6 includes three layers, which are, in order from the first principal surface 2a side, a base layer, an intermediate layer, and a surface layer.
  • metals used in the base layer include Cr, Ta, W, Ti, Mo, Ni, Pt, etc.
  • metals used in the intermediate layer include Ni, Pt, Pd, etc.
  • metals used in the surface layer include Au, Sn, Ag, Ni, Pt, etc.
  • the metal used in the metal layer 6 may be a single metal or an alloy.
  • Methods for forming the metal layer 6 on the first main surface 2a of the substrate 2 include, for example, film formation methods such as sputtering, vacuum deposition, ion-assisted or ion-plating vacuum deposition, and CVD.
  • the light-emitting element 3 is fixed to the first main surface 2a of the base 2.
  • the package 1 uses an ultraviolet irradiating LED as the light-emitting element 3, but the light-emitting element 3 according to the present invention is not limited to this embodiment, and an infrared LED or a visible light LED can also be used.
  • Figures 5 and 6 show the lid member 4 before it is bonded to the base 2.
  • the lid member 4 is manufactured by molding a portion of a plate glass.
  • the glass used for the lid member 4 is preferably non-alkali glass, borosilicate glass, aluminosilicate glass, quartz glass, or crystallized glass.
  • Non-alkali glass, borosilicate glass, or aluminosilicate glass can achieve both high transmittance and high workability during molding.
  • Quartz glass can have a significantly high transmittance in the ultraviolet range while maintaining workability during molding.
  • Crystallized glass can achieve both high transmittance and high breaking strength.
  • the glass when the glass is borosilicate glass, aluminosilicate glass, or alkali-free glass, the glass composition preferably contains, in mass %, SiO2 : 50-75%, Al2O3 : 1-25%, B2O3 : 1-30%, Li2O + Na2O + K2O : 0-20%, and MgO+CaO+SrO+BaO: 0-20%. Glasses whose composition falls within the above composition ranges fall under these glass types.
  • the glass composition preferably contains, in mass %, SiO2 : 60-80 % , Al2O3 : 3-30%, Li2O + Na2O + K2O : 1-20%, MgO+CaO+SrO+BaO: 5-20%, and is a low-thermal expansion crystallized glass in which ⁇ -quartz solid solution or ⁇ -spodumene precipitates as crystals from inside the glass.
  • low thermal expansion refers to a thermal expansion coefficient value of -10 ⁇ 10-7 to 20 ⁇ 10-7 /°C in the temperature range of 30 to 300°C.
  • the cover member 4 includes a plate-shaped frame portion 7, a dome-shaped protrusion portion 8 protruding from the frame portion 7, and a connecting portion 9 connecting the frame portion 7 and the protrusion portion 8.
  • the cover member 4 can also include a first anti-reflection film 10a and a second anti-reflection film 10b.
  • the frame portion 7 has, for example, a certain thickness, but is not limited to this embodiment.
  • the thickness of the frame portion 7 is, for example, 0.2 mm or more and 2 mm or less.
  • the frame portion 7 has a first main surface 7a and a second main surface 7b located opposite the first main surface 7a.
  • the surface roughness (arithmetic mean roughness) Ra of the first main surface 7a is preferably 1 nm or less, more preferably 0.5 nm or less, and even more preferably 0.3 nm or less.
  • the surface roughness Ra of the second main surface 7b is preferably 1 nm or less, more preferably 0.5 nm or less, and even more preferably 0.3 nm or less.
  • the protrusion 8 is for forming a storage space for the light-emitting element 3 together with the first main surface 2a of the base 2.
  • the protrusion 8 is formed at the center of the frame 7, but is not limited to this form.
  • the protrusion 8 has an inner surface 8a configured as a concave curved surface, an outer surface 8b configured as a convex curved surface, and an opening 8c formed on the inner surface 8a side.
  • the protrusion 8 also has a base 11, a midway portion 12, and a top 13.
  • the base 11 is configured integrally with the connecting portion 9.
  • the midway portion 12 is located between the base 11 and the top 13.
  • the base 11 is defined as a portion where a normal line (hereinafter referred to as a "first line”) L1 to the top 13 is drawn, and a straight line (hereinafter referred to as a "second line”) L2 drawn along the second main surface 7b of the frame 7 is drawn from an intersection P1 between the first line L1 and a straight line (hereinafter referred to as a "second line”) L2 that forms an angle of 5° with the second line L2, and where this third line L3 intersects with the protrusion 8.
  • first line a normal line
  • second line straight line
  • the portion where the third line L3 intersects with the inner surface 8a of the protrusion 8 is defined as a first base 11a, and the portion where the third line L3 intersects with the outer surface 8b of the protrusion 8 is defined as a second base 11b.
  • the midsection 12 is the portion where a straight line L7 (hereinafter referred to as the "seventh line") L7 that forms an angle of 60° with the second line L2 intersects with the protruding portion 8 when the seventh line L7 is drawn from the intersection P1 between the first line L1 and the second line L2.
  • a straight line L7 hereinafter referred to as the "seventh line” L7 that forms an angle of 60° with the second line L2 intersects with the protruding portion 8 when the seventh line L7 is drawn from the intersection P1 between the first line L1 and the second line L2.
  • the distance from the intersection point P2 between the first line L1 and the inner surface 8a of the protrusion 8 to the intersection point P1 is referred to as the protrusion height of the protrusion 8 and is indicated by the symbol H.
  • the protrusion height H of the protrusion 8 is, for example, 0.5 mm or more and 80 mm or less.
  • the outer diameter D of the protrusion 8 is the diameter of a circle made up of points at the position of the second base 11b, and is, for example, 2 mm or more and 150 mm or less. As shown in FIG. 5, the thickness of the protrusion 8 gradually decreases from the base 11 toward the top 13. Therefore, the thickness Tmin of the top 13 is thinner than the thickness Tmax of the base 11. Furthermore, the thickness Tmax of the top 13 is thinner than the thickness of the frame 7.
  • the thickness Tmax of the base 11 is, for example, 0.19 mm or more and 1.9 mm or less.
  • the thickness Tmin of the top 13 is, for example, 0.15 mm or more and 1 mm or less.
  • the ratio Tmin/Tmax of the thickness Tmax of the base 11 to the thickness Tmin of the top 13 is preferably 0.08 or more and 0.9 or less, more preferably 0.1 or more and 0.8 or less, and even more preferably 0.2 or more and 0.5 or less.
  • the protrusion 8 protrudes from the frame 7 at a predetermined protrusion angle ⁇ .
  • the protrusion angle ⁇ is defined as follows:
  • first reference point RP1 The intersection of the second line L2 and the inner surface 8a of the protrusion 8 is defined as the first reference point RP1.
  • first line L1 a straight line (hereinafter referred to as the "fourth line") L4 parallel to the second line L2 is drawn from point P3, which is at a height position half (H/2) of the protrusion height H, and the intersection of this fourth line L4 and the inner surface 8a of the protrusion 8 is defined as the second reference point RP2.
  • the protrusion angle ⁇ is preferably 40° or more, 45° or more, 50° or more, 60° or more, and preferably 90° or less, 85° or less, 80° or less.
  • the inner surface 8a and outer surface 8b of the protrusion 8 are configured as continuous curved surfaces from the base 11 to the top 13.
  • the surface roughness Ra of the inner surface 8a is preferably 1 nm or less, more preferably 0.5 nm or less, and even more preferably 0.3 nm or less.
  • the surface roughness Ra of the outer surface 8b is preferably 1 nm or less, more preferably 0.5 nm or less, and even more preferably 0.3 nm or less.
  • the opening 8c of the protrusion 8 is for inserting the light-emitting element 3 provided on the base 2 into the inside of the protrusion 8 when the cover member 4 is fixed to the base 2.
  • the opening 8c of the protrusion 8 is configured in a circular shape, but is not limited to this shape.
  • the opening length L of the opening 8c (the diameter of the opening 8c in this embodiment) is, for example, 1.5 mm or more and 80 mm or less.
  • the ratio L/H of the opening length L of the opening 8c to the protruding height H of the protruding portion 8 is preferably 1.6 or more, 2.1 or more, and preferably 5 or less, 3 or less.
  • the connecting portion 9 has a curved shape in order to connect the base 11 and the frame portion 7.
  • the connecting portion 9 has a first curved surface 9a that connects the first main surface 7a of the frame portion 7 and the inner surface 8a of the protruding portion 8, and a second curved surface 9b that connects the outer surface 8b of the protruding portion 8 and the second main surface 7b of the frame portion 7.
  • the radius of curvature of the first curved surface 9a is larger than the radius of curvature of the second curved surface 9b.
  • the radius of curvature of the first curved surface 9a is preferably 0.5 mm or more, 1 mm or more, and preferably 5 mm or less, 4 mm or less.
  • the radius of curvature of the second curved surface 9b is preferably 0.5 mm or more, 1.0 mm or more, and preferably 5 mm or less, 4 mm or less.
  • the surface roughness Ra of the first curved surface 9a is preferably 1 nm or less, more preferably 0.5 nm or less, and even more preferably 0.3 nm or less.
  • the surface roughness Ra of the second curved surface 9b is preferably 1 nm or less, more preferably 0.5 nm or less, and even more preferably 0.3 nm or less.
  • the first antireflection film 10a is formed on the inner surface 8a of the protrusion 8 and the first main surface 7a of the frame portion 7.
  • the first antireflection film 10a preferably has a multilayer film structure including, for example, a silicon oxide film (SiO 2 ) as a first film and a hafnium oxide film (HfO 2 ) as a second film alternately.
  • the portion 10a1 formed on the inner surface 8a of the protrusion 8 (hereinafter referred to as the "anti-reflection portion") is configured so that its thickness gradually decreases from the top 13 of the protrusion 8 toward the base 11.
  • the anti-reflection portion 10a1 is thickest at the portion formed at the top 13 and thinnest at the portion formed at the base 11.
  • the thickness of the first anti-reflection film 10a at the base 11 of the protrusion 8 is preferably 0.12 ⁇ m or more and 0.64 ⁇ m or less.
  • the thickness of the first anti-reflection film 10a at the midpoint 12 of the protrusion 8 is preferably 0.14 ⁇ m or more and 0.72 ⁇ m or less.
  • the thickness of the first anti-reflection film 10a at the top 13 of the protrusion 8 is preferably 0.15 ⁇ m or more and 0.8 ⁇ m or less.
  • the portion (hereinafter referred to as the "buffer portion") 10a2 formed on the first main surface 7a of the frame portion 7 has a constant film thickness.
  • the buffer portion 10a2 also has the function of mitigating the stress acting on the frame portion 7 when the lid member 4 is bonded to the base body 2.
  • the second anti-reflection film 10b is formed on the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame 7.
  • the second anti-reflection film 10b preferably has a multilayer structure including, for example, a silicon oxide film (SiO 2 ) as a first film and a hafnium oxide film (HfO 2 ) as a second film alternately.
  • the portion 10b1 formed on the outer surface 8b of the protrusion 8 (hereinafter referred to as the "anti-reflection portion") is configured so that its thickness gradually decreases from the top 13 toward the base 11.
  • the anti-reflection portion 10b1 is thickest at the portion formed at the top 13 and thinnest at the portion formed at the base 11.
  • the thickness of the second anti-reflection film 10b at the base 11 of the protrusion 8 is preferably 0.12 ⁇ m or more and 0.64 ⁇ m or less.
  • the thickness of the second anti-reflection film 10b at the midpoint 12 of the protrusion 8 is preferably 0.14 ⁇ m or more and 0.72 ⁇ m or less.
  • the thickness of the second anti-reflection film 10b at the top 13 of the protrusion 8 is preferably 0.15 ⁇ m or more and 0.8 ⁇ m or less.
  • the lid member 4 may deteriorate due to the external environment, resulting in a decrease in the light extraction efficiency.
  • a SiO 2 film or an Al 2 O 3 film instead of forming the second antireflection film 10b on the lid member 4, it is also possible to form a SiO 2 film or an Al 2 O 3 film as a weather-resistant film. It is also possible to form a SiO 2 film or an Al 2 O 3 film as a weather-resistant film by laminating it on the second antireflection film 10b.
  • the buffer section 10a2 of the first anti-reflection film 10a has a metal layer 14 and a joint section 15 formed therein.
  • the Young's modulus of the buffer section 10a2 is preferably 250 GPa or less, more preferably 200 GPa or less, even more preferably 150 GPa or less, and particularly preferably 100 GPa or less.
  • the thermal expansion coefficient of the frame section 7 is smaller than that of the joint section 15.
  • the thermal expansion coefficient of the frame section 7 is also smaller than that of the base 2.
  • the thickness of the buffer section 10a2 is preferably 0.1 ⁇ m or more, 0.2 ⁇ m or more, and preferably 1.0 ⁇ m or less, 0.8 ⁇ m or less.
  • the metal layer 14 is formed so as to overlap the buffer section 10a2.
  • the metal layer 14 is formed on the surface of the buffer section 10a2 opposite to the surface of the buffer section 10a2 that contacts the first main surface 7a of the frame section 7.
  • the metal layer 14 has a rectangular frame shape so as to correspond to the shape of the metal layer 6 of the base body 2.
  • the shape of the metal layer 14 is not limited to this embodiment.
  • the metal layer 14 may have a circular shape or various other frame shapes.
  • the metal layer 14 includes three layers, which are, in order from the buffer section 10a2 side, a base layer, an intermediate layer, and a surface layer.
  • Metals used in the underlayer include, for example, Cr, Ta, W, Ti, Mo, Ni, Pt, etc. When Cr is used in the underlayer, the Young's modulus of the underlayer is preferably 279 GPa or less.
  • Metals used in the intermediate layer include, for example, Ni, Pt, Pd, etc.
  • Metals used in the surface layer include, for example, Au, Sn, Ag, Ni, Pt, etc.
  • the metal used in the metal layer 14 may be a single metal or an alloy.
  • the joint 15 is configured in a layered manner so as to overlap the metal layer 14. As shown in Figure 5, the joint 15 contacts a portion of the metal layer 14 opposite the portion in contact with the buffer section 10a2. As shown in Figure 6, the joint 15 has a rectangular frame shape so as to correspond to the shapes of the buffer section 10a2 and the metal layer 14. The shape of the joint 15 is not limited to this embodiment, and may be a circle or any other frame shape.
  • the joint 15 is made of a metal-based joint material.
  • Commercially available solder materials and brazing materials can be used as the metal-based joint material.
  • metal-based joint materials include Au-Sn alloys, Pb-Sn alloys, Au-Ge alloys, and Sn-Ni alloys.
  • the sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 14 of the lid member 4 at the joint 15.
  • This method includes a preparation step for preparing the base body 2 and the lid member 4, and a joining step for joining the base body 2 and the lid member 4.
  • a metal layer 6 is formed on the first main surface 2a of the base 2, and then a light-emitting element 3 is mounted on this first main surface 2a.
  • the cover member 4 is formed by forming the protrusions 8 on the glass plate, and then the first anti-reflection film 10a is formed on the cover member 4. After that, the metal layer 14 and the bonding portion 15 are formed on the buffer portion 10a2 of the first anti-reflection film 10a. It is also possible to further increase the light extraction efficiency by forming a second anti-reflection film 10b on the cover member 4.
  • This process includes a molding process using heat and a film formation process using physical vapor deposition.
  • FIG. 7 shows the forming device used in the forming process.
  • the forming device 16 includes a support table 17 that supports the glass sheet GS, a heating source 18 that thermally deforms a part of the glass sheet GS to form the protrusion 8 of the cover member 4, and an external force generating device 19 that applies an external force to a part of the glass sheet GS.
  • the support base 17 has a fixing portion 20 that fixes the glass sheet GS, and a space portion 21 that allows thermal deformation of a portion of the glass sheet GS.
  • the support base 17 has an opening portion 17a surrounded by the fixing portion 20, and a suction portion 17b that sucks in a portion of the glass sheet GS.
  • materials that constitute the support base 17 include metals, ceramics, etc.
  • the fixed part 20 of the support base 17 has a support surface 20a that supports the glass sheet GS, and a suction part 20b that sucks the main surface of the glass sheet GS.
  • the support surface 20a is composed of a flat surface.
  • the suction part 20b of the fixed part 20 is formed so as to be exposed to a part of the support surface 20a.
  • the suction part 20b is connected to the external force generating device 19.
  • the space 21 of the support base 17 is formed inside a recess having a bottom.
  • the space 21 of the support base 17 is configured to mold the entire protrusion 8 of the lid member 4 in a non-contact state.
  • the opening 17a of the support base 17 has a circular opening edge in a plan view, but is not limited to this and may have an opening edge of a polygonal shape such as a triangle or a rectangle, or an elliptical shape.
  • the suction portion 17b of the support base 17 is formed at the bottom of the recess and communicates with the space 21.
  • This suction portion 17b is connected to the external force generating device 19 together with the suction portion 20b of the fixed portion 20.
  • the external force generating device 19 can perform suction by this suction portion 17b and suction by the suction portion 20b of the fixed portion 20 using a common suction device.
  • a lower support jig for supporting the glass sheet GS may be provided in the space 21.
  • the lower support jig is made of metal or ceramics.
  • the heating source 18 is disposed above the support stand 17.
  • the heating source 18 is a burner that sprays a flame FL toward the glass sheet GS.
  • the heating method of the heating source 18 may be, for example, resistance heating, laser heating, or heating using superheated steam.
  • superheated steam means high-temperature steam obtained by further heating saturated steam generated by boiling water.
  • the heating source 18 may also be configured by combining heating sources of different heating methods.
  • a suction device exhaust device
  • the suction device creates a negative pressure in the space 21 of the support base 17 by discharging the gas present in the space 21 of the support base 17. This causes a part of the glass sheet GS to be sucked into the space 21 of the support base 17, thereby promoting thermal deformation of a part of the glass sheet GS.
  • a pump using a Venturi mechanism is suitable as the suction device.
  • the sheet glass GS is placed on the fixed portion 20 of the support table 17 with the external force generating device 19 stopped.
  • the external force generating device 19 is started and the sheet glass GS is fixed to the fixed portion 20.
  • suction by the suction portion 17b of the support table 17 and suction by the suction portion 20b of the fixed portion 20 can be performed simultaneously.
  • the suction direction D1 of the sheet glass GS by the suction portion 17b and the suction direction D2 of the sheet glass GS by the suction portion 20b of the fixed portion 20 can be the same direction.
  • the plate glass GS is heated from above the support base 17 by the heating source 18. As shown in FIG. 8, a part of the plate glass GS is thermally deformed by suction from the suction part 17b, forming the protrusion 8. Furthermore, a part of the plate glass GS that was fixed to the fixing part 20 becomes the frame part 7 and constitutes the cover member 4. Note that, in the forming process, it is preferable to also heat this frame part 7 in order to suppress warping of the frame part 7.
  • the film-forming process includes a first film-forming process in which anti-reflective films 10a, 10b are formed on the lid member 4, and a second film-forming process in which a metal layer 14 is formed on the frame portion 7 of the lid member 4 after the first film-forming process.
  • FIGS. 9 and 10 show a film formation apparatus used in the film formation process.
  • a sputtering apparatus such as a magnetron sputtering apparatus is shown as an example of the film formation apparatus, but the present invention is not limited to this configuration, and a film formation apparatus that performs other physical vapor deposition methods such as vacuum deposition may also be used.
  • the film forming apparatus 22 includes a vacuum chamber 23 and targets 24a to 24c that scatter particles that will become the film forming material for the anti-reflection films 10a and 10b.
  • the vacuum chamber 23 contains the targets 24a to 24c inside.
  • the internal space of the vacuum chamber 23 is set to a predetermined degree of vacuum by a vacuum pump.
  • An inert gas such as argon gas can be supplied into the vacuum chamber 23.
  • Target 24a-24c includes a first target 24a that forms a first anti-reflection coating 10a on the lid member 4, a second target 24b that forms a second anti-reflection coating 10b on the lid member 4, and a third target 24c that forms a metal layer 14 on the frame portion 7 of the lid member 4.
  • the first target 24a and the second target 24b include a plurality of targets for forming the first film (SiO 2 ) and the second film (HfO 2 ) in the first antireflection coating 10a and the second antireflection coating 10b.
  • the lid member 4 is housed in a vacuum chamber 23. Then, particles scattered from the first target 24a are caused to adhere to the inner surface 8a of the protruding portion 8 of the lid member 4 and the first main surface 7a of the frame portion 7, thereby forming a first anti-reflection film 10a. Similarly, particles scattered from the second target 24b are caused to adhere to the outer surface 8b of the protruding portion 8 of the lid member 4 and the second main surface 7b of the frame portion 7, thereby forming a second anti-reflection film 10b.
  • the amount of particles adhering to the protruding portion 8 of the lid member 4 is greatest at the top 13 and least at the base 11.
  • the difference in the amount of particles adhering to the protruding portion 8 is due to the effect of the protruding angle ⁇ of the protruding portion 8.
  • a masking member 25 is attached to the glass plate GS in order to form a metal layer 14 at a predetermined position on the frame 7.
  • the masking member 25 has an opening 25a that allows particles scattered from the third target 24c to pass through and adhere to the frame 7.
  • a metal layer 14 is formed so as to overlap the buffer portion 10a2 of the first anti-reflection film 10a. Specifically, as shown in FIG. 10, particles scattered from the third target 24c are allowed to adhere to the first main surface 7a via the buffer portion 10a2 of the frame portion 7 through the opening 25a. This forms a frame-shaped metal layer 14 with a certain thickness.
  • Figures 11 and 12 are intended to compare the state in which the masking member 25 is attached to the lid member 4.
  • Figure 11 shows a lid member 4 as an example in which the glass sheet GS is molded while fixed to the fixing portion 20 of the support base 17 during the molding process.
  • Figure 12 shows a lid member 4a as a comparative example in which the glass sheet GS is molded without being fixed to the fixing portion 20.
  • the opening 25a of the masking member 25 is entirely blocked by the first main surface 7a of the frame 7. This allows a metal layer 14 of uniform thickness to be stably formed on the first main surface 7a of the frame 7.
  • the joint 15 is formed so as to overlap the metal layer 14.
  • the joint 15 is formed by a process (application process) in which, for example, a paste-like metal-based bonding material is applied so as to overlap the metal layer 14.
  • a process application process
  • Specific examples of the application process include a printing method using a mask (screen printing method) and an application method using a dispenser.
  • the bonding portion 15 may be formed by any method other than the above, for example by arranging a molded body of a metal-based bonding material formed in advance into a predetermined frame shape so that it overlaps the metal layer 14 on the first main surface 7a of the frame portion 7.
  • the heat treatment process includes a heating process and a cooling process.
  • the lid member 4 is heated using a heating device such as a reflow furnace, thereby melting the metal-based bonding material.
  • the heating process may be carried out, for example, with the furnace filled with nitrogen.
  • the lid member 4 is heated to a temperature of 300°C or higher.
  • the metal-based bonding material melted on the first main surface 7a of the frame 7 is solidified by cooling.
  • the cooling process is preferably performed slowly at a cooling rate of 50°C/min.
  • stress is generated in the cover member 4 due to the difference in thermal expansion coefficient between the frame 7 and the bonding portion 15, but the buffer portion 10a2 of the first anti-reflection film 10a can relieve this stress.
  • the lid member 4 manufactured through the preparation process is laid on the base body 2. Specifically, the first main surface 7a of the frame portion 7 of the lid member 4 is placed opposite the base body 2, and the joining portion 15 is brought into contact with the metal layer 6 formed on the first main surface 2a of the base body 2.
  • the pressing member 26 is placed on the frame portion 7 of the cover member 4.
  • the pressing member 26 has a weight 26a and a support member 26b that supports the weight 26a.
  • the weight 26a and the support member 26b are made of, for example, metal or ceramic.
  • the support member 26b has a first support portion 26b1 that supports the weight 26a, and a second support portion 26b2 that supports the first support portion 26b1.
  • the first support portion 26b1 has a support surface (upper surface) on which the weight 26a is placed.
  • the second support portion 26b2 includes a plurality of rod-shaped members. The second support portion 26b2 protrudes downward from the lower surface of the first support portion 26b1.
  • the second support portion 26b2 has a contact portion 26b3 that contacts the frame portion 7 of the cover member 4.
  • the contact portion 26b3 is configured in a pointed shape.
  • the contact portion 26b3 contacts the second main surface 7b of the frame portion 7 via the second anti-reflection film 10b.
  • the pressing member 26 presses the lid member 4 while standing on its own on the lid member 4, as each contact portion 26b3 of the multiple second support portions 26b2 comes into contact with the frame portion 7. Pressing the lid member 4 with the pressing member 26 allows the joint portion 15 formed on the frame portion 7 of the lid member 4 to be tightly attached to the metal layer 6 formed on the first main surface 2a of the base 2.
  • the metal layer 6 and the joint 15 are heated while being pressed against each other (heating process). This causes the metal-based joint material of the joint 15 to melt.
  • the pointed contact portion 26b3 of the second support portion 26b2 comes into contact with the frame portion 7 of the cover member 4, so that the contact area between the contact portion 26b3 and the frame portion 7 can be made as small as possible. This makes it possible to minimize the transfer of heat from the frame portion 7 to the second support portion 26b2 of the pressing member 26.
  • the molten metal-based bonding material is cooled and solidified (cooling process).
  • stress is generated in the frame portion 7 due to the difference in thermal expansion coefficient between the base 2 and the frame portion 7 of the lid member 4.
  • the buffer portion 10a2 of the first anti-reflection film 10a deforms to relieve this stress. This makes it possible to reduce damage to the frame portion 7.
  • the sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 14 of the lid member 4 at the joint 15. This completes the airtight package 1.
  • the frame portion 7 of the lid member 4 is sucked by the fixing portion 20 of the support base 17, thereby preventing warping of the frame portion 7.
  • the masking member 25 it is possible to prevent metal particles scattered from the third target 24c from adhering to the inner surface 8a of the protrusion 8.
  • the protrusion 8 of the lid member 4 has a thickness at the top 13 that is thinner than the base 11, while the anti-reflection films 10a, 10b are thicker at the top 13 and thinner at the base 11. Due to the above configuration of the protrusion 8, the light emitted from the light-emitting element 3 is relatively easy to transmit at the top 13 of the protrusion 8 and relatively difficult to transmit at the base 11. That is, in this embodiment, the anti-reflection films 10a, 10b are thicker in the areas where light is relatively easy to transmit, and thinner in the areas where light is relatively difficult to transmit.
  • the anti-reflective films 10a and 10b absorb a small amount of light that passes through them.
  • FIG. 15 shows an example of a glass substrate for manufacturing the lid member 4.
  • the glass substrate G includes a frame portion 7 and multiple protrusions 8 protruding from the frame portion 7.
  • the glass substrate G can also include anti-reflection films 10a, 10b.
  • Each protrusion 8 has the same configuration as the protrusion 8 of the lid member 4 described above.
  • Each protrusion 8 is formed by thermally deforming multiple locations of a large glass sheet GS using the molding device 16 described above. By cutting this glass substrate G along the cutting line CL, multiple lid members having the protrusions 8, frame portion 7, and anti-reflection films 10a, 10b can be efficiently manufactured.
  • a metal layer 14 and a bonding portion 15 may be formed on the first anti-reflection film 10a.
  • FIG 16 shows another example of a lid member.
  • the lid member 4 comprises a frame portion 7 and multiple protrusions 8 protruding from the frame portion 7.
  • the lid member 4 can also comprise anti-reflection films 10a, 10b, a metal layer 14, and a bonding portion 15.
  • Each component of this lid member 4 has the same configuration as the lid member 4 described above ( Figure 5).
  • this lid member 4 can individually seal each light-emitting element 3 with the multiple protrusions 8.
  • Figure 17 shows another example of a lid member.
  • the inner surface 8a of the lid member 4 has a first curved surface 8a1 and a second curved surface 8a2 with different radii of curvature, and a boundary portion 8a3 located between the first curved surface 8a1 and the second curved surface 8a2.
  • the radius of curvature of the first curved surface 8a1 formed on the base 11 side of the protrusion 8 is smaller than the radius of curvature of the second curved surface 8a2 formed on the top 13 side of the protrusion 8.
  • the outer surface 8b of the cover member 4 has a first curved surface 8b1 and a second curved surface 8b2 with different radii of curvature, and a boundary portion 8b3 located between the first curved surface 8b1 and the second curved surface 8b2.
  • the radius of curvature of the first curved surface 8b1 formed on the base 11 side of the protrusion 8 is smaller than the radius of curvature of the second curved surface 8b2 formed on the top 13 side of the protrusion 8.
  • FIG. 18 is a plan view showing another example of a lid member.
  • the lid member 4 has a plurality of protrusions 8 arranged in multiple rows and columns and having a circular shape in a plan view.
  • the lid member 4 can also have anti-reflection films 10a, 10b (first anti-reflection film 10a is not shown), a metal layer 14 (not shown), and a joint 15 (not shown).
  • Figure 19 shows a support table of a forming device for manufacturing the lid member 4 shown in Figure 18.
  • the support table 17 can form multiple protrusions 8 on the glass sheet GS.
  • the support table 17 has multiple spaces 21, and openings 17a and suction sections 17b corresponding to each space 21.
  • the spaces 21, openings 17a and suction sections 17b are formed in multiple rows and columns in a plan view.
  • the fixing section 20 of the support table 17 has one support surface 20a and multiple suction sections 20b configured to surround each opening 17a.
  • the suction sections 20b of the fixing section 20 are formed in multiple rows and columns to correspond to the spaces 21.
  • the suction sections 20b are configured in a circular ring shape, but are not limited to this and may be configured in other shapes.
  • FIG. 20 is a plan view showing another example of a lid member.
  • the lid member 4 has a plurality of protrusions 8 configured in a rectangular shape when viewed from above.
  • a scribe line is made on the smooth surface between adjacent protrusions 8, and the lid member 4 is broken along the scribe line, or diced by a blade dicing method or a laser ablation method, thereby obtaining a plurality of lid members, and a lid member of any shape can be obtained.
  • FIG. 21 is a bottom view showing another example of a lid member.
  • the lid member 4 has a protrusion 8 configured in a rectangular shape in a plan view, similar to the example shown in FIG. 20.
  • the opening 8c of the protrusion 8 is configured in a rectangular shape (e.g., a square shape).
  • the opening length L corresponds to the length of one side of the square.
  • the opening length L corresponds to the length of the long side of the rectangle.
  • Fig. 22 shows another example of a package.
  • the package 1 comprises a base 2 on which multiple light-emitting elements 3 are mounted, and the lid member 4 illustrated in Fig. 16.
  • This lid member 4 individually seals each light-emitting element 3 mounted on the base 2 with multiple protrusions 8 and sealing portions 5.
  • Figure 23 shows another example of a lid member.
  • the inner surface 8a of the lid member 4 has a first curved surface 8a1 that is convex toward the inside of the protruding portion 8, a second curved surface 8a2 that is convex toward the outside of the protruding portion 8, and an inflection point 8a3 located between the first curved surface 8a1 and the second curved surface 8a2.
  • the first curved surface 8a1 is formed at a position closer to the base 11 of the protruding portion 8 than the second curved surface 8a2.
  • the center of curvature of the first curved surface 8a1 is located on the outside of the protruding portion 8.
  • the second curved surface 8a2 is formed at a position closer to the apex 13 than the first curved surface 8a1.
  • the center of curvature of the second curved surface 8a2 is located on the inside of the protruding portion 8.
  • the outer surface 8b of the cover member 4 has a first curved surface 8b1 that is convex toward the inside of the protruding portion 8, a second curved surface 8b2 that is convex toward the outside of the protruding portion 8, and an inflection point 8b3 located between the first curved surface 8b1 and the second curved surface 8b2.
  • the first curved surface 8b1 is formed at a position closer to the base 11 of the protruding portion 8 than the second curved surface 8b2.
  • the center of curvature of the first curved surface 8b1 is located outside the protruding portion 8.
  • the second curved surface 8b2 is formed at a position closer to the top 13 of the protruding portion 8 than the first curved surface 8b1.
  • the center of curvature of the second curved surface 8b2 is located inside the protruding portion 8.
  • the inflection points 8a3 and 8b3 are provided above (towards the top 13) the second main surface 7b of the frame portion
  • the inflection points 8a3, 8b3 on the inner surface 8a and the outer surface 8b can be formed in the cover member 4 by the molding device and molding method shown in Figures 7 and 8. If the inflection points 8a3, 8b3 are formed in the protrusion 8, the protrusion angle ⁇ of the protrusion 8 may become small in the molding process, and the light extraction efficiency may decrease. In the present invention, it is desirable to sufficiently heat the glass sheet GS by the heating source 18 of the molding device 16 (see Figure 7) so that the protrusion angle ⁇ of the protrusion 8 can be ensured to be large.
  • the light extraction efficiency of the cover member 4 can be improved by setting the protrusion angle ⁇ to 40° or more and 90° or less.
  • the protrusion angle ⁇ is preferably 45° or more, 50° or more, 55° or more, 60° or more, 65° or more, and 70° or more, in that order.
  • the protrusion angle ⁇ is preferably less than 90°, and more preferably 85° or less.
  • the definition of the protrusion angle ⁇ differs from that of the embodiment in FIG. 5.
  • the protrusion angle ⁇ is the angle (acute angle) between the tangent L8 at the inflection point 8a3 and the first main surface 7a of the frame portion 7.
  • the protrusion angle ⁇ is the angle (acute angle) between the tangent L8 at the inflection point 8a3 and a sixth line L6 drawn along the first main surface 7a of the frame portion 7.
  • the opening length L and protrusion height H of the opening 8c are the same as those in the embodiment shown in FIG. 5.
  • the anti-reflection films (10a, 10b) are not necessarily required, but it is preferable to provide the anti-reflection films (10a, 10b), and the preferred material and thickness of the anti-reflection films (10a, 10b) are the same as in the embodiment shown in FIG. 5.
  • the preferred thickness of the protrusion 8 thickness of the base 11, thickness of the top 13
  • outer diameter are the same as in the embodiment shown in FIG. 5.
  • the shape of the lid member is different from that of the above embodiment.
  • the top 13 of the lid member 4 is configured in a flat plate shape.
  • the flat top 13 on the lid member 4 it is possible to form anti-reflection films 10a, 10b of uniform thickness on the inner surface 8a and the outer surface 8b of the lid member 4 related to the top 13.
  • the flat top 13 on the lid member 4 it is possible to make the distance Da between the top 13 and the light-emitting element 3 as small as possible. In addition, it becomes easier for the light emitted from the light-emitting element 3 to be perpendicularly incident on the flat top 13.
  • the light extraction efficiency of the lid member 4 can be significantly improved.
  • the light extraction efficiency can be calculated by measuring the energy EN1 of the light emitted from the light-emitting element 3 without passing through the lid member 4, measuring the energy EN2 when the light emitted from the light-emitting element 3 is transmitted through the lid member 4, and calculating the ratio of these energies (EN2/EN1).
  • the molding device 16 includes a support stand 17, a heating source 18, and an external force generating device 19.
  • the configurations of the heating source 18 and the external force generating device 19 are the same as those illustrated in Figure 7.
  • the support base 17 has a forming surface 27 that forms a portion of the sheet glass GS that is softened by heating.
  • the forming surface 27 is formed within the space 21 and is configured as a flat surface.
  • the other configurations of the support base 17 are the same as those shown in Figures 7 and 8.
  • the glass sheet GS is placed on the fixed portion 20 of the support base 17.
  • the external force generating device 19 is activated to fix the glass sheet GS to the fixed portion 20.
  • the glass sheet GS is heated by the heating source 18. This causes a part of the glass sheet GS to thermally deform.
  • a part of the deformed glass sheet GS comes into contact with the forming surface 27. This causes a part of the glass sheet GS to be formed into a flat plate shape.
  • This forming process forms a cover member 4 having a frame portion 7, a protruding portion 8 including a flat top portion 13, and a connecting portion 9.
  • the package can be manufactured by carrying out the film forming process and bonding process illustrated in Figures 9 to 11, 13, and 14 on this cover member 4.
  • this forming device 16 includes a support table 17, a first heating source 18a, and a second heating source 18b.
  • the first heating source 18a has the same configuration as the heating source 18 shown in FIG. 27.
  • the second heating source 18b is disposed inside the support table 17.
  • the support table 17 has a recess capable of accommodating the second heating source 18b. A portion of the second heating source 18b is exposed to the space 21 of the support table 17.
  • the second heating source 18b can locally apply high-temperature air to the glass sheet GS fixed to the support table 17. This allows the glass sheet GS supported by the support table 17 to be heated from the underside.
  • the second heating source 18b can promote the shaping of the protruding portion 8 (base portion 11 and mid-way portion 12) of the cover member 4 in the shaping process. This can effectively prevent warping of the frame portion 7 of the cover member 4 by increasing the protruding angle ⁇ of the protruding portion 8.
  • the second heating source 18b may be disposed above the support base 17.
  • the protruding portion 8 (base portion 11 and mid-way portion 12) of the glass sheet GS may be locally heated from above by the second heating source 18b.
  • the space 21 of the support base 17 includes a first space 21a formed above the molding surface 27, and a second space 21b formed between the molding surface 27 and the fixed part 20.
  • the first space 21a has the same configuration as the example shown in Figure 27.
  • the second space 21b is connected to a suction part 17c.
  • the suction part 17c is formed on the bottom surface of the support base 17, which separates the second space 21b, between the molding surface 27 and the fixed part 20.
  • the support base 17 is provided with four suction parts 17c, but the number of suction parts 17c is not limited to this embodiment.
  • the fixed part 20 of the support base 17 has a support surface 20a, a suction part 20b, and a recess 20c connected to the suction part 20b.
  • the recess 20c is configured as a groove formed to surround the space 21 of the support base 17 in a plan view. This groove has a rectangular frame shape.
  • the shape of the groove of the recess 20c in a plan view is not limited to this embodiment, and may be configured to be annular or other shapes.
  • the end (suction port) of the suction part 20b is connected to the bottom surface of the corner of the rectangular recess 20c.
  • the fixed part 20 of the support base 17 is provided with four suction parts 20b, but the number of suction parts 20b is not limited to this embodiment.
  • the recess 20c has a function of assisting the suction part 20b in sucking the glass sheet GS (auxiliary suction part).
  • the recess 20c may be omitted from the fixed portion 20 of the support base 17.
  • the position of the suction portion 20b formed on the fixed portion 20 may be changed.
  • the suction portions 20b may be provided at the midpoint of each side of the fixed portion 20 that is configured to have a rectangular shape in a plan view.
  • Figures 33 to 36 show another example of a method for manufacturing a lid member.
  • the support table 17 of the molding device 16 shown in Figure 33 does not have the suction portion 20b of the fixing portion 20 shown in Figure 7.
  • the other configuration of the support table 17 is the same as that shown in Figure 7.
  • the method for manufacturing the lid member 4 in this example includes a molding process, a processing process for processing the frame portion 7 of the lid member 4 after the molding process, and a film forming process that is performed after the processing process.
  • the plate glass GS placed on the fixed portion 20 of the support stand 17 is heated by the heating source 18 while a part (center portion) of the plate glass GS is sucked by the external force generator 19 and the suction portion 17b of the support stand 17.
  • the frame portion 7 of the cover member 4 formed in this way is not sucked by the suction portion 20b of the fixed portion 20 as in the example shown in FIG. 7, and therefore is warped away from the support surface 20a of the fixed portion 20 as shown in FIG. 33. If the film forming process is performed in this state, the first main surface 7a of the frame portion 7 cannot completely block the opening 25a of the masking member 25 as shown in FIG. 12.
  • a processing treatment is performed to flatten at least a part of the first main surface 7a so that the first main surface 7a of the frame portion 7 can close the opening 25a of the masking member 25.
  • a processing step in which a physical polishing treatment is performed on the first main surface 7a of the frame portion 7 is described.
  • Figures 34 and 35 show a polishing device used in the processing step.
  • the polishing device includes a polishing tool 28 and a pressing member 29 for pressing the cover member 4 against the polishing tool 28.
  • the polishing tool 28 for example, a polishing pad is used, but the form of the polishing tool 28 is not limited to this example.
  • the pressing member 29 includes a frame body 30 that houses the protruding portion 8 of the lid member 4, a buffer member 31 that is interposed between the frame portion 7 of the lid member 4 and the frame body 30, and a weight 32 that is placed on the frame body 30.
  • the frame body 30 is, for example, formed in a plate shape and has a hole 30a that penetrates in the thickness direction. A space (accommodation section) that accommodates the protrusion 8 of the lid member 4 is formed inside this hole 30a.
  • the hole 30a is configured to be larger than the protrusion 8. Therefore, the frame body 30 can accommodate the protrusion 8 inside without coming into contact with the protrusion 8.
  • the frame body 30 can press against the frame section 7 of the lid member 4 via the buffer member 31.
  • the cushioning member 31 is in contact with the second main surface 7b of the frame portion 7.
  • the cushioning member 31 is made of, for example, a contractible sponge-like resin, but the configuration of the cushioning member 31 is not limited to this example.
  • the weight 32 is placed on the top of the frame body 30. Multiple weights 32 may be placed on the top of the frame body 30.
  • the frame portion 7 of the cover member 4 is pressed toward the polishing tool 28 by a pressing member 29 while the first main surface 7a of the frame portion 7 of the cover member 4 is in contact with the polishing tool 28.
  • the polishing tool 28 is moved relative to the cover member 4, whereby the first main surface 7a of the frame portion 7 can be polished.
  • the polishing tool 28 forms a polished surface 7a1 on at least a portion of the first main surface 7a of the frame portion 7.
  • the surface roughness Ra of the polished surface 7a1 is preferably 0.1 nm or more and 1 nm or less.
  • the polished surface 7a1 can completely block the opening 25a of the masking member 25 used in the film formation process (second film formation process). This prevents the metal particles used to form the metal layer 14 from penetrating into the inside of the protruding portion 8 during the film formation process, and allows the metal layer 14 to be formed with a uniform thickness on the first main surface 7a of the frame portion 7.
  • the processing step can make the thickness of the frame 7 of the cover member 4 thinner than the thickness Tmax (see FIG. 5) of the base 11 of the protrusion 8. This makes it possible to heat the joint 15 effectively through the thin frame 7, for example, when the joint 15 is heated with a laser in the joining step.
  • the present invention is not limited to the configuration of the above embodiment, nor is it limited to the above-mentioned effects. Various modifications of the present invention are possible without departing from the gist of the present invention.
  • cover member 4 and the glass substrate G on which the first anti-reflection film 10a and the second anti-reflection film 10b are formed are shown, but the present invention is not limited to this configuration.
  • the cover member 4 and the glass substrate G according to the present invention may have only the first anti-reflection film 10a or only the second anti-reflection film 10b.
  • a cover member 4 having a protrusion 8 configured such that the thickness of the top 13 is thinner than the thickness of the base 11 is exemplified, but the present invention is not limited to this configuration. The present invention is also applicable to a cover member 4 having a protrusion 8 whose thickness is constant from the base 11 to the top 13.
  • the first main surface 7a of the frame portion 7 of the cover member 4 is processed by physical polishing, but the present invention is not limited to this configuration.
  • the first main surface 7a of the frame portion 7 may also be processed by a chemical polishing process using etching.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

Ce procédé de fabrication d'un élément de couvercle comprend une étape de formation servant à former une partie saillante (8) d'un élément de couvercle (4) par aspiration d'une partie d'un verre de plaque GS dans un état dans lequel le verre de plaque GS est fixé à un socle de support (17). Le socle de support (17) comprend une partie de fixation (20) qui fixe une partie de cadre (7) de l'élément de couvercle (4). Dans l'étape de formation, la partie de fixation (20) aspire la partie de cadre (7) dans la même direction que la direction dans laquelle la partie du verre de plaque GS est aspirée.
PCT/JP2023/033377 2022-09-30 2023-09-13 Élément de couvercle et son procédé de fabrication WO2024070699A1 (fr)

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JP2022158246 2022-09-30

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010186887A (ja) * 2009-02-12 2010-08-26 Sumita Optical Glass Inc 発光装置の製造方法
JP2013506251A (ja) * 2009-09-25 2013-02-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体照明装置
JP2016076306A (ja) * 2014-10-02 2016-05-12 パナソニックＩｐマネジメント株式会社 光源モジュール、光源ユニット及び照明器具
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