WO2024067668A1 - 电路板装置及电子设备 - Google Patents

电路板装置及电子设备 Download PDF

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Publication number
WO2024067668A1
WO2024067668A1 PCT/CN2023/121910 CN2023121910W WO2024067668A1 WO 2024067668 A1 WO2024067668 A1 WO 2024067668A1 CN 2023121910 W CN2023121910 W CN 2023121910W WO 2024067668 A1 WO2024067668 A1 WO 2024067668A1
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WO
WIPO (PCT)
Prior art keywords
chip
circuit board
board device
cooling
refrigeration
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PCT/CN2023/121910
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English (en)
French (fr)
Inventor
黎志冬
金豆
Original Assignee
维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2024067668A1 publication Critical patent/WO2024067668A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular to a circuit board device and electronic equipment.
  • More functional devices will occupy a larger board space of the circuit board, and these functional devices need to dissipate heat or heat during operation, which will result in the need for additional heat dissipation devices or heating devices to be stacked on the circuit board, resulting in the circuit board and the heat dissipation device or heating device forming a thicker structure, resulting in a problem of occupying a large space and being unfavorable for thinning the electronic device.
  • the present application discloses a circuit board device and an electronic device to solve the problem in the related art that a heating device or a heat dissipation device is required to be provided on the circuit board, which results in the circuit board and the heat dissipation device or the heating device forming a thick structure, thereby occupying a large space and being unfavorable for the thinning of the electronic device.
  • the present application is implemented as follows.
  • the present application discloses a circuit board device, comprising a circuit board, a first chip and a cooling element, wherein the circuit board is provided with a receiving space, and the first chip and the cooling element are both arranged in the receiving space.
  • the heating end of the refrigeration component or the cooling end of the refrigeration component is connected to the first chip, and the first chip is electrically connected to the circuit board.
  • the present application further discloses an electronic device, and the disclosed electronic device includes the circuit board device described in the first aspect.
  • the embodiment of the present application opens a receiving space on the circuit board so that the first chip and the cooling element are both arranged in the receiving space, thereby sacrificing a part of the circuit board structure to arrange the first chip and the cooling element, which is conducive to reducing the occupied space of the entire circuit board device.
  • the problem of the first chip, the cooling element and the circuit board being stacked and causing the circuit board device to have a large thickness can be avoided, which is conducive to the thinning design of the circuit board device, and further to the thinning design of the electronic device.
  • FIG1 is a schematic diagram of the structure of a circuit board device disclosed in an embodiment of the present application.
  • FIG2 is a schematic diagram of the structure of a refrigeration component disclosed in an embodiment of the present application.
  • FIG3 is a schematic diagram of the arrangement of the thermistor chip, the cooling element, the second chip and the third chip disclosed in the embodiment of the present application.
  • an embodiment of the present application discloses a circuit board device, and the disclosed circuit board device includes a circuit board 100 , a first chip and a cooling element 300 .
  • the circuit board 100 is the foundation for installing other components of the circuit board device.
  • the circuit board 100 is provided with a storage space, and the first chip and the cooling element 300 are both arranged in the storage space.
  • the heating end 330 of the cooling element 300 or the cooling end 320 of the cooling element 300 is connected to the first chip, and the first chip is electrically connected to the circuit board 100 to realize information exchange or power supply connection between the first chip and the circuit board 100.
  • the cooling element 300 may be a Peltier element.
  • the cooling element 300 is a Peltier element
  • a temperature gradient will appear at the two opposite ends of the cooling element 300, that is, the temperature of one end of the cooling element 300 increases to form a heating end 330, and the temperature of the other end decreases to form a cooling end 320, so that the cooling element 300 can be used to heat other components or to dissipate heat from other components.
  • the first chip is a component that needs to dissipate heat
  • the first chip can be connected to the cooling end 320 of the cooling element 300.
  • the first chip is a component that needs to be heated
  • the first chip can be connected to the heating end 330 of the cooling element 300.
  • the cooling element 300 is other cooling elements, it also has a heating end 330 and a cooling end 320.
  • the embodiment of the present application opens a receiving space on the circuit board 100 so that both the first chip and the cooling element 300 are disposed in the receiving space, thereby sacrificing a portion of the structure of the circuit board 100 to dispose the first chip and the cooling element 300, thereby facilitating reducing the occupied space of the entire circuit board device.
  • the accommodating space can be a first through hole 110, the first through hole 110 can pass through the circuit board 100, and the two openings of the first through hole 110 are respectively located on two opposite board surfaces of the circuit board 100, the first chip can be arranged in the first through hole 110, and the refrigeration parts 300 can be provided on both sides of the two openings of the first through hole 110 of the first chip.
  • the first chip By setting the accommodation space as the first through hole 110, and the first through hole 110 passing through the circuit board 100, the first chip can be arranged in the first through hole 110, so that the first chip faces the first through hole 110.
  • the two openings may be provided with cooling elements 300, so that the first chip is heated or cooled by a plurality of cooling elements 300, thereby improving the heating or cooling effect of the first chip.
  • the circuit board device may further include a second chip 400 and/or a third chip 500, and the second chip 400 and the third chip 500 may be of a different type from the first chip.
  • the second chip 400 and the third chip 500 are of a different type from the first chip, which means that when the first chip is a component that needs to be heated, the second chip 400 and the third chip 500 may be components that need to be cooled, and when the first chip is a component that needs to be cooled, the second chip 400 and the third chip 500 may be components that need to be heated.
  • the second chip 400 can be disposed on the first board surface of the circuit board 100 and connected to the corresponding heating end 330 of the refrigeration element 300 or the cooling end 320 of the refrigeration element 300.
  • the second chip 400 can be a component that needs to be refrigerated, and the second chip 400 is connected to the cooling end 320 of the refrigeration element 300.
  • the second chip 400 can be a component that needs to be heated, and the second chip 400 is connected to the heating end 330 of the refrigeration element 300.
  • the third chip 500 can be disposed on the second board surface of the circuit board 100 and connected to the corresponding heating end 330 of the refrigeration element 300 or the cooling end 320 of the refrigeration element 300.
  • the third chip is a component that needs to be refrigerated, and the third chip 500 is connected to the cooling end 320 of the refrigeration element 300.
  • the third chip 500 is a component that needs to be heated, and the third chip 500 is connected to the heating end 330 of the refrigeration element 300.
  • the second chip 400 and the third chip 500 can be respectively arranged on the first and second opposite board surfaces of the circuit board 100, and connected to the corresponding heating end 330 of the refrigeration element 300 or the cooling end 320 of the refrigeration element 300.
  • the first chip is connected to the heating end 330 of the refrigeration element 300
  • the second chip 400 and the third chip 500 can both be components that need to be refrigerated, and the second chip 400 and the third chip 500 are respectively connected to the cooling ends 320 of the refrigeration element 300 on both sides of the first chip.
  • the second chip 400 and the third chip 500 can both be components that need to be heated, and the second chip 400 and the third chip 500 can be respectively connected to the heating end 330 of the refrigeration element 300.
  • the second chip 400 and the third chip 500 can be arranged at the two openings of the first through hole 110.
  • a cooling element 300 may be disposed between the first chip and the second chip 400, and/or the first chip and A cooling element 300 may be disposed between the third chips 500 .
  • the heating end 330 and the cooling end 320 of the cooling element 300 can be utilized, so that the second chip 400 and the third chip 500 can use the cooling element 300 together with the first chip for heating and cooling, so that the cooling element 300 can be fully utilized, and it is avoided that the cooling element and the heating element need to be separately set when the first chip is of different types from the second chip 400 and the third chip 500, which is beneficial to the thinning of the circuit board device, and further beneficial to the thinning of the electronic device.
  • the second chip 400 and the third chip 500 can be respectively arranged to cover the corresponding openings.
  • the first chip and the cooling element 300 located in the first through hole 110 can be protected.
  • the cooling elements 300 located on both sides of the first chip can be provided with opposite second through holes 310, and the opposite second through holes 310 of the cooling elements 300 located on both sides of the first chip can be connected to form an electrical connection channel.
  • the circuit board device can also include an electrical connector, at least part of which can be arranged in the electrical connection channel, and the second chip 400 and the third chip 500 can be electrically connected through the electrical connector.
  • the first chip can be provided with a through avoidance hole, and the openings at both ends of the avoidance hole can correspond to the two second through holes, respectively, so that the opposite second through holes 310 of the cooling elements 300 located on both sides of the first chip are connected.
  • the projection of the first chip on the cooling element 300 can be located in the cooling element 300, and the second through holes 310 can surround the first chip.
  • the cooling elements 300 on both sides of the first chip are provided with opposite second through holes 310, and the opposite second through holes 310 of the cooling elements 300 on both sides of the first chip are connected, so that an electrical connection channel can be formed, so that at least part of the electrical connector can be arranged in the electrical connection channel, and then the second chip 400 and the third chip 500 can be electrically connected through the electrical connector.
  • an electrical connection channel can be formed, so that at least part of the electrical connector can be arranged in the electrical connection channel, and then the second chip 400 and the third chip 500 can be electrically connected through the electrical connector.
  • each electrical connection channel can be provided with an electrical connector.
  • the electrical connection channel allows the second chip 400 and the third chip 500 to be connected through a plurality of electrical connectors, thereby facilitating the electrical connection stability between the second chip 400 and the third chip 500.
  • the first chip may be a thermosensitive chip 200, and the heating end 330 of the cooling element 300 may be connected to the thermosensitive chip 200 to heat the thermosensitive chip 200.
  • the second chip 400 and the third chip 500 may both be heating chips, and the cooling end 320 of the cooling element 300 may be connected to the heating chip to cool the second chip 400 and the third chip 500.
  • the cooling element 300 can heat the thermistor chip 200, and the thermistor chip 200 is set in the first through hole 110, which is conducive to maintaining the temperature of the thermistor chip 200.
  • the heating chip is placed outside the circuit board 100, so that the cooling element 300 can be fully utilized, which is also conducive to further heat dissipation, after all, the heating chip is exposed outside the first through hole 110.
  • the second chip 400 and the third chip 500 can be fixedly electrically connected to the circuit board 100 through the welding ball 600, and the second chip 400 and/or the third chip 500 can be connected to the refrigeration end 320 of the corresponding refrigeration component 300 through a plurality of spaced connection parts 700, and a heat dissipation airflow channel is formed between the plurality of connection parts 700.
  • the electrical connection between the second chip 400 and the third chip 500 and the circuit board 100 is more stable.
  • the second chip 400 and/or the third chip 500 is connected to the refrigeration end 320 of the corresponding refrigeration component 300 through a plurality of connection parts 700 distributed at intervals, and a heat dissipation airflow channel is formed between the plurality of connection parts 700, so that the electrical connection between the second chip 400 and the third chip 500 and the corresponding refrigeration component 300 is more stable, and a heat dissipation airflow channel is formed, which is beneficial to improve the heat dissipation of the circuit board device.
  • the circuit board device may include a chip module, and the chip module may include a first chip fixed to each other and a cooling element 300.
  • the chip module is configured to include a first chip fixed to each other and a cooling element 300, thereby facilitating modularization of the circuit board device and facilitating overall assembly and disassembly.
  • the present application also discloses an electronic device, and the disclosed electronic device includes the circuit board device in the above embodiment.
  • the electronic device disclosed in the present application adopts the circuit board device in the above embodiment, so that a storage space is opened on the circuit board 100, so that the first chip and the cooling element 300 are both arranged in the storage space, thereby sacrificing a part of the structure of the circuit board 100 to set the first chip and the cooling element 300, which is conducive to reducing the occupied space of the entire circuit board device.
  • the first chip and the cooling element 300 By arranging the first chip and the cooling element 300 in the storage space, it is possible to avoid the first chip, the cooling element 300 and the circuit board 100 being overlapped to cause the circuit board to be The problem of large thickness of the device is solved, which is conducive to the thinning design of the circuit board device, and further conducive to the thinning design of the electronic device.
  • the electronic device disclosed in the embodiments of the present application may be a mobile phone, a tablet computer, an e-book reader, a game console, etc., and of course may also be other electronic devices.
  • the embodiments of the present application do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开一种电路板装置及电子设备，所公开的电路板装置包括电路板、第一芯片和制冷件，所述电路板开设有容纳空间，所述第一芯片和所述制冷件均设于所述容纳空间内，所述制冷件的发热端或所述制冷件的制冷端与所述第一芯片相连，所述第一芯片与所述电路板电连接。

Description

电路板装置及电子设备
交叉引用
本申请要求在2022年09月27日提交中国专利局、申请号为202211179559.6、名称为“电路板装置及电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电路板装置及电子设备。
背景技术
随着用户需求的提升，电子设备的性能持续在优化，其中，较为明显的表现为，电子设备内集成的功能器件越来越多。我们知道，电子设备较多的功能器件集成在电子设备内的电路板上，电路板不但为这些功能器件提供安装基础，而且还为这些功能器件供电。
较多的功能器件会占据电路板的较大的板面空间，而且这些功能器件在工作的过程中需要散热或加热，进而会导致电路板上还需要额外叠置散热装置或加热装置，从而会导致电路板与散热装置或加热装置形成较厚的结构，从而存在占用空间较大而不利于电子设备的减薄的问题。
发明内容
本申请公开一种电路板装置及电子设备，以解决相关技术中电路板需要设置加热装置或散热装置，而导致电路板与散热装置或加热装置形成较厚的结构，从而存在占用空间较大而不利于电子设备的减薄的问题。为了解决上述技术问题，本申请是这样实现的。
第一方面，本申请公开一种电路板装置，包括电路板、第一芯片和制冷件，所述电路板开设有容纳空间，所述第一芯片和所述制冷件均设于所述容 纳空间内，所述制冷件的发热端或所述制冷件的制冷端与所述第一芯片相连，所述第一芯片与所述电路板电连接。
第二方面，本申请还公开一种电子设备，所公开的电子设备包括第一方面所述的电路板装置。
本申请采用的技术方案能够达到以下技术效果：本申请实施例通过在电路板上开设容纳空间，使得第一芯片和制冷件均设于容纳空间，从而牺牲了一部分电路板的结构来设置第一芯片和制冷件，从而有利于减小整个电路板装置的占用空间。通过将第一芯片和制冷件均设于容纳空间，可以避免第一芯片、制冷件和电路板叠置而造成电路板装置的厚度较大的问题，从而有利于电路板装置的减薄设计，进而有利于电子设备的减薄设计。
附图说明
图1为本申请实施例公开的电路板装置的结构示意图；
图2为本申请实施例公开的一种制冷件的结构示意图；
图3为本申请实施例公开的热敏芯片、制冷件、第二芯片和第三芯片的排布示意图。
附图标记说明：
100-电路板、110-第一通孔、
200-热敏芯片、
300-制冷件、310-第二通孔、320-制冷端、330-发热端、
400-第二芯片、
500-第三芯片、
600-焊接球、
700-连接部。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请具体实施例及相应的附图对本申请技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请 中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下结合附图，详细说明本申请各个实施例公开的技术方案。
请参考图1至图3，本申请实施例公开一种电路板装置，所公开的电路板装置包括电路板100、第一芯片和制冷件300。
电路板100是电路板装置的其他部件的安装的基础。电路板100开设有容纳空间，第一芯片和制冷件300均设于容纳空间内。制冷件300的发热端330或制冷件300的制冷端320与第一芯片相连，第一芯片与电路板100电连接，以实现第一芯片与电路板100的信息交互或供电连接。
具体的，制冷件300可以是帕尔贴件，在制冷件300为帕尔贴件时，制冷件300在通入低电压直流电时，制冷件300的相背的两端将会出现温度梯度，即制冷件300的一端温度升高形成发热端330，另一端温度降低形成制冷端320，从而使得制冷件300既可以用于加热其他部件，也可以用于对其他部件散热。在第一芯片为需要散热的部件时，第一芯片可以与制冷件300的制冷端320相连。在第一芯片为需要加热的部件时，第一芯片可以与制冷件300的发热端330相连。当然，在制冷件300为其它制冷件时，也具有发热端330和制冷端320。
本申请实施例通过在电路板100上开设容纳空间，使得第一芯片和制冷件300均设于容纳空间，从而牺牲了一部分电路板100的结构来设置第一芯片和制冷件300，从而有利于减小整个电路板装置的占用空间。通过将第一芯片和制冷件300均设于容纳空间，可以避免第一芯片、制冷件300和电路板100叠置而造成电路板装置的厚度较大的问题，从而有利于电路板装置的减薄设计，进而有利于电子设备的减薄设计。
为了进一步提高对第一芯片的加热或制冷的效果，可选的，容纳空间可以为第一通孔110，第一通孔110可以贯穿电路板100，且第一通孔110的两个孔口分别位于电路板100的相背的两个板面上，第一芯片可以设于第一通孔110内，第一芯片朝向第一通孔110的两个孔口的两侧均可以设有制冷件300。
通过将容纳空间设置为第一通孔110，且第一通孔110贯穿电路板100，使得第一芯片可以设于第一通孔110内，进而使得第一芯片朝向第一通孔110 的两个孔口均可以设置制冷件300，从而使得通过多个制冷件300对第一芯片加热或制冷，从而可以提高对第一芯片的加热或制冷的效果。
为了使制冷件300得到充分的利用，可选的，电路板装置还可以包括第二芯片400和/或第三芯片500，第二芯片400和第三芯片500均可以与第一芯片的种类不同。第二芯片400和第三芯片500与第一芯片的种类不同是指，第一芯片为需要加热的部件时，第二芯片400和第三芯片500可以为需要制冷的部件，在第一芯片为需要制冷的部件时，第二芯片400和第三芯片500可以为需要加热的部件。
在电路板装置包括第二芯片400的情况下，第二芯片400可以设于电路板100的第一板面上，且与相对应的制冷件300的发热端330或制冷件300的制冷端320相连。具体的，在第一芯片与制冷件300的发热端330相连时，则第二芯片400可以为需要制冷的部件，第二芯片400与制冷件300的制冷端320相连，在第一芯片与制冷件300的制冷端320相连时，第二芯片400可以是需要加热的部件，第二芯片400与制冷件300的发热端330相连。
在电路板装置包括第三芯片500的情况下，第三芯片500可以设于电路板100的第二板面上，且与相对应的制冷件300的发热端330或制冷件300的制冷端320相连。具体的，在第一芯片与制冷件300的发热端330相连时，第三芯片则为需要制冷的部件，第三芯片500与制冷件300的制冷端320相连，在第一芯片与制冷件300的制冷端320相连时，第三芯片500则为需要加热的部件，第三芯片500与制冷件300的发热端330相连。
在电路板装置包括第二芯片400和第三芯片500的情况下，第二芯片400和第三芯片500可以分别设于电路板100的相背的第一板面和第二板面上，且与相对应的制冷件300的发热端330或制冷件300的制冷端320相连。具体的，在第一芯片与制冷件300的发热端330相连时，第二芯片400和第三芯片500均可以为需要制冷的部件，第二芯片400和第三芯片500分别对应的与第一芯片的两侧的制冷件300的制冷端320相连，在第一芯片与制冷件300的制冷端320相连时，第二芯片400和第三芯片500均可以为需要加热的部件，第二芯片400和第三芯片500可以分别对应的与制冷件300的发热端330相连。第二芯片400和第三芯片500可以设于第一通孔110的两个孔口处。第一芯片与第二芯片400之间可以设有制冷件300，和/或第一芯片和 第三芯片500之间可以设有制冷件300。
通过设置第二芯片400和第三芯片500，且第二芯片400和第三芯片500与第一芯片的种类不同，从而可以利用制冷件300的发热端330和制冷端320，使得第二芯片400和第三芯片500可以与第一芯片共同利用制冷件300进行加热和制冷，从而使得制冷件300可以得到充分利用，而且也避免了在第一芯片与第二芯片400和第三芯片500种类不同时需要分别设置制冷件和加热件，从而有利于电路板装置的减薄，进而有利于电子设备的减薄。
为了对制冷件300和第一芯片进行防护，可选的，在电路板装置包括第二芯片400和第三芯片500的情况下，第二芯片400和第三芯片500可以分别设于覆盖相对应的孔口。通过将第二芯片400和第三芯片500分别设于覆盖相对应的孔口，使得可以对位于第一通孔110内的第一芯片和制冷件300进行防护。
在其他一些实施例中，在电路板装置包括第二芯片400和第三芯片500的情况下，位于第一芯片两侧的制冷件300均可以开设有相对的第二通孔310，位于第一芯片两侧的制冷件300相对的第二通孔310可以贯通，以形成电连接通道，电路板装置还可以包括电连接件，电连接件的至少部分可以设于电连接通道之内，第二芯片400和第三芯片500可以通过电连接件电连接。具体的，第一芯片可以设有贯穿的避让孔，避让孔的两端的孔口可以分别对应的与两个第二通孔相对，从而使得位于第一芯片两侧的制冷件300相对的第二通孔310贯通，当然，第一芯片在制冷件300上的投影可以位于制冷件300内，第二通孔310可以环绕在第一芯片的周围。
本申请实施例通过将位于第一芯片两侧的制冷件300均开设有相对的第二通孔310，位于第一芯片两侧的制冷件300相对的第二通孔310贯通，使得可以形成电连接通道，从而使得电连接件的至少部分可以设于电连接通道之内，进而使得第二芯片400和第三芯片500可以通过电连接件电连接。通过将第一芯片两侧的制冷件300相对的第二通孔310贯通，形成电连接通道，有利于建立较短的电连接结构，电连接路径可以相对较短，而且电连接件内置在电连接通道内，从而有利于电路板装置的减薄。
进一步的，第二通孔310为多对，以形成多个电连接通道，多个电连接通道可以间隔设置，每个电连接通道内均可以设有电连接件。通过设置多个 电连接通道，从而使得第二芯片400和第三芯片500之间可以通过多个电连接件连接，从而有利于第二芯片400与第三芯片500之间电连接稳定性。
一种可选的实施例，第一芯片可以为热敏芯片200，制冷件300的发热端330可以与热敏芯片200相连，以对热敏芯片200加热。第二芯片400和第三芯片500均可以为发热芯片，制冷件300的制冷端320可以与发热芯片连接，以对第二芯片400和第三芯片500冷却。
通过将第一芯片设置为热敏芯片200，第二芯片400和第三芯片500均为发热芯片，使得制冷件300可以对热敏芯片200加热，同时将热敏芯片200设置在第一通孔110内，有利于热敏芯片200的温度保持。发热芯片外置于电路板100，从而能够充分利用制冷件300的情况下，还有利于进一步的散热，毕竟发热芯片是外露在第一通孔110外。
可选的，第二芯片400和第三芯片500均可以通过焊接球600与电路板100固定电连接，第二芯片400和/或第三芯片500可以与对应的制冷件300的制冷端320通过间隔分布的多个连接部700连接，多个连接部700之间形成散热气流通道。
通过在第二芯片400和第三芯片500均通过焊接球600与电路板100固定电连接，使得第二芯片400和第三芯片500与电路板100之间的电连接更稳定，第二芯片400和/或第三芯片500与对应的制冷件300的制冷端320通过间隔分布的多个连接部700连接，多个连接部700之间形成散热气流通道，使得第二芯片400和第三芯片500与对应的制冷件300电连接更稳定，而且形成散热气流通道，从而有利于提高电路板装置的散热。
在一些实施例中，电路板装置可以包括芯片模块，芯片模块可以包括相互固定的第一芯片与制冷件300。通过芯片模块设置为包括相互固定的第一芯片与制冷件300，从而有利于电路板装置的模块化，从而由于整体的拆装。
本申请还公开一种电子设备，所公开的电子设备包括上述实施例中的电路板装置。本申请公开的电子设备采用上述实施例中的电路板装置，使得在电路板100上开设容纳空间，使得第一芯片和制冷件300均设于容纳空间，从而牺牲了一部分电路板100的结构来设置第一芯片和制冷件300，从而有利于减小整个电路板装置的占用空间。通过将第一芯片和制冷件300均设于容纳空间，可以避免第一芯片、制冷件300和电路板100叠置而造成电路板 装置的厚度较大的问题，从而有利于电路板装置的减薄设计，进而有利于电子设备的减薄设计。
本申请实施例公开的电子设备可以是手机、平板电脑、电子书阅读器、游戏机等，当然还可以为其它电子设备，本申请实施例不限制电子设备的具体种类。
本申请上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电路板装置，包括电路板(100)、第一芯片和制冷件(300)，所述电路板(100)开设有容纳空间，所述第一芯片和所述制冷件(300)均设于所述容纳空间内，所述制冷件(300)的发热端(330)或所述制冷件(300)的制冷端(320)与所述第一芯片相连，所述第一芯片与所述电路板(100)电连接。
  2. 根据权利要求1所述的电路板装置，其中，所述容纳空间为第一通孔(110)，所述第一通孔(110)贯穿所述电路板(100)，且所述第一通孔(110)的两个孔口分别位于所述电路板(100)的相背的两个板面上，所述第一芯片设于所述第一通孔(110)内，所述第一芯片朝向所述第一通孔(110)的两个孔口的两侧均设有所述制冷件(300)。
  3. 根据权利要求2所述的电路板装置，其中，所述电路板装置还包括第二芯片(400)和/或第三芯片(500)，所述第二芯片(400)和所述第三芯片(500)均与所述第一芯片的种类不同，其中，
    在所述电路板装置包括所述第二芯片(400)的情况下，所述第二芯片(400)设于所述电路板(100)的第一板面上，且与相对应的所述制冷件(300)的所述发热端(330)或所述制冷件(300)的所述制冷端(320)相连；
    在所述电路板装置包括所述第三芯片(500)的情况下，所述第三芯片(500)设于所述电路板(100)的第二板面上，且与相对应的所述制冷件(300)的所述发热端(330)或所述制冷件(300)的所述制冷端(320)相连；
    在所述电路板装置包括所述第二芯片(400)和所述第三芯片(500)的情况下，所述第二芯片(400)和所述第三芯片(500)分别设于所述电路板(100)的相背的第一板面和第二板面上，且与相对应的所述制冷件(300)的所述发热端(330)或所述制冷件(300)的所述制冷端(320) 相连。
  4. 根据权利要求3所述的电路板装置，其中，在所述电路板装置包括所述第二芯片(400)和所述第三芯片(500)的情况下，所述第二芯片(400)和所述第三芯片(500)分别设于覆盖相对应的所述孔口。
  5. 根据权利要求3所述的电路板装置，其中，在所述电路板装置包括所述第二芯片(400)和所述第三芯片(500)的情况下，位于所述第一芯片两侧的所述制冷件(300)均开设有相对的第二通孔(310)，位于所述第一芯片两侧的所述制冷件(300)相对的所述第二通孔(310)贯通，以形成电连接通道，所述电路板装置还包括电连接件，所述电连接件的至少部分设于所述电连接通道之内，所述第二芯片(400)和所述第三芯片(500)通过所述电连接件电连接。
  6. 根据权利要求5所述的电路板装置，其中，所述第二通孔(310)为多对，以形成多个所述电连接通道，所述多个电连接通道间隔设置，每个所述电连接通道内均设有所述电连接件。
  7. 根据权利要求3所述的电路板装置，其中，所述第一芯片为热敏芯片(200)，所述制冷件(300)的发热端(330)与所述热敏芯片(200)相连，所述第二芯片(400)和所述第三芯片(500)均为发热芯片，所述制冷件(300)的制冷端(320)与所述发热芯片连接。
  8. 根据权利要求7所述的电路板装置，其中，所述第二芯片(400)和所述第三芯片(500)均通过焊接球(600)与所述电路板(100)固定电连接，所述第二芯片(400)和/或所述第三芯片(500)与对应的所述制冷件(300)的制冷端(320)通过间隔分布的多个连接部(700)连接，所述多个连接部(700)之间形成散热气流通道。
  9. 根据权利要求1所述的电路板装置，其中，所述电路板装置包括芯片模块，所述芯片模块包括相互固定的所述第一芯片与所述制冷件(300)。
  10. 一种电子设备，包括权利要求1至9中任一项所述的电路板装置。
PCT/CN2023/121910 2022-09-27 2023-09-27 电路板装置及电子设备 WO2024067668A1 (zh)

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