WO2024066769A1 - 显示面板和显示模组 - Google Patents

显示面板和显示模组 Download PDF

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Publication number
WO2024066769A1
WO2024066769A1 PCT/CN2023/112899 CN2023112899W WO2024066769A1 WO 2024066769 A1 WO2024066769 A1 WO 2024066769A1 CN 2023112899 W CN2023112899 W CN 2023112899W WO 2024066769 A1 WO2024066769 A1 WO 2024066769A1
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WIPO (PCT)
Prior art keywords
display panel
film layer
heat dissipation
area
temperature
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Ceased
Application number
PCT/CN2023/112899
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English (en)
French (fr)
Inventor
牟鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/697,321 priority Critical patent/US20250048908A1/en
Publication of WO2024066769A1 publication Critical patent/WO2024066769A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the technical field of display product manufacturing, and in particular to a display panel and a display module.
  • OLED Organic light emitting diodes
  • dream displays because of their self-luminescence, high efficiency, bright colors, thinness, power saving, rollability, and wide operating temperature range.
  • OLED has been widely used in the field of small and medium-sized displays, and has gradually entered the fields of large-area displays and lighting.
  • OLED has been widely used in the field of small and medium-sized displays, and has gradually entered the fields of large-area displays, automotive and lighting.
  • Flexible foldable panels can be designed more flexibly, which can greatly improve the sense of technology of automobile display panels and are the development trend of future vehicle panels.
  • OLED display panels will also generate Joule heat during use, thereby increasing the temperature of the display panel (for example, when the ambient temperature is 26.3°C, that is, room temperature, the temperature of the full white display screen without heat dissipation structure is as high as 37.6-43.1°C when the brightness is 600nits, and the temperature difference in the surface is 5.5°C), and the temperature increase will accelerate the attenuation of the brightness of the OLED display panel (for example, the life attenuation rate of the OLED display panel at 85°C is much faster than that at room temperature, such as 500 hours, the brightness at room temperature decays to 97.97% of the initial brightness; but at 85°C, the brightness decays to 72% of the initial brightness), and the service life of the car is often as long as 10 years or even longer, so the long-term heat resistance of the panel is very high. How to improve the heat
  • the present disclosure provides a display panel and a display module to improve the heat dissipation problem of the display panel.
  • a display panel including a flexible substrate, the flexible substrate including a first side and a second side opposite to each other, the first side is provided with an OLED device, the second side is directly adhered with a heat dissipation functional film layer, or a thermal conductive film layer and a heat dissipation functional film layer are sequentially provided on the second side along a direction away from the flexible substrate, and the thermal conductive film layer includes at least one sub-thermal conductive film layer arranged in a stacked manner.
  • the heat dissipation functional film layer includes a high thermal conductivity adhesive
  • the high thermal conductivity adhesive is made of one or more of acrylic resin, silicon-based material, thermal conductive silicone grease, and liquid metal.
  • the heat dissipation functional film layer further includes a metal layer located on a side of the high thermal conductive adhesive away from the flexible substrate.
  • the heat dissipation functional film layer includes one or more film layers made of Al, Cu, graphite sheets, and nano copper carbon.
  • the thermally conductive film layer includes one or two film layers among a back film layer, a grid adhesive layer and a buffer layer.
  • the thermally conductive film layer includes the stacked back film layer and/or the grid adhesive layer, and a buffer layer is provided on a side of the heat dissipation functional film layer away from the flexible substrate.
  • a heat insulation layer is provided on a side of the heat dissipation functional film layer away from the flexible substrate.
  • the heat dissipation functional film layer includes a temperature homogenizer.
  • a plurality of heat dissipation columns are provided on a side of the temperature homogenizing plate away from the flexible substrate.
  • the display panel includes a flexible circuit board electrically connected through a chip-on-chip film, the flexible circuit board is bent to a side of the temperature equalizing plate away from the flexible substrate, the orthographic projection of the flexible circuit board on the temperature equalizing plate is located in a first area, and the heat dissipation column is located in a second area of the temperature equalizing plate adjacent to the first area.
  • the height of the heat dissipation column in a direction perpendicular to the flexible substrate increases sequentially along a direction from the second area to the first area.
  • a cross-sectional area of the heat dissipation column in a direction parallel to the flexible substrate gradually decreases along a direction away from the flexible substrate.
  • the distribution density of the heat dissipation columns increases sequentially along a direction from the second area to the first area.
  • the flexible substrate is a curved surface structure that is curved in at least a first direction. direction, the distribution density of the heat dissipation columns gradually increases from the two ends of the temperature homogenizing plate to the middle.
  • the area of the direct projection of the heat dissipation column located in the middle area of the temperature equalizing plate on the temperature equalizing plate is a first area
  • the area of the direct projection of the heat dissipation column located in the edge area of the temperature equalizing plate on the temperature equalizing plate is a second area
  • the first area is larger than the second area
  • the flexible circuit board is connected to the temperature equalizing plate via a connector.
  • the heat dissipation column is reused as the connecting piece.
  • the embodiment of the present disclosure further provides a display module, comprising a cover plate and the above-mentioned display panel, and an optical film layer located between the cover plate and the display panel.
  • the temperature t1 at the first position on the light-emitting side of the OLED device satisfies the following formula:
  • the temperature t2 at the second position located on the backlight side of the OLED device satisfies the following formula:
  • R1 or R2 is obtained by the following formula:
  • q0 is the total heat flux density
  • p is the heat generation power of the display panel
  • s is the heat dissipation area of the display panel
  • R1 is the thermal resistance of the light-emitting side of the OLED device
  • R2 is the thermal resistance of the backlight side of the OLED device
  • x is the distance between the first position or the second position and the OLED device
  • ⁇ is the thermal conductivity of each film layer located between the first position or the second position and the OLED device
  • h is the air convection heat transfer coefficient
  • t ⁇ is the ambient temperature.
  • the beneficial effect of the present disclosure is to remove the film layer with poor thermal conductivity between the flexible substrate and the heat dissipation functional film layer, or even directly adhere the heat dissipation functional film layer to the backlight side of the flexible substrate, so as to effectively achieve heat dissipation of the display panel.
  • FIG1 is a schematic diagram showing a structure of a display panel in the related art
  • FIG2 is a first structural diagram of a display panel in an embodiment of the present disclosure
  • FIG3 shows a second structural schematic diagram of a display panel in an embodiment of the present disclosure
  • FIG4 is a third structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG5 is a fourth structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG6 is a fifth structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG7 is a sixth structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG8 is a schematic diagram showing heat dissipation simulation results
  • FIG9 is a schematic diagram showing the comparison between the measured values and the calculated values
  • FIG10 is a seventh structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG11 is a schematic structural diagram 8 of a display panel in an embodiment of the present disclosure.
  • FIG12 is a schematic diagram showing the temperature distribution of the display panel 1;
  • FIG13 is a second schematic diagram showing the temperature distribution of the display panel
  • FIG14 is a ninth structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG15 is a schematic diagram showing the structure of a display panel in an embodiment of the present disclosure.
  • FIG16 is a schematic structural diagram eleven of a display panel in an embodiment of the present disclosure.
  • FIG17 is a second schematic diagram showing the structure of a display panel in the related art.
  • FIG18 shows a side view of FIG17
  • FIG19 is a twelfth structural diagram of a display panel in an embodiment of the present disclosure.
  • Fig. 20 shows a side view of Fig. 19
  • FIG21 shows a schematic diagram of the structure of a flexible circuit board 1
  • FIG22 shows a second structural schematic diagram of a flexible circuit board
  • FIG23 is a thirteenth schematic diagram showing the structure of the display panel in the embodiment of the present disclosure.
  • FIG24 is a fourteenth structural diagram of a display panel in an embodiment of the present disclosure.
  • FIG25 is a schematic diagram showing the structure of the display panel in the embodiment of the present disclosure.
  • FIG26 is a sixteenth structural diagram of a display panel in an embodiment of the present disclosure.
  • Fig. 27 shows a side view of Fig. 26
  • FIG28 is a schematic structural diagram XVII of a display panel in an embodiment of the present disclosure.
  • Fig. 29 shows a side view of Fig. 28
  • FIG30 is a schematic diagram eighteen showing the structure of the display panel in the embodiment of the present disclosure.
  • this embodiment provides a display panel, including a flexible substrate 1, wherein the flexible substrate 1 includes a first side and a second side opposite to each other, wherein an OLED device 2 is provided on the first side, and a heat dissipation functional film layer 4 is directly adhered to the second side, or a thermal conductive film layer 3 and a heat dissipation functional film layer 4 are sequentially provided on the second side in a direction away from the flexible substrate 1, wherein the thermal conductive film layer 3 includes at least one sub-thermal conductive film layer arranged in a stacked manner.
  • the effective heat dissipation functional film layers 4 are not in direct contact with the OLED display screen (that is, they are not in direct contact with the flexible substrate 1), and there are many plastic insulation layers in between (that is, the thermal conductive film layers 3, and the thermal conductivity coefficients of each thermal conductive film layer are different.
  • Some film layers have relatively poor thermal conductivity and strong thermal insulation performance), such as PSA (pressure sensitive adhesive) and PI (polyimide) FILM.
  • PSA pressure sensitive adhesive
  • PI polyimide
  • the main purpose of the plastic insulation layer is to prevent the heat of other electronic components such as IC, CPU, etc. from diffusing to the screen.
  • the function achieved by the combination of the heat dissipation film layer 4 and the thermal conductive film layer 3 is actually to insulate the OLED screen and prevent the heat of other components from diffusing to the OLED screen 2, rather than to dissipate the heat generated by the OLED screen 2.
  • the heat-conducting film layer 3 includes a plurality of sub-heat-conducting film layers, which refers to reducing the number of sub-heat-conducting film layers included in the heat-conducting film layer 3), and only a part of the sub-heat-conducting film layer is left between the flexible substrate 1 and the heat-dissipating functional film layer 4, and the heat-conducting film layer 3 and the heat-dissipating functional film layer 4 are sequentially arranged on the second side, and the heat-conducting film layer 3 includes at least one sub-heat-conducting film layer arranged in a stacked manner. This is beneficial to reducing the temperature of the OLED device 2, slowing
  • the heat dissipation functional film layer 4 includes a high thermal conductivity adhesive, and the high thermal conductivity adhesive is made of one or more of acrylic resin, silicon-based material, thermal conductive silicone grease, and liquid metal.
  • the heat dissipation of the OLED device is achieved by using the high thermal conductivity adhesive with a high thermal conductivity, which accelerates the heat dissipation in a direction perpendicular to the flexible substrate and improves the overall heat dissipation effect of the display panel.
  • the thermal conductivity of the highly thermally conductive adhesive may be different depending on the material used to make it.
  • the thermal conductivity of liquid metal is 80 W/m ⁇ k.
  • the heat dissipation functional film layer 4 further includes a metal layer located on a side of the high thermal conductive adhesive away from the flexible substrate 1, see Fig. 7. This can further improve the overall heat dissipation effect of the display panel.
  • the function of the heat dissipation functional film layer 4 is to achieve heat dissipation. Its specific structural form can be various, and can include a single-layer or multi-layer heat dissipation film layer.
  • the heat dissipation functional film layer 4 includes one or more film layers made of Al, Cu, graphite sheets, and nano copper carbon.
  • an optical film layer 40 is further provided on the light-emitting side of the display panel, and a cover plate CG is further provided on the light-emitting side of the optical film layer 40, and the optical film layer 40 may include a polarizer and a touch layer (but not limited thereto).
  • the OLED device 2 is a heat source, which transfers heat to the light-emitting side and the backlight side respectively.
  • the thickness, thermal conductivity and other parameters of each film layer located on the light-emitting side or the backlight side of the OLED device 2 are different, and the surface temperature of each corresponding film layer is different.
  • the number of sub-thermal conductive film layers in the thermal conductive film layer and the specific structure of the sub-thermal conductive film layer can be selected according to the temperature of the light-emitting surface of the cover plate CG of the display module and the temperature of the bottom surface of the display module.
  • This method uses the heat transfer formula, and the heat flux density q 0 is:
  • p is the heat generation power of the OLED device
  • s is the heat dissipation area
  • q1 is the heat flux density of heat transferred to the light-emitting side
  • q2 is the heat flux density of heat transferred to the backlight side.
  • the steady-state heat transfer resistance of the multilayer wall is:
  • the heat transfer resistance R1 for transferring heat to the light-emitting side and the heat transfer resistance R2 for transferring heat to the backlight side can be obtained.
  • x is the thickness of the film layer located on the light-emitting side or the backlight side of the OLED device
  • ⁇ is the thermal conductivity of the film layer on the light-emitting side or the backlight side of the OLED device
  • h is the air convection heat transfer coefficient
  • q 1 R1 q 2 R2; wherein a is the thickness at a first position on the light-emitting side of the OLED device (i.e., the distance between the OLED device and the first position), b is the thickness at a second position on the backlight side of the OLED device (i.e., the distance between the OLED device and the second position).
  • ⁇ 1 is the thermal conductivity of the film layer on the light-emitting side of the OLED device
  • ⁇ 2 is the thermal conductivity of the film layer on the backlight side of the OLED device
  • t ⁇ is the ambient temperature.
  • the thermally conductive film layer 3 includes a sub-thermal conductive film layer, which is a back film layer (BF) 31 (no heat dissipation functional film layer is provided), refer to FIG. 2 .
  • BF back film layer
  • the thermally conductive film layer 3 includes two sub-thermal conductive film layers, and the two sub-thermal conductive film layers include a back film layer (BF) 31 and a mesh adhesive layer (Embo tape) 32 that are stacked.
  • the heat dissipation functional film layer 4 includes a graphite layer (Graphite sheet) and a copper metal layer (Cu) that are stacked, refer to Figure 3.
  • the thermally conductive film layer 3 includes two sub-thermal conductive film layers, and the two sub-thermal conductive film layers include a back film layer (BF) 31 and a mesh adhesive layer (Embo tape) 32 that are stacked, and the heat dissipation functional film layer 4 includes a stacked graphite layer (Graphite sheet) and a copper metal layer (Cu), and a mesh adhesive layer (Embo tape) and an Al plate are stacked on the side of the heat dissipation functional film layer 4 away from the flexible substrate 1, refer to Figure 4.
  • BF back film layer
  • Embo tape mesh adhesive layer
  • the thermally conductive film layer 3 includes two sub-thermal conductive film layers, and the two sub-thermal conductive film layers include a stacked back film layer (BF) 31 and a mesh adhesive layer (Embo tape) 32, and the heat dissipation functional film layer 4 only includes an AL plate, refer to Figure 5.
  • BF stacked back film layer
  • Embo tape mesh adhesive layer
  • the thermal conductive film layer 3 includes a sub-thermal conductive film layer, the sub-thermal conductive film layer includes an Embo tape 32, and the heat dissipation functional film layer includes an AL board, refer to FIG. 6 .
  • the high thermal conductivity adhesive in the above table is made of liquid metal, but it is not limited to this. In practical applications, acrylic resin or the like can also be used to make the high thermal conductivity adhesive.
  • a back plate BP is provided on one side of the flexible substrate 1
  • an OLED light-emitting layer is provided on the back plate BP
  • an encapsulation layer TFE is provided on the light-emitting side of the OLED light-emitting layer
  • an optical film layer 40 is provided on the side of the encapsulation layer away from the OLED light-emitting layer
  • a cover plate CG is provided on the side of the optical film layer 40 away from the OLED light-emitting layer.
  • the dot numbered 300 represents the temperature of the heat source (i.e., the temperature of the light-emitting layer of the OLED device)
  • the dot numbered 200 represents the temperature of the top surface (i.e., the light-emitting surface of the cover plate) of the above six structures
  • the dot numbered 100 represents the temperature of the bottom surface of the six structures.
  • the temperature values (calculated values) obtained by the above formula and the actually measured temperature values (measured values) have the same change trend.
  • the measured value in structure one is 46.6
  • the measured value in structure two is 44.4
  • the temperature decreases.
  • the calculated value in structure one is 43.45
  • the calculated value in structure two is 43.41, and the temperature also has a decreasing trend. Therefore, the calculated value obtained by the above formula is of guiding significance, and the corresponding sub-thermal conductive film layer can be increased or decreased according to the corresponding calculated value to meet the corresponding heat dissipation requirements.
  • the heat generation power P of the vehicle display screen is 21.84W.
  • the film stacking structure of the display screen and the thickness thermal conductivity of each film layer are shown in the following table.
  • the air convection heat transfer coefficient h is 10W/(m2.k). Please calculate the maximum temperature of the display screen (heat source temperature, i.e., the temperature of the OLED device) t, the surface temperature of the cover plate (CG) t1, and the surface temperature of the Al plate t2.
  • the light-emitting side of the display panel panel is sequentially laminated with a polarizer pol, a first optical adhesive layer COA2, a touch substrate TSP, a second optical adhesive layer COA1 and a cover plate CG, and the backlight side of the display panel panel is sequentially laminated with a back film BF, a mesh adhesive layer EMBO, a foam adhesive layer FOAM, a graphite layer GRAPHITE, a double-sided adhesive layer DOUBLE TAPE and an aluminum plate AL.
  • the thermally conductive film layer 3 includes a back film layer (BF) 31, an Embo tape 32, and a buffer layer 33 (such as a foam adhesive layer Foam) One or two film layers.
  • BF back film layer
  • Embo tape 32 an Embo tape
  • buffer layer 33 such as a foam adhesive layer Foam
  • the thermal conductive film layer 3 not only saves the PSA (pressure sensitive adhesive layer) and PI (poly The imide film layer) is also removed, and one of the back film layer (BF) 31, the mesh adhesive layer (Embo tape) 32 and the buffer layer 33 is removed, so that the heat generated when the OLED display panel is working can be better transferred through the heat dissipation functional film layer 4, which is beneficial to reduce the temperature of the OLED display panel.
  • PSA pressure sensitive adhesive layer
  • PI poly The imide film layer
  • the thermally conductive film layer 3 includes the stacked back film layer (BF) 31 and/or the mesh adhesive layer (Embo tape) 32, and a buffer layer 33 is provided on the side of the heat dissipation functional film layer 4 away from the flexible substrate 1 (using a foam adhesive layer Foam, the foam adhesive layer Foam is connected to one side of the heat dissipation functional film layer 4 through an adhesive layer (Adhesive layer)), refer to Figure 11.
  • the comparison structure is the structure of Figure 1, with PSA (pressure-sensitive adhesive layer) and PI (polyimide film layer) above the heat dissipation functional film layer 4.
  • the heat dissipation functional layer 4 is a metal layer (Cu) with a thickness of 80um and a graphite sheet with a thickness of 17um (not shown in Figure 11).
  • the screen is lit at 800nits for 1h, the screen brightness and surface temperature distribution corresponding to the structure in Figure 1 are shown in Figure 13, and the temperature distribution is 38.9-45.2°C.
  • the screen brightness and surface temperature distribution corresponding to the structure in Figure 11 are shown in Figure 12, and the temperature distribution is 38.1-44.7°C, and the temperature drops by about 0.5°C.
  • a temporary protective film is usually affixed to the bottom of the flexible substrate 1.
  • the material of this film is usually plastic such as PI or PET, which has very poor thermal conductivity.
  • the back film BF is removed on the basis of Figure 11. Referring to Figure 14, compared with the structure of Figure 11, it is more conducive to the heat dissipation of the OLED panel.
  • a heat insulation layer is provided on a side of the heat dissipation functional film layer 4 away from the flexible substrate 1 .
  • a heat insulation layer can be added on the side of the heat dissipation functional film layer 4 away from the flexible substrate 1.
  • the heat insulation layer can be made of insulating materials such as PSA/PI. Referring to FIG15 , the heat insulation layer includes a pressure-sensitive adhesive layer (PSA) 5 and a polyimide layer (PI) 6.
  • the foam rubber layer that serves as a buffer can be omitted, see FIG. 16 .
  • the heat dissipation functional film layer 4 includes a temperature vapor chamber.
  • the setting of the temperature averaging plate is conducive to reducing the overall temperature of the OLED module (the temperature averaging plate can achieve uniformity and cooling at the same time (neutralization of the high temperature part and the low temperature part, actually achieving cooling)) and improving In-plane temperature uniformity.
  • heat pipes and vapor chambers are widely used in high-power or highly integrated electronic products.
  • the vapor chamber is a vacuum cavity with a capillary microstructure on the inner wall.
  • the basic principle and theoretical framework are the same as those of the heat pipe. The difference is that the heat conduction method is different.
  • the heat pipe conducts in one dimension and is linear, while the vapor chamber conducts in two dimensions and is a surface conduction method. Specifically, after absorbing the heat from the chip, the liquid at the bottom of the vacuum cavity evaporates and diffuses into the vacuum cavity, conducts the heat to the heat sink fins, and then condenses into liquid and returns to the bottom. This evaporation and condensation process, similar to that of a refrigerator or air conditioner, circulates rapidly in the vacuum cavity, achieving a very high heat dissipation efficiency.
  • the temperature plate is a two-piece structure, and its width can be customized arbitrarily, and is theoretically unlimited. Due to its large area, its maximum heat transfer is also relatively large.
  • the bosses are etched on the copper plate using etching technology, and the bosses play a supporting role.
  • the inside of the other copper plate is fitted with a copper mesh as a capillary structure.
  • the gap between the copper columns (i.e. the bosses) is the steam flow channel, and the copper mesh is the liquid reflux channel.
  • the VC temperature spreader is also a representative of phase change heat conduction. It is also made of pure copper, which is internally sealed and hollow (the inner wall is not smooth and covered with capillary structures), and is a heat dissipation unit filled with condensate. However, its shape is not the flat "strip" of the heat pipe, but a wider flat "sheet”.
  • the working principle of the VC temperature spreader is similar to and different from that of the heat pipe, but generally includes four steps: conduction ⁇ evaporation ⁇ convection ⁇ solidification.
  • the gas When the gas is transferred to the condensation section, it is condensed into liquid.
  • the condensed liquid is transferred to the evaporation section through the action of capillary force in the liquid absorption core, forming a cycle (the specific structural setting of the temperature spreader can refer to the relevant technology, and will not be repeated here).
  • a plurality of heat dissipation columns 20 are disposed on a side of the temperature vapor chamber away from the flexible substrate.
  • the flexible substrate and the OLED device are represented as a whole, that is, the display substrate indicated by 10 in FIGS. 20 to 30 .
  • heat dissipation columns 20 are added to further expand the heat dissipation area, which is beneficial to lowering the temperature of the OLED module, reducing the temperature difference within the surface of the OLED module, and improving the yellowing MURA (uneven brightness) phenomenon in the back fold area of the PCB.
  • the display panel includes a flexible circuit board 7 electrically connected via a COF film, and the flexible circuit board 7 is bent to a side of the temperature evaporating plate away from the flexible substrate.
  • the orthographic projection of the flexible circuit board 7 on the temperature homogenizing plate is located in a first area, and the heat dissipation column 20 is located in a second area of the temperature homogenizing plate adjacent to the first area.
  • the conventional OLED module heat dissipation method is to attach a heat dissipation film or a heat dissipation aluminum plate to the non-display surface of the screen, and the PCB (i.e., flexible circuit board) is folded back and attached to the aluminum plate.
  • the PCB i.e., flexible circuit board
  • the heat of the PCB board 7 will be transferred to the screen, causing the temperature of the lower and upper ends of the screen to be inconsistent.
  • the upper end of the screen has a low temperature, and the lower end has a high temperature, so the brightness of the lower end decays faster than the upper end, which will cause the picture at the lower end to turn yellow after a long time.
  • the heat dissipation functional film layer 4 includes a temperature averaging plate, and the flexible circuit board 7 is bent to the side of the temperature averaging plate away from the flexible substrate to improve the uniformity of the overall temperature of the display panel.
  • the flexible circuit board 7 in order to achieve the purpose of reducing the length of the flexible circuit board 7 (the length in the direction from the flip chip film to the flexible circuit board), the flexible circuit board can be made to adopt a multi-layer structure, and even the number of stacked layers in the flexible circuit board can be increased.
  • the flexible circuit board adopts a 4-layer structure (including two signal layers (signal routing layers, and a GND plane layer (ground layer) and a power plane layer (functional routing layer) located between the two signal routing layers), and in Figure 22, the flexible circuit board adopts an 8-layer structure (including four signal layers (signal routing layers), which are respectively the first signal routing layer, The second signal routing layer, the third signal routing layer and the fourth signal routing layer, a GND plane layer (grounding layer) is arranged between the first signal routing layer and the second signal routing layer, a GND plane layer (grounding layer) is arranged between the third signal routing layer and the fourth signal routing layer, a GND plane layer (grounding layer) and a power plane layer (functional routing layer) are arranged between the second signal routing layer and the third signal routing layer), the laminated structure in FIG22 is relative to the laminated structure in FIG21, and the length of the flexible circuit board 7 (the length in the direction from the chip-on-cover film to the flexible circuit board)
  • the flexible circuit board includes a signal layer (signal wiring layer), a GND plane layer (ground layer), and a power plane layer (functional wiring layer).
  • the heat dissipation column 20 is perpendicular to the direction of the flexible substrate (ie The height of the heat dissipation column 20 in the direction perpendicular to the flexible substrate increases successively along the direction from the second area to the first area.
  • the arrangement manner in which the height of the heat dissipation column 20 in the direction perpendicular to the flexible substrate increases successively along the direction from the second area to the first area can reduce the temperature difference between the first area and the second area.
  • the cross-sectional area of the heat dissipation column in a direction parallel to the flexible substrate gradually decreases along a direction away from the flexible substrate, refer to FIG. 24 .
  • the height of the heat dissipation column 20 in a direction perpendicular to the flexible substrate increases sequentially along the direction from the second area to the first area, and the cross-sectional area of the heat dissipation column in a direction parallel to the flexible substrate gradually decreases along the direction away from the flexible substrate, refer to Figure 25.
  • the distribution density of the heat dissipation columns increases sequentially along the direction from the second area to the first area, refer to Figures 26 and 27.
  • the flexible substrate is a curved structure that is bent in at least a first direction (i.e., the display substrate 10 is a curved structure that is bent in at least a first direction), and along the first direction, the distribution density of the heat dissipation columns 20 gradually increases from both ends of the temperature equilibrium plate to the middle, refer to Figures 28 and 29.
  • the area of the direct projection of the heat dissipation column 20 located in the middle area of the temperature equalizing plate on the temperature equalizing plate is a first area
  • the area of the direct projection of the heat dissipation column 20 located in the edge area of the temperature equalizing plate on the temperature equalizing plate is a second area
  • the first area is greater than the second area
  • the size, spacing, height, diameter, etc. of the heat dissipation columns are determined according to the actual heat dissipation needs.
  • the diameter is generally between 1 and 50 mm
  • the spacing between adjacent heat dissipation columns is generally between 1 and 30 mm
  • the height of the heat dissipation columns is generally between 0.5 and 100 mm.
  • the shape can be cylindrical (including cylinders with different upper and lower diameters), elliptical, square, rectangular, conical, etc.
  • the distribution can be uniform or uneven, the height can be consistent or inconsistent, and can be upright or inclined.
  • the flexible circuit board 7 is connected to the temperature equalizing plate via a connector 30 , see FIG. 30 .
  • the connecting member 30 may be a screw column, through which the flexible circuit board is prevented from directly contacting the temperature balancing board. touch.
  • the heat dissipation column 20 is reused as the connecting member.
  • the embodiment of the present disclosure further provides a display module, comprising a cover plate and the above-mentioned display panel, and an optical film layer located between the cover plate and the display panel.
  • the temperature t1 at the first position on the light-emitting side of the OLED device satisfies the following formula:
  • the temperature t2 at the second position located on the backlight side of the OLED device satisfies the following formula:
  • R1 or R2 is obtained by the following formula:
  • q0 is the total heat flux density
  • p is the heat generation power of the display panel
  • s is the heat dissipation area of the display panel
  • R1 is the thermal resistance of the light-emitting side of the OLED device
  • R2 is the thermal resistance of the backlight side of the OLED device
  • x is the distance between the first position or the second position and the OLED device
  • ⁇ is the thermal conductivity of each film layer located between the first position or the second position and the OLED device
  • h is the air convection heat transfer coefficient
  • t ⁇ is the ambient temperature.
  • the calculation result of the above formula can be used as a reference to determine the number of sub-thermal conductive film layers included in the thermal conductive film layer and the specific material to be used.

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Abstract

一种显示面板及显示模组，包括柔性衬底（1），柔性衬底（1）包括相对的第一侧和第二侧，第一侧设置有OLED器件（2），第二侧直接贴合有散热功能膜层（4），或者沿着远离柔性衬底（1）的方向，在第二侧依次设置有导热膜层（3）和散热功能膜层（4），导热膜层（3）包括层叠设置的至少一个子导热膜层。

Description

显示面板和显示模组
相关申请的交叉引用
本申请主张在2022年9月29日在中国提交的中国专利申请号No.202211200771.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示产品制作技术领域，尤其涉及一种显示面板和显示模组。
背景技术
有机发光二极管(organic light emitting diode,OLED)由于具有自发光，高效率，色彩鲜艳、轻薄省电，可卷曲以及使用温度范围宽等优点，被誉为梦幻显示器，近年来，OLED已在中小尺寸显示领域得到广泛的应用，并逐步进入大面积显示和照明等领域。OLED已在中小尺寸显示领域得到广泛的应用，并逐步进入大面积显示，车载和照明等领域。
柔性可折叠面板可以更灵活的进行设计，可大大提高汽车显示面板的科技感，是未来车载面板的发展趋势，然而OLED显示面板在使用过程中也会产生焦耳热，从而使显示面板的温度升高(例如，在环境温度为26.3℃，即为室温时，无散热结构的全白显示画面亮度为600nits时的温度高达37.6～43.1℃，面内温差为5.5℃)，而温度升高会加速OLED显示面板亮度的衰减(例如，OLED显示面板在85℃下的寿命衰减速度远远快于常温下的寿命衰减，如500小时时，常温下亮度衰减至初始亮度的97.97％；但在85℃下，亮度衰减至初始亮度的72％)，而汽车的使用寿命往往长达10年甚至更久，因此对面板的长期耐热性要求十分高。如何改善OLED面板的散热是本领域技术人员需要解决的技术难题之一。
发明内容
为了解决上述技术问题，本公开提供一种显示面板和显示模组，改善显示面板的散热难的问题。
为了达到上述目的，本公开实施例采用的技术方案是：一种显示面板，包括柔性衬底，所述柔性衬底包括相对的第一侧和第二侧，所述第一侧设置有OLED器件，所述第二侧直接贴合有散热功能膜层，或者沿着远离所述柔性衬底的方向，在所述第二侧依次设置有导热膜层和散热功能膜层，所述导热膜层包括层叠设置的至少一个子导热膜层。
可选的，所述散热功能膜层包括高导热胶，所述高导热胶采用丙烯酸树脂、硅基材料和导热硅脂、液态金属中的一种或多种制成。
可选的，所述散热功能膜层还包括位于所述高导热胶远离所述柔性衬底的一侧的金属层。
可选的，所述散热功能膜层包括由Al、Cu、石墨片、纳米铜碳制成的膜层中的一个或者多个膜层。
可选的，所述导热膜层包括背膜层、网格胶层和缓冲层中的一个膜层或2个膜层。
可选的，所述导热膜层包括叠置的所述背膜层和/或所述网格胶层，在所述散热功能膜层远离所述柔性衬底的一侧设置有缓冲层。
可选的，所述散热功能膜层远离所述柔性衬底的一侧设置有隔热层。
可选的，所述散热功能膜层包括均温板。
可选的，所述均温板远离所述柔性衬底的一侧设置有多个散热柱。
可选的，所述显示面板包括通过覆晶薄膜进行电连接的柔性线路板，所述柔性线路板弯折至所述均温板远离所述柔性衬底的一侧，所述柔性线路板在所述均温板上的正投影位于第一区域内，所述散热柱位于所述均温板上与所述第一区域相邻的第二区域内。
可选的，所述散热柱在垂直于所述柔性基底的方向上的高度沿着从所述第二区域到所述第一区域的方向依次增大。
可选的，所述散热柱在平行于所述柔性基底的方向上的截面积沿着远离所述柔性衬底的方向逐渐减小。
可选的，所述散热柱的分布密度沿着从所述第二区域到所述第一区域的方向依次增大。
可选的，所述柔性基底为至少在第一方向上弯曲的曲面结构，沿所述第一 方向，所述散热柱的分布密度由所述均温板的两端向中间逐渐增大。
可选的，位于所述均温板的中间区域的所述散热柱在所述均温板上的正投影的面积为第一面积，位于所述均温板的边缘区域的所述散热柱在所述均温板的正投影的面积为第二面积，所述第一面积大于所述第二面积。
可选的，所述柔性线路板通过连接件连接于所述均温板上。
可选的，所述散热柱复用为所述连接件。
本公开实施例还提供一种显示模组，包括盖板和上述的显示面板，以及位于所述盖板和所述显示面板之间的光学膜层，
位于所述OLED器件的出光侧的第一位置的温度t1满足以下公式：
位于所述OLED器件的背光侧的第二位置的温度t2满足以下公式：
R1或R2由以下公式获得：
q0由以下公式获得：q0＝p/s
其中，q0为总热流密度，p为显示面板的发热功率，s为显示面板的散热面积，R1为所述OLED器件的出光侧的热阻，R2为所述OLED器件的背光侧的热阻，x为所述第一位置或所述第二位置与所述OLED器件之间的距离，λ为位于所述第一位置或所述第二位置和所述OLED器件之间的各膜层的导热系数，h为空气对流换热系数，t∞为环境温度。
本公开的有益效果是：去除所述柔性衬底和所述散热功能膜层之间导热性能差的膜层，甚至是将散热功能膜层直接贴合于所述柔性衬底的背光侧，有效的实现所述显示面板的散热。
附图说明
图1表示相关技术中的显示面板的结构示意图一；
图2表示本公开实施例中的显示面板的结构示意图一；
图3表示本公开实施例中的显示面板的结构示意图二；
图4表示本公开实施例中的显示面板的结构示意图三；
图5表示本公开实施例中的显示面板的结构示意图四；
图6表示本公开实施例中的显示面板的结构示意图五；
图7表示本公开实施例中的显示面板的结构示意图六；
图8表示散热模拟结果示意图；
图9表示实测值和计算值对比示意图；
图10表示本公开实施例中的显示面板的结构示意图七；
图11表示本公开实施例中的显示面板的结构示意图八；
图12表示显示面板的温度分布示意图一；
图13表示显示面板的温度分布示意图二；
图14表示本公开实施例中的显示面板的结构示意图九；
图15表示本公开实施例中的显示面板的结构示意图十；
图16表示本公开实施例中的显示面板的结构示意图十一；
图17表示相关技术中的显示面板的结构示意图二；
图18表示图17的侧视图；
图19表示本公开实施例中的显示面板的结构示意图十二；
图20表示图19的侧视图；
图21表示柔性线路板的结构示意图一；
图22表示柔性线路板的结构示意图二；
图23表示本公开实施例中的显示面板的结构示意图十三；
图24表示本公开实施例中的显示面板的结构示意图十四；
图25表示本公开实施例中的显示面板的结构示意图十五；
图26表示本公开实施例中的显示面板的结构示意图十六；
图27表示图26的侧视图；
图28表示本公开实施例中的显示面板的结构示意图十七；
图29表示图28的侧视图；
图30表示本公开实施例中的显示面板的结构示意图十八。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开 实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
在本公开的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
参考图2-图30，本实施例提供一种显示面板，包括柔性衬底1，所述柔性衬底1包括相对的第一侧和第二侧，所述第一侧设置有OLED器件2，所述第二侧直接贴合有散热功能膜层4，或者沿着远离所述柔性衬底1的方向，在所述第二侧依次设置有导热膜层3和散热功能膜层4，所述导热膜层3包括层叠设置的至少一个子导热膜层。
参考图1，相关技术中，有效的散热功能膜层4均未与OLED显示屏幕直接接触(即未与所述柔性衬底1直接接触)，中间隔了很多塑料绝热层(即导热膜层3，各导热膜层的导热系数不同，有的膜层导热性能比较差，隔热性能较强)，如PSA(压敏胶)和PI(聚酰亚胺)FILM，塑料绝热层的主要目的是为了防止其他电子元器件如IC、CPU等的热量扩散到屏幕上去，因此，散热膜层4和导热膜层3相结合实现的功能实际上是对OLED屏幕进行隔热，防止其他元器件的热量扩散到OLED屏幕2，而非对OLED屏幕2产生的热量进行散热。
本实施例中，去除所述散热功能膜层4和所述柔性衬底1之间的全部的导热膜层3，将所述散热功能膜层4直接贴合于所述柔性衬底1的第二侧，或者去掉部分导热膜层3(所述导热膜层3包括多个子导热膜层，这里指的是减少所述导热膜层3所包含的子导热膜层的数量)，仅在所述柔性衬底1和所述散热功能膜层4之间留一部分子导热膜层，在所述第二侧依次设置有导热膜层3和散热功能膜层4，所述导热膜层3包括层叠设置的至少一个子导热膜层，这 样有利于降低所述OLED器件2的温度，减缓OLED显示面板的亮度衰减，延长使用寿命。
示例性的实施方式中，所述散热功能膜层4包括高导热胶，所述高导热胶采用丙烯酸树脂、硅基材料和导热硅脂、液态金属中的一种或多种制成。
通过导热系数较高的所述高导热胶实现所述OLED器件的散热，加速了在垂直于所述柔性衬底的方向上的散热，提高所述显示面板的整体的散热效果。
所述高导热胶的制作材料不同，则相应的导热系数会有所不同，例如液态金属的导热系数为80W/m·k。
示例性的实施方式中，所述散热功能膜层4还包括位于所述高导热胶远离所述柔性衬底1的一侧的金属层，参考图7。这样可以进一步的提高所述显示面板的整体的散热效果。
所述散热功能膜层4的作用在于实现散热，其具体结构形式可以有多种，可以包括单层或多层的散热膜层，示例性的实施方式中，所述散热功能膜层4包括由Al、Cu、石墨片、纳米铜碳制成的膜层中的一个或者多个膜层。
在包括所述显示面板的显示模组中，所述显示面板的出光侧还设置有光学膜层40，所述光学膜层40的出光侧还设置有盖板CG，所述光学膜层40可以包括偏光片和触控层(但并不以此为限)。OLED器件2为热源，分别向出光侧和背光侧传递热量，位于所述OLED器件2的出光侧的或背光侧的各膜层的厚度、导热系数等参数不同，则相应的各膜层的表面的温度不同，可以根据所述显示模组的盖板CG的出光面的温度以及所述显示模组的底面的温度选择所述导热膜层中的子导热膜层的数量，以及所述子导热膜层的具体结构。
该方法利用热传递公式，热流密度q0为：
总热流密度其中p为OLED器件的发热功率，s为散热面积，q1为热量向出光侧传递的热流密度，q2为热量向背光侧传递的热流密度。
根据第三类边界条件多层壁稳态传热热阻为：可以获得向出光侧传递热量的传热热阻R1和向背光侧传递热量的传热热阻R2。
其中，x为位于所述OLED器件的出光侧或背光侧的膜层的厚度，λ为所述OLED器件的出光侧或背光侧的膜层的导热系数，h为空气对流换热系数，
热平衡时，温度最高点位于所述OLED器件(实际上是所述OLED器件中的发光层)，x＝0，则根据以下公式和 获得即q1R1＝q2R2；其中a为位于所述OLED器件的出光侧的第一位置的厚度(即所述OLED器件与所述第一位置之间的距离)，b为所述OLED器件的背光侧的第二位置的厚度(即所述OLED器件与所述第二位置之间的距离)。λ1为所述OLED器件的出光侧的膜层的导热系数，λ2为所述OLED器件的背光侧的膜层的导热系数，t∞为环境温度。
根据公式q1R1＝q2R2和q0＝q1+q2可获得：
根据上述公式，x＝a时，所述第一位置的温度
x＝b时，所述第二位置的温度
选取了以下几种结构形式进行各膜层的温度计算：
结构一：所述导热膜层3包括一层子导热膜层，该子导热膜层为背膜层(BF)31(未设置散热功能膜层)，参考图2。
结构二：所述导热膜层3包括两层子导热膜层，该两层子导热膜层包括层叠设置的背膜层(BF)31和网格胶层(Embo tape)32，所述散热功能膜层4包括层叠设置的石墨层(Graphite sheet)和铜金属层(Cu)，参考图3。
结构三：所述导热膜层3包括两层子导热膜层，该两层子导热膜层包括层叠设置的背膜层(BF)31和网格胶层(Embo tape)32，所述散热功能膜层4包括层叠设置的石墨层(Graphite sheet)和铜金属层(Cu)，且在所述散热功能膜层4远离所述柔性衬底1的一侧层叠设置有网格胶层(Embo tape)和Al板，参考图4。
结构四：所述导热膜层3包括两层子导热膜层，该两层子导热膜层包括层叠设置的背膜层(BF)31和网格胶层(Embo tape)32，所述散热功能膜层4仅包括AL板，参考图5。
结构五：所述导热膜层3包括一层子导热膜层，该层子导热膜层包括网格胶层(Embo tape)32，所述散热功能膜层包括AL板，参考图6。
结构六：所述柔性衬底1和所述散热功能膜层4之间未设置导热膜层，所述柔性衬底1与所述散热功能膜层4直接接触，所述散热功能膜层4包括层叠设置的高导热胶和AL板，参考图7。
各个膜层结构的厚度以及导热系数如下表一所示：
需要说明的是，上表中高导热胶采用液态金属制成，但并不限于此，在实际应用中，还可以采用丙烯酸树脂等制成高导热胶。
温度计算值如下表二：
需要说明的是，所述柔性衬底1的一侧设置有背板BP，背板BP上设置有OLED发光层，所述OLED发光层的出光侧设置有封装层TFE，封装层远离所述OLED发光层的一侧设置有光学膜层40，所述光学膜层40远离所述OLED发光层的一侧设置有盖板CG，上述表格中并没有表示出具体的每个膜层的相应的表面的温度。
图8中标号为300的圆点表示热源温度(即OLED器件发光层的温度)，标号为200的圆点为上述六种结构中的顶面(即盖板的出光面)的温度，标号为100的圆点表示六种结构中的底面的温度。
由上表和图8可获得，上述结构中，采用结构六，盖板的上表面的温度是最低的。
在白色画面下，通过上述公式计算获得的计算值与实测值对比如图9所示(图9中选取了结构一到结构四的四种结构的实测值和计算值进行对比)：图9中斜纹图案代表的是计算值，点状图案代表的是实测值。
参考图9可知，对于不同的结构，经过上述公式计算获得的温度值(计算值)和实际测量的温度值(实测值)的变化趋势一致，例如，结构一中的实测值为46.6，结构二中的实测值为44.4，温度降低，而结构一中的计算值为43.45，结构二中的计算值为43.41，温度也是降低趋势，因此，通过上述公式计算获得的计算值具有指导意义，可根据相应的计算值增减相应的子导热膜层以达到相应的散热的需求。
显示面板应用于显示屏时，在室温25℃环境下，车载显示屏的发热功率P为21.84W，显示屏的膜层堆叠结构及每种膜层的厚度导热系数如下表，空气对流换热系数h取10W/(m2.k)，请计算显示屏的最高温度(热源温度，即OLED器件的温度)t以及盖板(CG)表面温度t1和Al板表面温度t2。
以下表格中显示面板panel的出光侧依次叠层设置有偏光片pol、第一光学胶层COA2、触控基板TSP、第二光学胶层COA1和盖板CG，显示面板panel的背光侧依次叠层设置有背膜BF、网格胶层EMBO、泡棉胶层FOAM、石墨层GRAPHITE、双面胶层DOUBLE TAPE、铝板AL。
最高点温度
上表面温度
下表面温度
由上述公式获得：R1＝0.1100，R2＝0.1022，q0＝386.1181，t＝45.4573，t1＝43.6003，t2＝45.0115。
以下介绍本实施例中的几种结构形式。
示例性的实施方式中，所述导热膜层3包括背膜层(BF)31、网格胶层(Embo tape)32和缓冲层33(例如泡棉胶层Foam)中的一个膜层或2个膜层。
相对于传统技术，所述导热膜层3不但省去了PSA(压敏胶层)和PI(聚 酰亚胺膜层)，还去掉了背膜层(BF)31、网格胶层(Embo tape)32和缓冲层33中的一个，这样OLED显示面板工作时产生的热量可更好的通过散热功能膜层4进行热传递，从而有利于降低OLED显示面板的温度。
示例性的实施方式中，所述导热膜层3包括叠置的所述背膜层(BF)31和/或所述网格胶层(Embo tape)32，在所述散热功能膜层4远离所述柔性衬底1的一侧设置有缓冲层33(采用泡棉胶层Foam，泡棉胶层Foam通过粘结胶层(Adhesive layer)与所述散热功能膜层4的一侧)，参考图11。
对比结构为图1的结构，散热功能膜层4的上方有PSA(压敏胶层)和PI(聚酰亚胺膜层)，图11中，散热功能层4为厚度为80um的金属层(Cu)和厚度为17um的石墨片(图11中未示)，屏幕在800nits下点亮1h后，图1中的结构对应的屏幕亮度及表面温度分布如图13所示，温度分布为38.9—45.2℃，图11中的结构对应的屏幕亮度及表面温度分布如图12所示，温度分布为38.1—44.7℃，温度降低约0.5℃。
在OLED屏幕制备了OLED发光层和封装层之后，为了避免OLED屏幕在后续制程中的划伤等，通常会在柔性衬底1的下方贴上一层临时性保护膜，一般叫做背膜(Bottom film)，而这一层膜的材质通常为PI或PET等塑料，其导热性非常差，本实施例的一实施方式中在图11的基础上去除了背膜BF，参考图14，相对于图11的结构，更有利于OLED面板的散热。
示例性的实施方式中，所述散热功能膜层4远离所述柔性衬底1的一侧设置有隔热层。
如果散热功能膜层4的下方还有电子元器件，如驱动OLED屏幕所需要的Tcon FPC，则需防止Tcon FPC的热量扩散到OLED显示屏上，可在散热功能膜层4远离所述柔性衬底1的一侧增加隔热层，隔热层可以采用PSA/PI等绝热材料，参考图15，隔热层包括压敏胶层(PSA)5和聚酰亚胺层(PI)6。
如果显示屏的抗机械振动效果符合要求，则还可以省去起缓冲作用的泡棉胶层，参考图16。
参考图20-图30，示例性的实施方式中，所述散热功能膜层4包括均温板。
均温板的设置有利于降低OLED模组的整体温度(均温板实现均一性地同时可实现降温(高温部分和低温部分的中和，实际上实现了降温))和提高 面内温度均一性。
需要说明的是：热管(Heatpipe)和均温板(Vapor Chamber，简称VC)在高功率或高集成度电子产品中应用广泛。均温板是一个内壁具有毛细微结构的真空腔体，与热管的的基本原理和理论架构是一样的，不同的是热传导的方式不一样，热管的传导是一维的、是线性传导，而均温板是二维的、是面的传导方式。具体来说，真空腔底部的液体在吸收芯片热量后，蒸发扩散至真空腔内，将热量传导至散热鳍片上，随后冷凝为液体回到底部。这种类似冰箱空调的蒸发、冷凝过程在真空腔内快速循环，实现了相当高的散热效率。
均温板是两片式结构，其宽度可以任意定制，理论上不受限制。由于面积大，其最大传热量也比较大。使用蚀刻的技术在铜板上蚀刻出凸台，凸台起到支撑作用。另外一片铜板内部则贴合铜网作为毛细结构。铜柱(即所述凸台)间的间隙就是蒸汽流动通道，铜网则是液体回流通道。
VC均温板同样属于相变导热的代表，也是由纯铜打造的内部密封且中空(内壁不光滑，布满毛细结构)，并填充冷凝液的散热单元，只是它的形态并非热管的扁平“条状”，而是呈现出更宽的扁平“片状”。VC均温板的工作原理和热管有相似也有不同，但大体上都包含传导→蒸发→对流→凝固四个步骤。当VC蒸发段受热时，蒸发段内侧吸液芯内液体蒸发，此处压强升高，蒸汽在压差的作用下向冷凝段转移。当气体转移到冷凝段后被冷凝成液体。冷凝后的液体在吸液芯内通过毛细力的作用转移到蒸发段，形成循环(均温板的具体结构设置可参照相关技术，再此不再赘述)。
示例性的实施方式中，所述均温板远离所述柔性衬底的一侧设置有多个散热柱20。
需要说明的是，图20-图30中，将柔性衬底和OLED器件作为一个整体来表示，即图20-图30中10所标示的显示基板。
在均温板的基础上增加了散热柱20以进一步扩大散热面积，有利于降低OLED模组的温度，减小OLED模组面内温差，改善PCB背折区域出现发黄MURA(亮度不均)的现象。
示例性的实施方式中，所述显示面板包括通过覆晶薄膜进行电连接的柔性线路板7，所述柔性线路板7弯折至所述均温板远离所述柔性衬底的一侧，所 述柔性线路板7在所述均温板上的正投影位于第一区域内，所述散热柱20位于所述均温板上与所述第一区域相邻的第二区域内。
常规的OLED模组散热方法是在屏幕的非显示面贴散热膜或者散热铝板，PCB(即柔性线路板)背折贴到铝板的上面，如图17和图18所示，由于PCB上有芯片的高发热的器件，因此PCB板7的热量会传递到屏幕上，造成屏幕下端和上端的温度不一致，屏幕上端温度低，下端温度高，因而下端的亮度衰减快于上端，长时间之后会导致下端的画面发黄。本实施例中，所述散热功能膜层4包括均温板，将所述柔性线路板7弯折至所述均温板远离所述柔性衬底的一侧，提升显示面板的整体的温度的均一性。
将图17和图19进行对比，图18和图20进行对比可知，本实施例中，将柔性线路板7的长度(从所述覆晶薄膜到所述柔性线路板板的方向上的长度)缩小，从而减小所述柔性线路板7在所述显示基板10上的正投影的面积，进而减小由于柔性线路板7造成的温度差。
示例性的，为了实现将柔性线路板7的长度(从所述覆晶薄膜到所述柔性线路板板的方向上的长度)缩小的目的，可以使得所述柔性线路板采用多层结构，甚至可以增加所述柔性线路板中叠层的数量，参照图21和图22，图21中，柔性线路板采用4层结构(包括两层signal层(信号走线层)，和位于两层信号走线层之间的GND plane层(接地层)和power plane层(功能走线层))，图22中柔性线路板采用8层结构(包括四层signal层(信号走线层)，沿第一方向分别为第一信号走线层、第二信号走线层、第三信号走线层和第四信号走线层，所述第一信号走线层和第二信号走线层之间设置有GND plane层(接地层)，所述第三信号走线层和第四信号走线层之间设置有GND plane层(接地层)，所述第二信号走线层和所述第三信号走线层之间设置有GND plane层(接地层)和power plane层(功能走线层))，图22中的叠层结构相对与图21中的叠层结构，柔性线路板7的长度(从所述覆晶薄膜到所述柔性线路板板的方向上的长度)的缩小量超过50％，但并不以此为限。
需要说明的是，图7和图8中，所述柔性线路板包括signal层(信号走线层)，GND plane层(接地层)，power plane层(功能走线层)
示例性的实施方式中，所述散热柱20在垂直于所述柔性基底的方向(即 垂直于显示基板10的方向)上的高度沿着从所述第二区域到所述第一区域的方向依次增大，参考图23，由于所述柔性线路板7的设置，靠近所述柔性线路板的区域的温度高于远离所述柔性线路板的区域的温度，所述散热柱20在垂直于所述柔性基底的方向上的高度沿着从所述第二区域到所述第一区域的方向依次增大的设置方式，可以减小所述第一区域和所述第二区域的温度差。
示例性的实施方式中，所述散热柱在平行于所述柔性基底的方向上的截面积沿着远离所述柔性衬底的方向逐渐减小，参考图24。
示例性的实施方式中，所述散热柱20在垂直于所述柔性基底的方向(即垂直于显示基板10的方向)上的高度沿着从所述第二区域到所述第一区域的方向依次增大，且所述散热柱在平行于所述柔性基底的方向上的截面积沿着远离所述柔性衬底的方向逐渐减小，参考图25。
示例性的实施方式中，所述散热柱的分布密度沿着从所述第二区域到所述第一区域的方向依次增大，参考图26和图27。
示例性的实施方式中，所述柔性基底为至少在第一方向上弯曲的曲面结构(即所述显示基板10为至少在第一方向上弯曲的曲面结构)，沿所述第一方向，所述散热柱20的分布密度由所述均温板的两端向中间逐渐增大，参考图28和图29。
示例性的实施方式中，位于所述均温板的中间区域的所述散热柱20在所述均温板上的正投影的面积为第一面积，位于所述均温板的边缘区域的所述散热柱20在所述均温板的正投影的面积为第二面积，所述第一面积大于所述第二面积，参考图28和图29。
需要说明的是，散热柱尺寸、间距、高度、直径等根据实际的散热需求确定，其直径一般在1～50mm之间，相邻散热柱之间的间距一般在1～30mm，散热柱的高度一般为0.5～100mm，其形状可以为圆柱形(包含上下圆直径不同的圆柱)、椭圆形、正方形、长方形、圆锥形等，其分布可以是均匀的也可以是不均匀的，其高度可以一致，也可不一致，可以是直立的，也可是倾斜的。
示例性的实施方式中，所述柔性线路板7通过连接件30连接于所述均温板上，参考图30。
所述连接件30可以为螺丝柱，通过螺丝柱避免柔性线路板直接与均温板 接触。
示例性的实施方式中，所述散热柱20复用为所述连接件。
本公开实施例还提供一种显示模组，包括盖板和上述的显示面板，以及位于所述盖板和所述显示面板之间的光学膜层，
位于所述OLED器件的出光侧的第一位置的温度t1满足以下公式：
位于所述OLED器件的背光侧的第二位置的温度t2满足以下公式：
R1或R2由以下公式获得：
q0由以下公式获得：q0＝p/s
其中，q0为总热流密度，p为显示面板的发热功率，s为显示面板的散热面积，R1为所述OLED器件的出光侧的热阻，R2为所述OLED器件的背光侧的热阻，x为所述第一位置或所述第二位置与所述OLED器件之间的距离，λ为位于所述第一位置或所述第二位置和所述OLED器件之间的各膜层的导热系数，h为空气对流换热系数，t∞为环境温度。
可以通过上述公式的计算结果作为参考以确定所述导热膜层所包括的子导热膜层的数量以及具体材质的使用。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (18)

  1. 一种显示面板，其中，包括柔性衬底，所述柔性衬底包括相对的第一侧和第二侧，所述第一侧设置有OLED器件，所述第二侧直接贴合有散热功能膜层，或者沿着远离所述柔性衬底的方向，在所述第二侧依次设置有导热膜层和散热功能膜层，所述导热膜层包括层叠设置的至少一个子导热膜层。
  2. 根据权利要求1所述的显示面板，其中，所述散热功能膜层包括高导热胶，所述高导热胶采用丙烯酸树脂、硅基材料和导热硅脂、液态金属中的一种或多种制成。
  3. 根据权利要求2所述的显示面板，其中，所述散热功能膜层还包括位于所述高导热胶远离所述柔性衬底的一侧的金属层。
  4. 根据权利要求1所述的显示面板，其中，所述散热功能膜层包括由Al、Cu、石墨片、纳米铜碳制成的膜层中的一个或者多个膜层。
  5. 根据权利要求1所述的显示面板，其中，所述导热膜层包括背膜层、网格胶层和缓冲层中的一个膜层或2个膜层。
  6. 根据权利要求5所述的显示面板，其中，所述导热膜层包括叠置的所述背膜层和/或所述网格胶层，在所述散热功能膜层远离所述柔性衬底的一侧设置有缓冲层。
  7. 根据权利要求1所述的显示面板，其中，所述散热功能膜层远离所述柔性衬底的一侧设置有隔热层。
  8. 根据权利要求1所述的显示面板，其中，所述散热功能膜层包括均温板。
  9. 根据权利要求8所述的显示面板，其中，所述均温板远离所述柔性衬底的一侧设置有多个散热柱。
  10. 根据权利要求9所述的显示面板，其中，所述显示面板包括通过覆晶薄膜进行电连接的柔性线路板，所述柔性线路板弯折至所述均温板远离所述柔性衬底的一侧，所述柔性线路板在所述均温板上的正投影位于第一区域内，所述散热柱位于所述均温板上与所述第一区域相邻的第二区域内。
  11. 根据权利要求10所述的显示面板，其中，所述散热柱在垂直于所述 柔性基底的方向上的高度沿着从所述第二区域到所述第一区域的方向依次增大。
  12. 根据权利要求9或10所述的显示面板，其中，所述散热柱在平行于所述柔性基底的方向上的截面积沿着远离所述柔性衬底的方向逐渐减小。
  13. 根据权利要求10或11所述的显示面板，其中，所述散热柱的分布密度沿着从所述第二区域到所述第一区域的方向依次增大。
  14. 根据权利要求10或11所述的显示面板，其中，所述柔性基底为至少在第一方向上弯曲的曲面结构，沿所述第一方向，所述散热柱的分布密度由所述均温板的两端向中间逐渐增大。
  15. 根据权利要求14所述的显示面板，其中，位于所述均温板的中间区域的所述散热柱在所述均温板上的正投影的面积为第一面积，位于所述均温板的边缘区域的所述散热柱在所述均温板的正投影的面积为第二面积，所述第一面积大于所述第二面积。
  16. 根据权利要求10所述的显示面板，其中，所述柔性线路板通过连接件连接于所述均温板上。
  17. 根据权利要求16所述的显示面板，其中，所述散热柱复用为所述连接件。
  18. 一种显示模组，其中，包括盖板和权利要求1-17任一项所述的显示面板，以及位于所述盖板和所述显示面板之间的光学膜层，
    位于所述OLED器件的出光侧的第一位置的温度t1满足以下公式：
    位于所述OLED器件的背光侧的第二位置的温度t2满足以下公式：
    R1或R2由以下公式获得：
    q0由以下公式获得：q0＝p/s
    其中，q0为总热流密度，p为显示面板的发热功率，s为显示面板的散热面积，R1为所述OLED器件的出光侧的热阻，R2为所述OLED器件的背光侧的热阻，x为所述第一位置或所述第二位置与所述OLED器件之间的距离， λ为位于所述第一位置或所述第二位置和所述OLED器件之间的各膜层的导热系数，h为空气对流换热系数，t∞为环境温度。
PCT/CN2023/112899 2022-09-29 2023-08-14 显示面板和显示模组 Ceased WO2024066769A1 (zh)

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CN116259246A (zh) * 2023-03-16 2023-06-13 京东方科技集团股份有限公司 显示面板、显示装置及显示面板的制作方法
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