WO2024063144A1 - Composition durcissable pour impression à jet d'encre, composant électronique et procédé de production de composant électronique - Google Patents

Composition durcissable pour impression à jet d'encre, composant électronique et procédé de production de composant électronique Download PDF

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Publication number
WO2024063144A1
WO2024063144A1 PCT/JP2023/034306 JP2023034306W WO2024063144A1 WO 2024063144 A1 WO2024063144 A1 WO 2024063144A1 JP 2023034306 W JP2023034306 W JP 2023034306W WO 2024063144 A1 WO2024063144 A1 WO 2024063144A1
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curable composition
meth
inkjet
weight
cured product
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PCT/JP2023/034306
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English (en)
Japanese (ja)
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孝徳 井上
真澄 本田
崇志 福田
倫久 上田
貴志 渡邉
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積水化学工業株式会社
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Publication of WO2024063144A1 publication Critical patent/WO2024063144A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks

Definitions

  • the present invention relates to an inkjet curable composition that is applied by an inkjet method.
  • the present invention also relates to an electronic component using the above-mentioned curable composition for inkjet, and a method for manufacturing the electronic component.
  • marking sections with characters or symbols drawn on the surface of electronic components are formed on the surface of electronic components to record the type and manufacturing information of electronic components such as printed wiring boards and electrolytic capacitors.
  • the marking portion may be formed using a curable composition.
  • Patent Document 1 describes (A) a photopolymerizable monomer having a cyclic skeleton and a shrinkage rate of less than 10%; % or more and 20% or less of a photopolymerizable bifunctional monomer and (C) a photopolymerization initiator.
  • the marking part is formed using a conventional curable composition
  • a high temperature (e.g. 60°C) alkaline solution during the manufacturing process of electronic parts (e.g. flux removal process, etc.)
  • the alkaline may penetrate into the inside of the marking part and the interface between the electronic component and the marking part, and the marking part may peel off from the part to be marked.
  • curable compositions for forming marking portions are designed to increase the adhesion between the substrate and the cured product when the curable composition is applied to a substrate and cured, and It is difficult to increase resistance to.
  • curable composition that can improve the adhesion between the substrate and the cured product and also increase the resistance of the cured product to high-temperature alkaline liquid
  • curable composition that can be applied by an inkjet method to coat the marking area. is not known to form.
  • An object of the present invention is to provide an inkjet curable composition that, when applied and cured, can increase the adhesion between the substrate and the cured product and increase the resistance of the cured product to high-temperature alkaline liquid.
  • An object of the present invention is to provide a curable composition.
  • Another object of the present invention is to provide an electronic component using the above-mentioned curable composition for inkjet, and a method for manufacturing the electronic component.
  • the inventors of the present invention were able to improve the adhesion between the substrate and the cured product, increase the resistance of the cured product to high-temperature alkaline liquid, and apply the coating using an inkjet method. Possible compositions of curable compositions have been discovered.
  • a curable composition for inkjet recording comprising a first (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alicyclic skeleton, a second (meth)acrylate compound represented by the following formula (1), a photopolymerization initiator, and a colorant.
  • R1 and R2 each represent a hydrogen atom or a methyl group
  • R3 represents an alkylene group
  • Section 2. The curable composition for inkjet according to item 1, wherein the colorant contains carbon black.
  • Item 3 The curable composition for inkjet according to Item 1 or 2, wherein the colorant contains a copper phthalocyanine compound.
  • Section 4 The curable composition for inkjet according to any one of Items 1 to 3, wherein in the formula (1), R3 is an alkylene group having 6 or more and 12 or less carbon atoms.
  • Item 5 The curable composition for inkjet according to any one of items 1 to 4, wherein the first (meth)acrylate compound has two (meth)acryloyl groups and is a (meth)acrylate compound having a dicyclopentadiene skeleton.
  • Section 6. The curable composition for inkjet according to any one of items 1 to 5, which contains a urethane (meth)acrylate compound having a (meth)acryloyl group.
  • Section 7. The curable composition for inkjet according to item 6, wherein the urethane (meth)acrylate compound is a urethane (meth)acrylate compound having a plurality of (meth)acryloyl groups.
  • Item 8 The curable composition for inkjet according to any one of Items 1 to 7, comprising a (meth)acrylamide compound.
  • Item 9 The curable composition for inkjet according to any one of Items 1 to 8, which does not contain a solvent or contains a solvent in an amount of 1% by weight or less based on 100% by weight of the curable composition for inkjet.
  • Items 1 to 9 further include a dispersant, and the content of the dispersant is 25 parts by weight or more and 150 parts by weight or less with respect to 100 parts by weight of the colorant.
  • Section 11 The inkjet according to any one of Items 1 to 10, wherein the content of the first (meth)acrylate compound in 100% by weight of the curable composition for inkjet is 5% by weight or more and 70% by weight or less. curable composition for use.
  • Weight change rate (%)
  • W1 Weight of the cured product of the curable composition for inkjet before immersion
  • W2 Weight of the cured product of the curable composition for inkjet after immersion and before heating
  • W3 Weight of the cured product of the curable composition for inkjet after heating weight
  • Section 14. The curable composition for inkjet according to item 13, wherein the weight change rate is 2.0% or less.
  • Item 15 The curable composition for inkjet according to any one of Items 1 to 14, wherein the cured product of the curable composition for inkjet has a glass transition temperature of 80° C. or higher.
  • Item 16 The inkjet curable composition according to any one of Items 1 to 15, which is used to form a marking part in an electronic component.
  • Section 17 An electronic component body, and a marking portion disposed on the surface of the electronic component body, the marking portion being formed of the curable composition for inkjet according to any one of Items 1 to 16. , electronic components.
  • Section 18 A step of applying the curable composition for inkjet according to any one of Items 1 to 16 on the surface of the electronic component main body using an inkjet device to form a marking layer;
  • a method for manufacturing an electronic component comprising: curing a marking layer to form a marking part.
  • the curable composition for inkjet according to the present invention comprises a first (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alicyclic skeleton, and a first (meth)acrylate compound represented by the above formula (1). 2 (meth)acrylate compound, a photopolymerization initiator, and a coloring agent. Since the curable composition for inkjet according to the present invention has the above-mentioned configuration, when the curable composition for inkjet is applied and cured, the adhesiveness between the substrate and the cured product is increased, and , the resistance of the cured product to high-temperature alkaline solutions can be increased.
  • FIGS. 1A and 1B are schematic cross-sectional views for explaining a method of manufacturing an electronic component according to a first embodiment of the present invention.
  • curable composition for inkjet The curable composition for inkjet according to the present invention (hereinafter sometimes referred to as "curable composition") is used for inkjet coating.
  • the curable composition according to the present invention contains a first (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alicyclic skeleton, a second (meth)acrylate compound represented by the following formula (1), a photopolymerization initiator, and a colorant.
  • R1 and R2 each represent a hydrogen atom or a methyl group
  • R3 represents an alkylene group
  • the marking part is formed using a conventional curable composition
  • a high temperature (e.g. 60°C) alkaline solution during the manufacturing process of electronic parts (e.g. flux removal process, etc.)
  • the alkaline may pass through the inside of the marking part and enter the interface between the electronic component and the marking part, causing the marking part to peel off from the part to be marked.
  • Conventional curable compositions for forming marking portions are designed to increase the adhesion between the substrate and the cured product when the curable composition is applied to a substrate and cured, and It is difficult to increase resistance to.
  • curable composition that can improve the adhesion between the substrate and the cured product and also increase the resistance of the cured product to high-temperature alkaline liquid
  • curable composition that can be applied by an inkjet method to coat the marking area. is not known to form.
  • the present inventors found that by using a (meth)acrylate compound having multiple (meth)acryloyl groups and an alicyclic skeleton, the high-temperature alkaline liquid can cure the cured product of the composition. It has been found that the resistance of the cured product to high-temperature alkaline liquid can be increased by suppressing the penetration of the cured product into the interior of the alkali solution.
  • the above-mentioned (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alicyclic skeleton has a rigid molecular skeleton structure, so the glass transition temperature (Tg) It is conceivable that the temperature is higher than the processing temperature (for example, 60° C.) of alkaline liquid in the manufacturing process of electronic components.
  • the present inventors used a (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alicyclic skeleton in combination with a (meth)acrylate compound represented by a specific structural formula. It has been found that by doing so, it is possible to improve the adhesion between the substrate and the cured product, and to increase the resistance of the cured product to high-temperature alkaline liquid.
  • the (meth)acrylate compound represented by the above specific structural formula has a low water absorption rate, it suppresses the absorption of high-temperature alkaline liquid into the curable composition in the manufacturing process of electronic components, and It is possible to suppress the liquid from penetrating into the inside of the cured product of the curable composition.
  • the curable composition according to the present invention has the above configuration, when the curable composition is applied and cured, the adhesiveness between the substrate and the cured product is increased, and The resistance of the cured product to high-temperature alkaline liquid can be increased.
  • the above curable composition can be applied by an inkjet method.
  • An inkjet device is used when applying the above-mentioned curable composition by an inkjet method.
  • the inkjet device has an inkjet head.
  • the inkjet head has an inkjet nozzle.
  • the above-mentioned curable composition is different from a curable composition applied by screen printing, a curable composition applied by a dispenser, and the like.
  • the curable composition is preferably used to form a marking portion.
  • the curable composition is particularly preferably used to form a marking portion in an electronic component.
  • the marking portion generally contains display information or recorded information composed of characters or symbols.
  • the marking portion preferably contains characters or symbols.
  • the marking portion preferably contains display information or recorded information.
  • the curable composition is particularly preferably used as a marking material for electronic components.
  • the marking portion is preferably formed to a thickness of 1 ⁇ m or more and 10 ⁇ m or less in the electronic component.
  • the curable composition may be disposed (applied) on the upper surface of the electronic component body, disposed (applied) on the lower surface of the electronic component body, or disposed (applied) inside the electronic component body.
  • the marking portion may be formed on the upper surface of the electronic component body, disposed on the lower surface of the electronic component body, or formed inside the electronic component body.
  • a traceability function can be imparted to the obtained electronic component.
  • the color of the curable composition and the marking portion may be the same as or different from the color of the portion to be marked.
  • a traceability function can be imparted to the obtained electronic component without making the marking portion stand out.
  • the color of the curable composition and the marking portion is different from the color of the portion to be marked, the visibility of the marking portion can be improved.
  • the curable composition is liquid at 25°C.
  • the liquid state also includes a paste state.
  • the viscosity ( ⁇ 1) at 25°C of the curable composition is preferably 40 mPa ⁇ s or more, more preferably 60 mPa ⁇ s or more, even more preferably 80 mPa ⁇ s or more, and preferably 500 mPa ⁇ s or less, more preferably is 300 mPa ⁇ s or less, more preferably 200 mPa ⁇ s or less.
  • the curable composition can be applied with a uniform thickness by an inkjet method. The adhesion between the cured product and the cured product can be further improved.
  • the viscosity ( ⁇ 1) is preferably measured using, for example, an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) on the curable composition immediately after preparation at 25° C. and 10 rpm. .
  • the glass transition temperature (Tg) of the cured product of the curable composition is preferably 80°C or higher, more preferably 90°C or higher, even more preferably 100°C or higher, and preferably 200°C or lower, more preferably 190°C. Below, the temperature is more preferably 180°C or below.
  • Tg glass transition temperature
  • the glass transition temperature of the cured product of the curable composition is at least the above lower limit and below the above upper limit, the resistance of the cured product to high-temperature alkaline liquid is further increased (high-temperature alkaline liquid (infiltration into the interior) can be further suppressed, and the adhesion between the substrate and the cured product can be further improved.
  • the glass transition temperature of the cured product of the above-mentioned curable composition can be measured using a dynamic viscoelasticity measuring device under the conditions of a heating rate of 10° C./min and a frequency of 10 Hz.
  • a dynamic viscoelasticity measuring device examples include "DVA-200" manufactured by IT Keizai Control Co., Ltd.
  • a cured product of the above-mentioned curable composition can be obtained, for example, by the following method.
  • a step of applying the above curable composition to a thickness of 10 ⁇ m using spin coating for example, “MS-A100” manufactured by Mikasa
  • the step of irradiating with ultraviolet rays (UV-LED) is repeated to form a cured product (thickness: 300 ⁇ m) of the above-mentioned curable composition.
  • UV-LED ultraviolet rays
  • the cured product of the above-mentioned curable composition should be cured at 60°C. It is preferable that the following weight change rate when heated at 170° C. for 1 hour after being immersed in water for 1 hour is less than 5.0%.
  • Weight change rate (%)
  • W1 Weight of the cured product of the curable composition before immersion
  • W2 Weight of the cured product of the curable composition after immersion and before heating
  • W3 Weight of the cured product of the curable composition after heating
  • the cured product of the above-mentioned curable composition may be the cured product (thickness: 300 ⁇ m) of the above-mentioned curable composition used for measuring the glass transition temperature.
  • the weight of the cured product of the above curable composition is defined as W1.
  • the cured product of the above curable composition is immersed in water at 60° C. for 1 hour, and the weight after wiping off water droplets on the surface is defined as W2.
  • the weight of the cured product of the above-mentioned curable composition after immersion is heated in an oven at 170° C. for 1 hour, and the weight thereof is defined as W3.
  • the weight change rate is preferably less than 5.0%. , more preferably 4.5% or less, further preferably 4.0% or less, particularly preferably 3.0% or less.
  • the weight change rate is preferably 2.0% or less, more preferably 1.5% or less, and even more preferably 1.0%. % or less, particularly preferably 0.9% or less.
  • the lower limit of the weight change rate is not particularly limited.
  • the weight change rate may be 0%, 0% or more, or 0.5% or more.
  • the weight change rate is preferably 2.0% or more, and preferably 2.5% or more.
  • the cured product may peel off from the substrate.
  • the liquid component permeates into the inside of the cured product and the presence of the liquid component at the interface between the substrate and the cured product reduces the contact area at the interface between the substrate and the cured product, causing the cured product to peel off from the substrate. It becomes easier.
  • the weight change rate is within the above preferable range, it becomes difficult for the liquid component to penetrate into the cured product, thereby suppressing peeling due to a decrease in the contact area at the interface between the substrate and the cured product. be able to.
  • the resistance of the cured product to high-temperature alkaline liquid can be further improved.
  • Examples of methods for adjusting the weight change rate within the above preferable range include the following methods.
  • the cured product of the curable composition has a glass transition temperature (Tg) of 80° C. or higher and a weight change rate of less than 5.0%.
  • (meth)acryloyl means one or both of “acryloyl” and “methacryloyl”
  • (meth)acrylate means one or both of “acrylate” and “methacrylate”.
  • the curable composition includes a first (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alicyclic skeleton.
  • the above-mentioned curable composition contains the above-mentioned first (meth)acrylate compound, when the above-mentioned curable composition is applied and cured, it is possible to increase the resistance of the cured product to high-temperature alkaline liquid. can.
  • the first (meth)acrylate compound may be a bifunctional (meth)acrylate compound, a bifunctional or more (meth)acrylate compound, or a trifunctional (meth)acrylate compound. It may be a trifunctional or higher functional (meth)acrylate compound, or a tetrafunctional or higher functional (meth)acrylate compound.
  • the first (meth)acrylate compound may be a (meth)acrylate compound with 20 or less functionalities, a (meth)acrylate compound with 10 or less functionalities, or a (meth)acrylate compound with 5 or less functionalities. It may be.
  • the functional number corresponds to the number of (meth)acryloyl groups. Only one type of the first (meth)acrylate compound may be used, or two or more types may be used in combination.
  • the first (meth)acrylate compound may have two (meth)acryloyl groups, may have two or more, may have three, or may have three or more (meth)acryloyl groups. It may have 4 or more, it may have 20 or less, it may have 10 or less, or it may have 5 or less.
  • bifunctional (meth)acrylate compounds having an alicyclic skeleton examples include ethoxylated cyclohexane methanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, 1,3-adamantanediol di(meth)acrylate, and propoxylated cyclohexane methanol di(meth)acrylate.
  • Examples of the trifunctional (meth)acrylate compound having an alicyclic skeleton include pentaerythritol triacrylate-isophorone diisocyanate-urethane prepolymer.
  • the first (meth)acrylate compound preferably has two (meth)acryloyl groups and preferably has a dicyclopentadiene skeleton.
  • the first (meth)acrylate compound is more preferably a (meth)acrylate compound having two (meth)acryloyl groups and a dicyclopentadiene skeleton.
  • the double bond portion of dicyclopentadiene may be reacted.
  • the dicyclopentadiene skeleton of the first (meth)acrylate compound may be a skeleton represented by the following formula (2).
  • the right end and the left end are bonding sites with other groups.
  • the first (meth)acrylate compound preferably contains ethoxylated cyclohexanemethanol di(meth)acrylate or tricyclodecane dimethanol di(meth)acrylate, and more preferably contains tricyclodecane dimethanol di(meth)acrylate.
  • Tricyclodecane dimethanol di(meth)acrylate has a skeleton represented by the above formula (2).
  • the first (meth)acrylate compound preferably has a tricyclodecane skeleton.
  • the glass transition temperature (Tg) of the homopolymer of the first (meth)acrylate compound is preferably 100°C or higher, more preferably 150°C or higher, even more preferably 190°C or higher, and preferably 250°C or lower, More preferably it is 220°C or lower.
  • Tg glass transition temperature
  • the glass transition temperature of the homopolymer of the first (meth)acrylate compound described above and the glass transition temperature of the homopolymer of the second (meth)acrylate compound described below each have a degree of polymerization of 3000 to 4000 (preferably 3500). ) means the glass transition temperature of the homopolymer.
  • the above glass transition temperature can be measured in accordance with JIS K7121 using a differential scanning calorimeter at a heating rate of 10° C./min.
  • Examples of the differential scanning calorimeter include "DSC7020” manufactured by Hitachi High-Tech Science.
  • the content of the first (meth)acrylate compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 20% by weight or more, particularly preferably The content is 30% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 60% by weight or less.
  • the content of the first (meth)acrylate compound is not less than the above lower limit and not more than the above upper limit, the effects of the present invention can be exhibited even more effectively.
  • the curable composition contains a second (meth)acrylate compound represented by the following formula (1).
  • R1 and R2 each represent a hydrogen atom or a methyl group
  • R3 represents an alkylene group
  • the curable composition contains the second (meth)acrylate compound, it is possible to increase the adhesion between the substrate and the cured product when the curable composition is applied and cured. can.
  • R1 and R2 may be the same or different.
  • the number of carbon atoms is preferably 2 or more, more preferably 4 or more, even more preferably 6 or more, and preferably 16 or less, more preferably 14 or less, and still more preferably 12 or less.
  • R3 is the number of carbon atoms. Particularly preferred is an alkylene group of 6 or more and 12 or less.
  • Examples of the second (meth)acrylate compound include decanediol di(meth)acrylate, nonanediol di(meth)acrylate, and hexanediol di(meth)acrylate.
  • the second (meth)acrylate compound is preferably nonanediol di(meth)acrylate or hexanediol di(meth)acrylate, and more preferably nonanediol di(meth)acrylate.
  • the glass transition temperature (Tg) of the homopolymer of the second (meth)acrylate compound is preferably -50°C or higher, more preferably -40°C or higher, even more preferably -30°C or higher, and preferably 50°C or higher.
  • the temperature is preferably 40°C or lower, more preferably 40°C or lower.
  • the content of the second (meth)acrylate compound in 100% by weight of the curable composition is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, and preferably is 70% by weight or less, more preferably 60% by weight or less, even more preferably 55% by weight or less.
  • the content of the second (meth)acrylate compound is at least the above lower limit and below the above upper limit, when the curable composition is applied and cured, the adhesion between the substrate and the cured product is improved. It can be further improved.
  • the content of the second (meth)acrylate compound is preferably 20 parts by weight or more, more preferably 30 parts by weight or more, and even more preferably is 40 parts by weight or more, preferably 250 parts by weight or less, more preferably 200 parts by weight or less, still more preferably 150 parts by weight or less.
  • the content of the second (meth)acrylate compound is not less than the above lower limit and not more than the above upper limit, the effects of the present invention can be exhibited even more effectively.
  • the curable composition contains the photopolymerization initiator.
  • the curable composition contains the photopolymerization initiator, the curable composition can be cured by irradiation with light.
  • photopolymerization initiators examples include radical photopolymerization initiators, cationic photopolymerization initiators, and the like.
  • the photopolymerization initiator is preferably a radical photopolymerization initiator. Only one kind of the above-mentioned photopolymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • the photo-radical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.
  • the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 1-hydroxycyclohexylphenyl ketone and 2-hydroxy-2-methylpropiophenone; Acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1-[4-(methylthio)phenyl]- 2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-
  • the photopolymerization initiator is 2-dimethylamino-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]1-butanone, or 2-(dimethylamino)-1- Preferably, it contains (4-morpholinophenyl)-2-benzyl-1-butanone.
  • a photopolymerization initiation aid may be used together with the above-mentioned radical photopolymerization initiator.
  • the photopolymerization initiation aid include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine.
  • the photopolymerization initiation aid may be used alone or in combination of two or more.
  • titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals) that absorb in the visible light region may be used to promote the photoreaction.
  • photocationic polymerization initiator examples include sulfonium salts, iodonium salts, metallocene compounds, and benzointosylate. Only one kind of the above-mentioned photocationic polymerization initiator may be used, or two or more kinds thereof may be used in combination.
  • the content of the photopolymerization initiator in 100% by weight of the curable composition is preferably 4% by weight or more, more preferably 5% by weight or more, and preferably 15% by weight or less, more preferably 12% by weight. It is as follows. When the content of the photopolymerization initiator is not less than the lower limit and not more than the upper limit, the curability of the curable composition can be improved, so when the curable composition is applied and cured, Adhesion between the substrate and the cured product can be further improved.
  • the content of the photopolymerization initiator is preferably 4 parts by weight or more, more preferably 5 parts by weight or more, and preferably 20 parts by weight or less, more preferably 15 parts by weight or less, relative to a total of 100 parts by weight of the first (meth)acrylate compound and the second (meth)acrylate compound.
  • the content of the photopolymerization initiator is equal to or more than the lower limit and equal to or less than the upper limit, the curability of the curable composition can be increased, and therefore, when the curable composition is applied and cured, the adhesion between the substrate and the cured product can be further increased.
  • the curable composition includes the colorant.
  • the above-mentioned curable composition contains the above-mentioned colorant, it is suitably used to form the marking part. Since the curable composition contains the colorant, it is suitably used as a marking material.
  • coloring agent examples include dyes, pigments, and the like. As for the above-mentioned coloring agent, only 1 type may be used, and 2 or more types may be used together. When only one type of colorant is used, the process for producing the curable composition becomes simpler. When two or more colorants are used together, the color of the curable composition can be easily adjusted.
  • the above dyes include pyrazole azo dyes, anilinoazo dyes, triphenylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxole dyes, pyrazolotriazole azo dyes, pyridone azo dyes, and cyanine dyes.
  • the above dyes are acid dyes, direct dyes, basic dyes, mordant dyes, acidic mordant dyes, azoic dyes, disperse dyes, oil-soluble dyes, food dyes, and black color by mixing two or more of these derivatives. It may also be a dye made into a dye. The above dyes may be used alone or in combination of two or more.
  • the pigment may be an organic pigment or an inorganic pigment.
  • the organic pigment may be an organic pigment having a metal atom or an organic pigment not having a metal atom. Only one type of the pigment may be used, or two or more types may be used in combination.
  • organic pigments examples include phthalocyanine compounds, quinacridone compounds, azo compounds, pentaphene compounds, perylene compounds, indole compounds, and dioxazine compounds.
  • phthalocyanine compounds examples include copper phthalocyanine compounds.
  • inorganic pigments examples include carbon black, carbon nanotubes, graphene, iron oxide, zinc oxide, titanium oxide, calcium carbonate, alumina, kaolin clay, calcium silicate, magnesium oxide, magnesium hydroxide, aluminum hydroxide, magnesium carbonate, talc, Examples include feldspar powder, mica, barite, barium carbonate, silica, and glass beads.
  • the colorant preferably contains a pigment.
  • the colorant is preferably a black pigment or a blue pigment.
  • the colorant more preferably contains carbon black or a phthalocyanine compound, and particularly preferably contains carbon black or a copper phthalocyanine compound.
  • the content of the colorant in 100% by weight of the curable composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 5% by weight or more. It is not more than 3% by weight, more preferably not more than 3% by weight.
  • the curable composition may contain a dispersant. From the viewpoint of improving dispersibility, it is preferable that the curable composition further contains a dispersant. In particular, when the colorant contains carbon black, the curable composition preferably further contains a dispersant.
  • dispersants examples include polyurethane dispersants, phosphate ester dispersants, carboxylic acid dispersants, amine dispersants, and ricinoleate ester dispersants.
  • the above-mentioned dispersants may be used alone or in combination of two or more.
  • polyurethane dispersant examples include basic polyurethane, polyurethane-acrylic, polyurethane-polyurea, polyester-polyurethane, polyether-polyurethane, and silicone polyurethane.
  • phosphate dispersants include polyoxyalkylene alkyl phenyl ether phosphates such as polyoxyethylene nonylphenyl ether phosphate, polyoxyethylene tridecyl ether phosphate, and polyoxyethylene octylphenyl ether phosphate. , polyoxyethylene alkyl ether phosphate, polyoxyethylene alkyl ether phosphate/monoethanolamine salt, polyoxyethylene lauryl ether phosphate, polyoxyethylene lauryl ether phosphate/monoethanolamine salt, polyethylene styrenation Examples include phenyl ether phosphate, sodium alkyl phosphate, and alkyl phosphate monoethanolamine salt.
  • the above carboxylic acid dispersant is preferably a polycarboxylic acid.
  • the polycarboxylic acid include polycarboxylic acid polymers in which polyoxyalkylene is grafted onto a polymer having a carboxyl group in the main chain skeleton.
  • the weight average molecular weight of the polycarboxylic acid is preferably 500 or more, more preferably 1000 or more, even more preferably 2000 or more, and preferably 1,500,000 or less, more preferably 1,250,000 or less, even more preferably 1,000,000 or less.
  • the weight average molecular weight is the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).
  • Examples of the above amine dispersants include tetradecylamine acetate, laurylamine, oleylamine, distearylamine, and dimethyllaurylamine.
  • ricinoleic acid ester dispersants examples include glycerinricinoleic acid monoester, polyglycerinricinoleic acid monoester, and acetyl ricinoleic acid ester.
  • the above dispersant contains a phosphate ester-based dispersant.
  • the content of the dispersant in 100% by weight of the curable composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 5% by weight or more. It is at most 3% by weight, more preferably at most 3% by weight, even more preferably at most 2% by weight.
  • the content of the dispersant is preferably 25 parts by weight or more, more preferably 50 parts by weight or more, and even more preferably 75 parts by weight, relative to 100 parts by weight of the colorant.
  • the content is preferably 150 parts by weight or less, more preferably 125 parts by weight or less, even more preferably 110 parts by weight or less.
  • the curable composition does not contain or contains a solvent.
  • the curable composition may or may not contain a solvent. From the viewpoint of suppressing curing shrinkage that occurs when the solvent evaporates and further improving the adhesion between the substrate and the cured product, the lower the content of the solvent in the curable composition, the better.
  • Examples of the above-mentioned solvents include water, organic solvents, and the like.
  • the above-mentioned solvent is preferably an organic solvent.
  • the above-mentioned organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl
  • the curable composition does not contain the solvent or the curable composition 100 It is preferable that the above-mentioned solvent is contained in an amount of 5% by weight or less. From the viewpoint of suppressing curing shrinkage that occurs when the solvent evaporates and further increasing the adhesion between the substrate and the cured product, when the curable composition contains the solvent, 100% by weight of the curable composition Among them, the content of the above-mentioned solvent is preferably 5% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight or less. The lower limit of the content of the solvent is not particularly limited. The content of the solvent may be 0% by weight (not contained), 0% by weight or more, or 0.5% by weight or more.
  • the curable composition does not contain or contains a thermosetting compound.
  • the curable composition may or may not contain a thermosetting compound. From the viewpoint of suppressing the generation of outgas when the curable composition is heated, the lower the content of the thermosetting compound in the curable composition, the better.
  • thermosetting compounds examples include oxetane compounds, epoxy compounds, episulfide compounds, (meth)acrylic compounds, phenol compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds.
  • the above thermosetting compounds may be used alone or in combination of two or more.
  • thermosetting compound may be used in combination with a thermosetting agent.
  • the curable composition may contain a thermosetting compound and a thermosetting agent.
  • the thermosetting agent thermally cures the thermosetting compound.
  • thermosetting agents examples include thiol curing agents such as imidazole curing agents, amine curing agents, phenol curing agents, and polythiol curing agents, acid anhydride curing agents, thermal cationic initiators (thermal cationic curing agents), thermal radical generators, etc. can be mentioned.
  • thiol curing agents such as imidazole curing agents, amine curing agents, phenol curing agents, and polythiol curing agents, acid anhydride curing agents, thermal cationic initiators (thermal cationic curing agents), thermal radical generators, etc.
  • the above thermosetting agents may be used alone or in combination of two or more.
  • the curable composition does not contain the thermosetting compound, or the thermosetting compound does not contain the thermosetting compound in 100% by weight of the curable composition. It is preferable that the content is 5% by weight or less. From the perspective of further increasing the adhesion between the substrate and the cured product, when the curable composition contains the thermosetting compound, the content of the thermosetting compound in 100% by weight of the curable composition is preferably 4% by weight or less, more preferably 3% by weight or less, even more preferably 2% by weight or less. The lower limit of the content of the thermosetting compound is not particularly limited. The content of the thermosetting compound may be 0% by weight (not contained), 0% by weight or more, or 0.5% by weight or more.
  • the content of the thermosetting agent is preferably 10 parts by weight or more, more preferably 20 parts by weight or more, even more preferably 25 parts by weight or more, particularly preferably 30 parts by weight, relative to 100 parts by weight of the thermosetting compound.
  • the content is preferably 60 parts by weight or less, more preferably 55 parts by weight or less, and even more preferably 50 parts by weight.
  • the thermosetting compound can be cured well.
  • the curable composition comprises the first (meth)acrylate compound, the second (meth)acrylate compound, the photopolymerization initiator, the colorant, the solvent, the dispersant, and the thermosetting compound. It may also contain other components.
  • Other ingredients listed above include fillers, antifoaming agents, coupling agents, curing agents, curing accelerators, mold release agents, surface treatment agents, flame retardants, viscosity modifiers, dispersants, dispersion aids, and surface modification agents. agents, plasticizers, antibacterial agents, antifungal agents, leveling agents, stabilizers, anti-sagging agents, and phosphors.
  • the curable composition may contain (meth)acrylate compounds other than the first (meth)acrylate compound and the second (meth)acrylate compound (hereinafter referred to as "other (meth)acrylate compounds"). ) may be included.
  • the other (meth)acrylate compounds mentioned above may be monofunctional (meth)acrylate compounds or may be polyfunctional (meth)acrylate compounds.
  • Examples of the other (meth)acrylate compounds include polypropylene glycol #700 diacrylate, polypropylene glycol #400 diacrylate, and tripropylene glycol diacrylate. From the viewpoint of further enhancing the adhesion between the substrate and the cured product, the other (meth)acrylate compound is preferably polypropylene glycol #700 diacrylate.
  • the other (meth)acrylate compound preferably contains a urethane (meth)acrylate compound having a (meth)acryloyl group.
  • the urethane (meth)acrylate compound may have one (meth)acryloyl group, may have two or more (meth)acryloyl groups, or may have three or more (meth)acryloyl groups. It may have four or more (meth)acryloyl groups.
  • the urethane (meth)acrylate compound may have 100 or less (meth)acryloyl groups, or may have 50 or less (meth)acryloyl groups.
  • the urethane (meth)acrylate compound may be a monofunctional urethane (meth)acrylate compound or a polyfunctional urethane (meth)acrylate compound.
  • the urethane (meth)acrylate compound is preferably a urethane (meth)acrylate compound having multiple (meth)acryloyl groups.
  • the number of (meth)acryloyl groups in the urethane (meth)acrylate compound is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and preferably 8 or less, more preferably 7 or less, even more preferably 6 or less.
  • the urethane (meth)acrylate compound has 4 to 6 (meth)acryloyl groups.
  • the urethane (meth)acrylate compound is preferably a urethane (meth)acrylate compound having an aromatic skeleton.
  • aromatic skeleton examples include a naphthalene skeleton, a fluorene skeleton, a phenyl skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, a xanthene skeleton, an adamantane skeleton, and a bisphenol A type skeleton.
  • the aromatic skeleton in the urethane (meth)acrylate compound is preferably a phenyl skeleton or a biphenyl skeleton.
  • the urethane (meth)acrylate compound preferably contains a urethane (meth)acrylate compound having a phenyl skeleton or a biphenyl skeleton; It is more preferable to include a meth)acrylate compound.
  • urethane (meth)acrylate compound having a biphenyl skeleton Commercially available products can be used as the urethane (meth)acrylate compound having a biphenyl skeleton.
  • Commercially available urethane (meth)acrylate compounds having the biphenyl skeleton include EBECRYL220 (manufactured by Daicel Allnex) and EBECRYL210 (manufactured by Daicel Allnex).
  • the curable composition further contains a (meth)acrylamide compound.
  • the other (meth)acrylate compound preferably includes a (meth)acrylamide compound.
  • the above (meth)acrylamide compounds include N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N,N-dimethylaminopropyl(meth)acrylamide, N , N-diethylaminopropyl (meth)acrylamide, N,N-dimethylaminoethyl (meth)acrylamide, N,N-diethylaminoethyl (meth)acrylamide, and (meth)acryloylmorpholine.
  • the (meth)acrylamide compound preferably contains (meth)acryloylmorpholine.
  • An electronic component according to the present invention includes an electronic component main body and a marking section arranged on a surface of the electronic component main body.
  • the marking portion is formed from the above-mentioned curable composition for inkjet.
  • the marking portion includes a cured product of the curable composition for inkjet.
  • the method for manufacturing an electronic component according to the present invention includes the following steps. (1) A step (coating step) of applying the above-described curable composition for inkjet onto the surface of the electronic component main body using an inkjet device to form a marking layer. (2) A step of curing the marking layer by irradiating light to form a marking part (photo-curing step).
  • FIGS. 1(a) and 1(b) are schematic cross-sectional views for explaining the method for manufacturing an electronic component according to the first embodiment of the present invention.
  • a curable composition (marking material) is applied onto the surface of the electronic component main body 1 using an inkjet device to form a marking layer 3A (coating step).
  • a curable composition (marking material) is discharged from the discharge section 51 of the inkjet device.
  • the marking layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to advance the curing of the marking layer 3A to form the marking portion 3B (photocuring process).
  • Light is irradiated from the light irradiation unit 52 of the inkjet device to harden the marking layer 3A to form the marking portion 3B.
  • the coating step and the photocuring step may be repeated.
  • the curable composition is applied to the surface side of the formed marking portion 3B opposite to the electronic component main body 1 side.
  • the thickness of the marking part can be increased by performing each of the above coating step and the above photocuring step multiple times in the thickness direction of the marking layer.
  • the coating step and the photocuring step may each be performed two or more times, three or more times, 1000 times or less, or 100 times or less.
  • ultraviolet rays be irradiated.
  • the illuminance and irradiation time of ultraviolet rays in the photocuring step can be changed as appropriate depending on the composition of the curable composition and the coating thickness of the curable composition.
  • the illuminance of ultraviolet rays in the photocuring step may be, for example, 1000 mW/cm 2 or more, 5000 mW/cm 2 or more, 10000 mW/cm 2 or less, or 8000 mW/cm 2 or less. It may be.
  • the irradiation time of ultraviolet rays in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less. Good too.
  • the width, thickness, etc. of the marking part can be changed as appropriate.
  • the width of the marking part may be 30 ⁇ m or more, 50 ⁇ m or more, 70 ⁇ m or more, 1000 ⁇ m or less, 800 ⁇ m or less, or 700 ⁇ m or less. There may be.
  • the thickness of the marking part may be 1 ⁇ m or more, 5 ⁇ m or more, 100 ⁇ m or less, 50 ⁇ m or less, 30 ⁇ m or less, or 10 ⁇ m or less. There may be.
  • Examples of electronic components include electrolytic capacitors, coils, capacitors, antennas, printed wiring boards, and touch panel components.
  • Second (meth)acrylate compound Tricyclodecane dimethanol diacrylate ("IRR-214K” manufactured by Daicel Allnex Corporation, glass transition temperature of homopolymer: 190°C)
  • Ethoxylated cyclohexanemethanol diacrylate (“HBPE-4" manufactured by Daiichi Kogyo Seiyaku Co., Ltd., glass transition temperature of homopolymer: 50°C)
  • Second (meth)acrylate compound 1,9-nonanediol diacrylate (“Viscoat #260” manufactured by Osaka Organic Chemical Industry Co., Ltd., glass transition temperature of homopolymer: 68°C) 1,6-hexanediol diacrylate (“Viscoat #230” manufactured by Osaka Organic Chemical Industry Co., Ltd., glass transition temperature of homopolymer: 63°C)
  • Photoinitiator 2,4,6-trimethylbenzoyldiphenylphosphine oxide (“OmniradTPO” manufactured by IGM Resins) 2-dimethylamino-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]1-butanone (“Omnirad379” manufactured by IGM Resins) Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (“Omnirad819” manufactured by IGM Resins)
  • Carbon black (“Carbon Black #10” manufactured by Mitsubishi Chemical Corporation) Carbon black (“Carbon Black MA14” manufactured by Mitsubishi Chemical Corporation) Copper phthalocyanine compound (pigment, “Oil Blue 5511-N” manufactured by Orient Chemical Industries Co., Ltd.) Copper phthalocyanine compound (pigment, "OPLAS BLUE 635" manufactured by Orient Chemical Industries Co., Ltd.) Titanium oxide (Ishihara Sangyo Kaisha, Ltd.
  • Pigment Violet 37 Purple pigment, "CROMOPHTAL VIOLET B” manufactured by BASF
  • Pigment Red 122 red pigment, "Fastogen Super Magenta RGT” manufactured by DIC Corporation
  • Solvent Green 5 yellow pigment, "PLAST YELLOW 8025” manufactured by Arimoto Chemical Co., Ltd.
  • Phosphate ester dispersant (“DISPERBYK-106” manufactured by BYK) Phosphate ester dispersant (“DISPERBYK-145” manufactured by BYK) Polyacrylic dispersant (manufactured by BASF, "PX4701”) Phosphate ester dispersant (“DISPERBYK-9076” manufactured by BYK) Polycaprolactone-based dispersant (Ajisper PB821, manufactured by Ajinomoto Fine Techno)
  • TPM Tripropylene glycol monomethyl ether
  • Examples 1 to 29 and Comparative Examples 1 to 4 The ingredients shown in Tables 1, 3, 5, 7, 9, 11, and 13 below are blended in the amounts (units are parts by weight) shown in Tables 1, 3, 5, 7, 9, 11, and 13 below.
  • a curable composition for inkjet (curable composition) was obtained.
  • the marking layer was cured by irradiating ultraviolet light (UV-LED) with a cumulative light intensity of 3000 mJ/cm 2 so that the illuminance at a wavelength of 365 nm was 6000 mW/cm 2 . (thickness: 10 ⁇ m).
  • UV-LED ultraviolet light
  • the tape was peeled off from the edge.
  • the adhesion (tape peeling resistance) between the substrate and the marking part (cured product) was determined based on the following criteria.
  • a curable composition obtained from an inkjet head of a piezo type inkjet printer equipped with an ultraviolet irradiation device was discharged onto the surface of an aluminum substrate (5 cm x 5 cm in size) to form a marking layer. Formed. After that, for Examples 1 to 14, 28 to 29 and Comparative Examples 1 to 4, ultraviolet light (UV-LED) was irradiated with an integrated light intensity of 1000 mJ/cm 2 so that the illuminance at a wavelength of 365 nm was 1000 mW/cm 2 . Then, the marking layer was cured to form a marking part (thickness: 10 ⁇ m).
  • UV-LED ultraviolet light
  • the marking layer was cured by irradiating ultraviolet light (UV-LED) with an integrated light intensity of 3000 mJ/cm 2 so that the illuminance at a wavelength of 365 nm was 6000 mW/cm 2 . (thickness: 10 ⁇ m).
  • UV-LED ultraviolet light
  • the substrate provided with the marking portion was placed in an alkaline solution (pH 9.5, "Cleanthrough 750HS” manufactured by Kao Corporation) heated to 60° C., and 40 kHz ultrasonic waves were applied to clean it for 10 minutes.
  • the resistance of the marking part (cured product) to high-temperature alkaline liquid was determined based on the following criteria.
  • Viscosity at 25°C The viscosity of the obtained curable composition was measured using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) at 25°C and 10 rpm.
  • the step of applying 10 ⁇ m of the curable composition obtained using spin coating (“MS-A100” manufactured by Mikasa) and the illuminance at a wavelength of 365 nm were set to 6000 mW/cm 2
  • the process of irradiating ultraviolet rays with an integrated light amount of 3000 mJ/cm 2 was repeated to obtain a cured product (thickness: 300 ⁇ m) of the curable composition.
  • the glass transition temperature of the cured product of the obtained curable composition was measured using a dynamic viscoelasticity measuring device under conditions of a heating rate of 10° C./min and a frequency of 10 Hz.
  • Weight change rate of cured product When the cured product (thickness: 300 ⁇ m) of the curable composition obtained in (1) was immersed in water at 60°C for 1 hour, and then heated at 170°C for 1 hour. , the following weight change rate was calculated.
  • Weight change rate (%)
  • the marking layer was cured by irradiating ultraviolet light (UV-LED) with an integrated light amount of 3000 mJ/cm 2 so that the illuminance at a wavelength of 365 nm was 6000 mW/cm 2 after 2 seconds.
  • a marking portion (thickness: 10 ⁇ m) was formed.
  • the printability of the curable composition was evaluated based on the following criteria.
  • compositions and results of the curable compositions are shown in Tables 1 to 14 below.

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  • Life Sciences & Earth Sciences (AREA)
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Abstract

L'invention concerne une composition durcissable pour impression à jet d'encre qui, lorsqu'elle est appliquée et durcie, peut donner un objet durci ayant une adhésivité accrue à un substrat et ayant une résistance accrue aux solutions alcalines à haute température.　La composition durcissable pour impression à jet d'encre selon la présente invention comprend un premier composé (méth)acrylate, qui a une pluralité de groupes (méth)acryloyle et un squelette alicyclique, un second composé (méth)acrylate, représenté par la formule (1), un initiateur de photopolymérisation et un colorant.
PCT/JP2023/034306 2022-09-22 2023-09-21 Composition durcissable pour impression à jet d'encre, composant électronique et procédé de production de composant électronique WO2024063144A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010143982A (ja) * 2008-12-17 2010-07-01 Chisso Corp 光硬化性インクジェット用インク
JP2018065911A (ja) * 2016-10-18 2018-04-26 マクセルホールディングス株式会社 エネルギー線硬化型インクジェットインク組成物
JP2020152800A (ja) * 2019-03-20 2020-09-24 株式会社リコー 硬化型組成物、印刷物、粘着ラベル、収容容器、２次元又は３次元の像の形成方法及び形成装置、硬化物、構造体、並びに成形加工品
WO2021200258A1 (fr) * 2020-03-31 2021-10-07 太陽インキ製造株式会社 Composition durcissable, produit durci et carte de circuit imprimé

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010143982A (ja) * 2008-12-17 2010-07-01 Chisso Corp 光硬化性インクジェット用インク
JP2018065911A (ja) * 2016-10-18 2018-04-26 マクセルホールディングス株式会社 エネルギー線硬化型インクジェットインク組成物
JP2020152800A (ja) * 2019-03-20 2020-09-24 株式会社リコー 硬化型組成物、印刷物、粘着ラベル、収容容器、２次元又は３次元の像の形成方法及び形成装置、硬化物、構造体、並びに成形加工品
WO2021200258A1 (fr) * 2020-03-31 2021-10-07 太陽インキ製造株式会社 Composition durcissable, produit durci et carte de circuit imprimé

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