Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/10—Junction-based devices
  • H10N60/12—Josephson-effect devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/01—Manufacture or treatment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N60/00—Superconducting devices
  • H10N60/80—Constructional details
  • H10N60/85—Superconducting active materials
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
  • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Definitions

• the disclosed technology relates to an electronic device and a method for manufacturing an electronic device.
• the following electronic devices containing transition metal dichalcogenite are known.
• a light receiving part including a transition metal dichalcogenite layer and a charge guiding layer, a charge guiding layer covering the transition metal dichalcogenite layer, and a topological insulator disposed apart from the transition metal dichalcogenite layer.
• Photoelectric devices are known that include a sensing portion that includes a layer.
• Majorana particle a special elementary particle called the Majorana particle.
• the transformation factor of this particle becomes a 2 ⁇ 2 unitary matrix, and the swapping of the physical positions of the particles itself becomes a unitary transformation, that is, a quantum operation.
• a quantum computer using Majorana particles is a system that takes advantage of the fact that the sign change of the wave function when replacing Majorana particles is the same as quantum gate operation. While conventional quantum computers were rather analog-like, quantum bits using Majorana particles retain information based on the relative positional relationship of particles, and swapping particle positions is a quantum gate operation. Since it corresponds to , it can be said to be digital. Because Majorana particles originate from the geometric properties of materials, they are highly resistant to noise without damaging topology (geometric features).
• Topological superconductors which are special low-dimensional structures of superconductors, are attracting attention as materials in which Majorana particles can exist.
• a suitable candidate material as a topological superconductor has not yet been discovered. Therefore, research is being conducted on the idea of bringing a superconductor into contact with a topological insulator and inducing superconductivity in the topological insulator through the proximity effect.
• topological insulators such as WTe 2 , which is a type of transition metal dichalcogenite, have the disadvantage of being easily oxidized. Additionally, many superconductors are easily oxidized. For example, Al and Nb, which are known as superconductors, form a passive oxide film on their surfaces. The presence of an oxide film at the junction interface between a topological insulator and a superconductor not only weakens the proximity effect but also slows down the superconducting gap, which adversely affects the development of Majorana particles.
• the disclosed technology aims to suppress the formation of an oxide film at the interface between a transition metal dichalcogenite and a superconductor.
• An electronic device includes a superconducting electrode containing PdTe 2 or PdTe, and a TMD film containing transition metal dichalcogenite laminated on the superconducting electrode.
• 1 is a cross-sectional view showing an example of the configuration of an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• FIG. 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to an embodiment of the disclosed technology.
• FIG. 2 is a diagram illustrating an example of a method for obtaining a peeled piece of WTe 2 single crystal according to an embodiment of the disclosed technology.
• FIG. 2 is a diagram illustrating an example of a method for obtaining a peeled piece of WTe 2 single crystal according to an embodiment of the disclosed technology.
• FIG. 2 is a diagram illustrating an example of a method for obtaining a peeled piece of WTe 2 single crystal according to an embodiment of the disclosed technology.
• FIG. 2 is a diagram illustrating an example of a method for obtaining a peeled piece of WTe 2 single crystal according to an embodiment of the disclosed technology.
• FIG. 2 is a diagram illustrating an example of a method for obtaining a peeled piece of WTe 2 single crystal according to an embodiment of the disclosed technology.
• FIG. 2 is a diagram showing how a superconductor is formed near the interface between Pd and WTe 2 films.
• FIG. 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device using an MBE method or a PLD method according to an embodiment of the disclosed technology.
• FIG. 1 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device using an MBE method or a PLD method according to an embodiment of the disclosed technology.
• 1 is a cross-sectional view showing an example of a method for manufacturing an electronic device using an MBE method or a PLD method according to an embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view showing an example of the configuration of an electronic device according to another embodiment of the disclosed technology.
• FIG. 7 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 7 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 7 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 7 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 7 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for manufacturing an electronic device according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for partially thinning a WTe 2 film by etching using an ALE method according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for partially thinning a WTe 2 film by etching using an ALE method according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for partially thinning a WTe 2 film by etching using an ALE method according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for partially thinning a WTe 2 film by etching using an ALE method according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a method for partially thinning a WTe 2 film by etching using an ALE method according to another embodiment of the disclosed technology.
• FIG. 3 is a cross-sectional view illustrating an example of a manufacturing method for forming a superconducting electrode using alternating Pd and Te laminated films.
• FIG. 3 is a cross-sectional view illustrating an example of a manufacturing method for forming a superconducting electrode using alternating Pd and Te laminated films.
• FIG. 2 is a cross-sectional view showing an example of a manufacturing method for forming a superconducting electrode using alternately laminated Pd and Te films.
• FIG. 3 is a cross-sectional view illustrating an example of a manufacturing method for forming a superconducting electrode using alternating Pd and Te laminated films.
• FIG. 3 is a plan view showing an example of the configuration of an electronic device according to another embodiment of the disclosed technology.
• FIG. 3 is a plan view showing an example of the configuration of an electronic device according to another embodiment of the disclosed technology.
• FIG. 1 is a cross-sectional view showing an example of the configuration of an electronic device 10 according to a first embodiment of the disclosed technology.
• the electronic device 10 includes a superconducting electrode 20 containing PdTe 2 or PdTe, and a TMD film 30 (Transition Metal Dichalcogenide) containing transition metal dichalcogenite laminated on the superconducting electrode 20.
• Electronic device 10 may be provided on substrate 15 .
• the material of the substrate 15 is not particularly limited, it is possible to use, for example, SiO 2 .
• the transition metal dichalcogenite constituting the TMD film 30 may be a topological insulator.
• a topological insulator is an insulator that does not exhibit electrical conductivity on the inside, and has metallic properties that exhibit electrical conductivity on the surface.
• the topological insulator may be WTe2 , for example.
• the TMD film 30 may be composed of a single layer or multiple layers of atomic layer material.
• the electronic device 10 is a bottom contact type device in which a TMD film 30 covers a superconducting electrode 20.
• 2A to 2H are cross-sectional views showing an example of a method for manufacturing the electronic device 10.
• a resist mask 40 having an opening 41 corresponding to the pattern of the superconducting electrode 20 is formed on the substrate 15 (FIG. 2A).
• a Pd/Te alternately laminated film 23 is formed by alternately depositing a Pd film 21 and a Te film 22 on the substrate 15 via a resist mask 40 (FIG. 2B).
• the Pd/Te alternately laminated film 23 can be formed, for example, by alternately depositing Pd and Te to a thickness of about several nm (maximum about 10 nm) using a binary vapor deposition machine. It is also possible to form the Pd/Te alternately laminated film 23 by co-evaporating Pd and Te.
• the Pd/Te alternately laminated film 23 it is also possible to form the Pd/Te alternately laminated film 23 by vapor deposition or sputtering using a mixed target of sintered Pd and Te. In order to minimize surface oxidation, it is preferable that the uppermost layer of the Pd/Te alternately laminated film 23 is the Pd film 21. Thereby, oxidation of the Pd and Te alternately laminated film 23 can be suppressed. After the Pd/Te alternately laminated film 23 is formed, the Pd/Te alternately laminated film 23 may be exposed to the atmosphere or brought into contact with an organic solvent or an organic alkaline developer.
• the excess Pd/Te alternate laminated film 23 deposited on the resist mask 40 is removed together with the resist mask 40. That is, the alternate laminated film 23 of Pd and Te is patterned by lift-off (FIG. 2C).
• a TMD film 30 is formed on a substrate 16 different from the substrate 15 on which the Pd/Te alternately laminated film 23 is formed (FIG. 2D).
• the TMD film 30 is the WTe 2 film 30A
• the method shown below is also applicable to the case where the TMD film 30 is composed of transition metal dichalcogenite other than WTe 2 . It is.
• the WTe 2 film 30A of one atomic layer or several atomic layers can be formed on the substrate 16.
• 3A to 3E are diagrams showing an example of a method for obtaining exfoliated pieces of WTe 2 single crystal.
• the WTe 2 single crystal is obtained by placing WO 3 (tungsten oxide) and powdered Te in a quartz glass crucible and heating it.
• the thickness of WTe 2 single crystal is about 1 to 2 ⁇ m.
• the obtained WTe 2 single crystal 30B is attached to the end of the adhesive surface of the adhesive tape 300 (FIG. 3A).
• a process of peeling is repeated (FIG. 3B).
• a WTe 2 film 30A which is a plurality of peeled pieces of the WTe 2 single crystal 30B, is obtained on the adhesive surface of the adhesive tape 300 (FIG. 3C).
• the portion of the adhesive tape 300 to which the WTe 2 film 30A is attached is attached to the substrate 16, and the substrate 16 is heated to a temperature of about 60° C. (FIG. 3D). Thereafter, the adhesive tape 300 is peeled off from the substrate 16. As a result, the WTe 2 film 30A is transferred to the substrate 16 (FIG. 3E).
• the transfer jig 200 includes a dome-shaped first resin layer 202 provided on a base 201 and a second resin layer 203 covering the first resin layer 202.
• glass can be used as the material for the base 201.
• the first resin layer 202 is made of a resin whose softening temperature is relatively high.
• PDMS polydimethylsiloxane
• the second resin layer 203 is made of resin whose softening temperature is relatively low.
• PS polystyrene
• PPC polypropylene carbonate
• the picked up WTe 2 film 30A is laminated on the superconducting electrode 20 using the transfer jig 200 (FIGS. 2F and 2G).
• a step of forming the WTe 2 film 30A on the substrate 16 (FIG. 2D), a step of picking up the WTe 2 film 30A from the substrate 16 (FIG. 2E), and a step of stacking the WTe 2 film 30A on the superconducting electrode 20 (FIG. 2D) 2F, Fig. 2G) is performed in a glove box purged with inert gas. Thereby, oxidation of the WTe 2 film 30A can be suppressed.
• the superconducting electrode 20 is formed by annealing the Pd/Te alternately laminated film 23 (FIG. 2C) at about 180° C. to cause a solid phase reaction in the Pd film 21 and the Te film 22.
• a superconducting electrode 20 containing PdTe 2 or PdTe is formed by solid phase reaction of the Pd/Te alternately laminated film 23 (FIG. 2F).
• the annealing process is performed in a glove box before laminating the WTe 2 film 30A on the superconducting electrode 20.
• the superconducting electrode 20 and the WTe 2 film 30A are joined by intermolecular force.
• the transfer jig 200 is heated to about 100° C. to soften the second resin layer 203.
• the WTe 2 film 30A is separated from the transfer jig 200.
• the heating temperature is set to about 100° C.
• diffusion of Pd contained in the superconducting electrode 20 into the WTe 2 film 30A can be avoided, and the characteristics of the WTe 2 film 30A as a topological insulator are maintained.
• the temperature at which Pd diffusion occurs is 150° C. or higher.
• a part of the resin constituting the second resin layer 203 remains on the WTe 2 film 30A side.
• This residue 50 functions as a protective film that prevents oxidation of the WTe 2 film 30A and the superconducting electrode 20 (FIG. 2H).
• the residue 50 may be removed using an organic solvent such as chloroform.
• the electronic device 10 includes the superconducting electrode 20 containing PdTe 2 or PdTe, and the TMD film 30 containing transition metal dichalcogenite laminated on the superconducting electrode 20.
• the manufacturing method of the electronic device 10 according to the embodiment of the disclosed technology includes performing an annealing treatment on a film containing Pd and Te (Pd/Te alternately laminated film 23) in an inert gas atmosphere to cause a solid phase reaction.
• the method includes a step of forming a superconducting electrode 20 containing PdTe 2 or PdTe.
• the method for manufacturing the electronic device 10 includes a step of laminating a TMD film 30 containing transition metal dichalcogenite and a superconducting electrode 20 in an inert gas atmosphere.
• the present inventor focused on the solid phase reaction between WTe 2 and Pd in order to realize a structure in which a topological insulator is brought into contact with a superconductor. Although it was known that superconductivity occurs when WTe 2 and Pd are bonded, the mechanism has not been clarified. As shown in FIG. 4, the inventor's research has shown that by stacking the WTe 2 film 30A on the Pd film 21 and annealing it at about 180°C, Pd diffuses into the WTe 2 and solidifies. It was revealed that a phase reaction occurred and a superconductor 20X containing PdTe or PdTe 2 was formed near the interface between the Pd film 21 and the WTe 2 film 30A.
• Te contained in the superconducting electrode 20 containing PdTe or PdTe 2 is supplied from the Pd and Te alternately laminated film 23 .
• extraction of Te from the TMD film to the Pd film can be suppressed. That is, it is possible to realize a structure in which a topological insulator and a superconductor are in contact without impairing the characteristics of the TMD film 30 as a topological insulator.
• oxidation of the Pd/Te alternately laminated film 23 can be suppressed.
• the WTe 2 film 30A (TMD film 30) is laminated on the superconducting electrode 20 by transferring a peeled piece of WTe 2 single crystal was illustrated, but the disclosed technology is limited to this embodiment. It's not something you can do.
• the MBE method is one of the physical vapor deposition methods, and is a method in which a raw material is heated with an electron beam under vacuum, and the generated molecular beam is caused to reach a substrate to grow crystals.
• the PLD method is a method in which a target is irradiated with a pulsed laser having high power density under vacuum to ablate and evaporate target components to form a thin film.
• FIG. 5A to 5C are cross-sectional views showing an example of a method for manufacturing the electronic device 10 using the MBE method or the PLD method.
• the substrate 15 on which the Pd/Te alternately laminated film 23 is formed is housed in a vacuum chamber of an MBE device or a PLD device (FIG. 5A).
• a superconducting electrode 20 containing PdTe 2 or PdTe is formed by subjecting the Pd/Te alternately laminated film 23 to annealing treatment at about 180° C. to cause a solid phase reaction in a vacuum chamber.
• a mask 45 having openings corresponding to the pattern of the WTe 2 film 30A is placed in the vacuum chamber (FIG. 5B).
• a WTe 2 film 30A is formed on the superconducting electrode 20 using the MBE method or the PLD method (FIG. 5C). If necessary, a protective film (not shown) may be formed to cover the superconducting electrode 20 and the WTe 2 film 30A.
• FIG. 6 is a cross-sectional view showing an example of the configuration of an electronic device 10A according to the second embodiment of the disclosed technology.
• the electronic device 10A according to this embodiment is a top contact type device in which a superconducting electrode 20 is provided on a TMD film 30. Similar to the electronic device 10 according to the first embodiment, the superconducting electrode 20 contains PdTe 2 or PdTe, and the TMD film 30 contains transition metal dichalcogenite.
• the transition metal dichalcogenite may be a topological insulator, for example WTe2 .
• the transition metal dichalcogenite constituting the TMD film 30 may be, for example, WSe 2 , WS 2 , MoSe 2 , or MoS 2 .
• the thickness of the TMD film 30 at the first portion P1, which is the portion in contact with the superconducting electrode 20, is thicker than the thickness of the second portion P2, which is a portion other than the first portion.
• the thickness of the second portion P2 of the TMD film 30 is, for example, the thickness of two to four atomic layers.
• the surface of the TMD film 30 is exposed to the atmosphere, is oxidized, and is covered with an oxide film 60. In the second portion P2 of the TMD film 30, only the surface layer of the second to fourth atomic layers is oxidized.
• the surface of the superconducting electrode 20 may be covered with a Pd film 21.
• 7A to 7F are cross-sectional views showing an example of a method for manufacturing the electronic device 10A.
• a multilayer TMD film 30 is formed on the substrate 15.
• the TMD film 30 is the WTe 2 film 30A
• the method shown below is also applicable to the case where the TMD film 30 is composed of transition metal dichalcogenite other than WTe 2 . It is.
• the multilayer WTe 2 film 30A can be formed by transferring a peeled piece of WTe 2 single crystal, as in the first embodiment, and can also be formed by the MBE method or the PLD method (FIG. 7A). ).
• a Pd film 21 is formed on the surface of the WTe 2 film 30A using a lift-off method. By lift-off, the Pd film 21 is patterned into a desired shape (FIG. 7B). Next, by etching the WTe 2 film 30A using the Pd film 21 as a mask, the WTe 2 film 30A is partially thinned (FIG. 7C). The portion (second portion P2) other than the portion (first portion P1) covered with the Pd film 21 of the WTe 2 film 30A is thinned to a thickness of two to four atomic layers. . Argon milling or atomic layer etching (ALE) can be used as an etching method for the WTe 2 film 30A.
• ALE atomic layer etching
• FIG. 8A to 8D are cross-sectional views showing an example of a method for partially thinning the WTe 2 film 30A by etching using the ALE method.
• the WTe 2 film 30A is subjected to UV ozone treatment using the Pd film 21 as a mask.
• the outermost layer of the WTe 2 film 30A is oxidized, and an oxide film 61 is formed on the surface of the WTe 2 film 30A (FIG. 8A). Since the WTe 2 film 30A is damaged by ultraviolet light irradiation, it is preferable to shield the WTe 2 film 30A from direct irradiation of the ultraviolet light.
• the oxide film 61 formed on the surface of the WTe 2 film 30A is removed using a KOH ethanol solution.
• the WTe 2 film 30A is thinned by the thickness of one atomic layer (FIG. 8B).
• the surface of the WTe 2 film 30A from which the oxide film 61 has been removed is oxidized again by UV ozone treatment, and the oxide film 61 is again formed on the surface of the WTe 2 film 30A (FIG. 8C).
• the oxide film 61 formed on the surface of the WTe 2 film 30A is removed using a KOH ethanol solution (FIG. 8D).
• the process of forming the oxide film 61 on the surface of the WTe 2 film 30A and the process of removing the oxide film 61 are performed on the part of the WTe 2 film 30A other than the part covered with the Pd film 21 (the first part P1). This process is repeated until the thickness of the part P2) in step 2 becomes the thickness of 2 to 4 atomic layers.
• the Pd film 21 and the WTe 2 film 30A are annealed at about 180°C.
• Pd contained in the Pd film 21 diffuses into the WTe 2 film 30A, and a superconducting electrode 20 containing PdTe or PdTe 2 is formed near the interface between the Pd film 21 and the WTe 2 film 30A by solid phase reaction. Ru.
• the unreacted Pd film 21 remains on the superconducting electrode 20 (FIG. 7D). Since the WTe 2 film 30A is easily oxidized, there is a possibility that an oxide film exists between the Pd film 21 and the WTe 2 film 30A before the annealing process.
• the Pd film 21 can pass through the oxide film existing between the Pd film 21 and the WTe 2 film 30A and diffuse into the WTe 2 film 30A. No oxide film is formed at the interface between the superconducting electrode 20 containing PdTe or PdTe 2 formed by diffusion of the Pd film 21 and the WTe 2 film 30A. Furthermore, the portion of the WTe 2 film 30A directly below the Pd film 21 may be destroyed by the diffusion of Pd. However, since Pd does not diffuse into the thinned portion (second portion P2) of the WTe 2 film 30A, the characteristics of the WTe 2 film 30A as a topological insulator are maintained.
• the WTe 2 film 30A is exposed to the atmosphere so that the outermost layer thereof is oxidized to form an oxide film 60.
• at least one layer, including the bottom layer of WTe 2 film 30A, is maintained in an unoxidized state (FIG. 7E).
• a cap film 55 may be formed to cover the Pd film 21, the superconducting electrode 20, and the WTe 2 film 30A (FIG. 7F).
• the cap film 55 may be made of hexagonal boron nitride, for example.
• the WTe 2 film 30A will be oxidized, and the portion of the WTe 2 film 30A other than the portion covered with the Pd film 21 (the first portion P1) (the second portion P1) is The thickness of the portion P2) can be one atomic layer thick.
• the electronic device 10A according to the second embodiment of the disclosed technology is a top contact type device in which the superconducting electrode 20 is provided on the TMD film 30.
• the thickness of the first portion P2 of the TMD film 30, which is the portion in contact with the superconducting electrode 20, is thicker than the thickness of the second portion P2, which is a portion of the TMD film 30 other than the first portion P1.
• a method for manufacturing an electronic device 10A according to a second embodiment of the disclosed technology includes a step of forming a Pd film 21 on the surface of a multilayer TMD film 30 containing Te, and etching the TMD film 30 using the Pd film 21 as a mask.
• the method includes a step of partially thinning the TMD film 30 by doing so.
• the method for manufacturing the electronic device 10A includes annealing the Pd film 21 and the TMD film 30 to cause a solid phase reaction, thereby forming a superconductor containing PdTe 2 or PdTe near the interface between the Pd film 21 and the TMD film 30.
• the method includes a step of forming an electrode.
• the portion of the WTe 2 film 30A directly below the Pd film 21 can be destroyed by the diffusion of the Pd film 21.
• Pd does not diffuse into the thinned portion (second portion P2) of the WTe 2 film 30A, the characteristics of the WTe 2 film 30A as a topological insulator are maintained.
• no oxide film is formed at the interface between the superconducting electrode 20 containing PdTe or PdTe 2 formed by diffusion of the Pd film 21 and the WTe 2 film 30A.
• the method for manufacturing the electronic device 10A according to the present embodiment it is possible to suppress the formation of an oxide film at the interface between the TMD film 30 (WTe 2 ) and the superconducting electrode 20 (PdTe or PdTe 2 ).
• 9A to 9D are cross-sectional views showing an example of a manufacturing method for forming the superconducting electrode 20 using the Pd and Te alternately laminated film 23.
• a Pd/Te alternately laminated film 23 is formed on the surface of the WTe 2 film 30A.
• the top layer of the Pd/Te alternately laminated film 23 is preferably made of Pd.
• the bottom layer of the Pd/Te alternately laminated film 23 is also made of Pd.
• the WTe 2 film 30A is partially thinned by etching the WTe 2 film 30A using the Pd/Te alternate laminated film 23 as a mask (FIG. 9B).
• the part (second part P2) other than the part (first part P1) covered with the Pd/Te alternate laminated film 23 of the WTe 2 film 30A has a thickness of 2 to 4 atomic layers. Become thinner.
• Argon milling or atomic layer etching (ALE) can be used as an etching method for the WTe 2 film 30A.
• the Pd/Te alternately laminated film 23 and the WTe 2 film 30A are annealed at about 180°C.
• a solid phase reaction occurs within the Pd/Te alternately laminated film 23, and PdTe or PdTe 2 is formed.
• Pd also diffuses into the WTe 2 film 30A, and PdTe or PdTe 2 is also formed near the interface between the Pd/Te alternately laminated film 23 and the WTe 2 film 30A due to solid phase reaction.
• a superconducting electrode 20 is formed by PdTe or PdTe 2 generated by the solid state reaction (FIG. 9C).
• No oxide film is formed at the interface between the WTe 2 film 30A and the superconducting electrode 20 containing PdTe or PdTe 2 formed by diffusion of Pd. Furthermore, the portion of the WTe 2 film 30A directly below the Pd/Te alternately laminated film 23 may be destroyed by the diffusion of Pd. However, since Pd does not diffuse into the thinned portion (second portion P2) of the WTe 2 film 30A, the characteristics of the WTe 2 film 30A as a topological insulator are maintained.
• the WTe 2 film 30A is exposed to the atmosphere so that the outermost layer thereof is oxidized to form an oxide film 60.
• at least one layer, including the bottom layer of the WTe 2 film 30A, is maintained in an unoxidized state (FIG. 9D).
• FIG. 10 is a plan view showing an example of the configuration of an electronic device 10B according to the third embodiment of the disclosed technology.
• the electronic device 10B functions as a quantum bit element using Majorana particles.
• the electronic device 10B includes a first TMD film 30P, a second TMD film 30Q, superconducting electrodes 20A, 20B, 20C, and magnetic bodies 70A, 70B, 70C, 70D.
• the first TMD film 30P and the second TMD film 30Q are made of a topological insulator, and may be, for example, a single-layer WTe 2 film.
• the superconducting electrodes 20A to 20C are made of PdTe 2 or a superconductor containing PdTe.
• the first TMD film 30P and the second TMD film 30Q are each patterned into a rectangular shape.
• the first TMD film 30P is arranged so that its longitudinal direction is horizontal.
• the second TMD film 30Q is arranged so that its longitudinal direction is vertical, and is stacked on the first TMD film 30P while intersecting with the first TMD film 30P.
• the long side edge E1 of the first TMD film 30P and the long side edge E2 of the second TMD film 30Q intersect.
• the superconducting electrodes 20A and 20B are provided in contact with the long edge E1 of the first TMD film 30P.
• the superconducting electrode 20C is provided in contact with the long edge E2 of the second TMD film 30Q.
• the superconducting electrodes 20A to 20C are each patterned into a rectangular shape, and the short edge of one of them is the long edge E1 of the first TMD film 30P and the long edge E2 of the second TMD film 30Q. It is located near the intersection of
• the superconducting electrode 20A is provided in contact with an edge of the first TMD film 30P that forms a corner that contacts the second TMD film 30Q.
• the electronic device 10B is of a bottom contact type in which a first TMD film 30P and a second TMD film 30Q are laminated on superconducting electrodes 20A to 20C.
• the magnetic body 70A is in contact with the long edge E1 of the first TMD film 30P, and is provided near the other short edge of the superconducting electrode 20A.
• the magnetic body 70B is in contact with the long edge E1 of the first TMD film 30P, and is provided near the other short edge of the superconducting electrode 20B.
• the magnetic body 70C is in contact with the long edge E2 of the second TMD film 30Q, and is provided near the other short edge of the superconducting electrode 20C.
• the magnetic body 70D is provided near the intersection of the long side edge E1 of the first TMD film 30P and the long side edge E2 of the second TMD film 30Q.
• Ni, Co, or Fe can be used as the magnetic materials 70A to 70D.
• Superconducting wires 71A, 71B, and 71C are connected to superconducting electrodes 20A, 20B, and 20C, respectively.
• the superconducting wirings 71A, 71B, and 71C may be made of a superconductor containing PdTe 2 or PdTe, similarly to the superconducting electrodes 20A, 20B, and 20C, respectively.
• the superconducting wirings 71A, 71B, and 71C may have, for example, a two-layer structure in which PdTe 2 and Al are stacked, or a two-layer structure in which NbTe 2 and Nb are stacked.
• Switches 72A, 72B, and 72C are provided on the respective paths of superconducting wirings 71A, 71B, and 71C.
• Switches 72A, 72B, 72C may be Josephson junction devices.
• Switches 72A, 72B, and 72C are each connected to ground potential.
• the electronic device 10B there is a gap between the superconducting electrode 20A and the magnetic body 70A at the long side edge E1 of the first TMD film 30P, and between the long side edge E2 of the second TMD film 30Q.
• Majorana particles 100 are generated at the intersection and at positions between the superconducting electrode 20B and the magnetic body 70B. Further, Majorana particles 100 are generated at a position between the superconducting electrode 20C and the magnetic body 70C on the long side edge E2 of the second TMD film 30Q.
• the Majorana particles 100 can be localized by the magnetic bodies 70A to 70D. By turning on and off the switches 72A, 72B, and 72C to ground or float the superconducting electrodes 20A, 20B, and 20C, it becomes possible to mutually exchange the Majorana particles 100 generated at each location.
• FIG. 11 is a plan view showing an example of the configuration of an electronic device 10C according to the fourth embodiment of the disclosed technology.
• the electronic device 10C functions as a quantum bit device using Majorana particles.
• the electronic device 10C has a first TMD film 30P, a second TMD film 30Q, superconducting electrodes 20A, 20B, 20C, and magnetic bodies 70A, 70B, 70C, 70D.
• the first TMD film 30P and the second TMD film 30Q are made of a topological insulator, and may be, for example, a single-layer WTe 2 film.
• the superconducting electrodes 20A to 20C are made of PdTe 2 or a superconductor containing PdTe.
• the first TMD film 30P and the second TMD film 30Q are each patterned into a rectangular shape. Note that the first TMD film 30P and the second TMD film 30Q only need to have at least one corner, and may have polygons other than quadrangles or other shapes.
• One corner of the second TMD film 30Q is in contact with one corner of the first TMD film 30P.
• the superconducting electrode 20A is provided in contact with an edge of the first TMD film 30P that forms a corner that contacts the second TMD film 30Q.
• the superconducting electrode 20B is provided in contact with one edge of the second TMD film 30Q forming a corner that contacts the first TMD film 30P.
• the superconducting electrode 20C is provided in contact with the other edge of the second TMD film 30Q forming a corner that contacts the first TMD film 30P.
• the electronic device 10C is a top contact type in which superconducting electrodes 20A to 20C are stacked on a first TMD film 30P and a second TMD film 30Q.
• the magnetic body 70A is in contact with an edge forming a corner of the first TMD film 30P that is in contact with the second TMD film 30Q, and is provided near the superconducting electrode 20A.
• the magnetic body 70B is in contact with one edge of the second TMD film 30Q forming a corner that is in contact with the first TMD film 30P, and is provided near the superconducting electrode 20B.
• the magnetic body 70C is in contact with the other edge of the second TMD film 30Q forming a corner that is in contact with the first TMD film 30P, and is provided near the superconducting electrode 20C.
• the magnetic body 70D is provided near the corner where the first TMD film 30P and the second TMD film 30Q are in contact with each other.
• Superconducting wires 71A, 71B, and 71C are connected to superconducting electrodes 20A, 20B, and 20C, respectively.
• the superconducting wirings 71A, 71B, and 71C may be made of a superconductor containing PdTe 2 or PdTe, respectively, similarly to the superconducting electrodes 20A, 20B, and 20C.
• the superconducting wirings 71A, 71B, and 71C may have, for example, a two-layer structure in which PdTe 2 and Al are stacked, or a two-layer structure in which NbTe 2 and Nb are stacked.
• Switches 72A and 72B are provided on the respective paths of the superconducting wirings 71A and 71B.
• Switches 72A, 72B may be Josephson junction devices.
• Switches 72A, 72B and superconducting wiring 71C are each connected to ground potential.
• the electronic device 10C at a position between the superconducting electrode 20A and the magnetic body 70A at the edge forming the corner of the first TMD film 30P in contact with the second TMD film 30Q.
• Majorana particles 100 are generated. Additionally, Majorana particles 100 are generated between the superconducting electrode 20B and the magnetic body 70B at one edge of the second TMD film 30Q forming a corner that contacts the first TMD film 30P. Further, Majorana particles 100 are generated between the superconducting electrode 20C and the magnetic material 70C at the other edge of the second TMD film 30Q forming a corner in contact with the first TMD film 30P.
• Majorana particles 100 are generated at the corners where the first TMD film 30P and the second TMD film 30Q are in contact with each other.
• the Majorana particles 100 can be localized by the magnetic bodies 70A to 70D.

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• 2022
  • 2022-08-31 WO PCT/JP2022/032865 patent/WO2024047817A1/ja not_active Ceased
  • 2022-08-31 JP JP2024543710A patent/JPWO2024047817A1/ja active Pending
• 2025
  • 2025-02-05 US US19/045,596 patent/US20250185521A1/en active Pending

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