WO2024046577A1 - Procédé et dispositif pour influencer une onde de liaison lors d'une liaison - Google Patents

Procédé et dispositif pour influencer une onde de liaison lors d'une liaison Download PDF

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Publication number
WO2024046577A1
WO2024046577A1 PCT/EP2022/074470 EP2022074470W WO2024046577A1 WO 2024046577 A1 WO2024046577 A1 WO 2024046577A1 EP 2022074470 W EP2022074470 W EP 2022074470W WO 2024046577 A1 WO2024046577 A1 WO 2024046577A1
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WO
WIPO (PCT)
Prior art keywords
zone
substrate
bonding
holding force
pressure
Prior art date
Application number
PCT/EP2022/074470
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German (de)
English (en)
Inventor
Jürgen Burggraf
Andreas FEHKÜHRER
Original Assignee
Ev Group E. Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E. Thallner Gmbh filed Critical Ev Group E. Thallner Gmbh
Priority to PCT/EP2022/074470 priority Critical patent/WO2024046577A1/fr
Priority to TW112130292A priority patent/TW202425171A/zh
Publication of WO2024046577A1 publication Critical patent/WO2024046577A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the invention relates to a method and a device for influencing a bonding wave when bonding substrates.
  • the invention also relates to a method and a device for bonding with a substrate holder having at least one zone. Such zones are essential in some devices and methods for individually processing, fixing and bonding the substrate to other substrates or substrate stacks.
  • connection process takes place through a progressive bonding wave, which, starting from the contact point, spreads towards the periphery of the two substrates.
  • a separation of the two substrates using appropriate methods and devices would be conceivable. Separation is necessary if it is determined that the substrates were not optimally connected to each other. Very few substrates have an untreated substrate surface. In most cases, the substrates have already been processed and have different structures. For example, integrated circuits, microprocessors, LEDs, MEMS, etc. are conceivable. These structures should then be aligned with the structures on a second substrate and connected to them. What is particularly important is that each individual structure of the first substrate must be correctly aligned and connected to the structure present on the second substrate opposite it.
  • the substrate stack produced is regularly thermally treated in order to increase the adhesion strength between the two substrate surfaces. After this thermal treatment has ended, it is referred to as a fusion or permanent bond. From this second point onwards, the two substrates can no longer be separated from one another in a non-destructive manner.
  • a zone is understood to be an area that has at least one, possibly several, Has fixing elements.
  • the zones are usually physically separated from each other but can also simply be regions in which the fixing elements are switched according to a predetermined plan.
  • a substrate holder can only have a single zone in which there are generally several fixing elements.
  • substrate holders with several zones separated from one another by partition walls are particularly preferred.
  • the outer periphery can be viewed as the partition in the sense of the invention, which separates the one, individual zone from the surroundings.
  • One type of substrate holders are vacuum substrate holders.
  • the space between the substrate and the substrate holder is evacuated via the fixing elements, which are usually only small holes, and the atmospheric pressure presses the substrate open and fixes the substrate on the substrate holder.
  • the fixing elements which are usually only small holes, and the atmospheric pressure presses the substrate open and fixes the substrate on the substrate holder.
  • Only individual holes were drilled into the substrate holder, forming very simple fixing elements.
  • the entire area between the substrate and the substrate holder surface was evacuated. All existing fixing elements were connected to the same vacuum line. This resulted in a full-surface fixation of the substrate that could not be locally controlled or regulated when a vacuum was applied.
  • a further development of the substrate holder was to combine the fixing elements and zones with a pins chuck.
  • a studded substrate holder is a substrate holder that has been milled out at several, in particular symmetrically distributed, positions. The milling is not carried out over the entire surface, but preferably symmetrically along radial, azimuthal or rectangular lines. This leaves elevations between these lines, in Reference to the milled back area, which are referred to as knobs in the prior art.
  • knobs in Reference to the milled back area
  • the knob density can also be varied as a function of the location, in particular as a function of the radius, in order to obtain a more homogeneous force on the substrate when using several fixing elements per zone.
  • the milled knobs create a recessed structure that is generally identical to a zone. Adjacent zones are separated from each other by a partition.
  • the partition is either made of material that has not been milled back or has an intentionally inserted, especially polymeric, seal.
  • the partition completely encloses a zone and can also be viewed as a vacuum seal in a vacuum substrate holder.
  • the partition of the substrate holder is also the periphery, which separates the zone from the surroundings. If a bonding wave runs to the edge of such a substrate holder, the same problem arises as when crossing a partition wall that separates several zones from one another; the substrate areas close to the bonding wave can be distorted. It is therefore the object of the invention to at least partially eliminate, in particular completely eliminate, the disadvantages listed in the prior art. In particular, it is an object of the invention to demonstrate an improved method and device for bonding. Furthermore, it is the object of the present invention to demonstrate a method and a device with which the bonding result, in particular the distortion between two substrates, can be reduced.
  • the invention relates to a method for influencing a bonding wave when bonding a first substrate to a second substrate, wherein at least the first substrate is fixed on a first substrate holder with at least one zone and the at least one zone each has at least one at least partially forming the substrate holder surface Separating element, and wherein the at least one separating element separates the at least one zone from a further zone or an environment of the first substrate holder, and wherein the at least one zone each has at least one fixing element and the at least one fixing element each has a holding force for fixing the first substrate on the first substrate holder, the method having at least the following steps: i) initiating a bonding wave by contacting the second substrate with the first substrate and then ii) adjusting the Holding force of the at least one fixing element of the at least one zone to a holding force of a fixing element of a further zone immediately in front of it in a propagation direction of the bonding wave or to an ambient pressure of the environment.
  • the at least one zone is controlled by adjusting the holding forces of the fixing elements of the zone substrate holder in such a way that the pressure gradient of the at least one zone in the direction of the propagation of the bonding wave, in particular in the area of the separating element, is as low as possible.
  • the holding force of the at least one fixing element to the ambient pressure, in particular to the pressure of the last zone in the direction of propagation, it is ensured that the atmospheric pressure during bonding at the moment the bonding wave passes over the partition at the edge of the substrate holder corresponds to the holding force of the zone fits on the outer edge.
  • the pressure within the at least one, in particular the last, zone can be adapted to the ambient pressure. Since the adjustment of the pressure within the zone can be accomplished more quickly and efficiently than a pressure change in a large chamber or the environment, the bonding wave is advantageously influenced.
  • the holding force on the lower substrate is particularly reduced or even completely eliminated, so that it can expand unhindered at the edge.
  • the at least one zone has a plurality of controllable fixing elements, whereby the holding forces can be changed in a targeted manner.
  • the bonding wave is preferably initiated by centrally contacting the second substrate with the first substrate, so that the bonding wave propagates radially symmetrically.
  • Substrate holders with several zones are particularly preferred. Therefore, the embodiment of a substrate holder is often used in the further course of the text described with several zones in which there is at least one partition that separates two zones from each other.
  • the holding force is preferably the last zone or the outermost zone adapted so that a particularly even transition over the last or outermost partition wall is possible.
  • the partition can also be inserted elements, in particular a sealing lip. The partition therefore does not necessarily have to result from a milled-back area of the substrate holder, but can be an attached component.
  • the pressure in the outermost zone is adapted to the ambient pressure.
  • the zones can be divided into several segments perpendicular to the direction of propagation of the bond wave.
  • several isosceles trapezoidal segments can form a zone, the segments in turn preferably each having at least one fixing element.
  • the bonding shaft can advantageously be adjusted at several points simultaneously along the preferably circular substrate holder, regardless of the radial position. The adjustment takes place after the bonding wave has been initiated and preferably in the area where the bonding wave moves (the first and second substrates are contacted or connected). In this way, particularly distortion-free bonding is possible.
  • the ambient pressure is additionally adjusted to the holding force of the fixing element of the at least one zone.
  • the prevailing atmospheric pressure or the ambient pressure in the bonding chamber is adjusted.
  • the holding force in the at least one zone can advantageously be adjusted indirectly, since the ambient pressure acts on the first substrate.
  • the adjustment in step ii) is carried out in such a way that the holding force is the same in the propagation direction of the bonding wave immediately in front of and behind the at least one separating element.
  • the holding force can also be continuously adjusted. What is crucial is that the large difference in holding force between the zones immediately before and after the bonding wave exceeds the separation turn, which is desired to regulate the bonding wave, is minimal. In this way, distortion in the area of the zone transitions can advantageously be ensured.
  • step i) after the bonding wave has been initiated in step i), the position of the bonding wave is continuously determined and the holding force of the at least one zone is adjusted in such a way that when the bonding wave passes over the at least one Separating element, the holding force is the same in front of and behind the at least one separating element.
  • the adjustment in step ii) can advantageously be carried out in exactly the same period of time in which the bonding wave moves over the separating elements. In this way, the desired holding force differences can still be implemented in areas outside the separating elements or between them to regulate the bonding wave without generating distortion in the area of the zone transitions.
  • the at least one fixing element of the at least one zone is each designed as a vacuum fixation and the at least one separating element fluidly separates the at least one zone from the further zone or the environment.
  • the substrate holder is a vacuum zone substrate holder, which is divided into a plurality of controllable vacuum zones arranged symmetrically in the radial direction and in the direction of propagation. The substrate arranged on the separating elements is thus sucked in and fixed.
  • the holding force of the vacuum fixings is advantageously adjusted individually in each zone (or segment), since they are fluidically tight and therefore suitable for vacuum.
  • the fixing element can advantageously act in the entire area and the bonding shaft can be regulated as completely as possible.
  • the substrate holder can in particular be surrounded by an inert gas, preferably helium. It is also conceivable that the vacuum lines are flushed with the inert gas.
  • the adjustment in step ii) is carried out by flooding or evacuating the at least one zone or by flooding or evacuating the surroundings.
  • the holding force can advantageously be provided simply, quickly and over a large area.
  • the holding force can be adjusted particularly quickly during the transition in the area of the zone transitions or in the area of the separating elements and can then advantageously be quickly adjusted to the desired holding forces for regulating the bonding wave in the areas between the separating elements.
  • the adjustment in step ii) includes determining a pressure difference between the at least one zone and the further zone or the environment, the pressure difference being determined by the adjustment is balanced. In this way it can be ensured that there is a particularly low pressure gradient in front of and behind the separating element and that distortion during bonding can be minimized.
  • the area in front of the separating element can advantageously be flooded instead of evacuated.
  • a pressure of the at least one zone is adjusted to the pressure of the further zone. In this way, there is advantageously sufficient time to precisely determine the position of the bonding wave and to only adjust the pressure in the zone downstream of the propagation direction.
  • the holding force of the at least one zone and the further zone are adapted to one another to compensate for the pressure gradient.
  • the further zone also has corresponding fixing elements with variable holding force.
  • the ambient pressure is adjusted to the last zone in the direction of propagation, it can also take place simultaneously with the holding force of the at least one zone.
  • the invention relates to a device for influencing a bonding wave when bonding a first substrate to a second substrate, at least comprising a first substrate holder for fixing the first substrate with at least one zone, the at least one zone over at least one at least partially a substrate holder surface of the first substrate holder forming separating element, and at least one fixing element arranged in the at least one zone with a holding force for fixing the first substrate to the first substrate holder, a control unit for adjusting the holding force of the at least one fixing element of the at least one zone, the control unit being set up to control the holding force of the at least one fixing element to adapt at least one zone to a holding force of a fixing element of a further zone immediately in front of it in a propagation direction of the bonding wave or to an ambient pressure as the bonding wave advances.
  • the control unit is thus set up to adapt the holding force of the at least one fixing element to the holding force of the upstream zone.
  • the holding force is adapted to the ambient pressure
  • the holding force of the last zone on the periphery of the substrate holder is adapted as a function of the ambient pressure.
  • a zone substrate holder is provided with a plurality of controllable fixing elements, the fixing elements being controlled in such a way that optimal holding forces are provided during bonding before and after a partition separating the zone, so that distortion during the transition is reduced.
  • the first substrate lies with the side facing away from the second substrate on the separating element that at least partially forms the substrate holder surface.
  • a bonding wave By controlling the holding forces before and after the transition over the partition, a bonding wave can move particularly smoothly and undisturbed in the area of the partition. This reduces the undesirable influence of different holding forces in front of and behind the partition, on the bonding wave that propagates in particular from the inside to the outside. Different holding forces can be desired between the zones to regulate the bonding wave. If a bonding process is not initiated from the center, the outer zone with the fixing element with variable holding force can also be arranged closer to the center of the substrate holder. What is crucial is that the holding force of the following zone, particularly in the area of the separating element, can be adjusted in the direction of the expected bonding wave in order to compensate for the influence of the different holding forces acting (before and after the separating wall).
  • the control unit is not limited to pure control, but can also regulate the holding forces depending on other parameters (e.g. bond shaft position).
  • the holding forces of the fixing elements are preferably adjustable by the control unit.
  • the substrate holder preferably has a plurality of separating elements, which in turn can be divided into several segments along the preferably circular substrate holder.
  • the device can advantageously minimize the tension and distortion, particularly in the area of the zone transitions or from the inner to the outer zone.
  • the control unit can also regulate the respective holding forces depending on other parameters.
  • the device for influencing a bonding wave during bonding, it is provided that the device additionally has means for adapting the ambient pressure to the holding force of the at least one zone.
  • the bonding wave can advantageously be indirectly influenced or the holding force can be adjusted, since the ambient pressure acts on the first substrate.
  • the fixing elements are vacuum fixing elements that work with pressure, the pressures can advantageously be equalized so that the bonding wave runs out particularly gently.
  • the control unit is set up to control the holding force of the at least one fixing element or the ambient pressure after contacting during bonding of the second Adapt substrate with the first substrate.
  • the control unit is therefore designed in such a way that the holding forces or the ambient pressure are only adjusted after a bonding wave has been initiated during bonding. In this way, the device or the control unit can carry out the adjustment taking into account the position, in particular based on empirical data in the control unit, of the bonding shaft.
  • the control unit is set up to determine the holding force of the at least one fixing element of the at least one zone using a sensor.
  • the sensor is preferably arranged in the area of the separating element in the at least one outer and/or inner zone.
  • a sensor can preferably be provided which determines the ambient pressure. In this way, the control unit can advantageously regulate the adjustment of the holding forces based on real values, so that the distortion can be further reduced.
  • the control unit is set up to control the holding force of the at least one fixing element of the at least one zone and the holding force of at least one further fixing element of a further zone during the bonding of the first substrate with the to keep the second substrate the same size.
  • the bonding wave is able to make the transition from the inner to the outer zone particularly gently and without distortion.
  • uniform holding forces can be set efficiently and uniformly in several zones, especially in successive zones. This further improves the bonding result and ensures low distortion when transitioning over the partition.
  • the control unit is set up to control the holding force of the at least one fixing element of the at least one and the holding force of the at least one fixing element of the further zone directly in the area of the at least one separating element and in To keep the period of overflow of a bond wave over the at least one separating element the same.
  • the position of the bonding shaft is preferably also determined by a measuring device, particularly preferably designed optically, and the period of adjustment is optimally adapted to the position of the bonding shaft. In this way, the regulation of the holding forces between the separating elements to influence the bonding wave can advantageously be continued quickly after the separating elements have been exceeded. In addition, further improved bonding results can be achieved, particularly in the area of the separating elements.
  • the at least one fixing element of the further zone and the at least one fixing element of the at least one zone are designed as vacuum fixings and the separating element fluidly separates the inner zone and the outer zone from one another.
  • a fixation of the substrate to the first substrate holder over a large area in the entire zone area can thus advantageously be achieved by suppressing pressure (relative to the atmosphere or the environment).
  • This holding force can advantageously be changed quickly, precisely and in every zone.
  • contamination of the first substrate can be kept to a minimum since no contact with the substrate is necessary to apply the force.
  • the zones which are fluidically separated from one another and controlled via vacuum fixing elements, are therefore predestined for use in the device for influencing the bonding wave.
  • the control unit is set up to keep a pressure difference between a pressure of the further zone and a pressure of the at least one zone during bonding as low as possible, preferably to keep it the same.
  • the pressure is preferably regulated by means of pressure sensors arranged in the respective zones.
  • the control unit is set up so that the means for changing the ambient pressure adjusts the ambient pressure to the pressure of the at least one zone immediately before and after the bonding wave exceeds the at least one Adjust separating element.
  • an outer zone is understood to mean the at least one zone or a zone downstream in the direction of propagation of a bonding wave.
  • An inner zone is another zone or the final zone if the ambient pressure is adjusted.
  • the inner zone is an upstream zone in the direction of propagation.
  • the holding force of the downstream or at least one zone is preferably adapted to the holding forces of the upstream zone.
  • a particularly advantageous effect of the device and the method for influencing the bonding wave during bonding is that none arise or only negligible distortions arise between the two substrates near the partition walls that separate the zones from one another. This enables a seamless, gentle and non-distorting transition of the bonding wave front over the partition. The distortion is reduced, particularly in the area of the partition walls, and stresses in the bonded substrate stack are reduced.
  • Another aspect is to continuously control or regulate the pressure in the zones shortly before and/or during and/or after the transition of the bonding wave front over the partition.
  • the pressure of a zone behind the bonding wave or a zone in which the bonding wave is currently located is continuously changed so that it is adapted to the pressure of the zone into which the bonding wave is moving.
  • the bonding wave's movement behavior is influenced by controlling or regulating the holding forces of the zones along the direction of propagation of the initiated bonding wave.
  • the speed or acceleration of the bonding wave is specifically adjusted in a zone by controlling at least one fixing element, in particular by adjusting the pressure state over time. In particular, this enables a distortion-free, continuous and smooth transition of the advancing bond wave across the partition walls of zones.
  • the following procedure assumes and describes idealized processes to illustrate an exemplary bonding procedure.
  • the bonding wave spreads radially symmetrically, ie as circular as possible, from the contact point to the periphery.
  • This approach makes it easier to describe the process, as we can always speak of a bond wave in general that needs to be regulated.
  • an asymmetrical propagation of the bond wave is also conceivable.
  • all methods, devices and procedures mentioned here are taken into account It is considered that a bond wave can generally propagate anisotropically and therefore a regulation of the zones in front of and/or behind a bond wave section must be considered, ie the regulation of the zones is generally applied to the individual bond wave sections which exceed the partition at a certain position should be adjusted.
  • a regulation means a method in which a measurement signal for a first physical value is obtained and a second physical value is set depending on a desired result. It would be conceivable, for example, to measure the position of a bonding wave (first physical value) and then adjust the pressure in the zone in front of and/or the pressure in the zone behind (second physical measurement) of the bonding wave so that a desired result (minimal distortion of the substrate or the substrates on the partition).
  • a control is only the definition of a physical value, without a corresponding measurement signal. It may be that based on empirical data determined, it is known when a physical value must be set in order to achieve a result. For example, it could be known how a bonding wave behaves on substrates of the same type under the same initial and boundary conditions. In this case, the pressure in the individual zones could be controlled as a function of time, starting from the time of contacting, without having to measure the advancing bonding wave.
  • fixations are vacuum fixations, in particular simple holes drilled into the substrate holder surface, which can be evacuated or flooded. It is also conceivable that other fixing elements such as electrostatic fixings or magnetic fixings are used. These are then also divided into zones and are suitable for adapting the respective holding forces. In this case too, the fixing elements or their holding force can be changed/adjusted.
  • fixing element is therefore to be interpreted generally and refers not only but preferably to vacuum fixings.
  • a lower substrate is loaded onto a lower substrate holder and an upper substrate is loaded onto an upper substrate holder. Both substrates are preferably fixed with the fixing elements provided for this purpose.
  • the two substrates are aligned with one another.
  • the alignment is preferably carried out using alignment systems provided for this purpose.
  • the alignment between the two substrates is preferably carried out using alignment marks located on the substrates. The methods and devices for alignment are not discussed in detail.
  • the two substrates are brought closer to one another.
  • the distance between the two substrate surfaces to be connected to one another is smaller than 10 mm, preferably smaller than 5 mm, even more preferably smaller than 1 mm, most preferably smaller than 0.1 mm, most preferably smaller than 0.01 mm.
  • a fourth method step of an exemplary method for influencing a bonding wave during bonding at least one of the two substrates is deformed such that the deformed substrate comes into contact with the second substrate.
  • the contacting preferably takes place as pointwise as possible.
  • the contact takes place preferably as centrally as possible.
  • the contact point is the beginning of a later advancing bond wave.
  • the fixings are switched or regulated in such a way that at least one of the substrates can deform in such a way that a bonding wave begins to run.
  • the bonding wave is preferably initiated in the respective center of the substrate and spreads out radially symmetrically. As the bond wave advances, further fixations are switched or regulated so that the bond wave continues to move further towards the periphery.
  • the sixth method step of an exemplary method for influencing a bonding wave during bonding generally takes place several times and whenever a bonding wave section moves towards a partition wall between the zones.
  • the pressure is regulated in at least one zone, in particular in a zone in front of and/or behind the bonding shaft section.
  • the bonding wave section is therefore the region, which spreads particularly radially symmetrically, in which the upper and lower substrates connect.
  • the control is carried out in such a way that the bonding wave section generates minimal, in particular no, distortion between the substrate areas that are located in the vicinity of the partition wall.
  • the pressure in the zone in front of and/or in the zone behind the bonding shaft section must be continuously regulated so that the bonding shaft section is not exposed to any or a very low pressure gradient.
  • the substrate holder has several fixing elements.
  • the fixing elements can be controlled individually.
  • the fixing elements are preferably vacuum fixing devices. With the help of vacuum fixings, the contact pressure of the environment on the substrate can be controlled very easily and very precisely.
  • the fixing elements are part of a zone. In general, a zone could have multiple fixing elements to fit within one Zone to allow finer control of the bond wave. Particularly in the case of vacuum zones, several fixing elements are used to enable the zone to be evacuated more quickly. Using several fixing elements within a zone, a larger volume flow of gas can then be removed and thus faster control can be carried out. Theoretically it would also be conceivable that the fixations within a zone suck out the gas at different speeds.
  • the pressure within a zone is therefore preferably exclusively a function of time and several fixing elements are preferably switched in line so that the pressure in a zone is controlled homogeneously and isotropically.
  • a device for bonding comprises at least one zone substrate holder, preferably at least one measuring device and at least one control unit.
  • the measuring device takes over the measurement of a physical parameter, for example the position determination of the bonding wave or at least one bonding wave section.
  • the measuring device transmits this data to the control unit.
  • the control unit evaluates the measurement and, depending on the result, determines the necessary physical parameters for controlling or regulating the fixing elements.
  • the measuring device is preferably an optical system for determining the bonding shaft position. Sensors that determine the position of a bonding wave electromagnetically would also be conceivable. Proximity sensors, for example, would be conceivable.
  • the radius of curvature of a substrate at the point of the bonding wave is also of particular interest.
  • the control of the fixing elements can also take place depending on the radius of curvature of the substrate in the area of the bonding shaft.
  • the control unit is microchips, computers, software or a combination thereof. In most cases it will be software in a computer.
  • the measurement signals enter the computer via peripheral devices and are evaluated by the software.
  • the software then controls the fixing elements in the substrate holder via peripheral devices. It would also be conceivable to use PID controllers in which the control was programmed electronically.
  • FIG. 1 shows a top view of an embodiment of a substrate holder of a device for influencing a bonding wave during bonding
  • FIG. 2a shows a first state of a sixth method step of an exemplary method according to the invention for influencing a bonding wave during bonding
  • FIG. 2b shows a second state of a sixth method step of an exemplary method according to the invention for influencing a bonding wave during bonding
  • FIG. 2c shows a third state of a sixth method step of an exemplary method according to the invention for influencing a bonding wave during bonding
  • Figure 2d shows a fourth state of a sixth method step of an exemplary method according to the invention for influencing a bond wave during bonding.
  • the same components or components with the same function are marked with the same reference numerals.
  • Figure 1 shows the fixing surface of an embodiment of a substrate holder 1 of the bonding device.
  • the base body 2 can be mounted on a device with fasteners 3.
  • the substrate holder 1 has several, in particular radially and azimuthally delimited zones 7, 7 ', 7 ".
  • zones 7, 7', 7" are delimited by partitions 10.
  • the substrate holder 1 could also be designed in such a way that the partitions 10 are polymer seals or metal seals. In the figure you can see a central, radially symmetrical zone 7.
  • the zones 7, 7', 7" are in particular recessed, preferably milled, depressions 11, in which knobs 9 are located in some places.
  • the pin surface of the pins 9 is in particular congruent to the web surface of the partitions 10.
  • the zones 7, 7 ', 7" are designed in particular as vacuum zones.
  • the depressions 11 can be evacuated, in particular individually and independently of one another, via a fixing means 12 due to the separation by the partitions 10.
  • the fixing element 12 is simply a hole through which the space between the knobs 9 and thus the zone 7, 7 ', 7 "can be evacuated or flooded. If the zones 7, 7 ', 7 "also serve for deformation, a fluid can also flow in via the fixing means 12, which leads to a, in particular local, deformation of a fixed substrate.
  • a deforming element 5 which can deform a fixed substrate, in particular centrally.
  • the knobs 9 serve in particular to reduce the contact area of a fixed substrate 4, preferably to prevent contamination avoid.
  • sensors 8, in particular pressure sensors, can be located in the zones 7, 7 ', 7 "of the substrate holder 1.
  • a pressure can be defined as a force per unit area. Since the method for influencing a bonding wave is described using a vacuum substrate sample holder, and the zones are evacuated to generate a force on the substrate, it is advantageous to speak of pressures. Physical considerations regarding forces and their effects must then be carried out in accordance with the state of knowledge.
  • Figure 2a shows a first state of a sixth method step of a method for influencing a bond wave during bonding.
  • the cross section of an area Q (see Fig. 1) is shown through two zones 7 ', 7", as well as their partition 10.
  • a lower substrate 4 rests on the knobs 9 and the partition 10.
  • an upper substrate 4' is connected to the lower substrate 4 in this section of the two zones 7', 7′′.
  • the spreading bond wave 6 can be seen.
  • the bond wave 6 is only shown as a point in cross section. When viewed from above, the bond wave 6 would be a completely closed curve, in particular and preferably a circle. Since the progression of the bonding wave 6 is to be controlled or regulated, the two zones 7', 7" generally have different pressures.
  • the pressure pl in the zone 7' is chosen to be lower in order to be able to fix the substrate region 13 of the lower substrate 4 in the vicinity of the bonding shaft 6 more strongly and better, so that the substrate region 13' of the upper substrate 4' is as possible without Distortion can be associated with this.
  • the zone 7′′ has a higher pressure p2, in particular close to the ambient pressure, so that the substrate areas 13, 13′, which are even further away from the bonding shaft 6, can still adapt.
  • a pressure diagram is shown in the lower part of the figure.
  • the abscissa shows the position in any unit, preferably in millimeters, the ordinate represents the pressure value. Three pressures are shown. On the one hand, the external ambient pressure pO. In this case it is approx. 1 bar.
  • the substrate holder 1 is located in a chamber in which the external pressure is increased.
  • the ambient pressure would then be an overpressure in relation to the atmosphere.
  • the substrate holder 1 is located in a chamber in which the external pressure is reduced.
  • the ambient pressure would then be a negative pressure in relation to the atmosphere.
  • This embodiment is particularly relevant when the substrates need to be bonded in a lower pressure environment, for example to avoid or reduce contamination.
  • the ambient pressure pO can be between 2 bar and 0.1 bar, preferably between 1.5 bar and 0.5 bar, even more preferably between 1.25 bar and 0.75 bar, most preferably between 1.10 bar and 0.90 bar, most preferably exactly 1.0 bar.
  • zone 7 ' The pressure in zone 7 ' is denoted by pl. It is correspondingly low because Zone 7 is being evacuated very heavily.
  • the pressure in zone 7" is designated p2. It is greater than the pressure pl because zone 7" is not evacuated to a great extent.
  • the pressures pl, p2 are generally always below the ambient pressure pO. In very specific embodiments, it is conceivable that at least one of the pressures is above the ambient pressure pO. In this case, the substrate region 13 of the substrate 4 would be raised below the zone in which the pressure is above the ambient pressure pO. The bonding wave 6 is still far enough away from zone 7" so that the pressure difference between the pressure p1 in zone 7' and the pressure p2 in zone 7" does not yet lead to any undesirable distortion between the two substrate areas 13, 13'.
  • the values of the pressures p l, p2 generally depend on the process and must be determined through tests and/or simulations.
  • Figure 2b shows a second state of a sixth method step of a method for influencing a bonding wave, in which the bonding wave 6 has already progressed further.
  • the pressures p l in the zone 7 'and p2 in the zone 7 are now equalized.
  • the transition from the first state according to FIG. 2a to the second state according to FIG. 2b is of course continuous, i.e. while the bonding wave 6 advances continuously, the pressures p1, p2 are continuously adjusted.
  • the aim is to ensure that the substrate areas 13, 13 ' are connected to one another with no or only minimal errors.
  • the new values of the pressures pl, p2 generally depend on the process and must be determined through tests and/or simulations.
  • Figure 2c shows a third state of a sixth method step of a method for influencing a bonding wave, in which the bonding wave 6 is located on the partition 10.
  • different pressures from zone 7' and zone 7" would act on the substrate region 13, which would lead to faulty bonding between the substrate regions 13 and 13'.
  • By adjusting the Holding forces or by regulating the pressures pl, p2 in the zones 7 ', 7' an optimal bonding process between the substrate areas 13, 13 ' is possible.
  • the values of the pressures p l, p2 generally depend on the process and must be determined through tests and/or simulations. It is therefore not necessarily the case that the pressures pl, p2, as shown as an example in this illustration, must be the same, but rather they must be adjusted so that the two substrate regions 13, 13 'are connected to one another as optimally as possible. Optimally bonded means that any structures on the substrate surfaces in the substrate areas 13, 13 'are bonded correctly aligned with one another.
  • Figure 2d shows a fourth state of a sixth method step of a method in which the bonding wave 6 has moved over the partition 10.
  • the substrate areas 13, 13 ' is now in the new zone 7".
  • the pressure p2 in zone 7" could, for example, have been set again to a very low value in order to fix the lower substrate 10 while the bonding wave 6 advances to the end of zone 7".
  • the new values of the pressures pl, p2 generally depend on the process and must be determined through tests and/or simulations.
  • the method shown in Figures 2a to 2d envisages switching the fixing element 12 when a bonding wave 6 passes over a partition 10 of two zones 7', 7" in such a way that the bond is between the substrate areas 13, 13' and thus generally between the Substrates 4, 4' takes place optimally, that is, so that the deviations between opposing structures on the substrates 4, 4' are minimal.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour influencer une onde de liaison (6) pendant la liaison d'un premier substrat (4) à un second substrat (4'), - au moins le premier substrat (4) étant fixé à un premier support de substrat (1) ayant au moins une zone (7', 7"), et chacune de l'au moins une zone (7', 7") ayant au moins un élément de séparation (10) formant au moins partiellement la surface de support de substrat, et - l'au moins un élément de séparation (10) séparant l'au moins une zone (7', 7") vis-à-vis d'une autre zone (7, 7') ou de l'environnement du premier support de substrat (1), et - chacune de l'au moins une zone (7', 7") ayant au moins un élément de fixation (12), et chacun de l'au moins un élément de fixation (12) fournissant une force de maintien pour fixer le premier substrat (4) au premier support de substrat (1).
PCT/EP2022/074470 2022-09-02 2022-09-02 Procédé et dispositif pour influencer une onde de liaison lors d'une liaison WO2024046577A1 (fr)

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TW112130292A TW202425171A (zh) 2022-09-02 2023-08-11 於接合期間影響接合波的方法與裝置

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140261960A1 (en) * 2013-03-14 2014-09-18 International Business Machines Corporation Wafer-to-wafer oxide fusion bonding
WO2017162272A1 (fr) 2016-03-22 2017-09-28 Ev Group E. Thallner Gmbh Dispositif et procédé de liaison de substrats
WO2018028801A1 (fr) 2016-08-12 2018-02-15 Ev Group E. Thallner Gmbh Procédé et porte-échantillon pour lier des substrats de façon commandée
EP3382744A1 (fr) * 2016-02-16 2018-10-03 EV Group E. Thallner GmbH Dispositif de liaison de substrats
WO2019057286A1 (fr) 2017-09-21 2019-03-28 Ev Group E. Thallner Gmbh Dispositif et procédé de bonding de substrats
JP2020115593A (ja) * 2020-05-01 2020-07-30 東京エレクトロン株式会社 接合装置および接合システム
EP3886149A1 (fr) * 2011-08-12 2021-09-29 EV Group E. Thallner GmbH Dispositif et procédé de liaison de substrats
WO2022002345A1 (fr) * 2020-06-29 2022-01-06 Ev Group E. Thallner Gmbh Support de substrat et procédé de fixation et de collage d'un substrat

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3886149A1 (fr) * 2011-08-12 2021-09-29 EV Group E. Thallner GmbH Dispositif et procédé de liaison de substrats
US20140261960A1 (en) * 2013-03-14 2014-09-18 International Business Machines Corporation Wafer-to-wafer oxide fusion bonding
EP3382744A1 (fr) * 2016-02-16 2018-10-03 EV Group E. Thallner GmbH Dispositif de liaison de substrats
WO2017162272A1 (fr) 2016-03-22 2017-09-28 Ev Group E. Thallner Gmbh Dispositif et procédé de liaison de substrats
WO2018028801A1 (fr) 2016-08-12 2018-02-15 Ev Group E. Thallner Gmbh Procédé et porte-échantillon pour lier des substrats de façon commandée
WO2019057286A1 (fr) 2017-09-21 2019-03-28 Ev Group E. Thallner Gmbh Dispositif et procédé de bonding de substrats
JP2020115593A (ja) * 2020-05-01 2020-07-30 東京エレクトロン株式会社 接合装置および接合システム
WO2022002345A1 (fr) * 2020-06-29 2022-01-06 Ev Group E. Thallner Gmbh Support de substrat et procédé de fixation et de collage d'un substrat

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