WO2024045818A1 - 基板热处理装置及半导体设备 - Google Patents

基板热处理装置及半导体设备 Download PDF

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Publication number
WO2024045818A1
WO2024045818A1 PCT/CN2023/102586 CN2023102586W WO2024045818A1 WO 2024045818 A1 WO2024045818 A1 WO 2024045818A1 CN 2023102586 W CN2023102586 W CN 2023102586W WO 2024045818 A1 WO2024045818 A1 WO 2024045818A1
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WO
WIPO (PCT)
Prior art keywords
heat treatment
mobile base
substrate heat
treatment device
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/102586
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English (en)
French (fr)
Inventor
程成
王晖
吴均
吴雷
陈添喆
徐飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACM Research Shanghai Inc
Original Assignee
ACM Research Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACM Research Shanghai Inc filed Critical ACM Research Shanghai Inc
Publication of WO2024045818A1 publication Critical patent/WO2024045818A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Definitions

  • the present invention relates to the field of semiconductor manufacturing equipment, and in particular, to a substrate heat treatment device and semiconductor equipment.
  • the photolithography process generally includes glue coating, exposure and development.
  • the glue coating is completed on the coating machine, the development is completed on the development machine, and the exposure is completed on the photolithography machine.
  • the cost of photolithography equipment used for exposure processing is high. Therefore, the glue coating machine, development machine or glue coating and development machine must try to match or exceed the production capacity of the photolithography machine, minimize downtime and maintenance time, and shorten Only when the lithography machine is idle can the lithography machine be more fully utilized and maximize production capacity.
  • Traditional heat treatment modules usually include any one or a combination of heating modules and cooling modules.
  • the heating module generally consists of a hot plate, top cover, insulation ring, lifting pins, exhaust ducts, etc.
  • the cooling module generally consists of a cold plate and lifting pins, etc. Therefore, the heat treatment module usually includes circuits, gas lines, mechanical guide rails, etc. specific components. It can be seen that the integration of many functions into one heat treatment module not only brings great challenges to the difficulty of arrangement, parts processing and module assembly, but also increases the manufacturing cost and installation cycle of the machine. It also increases the difficulty of maintenance. Since the heat treatment module heats the substrate, various chemical substances on the substrate will often adhere to it, and chemical substances will also remain on the exhaust duct.
  • the purpose of the present invention is to provide a substrate heat treatment device to solve the problems in the prior art that the heat treatment module is difficult to maintain, inconvenient to operate, and has deviations in reset.
  • the present invention provides a substrate heat treatment device with a heat treatment module, including:
  • the mobile base is movably installed in the fixed frame through the limited plate motion guide rail;
  • the first positioning pin assembly is used to position and fix the mobile base in the direction of movement of the mobile base
  • At least two sets of sliding assemblies are distributed on both sides of the mobile base in the horizontal direction perpendicular to the direction of movement.
  • Each set of sliding assemblies includes guide wheels and slide rails that cooperate with each other.
  • the guide wheels are arranged on the side walls of the mobile base, and the slide rails are arranged on
  • On the side wall of the fixed frame at least one set of guide wheels and slide rails of the sliding assembly adopt positioning wheels and positioning slide rails to position the mobile base in a horizontal direction perpendicular to the movement direction of the mobile base.
  • the at least two sets of sliding assemblies include two sets of sliding assemblies arranged on at least one side of the mobile base and arranged at intervals in the vertical direction, for positioning the mobile base in the vertical direction.
  • a first positioning part is formed on the outer peripheral surface of the positioning wheel, and the positioning slide rail has a second positioning part matching the first positioning part.
  • the first positioning part is any one of a slope surface, a V-shaped groove, a V-shaped protrusion, a trapezoidal groove and a trapezoidal protrusion.
  • the limited plate motion guide rail is fixedly installed on the mobile base and is located on both sides of the mobile base in the horizontal direction perpendicular to the movement direction, and the fasteners pass through the fixed frame
  • the reserved installation holes lock the limited plate motion guide rails on the corresponding side, and the mobile base is removably assembled with the fixed frame.
  • the heat treatment module is any one of a heating module and a cooling module or Two combinations.
  • the heating module includes a top cover and a hot plate.
  • the hot plate is installed on the mobile base, and the top cover is located above the hot plate.
  • the top cover is mounted on a fixed frame.
  • the top cover is mounted on a mobile base.
  • the top cover is provided with an exhaust port and an exhaust duct
  • the fixed frame is provided with a main exhaust duct. Both ends of the exhaust duct are detachably connected to the exhaust port and the main exhaust duct through positioning pins. Pipes are connected.
  • the hot plate has a heating plate and a lifting pin.
  • the upper end of the lifting pin extends out of the upper surface of the heating plate.
  • the lower end of the lifting pin has a mounting plate.
  • the mounting plate is located under the mobile base.
  • the mounting plate is equipped with Fastening screw and adjusting screw, the fastening screw is used to fix the lifting pin and the moving base, and the adjusting screw is used to adjust the distance between the mounting plate and the moving base, thereby adjusting the height of the upper end of the lifting pin from the upper surface of the heating plate.
  • the present invention also provides a semiconductor equipment, including a plurality of the above-mentioned substrate heat treatment devices, wherein at least one substrate heat treatment device is a backup substrate heat treatment device.
  • the plurality of substrate heat treatment devices are stacked in a vertical direction.
  • the present invention provides a substrate heat treatment device and semiconductor equipment, which have the following beneficial effects:
  • a first positioning pin assembly is provided between the mobile base and the fixed frame, which is used to position the mobile base in the movement direction of the mobile base (such as the Y direction), so that the heat treatment module can be positioned in the Y direction after being repeatedly pulled out with the mobile base. Precise reset;
  • At least one set of sliding components between the mobile base and the fixed frame uses positioning wheels and positioning slide rails to position the mobile base in the horizontal direction (such as the X direction) perpendicular to the movement direction of the mobile base, so that the heat treatment module moves with the movement.
  • the base is accurately reset in the X direction after being repeatedly pulled out;
  • the heat treatment module can be positioned in the vertical direction (i.e., Z direction) under its own weight.
  • Z direction i.e., Z direction
  • the heat treatment module is a heating module
  • the top cover and hot plate of the heating module are installed on the fixed frame and the movable base respectively.
  • the heat treatment module is extracted from the fixed frame for maintenance, the top cover and the hot plate are in different spaces. It is more convenient for maintenance personnel to operate, shortens maintenance time, and improves the utilization rate of lithography machines;
  • the lifting pins in the hot plate are equipped with fastening screws and adjusting screws to facilitate adjustment of the upper end positions of multiple lifting pins. On the same plane, it improves the stability of the lifting pin action and avoids damage to the substrate by the slider;
  • the semiconductor equipment is equipped with at least one spare substrate heat treatment device.
  • the spare substrate heat treatment device can be used to replace the substrate heat treatment device under maintenance, so that the maintenance and replacement of the substrate heat treatment device will not cause photolithography. The machine is shut down and waiting.
  • Figure 1 shows a schematic diagram of a substrate heat treatment device in Embodiment 1 of the present invention, in which the movable base is pushed into the fixed frame;
  • Figure 2 is a front view of Figure 1, in which the first positioning pin assembly is hidden;
  • Figure 3 shows a schematic diagram of a substrate heat treatment device in Embodiment 1 of the present invention, in which the mobile base is extracted from the fixed frame;
  • FIG. 4 shows a schematic diagram of the substrate heat treatment device in Embodiment 1 of the present invention, in which the mobile base is removed from the fixed frame;
  • Figure 5 shows an enlarged view of part A in Figure 2;
  • Figure 6 shows an enlarged partial view of B in Figure 2;
  • FIGS 7a to 7d show schematic diagrams of other different structures of the positioning wheel and positioning slide rail in the present invention.
  • Figure 8 shows a schematic diagram of another substrate heat treatment device in Embodiment 1 of the present invention, in which the movable base is pushed into the fixed frame;
  • Figure 9 shows a schematic diagram of yet another substrate heat treatment device in Embodiment 1 of the present invention, in which the movable base is pushed into the fixed frame;
  • Figure 10 shows a cross-sectional view of the lifting pin in the heat treatment module of the present invention
  • Figure 11 shows a schematic diagram of a substrate heat treatment device in Embodiment 2 of the present invention.
  • Figure 12 shows a schematic diagram of a substrate heat treatment device in Embodiment 3 of the present invention.
  • FIG. 13 is a schematic diagram of a substrate heat treatment device in Embodiment 4 of the present invention.
  • FIG. 1 to 4 show schematic diagrams of a substrate heat treatment device 100 in the first embodiment of the present invention.
  • Figure 1 is a schematic diagram of the substrate heat treatment device 100 in Embodiment 1 of the present invention, in which the mobile base 122 is located in the fixed frame 121, which is the working position of the heat treatment module 130;
  • Figure 2 is a front view of Figure 1, in which the first The positioning pin assembly is hidden;
  • Figure 3 is another schematic diagram of the substrate heat treatment device 100 in the first embodiment of the present invention, in which the movable base 122 is extracted from the fixed frame 121, and the movable base 122 and the fixed frame 121 are still driven by limited plate motion guide rails.
  • FIG. 4 is another schematic diagram of the substrate heat treatment device 100 in the first embodiment of the present invention, in which the movable base 122 is removed from the fixed frame 121, that is, the movable base 122 Separated from the fixed frame 121, in this state, the heat treatment module 130 can be inspected or replaced.
  • the substrate heat treatment device 100 includes main components such as a fixed frame 121 , a moving base 122 , a limited plate motion guide 124 , a first positioning pin assembly, and at least two sets of sliding assemblies.
  • the mobile base 122 is used to load the heat treatment module 130, and the mobile base 122 is movably installed in the fixed frame 121 through the limited plate motion guide rail 124, so that the mobile base 122 carries the heat treatment module 130 from the fixed frame 121 along the limited plate motion guide rail 124. Pull it out, or push it into the fixed frame 121.
  • the first positioning pin assembly is used to position and fix the mobile base 122 in the movement direction of the mobile base 122 .
  • At least two sets of sliding assemblies are distributed on both sides of the mobile base 122 in the horizontal direction perpendicular to the direction of movement.
  • Each set of sliding assemblies includes guide wheels and slide rails that cooperate with each other. Specifically, the guide wheels move along their corresponding slide rails, and the guide wheels move along their corresponding slide rails.
  • the wheels are arranged on the side walls of the mobile base 122, where at least one set of guide wheels and slide rails of the sliding assembly adopt positioning wheels and positioning slide rails for aligning the mobile base 122 in the horizontal direction perpendicular to the movement direction of the mobile base 122. To position.
  • the movement direction of the mobile base 122 is defined as the Y direction
  • the horizontal direction perpendicular to the movement direction of the mobile base 122 is defined as the X direction
  • the location of the X direction and the Y direction is defined as The direction perpendicular to the plane is the Z direction.
  • the mobile base 122 is configured to load the heat treatment module 130
  • the first positioning pin assembly is configured to position the mobile base 122 in the Y direction
  • at least one set of sliding assemblies using positioning wheels and positioning slide rails are configured to position the mobile base. 122 is limited in the
  • the front side of the fixed frame 121 has an opening for the movable base 122 to enter and exit.
  • the mobile base 122 can serve as the installation base of the heat treatment module 130.
  • the heat treatment module 130 includes a heat plate 131 and a top cover 132.
  • the top cover 132 is installed on the fixed frame 121, and the heat plate 131 is installed on the mobile base 122. That is,
  • the mobile base 122 is the installation base of the hot plate 131 , that is, the mobile base 122 can be a part of the hot plate 131 .
  • the mobile base 122 is pulled out or pushed into the fixed frame 121 through the opening through the limited plate movement guide rail 124 and at least two sets of sliding assemblies.
  • the first positioning pin assembly is used to position the mobile base 122 in the movement direction of the mobile base 122. After the mobile base 122 is sent into the fixed frame 121, the mobile base 122 is fixed to the fixed frame 121 through the first positioning pin assembly. Referring to FIG. 3 , in this example, the movement direction of the mobile base 122 is the Y direction, and the first positioning pin assembly is used to position the mobile base 122 in the Y direction.
  • the first positioning pin assembly includes a first positioning pin 123 and a first positioning pin hole (not shown).
  • the first positioning pin 123 and the first positioning pin hole (not shown) are respectively provided on the mobile base 122 and the fixed frame 121.
  • the first positioning pin 123 is located on the side of the mobile base 122 close to the opening. After the mobile base 122 is pushed into the fixed frame 121, the mobile base 122 is locked in the fixed frame 121 through the first positioning pin 123 and the first positioning pin hole (not shown).
  • the substrate heat treatment device 100 is equipped with the first positioning pin assembly to prevent the movable base 122 and the heat treatment module 130 thereon from sliding out during the process. On the other hand, the heat treatment module 130 can be accurately reset in the Y direction after repeated extraction.
  • the first positioning pin 123 can also be provided on the fixed frame 121 , and accordingly, the first positioning pin hole (not shown) is opened in a corresponding position of the mobile base 122 .
  • the mobile base 122 is movably installed in the fixed frame 121 through a limited plate motion guide 124.
  • the mobile base 122 is equipped with limited plate motion guide rails 124 extending along the motion direction on both sides of the horizontal direction perpendicular to the motion direction.
  • a limited plate motion guide 124 is installed on each side.
  • Figure 4 shows the mobile base 122 and the fixed frame. 121 in a state of being assembled.
  • the limited plate motion guide rails 124 are pre-fixed on both sides of the mobile base 122, and then fasteners 1222 (such as fixing screws) pass through the reserved mounting holes on the fixed frame 121 and then lock the mobile base 122 respectively.
  • the limited plate movement guide rail 124 on the corresponding side movably assembles the mobile base 122 and the fixed frame 121 together.
  • the fasteners 1222 are removed, as shown in FIG. 4 , to separate the movable base 122 from the fixed frame 121, so that the heat treatment module 130 can be quickly replaced.
  • the mobile base 122 is movably connected to the fixed frame 121 through the limited plate motion guide rail 124, as shown in Figure 3, even if the mobile base 122 is in the pulled-out state, the limited plate motion guide rail 124 can still support the mobile base 122. , so that the movable base 122 is connected to the fixed frame 121, so that the entire device does not require additional external support, and maintenance personnel do not have to worry about the device falling down, which not only ensures safety, but also has enough space to perform maintenance work on the equipment.
  • the substrate heat treatment apparatus 100 includes at least two sets of sliding assemblies.
  • the substrate heat treatment device 100 shown in FIGS. 1 to 4 includes two sets of sliding assemblies, which are respectively designated as a first set of sliding assemblies 125 and a second set of sliding assemblies 126 .
  • the first set of sliding assemblies 125 is disposed on the left side of the moving base 122
  • the second set of sliding assemblies 126 is disposed on the right side of the moving base 122 .
  • the first set of sliding components 125 includes a first guide wheel 1251 and a first slide rail 1252 that cooperate with each other.
  • the first guide wheel 1251 rolls along the first slide rail 1252.
  • the first guide wheel 1251 is arranged on the first side wall of the mobile base 122.
  • the second set of sliding components 126 includes a second guide wheel 1261 and a second slide rail 1262 that cooperate with each other.
  • the second guide wheel 1261 rolls along the second slide rail 1262.
  • the second guide wheel 1261 is arranged on the second side wall of the mobile base 122.
  • 1220b the second slide rail 1262 is arranged on the second side wall 1210b of the fixed frame 121, and the second side wall 1210b of the fixed frame 121 and the second side wall 1220b of the mobile base 122 are arranged oppositely.
  • the first guide wheel 1251 is the positioning wheel 20
  • the first slide rail 1252 is the positioning slide rail 30
  • the second guide wheel 1261 and the second slide rail 1262 are conventional guide wheels and conventional slide rails, that is, the second guide wheel 1261 and the second slide rail 1262 can be non-positioning wheels and non-positioning slide rails.
  • the second guide wheel 1261 is in contact with the second slide rail 1262 and plays a supporting role when the movable base 122 is pulled out and pushed into the fixed frame 121 to maintain the left and right balance of the device.
  • conventional guide wheels may be cylindrical rollers or eccentric wheels 40 .
  • FIG. 5 shows a partial enlarged view of the second guide wheel and the second slide rail at position A in FIG. 2 .
  • the second guide wheel 1261 is an eccentric wheel 40 .
  • the eccentric wheel 40 includes a circular outer wheel 40a and an eccentric wheel 40a.
  • the eccentric shaft 40b has an integrally formed first shaft body 40c and a second shaft body 40d.
  • the axis of the first shaft body 40c and the axis of the second shaft body 40d are parallel to each other and deviated from a certain distance e.
  • the first shaft body 40c is fixed in movement.
  • the circular outer wheel 40a On the side wall of the base 122, the circular outer wheel 40a is rotatably disposed outside the second shaft 40d, and the circular outer wheel 40a is coaxial with the second shaft 40d.
  • the distance W between the circular outer wheel 40a and the second slide rail 1262 can be adjusted by rotating the first shaft 40c, so that the circular outer wheel 40a contacts the track surface of the second slide rail 1262, thereby This prevents the sliding components on the left and right sides of the mobile base 122 from being over-constrained when the sliding mechanism is installed.
  • the eccentric 40 is a well-known technology, and the details will not be described again.
  • FIG. 6 shows a partial enlarged view of the first guide wheel and the first slide rail at B in FIG. 2 .
  • the first guide wheel 1251 is the positioning wheel 20 and the first slide rail 1252 is the positioning slide rail 30 .
  • a first positioning part 20a is formed on the outer peripheral surface of the positioning wheel 20, and the positioning slide rail 30 has a second positioning part 30a matching the first positioning part 20a.
  • the first positioning portion 20a can be a slope surface, a V-shaped groove, a V-shaped protrusion, a trapezoidal groove, a trapezoidal protrusion, or any other shape for limiting the position of the mobile base 122 in the X direction.
  • the first positioning part 20a is a V-shaped groove
  • the second positioning part 30a is a V-shaped protrusion that cooperates with the first positioning part 20a.
  • the top of the V-shaped protrusion No contact with V-groove.
  • Figures 7a to 7d show other examples of positioning wheels 20 and positioning slide rails 30 with different structures.
  • the first positioning part 20a is a V-shaped protrusion
  • the second positioning part 30a is a V-shaped groove matching it.
  • the top of the V-shaped protrusion does not contact the V-shaped groove.
  • the first positioning part 20a is a slope surface
  • the second positioning part 30a is a matching slope surface.
  • the first positioning part 20a is a trapezoidal groove
  • the second positioning part 30a is a trapezoidal protrusion matching therewith.
  • the first positioning part 20a is a trapezoidal protrusion
  • the second positioning part 30a is a trapezoidal groove matching therewith.
  • FIG. 8 shows a schematic diagram of another substrate heat treatment device 200 in Embodiment 1.
  • the difference lies in the first guide wheel 1251 and the second guide wheel 1261 Both are positioning wheels 20, and the first slide rail 1252 and the second slide rail 1262 are both positioning slide rails 30.
  • the same structures of the substrate heat treatment device 200 and the substrate heat treatment device 100 use the same reference numerals and will not be described again.
  • the substrate heat treatment devices 100 and 200 can rely on the self-weight of the heat treatment module 130 to achieve vertical positioning. To further ensure that the mobile base 122 and the heat treatment module 130 thereon are accurately reset in the vertical direction (ie, the Z direction) after being extracted, at least one side of the mobile base 122 is provided with two sets of sliding assemblies spaced apart in the vertical direction.
  • FIG. 9 shows a schematic diagram of yet another substrate heat treatment device 300 in Embodiment 1.
  • the substrate heat treatment device 300 includes three sets of sliding assemblies, respectively designated as a first set of sliding assemblies 125, a second set of sliding assemblies 126 and The third set of sliding components 127.
  • the first set of sliding assemblies 125 and the third set of sliding assemblies 127 are disposed on the left side of the moving base 122
  • the second set of sliding assemblies 126 are disposed on the right side of the moving base 122 .
  • the substrate heat treatment apparatus 300 will be described below with reference to FIG. 9 . It should be noted that in this example, the same reference numerals are used for the same structures of the substrate heat treatment device 300 and the substrate heat treatment device 100 .
  • the first set of sliding components 125 includes a first guide wheel 1251 and a first slide rail 1252 that cooperate with each other.
  • the first guide wheel 1251 is configured on the first side wall 1220a of the mobile base 122
  • the first slide rail 1252 is arranged on the first side wall 1210a of the fixed frame 121, and the first side wall 1210a of the fixed frame 121 and the first side wall 1220a of the mobile base 122 are arranged oppositely.
  • the third set of sliding components 127 includes a third guide wheel 1271 and a third slide rail 1272 that cooperate with each other.
  • the third guide wheel 1271 is configured on the first side wall 1220a of the mobile base 122
  • the third slide rail 1272 is configured on the fixed frame 121 on the first side wall 1210a.
  • the third set of sliding assemblies 127 is disposed below the first set of sliding assemblies 125 .
  • the second set of sliding components 126 includes a second guide wheel 1261 and a second slide rail 1262 that cooperate with each other.
  • the second guide wheel 1261 is configured on the second side wall 1220b of the mobile base 122
  • the second slide rail 1262 is arranged on the second side wall 1210b of the fixed frame 121, and the second side wall 1210b of the fixed frame 121 and the second side wall 1220b of the mobile base 122 are arranged oppositely.
  • the first guide wheel 1251 is the positioning wheel 20
  • the first slide rail 1252 is the positioning slide rail 30
  • the second guide wheel 1261 and the third guide wheel 1271 are both conventional guide wheels, such as cylindrical rollers or eccentric wheels 40 .
  • the slide rails in multiple sets of sliding assemblies located on the same side can share the same plate body.
  • the first slide rail 1252 and the third slide rail 1272 can be formed on the upper and lower sides of the same plate body, reducing the number of components, reducing installation errors, and improving positioning accuracy.
  • the heat treatment module 130 is the heating module H.
  • the heating module H mainly includes a hot plate 131 and a top cover 132 , where the top cover 132 is installed on the fixed frame 121 and the hot plate 131 is installed on the mobile base 122 .
  • the maintenance personnel only need to pull out the first positioning pin 123 from the first positioning pin hole (not shown) on the fixed frame 121, and then the heating plate 131 and the top cover 132 need to be maintained.
  • the plate 131 is easily pulled out from the fixed frame 121. At this time, the hot plate 131 and the top cover 132 are not in the same space.
  • the hot plate 131 is pulled out along the limited plate motion guide 124 with the movable base 122, and the top cover The cover 132 will still remain in the fixed frame 121, so that there will be a certain distance difference between the hot plate 131 and the top cover 132 during maintenance, and the staff will have enough space and vision to perform maintenance on the hot plate 131 and the top cover 132 respectively. Wipe or maintain.
  • a cable protection chain 140 is disposed on the mobile base 122 , so that various cables and pipelines led out by the heat treatment module 130 in the mobile base 122 pass through the cable protection chain 140 from the square on the fixed frame 121 .
  • the opening 1212 leads to the machine platform. Since the cable protection chain 140 can ensure that the cables and pipes running inside the cable protection chain 140 are not affected when the mobile base 122 is pulled out, a lot of time is saved in rearranging the cables after maintenance.
  • the top cover 132 is mounted on the fixed frame 121 through horizontal brackets 1213 .
  • the top cover 132 is equipped with an air exhaust port 1321 and an air exhaust duct 1322
  • the fixed frame 121 is equipped with a main air exhaust duct 1214.
  • One end of the exhaust duct 1322 is detachably connected to the exhaust port 1321 of the top cover 132 through the second positioning pin 1322a, and the other end of the exhaust duct 1322 is detachably connected to the connection port 1215 of the main exhaust duct 1214 through the third positioning pin 1322b. connected.
  • the exhaust duct 1322 is used to discharge exhaust gas generated when the substrate is heat treated.
  • the exhaust duct 1322 adopts a flexible hose, such as a corrugated hose, so that it can be bent and deformed in a small space.
  • the two ends of the exhaust duct 1322 are rectangular hard joints 1322c with matching tolerances guaranteed by machining.
  • the maintenance personnel only need to pull out the positioning pins 1322a and 1322b at both ends of the exhaust duct 1322 to remove the exhaust duct 1322 for cleaning.
  • the heating plate 131 includes a heating plate 1311 and a plurality of lifting pins 1312.
  • the heating plate 1311 is installed on the mobile base 122, and the plurality of lifting pins 1312 are provided in the heating plate 1311.
  • a plurality of lifting pins 1312 are connected to the driver 1313.
  • the driver 1313 is used to drive the lifting pins 1312 to rise and fall, so that the plurality of lifting pins 1312 support the wafer and place the wafer on the surface of the heating plate 1311.
  • the heating plate 1311 is used to provide Wafer heating.
  • the driver 1313 can be a motor or a cylinder.
  • the lift pin 1312 has a hollow through hole 13120 along its axis inside, and the hollow through hole 13120 is used to connect to a vacuum pump.
  • a negative pressure is formed on the back of the wafer through the vacuum pump and the hollow through hole 13120, so that the wafer is firmly adsorbed on the lift pin 1312, which can improve the stability of the lift pin 1312 action.
  • the hot plate 131 has three lifting pins 1312. It is very important that the vertical heights of the three lifting pins 1312 are consistent with the upper surface of the heating plate 1311. During use, it is necessary to ensure that the upper end surfaces of the three lifting pins 1312 are at on the same horizontal plane to ensure the stability of the lifting action of the lifting pin 1312 and prevent the wafer slider placed above the lifting pin 1312 from falling. In order to facilitate maintenance personnel to conveniently adjust the height of the lifting pin 1312, the present invention optimizes the installation structure of the traditional lifting pin 1312. Referring again to Figure 10, the lower end of the lifting pin 1312 has a mounting plate 13121. The mounting plate 13121 is equipped with a fastening screw 13122 and an adjusting screw 13123.
  • the fastening screw 13122 is used to fix the mounting plate 13121 to the mobile base 122.
  • the adjusting screw 13123 is used to fix the mounting plate 13121 to the mobile base 122.
  • the height of the lifting pin 1312 extending out of the heating plate 1311 is adjusted.
  • One end of the adjusting screw 13123 is screwed on the mounting plate 13121 through threads, and the other end is in contact with the lower surface of the mobile base 122.
  • the adjusting screw 13123 By screwing the adjusting screw 13123, the distance between the mounting plate 13121 and the lower surface of the mobile base 122 can be adjusted. Adjust the height between the upper end of the lifting pin 1312 and the upper surface of the heating plate 1311.
  • each lifting pin 1312 is equipped with three fastening screws 13122 and three adjusting screws 13123.
  • the lifting pin 1312 reaches the ideal height tighten the tightening screw 13122 to ensure that the final lifting pin 1312 is connected to the mobile base 122. firm.
  • the hot plate 131 is also equipped with a liftable heat preservation ring 1314.
  • the heat preservation ring 1314 is arranged around the heating plate 1311.
  • the heat preservation ring 1314 is raised to seal the gap between the top cover 132 and the heating plate 1311 so that the wafer is not disturbed by the external environment when being heated, thereby improving the reliability of the heat treatment process.
  • the insulation ring 1314 is lowered, the external manipulator can perform a pick-and-place operation. It should be noted that the heat preservation ring 1314 in Figures 1 to 4 is not raised.
  • the heat treatment module 130 is still the heating module H.
  • the difference is that the top cover 132 and the hot plate 131 of the heating module H are installed on On the movable base 122, that is, when the movable base 122 is pulled out from the fixed frame 121, the entire heating module H is pulled out together with the movable base 122, and the top cover 132 is not separated from the heating plate 131.
  • the top cover 132 can be fixed on the mobile base 122 through the vertical bracket 2213 and located above the hot plate 131 .
  • a liftable heat preservation ring 1314 is disposed on the hot plate 131 to prevent the wafer from being disturbed by the external environment when heating. It should be noted that in Figure 11, the insulation ring 1314 is in unraised state.
  • the top cover 132 can also be installed on the mobile base 122 through a lifting bracket and located above the hot plate 131, that is, the height of the top cover 132 relative to the hot plate 131 is adjustable. When the wafer is heated, The top cover 132 is lowered to cover the hot plate 131.
  • the substrate heat treatment device 100, 200, 300 or 400 proposed in the first and second embodiments can be applied to a glue coating machine and/or a developing machine to heat the substrate.
  • a plurality of stacked substrate heat treatment devices 100, 200, 300 or 400 may be configured in the glue coating machine and/or the developing machine.
  • the difference between the substrate heat treatment device 500 provided in this embodiment and the first embodiment is that the heat treatment module 130 is a cooling module C. Cooling module C is used to cool the wafer.
  • the cooling module C generally includes a cold plate 133 and a second lifting pin 1331 .
  • the upper end of the second lifting pin 1331 extends from the upper surface of the cold plate 133 for supporting the wafer and placing the wafer on the surface of the cold plate 133 .
  • Cooling module C can adopt a conventional design.
  • the substrate heat treatment device 600 provided in this embodiment is different from the first embodiment in that the heat treatment module 130 not only includes a heating module H, but also a cooling module C.
  • the heating module H is used to treat the wafer. Heating is performed, and cooling module C is used to cool the wafer.
  • the substrate heat treatment device 600 can be used in a glue coating and developing machine to heat or cool the substrate.
  • the glue coating and developing machine can be equipped with multiple substrate heat treatment devices 600 , and the plurality of substrate heat treatment devices 600 are stacked in the glue coating and developing machine.
  • the present invention also proposes a semiconductor equipment, including a plurality of substrate heat treatment devices as described in Embodiments 1 to 4, wherein at least one substrate heat treatment device is a backup substrate heat treatment device.
  • a semiconductor equipment including a plurality of substrate heat treatment devices as described in Embodiments 1 to 4, wherein at least one substrate heat treatment device is a backup substrate heat treatment device.
  • the backup substrate heat treatment device is enabled to replace the repaired substrate heat treatment device, so that the photolithography machine does not need to be shut down during maintenance of the substrate heat treatment device.
  • Semiconductor equipment is equipped with three backup substrate heat treatment devices.
  • a plurality of substrate heat treatment devices configured in a semiconductor device are stacked in a vertical direction.
  • the semiconductor device proposed in this embodiment can be specifically applied to a glue coating machine, a developing machine, or a glue coating and developing machine.

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Abstract

基板热处理装置包括固定框架；移动底座，用于装载热处理模块；有限板式运动导轨，移动底座通过有限板式运动导轨可移动地安装在固定框架内，第一定位销组件，用于在移动底座运动方向上对移动底座进行定位固定；至少两组滑动组件，分布在移动底座垂直于运动方向的水平方向的两侧，每组滑动组件包括相互配合的导向轮和滑轨，至少一组滑动组件的导向轮和滑轨采用定位轮和定位滑轨，用于在与移动底座运动方向垂直的水平方向上对移动底座进行定位。本发明还提出了一种半导体设备，包括至少一个备用基板热处理装置。

Description

基板热处理装置及半导体设备 技术领域
本发明涉及半导体制造设备领域，特别是涉及一种基板热处理装置及半导体设备。
背景技术
光刻工艺一般包括涂胶处理、曝光处理以及显影处理，涂胶处理在涂胶机台完成，显影处理在显影机台完成，曝光处理在光刻机中完成。然而，用于曝光处理的光刻机设备造价高昂，因此，涂胶机台、显影机台或者涂胶显影机台必须要尽量匹配或高于光刻机的产能，尽量减少停机以及检修维护时间，缩短光刻机闲置时间，才能更充分地利用光刻机，实现产能最大化。
传统的涂胶机台、显影机台以及涂胶显影机台为节省厂房的占用空间，结构设计时会尽可能地压缩结构尺寸，减小零部件之间的间隙。例如机台中的热处理模块，国内外传统的热处理模块整体均呈扁平状结构，多个热处理模块在机台中堆叠布置，相邻热处理模块之间的距离非常紧凑，只留出满足机械手取放片的较小空间。该传统的热处理模块优势在于节省足够空间让给其他模块，但其缺点在维养过程中就非常凸显了。
传统的热处理模块通常包括加热模块和冷却模块中任意一种或两种组合。加热模块一般由热板、顶盖、保温环、升降销、排风管道等组成，冷却模块一般由冷板和升降销等组成，因此，热处理模块通常包含电路、气路、机械导轨等多种具体元器件。由此可见众多功能整合在一个热处理模块中，不仅仅会对排布难度、零部件加工难度和模块组装难度都带来很大的挑战，无形中增加了机台的制造成本和安装周期，也同样增加了维养的难度。由于热处理模块对基板进行加热后，往往会黏附上基板上的各种化学物质，排风管道上也会残留下化学物质。维养人员每隔一段时间就会对热板、顶盖和排风管道等结构进行擦拭，但不符合人机工程的结构(如热板框架内塞满各路电路和气路、两热板之间的间隙过小等)，人手就很难接触到，会被各种功能的元器件阻挡，即使利用工具来养护，往往维养得也会不彻底，并且 耗时耗力，影响光刻机的产能。此外，当热处理模块维养结束后，热处理模块复位出现偏差，可能会对基板热处理工艺带来不良影响，甚至会导致机台停运等严重风险。
发明内容
鉴于以上所述现有技术的缺点，本发明的目的在于提供一种基板热处理装置，用于解决现有技术中热处理模块维修难度大、操作不方便以及复位存在偏差等问题。
为实现上述目的及其它相关目的，本发明提供了一种基板热处理装置，具有热处理模块，包括：
固定框架；
移动底座，用于装载热处理模块；
有限板式运动导轨，所述移动底座通过有限板式运动导轨可移动地安装在固定框架内；
第一定位销组件，用于在移动底座运动方向上对移动底座进行定位固定；
至少两组滑动组件，分布在移动底座垂直于运动方向的水平方向的两侧，每组滑动组件包括相互配合的导向轮和滑轨，导向轮配置在移动底座的侧壁上，滑轨配置在固定框架的侧壁上，其中，至少一组滑动组件的导向轮和滑轨采用定位轮和定位滑轨，用于在与移动底座运动方向垂直的水平方向上对移动底座进行定位。
作为一种可选方案，所述至少两组滑动组件包括设置在移动底座的至少一侧设置且在竖直方向间隔排布的两组滑动组件，用于在竖直方向对移动底座进行定位。
作为一种可选方案，所述定位轮的外周面形成有第一定位部，所述定位滑轨具有与第一定位部相匹配的第二定位部。
作为一种可选方案，所述第一定位部为斜坡面、V形槽、V形凸起、梯形槽和梯形凸起中的任意一种。
作为一种可选方案，还包括紧固件，所述有限板式运动导轨固定安装在移动底座上并位于移动底座垂直于运动方向的水平方向的两侧，所述紧固件穿过固定框架上预留的安装孔锁住对应侧的有限板式运动导轨，将移动底座可移动地与固定框架组装在一起。
作为一种可选方案，所述热处理模块为加热模块和冷却模块中的任意一种或 两种组合。
作为一种可选方案，所述加热模块包括顶盖和热板，热板安装在移动底座上，顶盖位于热板的上方。
作为一种可选方案，所述顶盖安装在固定框架上。
作为一种可选方案，所述顶盖安装在移动底座上。
作为一种可选方案，所述顶盖上具有排风口和排风管道，固定框架上具有主排风管道，排风管道两端分别通过定位销可拆卸地与排风口和主排风管道相连。
作为一种可选方案，所述热板具有加热盘和升降销，升降销的上端伸出加热盘的上表面，升降销的下端具有安装板，安装板位于移动底座下方，安装板上配有紧固螺钉和调节螺钉，紧固螺钉用于使升降销与移动底座固定，调节螺钉用于调整安装板与移动底座之间的距离，从而调整升降销的上端距离加热盘上表面的高度。
本发明还提出了一种半导体设备，包括多个上述基板热处理装置，其中，至少一个基板热处理装置为备用基板热处理装置。
作为一种可选方案，所述多个基板热处理装置在竖直方向上堆叠布置。如上所述，本发明提供一种基板热处理装置及半导体设备，具有以下有益效果：
1)移动底座和固定框架之间设置第一定位销组件，用于在移动底座的运动方向(如Y方向)上对移动底座进行定位，从而使得热处理模块随移动底座反复抽出后在Y方向上精准复位；
2)移动底座和固定框架之间至少一组滑动组件采用定位轮和定位滑轨，在垂直于移动底座运动方向的水平方向(如X方向)上对移动底座进行定位，从而使得热处理模块随移动底座反复抽出后在X方向上精准复位；
3)热处理模块在自重作用下可以实现竖直方向(即Z方向)上的定位，另外，在本发明中，通过在移动底座的同一侧设置上下分布的两组滑动组件，可以进一步在竖直方向上对移动底座进行定位，以使热处理模块随移动底座反复抽出后在Z方向上精准复位；
4)当热处理模块为加热模块时，加热模块的顶盖和热板分别安装在固定框架和移动底座上，当热处理模块从固定框架中抽出进行养护时，顶盖和热板处于不同的空间，更方便维修人员操作，缩短维修时间，提高光刻机的利用率；
5)热板中的升降销配置紧固螺钉和调节螺钉，方便调整多个升降销的上端位 于同一平面，提高升降销动作的稳定，避免滑片损伤基板；
6)半导体设备中配置设置至少一个备用基板热处理装置，在基板热处理装置进行维修更换时，可以利用备用基板热处理装置代替维修中的基板热处理装置工作，从而使得基板热处理装置维修更换不会导致光刻机停机等待。
附图概述
本发明的特征、性能由以下的实施例及其附图进一步描述。
图1显示为本发明实施例一中基板热处理装置的示意图，其中，移动底座推入固定框架中；
图2为图1的正视图，其中，第一定位销组件被隐藏；
图3显示为本发明实施例一中基板热处理装置的示意图，其中，移动底座从固定框架中抽出；
图4显示为本发明实施例一中基板热处理装置的示意图，其中，移动底座从固定框架中拆除；
图5显示为图2中A处局部放大图；
图6显示为图2中B处局部放大图；
图7a至图7d显示为本发明中定位轮和定位滑轨的其他不同结构的示意图；
图8显示为本发明实施例一中另一基板热处理装置的示意图，其中，移动底座推入固定框架中；
图9显示为本发明实施例一中又一基板热处理装置的示意图，其中，移动底座推入固定框架中；
图10显示为本发明中热处理模块中的升降销剖面图；
图11显示为本发明实施例二中基板热处理装置的示意图；
图12显示为本发明实施例三中基板热处理装置的示意图；以及
图13显示为本发明实施例四中基板热处理装置的示意图。
本发明的较佳实施方式
以下通过特定的具体实例说明本发明的实施方式，本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其它优点与功效。本发明还可以通过另外不 同的具体实施方式加以实施或应用，本说明书中的各项细节也可以基于不同观点与应用，在没有背离本发明的精神下进行各种修饰或改变。
请参阅图1至图13。需要说明的是，本实施例中所提供的图示仅以示意方式说明本发明的基本构想，虽图示中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的形态、数量及比例可为一种随意的改变，且其组件布局形态也可能更为复杂。
实施例一
图1至图4示出了本发明实施一中的基板热处理装置100的示意图。图1为本发明实施例一中基板热处理装置100的示意图，其中，移动底座122位于固定框架121中，该位置为热处理模块130的工作位置；图2为图1的正视图，其中，第一定位销组件被隐藏；图3为本发明实施一中的基板热处理装置100的又一示意图，其中，移动底座122从固定框架121中抽出，且移动底座122和固定框架121仍由有限板式运动导轨124相连，在此状态下，可对热处理模块130进行检修；图4为本发明实施一中的基板热处理装置100的又一示意图，其中，移动底座122从固定框架121中拆除，即移动底座122与固定框架121分离，在此状态下，可对热处理模块130进行检修或更换。
如图1至图4所示，基板热处理装置100包括固定框架121、移动底座122、有限板式运动导轨124、第一定位销组件以及至少两组滑动组件等主要部件。移动底座122用于装载热处理模块130，且移动底座122通过有限板式运动导轨124可移动地安装在固定框架121内，以使移动底座122携带热处理模块130沿有限板式运动导轨124从固定框架121中抽出，或者推入固定框架121中。第一定位销组件，用于在移动底座122运动方向上对移动底座122进行定位固定。至少两组滑动组件分布在移动底座122的垂直于运动方向的水平方向的两侧，每组滑动组件包括相互配合的导向轮和滑轨，具体地，导向轮沿其对应的滑轨移动，导向轮配置在移动底座122的侧壁上，其中，至少一组滑动组件的导向轮和滑轨采用定位轮和定位滑轨，用于在与移动底座122运动方向垂直的水平方向上对移动底座122进行定位。
在本发明中，参考图1至图4，定义移动底座122的运动方向为Y方向，定义与移动底座122运动方向垂直的水平方向为X方向，定义与X方向和Y方向所在 平面垂直的方向为Z方向。
在本发明中，通过配置移动底座122用于装载热处理模块130，配置第一定位销组件对移动底座122的Y方向进行定位，配置至少一组采用定位轮和定位滑轨的滑动组件对移动底座122的X方向进行限位，这些配置不仅方便热处理模块130随移动底座122反复抽出进行检修，还有利于热处理模块130反复抽出后的精准复位。
再次参考图1至图4，固定框架121的前侧具有供移动底座122进出的开口。移动底座122可以作为热处理模块130的安装基体，在本示例中，热处理模块130包括热板131和顶盖132，顶盖132安装在固定框架121上，热板131安装在移动底座122上，即移动底座122为热板131的安装基体，即移动底座122可以为热板131的一部分。移动底座122通过有限板式运动导轨124和至少两组滑动组件经由开口抽出或推入固定框架121中。
第一定位销组件用于在移动底座122运动方向上对移动底座122进行定位，当移动底座122送入固定框架121中后，移动底座122通过第一定位销组件与固定框架121固定。参见图3，在本示例中，移动底座122的运动方向为Y方向，第一定位销组件用于在Y方向对移动底座122进行定位。
第一定位销组件包括第一定位销123和第一定位销孔(图未示出)。在本示例中，第一定位销123和第一定位销孔(图未示出)分别设置在移动底座122和固定框架121上，第一定位销123位于移动底座122靠近开口的一侧，当移动底座122推入固定框架121中后，移动底座122通过第一定位销123和第一定位销孔(图未示出)配合锁在固定框架121中。基板热处理装置100配置第一定位销组件一方面可以避免工艺过程中移动底座122和其上的热处理模块130滑出，另一方面可以实现热处理模块130反复抽出后在Y方向上精准复位。需要说明的是，在其它示例中，第一定位销123还可以设置在固定框架121上，相应地，第一定位销孔(图未示出)开设在移动底座122对应位置上。
移动底座122通过有限板式运动导轨124可移动地安装在固定框架121内。具体地，移动底座122在其与运动方向垂直的水平方向的两侧均安装有沿着运动方向延伸有限板式运动导轨124，例如，如图1和图2所示，在移动底座122的左右两侧各安装有一个有限板式运动导轨124。图4示出了移动底座122与固定框架 121的待组装的状态。如图4所示，有限板式运动导轨124预先固定在移动底座122的两侧，再通过紧固件1222(例如固定螺钉)穿过固定框架121上预留的安装孔后分别锁住移动底座122对应侧的有限板式运动导轨124，将移动底座122与固定框架121可移动地组装在一起。同样地，当热处理模块130需要更换时，将紧固件1222拆除，如图4所示，即可将移动底座122与固定框架121分离，从而可以实现热处理模块130的快速更换。
此外，由于移动底座122通过有限板式运动导轨124与固定框架121可移动的连接，如图3所示，移动底座122即使处于抽出状态，有限板式运动导轨124也能够对移动底座122起到支撑作用，以使移动底座122与固定框架121相连，从而使得整套装置不需要额外的外力支撑，维养人员也不用担心装置会砸落，既保障了安全，又有足够的空间对设备进行保养工作。
基板热处理装置100包括至少两组滑动组件。具体地，在图1至图4示出的基板热处理装置100中，包括两组滑动组件，分别记为第一组滑动组件125和第二组滑动组件126。第一组滑动组件125设置在移动底座122的左侧，第二组滑动组件126设置在移动底座122的右侧。第一组滑动组件125包括相互配合的第一导向轮1251和第一滑轨1252，第一导向轮1251沿第一滑轨1252滚动，第一导向轮1251配置在移动底座122的第一侧壁1220a上，第一滑轨1252配置在固定框架121的第一侧壁1210a上，固定框架121的第一侧壁1210a和移动底座122的第一侧壁1220a相对设置。第二组滑动组件126包括相互配合的第二导向轮1261和第二滑轨1262，第二导向轮1261沿第二滑轨1262滚动，第二导向轮1261配置在移动底座122的第二侧壁1220b上，第二滑轨1262配置在固定框架121的第二侧壁1210b上，固定框架121的第二侧壁1210b和移动底座122的第二侧壁1220b相对设置。其中，第一导向轮1251为定位轮20，第一滑轨1252为定位滑轨30。第二导向轮1261和第二滑轨1262为常规导向轮和常规滑轨，即第二导向轮1261和第二滑轨1262可选用非定位轮和非定位滑轨。第二导向轮1261与第二滑轨1262接触，在移动底座122抽出和推入固定框架121过程中，起到支撑作用，保持装置的左右平衡。例如，常规导向轮可以为圆柱滚轮或偏心轮40。
图5示出了图2中A处第二导向轮及第二滑轨的局部放大图。在一实施例中，如图5所示，第二导向轮1261为偏心轮40。偏心轮40包括圆形外轮40a和偏心 轴40b。偏心轴40b具有一体成型的第一轴体40c和第二轴体40d，第一轴体40c的轴线与第二轴体40d的轴线相互平行且偏离一定距离e，第一轴体40c固定在移动底座122的侧壁，圆形外轮40a转动设置在第二轴体40d的外侧，且圆形外轮40a与第二轴体40d共轴线。在偏心轮40安装时，可以通过转动第一轴体40c调整圆形外轮40a与第二滑轨1262之间的距离W，以使圆形外轮40a与第二滑轨1262的轨道面接触，从而避免滑动机构在安装时，移动底座122左右两侧滑动组件发生过约束的情况。偏心轮40为公知技术，细节不再赘述。
图6示出了图2中B处第一导向轮和第一滑轨的的局部放大图。在一实施例中，如图6所示，第一导向轮1251为定位轮20，第一滑轨1252为定位滑轨30。定位轮20外周面形成有第一定位部20a，定位滑轨30具有与第一定位部20a相匹配的第二定位部30a。第一定位部20a可以为斜坡面、V形槽、V形凸起、梯形槽、梯形凸起等任意在X方向对移动底座122进行限位的形状。在本示例中，如图6所示，第一定位部20a为V形槽，第二定位部30a为与第一定位部20a配合的V形凸起，较佳地，V形凸起的顶部与V形槽不接触。
图7a至图7d示出了不同结构的定位轮20和定位滑轨30的其他示例。如图7a所示，第一定位部20a为V形凸起，第二定位部30a为与之配合的V形凹槽，同样地，V形凸起的顶部与V形槽不接触。如图7b所示，第一定位部20a为斜坡面，第二定位部30a为与之配合的斜坡面。如图7c所示，第一定位部20a为梯形槽，第二定位部30a为与之配合的梯形凸起。如图7d所示，第一定位部20a为梯形凸起，第二定位部30a为与之配合的梯形槽。
图8示出了实施例一中另一基板热处理装置200的示意图，与如图1至图4示出的基板处理装置100相比，区别之处在于第一导向轮1251和第二导向轮1261均为定位轮20，第一滑轨1252和第二滑轨1262均为定位滑轨30。需要说明的是，基板热处理装置200与基板热处理装置100相同的结构采用相同的附图标号，不再赘述。
基板热处理装置100和200可以依靠热处理模块130的自重实现竖直方向的定位。为进一步确保移动底座122及其上的热处理模块130抽出后在竖直方向(即Z方向)精准复位，移动底座122的至少一侧设置有在竖直方向间隔排布的两组滑动组件。
例如，图9示出了实施例一中又一基板热处理装置300的示意图，具体地，基板热处理装置300包括三组滑动组件，分别记为第一组滑动组件125、第二组滑动组件126和第三组滑动组件127。第一组滑动组件125和第三组滑动组件127设置在移动底座122的左侧，第二组滑动组件126设置在移动底座122的右侧。下面将结合图9对基板热处理装置300进行说明。需要说明的是，在本示例中，基板热处理装置300与基板热处理装置100相同的结构采用相同的附图标号。
如图9所示，第一组滑动组件125包括相互配合的第一导向轮1251和第一滑轨1252，第一导向轮1251配置在移动底座122的第一侧壁1220a上，第一滑轨1252配置在固定框架121的第一侧壁1210a上，固定框架121的第一侧壁1210a和移动底座122的第一侧壁1220a相对设置。第三组滑动组件127包括相互配合的第三导向轮1271和第三滑轨1272，第三导向轮1271配置在移动底座122的第一侧壁1220a上，第三滑轨1272配置在固定框架121的第一侧壁1210a上。第三组滑动组件127设置在第一组滑动组件125的下方。
如图9所示，第二组滑动组件126包括相互配合的第二导向轮1261和第二滑轨1262，第二导向轮1261配置在移动底座122的第二侧壁1220b上，第二滑轨1262配置在固定框架121的第二侧壁1210b上，固定框架121的第二侧壁1210b和移动底座122的第二侧壁1220b相对设置。
其中，如图9所示，第一导向轮1251为定位轮20，第一滑轨1252为定位滑轨30。第二导向轮1261和第三导向轮1271均为常规导向轮，例如圆柱滚轮或偏心轮40。
进一步的，位于同一侧的多组滑动组件中的滑轨可以共用同一块板体。如图9所示，第一滑轨1252和第三滑轨1272可以形成在同一板体的上下两侧，减少部件数量，降低安装误差，提高定位精度。
再次参见图1至图4，在本实施例中，热处理模块130为加热模块H。加热模块H主要包括热板131和顶盖132，其中，顶盖132安装在固定框架121上，热板131安装在移动底座122上。当需要对热板131和顶盖132维护保养时，维养人员只需将第一定位销123从固定框架121上的第一定位销孔(图未示出)中拔出，即可把热板131从固定框架121中轻松抽出，此时，热板131和顶盖132不在同一空间内，如图3所示，热板131随移动底座122沿有限板式运动导轨124抽出，而顶 盖132仍将留在固定框架121内，这样在维养时热板131和顶盖132之间会有一定的距离差，工作人员有足够的空间和视野对热板131和顶盖132分别进行擦拭或保养。
参见图1至图4，移动底座122上配置有线缆保护链140，以使热处理模块130在移动底座122内引出的各种电缆和管路通过线缆保护链140从固定框架121上的方形开口1212引出到机台上。由于线缆保护链140可以保证穿行在线缆保护链140内部的电缆和管路在移动底座122抽拉时不受影响，节省了大量维养后需要重新整理线缆的时间。
再次参见图2和图3，顶盖132通过水平支架1213安装在固定框架121上。顶盖132上配置有排风口1321和排风管道1322，固定框架121上配置有主排风管道1214。排风管道1322的一端通过第二定位销1322a与顶盖132的排风口1321可拆卸相连，排风管道1322的另一端通过第三定位销1322b与主排风管道1214的连接口1215可拆卸相连。排风管道1322用于将基板进行热处理时产生的废气排出。排风管道1322采用柔性软管，例如波纹软管，以便在狭小的空间内弯曲变形。排风管道1322的两端是通过机加工保证的带配合公差的矩形硬接头1322c。当要针对排风管道1322进行清洁任务时，维养人员只需拔出排风管道1322两端的定位销1322a、1322b，即可卸下排风管道1322进行清洁。由于排风管道1322两端的硬接头1322c与对应的顶盖132的排风口1321和主排风管道1214的连接口1215是矩形配合连接，因而维养人员能够轻松地将硬接头1322c插入对应的排风口1321和连接口1215中，并重新利用定位销1322a、1322b固定。
在本实施例中，如图2至图4所示，热板131包括加热盘1311和多个升降销1312，加热盘1311安装在移动底座122上，多个升降销1312设置在加热盘1311中，多个升降销1312与驱动器1313相连，驱动器1313用于驱动升降销1312上升和下降，以使多个升降销1312支撑晶圆并将晶圆放置于加热盘1311表面，加热盘1311用于给晶圆加热。驱动器1313可以选用电机或气缸。
在本实施例中，如图10所示，升降销1312内部沿其轴线具有中空通孔13120，中空通孔13120用于连接真空泵。当升降销1312支撑晶圆时，通过真空泵和中空通孔13120在晶圆背面形成负压，以使晶圆牢牢地吸附在升降销1312上，这样可以提高升降销1312动作的稳定性。
如图2所示，热板131中具有三根升降销1312，三根升降销1312与加热盘1311上表面的垂直高度的一致性非常重要，在使用过程中，要确保三根升降销1312的上端面处于同一水平面上，以保证升降销1312升降动作的稳定性，避免放置在升降销1312上方的晶圆滑片掉落。为方便维养人员对升降销1312的高度进行方便调节，本发明对传统升降销1312的安装结构进行了优化。再次参见图10，升降销1312的下端具有安装板13121，安装板13121上配有紧固螺钉13122和调节螺钉13123，紧固螺钉13122用于将安装板13121与移动底座122固定，调节螺钉13123用于调整安装板13121与移动底座122之间的距离，从而调整升降销1312伸出加热盘1311的高度。调节螺钉13123的一端通过螺纹旋紧在安装板13121上，另一端抵接在移动底座122的下表面，通过旋拧调节螺钉13123可以调整安装板13121与移动底座122下表面之间的距离，从而调整升降销1312的上端距离加热盘1311上表面的高度。在本实施例中，每根升降销1312均配有三个紧固螺钉13122和三个调节螺钉13123。调节时，先通过旋拧调节螺钉13123来改变升降销1312伸出加热盘1311的高度，当升降销1312达到理想高度后，再通过拧紧紧固螺钉13122来确保最后升降销1312与移动底座122连接牢固。
此外，热板131还配置有可升降的保温环1314，如图3所示，保温环1314围绕加热盘1311设置。当对晶圆进行加热处理时，升起保温环1314，封住顶盖132与加热盘1311之间的空隙，以使晶圆进行加热时不受外部环境干扰，提高热处理工艺的可靠性。当保温环1314下降时，外部机械手可执行取放片操作。需要说明的是，图1至图4中的保温环1314均为未升起状态。
实施例二
请参见图11，本实施例提供的基板热处理装置400，热处理模块130仍为加热模块H，与实施例一相比，区别之处在于，加热模块H的顶盖132和热板131均安装在移动底座122上，即当移动底座122从固定框架121中抽出时，整个加热模块H随移动底座122一起抽出，顶盖132与热板131不分离。
具体地，如图11所示，顶盖132可以通过竖直支架2213固定在移动底座122上，并位于热板131上方。同样地，在本实施例中，热板131上配置有可升降的保温环1314，以使晶圆加热时不受外部环境干扰。需要说明的是，图11中，保温环 1314处于未升起状态。
在其他实施例中，顶盖132还可以通过升降支架安装在移动底座122上，并位于热板131上方，即顶盖132相对热板131的高度可调，当对晶圆进行加热处理时，顶盖132下降，罩住热板131即可。
需要说明的是，基板热处理装置400中与实施例一中基板热处理装置100的相同结构采用相同的附图标号，不再赘述。
实施例一及实施例二提出的基板热处理装置100、200、300或400可以应用在涂胶机台和/或显影机台，用以对基板进行加热处理。涂胶机台和/或显影机台中可以配置多个堆叠布置的基板热处理装置100、200、300或400。
实施例三
请参见图12，本实施例提供的基板热处理装置500，与实施例一相比，区别之处在于，热处理模块130为冷却模块C。冷却模块C用于对晶圆进行冷却。
冷却模块C通常包括冷板133和第二升降销1331，第二升降销1331的上端伸出冷板133的上表面，用于支撑晶圆并将晶圆放置于冷板133表面。冷却模块C可以采用常规设计。
实施例四
请参见图13，本实施例提供的基板热处理装置600，与实施例一相比，区别之处在于，热处理模块130不仅包括加热模块H，还包括冷却模块C，加热模块H用于对晶圆进行加热，冷却模块C用于对晶圆进行冷却。
基板热处理装置600可以应用于涂胶显影机台中，用以对基板进行加热或冷却处理。涂胶显影机台可以配置多个基板热处理装置600，多个基板热处理装置600在涂胶显影机台中堆叠布置。
实施例五
本发明还提出一种半导体设备，包括多个如实施例一至实施例四中涉及的基板热处理装置，其中，至少一个基板热处理装置为备用基板热处理装置，当基板热处理装置需要进行维修时，可以直接启用备用基板热处理装置替代被维修的基板热处理装置进行工作，以使光刻机在基板热处理装置养护时不需要停机。在一示例中， 半导体设备中配置三个备用基板热处理装置。
在一实施例中，半导体设备中配置的多个基板热处理装置在竖直方向上堆叠布置。
本实施例中提出的半导体设备具体地可以应用在涂胶机台、显影机台或涂胶显影机台。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (13)

  1. 一种基板热处理装置，具有热处理模块，其特征在于，包括：
    固定框架；
    移动底座，用于装载热处理模块；
    有限板式运动导轨，所述移动底座通过有限板式运动导轨可移动地安装在固定框架内；
    第一定位销组件，用于在移动底座运动方向上对移动底座进行定位固定；
    至少两组滑动组件，分布在移动底座垂直于运动方向的水平方向的两侧，每组滑动组件包括相互配合的导向轮和滑轨，导向轮配置在移动底座的侧壁上，滑轨配置在固定框架的侧壁上，其中，至少一组滑动组件的导向轮和滑轨采用定位轮和定位滑轨，用于在与移动底座运动方向垂直的水平方向上对移动底座进行定位。
  2. 根据权利要求1所述的基板热处理装置，其特征在于，所述至少两组滑动组件包括设置在所述移动底座的至少一侧且在竖直方向间隔排布的两组滑动组件，用于在竖直方向对移动底座进行定位。
  3. 根据权利要求1所述的基板热处理装置，其特征在于，所述定位轮的外周面形成有第一定位部，所述定位滑轨具有与第一定位部相匹配的第二定位部。
  4. 根据权利要求3所述的基板热处理装置，其特征在于，所述第一定位部为斜坡面、V形槽、V形凸起、梯形槽和梯形凸起中的任意一种。
  5. 根据权利要求1所述的基板热处理装置，其特征在于，还包括紧固件，所述有限板式运动导轨固定安装在移动底座上并位于移动底座垂直于运动方向的水平方向的两侧，所述紧固件穿过固定框架上预留的安装孔锁住移动底座上对应侧的有限板式运动导轨，以使移动底座可移动地与固定框架组装在一起。
  6. 根据权利要求1所述的基板热处理装置，其特征在于，所述热处理模块为加热模块和冷却模块中的任意一种或两种组合。
  7. 根据权利要求6所述的基板热处理装置，其特征在于，所述加热模块包括顶盖和热板，热板安装在移动底座上，顶盖位于热板的上方。
  8. 根据权利要求7所述的基板热处理装置，其特征在于，所述顶盖安装在 固定框架上。
  9. 根据权利要求7所述的基板热处理装置，其特征在于，所述顶盖安装在移动底座上。
  10. 根据权利要求7所述的基板热处理装置，其特征在于，所述顶盖上具有排风口和排风管道，固定框架上具有主排风管道，排风管道两端分别通过定位销可拆卸地与排风口和主排风管道相连。
  11. 根据权利要求7所述的基板热处理装置，其特征在于，所述热板具有加热盘和升降销，升降销的上端伸出加热盘的上表面，升降销的下端具有安装板，安装板位于移动底座下方，安装板上配有紧固螺钉和调节螺钉，紧固螺钉用于使升降销与移动底座固定，调节螺钉用于调整安装板与移动底座之间的距离，从而调整升降销的上端距离加热盘上表面的高度。
  12. 一种半导体设备，其特征在于，包括多个如权利要求1～11中任一项所述的基板热处理装置，其中，至少一个基板热处理装置为备用基板热处理装置。
  13. 根据权利要求12所述的半导体设备，其特征在于，所述多个基板热处理装置在竖直方向上堆叠布置。
PCT/CN2023/102586 2022-08-31 2023-06-27 基板热处理装置及半导体设备 Ceased WO2024045818A1 (zh)

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