WO2024045805A1 - 光组件、光芯片、电子设备及光通信系统 - Google Patents

光组件、光芯片、电子设备及光通信系统 Download PDF

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Publication number
WO2024045805A1
WO2024045805A1 PCT/CN2023/102223 CN2023102223W WO2024045805A1 WO 2024045805 A1 WO2024045805 A1 WO 2024045805A1 CN 2023102223 W CN2023102223 W CN 2023102223W WO 2024045805 A1 WO2024045805 A1 WO 2024045805A1
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WIPO (PCT)
Prior art keywords
optical
optical fiber
colloid
waveguide
face
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PCT/CN2023/102223
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English (en)
French (fr)
Inventor
肖鹏程
张学明
张文奇
王猛
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华为技术有限公司
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Publication of WO2024045805A1 publication Critical patent/WO2024045805A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present application relates to the field of communication technology, and in particular to an optical component, an optical chip, an electronic device and an optical communication system.
  • optical component packaging involves the packaging of optical chips and fiber array units (Fiber Array Units, FAU) to obtain more compact photoelectric combined packaging (Co-Packaged-Optics, CPO ) module.
  • optical components In the manufacturing process of optical components, it involves the edge coupling process between the FAU and the waveguide array in the optical chip.
  • the edge coupling process involves using glue to secure and couple the FAU to the optical chip.
  • the aforementioned optical components need to undergo high-temperature reflow after packaging, so the glue has requirements for low refractive index, high temperature resistance, and high bonding strength.
  • the current glue it is difficult for the current glue to meet the above requirements at the same time, resulting in unsatisfactory coupling effect between FAU and optical chip.
  • a first aspect of this application provides an optical component, including:
  • An optical fiber array unit includes a substrate and a plurality of optical fibers.
  • the plurality of optical fibers are located on a surface of the substrate.
  • the multiple optical fibers have optical fiber end faces.
  • the plane of the optical fiber end faces is not perpendicular to the plane of the surface of the substrate. ;as well as
  • Optical chip including a base material and a waveguide layer
  • the base material has a base material end surface
  • the waveguide layer is formed on a surface of the base material
  • the waveguide layer has a waveguide end surface
  • the base material end surface and the waveguide end surface At a non-zero included angle, the optical fiber end face is coupled to the waveguide end face.
  • the optical fiber and the waveguide form horizontal chamfers, causing the chamfering errors to accumulate in multiple waveguides, resulting in excessive errors in the entire waveguide layer.
  • the fiber end face The plane is not perpendicular to the plane of the surface of the substrate, and the base material end face and the waveguide end face are set to have a non-zero angle, so that the optical fiber and the waveguide layer can form vertical chamfers instead of horizontal chamfers, and each fiber and each waveguide are on the same Formed under the etching process, if there are errors, the errors of each optical fiber and each waveguide will be consistent, and there will be no accumulation of errors.
  • the above-mentioned optical components can help reduce the alignment error between the optical fiber and the waveguide by forming vertical chamfers, thereby reducing the return loss after coupling the optical fiber and the waveguide, and improving the coupling effect between the optical fiber array unit and the optical chip.
  • the optical fiber array unit further includes a cover plate; the cover plate partially covers a side of the plurality of optical fibers away from the substrate, the cover plate has a cover end surface, and the cover end surface is connected to The optical fiber end faces are not on the same plane.
  • the structure of the optical fiber is better fixed and the optical fiber is protected.
  • the end surface of the cover plate and the end surface of the optical fiber are not on the same plane, so that there is a distance between the end surface of the optical fiber and the end surface of the cover plate.
  • the cover plate covers the side of the optical fiber away from the base plate, and the area outside the V-shaped grooves on the surface of the base plate is connected to the cover through a third colloid (not shown). Board bonding.
  • the first colloid is located between the waveguide end face and the optical fiber end face and directly contacts the optical fiber end face.
  • the third colloid between the substrate and the cover plate may be in contact with the first colloid, which results in the existence of different material interfaces between the first colloid and the third colloid at the optical fiber end face.
  • the interface between different materials will affect the propagation of optical signals in the fiber.
  • a side of the plurality of optical fibers away from the substrate is exposed.
  • the optical fiber array unit does not include a cover plate, there is no need to bond and fix the substrate and the cover plate through a third colloid, so there is no problem of different material interfaces affecting optical signal transmission. There is no need to consider setting a separation distance between the optical fiber end face and the cover plate end face.
  • the waveguide end surface is connected to the substrate end surface.
  • the waveguide end surface and the surface of the substrate form a step-like structure.
  • the formation method of the waveguide end surface is not limited to exposure and development, and other etching methods (such as laser etching) can be used.
  • the optical component further includes: a first colloid located between the optical fiber end face and the waveguide end face for coupling the optical fiber array and the waveguide layer; and a second colloid located between the optical fiber end face and the waveguide end face.
  • a first colloid located between the optical fiber end face and the waveguide end face for coupling the optical fiber array and the waveguide layer
  • a second colloid located between the optical fiber end face and the waveguide end face.
  • the first colloid is mainly used to couple the optical fiber to the waveguide, and has the characteristics of low refractive index and high temperature resistance.
  • the second colloid is mainly used to fix the optical fiber array unit and the optical chip, and has the characteristics of high adhesion and high temperature resistance. Therefore, during the subsequent high-temperature processing of the optical component, both the first colloid and the second colloid can maintain their properties, that is, the first colloid can keep its refractive index matching the refractive index of the cladding layer of the optical fiber, maintaining the coupling effect between the optical fiber and the waveguide. , control return loss.
  • the second colloid can maintain a high bonding strength so that the optical fiber array unit and the optical chip are firmly bonded.
  • the first colloid has the characteristics of low refractive index and high temperature resistance
  • the second colloid has the characteristics of high adhesion and high temperature resistance to pass through the first colloid.
  • the body and the second colloid achieve refractive index matching and fixing effects respectively, solving the technical problem that it is difficult to use one kind of glue in optical components to simultaneously meet the three characteristics of low refractive index, high temperature resistance, and high adhesion.
  • the heat resistance of the second colloid is higher than that of the first colloid.
  • the optical fiber array unit and the optical chip are mainly fixed through the second colloid and coupled mainly through the first colloid, the heat resistance of the second colloid is higher than that of the first colloid, and the refractive index requirements of the first colloid can be guaranteed to a limited extent, even if the second colloid is The first colloid has poor heat resistance due to the refractive index requirement.
  • the optical fiber array unit and the optical chip can also be well fixed by the second colloid. Therefore, by setting the second colloid to have higher heat resistance than the first colloid, it is beneficial to The coupling effect is improved while ensuring the bonding strength between the optical fiber array unit and the optical chip 3.
  • the first colloid and the second colloid are spaced apart.
  • the second colloid is located between the substrate and the optical chip for bonding the substrate and the optical chip.
  • the optical fiber array unit and the optical chip are directly bonded through the second colloid, without the need for auxiliary bonding components.
  • the optical component further includes an auxiliary bonding member that bonds the optical fiber array unit and the optical chip respectively through the first colloid.
  • the optical fiber array unit and the optical chip are respectively bonded through the auxiliary adhesive member, so that the optical fiber array unit and the optical chip are fixed.
  • the auxiliary adhesive member is made separately, and its structure is easier to change. If it is necessary to directly bond the substrate of the optical fiber array unit and the optical chip , the substrate of the optical fiber array unit needs to be shaped into a specific shape, and the manufacturing process is complicated. Therefore, respectively bonding the optical fiber array unit and the optical chip through auxiliary adhesive members is conducive to simplifying the structure of the substrate, thereby simplifying the manufacturing process of the optical fiber array unit.
  • the first colloid is silicone gel; and/or the second colloid is epoxy glue or acrylic resin glue.
  • the cladding layer of the waveguide is usually made of silica, and the first colloid is used as the colloid for coupling the waveguide and the optical fiber.
  • silica gel is beneficial to refractive index matching.
  • Epoxy glue and acrylic resin have high heat resistance and bonding strength, so that the second colloid can better adapt to the subsequent high-temperature manufacturing process of the optical component and maintain the bonding strength between the optical fiber array unit and the optical chip.
  • a second aspect of the present application provides an optical chip, including: a base material having a base material end face; and a waveguide layer formed on a surface of the base material, the waveguide layer having a waveguide end face, the base material end face being in contact with the The waveguide end face has a non-zero included angle.
  • the waveguide end face is used for coupling with the optical fiber end face of the optical fiber.
  • the optical fiber is located on the surface of a substrate.
  • the plane of the optical fiber end face is not perpendicular to the plane of the surface of the substrate. .
  • the optical fiber and the waveguide form a horizontal chamfer, so that the error in the chamfer occurs in multiple waveguides. accumulation in sequence, resulting in excessive errors in the entire waveguide layer.
  • the waveguide layer can form a vertical chamfer instead of a horizontal chamfer.
  • the waveguides are formed under the same etching process. If there are errors, the chamfering errors of each waveguide will be consistent, and there will be no accumulation of errors.
  • the waveguide end surface is connected to the substrate end surface.
  • the waveguide end surface and the surface of the substrate form a step-like structure.
  • the formation method of the waveguide end surface is not limited to exposure and development, and other etching methods (such as laser etching) can be used.
  • a third aspect of the present application provides an electronic device, including: a plurality of optical components as described in any one of the above, each of the optical components is configured to output interactive signals through the plurality of optical fibers and the waveguide layer; exchange A chip is respectively connected to the plurality of optical devices, and is used to establish communication between the plurality of optical components according to the interactive signal.
  • the optical fiber and the waveguide form horizontal chamfers, so that the chamfering errors accumulate in multiple waveguides, resulting in excessive errors in the entire waveguide layer.
  • the above-mentioned electronic equipment provided by this application includes optical components.
  • the optical fiber and the waveguide layer can form a vertical chamfer instead of a horizontal chamfer, and each fiber Each waveguide is formed under the same etching process. If there is an error, the error of each optical fiber and each waveguide is consistent, and there is no error accumulation.
  • the above-mentioned optical components can help reduce the alignment error between the optical fiber and the waveguide by forming vertical chamfers, thereby reducing the return loss after coupling the optical fiber and the waveguide, and improving the coupling effect between the optical fiber array unit and the optical chip.
  • a fourth aspect of the present application provides an optical communication system, including a plurality of electronic devices connected by communication, and at least one of the electronic devices is the above-mentioned electronic device.
  • the optical fiber and the waveguide form horizontal chamfers, causing the chamfering errors to accumulate in multiple waveguides, resulting in excessive errors in the entire waveguide layer.
  • the above-mentioned optical communication system provided by this application includes electronic equipment, electronics
  • the equipment includes an optical component.
  • the optical fiber and the waveguide layer can form a vertical chamfer.
  • each optical fiber and each waveguide are formed under the same etching process.
  • the above-mentioned optical components can help reduce the alignment error between the optical fiber and the waveguide by forming vertical chamfers, thereby reducing the return loss after coupling the optical fiber and the waveguide, and improving the coupling effect between the optical fiber array unit and the optical chip.
  • Figure 1 is a schematic cross-sectional structural diagram of an optical component according to an embodiment of the present application.
  • FIG. 2 is a schematic plan view of the optical fiber array unit in the optical assembly according to the embodiment of the present application.
  • FIG. 3 is a schematic plan view of the optical chip in the optical component according to the embodiment of the present application.
  • Figure 4 is another schematic cross-sectional structural diagram of an optical component according to an embodiment of the present application.
  • Figure 5 is a schematic cross-sectional structural diagram of an optical component in a modified embodiment of the present application.
  • Figure 6 is a schematic cross-sectional structural diagram of an optical component in another modified embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • Figure 8 is a schematic diagram of the planar structure when the FAU is coupled to the optical chip in a pair of ratios.
  • the optical component fabrication process involves an edge coupling process between the FAU and the waveguide array in the optical chip.
  • the edge coupling process includes using glue to fix and couple the FAU 100 with the optical chip 200.
  • the waveguide 300 in the optical chip 200 and the optical fiber 400 in the FAU 100 need to be matched at a certain angle. That is, on the horizontal plane (the plane where the waveguide 300 and the optical fiber 400 are located in FIG. 8 ), the extending directions of the waveguide 300 and the optical fiber 400 are inclined relative to the coupling end surface. In the early stage of processing, the extension direction of the optical fiber 400 is perpendicular to the initial end face S1 of the FAU100. By etching the FAU100 along the cutting line L, the etched FAU100 forms the coupling end face S2. The optical fiber 400 is tilted relative to the coupling end face S2.
  • the waveguide 300 is also formed at a corresponding tilt angle of the optical fiber 400 during the photolithography process to facilitate coupling.
  • the above process of etching the FAU 100 is defined as forming a horizontal chamfer ⁇ (that is, the optical fiber 400 forms a horizontal angle with the coupling end surface S2 on the horizontal plane).
  • the optical fiber 400 and the waveguide 300 correspond one to one.
  • the optical fiber 400 and the waveguide 300 located in the middle are aligned, and then the optical fiber 400 and the waveguide 300 located on both sides correspond one to one.
  • Embodiments of the present application provide an optical component, an optical fiber array unit, an optical chip, an electronic device, and an optical communication system to solve the above technical problem of return loss caused by horizontal chamfering errors.
  • the optical component 1 of the embodiment of the present application is an optoelectronic package structure, including an optical fiber array unit. Yuan 2 and optical chip 3.
  • the optical fiber array unit 2 and the optical chip 3 are fixedly coupled to each other, so that optical signals can be transmitted between the optical fiber array unit 2 and the optical chip 3 .
  • the optical fiber array unit 2 includes a base plate 21, a plurality of optical fibers 22 and a cover plate 23.
  • the substrate 21 has a surface 211, and each optical fiber 22 is located on the surface 211 of the substrate 21. Each optical fiber 22 is spaced apart and arranged in parallel.
  • the cover plate 23 partially covers the side of each optical fiber 22 away from the substrate 21 . That is, each optical fiber 22 is located between the base plate 21 and the cover plate 23 , and one end of each optical fiber 22 for coupling with the optical chip 3 is exposed relative to the cover plate 23 .
  • the base plate 21 serves as a base material for carrying optical fibers 22.
  • Each optical fiber 22 is used to transmit optical signals.
  • the cover plate 23 and the base plate 21 are used to jointly fix and protect the optical fibers 22. In this embodiment, both the substrate 21 and the cover plate 23 are made of glass.
  • the optical chip 3 includes a structure for transmitting optical signals, and may also be integrated with a structure for transmitting electrical signals. In the embodiment of this application, the structure of the optical chip 3 for transmitting optical signals is mainly described.
  • the optical chip 3 includes a base material 31 and a waveguide layer 32 .
  • the base material 31 has an upper surface 312, and the waveguide layer 32 is located on the upper surface 312 of the base material 31.
  • the waveguide layer 32 includes a plurality of waveguides 321 (see FIG. 2 ), and each waveguide 321 is spaced apart and arranged in parallel. Each waveguide 321 is used to transmit optical signals.
  • the optical fiber 22 and the waveguide 321 are coupled in a one-to-one correspondence to realize optical signal transmission between the optical fiber 22 and the waveguide 321 .
  • coupling the optical fiber array unit 2 and the optical chip 3 mainly includes a coupling optical fiber 22 and a waveguide 321 .
  • the return loss is reduced by improving the angle matching between the optical fiber 22 and the waveguide 321 .
  • each optical fiber 22 has an optical fiber end face 221, and each waveguide 321 has a waveguide end face 322.
  • the optical fiber end faces 221 and the waveguide end faces 322 are arranged one by one and coupled.
  • the substrate 21 has a substrate end surface 212 facing the optical chip 3
  • the cover plate 23 has a cover end surface 231 facing the optical chip 3 .
  • the optical fiber end face 221 and the plane of the surface 211 of the substrate 21 form an angle other than 90°, that is, they form an inclined plane.
  • the substrate end face 212 of the substrate 21 and the optical fiber end face 221 are on the same plane.
  • the substrate end face 212 and the fiber end face 221 are both perpendicular to the plane of the surface 211 in the early stages of processing.
  • the substrate 21 and each optical fiber 22 are etched together to form the shapes of the substrate end face 212 and the optical fiber end face 221 as shown in FIGS. 1-2 .
  • each waveguide 321 has a waveguide end surface 322, and the base material 31 has a base material end surface 311.
  • the base material end surface 311 extends perpendicularly to the upper surface 312, and the waveguide end surface 322 and the base material end surface 311 have a non-zero included angle. That is, the waveguide end surface 322 and the base material end surface 311 are not located on the same plane, which causes the waveguide end surface 322 to form a slope structure.
  • the inclined directions of the optical fiber end face 221 and the waveguide end face 322 are substantially parallel, thereby facilitating coupling between the two.
  • the structure of the optical fiber end face 221 and the waveguide end face 322 forms an included angle of non-90° with the base material end face 311 on a vertical plane (a plane perpendicular to the plane where the waveguide 321 is located), as defined in the embodiment of the present application. It is a vertical chamfer, which is beneficial to reducing the return loss when the optical fiber 22 is coupled to the waveguide 321.
  • the optical fiber 400 and the waveguide 300 form a horizontal chamfer, causing the error of the optical fiber 400 to gradually accumulate from the middle position to both sides, and the loss consistency of each channel becomes worse.
  • vertical chamfers are formed instead of horizontal chamfers. Even if there are errors in the chamfer formation process, for each optical fiber 22, the chamfering errors have the same impact, that is, the chamfering errors of each optical fiber 22 are consistent, and there is no accumulation of errors.
  • the embodiment of the present application is beneficial to reducing the alignment error between the optical fiber 22 and the waveguide 321 by forming a vertical chamfer, thereby reducing the return loss after the optical fiber 22 and the waveguide 321 are coupled, and improving the channel loss consistency, improving the optical fiber 22 and the waveguide 321. Coupling effect of waveguide 321.
  • the optical component uses surface mounting technology (SMT), so that the optical component needs to pass a high temperature of more than 260 degrees Celsius in the reflow oven.
  • SMT surface mounting technology
  • the glue bonded between the FAU100 and the optical chip 200 needs to withstand high-temperature reflow of 260 degrees Celsius.
  • glue whose refractive index matches the refractive index of the material of the wrapping layer of the waveguide 300 (the waveguide 300 usually has a wrapping layer) needs to be filled. Since SiO2 is a very typical coating material, a low refractive index glue is usually required.
  • the optical component 1 provided by the embodiment of the present application is also used to solve the above technical problem of glue.
  • the optical component 1 further includes a first colloid 4 .
  • the first colloid 4 is located between the fiber end face 221 and the waveguide end face 322, and is in direct contact with the fiber end face 221 and the waveguide end face 322, for coupling the fiber end face 221 and the waveguide end face 322.
  • Each optical fiber 22 includes a core and a cladding layer (not shown) covering the core.
  • the first colloid 4 matches the refractive index of the material of the cladding layer of the optical fiber 22 .
  • the first colloid 4 also has viscosity and can be used to fix the optical fiber 22 and the waveguide 321 .
  • the optical component 1 also includes a second colloid 5 and an auxiliary adhesive member 6 .
  • the auxiliary bonding member 6 is made of glass. One end of the auxiliary adhesive member 6 is connected to the optical fiber array unit 2, and the other end is connected to the optical chip 3.
  • the second colloid 5 is filled between the optical fiber array unit 2 and the auxiliary adhesive member 6 , and the second colloid 5 is also filled between the optical chip 3 and the auxiliary adhesive member 6 .
  • the second colloid 5 is used to bond the optical fiber array unit 2 and the auxiliary bonding member 6 , and is also used to bond the optical chip 3 and the auxiliary bonding member 6 .
  • the auxiliary bonding member 6 is bonded to the optical fiber array unit 2 and the optical chip 3 respectively through the second colloid 5, so that the optical fiber array unit 2 and the optical chip 3 are fixed to each other.
  • one end of the auxiliary adhesive member 6 is connected to the substrate 21 of the optical fiber array unit 2 , and the other end is connected to the side of the optical chip 3 having the waveguide layer 32 .
  • the optical component 1 may not include the auxiliary adhesive member 6.
  • the substrate 21 of the optical fiber array unit 2 extends backward toward the optical chip 3 to form a connection part with the same structure as the auxiliary adhesive member 6, and is close to the connection part.
  • the second colloid 5 is filled between the end of the optical chip 3 and the optical chip 3, so that the substrate 21 and the optical chip 3 can be directly fixed. In this way, there is no need to make additional auxiliary bonding parts 6 .
  • the first colloid 4 is mainly used to couple the optical fiber 22 to the waveguide 321, and has the characteristics of low refractive index and high temperature resistance.
  • the refractive index of the first colloid 4 matches the cladding layer of the waveguide 321, and the refractive index is less than or equal to 1.44.
  • the first colloid 4 can withstand high temperatures of at least 260°.
  • the second colloid 5 is mainly used to fix the optical fiber array unit 2 and the optical chip 3, and has the characteristics of high adhesion and high temperature resistance.
  • both the first colloid 4 and the second colloid 5 can maintain their characteristics, that is, the first colloid 4 can maintain its refractive index matching that of the optical fiber 22.
  • the refractive index characteristics of the cladding layer are used to maintain the coupling effect between the optical fiber 22 and the waveguide 321 and control the return loss.
  • the second colloid 5 can maintain a high bonding strength so that the optical fiber array unit 2 and the optical chip 3 are firmly bonded.
  • the heat resistance of the second colloid 5 is higher than that of the first colloid 4 . Since the optical fiber array unit 2 and the optical chip 3 are mainly fixed through the second colloid 5 and coupled mainly through the first colloid 4, the heat resistance of the second colloid 5 is higher than that of the first colloid 4, and the first colloid 4 can be guaranteed to a limited extent.
  • the refractive index requirement even if the first colloid 4 has poor heat resistance due to the refractive index requirement, the optical fiber array unit 2 and the optical chip 3 can be well fixed by the second colloid 5, so by setting the second colloid 5
  • the heat resistance is higher than that of the first colloid 4, which is beneficial to improving the coupling effect on the basis of ensuring the bonding strength between the optical fiber array unit 2 and the optical chip 3.
  • the first colloid 4 is silicone gel
  • the second colloid 5 is epoxy glue or acrylic resin glue.
  • the first colloid 4 has the characteristics of low refractive index and high temperature resistance
  • the second colloid 5 has the characteristics of high adhesion and high temperature resistance. characteristics to achieve refractive index matching and fixing effects through the first colloid 4 and the second colloid 5 respectively, solving the problem of difficulty in meeting the requirements of low refractive index and high temperature resistance at the same time when using a glue coupling to fix the optical chip and the optical fiber array unit in the optical assembly. , high adhesion three characteristics of technical issues.
  • the coupling and fixing effects of the optical fiber array unit 2 and the optical chip 3 in the optical component 1 are improved.
  • the angle matching method of the optical fiber 22 and the waveguide 321 is changed, and the return loss of the optical fiber 22 and the waveguide 321 is significantly reduced, which makes the first The sensitivity of the colloid 4 to return loss is reduced, which is beneficial to expanding the material selection range of the first colloid 4 . That is to say, in the comparative example, the horizontal chamfering method makes the coupling effect between the optical fiber and the waveguide poor, and the return loss is high. At this time, only glue with some specific materials can be used to achieve refractive index matching to meet the requirements of the optical fiber and the waveguide. coupling requirements.
  • the coupling effect between the optical fiber 22 and the waveguide 321 is significantly improved, and the return loss when the optical fiber 22 is coupled with the waveguide 321 is significantly reduced.
  • the material of the first colloid 4 can be appropriately selected. Relaxation can also meet the coupling requirements of the optical fiber 22 and the waveguide 321. Therefore, in this embodiment, by arranging the optical fiber 22 and the waveguide 321 with vertical chamfers, it is also beneficial to expand the material selection range of the first colloid 4 .
  • the cover 23 has a cover end surface 231 , and the cover end surface 231 is perpendicular to the plane where the surface 211 of the substrate 21 is located. And in the horizontal direction (based on FIG. 4 ), there is a separation distance between the optical fiber end face 221 and the cover end face 231 . That is, the optical fiber end face 221 and the cover plate end face 231 are not on the same plane and are not connected to each other.
  • the base plate 21 is provided with a plurality of "V"-shaped grooves to accommodate the optical fiber 22.
  • the cover plate 23 covers the side of the optical fiber 22 away from the base plate 21, and the surface 211 of the base plate 21 is provided with a plurality of "V"-shaped grooves.
  • the area outside the V-shaped groove is bonded to the cover plate 23 through a third colloid (not shown).
  • the first colloid 4 is located between the waveguide end face 322 and the optical fiber end face 221 and directly contacts the optical fiber end face 221 .
  • Figure 4 again.
  • the third colloid between the base plate 21 and the cover plate 23 may contact the first colloid 4, which results in the presence of the first colloid 4 at the optical fiber end face 221.
  • Different material interfaces with third colloids. The interface between different materials will affect the light Propagation of optical signals in fibers.
  • the optical fiber end face 221 and the cover end face 231 are arranged to have a distance, it is helpful to avoid the contact between the first colloid 4 and the third colloid, thereby avoiding the appearance of the interface of different materials, and is conducive to ensuring that the optical fiber 22 has light. Correct signal propagation is beneficial to improving the coupling effect between the optical fiber 22 and the waveguide 321.
  • the auxiliary bonding member 6 has a roughly “L”-shaped structure, which makes the end connecting the auxiliary bonding member 6 and the optical fiber array unit 2 as far away from the first colloid 4 as possible, thereby preventing the first colloid 4 from being connected to the second colloid 4 .
  • the contact of colloid 5 produces interfaces between different materials, which affects the transmission of optical signals. That is, the auxiliary adhesive member 6 keeps the first colloid 4 and the second colloid 5 in a spaced state.
  • the auxiliary adhesive member 6 can have other structures, such as arc shape, etc., as long as the aforementioned effect can be achieved.
  • the optical fiber array unit 2 does not include the cover plate 23 , that is, the side of each optical fiber 22 away from the substrate 21 is exposed.
  • the optical fiber array unit 2 does not include the cover plate 23 , there is no need to adhere and fix the substrate 21 and the cover plate 23 through a third colloid. Therefore, there is no problem of the interface of different materials affecting the transmission of optical signals. There is no need to consider setting the optical fiber end face 221 and the cover end face 231 to have a separation distance.
  • the manner of forming the vertical chamfer may be different from the manner shown in FIGS. 1 to 5 .
  • the inclined directions of the optical fiber end face 221 and the substrate end face 212 are different from the inclined plane structures shown in FIGS. 1 to 5 .
  • the inclination direction of the waveguide end face 322 is also different from the inclined structure shown in FIGS. 1 to 5 , and is generally parallel to the optical fiber end face 221 and the substrate end face 212 to facilitate the coupling between the optical fiber 22 and the waveguide 321 .
  • the waveguide end surface 322 is not connected to the base material end surface 311.
  • the waveguide end surface 322 and the base material end surface 311 form a stepped structure, in which the first colloid 4 is located in the stepped structure. structure.
  • the method of forming the waveguide end surface 322 in the optical chip 3 requires an etching method of exposure and development.
  • the structure of the optical component 1 is also applicable to the case where the optical fiber array unit 2 does not include the cover plate 23 .
  • an embodiment of the present application also provides an electronic device 10 .
  • the electronic device 10 includes one or more of the aforementioned optical components 1 , and also includes a switching chip 110 connected to the optical component 1 .
  • Each optical component 1 is used to output interactive signals through optical fibers and waveguides, and the switching chip 110 is connected to each optical component 1 respectively, and is used to establish communication between multiple optical components based on the interactive signals.
  • the electronic device 10 may be a telecommunications computer room, a data center, a router, a switch, a server, etc.
  • the optical component 1 can also be applied to other types of electronic equipment, which is not limited in this application.
  • This embodiment also provides an optical communication system.
  • the optical communication system includes multiple electronic devices, at least one of which is the electronic device 10 in the embodiment of the present application.
  • the communication between each electronic device is Information connection to realize the interaction of information and data. Since the optical communication system of this embodiment uses the electronic device 10, which includes the optical component 1, it has higher reliability and lower loss.

Abstract

一种光组件，包括：光纤阵列单元（2），包括基板（21）和多个光纤（22），多个光纤（22）位于基板（21）一表面，多个光纤（22）具有光纤端面（221），光纤端面（221）所在平面与基板（21）的表面所在平面不垂直；以及光芯片（3），包括基材（31）和波导层（32），基材（31）具有基材端面（311），波导层（32）形成于基材（31）一表面，波导层（32）具有波导端面（322），基材端面（311）与波导端面（322）是一非零夹角，光纤端面（221）与波导端面（322）耦合。还提供一种光芯片、电子设备以及光通信系统。

Description

光组件、光芯片、电子设备及光通信系统
相关申请的交叉引用
本申请要求在2022年9月1日提交中国专利局、申请号为202211067447.1、申请名称为“光组件、光芯片、电子设备及光通信系统”的中国专利的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，尤其涉及一种光组件、光芯片、电子设备及光通信系统。
背景技术
全球数据通信的持续增长推动了硅基光子学的不断发展，特别是基于硅基光子学的高速高带宽光组件得到广泛应用和发展。为了获得更好的性能，更小的尺寸，光组件封装涉及光芯片与光纤阵列单元(Fiber Array Unit，FAU)的封装，以此得到结构更紧凑的光电合封(Co-Packaged-Optics，CPO)模块。
在光组件制作过程中，涉及FAU与光芯片中波导阵列之间的边耦合过程。边耦合过程包括使用胶水将FAU与光芯片固定和耦合。前述光组件封装后需要经过高温回流，因此对胶水有低折射率、耐高温、高粘接强度的要求。但目前的胶水难以同时满足上述要求，造成FAU与光芯片耦合效果不理想。
发明内容
本申请第一方面提供一种光组件，包括：
光纤阵列单元，包括基板和多个光纤，所述多个光纤位于所述基板一表面，所述多个光纤具有光纤端面，所述光纤端面所在平面与所述基板的所述表面所在平面不垂直；以及
光芯片，包括基材和波导层，所述基材具有基材端面，所述波导层形成于所述基材一表面，所述波导层具有波导端面，所述基材端面与所述波导端面呈一非零夹角，所述光纤端面与所述波导端面耦合。
在一对比例中，光纤与波导形成水平倒角，使得形成倒角的误差在多根波导中依次累积，造成整个波导层误差过大，而本申请提供的上述光组件中，通过设置光纤端面所在平面与基板的表面所在平面不垂直，并设置基材端面与波导端面呈一非零夹角，可以使得光纤与波导层形成垂直倒角取代水平倒角，各个光纤和各个波导都是在同一蚀刻制程下形成，若存在误差，则各个光纤和各个波导的误差都是一致的，不存在误差累积的情况。因此上述光组件通过形成垂直倒角的方式有利于减小光纤与波导的对位误差，从而降低光纤与波导耦合后的回损，提升光纤阵列单元与光芯片的耦合效果。
于一些实施例中，所述光纤阵列单元还包括盖板；所述盖板部分覆盖所述多个光纤远离所述基板的一侧，所述盖板具有盖板端面，所述盖板端面与所述光纤端面不在同一平面上。
如此，通过将光纤设置于盖板和基板之间，有利于更好地固定光纤的结构，且有利于保护光纤。并且，盖板端面与所述光纤端面不在同一平面上，使得光纤端面与盖板端面具有一间隔距离。基板上开设有多个“V”型槽以容纳光纤，盖板覆盖在光纤远离基板的一侧，而基板的表面上开设V型槽之外的区域通过第三胶体(图未示)与盖板粘接。根据前述的结构可知，第一胶体位于波导端面与光纤端面之间且直接接触光纤端面。若盖板延伸至与光纤端面连接，基板与盖板之间的第三胶体可能与第一胶体接触，这导致在光纤端面处存在第一胶体与第三胶体的不同材料分界面。该不同材料分界面会影响易纤中光信号的传播。通过设置光纤端面与盖板端面具有一间隔距离，有利于避免第一胶体与第三胶体接触，从而避免出现不同材料分界面，有利于保证光纤中光信号正确传播，有利于提升光纤与波导的耦合效果。
于一些实施例中，所述多个光纤远离所述基板的一侧裸露。
由于光纤阵列单元不包括盖板，则无需通过第三胶体粘接固定基板与盖板，因此便不存在不同材料分界面影响光信号传输的问题。进而无需考虑设置光纤端面与盖板端面具有一间隔距离。
于一些实施例中，所述波导端面与所述基材端面连接。
于一些实施例中，所述波导端面与所述基材的所述表面形成一台阶状结构。
波导端面与基材端面连接时，波导端面的形成方式可以不局限于曝光显影，可以采用其他的蚀刻方式(例如激光蚀刻)。
于一些实施例中，光组件还包括：第一胶体，位于所述光纤端面与所述波导端面之间，用于耦合所述光纤阵列与所述波导层；以及第二胶体，位于所述光纤阵列单元与所述光芯片之间，用于固定所述光纤阵列单元与所述光芯片；所述第一胶体与所述第二胶体材料不同，所述第一胶体的粘接强度小于所述第二胶体的粘接强度。
第一胶体主要用于使得光纤与波导耦合，其具有低折射率和耐高温的特性。第二胶体主要用于固定光纤阵列单元与光芯片，其具有粘接度高和耐高温的特性。因此光组件在后续的高温制程中，第一胶体和第二胶体都可以保持其特性，也即第一胶体可以保持其折射率匹配光纤的包覆层的折射率，保持光纤与波导的耦合效果，控制回损。第二胶体可以保持较高的粘接强度使得光纤阵列单元与光芯片粘接牢固。通过分别使用材料不同的第一胶体和第二胶体，使得第一胶体具有低折射率和耐高温的特性，第二胶体具有粘接度高和耐高温的特性，以通过第一胶 体和第二胶体分别实现折射率匹配和固定效果，解决了光组件中采用一种胶水难以同时满足低折射率、耐高温、粘接度高三种特性的技术问题。
于一些实施例中，所述第二胶体的耐热性高于所述第一胶体。
由于光纤阵列单元与光芯片主要通过第二胶体进行固定，而主要通过第一胶体进行耦合，第二胶体的耐热性高于第一胶体，可以有限保证第一胶体的折射率要求，即便第一胶体因为折射率要求导致耐热性不佳，光纤阵列单元与光芯片也可以通过第二胶体很好地被固定，因此通过设置第二胶体的耐热性高于第一胶体，有利于在保证光纤阵列单元与光芯片3的粘接强度的基础上提升耦合效果。
于一些实施例中，所述第一胶体与所述第二胶体间隔设置。
如此，有利于避免第一胶体与第二胶体产生不同材料分界面，避免影响光信号传播。
于一些实施例中，所述第二胶体位于所述基板与所述光芯片之间，用于粘接所述基板与所述光芯片。
如此，通过第二胶体直接粘接光纤阵列单元与光芯片，无需辅助粘接件。
于一些实施例中，光组件还包括辅助粘接件，所述辅助粘接件通过所述第一胶体分别粘接所述光纤阵列单元和所述光芯片。
通过辅助粘接件分别粘接光纤阵列单元与光芯片，使得光纤阵列单元与光芯片固定，辅助粘接件单独制作，其结构改变较容易，若要直接粘接光纤阵列单元的基板与光芯片，光纤阵列单元的基板需要涉及成特定的形状，制程复杂。因此通过辅助粘接件分别粘接光纤阵列单元与光芯片，有利于简化基板的结构，从而简化光纤阵列单元的制程。
于一些实施例中，所述第一胶体为硅胶；和/或，所述第二胶体为环氧胶或丙烯酸树脂胶。
波导的包覆层通常采用二氧化硅，第一胶体作为耦合波导与光纤的胶体，采用硅胶有利于折射率匹配。环氧胶和丙烯酸树脂的耐热性和粘接强度较高，使得第二胶体可以较好地适应光组件后续的高温制程，并保持光纤阵列单元与光芯片的粘接强度。
本申请第二方面提供一种光芯片，包括：基材，具有基材端面；以及波导层，形成于所述基材一表面，所述波导层具有波导端面，所述基材端面与所述波导端面呈一非零夹角，所述波导端面用于与光纤的光纤端面耦合，所述光纤位于一基板的表面上，所述光纤端面所在平面与所述基板的所述表面所在平面不垂直。
在一对比例中，光纤与波导形成水平倒角，使得形成倒角的误差在多根波导 中依次累积，造成整个波导层误差过大，而上述光芯片中，通过设置基材端面与波导端面呈一非零夹角，可以使得波导层形成垂直倒角取代水平倒角，波导层中各个波导在同一蚀刻制程下形成，若存在误差，则各个波导倒角的误差都是一致的，不存在误差累积的情况。因此上述光芯片通过形成垂直倒角的方式，当光芯片中的波导与光纤阵列单元中的光纤耦合时，有利于减小光纤与波导的对位误差，从而降低光纤与波导耦合后的回损，提升光纤阵列单元与光芯片的耦合效果。
于一些实施例中，所述波导端面与所述基材端面连接。
于一些实施例中，所述波导端面与所述基材的所述表面形成一台阶状结构。
波导端面与基材端面连接时，波导端面的形成方式可以不局限于曝光显影，可以采用其他的蚀刻方式(例如激光蚀刻)。
本申请第三方面提供一种电子设备，包括：多个如上述任一项所述的光组件，每一所述光组件用于通过所述多个光纤和所述波导层输出交互信号；交换芯片，分别与所述多个光器件连接，用于根据所述交互信号建立所述多个光组件之间的通信。
在一对比例中，光纤与波导形成水平倒角，使得形成倒角的误差在多根波导中依次累积，造成整个波导层误差过大，而本申请提供的上述电子设备包括光组件，在光组件中，通过设置光纤端面所在平面与基板的表面所在平面不垂直，并设置基材端面与波导端面呈一非零夹角，可以使得光纤与波导层形成垂直倒角取代水平倒角，各个光纤和各个波导都是在同一蚀刻制程下形成，若存在误差，则各个光纤和各个波导的误差都是一致的，不存在误差累积的情况。因此上述光组件通过形成垂直倒角的方式有利于减小光纤与波导的对位误差，从而降低光纤与波导耦合后的回损，提升光纤阵列单元与光芯片的耦合效果。
本申请第四方面提供一种光通信系统，包括多个通信连接的电子设备，至少一所述电子设备为如上述的电子设备。
在一对比例中，光纤与波导形成水平倒角，使得形成倒角的误差在多根波导中依次累积，造成整个波导层误差过大，而本申请提供的上述光通信系统包括电子设备，电子设备包括光组件，上述光组件中，通过设置光纤端面所在平面与基板的表面所在平面不垂直，并设置基材端面与波导端面呈一非零夹角，可以使得光纤与波导层形成垂直倒角取代水平倒角，各个光纤和各个波导都是在同一蚀刻制程下形成，若存在误差，则各个光纤和各个波导的误差都是一致的，不存在误差累积的情况。因此上述光组件通过形成垂直倒角的方式有利于减小光纤与波导的对位误差，从而降低光纤与波导耦合后的回损，提升光纤阵列单元与光芯片的耦合效果。
附图说明
图1为本申请实施例的光组件的一剖面结构示意图。
图2为本申请实施例的光组件中光纤阵列单元的一平面结构示意图。
图3为本申请实施例的光组件中光芯片的一平面结构示意图。
图4为本申请实施例的光组件的另一剖面结构示意图。
图5为本申请一变更实施例中光组件的剖面结构示意图。
图6为本申请另一变更实施例中光组件的剖面结构示意图。
图7为本申请实施例的电子设备的结构示意图。
图8为一对比例中FAU与光芯片耦合时的平面结构示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
应注意的是，本申请的附图中相同的附图标记表示相同或类似的结构，因而将省略对它们的重复描述。本申请中所描述的表达位置与方向的词，均是以附图为例进行的说明，但根据需要也可以做出改变，所做改变均包含在本申请保护范围内。本申请的附图仅用于示意相对位置关系不代表真实比例。
在一对比例中，光组件制作过程涉及FAU与光芯片中波导阵列之间的边耦合过程。请参阅图8，边耦合过程包括使用胶水将FAU100与光芯片200固定和耦合。
一方面，为降低回损，需要将光芯片200中的波导300与FAU100中的光纤400以一定的角度进行匹配。也即，在水平面上(图8中波导300和光纤400所在平面上)，波导300和光纤400的延伸方向相对于耦合端面倾斜。在加工初期，光纤400的延伸方向与FAU100的初始端面S1是垂直的，通过沿着切割线L蚀刻FAU100使得蚀刻之后的FAU100形成耦合端面S2，光纤400相对于耦合端面S2倾斜，对应的，波导300在光刻过程中也形成于光纤400对应的倾斜角度以利于耦合。上述蚀刻FAU100的过程定义为形成水平倒角θ(也即光纤400在水平面上与耦合端面S2形成水平角度)。在耦合光纤400与波导300时，光纤400与波导300一一对应，先对齐位于中间位置的光纤400与波导300，位于两边的光纤400与波导300再一一对应。
这种方式下，当水平倒角θ存在误差时(θ存在误差时图8中切割线L会偏左或偏右)，各个光纤400的端面的位置会发生偏移，且由于先对准中间位置的光纤400和波导300，越靠近两边位置的光纤400的端面位置偏移越大，与波导300的对位误差越大。随着光组件的通道(一个通道包括一个波导300和与之耦合的一个光纤400)数目不断增加，水平倒角θ的误差导致光纤400与波导300的对位误差增大。上述误差的增大进而引起不同通道的耦合损耗一致性变差，如72通道里由于0.3度倒角公差会引入0.7-2.5dB额外损耗。
本申请实施例提供一种光组件、光纤阵列单元、光芯片、电子设备以及光通信系统，以解决上述的水平倒角误差引起回损的技术问题。
请参阅图1，本申请实施例的光组件1为光电合封的结构，包括光纤阵列单 元2和光芯片3。光纤阵列单元2与光芯片3相互固定耦合，以使得光纤阵列单元2与光芯片3之间可以传输光信号。
请一并参阅图1-图3，光纤阵列单元2包括基板21、多个光纤22及盖板23。基板21具有表面211，每一光纤22位于基板21的表面211上，各个光纤22间隔且平行排列。盖板23部分覆盖各个光纤22远离基板21的一侧。也即，各个光纤22位于基板21与盖板23之间，且每个光纤22用于与光芯片3耦接的一端相对于盖板23露出。基板21作为承载光纤22的基材，每一光纤22用于传输光信号，盖板23与基板21用于共同固定和保护光纤22。本实施例中，基板21和盖板23都为玻璃。
光芯片3中包括传输光信号的结构，还可集成用于传输电信号的结构，本申请实施例中，主要对光芯片3中传输光信号的结构进行说明。
本实施例中，光芯片3包括基材31和波导层32。基材31具有上表面312，波导层32位于基材31的上表面312上。波导层32包括多根波导321(参图2)，各根波导321间隔且平行排列。每一波导321用于传输光信号。本实施例中，光纤22与波导321一一对应耦合，以实现光纤22与波导321之间的光信号传输。
在组装光组件1时，需要将光纤阵列单元2与光芯片3进行耦合，本实施例中，耦合光纤阵列单元2与光芯片3主要包括耦合光纤22与波导321。对比例中光纤与波导耦合时由于误差的存在导致难以降低回损，本申请中通过改善光纤22与波导321的角度匹配从而实现降低回损。
本申请实施例中，每一光纤22具有光纤端面221，每一波导321具有波导端面322，光纤端面221与波导端面322一一相对设置并进行耦合。
光纤阵列单元2中，基板21具有朝向光芯片3的基板端面212，盖板23具有朝向光芯片3的盖板端面231。光纤端面221与基板21的表面211所在平面形成一非90°的夹角，也即形成一斜面。且本实施例中，基板21的基板端面212与光纤端面221在同一平面上。基板端面212与光纤端面221在加工初期都是垂直于表面211所在平面的。在后续制程中通过一并蚀刻基板21和各个光纤22以形成如图1-图2所示的基板端面212与光纤端面221的形状。
与光纤阵列单元2相对应的，光芯片3中，每一波导321具有一波导端面322，基材31具有基材端面311。基材端面311垂直与上表面312延伸，波导端面322与基材端面311具有非零夹角。也即，波导端面322与基材端面311不位于同一平面上，这使得波导端面322形成一斜面结构。
光纤端面221与波导端面322的倾斜方向大致平行，从而便于两者耦合。
如图1所示的光纤端面221与波导端面322的结构，在垂直平面上(垂直于波导321所在平面的平面上)与基材端面311形成一非90°的夹角，本申请实施例定义为垂直倒角，这有利于降低光纤22与波导321耦合时的回损。
在前述的对比例中，光纤400与波导300形成水平倒角使得光纤400的误差从中间位置向两边位置逐渐累积，各个通道损耗一致性变差。而本申请实施例中通过形成垂直倒角取代水平倒角，即便形成倒角的过程存在误差，对于各个光纤 22来说，倒角的误差对其影响都是一致的，也即各个光纤22的倒角误差一致，不存在误差累积的情况。因此本申请实施例通过形成垂直倒角的方式有利于减小光纤22与波导321的对位误差，从而降低光纤22与波导321耦合后的回损，且提升通道损耗一致性，提升光纤22与波导321的耦合效果。
另一方面，在上述对比例中，光组件采用表面贴装技术(Surfaced Mounting Technology，SMT)使得光组件需要在回流炉内经过260摄氏度以上的高温。请再参阅图8，FAU100与光芯片200之间粘接的胶水需要耐受260摄氏度的高温回流。为降低插损，FAU100中的光纤400与光芯片200中的波导300耦合时需要填入折射率与波导300的包裹层(波导300通常具有包裹层)材料折射率匹配的胶水。由于SiO2是非常典型的包裹层材料，所以通常需要低折射率的胶水。
由此可知，胶水需要同时满足三种特性：低折射率，耐高温，足够的粘接强度，而同时满足上述三个要求难度非常高。在现有技术的耦合方式下，经过260摄氏度高温回流后，在FAU与光芯片的粘接面胶水出现明显的缺陷，粘接力大幅下降，增大了光组件的损耗和光组件的可靠性风险。
本申请实施例提供的光组件1还用于解决上述胶水的技术问题。
请参阅图4，本申请实施例中，光组件1还包括第一胶体4。第一胶体4位于光纤端面221与波导端面322之间，且与光纤端面221和波导端面322直接接触，用于耦合光纤端面221与波导端面322。每一光纤22包括纤芯和包覆纤芯的包覆层(图未示)，第一胶体4与光纤22的包覆层的材料折射率匹配。第一胶体4还具有粘性，可以用于固定光纤22与波导321。
本实施例中，光组件1还包括第二胶体5和辅助粘接件6。本实施例中，辅助粘接件6为玻璃。辅助粘接件6一端连接光纤阵列单元2，另一端连接光芯片3。光纤阵列单元2与辅助粘接件6之间填充有第二胶体5，光芯片3与辅助粘接件6之间也填充有第二胶体5。第二胶体5用于粘接光纤阵列单元2与辅助粘接件6，还用于粘接光芯片3与辅助粘接件6。也即，辅助粘接件6通过第二胶体5分别与光纤阵列单元2和光芯片3粘接，从而使得光纤阵列单元2与光芯片3相互固定。一实施例中，辅助粘接件6的一端与光纤阵列单元2的基板21连接，另一端与光芯片3具有波导层32的一侧连接。
于其他实施例中，光组件1可不包括辅助粘接件6，光纤阵列单元2的基板21朝光芯片3反向延伸形成与辅助粘接件6结构相同的连接部，并在该连接部靠近光芯片3的端部与光芯片3之间填充第二胶体5，即可直接固定基板21与光芯片3。如此，可无需额外制作辅助粘接件6。
第一胶体4主要用于使得光纤22与波导321耦合，其具有低折射率和耐高温的特性。本实施例中，第一胶体4与波导321的包覆层的折射率匹配，折射率小于等于1.44；为适应光组件后续的高温制程，第一胶体4至少耐260°高温。第二胶体5主要用于固定光纤阵列单元2与光芯片3，其具有粘接度高和耐高温的特性。因此光组件1在后续的高温制程中，第一胶体4和第二胶体5都可以保持其特性，也即第一胶体4可以保持其折射率匹配光纤22的 包覆层的折射率的特性，以保持光纤22与波导321的耦合效果，控制回损。第二胶体5可以保持较高的粘接强度使得光纤阵列单元2与光芯片3粘接牢固。
本实施例中，第二胶体5的耐热性高于第一胶体4。由于光纤阵列单元2与光芯片3主要通过第二胶体5进行固定，而主要通过第一胶体4进行耦合，第二胶体5的耐热性高于第一胶体4，可以有限保证第一胶体4的折射率要求，即便第一胶体4因为折射率要求导致耐热性不佳，光纤阵列单元2与光芯片3也可以通过第二胶体5很好地被固定，因此通过设置第二胶体5的耐热性高于第一胶体4，有利于在保证光纤阵列单元2与光芯片3的粘接强度的基础上提升耦合效果。
本实施例中，第一胶体4为硅胶，第二胶体5为环氧胶或丙烯酸树脂胶。
也即，本实施例中通过分别使用材料不同的第一胶体4和第二胶体5，使得第一胶体4具有低折射率和耐高温的特性，第二胶体5具有粘接度高和耐高温的特性，以通过第一胶体4和第二胶体5分别实现折射率匹配和固定效果，解决了光组件中采用一种胶水耦合固定光芯片与光纤阵列单元时难以同时满足低折射率、耐高温、粘接度高三种特性的技术问题。
本实施例中，由于第一胶体4和第二胶体5分别实现耦合和固定的效果，光组件1中光纤阵列单元2与光芯片3的耦合与固定效果都得到改善。
进一步的，本实施例中通过设置光纤端面221和波导端面322具有垂直倒角，改变了光纤22与波导321的角度匹配方式，显著减小了光纤22与波导321的回损，这使得第一胶体4的对回损的敏感度降低，这有利于扩大第一胶体4的材料选择范围。也即，在对比例中，采用水平倒角的方式使得光纤与波导的耦合效果较差，回损较高，此时只能采用一些特定材料的胶水才能实现折射率匹配，满足光纤与波导的耦合要求。但是在本实施例中，由于采用垂直倒角，光纤22与波导321的耦合效果得到显著改善，光纤22与波导321耦合时的回损显著降低，此时对第一胶体4的材料选取可以适当放宽，也能满足光纤22与波导321的耦合要求。因此本实施例中通过设置光纤22与波导321采用垂直倒角，还有利于扩大第一胶体4的材料选取范围。
本实施例中，盖板23具有盖板端面231，盖板端面231垂直于基板21的表面211所在平面。且在水平方向(以图4为基准)上，光纤端面221与盖板端面231具有一间隔距离。也即，光纤端面221与盖板端面231不在同一平面上也不相互连接。
请再参阅图2，本实施例中，基板21上开设有多个“V”型槽以容纳光纤22，盖板23覆盖在光纤22远离基板21的一侧，而基板21的表面211上开设V型槽之外的区域通过第三胶体(图未示)与盖板23粘接。根据前述的结构可知，第一胶体4位于波导端面322与光纤端面221之间且直接接触光纤端面221。请再参阅图4，若盖板23延伸至与光纤端面221连接，基板21与盖板23之间的第三胶体可能与第一胶体4接触，这导致在光纤端面221处存在第一胶体4与第三胶体的不同材料分界面。该不同材料分界面会影响光 纤中光信号的传播。
因此本申请实施例中，通过设置光纤端面221与盖板端面231具有一间隔距离，有利于避免第一胶体4与第三胶体接触，从而避免出现不同材料分界面，有利于保证光纤22中光信号正确传播，有利于提升光纤22与波导321的耦合效果。
本实施例中，辅助粘接件6为大致的“L”形结构，其使得辅助粘接件6与光纤阵列单元2连接的一端尽量远离第一胶体4，从而避免第一胶体4与第二胶体5接触产生不同材料分界面，影响光信号传输。也即，辅助粘接件6使得第一胶体4与第二胶体5保持间隔的状态。于其他实施例中，辅助粘接件6可为其他结构，例如弧形等，可实现前述的效果即可。
请参阅图5，于本申请一变更实施例中，光纤阵列单元2不包括盖板23，也即每一光纤22远离基板21的一侧裸露。在该变更实施例中，由于光纤阵列单元2不包括盖板23，则无需通过第三胶体粘接固定基板21与盖板23，因此便不存在不同材料分界面影响光信号传输的问题，进而无需考虑设置光纤端面221与盖板端面231具有一间隔距离。
请参阅图6，于本申请另一变更实施例中，形成垂直倒角的方式可与图1-图5中所示方式不同。
在该变更实施例中，光纤端面221和基板端面212的倾斜方向不同于图1-图5中所示的斜面结构。相应的，波导端面322的倾斜方向也不同于图1-图5中所示的斜面结构，而与光纤端面221和基板端面212大致平行，以利于光纤22与波导321的耦合。
本实施例中，因波导端面322的倾斜方向发生改变，波导端面322不与基材端面311连接，波导端面322与基材端面311形成一台阶状的结构，其中第一胶体4位于该台阶状的结构处。
图6所示的变更实施例中，由于波导端面322的倾斜方向发生改变，在光芯片3中形成波导端面322的方式需要采用曝光显影的蚀刻方式。
图6所示的变更实施例中，光组件1的结构同样适用于光纤阵列单元2不包括盖板23的情况。
本申请中，前述所有变更实施例可以实现如图1-图4中所示实施例的所有有益效果。
请参阅图7，基于同一技术构思，本申请实施例还提供了电子设备10，电子设备10包括一个或多个前述的光组件1，还包括与光组件1连接的交换芯片110。每一光组件1用于通过光纤和波导输出交互信号，交换芯片110分别与各个光组件1连接，用于根据该交互信号建立多个光组件之间的通信。电子设备10可以为电信机房、数据中心、路由器、交换机、服务器等。光组件1也可以应用于其他类型的电子设备中，本申请不做限定。
本实施例还提供一种光通信系统，该光通信系统包括多个电子设备，其中至少一个电子设备为本申请实施例中的电子设备10，各个电子设备之间通 信连接，以实现信息、数据的交互。本实施例的光通信系统，由于使用了电子设备10，电子设备10包括光组件1，可靠性较高、损耗较低。
本技术领域的普通技术人员应当认识到，以上的实施方式仅是用来说明本发明，而并非用作为对本发明的限定，只要在本发明的实质精神范围之内，对以上实施例所作的适当改变和变化都落在本发明要求保护的范围之内。

Claims (16)

  1. 一种光组件，其特征在于，包括：
    光纤阵列单元，包括基板和多个光纤，所述多个光纤位于所述基板一表面，所述多个光纤具有光纤端面，所述光纤端面所在平面与所述基板的所述表面所在平面不垂直；以及
    光芯片，包括基材和波导层，所述基材具有基材端面，所述波导层形成于所述基材一表面，所述波导层具有波导端面，所述基材端面与所述波导端面呈一非零夹角，所述光纤端面与所述波导端面耦合。
  2. 如权利要求1所述的光组件，其特征在于，所述光纤阵列单元还包括盖板；
    所述盖板部分覆盖所述多个光纤远离所述基板的一侧，所述盖板具有盖板端面，所述盖板端面与所述光纤端面不在同一平面上。
  3. 如权利要求1所述的光组件，其特征在于，所述多个光纤远离所述基板的一侧裸露。
  4. 如权利要求1-3中任一项所述的光组件，其特征在于，所述波导端面与所述基材端面连接。
  5. 如权利要求1-3中任一项所述的光组件，其特征在于，所述波导端面与所述基材的所述表面形成一台阶状结构。
  6. 如权利要求1-5中任一项所述的光组件，其特征在于，还包括：
    第一胶体，位于所述光纤端面与所述波导端面之间，用于耦合所述光纤阵列与所述波导层；以及
    第二胶体，位于所述光纤阵列单元与所述光芯片之间，用于固定所述光纤阵列单元与所述光芯片；
    所述第一胶体与所述第二胶体材料不同，所述第一胶体的粘接强度小于所述第二胶体的粘接强度。
  7. 如权利要求6所述的光组件，其特征在于，所述第二胶体的耐热性高于所述第一胶体。
  8. 如权利要求6或7所述的光组件，其特征在于，所述第一胶体与所述第二胶体间隔设置。
  9. 如权利要求6-8中任一项所述的光组件，其特征在于，所述第二胶体位于所述基板与所述光芯片之间，用于粘接所述基板与所述光芯片。
  10. 如权利要求6-8中任一项所述的光组件，其特征在于，还包括辅助粘接件，所述辅助粘接件通过所述第二胶体分别粘接所述光纤阵列单元和所述光芯片。
  11. 如权利要求6-10中任一项所述的光组件，其特征在于，所述第一胶体为硅胶；和/或，所述第二胶体为环氧胶或丙烯酸树脂胶。
  12. 一种光芯片，其特征在于，包括：
    基材，具有基材端面；以及
    波导层，形成于所述基材一表面，所述波导层具有波导端面，所述基材端面与所述波导端面呈一非零夹角，所述波导端面用于与光纤的光纤端面耦合，所述光纤位于一基板的表面上，所述光纤端面所在平面与所述基板的所述表面所在平面不垂直。
  13. 如权利要求12所述的光芯片，其特征在于，所述波导端面与所述基材端面连接。
  14. 如权利要求12所述的光芯片，其特征在于，所述波导端面与所述基材的所述表面形成一台阶状结构。
  15. 一种电子设备，其特征在于，包括：
    多个如权利要求1-11中任一项所述的光组件，每一所述光组件用于通过所述多个光纤和所述波导层输出交互信号；
    交换芯片，分别与所述多个光组件连接，用于根据所述交互信号建立所述多个光组件之间的通信。
  16. 一种光通信系统，其特征在于，包括多个通信连接的电子设备，至少一所述电子设备为如权利要求15所述的电子设备。
PCT/CN2023/102223 2022-09-01 2023-06-25 光组件、光芯片、电子设备及光通信系统 WO2024045805A1 (zh)

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