WO2024037255A1

WO2024037255A1 - Rapid mounting system and method for micro semiconductor refrigeration crystal grains

Info

Publication number: WO2024037255A1
Application number: PCT/CN2023/106849
Authority: WO
Inventors: 蔡植善; 王朝阳; 吴伟斌
Original assignee: 泉州师范学院
Priority date: 2022-08-16
Filing date: 2023-07-12
Publication date: 2024-02-22
Also published as: CN115117228A

Abstract

The present invention relates to semiconductor refrigerator production automation technology, and particularly relates to a mounting system and method for micro semiconductor refrigeration crystal grains. The system comprises a platform, wherein a Y0-axis module is transversely provided on the platform; a Z-axis module is vertically mounted on a slide carriage of the Y0-axis module; a crystal grain suction and release assembly and an identification and positioning camera assembly located on a side face of the suction and release assembly are mounted on a slide carriage of the Z-axis module; and the platform is provided with a crystal grain orientation adjusting camera mechanism located below the suction and release assembly, and is provided with a crystal grain carrier module and a flow deflector carrier module on two sides of the crystal grain orientation adjusting camera mechanism. The system is beneficial for increasing the mounting speed of micro semiconductor refrigeration crystal grains on the basis of ensuring the placement and mounting precision of the crystal grains.

Description

A rapid mounting system and method for miniature semiconductor refrigeration grains

Technical field

The invention relates to semiconductor refrigerator production automation technology, and specifically relates to a rapid mounting system and method for miniature semiconductor refrigeration grains.

Background technique

At present, in the production process of domestic semiconductor refrigeration chips, the tin dispensing process has been automated by a dispensing machine. The dispensing machine sends compressed air into a syringe or a glue bottle, and presses the glue into the inlet connected to the piston chamber. In the feeding pipe, pressure is used to perform dispensing operations. When the piston is on the up stroke, the piston chamber will be filled with glue; when the piston pushes the glue dispensing needle downward, the glue will be pressed out of the needle mouth under pressure. The amount of glue dripped out is determined by the distance of the piston's downstroke, which can be adjusted manually or controlled through programming. However, after the glue dispensing process is completed, the placement of the semiconductor cooling die on the guide plate with tin glue is mainly done manually. For micro products, the size of the grains is even smaller. Taking currently commonly used micro devices as an example, the length, width, and height of the grain size are generally within 0.5mm. During the production process, the accuracy requirement for the distance between the grains of the product is generally within 10% of the grain width, that is, within 50 microns or even higher, which greatly increases the difficulty of manual operation and requires a microscope to complete. This process method not only has low work efficiency, but also has difficulty in ensuring accuracy, thus affecting the output and performance of the product. In the automated mold placement process that replaces manual work: there are three main factors that affect the placement accuracy of semiconductor refrigeration die: ① the repetitive positioning accuracy of the robot; ② the rotational offset that occurs when the die is picked up; ③ the placement of the die rotational offset that occurs.

In the field of automation, industrial placement systems for tiny components based on machine vision require two steps of picking up and placing products, compared to single-operation dispensing systems. This requires identifying and positioning the target components at the pick-up station. After grabbing, move to the placement station and position again for position matching and placement, which greatly increases the difficulty in controlling the accuracy. Currently, in order to improve the accuracy of placement, a visual correction station is added between the two actions. Its function is It can eliminate the rotational offset error caused by the suction link.

Due to the small size of the micro-crystals, they are light in weight: the length, width and height dimensions are about 0.5mm, and the weight is about 3mg. Existing automated placement technology is limited to: ① In the suction process, for micro-die, the key to successful suction is how to align the center of the nozzle with the geometric center of the die when implementing the suction action. If the two "centers" are not aligned, after the nozzle performs the suction action, the grain will not only shift in plane, but its position in space may also rotate. This requires more accurate image recognition algorithms and higher-precision displacement control, which means higher cost investment. ② In the placement process, for micro-crystals of such a small size, after the negative pressure stops suction, the chips may still be adsorbed on the suction nozzle due to static electricity. When the suction nozzle is removed, the chips will move. Interference will also cause random spatial errors in the grains. ③In the patented technology "Micro Semiconductor Refrigeration Die Mounting Device, Patent Application Number: 202221189130.0" that has been applied for, the movement of the suction nozzle is controlled in chronological order by a three-axis module, and the die is processed from suction to placement. There is only movement control in a certain axis at each moment, resulting in limited placement speed.

technical problem

The object of the present invention is to provide a rapid mounting system and method for micro-semiconductor refrigeration crystals. This system helps to improve the accuracy of die placement on the basis of ensuring the mold placement and mounting accuracy of micro-semiconductor refrigeration crystals. Installation speed.

Technical solutions

The technical solution of the present invention is: a micro semiconductor refrigeration die rapid mounting system, including a machine platform, a Y0-axis module is arranged transversely on the machine platform, and the Y0-axis module is installed vertically on the slider There is a Z-axis module. The sliding seat of the Z-axis module is equipped with a pick-up and release component for crystals and an identification and positioning camera component located on the side of the pick-up and release component. The machine is provided with a crystal pick-up and release component below. The grain orientation adjustment camera mechanism is provided with a grain carrier module and a guide plate carrier module on both sides of the grain orientation adjustment camera mechanism.

Further, the pick-up and release assembly includes a hollow shaft stepper motor that is installed vertically and is fixedly connected to the sliding seat of the Z-axis module via a mounting base. The upper end of the hollow shaft of the hollow shaft stepper motor is equipped with a trachea rotatable joint. , a connecting seat is installed at the lower end of the hollow shaft of the hollow shaft stepper motor, and a suction nozzle is elastically connected below the connecting seat.

Further, the identification and positioning camera assembly includes an identification and positioning camera and a lens installed on the identification and positioning camera. A first coaxial light source is installed below the lens, and the suction nozzle is located below the lower surface of the first coaxial light source. The center of the nozzle is parallel to the optical center line of the identification and positioning camera and the Y-axis.

Further, the grain orientation adjustment camera mechanism includes a dovetail-type sliding table installed longitudinally on the machine table. A vertical plate is installed on the dovetail-type sliding table, and a fixed plate that can be raised and lowered is installed on the vertical plate. A grain orientation adjustment camera is installed on the lower side of the fixed plate. A lens diverter is installed on the telecentric lens of the grain orientation adjustment camera. A third lens located on the upper side of the lens diverter is installed on the cantilever end of the fixed plate. Two coaxial light sources.

Further, a dovetail slide rail is vertically provided on the vertical plate, the fixed plate is connected to the dovetail slide rail via a slide block, and hand-tightening bolts are provided on the slide block.

Further, the die carrier module includes an X1 axis module arranged longitudinally, a Y1 axis module is installed transversely on the slide seat of the X1 axis module, and a Y1 axis module is installed on the slide seat of the Y1 axis module. There is an R-axis rotary table for placing dies.

Further, the deflector carrier module includes an X2-axis module installed longitudinally, a Y2-axis module is installed transversely on the sliding seat of the X2-axis module, and the Y2-axis module is mounted on the sliding seat. A guide vane carrier platform is installed.

A method for rapid mounting of micro semiconductor refrigeration grains, including a rapid mounting system for micro semiconductor refrigeration grains. The steps are as follows:

(1) Set the photo detection position based on the Mark mark points of the two suction and placement stations, that is, the O1 point for the die carrier and the O2 point for the photo placement station;

(2) Identify and locate the micro-crystals to be absorbed and the diversion substrate to be mounted respectively;

(3) Adjust the suction height and placement height by adjusting the appropriate height through the laser displacement ranging sensor installed on the Z-axis module. The two heights are the same;

(4) The Y0 axis module moves to the O1 point of the die carrier, and the die carrier moves to the work area at the same time. Its initial position is to make the first die to be picked up at the O1 point, and the identification and positioning camera identifies the die and positions it. , the movement of the suction and release component causes the suction nozzle to move directly above the wafer to absorb the wafer, completing the suction process;

(5) After the die is absorbed, the Y0-axis module moves toward the direction of the guide plate carrier, and the camera mechanism is adjusted through the die orientation for correction;

(6) After calibration, the Y0-axis module reaches the O2 point for taking pictures at the placement station, and the diversion carrier also moves at the same time, so that the center point of the pattern to be mounted reaches the O2 point for taking pictures at the placement station, and the positioning camera identifies the positioning of the diversion base. After the chip is identified and positioned, the pick-and-place component is micro-controlled to blow air directly above it and released completely to complete the placement process. Since then, the swing mold of a die has been completed;

(7) Repeat steps (4) ~ (6) to complete the automatic placement of the micro-die on the entire guide substrate.

beneficial effects

1. This invention is based on the mounting technology of the patented technology "Micro Semiconductor Cooling Die Mounting Device" (patent application number: 202221189130.0), which is based on the original die absorption, orientation correction and mounting operations. The process has been improved, and the die source coordinate control, placement coordinate control and visual correction links have been improved. On the basis of ensuring the mold placement and placement accuracy of the micro semiconductor cooling die, the die placement speed has been increased.

2. During the placement process, the movement control of the die carrier, the movement control of the guide sheet carrier and the Y-axis movement control can be performed simultaneously to increase the placement speed.

3. By installing a die orientation adjustment camera mechanism, a single die can be rotated and adjusted to improve the flexibility of the die position adjustment action, making it easy to correct the die orientation and quickly mount.

Description of drawings

Figure 1 is a structural diagram of the die mounting system of the present invention;

Figure 2 is a structural diagram of the suction and release assembly of the present invention;

Figure 3 is a structural diagram of the die carrier of the present invention;

Figure 4 is a structural diagram of the guide vane carrier of the present invention;

Figure 5 is a structural diagram of the crystal grain orientation adjustment camera mechanism of the present invention;

Figure 6 is a schematic diagram of the die mounting process of the present invention;

Figure 7 shows the effect of the cooling chip after the die mounting and welding of the upper and lower guide substrates of the present invention;

In the picture: 1-Y0 axis module; 2. Z-axis module; 3. Identification and positioning camera component; 31. First coaxial light source; 4. Suction and release component; 41. Suction nozzle; 42. Spring; 43. Connection 44. Hollow shaft stepper motor; 45. Air pipe rotatable joint; 46. Mounting seat; 5. Guide plate carrier module; 51. X2 axis module; 52. Y2 axis module; 53. Limit Switch; 54. Guide plate carrier platform; 6. Dovetail slide; 61. Vertical plate; 62. Fixed plate; 63. Dovetail slide rail; 64. Slider; 65. Hand-tightening bolts; 7. Grain orientation adjustment Camera mechanism; 71. Grain orientation adjustment camera; 72. Telecentric lens; 73. Lens steering device; 74. Second coaxial light source 8. Grain carrier module; 81. X1 axis module; 82. Y1 axis Module; 83. R-axis rotary table; 84. R-axis rotary table driver; 9. Crystal grain; 10. Diversion substrate.

Embodiments of the invention

In order to make the above-mentioned features and advantages of the present invention easier to understand, embodiments are given below and described in detail along with the accompanying drawings, but the present invention is not limited thereto.

Refer to Figure 1 to Figure 7

A rapid mounting system for micro-semiconductor cooling wafers, including a machine platform on which a Y0-axis module 1 is installed horizontally, and a Z-axis module 2 is installed vertically on the slide of the Y0-axis module , The slide seat of the Z-axis module is equipped with a die pickup and release component 4 and an identification and positioning camera component 3 located on the side of the pickup and release component. The machine is equipped with a die orientation adjustment located below the pickup and release component. The camera mechanism 7 is provided with a die carrier module 8 and a guide plate carrier module 5 on both sides of the die orientation adjustment camera mechanism.

In this embodiment, the pick-up and release assembly includes a hollow shaft stepper motor 44 that is installed vertically and is fixedly connected to the sliding seat of the Z-axis module via a mounting base 46. The upper end of the hollow shaft of the hollow shaft stepper motor is installed with a The trachea rotatable joint 45 is installed with a connecting seat 43 at the lower end of the hollow shaft of the hollow shaft stepper motor, and a suction nozzle 41 is elastically connected below the connecting seat. The suction nozzle is provided with an annular flange. The suction nozzle is provided with a spring 42 whose lower end abuts on the annular flange and whose upper end abuts the connecting seat, so as to achieve elastic connection between the suction nozzle and the connecting seat. When the suction nozzle is working again, it moves in the Y-axis direction through the Y0-axis module, to and from the die carrier module and the guide plate carrier module, and is raised and lowered through the Z-axis module. You can control the positive pressure of the suction nozzle by controlling the solenoid valve and the pressure regulating valve, and add appropriate blowing actions during placement to ensure that the crystal grains are completely released and avoid interference when the suction nozzle is removed.

In this embodiment, taking the suction of semiconductor refrigeration grains of 0.5mm*0.5mm*1.5mm as an example, a suction nozzle with a diameter of 0.30mm is used, and the grain suction height and release height are selected to press the position of 0.10mm in the spring state.

In this embodiment, the identification and positioning camera assembly includes an identification and positioning camera and a lens installed on the identification and positioning camera. A first coaxial light source 31 is installed below the lens, and the suction nozzle is located below the first coaxial light source. Below the surface, the center of the nozzle is parallel to the optical center line of the identification and positioning camera and the Y-axis.

Identifying the die on the die carrier and identifying the guide pattern on the guide plate carrier both use the lens of the identification and positioning camera assembly. When starting the operation, fine-tune the die identification station and the guide plate placement station respectively so that the die pickup point and the guide plate placement point are at the center of the respective camera field of view, which are two fixed points (let’s call them the die for the time being). (O1 point of the carrier and O2 point of the placement station photo), the suction nozzle only reciprocates between these two fixed points to achieve the suction and placement actions.

In this embodiment, the grain orientation adjustment camera mechanism includes a dovetail-type sliding table 6 installed longitudinally on the machine table. In order to achieve longitudinal position adjustment, hand-tightening bolts are provided on the dovetail-type sliding table to limit its sliding The location of the stage. A vertical plate 61 is installed on the dovetail slide, and a fixed plate 62 that can be adjusted up and down is installed on the vertical plate. A grain orientation adjustment camera 71 is installed on the lower side of the fixed plate. The grain orientation adjustment camera 71 is installed on the lower side of the fixed plate. A lens diverter 73 is installed on the telecentric lens 72, and a second coaxial light source 74 located on the upper side of the lens diverter is installed on the cantilever end of the fixed plate.

In this embodiment, in order to realize the lifting adjustment of the fixed plate, a dovetail slide rail 63 is provided vertically on the vertical plate. The fixed plate is connected to the dovetail slide rail through a slide block 64. A hand-tightening slide rail is provided on the slide block. Bolt 65.

In this embodiment, the grain orientation adjustment camera mechanism is arranged on the moving line of the grain and below the grain (between O1 and O2 points), and uses the lens diverter 73 to perform 90º light path direction conversion, so that the horizontal installation The camera can capture the orientation of the die on the suction nozzle from below the die to facilitate image recognition and adjustment of the die orientation so that it can be mounted smoothly.

In this embodiment, in order to provide the dies that need to be sucked, the die carrier module includes an X1-axis module 81 arranged longitudinally, and a Y1-axis module 82 is installed laterally on the sliding seat of the X1-axis module. , the slide seat of the Y1-axis module is equipped with an R-axis rotary table 83 for carrying dies, and the table top of the R-axis rotary table forms a wafer carrier platform. Whenever the pick-and-place component picks up and mounts a die, the X1-axis module and Y1-axis module can move the next die according to the preset path direction and movement parameters with the support of the visual recognition algorithm. When the center point moves to point O1, the R-axis rotary table can fine-tune the rotating die carrier with the support of the visual recognition algorithm so that the edge direction of the die is adjusted to be basically parallel to the X and Y axes for easy placement.

In this embodiment, as a target board for die placement and mounting, the guide plate carrier module includes an X2-axis module 51 arranged longitudinally, and a slider mounted transversely on the X2-axis module Y2 axis module 52, the guide plate carrier platform 54 is installed on the sliding seat of the Y2 axis module. The deflector carrier module is also provided with a limit switch 53 to limit the movement position of the slide seat of the X2-axis module and the slide seat of the Y2-axis module. The die mounting coordinate position can be defined in advance according to the PCB pattern and pad size of the guide plate. Whenever the pick-and-place component picks up and mounts a die, the movement control of the X2-axis module and Y2-axis module can be Automatically move the coordinates of the next placement position to point O2.

In this embodiment, the Y0 axis module, Z axis module, X1 axis module, X2 axis module, Y1 axis module, and Y2 axis module may be linear modules respectively.

In this embodiment, the system also includes a pick-up and release control unit and a motion control module for the pick-up and release components. The motion control module includes the coordinate position control of each module mentioned above and the connection control of each action in the placement process.

In this embodiment, during the suction and placement process of the suction nozzle, the die carrier module and the guide sheet carrier module can be synchronously shifted and controlled so that the next die to be sucked is always at O1 The position of the guide plate of the next die to be mounted is always at the O2 position, which can significantly increase the placement speed.

(4) The Y0 axis module moves to the O1 point of the die carrier, and the die carrier moves to the work area at the same time. Its initial position is to make the first die to be picked up at the O1 point, and the identification and positioning camera identifies the die and positions it. , the suction and release component uses the coordinated movement of each module to move the suction nozzle directly above the die to suck the expanded die in Figure 6(a), completing the suction process;

(5) After the die is sucked, the Y0-axis module moves towards the direction of the guide sheet carrier, and is calibrated by the die orientation adjustment camera mechanism. The purpose of the correction is to make the die orientation on the suction nozzle consistent with the one to be mounted. The diversion pattern is matched for easy mounting;

(6) After calibration, the Y0-axis module reaches the O2 point for taking pictures at the placement station, and the diversion carrier also moves at the same time, so that the center point of the pattern to be mounted reaches the O2 point for taking pictures at the placement station, and the positioning camera identifies the positioning of the diversion base. After the chip is identified and positioned, the pick-and-place component is micro-controlled to blow air directly above it and released completely, so that the die is placed on the diversion substrate with solder glue in Figure 6(b) to complete the mounting process. A swing mold of the grain is obtained;

(7) Repeat steps (4) ~ (6) to complete the automatic placement of the micro-crystals on the entire diversion substrate. The placement effect is shown in Figure 6(c). The above process is repeated for the placement of the next die. After initialization and setting through the host computer interface, the entire process is fully automated.

The above are only preferred embodiments of the present invention. For those of ordinary skill in the art, it is not necessary to design different forms of rapid mounting methods and devices for micro semiconductor refrigeration die based on the teachings of the present invention. Creative work, without departing from the principle and spirit of the invention, all equivalent changes, modifications, substitutions and modifications made in accordance with the patent scope of the invention shall fall within the scope of the invention.

Claims

A rapid mounting system for micro-semiconductor refrigerated crystal grains, including a machine platform, characterized in that a Y0-axis module is installed horizontally on the machine platform, and a Z-axis is installed vertically on the slide of the Y0-axis module Module, the sliding seat of the Z-axis module is equipped with a die pickup and release component and an identification and positioning camera component located on the side of the pick-up and release component. The machine is provided with a crystal orientation adjustment located below the pickup and release component. The camera mechanism is provided with a grain carrier module and a guide plate carrier module on both sides of the camera mechanism for adjusting the grain orientation.
A rapid mounting system for micro-semiconductor refrigerated wafers according to claim 1, characterized in that the pick-up and release assembly includes a hollow shaft arranged vertically and fixedly connected to the slide seat of the Z-axis module through a mounting seat. Stepper motor, the upper end of the hollow shaft of the hollow shaft stepper motor is equipped with a trachea rotatable joint, the lower end of the hollow shaft of the hollow shaft stepper motor is installed with a connecting seat, and a suction nozzle is elastically connected below the connecting seat.
A micro semiconductor refrigeration die rapid mounting system according to claim 2, characterized in that the identification and positioning camera assembly includes an identification and positioning camera and a lens installed on the identification and positioning camera, and a lens is installed below the lens. The first coaxial light source, the suction nozzle is located below the lower surface of the first coaxial light source, and the center of the suction nozzle is parallel to the line connecting the optical center of the identification and positioning camera and the Y-axis.
A micro-semiconductor refrigeration die rapid mounting system according to claim 1, 2 or 3, characterized in that the die orientation adjustment camera mechanism includes a dovetail-type slide installed longitudinally on the machine table, so A vertical plate is installed on the dovetail slide, and a fixed plate that can be lifted and lowered is installed on the vertical plate. A grain orientation adjustment camera is installed on the lower side of the fixed plate, and a telecentric lens of the grain orientation adjustment camera is installed on the lower side of the fixed plate. A lens diverter is installed on the fixed plate, and a second coaxial light source located on the upper side of the lens diverter is installed on the cantilever end of the fixed plate.
A micro semiconductor refrigeration die rapid mounting system according to claim 4, characterized in that a dovetail slide rail is vertically provided on the vertical plate, and the fixed plate is connected to the dovetail slide rail through a slider. , the slider is provided with hand-tightening bolts.
A micro semiconductor refrigeration die rapid mounting system according to claim 1, characterized in that the die carrier module includes an X1 axis module arranged longitudinally, and the slider of the X1 axis module A Y1-axis module is installed transversely on the seat, and an R-axis rotating table for placing dies is installed on the sliding seat of the Y1-axis module.
A miniature semiconductor refrigeration die rapid mounting system according to claim 1, 2, 3, 5 or 6, characterized in that the guide plate carrier module includes an X2 axis module arranged longitudinally , the Y2-axis module is laterally installed on the sliding seat of the X2-axis module, and the guide plate carrier platform is installed on the sliding seat of the Y2-axis module.
A method for rapid mounting of micro-semiconductor refrigerated crystal grains, including a rapid mounting system of micro-semiconductor refrigerated crystal grains according to claim 2, characterized in that the steps are as follows:

(1) Set the photo detection position based on the Mark mark points of the two suction and placement stations, that is, the O1 point for the die carrier and the O2 point for the photo placement station;

(2) Identify and locate the micro-crystals to be absorbed and the diversion substrate to be mounted respectively;

(3) Adjust the suction height and placement height by adjusting the appropriate height through the laser displacement ranging sensor installed on the Z-axis module. The two heights are the same;

(4) The Y0 axis module moves to the O1 point of the die carrier, and the die carrier moves to the work area at the same time. Its initial position is to make the first die to be picked up at the O1 point, and the identification and positioning camera identifies the die and positions it. , the movement of the suction and release component causes the suction nozzle to move directly above the wafer to absorb the wafer, completing the suction process;

(5) After the die is absorbed, the Y0-axis module moves toward the direction of the guide plate carrier, and the camera mechanism is adjusted through the die orientation for correction;

(6) After calibration, the Y0-axis module reaches the O2 point for taking pictures at the placement station, and the diversion carrier also moves at the same time, so that the center point of the pattern to be mounted reaches the O2 point for taking pictures at the placement station, and the positioning camera identifies the positioning of the diversion base. After the chip is identified and positioned, the pick-and-place component is micro-controlled to blow air directly above it and released completely to complete the placement process. Since then, the swing mold of a die has been completed;

(7) Repeat steps (4) ~ (6) to complete the automatic placement of the micro-die on the entire guide substrate.