WO2024036983A1 - 一种抛光垫 - Google Patents

一种抛光垫 Download PDF

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Publication number
WO2024036983A1
WO2024036983A1 PCT/CN2023/086148 CN2023086148W WO2024036983A1 WO 2024036983 A1 WO2024036983 A1 WO 2024036983A1 CN 2023086148 W CN2023086148 W CN 2023086148W WO 2024036983 A1 WO2024036983 A1 WO 2024036983A1
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Prior art keywords
polyamine composition
mass
parts
composition
polyamine
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PCT/CN2023/086148
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English (en)
French (fr)
Inventor
罗乙杰
陈博
张季平
高越
刘敏
蔡龙丹
Original Assignee
湖北鼎汇微电子材料有限公司
湖北鼎龙控股股份有限公司
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Application filed by 湖北鼎汇微电子材料有限公司, 湖北鼎龙控股股份有限公司 filed Critical 湖北鼎汇微电子材料有限公司
Publication of WO2024036983A1 publication Critical patent/WO2024036983A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Definitions

  • the present invention relates to the technical field of polishing by chemical mechanical planarization, and in particular, to a polishing pad.
  • CMP technology is a method of placing the surface of the workpiece to be processed downward, applying a certain pressure to the polishing pad, and using the polishing medium under the condition of flowing polishing fluid medium (a mixture composed of nanoparticles, chemical oxidants and liquid media).
  • polishing fluid medium a mixture composed of nanoparticles, chemical oxidants and liquid media.
  • planarization technologies such as selective deposition based on deposition technology, sputtered glass SOG, low-pressure CVD, plasma-enhanced CVD, bias sputtering and post-sputtering corrosion belonging to the structure, thermal reflow, deposition-etch- Deposition, etc., although they can also provide a "smooth" surface, are all local planarization technologies and cannot achieve global planarization.
  • the purpose of the present invention is to provide a polishing pad with high life stability and suitable for mature processes.
  • a first aspect of the present invention provides a polishing pad, comprising a polishing layer, the polishing layer comprising a polyurethane base material, the polyurethane base material comprising a multifunctional isocyanate, a polyol composition and a polyamine composition obtained by reacting, the polyurethane base material is
  • the amine composition includes one and/or multiple diamines and/or triamines and/or trivalent or higher polyamines.
  • the average molecular weight of the polyamine composition is between 200 and 400.
  • the polyvalent amines The average functionality of the amine composition is greater than 2 and not higher than 2.20.
  • the proportion of diamine and triamine in the polyamine composition to the total amount of the polyamine composition is between 77% and 96%: Between 3% and 12%.
  • a second aspect of the present invention provides a polishing pad, comprising a polishing layer, the polishing layer comprising a polyurethane base material, the polyurethane base material comprising a multifunctional isocyanate, a polyol composition and a polyamine composition obtained by reacting, and the polyurethane base material is obtained by reaction.
  • the amine composition includes one and/or multiple diamines and/or triamines and/or trivalent or higher polyamines.
  • the average molecular weight of the polyamine composition is between 200 and 400.
  • the polyvalent amines The average functionality of the amine composition is greater than 2 and not higher than 2.20, and the proportions of diamine and tetraamine in the total amount of the polyamine composition in the polyamine composition are between 77% and 96%: 0.1% and between 10%.
  • the trivalent or higher polyamines include tetravalent amines, and the proportion of the tetravalent amines in the total amount of the polyamine composition is between 0.1% and 10%;
  • diamine and/or triamine and/or a trivalent or higher polyamine includes a compound shown in Structural Formula 1:
  • X in Structural Formula 1 means that it contains carbon atoms or it means that it contains one or more combinations of the structural fragments shown in Structural Formula 2 or Structural Formula 3;
  • the polyamine composition contains free chloride ions, and the content of the free chloride ions is less than 900 ppm.
  • the total average functionality of the polyol composition and the polyamine composition is not higher than 2.2;
  • the multifunctional isocyanate includes one or more combinations of aromatic isocyanate or aliphatic isocyanate;
  • the aromatic isocyanate includes 2,4-toluene diisocyanate, 2,6- Toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, p-phenylene
  • the aliphatic isocyanate includes ethylene diisocyanate, 2,2, 4-Trimethylhexamethylene diisocyanate, 1,6-hexamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, is
  • the polyol composition includes polytetramethylene ether glycol, polyethylene glycol, polypropylene glycol, ethylene glycol, 1,3-butanediol, 1,4-butanediol, and diethylene glycol. , one or more of neopentyl glycol, 2-methyl-1,3-propanediol, hexanediol, 3-methyl-1,5-pentanediol, 1,4-cyclohexanedimethanol combination;
  • the density of the polishing layer is between 0.4 and 1.1g/cm 3 , and the Shore hardness is between 15 and 85D;
  • the polishing pad includes a buffer layer, an adhesive layer and a back-adhesive layer.
  • the polishing pad is arranged from top to bottom as: a polishing layer, an adhesive layer, a buffer layer and a back-adhesive layer.
  • the adhesive layer is used for bonding the polishing layer and the buffer layer.
  • the adhesive layer is used for bonding the polishing pad and the polishing machine table.
  • the adhesive layer also includes release paper or release film.
  • a third aspect of the present invention provides a polyamine composition, including one and/or multiple diamines and/or triamines and/or trivalent or higher polyamines.
  • the average molecular weight of the polyamine composition is between Between 200 and 400, the average functionality of the polyamine composition is greater than 2 and not higher than 2.20.
  • the proportions of diamines and triamines in the polyamine composition to the total amount of the polyamine composition are between Between 77% and 96%: between 3% and 12%.
  • the fourth aspect of the present invention provides a polyamine composition, including one and/or multiple diamines and/or triamines and/or trivalent or higher polyamines.
  • the average molecular weight of the polyamine composition is between Between 200 and 400, the average functionality of the polyamine composition is greater than 2 and not higher than 2.20, and the In the polyamine composition, the proportions of diamine and tetraamine in the total amount of the polyamine composition range from 77% to 96% and from 0.1% to 10% respectively.
  • polyamines above triamine include tetraamine, and the proportion of the tetraamine in the total amount of the polyamine composition is between 0.1% and 10%;
  • diamine and/or triamine and/or the polyamine of three or more valences include compounds represented by structural formula 1:
  • X in Structural Formula 1 means that it contains carbon atoms or it means that it contains one or more combinations of the structural fragments shown in Structural Formula 2 or Structural Formula 3.
  • the polyamine composition includes free chloride ions, and the content of the free chloride ions is less than 900 ppm.
  • a fifth aspect of the present invention provides a polishing layer, which is obtained by reacting the polyamine composition as described in any one of the above with a multifunctional isocyanate and polyol composition.
  • a sixth aspect of the present invention provides a polishing pad, comprising a polishing layer, the polishing layer comprising a polyurethane base material, the polyurethane base material comprising a multifunctional isocyanate, a polyol composition and a polyamine composition obtained by reacting, and the polyurethane base material is obtained by reaction.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is between 5 and 30:
  • Measurement sample Take 0.0204g of the polyamine composition and add methanol to a total mass of 20.0026g. Take 0.2ml of the above solution and add methanol to 2ml and mix to form a 100ppm solution. Take the above 100ppm solution. Add methanol to 0.2ml of solution to 2ml and mix to form a 10ppm solution;
  • Chromatographic column ZORBAX Eclipse XDB-C18 manufactured by Aglient, 4.6*250mm, 5-Micron;
  • UV detector wavelength 254nm
  • a seventh aspect of the present invention provides a polishing pad, comprising a polishing layer, the polishing layer comprising a polyurethane base material, the polyurethane base material comprising a polyfunctional isocyanate, a polyol composition and a polyamine composition obtained by reacting, and the polyurethane base material is obtained by reaction.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 14.2 to 16 min is between 10 and 400.
  • Measurement sample Take 0.0204g of the polyamine composition and add methanol to a total mass of 20.0026g. Take 0.2ml of the above solution and add methanol to 2ml and mix to form a 100ppm solution. Take 0.2ml of the above 100ppm solution and add methanol to 2ml and mix to form a 10ppm solution;
  • Chromatographic column ZORBAX Eclipse XDB-C18 manufactured by Aglient, 4.6*250mm, 5-Micron;
  • UV detector wavelength 254nm
  • An eighth aspect of the present invention provides a polishing pad, including a polishing layer containing polyurethane Ester base material, the polyurethane base material includes a multifunctional isocyanate, a polyol composition and a polyamine composition obtained through the reaction, and the polyamine composition is obtained by performing liquid chromatography analysis under the following conditions.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 minutes, the peak area with a retention time of 10 to 11 minutes, and the peak area with a retention time of 14.2 to 16 minutes is between: 360 to 450: 15 to 45: 1 to 40;
  • Measurement sample Take 0.0204g of the polyamine composition and add methanol to a total mass of 20.0026g. Take 0.2ml of the above solution and add methanol to 2ml and mix to form a 100ppm solution. Take 0.2ml of the above 100ppm solution and add methanol to 2ml and mix to form a 10ppm solution;
  • Chromatographic column ZORBAX Eclipse XDB-C18 manufactured by Aglient, 4.6*250mm, 5-Micron;
  • UV detector wavelength 254nm
  • the polishing pad provided by the invention has a polyurethane base material with a certain degree of cross-linking in the polishing layer, and uses materials with multi-functionality to control the degree of cross-linking.
  • the formed polishing layer has higher life stability, and has wider applicability to diamond dressing discs with different cutting capabilities. range, thereby achieving more stable performance.
  • the degree of cross-linking can be more conveniently adjusted, more appropriate mechanical properties can be adjusted, and a more stable removal rate performance can be achieved during the polishing process.
  • Figure 1 is a schematic diagram of the polishing operation process of the polishing pad in the embodiment of the present invention.
  • Figure 2 is a schematic diagram of a polishing pad provided by an embodiment of the present invention.
  • Figure 3-1 is a fitting relationship diagram between the liquid phase peak area and concentration of the diamine LC-MS involved in the present invention
  • Figure 3-2 is a fitting relationship diagram between the liquid phase peak area and concentration of the triamine LC-MS involved in the present invention
  • Figure 3-3 is a fitting relationship diagram between the liquid phase peak area and concentration of the quaternary amine LC-MS involved in the present invention
  • Figure 4-1 is a schematic diagram of the liquid phase peak area of the diamine LC-MS involved in the present invention.
  • Figure 4-2 is a schematic diagram of the liquid phase peak area of the triamine LC-MS involved in the present invention.
  • Figure 4-3 is a schematic diagram of the liquid phase peak area of the quaternary amine LC-MS involved in the present invention; 1-Material to be polished; 2-Polishing pad; 3-Polishing machine; 4-Bracket; 5-Polishing fluid; 20-Polishing layer; 21-Adhesive layer; 22-Buffer layer; 23-Back adhesive layer.
  • a semiconductor wafer generally refers to a wafer in which wiring metal and an oxide film are laminated on a silicon wafer.
  • the manufacturing method of a semiconductor device of the present invention includes the use of polishing pads. pads on the surface of the semiconductor wafer The polishing process has no special restrictions on the polishing device.
  • the polishing device as shown in FIG. 1 is used.
  • the polishing device has a polishing machine table 3 supporting a polishing pad 2, and a backing plate for uniformly pressurizing the holder 4 supporting the semiconductor wafer 1, the material to be polished, and the wafer. lining material and polishing fluid 5 supply mechanism.
  • the polishing pad 2 is mounted on the polishing machine table 3 by adhesion with an adhesive layer, for example.
  • the polishing machine table 3 and the holder 4 are arranged so that the polishing pad 2 and the semiconductor wafer 1 they support face each other, and each has a rotation axis.
  • a pressing mechanism for pressing the semiconductor wafer 1 onto the polishing pad 2 is provided on one side of the holder 4 .
  • polishing machine table 3 and the holder 4 are rotated, the semiconductor wafer 1 is pressed onto the polishing pad 2, and polishing is performed while supplying slurry.
  • polishing machine speed There are no special restrictions on the slurry flow rate, polishing load, polishing machine speed and wafer speed, and can be adjusted appropriately.
  • the protruding portion on the surface of the semiconductor wafer 1 is removed and polished into a flat shape.
  • semiconductor devices are manufactured through dicing, welding, packaging, etc., and the semiconductor devices are used in computing processing devices, storage devices, and the like.
  • the polishing pad in the present invention includes a polishing layer 20, a buffer layer 22, an adhesive layer 21 and a backing adhesive layer 23.
  • the polishing pad in the present invention is sequentially arranged from top to bottom as the polishing layer 20, the adhesive layer 20 and the adhesive layer 23.
  • the adhesive layer 21 is used to bond the polishing layer 20 and the buffer layer 22.
  • the adhesive layer 23 also contains a release film or release paper, which can be torn off during use. Release film or release paper can realize the bonding between polishing pad and polishing machine.
  • the polishing layer in the present invention has a certain degree of cross-linking.
  • the polishing layer is a closed-cell elastomer formed by a continuous polyurethane base material with pore separation of 5 to 100 ⁇ m.
  • the polyurethane base material contains one of thermoplastic polyurethane or thermosetting polyurethane. Or a combination of both.
  • the density of the polishing layer is between 0.4 and 1.1g/cm 3 .
  • the density of the polishing layer is between 0.5 and 1.06g/cm 3 .
  • the density of the polishing layer is between 0.51 and 1.06g/cm 3 .
  • 1.0g/cm 3 The Shore hardness of the polishing layer is between 15 and 85D.
  • the Shore hardness of the polishing layer is between 40 and 70D.
  • the Shore hardness of the polishing layer is between 52 and 68D. between.
  • the multifunctional isocyanate includes but is not limited to one or more combinations of aromatic isocyanate or aliphatic isocyanate. It is preferable to use more than 80 mol% of aromatic isocyanate, and more preferably to use more than 95 mol% of aromatic isocyanate. It is particularly preferred to use more than 95 mol% of aromatic isocyanate. 100 mol% aromatic isocyanate.
  • Aromatic isocyanates include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diisocyanate
  • Aliphatic isocyanates include ethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 1,6-hexamethylene diisocyanate, 1,4-cyclohexane diisocyanate, 4,4 '-One or more combinations of dicyclohexylmethane diisocyanate, isophorone diisocyanate, and norbornane diisocyanate.
  • the polyol composition of the present invention may include polyether-based high molecular weight glycols, where the polyether-based high molecular weight glycols include but are not limited to polytetramethylene ether glycol (PTMEG), polyethylene glycol (PEG), polypropylene glycol (PPG), and one or more of polytetramethylene ether glycol-polyethylene glycol, polytetramethylene ether glycol-polypropylene glycol, polyethylene glycol-polypropylene glycol A combination, or a polymer polyol formed by homopolymerization or copolymerization of ethylene glycol, propylene glycol, butylene glycol or an initiator with two hydroxyl groups and the above three small molecule diols, or multiple combinations.
  • PTMEG polytetramethylene ether glycol
  • PEG polyethylene glycol
  • PPG polypropylene glycol
  • polytetramethylene ether glycol-polyethylene glycol polytetramethylene
  • the polyol composition of the present invention may contain small molecule diols, wherein small molecules include but are not limited to ethylene glycol, 1,3-butanediol, 1,4-butanediol, diethylene glycol, and neopentyl glycol.
  • small molecules include but are not limited to ethylene glycol, 1,3-butanediol, 1,4-butanediol, diethylene glycol, and neopentyl glycol.
  • the polyol composition of the present invention may also include polyester-based polyols, wherein the polyester-based polyols are obtained by the condensation reaction of diols or diols/phenols and dibasic acids, wherein the diols include Ethylene glycol, 1,3-butanediol, 1,4-butanediol, diethylene glycol, neopentyl glycol, 2-methyl-1,3-propanediol, hexanediol, 3-methyl-1 , one or more combinations of 5-pentanediol and 1,4-cyclohexanedimethanol.
  • the polyester-based polyols are obtained by the condensation reaction of diols or diols/phenols and dibasic acids, wherein the diols include Ethylene glycol, 1,3-butanediol, 1,4-butanediol, diethylene glycol, neopentyl glycol, 2-methyl-1
  • the glycol includes one or both of 1,4-butanediol and hexanediol.
  • glycols/phenols are hydroquinone, resorcinol, naphthodiol, bisphenol A, bisphenol S, terephthalol, isophthalol, phthalophthalol, 2,5-furan
  • the diol/phenol is one or a combination of hydroquinone and terephthalenedimethanol
  • the acid is one or more combinations of succinic acid, adipic acid, azelaic acid, and subebic acid.
  • the polyol composition in the present invention may also include a polyol obtained by mixing a polyether or polyester formed by a small molecular polyol with a functionality greater than 2 as an initiator and a diol with a functionality of 2; or a polyol with a functionality greater than 2.
  • Small molecule polyols with a functionality greater than 2 can be listed but are not limited to: one or more combinations of glycerol, pentaerythritol, trimethylolpropane, propylene tetraol oxide, xylitol, sorbitol, and mannitol.
  • the above-mentioned average functionality is the arithmetic average of the number of hydroxyl groups in each molecule.
  • the number average molecular weight of the polyol is between 500 and 3000.
  • the polyether polyol can be a single Polyether polyols with a number average molecular weight between 500 and 3000, or a mixture of two or more polyether polyols with a number average molecular weight between 500 and 3000, or one with a number average molecular weight greater than 5000
  • the polyether is mixed with small molecule ethylene glycol, butylene glycol, and sorbitol to obtain a mixture of polyether and/or small molecule polyol with a number average molecular weight between 500 and 3000.
  • the polyurethane base material in the present invention can be manufactured by using known polyurethanization technologies such as melting method and solution method, and can also be manufactured by any of conventional methods such as prepolymer method and one-time injection method.
  • the prepolymer method is The isocyanate-terminated prepolymer is first synthesized from the components of the multifunctional isocyanate and polyol composition and reacted with the polyamine composition; the one-time injection method is to perform the multifunctional isocyanate, polyol composition and polyamine composition in one step reaction; in the present invention, it is preferred to use the prepolymer method to synthesize the polyurethane base material.
  • the above-mentioned isocyanate-terminated prepolymer can be obtained by reacting the above-mentioned multifunctional isocyanate and a polyol composition, or can be obtained by purchasing commercially available prepolymer products.
  • isocyanate-terminated prepolymers include but are not limited to a series of prepolymers produced by Chemtura: L325, LF800A, LF900A, LF910A, LF930A, LF931A, LF939A, LF950A, LF952A, LF600D, LF601D, Any one or combination of LF650D, LF667D, LF700D, LF750D, LF751D, LF752D, LF753D, LFG963A, LFG964A, LFG740D.
  • the isocyanate-terminated prepolymer of the present invention contains 6.0 to 9.5 wt% of unreacted isocyanate groups (-NCO).
  • the isocyanate-terminated prepolymer of the present invention contains 8.0 to 9.5 wt. % of unreacted isocyanate groups (-NCO).
  • the isocyanate-terminated prepolymer of the present invention contains 8.5 to 9.5 wt% of unreacted isocyanate groups (-NCO).
  • the polyamine composition includes one and/or multiple diamines and/or trivalent and above polyamine compositions, wherein the average molecular weight of the polyamine composition is between 200 and 400, and the polyamine composition
  • the average functionality of the curing agent composition is greater than 2 and not higher than 2.20.
  • the average functionality of the curing agent composition is not less than 2.01 and not higher than 2.15.
  • the average functionality of the polyamine composition is not less than 2.01. And not higher than 2.09, taking into account the influence of polymer micromorphology on the performance of the polishing layer.
  • the invention provides a polyamine composition, in which diamines and triamines respectively account for the polyamine group.
  • the ratio of the total amount of the compound is between 77% and 96%: 3% and 12%, preferably between 87% and 95%: 4% and 11%, particularly preferably between 87% and 91%: 6 % to 10%, the total amount of diamine does not exceed 96%.
  • the reason is that when the diamine exceeds 96%, the polishing effect of the polishing pad is poor.
  • the content of diamine should not be too low. When the content of metaamine is less than 77%, the polishing life of the polishing pad will be insufficient.
  • the proportion of a single component amine compound to the total amount of the polyamine composition is mass percentage, and the proportions of other component amine compounds to the total amount of the polyamine composition are all mass percent.
  • the polyamine composition also contains three or more polyamines, wherein the three or more polyamines include common polyamines such as tetra-, penta-, hexa-, hepta- and octa-amines.
  • common polyamines such as tetra-, penta-, hexa-, hepta- and octa-amines.
  • tetravalent amines and pentavalent amines are preferred, and tetravalent amines are particularly preferred; as a preferred embodiment, in the polyamine composition containing tetravalent amines, diamines are preferred.
  • the proportions of monoamine, triamine and tetraamine in the total amount of the polyamine composition respectively range from 77% to 96%: 3% to 12%: 0.1% to 10%.
  • diamine, triamine The proportions of primary amines and quaternary amines in the total amount of the polyamine composition are between 87% to 95%: 4% to 11%: 0.1% to 2%.
  • the content of triamines and tetraamines should not be too high. , Excessive amounts of tri- and quaternary amines will reduce the service life of the polishing pad.
  • the invention also provides a polyamine composition including diamine and tetraamine, wherein the proportions of diamine and tetraamine in the total amount of the polyamine composition are between 77% and 96%: 0.1% and 0.1%, respectively.
  • the average molecular weight of the polyamine composition is between 200 and 400, and the average functionality of the polyamine composition is greater than 2 and not higher than 2.20.
  • the average functionality of the curing agent composition is not more than 2.20.
  • Lower than 2.01 and not higher than 2.15, particularly preferably, the average functionality of the polyamine composition is not lower than 2.01 and not higher than 2.09; preferably, the diamine and tetraamine in the polyamine composition respectively account for the polyamine.
  • the ratio of the total composition is between 87% and 95%: 0.1% and 2%.
  • aliphatic polyamines will reduce the hardness of the cured polishing layer, reduce the removal rate, and cause the compression rate to be too high. Therefore, it is preferred that no fat is included in the present invention.
  • Family polyamines, further preferably diamines and/or triamines and trivalent or higher polyamines only include aromatic polyamines, particularly preferably diamines and/or trivalent amines and trivalent or higher polyamines include structural formula 1 Compounds shown:
  • X in Structural Formula 1 represents one or more combinations of carbon atoms or structural fragments shown in Structural Formula 2 or Structural Formula 3.
  • Structural Formula 1 represents a diamine, preferably including the following compounds as shown in Structural Formula 4:
  • Structural Formula 1 represents a triamine, preferably including the following compounds shown in Structural Formula 5:
  • Structural Formula 1 represents a quaternary amine, preferably including one or more combinations of the following compounds shown in Structural Formula 6:
  • the above-mentioned polyamine composition can be obtained by combining diamines, triamines, and tetraamines conventional in the art that are commercially available, or can be synthesized directly or synthesized by conventional synthesis methods in the art. It is obtained by separation and combination.
  • the proportion of various polyamine compounds in the polyamine composition to the total amount of the polyamine composition can be effectively controlled.
  • the proportion of diamines, triamines, and tetraamines When the proportion of the total amount of the polyamine composition is within a certain range, the service life of the polishing layer can be effectively improved.
  • the standard curve method can be used for calculation.
  • the standard curve can be calculated using LC-MS.
  • the standard curve test sample can use the polyamine composition G1 prepared by the above polyamine composition preparation method as the standard curve test sample, or the cured polishing layer can be used for hydrolysis, post-processing, separation and purification, etc.
  • the polyamine composition G2 obtained later was used as a standard curve test sample.
  • the invention also provides a method for obtaining the polyamine composition G2 from the cured polishing layer through hydrolysis, post-treatment, separation and purification, which includes the following steps:
  • Hydrolysis reaction feeding Add a finely divided polishing layer containing polyamine composition G2 into the hydrothermal synthesis reaction kettle, and stir in a certain amount of NaOH solution and absolute ethanol at 150°C for 10 hours.
  • reaction pretreatment After the reaction time is over, after cooling to room temperature, the above liquid is rotary evaporated at 40 to 50°C.
  • a certain amount of standard samples of diamines, triamines, and quaternary amines can be dissolved in a solvent, configured into a solution of a certain concentration, and a certain amount of the above solution is diluted into a solution with a certain concentration.
  • a solution with a certain concentration gradient, and then the above-mentioned solutions with a certain concentration gradient were analyzed by LC-MS (liquid mass spectrometry) to obtain the concentration (ppm) and liquid chromatography peaks
  • concentration (ppm) and liquid chromatography peak area as the horizontal and vertical coordinates respectively to make a scatter plot, and then use software to perform linear fitting to obtain the slope, intercept and R 2 value.
  • the standard curve method can be used to measure the mass percentages of diamines, triamines, and tetraamines respectively in the total amount of the polyamine composition.
  • the following methods can be used for measurement.
  • Diamine Weigh 0.005g of the diamine standard sample into a 10ml centrifuge tube, then add methanol for a total mass of 5.00g. Take 0.1 ml of the above prepared solution, add methanol to 10 ml and mix to form A (10 ppm) solution. Take 0.2ml of solution A + 1.8ml of methanol, 0.6ml + 1.4ml of methanol, 1.0ml + 1.0ml of methanol, and 1.4ml + 0.6ml of methanol to make solutions of 1, 3, 5, and 7ppm, plus the undiluted 10ppm solution to form the following Concentration gradient diamine standard sample solution.
  • Triamine Weigh 0.005g of the triamine standard sample into a 10ml centrifuge tube, then add methanol for a total mass of 5.00g. Take 0.1 ml of the solution prepared above, add methanol to 10 ml, and mix to form B (10 ppm) solution. Take 0.2ml of B solution + 1.8ml of methanol, 0.6ml + 1.4ml of methanol, 1.0ml + 1.0ml of methanol and 1.4ml + 0.6ml of methanol to make solutions of 1, 3, 5 and 7ppm, plus the undiluted 10ppm solution to form the following Concentration gradient triamine standard sample solution.
  • Quaternary amine Weigh 0.005g of the quaternary amine standard sample into a 10ml centrifuge tube, then add methanol for a total mass of 5.00g. Take 0.1 ml of the above prepared solution, add methanol to 10 ml and mix to form C (10 ppm) solution. Take 0.2ml of C solution + 1.8ml of methanol, 0.6ml + 1.4ml of methanol, 1.0ml + 1.0ml of methanol, and 1.4ml + 0.6ml of methanol to make solutions of 1, 3, 5, and 7ppm, plus the undiluted 10ppm solution to form the following Concentration gradient quaternary amine standard sample solution.
  • LC-MS liquid mass spectrometry
  • Aglient 1220 HPLC column: Aglient model: ZORBAX Eclipse
  • the standard sample injection volume is 10 ⁇ l, and the detector uses a UV detector with a wavelength of 254 nm.
  • the retention time of diamine is between 7.0 and 7.8 minutes
  • the retention time of triamine is between 10 and 11 minutes
  • the retention time of tetraamine is between 14.2 and 16 minutes.
  • the standard curves of diamine, triamine and tetraamine are shown in Figures 3-1, 3-2 and 3-3.
  • the above-mentioned polyamine composition G1 or G2 is configured into a standard curve test sample with a concentration of 10 to 100 ppm, and LC-MS analysis is performed under the same analysis conditions as the standard sample to obtain the results.
  • the obtained standard curve test sample is The liquid chromatography peak areas of the three amine compounds were substituted into the standard curves of the above diamines, triamines, and tetraamines, and the concentrations (ppm) of the diamines, triamines, and tetraamines in the analyzed samples were calculated. Subsequent calculation can obtain the mass percentages of the diamine, triamine and tetraamine respectively in the total amount of the polyamine composition.
  • a standard solution test sample you can use 0.0204g of the polyamine composition and add methanol to a total mass of 20.0026g. Take 0.2ml of the above solution and add methanol to 2ml and mix it to form a 100ppm solution. Take 0.2ml of the above 100ppm solution and add methanol to 2ml. Mixed into a 10 ppm solution, the present invention can adjust the concentration of the above standard curve test sample according to actual use conditions.
  • the liquid chromatography peak areas of diamines, triamines and quaternary amines obtained through the above test conditions satisfy the following relationship, wherein the peak area with a retention time of 7.0-7.8 min and the peak area with a retention time of 10-11 min
  • the ratio is between 5 and 30; the ratio of the peak area with a retention time of 7.0-7.8 min and the peak area with a retention time of 14.2-16 min is between 10 and 400.
  • the ratio of the peak area with a retention time of 7.0-7.8 min, the peak area with a retention time of 10-11 min, and the peak area with a retention time of 14.2-16 min is between: 360-450:15-45:1-40.
  • liquid phase peak area ratios of diamines, triamines and quaternary amines in the polishing layer through LC-MS do not in any way limit the scope of the claims of the present invention.
  • Limitation, it should be known that the liquid phase peak area ratios of diamines, triamines and tetraamines in the polishing layer to be protected by the present invention can be measured by any method and are applicable to the protection scope of the present invention.
  • the research of the present invention has found that by controlling the total average functionality of the polyamine composition and the polyol within a certain range, the polishing layer will have a higher service life.
  • the polyamine combination is controlled
  • the total average functionality of the polyamine composition and the polyol is not higher than 2.2.
  • the polishing layer becomes hard and brittle, seriously affecting the service life.
  • a polyol with a low average functionality in combination with a polyamine composition with a high average functionality, or even use a polyamine composition with an average functionality.
  • the low functionality polyol is combined with a low average functionality polyamine composition.
  • the polyamine composition in the present invention contains a certain content of free chloride ions. Considering that excessive chloride ion content will cause a complex reaction between chloride ions and metal ions generated after the metal to be polished is oxidized, thus affecting the stability of the polishing rate. , Therefore, in the present invention, the chloride ion content is controlled to be less than 900 ppm, preferably in the present invention, the chloride ion content is controlled to be less than 100 ppm, and it is particularly preferred to control the chloride ion content to be less than 10 ppm.
  • the polyurethane substrate is usually foamed.
  • Commonly used foaming processes include mechanical foaming or microsphere foaming.
  • a copolymer of polyalkyl siloxane and polyether and silicone without active hydrogen groups as a surfactant, and mechanically stir it to achieve mechanical foaming of the polyurethane base material.
  • Bubbles optional surfactants such as L5340 (manufactured by NIHON UNICA), SH-192 (manufactured by Dow Corning Toray Silicone Co., Ltd.), etc.
  • hollow microsphere polymers are usually uniformly dispersed in the polyurethane substrate to adjust the performance of the polishing layer.
  • the term "hollow microsphere polymer” in the present invention refers to a Expandable hollow polymer microspheres that can expand moderately due to the temperature increase caused by the exotherm of reaction during the curing process.
  • the polishing performance of the polishing layer can be further adjusted.
  • the hollow microsphere polymer is dispersed in the polishing layer so that the final porosity of the polishing layer is 1 to 60%, and particularly preferably, the porosity is 15 to 45%.
  • the hollow microsphere polymer includes but is not limited to a capsule-like structure with an outer wall of polyacrylonitrile and polyacrylonitrile copolymer, which can be purchased from any one of AkzoNobel, Matsumoto Oils and Fats Pharmaceutical Co., Ltd. or Sekisui Chemical Industry Co., Ltd.
  • the company's microspheres or microbeads are particularly preferred.
  • AkzoNobel hollow microspheres or Matsumoto microbeads F series are selected.
  • modifiers can also be added to the polyurethane base material in order to obtain more excellent comprehensive performance improvements.
  • these modifiers can modify at least one property of the polishing layer, including but not limited to the group consisting of: porosity, stiffness, surface energy, wear resistance, conductivity, and chemical functionality.
  • Modified materials include but are not limited to: antioxidants, lubricants, pigments, fillers, antistatic agents, etc.
  • the polishing layer can be provided with grooves according to conventional methods in this field, and the grooves are used to receive polishing liquid during the polishing process.
  • the grooves may be processed after the polishing layer is formed.
  • the grooves are arranged to ensure smooth discharge and flow of the polishing fluid used in the polishing process.
  • the grooves are concentric grooves (for example, they can be ring-shaped or spiral grooves), curved grooves, grid line grooves, regular polygonal grooves (for example, hexagons, triangles), and tire One or more of the facial patterns.
  • the groove is one or more of annular grooves, spiral grooves, X-Y grid grooves, hexagonal grooves, triangular grooves and fractal grooves.
  • the cross-section of the groove is one or more of a rectangular shape with straight side walls, a "V" shape, a "U” shape and a zigzag shape.
  • the width of the groove is 0.1 ⁇ 0.6mm
  • the depth of the groove is 0.5 ⁇ 0.9mm
  • the distance between adjacent grooves is 2 ⁇ 5mm
  • a central blank area can be set or not, where , the radius of the central blank area is 60mm ⁇ 70mm.
  • the polishing pad further includes a buffer layer.
  • a buffer layer is required in order to take into account both planarity and uniformity, which are mutually compromised.
  • Planarity refers to the flatness of a pattern portion when polishing a material to be polished that has minute irregularities produced during pattern formation
  • uniformity refers to the uniformity of the entire material to be polished. Utilize the characteristics of the polishing layer to improve flatness, and utilize the characteristics of the buffer layer to improve uniformity.
  • buffer layer examples include fiber nonwoven fabrics such as polyester nonwoven fabrics, nylon nonwoven fabrics, and acrylic nonwoven fabrics, resin-impregnated nonwoven fabrics such as polyurethane-impregnated polyester nonwoven fabrics, and polyurethane foams. Polyethylene foam and other polymer resin foams, butadiene rubber, isoprene rubber and other rubber resins, photosensitive resins, etc.
  • the polishing pad of the present invention also includes an adhesive layer, and double-sided tape can also be used as the adhesive layer.
  • the composition of the back adhesive layer include rubber adhesives, acrylic adhesives, and the like. Considering the content of metal ions, acrylic adhesives are preferred because they have a small content of metal ions.
  • the adhesive layer also includes a release film or release paper.
  • the bonding between the polishing pad and the polishing machine can be achieved by tearing off the release film or release paper before use.
  • the polishing layer in the present invention can be provided with an end-point detection window according to actual needs.
  • at least one end-point detection area is formed in the polishing layer.
  • the end-point detection area of the polishing layer can perform high-precision optical end-point detection. Detection, the detection method can be optical detection.
  • the end point detection area made of appropriate materials, it has appropriate light transmittance to observe the polished object (such as a silicon wafer).
  • the light transmittance of the material forming the end point detection area is not less than 20% in the entire wavelength range of 300 to 800. More preferably, the light transmittance of the high light transmittance material is not less than 60%.
  • the materials of the endpoint detection area include but are not limited to thermosetting resins such as polyurethane resin, polyester resin, phenol resin, urea resin, melamine resin, epoxy resin, and acrylic resin; polyurethane resin, polyester resin, polyamide resin, Cellulose resin, acrylic resin, polycarbonate resin, halogen-containing resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene and olefin resin (polyethylene, polypropylene, etc.) thermoplastic One or more combinations of type resins.
  • thermosetting resins such as polyurethane resin, polyester resin, phenol resin, urea resin, melamine resin, epoxy resin, and acrylic resin
  • polyurethane resin polyester resin, polyamide resin, Cellulose resin, acrylic resin, polycarbonate resin, halogen-containing resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polyst
  • the Shore hardness of the end point detection area is 40 to 75D, and more preferably 55 to 70D.
  • the Shore hardness of the end point detection area is less than 40D, this area is prone to creep and is difficult to stabilize.
  • Optical endpoint detection is performed, and when the Shore hardness exceeds 75D, scratches are likely to occur on the surface of the polished material.
  • the polishing pad involved in the present invention can be applied to any common semiconductor process.
  • Examples of common processes include but are not limited to: STI process, Oxide process, W process, Al process, Copper process Process, Poly process.
  • Polishing treatment carried out using a polishing device as shown in Figure 1.
  • the polishing device has a polishing machine table 3 that supports a polishing pad 2 and is used to uniformly pressurize the bracket 4 and the wafer that support the material to be polished - the semiconductor wafer 1.
  • the polishing pad 2 is mounted on the polishing machine table 3 by adhesion with an adhesive layer, for example.
  • the polishing machine table 3 and the holder 4 are arranged so that the polishing pad 2 and the semiconductor wafer 1 they support face each other, and each has a rotation axis.
  • a pressing mechanism for pressing the semiconductor wafer 1 onto the polishing pad 2 is provided on one side of the holder 4 .
  • polishing machine table 3 and the holder 4 are rotated, the semiconductor wafer 1 is pressed onto the polishing pad 2, and polishing is performed while supplying slurry.
  • polishing machine speed There are no special restrictions on the slurry flow rate, polishing load, polishing machine speed and wafer speed, and can be adjusted appropriately.
  • TDI100 100% 2,4-toluene diisocyanate
  • TDI80 80% 2,4-toluene diisocyanate, 20% 2,6-toluene diisocyanate;
  • HMDI 4,4’-dicyclohexylmethane diisocyanate
  • PTMEG polytetramethylene ether glycol
  • MOCA 4,4’-methylene-bis-(2-chloroaniline);
  • M-CDEA 4,4’-methylene-bis-(3-chloro-2,6-diethylaniline);
  • T5000 trifunctional polyetheramine
  • Hollow microsphere polymer The average particle size is 40 ⁇ m, and the density is 0.042g/cm 3 .
  • the average particle size is 20 ⁇ m and the density is 0.07g/cm 3 .
  • the above raw materials are all from commercially available bulk industrial products, and manufacturers include BASF, Covestro, Wanhua Chemical, Suzhou Xiangyuan, Chizhou Tianci, Mitsui Chemicals, Mitsubishi Chemical, etc.
  • Tri-A triamine
  • Tetra-A tetraamine
  • Di-A, Tri-A and Tetra-A are obtained by separating the polyamine composition prepared in any one of Preparation Examples 1 to 8.
  • HPLC chromatographic column: Aglient model: ZORBAX Eclipse XDB-C18, 4.6*250mm, 5-Micron
  • Agilent G6125C MS Agilent G6125C MS
  • the detector uses a UV detector with a wavelength of 254nm.
  • X 2 , X 3 and C 3 , C 4 , and C n represent the mass of polyols with functionality of 2, 3, 4, and n; M 2 amine , M 3 amine , and M 4 amine represent diamine, triamine, and tetraamine respectively. Molecular weight; M 2 alcohols , M 3 alcohols , M 4 alcohols , and M n alcohols respectively represent the molecular weight of dihydric alcohols, trihydric alcohols, tetrahydric alcohols or polyhydric alcohols.
  • polishing pads in the prepared examples and comparative examples were tested on the machine to evaluate the polishing performance.
  • the test conditions were as follows:
  • test machine is AMAT Refelxion (Modify 5Zone);
  • Zone Pressure RR/Z1/Z2/Z3/Z4/Z5:5.90/5.10/2.40/2.15/2.10/2.20;
  • the wafer used is Patten wafer: Semitech 754, Cu Blanket wafer Pre Thickness 10 ⁇ 12KA.
  • polishing pads in the examples and comparative examples were cut by a dresser for a long time to test their ultimate service life, that is, the parameters were the same (groove depth 30 mil, groove width 20 mil, groove spacing 120 mil, and the center blank area radius was 60 The time required to finish cutting a groove of ⁇ 70mm).
  • Defects on the polished base material after polishing can be obtained using KLA-Tencor
  • the SP2 defect inspection system conducts inspection and detects the size of the defect: 0.16 ⁇ m; ⁇ means almost no defect, ⁇ means there is a very small amount of defect, ⁇ means there is a small amount of defect, ⁇ means there are more defects, and ⁇ means there are a large number of defects. .
  • the gradient heating program is: 35 ⁇ 40°C for 2h, 50 ⁇ 60°C for 4h, 70 ⁇ 80°C for 4h, and 100°C for 1h. temperature rise for each heating gradient The time is 0.5h. Cool down to 50-60°C, add 249.6kg of sodium hydroxide solution with a mass fraction of 25% to neutralize to a pH greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 249.6kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water. The volume of deionized water is 1.5 times the volume of the organic phase.
  • the Di-A component accounts for 90.86% of the mass of the polyamine composition
  • the Tri-A component accounts for 6.46% of the mass of the polyamine composition
  • the Tetra-A component accounts for 6.46% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 1.09%.
  • the average functionality of the polyamine composition is 2.06.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 18;
  • the ratio of the peak area with a retention time of 7.0-7.8min and the peak area with a retention time of 14.2-16min is 91, of which the peak area with a retention time of 7.0-7.8min is 430.2, and the peak area with a retention time of 10-11min
  • the peak area with retention time of 14.2 to 16 min is 4.8.
  • the gradient heating program is: 35 ⁇ 40°C for 2h, 50 ⁇ 60°C for 4h, 70 ⁇ 80°C for 4h, and 100°C for 1h.
  • the heating time of each heating gradient is 0.5h. Cool to 50-60°C, add 274.56kg of sodium hydroxide solution with a mass fraction of 25% to neutralize to a pH greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 274.56kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water.
  • the volume of deionized water is 1.5 times the volume of the organic phase.
  • polyamine composition B2 the Di-A component accounts for 87.21% of the mass of the polyamine composition, the Tri-A component accounts for 9.83% of the mass of the polyamine composition, and the Tetra-A component accounts for 9.83% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 1.92%.
  • the average functionality of the polyamine composition is 2.09.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 11;
  • the ratio of the peak area with a retention time of 7.0-7.8min and the peak area with a retention time of 14.2-16min is 53, of which the peak area with a retention time of 7.0-7.8min is 412.9 and the peak area with a retention time of 10-11min
  • the peak area with retention time of 14.2 to 16 min is 7.8.
  • the gradient heating program is: 35 ⁇ 40°C for 2h, 50 ⁇ 60°C for 4h, 70 ⁇ 80°C for 4h, and 100°C for 1h.
  • the heating time of each heating gradient is 0.5h. Cool to 50 ⁇ 60°C, add 247.10kg of sodium hydroxide solution with a mass fraction of 25% to neutralize to a pH greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 247.10kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water.
  • the volume of deionized water is 1.5 times the volume of the organic phase.
  • polyamine composition B3 the Di-A component accounts for 94.83% of the mass of the polyamine composition
  • the Tri-A component accounts for 4.13% of the mass of the polyamine composition
  • the Tetra-A component accounts for 4.13% of the mass of the polyamine composition.
  • the mass percentage of the compound is 0.12%, the average functionality of the polyamine composition is 2.03, and in the liquid chromatography peak area of the polyamine composition, the peak area with a retention time of 7.0-7.8 min and the peak area with a retention time of 10-11 min are The ratio is 28; the ratio of the peak area with a retention time of 7.0-7.8min and the peak area with a retention time of 14.2-16min is 395, of which the peak area with a retention time of 7.0-7.8min is 449.1, and the peak area with a retention time of 10-11min is 395.
  • the peak area is 15.8, and the peak area with retention time of 14.2 to 16 minutes is 1.1.
  • the gradient heating program is: 35 ⁇ 40°C for 2h, 50 ⁇ 60°C for 4h, 70 ⁇ 80°C for 4h, and 100°C for 1h.
  • the heating time of each heating gradient is 0.5h. Cool to 50 ⁇ 60°C, add 247.75kg of sodium hydroxide solution with a mass fraction of 25% to neutralize to a pH greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 247.75kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water.
  • the volume of deionized water is 1.5 times the volume of the organic phase.
  • the Di-A component accounts for 88.31% of the mass of the polyamine composition
  • the Tri-A component accounts for 8.29% of the mass of the polyamine composition
  • the Tetra-A component accounts for 8.29% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 1.86%.
  • the average functionality of the polyamine composition is 2.08.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 13;
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 14.2 to 16 min is 55, among which the peak area with a retention time of 7.0 to 7.8 min is
  • the product is 418.1, the peak area for the retention time of 10 to 11 min is 31.3, and the peak area for the retention time of 14.2 to 16 min is 7.6.
  • the gradient heating program is: 35 ⁇ 40°C for 2h, 50 ⁇ 60°C for 4h, 70 ⁇ 80°C for 4h, and 100°C for 1h.
  • the heating time of each heating gradient is 0.5h. Cool the temperature to 50-60°C, add 247.52kg of sodium hydroxide solution with a mass fraction of 25% to neutralize it until the pH is greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 247.52kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water.
  • the volume of deionized water is 1.5 times the volume of the organic phase.
  • the organic phase is separated, the temperature is lowered to allow the organic phase to crystallize into a solid, and the organic phase is evacuated at 50-60°C to 100pa and dried for 5 hours to obtain 125.85kg of polyamine composition B5.
  • the Di-A component accounts for 81.84% of the mass of the polyamine composition
  • the Tri-A component accounts for 9.95% of the mass of the polyamine composition
  • the Tetra-A component accounts for 9.95% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 7.32%.
  • the average functionality of the polyamine composition is 2.15.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 10;
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 14.2 to 16 min is 14, of which the peak area with a retention time of 7.0 to 7.8 min is 387.4 and the peak area with a retention time of 10 to 11 min
  • the peak area with retention time of 14.2 to 16 minutes is 37.5, and the peak area is 28.0.
  • the gradient temperature increase program was: 35 to 40°C for 2 hours, 50 ⁇ 60°C4h, 70 ⁇ 80°C4h, 100°C1h.
  • the heating time of each heating gradient is 0.5h. Cool down to 50-60°C, add 274.56kg of sodium hydroxide solution with a mass fraction of 25% to neutralize to a pH greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 274.56kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water.
  • the volume of deionized water is 1.5 times the volume of the organic phase. Stir thoroughly and then let it stand to separate the water phase.
  • polyamine composition B6 the Di-A component accounts for 77.12% of the mass of the polyamine composition
  • the Tri-A component accounts for 11.84% of the mass of the polyamine composition
  • the Tetra-A component accounts for 11.84% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 9.98%.
  • the average functionality of the polyamine composition is 2.20.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 8;
  • the ratio of the peak area with a retention time of 7.0 to 7.8 minutes and the peak area with a retention time of 14.2 to 16 minutes is 10, of which the peak area with a retention time of 7.0 to 7.8 minutes is 365.0 and the peak area with a retention time of 10 to 11 minutes
  • the peak area with retention time of 14.2 to 16 min is 37.9.
  • the gradient heating program is: 35 ⁇ 40°C 2h, 50 ⁇ 60°C 4h, 70 ⁇ 80°C 4h, 100°C 1h.
  • the heating time of each heating gradient is 0.5h. Cool down to 50-60°C, add 274.12kg of sodium hydroxide solution with a mass fraction of 25% to neutralize to a pH greater than 12, let it stand for 12 hours, separate the lower inorganic salt solution layer, and then add 274.12kg of sodium hydroxide solution with a mass fraction of 25% to the organic phase at a temperature of not less than 95 °C deionized water.
  • the volume of deionized water is 1.5 times the volume of the organic phase.
  • polyamine composition B7 the Di-A component accounts for 66.38% of the mass of the polyamine composition
  • the Tri-A component accounts for 18.94% of the mass of the polyamine composition
  • the Tetra-A component accounts for 18.94% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 13.73%.
  • the average functionality of the polyamine composition is 2.30.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 4;
  • the ratio of the peak area with a retention time of 7.0-7.8 min and the peak area with a retention time of 14.2-16 min is 6, of which the peak area with a retention time of 7.0-7.8 min is 314.0 and the peak area with a retention time of 10-11 min is 71.0, and the peak area with retention time of 14.2 to 16 minutes is 51.8.
  • the gradient heating program is: 35 ⁇ 40°C for 2h, 50 ⁇ 60°C for 4h, 70 ⁇ 80°C for 4h, and 100°C for 1h.
  • the heating time of each heating gradient is 0.5h.
  • polyamine composition B8 the Di-A component accounts for 54.54% of the mass of the polyamine composition
  • the Tri-A component accounts for 24.97% of the mass of the polyamine composition
  • the Tetra-A component accounts for 24.97% of the mass of the polyamine composition.
  • the mass percentage of the polyamine composition is 19.49%.
  • the average functionality of the polyamine composition is 2.44.
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 10 to 11 min is 3;
  • the ratio of the peak area with a retention time of 7.0 to 7.8 min and the peak area with a retention time of 14.2 to 16 min is 4, of which the peak area with a retention time of 7.0 to 7.8 min is 257.7, and the peak area with a retention time of 10 to 11 min is 257.7.
  • the peak area with retention time from 14.2 to 16 minutes is 93.4, and the peak area is 73.3.
  • This embodiment provides a polishing pad, and its preparation method is as follows:
  • Step 1 Take 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000 and 5.92 parts by mass of DEG to react to obtain an isocyanate-terminated prepolymer, heat to 25 ⁇ 65°C, and degas under vacuum (-0.095MPa) for 2 hours so that Remove the gas and small molecular compounds in the prepolymer; then add 1.83 parts by mass of hollow microsphere polymer 551DE40d42 with an average particle size of 40 ⁇ m, and stir to make the hollow microsphere polymer evenly dispersed in the prepolymer, vacuum ( -0.095MPa), degas again for 2h and set aside.
  • Step 2 Warm 27.06 parts by mass of the polyamine composition B1 to 115°C and set aside for use.
  • the average molecular weight of the polyamine composition is 275.
  • Step 3 Mix the prepolymer and the polyamine composition under high-speed shear, and then cast it into a circular grinding mold to form a casting block with a thickness of 12cm. Leave it at room temperature for 10 minutes, and then place it in a 100°C oven to solidify for 16 seconds. Hour. After curing is completed, it is automatically cooled to room temperature in the oven, and then cut into sheets with a thickness of 80 mil, a total of 60 pieces.
  • Step 4 Choose a groove shape that uses an annular groove and has a blank (unnotched) area in the center.
  • the groove parameters are: trench depth 30mil, trench width 20mil, groove spacing 120mil, and blank area in the center.
  • the radius is 60 ⁇ 70mm, and the polished layer is formed after the groove is carved.
  • Step 5 Use double-sided tape for the middle glue and back glue layer.
  • Use the middle glue to bond the polishing layer and the buffer layer, and bond the back glue layer on the other side of the buffer layer (the side without the polishing layer).
  • the polishing pad P1 can be obtained, in which the buffer layer uses polyurethane-impregnated non-woven material (SUBA).
  • SUBA polyurethane-impregnated non-woven material
  • This embodiment provides a polishing pad P2, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 57.25 parts by mass of PTMEG650 and 2.1 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 2.00 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26.32 parts by mass of B1, in which the average molecular weight of the polyamine composition was 275.
  • This embodiment provides a polishing pad P3, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 51.84 parts by mass of PTMEG1400 and 7.51 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 1.92 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26.77 parts by mass of B2, in which the average molecular weight of the polyamine composition was 279.
  • This embodiment provides a polishing pad P4, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 53.6 parts by mass of PTMEG1000 and 5.76 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 1.99 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 25.98 parts by mass of B3, in which the average molecular weight of the polyamine composition was 271.
  • This embodiment provides a polishing pad P5, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 1.84 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 27.51 parts by mass of B2, in which the average molecular weight of the polyamine composition is 279.
  • This embodiment provides a polishing pad P6, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 1.83 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 26.7 parts by mass of B3, in which the average molecular weight of the polyamine composition is 271.
  • This embodiment provides a polishing pad P7, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 1.84 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 27.35 parts by mass of B4, in which the average molecular weight of the polyamine composition is 278.
  • This embodiment provides a polishing pad P8, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 1.76 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 28.34 parts by mass of B5, in which the average molecular weight of the polyamine composition is 288.
  • This embodiment provides a polishing pad P9, the preparation method of which is the same as that of Embodiment 1, except that The following is: the isocyanate-terminated prepolymer is obtained by reacting 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000 and 5.92 parts by mass of DEG; the hollow microsphere polymer is 1.69 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine combination The material is 28.98 parts by mass of B6, in which the average molecular weight of the polyamine composition is 294.
  • This embodiment provides a polishing pad P10, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 34.55 parts by mass of TDI100, 1.81 parts by mass of HMDI and 63.64 parts by mass of PTMEG650 Obtained; the hollow microsphere polymer is 2.27 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 25.68 parts by mass of B1, in which the average molecular weight of the polyamine composition is 275.
  • This embodiment provides a polishing pad P11, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 30.68 parts by mass of TDI100, 5.42 parts by mass of HMDI and 63.9 parts by mass of PTMEG650 Obtained; the hollow microsphere polymer is 2.87 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 23.82 parts by mass of B4, in which the average molecular weight of the polyamine composition is 278.
  • This embodiment provides a polishing pad P12, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 31.99 parts by mass of TDI100, 4.21 parts by mass of HMDI and 63.8 parts by mass of PTMEG650 Obtained; the hollow microsphere polymer is 2.65 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 23.97 parts by mass of B3, in which the average molecular weight of the polyamine composition is 271.
  • This embodiment provides a polishing pad, and its preparation method is as follows:
  • Step 1 Take 20.1 parts by mass of TDI100, 8.3 parts by mass of HMDI and 71.6 parts by mass of PTMEG1000, add 4.04 parts by mass of hollow microsphere polymer 551DE40d42 with an average particle size of 40 ⁇ m, add 18.05 parts by mass of polyamine composition B1 and stir at 115°C to fully react, in which the average molecular weight of the polyamine composition to 275.
  • Step 2 Mix the materials in step 1 under high-speed shear, then cast them into a circular grinding mold to form a casting block with a thickness of 12cm. Leave it at room temperature for 10 minutes, and then place it in a 100°C oven to solidify for 16 hours. After curing is completed, it is automatically cooled to room temperature in the oven, and then cut into sheets with a thickness of 80 mil, a total of 60 pieces.
  • Step 3 Choose a groove shape that uses an annular groove and has a blank (unnotched) area in the center.
  • the groove parameters are: trench depth 30mil, trench width 20mil, groove spacing 120mil, and blank area in the center.
  • the radius is 60 ⁇ 70mm, and the polished layer is formed after the groove is carved.
  • Step 4 Use double-sided tape for the middle glue and back glue layer.
  • Use the middle glue to bond the polishing layer and the buffer layer, and bond the back glue layer on the other side of the buffer layer (the side without the polishing layer).
  • the polishing pad P13 can be obtained, in which the buffer layer uses polyurethane-impregnated non-woven material (SUBA).
  • This embodiment provides a polishing pad P14, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 25.68 parts by mass of TDI100 and 5.42 parts by mass of HMDI and 65.3 parts by mass of PTMEG1400 and 3.6 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 3.16 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 20.94 parts by mass of B1, in which the average molecular weight of the polyamine composition was 275.
  • This embodiment provides a polishing pad P15, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 5.92 parts by mass of DEG and 55.08 parts by mass of PTMEG1000. Obtained; the hollow microsphere polymer is 1.83 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 25.12 parts by mass Di-A and 1.79 parts by mass of Tri-A, wherein the average molecular weight of the polyamine composition is 273, and the average functionality of the polyamine composition is 2.04.
  • This embodiment provides a polishing pad P16, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 5.92 parts by mass of DEG and 55.08 parts by mass of PTMEG1000. Obtained; the hollow microsphere polymer is 1.83 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 24.77 parts by mass of Di-A and 2.33 parts by mass of Tri-A, in which the average molecular weight of the polyamine composition is 275 , the average functionality of the polyamine composition is 2.06.
  • This embodiment provides a polishing pad P17, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 5.92 parts by mass of DEG and 55.08 parts by mass of PTMEG1000. Obtained; the hollow microsphere polymer is 1.84 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 25.2 parts by mass of Di-A and 2.25 parts by mass of Tetra-A, in which the average molecular weight of the polyamine composition is 279 , the average functionality of the polyamine composition is 2.08.
  • This embodiment provides a polishing pad P18, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 32.65 parts by mass of TDI100, 8 parts by mass of HMDI and 57.25 parts by mass of PTMEG650 and 2.1 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 2.00 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 24.51 parts by mass of Di-A and 2.19 parts by mass of Tetra-A, in which the polyamine combination The average molecular weight of the polyamine composition is 279, and the average functionality of the polyamine composition is 2.08.
  • This embodiment provides a polishing pad P19, the preparation method of which is the same as that of Embodiment 1, except that The isocyanate-terminated prepolymer is obtained by reacting 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI, 51.84 parts by mass of PTMEG1400 and 7.51 parts by mass of DEG; the hollow microsphere polymer is 2.00 parts by mass and the average particle size is 40 ⁇ m. 551DE40d42; the polyamine composition is 23.51 parts by mass of Di-A, 2.21 parts by mass of Tri-A, and 0.91 parts by mass of M-CDEA, where the average molecular weight of the polyamine composition is 278, and the average functionality of the polyamine composition is is 2.06.
  • This embodiment provides a polishing pad P20, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 53.6 parts by mass of PTMEG1000 and 5.76 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 1.98 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 20.6 parts by mass of Di-A, 1.84 parts by mass of Tetra-A, and 2.73 parts by mass of DETDA, wherein the average molecular weight of the polyamine composition is 263, and the average functionality of the polyamine composition is 2.07.
  • This embodiment provides a polishing pad P21, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer was 2.41 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 27.5 parts by mass of B1, in which the average molecular weight of the polyamine composition was 275.
  • This embodiment provides a polishing pad P22, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 57.25 parts by mass of PTMEG650 and 2.1 parts by mass of DEG were obtained by reaction; the hollow microsphere polymer was 2.94 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine group The compound was 26.76 parts by mass of B1, in which the average molecular weight of the polyamine composition was 275.
  • This embodiment provides a polishing pad P23, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer was 4.04 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 27.5 parts by mass of B1, in which the average molecular weight of the polyamine composition was 275.
  • This embodiment provides a polishing pad P24, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 4.7 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 27.35 parts by mass of B4, in which the average molecular weight of the polyamine composition is 278.
  • Example 25 the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 4.7 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 27.35 parts by
  • This embodiment provides a polishing pad P25, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 53.6 parts by mass of PTMEG1000 and 5.76 parts by mass.
  • the mass parts of DEG were obtained by reaction; the hollow microsphere polymer was 6.06 mass parts of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 25.98 mass parts of B3, in which the average molecular weight of the polyamine composition was 271.
  • This embodiment provides a polishing pad P26, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 51.84 parts by mass of PTMEG1400 and 7.51
  • the mass parts of DEG were obtained by reaction;
  • the hollow microsphere polymer was 9.08 mass parts of 551DE40d42 with an average particle size of 40 ⁇ m;
  • the polyamine composition was 26.77 mass parts of B2, in which the average molecular weight of the polyamine composition was 279.
  • This embodiment provides a polishing pad P27, the preparation method of which is the same as that of Example 13, except that the raw materials include 34.55 parts by mass of TDI100, 3.81 parts by mass of HMDI and 61.64 parts by mass of PPG600; the hollow microsphere polymer is 3.3 parts by mass of 461DE20d70 with an average particle size of 20 ⁇ m; the polyamine composition is 26.35 parts by mass of B1, in which the average molecular weight of the polyamine composition is 275.
  • This embodiment provides a polishing pad P28, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 38.5 parts by mass of TDI100 and 3 parts by mass of HMDI and 53.4 parts by mass of PPG800 and 5.1
  • the mass parts of DEG were obtained by reaction;
  • the hollow microsphere polymer was 2.6 mass parts of 461DE20d70 with an average particle size of 20 ⁇ m;
  • the polyamine composition was 27.55 mass parts of B2, in which the average molecular weight of the polyamine composition was 279.
  • This embodiment provides a polishing pad P29, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PPG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer was 3.16 parts by mass of 461DE20d70 with an average particle size of 20 ⁇ m; the polyamine composition was 26.7 parts by mass of B3, in which the average molecular weight of the polyamine composition was 271.
  • This embodiment provides a polishing pad P30, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, 5.33 parts by mass of DEG and 0.34 parts by mass of glycerol was obtained by reaction; the hollow microsphere polymer was 1.74 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 27.06 parts by mass of B1, in which the average molecular weight of the polyamine composition was 275, and the polyamine composition was 275.
  • the combined average functionality of the amine composition and polyol composition was 2.04.
  • This embodiment provides a polishing pad P31, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 56.05 parts by mass of PTMEG650 and 1.89 parts by mass of DEG and 0.12 parts by mass of xylitol were obtained by reacting; the hollow microsphere polymer was 1.64 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26.68 parts by mass of B3, of which the polyamine composition The average molecular weight is 271, and the combined average functionality of the polyamine composition and the polyol composition is 2.03.
  • This embodiment provides a polishing pad P32, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 56.49 parts by mass of PTMEG1400 and 6.58 parts by mass of DEG and 0.47 parts by mass of pentaerythritol were obtained by reacting; the hollow microsphere polymer was 2.26 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26.46 parts by mass of B3, in which the average molecular weight of the polyamine composition was is 271, and the total average functionality of the polyamine composition and the polyol composition is 2.05.
  • This embodiment provides a polishing pad P33, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 39.01 parts by mass of TDI100, 55.93 parts by mass of PTMEG1000, 5.33 parts by mass of DEG and 0.34 parts by mass of glycerol was obtained by reaction; the hollow microsphere polymer was 1.68 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 27.59 parts by mass of B4, in which the average molecular weight of the polyamine composition was 278, and the polyamine composition was 278.
  • the combined average functionality of the amine composition and polyol composition is 2.05.
  • This embodiment provides a polishing pad P34, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 56.05 parts by mass of PTMEG1400 and 6.39 parts by mass of DEG and 0.65
  • the mass parts of xylitol were obtained by reaction; the hollow microsphere polymer was 2.07 mass parts of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26.78 mass parts of B3, in which the average molecular weight of the polyamine composition was 271, and the polyamine composition was 271.
  • the overall average functionality of the composition and the polyol composition was 2.08.
  • This embodiment provides a polishing pad P35, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 56.49 parts by mass of PTMEG1400 and 6.21 parts by mass of DEG and 0.7 parts by mass of pentaerythritol were obtained by reacting; the hollow microsphere polymer was 1.91 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 28.53 parts by mass of B5, in which the average molecular weight of the polyamine composition was is 288, and the total average functionality of the polyamine composition and the polyol composition is 2.12.
  • This embodiment provides a polishing pad P36, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer consists of 39.01 parts by mass of TDI100, 55.93 parts by mass of PTMEG1000, 5.03 parts by mass of DEG and 0.51 parts by mass of glycerol was obtained by reaction; the hollow microsphere polymer was 1.6 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 27.82 parts by mass of B4, in which the average molecular weight of the polyamine composition was 278, and the polyamine composition was 278.
  • the combined average functionality of the amine composition and polyol composition was 2.06.
  • This embodiment provides a polishing pad P37, the preparation method of which is the same as that of Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 48.54 parts by mass of PTMEG3000 and 9.19 parts by mass of DEG and 0.93 parts by mass of mannitol were obtained by reacting; the hollow microsphere polymer was 1.82 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26.75 parts by mass of B2, in which the average of the polyamine composition The molecular weight is 279 and the combined average functionality of the polyamine composition and the polyol composition is 2.14.
  • This comparative example provides a polishing pad whose preparation method is as follows:
  • Step 1 Take 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000 and 5.92 parts by mass of DEG to react to obtain an isocyanate-terminated prepolymer, heat to 25 ⁇ 65°C, and degas under vacuum (-0.095MPa) for 2 hours so that Remove the gas and small molecular compounds in the prepolymer; then add 1.82 parts by mass of hollow microsphere polymer 551DE40d42 with an average particle size of 40 ⁇ m, and stir to make the hollow microsphere polymer evenly dispersed in the prepolymer, vacuum ( -0.095MPa), degas again for 2h and set aside.
  • Step 2 Warm 26.3 parts by mass of the polyamine composition MOCA to 115°C and set aside for use.
  • the average functionality is 2.0.
  • Step 3 Mix the prepolymer and the polyamine composition under high-speed shear, and then cast it into a circular grinding mold to form a casting block with a thickness of 12cm. Leave it at room temperature for 10 minutes, and then place it in a 100°C oven to solidify for 16 seconds. Hour. After curing is completed, it is automatically cooled to room temperature in the oven, and then cut into sheets with a thickness of 80 mil, a total of 60 pieces.
  • Step 4 Choose a groove shape that uses an annular groove and has a blank (unnotched) area in the center.
  • the groove parameters are: trench depth 30mil, trench width 20mil, groove spacing 120mil, and blank area in the center.
  • the radius is 60 ⁇ 70mm, and the polished layer is formed after the groove is carved.
  • Step 5 Use double-sided tape for the middle glue and back glue layer. Use the middle glue to bond the polishing layer and the buffer layer, and bond the back glue layer on the other side of the buffer layer (the side without the polishing layer).
  • the polishing pad PD1 can be obtained, in which the buffer layer uses polyurethane-impregnated non-woven material (SUBA).
  • This comparative example provides a polishing pad PD2 whose preparation method is the same as that of Comparative Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG.
  • the hollow microsphere polymer is 2.17 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m;
  • the polyamine composition is 37.34 parts by mass of M-CDEA with an average functionality of 2.0.
  • This comparative example provides a polishing pad PD3.
  • the preparation method is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 2.22 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 17.55 parts by mass of DETDA, and the average functionality is 2.0.
  • This comparative example provides a polishing pad PD4, the preparation method of which is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 1.56 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 32.35 parts by mass of B8, in which the average molecular weight of the polyamine composition is 329.
  • This comparative example provides a polishing pad PD5.
  • the preparation method is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 1.62 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 30.45 parts by mass of B7, in which the average molecular weight of the polyamine composition is 309.
  • This comparative example provides a polishing pad PD6.
  • the preparation method is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 2.44 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 23.46 parts by mass parts of MOCA and 5.92 parts by mass of D2000, in which the average molecular weight of the polyamine composition is 619 and the average functionality is 2.0.
  • This comparative example provides a polishing pad PD7, the preparation method of which is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer is reacted with 39.01 parts by mass of TDI100, 55.08 parts by mass of PTMEG1000, and 5.92 parts by mass of DEG. Obtained; the hollow microsphere polymer is 2.64 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition is 23.46 parts by mass of MOCA, 4 parts by mass of D2000, and 1 part by mass of T5000, in which the average molecular weight of the polyamine composition is is 677 and the average functionality is 2.03.
  • This comparative example provides a polishing pad PD8, the preparation method of which is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer consists of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 56.05 parts by mass of PTMEG1000 and 4.13 parts by mass of DEG and 1.94 parts by mass of xylitol were obtained by reacting; the hollow microsphere polymer was 1.86 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 26 parts by mass of B3, in which the polyamine composition was The average molecular weight is 271, and the combined average functionality of the polyamine composition and the polyol composition is 2.21.
  • This comparative example provides a polishing pad PD9, the preparation method of which is the same as Comparative Example 1, except that the isocyanate-terminated prepolymer is composed of 32.65 parts by mass of TDI100 and 8 parts by mass of HMDI and 28.03 parts by mass of PTMEG1000 and 28.03 parts by mass of PTMEG650, 1.88 parts by mass of DEG and 3.22 parts by mass of mannitol were obtained by reacting; the hollow microsphere polymer was 0.2 parts by mass of 551DE40d42 with an average particle size of 40 ⁇ m; the polyamine composition was 29.99 parts by mass of B7, in which The average molecular weight of the polyamine composition is 309, and the total average functionality of the polyamine composition and the polyol composition is 2.49.
  • the polishing pad removal rate is higher, and the polishing removal rate decays less with time, the NU value is lower, there is almost no defect or a very small amount of defect, and the service life is significantly longer than that of the comparative example. promote.

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Abstract

一种抛光垫（2），包含有抛光层（20），抛光层（20）包含聚氨酯基材，聚氨酯基材由多官能异氰酸酯，多元醇组合物以及多元胺组合物经反应得到，其中，多元胺组合物包含一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，多元胺组合物的平均分子量介于200～400之间，多元胺组合物的平均官能度大于2且不超过2.20，多元胺组合物中二元胺与三元胺分别占多元胺组合物总量的比例介于77％～96％：3％～12％之间。抛光垫具有高可控性、较低的加工条件要求以及较宽的加工窗口，所形成的抛光层具有较高的寿命稳定性。还提供了一种多元胺组合物、一种抛光层。

Description

一种抛光垫
相关申请的交叉引用
本申请要求申请日为2022年08月16日，申请号为202210978288.4，题名为“一种抛光垫”的优先权，以上中国专利申请的全部内容在此以引入方式并入本申请。
技术领域
本发明涉及化学机械平面化处理的抛光技术领域，具体而言，涉及一种抛光垫。
背景技术
CMP技术是一种将待加工工件表面朝下，以一定的压力向抛光垫施压，在流动抛光液介质(由纳米颗粒、化学氧化剂和液体介质组成的混合液)的条件下，借助于抛光垫和工件的相对运动，在纳米粒子的机械磨削及氧化剂的化学腐蚀作用下来完成对工件表面的材料去除，从而获得工件表面全局平坦化的技术。随着半导体工业沿着摩尔定律的曲线变化，趋势加工工艺向着更高的电流密度、更高的时钟频率和更多的互联层转移。由于期间尺寸的缩小、光学光刻设备焦深的减小，要求芯片表面可接收分辨率的平整度达到纳米级。而传统的平面化技术如基于淀积技术的选择淀积、溅射玻璃SOG、低压CVD、等离子体增强CVD、偏压溅射和属于结构的溅射后腐蚀、热回流、淀积-腐蚀-淀积等，虽然也能提供“光滑”的表面，却都是局部平坦化技术，不能做到全局平坦化。目前国际上普遍认为，器件特征尺寸在0.35μm以下时，必须进行全局平面化以保证光刻影响传递的精确度和分辨率，而CMP技术是目前国际公认唯一可以提供全局平面化的技术， CMP的良率严重芯片的收率。
随着特征尺寸技术节点向着深纳米的发展，互联金属线宽越来越窄，DRAM技术从30纳米级别发展到10纳米级别，NAND技术从平面发展到3D，CMP次数也越来越多，例如28nm逻辑芯片需要12～13次CMP，进入10nm制程之后CMP次数翻倍，达到了25～30次，这就对CMP制程耗材提出了更高的要求，更高的平坦化特性，更低的缺陷水平，更高的效率，更低的成本是半导体制程耗材的永恒话题。
受到疫情的影响，半导体制造厂商停产或减产，与之对应的是市场对芯片的需求的急剧增加，导致了近两年来的芯片短缺；虽然先进制程芯片诸如5nm、3nm随着手机等产品广为普通群众所知，但是市场最大份额仍在成熟制程，即28nm及以上制程，其更宽的线宽，更成熟的制程，虽然对CMP耗材的要求相对较低，但是对其成本的卡控更为严格例如，成熟制程对CMP抛光垫的寿命要求更加严格，通常将每张抛光垫的寿命使用到极致，因而对抛光垫的稳定性，尤其是寿命稳定性提出了极其苛刻的要求。
因此，亟待开发一款寿命稳定性高，更加适用于成熟制程的CMP抛光垫。
发明内容
针对现有技术中存在的问题，本发明的目的在于提供一种寿命稳定性高适合于成熟制程的抛光垫。
本发明第一方面提供一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物包含一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与三元胺分别占多元胺组合物总量的比例介于77％～96％： 3％～12％之间。
本发明第二方面提供一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物包含一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与四元胺分别占多元胺组合物总量的比例介于77％～96％：0.1％～10％之间。
进一步的，所述三元以上的多元胺包含四元胺，所述四元胺占多元胺组合物总量的比例介于0.1％～10％之间；
进一步的，所述二元胺和/或三元胺和/或三元以上的多元胺包含如结构式1所示的化合物：
其中，结构式1中X表示包含碳原子或表示包含结构式2或结构式3所示的结构片段中的一种或多种组合；
进一步的，所述多元胺组合物中包含有游离氯离子，所述游离氯离子的含量小于900ppm。
进一步的，所述多元醇组合物与多元胺组合物的总平均官能度不高于2.2；
进一步的，所述多官能异氰酸酯包括芳香族异氰酸酯或脂肪族异氰酸酯中的一种或多种组合；所述芳香族异氰酸酯包含2,4-甲苯二异氰酸酯、2,6- 甲苯二异氰酸酯、2,2’-二苯基甲烷二异氰酸酯、2,4’-二苯基甲烷二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、1,5-萘二异氰酸酯、对苯二异氰酸酯、间苯二异氰酸酯、对苯二亚甲基二异氰酸酯、间苯二亚甲基二异氰酸酯中的一种或多种组合；所述脂肪族异氰酸酯包含亚乙基二异氰酸酯、2,2,4-三甲基六亚甲基二异氰酸酯、1,6-六亚甲基二异氰酸酯、1，4-环己烷二异氰酸酯、4，4’-二环己基甲烷二异氰酸酯、异佛尔酮二异氰酸酯、降冰片烷二异氰酸酯中的一种或多种组合；
进一步的，所述多元醇组合物包含聚四亚甲基醚二醇、聚乙二醇、聚丙二醇、乙二醇、1,3-丁二醇、1,4-丁二醇、二甘醇、新戊二醇、2-甲基-1,3-丙二醇、己二醇、3-甲基-1,5-戊二醇、1,4-环己烷二甲醇中的一种或多种组合；
进一步的，所述抛光层的密度介于0.4～1.1g/cm3之间，邵氏硬度介于15～85D之间；
进一步的，所述抛光垫包括有缓冲层，粘胶层以及背胶层，所述抛光垫从上到下以此设置为：抛光层，粘胶层，缓冲层以及背胶层，所述粘胶层用于抛光层与缓冲层的粘合，所述背胶层用于抛光垫与抛光机台的粘合，所述背胶层还包含有离型纸或离型膜。
本发明第三方面提供一种多元胺组合物，包括一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与三元胺分别占多元胺组合物总量的比例介于77％～96％：3％～12％之间。
本发明第四方面提供一种多元胺组合物，包括一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述 多元胺组合物中二元胺与四元胺分别占多元胺组合物总量的比例介于77％～96％：0.1％～10％之间。
进一步的，所述三元胺以上的多元胺包括四元胺，所述四元胺占多元胺组合物总量的比例介于0.1％～10％之间；
进一步的，所述二元胺和/或三元胺和/或三元以上的多元胺包含结构式1所示的化合物：
其中，结构式1中X表示包含碳原子或表示包含结构式2或结构式3所示的结构片段中的一种或多种组合。
进一步的，所述多元胺组合物包括游离氯离子，所述游离氯离子的含量小于900ppm。
本发明第五方面提供一种抛光层，使用如上述任意一项所述的多元胺组合物与多官能异氰酸酯和多元醇组合物经反应得到。
本发明第六方面提供一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物通过下述条件下进行液相色谱分析获得的液相色谱图中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值介于5～30之间：
液相色谱分析条件：
测量样品：取多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶 液0.2ml加甲醇至2ml混合成10ppm溶液；
色谱柱：由Aglient制造的ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron；
色谱柱温度：40℃；
流动相：A:0.1％甲酸水溶液:B:甲醇＝20:80；
流动速率：0.5ml/min；
检测器：紫外检测器，波长254nm；
注入样品量：10μl。
本发明第七方面提供一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物通过下述条件下进行液相色谱分析获得的液相色谱图中，保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值介于10～400之间：
液相色谱分析条件：
测量样品：取多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶液0.2ml加甲醇至2ml混合成10ppm溶液；
色谱柱：由Aglient制造的ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron；
色谱柱温度：40℃；
流动相：A:0.1％甲酸水溶液:B:甲醇＝20:80；
流动速率：0.5ml/min；
检测器：紫外检测器，波长254nm；
注入样品量：10μl。
本发明第八方面提供一种抛光垫，包含抛光层，所述抛光层包含聚氨 酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物通过下述条件下进行液相色谱分析获得的液相色谱图中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积与保留时间为14.2～16min的峰面积的比介于：360～450：15～45：1～40之间；
液相色谱分析条件：
测量样品：取多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶液0.2ml加甲醇至2ml混合成10ppm溶液；
色谱柱：由Aglient制造的ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron；
色谱柱温度：40℃；
流动相：A:0.1％甲酸水溶液:B:甲醇＝20:80；
流动速率：0.5ml/min；
检测器：紫外检测器，波长254nm；
注入样品量：10μl。
有益效果：
本发明所提供的抛光垫，其中的抛光层中具有一定交联程度的聚氨酯基材，采用具有多官能度的材料对交联程度进行控制，与常规过量游离的异氰酸酯基团微交联相比，具有更高的可控性，具有较低的加工条件要求，具有更宽的加工窗口，所形成的抛光层具有更高的寿命稳定性，对于不同切削能力的金刚石修整盘具有更加宽的适用范围，从而达到更稳定的使用性能，此外由于多官能原料的引入，可以更方便的调节交联程度，调节更加合适的力学性能，在抛光过程中具有更加稳定的去除速率表现。
附图说明
为了更清楚的说明本申请实施例中的技术方案，下面将对实施例中所需要的使用的附图进行简要介绍，显而易见的，下面描述的附图仅为本申请的一部分实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他附图。
图1为本发明涉及的实施例中抛光垫进行抛光作业过程示意图；
图2为本发明涉及的实施例提供的抛光垫的示意图；
图3-1为本发明涉及的二元胺LC-MS液相峰面积与浓度拟合关系图；
图3-2为本发明涉及的三元胺LC-MS液相峰面积与浓度拟合关系图；
图3-3为本发明涉及的四元胺LC-MS液相峰面积与浓度拟合关系图；
图4-1为本发明涉及的二元胺LC-MS液相峰面积示意图；
图4-2为本发明涉及的三元胺LC-MS液相峰面积示意图；
图4-3为本发明涉及的四元胺LC-MS液相峰面积示意图；
1-待抛光材料；2-抛光垫；3-抛光机台；4-支架；5-抛光液；20-抛光层；
21-粘胶层；22-缓冲层；23-背胶层。
具体实施方式
下面将结合实施例对本发明的实施方案进行详细的描述，但是本领域人员将会理解，下列实施例仅用于说明本发明而不是对发明范围的限定，实施例中未注明的具体条件者，按照常规条件，或者制造商的建议条件下进行，所用试剂或仪器未注明生产商的，均可以通过市售或购买获得的常规产品。
<半导体器件的制造方法>
半导体器件是经过了使用抛光垫来抛光半导体晶片表面的工序而制造的，半导体晶片一般是指在硅晶片上层叠了配线金属以及氧化膜的晶片，本发明半导体器件的制造方法，包括使用抛光垫对半导体晶片的表面进行 抛光的工序，对抛光装置没有特别的限制。
例如，使用如图1所示的抛光装置等进行，该抛光装置具有支承抛光垫2的抛光机台3，用于对支撑待抛光材料-半导体晶片1的支架4和晶片进行均匀加压的背衬材料、以及抛光液5的供给机构。抛光垫2例如通过背胶层粘附而被安装到抛光机台3上。抛光机台3和支架4被配置成各自所支撑的抛光垫2和半导体晶片1相对，并各自具备旋转轴。另外，在支架4一侧设置有用于将半导体晶片1压接到抛光垫2上的加压机构。在进行抛光时，使抛光机台3和支架4旋转，并将半导体晶片1压接到抛光垫2上，边供给浆料边进行抛光。浆料的流量、抛光荷重、抛光机台转速和晶片转速没有特别限制，可进行适当调节。
由此，半导体晶片1的表面的突出部分被除去，抛光成平坦状。此后，通过划片、焊接、封装等，制成半导体器件，半导体器件用于运算处理装置、储存设备等中。
<抛光垫>
本发明中的抛光垫如图2所示，包括有抛光层20、缓冲层22、粘胶层21以及背胶层23，本发明中的抛光垫从上到下依次设置为抛光层20、粘胶层21、缓冲层22、背胶层23，其中粘胶层21用于抛光层20与缓冲层22的贴合，背胶层23还包含有离型膜或离型纸，使用时撕掉离型膜或离型纸即可实现抛光垫与抛光机台的粘合。
<抛光层>
本发明中的抛光层具有一定的交联程度，抛光层是由具有5～100μm孔隙分隔连续的聚氨酯基材形成的闭孔弹性体，所述聚氨酯基材包含热塑性聚氨酯或热固性聚氨酯中的一种或两者组合。
本发明中抛光层的密度介于0.4～1.1g/cm3之间，优选的，抛光层的密度介于0.5～1.06g/cm3之间，特别优选的，抛光层的密度介于0.51～1.0g/cm3 之间，抛光层的邵氏硬度介于15～85D之间，优选的，抛光层的邵氏硬度介于40～70D之间，特别优选的，抛光层的邵氏硬度介于52～68D之间。
多官能异氰酸酯
本发明中多官能异氰酸酯包含但不限于芳香族异氰酸酯或脂肪族异氰酸酯中的一种或多种组合，优选使用80mol％以上的芳香族异氰酸酯，进一步优选使用95mol％以上的芳香族异氰酸酯，特别优选使用100mol％的芳香族异氰酸酯。
芳香族异氰酸酯包括2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、2,2’-二苯基甲烷二异氰酸酯、2,4’-二苯基甲烷二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、1,5-萘二异氰酸酯、对苯二异氰酸酯、间苯二异氰酸酯、对苯二亚甲基二异氰酸酯、间苯二亚甲基二异氰酸酯中的一种或多种组合。
脂肪族异氰酸酯包括亚乙基二异氰酸酯、2,2,4-三甲基六亚甲基二异氰酸酯、1,6-六亚甲基二异氰酸酯、1，4-环己烷二异氰酸酯、4，4’-二环己基甲烷二异氰酸酯、异佛尔酮二异氰酸酯、降冰片烷二异氰酸酯中的一种或多种组合。
本发明中出于反应活性以及抛光垫的物理性能考虑，优选使用2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、4，4’-二环己基甲烷二异氰酸酯中的一种或多种组合。
多元醇组合物
本发明中多元醇组合物可以包含有基于聚醚的高分子量二元醇，其中基于聚醚的高分子量二元醇包括但不限于聚四亚甲基醚二醇(PTMEG)、聚乙二醇(PEG)、聚丙二醇(PPG)以及聚四亚甲基醚二醇-聚乙二醇、聚四亚甲基醚二醇-聚丙二醇、聚乙二醇-聚丙二醇中的一种或多种组合，或者乙二醇、丙二醇、丁二醇或者具有两个羟基的引发剂与上述三个小分子二元醇进行均聚或者共聚形成的高分子多元醇，或多种组合物。
本发明中多元醇组合物可以包含有小分子二元醇，其中小分子包括但不限于乙二醇、1,3-丁二醇、1,4-丁二醇、二甘醇、新戊二醇、2-甲基-1,3-丙二醇、己二醇、3-甲基-1,5-戊二醇、1,4-环己烷二甲醇中的一种或多种组合。
本发明中多元醇组合物还可以包含有基于聚酯的多元醇，其中基于聚酯的多元醇是由二元醇或二元醇/酚与二元酸通过缩合反应所得，其中二元醇包括乙二醇、1,3-丁二醇、1,4-丁二醇、二甘醇、新戊二醇、2-甲基-1,3-丙二醇、己二醇、3-甲基-1,5-戊二醇、1,4-环己烷二甲醇中的一种或多种组合，优选地，二元醇包括1,4-丁二醇，己二醇中的一种或两者组合；二元醇/酚为对苯二酚、间苯二酚、萘二酚、双酚A、双酚S、对苯二甲醇、间苯二甲醇、邻苯二甲醇、2,5-呋喃二甲醇、对苯二甲醇或二苯醚二酚中的一种或多种组合，优选地，二元醇/酚为对苯二酚、对苯二甲醇中的一种或两者组合；二元酸为丁二酸、己二酸、壬二酸、葵二酸中的一种或多种组合。
本发明中多元醇组合物还可以包含官能度大于2的小分子多元醇作为引发剂形成的聚醚、聚酯与官能度为2的二元醇相混合所得的多元醇；或者官能度大于2的小分子多元醇与官能度为2的高分子多元醇相混合所得的多元醇，混合后多元醇平均官能度不高于2.2。官能度大于2的小分子多元醇可以列举但不限于：丙三醇、季戊四醇、三羟甲基丙烷、氧化丙烯四醇、木糖醇、山梨醇、甘露醇中一种或者多种组合。
上述平均官能度为平均每个分子中羟基数的算术平均值，所述的多元醇其数均分子量介于500～3000之间，作为一种可选示例，聚醚多元醇可以是一种单一的数均分子量介于500～3000之间聚醚多元醇，也可以是两种或者两种以上500～3000之间的聚醚多元醇组成的混合物，也可以是数均分子量大于5000的一种聚醚与小分子乙二醇、丁二醇、山梨醇相混合而得到数均分子量介于500～3000之间聚醚和/或小分子多元醇的混合物。
本发明中聚氨酯基材可以应用熔融法、溶液法等公知的聚氨酯化技术进行制造，还可以通过预聚体法，一次注入法等常规的方法中的任意一种进行制造，预聚体法是先由多官能异氰酸酯与多元醇组合物成分合成的异氰酸酯封端的预聚体并使其与多元胺组合物反应；一次注入法是将多官能异氰酸酯、多元醇组合物以及多元胺组合物进行一步进行的反应；本发明中优选使用预聚体法进行聚氨酯基材的合成。
上述异氰酸酯封端的预聚体可以由上述多官能异氰酸酯与多元醇组合物反应得到，也可以通过购买市售预聚体产品得到。
作为市售的异氰酸酯封端的预聚体包括但不限于科聚亚(Chemtura)公司生产的系列预聚物：L325、LF800A、LF900A、LF910A、LF930A、LF931A、LF939A、LF950A、LF952A、LF600D、LF601D、LF650D、LF667D、LF700D、LF750D、LF751D、LF752D、LF753D、LFG963A、LFG964A、LFG740D中的任意一种或多种组合。
本发明中异氰酸酯封端的预聚体中包含有6.0～9.5wt％的未反应的异氰酸基团(-NCO)，优选的，本发明中异氰酸酯封端的预聚体中包含有8.0～9.5wt％的未反应的异氰酸基团(-NCO)，特别优选的，本发明中异氰酸酯封端的预聚体中包含有8.5～9.5wt％的未反应的异氰酸基团(-NCO)。
多元胺组合物
本发明中多元胺组合物包含有一种和/或多种二元胺和/或三元及以上多元胺的组合物，其中多元胺组合物中平均分子量介于200～400之间，多元胺组合物的平均官能度大于2且不高于2.20，优选的，固化剂组合物的平均官能度不低于2.01且不高于2.15，特别优选的，多元胺组合物的平均官能度不低于2.01且不高于2.09，考虑到聚合物微观形态对抛光层性能的影响。
本发明提供一种多元胺组合物，其中二元胺与三元胺分别占多元胺组 合物总量的比例介于77％～96％：3％～12％之间，优选介于87％～95％：4％～11％之间，特别优选介于87％～91％：6％～10％之间，其中二元胺的总量不超过96％，原因在于，当二元胺超过96％抛光垫抛光效果不佳，另一方面二元胺的含量不宜过低，当二元胺的含量低于77％以后，会使得抛光垫的抛光寿命不足。
此处单一组分胺化合物占多元胺组合物总量的比例为质量百分比，其他组分胺化合物占多元胺组合物总量的比例均为质量百分比。
作为优选方案，多元胺组合物中还包含有三元以上的多元胺，其中三元及以上多元胺包含四元胺、五元胺、六元胺、七元胺、八元胺等常见的多元胺中的一种或多种组合，考虑到抛光性能与抛光寿命的影响，优选四元胺、五元胺，特别优选四元胺；作为优选方案包含有四元胺的多元胺组合物中，二元胺、三元胺以及四元胺分别占多元胺组合物总量的比例介于77％～96％：3％～12％：0.1％～10％之间，优选的，二元胺、三元胺以及四元胺分别占多元胺组合物总量的比例介于87％～95％：4％～11％：0.1％～2％之间，三元胺以及四元胺的含量不宜过高，过高的三、四元胺会导致抛光垫使用寿命降低。
本发明还提供一种包含有二元胺以及四元胺的多元胺组合物，其中二元胺与四元胺分别占多元胺组合物总量的比例介于77％～96％：0.1％～10％之间；多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，优选的，固化剂组合物的平均官能度不低于2.01且不高于2.15，特别优选的，多元胺组合物的平均官能度不低于2.01且不高于2.09；优选的，多元胺组合物中二元胺与四元胺分别占多元胺组合物总量的比例介于87％～95％：0.1％～2％之间。
本发明中考虑到脂肪族多元胺的会使得固化后的抛光层硬度降低，去除速率降低，以及压缩率过高等问题，因此，本发明中优选不包含有脂肪 族多元胺，进一步优选二元胺和/或三元胺及三元以上的多元胺仅包含芳香族多元胺，特别优选二元胺和/或三元胺及三元以上的多元胺包含结构式1所示的化合物：
结构式1中X表示包含碳原子或结构式2或结构式3所示的结构片段中的一种或多种组合。
当X表示碳原子时，结构式1表示二元胺，优选包含以下如结构式4所示的化合物：
当X表示结构式2所示的结构时，结构式1表示三元胺，优选包含以下如结构式5所示的化合物：
当X表示结构式3所示的结构时，结构式1表示四元胺，优选包含以下如结构式6所示的化合物中的一种或多种组合：
上述多元胺组合物中可以为市售途径购买得到的本领域常规的二元胺、三元胺、四元胺组合后得到，也可以为通过本领域常规的合成方法进行合成后直接得到或合成后经分离组合而得到。
作为合成方法的举例，可以选择使用邻氯苯胺与甲醛反应制备，具体制备方法如下：
1、室温下，将一定量的去离子水加入反应釜中，加入一定量37％的盐酸，在良好的搅拌情况下加入一定量纯度为99％的邻氯苯胺，形成邻氯苯胺盐酸盐溶液；
2、在惰性气体保护下，控制温度低于35℃的情况下，将一定含量的甲醛水溶液匀速滴入反应釜内，滴加完毕后使用梯度升温，保证邻氯苯胺与甲醛充分反应，可选择的，梯度升温为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h，每个梯度升温的升温时间均为0.5～1h，反应完全后降温至50～60℃；
3、随后调节pH至大于12，静置12～24h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后静置，分离水相后重复用水洗涤5～8次，保证有机盐充分洗净；
4、充分洗涤后分析有机相，降温使得有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，即可得到多元胺组合物G1，计算收率即可。
经过研究发现，通过控制反应条件及原料配比，可以有效控制多元胺组合物中各种多元胺化合物占多元胺组合物总量的比例，通过控制二元胺、三元胺、四元胺占多元胺组合物总量的比例在一定的范围内，可以有效提高抛光层的使用寿命。
因此，为了确定抛光层中二元胺、三元胺、四元胺分别占多元胺组合物总量的质量百分比，作为可选择的方案，使用标准曲线法进行计算，标准曲线可使用LC-MS或HPLC测定，标准曲线测试样品可使用上述多元胺组合物制备方法制备而来的多元胺组合物G1作为标准曲线测试样品，也可以使用经过固化后抛光层经过水解、后处理以及分离纯化等操作后得到的多元胺组合物G2作为标准曲线测试样品。
本发明还提供一种由固化后的抛光层中水解、后处理以及分离纯化得到多元胺组合物G2的方法，包括以下步骤：
1、水解反应投料：在水热合成反应釜中加入含有多元胺组合物G2的细碎抛光层，在一定量的NaOH溶液以及无水乙醇中150℃下搅拌10h。
2、反应预处理：待反应时间结束后，冷却至室温后，将上述液体在40～50℃条件下进行旋蒸。
3、萃取分离：取上述旋蒸后溶液加入30～50ml的二氯甲烷继续搅拌，随后使用分液漏斗进行水油分离，收集有机相，随后将水相再次加入30～50ml的二氯甲烷反复萃取两次，将得到的所有有机相加入适量干燥剂进行除水，随后使用旋蒸将二氯甲烷彻底分离后称重即可得到多元胺组合物G2。
本发明中标准曲线的测定：可将单独一定量的二元胺、三元胺、四元胺的标准样品溶解于溶剂中，配置成一定浓度的溶液，分别取一定量的上述溶液稀释成具有一定浓度梯度的溶液，随后分别将上述具有一定浓度梯度的溶液进行LC-MS(液质联用)分析，得到浓度(ppm)与液相色谱峰 面积的关系，分别以浓度(ppm)以及液相色谱峰面积为横纵坐标，做出散点图，随后使用软件进行线性拟合，得到其中的斜率、截距以及R2值。
本发明中标准曲线法测量二元胺、三元胺、四元胺分别占多元胺组合物总量的质量百分比可以使用以下方法进行测量。
二元胺：称取二元胺标准样品0.005g于10ml离心管中，再加入甲醇总质量为5.00g。取上述配制完成的溶液0.1ml，加甲醇至10ml混合成A(10ppm)溶液。分别取A溶液0.2ml+甲醇1.8ml、0.6ml+甲醇1.4ml、1.0ml+甲醇1.0ml和1.4ml+甲醇0.6ml制成1、3、5、7ppm的溶液，加上未进行稀释的10ppm的溶液组成具有浓度梯度的二元胺标准样品溶液。
三元胺：称取三元胺标准样品0.005g于10ml离心管中，再加入甲醇总质量为5.00g。取上述配制完成的溶液0.1ml，加甲醇至10ml混合成B(10ppm)溶液。分别取B溶液0.2ml+甲醇1.8ml、0.6ml+甲醇1.4ml、1.0ml+甲醇1.0ml和1.4ml+甲醇0.6ml制成1、3、5、7ppm的溶液，加上未进行稀释的10ppm的溶液组成具有浓度梯度的三元胺标准样品溶液。
四元胺：称取四元胺标准样品0.005g于10ml离心管中，再加入甲醇总质量为5.00g。取上述配制完成的溶液0.1ml，加甲醇至10ml混合成C(10ppm)溶液。分别取C溶液0.2ml+甲醇1.8ml、0.6ml+甲醇1.4ml、1.0ml+甲醇1.0ml和1.4ml+甲醇0.6ml制成1、3、5、7ppm的溶液，加上未进行稀释的10ppm的溶液组成具有浓度梯度的四元胺标准样品溶液。
将上述具有浓度梯度的二元胺、三元胺、四元胺标准样品溶液进行LC-MS(液质联用)分析，作为分析仪器的举例，可使用Aglient 1220 HPLC(色谱柱：Aglient型号：ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron)、Agilent G6125C MS，其中HPLC流动相为0.1％甲酸水溶液：甲醇＝20:80，流速0.5ml/min，色谱柱柱温可使用40℃，标准样品进样量为10μl，检测器使用紫外检测器，其中波长为254nm。
其中，二元胺的保留时间在7.0～7.8min之间，三元胺的保留时间在10～11min之间，四元胺的保留时间在14.2～16min之间。
作为举例：二元胺，三元胺，四元胺的标准曲线见图3-1、3-2、3-3，图3-1所示二元胺的标准曲线为y2＝48.429x2-1.2514，拟合优度R2＝0.9995，其中，y2表示二元胺液相色谱峰面积，x2表示二元胺标准溶液的浓度(ppm)；图3-2所示三元胺的标准曲线为y3＝37.969x3+0.4591，拟合优度R2＝0.9996，其中，y3表示三元胺液相色谱峰面积，x3表示三元胺标准溶液的浓度(ppm)；图3-3所示四元胺的标准曲线为y4＝37.983x4+0.6908，拟合优度R2＝0.9998，其中，y4表示四元胺液相色谱峰面积，x4表示四元胺标准溶液的浓度(ppm)。
本领域技术人员知道，本说明书中所列举出的通过LC-MS的标准曲线法测量抛光层中二元胺，三元胺以及四元胺分别占多元胺组合物总量的质量百分比的方法并不对本发明权利要求的范围进行任何限定，需要知道的是，可以通过任何方法测得本发明所要保护的抛光层中二元胺、三元胺以及四元胺分别占多元胺组合物总量的质量百分比都适用于本发明的保护范围。
本发明中取上述多元胺组合物G1或G2配置成浓度为10～100ppm的标准曲线测试样品，以与标准样品相同的分析条件进行LC-MS分析，得到结果，将得到的标准曲线测试样品的三种胺化合物的液相色谱峰面积代入上述二元胺、三元胺、四元胺的标准曲线中，计算出分析样品中二元胺、三元胺以及四元胺的浓度(ppm)，随后计算即可得到二元胺、三元胺以及四元胺分别占多元胺组合物总量的质量百分比。
作为标准溶液测试样品的举例，可使用多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶液0.2ml加甲醇至2ml混合成10ppm溶液，本发明可根据实际使用其情况对上述标准曲线测试样品的浓度进行调变。
本发明中通过上述测试条件得到二元胺、三元胺以及四元胺的液相色谱峰面积满足以下关系，其中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值介于5～30之间；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值介于10～400之间。
其中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积与保留时间为14.2～16min的峰面积的比介于：360～450：15～45：1～40之间。
本领域技术人员知道，本说明书中所列举出的通过LC-MS确定抛光层中二元胺，三元胺以及四元胺的液相峰面积比值的方法并不对本发明权利要求的范围进行任何限定，需要知道的是，可以通过任何方法测得本发明所要保护的抛光层中二元胺、三元胺以及四元胺的液相峰面积比值都适用于本发明的保护范围。
本发明研究发现，通过控制多元胺组合物与多元醇的总平均官能度在一定的范围内，会使得抛光层具有较高的使用寿命，考虑到抛光层的硬度，本发明中控制多元胺组合物与多元醇的总平均官能度不高于2.2，当多元胺组合物与多元醇的总平均官能度高于2.2时，抛光层变得硬而脆，严重影响使用寿命，因此在选择多元胺组合物以及多元醇时，避免同时选择平均官能度较高的两者；因此，本发明中优选使用平均官能度低的多元醇与平均官能度高的多元胺组合物结合，更或是使用平均官能度低的多元醇与平均官能度低的多元胺组合物结合。
本发明中多元胺组合物中包含有一定含量的游离氯离子，考虑到氯离子含量过高会导致氯离子与被抛光金属氧化后产生的金属离子发生络合反应，从而影响抛光速率的稳定性，因此，本发明中控制氯离子含量低于900ppm，优选本发明中控制氯离子含量低于100ppm，特别优选控制氯离子含量低于10ppm。
其他添加剂
本发明中为了使得抛光层具有适当的密度以及优异的物理性能，通常会对聚氨酯基材进行发泡处理，常用的发泡工艺包含有机械发泡或微球发泡等。
可选择的，作为机械发泡，可选择使用聚烷基硅氧烷和聚醚的共聚体且不含活性氢基的硅酮作为表面活性剂，加以机械搅拌，可实现聚氨酯基材的机械发泡，可选择的，表面活性剂诸如L5340(NIHON UNICA制造)、SH-192(Dow Corning Toray Silicone Co.，Ltd.制造)等。
可选择的，作为微球发泡，通常将中空微球聚合物均匀的分散在聚氨酯基材中，实现对抛光层性能的调整，本发明中的术语“中空微球聚合物”是指一种可膨胀的中空聚合物微球体，可在固化过程中借助反应放热导致的温度升高而适度膨胀。通过调整中空微球聚合物在聚氨酯抛光层中分布方式(如密度)并结合调节中空微球聚合物的粒度，可以进一步调节抛光层的抛光性能。优选的，中空微球聚合物分散在抛光层中可使抛光层最终具有的孔隙率为1～60％，特别优选的，孔隙率为15～45％。
优选的，中空微球聚合物包括但不限于具有聚丙烯腈和聚丙烯腈共聚物外壁的囊状结构，可以采购自阿克苏诺贝尔公司、松本油脂制药株式会社或积水化学工业株式会社任意一家公司的微球或微珠，特别优选的，本发明实施例中选择阿克苏诺贝尔公司(AkzoNobel)中空微球或松本微珠F系列。
本发明中，聚氨酯基材中还可以添加适当的改性剂，以便获得更加优异的综合性能改进。优选的，这些改性剂可改抛光层的至少一个性质，上述性质包括但不限于以下各项构成的组：孔隙度、刚性、表面能量、抗磨性、传导性，以及化学功能。改性材料包括但不限于：抗氧化剂、润滑剂、颜料、填充剂、防带电剂等。
沟槽
本发明中，抛光层可按本领域常规设有沟槽，沟槽用于在抛光过程中接收抛光液。沟槽可在所述抛光层成型之后经加工获得。沟槽的设置能够确保抛光过程中所用的抛光液的平稳排放和流动。优选的，沟槽为同心圆沟槽(例如可以是环状或螺旋状的沟槽)、曲线沟槽、网格线沟槽、正多边形沟槽(例如，六边形、三角形)、和轮胎面型图案中的一种或多种。特别优选的，沟槽为环状沟槽、螺旋沟槽、X～Y网格沟槽、六边形沟槽、三角形沟槽和分形沟槽中的一种或多种。特别优选的，沟槽的横截面为直侧壁矩形、“V”形、“U”形和锯齿形中的一种或多种。
可选择的，沟槽的宽度为0.1～0.6mm，沟槽深度为0.5～0.9mm，相邻沟槽间槽间距为2～5mm，可设置中心留白区域或不设置中心留白区域，其中，中心留白区域半径为60mm～70mm。
<缓冲层、中间胶、背胶层>
本发明中抛光垫还包含有缓冲层，在CMP中，为兼顾互为折中关系的平面性和均匀性两者，需要缓冲层。平面性是指对具有在图案形成时产生的微小凹凸的被抛光材料进行抛光时的图案部的平坦性，均匀性是指被抛光材料整体的均匀性。利用抛光层的特性，改善平面性，利用缓冲层的特性，改善均匀性。在本发明的抛光垫中，缓冲层优选使用比抛光层柔软的材料。
作为缓冲层可列举诸如：聚酯无纺布、尼龙无纺布、丙烯腈系无纺布等纤维无纺布、浸渍了聚氨酯的聚酯无纺布这样的树脂浸渍无纺布、聚氨酯泡沫、聚乙烯泡沫等高分子树脂发泡体、丁二烯橡胶、异戊二烯橡胶等橡胶性树脂、感光性树脂等。
作为将抛光层和缓冲层贴合的方法，使用中间胶实现，中间胶可选择使用双面胶带，将抛光层和缓冲层置于中间胶两侧进行压制。
本发明的抛光垫还包括背胶层，作为背胶层同样可选择使用双面胶带， 作为背胶层的组成，可列举出例如，橡胶系粘接剂、丙烯酸系粘接剂等。考虑金属离子的含量，丙烯酸系粘接剂的金属离子含量少，故优选。
本发明中背胶层还包含有离型膜或离型纸，使用之前撕掉离型膜或离型纸即可实现抛光垫与抛光机台的粘合。
<终点检测窗>
本发明中的抛光层可根据实际需要设置有终点检测窗，可选择的，在抛光层中形成至少一个终点检测区域，在进行抛光作业时，抛光层的终点检测区域能够进行高精度的光学终点检测，检测方法可以是光学检测。通过使终点检测区域由适当的材料制作而成，使其具有适当的光透过率，以便观测被抛光物体(如硅晶片)。作为优选方案，形成终点检测区域的材料在波长300～800的整个范围内的透光率不低于20％，进一步优选，高透光率材料的光透过率不低于60％。
作为优选方案，终点检测区域的材料包括但不限于聚氨酯树脂，聚酯树脂，酚树脂，尿素树脂，三聚氰胺树脂，环氧树脂以及丙烯酸树脂等热固性树脂；聚氨酯树脂，聚酯树脂，聚酰胺树脂，纤维素类树脂，丙烯酸树脂，聚碳酸酯树脂，含卤素树脂(聚氯乙烯、聚四氟乙烯以及聚偏氟乙烯等)、聚苯乙烯及烯烃类树脂(聚乙烯、聚丙烯等)热塑型树脂中的一种或多种组合。
作为优选方案，在进行抛光作业时，终点检测区域的邵氏硬度为40～75D，进一步优选55～70D，当终点检测区域的邵氏硬度小于40D时，该区域容易发生蠕变，难以稳定的进行光学终点检测，而当邵氏硬度超过75D时被抛光材料表面容易产生划痕。
<抛光处理>
本发明中涉及的抛光垫，半导体常用制程均可应用，作为常见的制程举例，包括但不限于：STI制程，Oxide制程，W制程，Al制程，Copper 制程，Poly制程。
抛光处理：使用如图1所示的抛光装置等进行，该抛光装置具有支承抛光垫2的抛光机台3，用于对支撑待抛光材料-半导体晶片1的支架4和晶片进行均匀加压的背衬材料、以及抛光液5的供给机构。抛光垫2例如通过背胶层粘附而被安装到抛光机台3上。抛光机台3和支架4被配置成各自所支撑的抛光垫2和半导体晶片1相对，并各自具备旋转轴。另外，在支架4一侧设置有用于将半导体晶片1压接到抛光垫2上的加压机构。在进行抛光时，使抛光机台3和支架4旋转，并将半导体晶片1压接到抛光垫2上，边供给浆料边进行抛光。浆料的流量、抛光荷重、抛光机台转速和晶片转速没有特别限制，可进行适当调节。
实施例
为了便于理解本发明，本发明列举实施例如下，本领域技术人员应该明了，所述实施例仅仅是帮助理解本发明，并不应视为对本发明的具体限定。
实施例中标号释义：
TDI100：100％2,4-甲苯二异氰酸酯；
TDI80：80％2,4-甲苯二异氰酸酯，20％2,6-甲苯二异氰酸酯；
HMDI：4，4’-二环己基甲烷二异氰酸酯；
PTMEG：聚四亚甲基醚二醇；
MOCA：4，4’-亚甲基-双-(2-氯苯胺)；
M-CDEA：4，4’-亚甲基-双-(3-氯-2,6-二乙苯胺)；
DETDA：3,5-二乙基甲苯二胺；
D2000：氨基封端的聚氧化丙烯醚；
T5000：三官能度聚醚胺；
DEG：二甘醇；
中空微球聚合物：平均粒径40μm，密度0.042g/cm3，平均粒径20μm，密度0.07g/cm3。
上述原料均来自市售大宗工业品，厂家包括巴斯夫、科思创、万华化学、苏州湘园、池州天赐、三井化学、三菱化学等。
Di-A：二元胺；
Tri-A：三元胺；
Tetra-A：四元胺；
上述Di-A，Tri-A以及Tetra-A通过制备例1～8中任意一项制备而来的多元胺组合物分离后得到。
以下涉及的理化参数测定方法以及其他参数的计算方法如下：
抛光层的邵氏硬度
使用REX数显邵氏D型自动测量硬度计、Bareiss数显邵氏D型自动测量硬度计进行测量，将待测样品冲切成3＂×3＂正方形样本的试样，待测样品厚度不小于5mm，测量点距试样任一边缘至少9mm，同一试样上至少相隔6mm测量硬度值，取最大值，试样需要在23±2℃，湿度50％±10％标准环境下测试。
抛光层的密度
按以下公式计算：S.G＝m/v＝m/(π(d/2)^2*h)，其中m为抛光层重量，d为抛光层直径，h为抛光层厚度。
游离氯离子含量测定
取一定量的多元胺组合物，溶解后超声以3000～10000r/min离心10min，取上清液，使用阴离子色谱进行测试。
二元胺、三元胺以及四元胺分别占多元胺组合物总量的质量百分比
取多元胺组合物配置成浓度为10ppm的溶液，使用Aglient 1220 HPLC(色谱柱：Aglient型号：ZORBAX Eclipse XDB-C18，4.6*250mm， 5-Micron)、Agilent G6125C MS进行测量，其中HPLC流动相为0.1％甲酸水溶液：甲醇＝20:80，流速0.5ml/min，色谱柱柱温可使用40℃，标准样品进样量为10μl，检测器使用紫外检测器，其中波长为254nm。
多元胺组合物平均官能度
其中：公式1中X2、X3及X4分别为二元胺、三元胺以及四元胺分别占多元胺组合物总量的质量百分比；M2胺，M3胺，M4胺分别表示二元胺、三元胺以及四元胺的分子量。
多元胺组合物平均分子量
其中：公式2中X2、X3及X4分别为二元胺、三元胺以及四元胺分别占多元胺组合物总量的质量百分比；M2胺，M3胺，M4胺分别表示二元胺、三元胺以及四元胺的分子量。
多元胺组合物与多元醇组合物的总平均官能度
其中：公式3中X2、X3及X4分别为二元胺、三元胺以及四元胺分别占多元胺组合物总量的质量百分比，m表示多元胺组合物的质量，C2、C3、C4、Cn表示官能度为2、3、4、n的多元醇的质量；M2胺，M3胺，M4胺分别表示二元胺、三元胺以及四元胺的分子量；M2醇，M3醇，M4醇，Mn醇分别表示二元醇、三元醇以及四元醇或多元醇的分子量。
抛光垫的抛光性能评价
对于制备的实施例及对比例中的抛光垫进行上机测试，对抛光性能进行评价，测试条件如下：
测试机台为AMAT Refelxion(Modify 5Zone)；
抛光液为ANJI U3061A(slurry(g):DIW(g):30％H2O2(g)＝1:10:0.37)，流速300mL/min；
修整盘为Saesol Disk AJ27，6lbf，in-situ 100％；Platen/Head Speed＝97/91；
Zone Pressure：RR/Z1/Z2/Z3/Z4/Z5:5.90/5.10/2.40/2.15/2.10/2.20；
所用的晶圆(wafer)为Patten wafer:Semitech 754,Cu Blanket wafer Pre Thickness 10～12KA。
记录在抛光过程中去除速率的变化，记录0/5hrs/10hrs/15hrs/20hrs的数据，并且记录0/5hrs/10hrs/15hrs/20hrs研磨速率不均一性(NU)的变化并计算出平均值，使用四探针膜厚仪(NAPSON Crestest/RG3000)。
抛光垫的寿命评价
将实施例及对比例中的抛光垫，通过修整器长时间的切削，测试其极限使用寿命，即将参数相同(沟槽深30mil，沟槽宽20mil，槽间距120mil，中心留白区域半径为60～70mm)的沟槽切削完所需要的时间。
Defect评价
被抛光基材抛光后材料上的缺陷(defect)使用科磊公司(KLA-Tencor)可获得的SP2缺陷检查系统进行检查，检测缺陷的尺寸：0.16μm；○○表示几乎无defect，○表示有极少量defect，×表示有少量defect，××表示有较多defect，×××表示有大量defect。
制备例1
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸118.25kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺128.86kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液41.39kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温 时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液249.6kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B1 126.56kg。多元胺组合物B1中Di-A组分占多元胺组合物的质量百分比为90.86％，Tri-A组分占多元胺组合物的质量百分比为6.46％，Tetra-A组分占多元胺组合物的质量百分比为1.09％，多元胺组合物的平均官能度2.06，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为18；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为91，其中保留时间为7.0～7.8min的峰面积为430.2，保留时间为10～11min的峰面积为24.5，保留时间为14.2～16min的峰面积为4.8。
制备例2
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸130.08kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺141.75kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液47.32kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液274.56kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有 机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B2 124.16kg。多元胺组合物B2中Di-A组分占多元胺组合物的质量百分比为87.21％，Tri-A组分占多元胺组合物的质量百分比为9.83％，Tetra-A组分占多元胺组合物的质量百分比为1.92％，多元胺组合物的平均官能度2.09，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为11；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为53，其中保留时间为7.0～7.8min的峰面积为412.9，保留时间为10～11min的峰面积为37.1，保留时间为14.2～16min的峰面积为7.8。
制备例3
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸120.97kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺131.83kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液40.26kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液247.10kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B3 131.12kg。多元胺组合物B3中Di-A组分占多元胺组合物的质量百分比为94.83％，Tri-A组分占多元胺组合物的质量百分比为4.13％，Tetra-A组分占多元胺组 合物的质量百分比为0.12％，多元胺组合物的平均官能度2.03，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为28；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为395，其中保留时间为7.0～7.8min的峰面积为449.1，保留时间为10～11min的峰面积为15.8，保留时间为14.2～16min的峰面积为1.1。
制备例4
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸120.97kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺126.45kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液42.12kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液247.75kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B4 127.52kg。多元胺组合物B4中Di-A组分占多元胺组合物的质量百分比为88.31％，Tri-A组分占多元胺组合物的质量百分比为8.29％，Tetra-A组分占多元胺组合物的质量百分比为1.86％，多元胺组合物的平均官能度2.08，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为13；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为55，其中保留时间为7.0～7.8min的峰面 积为418.1，保留时间为10～11min的峰面积为31.3，保留时间为14.2～16min的峰面积为7.6。
制备例5
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸120.97kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺127.56kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液42.94kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液247.52kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B5 125.85kg。多元胺组合物B5中Di-A组分占多元胺组合物的质量百分比为81.84％，Tri-A组分占多元胺组合物的质量百分比为9.95％，Tetra-A组分占多元胺组合物的质量百分比为7.32％，多元胺组合物的平均官能度2.15，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为10；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为14，其中保留时间为7.0～7.8min的峰面积为387.4，保留时间为10～11min的峰面积为37.5，保留时间为14.2～16min的峰面积为28.0。
制备例6
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸 128.03kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺143.75kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液48.91kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液274.56kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B6 124.16kg。多元胺组合物B6中Di-A组分占多元胺组合物的质量百分比为77.12％，Tri-A组分占多元胺组合物的质量百分比为11.84％，Tetra-A组分占多元胺组合物的质量百分比为9.98％，多元胺组合物的平均官能度2.20，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为8；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为10，其中保留时间为7.0～7.8min的峰面积为365.0，保留时间为10～11min的峰面积为44.5，保留时间为14.2～16min的峰面积为37.9。
制备例7
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸129.42kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺140.81kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液48.95kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为： 35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液274.12kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B7 128.42kg。多元胺组合物B7中Di-A组分占多元胺组合物的质量百分比为66.38％，Tri-A组分占多元胺组合物的质量百分比为18.94％，Tetra-A组分占多元胺组合物的质量百分比为13.73％，多元胺组合物的平均官能度2.30，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为4；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为6，其中保留时间为7.0～7.8min的峰面积为314.0，保留时间为10～11min的峰面积为71.0，保留时间为14.2～16min的峰面积为51.8。
制备例8
室温下，将60L去离子水加入到反应釜中，加入浓度为37％的盐酸130.84kg，在良好地搅拌情况下，加入纯度为99％的邻氯苯胺134.82kg,形成邻氯苯胺的盐酸盐溶液；在氮气的保护下，控制温度低于35℃的情况下，将含量为37％的甲醛水溶液47.65kg匀速滴加进反应釜内，用时2～3h，滴加完毕后进行梯度升温，保证邻氯苯胺与甲醛充分反应，梯度升温程序为：35～40℃2h，50～60℃4h，70～80℃4h，100℃1h。每个升温梯度的升温时间均为0.5h。降温到50～60℃，加入质量分数为25％的氢氧化钠溶液275.42kg中和到pH大于12，静置12h，分离下部的无机盐水溶液层，再向有机相中加入温度不低于95℃的去离子水，去离子水的体积为有机相体 积的1.5倍，充分搅拌后再静置，分离水相，重复水洗过程5～8次，保证有机盐充分洗净。最后一次洗涤后分离有机相，降温让有机相结晶成固体，并在50～60℃下抽真空至100pa下干燥5h，得多元胺组合物B8 127.21kg。多元胺组合物B8中Di-A组分占多元胺组合物的质量百分比为54.54％，Tri-A组分占多元胺组合物的质量百分比为24.97％，Tetra-A组分占多元胺组合物的质量百分比为19.49％，多元胺组合物的平均官能度2.44，多元胺组合物液相色谱峰面积中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值为3；保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值为4，其中保留时间为7.0～7.8min的峰面积为257.7，保留时间为10～11min的峰面积为93.4，保留时间为14.2～16min的峰面积为73.3。
实施例1
本实施例提供了一种抛光垫，其制备方法如下：
步骤一：取39.01质量份的TDI100和55.08质量份的PTMEG1000以及5.92质量份的DEG进行反应得到异氰酸酯封端的预聚体，加热至25～65℃，真空(-0.095MPa)下脱气2h，以便将预聚体中的气体和小分子化合物除去；然后加入1.83质量份平均粒径为40μm的中空微球聚合物551DE40d42，搅拌下使得中空微球聚合物均匀的分散在预聚体中，真空(-0.095MPa)下再次脱气2h，待用。
步骤二：将27.06质量份的多元胺组合物B1升温至115℃，待用，其中多元胺组合物的平均分子量为275。
步骤三：将预聚体与多元胺组合物在高速剪切下混合，然后浇铸到圆形磨具中，形成厚度为12cm的浇铸块，室温静置10min，然后置于100℃烘箱中固化16小时。固化完成后使其在烘箱中自动降温至室温，然后切割成厚度为80mil的薄片，共计60片。
步骤四：沟槽选择使用环状沟槽且中心存在留白(未刻槽)区域的沟槽形状，刻槽参数为：沟槽深30mil，沟槽宽20mil，槽间距120mil，中心留白区域半径为60～70mm，刻槽后即为抛光层。
步骤五：中间胶以及背胶层选择使用双面胶带，使用中间胶将上述抛光层与缓冲层粘合，并且在缓冲层另一侧(未粘合抛光层的面)粘合背胶层，即可得到抛光垫P1，其中缓冲层使用聚氨酯浸渍的无纺布材料(SUBA)。
实施例2
本实施例提供了一种抛光垫P2，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及57.25质量份的PTMEG650和2.1质量份的DEG反应得到；中空微球聚合物为2.00质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.32质量份的B1，其中多元胺组合物的平均分子量为275。
实施例3
本实施例提供了一种抛光垫P3，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及51.84质量份的PTMEG1400和7.51质量份的DEG反应得到；中空微球聚合物为1.92质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.77质量份的B2，其中多元胺组合物的平均分子量为279。
实施例4
本实施例提供了一种抛光垫P4，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及53.6质量份的PTMEG1000和5.76质量份的DEG反应得到；中空微球聚合物为1.99质量份平均粒径为40μm的551DE40d42；多元胺组合物为25.98质量份的B3，其中多元胺组合物的平均分子量为271。
实施例5
本实施例提供了一种抛光垫P5，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000和5.92质量份的DEG反应得到；中空微球聚合物为1.84质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.51质量份的B2，其中多元胺组合物的平均分子量为279。
实施例6
本实施例提供了一种抛光垫P6，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000和5.92质量份的DEG反应得到；中空微球聚合物为1.83质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.7质量份的B3，其中多元胺组合物的平均分子量为271。
实施例7
本实施例提供了一种抛光垫P7，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000和5.92质量份的DEG反应得到；中空微球聚合物为1.84质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.35质量份的B4，其中多元胺组合物的平均分子量为278。
实施例8
本实施例提供了一种抛光垫P8，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000和5.92质量份的DEG反应得到；中空微球聚合物为1.76质量份平均粒径为40μm的551DE40d42；多元胺组合物为28.34质量份的B5，其中多元胺组合物的平均分子量为288。
实施例9
本实施例提供了一种抛光垫P9，其制备方法与实施例1相同，不同之 处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000和5.92质量份的DEG反应得到；中空微球聚合物为1.69质量份平均粒径为40μm的551DE40d42；多元胺组合物为28.98质量份的B6，其中多元胺组合物的平均分子量为294。
实施例10
本实施例提供了一种抛光垫P10，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由34.55质量份的TDI100和1.81质量份的HMDI以及63.64质量份的PTMEG650反应得到；中空微球聚合物为2.27质量份平均粒径为40μm的551DE40d42；多元胺组合物为25.68质量份的B1，其中多元胺组合物的平均分子量为275。
实施例11
本实施例提供了一种抛光垫P11，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由30.68质量份的TDI100和5.42质量份的HMDI以及63.9质量份的PTMEG650反应得到；中空微球聚合物为2.87质量份平均粒径为40μm的551DE40d42；多元胺组合物为23.82质量份的B4，其中多元胺组合物的平均分子量为278。
实施例12
本实施例提供了一种抛光垫P12，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由31.99质量份的TDI100和4.21质量份的HMDI以及63.8质量份的PTMEG650反应得到；中空微球聚合物为2.65质量份平均粒径为40μm的551DE40d42；多元胺组合物为23.97质量份的B3，其中多元胺组合物的平均分子量为271。
实施例13
本实施例提供了一种抛光垫，其制备方法如下：
步骤一：取20.1质量份的TDI100和8.3质量份的HMDI以及71.6质 量份的PTMEG1000，加入4.04质量份平均粒径为40μm的中空微球聚合物551DE40d42，加入18.05质量份的多元胺组合物B1在115℃下搅拌使其充分反应，其中多元胺组合物的平均分子量为275。
步骤二：将步骤一种的物料在高速剪切下混合，然后浇铸到圆形磨具中，形成厚度为12cm的浇铸块，室温静置10min，然后置于100℃烘箱中固化16小时。固化完成后使其在烘箱中自动降温至室温，然后切割成厚度为80mil的薄片，共计60片。
步骤三：沟槽选择使用环状沟槽且中心存在留白(未刻槽)区域的沟槽形状，刻槽参数为：沟槽深30mil，沟槽宽20mil，槽间距120mil，中心留白区域半径为60～70mm，刻槽后即为抛光层。
步骤四：中间胶以及背胶层选择使用双面胶带，使用中间胶将上述抛光层与缓冲层粘合，并且在缓冲层另一侧(未粘合抛光层的面)粘合背胶层，即可得到抛光垫P13，其中缓冲层使用聚氨酯浸渍的无纺布材料(SUBA)。
实施例14
本实施例提供了一种抛光垫P14，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由25.68质量份的TDI100和5.42质量份的HMDI以及65.3质量份的PTMEG1400和3.6质量份DEG反应得到；中空微球聚合物为3.16质量份平均粒径为40μm的551DE40d42；多元胺组合物为20.94质量份的B1，其中多元胺组合物的平均分子量为275。
实施例15
本实施例提供了一种抛光垫P15，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100和5.92质量份的DEG以及55.08质量份的PTMEG1000反应得到；中空微球聚合物为1.83质量份平均粒径为40μm的551DE40d42；多元胺组合物为25.12质量份的 Di-A以及1.79质量份的Tri-A，其中多元胺组合物的平均分子量为273，多元胺组合物平均官能度为2.04。
实施例16
本实施例提供了一种抛光垫P16，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100和5.92质量份的DEG以及55.08质量份的PTMEG1000反应得到；中空微球聚合物为1.83质量份平均粒径为40μm的551DE40d42；多元胺组合物为24.77质量份的Di-A以及2.33质量份的Tri-A，其中多元胺组合物的平均分子量为275，多元胺组合物平均官能度为2.06。
实施例17
本实施例提供了一种抛光垫P17，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100和5.92质量份的DEG以及55.08质量份的PTMEG1000反应得到；中空微球聚合物为1.84质量份平均粒径为40μm的551DE40d42；多元胺组合物为25.2质量份的Di-A以及2.25质量份的Tetra-A，其中多元胺组合物的平均分子量为279，多元胺组合物平均官能度为2.08。
实施例18
本实施例提供了一种抛光垫P18，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及57.25质量份的PTMEG650以及2.1质量份的DEG反应得到；中空微球聚合物为2.00质量份平均粒径为40μm的551DE40d42；多元胺组合物为24.51质量份的Di-A以及2.19质量份的Tetra-A，其中多元胺组合物的平均分子量为279，多元胺组合物平均官能度为2.08。
实施例19
本实施例提供了一种抛光垫P19，其制备方法与实施例1相同，不同之 处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及51.84质量份的PTMEG1400以及7.51质量份的DEG反应得到；中空微球聚合物为2.00质量份平均粒径为40μm的551DE40d42；多元胺组合物为23.51质量份的Di-A以及2.21质量份的Tri-A，0.91质量份的M-CDEA，其中多元胺组合物的平均分子量为278，多元胺组合物平均官能度为2.06。
实施例20
本实施例提供了一种抛光垫P20，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及53.6质量份的PTMEG1000以及5.76质量份的DEG反应得到；中空微球聚合物为1.98质量份平均粒径为40μm的551DE40d42；多元胺组合物为20.6质量份的Di-A以及1.84质量份的Tetra-A，2.73质量份的DETDA，其中多元胺组合物的平均分子量为263，多元胺组合物平均官能度为2.07。
实施例21
本实施例提供了一种抛光垫P21，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为2.41质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.5质量份的B1，其中多元胺组合物的平均分子量为275。
实施例22
本实施例提供了一种抛光垫P22，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及57.25质量份的PTMEG650以及2.1质量份的DEG反应得到；中空微球聚合物为2.94质量份平均粒径为40μm的551DE40d42；多元胺组 合物为26.76质量份的B1，其中多元胺组合物的平均分子量为275。
实施例23
本实施例提供了一种抛光垫P23，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为4.04质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.5质量份的B1，其中多元胺组合物的平均分子量为275。
实施例24
本实施例提供了一种抛光垫P24，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为4.7质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.35质量份的B4，其中多元胺组合物的平均分子量为278。实施例25
本实施例提供了一种抛光垫P25，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份HMDI以及53.6质量份的PTMEG1000以及5.76质量份的DEG反应得到；中空微球聚合物为6.06质量份平均粒径为40μm的551DE40d42；多元胺组合物为25.98质量份的B3，其中多元胺组合物的平均分子量为271。
实施例26
本实施例提供了一种抛光垫P26，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份HMDI以及51.84质量份的PTMEG1400以及7.51质量份的DEG反应得到；中空微球聚合物为9.08质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.77质量份的B2，其中多元胺组合物的平均分子量为279。
实施例27
本实施例提供了一种抛光垫P27，其制备方法与实施例13相同，不同之处在于：原料包含34.55质量份的TDI100和3.81质量份HMDI以及61.64质量份的PPG600；中空微球聚合物为3.3质量份平均粒径为20μm的461DE20d70；多元胺组合物为26.35质量份的B1，其中多元胺组合物的平均分子量为275。
实施例28
本实施例提供了一种抛光垫P28，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由38.5质量份的TDI100和3质量份HMDI以及53.4质量份的PPG800以及5.1质量份的DEG反应得到；中空微球聚合物为2.6质量份平均粒径为20μm的461DE20d70；多元胺组合物为27.55质量份的B2，其中多元胺组合物的平均分子量为279。
实施例29
本实施例提供了一种抛光垫P29，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PPG1000以及5.92质量份的DEG反应得到；中空微球聚合物为3.16质量份平均粒径为20μm的461DE20d70；多元胺组合物为26.7质量份的B3，其中多元胺组合物的平均分子量为271。
实施例30
本实施例提供了一种抛光垫P30，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.33质量份的DEG以及0.34质量份的丙三醇反应得到；中空微球聚合物为1.74质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.06质量份的B1，其中多元胺组合物的平均分子量为275，多元胺组合物与多元醇组合物的总平均官能度为2.04。
实施例31
本实施例提供了一种抛光垫P31，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及56.05质量份的PTMEG650以及1.89质量份的DEG以及0.12质量份的木糖醇反应得到；中空微球聚合物为1.64质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.68质量份的B3，其中多元胺组合物的平均分子量为271，多元胺组合物与多元醇组合物的总平均官能度为2.03。
实施例32
本实施例提供了一种抛光垫P32，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及56.49质量份的PTMEG1400以及6.58质量份的DEG以及0.47质量份的季戊四醇反应得到；中空微球聚合物为2.26质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.46质量份的B3，其中多元胺组合物的平均分子量为271，多元胺组合物与多元醇组合物的总平均官能度为2.05。
实施例33
本实施例提供了一种抛光垫P33，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.93质量份的PTMEG1000以及5.33质量份的DEG以及0.34质量份的丙三醇反应得到；中空微球聚合物为1.68质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.59质量份的B4，其中多元胺组合物的平均分子量为278，多元胺组合物与多元醇组合物的总平均官能度为2.05。
实施例34
本实施例提供了一种抛光垫P34，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及56.05质量份的PTMEG1400以及6.39质量份的DEG以及0.65 质量份的木糖醇反应得到；中空微球聚合物为2.07质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.78质量份的B3，其中多元胺组合物的平均分子量为271，多元胺组合物与多元醇组合物的总平均官能度为2.08。
实施例35
本实施例提供了一种抛光垫P35，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及56.49质量份的PTMEG1400以及6.21质量份的DEG以及0.7质量份的季戊四醇反应得到；中空微球聚合物为1.91质量份平均粒径为40μm的551DE40d42；多元胺组合物为28.53质量份的B5，其中多元胺组合物的平均分子量为288，多元胺组合物与多元醇组合物的总平均官能度为2.12。
实施例36
本实施例提供了一种抛光垫P36，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.93质量份的PTMEG1000以及5.03质量份的DEG以及0.51质量份的丙三醇反应得到；中空微球聚合物为1.6质量份平均粒径为40μm的551DE40d42；多元胺组合物为27.82质量份的B4，其中多元胺组合物的平均分子量为278，多元胺组合物与多元醇组合物的总平均官能度为2.06。
实施例37
本实施例提供了一种抛光垫P37，其制备方法与实施例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及48.54质量份的PTMEG3000以及9.19质量份的DEG以及0.93质量份的甘露醇反应得到；中空微球聚合物为1.82质量份平均粒径为40μm的551DE40d42；多元胺组合物为26.75质量份的B2，其中多元胺组合物的平均分子量为279，多元胺组合物与多元醇组合物的总平均官能度为2.14。
对比例1
本对比例提供了一种抛光垫，其制备方法如下：
步骤一：取39.01质量份的TDI100和55.08质量份的PTMEG1000以及5.92质量份的DEG进行反应得到异氰酸酯封端的预聚体，加热至25～65℃，真空(-0.095MPa)下脱气2h，以便将预聚体中的气体和小分子化合物除去；然后加入1.82质量份平均粒径为40μm的中空微球聚合物551DE40d42，搅拌下使得中空微球聚合物均匀的分散在预聚体中，真空(-0.095MPa)下再次脱气2h，待用。
步骤二：将26.3质量份的多元胺组合物MOCA升温至115℃，待用，平均官能度为2.0。
步骤三：将预聚体与多元胺组合物在高速剪切下混合，然后浇铸到圆形磨具中，形成厚度为12cm的浇铸块，室温静置10min，然后置于100℃烘箱中固化16小时。固化完成后使其在烘箱中自动降温至室温，然后切割成厚度为80mil的薄片，共计60片。
步骤四：沟槽选择使用环状沟槽且中心存在留白(未刻槽)区域的沟槽形状，刻槽参数为：沟槽深30mil，沟槽宽20mil，槽间距120mil，中心留白区域半径为60～70mm，刻槽后即为抛光层。
步骤五：中间胶以及背胶层选择使用双面胶带，使用中间胶将上述抛光层与缓冲层粘合，并且在缓冲层另一侧(未粘合抛光层的面)粘合背胶层，即可得到抛光垫PD1，其中缓冲层使用聚氨酯浸渍的无纺布材料(SUBA)。
对比例2
本对比例提供了一种抛光垫PD2，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为 2.17质量份平均粒径为40μm的551DE40d42；多元胺组合物为37.34质量份的M-CDEA，平均官能度为2.0。
对比例3
本对比例提供了一种抛光垫PD3，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为2.22质量份平均粒径为40μm的551DE40d42；多元胺组合物为17.55质量份的DETDA，平均官能度为2.0。
对比例4
本对比例提供了一种抛光垫PD4，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为1.56质量份平均粒径为40μm的551DE40d42；多元胺组合物为32.35质量份的B8，其中多元胺组合物的平均分子量为329。
对比例5
本对比例提供了一种抛光垫PD5，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为1.62质量份平均粒径为40μm的551DE40d42；多元胺组合物为30.45质量份的B7，其中多元胺组合物的平均分子量为309。
对比例6
本对比例提供了一种抛光垫PD6，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为2.44质量份平均粒径为40μm的551DE40d42；多元胺组合物为23.46质量 份的MOCA以及5.92质量份的D2000，其中多元胺组合物的平均分子量为619，平均官能度为2.0。
对比例7
本对比例提供了一种抛光垫PD7，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由39.01质量份的TDI100以及55.08质量份的PTMEG1000以及5.92质量份的DEG反应得到；中空微球聚合物为2.64质量份平均粒径为40μm的551DE40d42；多元胺组合物为23.46质量份的MOCA以及4质量份的D2000以及1质量份的T5000，其中多元胺组合物的平均分子量为677，平均官能度为2.03。
对比例8
本对比例提供了一种抛光垫PD8，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及56.05质量份的PTMEG1000以及4.13质量份的DEG和1.94质量份的木糖醇反应得到；中空微球聚合物为1.86质量份平均粒径为40μm的551DE40d42；多元胺组合物为26质量份的B3，其中多元胺组合物的平均分子量为271，多元胺组合物与多元醇组合物的总平均官能度为2.21。
对比例9
本对比例提供了一种抛光垫PD9，其制备方法与对比例1相同，不同之处在于：异氰酸酯封端的预聚体由32.65质量份的TDI100和8质量份的HMDI以及28.03质量份的PTMEG1000与28.03质量份的PTMEG650以及1.88质量份的DEG和3.22质量份的甘露醇反应得到；中空微球聚合物为0.2质量份平均粒径为40μm的551DE40d42；多元胺组合物为29.99质量份的B7，其中多元胺组合物的平均分子量为309，多元胺组合物与多元醇组合物的总平均官能度为2.49。
对于实施例1～37以及对比例1～9抛光垫的物性指标及性能参数见表1：
表1
包含多元胺组合物的实施例，抛光垫去除速率较高，且抛光去除速率随着时间衰减较少，NU值较低，几乎没有defect或有极少量defect，寿命较对比例而言具有明显的提升。
需要说明的是，根据上述说明书的解释和阐述，本发明所属领域的技术人员还可以对上述实施方式进行变更和修改。因此，本发明并不局限于上面揭示和描述的具体实施方式，对本发明的一些等同修改和变更也应当在本发明的权利要求保护范围之内。此外尽管本说明书使用了一写特定的 术语，但是这些术语只是为了方便说明，并不对发明构成任何限制。

Claims (19)

  1. 一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物包含一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与三元胺分别占多元胺组合物总量的比例介于77％～96％：3％～12％之间。
  2. 一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物包含一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与四元胺分别占多元胺组合物总量的比例介于77％～96％：0.1％～10％之间。
  3. 根据权利要求1所述的抛光垫，所述三元以上的多元胺包含四元胺，所述四元胺占多元胺组合物总量的比例介于0.1％～10％之间。
  4. 根据权利要求1～3中任意一项所述的抛光垫，所述二元胺和/或三元胺和/或三元以上的多元胺包含如结构式1所示的化合物：
    其中，结构式1中X表示包含碳原子或表示包含结构式2或结构式3所示的结构片段中的一种或多种组合。
  5. 根据权利要求1～3中任意一项所述的抛光垫，所述多元胺组合物中 包含有游离氯离子，所述游离氯离子的含量小于900ppm。
  6. 根据权利要求1～3中任意一项所述的抛光垫，所述多元醇组合物与多元胺组合物的总平均官能度不高于2.2。
  7. 根据权利要求6所述的抛光垫，所述多官能异氰酸酯包括芳香族异氰酸酯或脂肪族异氰酸酯中的一种或多种组合；所述芳香族异氰酸酯包含2,4-甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、2,2’-二苯基甲烷二异氰酸酯、2,4’-二苯基甲烷二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、1,5-萘二异氰酸酯、对苯二异氰酸酯、间苯二异氰酸酯、对苯二亚甲基二异氰酸酯、间苯二亚甲基二异氰酸酯中的一种或多种组合；所述脂肪族异氰酸酯包含亚乙基二异氰酸酯、2,2,4-三甲基六亚甲基二异氰酸酯、1,6-六亚甲基二异氰酸酯、1，4-环己烷二异氰酸酯、4，4’-二环己基甲烷二异氰酸酯、异佛尔酮二异氰酸酯、降冰片烷二异氰酸酯中的一种或多种组合。
  8. 根据权利要求6所述的抛光垫，所述多元醇组合物包含聚四亚甲基醚二醇、聚乙二醇、聚丙二醇、乙二醇、1,3-丁二醇、1,4-丁二醇、二甘醇、新戊二醇、2-甲基-1,3-丙二醇、己二醇、3-甲基-1,5-戊二醇、1,4-环己烷二甲醇中的一种或多种组合。
  9. 根据权利要求1～3中任意一项所述的抛光垫，所述抛光层的密度介于0.4～1.1g/cm3之间，邵氏硬度介于15～85D之间。
  10. 根据权利要求1～3中任意一项所述的抛光垫，所述抛光垫包括有缓冲层，粘胶层以及背胶层，所述抛光垫从上到下以此设置为：抛光层，粘胶层，缓冲层以及背胶层，所述粘胶层用于抛光层与缓冲层的粘合，所述背胶层用于抛光垫与抛光机台的粘合，所述背胶层还包含有离型纸或离型膜。
  11. 一种多元胺组合物，包括一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所 述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与三元胺分别占多元胺组合物总量的比例介于77％～96％：3％～12％之间。
  12. 一种多元胺组合物，包括一种和/或多种二元胺和/或三元胺和/或三元以上的多元胺，所述多元胺组合物的平均分子量介于200～400之间，所述多元胺组合物的平均官能度大于2且不高于2.20，所述多元胺组合物中二元胺与四元胺分别占多元胺组合物总量的比例介于77％～96％：0.1％～10％之间。
  13. 根据权利要求11所述的多元胺组合物，所述三元胺以上的多元胺包括四元胺，所述四元胺占多元胺组合物总量的比例介于0.1％～10％之间。
  14. 根据权利要求11～13中任意一项所述的多元胺组合物，所述二元胺和/或三元胺和/或三元以上的多元胺包含结构式1所示的化合物：
    其中，结构式1中X表示包含碳原子或表示包含结构式2或结构式3所示的结构片段中的一种或多种组合。
  15. 根据权利要求11～13中任意一项所述的多元胺组合物，所述多元胺组合物包括游离氯离子，所述游离氯离子的含量小于900ppm。
  16. 一种抛光层，使用如权利要求11～13中任意一项所述的多元胺组合物与多官能异氰酸酯和多元醇组合物经反应得到。
  17. 一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得 到，所述多元胺组合物通过下述条件下进行液相色谱分析获得的液相色谱图中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积的比值介于5～30之间：
    液相色谱分析条件：
    测量样品：取多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶液0.2ml加甲醇至2ml混合成10ppm溶液；
    色谱柱：由Aglient制造的ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron；
    色谱柱温度：40℃；
    流动相：A:0.1％甲酸水溶液:B:甲醇＝20:80；
    流动速率：0.5ml/min；
    检测器：紫外检测器，波长254nm；
    注入样品量：10μl。
  18. 一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物通过下述条件下进行液相色谱分析获得的液相色谱图中，保留时间为7.0～7.8min的峰面积与保留时间为14.2～16min的峰面积的比值介于10～400之间：
    液相色谱分析条件：
    测量样品：取多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶液0.2ml加甲醇至2ml混合成10ppm溶液；
    色谱柱：由Aglient制造的ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron；
    色谱柱温度：40℃；
    流动相：A:0.1％甲酸水溶液:B:甲醇＝20:80；
    流动速率：0.5ml/min；
    检测器：紫外检测器，波长254nm；
    注入样品量：10μl。
  19. 一种抛光垫，包含抛光层，所述抛光层包含聚氨酯基材，所述聚氨酯基材包含多官能异氰酸酯、多元醇组合物以及多元胺组合物经反应得到，所述多元胺组合物通过下述条件下进行液相色谱分析获得的液相色谱图中，保留时间7.0～7.8min的峰面积与保留时间为10～11min的峰面积与保留时间为14.2～16min的峰面积的比介于：360～450：15～45：1～40之间；
    液相色谱分析条件：
    测量样品：取多元胺组合物0.0204g加入甲醇总质量为20.0026g，取上述溶液0.2ml加甲醇至2ml混合成100ppm的溶液，取上述100ppm的溶液0.2ml
    甲醇至2ml混合成10ppm溶液；
    色谱柱：由Aglient制造的ZORBAX Eclipse XDB-C18，4.6*250mm，5-Micron；
    色谱柱温度：40℃；
    流动相：A:0.1％甲酸水溶液:B:甲醇＝20:80；
    流动速率：0.5ml/min；
    检测器：紫外检测器，波长254nm；
    注入样品量：10μl。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106891246A (zh) * 2017-03-30 2017-06-27 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
CN107553313A (zh) * 2017-08-31 2018-01-09 湖北鼎龙控股股份有限公司 一种抛光垫、聚氨酯抛光层及其制备方法
US20200215661A1 (en) * 2017-08-31 2020-07-09 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
CN114346894A (zh) * 2020-09-29 2022-04-15 Skc索密思株式会社 抛光垫和使用该抛光垫的半导体器件的制造方法
CN114755327A (zh) * 2022-03-31 2022-07-15 国高材高分子材料产业创新中心有限公司 一种高分子材料中n,n’-乙撑双硬脂酰胺的定量分析方法
CN115284166A (zh) * 2022-08-16 2022-11-04 湖北鼎汇微电子材料有限公司 一种抛光垫

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028637A (en) * 1989-10-06 1991-07-02 Mobay Corporation Isocyanate reactive mixture and the use thereof in the manufacture of flexible polyurethane foams
PL163279B1 (pl) * 1990-06-26 1994-03-31 Inst Ciezkiej Syntezy Orga Sposób wytwarzania elastomerów poliuretanowych o podwyższonej mrozoodporności
JP4615705B2 (ja) * 2000-12-26 2011-01-19 東洋ゴム工業株式会社 研磨材組成物及び研磨シート
KR102287235B1 (ko) * 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106891246A (zh) * 2017-03-30 2017-06-27 湖北鼎龙控股股份有限公司 一种用于半导体、光学材料和磁性材料表面平坦化的化学机械抛光垫
CN107553313A (zh) * 2017-08-31 2018-01-09 湖北鼎龙控股股份有限公司 一种抛光垫、聚氨酯抛光层及其制备方法
US20200215661A1 (en) * 2017-08-31 2020-07-09 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
CN114346894A (zh) * 2020-09-29 2022-04-15 Skc索密思株式会社 抛光垫和使用该抛光垫的半导体器件的制造方法
CN114755327A (zh) * 2022-03-31 2022-07-15 国高材高分子材料产业创新中心有限公司 一种高分子材料中n,n’-乙撑双硬脂酰胺的定量分析方法
CN115284166A (zh) * 2022-08-16 2022-11-04 湖北鼎汇微电子材料有限公司 一种抛光垫

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