WO2024033205A1 - Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer - Google Patents

Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer Download PDF

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Publication number
WO2024033205A1
WO2024033205A1 PCT/EP2023/071505 EP2023071505W WO2024033205A1 WO 2024033205 A1 WO2024033205 A1 WO 2024033205A1 EP 2023071505 W EP2023071505 W EP 2023071505W WO 2024033205 A1 WO2024033205 A1 WO 2024033205A1
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WIPO (PCT)
Prior art keywords
upper polishing
polishing
plate
machine
polishing plate
Prior art date
Application number
PCT/EP2023/071505
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German (de)
French (fr)
Inventor
Tobias Opitz
Rocco Hunke
Jannis Liebscher
Jörg Mehnert
Original Assignee
Siltronic Ag
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Publication of WO2024033205A1 publication Critical patent/WO2024033205A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

Definitions

  • the subject of the invention is a device for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer.
  • the invention also relates to a corresponding method which uses the device.
  • Polishing workpieces such as semiconductor wafers on both sides is also called double-side polishing (DSP).
  • DSP double-side polishing
  • both polishing plates of a DSP system are covered with polishing cloths. These should be glued on without bubbles in order to exclude a source that would affect the desired polishing result.
  • the respective polishing cloth should adhere evenly to the polishing plate.
  • the polishing cloths can be pressed together between the polishing plates (cloth pressing). Pressing causes the glue to flow and adhere better.
  • Methods for creating an adhesive connection between the respective polishing cloth and the corresponding polishing plate are known from US 2007 0 087 671 A1, JP 2006289 523 A, JP 2006 346 808 A and DE 102 39 774 A1.
  • the upper polishing cloth which is ring-shaped, is glued to the upper polishing plate.
  • Such a method is described, for example, in EP 4 000 806 A1. Bubbles in the space between the upper polishing plate and the upper polishing cloth must then be removed because this cannot be achieved adequately with cloth presses alone. Such bubbles can be pressed manually using a squeegee or a roller to the outer edge or inner edge of the upper polishing cloth and pressed out of the gap there. This work is strenuous and difficult because it requires working overhead.
  • EP 4 000 806 A1 points out that the process can also be carried out mechanically, it remains unclear how this can be implemented.
  • US 2007 0 087 671 A1 recommends clamping a roller unit with radially arranged rollers between the lower and upper polishing plates after sticking the polishing cloths on and rotating the polishing plates in opposite directions. Since radially arranged rollers move bubbles in the space between the polishing plate and the polishing cloth mainly in the circumferential direction, they are only able to adequately remove bubbles from this space.
  • the object of the present invention is to offer a more efficient solution to remove bubbles from the space between the upper polishing plate and the upper polishing cloth.
  • the object of the invention is achieved by a device for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer between the upper polishing plate and a lower polishing plate, comprising two parallel linear rails which are at a short distance above the lower polishing plate are arranged parallel to an intermediate radius of the lower polishing plate; a base body on which the linear rails are attached; two driven carriages that can be moved along the linear rails; actuators carried by the carriages for raising and lowering a roller attached to the actuators and arranged between the linear rails; and a controller for synchronously moving the carriages back and forth between an inner and an outer pin ring of the machine and for synchronously moving the actuators.
  • the linear rails are preferably attached to a ring or a plate as a base body.
  • the ring or plate lies on the lower one Polishing cloth and has teeth that engage in the outer and inner pin ring of the machine.
  • the linear rails can protrude over the edge of the lower polishing plate. But it is also possible to shorten it to a length that corresponds to the distance between the inner pin ring and the outer pin ring.
  • the actuators preferably work pneumatically or electrically.
  • the object is achieved by a method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer, comprising sticking the upper polishing plate with the upper polishing cloth; and placing the device according to any one of claims 1 to 3 over the lower polishing cloth; arranging the upper polishing pad over the lower polishing pad at a distance from each other that allows the roller of the device to be pressed against the upper polishing cloth; and at least temporarily pressing the roller against the upper polishing cloth while simultaneously rotating the upper polishing plate and moving the roller back and forth between the inner and outer pin rings of the machine.
  • the upper polishing cloth is glued to the upper polishing plate and thereby brought into an intermediate state in which bubbles are present in the space between the upper polishing cloth and the upper polishing plate and the upper polishing cloth does not yet adhere evenly to the upper polishing plate.
  • This can be done, for example, by placing the upper polishing cloth on the lower polishing cloth, with the adhesive layer of the upper polishing cloth facing upwards, i.e. facing away from the lower polishing plate, and the polishing plates being pressed against each other. You can also proceed as described in EP 4 000 806 A1.
  • the device according to the invention is used to remove the bubbles from the space between the upper polishing plate and the upper polishing cloth in the next step.
  • the device is placed above the lower one Polishing cloth arranged and the upper polishing plate swiveled over the lower polishing plate so that there is a small distance between the two polishing plates. At this distance, the roller does not yet touch the upper polishing cloth unless the actuators have raised it yet. However, the distance is also sufficiently small so that the roller can be pressed against the upper polishing cloth using the actuators.
  • the upper polishing plate is rotated, preferably at a speed of not less than 0.1 rpm and not more than 1 rpm, particularly preferably 0.2 rpm, and the roller is raised by means of the actuators so that it is pressed against the upper polishing cloth.
  • the contact pressure of the roller is preferably 1.8 x 10 5 Pa - 2.0 x 10 5 Pa (1.8 bar - 2.0 bar) and can be varied.
  • the roller with the carriages is moved along the linear rails between the inner and outer pin rings of the polishing machine.
  • the roller drives bubbles primarily in the radial direction from the inner edge to the outer edge of the upper polishing cloth and thus out of the space between the upper polishing cloth and the upper polishing plate.
  • the speed of the roller movement along the linear rails is preferably 0.5 m/s - 1.5 m/s and can also be varied.
  • the roller is at least temporarily pressed against the upper polishing cloth while the upper polishing plate is rotated and the roller is moved between the inner and outer pin rings of the machine.
  • the roller is moved back and forth between the inner and outer pin rings of the polishing machine and pressed against the upper polishing cloth while the upper polishing plate is rotated.
  • the roller is moved back and forth between the inner and outer pin rings of the polishing machine and is only pressed against the upper polishing cloth on the way there or back while the upper polishing plate is rotated.
  • Fig. 1 shows features of a DSP polishing machine with a top view of the lower polishing plate.
  • Fig. 2 shows a preferred embodiment of the invention.
  • Fig. 1 shows features of a DSP polishing machine in a top view of the lower polishing plate 1, on which an annular lower polishing cloth 2 is glued.
  • An inner pin ring 5 and an outer pin ring 6 are arranged parallel to the inner edge 3 and to the outer edge 4 of the lower polishing cloth 2 and the lower polishing plate 1, by means of which the polishing plates 1, 8 can be rotated.
  • the lower polishing plate 1 is used to support the device for pressing the upper polishing cloth 7 against the upper polishing plate 8 thereon.
  • the device comprises two parallel linear rails 9, which are arranged at a short distance above the lower polishing plate 1 parallel to an intermediate radius of the lower polishing plate 1.
  • Each of the linear rails 9 serves as a guide for a slide 10, each of the slides 10 carrying an actuator 11 and a roller 12 is attached to the actuators, so that the roller is arranged between the linear rails 9.
  • the actuators can raise and lower the roller 12 and the carriages 10 can move it along a path between the outer pin ring 6 and the inner pin ring 5.
  • the carriages 10 and the actuators 11 each move synchronously, which is ensured by a control 13 (controller).
  • the linear rails 9 rest on a ring 14 and strips 15 lying in the ring 14, the ring 14 having external teeth 16 which engage in the outer pin ring 6 and the inner pin ring 5 of the machine.
  • the upper polishing cloth 7 is brought into an intermediate state in which bubbles are present in the space between the upper polishing cloth 7 and the upper polishing plate 8 and the upper polishing cloth 7 does not yet adhere evenly to the upper polishing plate 8.
  • the device for pressing the upper polishing cloth 7 against the upper polishing plate 8 is then arranged above the lower polishing cloth 2, and the upper polishing plate 8 is pushed over the lower polishing plate 1.
  • the two polishing plates 8,1 are at a distance from one another which allows the roller 12 of the device to be pressed against the upper polishing cloth 7.
  • Fig. 2 shows the situation before the upper polishing plate 8 was arranged over the lower polishing plate 1.
  • the upper polishing plate 8 is then slowly rotated and the roller 12 is moved between the outer pin ring 6 and the inner pin ring 5 by means of the carriage 10. and moved here while the actuators 11 press the roller 12 against the upper polishing cloth 7 at least temporarily.

Abstract

The invention relates to a device and a method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer between the upper polishing plate and a lower polishing plate. The device comprises: two parallel linear rails which are arranged at a short distance above the lower polishing plate in parallel with an intermediate radius of the lower polishing plate; a main body to which the linear rails are attached; two driven carriages which can be moved along the linear rails; actuators which are carried by the carriages for raising and lowering a roller which is attached to the actuators and arranged between the linear rails; and a controller for synchronously moving the carriages back and forth between an outer and an inner pin ring of the machine and for synchronously moving the actuators.

Description

Vorrichtung und Verfahren zum Anpressen eines oberen Poliertuchs gegen einen oberen Polierteller einer Maschine zum gleichzeitigen Polieren einer Vorderseite und einer Rückseite einer Halbleiterscheibe Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer
Gegenstand der Erfindung ist eine Vorrichtung zum Anpressen eines oberen Poliertuchs gegen einen oberen Polierteller einer Maschine zum gleichzeitigen Polieren einer Vorderseite und einer Rückseite einer Halbleiterscheibe. Gegenstand der Erfindung ist auch ein entsprechendes Verfahren, welches die Vorrichtung verwendet. The subject of the invention is a device for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer. The invention also relates to a corresponding method which uses the device.
Stand der Technik / Probleme State of the art / problems
Das beidseitige Polieren von Werkstücken wie Halbleiterscheiben wird auch Doppelseitenpolitur (DSP) genannt. Grundzüge der DSP von Halbleiterscheiben sind beispielsweise in US 2003 0 054 650 A1 und in DE 100 07 390 A1 beschrieben. Polishing workpieces such as semiconductor wafers on both sides is also called double-side polishing (DSP). Basic features of the DSP of semiconductor wafers are described, for example, in US 2003 0 054 650 A1 and in DE 100 07 390 A1.
In der Regel werden beide Polierteller einer DSP-Anlage mit Poliertüchern beklebt. Diese sollten blasenfrei aufgeklebt sein, um eine Quelle auszuschließen, die das gewünschte Polierergebnis beeinträchtigt. Das jeweilige Poliertuch sollte auf dem Polierteller auch gleichmäßig stark haften. Um die notwendige Haftung zu erreichen, können die Poliertücher zwischen den Poliertellern zusammengepresst werden (Tuchpressen). Durch das Pressen verfließt der Kleber und haftet besser. Verfahren zum Schaffen einer klebenden Verbindung zwischen dem jeweiligen Poliertuch und dem entsprechenden Polierteller sind aus US 2007 0 087 671 A1 , JP 2006289 523 A, JP 2006 346 808 A und DE 102 39 774 A1 bekannt. As a rule, both polishing plates of a DSP system are covered with polishing cloths. These should be glued on without bubbles in order to exclude a source that would affect the desired polishing result. The respective polishing cloth should adhere evenly to the polishing plate. In order to achieve the necessary adhesion, the polishing cloths can be pressed together between the polishing plates (cloth pressing). Pressing causes the glue to flow and adhere better. Methods for creating an adhesive connection between the respective polishing cloth and the corresponding polishing plate are known from US 2007 0 087 671 A1, JP 2006289 523 A, JP 2006 346 808 A and DE 102 39 774 A1.
Vor dem Tuchpressen wird das obere Poliertuch, das ringförmig ausgebildet ist, auf den oberen Polierteller geklebt. Ein solches Verfahren ist beispielsweise in EP 4 000 806 A1 beschreiben. Danach müssen Blasen im Zwischenraum zwischen dem oberen Polierteller und dem oberen Poliertuch entfernt werden, weil das mit Tuchpressen allein nur unzureichend gelingt. Solche Blasen können manuell mittels einer Rakel oder einer Walze zum Außenrand oder Innenrand des oberen Poliertuchs gedrückt und dort aus dem Zwischenraum herausgepresst werden. Diese Arbeit ist anstrengend und schwierig, weil währenddessen Überkopf gearbeitet werden muss. In EP 4 000 806 A1 wird zwar darauf hingewiesen, dass der Vorgang auch maschinell durchgeführt werden kann, es bleibt aber offen, in welcher Weise das umgesetzt werden kann. Before the cloth is pressed, the upper polishing cloth, which is ring-shaped, is glued to the upper polishing plate. Such a method is described, for example, in EP 4 000 806 A1. Bubbles in the space between the upper polishing plate and the upper polishing cloth must then be removed because this cannot be achieved adequately with cloth presses alone. Such bubbles can be pressed manually using a squeegee or a roller to the outer edge or inner edge of the upper polishing cloth and pressed out of the gap there. This work is strenuous and difficult because it requires working overhead. Although EP 4 000 806 A1 points out that the process can also be carried out mechanically, it remains unclear how this can be implemented.
US 2007 0 087 671 A1 empfiehlt nach dem Aufkleben der Poliertücher eine Walzen- Einheit mit radial angeordneten Walzen zwischen den unteren und den oberen Polierteller zu klemmen und die Polierteller gegensinnig zu drehen. Da radial angeordnete Walzen Blasen im Zwischenraum zwischen Polierteller und Poliertuch hauptsächlich in Umfangsrichtung bewegen, vermögen sie nur unzureichend Blasen aus diesem Zwischenraum zu entfernen. US 2007 0 087 671 A1 recommends clamping a roller unit with radially arranged rollers between the lower and upper polishing plates after sticking the polishing cloths on and rotating the polishing plates in opposite directions. Since radially arranged rollers move bubbles in the space between the polishing plate and the polishing cloth mainly in the circumferential direction, they are only able to adequately remove bubbles from this space.
Aufgabe der vorliegenden Erfindung ist es, eine effizientere Lösung anzubieten, um Blasen aus dem Zwischenraum zwischen dem oberem Polierteller und dem oberen Poliertuch zu entfernen. The object of the present invention is to offer a more efficient solution to remove bubbles from the space between the upper polishing plate and the upper polishing cloth.
Die Aufgabe der Erfindung wird gelöst durch eine Vorrichtung zum Anpressen eines oberen Poliertuchs gegen einen oberen Polierteller einer Maschine zum gleichzeitigen Polieren einer Vorderseite und einer Rückseite einer Halbleiterscheibe zwischen dem oberen Polierteller und einem unteren Polierteller, umfassend zwei parallel liegende Linearschienen, die in geringem Abstand über dem unteren Polierteller parallel zu einem dazwischenliegenden Radius des unteren Poliertellers angeordnet sind; einen Grundkörper, auf dem die Linearschienen befestigt sind; zwei entlang der Linearschienen bewegbare, angetriebene Schlitten; von den Schlitten getragene Aktuatoren zum Anheben und Absenken einer Walze, die an den Aktuatoren befestigt und zwischen den Linearschienen angeordnet ist; und eine Steuerung zum synchronen Hin- und Herbewegen der Schlitten zwischen einem inneren und einem äußeren Stiftkranz der Maschine und zum synchronen Bewegen der Aktuatoren. The object of the invention is achieved by a device for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer between the upper polishing plate and a lower polishing plate, comprising two parallel linear rails which are at a short distance above the lower polishing plate are arranged parallel to an intermediate radius of the lower polishing plate; a base body on which the linear rails are attached; two driven carriages that can be moved along the linear rails; actuators carried by the carriages for raising and lowering a roller attached to the actuators and arranged between the linear rails; and a controller for synchronously moving the carriages back and forth between an inner and an outer pin ring of the machine and for synchronously moving the actuators.
Die Linearschienen sind vorzugsweise auf einem Ring oder einer Platte als Grundkörper befestigt. Der Ring beziehungsweise die Platte liegt auf dem unteren Poliertuch und weist eine Verzahnung auf, die in den äußeren und in den inneren Stiftkranz der Maschine eingreift. Die Linearschienen können über den Rand des unteren Poliertellers ragen. Es ist aber auch möglich, sie bis auf eine Länge zu verkürzen, die dem Abstand zwischen dem inneren Stiftkranz und dem äußeren Stiftkranz entspricht. The linear rails are preferably attached to a ring or a plate as a base body. The ring or plate lies on the lower one Polishing cloth and has teeth that engage in the outer and inner pin ring of the machine. The linear rails can protrude over the edge of the lower polishing plate. But it is also possible to shorten it to a length that corresponds to the distance between the inner pin ring and the outer pin ring.
Die Aktuatoren arbeiten vorzugsweise pneumatisch oder elektrisch. The actuators preferably work pneumatically or electrically.
Des Weiteren wird die Aufgabe gelöst durch ein Verfahren zum Anpressen eines oberen Poliertuchs gegen einen oberen Polierteller einer Maschine zum gleichzeitigen Polieren einer Vorderseite und einer Rückseite einer Halbleiterscheibe, umfassend das Bekleben des oberen Poliertellers mit dem oberen Poliertuch; und das Anordnen der Vorrichtung nach einem der Ansprüche 1 bis 3 über dem unteren Poliertuch; das Anordnen des oberen Poliertellers über dem unteren Polierteller in einem Abstand zueinander, der es erlaubt, die Walze der Vorrichtung gegen das obere Poliertuch zu pressen; und das zumindest zeitweise Pressen der Walze gegen das obere Poliertuch bei gleichzeitigem Drehen des oberen Poliertellers und Hin- und Herbewegen der Walze zwischen dem inneren und dem äußeren Stiftkranz der Maschine. Furthermore, the object is achieved by a method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer, comprising sticking the upper polishing plate with the upper polishing cloth; and placing the device according to any one of claims 1 to 3 over the lower polishing cloth; arranging the upper polishing pad over the lower polishing pad at a distance from each other that allows the roller of the device to be pressed against the upper polishing cloth; and at least temporarily pressing the roller against the upper polishing cloth while simultaneously rotating the upper polishing plate and moving the roller back and forth between the inner and outer pin rings of the machine.
Das obere Poliertuch wird auf den oberen Polierteller geklebt und dabei in einen Zwischenzustand gebracht, in dem Blasen im Zwischenraum zwischen dem oberen Poliertuch und dem oberen Polierteller vorhanden sind und das obere Poliertuch noch nicht gleichmäßig am oberen Polierteller haftet. Das kann beispielsweise geschehen, indem das obere Poliertuch auf dem unteren Poliertuch abgelegt wird, wobei die klebende Schicht des oberen Poliertuchs nach oben weisend, also vom unteren Polierteller abgewendet liegt, und die Polierteller gegeneinandergepresst werden. Es kann auch so vorgegangen werden, wie es in EP 4 000 806 A1 beschrieben ist. The upper polishing cloth is glued to the upper polishing plate and thereby brought into an intermediate state in which bubbles are present in the space between the upper polishing cloth and the upper polishing plate and the upper polishing cloth does not yet adhere evenly to the upper polishing plate. This can be done, for example, by placing the upper polishing cloth on the lower polishing cloth, with the adhesive layer of the upper polishing cloth facing upwards, i.e. facing away from the lower polishing plate, and the polishing plates being pressed against each other. You can also proceed as described in EP 4 000 806 A1.
Die erfindungsgemäße Vorrichtung wird verwendet, um im nächsten Schritt die Blasen aus dem Zwischenraum zwischen dem oberen Polierteller und dem oberen Poliertuch zu entfernen. Zu diesem Zweck wird die Vorrichtung über dem unteren Poliertuch angeordnet und der obere Polierteller über den unteren Polierteller geschwenkt, so dass ein geringer Abstand zwischen beiden Pol iertel lern besteht. Bei diesem Abstand berührt die Walze noch nicht das obere Poliertuch, sofern die Aktuatoren sie noch nicht angehoben haben. Der Abstand ist aber auch ausreichend klein, damit die Walze mittels der Aktuatoren gegen das obere Poliertuch gepresst werden kann. Danach wird der obere Polierteller gedreht, vorzugsweise mit einer Geschwindigkeit von nicht weniger als 0,1 U/rnin und nicht mehr als 1 U/rnin, besonders bevorzugt 0,2 U/rnin, und die Walze mittels der Aktuatoren angehoben, so dass sie gegen das obere Poliertuch gedrückt wird. Der Anpressdruck der Walze beträgt vorzugsweise 1 ,8 x 105 Pa - 2,0 x 105 Pa (1 ,8 bar - 2,0 bar) und kann variiert werden. The device according to the invention is used to remove the bubbles from the space between the upper polishing plate and the upper polishing cloth in the next step. For this purpose, the device is placed above the lower one Polishing cloth arranged and the upper polishing plate swiveled over the lower polishing plate so that there is a small distance between the two polishing plates. At this distance, the roller does not yet touch the upper polishing cloth unless the actuators have raised it yet. However, the distance is also sufficiently small so that the roller can be pressed against the upper polishing cloth using the actuators. Thereafter, the upper polishing plate is rotated, preferably at a speed of not less than 0.1 rpm and not more than 1 rpm, particularly preferably 0.2 rpm, and the roller is raised by means of the actuators so that it is pressed against the upper polishing cloth. The contact pressure of the roller is preferably 1.8 x 10 5 Pa - 2.0 x 10 5 Pa (1.8 bar - 2.0 bar) and can be varied.
Gleichzeitig mit dem Pressen der Walze gegen das obere Poliertuch wird die Walze mit den Schlitten entlang der Linearschienen zwischen dem inneren und dem äußeren Stiftkranz der Poliermaschine bewegt. Dabei treibt die Walze, Blasen vornehmlich in radialer Richtung vom Innenrand zum Außenrand des oberen Poliertuchs und damit aus dem Zwischenraum zwischen dem oberen Poliertuch und dem oberen Polierteller. Die Geschwindigkeit der Walzenbewegung entlang der Linearschienen beträgt vorzugsweise 0,5 m/s - 1 ,5m/s und kann ebenfalls variiert werden. At the same time as the roller is pressed against the upper polishing cloth, the roller with the carriages is moved along the linear rails between the inner and outer pin rings of the polishing machine. The roller drives bubbles primarily in the radial direction from the inner edge to the outer edge of the upper polishing cloth and thus out of the space between the upper polishing cloth and the upper polishing plate. The speed of the roller movement along the linear rails is preferably 0.5 m/s - 1.5 m/s and can also be varied.
Die Walze wird zumindest zeitweise gegen das obere Poliertuch gepresst, während der obere Polierteller gedreht und die Walze zwischen dem inneren und dem äußerem Stiftkranz der Maschine bewegt wird. The roller is at least temporarily pressed against the upper polishing cloth while the upper polishing plate is rotated and the roller is moved between the inner and outer pin rings of the machine.
Gemäß einer Ausführungsform wird die Walze zwischen dem inneren und dem äußeren Stiftkranz der Poliermaschine hin- und herbewegt und gegen das obere Poliertuch gepresst, während der obere Polierteller gedreht wird. According to one embodiment, the roller is moved back and forth between the inner and outer pin rings of the polishing machine and pressed against the upper polishing cloth while the upper polishing plate is rotated.
Gemäß einer anderen Ausführungsform wird die Walze zwischen dem inneren und dem äußeren Stiftkranz der Poliermaschine hin- und herbewegt und nur auf dem Hinoder Rückweg gegen das obere Poliertuch gepresst, während der obere Polierteller gedreht wird. Die weitere Beschreibung der Erfindung erfolgt unter Bezugnahme auf Zeichnungen. According to another embodiment, the roller is moved back and forth between the inner and outer pin rings of the polishing machine and is only pressed against the upper polishing cloth on the way there or back while the upper polishing plate is rotated. The further description of the invention takes place with reference to drawings.
Kurzbeschreibung der Figuren Short description of the characters
Fig. 1 zeigt Merkmale einer DSP-Poliermaschine bei Draufsicht auf den unteren Polierteller. Fig. 1 shows features of a DSP polishing machine with a top view of the lower polishing plate.
Fig. 2 zeigt eine bevorzugte Ausführungsform der Erfindung. Fig. 2 shows a preferred embodiment of the invention.
Liste der verwendeten Bezugszeichen List of reference symbols used
1 unterer Polierteller 1 lower polishing plate
2 unteres Poliertuch 2 lower polishing cloth
3 Innenrand 3 inner edge
4 Außenrand 4 outer edge
5 innerer Stiftkranz 5 inner pin wreath
6 äußerer Stiftkranz 6 outer pin wreath
7 oberes Poliertuch 7 upper polishing cloth
8 oberer Polierteller 8 upper polishing plate
9 Linearschienen 9 linear rails
10 Schlitten 10 sleighs
11 Aktuator 11 actuator
12 Walze 12 reel
13 Steuerung 13 Control
14 Ring 14 rings
15 Leisten 15 strips
16 Außenverzahnung 16 external teeth
Detaillierte
Figure imgf000007_0001
Detailed
Figure imgf000007_0001
Fig.1 zeigt Merkmale einer DSP-Poliermaschine bei Draufsicht auf den unteren Polierteller 1 , auf dem ein ringförmiges unteres Poliertuch 2 aufgeklebt ist. Parallel zum Innenrand 3 und zum Außenrand 4 des unteren Poliertuchs 2 und des unteren Poliertellers 1 sind ein innerer Stiftkranz 5 und ein äußerer Stiftkranz 6 angeordnet, mittels derer die Polierteller 1 ,8 gedreht werden können. Wie in Fig.2 dargestellt ist, wird der untere Polierteller 1 dazu verwendet, um die Vorrichtung zum Anpressen des oberen Poliertuchs 7 gegen den oberen Polierteller 8 darauf abzustützen. Die Vorrichtung umfasst zwei parallel liegende Linearschienen 9, die in geringem Abstand über dem unteren Polierteller 1 parallel zu einem dazwischenliegenden Radius des unteren Poliertellers 1 angeordnet sind. Jede der Linearschienen 9 dient jeweils einem Schlitten 10 als Führung, wobei jeder der Schlitten 10 einen Aktuator 11 trägt und eine Walze 12 an den Aktuatoren befestigt ist, so dass die Walze zwischen den Linearschienen 9 angeordnet ist. Die Aktuatoren können die Walze 12 anheben und wieder absenken und die Schlitten 10 sie entlang eines Wegs zwischen dem äußeren Stiftkranz 6 und dem inneren Stiftkranz 5 bewegen. Die Schlitten 10 und die Aktuatoren 11 bewegen sich jeweils synchron, was durch eine Steuerung 13 (Controller) sichergestellt wird. Fig. 1 shows features of a DSP polishing machine in a top view of the lower polishing plate 1, on which an annular lower polishing cloth 2 is glued. An inner pin ring 5 and an outer pin ring 6 are arranged parallel to the inner edge 3 and to the outer edge 4 of the lower polishing cloth 2 and the lower polishing plate 1, by means of which the polishing plates 1, 8 can be rotated. As shown in Fig. 2, the lower polishing plate 1 is used to support the device for pressing the upper polishing cloth 7 against the upper polishing plate 8 thereon. The device comprises two parallel linear rails 9, which are arranged at a short distance above the lower polishing plate 1 parallel to an intermediate radius of the lower polishing plate 1. Each of the linear rails 9 serves as a guide for a slide 10, each of the slides 10 carrying an actuator 11 and a roller 12 is attached to the actuators, so that the roller is arranged between the linear rails 9. The actuators can raise and lower the roller 12 and the carriages 10 can move it along a path between the outer pin ring 6 and the inner pin ring 5. The carriages 10 and the actuators 11 each move synchronously, which is ensured by a control 13 (controller).
Gemäß der dargestellten Ausführungsform liegen die Linearschienen 9 auf einem Ring 14 und im Ring 14 liegende Leisten 15 auf, wobei der Ring 14 eine Außenverzahnung 16 aufweist, die in den äußeren Stiftkranz 6 und in den inneren Stiftkranz 5 der Maschine eingreift. According to the embodiment shown, the linear rails 9 rest on a ring 14 and strips 15 lying in the ring 14, the ring 14 having external teeth 16 which engage in the outer pin ring 6 and the inner pin ring 5 of the machine.
Zum Durchführen des erfindungsgemäßen Verfahrens wird das obere Poliertuch 7 in einem Zwischenzustand gebracht, in dem Blasen im Zwischenraum zwischen dem oberen Poliertuch 7 und dem oberen Polierteller 8 vorhanden sind und das obere Poliertuch 7 noch nicht gleichmäßig am oberen Polierteller 8 haftet. To carry out the method according to the invention, the upper polishing cloth 7 is brought into an intermediate state in which bubbles are present in the space between the upper polishing cloth 7 and the upper polishing plate 8 and the upper polishing cloth 7 does not yet adhere evenly to the upper polishing plate 8.
Danach wird die Vorrichtung zum Anpressen des oberen Poliertuchs 7 gegen den oberen Polierteller 8 über dem unteren Poliertuch 2 angeordnet, und der obere Polierteller 8 über den unteren Polierteller 1 geschoben. Die beiden Polierteller 8,1 haben einen Abstand zueinander, der es erlaubt, die Walze 12 der Vorrichtung gegen das obere Poliertuch 7 zu pressen. The device for pressing the upper polishing cloth 7 against the upper polishing plate 8 is then arranged above the lower polishing cloth 2, and the upper polishing plate 8 is pushed over the lower polishing plate 1. The two polishing plates 8,1 are at a distance from one another which allows the roller 12 of the device to be pressed against the upper polishing cloth 7.
Fig. 2 zeigt sie Situation, bevor der obere Polierteller 8 über den unteren Polierteller 1 angeordnet wurde. Fig. 2 shows the situation before the upper polishing plate 8 was arranged over the lower polishing plate 1.
Anschließend wird der obere Polierteller 8 langsam gedreht und die Walze 12 mittels der Schlitten 10 zwischen dem äußeren Stiftkranz 6 und dem inneren Stiftkranz 5 hin- und herbewegt, während die Aktuatoren 11 die Walze 12 zumindest zeitweise gegen das obere Poliertuch 7 pressen. The upper polishing plate 8 is then slowly rotated and the roller 12 is moved between the outer pin ring 6 and the inner pin ring 5 by means of the carriage 10. and moved here while the actuators 11 press the roller 12 against the upper polishing cloth 7 at least temporarily.
Es konnte nachgewiesen werden, dass der Vorteil des Verfahrens nicht nur darin besteht, anstrengende manuelle Arbeit zu vermeiden, sondern sich auch vorteilhaft auf das Polierergebnis auswirkt. Die Geometrie, also die Ebenheit und Planparallelität polierter Halbleiterscheiben aus einkristallinem Silizium wurde gemessen, auch die lokale Geometrie am Rand, und zu einem Messwert zusammengefasst, der die Messergebnisse von GBIR (global flatness back ideal range) und ESFQR (edge site front least squares range) vereint. Dieser Messwert war um durchschnittlich nahezuIt has been proven that the advantage of the process is not only that it avoids strenuous manual work, but also has a beneficial effect on the polishing result. The geometry, i.e. the flatness and plane parallelism of polished semiconductor wafers made of single-crystalline silicon, was measured, including the local geometry at the edge, and combined into a measurement value that contains the measurement results of GBIR (global flatness back ideal range) and ESFQR (edge site front least squares range ) united. This reading was close to average
17,8 % kleiner, wenn das obere Poliertuch vor der Politur nicht manuell, sondern erfindungsgemäß gegen den oberen Polierteller gepresst worden war. 17.8% smaller if the upper polishing cloth was not pressed manually before polishing but was pressed against the upper polishing plate according to the invention.

Claims

Patentansprüche Patent claims
1. Vorrichtung zum Anpressen eines oberen Poliertuchs gegen einen oberen Polierteller einer Maschine zum gleichzeitigen Polieren einer Vorderseite und einer Rückseite einer Halbleiterscheibe zwischen dem oberen Polierteller und einem unteren Polierteller, umfassend zwei parallel liegende Linearschienen, die in geringem Abstand über dem unteren Polierteller parallel zu einem dazwischenliegenden Radius des unteren Poliertellers angeordnet sind; einen Grundkörper, auf dem die Linearschienen befestigt sind; zwei entlang der Linearschienen bewegbare, angetriebene Schlitten; von den Schlitten getragene Aktuatoren zum Anheben und Absenken einer Walze, die an den Aktuatoren befestigt und zwischen den Linearschienen angeordnet ist; und eine Steuerung zum synchronen Hin- und Herbewegen der Schlitten zwischen einem inneren und einem äußeren Stiftkranz der Maschine und zum synchronen Bewegen der Aktuatoren. 1. Device for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front and a back of a semiconductor wafer between the upper polishing plate and a lower polishing plate, comprising two parallel linear rails which are at a short distance above the lower polishing plate parallel to one intermediate radius of the lower polishing plate are arranged; a base body on which the linear rails are attached; two driven carriages that can be moved along the linear rails; actuators carried by the carriages for raising and lowering a roller attached to the actuators and arranged between the linear rails; and a controller for synchronously moving the carriages back and forth between an inner and an outer pin ring of the machine and for synchronously moving the actuators.
2. Vorrichtung nach Anspruch 1 , gekennzeichnet durch einen Ring oder eine Platte als Grundkörper und im Ring liegende Leisten, auf denen die Linearschienen abgestützt sind, wobei der Ring oder die Platte eine Verzahnung aufweist, die in den äußeren und in den inneren Stiftkranz der Maschine eingreift. 2. Device according to claim 1, characterized by a ring or a plate as a base body and strips lying in the ring on which the linear rails are supported, the ring or the plate having teeth which are in the outer and in the inner pin ring of the machine intervenes.
3. Vorrichtung nach Anspruch 1 oder Anspruch 2, dadurch gekennzeichnet, dass die Aktuatoren pneumatisch oder elektrisch arbeiten. 3. Device according to claim 1 or claim 2, characterized in that the actuators work pneumatically or electrically.
4. Verfahren zum Anpressen eines oberen Poliertuchs gegen einen oberen Polierteller einer Maschine zum gleichzeitigen Polieren einer Vorderseite und einer Rückseite einer Halbleiterscheibe, umfassend das Bekleben des oberen Poliertellers mit dem oberen Poliertuch; und das Anordnen der Vorrichtung nach einem der Ansprüche 1 bis 3 über dem unteren Poliertuch; das Anordnen des oberen Poliertellers über dem unteren Polierteller in einem Abstand zueinander, der es erlaubt, die Walze der Vorrichtung gegen das obere Poliertuch zu pressen; und das zumindest zeitweise Pressen der Walze gegen das obere Poliertuch bei gleichzeitigem Drehen des oberen Poliertellers und Hin- und Herbewegen der Walze zwischen dem inneren und dem äußeren Stiftkranz der Maschine. 4. A method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a back side of a semiconductor wafer, comprising sticking the upper polishing plate with the upper polishing cloth; and placing the device according to any one of claims 1 to 3 over the lower polishing cloth; arranging the upper polishing pad over the lower polishing pad at a distance from each other that allows the roller of the device to be pressed against the upper polishing cloth; and the at least temporary pressing of the roller against the upper polishing cloth while simultaneously rotating the upper polishing plate and moving the roller back and forth between the inner and outer pin rings of the machine.
5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass die Walze zwischen dem äußeren und dem inneren Stiftkranz der Poliermaschine hin- und herbewegt und währenddessen gegen das obere Poliertuch gepresst wird. 5. The method according to claim 4, characterized in that the roller is moved back and forth between the outer and inner pin ring of the polishing machine and is thereby pressed against the upper polishing cloth.
6. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass die Walze zwischen dem äußeren und dem inneren Stiftkranz der Poliermaschine hin- und herbewegt und nur auf dem Hin- oder Rückweg gegen das obere Poliertuch gepresst wird. 6. The method according to claim 4, characterized in that the roller is moved back and forth between the outer and inner pin ring of the polishing machine and is only pressed against the upper polishing cloth on the way there or back.
PCT/EP2023/071505 2022-08-12 2023-08-03 Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a rear side of a semiconductor wafer WO2024033205A1 (en)

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EP22190170.5 2022-08-12

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Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953151A (en) * 1982-09-16 1984-03-27 Toshiba Corp Method and apparatus for attaching abrasive cloth to grinding machine
DE10007390A1 (en) 1999-03-13 2000-10-12 Wolters Peter Werkzeugmasch Dual disc polishing apparatus for semiconductor wafer, has support base which is connected with drive shaft and support disc, so that inclination of upper and lower grinding discs are equal
US20010041650A1 (en) * 1999-09-07 2001-11-15 Nikon Corporation Polishing device and polishing pad component exchange device and method
US20030054650A1 (en) 2001-07-05 2003-03-20 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Process for material-removing machining of both sides of semiconductor wafers
DE10239774A1 (en) 2002-08-29 2003-11-27 Wacker Siltronic Halbleitermat Method and apparatus for attaching polishing cloths to the plates of a polishing machine such as for polishing silicon wafers using grooves or ridges to control application of a vacuum
US20050277368A1 (en) * 2004-06-14 2005-12-15 Ebara Technologies Incorporated Apparatus and method for removing a cmp polishing pad from a platen
JP2006289523A (en) 2005-04-06 2006-10-26 Speedfam Co Ltd Double sided polishing device equipped with pressure roller for applying polishing pad, and applying method of polishing pad
JP2006346808A (en) 2005-06-15 2006-12-28 Mimasu Semiconductor Industry Co Ltd Grinding pad sticking method and workpiece producing method
US20070087671A1 (en) 2005-10-17 2007-04-19 Fujikoshi Machinery Corp. Method of adhering polishing pads and jig for adhering the same
DE102019213657A1 (en) * 2019-09-09 2021-03-11 Siltronic Ag Method and device for pressing a polishing cloth
EP4000806A1 (en) 2020-11-16 2022-05-25 Siltronic AG Method for polishing semiconductor wafers on both sides between a lower polishing plate and an upper polishing plate

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