WO2024032630A1 - 一种散热装置及电路板表面温度的控制方法 - Google Patents
一种散热装置及电路板表面温度的控制方法 Download PDFInfo
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- WO2024032630A1 WO2024032630A1 PCT/CN2023/111815 CN2023111815W WO2024032630A1 WO 2024032630 A1 WO2024032630 A1 WO 2024032630A1 CN 2023111815 W CN2023111815 W CN 2023111815W WO 2024032630 A1 WO2024032630 A1 WO 2024032630A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- heat dissipation
- wind
- air
- dissipation structure
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000000903 blocking effect Effects 0.000 claims abstract description 8
- 238000007664 blowing Methods 0.000 claims abstract description 8
- 238000004590 computer program Methods 0.000 claims description 13
- 238000011144 upstream manufacturing Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000003570 air Substances 0.000 description 87
- 238000005260 corrosion Methods 0.000 description 31
- 230000007797 corrosion Effects 0.000 description 22
- 238000004891 communication Methods 0.000 description 19
- 238000009833 condensation Methods 0.000 description 12
- 230000005494 condensation Effects 0.000 description 12
- 238000001816 cooling Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 239000000428 dust Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002918 waste heat Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
Definitions
- Embodiments of the present invention relate to the technical field of anti-corrosion of communication network equipment circuit boards, and specifically to a heat dissipation device and a method for controlling the surface temperature of a circuit board.
- Communication network equipment is usually installed in computer rooms and cabinets. It consists of a chassis and a circuit board installed in the chassis to implement various functions.
- the circuit board is composed of printed circuit boards, components, structural parts, etc. In these structures, it is inevitable Use a lot of metal materials. Components on the circuit board, such as various chips, module power supplies, and optical modules, emit a large amount of heat during operation. In order to ensure the reliable operation of the circuit board, the most economical and widely used method is to use forced air cooling to meet the device junction temperature requirements.
- the anti-corrosion protection and waterproof protection solutions commonly used in existing designs include: sealing the control circuit board in a protective shell.
- This technology can isolate the surface of the single board from the air in the external environment, making it as safe as possible. Ensure that the surface humidity of the veneer is not affected by the external ambient air.
- this method will also increase the size of the control circuit board, which is not conducive to compact design, and the technical cost of sealing technology is also high; at the same time, sealing directly affects the heat dissipation of the circuit board. For example, when the temperature is high during the day, the circuit board The temperature may be too high, causing the board to malfunction.
- Embodiments of the present invention provide a heat dissipation device and a circuit board surface temperature control method, so as to at least solve the problem in the related art that the circuit board anti-corrosion and waterproofing through sealing technology will affect the heat dissipation of the circuit board.
- a heat dissipation device which is applied to a circuit board installed in a chassis, including: a heat dissipation structure, arranged in parallel above the circuit board, and configured to protect the components on the circuit board.
- a wind blocking structure is provided in the air inlet area of the circuit board, and is configured to block the air flow directly blowing to the surface of the circuit board, and guide the air flow to the surface of the heat dissipation structure.
- a method for controlling the surface temperature of a circuit board including: monitoring the ambient temperature value T in at the air inlet, the surface temperature value T on of the circuit board, and the heat dissipation Air temperature in structural exhaust ducts Degree value T out ; by adjusting the fan speed, the temperature difference between T on and Tin is greater than the first threshold, and the temperature difference between T out and Tin is greater than the second threshold.
- a computer-readable storage medium is also provided.
- a computer program is stored in the computer-readable storage medium, wherein the computer program is configured to execute any of the above methods when running. Steps in Examples.
- an electronic device including a memory and a processor.
- a computer program is stored in the memory, and the processor is configured to run the computer program to perform any of the above. Steps in method embodiments.
- Figure 1 is a structural block diagram of a heat dissipation device according to an embodiment of the present invention
- Figure 2 is a flow chart of a method for controlling the surface temperature of a circuit board according to an embodiment of the present invention
- FIG. 3 is a schematic diagram of a chassis structure according to an embodiment of the present invention.
- Figure 4 is a schematic diagram of the heat dissipation structure of the circuit board in the chassis according to an embodiment of the present invention
- Figure 5 is a schematic diagram of a duct in a chassis according to an embodiment of the present invention.
- Figure 6 is a schematic diagram of the heat dissipation structure in the chassis covering the circuit board according to an embodiment of the present invention.
- FIG. 7 is a flow chart of a method for controlling the surface temperature of a circuit board according to another embodiment of the present invention.
- FIG. 1 is a structural block diagram of a heat dissipation device according to an embodiment of the present invention. As shown in Figure 1, the device includes: a heat dissipation structure 101 and wind blocking structure 102.
- the heat dissipation structure 101 is arranged in parallel above the circuit board and is configured to dissipate heat from the components on the circuit board;
- the wind-shielding structure 102 is provided in the air inlet area of the circuit board, and is configured to block the air flow directly blowing to the surface of the circuit board, and guide the air flow to the surface of the heat dissipation structure.
- the heat dissipation structure 101 and the wind shielding structure 102 are an integrated structure, or the heat dissipation structure 101 and the wind shielding structure 102 are separate structures.
- the method further includes: the wind-shielding structure 102 is vertically disposed at the portion of the circuit board located at the air inlet, and the wind-shielding structure 102 is disposed in close contact with the portion of the circuit board located at the air inlet.
- the windshielding structure 102 is vertically disposed on the part of the circuit board located at the air inlet and the air outlet, and the windshielding structure 102 is closely connected to the part of the circuit board located at the air inlet. Post settings.
- the wind-shielding structure 102 is arranged vertically around the circuit board.
- the method further includes: the heat dissipation structure 101 is disposed in parallel on the front and back of the circuit board, wherein the heat dissipation structure 101 disposed on the front of the circuit board partially covers the surface of the circuit board. On the front side, the heat dissipation structure 101 provided on the back side of the circuit board completely or partially covers the back side of the circuit board.
- it further includes: when multiple circuit boards are installed in the chassis, the heat dissipation structure 101 is provided on the circuit board located upstream of the plug-in box or the chassis air duct.
- the windshielding structure 102 is made of one of the following materials: metal, ceramics, and plastic.
- the wind-shielding structure 102 includes: a wind-shielding surface, perpendicular to the circuit board, and configured to block airflow directly blowing to the surface of the circuit board; and an air duct surface, parallel to the circuit board.
- a plate configured to direct the airflow to a surface of the heat dissipation structure.
- the wind shielding structure 102 is L-shaped or U-shaped.
- the windshield is provided with a plurality of holes.
- a heat dissipation structure is provided on the circuit board to dissipate heat from the circuit board.
- a wind-shielding structure is also provided to block the air flow directly blowing to the surface of the circuit board to prevent water film and accumulation of dust on the surface of the circuit board. Prevent corrosive gases, liquids, and solid particles from invading the core functional circuit boards and components of communication equipment. Therefore, it is possible to solve the problem in related technologies that the circuit board anti-corrosion and waterproofing through sealing technology will affect the heat dissipation of the circuit board, thereby reducing the risk of circuit board corrosion.
- FIG. 1 is a flow chart of a method for controlling the surface temperature of a circuit board according to an embodiment of the present invention. As shown in Figure 2, the process includes follow these steps:
- Step S202 monitor the ambient temperature value T in at the air inlet, the surface temperature value T on of the circuit board, and the air temperature value T out of the exhaust duct of the heat dissipation structure;
- Step S204 Adjust the rotation speed of the fan so that the temperature difference between T on and T in is greater than the first threshold, and the temperature difference between T out and Tin is greater than the second threshold.
- ROM/RAM Read-Only Memory/Random Access Memory
- disk optical disk
- ROM/RAM Read-Only Memory/Random Access Memory
- terminal device which can be a mobile phone, computer, server, or network device, etc.
- Methods described in various embodiments of the present invention include a number of instructions to cause a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute Methods described in various embodiments of the present invention.
- the embodiment of the present invention proposes a heat dissipation system of a communication equipment plug-in box or a chassis, a communication equipment plug-in box or a chassis.
- Figure 3 is a schematic diagram of a chassis structure according to an embodiment of the present invention.
- the heat dissipation system can Prevent water films from forming on the surface of circuit boards in communication equipment sockets or chassis, accumulation of dust, and corrosive gases, liquids, and solid particles from invading core functional circuit boards and components of communication equipment.
- the heat dissipation system of the communication equipment socket or chassis includes: a heat dissipation structure with wind-shielding functional devices (i.e., wind-shielding devices) installed on the front and back of the circuit board installed in the socket or chassis.
- Figure 4 is based on this Schematic diagram of the heat dissipation structure of the circuit board in the chassis according to the embodiment of the invention.
- FIG. 5 is a schematic diagram of a channel in a chassis according to an embodiment of the present invention.
- a fan is provided at one end of the chassis, and the fan guides cooling air to flow from one end of the chassis to the other end.
- the wind-shielding functional device of the heat dissipation structure is disposed in the air inlet area of the circuit board. The wind-shielding functional device is in close contact with the circuit board and blocks the air blown from the cooling fan from flowing directly and rapidly to the surface of the circuit board.
- the wind-shielding device is The functional device is functionally equivalent to the windshielding structure in the above embodiment; the heat dissipation structure covers the entire circuit board area, so that the air duct for cooling air passes through the surface of the heat dissipation structure instead of the circuit board surface.
- the heat dissipation structure serves as a common radiator for the heating devices on the circuit board. With the rapid heat transfer capability of the radiator, the waste heat generated by the circuit board operation is evenly and quickly transferred to every position of the radiator. The overall Increase the temperature rise of the radiator, thereby increasing the temperature rise of the air in the internal space between the radiator and the circuit board, thereby reducing the relative humidity of the air in the internal space, and further reducing the risk of circuit board corrosion.
- the wind shield and the heat dissipation structure are preferably designed as an integrated structure.
- a wind shielding device in addition to arranging a wind shielding device close to the circuit board in the air inlet area, can be set at the air outlet, or on the circuit board. Set windshields around the circuit board to minimize the wind speed on the circuit board surface and the entry of outside air.
- the wind blocking device and the heat dissipation structure can also be designed as separate structures according to actual needs.
- the wind shield can be made of various materials such as metal, ceramics, plastic, glue, etc., and cooperate with the heat dissipation structure to block the cooling air from the cooling fan from directly flowing through the circuit at a high wind speed. board surface.
- the wind blocking device is a thick metal plate with strong corrosion resistance.
- the circuit board can be provided with heat dissipation structures on both sides.
- the size of the heat dissipation structure is as large as or close to the circuit board, preferably to completely cover all components, lines, and vias of the circuit board.
- the size of the heat dissipation structure can be reduced as needed to reduce costs and the complexity of the internal structure of the chassis. It is not necessary to provide a heat dissipation structure with a baffle on the entire circuit board.
- the heat dissipation structure of the wind function device only needs to be installed at the air inlet of the circuit board and upstream of the air duct.
- the circuit board upstream of the air duct is protected by the heat dissipation structure, and the circuit board downstream of the air duct relies on the heated air for anti-corrosion to ensure that it flows through the heat dissipation structure.
- the temperature rise reaches the target value after leaving the heat dissipation structure.
- the temperature rise of the circuit board exceeds 10 degrees, which can effectively prevent corrosion.
- a heat dissipation structure with a wind-shielding device can be provided on the circuit board upstream of the air duct as needed to reduce costs and reduce the complexity of the internal structure of the chassis. In this way, it is not necessary for all circuit boards to be equipped with a heat dissipation structure.
- the heat dissipation structure with a wind blocking function only needs to be installed at the air inlet of the circuit board upstream of the air duct and upstream of the air duct. The circuit board upstream of the air duct is protected by the heat dissipation structure.
- the circuit board downstream of the air duct relies on the heated air for anti-corrosion to ensure that the air flowing through the heat dissipation structure exchanges heat with the heat dissipation structure and the temperature rise reaches the target value after leaving the heat dissipation structure.
- the circuit board equipped with a heat dissipation structure with a wind shield is placed at the air inlet of the air duct, or the circuit board is only partially provided with a heat dissipation device with a wind shield for the circuit board upstream of the air duct.
- the structure is conducive to increasing the overall temperature rise of the chassis and improving the anti-corrosion capability of the entire chassis.
- the heat generated by the heating device on the circuit board is uploaded from the device to the windshield through the thermal conductive medium.
- the heat evenly dissipated by the circuit board windshield device upstream of the air duct can provide air with a uniform temperature rise for the downstream circuit boards, thereby reducing the temperature of the downstream circuit boards.
- the humidity of the air on the surface of the circuit board reduces the risk of corrosion of downstream circuit boards.
- the windshield device on the circuit board not only plays an anti-corrosion role in the circuit board, but also can be used as a radiator to help the circuit board dissipate heat. It can also evenly increase the temperature rise of the entire equipment and protect the downstream circuit board in the air duct from moisture and dust. Troubles lead to corrosion and insulation degradation, which is beneficial to reducing the anti-corrosion cost of downstream circuit boards, making it possible for downstream circuit boards to spray conventional three-proof coatings or not spray three-proof coatings to meet corrosion protection requirements.
- the heat dissipation structure includes: an L-shaped or U-shaped windshield that covers the mounting surface of the circuit board.
- the windshield has at least two sides: the side is the windshield and the obstruction
- the air flow blown by the fan is directed to the surface of the circuit board;
- the flat surface is the air duct surface, which guides and changes the flow direction of the wind, and then guides the wind to the downstream of the heat dissipation structure.
- the heat dissipation structure is assembled to the circuit board.
- the circuit board is located on the leeward side. The wind speed on the surface of the circuit board tends to the natural heat dissipation state, limiting the The impact of air flow on PCB reduces PCB corrosion.
- some small holes can be arranged on the windshield surface, and the small holes can reduce the wind speed flowing through the PCB surface, so that the high-speed wind blown by the fan can be converted into low-speed wind when flowing through the PCB surface.
- the windshielding surface of the windshielding device is disposed at the air inlet of the circuit board to prevent the air accelerated by the fan from entering the circuit board, so that the surface of the circuit board protected by the windshielding device maintains a natural heat dissipation state, and the circuit
- the devices on the surface of the board are located on the leeward side; the air duct surface of the windshield is parallel to the surface of the circuit board.
- the air flows through the windshield and takes away the heat generated by the work of the circuit board.
- Heat dissipation teeth can be set as needed; the circuit board and the windshield In between, thermally conductive materials can be used to absorb and dissipate heat as needed, and the windshield device serves as a common radiator for multiple heating devices on the circuit board.
- functional components are provided on the front and back surfaces of the circuit board, and the components are interconnected using solder joints, traces, and vias.
- a windshield when a windshield is provided on both sides of the circuit board, it will block the wind for the equipment system and affect the heat dissipation of the entire device. At this time, a complete windshield cannot be installed on the front due to ventilation and heat dissipation requirements. Therefore, The windshielding device can only be provided with a partial windshielding device on the front, and a partial or complete windshielding device can be provided on the back. In this scenario, it is preferable to move components that are prone to corrosion and have poor protection capabilities, such as small-size chip components, fine-pitch components, and important components, to the back of the PCB.
- the front of the PCB is equipped with devices that have strong corrosion resistance or have certain heat and temperature rise, such as MOS tubes and plug-in devices.
- the circuit board is inserted into the chassis slot using a PCB board edge.
- the wind blown from the equipment chassis fan has uneven wind speed at the fan outlet and circuit board air inlet, and the wind speed is high in the center of the air duct.
- the circuit board air inlet Corrosive risk is greatest. Therefore, setting up a heat dissipation structure with a windshield device can, on the one hand, prevent the wind with low temperature and high humidity blown out by the fan of the chassis from blowing directly to the circuit board at the air inlet of the circuit board; on the other hand, through the air inlet at the The heat dissipation structure rubs and blocks the wind, reducing the air speed and making the air volume at various locations more uniform.
- the heat dissipation structure with the wind-shielding function device does not block the air duct of the equipment, so that the wind originally blowing to the surface of the circuit board is instead blown to the surface of the heat dissipation structure, so that the wind speed on the surface of the air-cooled circuit board is reduced.
- Reduce the heat exchange speed on the surface of the circuit board thereby reducing the humidity on the surface of the circuit board.
- it reduces the accumulation of dust, salt spray, oil and other pollutants on the surface of the circuit board, thereby reducing the risk of condensation and corrosion of the circuit board.
- the above-mentioned cooling system and communication equipment have a simple structure, no additional consumables, low energy consumption, and are environmentally friendly, which helps reduce manufacturing costs. It can also effectively reduce the relative humidity of the air blown to the circuit board, which is beneficial to improving the reliability of the operation of communication equipment. Reduce the chance of communication equipment failure.
- circuit boards of electronic equipment such as communication equipment will corrode rapidly, causing the circuit board to lose its communication function; in order to improve the operational reliability of communication equipment, it is necessary to reduce the relative humidity, and
- the control circuit board is contaminated by dust and the circuit board is protected from condensation. Condensation is a necessary condition for circuit board corrosion, and condensation is related to the contamination of electronic devices such as circuit boards. We must try to block the conditions that cause condensation to prevent electronic devices from failing due to environmental corrosion.
- the contamination degree and relative humidity on the surface of the circuit board are strictly controlled, the occurrence of condensation can be controlled. Dissipate heat through the above The system can dissipate and cool the circuit board while reducing the environmental pollution and relative contamination of the circuit board, thereby effectively preventing the generation of condensation.
- the ambient humidity is lower than 40% RH, which can effectively prevent corrosion.
- the surface temperature of the circuit board is within a certain temperature range higher than the external ambient temperature, the surface humidity of the single board can be maintained within the allowable range and the environmental adaptability of the circuit board can be improved.
- the heat dissipation structure with a windshield device in the embodiment of the present invention can effectively increase the temperature rise of the circuit board, reduce the humidity of the circuit board, reduce the cooling wind speed and dust accumulation on the surface of the circuit board, and effectively inhibit the corrosion factors of the circuit board.
- Figure 7 is a method according to an embodiment of the present invention to control the air temperature, relative humidity, and cooling airflow direction inside the plug-in box or chassis equipment by relying on the waste heat of the circuit board itself and using a heat dissipation structure with a windshield device.
- the windshield is made of metal and has good heat dissipation, it can quickly disperse the heat generated by the circuit board to the entire surface of the windshield, thereby evenly improving the heat generated by the combination of the windshield and the circuit board.
- the temperature of the air in the cavity further reduces the relative humidity of the air in the cavity and increases the temperature rise on the surface of the circuit board, thereby achieving the purpose of preventing corrosion of the circuit board and the windshield.
- the method includes the following steps:
- Step S702 A heat dissipation structure is provided on the surface of the circuit board, and the heat dissipation structure absorbs waste heat from the operation of the circuit board to increase the overall temperature of the equipment chassis.
- the heat dissipation structure covers part of the circuit board.
- Step S704 Set temperature detection points on the circuit board and heat dissipation structure, and perform temperature comparisons.
- Step S706 Control the rotation speed of the fan device of the chassis according to the comparison result.
- the heat dissipation structure when the heat dissipation structure covers the entire circuit board, it is only necessary to detect and compare the ambient temperature value T in at the air inlet and the circuit board surface temperature value T on , and adjust the wind speed according to the comparison results to ensure that the circuit board The surface temperature rise reaches the target value.
- the heating device on the circuit board transfers heat to the upper metal heat dissipation structure for heat dissipation through thermal conductive materials such as thermal pads, thermal conductive glue, etc.
- the heat dissipation structure can quickly disperse the heat generated by the work of the circuit board to the entire surface of the heat dissipation structure, thereby uniformly increasing the temperature of the air in the cavity formed by the combination of the heat dissipation structure and the circuit board, thereby reducing the relative humidity of the air in the cavity and improving the circuit board
- the surface temperature rises to achieve the purpose of preventing corrosion of circuit boards and windshields.
- the heat dissipated evenly by the circuit board heat dissipation structure upstream of the air duct can provide air with uniform temperature rise for the downstream circuit boards, thereby reducing the humidity of the air on the surface of the downstream circuit boards. Reduce the corrosion risk of downstream circuit boards, thereby reducing the corrosion protection process and cost of the downstream circuits of the chassis equipment air duct.
- Embodiments of the present invention also provide a computer-readable storage medium that stores a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when running.
- the computer-readable storage medium may include but is not limited to: USB flash drive, read-only memory (ROM), random access memory (Random Access Memory, RAM) , Various media that can store computer programs, such as removable hard drives, magnetic disks, or optical disks.
- An embodiment of the present invention also provides an electronic device, including a memory and a processor.
- a computer program is stored in the memory, and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.
- the above-mentioned electronic device may further include a transmission device and an input-output device, wherein the transmission device is connected to the above-mentioned processor, and the input-output device is connected to the above-mentioned processor.
- each module or each step of the above-mentioned embodiments of the present invention can be implemented by a general-purpose computing device. They can be concentrated on a single computing device, or distributed among multiple computing devices. over a network, they may be implemented with program code executable by a computing device, such that they may be stored in a storage device for execution by the computing device, and in some cases, may be executed in a sequence different from that described here.
- the steps shown or described may be implemented by fabricating them separately into individual integrated circuit modules, or by fabricating multiple modules or steps among them into a single integrated circuit module. As such, the invention is not limited to any specific combination of hardware and software.
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Abstract
一种散热装置及电路板表面温度的控制方法。装置包括：散热结构（101），平行设置在电路板的上方，设置为对电路板上的元器件进行散热；挡风结构（102），设置在电路板的进风口区域，设置为阻挡直接吹向电路板表面的气流，并将气流导向散热结构（101）的表面。
Description
相关申请的交叉引用
本申请基于2022年8月8日提交的发明名称为“一种散热装置及电路板表面温度的控制方法”的中国专利申请CN2022109531956，并且要求该专利申请的优先权，通过引用将其所公开的内容全部并入本申请。
本发明实施例涉及通信网络设备电路板防腐蚀技术领域，具体而言，涉及一种散热装置及电路板表面温度的控制方法。
通信网络设备通常安装在机房、机柜内，由机箱和安装在机箱内实现各种功能的电路板组成，电路板由印制线路板、元器件、结构件等构成，在这些结构中不可避免的使用很多金属材料。电路板上的元器件如各种芯片、模块电源、光模块在工作中散发大量热量，为保证电路板可靠工作，使用强迫风冷方式满足器件结温要求是最经济且广泛使用的方式。
随着设备应用场景的不断扩展，越来越多的通信网络设备被安装在温湿度不受控的场所(如：车库、楼道、直通风机柜、简易机房等)中，即使设备安装在温湿度受控的空调机房、空调户外柜、热交换机柜里，由于空调和热交换风扇在室外环境使用可靠性差，坏机比率非常高，空调坏机后得不到及时维修，往往柜门被直接打开散热，使得原本温湿度受控的机房、机柜也变成了温湿度、粉尘不受控的简易机房，机房和机柜在这些场景下失去了保护电路板的作用，在冷却风扇的带动下，引入粉尘、高湿空气、凝露、腐蚀性气体，引起电路板线路腐蚀等失效，影响通信网络设备的可靠性，并带来巨大的经济损失。
为解决这一问题，现有设计通常所采用的防腐蚀保护和防水保护的方案包括：将控制电路板密封于保护壳体中，这种技术可以隔离单板表面与外界环境的空气，尽可能保证单板表面湿度不受外界环境空气的影响。但是这种方式也会增大控制电路板的体积，不利于紧凑化设计，密封技术的技术成本也较高；同时，密封直接影响到电路板的散热，如白天温度较高时，电路板的温度可能过大，会引起单板功能失常。
发明内容
本发明实施例提供了一种散热装置及电路板表面温度的控制方法，以至少解决相关技术中通过密封技术进行电路板防腐防水会影响电路板散热的问题。
根据本发明的一个实施例，提供了一种散热装置，应用于安装在机箱的电路板，包括：散热结构，平行设置在所述电路板的上方，设置为对所述电路板上的元器件进行散热；挡风结构，设置在所述电路板的进风口区域，设置为阻挡直接吹向所述电路板表面的气流，并将所述气流导向所述散热结构的表面。
根据本发明的另一个实施例，提供了一种电路板表面温度的控制方法，包括：监测所述进风口处的环境温度值Tin、所述电路板的表面温度值Ton以及所述散热结构的排风道的空气温
度值Tout；通过调整风扇的转速使得Ton与Tin的温度差大于第一阈值，以及Tout与Tin的温度差大于第二阈值。
根据本发明的又一个实施例，还提供了一种计算机可读存储介质，所述计算机可读存储介质中存储有计算机程序，其中，所述计算机程序被设置为运行时执行上述任一项方法实施例中的步骤。
根据本发明的又一个实施例，还提供了一种电子装置，包括存储器和处理器，所述存储器中存储有计算机程序，所述处理器被设置为运行所述计算机程序以执行上述任一项方法实施例中的步骤。
图1是根据本发明实施例的散热装置的结构框图；
图2是根据本发明实施例的电路板表面温度的控制方法的流程图；
图3是根据本发明实施例的一种机箱结构的示意图；
图4是根据本发明实施例的机箱内的电路板设置散热结构示意图；
图5是根据本发明实施例的机箱中风道的示意图；
图6是根据本发明实施例的机箱内散热结构覆盖电路板的示意图；
图7是根据本发明另一实施例的电路板表面温度的控制方法的流程图。
下文中将参考附图并结合实施例来详细说明本发明的实施例。
本发明实施例提出一种应用于通讯设备插箱或机箱内的电路板的散热装置，图1是根据本发明实施例的散热装置的结构框图，如图1所示，该装置包括：散热结构101和挡风结构102。
散热结构101，平行设置在所述电路板的上方，设置为对所述电路板上的元器件进行散热；
挡风结构102，设置在所述电路板的进风口区域，设置为阻挡直接吹向所述电路板表面的气流，并将所述气流导向所述散热结构的表面。
在一个示例性实施例中，所述散热结构101和所述挡风结构102为一体结构，或所述散热结构101与所述挡风结构102为分立结构。
在一个示例性实施例中，还包括：所述挡风结构102垂直设置在所述电路板位于进风口的部分，所述挡风结构102与所述电路板位于进风口的部分紧贴设置。
在一个示例性实施例中，还包括：所述挡风结构102垂直设置在所述电路板位于进风口和出风口的部分，所述挡风结构102与所述电路板位于进风口的部分紧贴设置。
在一个示例性实施例中，还包括：所述挡风结构102垂直设置在所述电路板的四周。
在一个示例性实施例中，还包括：所述散热结构101平行设置在所述电路板的正面和背面，其中，设置于所述电路板正面的所述散热结构101部分覆盖所述电路板的正面，设置于所述电路板背面的所述散热结构101完全或部分覆盖所述电路板的背面。
在一个示例性实施例中，还包括：在所述机箱中安装了多个电路板的情况下，所述散热结构101设置在位于所述插箱或机箱风道上游的电路板上。
在一个示例性实施例中，所述挡风结构102的材料为以下之一：金属、陶瓷、塑胶。
在一个示例性实施例中，所述挡风结构102包括：挡风面，垂直于所述电路板，设置为阻挡直接吹向所述电路板表面的气流；风道面，平行于所述电路板，设置为将所述气流导向所述散热结构的表面。
在一个示例性实施例中，所述挡风结构102为L型或U型。
在一个示例性实施例中，挡风面设有多个孔洞。
通过上述实施例，由于在电路板上设置了散热结构为电路板散热，同时，还设置了挡风结构阻挡直接吹向电路板表面的气流，以防止电路板表面产生水膜、积聚粉尘，以及防止腐蚀性气体、液体、固体颗粒侵害通讯设备的核心功能电路板及元器件。因此，可以解决相关技术中通过密封技术进行电路板防腐防水会影响电路板散热的问题，达到降低电路板被腐蚀风险效果。
在本实施例中提供了一种基于散热装置的电路板表面温度的控制方法，图2是根据本发明实施例的电路板表面温度的控制方法的流程图，如图2所示，该流程包括如下步骤：
步骤S202，监测所述进风口处的环境温度值Tin、所述电路板的表面温度值Ton以及所述散热结构的排风道的空气温度值Tout；
步骤S204，通过调整风扇的转速使得Ton与Tin的温度差大于第一阈值，以及Tout与Tin的温度差大于第二阈值。
通过上述步骤，依靠电路板自身工作余热，借助带挡风装置的散热结构控制插箱或机箱设备内部空气温度、相对湿度、冷却气流走向，进一步地可降低电路板腐蚀风险。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到根据上述实施例的方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本发明实施例的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如只读存储器/随机存取存储器(Read-Only Memory/Random Access Memory，ROM/RAM)、磁碟、光盘)中，包括若干指令用以使得一台终端设备(可以是手机，计算机，服务器，或者网络设备等)执行本发明各个实施例所述的方法。
为便于对本发明实施例所提供的技术方案的理解，下面将结合具体场景的实施例进行详细的阐述。
本发明实施例提出一种通讯设备插箱或机箱的散热系统、通讯设备插箱或机箱，图3是根据本发明实施例的一种机箱结构的示意图，在本实施例中通过该散热系统可以防止通讯设备插箱或机箱内的电路板表面产生水膜，积聚粉尘，防止腐蚀性气体、液体、固体颗粒侵害通讯设备的核心功能电路板及元器件。
具体地，通讯设备插箱或机箱的散热系统，包括：在插箱或机箱内安装的电路板的正面和背面设置带挡风功能装置(即挡风装置)的散热结构，图4是根据本发明实施例的机箱内的电路板散热结构示意图。
图5是根据本发明实施例的机箱中风道的示意图，如图5所示，在机箱中的一端设置有风扇，该风扇会引导冷却空气从机箱的一端流向另一端。在本实施例中，散热结构的挡风功能装置设置在电路板进风口区域，挡风功能装置与电路板紧贴，阻挡从冷却风扇吹出的空气直接快速流向电路板表面，其中，该挡风功能装置在功能上相当于上述实施例中的挡风结构；散热结构覆盖整个电路板区域，便于冷却空气的风道走散热结构表面，而不走电路板表面，
如图6所示；所述的散热结构作为电路板上发热器件的共用散热器，借助散热器的快速传热能力，将电路板工作产生的余热均匀快速传递到散热器的每个位置，整体提高散热器的温升，从而提高散热器与电路板之间的内部空间内的空气的温升，进而降低内部空间内的空气的相对湿度，进一步降低电路板腐蚀风险。
在一个示例性实施例中，挡风装置和散热结构优选设计为一体结构。
在一个示例性实施例中，为进一步降低电路板表面的空气流动速度，除了在进风口区域设置紧贴电路板的挡风装置外，可以同时在出风口设置挡风装置，也可以在电路板的四周设置挡风装置，以最大限度降低电路板表面风速和外界空气进入。
在一个示例性实施例中，挡风装置和散热结构，也可以根据实际需要设计为分立结构。
在一个示例性实施例中，挡风装置可以使用金属、陶瓷、塑胶、胶水等各种材料制作成挡风装置，配合散热结构，阻挡从冷却风扇出来的冷却空气直接以较大风速流经电路板表面。
在一个示例性实施例中，挡风装置为厚金属板，抗腐蚀能力强。
在一个示例性实施例中，电路板可双面设置散热结构，散热结构尺寸与电路板等大或接近，以完全覆盖住电路板的所有器件、线路、过孔为优选。
在一个示例性实施例中，当电路板工作产生的热量足够大，可以根据需要缩小散热结构的尺寸以降低成本，降低机箱内部结构的复杂度，不必整块电路板都设置散热结构，带挡风功能装置的散热结构只需要设置在电路板的进风口和风道上游，风道上游的电路板靠散热结构保护，风道下游的电路板依靠升温后的空气进行防腐蚀，确保流经散热结构的空气与散热结构热交换离开散热结构后温升达到目标值，电路板温升超过10度，可以有效预防腐蚀。
在一个示例性实施例中，当机箱或者插箱里安装多块电路板时，可以根据需要在风道上游的电路板设置带挡风功能装置的散热结构以降低成本，降低机箱内部结构的复杂度，这样，不必所有的电路板都设置散热结构，带挡风功能装置的散热结构只需要设置在风道上游的电路板的进风口和风道上游，风道上游的电路板靠散热结构保护，风道下游的电路板依靠升温后的空气进行防腐蚀，确保流经散热结构的空气与散热结构热交换离开散热结构后温升达到目标值。
在本实施例中，将设置了带有挡风装置的散热结构的电路板放在风道进风口，或者电路板只对出于风道上游的电路板进行局部设置带有挡风装置的散热结构，有利于提高机箱的整体温升，提高整个机箱的防腐蚀能力。将电路板上发热器件产生的热量，通过导热介质，从器件上传到挡风装置。
在本实施例中，当通信设备机箱内设置了多块电路板时，风道上游的电路板挡风装置均匀散发的热量，可以为下游的电路板提供得到均匀温升的空气，从而降低下游电路板表面空气的湿度，降低下游电路板的腐蚀风险。电路板上的挡风装置不仅起到了电路板的防腐蚀作用，可以作为电路板的散热器帮助电路板进行散热，还可以均匀提高整个设备的温升，保护风道下游电路板不受湿尘困扰导致腐蚀和绝缘下降，有利于降低下游电路板的防腐蚀成本，使得下游电路板有可能喷常规三防涂层或者不喷三防涂层，就能满足腐蚀防护要求。
在一个示例性实施例中，散热结构包括：将上述电路板的安装表面覆盖住的L型或U型结构挡风装置，该挡风装置至少包含有2个面：侧面为挡风面，阻碍风扇吹出来的风流直接向电路板表面；平面为风道面，引导、改变风的流向，进而将风引导吹向散热结构的下游。散热结构装配到电路板上，电路板位于背风面，电路板表面的风速趋于自然散热状态，限制
空气流动对PCB的影响，减小PCB腐蚀。
在一个示例性实施例中，挡风面上可布局开设一些小孔，通过小孔降低要流经PCB表面的风速，以将风扇吹出来的高速风在流经PCB表面时转变为低速风。
在一个示例性实施例中，挡风装置的挡风面设置在电路板的进风口，阻碍经风扇加速后的空气进入电路板，使挡风装置保护下的电路板表面保持自然散热状态，电路板表面的器件位于背风面；挡风装置的风道面平行于电路板表面，空气流经挡风装置，带走电路板工作产生的热量，可以根据需要设置散热齿；电路板和挡风装置之间，可以根据需要采用导热材料进行吸热、散热，挡风装置作为电路板上多个发热器件的共用散热器。
在一个示例性实施例中，电路板正反表面设置了功能元器件，元器件之间用焊点、走线、过孔进行互连。
在一个示例性实施例中，当电路板双面设置挡风装置会对设备系统进行挡风，会影响整个设备的散热，此时，正面因通风散热要求无法设置一块完整的挡风装置，因此挡风装置仅能在正面设置一块的局部的挡风装置，在背面则可设置一块局部的或者一块完整的挡风装置。这个场景下，优选地将容易腐蚀自身防护能力差的器件如小尺寸片式器件、密间距器件、重要器件转移到PCB背面。PCB正面设置自身抗腐蚀能力强或者自身有一定发热具有温升的器件，比如MOS管、插件器件。
在一个示例性实施例中，电路板采用PCB板边插入机箱插槽。
需要指出的是，在本发明实施例中，从设备机箱风扇吹出来的风，在风扇出风口电路板进风口处风速不均匀，风道中心风速大，在没有散热结构时，电路板进风口腐蚀性风险最大。因此，设置带挡风装置的散热结构，一方面可避免机箱自带风扇吹出来的温度较低湿度高的风，在电路板进风口处直接吹向电路板；另一方面通过进风口处的散热结构和风进行摩擦、阻挡，将空气风速降低、使其在各个位置的风量更加均匀。
在本发明的上述实施例中，带挡风功能装置的散热结构不阻塞设备风道，使得原先吹往电路板表面的风转而吹向散热结构表面，让风冷电路板表面的风速降低，降低电路板表面热交换速度，从而降低电路板表面湿度，同时减少灰尘、盐雾、油污等污染物在电路板表面积聚，进而降低电路板凝露和腐蚀风险。此外，上述散热系统和通讯设备结构简单、无额外耗材、能耗低、环保、有利于降低制造成本，还能有效降低吹到电路板的空气相对湿度，有利于提高通讯设备运行的可靠性，减少通讯设备失效机会。
在高盐类污染、高相对湿度的环境中，通讯设备等电子设备的电路板会快速腐蚀，使电路板失去通信功能；为了提高通信设各的运行可靠性，需要没法降低相对湿度，和控制电路板受到粉尘污染，使电路板免受凝露的影响。凝露是产生电路板腐蚀的必要条件，凝露又与电路板等电子器件受到的污染有关，要设法阻断产生凝露的条件，就能避免电子设各因环境腐蚀而失效。
以氯化钠(一种最常见的污染物污染)为例：
在高相对湿度(大于85％RH)的环境中，即使是符合所有电子组装出厂标准的电路板表面也会凝露。在长期运行的电路板上会沉积由冷却风扇带入了大量污染物，从而形成高污染度的电路板，在这种高污染度的电路板上即使环境相对湿度小于65％RH也会产生目视可见的凝露，而相对湿度大于75％RH时，所有污染度的电路板表面都会产生目视可见的凝露。
只要严格控制电路板表向的污染度和相对湿度就能控制凝露现象的发生。通过上述散热
系统可在对电路板进行散热冷却的同时降低电路板承受的环境污染和相对混度，从而有效防止了凝露的产生。环境湿度低于40％RH，能有效杜绝腐蚀发生。
根据温度和湿度之间的关系，一般只要保证电路板表面温度高出外界环境温度一定的温度范围内，就可以使单板的表面湿度维持在允许的范围内，提高运电路板的环境适应性。
本发明实施例中的带有挡风装置的散热结构，能有效提高电路板温升，降低电路板湿度，降低电路板表面降温风速和积尘量，有效抑制电路板腐蚀因素。
图7是根据本发明实施例的一种依靠电路板自身工作余热，借助带挡风装置的散热结构控制插箱或机箱设备内部空气温度、相对湿度、冷却气流走向的方法。在该方法中，因挡风装置使用了金属材质，均热性好，可以快速地将电路板工作产生的热量分散到整个挡风装置表面，从而能均匀提高挡风装置与电路板结合形成的腔体内的空气的温度，进而降低所述腔体内空气的相对湿度，提高电路板表面的温升，从而达到电路板和挡风装置防腐蚀的目的。通过控制电路板表面的温升，进而控制单板表面的相对湿度，解决现有电路板运行在恶劣环境中金属部分容易被腐蚀的问题。
如图7所示，该方法包括如下步骤：
步骤S702，在电路板表面设置散热结构，通过散热结构吸收电路板工作余热来抬高设备机箱整体温度。
在本实施例中，散热结构覆盖电路板部分区域。
步骤S704，在电路板和散热结构上设置温度检测点，并进行温度比较。
具体地，监测机箱设备的进风口处的环境温度值Tin、电路板表面温度值Ton、排出散热结构风道的空气温度值Tout；
控制电路分析比较Tin、Ton、Tout，使ΔT1＝Ton-Tin，ΔT2＝Tout-Tin都始终大于目标值。
有研究表明，当电路板温升大于3度时，能有效避免凝露产生，当电路板温升大于10度时，能有效避免腐蚀产生。
步骤S706，根据比较结果，控制所述机箱的风扇装置的转速。
在一个示例性实施例中，在散热结构覆盖住电路板整体时，只需要检测并比较进风口处的环境温度值Tin、电路板表面温度值Ton，根据比较结果调整风速，确保电路板表面温升达到目标值。
在本发明实施例中，通过结合电路板上的散热结构，电路板上的发热器件通过导热材料如导热垫、导热胶等导热材料，将热量传递到上出金属材质的散热结构进行散热，而散热结构可以快速地将电路板工作产生的热量分散到整个散热结构表面，从而能均匀提高散热结构与电路板结合形成的腔体内的空气的温度，进而降低腔体内空气的相对湿度，提高电路板表面的温升，从而达到电路板和挡风装置防腐蚀的目的。当通信设备机箱内设置了多块电路板时，风道上游的电路板散热结构均匀散发的热量，可以为下游的电路板提供得到均匀温升的空气，从而降低下游电路板表面空气的湿度，降低下游电路板的腐蚀风险，进而降低机箱设备风道下游电路的腐蚀防护工艺和成本。
本发明的实施例还提供了一种计算机可读存储介质，该计算机可读存储介质中存储有计算机程序，其中，该计算机程序被设置为运行时执行上述任一项方法实施例中的步骤。
在一个示例性实施例中，上述计算机可读存储介质可以包括但不限于：U盘、只读存储器(Read-Only Memory，简称为ROM)、随机存取存储器(Random Access Memory，简称为RAM)、
移动硬盘、磁碟或者光盘等各种可以存储计算机程序的介质。
本发明的实施例还提供了一种电子装置，包括存储器和处理器，该存储器中存储有计算机程序，该处理器被设置为运行计算机程序以执行上述任一项方法实施例中的步骤。
在一个示例性实施例中，上述电子装置还可以包括传输设备以及输入输出设备，其中，该传输设备和上述处理器连接，该输入输出设备和上述处理器连接。
本实施例中的具体示例可以参考上述实施例及示例性实施方式中所描述的示例，本实施例在此不再赘述。
显然，本领域的技术人员应该明白，上述的本发明实施例的各模块或各步骤可以用通用的计算装置来实现，它们可以集中在单个的计算装置上，或者分布在多个计算装置所组成的网络上，它们可以用计算装置可执行的程序代码来实现，从而，可以将它们存储在存储装置中由计算装置来执行，并且在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤，或者将它们分别制作成各个集成电路模块，或者将它们中的多个模块或步骤制作成单个集成电路模块来实现。这样，本发明不限制于任何特定的硬件和软件结合。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (14)
- 一种散热装置，应用于安装在机箱的电路板，包括：散热结构(101)，平行设置在所述电路板的上方，设置为对所述电路板上的元器件进行散热；挡风结构(102)，设置在所述电路板的进风口区域，设置为阻挡直接吹向所述电路板表面的气流，并将所述气流导向所述散热结构的表面。
- 根据权利要求1所述的散热装置，其中，所述散热结构(101)和所述挡风结构(102)为一体结构，或所述散热结构(101)与所述挡风结构(102)为分立结构。
- 根据权利要求1所述的散热装置，还包括：所述挡风结构(102)垂直设置在所述电路板位于进风口的部分，所述挡风结构(102)与所述电路板位于进风口的部分紧贴设置。
- 根据权利要求1所述的散热装置，还包括：所述挡风结构(102)垂直设置在所述电路板位于进风口和出风口的部分，所述挡风结构(102)与所述电路板位于进风口的部分紧贴设置。
- 根据权利要求1所述的散热装置，还包括：所述挡风结构(102)垂直设置在所述电路板的四周。
- 根据权利要求1所述的散热装置，还包括：所述散热结构(101)平行设置在所述电路板的正面和背面，其中，设置于所述电路板正面的所述散热结构(101)部分覆盖所述电路板的正面，设置于所述电路板背面的所述散热结构(101)完全或部分覆盖所述电路板的背面。
- 根据权利要求1所述的散热装置，还包括：在所述机箱中安装了多个电路板的情况下，所述散热结构(101)设置在位于所述插箱或机箱风道上游的电路板上。
- 根据权利要求1所述的散热装置，其中，所述挡风结构(102)的材料为以下之一：金属、陶瓷、塑胶。
- 根据权利要求1所述的散热装置，其中，所述挡风结构(102)包括：挡风面，垂直于所述电路板，设置为阻挡直接吹向所述电路板表面的气流；风道面，平行于所述电路板，设置为将所述气流导向所述散热结构的表面。
- 根据权利要求9所述的散热装置，其中，所述挡风结构(102)为L型或U型。
- 根据权利要求9所述的散热装置，其中，所述挡风面设有多个孔洞。
- 一种电路板表面温度的控制方法，应用于权利要求1-11任一项所述的散热结构，包 括：监测所述进风口处的环境温度值Tin、所述电路板的表面温度值Ton以及所述散热结构的排风道的空气温度值Tout；通过调整风扇的转速使得Ton与Tin的温度差大于第一阈值，以及Tout与Tin的温度差大于第二阈值。
- 一种计算机可读存储介质，所述计算机可读存储介质中存储有计算机程序，其中，所述计算机程序被处理器执行时实现所述权利要求12中所述的方法的步骤。
- 一种电子装置，包括存储器、处理器以及存储在所述存储器上并可在所述处理器上运行的计算机程序，所述处理器执行所述计算机程序时实现所述权利要求12中所述的方法的步骤。
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115064Y (zh) * | 2007-09-21 | 2008-09-10 | 中兴通讯股份有限公司 | 一种机柜 |
| CN102467199A (zh) * | 2010-11-16 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | 电子装置 |
| CN108401401A (zh) * | 2018-04-03 | 2018-08-14 | 四川斐讯信息技术有限公司 | 一种风冷散热装置、散热方法及电子设备 |
| CN111386003A (zh) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | 电子设备的散热方法及电子设备 |
| CN212970620U (zh) * | 2020-10-19 | 2021-04-13 | 深圳市浩湖网络技术有限公司 | 交换机 |
| US20210112682A1 (en) * | 2019-10-15 | 2021-04-15 | Cisco Technology, Inc. | Corrosion preventive heatsink for network device |
| CN113038781A (zh) * | 2019-12-09 | 2021-06-25 | 清能德创电气技术（北京）有限公司 | 一种具有独立风道结构的伺服驱动器 |
-
2022
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-
2023
- 2023-08-08 WO PCT/CN2023/111815 patent/WO2024032630A1/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201115064Y (zh) * | 2007-09-21 | 2008-09-10 | 中兴通讯股份有限公司 | 一种机柜 |
| CN102467199A (zh) * | 2010-11-16 | 2012-05-23 | 鸿富锦精密工业（深圳）有限公司 | 电子装置 |
| CN108401401A (zh) * | 2018-04-03 | 2018-08-14 | 四川斐讯信息技术有限公司 | 一种风冷散热装置、散热方法及电子设备 |
| CN111386003A (zh) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | 电子设备的散热方法及电子设备 |
| US20210112682A1 (en) * | 2019-10-15 | 2021-04-15 | Cisco Technology, Inc. | Corrosion preventive heatsink for network device |
| CN113038781A (zh) * | 2019-12-09 | 2021-06-25 | 清能德创电气技术（北京）有限公司 | 一种具有独立风道结构的伺服驱动器 |
| CN212970620U (zh) * | 2020-10-19 | 2021-04-13 | 深圳市浩湖网络技术有限公司 | 交换机 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118409637A (zh) * | 2024-07-02 | 2024-07-30 | 杭州海康威视数字技术股份有限公司 | 一种机箱及存贮服务器 |
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