WO2024032205A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2024032205A1
WO2024032205A1 PCT/CN2023/103552 CN2023103552W WO2024032205A1 WO 2024032205 A1 WO2024032205 A1 WO 2024032205A1 CN 2023103552 W CN2023103552 W CN 2023103552W WO 2024032205 A1 WO2024032205 A1 WO 2024032205A1
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WO
WIPO (PCT)
Prior art keywords
layer
inorganic
organic
display panel
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/103552
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English (en)
French (fr)
Inventor
彭斯敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US18/861,578 priority Critical patent/US20250287817A1/en
Publication of WO2024032205A1 publication Critical patent/WO2024032205A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present application relates to the field of display technology, and in particular to a display panel.
  • a single organic electroluminescent display panel is generally obtained by cutting after being integrally prepared on a display motherboard.
  • the overall thin-covering encapsulation layer is generally an encapsulation inorganic layer.
  • the encapsulation inorganic layer is prepared by a chemical vapor deposition process. Since there is a certain gap between the mask plate and the display motherboard, the reactive gas can enter the mask plate through the gap for shielding. part of the area and form a shadow in that area.
  • the shadow covers the cutting lane, it will increase the thickness of the inorganic film at the cutting point, causing edge cracks during cutting.
  • the edge cracks will extend along the encapsulating inorganic layer toward the display area, causing panel edge failure.
  • the distance between the chemical vapor deposition edge and the cutting track is usually increased to prevent the shadow from covering the cutting track.
  • the shadow will cover the cutting track. The narrower the border, the greater the shadow thickness, resulting in The greater the risk of cutting cracks, which greatly affects the life of the display panel.
  • Embodiments of the present application provide a display panel to solve the technical problem that shadows in existing display panels may cover cutting lanes, causing cutting cracks.
  • the present application provides a display panel, which includes a display area and a peripheral area located on at least one side of the display area.
  • the display panel includes:
  • a first inorganic layer disposed on one side of the substrate
  • a first organic layer is disposed on a side of the first inorganic layer away from the substrate.
  • the first organic layer includes a planarization layer disposed in the display area and a barrier structure disposed in the peripheral area. ;as well as
  • An encapsulation layer disposed on the side of the first organic layer away from the substrate;
  • the display panel further includes a stacked structure disposed in the peripheral area and located on a side of the retaining wall structure away from the display area.
  • the stacked structure includes inorganic sub-layers, organic sub-layers and Inorganic sub-layer, there is a gap between the organic sub-layer and the retaining wall structure, and the encapsulation layer contacts the first inorganic layer at the gap.
  • the encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer that are stacked in sequence;
  • the first inorganic encapsulation layer covers the display area and extends to cover the retaining wall structure, and the first inorganic encapsulation layer contacts the first inorganic layer at the interval.
  • the first organic layer further includes a first organic filling layer disposed on a side of the retaining wall structure away from the display area;
  • the stacked structure includes the first inorganic layer, the first organic filling layer and the first inorganic encapsulation layer which are stacked in sequence.
  • the first inorganic layer includes at least one groove provided on a side of the retaining wall structure away from the display area;
  • the first organic filling layer covers the groove.
  • the first organic layer further includes:
  • a pixel definition layer disposed on a side of the planarization layer away from the substrate
  • a support pillar disposed on the side of the pixel definition layer away from the substrate;
  • the first organic filling layer includes the same organic material as a combination of one or more of the planarization layer, the pixel definition layer and the support pillar.
  • the stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulation layer, the second organic filling layer and the second layer arranged in sequence.
  • the second organic filling layer includes the same organic material as the organic encapsulation layer.
  • the display panel further includes:
  • a second inorganic layer disposed on the side of the encapsulation layer away from the substrate.
  • a third organic filling layer is provided between the second inorganic layer and the encapsulation layer and is located on the side of the barrier structure away from the display area;
  • the stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulating layer, the second organic filling layer, the second inorganic encapsulating layer, which are stacked in sequence.
  • the third organic filling layer and the second inorganic layer, the third organic filling layer includes the same organic material as the organic encapsulation layer.
  • the stacked structure includes the first inorganic encapsulation layer, the second organic filling layer and the second inorganic encapsulation layer that are stacked in sequence;
  • the second organic filling layer includes the same organic material as the organic encapsulation layer.
  • the first inorganic layer further includes at least one groove provided on a side of the retaining wall structure away from the display area, and the first organic layer further includes a groove disposed on the retaining wall structure.
  • the thickness of the organic sub-layer ranges from 2 microns to 10 microns.
  • the present application provides a display panel, including a display area and a peripheral area located on at least one side of the display area, characterized in that the display panel includes:
  • a first inorganic layer disposed on one side of the substrate
  • a first organic layer is disposed on a side of the first inorganic layer away from the substrate.
  • the first organic layer includes a planarization layer disposed in the display area and a barrier structure disposed in the peripheral area. ;
  • An encapsulation layer disposed on the side of the first organic layer away from the substrate.
  • the driving circuit layer is located on one side of the substrate and includes an inorganic film layer and an organic film layer.
  • the first inorganic layer is one or a combination of one or more inorganic film layers in the driving circuit layer.
  • the first organic layer is a combination of one or more organic film layers in the driving circuit layer;
  • the display panel further includes a stacked structure disposed in the peripheral area and located on a side of the retaining wall structure away from the display area.
  • the stacked structure includes inorganic sub-layers, organic sub-layers and Inorganic sub-layer, there is a gap between the organic sub-layer and the retaining wall structure, and the encapsulation layer contacts the first inorganic layer at the gap.
  • the encapsulation layer includes a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer that are stacked in sequence;
  • the first inorganic encapsulation layer covers the display area and extends to cover the retaining wall structure, and the first inorganic encapsulation layer contacts the first inorganic layer at the interval.
  • the first organic layer further includes a first organic filling layer disposed on a side of the retaining wall structure away from the display area;
  • the stacked structure includes the first inorganic layer, the first organic filling layer and the first inorganic encapsulation layer which are stacked in sequence.
  • the first inorganic layer includes at least one groove provided on a side of the retaining wall structure away from the display area;
  • the first organic filling layer covers the groove.
  • the first organic layer further includes:
  • a pixel definition layer disposed on a side of the planarization layer away from the substrate
  • a support pillar disposed on the side of the pixel definition layer away from the substrate;
  • the first organic filling layer includes the same organic material as a combination of one or more of the planarization layer, the pixel definition layer and the support pillar.
  • the stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulation layer, the second organic filling layer and the second layer arranged in sequence.
  • the second organic filling layer includes the same organic material as the organic encapsulation layer.
  • the display panel further includes:
  • a second inorganic layer disposed on the side of the encapsulation layer away from the substrate.
  • a third organic filling layer is provided between the second inorganic layer and the encapsulation layer and is located on the side of the barrier structure away from the display area;
  • the stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulating layer, the second organic filling layer, the second inorganic encapsulating layer, which are stacked in sequence.
  • the third organic filling layer and the second inorganic layer, the third organic filling layer includes the same organic material as the organic encapsulation layer.
  • the stacked structure includes the first inorganic encapsulation layer, the second organic filling layer and the second inorganic encapsulation layer that are stacked in sequence;
  • the second organic filling layer includes the same organic material as the organic encapsulating layer.
  • the first inorganic layer further includes at least one groove provided on a side of the retaining wall structure away from the display area, and the first organic layer further includes a groove disposed on the retaining wall structure.
  • the thickness of the organic sub-layer ranges from 2 microns to 10 microns.
  • the beneficial effects of this application are: the display panel provided by this application.
  • the display panel includes a first inorganic layer, a first organic layer and an encapsulation layer.
  • the first organic layer includes a planarization layer disposed in the display area and a barrier disposed in the peripheral area.
  • the wall structure is provided with a stacking structure in the peripheral area. The stacking structure is located on the side of the retaining wall structure away from the display area.
  • the stacking structure includes inorganic sub-layers, organic sub-layers and inorganic sub-layers that are stacked in sequence.
  • the organic sub-layer and the retaining wall structure There is an interval between them, and the encapsulation layer and the first inorganic layer are in contact at the interval to form a complete encapsulation; the organic sub-layer in the stacked structure is arranged between two adjacent inorganic sub-layers, so that the stacked structure is inorganic/organic/inorganic
  • the multi-layer repeated stacked structure is equivalent to splitting the stacked inorganic film layers into multiple inorganic sub-layers.
  • Figure 1A is a schematic structural diagram of a top view of a display panel provided by an embodiment of the present application.
  • Figure 1B is a schematic top structural view of a display motherboard provided by an embodiment of the present application.
  • Figure 2A is a schematic diagram of the first cross-sectional structure along A-A in Figure 1B;
  • FIG. 2B is a schematic cross-sectional structural diagram of a display panel provided by an embodiment of the present application.
  • Figure 3 is a partial cross-sectional structural diagram of Figure 1B at B;
  • Figure 4A is a schematic diagram of the second cross-sectional structure along A-A in Figure 1B;
  • Figure 4B is a schematic diagram of the second cross-sectional structure of the display panel provided by the embodiment of the present application.
  • Figure 5A is a schematic diagram of the third cross-sectional structure along A-A in Figure 1B;
  • Figure 5B is a third cross-sectional structural schematic diagram of a display panel provided by an embodiment of the present application.
  • Figure 6A is a schematic diagram of the fourth cross-sectional structure along A-A in Figure 1B;
  • FIG. 6B is a schematic diagram of the fourth cross-sectional structure of a display panel provided by an embodiment of the present application.
  • FIG. 1A is a schematic structural view from above of a display panel provided by an embodiment of the present application.
  • FIG. 1B is a schematic structural view from above of a display motherboard provided by an embodiment of the present application.
  • An embodiment of the present application provides a display panel 200.
  • the display panel 200 includes a display area 1a and a peripheral area 1b located on at least one side of the display area 1a.
  • the display panel 200 is cut from a display motherboard 100.
  • the display motherboard 100 includes a substrate 300 and a plurality of display panels 200 disposed on one side of the substrate 300.
  • the display panel 200 is cut from a display motherboard 100.
  • the panel 200 is formed by cutting the display motherboard 100 .
  • the display motherboard 100 includes a cutting area 1c.
  • the cutting area 1c is provided with cutting lanes.
  • the display motherboard 100 is cut along the cutting lanes to form a plurality of independent display panels 200.
  • the cutting process used may be cutter wheel cutting or laser cutting or a combination of the two methods.
  • Figure 2A is a first cross-sectional structural schematic diagram along A-A in Figure 1B.
  • Figure 2B is a first cross-sectional structural diagram of a display panel provided by an embodiment of the present application.
  • Figure 2A is a schematic diagram before cutting.
  • a cross-sectional view of the motherboard 100 is shown.
  • FIG. 2B is a cross-sectional view of the display panel 200 after cutting.
  • the display panel 200 includes a substrate 204 , a first inorganic layer 201 , a first organic layer 202 and an encapsulation layer 23 .
  • the first inorganic layer 201 is disposed on one side of the substrate 204 .
  • the first organic layer 202 is disposed on a side of the first inorganic layer 201 away from the substrate 204.
  • the first organic layer 202 includes a planarization layer disposed in the display area 1a and a planarization layer disposed in the display area 1a. Retaining wall structure 114 of perimeter zone 1b.
  • the encapsulation layer 23 is disposed on a side of the first organic layer 202 away from the substrate 204 .
  • the display panel 200 further includes a stacked structure 10 disposed in the peripheral area 1b and located on a side of the barrier structure 114 away from the display area 1a.
  • the stacked structure 10 includes inorganic sub-layers 10a that are stacked in sequence. , organic sub-layer 11a and inorganic sub-layer 10a. There is a gap between the organic sub-layer 11a and the barrier structure 114, and the encapsulation layer 23 contacts the first inorganic layer 201 at the gap.
  • the display area 1a and the peripheral area 1b are schematically distinguished by dotted lines in FIG. 2B.
  • the display area 1a is used to set the light-emitting unit and the pixel circuit that drives the light-emitting unit to emit light.
  • the peripheral area 1b is the frame area of the display panel 200 and is used for arranging drive circuits and various signal lines.
  • the substrate 204 and the substrate 300 may be of the same film layer, and the substrate 204 is cut from the substrate 300 .
  • the substrate 204 can be a flexible substrate, and the flexible substrate can be a structure with a single layer or multiple layers of flexible organic films, which can resist stress impact to a certain extent, which is beneficial to reducing the stress on the substrate.
  • the stacked structure 10 on 204 is at risk of developing cracks during the cutting process.
  • the flexible substrate can be made of polyimide (PI), polyethylene terephthalate (PET), polybutylene naphthalate (PBN) or polycarbonate. Material.
  • the flexible substrate uses a single-layer PI film.
  • the flexible substrate may be a multi-layer PI film, or a multi-layer PET film, or have a multi-layer film structure in which PI films and PET are alternately stacked.
  • the packaging layer 23 is used to protect the light-emitting unit.
  • the packaging layer 23 adopts a film packaging method.
  • the packaging layer 23 can adopt an inorganic/organic/inorganic multi-layer packaging structure.
  • the encapsulation layer 23 includes a first inorganic encapsulation layer 231, a second inorganic encapsulation layer 232 and an organic encapsulation layer 233 that are stacked sequentially in a direction away from the substrate 204.
  • the first inorganic encapsulation layer 231 and the The second inorganic encapsulation layer 232 extends from the display area 1a and covers the peripheral area 1b, and the organic encapsulation layer 233 covers the display area 1a.
  • the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 extend from the display area 1a to the peripheral area 1b and cover the retaining wall structure 114.
  • the first inorganic encapsulation layer 231 and the The first inorganic layer 201 contacts at the interval to form a complete package, and encapsulates and protects the wiring in the peripheral area 1b, which plays a major role in blocking water and oxygen intrusion and improves the packaging effect.
  • the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 can be made of nitride, oxide, oxynitride, nitrate, carbide or any combination thereof.
  • the first organic encapsulation layer 233 usually ends at the retaining wall structure 114 and plays a role in assisting encapsulation and planarization.
  • the first organic encapsulation layer 233 can be made of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, polystyrene and other materials.
  • the first organic layer 202 also includes a first organic filling layer 111 disposed on the side of the barrier structure 114 away from the display area 1a.
  • the stacked structure 10 It includes the first inorganic layer 201, the first organic filling layer 111 and the first inorganic encapsulating layer 231 which are stacked in sequence.
  • the first inorganic layer 201 and the first inorganic encapsulation layer 231 in the prior art are in direct contact in the peripheral area 1b. At this time, the two inorganic layers are stacked, which is equivalent to one layer with a larger thickness. The inorganic film layer leads to a greater risk of cracks during the cutting process.
  • the first organic filling layer 111 is disposed between the first inorganic layer 201 and the first inorganic encapsulation layer 231 so that the first inorganic layer 201 and the first inorganic encapsulation layer 231 are spaced apart.
  • Arrangement without direct contact is equivalent to disassembling the inorganic stack composed of the first inorganic layer 201 and the first inorganic encapsulation layer 231, so that the stack structure 10 is inorganic/organic/inorganic.
  • the film layer structure is equivalent to splitting a thicker inorganic film layer into two smaller thick inorganic sub-layers 10a, which reduces the risk of cracks during the cutting process.
  • the first organic filling layer 111 is an organic film layer, which can play a stress buffering role and further reduce the risk of cracks during the cutting process.
  • the first inorganic layer 201 includes at least one groove 12 provided on the side of the barrier structure 114 away from the display area 1a, and the first organic filling layer 111 covers the groove 12.
  • the groove 12 is used to block cutting cracks from extending from the peripheral area 1b to the display area 1a, thereby reducing the risk of failure of the light-emitting unit located in the display area 1a.
  • each organic sub-layer 11a ranges from 2 microns to 10 microns.
  • the reason for setting this thickness range is that, on the one hand, the organic sub-layer 11a needs to play a buffering role, so each The thickness of the organic sub-layer 11a cannot be too thin; on the other hand, when cutting the display motherboard 100, if the thickness of the organic sub-layer 11a is too thick, adhesion may easily occur.
  • the thickness of each organic sub-layer 11a ranges from 5 microns to 10 microns.
  • the display panel 200 includes a driving circuit layer 20 and a light-emitting device layer 21.
  • the driving circuit layer 20 is located on one side of the substrate 204.
  • the light-emitting device layer 21 is located away from the driving circuit layer 20 and the substrate 204. and located in the display area 1a.
  • the encapsulation layer 23 covers the side of the light-emitting device layer 21 away from the substrate 204.
  • the light-emitting device layer 21 includes a plurality of light-emitting units.
  • the driving circuit layer 20 It includes a plurality of pixel driving circuits for driving the light-emitting unit to emit light, and the pixel driving circuit includes a plurality of thin film transistors.
  • the driving circuit layer 20 includes an inorganic film layer and an organic film layer.
  • the driving circuit layer 20 may include multiple inorganic film layers and multiple organic film layers.
  • the first inorganic layer 201 may be one of the inorganic film layers in the driving circuit layer 20 , or may be a combination of multiple inorganic film layers.
  • the first organic layer 202 may be It is one of the organic film layers in the driving circuit layer 20, or it can be a combination of multiple organic film layers.
  • the thin film transistor may be an etching barrier type, a back channel etching type, a top gate type thin film transistor, or other structures, and is not specifically limited.
  • the thin film transistor is a top-gate thin film transistor as an example.
  • the driving circuit layer 20 includes a semiconductor layer 101, a first gate insulating layer 102, a first gate layer 103, The second gate insulating layer 104, the second gate layer 105, the interlayer dielectric layer 106, the first source and drain metal layer 107, the first planarization layer 108, the second source and drain metal layer 109 and the second planarization Layer 110.
  • the semiconductor layer 101 is located on the side of the substrate 204, the first gate insulating layer 102 covers the side of the semiconductor layer 101 away from the substrate 204, and the first gate layer 103 is located on the side of the substrate 204.
  • a gate insulating layer 102 is on the side away from the substrate 204, and the second gate insulating layer 104 covers the side of the first gate layer 103 away from the substrate 204.
  • the second gate layer 105 The second gate insulating layer 104 is located on the side away from the substrate 204.
  • the interlayer dielectric layer 106 covers the side of the second gate layer 105 away from the substrate 204.
  • the first source and drain The electrode metal layer 107 is located on the side of the interlayer dielectric layer 106 away from the substrate 204, and the first planarization layer 108 covers the side of the first source and drain metal layer 107 away from the substrate 204, so
  • the second source-drain metal layer 109 is located on the side of the first source-drain metal layer 107 away from the substrate 204, and the second planarization layer 110 covers the second source-drain metal layer 109 away from the substrate 204. side of the substrate 204.
  • the first inorganic layer 201 may include one or more of the first gate insulating layer 102 , the second gate insulating layer 104 and the interlayer dielectric layer 106
  • the first organic layer 202 may include a combination of one or more of the first planarization layer 108 and the second planarization layer 110 .
  • the light-emitting device layer 21 includes a pixel definition layer 211.
  • the pixel definition layer 211 is disposed on the side of the second planarization layer 110 away from the substrate 204.
  • the pixel definition layer 211 is an organic film layer.
  • the light-emitting device layer 21 also includes an anode layer 212, a light-emitting functional layer 213 and a cathode layer (not shown in the figure).
  • the pixel definition layer 211 defines a plurality of pixel openings.
  • the light-emitting functional layer 213 is located on the pixel. inside the opening.
  • the light-emitting functional layer 213 may also include an electron injection layer, an electron transport layer, a light-emitting layer, a hole transport layer and a hole injection layer between the anode layer 212 and the cathode layer.
  • the display panel 200 further includes a plurality of support pillars 22 .
  • the support pillars 22 are disposed on a side of the pixel definition layer 211 away from the substrate 204 and located in the display area 1 a .
  • the material of the support pillars 22 is For organic materials.
  • the first organic filling layer 111 may include any one or more layers of the planarization layer, the pixel definition layer 211 and the support pillar 22 made of the same material, that is, The first organic filling layer 111 can be prepared and formed by using the same process as any one or more layers among the planarization layer, the pixel definition layer 211 and the support pillar 22 , which is beneficial to reducing the manufacturing process.
  • the first organic filling layer 111 includes any one or more of the first planarization layer 108, the second planarization layer 110, the pixel definition layer 211 and the support pillar 22.
  • the layers are made of the same material.
  • FIG. 4A is a second schematic cross-sectional structural diagram along A-A in FIG. 1B .
  • FIG. 4B is a second schematic cross-sectional structural diagram of a display panel provided by an embodiment of the present application.
  • the stacked structure 10 further includes a second organic filling disposed between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 .
  • the stacked structure 10 includes the first inorganic layer 201 , the first organic filling layer 111 , the first inorganic encapsulation layer 231 , the second organic filling layer 112 and the The second inorganic encapsulation layer 232.
  • the second organic filling layer 112 by arranging the second organic filling layer 112 so that the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 are spaced apart without direct contact, it is equivalent to the first inorganic encapsulation layer 231
  • the thicker inorganic film layer stacked with the second inorganic encapsulation layer 232 is separated once, so that the stacked structure 10 has an inorganic/organic/inorganic-organic/inorganic film layer structure, which reduces the need for cutting. Risk of cracks during the process.
  • the second organic filling layer 112 is an organic film layer, which can play a stress buffering role and further reduce the risk of cracks during the cutting process.
  • the second organic filling layer 112 may include the same organic material as the organic encapsulation layer 233 , that is, structurally speaking, the second organic filling layer 112 may be the same as the organic encapsulation layer 233 .
  • 233 are arranged in the same layer; from a manufacturing perspective, the second organic filling layer 112 and the organic encapsulation layer 233 are formed using the same manufacturing process, which is beneficial to reducing the manufacturing process and cost.
  • FIG. 5A is a third schematic cross-sectional structural diagram along A-A in FIG. 1B .
  • FIG. 5B is a third schematic cross-sectional structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 200 also includes a second inorganic layer 203 and a third organic filling layer 113 .
  • the second inorganic layer 203 is provided on the encapsulation layer. 23 on the side away from the substrate 204, the third organic filling layer 113 is disposed between the second inorganic layer 203 and the encapsulation layer 23 and is located on the barrier structure 114 away from the display area 1a side.
  • the stacked structure 10 includes the first inorganic layer 201 , the first organic filling layer 111 , the first inorganic encapsulation layer 231 , and the second organic filling layer 112 which are stacked in sequence. , the second inorganic encapsulation layer 232, the third organic filling layer 113 and the second inorganic layer 203.
  • the third organic filling layer 113 by arranging the third organic filling layer 113 so that the second inorganic encapsulation layer 232 and the second inorganic layer 203 are spaced apart without direct contact, it is equivalent to a direct contact between the second inorganic encapsulation layer 232 and the second inorganic layer 203
  • the thicker inorganic film layer formed by stacking the second inorganic layer 203 is split once, so that the stacked structure 10 has an inorganic/organic/inorganic/organic/inorganic/organic/inorganic film structure, which reduces Reduces the risk of cracks during cutting.
  • the third organic filling layer 113 is an organic film layer, which can play a stress buffering role and further reduce the risk of cracks during the cutting process.
  • the display panel 200 further includes a touch layer 24 .
  • the touch layer 24 is disposed on a side of the encapsulation layer 23 away from the substrate 204 .
  • the touch layer 24 includes a first insulating layer 241, a touch electrode 242 and a second insulating layer 243.
  • the first insulating layer 241 extends from the display area 1a and covers the peripheral area 1b.
  • the electrode 242 is disposed on a side of the first insulating layer 241 away from the substrate 204 and located in the display area 1a.
  • the second insulating layer 243 covers a side of the touch electrode 242 away from the substrate 204. side.
  • the first insulating layer 241 is made of an inorganic material.
  • the second inorganic layer 203 may include the first insulating layer 241 .
  • the third organic filling layer 113 may include the same organic material as the organic encapsulating layer 233 .
  • FIG. 6A is a fourth schematic cross-sectional structural diagram along A-A in FIG. 1B .
  • FIG. 6B is a fourth schematic cross-sectional structural diagram of a display panel provided by an embodiment of the present application.
  • the difference between FIG. 6A and FIG. 6B and FIG. 2A and FIG. 2B is that the second organic filling layer 112 is provided between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232.
  • the stacked structure 10 includes the first inorganic encapsulation layer 231, the second organic filling layer 112 and the second inorganic encapsulation layer 232 which are stacked in sequence.
  • the second organic filling layer 112 is located between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232, which is equivalent to the first inorganic layer 201 and the first inorganic encapsulation layer 232.
  • the relatively thick inorganic film layer formed by stacking the encapsulation layer 231 is split once, so that the stacked structure 10 has an inorganic/organic/inorganic film layer structure, which reduces the risk of cracks during the cutting process.
  • the second organic filling layer 112 may include the same organic material as the organic encapsulation layer 233 .
  • the first inorganic layer 201 is also disposed on at least one groove 12 on the side of the barrier structure 114 away from the display area 1a, and the first organic layer 202 is also disposed on the An anti-crack layer 14 is provided between the retaining wall structure 114 and the stacked structure 10 , and the anti-crack layer 14 covers the groove 12 .
  • the first inorganic encapsulation layer 231 covers the anti-crack layer 14 , and the anti-crack layer 14 and the second organic filling layer 112 are separated by the first inorganic encapsulation layer 231 .
  • the beneficial effects are: the display panel provided by the embodiment of the present application.
  • the display panel includes a first inorganic layer, a first organic layer and an encapsulation layer.
  • the first organic layer includes a planarization layer provided in the display area and a retaining wall provided in the peripheral area. structure, by setting up a stacking structure in the peripheral area.
  • the stacking structure is located on the side of the retaining wall structure away from the display area.
  • the stacking structure includes inorganic sub-layers, organic sub-layers and inorganic sub-layers that are stacked in sequence.
  • the organic sub-layer in the stacked structure is set between two adjacent inorganic sub-layers, making the stacked structure an inorganic/organic/inorganic multi-layer.
  • the repeated layer structure is equivalent to splitting the stacked inorganic film layers into multiple inorganic sub-layers.

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  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板（200），包括衬底（204）、第一无机层（201）、第一有机层（202）和封装层（23），第一有机层（202）包括设置于显示区（1a）的平坦化层和设置于周边区（1b）的挡墙结构（114），显示面板（200）还包括堆叠结构（10），堆叠结构（10）包括依次层叠设置的无机子层（10a）、有机子层（11a）和无机子层（10a），堆叠结构（10）中的有机子层（11a）与挡墙结构（114）之间存在间隔，封装层（23）与第一无机层（201）在间隔处接触。

Description

显示面板 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板。
 背景技术
在有机电致发光显示面板的制备过程中，为了提高生产效率、减低生产成本，单个有机电致发光显示面板一般是在显示母板上整体制备后进行切割获得的。显示母板制备过程中整体薄覆盖的封装层一般为封装无机层，封装无机层化学气相沉积工艺制备，由于掩模板与显示母板之间存在一定间隙，反应气体能够透过间隙进入掩模板遮挡的部分区域，并在该区域形成阴影(shadow)。
若shadow覆盖切割道则会增加切割处的无机膜的厚度，导致切割时产生边缘裂纹，边缘裂纹沿封装无机层向显示区延伸而引起面板边缘失效。为保证切割良率，通常采用增加化学气相沉积边缘至切割道的距离的方式来避免shadow覆盖切割道，但随着边框不断压缩，shadow会覆盖切割道，边框越窄，shadow厚度越大，产生切割裂纹的风险越大，极大影响了显示面板的寿命。
 发明概述
本申请实施例提供一种显示面板，以解决现有的显示面板中的shadow会覆盖切割道，导致产生切割裂纹的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种显示面板，包括显示区和位于所述显示区至少一侧的周边区，所述显示面板包括：
衬底；
第一无机层，设置于所述衬底的一侧；
第一有机层，设置于所述第一无机层远离所述衬底的一侧，所述第一有机层包括设置于所述显示区的平坦化层和设置于所述周边区的挡墙结构；以及
封装层，设置于所述第一有机层远离所述衬底的一侧；
其中，所述显示面板还包括设置于所述周边区且位于所述挡墙结构远离所述显示区的一侧的堆叠结构，所述堆叠结构包括依次层叠设置的无机子层、有机子层和无机子层，所述有机子层与所述挡墙结构之间存在间隔，所述封装层与所述第一无机层在所述间隔处接触。
根据本申请提供的显示面板，所述封装层包括依次层叠设置的第一无机封装层、第一有机封装层和第二无机封装层；
其中，所述第一无机封装层覆盖所述显示区且延伸覆盖所述挡墙结构，所述第一无机封装层与所述第一无机层在所述间隔处接触。
根据本申请提供的显示面板，所述第一有机层还包括设置于所述挡墙结构远离所述显示区一侧的第一有机填充层；
其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层和所述第一无机封装层。
根据本申请提供的显示面板，所述第一无机层包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽；
其中，所述第一有机填充层覆盖所述凹槽。
根据本申请提供的显示面板，所述第一有机层还包括：
像素定义层，设置于所述平坦化层远离所述衬底的一侧；以及
支撑柱，设置于所述像素定义层远离所述衬底的一侧；
其中，所述第一有机填充层包括与所述平坦化层、所述像素定义层和所述支撑柱中的其中一种或多种的组合相同的有机材料。
根据本申请提供的显示面板，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、第二有机填充层和所述第二无机封装层；
其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
根据本申请提供的显示面板，所述显示面板还包括：
第二无机层，设置于所述封装层远离所述衬底的一侧；以及
第三有机填充层，设置于所述第二无机层和所述封装层之间且位于所述挡墙结构远离所述显示区的一侧；
其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、所述第二有机填充层、所述第二无机封装层、所述第三有机填充层和所述第二无机层，所述第三有机填充层包括与所述有机封装层相同的有机材料。
根据本申请提供的显示面板，所述堆叠结构包括依次层叠设置的所述第一无机封装层、第二有机填充层和所述第二无机封装层；
其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
根据本申请提供的显示面板，所述第一无机层还包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽，所述第一有机层还包括设置于所述挡墙结构和所述堆叠结构之间的防裂层，所述防裂层覆盖所述凹槽。
根据本申请提供的显示面板，所述有机子层的厚度范围为2微米~10微米。
本申请提供一种显示面板，包括显示区和位于所述显示区至少一侧的周边区，其特征在于，所述显示面板包括：
衬底；
第一无机层，设置于所述衬底的一侧；
第一有机层，设置于所述第一无机层远离所述衬底的一侧，所述第一有机层包括设置于所述显示区的平坦化层和设置于所述周边区的挡墙结构；
封装层，设置于所述第一有机层远离所述衬底的一侧；以及
驱动电路层，位于所述的衬底一侧，包括无机膜层和有机膜层，所述第一无机层为所述驱动电路层中的其中一层或多层无机膜层的组合，所述第一有机层为所述驱动电路层中的其中一层或多层有机膜层的组合；
其中，所述显示面板还包括设置于所述周边区且位于所述挡墙结构远离所述显示区的一侧的堆叠结构，所述堆叠结构包括依次层叠设置的无机子层、有机子层和无机子层，所述有机子层与所述挡墙结构之间存在间隔，所述封装层与所述第一无机层在所述间隔处接触。
根据本申请提供的显示面板，所述封装层包括依次层叠设置的第一无机封装层、第一有机封装层和第二无机封装层；
其中，所述第一无机封装层覆盖所述显示区且延伸覆盖所述挡墙结构，所述第一无机封装层与所述第一无机层在所述间隔处接触。
根据本申请提供的显示面板，所述第一有机层还包括设置于所述挡墙结构远离所述显示区一侧的第一有机填充层；
其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层和所述第一无机封装层。
根据本申请提供的显示面板，所述第一无机层包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽；
其中，所述第一有机填充层覆盖所述凹槽。
根据本申请提供的显示面板，所述第一有机层还包括：
像素定义层，设置于所述平坦化层远离所述衬底的一侧；以及
支撑柱，设置于所述像素定义层远离所述衬底的一侧；
其中，所述第一有机填充层包括与所述平坦化层、所述像素定义层和所述支撑柱中的其中一种或多种的组合相同的有机材料。
根据本申请提供的显示面板，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、第二有机填充层和所述第二无机封装层；
其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
根据本申请提供的显示面板，所述显示面板还包括：
第二无机层，设置于所述封装层远离所述衬底的一侧；以及
第三有机填充层，设置于所述第二无机层和所述封装层之间且位于所述挡墙结构远离所述显示区的一侧；
其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、所述第二有机填充层、所述第二无机封装层、所述第三有机填充层和所述第二无机层，所述第三有机填充层包括与所述有机封装层相同的有机材料。
根据本申请提供的显示面板，所述堆叠结构包括依次层叠设置的所述第一无机封装层、第二有机填充层和所述第二无机封装层；
其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
根据本申请提供的显示面板，所述第一无机层还包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽，所述第一有机层还包括设置于所述挡墙结构和所述堆叠结构之间的防裂层，所述防裂层覆盖所述凹槽。
根据本申请提供的显示面板，所述有机子层的厚度范围为2微米~10微米。
有益效果
本申请的有益效果为：本申请提供的显示面板，显示面板包括第一无机层、第一有机层和封装层，第一有机层包括设置于显示区的平坦化层和设置于周边区的挡墙结构，通过在周边区设置堆叠结构，堆叠结构位于挡墙结构远离显示区的一侧，堆叠结构包括依次层叠设置的无机子层、有机子层和无机子层，有机子层与挡墙结构之间存在间隔，封装层与第一无机层在间隔处接触，以形成完整封装；堆叠结构中的有机子层设置于相邻两层无机子层之间，使得堆叠结构为无机/有机/无机多层重复的叠层结构，相当于将堆叠在一起的无机膜层拆分成多层无机子层，当对显示母板进行切割时，极大程度地减小了堆叠结构在切割过程中产生裂纹的风险，在实现边框极窄化的同时，有利于提升显示面板的发光器件性能，延长使用寿命。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A是本申请实施例提供的一种显示面板的俯视结构示意图；
图1B是本申请实施例提供的一种显示母板的俯视结构示意图；
图2A是图1B沿A-A的第一种截面结构示意图；
图2B是本申请实施例提供的显示面板的第一种截面结构示意图；
图3是图1B在B处的局部截面结构示意图；
图4A是图1B沿A-A的第二种截面结构示意图；
图4B是本申请实施例提供的显示面板的第二种截面结构示意图；
图5A是图1B沿A-A的第三种截面结构示意图；
图5B是本申请实施例提供的显示面板的第三种截面结构示意图；
图6A是图1B沿A-A的第四种截面结构示意图；
图6B是本申请实施例提供的显示面板的第四种截面结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
请参阅图1A和图1B，图1A是本申请实施例提供的一种显示面板的俯视结构示意图，图1B是本申请实施例提供的一种显示母板的俯视结构示意图。本申请实施例提供一种显示面板200，所述显示面板200包括显示区1a和位于所述显示区1a至少一侧的周边区1b。
所述显示面板200是由显示母板100切割而成的，如图1B所示，所述显示母板100包括基板300和设置于所述基板300一侧的多个显示面板200，所述显示面板200通过对所述显示母板100切割形成。具体地，所述显示母板100包括切割区1c，所述切割区1c设置有切割道，沿所述切割道对所述显示母板100进行切割以形成多个独立的所述显示面板200。在本实施例中，采用的切割工艺可以为刀轮切割或激光切割或两种方式的组合。
请参阅图2A和图2B，图2A是图1B沿A-A的第一种截面结构示意图，图2B是本申请实施例提供的显示面板的第一种截面结构示意图，图2A是切割之前的所述显示母板100的截面图，图2B是切割之后的所述显示面板200的截面图。
所述显示面板200包括衬底204、第一无机层201、第一有机层202和封装层23。所述第一无机层201设置于所述衬底204的一侧。所述第一有机层202设置于所述第一无机层201远离所述衬底204的一侧，所述第一有机层202包括设置于所述显示区1a的平坦化层和设置于所述周边区1b的挡墙结构114。所述封装层23设置于所述第一有机层202远离所述衬底204的一侧。
所述显示面板200还包括设置于所述周边区1b且位于所述挡墙结构114远离所述显示区1a的一侧的堆叠结构10，所述堆叠结构10包括依次层叠设置的无机子层10a、有机子层11a和无机子层10a。所述有机子层11a与所述挡墙结构114之间存在间隔，所述封装层23与所述第一无机层201在所述间隔处接触。
可以理解的是，随着边框不断压缩，阴影（shadow）会覆盖切割道，边框越窄，shadow的厚度越大，即位于切割区1c的无机叠构的厚度越大，从而导致产生切割裂纹的风险越大，本申请通过在所述堆叠结构10中增设有机子层11a，所述有机子层11a设置于相邻两层所述无机子层10a之间，使得所述堆叠结构10为无机/有机/无机多层重复的叠层结构，相当于将堆叠在一起的无机膜层拆分成多层无机子层10a，当对所述显示母板100进行切割时，极大程度地减小了所述堆叠结构10在切割过程中产生裂纹的风险，在实现边框极窄化的同时，有利于提升所述显示面板200的发光器件性能，延长使用寿命。
需要说明的是，图2B中以虚线对所述显示区1a和所述周边区1b进行了示意性的区分，所述显示区1a用于设置发光单元和驱动发光单元发光的像素电路，所述周边区1b为所述显示面板200的边框区域，用于设置驱动电路及各种信号线。
所述衬底204与所述基板300可以为同一膜层，所述衬底204由所述基板300切割而成。在本实施例中，所述衬底204可以为柔性基板，柔性基板可以是具有单层或多层柔性有机膜的结构，能够在一定程度上抵御应力冲击，有利于减小位于所述衬底204上的所述堆叠结构10在切割过程中产生裂纹的风险。
可选地，柔性基板可以采用聚酰亚胺(polyimide，PI)、聚对苯二甲酸乙二酯(polyethylene terephthalate，PET)、聚萘二甲酸丁二醇(PBN)或聚碳酸酯等柔性基板材料。在本实施例中，柔性基板采用单层PI膜。在本申请的其他实施例中，柔性基板可以为多层PI膜，或者为多层PET膜，或者具有PI膜与PET交替层叠的多层膜结构。
所述封装层23用于对发光单元起到保护作用，所述封装层23采用薄膜封装的方式，所述封装层23可以采用无机/有机/无机的多层封装结构，例如，在本实施例中，所述封装层23包括沿远离所述衬底204方向上依次层叠设置的第一无机封装层231、第二无机封装层232和有机封装层233，所述第一无机封装层231和所述第二无机封装层232从所述显示区1a延伸并覆盖所述周边区1b，所述有机封装层233覆盖所述显示区1a。
所述第一无机封装层231和所述第二无机封装层232从所述显示区1a延伸至所述周边区1b并覆盖所述挡墙结构114，所述第一无机封装层231与所述第一无机层201在所述间隔处接触，从而能够形成完整的封装，并对所述周边区1b的走线等进行封装保护，起到主要的阻隔水氧入侵的作用，提高封装效果。
可选地，所述第一无机封装层231和所述第二无机封装层232可采用氮化物、氧化物、氮氧化物、硝酸盐、碳化物或其任何组合的材料制作而成。
所述第一有机封装层233通常截止于所述挡墙结构114，起到辅助封装和平坦化的作用。可选地，所述第一有机封装层233可采用腈纶、六甲基二硅氧烷、聚丙烯酸酯类、聚碳酸脂类、聚苯乙烯等材料制作而成。
在本申请实施例中，所述第一有机层202还包括设置于所述挡墙结构114远离所述显示区1a一侧的第一有机填充层111，此种情况下，所述堆叠结构10包括依次层叠设置的所述第一无机层201、所述第一有机填充层111和所述第一无机封装层231。
可以理解的是，现有技术中的所述第一无机层201和所述第一无机封装层231在所述周边区1b直接接触，此时两层无机层堆叠，相当于一层厚度较大的无机膜层，导致在切割过程中产生裂纹的风险较大。本申请通过在所述第一无机层201和所述第一无机封装层231之间设置所述第一有机填充层111，使得所述第一无机层201和所述第一无机封装层231间隔设置而未产生直接接触，相当于对所述第一无机层201和所述第一无机封装层231组成的无机叠构进行了一次拆分，使得所述堆叠结构10呈无机/有机/无机的膜层结构，相当于将一层厚度较大的无机膜层拆分成两层厚度较小的无机子层10a，减小了在切割过程中产生裂纹的风险。
需要说明的是，所述第一有机填充层111为有机膜层，能够起到应力缓冲作用，进一步减小了在切割过程中产生裂纹的风险。
进一步地，所述第一无机层201包括设置于所述挡墙结构114远离所述显示区1a一侧的至少一条凹槽12，所述第一有机填充层111覆盖所述凹槽12。所述凹槽12用于阻挡切割裂纹从所述周边区1b向所述显示区1a延伸，降低了位于所述显示区1a的发光单元失效的风险。
需要说明的是，每一所述有机子层11a的厚度范围为2微米~10微米，设置于此厚度范围的原因在于，一方面，所述有机子层11a需起到缓冲作用，故每一所述有机子层11a的厚度不能过薄；另一方面，在切割所述显示母板100时，所述有机子层11a的厚度过厚容易出现粘接。优选地，每一所述有机子层11a的厚度范围为5微米~10微米。
具体地，请参阅图3，图3是图1B在B处的局部截面结构示意图。所述显示面板200包括驱动电路层20和发光器件层21，所述驱动电路层20位于所述衬底204一侧，所述发光器件层21位于所述驱动电路层20远离所述衬底204的一侧且位于所述显示区1a，所述封装层23覆盖所述发光器件层21远离所述衬底204一侧，所述发光器件层21包括多个发光单元，所述驱动电路层20包括用于驱动所述发光单元发光的多个像素驱动电路，所述像素驱动电路包括多个薄膜晶体管。
所述驱动电路层20包括无机膜层和有机膜层，具体地，所述驱动电路层20可以包括多层无机膜层和多层有机膜层。在本申请实施例中，所述第一无机层201可以为所述驱动电路层20中的其中一层无机膜层，也可以为多层无机膜层的组合，所述第一有机层202可以为所述驱动电路层20中的其中一层有机膜层，也可以为多层有机膜层的组合。
在本实施例中，所述薄膜晶体管可以为蚀刻阻挡型、背沟道蚀刻型或顶栅型薄膜晶体管等结构，具体没有限制。
如图3所示，本申请实施例以所述薄膜晶体管为顶栅型薄膜晶体管为例，所述驱动电路层20包括半导体层101、第一栅极绝缘层102、第一栅极层103、第二栅极绝缘层104、第二栅极层105、层间介质层106、第一源漏极金属层107、第一平坦化层108、第二源漏极金属层109和第二平坦化层110。
所述半导体层101位于所述衬底204一侧，所述第一栅极绝缘层102覆盖所述半导体层101远离所述衬底204一侧，所述第一栅极层103位于所述第一栅极绝缘层102远离所述衬底204一侧，所述第二栅极绝缘层104覆盖所述第一栅极层103远离所述衬底204一侧，所述第二栅极层105位于所述第二栅极绝缘层104远离所述衬底204一侧，所述层间介质层106覆盖所述第二栅极层105远离所述衬底204一侧，所述第一源漏极金属层107位于所述层间介质层106远离所述衬底204一侧，所述第一平坦化层108覆盖所述第一源漏极金属层107远离所述衬底204一侧，所述第二源漏极金属层109位于所述第一源漏极金属层107远离所述衬底204一侧，所述第二平坦化层110覆盖所述第二源漏极金属层109远离所述衬底204一侧。
在本实施例中，所述第一无机层201可以包括所述第一栅极绝缘层102、所述第二栅极绝缘层104和所述层间介质层106中的其中一层或多层的组合，所述第一有机层202可以包括所述第一平坦化层108和所述第二平坦化层110中的其中一层或多层的组合。
具体地，所述发光器件层21包括像素定义层211，所述像素定义层211设置于所述第二平坦化层110远离所述衬底204一侧，所述像素定义层211为有机膜层。所述发光器件层21还包括阳极层212、发光功能层213和阴极层（图中未示出），所述像素定义层211定义出多个像素开口，所述发光功能层213位于所述像素开口内。所述发光功能层213还可以包括在阳极层212与阴极层之间的电子注入层、电子传输层、发光层、空穴传输层和空穴注入层。
所述显示面板200还包括多个支撑柱22，所述支撑柱22设置于所述像素定义层211远离所述衬底204的一侧且位于所述显示区1a，所述支撑柱22的材料为有机材料。
在本实施例中，所述第一有机填充层111可以包括所述平坦化层、所述像素定义层211和所述支撑柱22中的任意一层或任意多层采用同种材料，即，所述第一有机填充层111可以与所述平坦化层、所述像素定义层211和所述支撑柱22中的任意一层或任意多层采用同一道制程制备形成，有利于减少制程。
具体地，所述第一有机填充层111包括所述第一平坦化层108、所述第二平坦化层110、所述像素定义层211和所述支撑柱22中的任意一层或任意多层采用同种材料。
在一种实施例中，请参阅图4A和图4B，图4A是图1B沿A-A的第二种截面结构示意图，图4B是本申请实施例提供的显示面板的第二种截面结构示意图。图4A及图4B与图2A及图2B的不同之处在于，所述堆叠结构10还包括设置于所述第一无机封装层231和所述第二无机封装层232之间的第二有机填充层112。
在此种情况下，所述堆叠结构10包括依次层叠设置的所述第一无机层201、所述第一有机填充层111、所述第一无机封装层231、第二有机填充层112和所述第二无机封装层232。
可以理解的是，在所述周边区1b，所述第一无机封装层231和所述第二无机封装层232若直接接触，则这两层膜层相当于一层厚度较大的无机膜层，容易导致在切割过程中产生裂纹的风险较大。本申请通过设置所述第二有机填充层112，使得所述第一无机封装层231和所述第二无机封装层232间隔设置而未产生直接接触，相当于对所述第一无机封装层231和所述第二无机封装层232堆叠形成的厚度较大的无机膜层进行了一次拆分，使得所述堆叠结构10呈无机/有机/无机有机/无机的膜层结构，减小了在切割过程中产生裂纹的风险。
同样地，所述第二有机填充层112为有机膜层，能够起到应力缓冲作用，进一步减小了在切割过程中产生裂纹的风险。
在本实施例中，所述第二有机填充层112可以包括与所述有机封装层233相同的有机材料，即，从结构上来说，所述第二有机填充层112可以与所述有机封装层233同层设置；从制程上来说，所述第二有机填充层112和所述有机封装层233采用同一道制程形成，有利于减少制程，降低成本。
在一种实施例中，请参阅图5A和图5B，图5A是图1B沿A-A的第三种截面结构示意图，图5B是本申请实施例提供的显示面板的第三种截面结构示意图。图5A及图5B与图4A及图4B的不同之处在于，所述显示面板200还包括第二无机层203和第三有机填充层113，所述第二无机层203设置于所述封装层23远离所述衬底204的一侧，所述第三有机填充层113设置于所述第二无机层203和所述封装层23之间且位于所述挡墙结构114远离所述显示区1a的一侧。
在此种情况下，所述堆叠结构10包括依次层叠设置的所述第一无机层201、所述第一有机填充层111、所述第一无机封装层231、所述第二有机填充层112、所述第二无机封装层232、第三有机填充层113和所述第二无机层203。
可以理解的是，在所述周边区1b，所述第二无机封装层232和所述第二无机层203若直接接触，则这两层膜层相当于一层厚度较大的无机膜层，容易导致在切割过程中产生裂纹的风险较大。本申请通过设置所述第三有机填充层113，使得所述第二无机封装层232和所述第二无机层203间隔设置而未产生直接接触，相当于对所述第二无机封装层232和所述第二无机层203堆叠形成的厚度较大的无机膜层进行了一次拆分，使得所述堆叠结构10呈无机/有机/无机/有机/无机/有机/无机的膜层结构，减小了在切割过程中产生裂纹的风险。
同样地，所述第三有机填充层113为有机膜层，能够起到应力缓冲作用，进一步减小了在切割过程中产生裂纹的风险。
请再次参阅图3，所述显示面板200还包括触控层24，所述触控层24设置于所述封装层23远离所述衬底204的一侧。所述触控层24包括第一绝缘层241、触控电极242和第二绝缘层243，所述第一绝缘层241从所述显示区1a延伸并覆盖所述周边区1b，所述触控电极242设置于所述第一绝缘层241远离所述衬底204的一侧且位于所述显示区1a，所述第二绝缘层243覆盖所述触控电极242远离所述衬底204的一侧。
所述第一绝缘层241的材料为无机材料，在本实施例中，所述第二无机层203可以包括所述第一绝缘层241。
在本实施例中，所述第三有机填充层113可以包括与所述有机封装层233相同的有机材料。
在一种实施例中，请参阅图6A和图6B，图6A是图1B沿A-A的第四种截面结构示意图，图6B是本申请实施例提供的显示面板的第四种截面结构示意图。图6A及图6B与图2A及图2B的不同之处在于，所述第二有机填充层112设置于所述第一无机封装层231和所述第二无机封装层232之间，在此种情况下，所述堆叠结构10包括依次层叠设置的所述第一无机封装层231、第二有机填充层112和所述第二无机封装层232。
可以理解的是，所述第二有机填充层112位于所述第一无机封装层231和所述第二无机封装层232之间，相当于对所述第一无机层201和所述第一无机封装层231堆叠形成的厚度较大的无机膜层进行了一次拆分，使得所述堆叠结构10呈无机/有机/无机的膜层结构，减小了在切割过程中产生裂纹的风险。
在本实施例中，所述第二有机填充层112可以包括与所述有机封装层233相同的有机材料。
在本实施例中，所述第一无机层201还设置于所述挡墙结构114远离所述显示区1a一侧的至少一条凹槽12，所述第一有机层202还包括设置于所述挡墙结构114和所述堆叠结构10之间的防裂层14，所述防裂层14覆盖所述凹槽12。
在本实施例中，所述第一无机封装层231覆盖所述防裂层14，所述防裂层14和所述第二有机填充层112通过所述第一无机封装层231间隔开。
有益效果为：本申请实施例提供的显示面板，显示面板包括第一无机层、第一有机层和封装层，第一有机层包括设置于显示区的平坦化层和设置于周边区的挡墙结构，通过在周边区设置堆叠结构，堆叠结构位于挡墙结构远离显示区的一侧，堆叠结构包括依次层叠设置的无机子层、有机子层和无机子层，有机子层与挡墙结构之间存在间隔，封装层与第一无机层在间隔处接触，以形成完整封装；堆叠结构中的有机子层设置于相邻两层无机子层之间，使得堆叠结构为无机/有机/无机多层重复的叠层结构，相当于将堆叠在一起的无机膜层拆分成多层无机子层，当对显示母板进行切割时，极大程度地减小了堆叠结构在切割过程中产生裂纹的风险，在实现边框极窄化的同时，有利于提升显示面板的发光器件性能，延长使用寿命。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，包括显示区和位于所述显示区至少一侧的周边区，其中，所述显示面板包括：
    衬底；
    第一无机层，设置于所述衬底的一侧；
    第一有机层，设置于所述第一无机层远离所述衬底的一侧，所述第一有机层包括设置于所述显示区的平坦化层和设置于所述周边区的挡墙结构；以及
    封装层，设置于所述第一有机层远离所述衬底的一侧；
    其中，所述显示面板还包括设置于所述周边区且位于所述挡墙结构远离所述显示区的一侧的堆叠结构，所述堆叠结构包括依次层叠设置的无机子层、有机子层和无机子层，所述有机子层与所述挡墙结构之间存在间隔，所述封装层与所述第一无机层在所述间隔处接触。
  2. 根据权利要求1所述的显示面板，其中，所述封装层包括依次层叠设置的第一无机封装层、第一有机封装层和第二无机封装层；
    其中，所述第一无机封装层覆盖所述显示区且延伸覆盖所述挡墙结构，所述第一无机封装层与所述第一无机层在所述间隔处接触。
  3. 根据权利要求2所述的显示面板，其中，所述第一有机层还包括设置于所述挡墙结构远离所述显示区一侧的第一有机填充层；
    其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层和所述第一无机封装层。
  4. 根据权利要求3所述的显示面板，其中，所述第一无机层包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽；
    其中，所述第一有机填充层覆盖所述凹槽。
  5. 根据权利要求3所述的显示面板，其中，所述第一有机层还包括：
    像素定义层，设置于所述平坦化层远离所述衬底的一侧；以及
    支撑柱，设置于所述像素定义层远离所述衬底的一侧；
    其中，所述第一有机填充层包括与所述平坦化层、所述像素定义层和所述支撑柱中的其中一种或多种的组合相同的有机材料。
  6. 根据权利要求3所述的显示面板，其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、第二有机填充层和所述第二无机封装层；
    其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
  7. 根据权利要求6所述的显示面板，其中，所述显示面板还包括：
    第二无机层，设置于所述封装层远离所述衬底的一侧；以及
    第三有机填充层，设置于所述第二无机层和所述封装层之间且位于所述挡墙结构远离所述显示区的一侧；
    其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、所述第二有机填充层、所述第二无机封装层、所述第三有机填充层和所述第二无机层，所述第三有机填充层包括与所述有机封装层相同的有机材料。
  8. 根据权利要求2所述的显示面板，其中，所述堆叠结构包括依次层叠设置的所述第一无机封装层、第二有机填充层和所述第二无机封装层；
    其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
  9. 根据权利要求8所述的显示面板，其中，所述第一无机层还包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽，所述第一有机层还包括设置于所述挡墙结构和所述堆叠结构之间的防裂层，所述防裂层覆盖所述凹槽。
  10. 根据权利要求1所述的显示面板，其中，所述有机子层的厚度范围为2微米~10微米。
  11. 一种显示面板，其中，包括显示区和位于所述显示区至少一侧的周边区，其特征在于，所述显示面板包括：
    衬底；
    第一无机层，设置于所述衬底的一侧；
    第一有机层，设置于所述第一无机层远离所述衬底的一侧，所述第一有机层包括设置于所述显示区的平坦化层和设置于所述周边区的挡墙结构；
    封装层，设置于所述第一有机层远离所述衬底的一侧；以及
    驱动电路层，位于所述的衬底一侧，包括无机膜层和有机膜层，所述第一无机层为所述驱动电路层中的其中一层或多层无机膜层的组合，所述第一有机层为所述驱动电路层中的其中一层或多层有机膜层的组合；
    其中，所述显示面板还包括设置于所述周边区且位于所述挡墙结构远离所述显示区的一侧的堆叠结构，所述堆叠结构包括依次层叠设置的无机子层、有机子层和无机子层，所述有机子层与所述挡墙结构之间存在间隔，所述封装层与所述第一无机层在所述间隔处接触。
  12. 根据权利要求11所述的显示面板，其中，所述封装层包括依次层叠设置的第一无机封装层、第一有机封装层和第二无机封装层；
    其中，所述第一无机封装层覆盖所述显示区且延伸覆盖所述挡墙结构，所述第一无机封装层与所述第一无机层在所述间隔处接触。
  13. 根据权利要求12所述的显示面板，其中，所述第一有机层还包括设置于所述挡墙结构远离所述显示区一侧的第一有机填充层；
    其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层和所述第一无机封装层。
  14. 根据权利要求13所述的显示面板，其中，所述第一无机层包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽；
    其中，所述第一有机填充层覆盖所述凹槽。
  15. 根据权利要求13所述的显示面板，其中，所述第一有机层还包括：
    像素定义层，设置于所述平坦化层远离所述衬底的一侧；以及
    支撑柱，设置于所述像素定义层远离所述衬底的一侧；
    其中，所述第一有机填充层包括与所述平坦化层、所述像素定义层和所述支撑柱中的其中一种或多种的组合相同的有机材料。
  16. 根据权利要求13所述的显示面板，其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、第二有机填充层和所述第二无机封装层；
    其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
  17. 根据权利要求16所述的显示面板，其中，所述显示面板还包括：
    第二无机层，设置于所述封装层远离所述衬底的一侧；以及
    第三有机填充层，设置于所述第二无机层和所述封装层之间且位于所述挡墙结构远离所述显示区的一侧；
    其中，所述堆叠结构包括依次层叠设置的所述第一无机层、所述第一有机填充层、所述第一无机封装层、所述第二有机填充层、所述第二无机封装层、所述第三有机填充层和所述第二无机层，所述第三有机填充层包括与所述有机封装层相同的有机材料。
  18. 根据权利要求12所述的显示面板，其中，所述堆叠结构包括依次层叠设置的所述第一无机封装层、第二有机填充层和所述第二无机封装层；
    其中，所述第二有机填充层包括与所述有机封装层相同的有机材料。
  19. 根据权利要求18所述的显示面板，其中，所述第一无机层还包括设置于所述挡墙结构远离所述显示区一侧的至少一条凹槽，所述第一有机层还包括设置于所述挡墙结构和所述堆叠结构之间的防裂层，所述防裂层覆盖所述凹槽。
  20. 根据权利要求11所述的显示面板，其中，所述有机子层的厚度范围为2微米~10微米。
PCT/CN2023/103552 2022-08-10 2023-06-29 显示面板 Ceased WO2024032205A1 (zh)

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