WO2024024424A1 - 金属材の連結体及び金属材の連結方法 - Google Patents

金属材の連結体及び金属材の連結方法 Download PDF

Info

Publication number
WO2024024424A1
WO2024024424A1 PCT/JP2023/024871 JP2023024871W WO2024024424A1 WO 2024024424 A1 WO2024024424 A1 WO 2024024424A1 JP 2023024871 W JP2023024871 W JP 2023024871W WO 2024024424 A1 WO2024024424 A1 WO 2024024424A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal material
film
metal
connected body
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/024871
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
信行 高橋
勇人 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Priority to CN202380056739.1A priority Critical patent/CN119630528A/zh
Priority to JP2023541815A priority patent/JP7563611B2/ja
Priority to EP23846157.8A priority patent/EP4563327A1/en
Priority to US18/871,881 priority patent/US20250353286A1/en
Priority to KR1020247036907A priority patent/KR20250002358A/ko
Publication of WO2024024424A1 publication Critical patent/WO2024024424A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/40—Applying molten plastics, e.g. hot melt
    • B29C65/42—Applying molten plastics, e.g. hot melt between pre-assembled parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44—Joining a heated non plastics element to a plastics element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/05—Interconnection of layers the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00—Apparatus for splicing webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/463—Splicing splicing means, i.e. means by which a web end is bound to another web end
    • B65H2301/4631—Adhesive tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/173—Metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Definitions

  • the present invention relates to a connecting body of metal materials formed by butting and connecting a cross section of a metal material and a cross section of another metal material, and a metal material suitable for connecting a cross section of a metal material and a cross section of another metal material to abutting against each other.
  • This relates to a method of connecting materials.
  • edge part refers to a flat part on at least one of the front and back sides near the end of the metal material to be connected.
  • the "opposing portion” refers to a region spanning the above-mentioned “edge portion” and refers to a region of both the flat surface portion on the front side and the flat surface portion on the back side of the metal material.
  • cross section is not limited to a cut surface
  • matching a cross section of a metal material to a cross section of another metal material refers to the end or starting point of a metal material that does not have a cut surface by cutting. It also includes a mode of matching.
  • butting means facing each other, and is not limited to a mode in which the entire surfaces are brought into contact with each other and facing each other.
  • roll materials In roll-to-roll manufacturing equipment that transports and continuously processes rolled metal sheets and/or metal foils (hereinafter referred to as roll materials), due to continuous operation, the amount of rolled material is reduced. It is necessary to connect the old roll material and the new roll material during continuous processing when the roll material is broken or at the point where the roll material is interrupted.
  • a backing material As a technique for connecting the starting end of a band-shaped metal material to the end of another band-shaped metal material, a backing material is placed on the back side of the butt part where the ends are butted together, and an arc welding torch is applied from the front side of this butt part.
  • a joining method is disclosed in which the abutting portions are welded and joined by running the joint (Patent Document 1).
  • Patent Document 1 relates to connection by welding, and after connection, it cannot be dismantled unless it is destroyed. For this reason, there is a problem in that it is not possible to easily reconnect (hereinafter also referred to as repair) in the event of a failure such as misalignment of a connection location.
  • connection methods other than welding include connection using liquid adhesive, connection using film-like thermosetting adhesive (hereinafter referred to as thermosetting adhesive film), connection using adhesive tape, and connection using caulking.
  • thermosetting adhesive film connection using film-like thermosetting adhesive
  • connection using adhesive tape connection using adhesive tape
  • connection using caulking connection using caulking
  • Connection using a liquid adhesive requires a coating step of applying a liquid thermosetting resin composition, and a curing step of causing the resin composition to undergo a polymerization reaction and harden after application. In the coating process, it takes time to apply the resin composition, and in the curing process, it takes time for the polymerization reaction. As described above, the connection using a liquid adhesive requires a long process time for connection, so there is a problem in that it lacks convenience. Furthermore, in the case of liquid thermosetting adhesives, repair is impossible or difficult.
  • thermosetting adhesive film In the case of connection using a thermosetting adhesive film, there is no need for a coating process and the process time can be shortened, but repairs cannot be performed after connection.
  • the thermosetting adhesive film is a B-stage film, the polymerization reaction tends to proceed at room temperature, so storage stability is poor and long-term storage at room temperature is not possible. That is, when the thermosetting adhesive film is a B-stage film, it needs to be stored at low temperatures and a low-temperature storage is required, making it difficult to store in large quantities for a long period of time and lacking in convenience.
  • adhesives When connecting with adhesive tape, adhesive components (hereinafter referred to as adhesives) such as matrix resin and tackifier, which are the resin compositions that make up the adhesive layer of the adhesive tape, adhere to the conveyance path of the production line and molds, causing transportation problems. There is a problem of contamination of roads and molds. Further, if the adhesive tape is peeled off due to an accident, there is a concern that the adhesive layer of the peeled adhesive tape will be exposed and the adhesive may contaminate the conveyance path and the mold.
  • adhesives such as matrix resin and tackifier
  • connection by caulking the metal materials are overlapped for caulking, and protrusions are generated due to the caulking. For this reason, since the thickness increases at the crimped portion, which is the connection portion, there is a problem in that it is difficult to apply it to a low-profile manufacturing line. Further, for caulking, a space of flat metal material larger than the caulking diameter is required, and there is a problem that sufficient connection strength cannot be obtained with metal materials of complicated shapes or narrow pitches. In addition, when the chemical liquid is passed through a plurality of tanks, a large amount of the chemical liquid is carried into the next tank, which leads to further contamination of the chemical liquid and a problem that the life of the chemical liquid is shortened.
  • the present invention has been made in view of the above technical background, and is repairable, shortens the process time, eliminates the risk of contamination of the production line due to adhesive components, and eliminates the possibility of thickness changes at connecting parts.
  • the purpose is to provide a connection technology that reduces
  • the present invention provides the following means.
  • Cross section A of flat metal material A and cross section B of flat metal material B are matched, and in a region spanning both edge A of metal material A and edge B of metal B.
  • a connected body of metal materials in which the metal material A and the metal material B are connected by covering at least a part of a certain facing part with a film including a layer containing a thermoplastic resin as a main component, wherein the film is a connected body of metal materials, which is a film that has been melted and solidified in the facing portion.
  • the metal material A and the metal material B are roll materials obtained by winding at least one selected from the group consisting of a metal plate and a metal foil into a roll shape, according to any one of [1] to [3]. Connecting body of metal materials.
  • thermoplastic resin is an amorphous thermoplastic resin.
  • amorphous thermoplastic resin is at least one of a thermoplastic epoxy resin and a phenoxy resin.
  • Cross section A of flat metal material A and cross section B of flat metal material B are matched, and at least the opposing portion, which is a region spanning both edge A of metal material A and edge B of metal material B, is A method for connecting metal materials, comprising covering a part of the metal materials with a film including a layer containing a thermoplastic resin as a main component, and melting and solidifying the film to connect the metal materials A and the metal materials B.
  • the method for connecting metal materials according to [11] wherein the metal material A and the metal material B are at least one selected from the group consisting of a metal plate with a thickness of 1 mm or less and a metal foil with a thickness of 1 mm or less.
  • the metal material A and the metal material B are roll materials obtained by winding at least one selected from the group consisting of a metal plate and a metal foil into a roll shape, according to any one of [11] to [13]. How to connect metal materials.
  • thermoplastic resin is an amorphous thermoplastic resin.
  • amorphous thermoplastic resin is at least one selected from the group consisting of thermoplastic epoxy resins and phenoxy resins.
  • the film has an adhesive on a surface that covers the facing portion, The method for connecting metal materials according to any one of [11] to [19], wherein the adhesive material performs a temporary fixing function for the film but does not perform an adhesive function.
  • connection technology that has a short process time, is repairable, has a short process time, does not have to worry about contaminating the production line due to adhesive components, and has little change in thickness at the connection part.
  • FIG. 2 is a plan view of a connected body of metal materials according to an embodiment of the present invention, in which a flat metal material A and a flat metal material B are both band-shaped and are joined by butting their cross sections in the width direction. It is a schematic diagram of a connection body.
  • FIG. 2 is a front view of a connected body of metal materials according to an embodiment of the present invention, in which a flat metal material A and a flat metal material B are both band-shaped and are joined by butting their cross sections in the width direction.
  • FIG. 2 is a schematic diagram of a connected body.
  • FIG. 3 is a front view of a connected body of metal materials according to another embodiment of the present invention, in which a flat metal material A and a flat metal material B are both band-shaped and are joined by butting their cross sections in the width direction;
  • FIG. 2 is a schematic diagram of a connected body.
  • connection means connecting two things to make one continuous, and joining is a subordinate concept thereof.
  • bonding means joining two objects so that they come into contact with each other, and adhesion and welding are subordinate concepts thereof.
  • Adhesion means joining two adherends (those to be bonded) via an organic material (thermosetting resin, thermoplastic resin, etc.) such as tape or adhesive.
  • Welding means melting the surface of a thermoplastic resin or the like by heat and cooling it to cause entanglement due to molecular diffusion to form a bonded state.
  • the connected body of metal materials of the present invention is produced by butting the cross section A:5 of the flat metal material A:1 and the cross section B:6 of the flat metal material B:2, so that the end edge of the metal material A:1 Covering at least a part of the opposing part 9, which is a region spanning both A: 7 and the edge part B: 8 of the metal material B: 2, with a film 3 containing a layer containing a thermoplastic resin as a main component, It is a connected body of metal materials formed by connecting the metal material A and the metal material B, and the film 3 is a film that has been melted and solidified in the facing portion 9.
  • the term "main component" refers to the component with the highest content among the resin components in the film.
  • the film preferably contains a resin component in an amount of 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more.
  • the film 3 and the edge part A:7 of the metal material A:1 are joined, and the edge part B:8 of the film 3 and the metal material B:2 is joined.
  • the metal material A and the metal material B are connected, and a connected body exhibiting excellent connection strength is obtained.
  • the film 3 melted in the facing part 9 enters the gap between the cross section A:5 of the metal material A:1 and the cross section B:6 of the metal material B:2 and solidifies, so that the cross section A:5 and the cross section B:6 A connected body in which the abutting surfaces 4 of 2 and 4 are joined exhibits even better connection strength, but in the connected body of the present invention, there may be a gap between cross section A: 5 and cross section B: 6.
  • the bonding strength is determined by a number of factors, including the thickness of the film, the molecular weight and chemical structure of the polymer that makes up the film, mechanical properties, and viscoelastic properties.
  • the bonding body of the present invention exhibits excellent bonding strength
  • the main cause is the formation of chemical bonds and intermolecular forces such as Waals force.
  • the state or characteristics of the interface between the film and the metal material are determined by analyzing the chemical structure of the very thin interface below the nanometer level, so it cannot be determined within a strict numerical range. It is impossible or impractical with the current state of the art to distinguish between the two.
  • Films are usually manufactured to have a uniform thickness, so there is no variation in thickness before melting and solidification. Since the film 3 has been melted and solidified in the section 9, it is presumed that there are variations in thickness that inevitably occur during the melting and solidification process. Any suitable method may be used to measure the thickness variation, such as measuring the thickness at any plurality of points within the surface of the measurement target and performing statistical processing. Methods for measuring such thickness include, for example, methods that involve physical contact such as a micrometer, micro caliper, or dial gauge; transmittance or reflectance of alpha rays, X-rays, infrared rays, electromagnetic waves, etc.
  • the measurement target examples include a non-contact method of measuring; a method of cutting the measurement target at an arbitrary measurement point and observing it with an optical microscope or an electron microscope; combinations of these methods may also be employed.
  • the surface texture of the edge portion A:7 is transferred to the film surface that is in contact with the edge portion A:7, and the surface texture of the edge portion A:7 is transferred to the film surface that is in contact with the edge portion B:8. It is presumed that the surface texture of edge portion B:8 has been transferred.
  • the surface texture refers to fine irregularities created on the surface of a metal material during a process such as machining of the metal material.
  • the connection of the present invention utilizes the phase change (solid to liquid to solid) of a film mainly composed of a thermoplastic resin, and is a connection that does not involve a chemical reaction such as a polymerization reaction. Since it is used after the polymerization reaction has been completed, the polymerization reaction does not proceed even at room temperature, and it can be stored for a long time at room temperature.
  • the film can be softened and melted by heat and can be easily peeled off, so it has excellent disassembly properties. Furthermore, since a film whose main component is a thermoplastic resin has thermoplastic properties, it can be reversibly softened, melted, and solidified repeatedly, and has excellent repairability.
  • thermoplastic resins are not liquids at room temperature, but are solids after the polymerization reaction has completed, and because they adhere using a mechanism different from adhesive, there is no need to use adhesives for adhesive purposes, and production lines using adhesives do not need to be used. No worries about contamination. Furthermore, since the polymerization reaction has been completed, it also has excellent heat resistance and chemical resistance. Furthermore, since the connection is made using a thin film, there is an advantage that there is less change in thickness at the connection part compared to caulking or the like.
  • FIG. 1 to 3 are schematic diagrams of a connected body in which a flat metal material A: 1 and a flat metal material B: 2 are both band-shaped and joined by butting their cross sections in the width direction.
  • the film is the facing part 9, and has a flat surface on the front side of the metal material A and the metal material B, and a flat surface on the back side of the metal material A and the metal material B. It is preferable that at least one of the flat surfaces covers the metal material A: 1 and the metal material B: 2.
  • both flat parts include a flat part on the front side of the metal material A and the metal material B, and a flat part on the back side of the metal material A and the metal material B. , it is particularly preferable that the metal material A: 1 and the metal material B: 2 be coated.
  • the shape of the metal material A and the metal material is not particularly limited as long as it is a flat plate shape, but the present invention is suitable for connection of metal plates with a thickness of 1 mm or less or metal foils with a thickness of 1 mm or less,
  • the material A and the metal material B are both belt-shaped (elongated), and are suitable for use in connecting opposing portions that are continuously opposed in the longitudinal direction.
  • it is suitable for connecting roll materials in which metal foil is wound into a roll shape, and connects the end of the preceding roll material being fed into the production line and the starting end of the following roll material. It is particularly suitable for connecting the ends of a roll material, or for connecting the end end and the start end of a roll when there is a break in the roll.
  • metal foil means a thin paper-like sheet of highly malleable metal.
  • the type of metal of the metal material A and the metal material B is not particularly limited either, but it is preferably at least one selected from the group consisting of aluminum, iron, copper, magnesium, and alloys thereof, and the interfacial adhesive strength with the film is From the viewpoint of strength, it is particularly preferable to use at least one member selected from the group consisting of aluminum alloys and iron alloys, because a strong connection can be achieved. Further, the surface of the metal material A or the metal material B may be subjected to a metal plating treatment, or may be coated with a resin.
  • the pretreatment is a process of cleaning the surface of the metal material or a process of making the surface uneven.
  • the metal material is made of aluminum or iron
  • at least one pretreatment selected from the group consisting of degreasing treatment, UV ozone treatment, blasting treatment, polishing treatment, plasma treatment, and etching treatment is suitable. Only one kind of pretreatment may be performed, or two or more kinds of pretreatments may be performed. As specific methods for these pretreatments, known methods can be used.
  • film refers to a thin film made of a resin whose main component is a thermoplastic resin, or a thin film made of a resin composition whose main component is a thermoplastic resin.
  • the content of the thermoplastic resin is preferably 60% by mass or more, and preferably 70% by mass or more of the resin components in the film.
  • the content is more preferably 80% by mass or more, and most preferably 90% by mass or more.
  • the thermoplastic resin is preferably an amorphous thermoplastic resin.
  • the amorphous thermoplastic resin in this embodiment means a resin in which crystals are not present, or even if they are present, the content thereof is very small, specifically, the heat of fusion of crystals is 15 J / g or less. do.
  • the heat of fusion is calculated from the area of the endothermic peak measured by DSC (differential scanning calorimeter) and the weight of the thermoplastic resin component. If an inorganic filler or the like is included in the film, it is calculated from the weight of the thermoplastic resin component excluding the inorganic filler. Specifically, 2-10 mg of the sample was weighed, placed in an aluminum pan, and heated from 23°C to 200°C or higher at 10°C/min using a DSC (DSC8231 manufactured by Rigaku Co., Ltd.) to obtain a DSC curve. Then, it can be calculated from the area of the endothermic peak during melting determined from the DSC curve and the weighed value.
  • the heat of fusion of the amorphous thermoplastic resin is more preferably 11 J/g or less, even more preferably 7 J/g or less, even more preferably 4 J/g or less, and the melting peak is detected. Most preferably below the limit.
  • a film whose main component is an amorphous thermoplastic resin with a heat of fusion of 15 J/g or less does not undergo the rapid viscosity drop that occurs with conventional hot melt adhesives when heated to melt it, and has a heat of fusion of 15 J/g or less. Even in a high temperature range exceeding °C, it does not reach a low viscosity (0.001 to 100 Pa ⁇ s) state. Therefore, the film does not melt and flow out, the thickness after solidification can be maintained within a predetermined range, and high connection strength can be stably obtained.
  • the amorphous thermoplastic resin that is the main component of the film contains a small amount of crystals
  • its melting point is preferably 50 to 400°C, more preferably 60 to 350°C, and more preferably 70 to 400°C. More preferably, the temperature is 300°C. Since the film has a melting point in the range of 50 to 400°C, it is efficiently deformed and melted by heating, and effectively wets and spreads on the bonding surfaces of the film and metal material A, and the film and metal material B. Connecting power can be obtained.
  • the melting point of a thermoplastic resin means the melting peak temperature measured by DSC.
  • the melting point is defined as the glass transition point plus 70°C.
  • the glass transition point means the temperature at which the DSC curve starts to fall in the second cycle, in which the temperature is raised to 200°C by DSC, then cooled to 40°C or less, and further heated to 200°C.
  • the amorphous thermoplastic resin is preferably at least one selected from the group consisting of thermoplastic epoxy resins and phenoxy resins.
  • Thermoplastic epoxy resins and phenoxy resins have low cohesive force within the resin, so they have strong interaction with metal materials, and can connect metal materials with a higher bonding force than conventional crystalline hot melt adhesives. . Furthermore, since thermoplastic epoxy resins and phenoxy resins have excellent flexibility and toughness, a high-strength connection can be obtained.
  • the amorphous thermoplastic resin preferably has an epoxy equivalent of 1,600 or more or does not contain an epoxy group.
  • the epoxy equivalent (weight of the thermoplastic resin containing 1 mole of epoxy groups) is the value of the epoxy equivalent of the thermoplastic resin contained in the film before connection, and is measured by the method specified in JIS-K7236:2001. (unit: "g/eq.”). Specifically, using a potentiometric titration device, a brominated tetraethylammonium acetic acid solution was added, a 0.1 mol/L perchloric acid-acetic acid solution was used, and the solvent diluted product (resin varnish) was determined from non-volatile to solid content. This is the calculated value of .
  • the epoxy equivalent of the amorphous thermoplastic resin is more preferably 2,000 or more, even more preferably 5,000 or more, even more preferably 9,000 or more, and the epoxy equivalent is more than the detection limit. Most preferably, the epoxy group is substantially undetectable.
  • the expression that the epoxy equivalent is equal to or higher than the detection limit means that no epoxy group is detected when the epoxy equivalent is measured based on JIS K 7236:2001, which will be described later.
  • the thermoplastic epoxy resin comprises (a) a bifunctional epoxy resin monomer or oligomer and (b) two identical or different functional groups selected from the group consisting of a phenolic hydroxyl group, a carboxy group, a mercapto group, an isocyanato group, and a cyanate ester group. It is preferable that it is a polymer with a bifunctional compound having the following. By using such a compound, the polymerization reaction to form a linear polymer proceeds preferentially, making it possible to obtain a thermoplastic epoxy resin having desired properties.
  • bifunctional epoxy resin monomer or oligomer refers to an epoxy resin monomer or oligomer having two epoxy groups in the molecule.
  • Specific examples of the above (a) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bifunctional phenol novolak type epoxy resin, bisphenol AD type epoxy resin, biphenyl type epoxy resin, bifunctional naphthalene type epoxy resin, Difunctional alicyclic epoxy resins, difunctional glycidyl ester type epoxy resins (e.g. diglycidyl phthalate, diglycidyl tetrahydrophthalate, dimer acid diglycidyl ester, etc.), difunctional glycidylamine type epoxy resins (e.g.
  • diglycidyl aniline, diglycidyl toluidine, etc. difunctional heterocyclic epoxy resins, difunctional diarylsulfone type epoxy resins, hydroquinone type epoxy resins (e.g. hydroquinone diglycidyl ether, 2,5-di-tert-butylhydroquinone diglycidyl ether, resorcinol) diglycidyl ether, etc.), difunctional alkylene glycidyl ether compounds (e.g., butanediol diglycidyl ether, butenediol diglycidyl ether, butynediol diglycidyl ether, etc.), difunctional glycidyl group-containing hydantoin compounds (e.g., 1,3- diglycidyl-5,5-dialkylhydantoin, 1-glycidyl-3-(glycidoxyalkyl)-5,5-dialkylhydantoin, etc.
  • bisphenol A type epoxy resin bisphenol F type epoxy resin
  • biphenyl type epoxy resin are preferred from the viewpoint of reactivity and workability.
  • the difunctional compound having a phenolic hydroxyl group (b) include mononuclear aromatic dihydroxy compounds having one benzene ring such as catechol, resorcinol, and hydroquinone, bis(4-hydroxyphenyl)propane (bisphenol A ), bisphenols such as bis(4-hydroxyphenyl)methane (bisphenol F) and bis(4-hydroxyphenyl)ethane (bisphenol AD), compounds with condensed rings such as dihydroxynaphthalene, diallyl resorcinol, diallylbisphenol A, tri- Examples include bifunctional phenol compounds into which an allyl group has been introduced, such as allyldihydroxybiphenyl, dibutylbisphenol A, and the like.
  • carboxy group-containing compound (b) examples include adipic acid, succinic acid, malonic acid, cyclohexanedicarboxylic acid, phthalic acid, isophthalic acid, and terephthalic acid.
  • the bifunctional compound having a mercapto group (b) examples include ethylene glycol bisthioglycolate and ethylene glycol bisthiopropionate.
  • Specific examples of the isocyanate group-containing bifunctional compound (b) include diphenylmethane diisocyanate (MDI), isophorone diisocyanate (IPDI), hexamethylene diisocyanate (HMDI), and tolylene diisocyanate (TDI). .
  • bifunctional compound containing a cyanate ester group (b) examples include 2,2-bis(4-cyanatophenyl)propane, 1,1-bis(4-cyanatophenyl)ethane, and bis(cyanatophenyl)ethane. Examples include (4-cyanatophenyl)methane.
  • bifunctional compounds having a phenolic hydroxyl group are preferable from the viewpoint of obtaining a thermoplastic polymer, and a bifunctional compound having two phenolic hydroxyl groups and a bisphenol structure or a biphenyl structure has good heat resistance and It is preferred from the viewpoint of connectivity, and at least one selected from the group consisting of bisphenol A, bisphenol F, and bisphenol S is preferred from the viewpoint of heat resistance and cost.
  • the above (a) is a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, or a biphenyl type epoxy resin
  • the above (b) is at least one selected from the group consisting of bisphenol A, bisphenol F, and bisphenol S.
  • the polymer obtained by polymerizing the above (a) and (b) has a main skeleton consisting of a paraphenylene structure and an ether bond, a main chain connecting them with an alkylene group, and a hydroxyl group generated by polyaddition. has a structure in which is arranged in the side chain.
  • the linear structure consisting of a paraphenylene skeleton can increase the mechanical strength of the polymer after polymerization, and the hydroxyl group arranged in the side chain can improve adhesion to metal materials. As a result, high connection strength can be achieved while maintaining the adhesive properties of the thermosetting resin. Furthermore, in the case of a thermoplastic resin, it can be recycled and repaired by softening and melting it with heat, and it is possible to improve the recyclability and repairability, which are problems with thermosetting resins.
  • Phenoxy resin is a polyhydroxy polyether synthesized from bisphenols and epichlorohydrin, and has thermoplasticity.
  • phenoxy resin there are known methods such as a direct reaction between dihydric phenols and epichlorohydrin, and an addition polymerization reaction between diglycidyl ether of dihydric phenols and dihydric phenols, but the method used in the present invention
  • the phenoxy resin may be obtained by any manufacturing method.
  • dihydric phenols include phenols such as bisphenol A, bisphenol F, bisphenol S, biphenol, biphenylene diol, and fluorenediphenyl; ethylene glycol, propylene glycol, and diethylene glycol.
  • examples include aliphatic glycols such as Among these, bisphenol A, bisphenol F, and bisphenol S are preferred from the viewpoint of cost, connectivity, viscosity, and heat resistance. These may be used alone or in combination of two or more.
  • Phenoxy resin has a chemical structure similar to that of epoxy resin, and has a main skeleton consisting of a paraphenylene structure and an ether bond, a main chain connecting these structures, and a structure in which hydroxyl groups are arranged in side chains.
  • thermoplastic epoxy resin and phenoxy resin preferably have a weight average molecular weight of 10,000 to 500,000, and preferably 18,000 to 300, as measured by GPC (gel permeation chromatography) in terms of polystyrene. ,000 is more preferable, and even more preferably 20,000 to 200,000.
  • the weight average molecular weight is calculated from the elution peak position detected by GPC, and is the molecular weight value in terms of standard polystyrene. When the weight average molecular weight is within this range, there is a good balance between thermoplasticity and heat resistance, and a linked body can be efficiently obtained by melting, and its heat resistance will also be high.
  • the weight average molecular weight is 10,000 or more, heat resistance is excellent, and when it is 500,000 or less, the viscosity when melted is low and the connectivity is high.
  • the film may or may not contain fillers and additives as components other than the resin component within a range that does not impede the object of the present invention.
  • fillers examples include inorganic fillers and organic fillers (resin powder).
  • inorganic fillers include spherical fused silica, metal powder such as iron, silica sand, talc, calcium carbonate, mica, acid clay, diatomaceous earth, kaolin, quartz, titanium oxide, silica, phenolic resin microballoons, glass balloons, etc. can be mentioned.
  • the content of the filler in 100 volume% of the total amount of the film is preferably 50 volume% or less, more preferably 30 volume% or less, and 20 volume% or less. is more preferable, and most preferably 10% by volume or less.
  • the volume of the filler can be determined by dividing the weight of the filler contained in the film by the appearance of the filler.
  • the content of the resin component in 100 volume% of the total amount of the film is preferably 10 volume% or more, more preferably 20 volume% or more, still more preferably 30 volume% or more, even more preferably 50 volume% or more, and in one embodiment. It is 80 volume % or more, in another embodiment 90 volume % or more, and in another embodiment 99 volume % or more.
  • additives include antifoaming agents, coupling agents such as silane coupling agents, pigments, etc., and one or more of these may be contained.
  • the content of the additive in the film is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 1% by mass or less.
  • the content of the resin component in the film is preferably 10% by mass or more, more preferably 20% by mass or more, even more preferably 30% by mass or more, even more preferably 50% by mass or more, in one embodiment 80% by mass or more, and another. In the embodiment, it is 90% by mass or more, and in another embodiment, it is 99% by mass or more.
  • the film has a thickness of 10 ⁇ m to 3 mm.
  • the thickness of the film is more preferably 1 mm or less, even more preferably 0.5 mm or less, and more preferably 0.3 mm or less, from the viewpoint of obtaining a connected body with excellent connectivity in a short process time. It is even more preferable, particularly preferably 0.2 mm or less, and most preferably 0.1 mm or less.
  • the film may be a single layer or a laminate consisting of multiple layers, it is preferable that the thermoplastic resin layer is a single layer from the viewpoint of ease of manufacture and improvement of connection strength.
  • the thermoplastic resin may be laminated in multiple layers on a film base material made of a resin having a melting point higher than that of the resin composition. In such a case, the resin film base material is not melted when heat welded to the metal base material and the thickness of the resin film base material remains, so that good connection strength can be maintained.
  • the film may have tackiness as long as it does not impede the connecting force or its heat resistance. Tackiness may be imparted by mixing a tackifier with the thermoplastic resin, or by applying a sticky substance to the film. It is preferable that the adhesive material performs a temporary fixing function for the film and does not perform an adhesive function.
  • An adhesive material that functions to temporarily fix the film but does not perform an adhesive function is, for example, an adhesive material that remains within the surface of the film that covers the facing portion 9 and is not exposed outside the surface. It is.
  • the adhesive may be applied to the entire surface covering the facing portion 9, or may be applied in the form of stripes, dots, grids, tiles (a plurality of squares lined up with gaps), etc. It may be applied to a part of the surface covering the opposing portion 9. The smaller the coating area, the lower the tackiness, but it is possible to reduce the risk of the adhesive material being exposed to the outside from the end surface of the film after connection and causing contamination.
  • the adhesive strength of the adhesive layer of the adhesive tape alone is responsible for the bonding force between the metal material and the film, but in the case of the thermoplastic film, the adhesion is achieved by melting and solidifying the thermoplastic resin as described above.
  • the tackiness is preferably such that it can perform the above-mentioned temporary fixing function. That is, when the film is placed on a metal material, it is not necessary for the film to stick to the metal material, and it is sufficient that the film has a large resistance (becomes difficult to slip) when a force in the shearing direction is applied.
  • the purpose is to impart tackiness sufficient to perform a temporary fixing function, it is preferable to suppress the amount of adhesive applied to the minimum amount that can temporarily hold (prevent slipping) the film.
  • the exposure of the adhesive part is reduced, but it is difficult to make both the back and front surfaces completely coincident.
  • the shape of the end face may be irregular, so the adhesive layer may be exposed at that part, and the adhesive may adhere to the conveyance path of the production line or the mold, causing contamination.
  • Ta which provides bonding strength through adhesion by melting and solidifying thermoplastic resin, adhesives are basically unnecessary for bonding purposes, and even when adhesives are used for purposes such as positioning, their use is minimal. Therefore, all of the above-mentioned problems with conventional adhesive tapes can be avoided.
  • the breaking strength of the film in the connected body of the metal material A and the metal material B connected by the film is preferably 20 to 1000 N/25 mm.
  • the strength is the strength when the films are first broken.
  • the breaking strength of the film in the connected body is more preferably 50 to 1000 N/25 mm, most preferably 100 to 1000 N/25 mm.
  • the breaking strength when the metal material A and the metal material B are connected using the film is the tensile strength at break per 25 mm of film width, measured under the conditions described in the Examples section. .
  • a resin composition is obtained by heating and polymerizing monomers or oligomers of a bifunctional epoxy compound, and a solvent is added to the obtained resin composition as necessary, and it is applied to a release film, etc., and then cured and dried.
  • a film may be obtained by applying pressure if necessary. Further, the polymerization reaction may be carried out after the release film is coated, after the film is obtained, or a combination of these may be carried out.
  • the method for manufacturing a connected body according to the present embodiment includes butting cross section A of flat metal material A and cross section B of flat metal material B, and At least a part of the facing portion, which is a region spanning both of the metal materials A and B, is covered with a film including a layer mainly composed of a thermoplastic resin, and the film is melted and solidified to separate the metal material A and the metal material B. It has a step of connecting. By melting and solidifying the film, the film and the metal material A and the film and the metal material B are respectively joined, and the metal material A and the metal material B are connected.
  • the metal materials and films are the same as those constituting the above-mentioned connecting body, and their explanations will be omitted.
  • the method for melting the film is not particularly limited as long as it can heat and melt the film. Specifically, melting is performed by at least one method selected from the group consisting of contact heating, hot air heating, heat pressing, impulse heater heating, hot plate welding, infrared heating, ultrasonic welding, vibration welding, and high frequency induction welding. Can be mentioned. Among these, melting using an impulse heater or hot press is preferable from the viewpoint of ease of manufacture and shortening of the process.
  • heating and pressurization are more preferably carried out under conditions of 100 to 400°C and 0.001 to 20 MPaG.
  • the heating conditions are more preferably 100 to 300°C, even more preferably 120 to 250°C, and most preferably 150 to 220°C.
  • the pressurizing conditions are preferably 0.001 to 20 MPaG, more preferably 0.005 to 10 MPaG, and most preferably 0.01 to 5 MPaG.
  • the film deforms efficiently and spreads effectively, resulting in a high bonding force.
  • a pressure of 0.001 to 20 MPaG By melting and solidifying the film, the film and the metal material A and the film and the metal material B are respectively joined, and the metal material A and the metal material B are connected.
  • the transmission frequency is preferably 10 to 70 kHz, more preferably 15 to 40 kHz.
  • the ultrasonic application time is preferably 0.1 to 3 seconds, more preferably 0.2 to 2 seconds from the viewpoint of adhesiveness and appearance.
  • the applied force is preferably 0.01 to 20 MPaG, more preferably 0.1 to 10 MPaG, and even more preferably 0.2 to 5 MPaG. Within this pressure range, the film deforms efficiently and spreads effectively over the adhesive surface, resulting in high adhesive strength.
  • the output is in the range of 100 to 5000 W, and the oscillation time may be adjusted depending on the size and type of the resin base material, for example, preferably 1.0 to 10.0 seconds. The time is more preferably 1.5 to 8.0 seconds.
  • Examples of methods for solidifying the molten film include a method of allowing it to cool at room temperature or a method of allowing it to cool using a cooling device.
  • "normal temperature” means a general room temperature within the range of 5 to 30°C. Among these, from the viewpoint of ease of manufacture, a method of cooling at room temperature is preferred.
  • solidification means that the material is solid at room temperature, that is, it has no fluidity at 23° C. without pressurization.
  • the film after solidification may have tackiness.
  • Metal material A and metal material B As metal material A and metal material B, C1100 (tough pitch copper) having a width of 25 mm, a length of 100 mm, and a thickness of 0.1 mm was prepared.
  • thermoplastic epoxy resin and phenoxy resin ⁇ Weight average molecular weight, heat of fusion and epoxy equivalent of thermoplastic epoxy resin and phenoxy resin> The weight average molecular weight, heat of fusion, and epoxy equivalent of the thermoplastic epoxy resin and phenoxy resin were determined as follows.
  • thermoplastic epoxy resin or phenoxy resin was dissolved in tetrahydrofuran and measured using Prominence 501 (manufactured by Showa Science Co., Ltd., Detector: Shodex (registered trademark) RI-501 (manufactured by Showa Denko Co., Ltd.)) under the following conditions.
  • Prominence 501 manufactured by Showa Science Co., Ltd.
  • Detector Shodex (registered trademark) RI-501 (manufactured by Showa Denko Co., Ltd.)
  • Flow rate 1 ml/min
  • Eluent Tetrahydrofuran
  • Calibration method Conversion using standard polystyrene
  • thermoplastic epoxy resin or phenoxy resin was weighed, placed in an aluminum pan, and heated from 23°C to 200°C at 10°C/min using DSC (DSC8231 manufactured by Rigaku Co., Ltd.) to obtain a DSC curve.
  • the heat of fusion was calculated from the area of the endothermic peak during melting of the DSC curve and the weighed value.
  • epoxy equivalent It was measured in accordance with JIS K-7236:2001 and converted into a value as resin solid content. In addition, in the case of a simple mixture that does not involve a reaction, it was calculated from the epoxy equivalent and content of each.
  • Example 1 (Film P-1) jER (registered trademark) 1007 (manufactured by Mitsubishi Chemical Corporation, bisphenol A type epoxy resin, weight average molecular weight approximately 10,000) was added to a reaction apparatus equipped with a stirrer, a reflux condenser, a gas inlet pipe, and a thermometer.1. 0 equivalent (203 g), bisphenol S 1.0 equivalent (12.5 g), triphenylphosphine 2.4 g, and methyl ethyl ketone 1,000 g, and the temperature was raised to 100° C. with stirring under a nitrogen gas atmosphere. Dissolution was visually confirmed, and the mixture was cooled to 40° C. to obtain a resin composition with a solid content of about 20% by mass.
  • Example 2 (Film P-2) Phenotote (registered trademark) YP-50S (manufactured by Nippon Steel Chemical & Materials Co., Ltd., phenoxy resin, weight average molecular weight approximately 50,000 ) and 80 g of cyclohexanone were charged, the temperature was raised to 60° C. while stirring, it was visually confirmed that the mixture had dissolved, and the mixture was cooled to 40° C. to obtain a resin composition with a solid content of 20% by mass. The resin composition was applied onto a release film and dried at 120° C. for 30 minutes to obtain a film P-2 having a solid content of 100% by mass and a thickness of 100 ⁇ m.
  • YP-50S manufactured by Nippon Steel Chemical & Materials Co., Ltd., phenoxy resin, weight average molecular weight approximately 50,000
  • Example 3 (Film P-3) Add 20 g of Phenotote (registered trademark) YPS-007A (manufactured by Nippon Steel Chemical & Materials Co., Ltd., phenoxy resin, weight average molecular weight approximately 42,000) to a reaction apparatus equipped with a stirrer, reflux condenser, gas inlet tube, and thermometer. , 80 g of cyclohexanone was charged, and the temperature was raised to 60° C. while stirring. Dissolution was confirmed visually, and the mixture was cooled to 40° C. to obtain a resin composition with a solid content of 20% by mass. The resin composition was applied onto a release film and dried at 120° C.
  • Phenotote registered trademark
  • YPS-007A manufactured by Nippon Steel Chemical & Materials Co., Ltd., phenoxy resin, weight average molecular weight approximately 42,000
  • Example 4> (concatenation) A connected body was produced in the same manner as in Example 1 except that a PET film (thickness: 25 ⁇ m) was layered on top of the solid binder P-1.
  • ⁇ Comparative example 2> (consolidated body) A crystalline olefin-based hot melt adhesive film (Elfan (registered trademark) NT-120 manufactured by Nippon Matai Co., Ltd., thickness 80 ⁇ m before making the connected body) was used as the film, and the temperature of the hot plate was set at 150°C. A connected body was produced in the same manner as in Example 1 except that the setting was made as follows. The heat of fusion peak in DSC was 60 J/g.
  • the present invention is suitable, for example, for connecting frame materials in an LED lead frame production line, or for connecting substrate materials in a flexible printed circuit board production line, but is not particularly limited to these illustrative applications. .

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Replacement Of Web Rolls (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Connection Of Plates (AREA)
PCT/JP2023/024871 2022-07-27 2023-07-05 金属材の連結体及び金属材の連結方法 Ceased WO2024024424A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202380056739.1A CN119630528A (zh) 2022-07-27 2023-07-05 金属材料的连结体及金属材料的连结方法
JP2023541815A JP7563611B2 (ja) 2022-07-27 2023-07-05 金属材の連結体及び金属材の連結方法
EP23846157.8A EP4563327A1 (en) 2022-07-27 2023-07-05 Connected body of metal materials and method for connecting metal materials
US18/871,881 US20250353286A1 (en) 2022-07-27 2023-07-05 Connected body of metal materials and method for connecting metal materials
KR1020247036907A KR20250002358A (ko) 2022-07-27 2023-07-05 금속재의 연결체 및 금속재의 연결 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-119867 2022-07-27
JP2022119867 2022-07-27

Publications (1)

Publication Number Publication Date
WO2024024424A1 true WO2024024424A1 (ja) 2024-02-01

Family

ID=89706146

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/024871 Ceased WO2024024424A1 (ja) 2022-07-27 2023-07-05 金属材の連結体及び金属材の連結方法

Country Status (7)

Country Link
US (1) US20250353286A1 (https=)
EP (1) EP4563327A1 (https=)
JP (1) JP7563611B2 (https=)
KR (1) KR20250002358A (https=)
CN (1) CN119630528A (https=)
TW (1) TWI884479B (https=)
WO (1) WO2024024424A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009298136A (ja) * 2008-05-16 2009-12-24 Nitto Denko Corp シート接合体の製造方法及びシート接合体
JP2017177465A (ja) * 2016-03-29 2017-10-05 マツダ株式会社 金属部材と熱硬化樹脂部材との接合方法およびその方法において使用される金属部材、熱硬化樹脂部材および熱可塑性樹脂シート
JP2021066805A (ja) * 2019-10-23 2021-04-30 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂及びその製造方法、その樹脂組成物及び硬化物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5689520A (en) * 1979-12-21 1981-07-20 Unitika Ltd Bonding method of metal plate
JP3943637B2 (ja) * 1996-11-28 2007-07-11 三井化学株式会社 基材繋ぎ装置
JP2012061511A (ja) 2010-09-17 2012-03-29 Isel Co Ltd コイル材接続方法及びコイル材接続装置
DE102016212622B4 (de) 2016-07-12 2022-02-10 Volkswagen Aktiengesellschaft Verfahren zum Fügen von Bauteilen
JP6953438B2 (ja) 2016-12-28 2021-10-27 日鉄ケミカル＆マテリアル株式会社 金属−繊維強化樹脂材料複合体、その製造方法及び接着シート
JP7312539B2 (ja) 2018-10-31 2023-07-21 リンテック株式会社 高周波誘電加熱接着シート
EP4180494A4 (en) 2020-07-13 2024-07-17 NIPPON STEEL Chemical & Material Co., Ltd. ADHESIVE RESIN COMPOSITION AND ADHESIVE FILM
JPWO2022118826A1 (https=) 2020-12-04 2022-06-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009298136A (ja) * 2008-05-16 2009-12-24 Nitto Denko Corp シート接合体の製造方法及びシート接合体
JP2017177465A (ja) * 2016-03-29 2017-10-05 マツダ株式会社 金属部材と熱硬化樹脂部材との接合方法およびその方法において使用される金属部材、熱硬化樹脂部材および熱可塑性樹脂シート
JP2021066805A (ja) * 2019-10-23 2021-04-30 日鉄ケミカル＆マテリアル株式会社 フェノキシ樹脂及びその製造方法、その樹脂組成物及び硬化物

Also Published As

Publication number Publication date
CN119630528A (zh) 2025-03-14
JP7563611B2 (ja) 2024-10-08
TWI884479B (zh) 2025-05-21
TW202415543A (zh) 2024-04-16
EP4563327A1 (en) 2025-06-04
JPWO2024024424A1 (https=) 2024-02-01
KR20250002358A (ko) 2025-01-07
US20250353286A1 (en) 2025-11-20

Similar Documents

Publication Publication Date Title
JP7563611B2 (ja) 金属材の連結体及び金属材の連結方法
JP7563612B2 (ja) 金属材の連結体及び金属材の連結方法
TWI835487B (zh) 接合體之製造方法
TWI858812B (zh) 接合體的製造方法、接合體及電氣電子零件
TWI869748B (zh) 接合體之製造方法
KR20240165421A (ko) 접합체의 제조 방법, 접합체, 및 전기 전자 부품
JP7544120B2 (ja) 接合体の製造方法
JP7544119B2 (ja) 接合体の製造方法
JP2024090916A (ja) 刃物及びその製造方法
US20250369706A1 (en) Heat exchanger and method for producing heat exchanger
JP7544121B2 (ja) 接合体の製造方法
KR20250111153A (ko) 접합체의 제조 방법
JP2024087607A (ja) 接合体の製造方法
WO2024135707A1 (ja) 接合体の製造方法
JP2023096713A (ja) 車載カメラの製造方法
JP2023096924A (ja) ラジエータの製造方法
JP2024090867A (ja) 連結部材及び連結部材の製造方法
JP2024087613A (ja) 接合体の製造方法
WO2024143148A1 (ja) フィルム状接合材の製造方法
JP2023096752A (ja) 車載モーターの製造方法、及び車載モーターを含む電動コンプレッサの製造方法
WO2024135166A1 (ja) 積層体及び積層体の製造方法
WO2026088843A1 (ja) 接合体の製造方法
JP2023097104A (ja) 車両用サイドステップの製造方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2023541815

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23846157

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020247036907

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 18871881

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 202380056739.1

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2023846157

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2023846157

Country of ref document: EP

Effective date: 20250227

WWP Wipo information: published in national office

Ref document number: 202380056739.1

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2023846157

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 18871881

Country of ref document: US

WWW Wipo information: withdrawn in national office

Ref document number: 2023846157

Country of ref document: EP