WO2024023903A1 - Convertisseur de guide d'ondes à ligne microruban - Google Patents

Convertisseur de guide d'ondes à ligne microruban Download PDF

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Publication number
WO2024023903A1
WO2024023903A1 PCT/JP2022/028676 JP2022028676W WO2024023903A1 WO 2024023903 A1 WO2024023903 A1 WO 2024023903A1 JP 2022028676 W JP2022028676 W JP 2022028676W WO 2024023903 A1 WO2024023903 A1 WO 2024023903A1
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Prior art keywords
waveguide
conductor
microstrip line
wall
dielectric
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PCT/JP2022/028676
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English (en)
Japanese (ja)
Inventor
明道 廣田
隆二 稲垣
幹夫 畑本
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三菱電機株式会社
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Priority to PCT/JP2022/028676 priority Critical patent/WO2024023903A1/fr
Publication of WO2024023903A1 publication Critical patent/WO2024023903A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions

Definitions

  • the present disclosure relates to a microstrip line-waveguide converter that connects a microstrip line and a waveguide, which are transmission lines of different types.
  • Patent Document 1 discloses a waveguide-to-microstrip line converter that converts a transmission system using a waveguide to a transmission system using a microstrip line in order to transmit a signal to a microstrip line.
  • the waveguide-microstrip line converter disclosed in Patent Document 1 includes a ridge waveguide, a metal plate attached to the ridge waveguide so as to protrude from the tip of the opening side end of the ridge portion of the ridge waveguide, and and a microstrip line formed on a dielectric substrate, the main conductor of which is connected to a metal plate.
  • the metal plate is made into a rectangular flat thin plate with elasticity, and one end of the metal plate is attached to the tip of the opening side of the ridge part by welding, etc., and the other end of the metal plate is attached to the leading edge of the microstrip line. Connected to the body by soldering.
  • the waveguide-to-microstrip line converter disclosed in Patent Document 1 connects a waveguide and a microstrip line by alleviating stress concentration on the connection site and improving reliability of the connection site. Therefore, a rectangular flat thin metal plate with elasticity is used. However, one end of the metal plate and the tip of the open end of the ridge portion are attached by welding or the like, and the other end of the metal plate and the main conductor of the microstrip line are connected by soldering.
  • the waveguide-microstrip line converter shown in Patent Document 1 has a problem in that it is difficult to assemble because one end of the metal plate is welded and the other end is soldered.
  • the present disclosure aims to solve the above problems and to provide a microstrip line-waveguide converter that is easy to assemble.
  • a microstrip line-waveguide converter includes a waveguide having an upper wall, a lower wall, a right side wall, a left side wall, and a converter forming region at one end, and a waveguide converter.
  • a hollow portion is formed by the dielectric material disposed between the top wall and the bottom wall, the bottom wall formed on the back surface of the dielectric material and located in the converter formation region, the lower part of the right side wall, and the lower part of the left side wall.
  • a ground conductor constituting a conversion waveguide, which is a hollow waveguide that surrounds the hollow part by the lower wall, the lower part of the right side wall, and the lower part of the left side wall located in the converter formation area, and a dielectric material.
  • a signal conductor formed on the surface and having one end electrically connected to the other end of the ground conductor by a first through conductor penetrating from the front surface of the dielectric to the back surface, and a signal conductor facing the ground conductor on the surface of the dielectric.
  • One end is electrically connected to one end of the ground conductor by a second penetrating conductor that penetrates from the front surface to the back surface of the dielectric, and the length of the waveguide in the tube axis direction is the same as that of the waveguide. and a stub conductor that is an odd multiple of a quarter wavelength of the signal to be propagated.
  • FIG. 2 is a cross-sectional view parallel to the top wall of the waveguide as viewed from above and below, showing the microstrip line-waveguide converter according to Embodiment 1, located below the top wall of the waveguide.
  • 2 is a cross-sectional view taken along line AA shown in FIG. 1 in the microstrip line-waveguide converter according to Embodiment 1.
  • FIG. FIG. 2 is a cross-sectional view taken along line BB shown in FIG. 1 in the microstrip line-waveguide converter according to the first embodiment.
  • FIG. 2 is a cross-sectional view taken along line CC shown in FIG. 1 in the microstrip line-waveguide converter according to the first embodiment.
  • FIG. 7 is a cross-sectional view parallel to the top wall of the waveguide as seen from above and below, showing a microstrip line-waveguide converter according to a comparative example, located below the top wall of the waveguide.
  • FIG. 6 is a cross-sectional view taken along line AA shown in FIG. 5 in a microstrip line-waveguide converter according to a comparative example.
  • FIG. 6 is a cross-sectional view taken along line BB shown in FIG. 5 in a microstrip line-waveguide converter according to a comparative example.
  • FIG. 6 is a cross-sectional view taken along line CC shown in FIG. 5 in a microstrip line-waveguide converter according to a comparative example.
  • FIG. 3 is a plan view showing another example of the ground conductor in the microstrip line-waveguide converter according to Embodiment 1.
  • FIG. FIG. 2 is a cross-sectional view corresponding to the AA cross section shown in FIG. 1 in the microstrip line-waveguide converter according to the second embodiment. 2 is a cross-sectional view corresponding to the AA cross section shown in FIG. 1 in the microstrip line-waveguide converter according to Embodiment 3.
  • FIG. 2 is a cross-sectional view corresponding to the AA cross section shown in FIG. 1 in another example of the microstrip line-waveguide converter according to Embodiment 3.
  • FIG. 7 is a cross-sectional view parallel to the top wall of the waveguide, as seen from above and below, showing the microstrip line-waveguide converter according to Embodiment 4, located below the top wall of the waveguide.
  • 13 is a cross-sectional view taken along line AA shown in FIG. 12 in the microstrip line-waveguide converter according to Embodiment 4.
  • FIG. 13 is a cross-sectional view taken along line BB shown in FIG. 12 in the microstrip line-waveguide converter according to Embodiment 4.
  • FIG. 13 is a cross-sectional view taken along line DD shown in FIG. 12 in the microstrip line-waveguide converter according to Embodiment 4.
  • FIG. 13 is a cross-sectional view corresponding to the BB cross section shown in FIG.
  • FIG. 12 in another example of the microstrip line-waveguide converter according to Embodiment 4.
  • FIG. 9 is a cross-sectional view parallel to the top wall of the waveguide, as viewed from above and below, and showing the microstrip line-waveguide converter according to Embodiment 5, located below the top wall of the waveguide.
  • FIG. 12 is a cross-sectional view parallel to the top wall of the waveguide, as seen from above and below, showing the microstrip line-waveguide converter according to the sixth embodiment, located below the top wall of the waveguide.
  • 18 is a cross-sectional view taken along line AA shown in FIG. 17 in a microstrip line-waveguide converter according to a sixth embodiment.
  • FIG. 18 is a cross-sectional view taken along line BB shown in FIG. 17 in the microstrip line-waveguide converter according to the sixth embodiment.
  • FIG. 18 is a cross-sectional view taken along line CC shown in FIG. 17 in a microstrip line-waveguide converter according to a
  • Embodiment 1 A microstrip line-waveguide converter according to Embodiment 1 will be explained using FIGS. 1 to 4.
  • the microstrip line-waveguide converter according to the first embodiment is a millimeter-wave converter on a flat substrate (hereinafter referred to as a microstrip substrate) on which various high-frequency circuits for signal processing and their peripheral circuits are mounted.
  • a high-frequency signal from a microstrip line, which serves as a transmission line for high-frequency signals in a high-frequency region such as a microwave band or a microwave band, is transmitted to a waveguide that does not increase loss during signal transmission.
  • microstrip line-waveguide converter that converts a microstrip line to a waveguide will be explained, but conversely, a microstrip line-waveguide converter that converts a waveguide to a microstrip line will be described. It can also be applied to tube converters.
  • the microstrip line-waveguide converter according to Embodiment 1 includes one end of a waveguide (hereinafter referred to as waveguide 1), the so-called converter formation region of the waveguide, and a microstrip substrate. One end portion is provided with a so-called converting portion formed in a converter forming region of the microstrip substrate.
  • the waveguide 1 has an upper wall 1a, a lower wall 1b, a right side wall 1c, and a left side wall 1d.
  • the waveguide 1 has a transducer formation region at one end, and an electromagnetic wave propagation region communicating from the transducer formation region.
  • the waveguide 1 constitutes a propagation waveguide WG1 that propagates electromagnetic waves, which are high-frequency signals converted by a microstrip line-waveguide converter, in an electromagnetic wave propagation region.
  • the waveguide 1 constitutes a conversion waveguide WG2 for a microstrip line-waveguide converter in the converter formation region.
  • the waveguide 1 has a rectangular cross section, and the width of the upper wall 1a and the lower wall 1b is longer than the width of the right side wall 1c and the left side wall 1d.
  • the upper, lower, left, and right of the upper wall 1a, the lower wall 1b, the right side wall 1c, and the left side wall 1d are added for convenience of explanation, and the upper wall 1a and the lower wall 1b are a pair of side walls, and the right side wall 1c and the left side wall 1d. may be the upper wall and the lower wall.
  • the width of the pair of side walls is narrower than the width of the upper wall and the lower wall.
  • the waveguide 1 extends inward to the lower inner surface of the right wall 1c, and has a right standing portion 1c1 erected from the inner surface of the lower wall 1b and a lower inner surface of the left wall 1d. It has a left standing portion 1d1 that extends inward and is erected from the inner surface of the lower wall 1b, and an end portion 1e that is erected from the inner surface of the lower wall 1b at one end.
  • a plane parallel to the inner surface of the lower wall 1b in the right standing portion 1c1 (hereinafter referred to as the plane of the right standing portion 1c1) and a plane parallel to the inner surface of the lower wall 1b in the left standing portion 1d1 (hereinafter referred to as the plane of the left standing portion 1c1).
  • a plane parallel to the inner surface of the lower wall 1b in the end upright portion 1e (hereinafter referred to as the plane of the end upright portion 1e) is a converter forming area. , it is located on the same plane parallel to the inner surface of the lower wall 1b, and faces the inner surface of the upper wall 1a with a gap therebetween.
  • the waveguide 1 is easy to manufacture because it is only necessary to form the right erected portion 1c1, the left erected portion 1d1, and the end erected portion 1e in the transducer formation region. Note that the right standing portion 1c1 and the left standing portion 1d1 may not be provided, and each of the inner surface of the right side wall 1c and the inner surface of the left side wall 1d may be flat over the entire surface. It is preferable to provide an upright portion 1d1.
  • the converter formed in one end of the microstrip substrate that is, in the converter forming area, includes a dielectric 11, a ground conductor 12, a signal conductor 13, a first through conductor 14, and a stub conductor 15. , a plurality of second through conductors 16, in this example two second through conductors 16. Note that the number of second through conductors 16 is not limited to a plurality, and may be one.
  • the height of the converting portion is shorter than the gap between the plane of the end portion 1e and the inner surface of the upper wall 1a. The conversion portion is fixed parallel to the inner surface of the lower wall 1b to the plane of the end erected portion 1e, the right erected portion 1c1, and the left erected portion 1d1.
  • the dielectric 11 is a dielectric formed continuously with the dielectric of the microstrip substrate.
  • the dielectric 11 is arranged at one end of the waveguide 1, that is, in the transducer formation region of the waveguide 1, parallel to the inner surface of the lower wall 1b.
  • the dielectric 11 is, for example, ceramic, which is commonly used in microstrip substrates.
  • the ground conductor 17 is a ground conductor of a microstrip substrate formed on the back surface of the dielectric 11.
  • the ground conductor 17 is, for example, a conductive foil that is generally used for microstrip substrates, and is formed in the same manner as the generally known method of forming a conductive foil on a dielectric material that constitutes a substrate.
  • One end of the ground conductor 17 is electrically and mechanically connected to the plane of the end upright portion 1e by soldering or the like.
  • the ground conductor 17 is arranged parallel to the tube axis of the waveguide 1, and one end surface is located on the same plane as the vertical surface that is the inner surface of the end portion 1e.
  • the ground conductor 12 is formed at one end of the dielectric 11, that is, on the back surface of the dielectric 11 in the transducer formation region of the microstrip substrate, with the other end facing one end surface of the ground conductor 17 with a gap therebetween.
  • the ground conductor 12 is formed simultaneously with the ground conductor 17, and is, for example, a conductive foil.
  • the ground conductor 12 faces the inner surface of the lower wall 1b located in the transducer forming area of the waveguide 1, and is arranged parallel to the tube axis of the waveguide 1, and the right end of the ground conductor 12 is located in the right upright part.
  • the left end portion of the ground conductor 12 is electrically and mechanically connected to the plane of the left standing portion 1d1 by soldering or the like.
  • One end of the ground conductor 17 is mechanically connected to the plane of the end standing portion 1e, the right end of the ground conductor 12 is connected to the plane of the right standing portion 1c1, and the left end of the ground conductor 12 is connected to the plane of the left standing portion 1c1.
  • the conversion part is parallel to the inner surface of the lower wall 1b to the plane of the end erected part 1e, the right erected part 1c1, and the left erected part 1d1. Fixed.
  • the ground conductor 12 is formed by the lower wall 1b, the lower part of the right side wall 1c, that is, the right standing part 1c1, and the lower part of the left side wall, that is, the left standing part 1d1.
  • a hollow portion 10 is formed.
  • the ground conductor 12 is a conversion waveguide that is a hollow waveguide that surrounds the hollow portion 10 by the lower wall 1b, the lower part of the right side wall 1c, and the lower part of the left side wall 1d located in the converter forming area of the waveguide 1.
  • the conversion waveguide WG2 is a hollow waveguide that surrounds the hollow part 10, and by increasing the distance from the inner surface of the lower wall 1b to the surface of the ground conductor 12, the conversion waveguide WG2 has a relatively high impedance characteristic. Becomes a tube.
  • the signal conductor 13 is formed on the surface of the dielectric 11, and one end thereof is electrically connected to the other end of the ground conductor 12 by a first through conductor 14 that penetrates from the front surface to the back surface of the dielectric 11.
  • the signal conductor 13 is a line parallel to the tube axis of the waveguide 1.
  • the signal conductor 13 is, for example, a conductive foil formed continuously with the signal conductor formed on the dielectric surface of the microstrip substrate, and is a generally known conductor formed on the dielectric material constituting the substrate. It is formed in a similar way to forming foil.
  • the signal conductor, dielectric material, and ground conductor 17 constitute a microstrip line.
  • the signal conductor 13, dielectric 11, and ground conductor 17 constitute a microstrip line.
  • the signal conductor in the microstrip line connects to the ground conductor via the signal conductor 13 and the first through conductor 14. 12, the high frequency signal propagating through the microstrip line on the microstrip substrate is converted and propagated to the conversion waveguide WG2.
  • the first through conductor 14 is formed, for example, in the same manner as a generally known method of forming a via (VIA) in a dielectric material that constitutes a substrate.
  • the propagation waveguide In the waveguide 1, from the end face communicating with the waveguide 1 in the hollow part 10 of the conversion waveguide WG2 in the converter formation region to the other end side of the waveguide 1, that is, the electromagnetic wave propagation region is the propagation waveguide.
  • a pipe WG1 is configured. It is necessary to impedance match the conversion waveguide WG2 and the propagation waveguide WG1, and since the conversion waveguide WG2 is a waveguide with relatively high impedance characteristics, the propagation waveguide WG1 It can also be made into a waveguide with relatively high impedance characteristics.
  • Both the conversion waveguide WG2 and the propagation waveguide WG1 should be waveguides with high impedance characteristics by ensuring that they do not short-circuit, or in other words, maintain the open state. This results in good impedance matching between the propagation waveguide WG1 and the conversion waveguide WG2.
  • the stub conductor 15 is formed on the surface of the dielectric 11 to face the ground conductor 12, and its other end face faces one end face of the signal conductor 13 with a gap therebetween.
  • One end of the stub conductor 15 is electrically connected to one end of the ground conductor 12 by a second through conductor 16 that penetrates the dielectric 11 from the front surface to the back surface.
  • Two second through conductors 16 are arranged in parallel in the width direction at one end of the stub conductor 15 with a straight line including the first through conductor 14 along the tube axis of the waveguide 1 interposed therebetween.
  • the second penetrating conductor 16 is located on a straight line that includes the first penetrating conductor 14 along the tube axis of the waveguide 1.
  • the stub conductor 15 is formed at the same time as the signal conductor 13, and is, for example, a conductor foil.
  • the second through conductor 16 is formed simultaneously with the first through conductor 14, and is, for example, a via (VIA).
  • a gap G exists between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1.
  • the length of the stub conductor 15 in the tube axis direction of the waveguide 1 is an odd multiple of the 1/4 wavelength of the signal propagating through the waveguide 1. Therefore, the dielectric 11, the second through conductor 16, the stub conductor 15, and the ground conductor 12 operate as a stub of an odd number multiple of the 1/4 wavelength of the open end in the conversion section.
  • the length of the stub conductor 15 is 1/4 wavelength, and it operates as a 1/4 wavelength stub.
  • the length of the stub conductor 15 may be an odd number multiple of 1/4 wavelength, such as 3 times, 5 times, . . . .
  • stubs of odd multiples of 1/4 wavelength will be collectively referred to as 1/4 wavelength stubs to simplify the explanation.
  • the conversion waveguide WG2 is electrically connected to the microstrip line on the microstrip board by electrically connecting the other end of the ground conductor 12 to the signal conductor 13 at the other end.
  • one end of the ground conductor 12 and the upper wall 1a of the waveguide 1 are electrically short-circuited with respect to the signal propagating in the waveguide 1 by the stub conductor 15. (X section shown in FIGS. 2 and 3). That is, the conversion waveguide WG2 is electrically connected to the propagation waveguide WG1 at one end for a signal propagating through the waveguide 1.
  • the conversion waveguide WG2 in the conversion section transmits the high frequency signal transmitted through the microstrip line on the microstrip board to the point where the signal conductor 13 and the ground conductor 12 are electrically connected, that is, the signal conductor 13 and the ground It is converted into a high frequency signal that propagates through the waveguide 1 at the connection with the conductor 12, and the converted high frequency signal is propagated to the propagation waveguide WG1 in the waveguide 1.
  • a gap G exists between the other end of the stub conductor 15 and the upper wall 1a of the waveguide 1, the other end of the stub conductor 15 and the upper wall 1a of the waveguide 1 are It is in an electrically open state (section Y shown in FIGS. 2 and 3).
  • a waveguide is prepared in which a right erected portion 1c1, a left erected portion 1d1, and an end erected portion 1e are formed in a transducer formation region at one end.
  • one end of the dielectric material constituting the microstrip substrate is used as a converter formation region for forming a microstrip line-waveguide converter.
  • the dielectric material in the transducer formation region of the microstrip substrate is the dielectric material 11 in the microstrip line-waveguide converter.
  • the ground conductor 12 is formed on the back surface of the dielectric 11 at the same time as the ground conductor 17 on the microstrip substrate.
  • the first through conductor 14 and the plurality of second through conductors 16 are formed simultaneously with vias (VIAs) which are through conductors in the microstrip substrate.
  • the signal conductor 13 and the stub conductor 15 are placed on the surface of the dielectric material constituting the microstrip substrate at the same time as wiring layers for various high frequency circuits for signal processing and their peripheral circuits, and signal conductors constituting the microstrip line.
  • the ground conductor 12, the first through conductor 14, the plurality of second through conductors 16, the signal conductor 13, and the stub conductor 15 can be formed in the process of forming the microstrip substrate.
  • the signal conductor 13 in the microstrip line-waveguide converter is formed continuously with the signal conductor constituting the microstrip line in the microstrip board, and the signal conductor 13 is connected to the first through conductor. It is electrically connected to the ground conductor 12 via 14.
  • the microstrip line-waveguide converter is formed at one end of the microstrip substrate so that the surface of the ground conductor 12 faces the inner surface of the lower wall 1b located in the converter forming area of the waveguide 1. Insert the component into one end of the waveguide 1, place one end of the ground conductor 17 on the plane of the end upright part 1e of the waveguide 1, and place the right end of the ground conductor 12 on the right side of the waveguide 1.
  • the left end of the ground conductor 12 is electrically and mechanically connected to the plane of the upright portion 1c1 and the plane of the left upright portion 1d1 of the waveguide 1 by soldering or the like. Thereby, the components of the microstrip line-waveguide converter are attached to one end of the waveguide 1.
  • the transducer formation region of the waveguide 1 a hollow portion 10 is formed by the ground conductor 12, the lower wall 1b, the lower part of the right side wall 1c, and the lower part of the left side wall 1d.
  • the conversion waveguide WG2 which is a hollow waveguide having the stub conductor 15, is formed, and the microstrip line-waveguide converter having the 1/4 wavelength stub with an open end is connected to the waveguide 1.
  • One end of the transducer, that is, the transducer formation region is configured to be continuous with the propagation waveguide WG1 configured in the electromagnetic wave propagation region.
  • the microstrip line-waveguide converter is electrically connected to the signal conductor in the microstrip line on the microstrip board, and is connected to the upper wall 1a of the waveguide 1 constituting the propagation waveguide WG1 and the high-frequency They are electrically connected in a manner that allows signal propagation.
  • one end of the ground conductor 17 is placed on the plane of the end erected part 1e of the waveguide 1
  • the right end of the ground conductor 12 is placed on the plane of the right erected part 1c1 of the waveguide 1.
  • the microstrip line-waveguide is connected to the microstrip line on the microstrip board by electrically and mechanically connecting the left end portion to the plane of the left standing portion 1d1 of the waveguide 1 by soldering or the like.
  • the transducer and waveguide 1 can be connected, and assembly is easy.
  • the gap G absorbs the combined dimensional error, for example ⁇ 50 ⁇ m, so that the microstrip line-guide When the components of the wave tube converter are attached to the waveguide 1, stress is not applied to the stub conductor 15, the upper wall 1a of the waveguide 1, and the end portion 1e.
  • the microstrip line-waveguide converter, the microstrip substrate, and the waveguide 1 are not damaged. Furthermore, since the height of the waveguide 1 can be increased, the ratio of dimensional error to the height of the waveguide 1 is small, and the change in electrical characteristics as a microstrip line-waveguide converter is small.
  • the high frequency signal transmitted through the microstrip line on the microstrip substrate is transmitted to the microstrip line including the signal conductor 13 in the microstrip line-waveguide converter.
  • the high-frequency signal transmitted to the microstrip line including the signal conductor 13 is transmitted through a hollow section where one end of the signal conductor 13 and the other end of the ground conductor 12 are electrically connected by the first penetrating conductor 14. It is converted into a conversion waveguide WG2 surrounding the section 10. The converted high-frequency signal propagates through the conversion waveguide WG2.
  • the high frequency signal (electromagnetic wave) propagated through the conversion waveguide WG2 is transferred from one end of the ground conductor 12, which is electrically short-circuited to the signal propagating through the waveguide 1, to the waveguide 1 by the stub conductor 15.
  • the signal propagates to the propagation waveguide WG1.
  • a gap G exists between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1, and the stub conductor 15 and the ground Since the conductor 12 operates as a 1/4 wavelength stub with an open end, one end of the ground conductor 12 is electrically short-circuited to the upper wall 1a of the waveguide 1 for the signal propagating through the waveguide 1.
  • the current flowing through the ground conductor 12 due to the high frequency signal transmitted to the microstrip line including the conductor 13 flows from one end of the ground conductor 12 to the upper wall 1a of the waveguide 1, and the high frequency signal is passed through the propagation waveguide of the waveguide 1. It is propagated to pipe WG1.
  • the high-frequency signal propagating through the conversion waveguide WG2 constituted by the ground conductor 12 etc. does not leak from the gap G between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1. .
  • the high frequency signal propagating through the conversion waveguide WG2 is propagated with low loss and is propagated to the propagation waveguide WG1 of the waveguide 1.
  • the conversion waveguide surrounds the hollow portion 10 formed by the ground conductor 12, the lower wall 1b, the lower part of the right side wall 1c, and the lower part of the left side wall 1d.
  • FIGS. 5 to 8 show examples in which a conversion waveguide WG3, which is a resin waveguide surrounding the material of the dielectric 11, is used as a microstrip line-waveguide converter.
  • the conversion waveguide WG3 which is a resin waveguide, includes a ground conductor 12, a second ground conductor 18, a plurality of right through conductors 19, a right ground conductor pad 20, and a plurality of ground conductors. It is composed of a left through conductor 21, a left ground conductor pad 22, and a dielectric 11.
  • the conversion waveguide WG3 is a resin waveguide that surrounds the material of the dielectric 11, and has a relative dielectric constant larger than that of the hollow 1, and furthermore, since the thickness of the dielectric 11 is generally thin, the impedance is low. It becomes a waveguide with extremely low impedance characteristics.
  • the conversion waveguide WG3 and the propagation waveguide WG1 must be impedance matched, and as shown in FIGS. 6 and 7, from the inner surface of the propagation waveguide WG1 to the lower wall 1b of the waveguide 1.
  • the distance H2 from the inner surface of the upper wall 1a of the waveguide 1 to the inner surface of the upper wall 1a of the waveguide 1 from the inner surface with respect to the lower wall 1b of the waveguide 1 in the conversion waveguide WG3 It is necessary to make it smaller.
  • the distance H2 in the propagation waveguide WG1 is shorter than the thickness of the dielectric 11.
  • the distance H2 in the propagation waveguide WG1 is very small, and the height of the waveguide 1 is also inevitably low.
  • the microstrip line-waveguide converter according to Embodiment 1 from the inner surface of the waveguide 1 to the lower wall 1b of the waveguide 1 in the conversion waveguide WG2 to the inner surface of the upper wall 1a of the waveguide 1.
  • the distance from the inner surface to the lower wall 1b of the waveguide 1 in the propagation waveguide WG1 to the inner surface of the upper wall 1a of the waveguide 1 can be made the same, and the dimensional error with respect to the height of the waveguide 1 can be made the same.
  • the change in electrical characteristics of the microstrip line-waveguide converter due to dimensional errors is small.
  • the microstrip line-waveguide converter according to the first embodiment can reduce changes in electrical characteristics due to dimensional errors in the height direction from the inner surface of the lower wall 1b of the waveguide 1.
  • the microstrip line-waveguide converter according to Embodiment 1 includes a dielectric material that is electrically connected to one end of the signal conductor 13 formed on the surface of the dielectric material 11.
  • the components of the microstrip line-waveguide converter are electrically and mechanically connected to the plane of the end portion 1e of the waveguide 1 by connecting one end of the ground conductor 17 formed on the back surface of the dielectric 11 to the plane of the end portion 1e of the waveguide 1.
  • the ground conductor 12 and the lower wall 1b located in the transducer forming area of the waveguide 1, the lower part of the right side wall 1c, and the lower part of the left side wall 1d constitutes a conversion waveguide WG2 which is a hollow waveguide surrounding the hollow part 10, and the ground conductor 12 is electrically connected to the signal conductor 13, thereby forming a microstrip line-waveguide converter.
  • the microstrip line on the microstrip board is connected, and the stub conductor 15 and ground conductor 12 operate as a 1/4 wavelength stub with an open end, so the microstrip line on the microstrip board of the microstrip line-waveguide converter It is easy to assemble the line and waveguide 1.
  • the microstrip line-waveguide converter according to the first embodiment has a gap G between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1, Even if there is a thickness error, a thickness error of the stub conductor 15, or an error in the distance from the lower wall 1b to the upper wall 1a of the waveguide 1, the gap G absorbs the combined dimensional error, so the microstrip When attaching the components of the line-waveguide converter to the waveguide 1, stress is not applied to the stub conductor 15, the upper wall 1a of the waveguide 1, and the end portion 1e, and the microstrip line - The waveguide converter, the microstrip substrate and the waveguide 1 will not be damaged.
  • the microstrip line-waveguide converter according to the first embodiment configures the conversion waveguide WG2 which is a hollow waveguide
  • the conversion waveguide WG2 is a high-impedance characteristic guide.
  • the propagation waveguide WG1 in the waveguide 1 can be made into a waveguide with high impedance characteristics, and the height of the waveguide 1 can be increased, so the dimensional error in the height of the waveguide 1 can be reduced. Since the ratio of 1 to 1 is small, changes in the electrical characteristics of the microstrip line-to-waveguide converter due to dimensional errors in the height direction from the inner surface of the lower wall 1b of the waveguide 1 can be reduced.
  • a current flowing through the ground conductor 12 due to a high frequency signal transmitted to the microstrip line including the signal conductor 13 is transmitted between the ground conductor 12 and the stub conductor.
  • 15 operates as a 1/4 wavelength stub with an open end, the flow from one end of the ground conductor 12 to the upper wall 1a of the waveguide 1, and the high frequency signal is propagated to the propagation waveguide WG1 of the waveguide 1. Therefore, even though the gap G is provided between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1, the high frequency signal propagating through the conversion waveguide WG2 leaks from the gap G.
  • the high frequency signal propagating through the conversion waveguide WG2 propagates in a wide band and with low loss.
  • the ground conductor 12 in the microstrip line-waveguide converter according to the first embodiment is a ground conductor having two slits 12b and 12c parallel to one end of the signal conductor 13, as shown in FIG. It may be 12A.
  • the ground conductor 12A shown in FIG. 9 has a slit 12b parallel to the signal conductor connection part 12a on each side of the signal conductor connection part 12a that is electrically and mechanically connected to the surface of one end of the signal conductor 13. It has a slit 12c.
  • the ground conductor 12A has two slits 12b and 12c, impedance matching from the microstrip line to the conversion waveguide WG2 on the microstrip board can be set better, and good reflection can be achieved for broadband high-frequency signals. characteristics are obtained.
  • the number of slits 12b and 12c is not limited to two, and may be one or three or more.
  • the number of slits 12b and 12c is not limited to two. Just choose the number, location, and dimensions appropriately.
  • Embodiment 2 A microstrip line-waveguide converter according to Embodiment 2 will be explained using FIG. 10.
  • the microstrip line-waveguide converter according to the second embodiment has a flat inner surface of the upper wall 1a of the waveguide 1 in the microstrip line-waveguide converter according to the first embodiment. The difference is that a step is provided, but the other points are the same. Note that in FIG. 10, the same reference numerals as those shown in FIGS. 1 to 4 indicate the same or corresponding parts.
  • the upper wall 1a of the waveguide 1 which is different from the microstrip line-waveguide converter according to the first embodiment, will be mainly described below.
  • the distance G1 from the surface of the signal conductor 13 at a position where the stub conductor 15 is not present to the inner surface 1a2 of the upper wall 1a of the waveguide 1 is from the surface of the stub conductor 15. It is longer than the distance G to the inner surface 1a1 of the upper wall 1a of the waveguide 1.
  • the upper wall 1a is made thinner, a step is provided on the upper wall 1a, and the distance G1 is made longer than the distance G.
  • the gap G1 between the signal conductor 13 and the top wall 1a of the waveguide 1 is larger than the gap G between the stub conductor 15 and the top wall 1a of the waveguide 1.
  • the signal propagating through the upper wall 1a of the waveguide 1 is more reliably short-circuited.
  • leakage of high frequency signals from the gap between the stub conductor 15 and the upper wall 1a of the waveguide 1 can be further reduced, and a microstrip line-waveguide converter with lower loss can be obtained.
  • the microstrip line-waveguide converter according to the second embodiment has the same effects as the microstrip line-waveguide converter according to the first embodiment, and also has the same effect as the high-frequency wave propagating through the conversion waveguide WG2. Signals can be propagated with lower loss.
  • the ground conductor 12 is arranged as shown in FIG. As shown, the ground conductor 12A may have a plurality of slits 12b and 12c parallel to one end of the signal conductor 13.
  • Embodiment 3 A microstrip line-waveguide converter according to Embodiment 3 will be explained using FIG. 11.
  • the microstrip line-waveguide converter according to the third embodiment has a flat inner surface of the upper wall 1a of the waveguide 1 in the microstrip line-waveguide converter according to the first embodiment. The difference is that a step is provided, but the other points are the same.
  • FIG. 11 the same reference numerals as those shown in FIGS. 1 to 4 indicate the same or equivalent parts.
  • the inner surface 1a3 of the upper wall 1a of the waveguide 1 in the electromagnetic wave propagation region constituting the propagation waveguide WG1 is the inner surface of the conversion waveguide WG2, that is, the ground conductor 12
  • the entire thickness of the upper wall 1a in the converter formation area for configuring the conversion waveguide WG2 is made thinner, and a step is provided on the upper wall 1a so that the waveguide for propagation is on the same plane as the surface of the waveguide for propagation.
  • the distance h1 from the inner surface of the lower wall 1b to the inner surface of the upper wall 1a in the electromagnetic wave propagation region constituting the pipe WG1 is determined by the distance h1 from the inner surface of the lower wall 1b in the converter formation region to the ground conductor in the converter formation region constituting the conversion waveguide WG2.
  • the distance h2 to the surface of No. 12 shall be the same as the distance h2 to the surface of No. 12.
  • the inner surface 1a3 of the upper wall 1a of the waveguide 1 constituting the propagation waveguide WG1 is located above the waveguide 1 where the conversion waveguide WG2 is located. It is lower than the inner surface 1a4 of the wall 1a by the sum of the lengths of the dielectric 11, the ground conductor 12, the stub conductor 15, and the gap G1 in the height direction. Note that there is a gap between one end surface of the dielectric 11, one end surface of the ground conductor 12, and one end surface of the stub conductor 15, and the stepped surface of the upper wall 1a of the waveguide 1. Moreover, the sameness in the same plane shown above does not necessarily mean complete sameness, but sameness including manufacturing errors.
  • the thickness of the entire upper wall 1a is reduced at the position where the upper wall 1a is arranged, and a step is provided on the upper wall 1a, so that the upper wall 1a is raised from the inner surface of the lower wall 1b of the waveguide 1 in the electromagnetic wave propagation region constituting the propagation waveguide WG1.
  • the distance h1 to the inner surface 1a3 of the wall 1a is shorter than the distance from the inner surface of the lower wall 1b of the waveguide 1 to the inner surface 1a4 of the upper wall 1a in the converter formation region for configuring the conversion waveguide WG2. .
  • the distance h1 from the inner surface of the lower wall 1b of the waveguide 1 constituting the propagation waveguide WG1 to the inner surface 1a3 of the upper wall 1a of the waveguide 1 is the distance h1 of the waveguide where the conversion waveguide WG2 is located.
  • the distance h2 from the inner surface of the lower wall 1b of the pipe 1 to the surface of the ground conductor 12 should be approximately the same.
  • the gap between the surface of the stub conductor 15 and the inner surface 1a4 of the upper wall 1a of the waveguide 1 is narrowed to 1/4 of the open end formed by the stub conductor 15 and the ground conductor 12.
  • the distance between the wavelength stub and the inner surface 1a3 of the upper wall 1a of the waveguide 1 is shortened to ensure that one end of the ground conductor 12 and the upper wall 1a of the waveguide 1 are connected to each other for signals propagating in the waveguide 1.
  • the height h2 of the conversion waveguide WG2 and the propagation waveguide Since the height h1 of WG1 is approximately the same, the impedance characteristics of the conversion waveguide WG2 and the propagation waveguide WG1 are relatively high and comparable, resulting in a microstrip that has good reflection characteristics over a wide band.
  • a line-to-waveguide converter can be obtained.
  • the ground conductor 12 is arranged as shown in FIG. As shown, the ground conductor 12A may have a plurality of slits 12b and 12c parallel to one end of the signal conductor 13.
  • the signal conductor 13 The distance G1 from the surface of the waveguide 1 to the inner surface 1a2 of the upper wall 1a of the waveguide 1 may be longer than the distance G from the surface of the stub conductor 15 to the inner surface 1a1 of the upper wall 1a of the waveguide 1. With this configuration, the other end of the stub conductor 15 and the upper wall 1a of the waveguide 1 are electrically opened more reliably.
  • Embodiment 4 A microstrip line-waveguide converter according to Embodiment 4 will be explained using FIGS. 13 to 16.
  • the microstrip line-waveguide converter according to the fourth embodiment is different from the stub conductor 15 in the microstrip line-waveguide converter according to the first embodiment in that the other end of the stub conductor 15 is grounded.
  • the difference is that the other end of the conductor 12 is electrically connected to the third through conductor 23, and other points are the same. Note that in FIGS. 13 to 16, the same reference numerals as those shown in FIGS. 1 to 4 indicate the same or equivalent parts.
  • the other end of the stub conductor 15 is electrically connected to the other end of the ground conductor 12 by a third through conductor 23 that penetrates the dielectric 11 from the front surface to the back surface.
  • Two third through conductors 23 are arranged in parallel in the width direction at the other end of the stub conductor 15.
  • the third through conductor 23 is formed simultaneously with the first through conductor 14 and the second through conductor 16, and is, for example, a via (VIA). Further, the number of third through conductors 23 is not limited to a plurality, and may be one. When there is one third through conductor 23, it is located on a straight line including the second through conductor 16 along the tube axis of the waveguide 1, similarly to the second through conductor 16.
  • the stub conductor 15 is electrically connected to the ground conductor 12 at one end and the other end, and the dielectric 11 , the second through conductor 16 , the third through conductor 23 , the stub conductor 15 and the ground conductor 12 operates as a quarter-wavelength stub with one end shorted in the conversion section. Therefore, in the vicinity of the center frequency of the high-frequency signal propagating through the conversion waveguide WG2, it is possible to suppress the occurrence of unnecessary resonance within the 1/4 wavelength stub with one end shorted. It is possible to achieve wideband characteristics.
  • the high frequency signal transmitted to the microstrip line including the signal conductor 13 is transmitted between one end of the signal conductor 13 and the ground conductor. 12 is converted into a conversion waveguide WG2 surrounding the hollow portion 10 at a location where the other end portion of the conversion waveguide WG2 is electrically connected by the first through conductor 14.
  • the converted high-frequency signal propagates through the conversion waveguide WG2.
  • the high frequency signal (electromagnetic wave) propagated through the conversion waveguide WG2 is connected by the stub conductor 15 to one end of the ground conductor 12 (FIG. 13 and FIG. 14) to the propagation waveguide WG1 of the waveguide 1. Note that the other end of the stub conductor 15 and the upper wall 1a of the waveguide 1 are in an electrically open state (section Y shown in FIGS. 13 and 14).
  • the microstrip line-waveguide converter according to the fourth embodiment has the same effects as the microstrip line-waveguide converter according to the first embodiment, and also has the same effect as the microstrip line-waveguide converter according to the first embodiment. It is possible to suppress the occurrence of unnecessary resonance in the 1/4 wavelength stub with one end shorted near the center frequency of the signal, and it is possible to realize broadband characteristics as a microstrip line-waveguide converter.
  • the ground conductor 12 is arranged as shown in FIG. As shown, the ground conductor 12A may have a plurality of slits 12b and 12c parallel to one end of the signal conductor 13.
  • the waveguide 1 is connected from the surface of the signal conductor 13.
  • the distance to the inner surface of the upper wall 1a may be longer than the distance G from the surface of the stub conductor 15 to the inner surface of the upper wall 1a of the waveguide 1.
  • the lower wall constituting the propagation waveguide WG1 is similar to the microstrip line-waveguide converter according to the third embodiment.
  • the distance from the inner surface of 1b to the inner surface of upper wall 1a may be the same as the distance from the inner surface of lower wall 1b to the inner surface of upper wall 1a that constitutes conversion waveguide WG2.
  • the height of the conversion waveguide WG2 and the height of the propagation waveguide WG1 are made to be approximately the same.
  • the impedance characteristics of the tube WG2 and the propagation waveguide WG1 are relatively high and comparable, and a microstrip line-waveguide converter having good reflection characteristics over a wide band can be obtained.
  • the distance from the surface of the stub conductor 15 to the inner surface of the upper wall 1a of the waveguide 1 is made longer than the distance G from the surface of the stub conductor 15 to the inner surface of the upper wall 1a of the waveguide 1.
  • the distance from the inner surface of the lower wall 1b that constitutes the propagation waveguide WG1 to the inner surface of the upper wall 1a is determined by the distance from the inner surface of the lower wall 1b that constitutes the conversion waveguide WG2.
  • the distance may be the same as the distance from the inner surface of the upper wall 1a to the inner surface of the upper wall 1a.
  • the distance from the surface of the signal conductor 13 to the inner surface of the upper wall 1a of the waveguide 1 is made longer than the distance G from the surface of the stub conductor 15 to the inner surface of the upper wall 1a of the waveguide 1. This ensures that the other end of the stub conductor 15 and the upper wall 1a of the waveguide 1 are electrically opened.
  • the distance from the inner surface of the lower wall 1b constituting the propagation waveguide WG1 to the inner surface of the upper wall 1a is the distance from the inner surface of the lower wall 1b constituting the conversion waveguide WG2 to the inner surface of the upper wall 1a.
  • one end of the ground conductor 12 and the upper wall 1a of the waveguide 1 are more reliably short-circuited with respect to the signal propagating in the waveguide 1, and the conversion waveguide WG2 and the waveguide 1, the height of the conversion waveguide WG2 and the height of the propagation waveguide WG1 are approximately the same, so that the conversion waveguide
  • the impedance characteristics of WG2 and the propagation waveguide WG1 are relatively high and comparable, and a microstrip line-waveguide converter having good reflection characteristics over a wide band can be obtained.
  • Embodiment 5 A microstrip line-waveguide converter according to Embodiment 5 will be explained using FIG. 18.
  • the microstrip line-waveguide converter according to the fifth embodiment has a plurality of stub conductors, whereas the microstrip line-waveguide converter according to the first embodiment has one stub conductor 15. The difference is that it is constructed using a conductor, and the other points are the same.
  • FIG. 16 the same reference numerals as those shown in FIGS. 1 to 4 indicate the same or equivalent parts.
  • the stub conductors 15a and 15b which are different from the microstrip line-waveguide converter according to the first embodiment, will be mainly explained below.
  • the two stub conductors 15a and 15b are arranged in parallel in the width direction of the dielectric 11 (W direction in FIG. 16).
  • Each stub conductor 15a, 15b is formed on the surface of the dielectric 11 to face the ground conductor 12, and the other end face faces one end face of the signal conductor 13 with a gap therebetween.
  • One end of each stub conductor 15a, 15b is electrically connected to one end of the ground conductor 12 by a second through conductor 16 that penetrates from the front surface to the back surface of the dielectric 11.
  • each stub conductor 15a, 15b is formed at the same time as the signal conductor 13, and is, for example, a conductor foil. Further, the second through conductor 16 corresponding to each stub conductor 15a, 15b is formed simultaneously with the first through conductor 14, and is, for example, a via (VIA).
  • VIP via
  • each stub conductor 15a, 15b operates as a 1/4 wavelength stub with an open end in the conversion section by the dielectric 11, the second through conductor 16, and the ground conductor 12.
  • each stub conductor 15a, 15b Since a gap G exists between the surface of each stub conductor 15a, 15b and the inner surface of the upper wall 1a of the waveguide 1, the other end of each stub conductor 15a, 15b and the top of the waveguide 1
  • the wall 1a is electrically open.
  • one end of each stub conductor 15a, 15b is electrically short-circuited with respect to the upper wall 1a of the waveguide 1 and the signal propagating through the waveguide 1.
  • the microstrip line-waveguide converter according to the fifth embodiment is configured with two stub conductors 15a and 15b, three or more stub conductors are arranged in the width direction of the dielectric 11. They may be configured by arranging them in parallel.
  • the microstrip line-waveguide converter according to the fifth embodiment has the same effect as the microstrip line-waveguide converter according to the first embodiment, and also has the same effect in the width direction of the stub conductors 15a and 15b. Unnecessary resonance determined by the length is unlikely to occur, and good electrical characteristics as a microstrip line-waveguide converter can be obtained.
  • the ground conductor 12 is arranged as shown in FIG. As shown, the ground conductor 12A may have a plurality of slits 12b and 12c parallel to one end of the signal conductor 13.
  • the waveguide 1 is connected from the surface of the signal conductor 13.
  • the distance to the inner surface of the upper wall 1a may be longer than the distance G from the surface of the stub conductor 15 to the inner surface of the upper wall 1a of the waveguide 1.
  • the lower wall constituting the propagation waveguide WG1 is similar to the microstrip line-waveguide converter according to the third embodiment.
  • the distance from the inner surface of 1b to the inner surface of upper wall 1a may be the same as the distance from the inner surface of lower wall 1b to the inner surface of upper wall 1a that constitutes conversion waveguide WG2.
  • each stub conductor 15a, 15b is similar to the microstrip line-waveguide converter according to the fourth embodiment.
  • a configuration may be adopted in which the third through conductor 23 is electrically connected to the other end of the ground conductor 12.
  • Embodiment 6 A microstrip line-waveguide converter according to a sixth embodiment will be explained using FIGS. 19 to 22.
  • the microstrip line-waveguide converter according to Embodiment 6 is a microstrip line-waveguide converter according to Embodiment 1, which converts the microstrip line-waveguide converter according to Embodiment 1 into a 1/4 wavelength stub with an open end using a stub conductor 15 and a ground conductor 12.
  • the stub conductor 15 and the ground conductor 12 are configured to resonate within the dielectric 11 sandwiched between the stub conductor 15 and the ground conductor 12 with respect to the frequency of the signal propagating through the waveguide 1. They are different in some respects and the same in other respects. Note that in FIGS. 19 to 22, the same reference numerals as those shown in FIGS. 1 to 4 indicate the same or equivalent parts.
  • the stub conductor 15 and the ground conductor 12, which are different from the microstrip line-waveguide converter according to the first embodiment, will be explained with respect to the frequency of the signal propagating in the waveguide 1.
  • the configuration that causes resonance within the dielectric 11 sandwiched between the dielectrics 12 will be mainly described.
  • the stub conductor 15 is formed on the surface of the dielectric 11 to face the ground conductor 12, and its other end face faces one end face of the signal conductor 13 with a gap therebetween.
  • One end of the stub conductor 15 is electrically connected to one end of the ground conductor 12 by a second through conductor 16 that penetrates the dielectric 11 from the front surface to the back surface.
  • Two second through conductors 16 are arranged in parallel in the width direction at one end of the stub conductor 15. Note that the number of second through conductors 16 is not limited to a plurality, and may be one.
  • a gap G exists between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1.
  • the stub conductor 15 cooperates with the ground conductor 12 to cause the frequency of the signal propagating through the waveguide 1 to resonate within the dielectric 11 sandwiched between the stub conductor 15 and the ground conductor 12. That is, the frequency of the signal propagating through the waveguide 1 resonates within the dielectric 11 surrounded by the stub conductor 15, the second through conductor 16, and the ground conductor 12.
  • the length of the stub conductor 15 in the tube axis direction of the waveguide 1 is determined to be such that the frequency of the signal propagating through the waveguide 1 resonates.
  • the length of the stub conductor 15 in the tube axis direction of the waveguide 1 is determined from the connecting portion 16a between the lower end of the second through conductor 16 and the surface of the ground conductor 12 to the second through conductor 16 and the second through conductor 16.
  • the length from the upper end of the through conductor 16 of No. 2 to the other end of the stub conductor 15 via the connection part 16b of one end of the back surface of the stub conductor 15 is 1/4 wavelength of the signal propagating through the waveguide 1. It is determined to be an odd number.
  • the stub conductor 15 and the ground conductor 12 operate to resonate within the dielectric 11 sandwiched between the stub conductor 15 and the ground conductor 12 with respect to the frequency of the signal propagating through the waveguide 1. Function.
  • the stub conductor 15 and the ground conductor 12 function as a 1/4 wavelength stub that operates to resonate within the dielectric 11 sandwiched between the stub conductor 15 and the ground conductor 12 with respect to the frequency of the signal propagating through the waveguide 1. Operate.
  • the frequency of the signal propagating through the waveguide 1 resonates within the dielectric 11 surrounded by the stub conductor 15, the second through conductor 16, and the ground conductor 12, and as a result, one end of the ground conductor 12
  • the upper wall 1a of the waveguide 1 can be regarded as an electrical short circuit (section X in FIGS. 18 and 19) for the signal propagating through the waveguide 1.
  • the conversion waveguide WG2 is electrically connected to the microstrip line on the microstrip board by electrically connecting the ground conductor 12 to the signal conductor 13 and the first through conductor 14 at the other end. connected.
  • one end of the conversion waveguide WG2 one end of the ground conductor 12 and the upper wall 1a of the waveguide 1 are considered to be electrically short-circuited with respect to the signal propagating through the waveguide 1.
  • the high frequency signal propagating through the conversion waveguide WG2 is propagated to the propagation waveguide WG1 of the waveguide 1.
  • the high frequency signal propagating through the conversion waveguide WG2 constituted by the ground conductor 12 etc. does not leak from the gap G between the surface of the stub conductor 15 and the inner surface of the upper wall 1a of the waveguide 1. .
  • the high frequency signal propagating through the conversion waveguide WG2 propagates with low loss and is propagated to the propagation waveguide WG1 of the waveguide 1.
  • the microstrip line-waveguide converter according to the sixth embodiment is also easily assembled and operates similarly to the microstrip line-waveguide converter according to the first embodiment. and has a similar effect.
  • the ground conductor 12 is arranged as shown in FIG. As shown, the ground conductor 12A may have a plurality of slits 12b and 12c parallel to one end of the signal conductor 13.
  • the waveguide 1 is connected from the surface of the signal conductor 13.
  • the distance to the inner surface of the upper wall 1a may be longer than the distance G from the surface of the stub conductor 15 to the inner surface of the upper wall 1a of the waveguide 1.
  • the lower wall constituting the propagation waveguide WG1 is similar to the microstrip line-waveguide converter according to the third embodiment.
  • the distance from the inner surface of 1b to the inner surface of upper wall 1a may be the same as the distance from the inner surface of lower wall 1b to the inner surface of upper wall 1a that constitutes conversion waveguide WG2.
  • each stub conductor 15a, 15b is similar to the microstrip line-waveguide converter according to the fourth embodiment.
  • a configuration may also be adopted in which the third through conductor 23 is electrically connected to the other end of the ground conductor 12.
  • microstrip line-waveguide converter according to the sixth embodiment may also be configured with a plurality of stub conductors 15, similarly to the microstrip line-waveguide converter according to the fifth embodiment. .
  • the microstrip line-waveguide converter according to the present disclosure is used to connect a microstrip line and a waveguide, and is used in wireless communications, radar, etc.
  • 1 waveguide 1a upper wall, 1b lower wall, 1c right side wall, 1c1 right erected part, 1d left side wall, 1d1 left erected part, 1e end erected part, 11 dielectric, 12, 12A ground conductor, 13 Signal conductor, 14 First through conductor, 15, 15A, 15a, 15b Stub conductor, 16 Second through conductor, 17 Ground conductor, 23 Third through conductor.

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Abstract

Ce convertisseur de guide d'ondes à ligne microruban comprend : un guide d'ondes (1) qui possède une paroi supérieure (1a), une paroi inférieure (1b), une paroi latérale droite (1c), une paroi latérale gauche (1d) et une région de formation de convertisseur disposée à une extrémité ; un corps diélectrique (11) qui est disposé entre la paroi supérieure (1a) et la paroi inférieure (1b) dans la région de formation de convertisseur du guide d'ondes (1) ; un conducteur de masse (12) qui est formé sur la surface arrière du corps diélectrique (11) et qui définit une section creuse (10) avec la partie de la paroi inférieure (1b), une partie inférieure de la paroi latérale droite (1c) et une partie inférieure de la paroi latérale gauche (1d) positionnée dans la région de formation de convertisseur et configure un guide d'ondes pour la conversion, c'est-à-dire un guide d'ondes creux où la section creuse est entourée par la partie de la paroi inférieure (1b), une partie inférieure de la paroi latérale droite (1c) et une partie inférieure de la paroi latérale gauche (1d) positionnée dans la région de formation de convertisseur ; un conducteur de signal (13) qui est formé sur la surface avant du corps diélectrique (11) et connecté électriquement à une extrémité à l'autre extrémité du conducteur de masse (12) par un premier conducteur traversant (14) pénétrant depuis la surface avant vers la surface arrière du corps diélectrique (11) ; et un conducteur d'embase (15), qui est formé sur la surface avant du corps diélectrique (11) de façon à faire face au conducteur de masse (12), est électriquement connecté à une extrémité à une extrémité du conducteur de masse (12) par un second conducteur traversant (16) pénétrant depuis la surface avant vers la surface arrière du corps diélectrique (11), et présente, dans une direction axiale du guide d'ondes (1), une longueur qui est un multiple impair de 1/4 de la longueur d'onde d'un signal se propageant à travers le guide d'ondes (1).
PCT/JP2022/028676 2022-07-26 2022-07-26 Convertisseur de guide d'ondes à ligne microruban WO2024023903A1 (fr)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483489A (en) * 1968-01-31 1969-12-09 Bell Telephone Labor Inc End launch stripline-waveguide transducer
JP2012175181A (ja) * 2011-02-17 2012-09-10 Japan Radio Co Ltd 導波管伝送線路変換器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3483489A (en) * 1968-01-31 1969-12-09 Bell Telephone Labor Inc End launch stripline-waveguide transducer
JP2012175181A (ja) * 2011-02-17 2012-09-10 Japan Radio Co Ltd 導波管伝送線路変換器

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