WO2024016921A1

WO2024016921A1 - Packaging structure of diode photovoltaic module and solar cell junction box device

Info

Publication number: WO2024016921A1
Application number: PCT/CN2023/100981
Authority: WO
Inventors: 贾子龙; 蒋忠伟; 朱沛瑶; 王乐; 帅莉芳; 杭超禹
Original assignee: 天合光能股份有限公司
Priority date: 2022-07-21
Filing date: 2023-06-19
Publication date: 2024-01-25
Also published as: CN218039169U

Abstract

A packaging structure (2) of a diode photovoltaic module (1). The packaging structure (2) comprises an insulating layer (21) and a heat dissipation layer (22), wherein the insulating layer (21) covers the diode photovoltaic module (1); and the heat dissipation layer (22) covers the insulating layer (21).

Description

Encapsulation structure of diode photovoltaic module and solar cell junction box device

Technical field

The present disclosure relates to the field of photovoltaic technology, and specifically to a packaging structure of a diode photovoltaic module and a solar cell junction box device.

Background technique

In order to avoid the loss of power generation efficiency and component safety risks when photovoltaic modules undergo hot spot effects, one or more bypass diodes are usually installed in the photovoltaic junction box (that is, the solar cell junction box device). At present, in order to protect the diode photovoltaic module (for example, the bypass diode can be located inside the diode photovoltaic module), it is usually covered with a layer of packaging material. However, as the current of the photovoltaic module becomes larger and larger, the reliability and reliability of the diode photovoltaic module are affected. The requirements for heat dissipation capacity are getting higher and higher.

The current packaging design can no longer meet current requirements, and a packaging structure that can improve heat dissipation efficiency and reliability is urgently needed.

Contents of the invention

The present disclosure provides a packaging structure of a diode photovoltaic module and a solar cell junction box device.

Embodiments of the present disclosure provide a packaging structure of a diode photovoltaic module, wherein the packaging structure includes an insulation layer and a heat dissipation layer, wherein the insulation layer covers the diode photovoltaic module; the heat dissipation layer covers the insulation layer.

Optionally, the packaging structure further includes at least one first heat dissipation interlayer, and at least one first heat dissipation interlayer is disposed between the insulation layer and the heat dissipation layer.

Optionally, the diode photovoltaic module includes two electrodes, a diode chip and a connecting piece, wherein the diode chip has a first mounting surface and a second mounting surface that are away from each other, and the first mounting surface is connected to one of the The electrode, one end of the connecting piece is connected to On the second mounting surface, the other end of the connecting piece is connected to the other electrode; the two electrodes penetrate the insulating layer and the heat dissipation layer in sequence, and extend to the outside of the heat dissipation layer; at least One of the first heat dissipation interlayers is located on a side of the insulation layer close to the second mounting surface.

Optionally, the first heat dissipation interlayer includes at least one of an aluminum alloy layer, a brass layer, and a bronze layer.

Optionally, the diode photovoltaic module includes two electrodes, a diode chip and a connecting piece, wherein the diode chip has a first mounting surface and a second mounting surface that are away from each other, and the first mounting surface is connected to one of the The electrode, one end of the connecting piece is connected to the second mounting surface, and the other end of the connecting piece is connected to the other electrode; the two electrodes penetrate the insulating layer and the heat dissipation layer in sequence , and extends to the outside of the heat dissipation layer; the packaging structure also includes at least one second heat dissipation interlayer; at least one second heat dissipation interlayer is provided between the connecting piece and the insulating layer, and is located with the at a position corresponding to the second mounting surface; or, at least one second heat dissipation interlayer is provided on a side of the connecting piece facing away from the diode chip, and at a position corresponding to the second mounting surface , and at least one second heat dissipation interlayer penetrates the insulating layer in a direction away from the connecting piece and is in contact with the heat dissipation layer.

Optionally, the second heat dissipation interlayer includes at least one of an aluminum alloy layer, a brass layer, and a bronze layer.

Optionally, the diode photovoltaic module includes two electrodes, a diode chip and a connecting piece, wherein the diode chip has a first mounting surface and a second mounting surface that are away from each other, and the first mounting surface is connected to one of the The electrode, one end of the connecting piece is connected to the second mounting surface, and the other end of the connecting piece is connected to the other electrode; the two electrodes penetrate the insulating layer and the heat dissipation layer in sequence , and extends to the outside of the heat dissipation layer; the packaging structure also includes at least a third heat dissipation interlayer; at least one third heat dissipation interlayer is provided between the electrode connected to the diode chip and the insulating layer between and located at a position corresponding to the first mounting surface; or, at least one third heat dissipation interlayer is provided on a side of the electrode connected to the diode chip away from the diode chip and located at at a position corresponding to the first mounting surface, and at least one The third heat dissipation interlayer penetrates the insulating layer in a direction away from the electrode and is in contact with the heat dissipation layer.

Optionally, the third heat dissipation interlayer includes at least one of an aluminum alloy layer, a brass layer, and a bronze layer.

Optionally, the outer surface of the heat dissipation layer is formed with a concave-convex structure, and the concave-convex structure includes a plurality of concave portions or convex portions evenly distributed on the outer surface of the heat dissipation layer.

Optionally, the insulating layer includes an epoxy resin layer or a polyimide layer.

Optionally, the heat dissipation layer includes an aluminum oxide ceramic layer or a beryllium oxide ceramic layer.

Embodiments of the present disclosure provide a solar cell junction box device, including a junction box, a diode photovoltaic module disposed in the junction box, and a packaging structure covering the diode photovoltaic module, wherein the packaging structure is implemented using the present disclosure. Any packaging structure of the example.

The present disclosure has the following beneficial effects.

The packaging structure of the diode photovoltaic module provided by the present disclosure adopts a composite structure, that is, an insulating layer and a heat dissipation layer. The insulating layer covers the diode photovoltaic module. The above-mentioned insulating layer can enhance the overall strength of the packaging structure and directly protect the diode photovoltaic module. module, reducing the impact of external interference such as external forces on the diode photovoltaic module, thereby improving the reliability of the packaging structure; at the same time, the heat dissipation layer is covered with an insulating layer, which is used to improve the heat dissipation efficiency of the diode photovoltaic module, thereby reducing the risk of diode photovoltaic modules. The impact of module heating on the solar cell backsheet of photovoltaic modules. Therefore, the above-mentioned composite packaging structure has both high reliability and excellent heat dissipation efficiency, and can meet the reliability and heat dissipation capacity requirements of high photovoltaic modules for diode photovoltaic modules.

The solar cell junction box device provided by the present disclosure can improve the heat dissipation efficiency and packaging reliability of the diode photovoltaic module by adopting the above-mentioned packaging structure of the diode photovoltaic module provided by the disclosure.

Description of drawings

FIG. 1 is a structural diagram of the packaging structure of a diode photovoltaic module provided by the first embodiment of the present disclosure.

FIG. 2 is a structural diagram of the packaging structure of the diode photovoltaic module provided by the second embodiment of the present disclosure.

FIG. 3A is a structural diagram of the packaging structure of the diode photovoltaic module provided by the third embodiment of the present disclosure.

FIG. 3B is another structural diagram of the packaging structure of the diode photovoltaic module provided by the third embodiment of the present disclosure.

FIG. 4A is a structural diagram of the packaging structure of the diode photovoltaic module provided by the fourth embodiment of the present disclosure.

FIG. 4B is another structural diagram of the packaging structure of the diode photovoltaic module provided by the fourth embodiment of the present disclosure.

FIG. 5 is a structural diagram of the packaging structure of the diode photovoltaic module provided by the fifth embodiment of the present disclosure.

Figure 6 is a surface shape diagram of the concave and convex structure adopted in the fifth embodiment of the present disclosure.

Figure 7 is a structural diagram of a solar cell junction box device provided by the sixth embodiment of the present disclosure.

Detailed ways

In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the packaging structure of the diode photovoltaic module and the solar cell junction box device provided by the present disclosure will be described in detail below in conjunction with the accompanying drawings.

First embodiment

This embodiment provides a packaging structure of a diode photovoltaic module. Please refer to Figure 1. The packaging structure 2 includes an insulating layer 21 and a heat dissipation layer 22. The insulating layer 21 covers the diode photovoltaic module 1; the heat dissipation layer 22 covers the insulating layer. twenty one.

The packaging structure 2 provided in this embodiment adopts a composite structure, that is, an insulation layer 21 and a heat dissipation layer 22. Among them, the insulating layer 21 covers the diode photovoltaic module 1. It uses an insulating material with less stress and higher reliability than the thermal conductive layer 22. Therefore, the insulating layer 21 can enhance the overall strength of the packaging structure 2 and directly protect the diode photovoltaic module 1. , Reduce the impact of external interference such as external force on the diode photovoltaic module, thereby improving the reliability of the packaging structure. At the same time, the heat dissipation layer 22 covers the insulating layer 21, which is made of a material with better heat dissipation than the insulating layer 21, which can improve the heat dissipation efficiency of the diode photovoltaic module 1, thereby reducing the impact of the heat of the diode photovoltaic module 1 on the solar cell backplane. Influence.

Therefore, the above-mentioned composite packaging structure has both high reliability and excellent heat dissipation efficiency, and can meet the reliability and heat dissipation capacity requirements of high photovoltaic modules for diode photovoltaic modules.

In some optional embodiments, the diode photovoltaic module 1 includes two electrodes (13a, 13b), a diode chip 11 and a connecting piece 12. Among them, the diode chip 11 is a semiconductor device that constitutes a diode (such as a bypass diode) structure, which can be a Schottky Barrier Diode (SBD), a metal oxide semi-(metal oxide) field effect transistor (Metal- Oxide-Semiconductor Field-Effect Transistor, MOSFET) and so on. The connecting piece 12 is used to electrically connect the diode chip 11 and the electrode 13b.

Specifically, the diode chip 11 has a first mounting surface (the downward surface in FIG. 1 ) and a second mounting surface (the upward surface in FIG. 1 ) that are away from each other, and the first mounting surface is connected to one of the electrodes 13 a. One end of the connecting piece 12 is connected to the second mounting surface, and the other end of the connecting piece 12 is connected to the other electrode 13b. The two electrodes (13a, 13b) penetrate the insulating layer 21 and the heat dissipation layer 22 in sequence, and extend to the outside of the heat dissipation layer 22 to be electrically connected to the corresponding power module (such as a photovoltaic module). Of course, in practical applications, diode photovoltaic modules with other arbitrary structures with the same functions can also be used, and the embodiments of the present disclosure have no special limitations on this.

The above-mentioned insulating layer 21 is located in the innermost layer, that is, closest to the diode photovoltaic module 1. To directly protect the diode photovoltaic module 1, it is necessary to use an insulating material with low stress and high reliability. For example, an insulating material with a strength greater than that of the heat dissipation layer 22 is used to protect the diode photovoltaic module 1 directly. It plays the role of enhancing the overall strength of the packaging structure 2 to reduce the impact of external interference such as external force on the diode photovoltaic module, thereby improving the reliability of the packaging structure. Optionally, the insulating layer 21 includes an epoxy resin layer or a polyimide layer or the like. Of course, the embodiments of the present disclosure are not limited to this. In practical applications, any other insulating material with low stress and high reliability can also be used, as long as the above functions can be achieved.

In some optional embodiments, the above-mentioned insulating layer 21 can be manufactured by mold casting. Specifically, the diode photovoltaic module 1 is placed in a mold container, and then introduced into the mold container. The liquid material of the insulating layer 21 is cast in the container. After the liquid material solidifies, the diode photovoltaic module 1 is covered (except for the lead-out parts of the two electrodes (13a, 13b)).

The heat dissipation layer 22 covers the insulating layer 21, which is used to improve the heat dissipation efficiency of the diode photovoltaic module 1. Optionally, the heat dissipation layer 22 includes an alumina ceramic layer or a beryllium oxide ceramic layer, or the like. Of course, the embodiments of the present disclosure are not limited to this. In practical applications, any other insulating material with high thermal conductivity efficiency can also be used, as long as the above functions can be achieved.

In some optional embodiments, similar to the above-mentioned insulating layer 21 , the above-mentioned heat dissipation layer 22 can also be manufactured by mold casting.

Second embodiment

The packaging structure of the diode photovoltaic module provided in this embodiment is an improvement based on the above-mentioned first embodiment. Specifically, please refer to Figure 2. Based on the above-mentioned first embodiment, the packaging structure 2 adds at least one first heat dissipation interlayer 23. The at least one first heat dissipation interlayer 23 is disposed between the insulating layer 21 and the heat dissipation layer 22. It is used to further enhance heat dissipation efficiency, and can also adjust the heat dissipation direction and enhance local heat dissipation.

In some optional embodiments, the first heat dissipation interlayer 23 includes an aluminum alloy layer, a brass layer, a bronze layer, or the like. Of course, the embodiments of the present disclosure are not limited to this. In practical applications, any other materials with high thermal conductivity efficiency can also be used, as long as the above functions can be achieved.

In some optional embodiments, at least one first heat dissipation interlayer 23 is located on the insulating layer 21 close to the above-mentioned second mounting surface (ie, the upward surface of the diode chip 11 in FIG. 2 , that is, the diode chip 11 is connected to the connecting piece 12 surface) side. In this way, the heat dissipation capacity of the diode chip 11 can be greatly improved, and at the same time, most of the heat generated by the diode chip 11 is conducted to the top of the packaging structure 2, so that the heat is away from the solar cell backplane (that is, the solar cell backplane of the photovoltaic module is located on (below the diode chip 11 in Figure 2), thereby reducing the impact of the heat generated by the diode chip 11 on the solar cell backplane. Of course, in practical applications, the first heat dissipation interlayer 23 can also be provided at any other position between the insulating layer 21 and the heat dissipation layer 22 , and there is no particular limitation on this in the embodiment of the present disclosure.

In some optional embodiments, the orthogonal projection of at least one first heat dissipation interlayer 23 on the plane where the above-mentioned second mounting surface of the diode chip 11 (the upward surface in FIG. 1 ) is located is At least the second mounting surface is completely covered, and the orthographic projection of the connecting piece 12 on the plane is covered to enable uniform heat dissipation.

Third embodiment

The packaging structure of the diode photovoltaic module provided in this embodiment is an improvement based on the above-mentioned first embodiment. Specifically, please refer to FIG. 3A. Based on the above-mentioned first embodiment, the packaging structure 2 adds at least one second heat dissipation interlayer 24. At least one second heat dissipation interlayer 24 is disposed between the connecting piece 12 and the insulating layer 21. And it is located at a position corresponding to the above-mentioned second mounting surface of the diode chip 11 to further enhance the heat dissipation efficiency, and at the same time, it can also adjust the heat dissipation direction and enhance local heat dissipation.

In some optional embodiments, the second heat dissipation interlayer 24 includes an aluminum alloy layer, a brass layer, a bronze layer, or the like. Of course, the embodiments of the present disclosure are not limited to this. In practical applications, any other materials with high thermal conductivity efficiency can also be used, as long as the above functions can be achieved.

In some optional embodiments, at least one first heat dissipation interlayer 23 can be provided between the insulating layer 21 and the heat dissipation layer 22 , and at least one second heat dissipation interlayer can be provided between the connecting piece 12 and the insulating layer 21 . 24, to further enhance heat dissipation efficiency.

In some other optional embodiments, please refer to FIG. 3B , at least one second heat dissipation interlayer 24 ′ can also be provided on the side of the connecting piece 12 away from the diode chip 11 and located at a position corresponding to the above-mentioned second mounting surface. at, and at least one second heat dissipation interlayer 24' penetrates the insulating layer 21 in the direction away from the connecting piece 12 (ie, the upward direction in FIG. 3B) and is in contact with the heat dissipation layer 22 (ie, both sides of the second heat dissipation interlayer 24' are respectively in contact with the connecting piece 12 and the heat dissipation layer 22). In this way, the heat dissipation efficiency can be further improved.

Fourth embodiment

The packaging structure of the diode photovoltaic module provided in this embodiment is an improvement based on the above-mentioned first embodiment. Specifically, please refer to FIG. 4A. Based on the above-mentioned first embodiment, the packaging structure 2 adds at least one third heat dissipation interlayer 25. The at least one third heat dissipation interlayer 25 is disposed between the electrode 13a connected to the diode chip 11 and the insulation. Between layers 21, And the position corresponding to the above-mentioned first mounting surface (ie, the downward surface of the diode chip 11 in FIG. 4A ) is used to further enhance the heat dissipation efficiency and can also enhance local heat dissipation.

In some optional embodiments, the third heat dissipation interlayer 25 includes an aluminum alloy layer, a brass layer, a bronze layer, or the like. Of course, the embodiments of the present disclosure are not limited to this. In practical applications, any other materials with high thermal conductivity efficiency can also be used, as long as the above functions can be achieved.

In some optional embodiments, at least one first heat dissipation interlayer 23 can be provided between the insulating layer 21 and the heat dissipation layer 22, and at least one first heat dissipation interlayer 23 can be provided between the electrode 13a connected to the diode chip 11 and the insulating layer 21. A third heat dissipation interlayer 25 is provided to further enhance heat dissipation efficiency. Optionally, at least one second heat dissipation interlayer 24 can also be provided between the connecting piece 12 and the insulating layer 21 . That is, in practical applications, the arrangements of the first heat dissipation interlayer 23 , the second heat dissipation interlayer 24 , and the third heat dissipation interlayer 25 can be freely combined according to specific needs.

In some other optional embodiments, please refer to FIG. 4B , at least one third heat dissipation interlayer 25 ′ is provided on the side of the electrode 13 a connected to the diode chip 11 away from the diode chip 11 , and is located opposite the first mounting surface. at the corresponding position, and at least one third heat dissipation interlayer 25' penetrates the insulating layer 21 in the direction away from the electrode 13a and is in contact with the heat dissipation layer 22 (that is, both sides of the third heat dissipation interlayer 25' are respectively connected with the electrode 13a and the heat dissipation layer 22 contacts). In this way, the heat dissipation efficiency can be further improved.

Fifth embodiment

The packaging structure of the diode photovoltaic module provided by this embodiment is an improvement based on any one of the above-mentioned first to fourth embodiments. Specifically, please refer to FIG. 5 . The outer surface of the heat dissipation layer 22 is formed with a concave-convex structure 221 . The concave-convex structure 221 includes a plurality of concave or convex portions evenly distributed on the outer surface of the heat dissipation layer 22 for increasing the heat dissipation layer 22 . The heat dissipation area of the outer surface can further improve the heat dissipation efficiency.

In some optional embodiments, as shown in FIG. 6 , in the above-described concave-convex structure 221 , the orthographic projection shape of each concave portion or convex portion on the outer surface of the heat dissipation layer 22 can have multiple shapes. For example, as shown in (a) to (c) in Figure 6, the orthographic projection shape may be a hexagon, an orthogonal Square or round. Of course, the embodiments of the present disclosure are not limited to this. In practical applications, any other orthographic projection shape can be used as long as the above functions can be achieved.

In summary, the packaging structure of the diode photovoltaic module provided by the above embodiments of the present disclosure adopts a composite structure, that is, an insulation layer and a heat dissipation layer. The strength of the insulation layer is greater than the strength of the heat dissipation layer. The insulation layer covers the diode photovoltaic module. By making the strength of the insulation layer greater than the strength of the heat dissipation layer, the overall strength of the packaging structure can be enhanced through the insulation layer and the diode photovoltaic module can be directly protected. , reducing the impact of external interference such as external forces on the diode photovoltaic module, thereby improving the reliability of the packaging structure; at the same time, the heat dissipation layer is covered with an insulating layer, which is used to improve the heat dissipation efficiency of the diode photovoltaic module, thereby reducing the impact of the diode photovoltaic module. The impact of heat generation on solar cell backsheets. Therefore, the above-mentioned composite packaging structure has both high reliability and excellent heat dissipation efficiency, and can meet the reliability and heat dissipation capacity requirements of high photovoltaic modules for diode photovoltaic modules.

Sixth embodiment

As another technical solution, this embodiment provides a solar cell junction box device, as shown in Figure 7, which includes: a junction box 3, a diode photovoltaic module 1 arranged in the junction box 3, and a covered diode photovoltaic module 1 The packaging structure 2 adopts the packaging structure 2 provided by the above-mentioned embodiments of the present disclosure.

In some optional embodiments, in order to fix the diode photovoltaic module 1 and further improve the heat dissipation effect, the junction box 3 can also be filled with silica gel material 4 , and the silica gel material 4 covers the diode photovoltaic module 1 and the packaging structure 2 .

Optionally, the outer surface of the heat dissipation layer 22 is formed with a concave-convex structure 221. The concave-convex structure 221 includes a plurality of concave or convex portions evenly distributed on the outer surface of the heat dissipation layer 22, for increasing the contact between the outer surface of the heat dissipation layer 22 and the silicone. 4 contact areas, which can further improve heat dissipation efficiency.

The solar cell junction box device provided by the embodiment of the disclosure can improve the heat dissipation efficiency and packaging reliability of the diode photovoltaic module by adopting the packaging structure of the diode photovoltaic module provided by the embodiment of the disclosure.

It can be understood that the above embodiments are only exemplary embodiments adopted to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For the general public in this field For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the present disclosure.

Claims

A packaging structure of a diode photovoltaic module, wherein the packaging structure includes an insulating layer and a heat dissipation layer, wherein the insulating layer covers the diode photovoltaic module; and the heat dissipation layer covers the insulating layer.
The packaging structure according to claim 1, wherein the packaging structure further includes at least one first heat dissipation interlayer, and the at least one first heat dissipation interlayer is disposed between the insulation layer and the heat dissipation layer.
The packaging structure according to claim 2, wherein the diode photovoltaic module includes two electrodes, a diode chip and a connecting piece, wherein the diode chip has a first mounting surface and a second mounting surface that are away from each other, and the The first mounting surface is connected to one of the electrodes, one end of the connecting piece is connected to the second mounting surface, and the other end of the connecting piece is connected to the other electrode; the two electrodes pass through all the electrodes in sequence. the insulating layer and the heat dissipation layer, and extending to the outside of the heat dissipation layer;

At least one first heat dissipation interlayer is located on a side of the insulation layer close to the second mounting surface.
The packaging structure according to claim 2 or 3, wherein the first heat dissipation interlayer includes at least one of an aluminum alloy layer, a brass layer, and a bronze layer.
The packaging structure according to claim 1, wherein the diode photovoltaic module includes two electrodes, a diode chip and a connecting piece, wherein the diode chip has a first mounting surface and a second mounting surface that are away from each other, and the The first mounting surface is connected to one of the electrodes, one end of the connecting piece is connected to the second mounting surface, and the other end of the connecting piece is connected to the other electrode; the two electrodes pass through all of them in sequence. the insulating layer and the heat dissipation layer, and extending to the outside of the heat dissipation layer;

The packaging structure further includes at least one second heat dissipation interlayer;

At least one second heat dissipation interlayer is disposed between the connecting piece and the insulating layer and is located at a position corresponding to the second mounting surface; or, at least one second heat dissipation interlayer is disposed between the connecting piece and the insulating layer. The connecting piece is on a side away from the diode chip and is located at a position corresponding to the second mounting surface, and at least one of the second heat dissipation interlayers penetrates the insulating layer in a direction away from the connecting piece, and in contact with the heat dissipation layer.
The packaging structure of claim 5, wherein the second heat dissipation interlayer includes at least one of an aluminum alloy layer, a brass layer, and a bronze layer.
The packaging structure according to claim 1, wherein the diode photovoltaic module includes two electrodes, a diode chip and a connecting piece, wherein the diode chip has a first mounting surface and a second mounting surface that are away from each other, and the The first mounting surface is connected to one of the electrodes, one end of the connecting piece is connected to the second mounting surface, and the other end of the connecting piece is connected to the other electrode; the two electrodes pass through all the electrodes in sequence. the insulating layer and the heat dissipation layer, and extending to the outside of the heat dissipation layer;

The packaging structure further includes at least one third heat dissipation interlayer;

At least one third heat dissipation interlayer is provided between the electrode connected to the diode chip and the insulating layer, and is located at a position corresponding to the first mounting surface; or, at least one third heat dissipation interlayer Three heat dissipation interlayers are provided on the side of the electrode connected to the diode chip away from the diode chip and located at a position corresponding to the first mounting surface, and at least one of the third heat dissipation interlayers is located away from the The direction of the electrode penetrates the insulating layer and is in contact with the heat dissipation layer.
The packaging structure of claim 7, wherein the third heat dissipation interlayer includes at least one of an aluminum alloy layer, a brass layer, and a bronze layer.
The packaging structure according to claim 1, wherein the outer surface of the heat dissipation layer is formed with a concave-convex structure, and the concave-convex structure includes a plurality of concave portions or convex portions evenly distributed on the outer surface of the heat dissipation layer.
The packaging structure of claim 1, wherein the insulating layer includes an epoxy resin layer or a polyimide layer.
The packaging structure of claim 1, wherein the heat dissipation layer includes an aluminum oxide ceramic layer or a beryllium oxide ceramic layer.
A solar cell junction box device, including a junction box, a diode photovoltaic module arranged in the junction box, and a packaging structure covering the diode photovoltaic module, wherein the packaging structure adopts any one of claims 1-11 The packaging structure.