WO2024012932A1 - Polyépoxyde non réticulé et composé adhésif comprenant ledit polyépoxyde - Google Patents
Polyépoxyde non réticulé et composé adhésif comprenant ledit polyépoxyde Download PDFInfo
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- WO2024012932A1 WO2024012932A1 PCT/EP2023/068348 EP2023068348W WO2024012932A1 WO 2024012932 A1 WO2024012932 A1 WO 2024012932A1 EP 2023068348 W EP2023068348 W EP 2023068348W WO 2024012932 A1 WO2024012932 A1 WO 2024012932A1
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- WIPO (PCT)
- Prior art keywords
- monomers
- polyepoxide
- monomer composition
- group
- range
- Prior art date
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 148
- 230000001070 adhesive effect Effects 0.000 title claims description 56
- 239000000853 adhesive Substances 0.000 title claims description 54
- 150000001875 compounds Chemical class 0.000 title abstract description 27
- 239000000178 monomer Substances 0.000 claims abstract description 285
- 239000000203 mixture Substances 0.000 claims abstract description 88
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 31
- 125000000524 functional group Chemical group 0.000 claims abstract description 29
- 239000004823 Reactive adhesive Substances 0.000 claims abstract description 26
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 26
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 238000006116 polymerization reaction Methods 0.000 claims description 37
- 239000003999 initiator Substances 0.000 claims description 33
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 21
- 239000002390 adhesive tape Substances 0.000 claims description 17
- 125000002091 cationic group Chemical group 0.000 claims description 14
- 230000000379 polymerizing effect Effects 0.000 claims description 10
- 125000001424 substituent group Chemical group 0.000 abstract 2
- -1 polyethylene Polymers 0.000 description 87
- 239000004593 Epoxy Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 33
- 238000006243 chemical reaction Methods 0.000 description 22
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 20
- 230000008569 process Effects 0.000 description 20
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 18
- 238000004132 cross linking Methods 0.000 description 15
- 239000000126 substance Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 239000000523 sample Substances 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 9
- 230000004913 activation Effects 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 8
- 238000010538 cationic polymerization reaction Methods 0.000 description 7
- 230000009257 reactivity Effects 0.000 description 7
- 238000009482 thermal adhesion granulation Methods 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 6
- 239000003153 chemical reaction reagent Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 150000001450 anions Chemical class 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 5
- 239000003880 polar aprotic solvent Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- VAUMWVVODNTNEA-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenyl)methoxyboronic acid Chemical compound FC1=C(C(=C(C(=C1COB(O)O)F)F)F)F VAUMWVVODNTNEA-UHFFFAOYSA-N 0.000 description 4
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 150000002924 oxiranes Chemical class 0.000 description 4
- 230000036962 time dependent Effects 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 239000012952 cationic photoinitiator Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QCGKUFZYSPBMAY-UHFFFAOYSA-N methyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1C(C(=O)OC)CCC2OC21 QCGKUFZYSPBMAY-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 2
- VJXRKZJMGVSXPX-UHFFFAOYSA-N 4-ethylpyridine Chemical compound CCC1=CC=NC=C1 VJXRKZJMGVSXPX-UHFFFAOYSA-N 0.000 description 2
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 229910018286 SbF 6 Inorganic materials 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- XHNHTGPYLHOQRA-UHFFFAOYSA-M bis(2-dodecylphenyl)iodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC XHNHTGPYLHOQRA-UHFFFAOYSA-M 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 238000010382 chemical cross-linking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000003502 gasoline Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004128 high performance liquid chromatography Methods 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000006855 networking Effects 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000006384 oligomerization reaction Methods 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
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- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- DHJLNRNHBNCJIA-UHFFFAOYSA-O (4-acetamidophenyl)-diphenylsulfanium Chemical compound C1=CC(NC(=O)C)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 DHJLNRNHBNCJIA-UHFFFAOYSA-O 0.000 description 1
- PLFFHJWXOGYWPR-HEDMGYOXSA-N (4r)-4-[(3r,3as,5ar,5br,7as,11as,11br,13ar,13bs)-5a,5b,8,8,11a,13b-hexamethyl-1,2,3,3a,4,5,6,7,7a,9,10,11,11b,12,13,13a-hexadecahydrocyclopenta[a]chrysen-3-yl]pentan-1-ol Chemical compound C([C@]1(C)[C@H]2CC[C@H]34)CCC(C)(C)[C@@H]1CC[C@@]2(C)[C@]4(C)CC[C@@H]1[C@]3(C)CC[C@@H]1[C@@H](CCCO)C PLFFHJWXOGYWPR-HEDMGYOXSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- VKUPSMQYJAUGOR-UHFFFAOYSA-N 1-(4-chlorophenyl)-N-(oxomethylidene)methanesulfonamide Chemical compound ClC1=CC=C(CS(=O)(=O)N=C=O)C=C1 VKUPSMQYJAUGOR-UHFFFAOYSA-N 0.000 description 1
- FODWCZHFEVTTCL-UHFFFAOYSA-N 1-(isocyanatomethylsulfonyl)-2-methylbenzene Chemical compound CC1=CC=CC=C1S(=O)(=O)CN=C=O FODWCZHFEVTTCL-UHFFFAOYSA-N 0.000 description 1
- IAYSDKUKIIYRRA-UHFFFAOYSA-N 1-(isocyanatomethylsulfonyl)-4-methylbenzene Chemical compound CC1=CC=C(S(=O)(=O)CN=C=O)C=C1 IAYSDKUKIIYRRA-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- FODCFYIWOJIZQL-UHFFFAOYSA-N 1-methylsulfanyl-3,5-bis(trifluoromethyl)benzene Chemical compound CSC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 FODCFYIWOJIZQL-UHFFFAOYSA-N 0.000 description 1
- YUMDBRZXSGRYPR-UHFFFAOYSA-N 10-methylthianthren-10-ium 5-oxide Chemical compound C1=CC=C2[S+](C)C3=CC=CC=C3S(=O)C2=C1 YUMDBRZXSGRYPR-UHFFFAOYSA-N 0.000 description 1
- NZZATTKZXCPGIL-UHFFFAOYSA-N 10-phenylthioxanthen-10-ium-9-one Chemical compound C12=CC=CC=C2C(=O)C2=CC=CC=C2[S+]1C1=CC=CC=C1 NZZATTKZXCPGIL-UHFFFAOYSA-N 0.000 description 1
- VUBUXALTYMBEQO-UHFFFAOYSA-N 2,2,3,3,3-pentafluoro-1-phenylpropan-1-one Chemical compound FC(F)(F)C(F)(F)C(=O)C1=CC=CC=C1 VUBUXALTYMBEQO-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- HEBTZZBBPUFAFE-UHFFFAOYSA-N 2-methyl-n-(oxomethylidene)benzenesulfonamide Chemical compound CC1=CC=CC=C1S(=O)(=O)N=C=O HEBTZZBBPUFAFE-UHFFFAOYSA-N 0.000 description 1
- VAYMIYBJLRRIFR-UHFFFAOYSA-N 2-tolyl isocyanate Chemical compound CC1=CC=CC=C1N=C=O VAYMIYBJLRRIFR-UHFFFAOYSA-N 0.000 description 1
- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical class CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- VLJQDHDVZJXNQL-UHFFFAOYSA-N 4-methyl-n-(oxomethylidene)benzenesulfonamide Chemical compound CC1=CC=C(S(=O)(=O)N=C=O)C=C1 VLJQDHDVZJXNQL-UHFFFAOYSA-N 0.000 description 1
- MGYGFNQQGAQEON-UHFFFAOYSA-N 4-tolyl isocyanate Chemical compound CC1=CC=C(N=C=O)C=C1 MGYGFNQQGAQEON-UHFFFAOYSA-N 0.000 description 1
- XVMSFILGAMDHEY-UHFFFAOYSA-N 6-(4-aminophenyl)sulfonylpyridin-3-amine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=N1 XVMSFILGAMDHEY-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000004775 Tyvek Substances 0.000 description 1
- 229920000690 Tyvek Polymers 0.000 description 1
- HFKJQIJFRMRSKM-UHFFFAOYSA-N [3,5-bis(trifluoromethyl)phenoxy]boronic acid Chemical compound OB(O)OC1=CC(C(F)(F)F)=CC(C(F)(F)F)=C1 HFKJQIJFRMRSKM-UHFFFAOYSA-N 0.000 description 1
- GKAZFNXELDRFNU-UHFFFAOYSA-N [O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 Chemical compound [O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.[O-]B([O-])F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 GKAZFNXELDRFNU-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- YCZWJBIXAUQULS-UHFFFAOYSA-M bis(4-methylphenyl)iodanium;bromide Chemical compound [Br-].C1=CC(C)=CC=C1[I+]C1=CC=C(C)C=C1 YCZWJBIXAUQULS-UHFFFAOYSA-M 0.000 description 1
- DNFSNYQTQMVTOK-UHFFFAOYSA-N bis(4-tert-butylphenyl)iodanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 DNFSNYQTQMVTOK-UHFFFAOYSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229920005605 branched copolymer Polymers 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical class [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000012955 diaryliodonium Substances 0.000 description 1
- 125000005520 diaryliodonium group Chemical group 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- BCQKUSCWNFMCKI-UHFFFAOYSA-M diphenyliodanium;hydrogen sulfate Chemical compound OS([O-])(=O)=O.C=1C=CC=CC=1[I+]C1=CC=CC=C1 BCQKUSCWNFMCKI-UHFFFAOYSA-M 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- BJMDYNHSWAKAMX-UHFFFAOYSA-N methyl(diphenyl)sulfanium Chemical compound C=1C=CC=CC=1[S+](C)C1=CC=CC=C1 BJMDYNHSWAKAMX-UHFFFAOYSA-N 0.000 description 1
- GJRXIEIMPVZSIR-UHFFFAOYSA-N n-(oxomethylidene)-1-phenylmethanesulfonamide Chemical compound O=C=NS(=O)(=O)CC1=CC=CC=C1 GJRXIEIMPVZSIR-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 125000000963 oxybis(methylene) group Chemical group [H]C([H])(*)OC([H])([H])* 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- BUXTXUBQAKIQKS-UHFFFAOYSA-N sulfuryl diisocyanate Chemical class O=C=NS(=O)(=O)N=C=O BUXTXUBQAKIQKS-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001757 thermogravimetry curve Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- AEXDMFVPDVVSQJ-UHFFFAOYSA-N trifluoro(trifluoromethylsulfonyl)methane Chemical compound FC(F)(F)S(=O)(=O)C(F)(F)F AEXDMFVPDVVSQJ-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- DCDZBASUOMHACN-UHFFFAOYSA-N tris(2-dodecylphenyl)sulfanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[S+](C=1C(=CC=CC=1)CCCCCCCCCCCC)C1=CC=CC=C1CCCCCCCCCCCC DCDZBASUOMHACN-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Definitions
- Uncrosslinked polyepoxide and adhesive composition comprising this polyepoxide
- the invention relates to a polyepoxide for use in reactive adhesives, a corresponding curable adhesive and an adhesive tape comprising such a curable adhesive. Also disclosed are a method for producing a corresponding polyepoxide and the use of a corresponding adhesive tape for bonding two or more components.
- Joining separate elements is one of the central processes in manufacturing technology.
- bonding i.e. joining using an adhesive
- pressure-sensitive adhesive tapes in particular are known in which a pressure-sensitive adhesive ensures the adhesive effect, which is permanently sticky and adhesive under normal environmental conditions.
- Corresponding pressure-sensitive adhesive tapes can be applied to a substrate by pressure and remain stuck there, but can later be removed more or less without leaving any residue.
- curable adhesive tapes which are sometimes also referred to as reactive adhesive tapes
- a curable adhesive or reactive adhesive is used.
- Corresponding curable adhesives have not yet reached their maximum degree of crosslinking in the state intended for application and can be cured by external influences, for example by polymerization in the curable adhesive initiated and thereby the degree of networking is increased. This changes the mechanical properties of the now hardened adhesive, with the viscosity, surface hardness and strength in particular increasing.
- the curability of corresponding curable adhesives is regularly achieved through the use of polymerizable compounds, in particular crosslinkable monomers, oligomers or polymers.
- epoxides which are sometimes also referred to as epoxy resins, with many of the epoxy compounds used on an industrial scale today being obtained by reacting mono- or dialcohols with epichlorohydrin.
- the primary object of the present invention was to eliminate or at least reduce the disadvantages of the prior art described above.
- the epoxy compounds to be specified should have excellent processability in the production of reactive adhesives.
- the epoxy compounds to be specified should have excellent reactivity in crosslinking reactions, it being a particular object of the present invention that the reactivity should be particularly precisely controllable and adaptable to the respective application requirements.
- polyepoxides which are produced by co-polymerization of a specific class of cycloaliphatic monoepoxy-functional monomers with specific cycloaliphatic monoepoxy-functional monomers which comprise reactive functional groups which are not are epoxy groups, and/or with specific cycloaliphatic multiepoxy-functional monomers, as defined in the claims.
- the reactivity of the polyepoxides in the later crosslinking can be advantageously controlled by the cycloaliphatic epoxy-functional monomers with the reactive functional groups.
- the use of cycloaliphatic monoepoxy-functional monomers, which include reactive functional groups that are not epoxy groups allows the particularly controlled introduction of reactive groups into the polyepoxides, which are available for later chemical crosslinking, without this when polymerizing the epoxy monomers can lead to undesired crosslinking, which in particular also makes high concentrations of reactive groups in the polyepoxide accessible, which, depending on the design, can be controlled precisely via the curing mechanism selected for the curable adhesive, for example in the course of further crosslinking of the adhesive in the adhesive tape and/or during later curing in the end application.
- a chemical bond to the substrate can also be made possible via the reactive groups in the later adhesive application.
- the invention relates to a polyepoxide for use in reactive adhesives, wherein the polyepoxide can be produced by polymerizing a monomer composition comprising, based on the mass of the monomer composition: i) one or more first monomers in a combined mass fraction of 50% or more, the first monomers are selected from the group consisting of cycloaliphatic monoepoxy-functional monomers of the formula (I), where R represents a linear or branched alkyl group with 1 to 30 carbon atoms, and ii) one or more second monomers in a combined mass fraction of 1% or more , wherein the second monomers are selected from the group consisting of cycloaliphatic monoepoxy-functional monomers of the formula (I), where R represents a linear or branched organic radical with 1 to 30 carbon atoms, which comprises at least one reactive functional group, and / or iii) one or more third monomers in a combined mass fraction of
- the third monomers being selected from the group consisting of multiepoxy-functional monomers of the formula (I), where R represents a linear or branched organic radical with 2 to 30 carbon atoms which comprises at least one epoxy group, where formula (I): corresponds.
- the polyepoxides according to the invention are copolymers which are or can be produced by polymerization from a specific monomer composition.
- the producibility is stated in relation to the monomer composition, which, in accordance with the expert understanding, includes all monomeric components which are converted into monomer units of the polyepoxide in the course of the polymerization. Accordingly, other components that may be present in the reaction mixture during polymerization but are not incorporated into the polyepoxide during polymerization, such as solvents, catalysts or initiators, are not included in the monomer composition.
- the components of the monomer composition defined above are each used as “one or more” in accordance with the understanding of those skilled in the art.
- the expression “one or more” refers to: As is customary in the industry, it refers to the chemical nature of the corresponding monomers and not to their amount of substance.
- the monomer composition may exclusively comprise methyl 3,4-epoxycyclohexylcarboxylate as the first monomer, which would mean that the monomer composition comprises a large number of the corresponding molecules.
- the mass proportions of the components in the monomer composition are given as combined mass proportions of the one or more monomers, which expresses that the mass proportion of the correspondingly formed monomers taken together meets the corresponding criteria, with the mass of the monomer composition forming the reference system.
- the person skilled in the art adjusts the polymerization process used for polymerization to the monomers present in the monomer composition, ie in particular to the available functional groups, and the desired structure of the polyepoxide.
- the polymerization will essentially in all cases include a cationic polymerization at least in one substep, since this is particularly suitable for the polymerization of epoxy compounds.
- Processes for cationic polymerization in which the active center of chain propagation is formed by a cation, are well known to those skilled in the art based on their general specialist knowledge and are among the established processes in the field of epoxy compounds. Preferred embodiments of cationic polymerization are disclosed below.
- the production can also include further polymerization steps using other polymerization processes.
- these alternative polymerization processes will generally only make a small contribution in view of the high epoxide concentrations, so that polyepoxides according to the invention are preferred, which can essentially only be produced using cationic polymerization.
- the polyepoxides are suitable for use in reactive adhesives, ie as a reactive component of the reactive adhesives, implies to the person skilled in the art that they are uncrosslinked polyepoxides, which can be further crosslinked in a reactive adhesive and physically have chemical properties that enable them to be used in reactive adhesives, especially with regard to solubility in common solvents.
- Crosslinked polyepoxides in which the polymerization has led to the formation of a network and which therefore represent essentially insoluble, mostly thermoset materials in most solvents, do not meet this suitability.
- uncrosslinked refers to chemical crosslinking, i.e. the covalent connection of individual copolymer strands to one another to form a network and not to any physical crosslinking of the copolymer chains, for example through entanglement, phase separation or crystallization .
- an uncrosslinked polyepoxide does not necessarily have to be linear, but can also have copolymer chains with branches, which can be the case in particular when the monomer composition comprises third monomers. Even if the transition from branched co-polymer chains to the network of a cross-linked polyepoxide may seem unclear in theory, the uncross-linked state or suitability for use in reactive adhesives can be determined relatively easily in practice by the person skilled in the art, whereby the A person skilled in the art can determine this, for example, based on the rheological properties or their temperature dependence or with a simple solubility test.
- properties of the polyepoxides according to the invention can be specified in which the suitability for use in reactive adhesives or the “uncrosslinked” property is present in any case, based on the crosslinking state. These are stated below and refer to the properties of solubility or gel content as well as to the weight-average molecular weights. Conversely, in these cases it is also preferred to produce the polyepoxides according to the invention in this form because of their good suitability for use in reactive adhesives.
- a polyepoxide according to the invention preference is initially given to a polyepoxide according to the invention, the polyepoxide being soluble at 23 ° C in one or more solvents selected from the group consisting of acetone, methyl ethyl ketone, gasoline, toluene, ethanol, isopropanol, ethyl acetate and diethyl ether.
- a polyepoxide according to the invention is also preferred, the polyepoxide having a mass-related gel content of 10% or less, preferably 5% or less.
- the mass-related gel content is defined as the ratio of the proportion of the polymer that is not soluble in toluene, acetone or methyl ethyl ketone, preferably not in toluene, at room temperature to the total mass of the polymer.
- the carefully dried, solvent-free polymer samples are sealed in a fleece bag made of polyethylene (Tyvek fleece).
- the weight fraction of the polymer that is not soluble in the solvent is determined from the difference in the sample weights before the extraction and after a 72-hour extraction through the solvent, i.e. through toluene, acetone or methyl ethyl ketone, preferably through toluene, at 23 °C.
- the extractant is renewed after 24 hours and after 48 hours.
- the sample mass remaining in the bag results in the gel content based on the mass of the polymer, which is also referred to as the gel value.
- the value is given as the mean value of a triplicate determination in %.
- a polyepoxide according to the invention is also preferred, the co-polymer chains in the polyepoxide having a maximum molecular weight (GPC) of 10 7 g/mol or less, preferably of 10 6 g/mol or less.
- GPC maximum molecular weight
- a polyepoxide according to the invention wherein the polyepoxide has a weight-average molecular weight M w (GPC) of 500,000 g/mol or less, preferably 250,000 g/mol or less, particularly preferably 125,000 g/mol or less, very particularly preferably 50,000 g / mol or less, and / or wherein the polyepoxide has a weight average molecular weight M w (GPC) in the range from 1000 to 300,000 g / mol, preferably in the range from 2000 to 200,000 g/mol, particularly preferably in the range from 3000 to 100,000 g/mol, with ranges from 1000 to 10,000 g/mol or alternatively from 10,000 to 100,000 g/mol being particularly preferred.
- M w weight-average molecular weight M w
- the information about the weight-average molecular weight M w refers to the determination using gel permeation chromatography (GPC).
- the determination is carried out with degassed THF as mobile phase, 100 pL injection volume and a sample concentration of 1 g/L at a flow rate of 0.5 mL/min at 25 °C on a system consisting of a PSS-SECcurity 1260 HPLC pump PSS SDV 10 pm ID 8 mm x 50 mm guard column, a PSS SDV 10 pm 10 3 ⁇ ID 8 mm x 300 mm, a PSS SDV 10 pm 10 5 ⁇ ID 8 mm x 300 mm, a PSS SDV 10 pm 10 7 ⁇ ID 8 mm x 300 mm and a SECcurity differential refractometer (RI) detector.
- RI SECcurity differential refractometer
- the data is recorded and evaluated using the software PSS - WinGPC UniChrome Version 8.33.
- the calibration is carried out using polystyrene standards, which are universally converted into a poly(methyl methacrylate) calibration using the Mark Houwink coefficients K and a.
- a polyepoxide according to the invention is preferred, the polyepoxide being a thermoplastic solid at 25 ° C and 100 kPa pressure.
- epoxy compounds are those compounds which carry at least one oxirane group.
- the monomers to be used as the first, second and third monomers are each cycloaliphatic, which means that their structure includes at least one ring system, but no aromatic ring system.
- the monomers to be used as first, second and third monomers each have the same basic structure, which is described by formula (I): However, they differ with regard to the respective residue R.
- the first monomers have no reactive functional groups in the radical R, i.e. neither epoxy groups nor other reactive functional groups. Rather, in the case of the first monomers, the radical R is an alkyl group, which can be linear or branched in the usual way, with linear radicals being more preferred. According to the inventors' assessment, it is in particular the large mass fraction of these monoepoxy-functional monomers, which do not have any reactive functional groups in the radical R, which enables the advantageous properties of the polyepoxides according to the invention and through which the result is uncrosslinked and particularly suitable for use in reactive adhesives Polyepoxides are made possible.
- the inventors have succeeded in specifying particularly preferred embodiments for the first monomers, with which, starting from the cycloaliphatic monoepoxy-functional monomers of the formula (I) to be used according to the invention, in which R represents a linear or branched, preferably linear, alkyl group with 1 to 30 C atoms, according to the inventors' assessment, particularly advantageous polyepoxides according to the invention can be obtained.
- the first monomers being selected from the group consisting of cycloaliphatic monoepoxy-functional monomers of the formula (I), where R is a linear or branched, preferably linear, alkyl group with 1 to 20 carbon atoms, preferably with 1 to 10 carbon atoms, particularly preferably with 1 to 5 carbon atoms, where R particularly preferably represents a methyl, ethyl or propyl group.
- a polyepoxide according to the invention where the first monomer is 3,4-epoxycyclohexylcarboxylic acid methyl ester, and/or where the monomer composition comprises 3,4-epoxycyclohexylcarboxylic acid methyl ester, preferably in a mass fraction of 50% or more, particularly preferably of 70% or more, especially preferably 90% or more, based on the combined mass fraction of the first monomers.
- the second monomers are also monoepoxy-functional monomers, but, in contrast to the first monomers, have at least one reactive functional group in the radical R.
- reactive functional group is clear to the person skilled in the art, who also understands that this reactive functional group in a monoepoxy-functional monomer according to formula (I) cannot itself be an epoxy group, since formula (I) is already an epoxy group having.
- the inventors have also succeeded in specifying particularly preferred embodiments for the second monomers, which, in the inventors' opinion, are based on the cycloaliphatic monoepoxy-functional monomers of the formula (I), in which R represents a linear or branched, preferably linear, organic radical 1 to 30 carbon atoms, which comprises at least one reactive functional group, can be used to obtain particularly advantageous polyepoxides according to the invention and which are particularly suitable for targeted subsequent crosslinking via the corresponding functional groups.
- R represents a linear or branched, preferably linear, organic radical 1 to 30 carbon atoms, which comprises at least one reactive functional group
- the second monomers being selected from the group consisting of cycloaliphatic monoepoxy-functional monomers of the formula (I), where R is a linear or branched, preferably branched, organic radical with 2 to 20 carbon atoms with 3 to 10 carbon atoms, which includes at least one reactive functional group.
- a polyepoxide according to the invention where the second monomer is ((3,4-epoxycyclohexyl)methyl) methacrylate, and/or where the monomer composition comprises ((3,4-epoxycyclohexyl)methyl) methacrylate, preferably in a mass fraction of 50 % or more, particularly preferably 70% or more, very particularly preferably 90% or more, based on the combined mass fraction of the second monomers.
- the second monomers In view of a pronounced crosslinkability, in the opinion of the inventors, it is possible to design the second monomers with several reactive functional groups, which can be the same or different, depending on whether a different reactivity in the side chains is desired or not.
- a polyepoxide according to the invention is therefore preferred, wherein the second monomers comprise two or more reactive functional groups, in particular similar reactive functional groups.
- the subsequent crosslinkability of the polyepoxides according to the invention can also be made possible by the third monomers, which, in contrast to the second monomers, comprise at least one epoxy group in the radical R and are therefore multiepoxy-functional monomers.
- the third monomers being selected from the group consisting of multiepoxy-functional monomers of the formula (I), where R is a linear or branched, preferably branched, substituted organic radical with 3 to 25 C atoms, preferably with 4 to 20 C atoms, particularly preferably with 6 to 15 carbon atoms, which comprises at least one epoxy group.
- a polyepoxide according to the invention is preferred, where the epoxy group is an epoxy group or an oxetane group, preferably an epoxy group and/or wherein the third monomers are selected from the group consisting of bis-epoxy-functional monomers.
- radical R of the third monomers can theoretically also comprise further reactive functional groups, such as those disclosed above for the second monomers, it is preferred if the third monomers in the radical R do not contain any further reactive functional groups apart from one or more epoxy groups include groups.
- a polyepoxide according to the invention where the third monomer is a bis-epoxycyclohexyl derivative, preferably ((3,4-epoxycyclohexyl)methyl-3,4-epoxycyclohexylcarboxylate, and/or where the monomer composition is a bis-epoxycyclohexyl derivative, preferably 3,4-epoxycyclohexyl)methyl-3,4-epoxycyclohexylcarboxylate, preferably in a mass fraction of 50% or more, particularly preferably of 70% or more, very particularly preferably of 90% or more, based on the combined mass fraction of third monomers.
- the term “monomers” is to be understood broadly and primarily serves to clearly differentiate the starting compounds from the copolymer of the polyepoxide. The term expresses that the monomers should be incorporated into the copolymer. The person skilled in the art understands that the term “monomers” also includes low molecular weight compounds that could be viewed as oligomers of one or more of the monomers.
- this is expedient because oligomerization can occur unnoticed and the resulting oligomers in the sense of the above definition can be produced from the corresponding monomers anyway, so that the presence of oligomers, so to speak as an intermediate stage, has no influence the producibility of the polyepoxides according to the invention from the monomer composition would have.
- preference is given to a polyepoxide according to the invention, wherein the first monomers and/or the second monomers, preferably the first monomers and the second monomers, have a molar mass in the range from 75 to 1000 g/mol, preferably in the range from 100 to 500 g/mol.
- the molar mass is particularly preferably in the range from 100 to 200 g/mol or in the range from 200 to 350 g/mol or in the range from 350 to 500 g/mol.
- the third monomers having a molecular weight in the range from 75 to 1000 g/mol, preferably in the range from 150 to 500 g/mol, with the molecular weight particularly preferably in the range from 150 to 250 g/mol or in the range of 250 to 350 g/mol or in the range of 350 to 500 g/mol.
- the high minimum proportion of first monomers and the specific basic structure of the cycloaliphatic epoxy-functional monomers according to formula (I) in particular open up the possibility of obtaining advantageous, uncrosslinked polyepoxides.
- the physicochemical properties of the polyepoxides according to the invention can advantageously be precisely adapted to the respective requirements and the desired crosslinking behavior by varying the mass ratios in the monomer composition, with the proportion of reactive side chains with epoxy groups or other reactive functional groups being increased as required can.
- the monomer composition comprises at least small amounts of second monomers, and in particular the combination of second and third monomers is particularly favorable in the opinion of the inventors, since in this case If non-epoxy functionalities are present in the polyepoxide, branching can be achieved via the third monomers, through which the rheological properties of the polyepoxides according to the invention can be optimized.
- the inventors have succeeded in specifying mass ratios and mass proportions of the various monomers with which, in the inventors' opinion, particularly high-performance polyepoxides according to the invention can be obtained.
- preferred ranges could be identified for the mass proportions of the respective monomers.
- Preferred is a polyepoxide according to the invention, the combined mass fraction of the first monomers being 70% or more, preferably 80% or more, particularly preferably 90% or more, very particularly preferably 95% or more, based on the mass of the monomer composition.
- a polyepoxide according to the invention the combined mass fraction of the first monomers being in the range from 50 to 99%, preferably in the range from 55 to 98%, particularly preferably in the range from 60 to 95%, very particularly preferably in the range from 65 to 90 %, based on the mass of the monomer composition.
- the combined mass fraction of the first monomers being in the range from 70 to 80% or in the range from 80 to 90% or in the range from 90 to 95%, based on the mass of the monomer composition.
- the second monomers preference is given to a polyepoxide according to the invention, the combined mass fraction of the second monomers being 2% or more, preferably 5% or more, particularly preferably 10% or more, based on the mass of the monomer composition.
- a polyepoxide according to the invention is also preferred, the combined mass fraction of the second monomers being in the range from 1 to 40%, preferably in the range from 2 to 30%, particularly preferably in the range from 5 to 20%, based on the mass of the monomer composition .
- the combined mass fraction of the third monomers being in the range from 1 to 10% or in the range from 10 to 35% or in the range from 35 to 49%, based on the mass of the monomer composition.
- the monomer composition comprising second monomers and third monomers, preferably in a mass ratio in the range from 10:1 to 1:10, particularly preferably in a mass ratio in the range from 5:1 to 1:5 , quite particularly preferably in a mass ratio in the range from 2:1 to 1:2.
- a polyepoxide according to the invention is, additionally or alternatively, a polyepoxide according to the invention, the combined mass fraction of the second monomers and the third monomers being 2% or more, preferably 4% or more, particularly preferably 10% or more, based on the mass of the monomer composition, and /or wherein the combined mass fraction of the second monomers and the third monomers is in the range from 2 to 40%, preferably in the range from 4 to 30%, particularly preferably in the range from 10 to 20%, based on the mass of the monomer composition.
- a polyepoxide according to the invention is preferred for various application scenarios, the combined mass fraction of the second monomers and the third monomers being in the range of 1 to 5% or in the range of 5 to 20% or in the range of 20 to 40%, since With these areas in the networking, networks of different densities can be obtained, with which the application properties can be tailored particularly well to the desired requirements, especially with regard to the pressure-sensitive tack and performance as a structural adhesive.
- the monomer composition comprising second monomers and third monomers, preferably in a mass ratio in the range from 10:1 to 1:10, particularly preferably in a mass ratio in the range from 5:1 to 1:5 , most preferably in a mass ratio in the range from 2:1 to 1:2.
- a polyepoxide according to the invention is, additionally or alternatively, a polyepoxide according to the invention, the combined mass fraction of the second monomers and the third monomers being 2% or more, preferably 4% or more, particularly preferably 10% or more, based on the mass of the monomer composition, and /or wherein the combined mass fraction of the second monomers and the third monomers is in the range from 2 to 40%, preferably in the range from 4 to 30%, particularly preferably in the range from 10 to 20%, based on the mass of the monomer composition.
- polyepoxides according to the invention are also preferred in which the presence of second monomers or of third monomers is mandatory. Based on this, polyepoxides according to the invention are preferred in which first monomers in the monomer composition are predominantly, preferably exclusively, combined with second monomers or third monomers, and/or where the monomer composition does not comprise any third monomers or any second monomers.
- a polyepoxide according to the invention the monomer composition comprising first monomers and second monomers, preferably in a mass ratio in the range from 1:1 to 99:1, particularly preferably in a mass ratio in the range from 1.5:1 to 49: 1, most preferably in a mass ratio in the range from 2.5:1 to 9:1.
- a polyepoxide according to the invention is preferred, the monomer composition comprising first monomers and third monomers, preferably in a mass ratio in the range from 1:1 to 99:1, particularly preferably in a mass ratio in the range from 1.5:1 to 49 :1, most preferably in a mass ratio in the range from 2.5:1 to 9:1.
- a polyepoxide according to the invention is therefore preferred, the combined mass fraction of the first monomers, the second monomers and the third monomers being 80% or more, preferably 90% or more, particularly preferably 95% or more, based on the mass of the monomer composition, and /or wherein the combined mass fraction of the first monomers, the second monomers and the third monomers is in the range from 60 to 99%, preferably in the range from 65 to 98%, particularly preferably in the range from 70 to 95%, based on the mass of Monomer composition
- the monomer composition can also include other monomers, which can be particularly advantageous for adjusting the physicochemical properties.
- the monomer composition comprises one or more further monomers, preferably in a combined mass fraction of 2% or more, particularly preferably 5% or more, very particularly preferably 10% or more, based on the mass of the monomer composition, and/or preferably in a combined mass fraction in the range from 1 to 45%, preferably in the range from 2 to 40%, particularly preferably in the range from 5 to 35%, based on the mass of the monomer composition.
- the use of diepoxy-functional monomers which are not third monomers, is initially preferred.
- the monomer composition comprising at least one diepoxy-functional monomer, which is selected from the group consisting of bis-epoxy monomers based on bisphenol-A, bisphenol-S or bisphenol-F, in particular bisphenol-A diglycidyl ether, bisphenol -S-diglycidyl ether and bisphenol-F-diglycidyl ether.
- the polyepoxide contains at least one oxetane monomer, in particular multifunctional oxetane monomers, as a further monomer, since the resulting “spacer” between the ether groups is Polyepoxide precipitates longer.
- the monomer composition comprises at least one oxetane monomer, preferably a multiepoxy-functional oxetane monomer, wherein the oxetane monomer is preferably not a third monomer, the oxetane monomer being particularly preferably selected from the group consisting of (3-ethyloxetan-3-yl)methanol and 3,3'-[oxybis(methylene)]bis(3-ethyloxetanes), whereby the combined mass fraction of all oxetane monomers that are not third Monomers, preferably in the range from 10 to 40%, particularly preferably in the range from 10 to 20% or in the range from 20 to 30 or in the range from 30 to 40%, based on the mass of the monomer composition.
- the oxetane monomer includes, in addition to the one or more epoxy groups, also one or more further reactive functional groups, preferably
- the monomer composition comprises at least one vinyl ether monomer, wherein the vinyl ether monomer is preferably not a second monomer or third monomer, the combined mass fraction of all vinyl ether monomers which are not are second monomers or third monomers, preferably in the range from 10 to 40%, particularly preferably in the range from 10 to 20% or in the range from 20 to 30 or in the range from 30 to 40%, based on the mass of the monomer composition , and/or wherein the vinyl ether monomer has a molecular weight in the range from 60 to 1000 g/mol, preferably in the range from 80 to 500 g/mol, with the molecular weight particularly preferably in the range from 80 to 200 g/mol or in Range from 200 to 350 g/mol or in the range from 350 to 500 g/mol.
- a polyepoxide according to the invention is explicitly preferred, whereby the polyepoxide can be produced by polymerizing the monomer composition, which is initiated by a cationic initiator, the cationic initiator preferably being used in a molar fraction in the range from 0.005 to 1% is based on the number of epoxy groups in the monomer composition. Additionally or alternatively, a polyepoxide according to the invention is preferred, with the cationic initiator preferably being supplied gradually or continuously.
- the initiator is first dissolved in at least one solvent and the resulting initiator solution is metered into the monomer composition and, if appropriate, the solvent contained therein.
- Organic polar aprotic solvents such as acetone, methyl ethyl ketone, diethyl ketone, dimethyl sulfoxide, N,N-dimethylformamide and acetonitrile are preferred for dissolving the initiator, with acetone and methyl ethyl ketone being particularly preferred.
- Cationic initiators are fundamentally familiar to those skilled in the art from the prior art.
- the polyepoxides according to the invention can be produced particularly advantageously if the cationic initiator is selected from the group consisting of cationic photoinitiators and cationic thermal initiators, with latent, thermally activatable cationic initiators (TAG; so-called “thermal acid generator”) being particularly preferred.
- TAG thermally activatable cationic initiators
- TAGs are known to those skilled in the art and are commercially available from numerous providers. Preferred are TAG which comprise a cation selected from the group consisting of 4-substituted benzylanilinium, 4-substituted benzylpyridinium, 4-substituted benzylphosphonium, S- substituted diphenylsulfonium and substituted aryl-benzylsulfonium, preferably 4-substituted benzylanilinium.
- the TAG can in principle contain any anion, with weakly coordinating anions such as tetrafluoroborate (BF4), hexafluorophosphate (PFe), hexafluoroantimonate (SbF 6 ), tetrakis(pentafluorophenyl) borate (B(C6F 5 )4-) and trifluoromethyl sulfonate (F3CSO3) being preferred are. Trifluoromethylsulfonate (F3CSO3) and hexafluorantimonate (SbF 6 ) are particularly preferred.
- weakly coordinating anions such as tetrafluoroborate (BF4), hexafluorophosphate (PFe), hexafluoroantimonate (SbF 6 ), tetrakis(pentafluorophenyl) borate (B(C6F 5 )4-) and trifluoromethyl sulfonate (F3CSO3) being
- Combinations of a TAG made of cation and anion in which the resulting initiator has an activation temperature in the range from 50 ° C to 150 ° C are advantageous, with the person skilled in the art preferably adjusting the activation energy to the respective application requirements, in particular a range of 80 ° C up to 120 ° C is preferred in many cases in order to be able to carry out the polymerization at a comparatively moderate activation temperature and still enable a clearly defined initiation.
- the activation temperature of reactive or chemically activated adhesives in general or of the TAG used is determined calorimetrically using Differential Scanning Calorimetry (DSC) according to DIN EN ISO 11357-3:2013-04.
- Sulfonium, iodonium and metallocene-based systems which are commercially available from a variety of suppliers, can be used as initiators for cationic UV-induced curing of epoxy compounds.
- sulfonium based cations see Statements referenced in US 6,908,722 B1.
- anions that serve as counterions for the above-mentioned cations are tetrafluoroborate, tetraphenyl borate, hexafluorophosphate, perchlorate, tetrachloroferrate, hexafluoroarsenate, hexafluoroantimonate, pentafluorohydroxyantimonate, hexachloroantimonate, tetrakispentafluorophenyl borate, tetrakis (pentafluoromethylphenyl) borate, bi (trifluoromethyl sulfone). yl )-amides and tris-(trifluoromethylsulfonyl)-methides.
- chloride, bromide or iodide are also conceivable as anions, particularly for iodonium-based initiators, although initiators that are essentially free of chlorine and bromine are preferred.
- iodonium-based initiators particularly for iodonium-based initiators, although initiators that are essentially free of chlorine and bromine are preferred.
- a powerful example of such a system is triphenylsulfonium hexafluoroantimonate.
- Other suitable initiators are, for example, in US 3,729,313 A, US 3,741,769 A, US 4,250,053 A, US 4,394,403 A, US 4,231,951 A, US 4,256,828 A, US 4,058,401 A, US 4,138,255 A and US 2010/06 3221 A1 disclosed.
- sulfonium salts that can be used are triphenylsulfonium hexafluoroarsenate, triphenylsulfonium hexafluoroborate, triphenylsulfonium tetrafluoroborate, triphenylsulfonium tetrakis (pentafluorobenzyl) borate, methyldiphenylsulfonium tetrafluoroborate, methyldiphenyl sulfonium tetrakis (pentafluorobenzyl) borate, Dimethylphenylsulfonium hexafluoro-phosphate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexa-fluoroantimonate, diphenylnaphthylsulfonium hexafluoroarsenate, T ritolyl - sulfon
- iodonium salts that can be used are diphenyliodonium tetrafluoroborate, di-(4-methylphenyl)-iodonium tetrafluoroborate, phenyl-4-methylphenyliodonium tetrafluoroborate, di-(4-chlorophenyl)-iodonium hexafluorophosphate, dinaphthyliodonium tetrafluoroborate, di-(4-trifluoromethyl-phenyl)- iodonium tetrafluoroborate, diphenyliodonium hexafluorophosphate, di-(4-methylphenyl)-iodonium hexafluorophosphate, diphenyliodonium hexafluoro-arsenate, di-(4-phenoxyphenyl)-iodonium tetrafluoroborate, phenyl-2-thienyl
- Photoinitiators are typically used individually or as a combination of two or more photoinitiators. When using photoinitiators, combinations with so-called sensitizers are very helpful for adapting the activation wavelength of the photoinitiation system to the selected emission spectrum, for the literature known to those skilled in the art, such as “Industrial Photoinitiators: A technical guide” 2010 by A.W. Green, is referred.
- activation by irradiation can occur initially, repeatedly or continuously.
- the initiator is not an electron-poor monoisocyanate, and accordingly preferably not selected from the group consisting of p-tolyl isocyanate, o-tolyl isocyanate and sulfonyl isocyanates, p-toluenesulfonylmethyl isocyanate, o-toluenesulfonylmethyl isocyanate, 4-chlorobenzylsulfonyl isocyanate, o-toluenesulfonyl isocyanate, p -Toluenesulfonyl isocyanate and benzylsulfonyl isocyanate.
- a polyepoxide according to the invention where the polyepoxide can be produced by polymerizing the monomer composition, which is carried out in a solvent. It is particularly preferred if the solvent is removed after the polyepoxide has been produced, since particularly pure polyepoxides are accessible in this way. In addition, for other applications it is preferred if the solvent remains in the polyepoxide after the polyepoxide has been produced, since the polyepoxides obtained in this way are particularly easy to handle and can easily be further processed, for example in adhesives or coating materials.
- the solvent is preferably selected from the group consisting of water, organic polar protic solvents, organic polar aprotic solvents and organic non-polar aprotic solvents and mixtures of these solvents, for example mixtures of different organic polar aprotic solvents with one another or mixtures of an organic non-polar aprotic solvent with one or more organic polar protic solvents, organic aprotic solvents being particularly preferred due to their chemical inertness.
- the solvent can in principle be used in any mixing ratio with the monomer composition, the initiator and optionally the other reactants, with an addition in a mass proportion of 5% or more (based on the mass of the resulting overall formulation). is preferred.
- the range from 5% to 40% is particularly preferred since the use of solvent can be kept low.
- the range from 70% to 95% is particularly preferred, since this results in solutions with a low polyepoxide content and thus keeps the risk of gelling low.
- the range from 40% to 70% is particularly preferred, as there is a good compromise between the amount of solvent and the risk of gelling.
- An important process variable for controlling the molecular weight of the polyepoxides is temperature.
- a polyepoxide according to the invention wherein the polyepoxide can be produced by polymerizing the monomer composition, which is carried out at a temperature in the range from 50 to 150 ° C, preferably in the range from 60 to 130 ° C, whereby the Polymerization of the monomer composition is particularly preferably carried out at a temperature in the range from 50 to 90 ° C or in the range between 90 and 120 ° C.
- the range from 50 to 90 °C is preferred because the reaction progress under these conditions is relatively slow and the reaction can be easily controlled, whereas the range between 90 and 120 °C is preferred because a balanced ratio of control and reaction rate is achieved .
- a preferred polymer structure can be derived from the above statements, in which the polymer comprises the monomer units derived from the respective monomers, whereby the above statements regarding the underlying monomers apply accordingly.
- the invention is therefore closely related to a polyepoxide for use in reactive adhesives, the polyepoxide being a copolymer with a large number of monomer units of the formula (II): is, wherein the polyepoxide comprises, based on the mass of the polyepoxide: ib) one or more first monomer units in which R represents a linear or branched alkyl group with 1 to 30 carbon atoms, in a combined mass fraction of 50% or more, and ii.b) one or more second monomer units in which R represents a linear or branched organic radical with 1 to 30 carbon atoms, which comprises at least one reactive functional group, where R does not comprise an epoxy group, in a combined mass fraction of 1% or more, and/or iii.b) one
- a process for producing a polyepoxide preferably a polyepoxide according to the invention, comprising:
- Process steps: a) Producing or providing a monomer composition comprising, based on the mass of the monomer composition: i) one or more first monomers in a combined mass fraction of 50% or more, the first monomers being selected from the group consisting of cycloaliphatic monoepoxy-functional monomers of the formula (I), where R represents a linear or branched alkyl group with 1 to 30 carbon atoms, and ii) one or more second monomers in a combined mass fraction of 1% or more, the second monomers being selected from the group consisting of cycloaliphatic monoepoxy-functional monomers of the formula (I), where R represents a linear or branched substituted organic radical with 1 to 30 carbon atoms, which comprises at least one reactive functional group, and / or iii) one or more third monomers in a combined one
- Mass fraction of 1% or more, the third monomers being selected from the group consisting of multiepoxy-functional monomers of the formula (I), where R represents a linear or branched substituted organic radical with 2 to 30 carbon atoms which has at least one epoxy Group comprises, where the formula (I): corresponds, and b) polymerizing the monomer composition to obtain the polyepoxide, preferably by means of cationic polymerization.
- the polymerization is ended by an additional step after a predetermined reaction time or when a desired epoxy monomer conversion is reached. This can be done, for example, by cooling, diluting or adding a stopper.
- a corresponding method wherein the polymerization in process step b) is slowed down or stopped after the start of the polymerization by one or more slowing measures, the slowing measure being selected from the group consisting of cooling, diluting and adding a stopper reagent, the slowing measure being preferred includes the addition of a stopper reagent, with the addition of a stopper reagent before cooling being particularly preferred.
- a stopper reagent or stopper is a substance or a mixture of substances that interacts with the reactive species of a polymerization through a chemical reaction and thus prevents further chain growth. This chemical interaction is usually based on the establishment of a chemical equilibrium, so that a certain amount of time can elapse from the time the stopper is added until the polymerization stops.
- a stopper is a substance or a mixture which ensures that no further epoxy monomer conversion can be observed no later than 30 minutes after mixing.
- the stopper reagent particularly preferably contains an organic or inorganic base such as sodium hydroxide, potassium hydroxide, ammonium hydroxide, potassium acetate, ammonium acetate, sodium acetate, pyridine, pyrrolidine, pyrrole, piperidine, indole, imidazole, pyrazole, imidazoline, (iso)quinoline, purine, Pyrimidine, 4-vinylpyridine or 4-ethylpyridine, with pyridine and 4-ethylpyridine being extremely preferred, and preferably a solvent.
- the addition of a gas as a stopper reagent is also preferred, as this can be distributed particularly quickly in the reaction mixture.
- the use of ammonia is particularly preferred.
- the polymerization in process step b) being carried out in such a way that an epoxy group conversion of 10% or more, preferably 30% or more, is achieved, the epoxy group conversion preferably being in the range is from 20 to 35%. If no third monomers are used whose second epoxy group is to be retained, there is even a corresponding process preferred, the polymerization in process step b) taking place in such a way that an epoxy group conversion of 50% or more, very particularly preferably 70% or more, particularly preferably 90% or more, is achieved, the epoxy group conversion preferably being in Range from 35 to 60% or in the range from 60 to 100%.
- a corresponding process is preferred, in which the polymerization of the monomer composition is initiated by a cationic initiator, the initiator preferably being used in a molar proportion in the range from 0.005 to 1%, based on the number of epoxy groups in the monomer composition, and /or wherein the initiator is preferably supplied gradually or continuously.
- a corresponding analogous process is therefore also preferred, wherein the polymerization of the monomer composition is initiated by a cationic thermal initiator or cationic photoinitiator, particularly preferably by a latently thermally activatable cationic initiator.
- a corresponding analogous process is also preferred, with the polymerization of the monomer composition being carried out in a solvent.
- a corresponding analogous process is therefore also preferred, with the polymerization of the monomer composition being carried out at a temperature in the range from 50 to 150 ° C, preferably in the range from 60 to 130 ° C, with the polymerization of the monomer composition particularly preferably at a temperature in the range from 50 to 90 °C or in the range between 90 and 120 °C.
- a corresponding process is also preferred, with the process being carried out as a semi-batch or fed-batch process.
- the process being carried out as a semi-batch or fed-batch process.
- a corresponding method is therefore preferred, additionally comprising the method step: c) partial crosslinking of the polyepoxides to increase the weight-average molecular weight Mw, the crosslinking being carried out at least partially, preferably predominantly, particularly preferably essentially completely, via that of second monomers and/or third monomers derived monomer units, preferably via the monomer units derived from second monomers.
- the invention also relates to a curable adhesive comprising the polyepoxide according to the invention.
- the curable adhesive according to the invention is curable. Due to the possibility of curing, the curable adhesive can function as a structural adhesive after curing.
- structural adhesives are adhesives that form adhesive bonds that can maintain a specified strength in a structure for a specified longer period of time (according to ASTM definition: “bonding agents used for transferring required loads between adherends exposed to service environments typical for the structure involved”). These are adhesives for chemically and physically highly stressable bonds which, when cured, contribute to the solidification of the adhesive tapes. In other words, it is a reactive adhesive.
- a pressure-sensitive adhesive is an adhesive that has pressure-sensitive adhesive properties, ie the property of forming a permanent bond to an adhesive base even under relatively weak pressure.
- Corresponding pressure-sensitive adhesive tapes can usually be removed from the adhesive base after use essentially without leaving any residue and are usually permanently self-adhesive even at room temperature, which means that they have a certain viscosity and stickiness to the touch, so that they wet the surface of a substrate even with slight pressure.
- a pressure-sensitive adhesive can be viewed as an extremely high-viscosity liquid with an elastic component, which therefore has characteristic viscoelastic properties that lead to the permanent inherent tack and pressure-sensitive adhesive ability described above. It is assumed that with corresponding pressure sensitive adhesives, mechanical deformation leads to both viscous flow processes and the build-up of elastic restoring forces. The proportionate viscous flow serves to achieve adhesion, while the proportionate elastic restoring forces are necessary in particular to achieve cohesion.
- the connections between rheology and pressure sensitive tack are known in the art and are described, for example, in “Satas, Handbook of Pressure Sensitive Adhesives Technology”, Third Edition, (1999), pages 153 to 203.
- an adhesive is preferably understood to be pressure-sensitively tacky and thus a pressure-sensitive adhesive if, at a temperature of 23 ° C in the deformation frequency range of 10 ° to 10 1 rad / sec, G 'and G "are each at least partially in the range of 10 3 to 10 7 Pa.
- initiators known to those skilled in the art can be used as initiators for the curable adhesives, in particular the use of those initiators which are disclosed above as being preferred with regard to the production of the polyepoxides is preferred.
- curable adhesives according to the invention that, in addition to the presence of the polyepoxides according to the invention, they are very flexible with regard to the use of typical additives, so that the physico-chemical properties can be further tailored to the requirements of the respective application.
- a curable adhesive according to the invention is therefore preferred, wherein the curable adhesive comprises one or more further additives, preferably in a combined mass proportion in the range from 0.1 to 50%, preferably in the range from 0.2 to 40%, based on the mass of Adhesive, and/or wherein the one or more further additives are preferably selected from the group consisting of adhesive resins, anti-aging agents, light stabilizers, UV absorbers, fillers and rheological additives.
- the invention also relates to an adhesive tape comprising the curable adhesive composition according to the invention.
- the adhesive tape according to the invention is a reactive adhesive tape and, in light of the above statements, is preferably a pressure-sensitive adhesive tape.
- An adhesive tape according to the invention is preferred, wherein the adhesive tape comprises a carrier layer or a separating layer on which the adhesive is arranged.
- An adhesive tape according to the invention is also preferred, wherein the adhesive tape comprises a cover layer which is arranged on the adhesive.
- an adhesive tape according to the invention for bonding two or more components.
- a preferred use is in which the curing takes place at least partially by reacting a reactive functional group of the polyepoxides according to the invention, which is not an epoxy group.
- Polyepoxides E1 to E6 were produced.
- a screw cap glass equipped with a magnetic stirring bar and rubber septum was charged with the respective initiator (0.017 - 0.400 mol%, see Table 1) and this was dissolved in acetone, so that a 5% solution was created.
- the monomer composition (ca. 5.0 g) and the solvent (ca. 5.0 g) were added, the jar was sealed and the reaction mixture was stirred for 5 min at room temperature.
- Initiator ended and cooled to room temperature.
- samples (0.40 mL each) were taken with a syringe through the septum both before the start of polymerization and at fixed intervals and mixed with a 6.25% solution of pyridine in ethanol (40 pL ) offset.
- the molecular weight distribution of the resulting polymer solution was determined using GPC. The determination was carried out with degassed THF as mobile phase, 100 pL injection volume and a sample concentration of 1 g/L at a flow rate of 0.5 mL/min at 25 °C on a system consisting of a PSS-SECcurity 1260 HPLC pump PSS SDV 10 pm ID 8 mm x 50 mm guard column, a PSS SDV 10 pm 10 3 ⁇ ID 8 mm x 300 mm, a PSS SDV 10 pm 10 5 ⁇ ID 8 mm x 300 mm, a PSS SDV 10 pm 10 7 ⁇ ID 8mm x 300mm and a SECcurity Differential Refractometer (RI) detector.
- RI SECcurity Differential Refractometer
- the epoxy conversion was determined using FTIR or NMR, depending on the substance observed.
- the shrinkage of the epoxy band in the IR spectrum was used to quantify the time-dependent epoxy monomer conversion.
- the integral ratio of the epoxy band (778 to 812 cm-1) and carbonyl band (1650 to 1800 cm-1) was formed.
- the integral ratio before the start of polymerization served as a reference for a conversion of 0%.
- the time-dependent epoxy monomer conversion U(t) could therefore be obtained from the following relationship: 100%
- the growth of the polyether band in the IR spectrum was used to quantify the time-dependent epoxy monomer conversion.
- the integral ratio of the polyether region (996 to 1115 cm -1 ) and carbonyl band (1660 to 1770 cm' 1 ) was formed.
- the time-dependent epoxy monomer conversion U(t) was determined using a correlation equation that was created by calibration with conversion determined by NMR spectroscopy:
- the Fourier transform infrared spectra were recorded on a Bruker Vertex 70 with a Platinum Diamond ATR unit in the spectral range from 4000 to 400 cm' 1 at a resolution of 2 cm' 1 .
- the OPUS software was used for evaluation.
- 1 H NMR spectra of samples dissolved in CDCh were performed on a Bruker AVI II (300 MHz) or Bruker AVII+ (500 MHz) recorded with 10 mm BBO / 5 mm BBFO probe head.
- the TopSpin software was used for the evaluation.
- the GPC results show that uncrosslinked polyepoxides according to the invention with advantageous molecular weights can be obtained, and in particular uncrosslinked polyepoxides according to the invention with high molecular weights (cf. Examples E4-E6) can also be obtained. These are particularly suitable for formulating reactive pressure-sensitive adhesives.
- the dissolved polyepoxides of Examples E4 to E6 were each formulated with 1,6-hexanediol diacrylate (HDDA) in a ratio of 90% by weight to 10% by weight, based on the solids content, spread out using methods known to those skilled in the art and dried.
- the films produced all showed advantageous pressure-sensitive adhesive properties.
- the person skilled in the art recognizes the advantageous properties of the polyepoxides according to the invention from the easy controllability of the properties via the number (proportion of monomer 2 and/or monomer 3, initiator concentration) and the type (selection of monomer 2 and/or monomer 3) of the crosslinking points along the polyepoxide polymer chain .
- the polyepoxides according to the invention are suitable for the construction of reactive pressure-sensitive adhesives can be used advantageously, since the polyepoxide according to the invention can first be used to formulate a pressure-sensitive adhesive, which can then be processed into a pressure-sensitive adhesive tape, which can be cured in a further step after application of the pressure-sensitive adhesive tape.
- epoxy adhesives according to the prior art are generally applied and cured in one step as a fluid formulation.
- Alternative approaches to epoxy-based pressure-sensitive adhesive tapes based on epoxy-functionalized novolaks or the polymerization of monomeric epoxy compounds or epoxy resins have the disadvantages explained above easily recognizable to those skilled in the art.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
Abstract
La présente invention concerne un polyépoxyde destiné à être utilisé dans des composés adhésifs réactifs, le polyépoxyde pouvant être produit par polymérisation d'une composition de monomères comprenant, sur la base de la masse de la composition de monomères : i) un ou plusieurs premiers monomères dans une proportion massique combinée d'au moins 50 %, les premiers monomères étant choisis dans le groupe constitué des monomères à fonction monoépoxyde cycloaliphatiques de formule (I), dans laquelle R est un groupe alkyle linéaire ou ramifié ayant de 1 à 30 atomes de C, et ii) un ou plusieurs deuxièmes monomères dans une proportion massique combinée d'au moins 1 %, les deuxièmes monomères étant choisis dans le groupe constitué des monomères à fonction monoépoxyde cycloaliphatiques de formule (I), dans laquelle R est un substituant organique linéaire ou ramifié d'au moins 1 %, les troisièmes monomères étant choisis dans le groupe constitué des monomères à fonction multiépoxyde de formule (I), dans laquelle R est un substituant organique linéaire ou ramifié ayant de 2 à 30 atomes de C qui comprend au moins un groupe époxyde, la formule correspondant à (I).
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DE102022117183.3 | 2022-07-11 | ||
DE102022117183.3A DE102022117183A1 (de) | 2022-07-11 | 2022-07-11 | Unvernetztes Polyepoxid und Klebemasse umfassend dieses Polyepoxid |
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WO2024012932A1 true WO2024012932A1 (fr) | 2024-01-18 |
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US3729313A (en) | 1971-12-06 | 1973-04-24 | Minnesota Mining & Mfg | Novel photosensitive systems comprising diaryliodonium compounds and their use |
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EP0542716B1 (fr) | 1982-11-22 | 1997-06-25 | Minnesota Mining And Manufacturing Company | Compositions polymérisables par apport d'énergie contenant des initiateurs organométalliques |
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WO2015189323A1 (fr) | 2014-06-11 | 2015-12-17 | Tesa Se | Polyester-polyuréthane |
EP3101047A1 (fr) | 2015-06-04 | 2016-12-07 | tesa SE | Procede de fabrication de sirop d'epoxyde visqueux et sirop d'epoxyde ainsi fabrique |
JP2021075673A (ja) * | 2018-11-30 | 2021-05-20 | 住友化学株式会社 | 光硬化性接着剤、偏光板および積層光学部材 |
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2022
- 2022-07-11 DE DE102022117183.3A patent/DE102022117183A1/de active Pending
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US3729313A (en) | 1971-12-06 | 1973-04-24 | Minnesota Mining & Mfg | Novel photosensitive systems comprising diaryliodonium compounds and their use |
US3741769A (en) | 1972-10-24 | 1973-06-26 | Minnesota Mining & Mfg | Novel photosensitive polymerizable systems and their use |
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WO2015189323A1 (fr) | 2014-06-11 | 2015-12-17 | Tesa Se | Polyester-polyuréthane |
EP3101047A1 (fr) | 2015-06-04 | 2016-12-07 | tesa SE | Procede de fabrication de sirop d'epoxyde visqueux et sirop d'epoxyde ainsi fabrique |
JP2021075673A (ja) * | 2018-11-30 | 2021-05-20 | 住友化学株式会社 | 光硬化性接着剤、偏光板および積層光学部材 |
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EDWARD PETRIE: "Epoxy Adhesive Formulations", 2005, MCGRAW-HILL PROFESSIONAL |
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