WO2024012324A1

WO2024012324A1 - Gluing apparatus and electronic product processing device

Info

Publication number: WO2024012324A1
Application number: PCT/CN2023/105878
Authority: WO
Inventors: 高天旭
Original assignee: 江苏立导科技有限公司
Priority date: 2022-07-12
Filing date: 2023-07-05
Publication date: 2024-01-18
Also published as: CN218902457U

Abstract

A gluing apparatus and an electronic product processing device comprising the gluing apparatus. The gluing apparatus comprises a carrying mechanism (2) and a gluing mechanism (3) opposite to the carrying mechanism (2); the carrying mechanism (2) comprises a moving carrying table (21); a substrate on which a fluorescent powder layer is deposited is arranged on the moving carrying table (21) and moves in a first direction along with the moving carrying table (21); the gluing mechanism (3) comprises a gluing nozzle (31) and an illumination heating member (32); the gluing nozzle (31) and the illumination heating member (32) are arranged above the moving carrying table (21); the gluing nozzle (31) is used for applying glue to the substrate and the fluorescent powder layer; and the illumination heating member (32) can heat the glue sprayed by the gluing nozzle (31). Since the illumination heating member can heat the glue sprayed by the gluing nozzle, the glue can be heated to be pre-cured once the glue is applied to the fluorescent powder layer, thereby avoiding fluorescent powder from moving relative to the substrate, and keeping the structural stability of the fluorescent powder layer.

Description

Glue coating equipment and electronic product processing equipment

Technical field

The present application relates to the field of color display technology, and in particular to a glue coating device and electronic product processing equipment.

Background technique

The description in this application part only provides background information related to the disclosure of this specification and does not constitute prior art.

In Mini-LED/Micro-LED color display technology, in order to modulate a color display effect, red, green, and blue luminescent microchips are usually combined with phosphor films to modulate the color. The preparation of phosphor film usually involves depositing phosphor particles with a diameter of 5-10um on the surface of the substrate to form an ultra-thin layer of about 10um. In order to fix the phosphor particles into a film, the current method is to use coating or spraying to cover the surface of the phosphor layer with glue and then solidify the glue.

However, due to the existence of the surface tension of the glue, and because the surface tension of the glue is greater than the friction force itself, that is, the surface tension exerted by the glue on the phosphor layer is greater than the friction force formed between the phosphor layer and the substrate surface, the phosphor layer Part of the phosphor in the layer is relatively displaced relative to the substrate, thereby destroying the physical structure of the phosphor layer, causing the phosphor in the phosphor film to be uneven or agglomerated, resulting in optical performance defects, or defects in optical performance and other display functions.

It should be noted that the above introduction to the technical background is only provided to facilitate a clear and complete description of the technical solutions in this specification and to facilitate the understanding of those skilled in the art. It cannot be considered that the above technical solutions are known to those skilled in the art just because these solutions are described in the background art section of this specification.

Contents of the invention

The main technical problem solved by this application is to provide glue coating devices and electronic product processing equipment, which can prevent relative displacement between the phosphor and the substrate during the preparation process of the phosphor film. This keeps the structure of the phosphor layer stable.

In order to solve the above technical problems, one technical solution adopted by this application is to provide a glue coating device for coating glue on the substrate and the phosphor layer located on the upper surface of the substrate; the glue coating device includes: a placing mechanism, the placing mechanism includes a moving stage, the substrate is arranged on the moving stage, and moves along the first direction with the moving stage; a gluing mechanism, the gluing mechanism includes a gluing Nozzle and light heating element, the gluing nozzle and the light heating element are arranged above the moving stage; wherein, the gluing nozzle faces the phosphor layer; the gluing nozzle is used to apply glue Coating onto the substrate and the phosphor layer; the light heating element can heat the glue sprayed from the glue coating nozzle.

Further, a controller is included, the controller is connected to the gluing nozzle and the light heating element, and the controller controls the light heating element to work when the gluing nozzle is coating.

Further, the light heating element is an infrared heater or a UV heater.

Further, the lighting and heating component includes a mounting component and an infrared lamp tube arranged on the mounting component, and the mounting component is inclined and faces the substrate.

Further, the mounting member is arranged at an angle close to the lower end of the base plate; or, the entire mounting member is arranged at an angle.

Further, a second heating element is provided in the moving stage, and the second heating element is used to heat the substrate.

Further, the second heating element is a heating rod or a heating sheet.

Further, the motion stage includes a mounting plate and an adsorption plate provided on the mounting plate;

The second heating element is arranged in the installation plate, and the adsorption plate generates negative pressure and adsorbs the substrate.

Further, the second heating element is a heating rod, and a plurality of the heating rods are evenly arranged in the installation plate.

Further, the gluing mechanism includes a frame, and the gluing nozzle and the light heating element are both arranged on the frame.

Further, the position of the glue coating nozzle and/or the light heating element relative to the frame It is adjustable along a second direction that is perpendicular to the first direction.

Further, the frame is provided with a plurality of installation positions along the second direction, and the gluing nozzle and the light heating element are selectively disposed at the installation positions.

Further, the glue coating nozzle is a long and narrow slot nozzle.

Further, the loading machine further includes a first driving module disposed on the first driving module and a second driving module, the moving stage is disposed on the second driving module, and the first driving module is disposed on the second driving module. The driving module drives the second driving module along the first direction, and the second driving module drives the moving stage along the second direction and/or the third direction. The first direction, the The second direction and the third direction are perpendicular to each other.

Furthermore, a vacuum chamber is also included, and the placing mechanism and the gluing mechanism are both accommodated in the vacuum chamber.

In order to solve the above technical problems, another technical solution adopted by this application is to provide an electronic product processing equipment for processing a substrate and a phosphor layer provided on the substrate. The processing equipment includes the above-mentioned glue coating device. .

Different from the situation of the prior art, the beneficial effects of this application are: the embodiment of the present application provides a gluing device. The gluing device includes a placing mechanism and a gluing mechanism opposite to the placing mechanism. The placing mechanism includes a movement A carrier stage, a substrate with a phosphor layer deposited on it is placed on the moving stage, and moves along the first direction with the moving stage; the gluing mechanism includes a gluing nozzle and a light heating element; the gluing nozzle and the light heating element are arranged above the moving stage; the glue nozzle faces the phosphor layer; the glue nozzle is used to apply glue to the substrate and the phosphor layer; the light heating element can heat the glue sprayed by the glue nozzle. Since the light heating element can heat the glue sprayed from the glue coating nozzle, the glue can be heated and pre-cured as soon as it is coated on the phosphor layer. Due to thermal expansion and contraction, the liquid volume becomes larger when heated, and the molecules are The distance between them becomes larger, resulting in smaller surface tension, thereby reducing the surface tension of the liquid glue, that is, the surface tension exerted by the glue on the phosphor is less than the combined force of the gravity of the phosphor and the friction with the substrate, thereby avoiding fluorescence. The movement of the powder relative to the substrate and glue keeps the spatial position between the phosphor particles relatively fixed, making the surface of the phosphor layer uniform and structurally stable, making its optical consistency good.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative efforts. in:

Figure 1 is a schematic structural diagram of the first embodiment of the gluing device provided by this application. The gluing device includes a loading mechanism and a gluing mechanism, and the target product is illustrated in the figure;

Figure 2 is a schematic structural diagram of the target product in Figure 1;

Figure 3 is a schematic structural diagram of the glue application device in Figure 1, wherein the glue application device includes a second heating element;

Figure 4 is a schematic side view of the glue coating device in Figure 3;

Figure 5 is an enlarged schematic diagram of the lighting heating element in Figure 3;

Figure 6 is a schematic structural diagram of a second embodiment of the glue coating device provided by this application.

Explanation of reference symbols:

100. Glue coating device, excluding vacuum chamber;

200. Glue coating device, including vacuum chamber;

1. Target product; 11. Substrate; 12. Phosphor layer; 13. Glue;

2. Mounting mechanism; 21. Movement stage; 211. Installation plate; 212. Second heating element; 213. Adsorption plate; 214. Mounting base; 22. Base; 221. First drive module; 222. Two drive modules;

3. Glue coating mechanism; 31. Glue coating nozzle; 32. Light heating element; 321. Heating tube; 322. Installation parts; 33. Frame;

4. Vacuum chamber;

X-axis, first direction; Z-axis, second direction; Y-axis, third direction.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, ordinary skills in the art All other embodiments obtained by persons without creative efforts shall fall within the scope of protection of this application.

It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or the other element may be interveningly present. When an element is said to be "connected" to another element, it can be directly connected to the other element or it may be present between the other element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation manner.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing specific embodiments only and is not intended to limit the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to FIGS. 1 to 2 . FIG. 1 is a schematic structural diagram of a first embodiment of a gluing device provided by the present application. The gluing device includes a loading mechanism and a gluing mechanism, and the target product is illustrated in the figure. Figure 2 is a schematic structural diagram of the target product in Figure 1. In one aspect of the present application, a glue application device 100 is provided. The glue coating device 100 is used to apply glue 13 on the phosphor layer 12 of the target product 1 .

The target product 1 further includes a substrate 11 , and the phosphor layer 12 is provided on the substrate 11 . The particle diameter of the phosphor is in the range of 5-10um. The phosphor is excited by a single luminophore of a specific wavelength to discharge and emit light. The phosphor can be evenly deposited on the surface of the substrate 11 by physical methods such as air sinking and form a phosphor layer 12 with a certain thickness. The position where the phosphor is deposited on the substrate 11 can be set according to the actual situation, that is, it can be distributed on the substrate 11 at intervals, or it can completely cover the substrate 11 .

Specifically, please continue to refer to FIGS. 1 to 2 . This application provides a gluing device 100 . In the first embodiment, it includes a placing mechanism 2 and a gluing mechanism 3 arranged opposite to the placing mechanism 2 . The glue application mechanism 3 may be located in the space above the placement mechanism 2 .

The placement mechanism 2 includes a moving stage 21 . The substrate 11 of the target product 1 is placed on the moving stage 21 and moves along the first direction with the moving stage 21 . The phosphor layer 12 is arranged on The side of the substrate 11 away from the moving stage 21 . Among them, the first direction is preferably the X-axis direction, as shown in Figure 1 .

The gluing mechanism 3 includes a gluing nozzle 31 and a light heating element 32 . The gluing nozzle 31 and the light heating element 32 are arranged above the moving stage 21 . Wherein, the glue coating nozzle 31 faces the phosphor layer 12 . The glue coating nozzle 31 is used to apply the sprayed glue 13 on the substrate 11 and the phosphor layer 12 . The light heating element 32 can heat the glue 13 sprayed from the glue coating nozzle 31 , that is, the light heating element 32 can heat the glue 13 just applied on the substrate 11 . It can be understood that the heating of the light heating element 32 The scope may also include all the glue 13 applied on the substrate 11 , and may also include the glue 13 between the glue nozzle 31 and the substrate 11 . There is no specific limitation here, and the specific selection can be made according to the actual situation.

Therefore, since the light heating element 32 can heat the glue 13 sprayed from the glue coating nozzle 31 , the glue 13 can be heated and pre-cured as soon as it is coated on the phosphor layer 12 . Since the glue 13 is heated, the distance between the molecules becomes larger, which can reduce the surface tension of the glue 13. Therefore, the force of the glue 13 coated on the phosphor layer 12 on the phosphor of the phosphor layer 12 is smaller than that of the phosphor. Due to the combined force of friction and gravity, the phosphor powder can remain in its original position in the phosphor powder layer 12 and does not move spatially relative to the substrate 11, thereby maintaining the stability of the phosphor powder layer 12 and thus avoiding the existing technology. , because the surface tension of the glue 13 is greater than the combined force of gravity and friction of the phosphor in the phosphor layer 12, part of the phosphor moves relative to the substrate 11, causing the phosphor in the phosphor film to be uneven or agglomerated, resulting in optical performance defects. The problem.

It can be understood that in order to save energy, the light heating element 32 is prevented from working when the glue nozzle 31 is not coating; but at the same time, it is ensured that when the glue nozzle 31 is coating, the light heating element 32 can work immediately. In some embodiments, the gluing device 100 further includes a controller (not shown). The controller connects the gluing nozzle 31 and the light heating element 32, and the controller can control the light heating element 32 to heat when the gluing nozzle 31 is coating.

It can be understood that in order to ensure the pre-curing effect at the beginning, the controller controls the time when the light heating element 32 is turned on to be before the time when the glue coating nozzle 31 is applied.

Specifically, the light heating element 32 may be an infrared heater or a UV heater.

Refer to Figure 5, which is an enlarged schematic diagram of the lighting heating element in Figure 3. In some embodiments , the lighting heating element 32 is an infrared heater, including a mounting component 322 and an infrared lamp tube arranged on the mounting component 322 . The mounting component 322 is inclined and faces the substrate 11 . Specifically, the mounting member 322 may be tilted close to the lower end of the base plate 11 , or the entire mounting member 322 may be tilted. Since the mounting member 322 is tilted and faces the substrate 11 , the light can be concentrated to improve the light extraction effect and light heating efficiency, so that the infrared light emitted by the infrared lamp can irradiate the glue 13 that has just been coated on the substrate 11 .

In some embodiments, the gluing mechanism 3 includes a frame 33 , and the gluing nozzle 31 and the light heating element 32 are both disposed on the frame 33 . Among them, the frame 33 is used to support the glue coating nozzle 31 and the light heating element 32 above the target product 1 .

Specifically, the frame 33 is provided with a plurality of installation positions along the second direction, and the glue nozzle 31 and the light heating element 32 are selectively disposed at the installation positions. Among them, the second direction is preferably the Z-axis direction, see Figure 1 . That is, the glue coating nozzle 31 and the light heating element 32 installed on the frame 33 can move closer to and away from the substrate 11 in the Z-axis direction manually.

Among them, since glue 13 with different compositions has different curing characteristics, for example, glue 13 with different compositions has different curing temperatures and curing times, by adjusting the distance of the light heating element 32 relative to the substrate 11 , the preset temperature of the glue 13 can be controlled. Degree of solidification. It can be understood that in some embodiments, the gluing nozzle 31 and the light heating element 32 can be connected to a driving component to automatically adjust the distance between the gluing nozzle 31 and the light heating element 32 relative to the substrate 11 through program control.

In some more specific embodiments, the frame 33 may be a gantry, the gantry spans both sides of the moving stage 21 , and the beams of the gantry are arranged along the third direction. Among them, the third direction is preferably the Y-axis direction, see Figure 1 . The gluing nozzle 31 and the light heating element 32 are arranged on both sides of the beam, so that the movements of the gluing nozzle 32 and the gluing nozzle 31 relative to the substrate 11 are synchronized, that is, during the coating process, the light heating element 32 moves relative to the glue Nozzle 31 is stationary. It can be understood that when the glue nozzle 31 and the light heating element 32 are respectively disposed on both sides of the fixing member, the light of the light heating element 32 needs to cover the position where the glue 13 of the glue nozzle 31 falls onto the substrate 11. Therefore, The mounting member 322 is disposed obliquely not only toward the substrate 11 but also toward the glue coating nozzle 31 .

In order to increase the coverage of the glue 13 sprayed by the glue nozzle 31 and reduce the coating action, In some embodiments, the glue nozzle 31 is a long and narrow slot nozzle. Specifically, the long side of the narrow slot nozzle is connected to the frame 33 , so that during coating, the moving stage 21 only moves in the first direction to apply the glue 13 to the entire substrate 11 . In addition, in order to increase the heating range of the light heating element 32 , the heating range of the light heating element 32 in the first direction should cover the position where the glue 13 of the glue coating nozzle 31 falls onto the substrate 11 . It can be understood that in practice, the glue outlet of the glue coating nozzle 31 is not limited to a long and narrow slot nozzle, and can be set according to the specific coating situation. The glue outlet can also be circular, or multiple circular nozzles. Side-by-side settings and more.

Continuing to refer to FIGS. 1 and 3 , FIG. 3 is a schematic structural diagram of the glue coating device in FIG. 1 , in which the coating device includes a second heating element 212 . In order to speed up the solidification of the glue 13 coated on the phosphor layer 12 , at least one second heating element 212 can also be provided on the moving stage 21 of the placement mechanism 2 . The second heating element 212 can be a heating rod or a heating sheet. When the second heating element 212 is a heating rod, the heating rod is evenly arranged on the moving stage 21, so that the substrate 11 can be evenly heated and coating can be achieved. The glue 13 covering the phosphor layer 12 is heated from the lower surface. Since the upper surface of the glue 13 is heated by the light heating element 32 and the lower surface is heated by the second heating element 212, the upper and lower surfaces of the glue 13 are heated at the same time, thereby speeding up the solidification of the glue 13.

Generally speaking, in order to ensure the coating effect, the spray range of the glue outlet of the glue coating nozzle 31 must cover the entire target product 1 so that the glue 13 can be evenly coated on the required position of the substrate 11 . However, in practice, in order to occupy less space, the gluing device 100 cannot be set too large, or the size of the target product 1 is too large, or the size of the glue outlet of the gluing nozzle 31 is small. The coating effect can drive the gluing nozzle 31 and/or the moving stage 21 to move, thereby moving the required coating position of the substrate 11 to the spray range of the glue outlet of the gluing nozzle 31 . The specific movement methods can be found below:

In one embodiment, continue to refer to Figures 1, 3 and 4. Figure 4 is a schematic side view of the glue coating device in Figure 3.

In order to cooperate the moving stage 21 with the glue coating nozzle 31 so that the glue 13 is coated on the entire target product 1 , the loading mechanism 2 includes a base 22 for carrying the moving stage 21 , and the base 22 may include a first driving mold. The group 221 and the second driving module 222 arranged on the first driving module 221.

Specifically, the first driving module 221 is arranged along the first direction, and the second driving module 222 is arranged along the third direction; the second driving module 222 is arranged on the side of the first driving module 221 close to the moving stage 21 and It can slide on the first driving module 221; the motion stage 21 is provided on the side of the second driving module 222 away from the first driving module 221 and can slide on the second driving module 222. Therefore, the first driving module 221 can drive the second driving module 222 and drive the moving stage 21 to move in the first direction, and the second driving module 222 can drive the moving stage 21 to move in the third direction. This ensures that for different types of gluing nozzles 31 and target products 1 of different sizes, through the movement of the moving stage 21, the gluing nozzle 31 can traverse every part of the substrate 11 provided on the moving stage 21. Thereby ensuring the normal progress of glue 13 coating.

It can be understood that in some more specific embodiments, multiple driving members may also be provided on the second driving module 222, and the driving members are used to provide power, so that the second driving module 222 not only drives the moving stage 21 moves in the third direction and can also move in the second direction. The second driving module 222 drives the movement stage 21 to move in the second direction to adjust the distance between the substrate 11 and the glue coating nozzle 31 and the light heating element 32 .

Alternatively, in other embodiments, the base 22 may only include the first driving module 221 or the second driving module 222. That is, when the moving stage 21 only needs to move in the first direction, the loading mechanism 2 It can include only the first driving module 221, and when the moving stage 21 only needs to move in the second direction, it can only include the second driving module 222. The selection of the driving module can be set according to the actual situation.

Continuing to refer to FIG. 3 , in order to enable the moving stage 21 to be heated and fixed according to the size of the product, in one embodiment, the moving stage 21 includes a mounting base 214 , and a mounting plate 211 and an adsorption plate 213 that are stacked in sequence.

The mounting base 214 is the mounting platform of the gluing device 100 and defines the maximum size of the target product 1 .

The mounting plate 211 can be installed on the mounting base 214 by means of screws, bolts, etc. The second heating element 212 is provided in the mounting plate 211 for heating the base plate 11 from the lower surface of the base plate 11 . Specifically, the second heating element 212 may be disposed in the mounting plate 211 . When the second heating element 212 uses a heating rod, multiple heating rods can be evenly arranged in the mounting plate 211. So that the substrate 11 is heated more uniformly.

The adsorption plate 213 is provided on the mounting plate 211 for generating negative pressure and firmly fixing the substrate 11 on the moving stage 21 so that there is no relative displacement between the substrate 11 and the moving stage 21 during the coating process. This makes the glue 13 applied more uniformly, and it will not appear that a part of the glue 13 on the substrate 11 is more coated, and another part of the substrate 11 is coated with less glue 13 .

Referring to Figure 6, Figure 6 is a schematic structural diagram of a second embodiment of the glue coating device provided by the present application.

In order to further reduce the surface tension of the liquid glue 13, this application provides a glue application device 200. In a second embodiment, the glue application device 200 further includes a vacuum chamber 4. Except for this, the structure of the glue application device 200 provided by the present application in the second embodiment is exactly the same as that in the first embodiment.

Specifically, the vacuum chamber 4 includes a vacuum chamber and a vacuum pump provided on the vacuum chamber. Among them, the glue application mechanism 3 and the placement mechanism 2 used for coating are both located in the vacuum chamber. Before coating is carried out, the vacuum chamber can be evacuated by a vacuum pump. The specific rated vacuum degree in the vacuum chamber is 1 kPa, so that the coating process of the glue 13 by the glue coating nozzle 31 is performed in a vacuum environment. As a result, in an environment where the atmospheric pressure is close to 0, the density of the liquid glue 13 becomes smaller, the distance between molecules becomes larger, and the surface tension becomes smaller, thereby further ensuring the pre-curing effect. In addition, coating under vacuum can also effectively eliminate bubbles in the glue 13 to ensure the deaeration effect. It can be understood that the greater the vacuum in the vacuum chamber, the smaller the surface tension of the liquid.

Another aspect of this application also provides an electronic product processing equipment. The electronic product processing equipment is used to process a target product 1. The target product 1 includes a substrate 11 and a phosphor layer 12 provided on the substrate 11. The electronic product processing equipment Including the glue coating device in any of the above embodiments.

It can be understood that the embodiment of the electronic processing equipment corresponds to the embodiment of the glue coating device, which can solve the technical problem that the phosphor in the phosphor layer 12 can move relative to the substrate 11 during the coating process of the glue 13 , correspondingly achieve the technical effect of the implementation of the glue coating device, and the specific details will not be repeated here.

It should be noted that in the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects. There is no order between the two, nor can it be understood as indicating or implies relative importance. Furthermore, in the description of this specification, "plurality" means two or more unless otherwise specified.

The use of the term "comprises" or "comprising" to describe a combination of elements, components, parts or steps herein also contemplates embodiments that consist essentially of such elements, components, parts or steps. By using the term "may" herein, it is intended that any described attribute included in "may" is optional.

Multiple elements, components, components or steps can be provided by a single integrated element, component, component or step. Alternatively, a single integrated element, component, component or step may be divided into separate multiple elements, components, components or steps. The word "a" or "an" used to describe an element, component, component or step is not intended to exclude other elements, components, components or steps.

The above descriptions are only embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies fields are equally included in the scope of patent protection of this application.

Claims

A glue coating device for coating glue on a substrate and a phosphor layer located on the upper surface of the substrate; characterized in that the glue coating device includes:

A placement mechanism, the placement mechanism includes a moving stage, the substrate is arranged on the moving stage and moves along the first direction with the moving stage;

Glue coating mechanism, the glue coating mechanism includes a glue coating nozzle and a light heating element, the glue coating nozzle and the lighting heating element are arranged above the moving stage; wherein the glue coating nozzle faces the fluorescent Powder layer; the glue coating nozzle is used to apply glue to the substrate and the phosphor layer;

The light heating element can heat the glue sprayed from the glue coating nozzle.
The gluing device according to claim 1, further comprising a controller, the controller is connected to the gluing nozzle and the light heating element, and the controller controls the light heating element to operate in the The glue nozzle works when applying.
The glue coating device according to claim 1, characterized in that the light heating element is an infrared heater or a UV heater.
The glue coating device according to claim 1, wherein the lighting and heating element includes a mounting component and an infrared lamp arranged on the mounting component, and the mounting component is inclined and faces the substrate.
The glue coating device according to claim 4, characterized in that the mounting member is arranged at an angle close to the lower end of the base plate; or the entire mounting member is arranged at an angle.
The glue coating device according to claim 1, characterized in that a second heating element is provided in the moving stage, and the second heating element is used to heat the substrate.
The glue coating device according to claim 6, characterized in that the second heating element is a heating rod or a heating sheet.
The gluing device according to claim 6, wherein the moving platform includes a mounting plate and an adsorption plate arranged on the mounting plate;

The second heating element is arranged in the installation plate, and the adsorption plate generates negative pressure and adsorbs the substrate.
The glue coating device according to claim 8, characterized in that the second heating element It is a heating rod, and a plurality of the heating rods are evenly arranged in the mounting plate.
The gluing device according to claim 1, wherein the gluing mechanism includes a frame, and the gluing nozzle and the light heating element are both arranged on the frame.
The glue coating device according to claim 10, characterized in that the position of the glue coating nozzle and/or the light heating element relative to the frame is adjustable along a second direction, and the second direction is consistent with the The first direction is vertical.
The gluing device according to claim 11, wherein the frame is provided with a plurality of installation positions along the second direction, and the gluing nozzle and/or the light heating element can be selectively provided in the installation position.
The gluing device according to claim 1, wherein the gluing nozzle is a long and narrow slit nozzle.
The gluing device according to claim 1, wherein the loading mechanism further includes a first driving module and a second driving module disposed on the first driving module, and the moving stage Disposed on the second driving module, the first driving module drives the second driving module along the first direction, and the second driving module drives along the second direction and/or the third direction. The moving stage is driven so that the first direction, the second direction and the third direction are vertical in pairs.
The gluing device according to any one of claims 1 to 14, further comprising a vacuum chamber, and both the placing mechanism and the gluing mechanism are accommodated in the vacuum chamber.
An electronic product processing equipment, used for processing a substrate and a phosphor layer provided on the substrate, characterized in that the processing equipment includes the glue coating device according to any one of claims 1-14.