CN218902457U - Gluing device and electronic product processing equipment - Google Patents
Gluing device and electronic product processing equipment Download PDFInfo
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- CN218902457U CN218902457U CN202221804066.2U CN202221804066U CN218902457U CN 218902457 U CN218902457 U CN 218902457U CN 202221804066 U CN202221804066 U CN 202221804066U CN 218902457 U CN218902457 U CN 218902457U
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 148
- 238000010438 heat treatment Methods 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000000843 powder Substances 0.000 claims abstract description 52
- 238000005286 illumination Methods 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000003892 spreading Methods 0.000 claims abstract description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000010073 coating (rubber) Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
The application discloses a rubber coating device and include rubber coating device's electronic product processing equipment. The gluing device comprises a loading mechanism and a gluing mechanism opposite to the loading mechanism, wherein the loading mechanism comprises a moving carrier, and a substrate deposited with a fluorescent powder layer is arranged on the moving carrier and moves along a first direction along with the moving carrier; the gluing mechanism comprises a gluing nozzle and an illumination heating piece; the gluing nozzle and the illumination heating piece are arranged above the moving carrier; wherein the glue spreading nozzle faces the fluorescent powder layer; the glue coating nozzle is used for coating glue on the substrate and the fluorescent powder layer; the illumination heating piece can heat the glue sprayed out of the glue coating nozzle. The illumination heating piece can heat the glue sprayed out of the gluing nozzle, so that the glue can be heated to be pre-cured as soon as the glue is coated on the fluorescent powder layer, the fluorescent powder is prevented from moving relative to the substrate, and the structural stability of the fluorescent powder layer is maintained.
Description
Technical Field
The application relates to the technical field of color display, in particular to a gluing device and electronic product processing equipment.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
In the Mini-LED/Micro-LED color display technology, three kinds of light-emitting microchips of red, green and blue are usually combined with a fluorescent powder film to be modulated into color for the purpose of modulating into color display effect. The phosphor film is generally prepared by depositing phosphor particles having a diameter of 5-10um on the surface of a substrate to form an ultra-thin layer of about 10 um. In order to fix the phosphor particles into a film, the current method is to coat the surface of the phosphor layer with glue by coating or spraying and cure the glue.
However, due to the existence of the surface tension of the glue, and due to the fact that the surface tension of the glue is larger than the friction force applied by the glue, namely the surface tension applied to the glue by the fluorescent powder layer is larger than the friction force formed by the fluorescent powder layer and the surface of the substrate, partial fluorescent powder of the fluorescent powder layer is displaced relative to the substrate, so that the physical structure of the fluorescent powder layer is damaged, and the fluorescent powder in the fluorescent powder film is uneven or clustered to cause optical performance defects or display function defects such as optical performance and the like.
It should be noted that the foregoing description of the technical background is only for the purpose of facilitating a clear and complete description of the technical solutions of the present specification and for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background section of the present description.
Disclosure of Invention
The technical problem that this application mainly solves is to provide rubber coating device and electronic product processing equipment, can make in the preparation in-process of phosphor powder film, the relative displacement takes place for phosphor powder and base plate to keep the stable in structure of phosphor powder layer.
In order to solve the technical problems, one technical scheme adopted by the application is as follows: providing a glue coating device, which is used for coating glue on a substrate and a fluorescent powder layer positioned on the upper surface of the substrate; the said
The gumming device includes: a mounting mechanism including a moving stage on which the substrate 5 is disposed and which moves along a first direction along with the moving stage; the gluing mechanism comprises a gluing nozzle and an illumination heating piece, and the gluing nozzle and the illumination heating piece are arranged above the moving carrier; wherein the glue spreading nozzle faces the fluorescent powder layer; the glue coating nozzle is used for coating glue on the substrate and the fluorescent powder layer; the illumination heating piece can heat the glue sprayed out of the glue spreading nozzle.
0 further comprises a controller, wherein the controller is connected with the gluing nozzle and the illumination heating piece, and controls the illumination heating piece to work when the gluing nozzle is coated.
Further, the illumination heating element comprises an installation element and an infrared lamp tube arranged on the installation element, and the installation element is obliquely arranged and faces the substrate.
5 further, a second heating element is arranged in the motion carrying platform and is used for heating the substrate.
Further, the gluing mechanism comprises a frame, and the gluing nozzle and the illumination heating piece are arranged on the frame; the frame is provided with a plurality of mounting positions along a second direction, and the glue spreading nozzle and the illumination heating element are selectively arranged at the mounting positions.
0, and the glue spreading nozzle is an elongated slit nozzle.
Further, the carrier further comprises a second driving module, wherein the first driving module is arranged on the first driving module, the motion carrier is arranged on the second driving module, the first driving module drives the second driving module along the first direction, and the second driving module drives the motion carrier along the second direction and/or the third direction.
5 further, the motion carrier comprises a mounting plate and an adsorption plate arranged on the mounting plate; the second heating piece is arranged in the mounting plate, and the adsorption plate generates negative pressure and adsorbs the substrate.
Further, the vacuum chamber is further included, and the carrying mechanism and the gluing mechanism are both accommodated in the vacuum chamber.
In order to solve the technical problems, another technical scheme adopted by the application is as follows: an electronic product processing device is provided, and is used for processing a substrate and a fluorescent powder layer arranged on the substrate, and the processing device comprises the gluing device.
In the condition of prior art, the beneficial effect of this application is: the embodiment of the application provides a gluing device, which comprises a carrying mechanism and a gluing mechanism opposite to the carrying mechanism, wherein the carrying mechanism comprises a moving carrier, and a substrate deposited with a fluorescent powder layer is arranged on the moving carrier and moves along a first direction along with the moving carrier; the gluing mechanism comprises a gluing nozzle and an illumination heating piece; the gluing nozzle and the illumination heating piece are arranged above the moving carrier; wherein the glue spreading nozzle faces the fluorescent powder layer; the glue coating nozzle is used for coating glue on the substrate and the fluorescent powder layer; the illumination heating piece can heat the glue sprayed out of the glue coating nozzle. The illumination heating piece can heat the glue sprayed out of the gluing nozzle, so that the glue can be heated to be pre-cured when being coated on the fluorescent powder layer, the liquid volume is increased when in heating due to thermal expansion and cold contraction, the distance between molecules is increased, the surface tension is reduced, and the surface tension of the liquid glue is reduced, namely, the surface tension of the glue applied to the fluorescent powder is smaller than the resultant force of the gravity of the fluorescent powder and the friction force between the fluorescent powder and the substrate, thereby avoiding the movement of the fluorescent powder relative to the substrate and the glue, keeping the relative fixed space position between fluorescent powder particles, ensuring the uniform surface and stable structure of the fluorescent powder layer and ensuring the good optical consistency of the fluorescent powder layer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
fig. 1 is a schematic structural view of a first embodiment of a glue applicator provided in the present application, where the glue applicator includes a loading mechanism and a glue applicator mechanism, and the target product is schematically shown in the figure;
FIG. 2 is a schematic diagram of the target product of FIG. 1;
fig. 3 is a schematic structural view of the glue applicator of fig. 1, wherein the glue applicator includes a second heating member;
fig. 4 is an axial side view of the gumming device of fig. 3;
FIG. 5 is an enlarged schematic view of the light heating member of FIG. 3;
fig. 6 is a schematic structural diagram of a second embodiment of the glue spreading device provided in the present application.
Reference numerals illustrate:
100. the gluing device does not comprise a vacuum cavity;
200. the gluing device comprises a vacuum cavity;
1. a target product; 11. a substrate; 12. a phosphor layer; 13. glue;
2. a mounting mechanism; 21. a motion stage; 211. a mounting plate; 212. a second heating member; 213. an adsorption plate; 214. a mounting base; 22. a base; 221. a first driving module; 222. a second driving module;
3. a gluing mechanism; 31. a glue spreading nozzle; 32. an illumination heating element; 321. heating pipes; 322. a mounting member; 33. a frame;
4. a vacuum chamber;
an X axis and a first direction; a Z axis and a second direction; y-axis, third direction.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of a first embodiment of a glue spreading device provided in the present application, where the glue spreading device includes a loading mechanism and a glue spreading mechanism, and a target product is schematically shown in the figure. Fig. 2 is a schematic structural diagram of the target product in fig. 1. In one aspect of the present application, a glue application device 100 is provided. The glue application device 100 is used for applying glue 13 to the phosphor layer 12 of the target product 1.
The target product 1 further comprises a substrate 11, and the fluorescent powder layer 12 is arranged on the substrate 11. The particle diameter of the fluorescent powder is in the range of 5-10um, and the fluorescent powder is excited by the irradiation of a single luminophor with specific wavelength to discharge and emit light. The phosphor may be uniformly deposited on the surface of the substrate 11 by physical means such as submerged air and form the phosphor layer 12 with a certain thickness. The position of the phosphor deposited on the substrate 11 may be set according to practical situations, that is, the phosphor may be distributed on the substrate 11 at intervals, or may cover the substrate 11 completely.
Specifically, referring to fig. 1 to 2, a glue applicator 100 provided in the present application includes a mounting mechanism 2 and a glue applying mechanism 3 disposed opposite to the mounting mechanism 2 in a first embodiment. The glue application mechanism 3 may be located in a space above the placement mechanism 2.
The mounting mechanism 2 includes a motion stage 21. The substrate 11 of the target product 1 is disposed on the motion stage 21, and moves along the first direction along with the motion stage 21. The phosphor layer 12 is disposed on a side of the substrate 11 remote from the motion stage 21. The first direction is preferably the X-axis direction, as shown in fig. 1.
The gluing mechanism 3 includes a gluing nozzle 31 and an illumination heating member 32, and the gluing nozzle 31 and the illumination heating member 32 are disposed above the moving stage 21. Wherein the glue nozzle 31 faces the phosphor layer 12. The glue nozzle 31 is used to apply the ejected glue 13 on the substrate 11 and the phosphor layer 12. The illumination heating element 32 can heat the glue 13 sprayed from the glue spraying nozzle 31, that is, the illumination heating element 32 can heat the glue 13 just coated on the substrate 11, it can be understood that the heating range of the illumination heating element 32 can also include all the glue 13 coated on the substrate 11, and can also include the glue 13 between the glue spraying nozzle 31 and the substrate 11, which is not limited in detail, and can be specifically selected according to practical situations.
Therefore, the illumination heating piece 32 can heat the glue 13 sprayed by the glue spraying nozzle 31, so that the glue 13 can be heated to be pre-cured as soon as being coated on the fluorescent powder layer 12. Since the glue 13 is heated, the distance between molecules becomes larger, and the surface tension of the glue 13 can be reduced, so that the acting force of the glue 13 coated on the fluorescent powder layer 12 on the fluorescent powder is smaller than the resultant force of the friction force and the gravity force applied to the fluorescent powder, the fluorescent powder can be kept at the original position in the fluorescent powder layer 12 and does not move relative to the substrate 11 in space, so that the stability of the fluorescent powder layer 12 is kept, and the problems that in the prior art, part of fluorescent powder moves relative to the substrate 11 due to the fact that the surface tension of the glue 13 is larger than the resultant force of the gravity force and the friction force of the fluorescent powder in the fluorescent powder layer 12, and the fluorescent powder in the fluorescent powder film is uneven or clusters to cause optical performance defects are avoided.
It will be appreciated that, in order to save energy, the light heating element 32 is prevented from operating when the gluing nozzle 31 is not being coated; but at the same time ensures that the light heating element 32 can cooperate to operate immediately when the application nozzle 31 is applying, and in some embodiments the applicator device 100 further comprises a controller (not shown). The controller is connected with the gluing nozzle 31 and the illumination heating piece 32, and can control the illumination heating piece 32 to heat when the gluing nozzle 31 is coated.
It will be appreciated that, in order to ensure the pre-curing effect at the start time, the controller controls the time that the light heating element 32 is turned on before the time that the glue nozzle 31 is coated.
Specifically, the light heating element 32 includes, but is not limited to, an infrared heater, a UV heater, and the like.
Referring to fig. 5, fig. 5 is an enlarged schematic view of the light heating element in fig. 3. In some embodiments, the light heating element 32 is an infrared heater, and includes a mounting element 322 and an infrared lamp tube disposed on the mounting element 322, where the mounting element 322 is disposed obliquely and toward the substrate 11. Specifically, the mounting member 322 may be disposed obliquely near the lower end of the base plate 11, or the mounting member 322 may be disposed obliquely as a whole. Because the installation piece 322 is obliquely arranged and faces the substrate 11, light can be concentrated, the light emitting effect and the light heating efficiency are improved, and the infrared light emitted by the infrared lamp tube is convenient for irradiating the glue 13 just coated on the substrate 11.
In some embodiments, the gluing mechanism 3 comprises a frame 33, and the gluing nozzle 31 and the illumination heating element 32 are both arranged on the frame 33. The frame 33 is used for supporting the glue nozzle 31 and the light heating element 32 above the target product 1.
Specifically, the frame 33 is provided with a plurality of mounting positions along the second direction, and the glue nozzle 31 and the illumination heating member 32 are selectively provided at the mounting positions. The second direction is preferably the Z-axis direction, see fig. 1. I.e. the glue nozzle 31 and the light heating member 32 mounted on the frame 33 can be moved in the Z-axis direction towards and away from the substrate 11 by manual means.
Wherein, since the glue 13 with different components has different curing characteristics, for example, the glue 13 with different components has different curing temperatures and curing times, the pre-curing degree of the glue 13 can be controlled by adjusting the distance between the photo-heating element 32 and the substrate 11. It will be appreciated that in some embodiments, the glue nozzle 31 and the light heating member 32 may be coupled to a driving member, and the distance between the glue nozzle 31 and the light heating member 32 relative to the substrate 11 may be automatically adjusted in a programmed manner.
In some more specific embodiments, the gantry 33 may be a gantry that spans across the motion stage 21, with the gantry beam disposed along a third direction. The third direction is preferably the Y-axis direction, see fig. 1. The glue application nozzle 31 and the photo-heating element 32 are arranged on both sides of the cross beam, whereby the movement of the photo-heating element 32 and the glue application nozzle 31 relative to the substrate 11 is synchronized, i.e. the photo-heating element 32 is stationary relative to the glue application nozzle 31 during the coating process. It will be appreciated that when the glue application nozzle 31 and the light application heating member 32 are disposed on both sides of the fixing member, respectively, the light of the light application heating member 32 needs to cover the position where the glue 13 applied to the glue application nozzle 31 falls onto the substrate 11, and therefore, the mounting member 322 is disposed obliquely not only toward the substrate 11 but also toward the glue application nozzle 31.
To increase the coverage of the glue 13 ejected by the glue nozzle 31 and reduce the coating action, in some embodiments the glue nozzle 31 is an elongated slit nozzle. Specifically, the long side of the slit nozzle is connected to the frame 33, so that the moving stage 21 moves only in the first direction to apply the glue 13 to the entire substrate 11 during application. In addition, in order to increase the heating range of the illumination heating element 32, the heating range of the illumination heating element 32 in the first direction is to cover the position where the glue 13 of the glue nozzle 31 falls to the substrate 11. It will be appreciated that in practice, the glue outlet of the glue nozzle 31 is not limited to a slit nozzle, and may be provided according to a specific application, or may be circular, or a plurality of circular nozzles may be arranged side by side, etc.
With continued reference to fig. 1 and 3, fig. 3 is a schematic structural view of the glue applicator apparatus of fig. 1, wherein the coating apparatus includes a second heating element 212. In order to accelerate the curing of the glue 13 applied to the phosphor layer 12, at least one second heating element 212 may also be provided on the moving stage 21 of the mounting mechanism 2. The second heating member 212 may be a heating rod or a heating sheet, and when the second heating member 212 is a heating rod, the heating rod is uniformly disposed on the moving stage 21, so that the substrate 11 can be uniformly heated, and the glue 13 coated on the phosphor layer 12 can be heated from the lower surface. Since the upper surface of the glue 13 is heated by the illumination heating element 32 and the lower surface is heated by the second heating element 212, the upper and lower surfaces of the glue 13 are heated simultaneously, so that the curing of the glue 13 can be accelerated.
Generally, in order to ensure the coating effect, the spray range of the glue outlet of the glue nozzle 31 must cover the entire target product 1 in order to uniformly apply the glue 13 at the desired position of the substrate 11. However, in practice, in order to reduce the floor space, the glue application device 100 cannot be set too large, or the size of the target product 1 is too large, or the size of the glue outlet of the glue application nozzle 31 is small, in order to ensure the coating effect, the glue application nozzle 31 and/or the moving stage 21 may be driven to move, so that the position of the desired coating of the substrate 11 is moved to the spray range of the glue outlet of the glue application nozzle 31. For a specific movement, see below:
in one embodiment, with continued reference to fig. 1, 3 and 4, fig. 4 is an axial side view of the gumming device of fig. 3.
In order to cooperate the moving stage 21 with the glue nozzle 31 such that the glue 13 is applied over the whole target product 1, the loading mechanism 2 comprises a base 22 for carrying the moving stage 21, the base 22 may comprise a first driving module 221 and a second driving module 222 arranged on the first driving module 221.
Specifically, the first driving module 221 is disposed along the first direction, and the second driving module 222 is disposed along the third direction; the second driving module 222 is disposed on one side of the first driving module 221 near the moving platform 21 and can slide on the first driving module 221; the moving carrier 21 is disposed on a side of the second driving module 222 away from the first driving module 221 and can slide on the second driving module 222. Therefore, the second driving module 222 can be driven by the first driving module 221 to drive the motion platform 21 to move in the first direction, and the motion platform 21 can be driven by the second driving module 222 to move in the third direction. It is thereby ensured that the glue application nozzles 31 of different types and different sizes of target products 1 are moved by the moving stage 21 so that the glue application nozzles 31 can traverse each of the substrates 11 provided on the moving stage 21, thereby ensuring the normal progress of the glue 13 application.
It will be appreciated that in some more specific embodiments, a plurality of driving members may be provided on the second driving module 222, where the driving members are configured to provide power, so that the second driving module 222 may not only drive the motion stage 21 to move in the third direction, but also move in the second direction. The second driving module 222 drives the moving stage 21 to move in the second direction to adjust the distance between the substrate 11 and the glue nozzle 31 and the light heating member 32.
Alternatively, in other embodiments, the base 22 may include only the first driving module 221 or the second driving module 222, that is, when the moving stage 21 only needs to move in the first direction, the mounting mechanism 2 may include only the first driving module 221, and when the moving stage 21 only needs to move in the second direction, the base may include only the second driving module 222, and the selection of the driving modules may be set according to the practical situation.
With continued reference to fig. 3, in order to allow the motion stage 21 to be heated and fixed according to the size of the product, in one embodiment, the motion stage 21 includes a mounting base 214, and a mounting plate 211 and a suction plate 213 stacked in order.
The mounting block 214 is a mounting platform for the gumming device 100 and defines the maximum size of the target product 1.
The mounting plate 211 may be mounted on the mounting base 214 by means of screws, bolts, or the like, and the second heating member 212 is provided in the mounting plate for heating the substrate 11 from the lower surface of the substrate 11. Specifically, the second heating member 212 may be disposed within the mounting plate 211. When the second heating member 212 employs a heating rod, the second heating member 212 may be uniformly disposed in the mounting plate 211 to make the heating of the substrate 11 more uniform.
The adsorption plate 213 is disposed on the mounting plate 211, and is used for generating negative pressure and firmly fixing the substrate 11 on the moving carrier 21, so that the substrate 11 and the moving carrier 21 have no relative displacement in the coating process, so that the coated glue 13 is more uniform, more glue 13 coating on one part of the substrate 11 cannot occur, and less glue 13 coating on the other part of the substrate 11 can occur.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a second embodiment of the glue spreading device provided in the present application.
In order to further reduce the surface tension of the liquid glue 13, the application provides a glue application device 200. In a second embodiment, the glue application device 200 further comprises a vacuum chamber 4. Except for this, the structure of the glue applicator 200 in the second embodiment is exactly the same as that in the first embodiment.
Specifically, the vacuum chamber 4 includes a vacuum chamber and a vacuum pump provided on the vacuum chamber. Wherein the gluing mechanism 3 and the placing mechanism 2 for coating are both in the vacuum chamber. Before the coating, the vacuum chamber may be vacuum-treated by a vacuum pump, and the rated vacuum degree in the vacuum chamber is 1kPa, so that the process of coating the glue nozzle 31 with the glue 13 is performed under a vacuum environment. Therefore, the liquid glue 13 has smaller liquid density and larger distance between molecules and smaller surface tension in the environment with the atmospheric pressure close to 0, so that the pre-curing effect can be further ensured. In addition, the coating under vacuum can effectively remove bubbles in the glue 13 to ensure the defoaming effect. It will be appreciated that the greater the vacuum in the vacuum chamber, the less the liquid surface tension.
In another aspect of the present application, there is further provided an electronic product processing apparatus for processing a target product 1, where the target product 1 includes a substrate 11 and a phosphor layer 12 disposed on the substrate 11, and the electronic product processing apparatus includes the glue spreading device in any of the foregoing embodiments.
It can be understood that the embodiment of the electronic processing device corresponds to the embodiment of the glue spreading device, which can solve the technical problem that the fluorescent powder in the fluorescent powder layer 12 can move relative to the substrate 11 in the process of coating the glue 13, and accordingly achieves the technical effect of the embodiment of the glue spreading device, and the detailed description of the application is omitted herein.
It should be noted that, in the description of the present specification, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference therebetween, nor should it be construed as indicating or implying relative importance. In addition, in the description of the present specification, unless otherwise indicated, the meaning of "a plurality" is two or more.
The use of the terms "comprises" or "comprising" to describe combinations of elements, components, or steps herein also contemplates embodiments consisting essentially of such elements, components, or steps. By using the term "may" herein, it is intended that any attribute described as "may" be included is optional.
Multiple elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, component, section or step is not intended to exclude other elements, components, sections or steps.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.
Claims (10)
1. The glue coating device is used for coating glue on the substrate and the fluorescent powder layer positioned on the upper surface of the substrate; the gluing device is characterized by comprising:
the substrate mounting device comprises a mounting mechanism, a first driving mechanism and a second driving mechanism, wherein the mounting mechanism comprises a moving carrier, and the substrate is arranged on the moving carrier and moves along a first direction along with the moving carrier;
the gluing mechanism comprises a gluing nozzle and an illumination heating piece, and the gluing nozzle and the illumination heating piece are arranged above the moving carrier; wherein the glue spreading nozzle faces the fluorescent powder layer; the glue coating nozzle is used for coating glue on the substrate and the fluorescent powder layer;
the illumination heating piece can heat the glue sprayed out of the glue spreading nozzle.
2. The glue applicator of claim 1, further comprising a controller connecting the glue applicator nozzle and the light heating member, the controller controlling the light heating member to operate when the glue applicator nozzle is applying.
3. The glue applicator of claim 1, wherein the light heating element comprises a mounting element and an infrared light tube disposed on the mounting element ， The mounting member is disposed obliquely and faces the substrate.
4. A glue applicator as defined in claim 3, wherein a second heating element is disposed within the motion stage, the second heating element being configured to heat the substrate.
5. A gluing device as claimed in claim 3, wherein the gluing mechanism comprises a frame, the gluing nozzle and the illumination heating element being both arranged on the frame;
the frame is provided with a plurality of mounting positions along a second direction, and the glue spreading nozzle and/or the illumination heating element are/is optionally arranged at the mounting positions.
6. The glue applicator of claim 1, wherein the glue applicator nozzle is an elongated slot nozzle.
7. The glue spreading device of claim 1, wherein the mounting mechanism further comprises a first drive module and a second drive module disposed on the first drive module, the motion stage is disposed on the second drive module, the first drive module drives the second drive module in the first direction, and the second drive module drives the motion stage in a second direction and/or a third direction.
8. The glue applicator of claim 4, wherein the motion stage comprises a mounting plate and an adsorption plate disposed on the mounting plate;
the second heating piece is arranged in the mounting plate, and the adsorption plate generates negative pressure and adsorbs the substrate.
9. The glue applicator of any one of claims 1-8, further comprising a vacuum chamber, wherein the mounting mechanism and the glue applicator are both housed within the vacuum chamber.
10. An electronic product processing apparatus for processing a substrate and a phosphor layer provided on the substrate, characterized in that the processing apparatus comprises a glue spreading device according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221804066.2U CN218902457U (en) | 2022-07-12 | 2022-07-12 | Gluing device and electronic product processing equipment |
| PCT/CN2023/105878 WO2024012324A1 (en) | 2022-07-12 | 2023-07-05 | Gluing apparatus and electronic product processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221804066.2U CN218902457U (en) | 2022-07-12 | 2022-07-12 | Gluing device and electronic product processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218902457U true CN218902457U (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221804066.2U Active CN218902457U (en) | 2022-07-12 | 2022-07-12 | Gluing device and electronic product processing equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN218902457U (en) |
| WO (1) | WO2024012324A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116544253A (en) * | 2023-05-08 | 2023-08-04 | 马鞍山东大汇泽半导体科技有限公司 | Packaging method of image sensor |
| WO2024012324A1 (en) * | 2022-07-12 | 2024-01-18 | 江苏立导科技有限公司 | Gluing apparatus and electronic product processing device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1099760A (en) * | 1996-09-26 | 1998-04-21 | Toshiba Corp | Coating device |
| JP4565648B2 (en) * | 2005-09-26 | 2010-10-20 | 大日本スクリーン製造株式会社 | Substrate heating device |
| JP5390956B2 (en) * | 2009-06-25 | 2014-01-15 | 大日本スクリーン製造株式会社 | Wiring forming apparatus and wiring forming method |
| JP2012071244A (en) * | 2010-09-28 | 2012-04-12 | Dainippon Screen Mfg Co Ltd | Pattern forming method and pattern forming apparatus |
| JP2012143691A (en) * | 2011-01-11 | 2012-08-02 | Dainippon Screen Mfg Co Ltd | Pattern forming method and pattern forming device |
| CN207887470U (en) * | 2018-01-29 | 2018-09-21 | 北京京东方显示技术有限公司 | A kind of automatic double surface gluer |
| JP6904583B2 (en) * | 2018-12-18 | 2021-07-21 | 株式会社飯沼ゲージ製作所 | Slit coater |
| CN218902457U (en) * | 2022-07-12 | 2023-04-25 | 江苏立导科技有限公司 | Gluing device and electronic product processing equipment |
-
2022
- 2022-07-12 CN CN202221804066.2U patent/CN218902457U/en active Active
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2023
- 2023-07-05 WO PCT/CN2023/105878 patent/WO2024012324A1/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024012324A1 (en) * | 2022-07-12 | 2024-01-18 | 江苏立导科技有限公司 | Gluing apparatus and electronic product processing device |
| CN116544253A (en) * | 2023-05-08 | 2023-08-04 | 马鞍山东大汇泽半导体科技有限公司 | Packaging method of image sensor |
| CN116544253B (en) * | 2023-05-08 | 2024-03-22 | 马鞍山东大汇泽半导体科技有限公司 | Packaging method of image sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024012324A1 (en) | 2024-01-18 |
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