CN112030110A - Vacuum coating equipment with separable base materials - Google Patents
Vacuum coating equipment with separable base materials Download PDFInfo
- Publication number
- CN112030110A CN112030110A CN202010848499.7A CN202010848499A CN112030110A CN 112030110 A CN112030110 A CN 112030110A CN 202010848499 A CN202010848499 A CN 202010848499A CN 112030110 A CN112030110 A CN 112030110A
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- CN
- China
- Prior art keywords
- substrate
- bearing disc
- generating device
- electrode
- substrate bearing
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
Abstract
The invention provides a vacuum coating device with separable base materials, which can obtain more uniform coating effect and ensure the consistency of the process in the coating area. It includes: the device comprises a substrate bearing disc for placing a substrate to be coated, a heater arranged below the substrate bearing disc, an electromagnetic field generating device and a process gas generating device which are arranged above the substrate bearing disc, wherein the region between the substrate bearing disc and the electromagnetic field generating device and between the substrate bearing disc and the process gas generating device is a coating process region; the lifting structure drives the heater to lift the substrate to be coated on the substrate bearing disc to the electromagnetic field stable area of the coating process area through the lifting port.
Description
Technical Field
The invention relates to the technical field of vacuum coating, in particular to vacuum coating equipment with a separable base material.
Background
The vacuum vapor deposition technique is that under the premise of an initial vacuum state, process gas is introduced into a vacuum-state process chamber, then reaction conditions such as temperature, electric field, radiation, laser and the like are applied to the process gas and a coated substrate, so that the process gas and a substrate are subjected to physical and chemical reaction, and finally a film is formed on the substrate. The vacuum vapor deposition technology has wide application in industrial production and scientific research, and especially plays an important, even central role in numerous industries such as semiconductors, displays, photovoltaics, LED illumination, environmental protection, high-end building materials, aerospace, digital communication, optical industry and the like.
However, in the current vacuum vapor deposition technology, a substrate carrying tray on which a substrate to be coated is placed enters a coating process chamber through a guide rail, a roller or other transmission devices, and then is coated with a film by process gas under the combined action of an electromagnetic field and a heater in a coating area in the process chamber; however, in the prior art, when large-area coating is carried out, the problems of poor coating uniformity, low process consistency in the coating area and the like generally exist.
Disclosure of Invention
In order to solve the problems of poor coating uniformity and low process consistency in the coating area in the existing vacuum coating technology, the invention provides vacuum coating equipment with a separable base material, which can obtain more uniform coating effect and ensure the consistency in the coating area.
The technical scheme of the invention is as follows: a vacuum plating apparatus with a separable substrate, comprising: the device comprises a substrate bearing disc for placing a substrate to be coated, a heater arranged below the substrate bearing disc, an electromagnetic field generating device and a process gas generating device which are arranged above the substrate bearing disc, wherein the region between the substrate bearing disc and the electromagnetic field generating device and between the substrate bearing disc and the process gas generating device is a coating process region; the lifting structure drives the heater to lift the substrate to be coated on the substrate bearing disc to the electromagnetic field stable area of the coating process area through the lifting port.
It is further characterized in that:
the elevation structure includes: the servo mechanism is connected with the screw rod in a driving mode, and the moving platform is provided with a trapezoidal nut which is in threaded connection with the screw rod; the movable platform is connected with a heater supporting block arranged at the bottom of the heater through a movable support column;
the electromagnetic field generating device includes: the electrode comprises a plurality of layers of electrode plates and an electrode base which are sequentially arranged from top to bottom, wherein the plurality of layers of electrode plates and the electrode base are fixedly connected through an electrode fixing assembly;
the process gas generation device comprises: the multi-layer electrode plate, the electrode base, the middle gas distribution plate and the multi-path gas distribution plate are fixedly connected through the electrode fixing assembly; the process gas inlet is arranged on the multilayer electrode plate, and the process gas is introduced into the film coating process area through the middle gas distribution plate and the multi-path gas distribution plate.
The invention provides a vacuum coating equipment with separable base materials, which is characterized in that a separable tray outer frame, a substrate bearing disc and a lifting structure are arranged, and the tray outer frame is lifted up through the lifting structure, so that the substrate bearing disc, a substrate to be coated placed on the substrate bearing disc, the bearing structure below the substrate bearing disc and a conveying device are separated; the lifting structure keeps the to-be-coated substrate placed on the substrate bearing disc away from the lower metal mechanical supporting parts such as the guide rail, the roller and the like, so that the phenomenon that the magnetic field is unstable due to the influence of the metal mechanical supporting parts on a process electromagnetic field is avoided, the consistency of a coating process is improved, and a more uniform coating effect can be obtained; meanwhile, in the technical scheme of the invention, the lifting structure lifts the heater away from the lower metal mechanical structure at the same time, so that the cold end in the process thermal field caused by the lower metal structure is avoided, the problem of non-uniformity of the process thermal field is avoided, the consistency of the coating process is improved, and a more uniform coating effect is ensured; the distance between the substrate to be coated and the electrode plate is adjustable through the lifting structure, namely, the position of the substrate to be coated in the coating process area can be adjusted according to the characteristics of the substrate to be coated, such as size, material and the like, the adjustable height of the coating process area increases a process parameter for the whole coating process system, the controllability of the process is increased, and the technical method can be flexibly suitable for various coating process requirements.
Drawings
FIG. 1 is a schematic cross-sectional side view of a substrate separable heating carrier system according to the present invention;
FIG. 2 is a schematic cross-sectional view of the system after the substrate carrier platter, the heater and the carrier are separated;
FIG. 3 is a schematic view of the structure of a substrate carrier tray and a tray frame;
fig. 4 is an enlarged schematic view of a portion a in fig. 1.
Detailed Description
The invention relates to a vacuum coating device with separable base materials, which comprises a substrate bearing disc 1 for placing a substrate to be coated, a heater 4 arranged below the substrate bearing disc 1, an electromagnetic field generating device 8 and a process gas generating device 9 arranged above the substrate bearing disc 1, wherein the area between the substrate bearing disc 1 and the electromagnetic field generating device 8 and the process gas generating device 9 is a coating process area 7, and the vacuum coating device also comprises a tray outer frame 2 and a lifting structure 6; as shown in fig. 1, a substrate carrying tray 1 is arranged on the upper end surface of a tray outer frame 2, a hollow lifting port 3 is arranged at the central part of the tray outer frame 2, and the area of a heater 4 is smaller than that of the lifting port 3; the lifting structure 6 drives the heater 4 to lift the substrate to be coated on the substrate bearing disc 1 to the stable electromagnetic field area of the coating process area 7 through the lifting port 3.
The lifting structure 6 comprises a screw rod 6-6, a servo mechanism 6-7 for driving and connecting the screw rod 6-6 and a moving platform 6-4, wherein the servo mechanism 6-7 and the screw rod 6-6 are fixed on the upper end surface of a servo fixing plate 6-9; a trapezoidal nut 6-2 is arranged on the movable platform 6-4, and the trapezoidal nut 6-2 is in threaded connection with the screw rod 6-6; the movable platform 6-4 is connected with a heater supporting block 5 arranged at the bottom of the heater 4 through a movable strut 6-1; the movable support 6-1 is sleeved inside the telescopic corrugated pipe 6-3, and the corrugated pipe 6-3 is arranged on the upper end face of the movable support fixing plate 6-5.
As shown in fig. 4, the electromagnetic-field generating device 8 includes: the electrode plate fixing device comprises a multilayer electrode plate 8-1 and an electrode base 8-3 which are sequentially arranged from top to bottom, wherein the multilayer electrode plate 8-1 and the electrode base 8-3 are fixedly connected through an electrode plate fixing piece 8-4 made of aluminum ceramic; the process gas generation device 9 includes: the middle gas distribution plate 9-2, the multi-path gas distribution plate 9-3, the multi-layer electrode plate 8-1, the electrode base 8-3, the middle gas distribution plate 9-2 and the multi-path gas distribution plate 9-3 are fixedly connected through an electrode fixing component 8-2 and are arranged below the electrode base 8-3; the process gas inlet 9-1 is arranged on the multilayer electrode plate 8-1, the process gas inlet 9-1 is communicated with the air passages of the middle gas distribution plate 9-2 and the multi-path gas distribution plate 9-3, and the process gas entering from the process gas inlet 9-1 is introduced into the film coating process area 7 through the middle gas distribution plate 9-2 and the multi-path gas distribution plate 9-3. The electromagnetic field generating device 8 and the process gas generating device 9 which are arranged together enable the process electromagnetic field and the gas generating area to be overlapped to form a coating process area 7, when the heater 4 is lifted up and enters the coating process area 7 to be preset, the coating process area with uniform electromagnetic field, thermal field and process gas distribution can be obtained, and the coating process of the substrate to be coated is ensured to be in the most uniform area under various conditions.
Referring to fig. 1, when the substrate carrier tray 1, the heater 4 and the lower carrier member are in an unseparated state, the heater 4 and the substrate carrier tray 1 are supported by four moving pillars 6-1 and four hexagonal columns 6-8. When the substrate bearing disc enters the coating process cavity through a guide rail, a roller or other transmission devices and is positioned below the electromagnetic field generating device 8 and the process gas generating device 9, the transmission devices stop moving, and the servo mechanisms 6-7 are started; the screw rod 6-6 rotates, and the trapezoidal nut 6-2 drives the moving platform 6-4 to move upwards along the screw rod 6-6; meanwhile, a movable support 6-1 fixedly connected with a movable platform 6-4 is drawn out from the interior of the corrugated pipe 6-3 to drive a heater support block 5 and a heater 4 fixed at the top end of the movable support 6-1 to move upwards, the heater 4 penetrates out of the lifting port 3, and the substrate bearing disc 1 is jacked up from the central part to separate the substrate bearing disc 1 from the outer tray frame 2 and moves upwards to enter a film coating process area 7; when the substrate bearing disc 1 reaches a preset height, the servo mechanisms 6-7 stop moving, and at the moment, the substrate bearing disc 1 and the substrate to be coated placed on the substrate bearing disc reach a preset electromagnetic field stable area in the coating process area 7;
as shown in fig. 2, the substrate carrying tray 1 and the heater 4 are separated from the lower carrying structure, and after the substrate carrying tray 1 and the substrate to be coated placed thereon reach the predetermined position in the coating process zone 7, the coating process is performed in a more stable electromagnetic field, so as to obtain a more uniform coating effect; the substrate to be coated is closer to the gas distribution port of the multi-path gas distribution plate 9-3, so that the process gas is distributed more uniformly in the region, and the coating effect is further ensured to be more uniform.
The heaters 5 classified with the supporting structures such as the lower tray outer frame 2 and the like only need to heat the substrate bearing disc 1 and the substrate to be coated, so that the heating speed is higher and the efficiency is higher; meanwhile, the substrate to be coated is positioned in an independent thermal field, so that the cold end in the process thermal field caused by a lower metal structure is avoided, the problem that the coating effect is inconsistent due to the fact that the process thermal field is not uniform is avoided, the consistency of the coating process is improved, and the more uniform coating effect can be obtained.
After the technical scheme of the invention is used, the consistency of the coating process can be ensured, a more uniform coating effect can be obtained, and the technical scheme of the invention has simple structure and extremely high practicability.
Claims (4)
1. A vacuum plating apparatus with a separable substrate, comprising: the device comprises a substrate bearing disc for placing a substrate to be coated, a heater arranged below the substrate bearing disc, an electromagnetic field generating device and a process gas generating device which are arranged above the substrate bearing disc, wherein the region between the substrate bearing disc and the electromagnetic field generating device and between the substrate bearing disc and the process gas generating device is a coating process region; the lifting structure drives the heater to lift the substrate to be coated on the substrate bearing disc to the electromagnetic field stable area of the coating process area through the lifting port.
2. The vacuum plating apparatus with a separable substrate according to claim 1, wherein: the elevation structure includes: the servo mechanism is connected with the screw rod in a driving mode, and the moving platform is provided with a trapezoidal nut which is in threaded connection with the screw rod; the movable platform is connected with a heater supporting block arranged at the bottom of the heater through a movable support column.
3. The vacuum plating apparatus with a separable substrate according to claim 1, wherein: the electromagnetic field generating device includes: the electrode comprises a plurality of layers of electrode plates and an electrode base which are sequentially arranged from top to bottom, wherein the plurality of layers of electrode plates and the electrode base are fixedly connected through an electrode fixing assembly.
4. The vacuum plating apparatus with a separable substrate according to claim 1, wherein: the process gas generation device comprises: the multi-layer electrode plate, the electrode base, the middle gas distribution plate and the multi-path gas distribution plate are fixedly connected through the electrode fixing assembly; the process gas inlet is arranged on the multilayer electrode plate, and the process gas is introduced into the film coating process area through the middle gas distribution plate and the multi-path gas distribution plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010848499.7A CN112030110A (en) | 2020-08-21 | 2020-08-21 | Vacuum coating equipment with separable base materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010848499.7A CN112030110A (en) | 2020-08-21 | 2020-08-21 | Vacuum coating equipment with separable base materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112030110A true CN112030110A (en) | 2020-12-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010848499.7A Pending CN112030110A (en) | 2020-08-21 | 2020-08-21 | Vacuum coating equipment with separable base materials |
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| Country | Link |
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| CN (1) | CN112030110A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113802105A (en) * | 2021-09-07 | 2021-12-17 | 无锡爱尔华光电科技有限公司 | Chain vacuum coating equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289064A (en) * | 2002-03-28 | 2003-10-10 | Mitsubishi Materials Corp | Multilayer silicon electrode plate for plasma etching |
| WO2011018912A1 (en) * | 2009-08-10 | 2011-02-17 | 三菱電機株式会社 | Plasma cvd apparatus, plasma electrode, and method for manufacturing semiconductor film |
| JP2012188684A (en) * | 2011-03-09 | 2012-10-04 | Mitsui Eng & Shipbuild Co Ltd | Thin film deposition apparatus, and thin film deposition method |
| KR20200053347A (en) * | 2018-11-08 | 2020-05-18 | 주식회사 원익아이피에스 | Substrate processing apparatus capable of controlling process temperature |
| CN212560416U (en) * | 2020-08-21 | 2021-02-19 | 无锡爱尔华光电科技有限公司 | Vacuum coating equipment with separable base material |
-
2020
- 2020-08-21 CN CN202010848499.7A patent/CN112030110A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003289064A (en) * | 2002-03-28 | 2003-10-10 | Mitsubishi Materials Corp | Multilayer silicon electrode plate for plasma etching |
| WO2011018912A1 (en) * | 2009-08-10 | 2011-02-17 | 三菱電機株式会社 | Plasma cvd apparatus, plasma electrode, and method for manufacturing semiconductor film |
| JP2012188684A (en) * | 2011-03-09 | 2012-10-04 | Mitsui Eng & Shipbuild Co Ltd | Thin film deposition apparatus, and thin film deposition method |
| KR20200053347A (en) * | 2018-11-08 | 2020-05-18 | 주식회사 원익아이피에스 | Substrate processing apparatus capable of controlling process temperature |
| CN212560416U (en) * | 2020-08-21 | 2021-02-19 | 无锡爱尔华光电科技有限公司 | Vacuum coating equipment with separable base material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113802105A (en) * | 2021-09-07 | 2021-12-17 | 无锡爱尔华光电科技有限公司 | Chain vacuum coating equipment |
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