WO2024011728A1 - 雾化片及雾化装置 - Google Patents

雾化片及雾化装置 Download PDF

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Publication number
WO2024011728A1
WO2024011728A1 PCT/CN2022/116135 CN2022116135W WO2024011728A1 WO 2024011728 A1 WO2024011728 A1 WO 2024011728A1 CN 2022116135 W CN2022116135 W CN 2022116135W WO 2024011728 A1 WO2024011728 A1 WO 2024011728A1
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Prior art keywords
micropores
atomization
sheet according
support frame
heating
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PCT/CN2022/116135
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English (en)
French (fr)
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李博
林旺
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深圳市克莱鹏科技有限公司
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Publication of WO2024011728A1 publication Critical patent/WO2024011728A1/zh

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/10—Devices using liquid inhalable precursors

Definitions

  • the present invention relates to the technical field of liquid atomization, and in particular to an atomization sheet and an atomization device.
  • Electronic atomization equipment includes an atomization device and a power supply that supplies power to the atomization device.
  • the atomization device is internally constructed with a liquid storage chamber, an air flow channel, and an electronic atomization component.
  • the power supply is provided with an accommodating slot, and the atomizing device is installed in the accommodating slot and is electrically connected to the power supply. When the power supply supplies power to the electronic atomization component inside the atomization device, the atomization component atomizes the solution stored in the liquid storage chamber into aerosol and discharges it.
  • the atomizing piece is one of the necessary components of the atomizing device.
  • the function of the atomizing piece is to heat or vibrate aerosols, liquids, etc. to produce atomized gas. Vibration atomization is generally achieved through ultrasonic waves, and heating atomization generally uses heating wires or heating sheets for heating. Most of the existing atomizer sheets have relatively thick structures, and the temperature field spreads rapidly after the heating is stopped, resulting in the need to reheat during continued use, affecting the heating efficiency, and there are also problems such as unconcentrated heat generation.
  • the present invention provides a method that thins the micropore area, places the heating element in the micropore area, and heats and atomizes the liquid passing through or attached to it.
  • the thinned structure effectively reduces the The temperature field diffusion caused by the heat dissipation of the atomizer sheet improves the heating efficiency, making the heat more concentrated and the atomizer sheet and atomization device with better atomization effect.
  • An atomizer sheet including a chip body and a heating element.
  • the chip body has a first side and a second side.
  • the second side is provided with a tank that sinks toward the first side.
  • the tank is connected to the third side.
  • the heating element is located on the first surface, and Electrical heating heats the liquid passing through or attached to the micropores to form an aerosol.
  • the present invention thins the micropore area, places the heating element in the micropore area, and heats and atomizes the liquid passing through or attached to it.
  • the thinned structure is effective. Reduce the temperature field diffusion caused by the heat dissipation of the atomizer piece, improve the heating efficiency, make the heat more concentrated, and the atomization effect is better.
  • a chip body and a heating element are provided.
  • the chip body has a first surface and a second surface.
  • the second surface is provided with a groove body that sinks toward the first surface.
  • the groove body is connected to the first surface.
  • the liquid in the tank can be sucked out through the micropores; the heating element is located on the first surface and is powered by electricity.
  • the liquid passing through or attached to the micropores is heated to form an aerosol.
  • the micropores can keep the liquid attached when there is no suction, which is the oil-locked state.
  • suction is applied, the liquid can be sucked out of the micropores.
  • the liquid can be heated by the heating element to form aerosol.
  • Figure 1 is a schematic three-dimensional structural diagram of the atomizer sheet of the present invention.
  • Figure 2 is a schematic three-dimensional view of the atomizer sheet in Figure 1 from another perspective.
  • Figure 3 is a front view of the atomizer sheet in Figure 1.
  • Figure 4 is a cross-sectional view along line A-A in Figure 3 .
  • an atomizer sheet is provided with a chip body 1 and a heating element 2.
  • the chip body 1 has a first surface 111 and a second surface 121.
  • the second surface 121 is provided with a surface facing the first surface.
  • the tank body 122 in which the surface 111 is sunk has a microporous area 112 between the tank body 122 and the first surface 111.
  • the microporous area 112 is evenly distributed with micropores.
  • the chip body 1 includes a diaphragm 11 and a support frame 12.
  • the support frame 12 is provided on one side of the diaphragm 11.
  • the chip body 1 is divided into a diaphragm 11 and a support frame 12 to facilitate the processing of the diaphragm 11 and reduce structural costs. Low and easy to manufacture.
  • the diaphragm 11 is a single crystal silicon film, and a template formed of the single crystal silicon film is used, which has strong wear resistance and reliable structure.
  • the first surface 111 is provided on the side of the single crystal silicon film facing away from the support frame
  • the second surface 121 is provided on the side of the support frame 12 facing away from the single crystal silicon film
  • the groove body 122 is provided on the support frame 12.
  • the microporous area 112 is formed on the single crystal silicon film through etching or photolithography.
  • the micropores on the microporous area 112 are smaller micropores used to lock and guide oil. They are formed through etching or photolithography, and the processing effect is good.
  • the thickness of the monocrystalline silicon film is 0.01 ⁇ 0.5mm. It adopts a thin film structure with a smaller thickness. Different from the traditional heating sheet, the structure is thinned to effectively reduce the temperature field diffusion caused by the heat dissipation of the atomization sheet and improve the heating efficiency.
  • the support frame 12 is a silicon-based support frame 12. In this embodiment, when combined with a single crystal silicon film, it has better stability and stronger wear resistance.
  • the support frame 12 is made of silicon dioxide or silicon nitride. In a more preferred embodiment, silicon dioxide or silicon nitride is used as the support frame 12, which can also ensure the wear resistance of the structure.
  • the heating element 2 includes a heating circuit 21 provided on the first surface 111 and passing through the micropore area 112.
  • the heating circuit 21 is provided with a first contact position 22 and a second contact position 23 at both ends.
  • the first contact position The position 22 and the second contact position 23 are used for contact conduction, and control the heating circuit 21 to heat the microporous area 112, and convert the liquid into aerosol after heating.
  • An atomization device which adopts the atomization sheet with the above structure, has high heating efficiency, good atomization effect on liquid, reliable structure and strong wear resistance.
  • the present invention thins the microporous area 112, places the heating element 2 in the microporous area 112, and heats and atomizes the liquid passing through or attached to it. Different from the traditional heating sheet, the thinned structure effectively reduces the heat dissipation of the atomizing sheet.
  • the temperature field diffusion improves the heating efficiency, making the structural heating more concentrated and the atomization effect better.
  • a chip body 1 and a heating element 2 are provided.
  • the chip body 1 has a first surface 111 and a second surface 121.
  • the second surface 121 is provided with a groove body 122 that sinks toward the first surface 111.
  • the heating element 2 is located on the first surface 111.
  • One side 111 is electrically heated to heat the liquid passing through or attached to the micropores to form aerosol.
  • the micropores can maintain the liquid adhesion state when there is no suction, that is, the oil-locked state.
  • suction is applied, the liquid can be sucked out of the micropores.
  • the liquid can be heated by the heating element 2 to form aerosol.

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  • Resistance Heating (AREA)

Abstract

一种雾化片及雾化装置，包括芯片本体（1），发热元件（2），芯片本体（1）具有第一面（111）、以及第二面（121），第二面（121）设有朝向第一面（111）沉入的槽体（122），槽体（122）与第一面（111）之间具有微孔区（112），微孔区（112）均布有微孔，当第一面（111）具有吸力时，可将槽体（122）内的液体通过微孔吸出；发热元件（2）设于第一面（111）、并通电加热将通过或附着在微孔的液体加热形成气雾。通过将微孔区（112）薄化，将发热元件（2）设在微孔区（112），将经过或附着的液体进行加热雾化，区别传统的发热片，将结构薄化后有效减低雾化片散热导致的温场扩散，提升发热效率，使得发热更加集中，雾化效果更佳。

Description

雾化片及雾化装置
相关申请的交叉引用。
本申请要求于2022年07月13日提交中国专利局，申请号为202210820951.8，发明名称为“雾化片及雾化装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及液体雾化技术领域，特别是涉及一种雾化片及雾化装置。
 背景技术
电子雾化设备包括雾化装置和为雾化装置供电的供电器，雾化装置内部构建有储液腔、气流通道及电子雾化组件。供电器开设有容纳槽，雾化装置安装于容纳槽内，并与供电器建立电性连接。当供电器为雾化装置内部的电子雾化组件供电时，雾化组件将储液腔内部存储的溶液雾化成气雾排出。
 技术问题
雾化片是雾化装置必备的元器件之一，雾化片的作用是将气溶胶、液体等物进行加热或震动产生雾化气体。震动雾化一般是通过超声波实现，加热雾化现有一般采用发热丝或发热片进行加热。现有的雾化片结构大都较为厚重，在加热停止后温场快速扩散，导致在持续使用时需要重新加热，影响加热效率，还存在发热不集中等问题存在。
 技术解决方案
为解决上述问题，本发明提供一种将微孔区薄化，将发热元件设在微孔区，将经过或附着的液体进行加热雾化，区别传统的发热片，将结构薄化后有效减低雾化片散热导致的温场扩散，提升发热效率，使得发热更加集中，雾化效果更佳的雾化片及雾化装置。
上述目的可采用下列技术方案来实现。
一种雾化片，包括芯片本体，发热元件，所述芯片本体具有第一面、以及第二面，所述第二面设有朝向第一面沉入的槽体，所述槽体与第一面之间具有微孔区，所述微孔区均布有微孔，当第一面具有吸力时，可将槽体内的液体通过微孔吸出；所述发热元件设于第一面、并通电加热将通过或附着在微孔的液体加热形成气雾。
本发明的一个或多个实施例的细节在下面的附图和描述中提出。本发明的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
 有益效果
相比现有的雾化片，本发明将微孔区薄化，将发热元件设在微孔区，将经过或附着的液体进行加热雾化，区别传统的发热片，将结构薄化后有效减低雾化片散热导致的温场扩散，提升发热效率，使得发热更加集中，雾化效果更佳。具体是，设置了芯片本体，发热元件，所述芯片本体具有第一面、以及第二面，所述第二面设有朝向第一面沉入的槽体，所述槽体与第一面之间具有微孔区，所述微孔区均布有微孔，当第一面具有吸力时，可将槽体内的液体通过微孔吸出；所述发热元件设于第一面、并通电加热将通过或附着在微孔的液体加热形成气雾。微孔可在没有吸力时保持液体附着状态，即为锁油状态，当受到吸力时，可将液体从微孔中吸出，吸出过程中可通过发热元件对液体加热形成气雾。
 附图说明
为了更好地描述和说明这里公开的那些发明的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的发明、目前描述的实施例和/或示例以及目前理解的这些发明的最佳模式中的任何一者的范围的限制。
图1 为本发明雾化片的立体结构示意图。
图2 为图1中雾化片另一视角的立体示意图。
图3 为图1中雾化片的主视图。
图4 为图3中A-A的剖视图。
附图标记说明：芯片本体1、膜片11、第一面111、微孔区112、支撑框12、第二面121、槽体122、发热元件2、发热线路21、第一接触位22、第二接触位23。
 本发明的实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
如图1~图4所示，一种雾化片，设置了芯片本体1，以及发热元件2，芯片本体1具有第一面111、以及第二面121，第二面121设有朝向第一面111沉入的槽体122，槽体122与第一面111之间具有微孔区112，微孔区112均布有微孔，当第一面111具有吸力时，可将槽体122内的液体通过微孔吸出；发热元件2设于第一面111、并通电加热将通过或附着在微孔的液体加热形成气雾。
芯片本体1包括膜片11以及支撑框12，支撑框12设于膜片11的一面，本实施例中，将芯片本体1分成膜片11和支撑框12架，方便膜片11加工，结构成本低，制造方便。
在上述实施例的进一步优选为，膜片11为单晶硅薄膜，采用单晶硅薄膜形成的模板，耐耗性强，结构可靠。
在上述实施例的进一步优选为，第一面111设于单晶硅薄膜背离支持框一面，第二面121设于支撑框12背离单晶硅薄膜一面，槽体122开设在支撑框12，分体结构，结构更加可靠，制备成本低，雾化液体导向稳定。
微孔区112通过蚀刻或光刻形成在单晶硅薄膜，微孔区112上的微孔为较小的微孔，用来锁油和导油，通过蚀刻或光刻形成，加工效果好。
单晶硅薄膜的厚度尺寸为0.01~0.5mm，采用厚度尺寸较小的薄膜结构，区别传统的发热片，将结构薄化后有效减低雾化片散热导致的温场扩散，提升发热效率。
支撑框12为硅基支撑框12，本实施例中，在结合单晶硅薄膜使用稳定性更佳，耐耗性更强。
支撑框12由二氧化硅或氮化硅制成，在更优选的实施例中，采用二氧化硅或者氮化硅作为支撑框12，同样能够保证结构的耐耗性。
发热元件2包括设于第一面111并通过微孔区112的发热线路21，发热线路21的两端分别设有第一接触位22以及第二接触位23，本实施例中，第一接触位22和第二接触位23用于接触导电，并控制发热线路21对微孔区112进行加热，加热后将液体转化为气雾。
一种雾化装置，采用以上结构的雾化片的雾化装置，发热效率高，对液体雾化效果好，结构可靠，耐耗性强。
本发明将微孔区112薄化，将发热元件2设在微孔区112，将经过或附着的液体进行加热雾化，区别传统的发热片，将结构薄化后有效减低雾化片散热导致的温场扩散，提升发热效率，使得结构发热更加集中，雾化效果更佳。具体是，设置了芯片本体1，发热元件2，芯片本体1具有第一面111、以及第二面121，第二面121设有朝向第一面111沉入的槽体122，槽体122与第一面111之间具有微孔区112，微孔区112均布有微孔，当第一面111具有吸力时，可将槽体122内的液体通过微孔吸出；发热元件2设于第一面111、并通电加热将通过或附着在微孔的液体加热形成气雾。微孔可在没有吸力时保持液体附着状态，即为锁油状态，当受到吸力时，可将液体从微孔中吸出，吸出过程中可通过发热元件2对液体加热形成气雾。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 雾化片，其特征在于：包括
    芯片本体，所述芯片本体具有第一面、以及第二面，所述第二面设有朝向第一面沉入的槽体，所述槽体与第一面之间具有微孔区，所述微孔区均布有微孔，当第一面具有吸力时，可将槽体内的液体通过微孔吸出；
    发热元件，所述发热元件设于第一面、并通电加热将通过或附着在微孔的液体加热形成气雾。
  2. 根据权利要求1所述的雾化片，其特征在于：所述芯片本体包括膜片以及支撑框，所述支撑框设于膜片的一面。
  3. 根据权利要求2所述的雾化片，其特征在于：所述膜片为单晶硅薄膜。
  4. 根据权利要求3所述的雾化片，其特征在于：所述第一面设于单晶硅薄膜背离支持框一面，所述第二面设于支撑框背离单晶硅薄膜一面，所述槽体开设在支撑框。
  5. 根据权利要求3所述的雾化片，其特征在于：所述微孔区通过蚀刻、光刻或激光雕刻形成在单晶硅薄膜。
  6. 根据权利要求3所述的雾化片，其特征在于：所述单晶硅薄膜的厚度尺寸为0.01~0.5mm。
  7. 根据权利要求2所述的雾化片，其特征在于：所述支撑框为硅基支撑框。
  8. 根据权利要求2所述的雾化片，其特征在于：所述支撑框为二氧化硅与氮化硅的结合体。
  9. 根据权利要求1所述的雾化片，其特征在于：所述发热元件包括设于第一面并通过微孔区的发热线路，所述发热线路的两端分别设有第一接触位以及第二接触位。
  10. 一种雾化装置，其特征在于：包括权利要求1~9任意一项所述的雾化片。
PCT/CN2022/116135 2022-07-13 2022-10-28 雾化片及雾化装置 WO2024011728A1 (zh)

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