WO2024007969A1 - 散热器及设备 - Google Patents

散热器及设备 Download PDF

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Publication number
WO2024007969A1
WO2024007969A1 PCT/CN2023/104296 CN2023104296W WO2024007969A1 WO 2024007969 A1 WO2024007969 A1 WO 2024007969A1 CN 2023104296 W CN2023104296 W CN 2023104296W WO 2024007969 A1 WO2024007969 A1 WO 2024007969A1
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WO
WIPO (PCT)
Prior art keywords
cavity
heat dissipation
component
heat
heat source
Prior art date
Application number
PCT/CN2023/104296
Other languages
English (en)
French (fr)
Inventor
郑伏惠
李传闪
吴凡
廖凯华
王萌
罗勇
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024007969A1 publication Critical patent/WO2024007969A1/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

Definitions

  • This application relates to the field of heat dissipation technology, and in particular to a radiator and equipment.
  • outdoor equipment In order to meet the operating requirements of various harsh outdoor environments such as ice, snow, heat, wind, sand, and salt spray, outdoor equipment usually uses radiators that can naturally dissipate heat to avoid overheating and downtime of base station equipment caused by the failure of various active heat dissipation components, such as Fan failure, etc.
  • a radiator is usually composed of a heat dissipation base plate and toothed fins.
  • the toothed fins are distributed on the base plate at a certain distance.
  • the heat source component is usually attached to the heat dissipation substrate, and the heat is transferred to the gear plate through the heat dissipation substrate, and then dissipated to the external environment through natural convection and thermal radiation.
  • the heat sink is made of a material with relatively large thermal resistance, when the heat dissipation of the heat source component is large, there is usually a temperature difference of more than 10 degrees from the contact surface between the heat sink substrate and the heat source component to the tooth root of the heat sink fin. There is a temperature difference of tens of degrees at the top, and the temperature difference between the heat dissipation teeth and the external environment is small, which affects the heat dissipation efficiency of the radiator.
  • the embodiment of the present application provides a radiator and equipment that can improve heat dissipation efficiency.
  • embodiments of the present application provide a heat sink, including a heat dissipation module and a main box.
  • the main box includes a first mounting surface, a second mounting surface and at least one through hole.
  • the first mounting surface and the second mounting surface are arranged opposite to each other.
  • the heat dissipation module is arranged on the first mounting surface, and the second mounting surface is provided with a contact structure; the at least one through hole penetrates the second mounting surface and the first mounting surface, and the heat dissipation module A part of the module is used to contact at least one first heat source device of the heat source component through the at least one through hole to dissipate heat of the at least one first heat source device; the contact structure is used to contact at least one of the heat source component A second heat source device contacts to dissipate heat from the at least one second heat source device.
  • a part of the heat dissipation module passes through the at least one through hole to be in contact with at least one first heat source device of the heat source component, including at least the following situations: a part of the heat dissipation module passes through the at least one through hole to be in contact with the heat source component. At least one first heat source device contacts; at least one first heat source device of the heat source component passes through the at least one through hole and can contact a part of the heat dissipation module; a part of the heat dissipation module passes through the at least one through hole, and at least one The first heat source device passes through the at least one through hole, so that a part of the heat dissipation module can be in contact with the at least one first heat source device.
  • the heat exchange path between the heat dissipation module and the first heat source device is greatly shortened, and the heat dissipation efficiency of the radiator is improved.
  • the working medium of the heat dissipation module can also absorb the heat generated by the second heat source device.
  • the main box further includes a recessed portion recessed on the second mounting surface, and the at least one through hole is in contact with the The structures are all located in the recessed portion, the contact structure is protruding on the inner wall of the recessed portion, and the recessed portion is used to accommodate the first heat source device and the second heat source device.
  • the contact structure, at least part of the first heat source device and at least part of the second heat source device are accommodated in the recess, the size occupied by the heat sink and the device with the heat sink in the first direction is reduced, which is beneficial to the heat sink and the device having the heat sink. Miniaturization of radiator equipment.
  • the first mounting surface and the second mounting surface are arranged along a first direction, and the second area and the first area are arranged along a first direction. Different from the arrangement in the third direction of the first direction, the at least one through hole and the contact structure are located in the first area, and the second area is used to provide heat dissipation fins.
  • the through holes are distributed in local areas of the second mounting surface instead of digging holes as a whole, which helps to improve the strength of the main box.
  • Providing heat dissipation fins in the second area is beneficial to dissipating heat to the third heat source device corresponding to the second area of the heat source component. Since the cost of cooling fins is lower than that of two-phase radiators, it is beneficial to reduce the cost of the radiator.
  • the main box includes a support part and a heat dissipation fin,
  • the first mounting surface and the second mounting surface are both provided on the support part, and the heat dissipation fins are fixed on the first mounting surface of the second area.
  • the heat dissipation fins can dissipate heat from the third heat source device of the heat source component, thereby improving the heat dissipation efficiency of the radiator.
  • the main box is formed by a die-casting process.
  • the heat dissipation module needs to circulate working fluid, and the heat dissipation module has high requirements for sealing and reliability.
  • the manufacturing process of the heat dissipation module includes machining (such as milling machine processing) and welding to make it meet the reliability requirements, so that the heat dissipation module
  • the manufacturing process is more complex and difficult, resulting in higher manufacturing costs for heat dissipation modules. If the heat dissipation module has many structural features, it will undoubtedly increase the difficulty and manufacturing cost of the heat dissipation module, and may also affect the reliability of the heat dissipation module.
  • the contact structure for contacting the second heat source device is provided on the main box, and the main box is formed using a die-casting process.
  • the die-casting process is to melt materials (such as aluminum alloy) and then inject them into a mold to form the required structural parts.
  • the contact structure on the main box can be integrally formed with the main body of the main box during the die-casting process, and the manufacturing difficulty and manufacturing cost are also low.
  • the heat dissipation module does not need to be equipped with a structure that is connected to the heat source component.
  • the main box is used to support the heat source component to achieve decoupling of the heat dissipation module and the heat source component, which is conducive to simplifying the structure of the heat dissipation module and facilitating the heat dissipation module.
  • the manufacturing of the heat dissipation module enables the heat dissipation module to adapt to more heat source components.
  • the heat dissipation module is a two-phase heat dissipation module.
  • the heat dissipation module includes: a tooth plate component, including a plurality of two-phase tooth plates, each of the two-phase tooth plates is provided with a heat dissipation pipeline, and the heat dissipation pipeline is used to circulate the working medium; a cavity component, located at the Between the tooth plate component and the first mounting surface, the cavity component is fixedly connected to a plurality of the two-phase tooth plates, the cavity component is fixedly connected to the first mounting surface, and the cavity body
  • the component is provided with a heat dissipation cavity connected to the heat dissipation pipelines of a plurality of two-phase tooth plates, and the heat dissipation cavity is used to circulate the working fluid.
  • the working fluid flowing through the heat dissipation module is a phase-changeable liquid.
  • the working fluid can absorb heat and change from liquid to vapor.
  • the working fluid can release heat and change from steam to liquid.
  • the tooth plate component is connected to the cavity component, and the heat dissipation pipeline on the two-phase tooth plate is connected with the heat dissipation cavity, thereby forming a heat dissipation module in which the working medium can circulate three-dimensionally.
  • the output power of the module can be increased under the same volume, or the occupied volume of the radiator can be reduced under the same output power.
  • the cavity component includes a cavity cover plate and a cavity substrate arranged in a stack, and the cavity cover plate is connected to a plurality of the cavity substrates.
  • the two-phase tooth plates are fixedly connected, and the cavity cover and the cavity base plate are fixedly connected and jointly form the heat dissipation cavity.
  • the cavity base plate is located on a side of the cavity cover away from the tooth plate component. side.
  • the cavity cover and the cavity substrate jointly form a heat dissipation cavity, which facilitates the preparation of cavity components.
  • the cavity cover is provided with a plurality of connection through holes penetrating the cavity cover, and each of the two-phase The tooth plate is fixedly inserted into the corresponding connecting through hole, the heat dissipation pipeline is provided with a flow channel opening, and the flow channel opening is connected with the heat dissipation cavity.
  • the cavity cover plate and the two-phase tooth plate are connected through a plug-in structure, which is beneficial to improving the connection stability between the cavity cover plate and the two-phase tooth plate.
  • the cavity cover includes a first surface and a second surface that are arranged oppositely, and the first surface is provided on the cavity
  • the cover plate faces the side of the cavity substrate, the connecting through hole penetrates the first surface and the second surface, and each of the two-phase teeth has a protruding end, and the protruding end protrudes from the
  • the first surface is provided with the flow channel opening located at the protruding end.
  • the cavity component forms a first weld at the intersection of the protruding end and the first surface. The first weld is fixedly connected to the first surface. The first weld is connected to the protruding end.
  • the end is fixedly connected; the cavity component forms a second weld at the intersection of each two-phase tooth piece and the second surface, and the second weld is fixedly connected to the second surface, and the The second weld seam is fixedly connected to the second surface.
  • the protruding end protrudes from the first surface, and a first micro-slit is formed at the intersection between the protruding end and the first surface.
  • the two-phase toothed plates protrude from the second surface, and a second micro-slit is formed at the intersection between the two-phase toothed plates and the second surface.
  • solder can be coated on the first surface and the second surface. Due to the capillary action of the first micro-slit jointly formed by the protruding end and the first surface, the melted solder on the first surface will flow directionally along the micro-slit jointly formed by the protruding end and the first surface and accumulate to form the first welding seam. Since the protruding end protrudes from the first surface, it is difficult for solder to enter the flow channel opening through the obstruction of the protruding end, thereby reducing the possibility that the flow channel opening is blocked by solder.
  • the melted solder on the second surface will move along the two-phase teeth.
  • the second micro seam formed by the sheet and the second surface flows in a directional direction and accumulates to form a second weld seam.
  • welds are formed on both the first and second surfaces of the cavity cover.
  • the two-phase gear plate includes a first connecting part and a second connecting part that are connected and arranged, and the second connecting part is passed through In the corresponding connecting through hole, the protruding end is provided on a side of the second connecting part away from the first connecting part, and the first connecting part forms a limiting step, and the limiting step is connected with the first connecting part.
  • the second surface contradicts the above.
  • the limiting step is used to limit the position of the two-phase tooth plate relative to the cavity component, thereby improving the positional stability between the two-phase tooth plate and the cavity component, thereby improving the reliability of the heat dissipation module.
  • the outer wall of each two-phase tooth plate is provided with a plurality of micro-stripes, and the plurality of micro-stripes are in contact with the cavity cover. plate contact.
  • Micro-stripes can form multiple micro-slits between the two-phase teeth and the cavity components. Micro-slits further promote directional movement of solder in the micro-slits due to capillary action. After the solder melts, under the capillary action of the micro-slits, it will further move toward the intersection and micro-slits between the two-phase teeth and the cavity components, thus further improving the reliability of the connection between the two-phase teeth and the cavity components.
  • the cavity cover is provided with a plurality of connection through holes communicating with the heat dissipation cavity, and each of the two-phase
  • the tooth plate is provided with a bending sub-portion fixedly connected to the cavity cover, and the bending sub-portion is provided with a diversion pipeline connected to the heat dissipation pipeline, and the diversion pipeline is connected to the corresponding Connection vias are connected.
  • the bending sub-portion is arranged approximately flatly on the cavity cover, that is, the bending sub-portion and the cavity cover are connected to form a flat overlapping structure.
  • the bent secondary part can be fixedly combined with the cavity cover through a welding process. Since the bent secondary part and the cavity cover are fixed on the cavity cover using a flat overlapping structure, the coverage area of the solder can be increased, thereby increasing the width of the weld, which is conducive to improving the quality of the two-phase tooth plate and the cavity cover. Connection stability and reliability between boards.
  • the cavity cover is formed by a stamping process, and the cavity cover includes a first fixing part and a second fixed part connected by bending. a fixing part, the first fixing part protrudes toward the cavity substrate, the first fixing part is fixedly connected to the cavity substrate, and the second fixing part and the cavity substrate together enclose a The heat dissipation cavity.
  • the cavity cover does not need to be provided with a characteristic structure in contact with the heat source component. Therefore, the cavity cover can be integrally formed using a stamping process, and the manufacturing process is simple and low-cost.
  • the cavity component further includes a heat dissipation boss, and the heat dissipation boss is fixedly connected to the cavity base plate away from the tooth plate.
  • the heat dissipation boss is provided separately from the cavity substrate, and the heat dissipation boss is used to contact the first heat source device. Since the cavity substrate and the heat dissipation boss are arranged separately, it is helpful to reduce the manufacturing difficulty of the cavity substrate.
  • the heat dissipation boss and the cavity substrate are fixedly connected together by welding. Fixing the heat dissipation boss on the cavity substrate through welding is beneficial to improving the connection stability between the cavity substrate and the heat dissipation boss.
  • the cavity component further includes a cavity dividing rib provided in the heat dissipation cavity, thereby dividing the heat dissipation cavity into mutually insulated The first subcavity and the second subcavity.
  • the heat dissipation cavity is arranged in separate cavities, which can reduce the impact of single-point leakage on the overall radiator.
  • the heat dissipation pipeline includes a plurality of sub-pipes
  • the two-phase tooth plate includes a first pipeline area and a second pipeline area that are connected and arranged.
  • Pipeline area, the sub-pipeline of the first pipeline area and the sub-pipeline of the second pipeline area are isolated from each other on the two-phase tooth plate, the sub-pipeline of the first pipeline area and all The first sub-cavity is connected to each other, and the sub-pipeline of the second pipeline area is connected to the second sub-cavity.
  • the sub-pipeline in the first pipeline area and the sub-pipeline in the second pipeline area are isolated from each other on the two-phase gear plate, which means that the sub-pipeline in the first pipeline area and the sub-pipeline in the second pipeline area are isolated from each other.
  • the sub-pipes in the second pipeline area are not connected by pipelines on the two-phase gear plates.
  • the sub-pipeline in the first pipeline area is connected to the first sub-cavity
  • the sub-pipeline in the second pipeline area is connected to the first sub-cavity.
  • the heat dissipation module further includes a first mouthguard With the second mouthguard, along the arrangement direction of the plurality of two-phase tooth plates, the plurality of two-phase tooth plates are located between the first mouthguard and the second mouthguard.
  • the first mouthguard and the second mouthguard are used to protect multiple two-phase tooth plates to reduce the impact of abnormal collision, turnover, etc. on the multiple two-phase tooth plates.
  • the heat dissipation module further includes a protective cover, and the protective cover is fixedly connected to a plurality of the two-phase tooth plates, so The tooth plate component is located between the protective cover plate and the cavity component.
  • the protective cover is used to protect multiple two-phase gears to reduce the impact of abnormal collisions, turnover, etc. on multiple two-phase gears.
  • the heat dissipation module further includes a liquid injection pipe
  • the liquid injection pipe includes a main body and a sleeve
  • the cavity component is An opening is provided, the main body is fixed on the opening, the sleeve is fixedly sleeved on the main body, and the sleeve is fixed to the cavity component.
  • the casing is used to enhance the strength of the main pipe and the connection strength between the main pipe and the cavity components, and to reduce the possibility of damage to the main pipe during vibrations (such as caused by strong winds, earthquakes, etc.).
  • the tooth plate component and the cavity component are arranged along a first direction, and a plurality of the two-phase tooth plates are arranged along a second direction different from the first direction. direction, the height of each two-phase tooth plate in the third direction is higher than the height of the cavity component along the third direction, the third direction is different from the first direction, the The third direction is different from said second direction.
  • each two-phase tooth plate along the third direction is higher than the height of the cavity component along the third direction, which is conducive to increasing the area of the heat dissipation pipeline on the two-phase tooth plate and increasing the steam accommodation space (i.e. increasing the size of the two-phase tooth plate).
  • the space of the evaporation cavity of the tooth plate which is beneficial to improving the heat dissipation efficiency of the heat dissipation module and improving the temperature uniformity of the two-phase tooth plate and cavity components.
  • a device in a second aspect, includes a heat sink and a heat source component according to the first aspect, the heat source component is located on the side of the second mounting surface of the main box, and the heat source component includes a first heat source device With the second heat source device, the first heat source device passes through at least one through hole of the heat dissipation module and is in direct contact with the heat dissipation module, and the second heat source device is in contact with the contact structure of the heat dissipation module.
  • the tooth plate component and the cavity component are stacked, and the heat dissipation pipelines on the two-phase tooth plate are connected with the heat dissipation cavity, thereby forming a radiator capable of three-dimensional circulation of working fluid.
  • a heat dissipation module including: a tooth plate component, including a plurality of two-phase tooth plates, each of the two-phase tooth plates is provided with a heat dissipation pipeline, and the heat dissipation pipeline Used for circulating working fluid; cavity component, the cavity component is fixedly connected to a plurality of the two-phase tooth plates, and the cavity component is provided with the heat dissipation pipeline communicating with a plurality of the two-phase tooth plates.
  • the heat dissipation cavity is used to circulate the working fluid.
  • the working fluid is a phase-changeable liquid.
  • the working fluid can absorb heat and change from liquid to vapor.
  • the working fluid can release heat and change from steam to liquid.
  • the tooth plate component is connected to the cavity component, and the heat dissipation pipeline on the two-phase tooth plate is connected with the heat dissipation cavity, thereby forming a heat dissipation module in which the working medium can circulate three-dimensionally.
  • the output power of the module can be increased under the same volume, or the occupied volume of the radiator can be reduced under the same output power.
  • the cavity component includes a cavity cover plate and a cavity substrate arranged in a stack, and the cavity cover plate is connected to a plurality of the cavity substrates.
  • the two-phase tooth plates are fixedly connected, and the cavity cover and the cavity base plate are fixedly connected and jointly form the heat dissipation cavity.
  • the cavity base plate is located on a side of the cavity cover away from the tooth plate component. side.
  • the cavity cover and the cavity substrate jointly form a heat dissipation cavity, which facilitates the preparation of cavity components.
  • the cavity cover is provided with a plurality of connection through holes penetrating the cavity cover, and each of the two-phase The tooth plate is fixedly inserted into the corresponding connecting through hole, the heat dissipation pipeline is provided with a flow channel opening, and the flow channel opening is connected with the heat dissipation cavity.
  • the cavity cover plate and the two-phase tooth plate are connected through a plug-in structure, which is beneficial to improving the connection stability between the cavity cover plate and the two-phase tooth plate.
  • the cavity cover includes a first surface and a second surface that are oppositely arranged, and the first surface is provided on the cavity
  • the cover plate faces the side of the cavity substrate, the connection through hole penetrates the first surface and the second surface, and each of the two-phase teeth has a protruding end, and the protruding end protrudes from the
  • the first surface is provided with the flow channel opening located at the protruding end.
  • the cavity component forms a first weld at the intersection of the protruding end and the first surface. The first weld is fixedly connected to the first surface. The first weld is connected to the protruding end.
  • the cavity component forms a second weld at the intersection of each two-phase tooth plate and the second surface, and the second weld is fixedly connected to the second surface, and the The second weld seam is fixedly connected to the second surface.
  • the protruding end protrudes from the first surface, and a first micro-slit is formed at the intersection between the protruding end and the first surface.
  • the two-phase toothed plate protrudes from the second surface, and a second micro-slit is formed at the intersection between the two-phase toothed plate and the second surface.
  • solder can be coated on the first surface and the second surface. Due to the capillary action of the first micro-slit jointly formed by the protruding end and the first surface, the melted solder on the first surface will flow directionally along the micro-slit jointly formed by the protruding end and the first surface and accumulate to form the first welding seam. Since the protruding end protrudes from the first surface, it is difficult for solder to enter the flow channel opening through the obstruction of the protruding end, thereby reducing the possibility that the flow channel opening is blocked by solder.
  • the melted solder on the second surface will flow directionally along the second micro-slit jointly formed by the two-phase tooth plate and the second surface and accumulate to form a third Two welds.
  • welds are formed on both the first and second surfaces of the cavity cover.
  • the two-phase gear plate includes a first connecting part and a second connecting part that are connected and arranged, and the second connecting part is passed through In the corresponding through groove, the protruding end is provided on a side of the second connecting part away from the first connecting part, and the first connecting part forms a limiting step, and the limiting step is connected with the first connecting part.
  • the second surface contradicts.
  • the limiting step is used to limit the position of the two-phase tooth plate relative to the cavity component, thereby improving the positional stability between the two-phase tooth plate and the cavity component, thereby improving the reliability of the heat dissipation module.
  • the outer wall of each two-phase tooth plate is provided with a plurality of micro-stripes, and the plurality of micro-stripes are in contact with the cavity cover. plate contact.
  • Micro-stripes can form multiple micro-slits between the two-phase teeth and the cavity components. Micro-slits further promote directional movement of solder in the micro-slits due to capillary action. After the solder melts, under the capillary action of the micro-slits, it will further move toward the intersection and micro-slits between the two-phase teeth and the cavity components, thus further improving the reliability of the connection between the two-phase teeth and the cavity components.
  • the cavity cover is provided with a plurality of connection through holes communicating with the heat dissipation cavity, and each of the two-phase
  • the tooth plate is provided with a bending sub-portion fixedly connected to the cavity cover, and the bending sub-portion is provided with a diversion pipeline connected to the heat dissipation pipeline, and the diversion pipeline is connected to the corresponding Connection vias are connected.
  • the bending sub-portion is arranged approximately flatly on the cavity cover, that is, the bending sub-portion and the cavity cover are connected to form a flat overlapping structure.
  • the bent secondary part can be fixedly combined with the cavity cover through a welding process. Since the bent secondary part and the cavity cover are fixed on the cavity cover using a flat overlapping structure, the coverage area of the solder can be increased, thereby increasing the width of the weld, which is conducive to improving the quality of the two-phase tooth plate and the cavity cover. Connection stability and reliability between boards.
  • the cavity cover is formed through a stamping process, and the cavity cover includes a first fixing part and a second fixing part that are integrally provided. part, the first fixing part protrudes toward the cavity substrate, the first fixing part is fixedly connected to the cavity substrate, and the second fixing part and the cavity substrate together enclose the Heat dissipation cavity.
  • the cavity cover does not need to be provided with a characteristic structure in contact with the heat source component. Therefore, the cavity cover can be integrally formed using a stamping process, and the manufacturing process is simple and low-cost.
  • the cavity component further includes a heat dissipation boss, and the heat dissipation boss is fixedly connected to the cavity base plate away from the tooth plate.
  • the heat dissipation boss is provided separately from the cavity substrate, and the heat dissipation boss is used to contact the first heat source device. Since the cavity substrate and the heat dissipation boss are arranged separately, it is helpful to reduce the manufacturing difficulty of the cavity substrate.
  • the heat dissipation boss and the cavity substrate are fixedly connected together by welding. Fixing the heat dissipation boss on the cavity substrate through welding is beneficial to improving the connection stability between the cavity substrate and the heat dissipation boss.
  • the cavity component further includes a cavity dividing rib provided in the heat dissipation cavity, thereby dividing the heat dissipation cavity into mutually insulated The first subcavity and the second subcavity.
  • the heat dissipation cavity is arranged in separate cavities, which can reduce the impact of single-point leakage on the overall radiator.
  • the heat dissipation pipeline includes a plurality of sub-pipes
  • the two-phase tooth plate includes a first pipeline area and a second pipeline area that are connected and arranged.
  • Pipeline area, the sub-pipeline of the first pipeline area and the sub-pipeline of the second pipeline area are isolated from each other on the two-phase tooth plate, the sub-pipeline of the first pipeline area and all The first sub-cavity is connected to each other, and the sub-pipeline of the second pipeline area is connected to the second sub-cavity.
  • the sub-pipeline in the first pipeline area and the sub-pipeline in the second pipeline area are isolated from each other on the two-phase gear plate, which means that the sub-pipeline in the first pipeline area and the sub-pipeline in the second pipeline area are isolated from each other.
  • the sub-pipeline in the second pipe area cannot carry out liquid circulation on the two-phase gear plate where it is located.
  • the sub-pipeline in the first pipeline area is connected to the first sub-cavity
  • the sub-pipeline in the second pipeline area is connected to the first sub-cavity.
  • the heat dissipation module further includes a first mouthguard and a second mouthguard, along the arrangement direction of a plurality of the two-phase tooth plates. , the plurality of two-phase tooth plates are located between the first mouthguard and the second mouthguard.
  • the first mouthguard and the second mouthguard are used to protect multiple two-phase tooth plates to reduce the impact of abnormal collision, turnover, etc. on the multiple two-phase tooth plates.
  • the heat dissipation module further includes a protective cover, and the protective cover is fixedly connected to a plurality of the two-phase tooth plates, so The tooth plate component is located between the protective cover plate and the cavity component.
  • the protective cover is used to protect multiple two-phase gears to reduce the impact of abnormal collisions, turnover, etc. on multiple two-phase gears.
  • the heat dissipation module further includes a liquid injection pipe
  • the liquid injection pipe includes a main body and a sleeve
  • the cavity component is An opening is provided, the main body is fixed on the opening, the sleeve is fixedly sleeved on the main body, and the sleeve is fixed to the cavity component.
  • the casing is used to enhance the strength of the main pipe and the connection strength between the main pipe and the cavity components, and to reduce the possibility of damage to the main pipe during vibrations (such as caused by strong winds, earthquakes, etc.).
  • the tooth plate component and the cavity component are arranged along a first direction, and a plurality of the two-phase tooth plates are arranged along a second direction different from the first direction. direction, the height of each two-phase tooth plate in the third direction is higher than the height of the cavity component along the third direction, the third direction is different from the first direction, the The third direction is different from said second direction.
  • each two-phase tooth plate along the third direction is higher than the height of the cavity component along the third direction, which is conducive to increasing the area of the heat dissipation pipeline on the two-phase tooth plate and increasing the steam accommodation space (i.e. increasing the size of the two-phase tooth plate).
  • the space of the evaporation cavity of the tooth plate which is beneficial to improving the heat dissipation efficiency of the heat dissipation module and improving the temperature uniformity of the two-phase tooth plate and cavity components.
  • a radiator including the heat dissipation module and a main box according to the third aspect, the cavity component of the heat dissipation module is connected to the main box, and the main box is used for Support heat source components.
  • the heat dissipation module includes a tooth plate component and a cavity component connected to the tooth plate component.
  • the heat dissipation pipeline on the two-phase gear plate is connected with the heat dissipation cavity, thereby allowing the working fluid to circulate three-dimensionally.
  • the rapid temperature equalization of the two-phase tooth plate and the cavity components can be achieved, and the equivalent thermal resistance from the heat source component to the heat dissipation module can be reduced. , thus greatly improving the heat dissipation efficiency of the radiator.
  • the main box includes a first mounting surface and a second mounting surface that are oppositely arranged, and the cavity component and the first mounting surface are arranged oppositely.
  • the mounting surfaces are connected, the second mounting surface is used to install the heat source component, the main box is provided with at least one through hole penetrating the first mounting surface and the second mounting surface, and the at least one through hole is The hole is used to pass through the first heat source device of the heat source component, so that the first heat source device and the cavity component can be in direct contact.
  • the first heat source device may be a high power consumption device on the heat source component. Since part of the first heat source device can be in direct contact with the cavity component through at least one through hole, the heat dissipation module can dissipate heat from the first heat source device with high power consumption, thus greatly shortening the exchange time between the radiator and the first heat source device. The thermal path improves the heat dissipation efficiency of the radiator.
  • the main box includes a support part and a heat dissipation fin, and the support part is provided with the first mounting surface and the third Two mounting surfaces, the heat dissipation fins are provided on the first mounting surface, The second mounting surface is used to support the heat source component.
  • the heat dissipation fins can dissipate heat from other heat source devices of the heat source component, thereby improving the heat dissipation efficiency of the radiator.
  • the present application further provides a device including the heat sink and a heat source component according to the second aspect, where the heat sink is used to dissipate heat for the heat source component.
  • this application also provides a method for manufacturing a heat dissipation module, including the following steps:
  • the first surface and the second surface of the cavity cover are coated with solder, and the first surface and the second surface are arranged oppositely.
  • the cavity cover is provided with a plurality of connection through holes penetrating the first surface and the second surface.
  • Each two-phase tooth plate of the tooth plate component is inserted into the corresponding connecting through hole and the cavity base plate and the cavity cover plate are stacked to form a prefabricated body.
  • Each two-phase tooth plate has a protruding end protruding from the first surface, and the cavity The body substrate and the cavity cover together form a heat dissipation cavity connected to the heat dissipation pipeline, and the first surface is arranged toward the cavity substrate.
  • the prefabricated body is put into a welding furnace and welded to obtain a heat dissipation module.
  • the solder forms a first weld at the intersection of the protruding end and the first surface, and the solder forms a second weld at the intersection of the two-phase tooth plate and the second surface.
  • the cavity substrate and the cavity cover are fixedly connected.
  • Figure 1 is a three-dimensional exploded schematic diagram of the equipment provided by the first embodiment of the present application.
  • Figure 2a is a cross-sectional view of the equipment provided by the first embodiment of the present application.
  • Figure 2b is a schematic diagram of the area of the second mounting surface of the main box according to an embodiment of the present application.
  • Figure 2c is a schematic plan view of a heat source component of the present application.
  • FIG. 3 is a partial structural schematic diagram of the radiator provided by the first embodiment of the present application.
  • Figure 4 is a three-dimensional exploded schematic view of the radiator shown in Figure 3;
  • Figure 5a is a schematic diagram of a heat dissipation module provided by the first embodiment of the present application.
  • Figure 5b is an enlarged schematic diagram of partial area A of the two-phase gear plate shown in Figure 5a;
  • Figure 6a is a plan view of the cavity cover provided by the first embodiment of the present application.
  • Figure 6b is a cross-sectional view of the cavity cover shown in Figure 6a;
  • Figure 6c is an enlarged schematic diagram of partial area B of the cavity cover shown in Figure 6b;
  • Figure 7a is a three-dimensional cross-sectional view of the tooth plate component and the cavity component provided by the first embodiment of the present application assembled together;
  • Figure 7b is a schematic diagram when the two-phase tooth plate and the cavity cover are welded together;
  • Figure 8 is an enlarged schematic diagram of a partial area of the radiator provided by the first embodiment of the present application.
  • Figure 9 is a schematic flow chart of a manufacturing method of a heat dissipation module provided by an embodiment of the present application.
  • Figure 10 is a three-dimensional assembly diagram of the heat dissipation module provided by the second embodiment of the present application.
  • Figure 11 is a three-dimensional exploded schematic view of the heat dissipation module shown in Figure 10;
  • Figure 12 is a three-dimensional schematic view of the two-phase tooth plate provided by the second embodiment of the present application.
  • Figure 13 is a partial perspective view of the heat dissipation module and cavity components assembled together according to the second embodiment of the present application;
  • Figure 14 is a three-dimensional exploded schematic view of the cavity cover and the cavity substrate provided in the second embodiment of the present application;
  • FIG. 15 is a cross-sectional view of the heat dissipation module provided by the third embodiment of the present application.
  • Figure 16 is a schematic diagram of a possible structure of the cavity cover provided by the third embodiment of the present application.
  • Figure 17 is a schematic diagram of another possible structure of the cavity cover provided by the third embodiment of the present application.
  • Mobile communication base stations usually have a stacked architecture, including radiators, transceivers (TRX), shielding covers, power supplies, filters and other components.
  • the main heat dissipation component is the radiator.
  • the radiator includes a heat dissipation base plate and teeth.
  • the gear plates are distributed on the base plate at a certain distance. Considering the requirements of anti-corrosion, weight, cost, etc., the materials of the gear plates and the base plate are generally aluminum alloy, which can be processed through die-casting, machining, cold embedding, welding and other processes.
  • the main heat-consuming components in the base station such as the transceiver and power supply, are attached to the heat dissipation substrate. The heat is transferred to the teeth through the heat dissipation substrate, and then dissipated to the external environment through natural convection and thermal radiation.
  • the thermal conductivity of aluminum alloy is limited, generally 140-210W/(mK), so the heat sink itself has a large thermal resistance.
  • the heat dissipation of modules and devices there is usually a temperature difference of more than 10 degrees from the contact surface between the heat dissipation substrate and the device to the root of the heat dissipation teeth, and there is a temperature difference of several tens of degrees from the tooth root to the tooth top.
  • the temperature difference between the heat dissipation teeth and the external environment It is too small to carry out efficient heat exchange, and the heat dissipation capacity of the radiator is limited. Therefore, how to improve the heat transfer of the radiator itself? Conductive capacity and reducing the thermal resistance of the radiator itself are crucial to improving the heat dissipation capacity of the base station.
  • the existing heat dissipation substrate is affected by the thermal conductivity of aluminum alloy, has limited thermal conductivity, and weak plane temperature equalization ability, which is not conducive to rapid heat dissipation of high-density heat-consuming chips to the surroundings, seriously restricting the improvement of the heat dissipation efficiency of the radiator.
  • the temperature uniformity of the tooth blades can be achieved by using an inflated plate, there are obvious constraints on the device layout.
  • the heat conduction path from the radiator substrate to the tooth blades is long, the thermal resistance is large, and the thermal performance improvement is still limited.
  • the radiator includes the cooling module and the main box.
  • the main box includes a first mounting surface, a second mounting surface and at least one through hole. The first mounting surface and the second mounting surface are arranged opposite to each other.
  • the heat dissipation module is arranged on the first mounting surface, and the second mounting surface is provided with a contact structure; the at least one through hole penetrates the second mounting surface and the first mounting surface, and the heat dissipation module A part of the module is used to contact at least one first heat source device of the heat source component through the at least one through hole to dissipate heat from the at least one first heat source device; the contact structure is used to contact at least one of the heat source component A second heat source device contacts to dissipate heat from the at least one second heat source device.
  • This application can be applied to outdoor natural heat dissipation scenarios of various equipment, such as wireless communication base stations, outdoor power supplies, etc.
  • a first embodiment of the present application provides a device 100.
  • the device 100 includes a heat sink 101 and a heat source component 103.
  • the heat sink 101 is used to dissipate heat from the heat source component 103 .
  • the heat source component 103 is a component that can generate heat during operation.
  • the heat source component 103 may be a receiver (RX), a transmitter (TX), a transceiver (TRX), or the like.
  • the heat source component 103 includes a carrier 1031 and a first heat source device 1033, a second heat source device 1035 (shown in Figure 2c) and a third heat source device 1037 (shown in Figure 2c) provided on the carrier 1031.
  • the carrier 1031 may be a printed circuit board (PCB).
  • the device 100 may be a base station device in a mobile communication base station.
  • the first heat source device 1033 may include a chip or the like.
  • the first heat source device 1033 may be a high-power consumption device on the heat source component 103.
  • a device that generates heat within a unit time (such as 1 second or 1 minute) that is not less than a preset range is used as the first heat source device 1033.
  • the second heat source device 1035 is a device whose heat generated per unit time is less than the preset range
  • the third heat source device 1037 is a device whose heat generated per unit time is less than the preset range.
  • the device 100 is not limited to mobile communication base stations, and the heat source component 103 can also be a power supply, a photovoltaic inverter, etc.
  • the radiator 101 includes a main box 1011 and a heat dissipation module 1013.
  • the main box 1011 is used to support the heat source component 103 .
  • the heat dissipation module 1013 dissipates heat from the first heat source device 1033 and the second heat source device 1035 of the heat source component 103 through phase change of the working medium.
  • the first heat source device 1033 of the heat source component 103 is in direct contact with the heat dissipation module 1013. It can be understood that the first heat source device 1033 of the heat source component 103 and the heat dissipation module 1013 can also be in indirect contact through other heat conductive objects.
  • the main box 1011 includes a support part 1012 and heat dissipation fins 1014.
  • the support part 1012 may be made of aluminum alloy or other materials.
  • the support part 1012 has a substantially plate-shaped structure. It can be understood that the material, shape, and size of the support portion 1012 are not limited in this application.
  • the support part 1012 includes a first mounting surface 1015, a second mounting surface 1016 and at least one through hole 1017.
  • the first mounting surface 1015 and the second mounting surface 1016 are arranged oppositely along a first direction, and the first direction may be the X direction shown in FIG. 1 and FIG. 2a.
  • the first mounting surface 1015 is disposed toward the heat dissipation module 1013 .
  • the first mounting surface 1015 is used to install the heat dissipation module 1013 and the heat dissipation fins 1014.
  • the main box 1011 also includes a first area 1020 and a second area 1021 that are connected and arranged.
  • the first area 1020 and the second area 1021 are arranged along a third direction different from the first direction, and the third direction may be the Z direction shown in FIG. 2b.
  • the third direction may be the Z direction shown in FIG. 2b.
  • the area division and structural features on the second mounting surface 1016 illustrated in FIG. 2b are only exemplary to facilitate explanation and understanding, and do not represent actual products. It can be understood that this application does not limit the number of the first areas 1020 and the number of the second areas 1021.
  • the heat dissipation module 1013 is installed on the first mounting surface 1015 of the first area 1020, and the heat dissipation fins 1014 are installed on the first mounting surface 1015 of the second area 1021.
  • the heat dissipation fins 1014 are used to dissipate heat from the heat source component 103, thereby improving the heat dissipation efficiency of the heat sink 101.
  • the position of the third heat source device 1037 on the carrier 1031 corresponds to the position of the heat dissipation fins 1014 on the main box 1011, that is, corresponding to the second area 1021 of the main box 1011.
  • Providing the heat dissipation fins 1014 in the second area 1021 is beneficial to dissipating heat to the third heat source device 1037 of the heat source component 103 corresponding to the second area 1021. Since the cost of the heat dissipation fins 1014 is lower than that of the two-phase heat sink, it is beneficial to reduce the cost of the heat sink 101.
  • the second mounting surface 1016 is used to place the heat source component 103 .
  • the through hole 1017 penetrates the first mounting surface 1015 and the second mounting surface 1016 and is used to pass through the first heat source device 1033 .
  • the second mounting surface 1016 is provided with a contact structure 1018 .
  • Contact structure 1018 is used with the second thermal
  • the source devices 1035 are in contact to dissipate heat from the second heat source device 1035 .
  • the contact structure 1018 may also be in indirect contact with the second heat source device 1035 .
  • the contact structure 1018 may be a protrusion, for example, a cylindrical protrusion, a truncated cone, or other regular or irregular shaped protrusions, etc.
  • the number of contact structures 1018 may be one, two or more.
  • the material of the contact structure 1018 may be aluminum alloy or other materials, such as copper.
  • the heat dissipation module 1013 and the heat source component 103 are arranged along the first direction.
  • the through holes 1017 are distributed in local areas of the second mounting surface 1016 instead of digging the entire hole, which is beneficial to improving the strength of the main box 1011.
  • the second heat source device 1035 and the heat dissipation module 1013 are in indirect contact through the contact structure 1018, the second heat source allows the working medium of the heat dissipation module 1013 to also absorb the heat generated by the second heat source device 1035.
  • a part of the heat dissipation module 1013 passes through at least one through hole 1017 to be in contact with at least one first heat source device 1033 of the heat source component 103; or, at least one first heat source device 1033 of the heat source component 103 Pass through at least one through hole 1017 to be able to contact a part of the heat dissipation module 1013; alternatively, a part of the heat dissipation module 1013 passes through at least one through hole 1017, and at least one first heat source device 1033 passes through at least one through hole 1017 to be able to It is realized that a part of the heat dissipation module 1013 is in contact with at least one first heat source device 1033 .
  • a part of the heat dissipation module 1013 is used to contact at least one first heat source device 1033 of the heat source component 103 through at least one through hole 1017 to dissipate heat from the at least one first heat source device 1033 .
  • the contact structure 1018 is used to contact at least one second heat source device 1035 of the heat source component 103 to dissipate heat from the at least one second heat source device 1035 .
  • the main box 1011 also includes a recessed portion 1030 recessed on the second mounting surface 1016, and at least one through hole 1017 and the contact structure 1018 are located in the recessed portion 1030.
  • the recess 1030 is located in the first area 1020.
  • the recessed portion 1030 is used to accommodate the first heat source device 1033 and the second heat source device 1035 .
  • the contact structure 1018 is protruding from the inner wall of the recessed portion 1030 .
  • the contact structure 1018 is at least partially received in the recess 1030 .
  • the contact structure 1018, at least part of the first heat source device 1033 and at least part of the second heat source device 1035 are accommodated in the recess 1030, the size occupied by the device 100 in the first direction is reduced, which is beneficial to the miniaturization of the device 100.
  • the area occupied by the recessed portion 1030 on the second mounting surface 1016 is the first area 1020.
  • the recessed portion 1030 may extend to the second area 1021. That is, the recess 1030 may be at least partially located in the first area 1020.
  • recessed portion 1030 can be omitted.
  • the main box 1011 is formed by a die-casting process, which is simple and low-cost to manufacture.
  • the die-casting process is to melt materials (such as aluminum alloy) and then inject them into a mold to form the required structural parts. It can be understood that the heat dissipation fins 1014 and the support portion 1012 can be made integrally or separately.
  • the heat dissipation module needs to circulate working fluid, and the heat dissipation module has high requirements for sealing and reliability.
  • the manufacturing process of the heat dissipation module includes machining (such as milling machine processing) and welding to make it meet the reliability requirements, so that the heat dissipation module The manufacturing process is more complex and difficult. If the heat dissipation module has many structural features, it will undoubtedly increase the difficulty and manufacturing cost of the heat dissipation module, and may also affect the reliability of the heat dissipation module.
  • the contact structure 1018 is provided on the main box 1011 instead of the heat dissipation module 1013, the layout of the heat dissipation module 1013 and the heat source component 103 is decoupled (no fixed connection relationship with each other), and the structure of the heat dissipation module 1013 is simplified. , which facilitates the manufacturing of the heat dissipation module 1013, reduces the manufacturing difficulty and cost of the heat dissipation module 1013, and also improves the reliability of the heat dissipation module 1013.
  • the contact structure 1018 for the second heat source device 1035 is provided on the main box 1011, and the main box 1011 is formed using a die-casting process, the contact structure 1018 on the main box 1011 can be connected with the main box 1011 during the die-casting process.
  • the main body is formed in one piece, making it simple to manufacture and low in cost.
  • the heat sink 101 also includes a heat conductive medium, which is filled in the gap between the main box 1011 and the heat dissipation module 1013 to reduce the thermal resistance between the heat dissipation module 1013 and the main box 1011.
  • the heat conductive medium can be silicone grease, Gel, graphite film, etc.
  • the main box 1011 and the heat dissipation module 1013 can be combined by threads, welding, etc. This application does not limit the connection method between the main box 1011 and the heat dissipation module 1013.
  • the heat source component 103 can be fixed on the support portion 1012 of the main box 1011 through threaded connection, bonding, etc.
  • a heat sink 101 includes a main box 1011 and a heat dissipation module 1013.
  • the main box 1011 includes a first mounting surface 1015 and a second mounting surface 1016 that are oppositely arranged.
  • the heat dissipation module 1013 is disposed on the first mounting surface 1015.
  • the second mounting surface 1016 is provided with at least one through hole 1017 and a contact structure 1018. .
  • At least one through hole 1017 is used to pass through the first heat source device 1033 of the heat source component 103 so that the first heat source device 1033 can directly contact the heat dissipation module 1013, and the contact structure 1018 is used to communicate with the second heat source device 1035 of the heat source component 103. touch.
  • main box 1011 is not limited to the die-casting process, and it can also be made by machining or other processes.
  • the heat dissipation module 1013 includes a tooth plate component 10 , a cavity component 30 and a liquid injection tube 40 .
  • the cavity component 30 is located between the first mounting surface 1015 and the gear component 10 .
  • the cavity component 30 is fixedly connected and communicated with the tooth plate component 10 for circulating working fluid.
  • the liquid injection pipe 40 is fixedly connected to the cavity component 30 and is used to inject working fluid into the cavity component 30 .
  • the cavity component 30 is fixedly connected to the first mounting surface 1015 of the main box 1011 , and the cavity component 30 is located between the tooth plate component 10 and the main box 1011 .
  • the heat dissipation module 1013 and the cavity component 30 are arranged in an array along the first direction.
  • the heat dissipation module 1013 can be used independently from the main box 1011 .
  • the gear assembly 10 includes a plurality of two-phase gears 12 , a protective cover 14 and a mouthguard 16 .
  • a plurality of two-phase tooth plates 12 are fixed on the protective cover 14 and the cavity component 30 .
  • the plurality of two-phase gear plates 12 are located between the protective cover 14 and the cavity component 30
  • the plurality of two-phase gear plates 12 are located between the protective cover 14 and the first mounting surface 1015 of the main box 1011 between.
  • the protective cover 14 is used to protect the plurality of two-phase gear plates 12 to reduce the impact of abnormal collision, turnover, etc. on the plurality of two-phase gear plates 12 .
  • the thickness of the protective cover 14 in the first direction may range from 0.5 mm to 1.5 mm. It can be understood that this application does not limit the thickness range of the protective cover 14 in the first direction.
  • the protective cover 14 can be fixedly connected to the two-phase tooth plate 12 by riveting, gluing or welding.
  • the mouthguard 16 includes a first mouthguard 162 and a second mouthguard 164 .
  • the first mouthguard 162 and the second mouthguard 164 are both fixed on the cavity component 30 .
  • the plurality of two-phase tooth plates 12 are located between the first mouthguard 162 and the second mouthguard 164 .
  • the second direction is different from the first direction, and the second direction may be the Y direction as shown in FIG. 2a, FIG. 3, and FIG. 4.
  • the first mouthguard 162 and the second mouthguard 164 are used to protect the plurality of two-phase tooth plates 12 to reduce the impact of abnormal collision, turnover, etc. on the plurality of two-phase tooth plates 12 .
  • the plurality of two-phase tooth plates 12 are arranged in a second direction that is different from the first direction.
  • the two-phase tooth plate 12 can be made of aluminum plate.
  • the thickness of the two-phase tooth plate 12 in the second direction ranges from 0.6 millimeters (mm) to 2 mm.
  • the two-phase tooth plate 12 can be manufactured through processes such as blowing, sheet metal stamping, and welding. It can be understood that this application does not limit the material of the two-phase tooth plate 12 , this application does not limit the manufacturing process of the two-phase tooth plate 12 , and this application does not limit the thickness range of the two-phase tooth plate 12 in the second direction.
  • the two-phase tooth plate 12 is provided with a heat dissipation pipeline 122 connected with the cavity component 30 for circulating the working fluid.
  • the working fluid can circulate in the heat dissipation pipeline 122 and the cavity component 30 .
  • rapid temperature equalization of the two-phase tooth plate 12 and the cavity component 30 can be achieved, reducing the heat source component 103 to the heat dissipation module.
  • the equivalent thermal resistance is 1013, thus greatly improving the heat dissipation efficiency of the radiator.
  • the heat dissipation pipeline 122 includes a plurality of connected sub-pipes 1222 .
  • the side wall of the sub-pipe 1222 includes a convex structure protruding toward the outside of the two-phase tooth plate 12 .
  • the height of the two-phase tooth plate 12 in the third direction is higher than the height of the cavity component 30 in the third direction, so that the two-phase tooth plate 12 is at least partially protruding from the cavity component 30 in the third direction.
  • the third direction may be the Z direction as shown in Figure 1, Figure 2a, Figure 3, Figure 4, and Figure 5a.
  • the third direction is different from the first direction, and the third direction is different from the second direction.
  • the first direction is generally perpendicular to the second direction
  • the second direction is generally perpendicular to the third direction
  • the third direction is generally perpendicular to the first direction.
  • the two-phase tooth plate 12 is arranged to protrude from the cavity component 30 in the third direction, which is beneficial to increasing the area of the heat dissipation pipeline 122 on the two-phase tooth plate 12 and increasing the steam accommodation space (that is, increasing the area of the two-phase tooth plate 12 (space of the evaporation cavity), which is beneficial to improving the heat dissipation efficiency of the heat dissipation module 1013 and improving the temperature uniformity of the two-phase tooth plate 12 and the cavity component 30.
  • the two-phase gear plate 12 in the third direction, includes a first part 124 and a second part 126 that are connected and arranged.
  • the heat dissipation pipeline 122 is distributed in the first part 124 and the second part 126 .
  • the position of the second part 126 in the third direction, along the direction from the first part 124 toward the second part 126 (that is, the position of the first part 124 is the bottom of the two-phase gear plate 12), the position of the second part 126 is higher than The position height of the cavity component 30 , that is, the second portion 126 is disposed protruding from the cavity component 30 .
  • the length of the end of the second part 126 connected to the first part 124 in the first direction is substantially equal to the length of the second part 126 away from the first part 124 in the first direction, and the second part 126 is along the first direction.
  • the length in one direction is smaller than the length of the first part 124 along the first direction, so that the second part 126 and the first part 124 can form an escape space to avoid the heat dissipation fins 1014 .
  • the length of the second part 126 along the first direction may not be less than the length of the first part 124 along the first direction, and the plurality of heat dissipation fins 1014 may be staggered with the plurality of two-phase teeth 12, for example , in the second direction, at least one heat dissipation fin 1014 is provided in the gap between two adjacent two-phase teeth 12 .
  • the working fluid in the cavity component 30 When the cavity component 30 dissipates heat for the heat source component 103, the working fluid in the cavity component 30 is heated and boils. The working fluid absorbs heat and changes from liquid to steam. The steam rises along the heat dissipation pipe 122 of the first part 124 to the second part 126. heat dissipation pipe 122. The vapor becomes liquid again by releasing heat, and finally flows back to the cavity component 30 under the influence of gravity.
  • the first part 124 includes a first connecting part 1242 and a second connecting part 1244 that are connected and arranged along the first direction.
  • the first connecting portion 1242 is connected between the second portion 126 and the second connecting portion 1244 .
  • the second connection part 1244 is used to connect and communicate with the cavity component 30 .
  • a limiting step 1245 is provided on the first connection part 1242 for connecting with the cavity.
  • the components 30 resist each other to limit the position of the two-phase tooth plate 12 relative to the cavity component 30 , thereby improving the positional stability between the two-phase tooth plate 12 and the cavity component 30 , thereby improving the reliability of the radiator 101 .
  • the number of the second connecting parts 1244 is two, and the two second connecting parts 1244 are protruding from the first connecting part 1242 at intervals, thereby forming a limiting step 1245.
  • the second connection part 1244 is fixedly connected to the cavity component 30 through a brazing process. It can be understood that this application does not limit the second connection part 1244 and the cavity component 30 to be welded together by brazing.
  • the second connection part 1244 and the cavity component 30 can also be welded together by fusion welding, arc welding, pressure welding, gas welding, Resistance welding and other welding processes are used to weld them together. It can be understood that this application does not limit the second connection part 1244 and the cavity component 30 to be fixed together by welding, but the second connection part 1244 and the cavity component 30 are fixedly connected.
  • a plurality of micro-stripes 1247 are provided on the outer wall of the second connecting part 1244 .
  • the micro-stripes 1247 are in contact with the cavity component 30 , so that a plurality of micro-slits are formed between the second connecting part 1244 and the cavity component 30 .
  • Micro-slits further promote directional movement of solder in the micro-slits due to capillary action. After the solder (such as solder) is melted, it will further move toward the junction and micro-slit between the two-phase tooth plate 12 and the cavity component 30 under the capillary action of the micro-slit, thereby further improving the connection between the two-phase tooth plate 12 and the cavity. Reliability of connections between components 30.
  • the micro-stripes 1247 on the second connecting part 1244 may extend along the first direction, and the micro-stripes 1247 on the second connecting part 1244 may also be arranged obliquely with respect to the first direction.
  • the side of the first part 124 away from the second part 126 can be regarded as the tooth root of the two-phase tooth plate 12
  • the side of the second part 126 away from the first part 124 can be regarded as the tooth top of the two-phase tooth plate 12 .
  • the cavity component 30 is provided with a heat dissipation cavity 300 .
  • the heat dissipation cavity 300 is connected with the heat dissipation pipe 122 of each two-phase tooth plate 12 , and the working fluid can circulate between the heat dissipation pipes 122 of the multiple two-phase tooth plates 12 and the heat dissipation cavity 300 .
  • the cavity component 30 includes a cavity cover 32 , a cavity substrate 34 and a heat dissipation boss 36 .
  • the cavity cover 32 and the cavity substrate 34 are stacked along the first direction.
  • the cavity cover 32 is fixedly connected to the cavity base plate 34 and surrounds the heat dissipation cavity 300 , which facilitates the preparation of the cavity component 30 .
  • the number of heat dissipation cavities 300 may be multiple, and the multiple heat dissipation cavities 300 are connected. It can be understood that the number of the heat dissipation cavities 300 may be one or two, and the number of the heat dissipation cavities 300 is not limited in this application.
  • the cavity substrate 34 is located on the side of the cavity cover 32 away from the heat dissipation module 1013 , that is, the cavity cover 32 is located between the heat dissipation module 1013 and the cavity substrate 34 .
  • the heat dissipation boss 36 is fixed on the side of the cavity substrate 34 away from the cavity cover 32 so that the first heat source device 1033 and the heat dissipation module 1013 can be in direct contact.
  • the heat dissipation boss 36 can be provided separately from the cavity substrate 34 to simplify the structure of the cavity substrate 34.
  • the heat dissipation boss 36 is fixedly combined with the cavity substrate 34 by welding, riveting or threading. In other embodiments of the present application, the heat dissipation boss 36 and the cavity substrate 34 may be integrally provided, or the heat dissipation boss 36 may be omitted.
  • various cover pipes 322 are provided on the cavity cover 32 for circulating working fluid.
  • the cavity substrate 34 can be approximately regarded as a flat plate structure.
  • Various connected heat dissipation cavities 300 are formed between the cavity cover 32 and the cavity substrate 34 .
  • Both the cavity cover 32 and the cavity substrate 34 can be formed by sheet metal stamping to reduce the manufacturing difficulty and cost of the cavity component 30 . It can be understood that the cavity cover plate 32 and the cavity base plate 34 can also be formed through other processes such as forging and die casting.
  • the front side of the cavity substrate 34 facing the cavity cover 32 is substantially flat, and the back side of the cavity substrate 34 facing away from the cavity cover 32 is substantially flat. Since the back surface of the cavity substrate 34 is flat, it is convenient to dispose the heat dissipation boss 36 on the back surface of the cavity substrate 34 , thereby reducing the air between the contact surface between the back surface of the cavity substrate 34 and the heat dissipation boss 36 , thereby reducing the heat dissipation mold.
  • the thermal resistance between the group 1013 and the first heat source device 1033 improves the heat dissipation efficiency of the heat sink 101.
  • the back surface of the cavity substrate 34 is flat, the contact between the cavity substrate 34 and the first mounting surface 1015 of the main box 1011 is facilitated, and the air between the back surface of the cavity substrate 34 and the first mounting surface 1015 is reduced.
  • the thermal resistance between the heat dissipation module 1013 and the second heat source device 1035 is reduced, further improving the heat dissipation efficiency of the heat sink 101.
  • the cavity substrate 34 has a simple flat plate structure, and the cavity substrate 34 can be manufactured using a lower manufacturing cost process (such as stamping). , without using a higher-cost manufacturing process (such as milling machine processing), thereby reducing the processing cost of the cavity substrate 34.
  • a lower manufacturing cost process such as stamping
  • a higher-cost manufacturing process such as milling machine processing
  • this application does not limit the molding process of the cavity cover 32 and the cavity substrate 34 .
  • substrate pipes such as grooves can also be provided on the cavity substrate 34 , and the cover pipes 322 on the cavity cover 32 and the substrate pipes of the cavity substrate 34 jointly form the heat dissipation cavity 300 .
  • the cavity cover 32 is made by sheet metal stamping process.
  • the cavity cover 32 includes a first fixing part 321 and a second fixing part 323 that are bent and connected.
  • the first fixing part 321 and the second fixing part 323 are integrally connected.
  • the first fixing part 321 is used for fixed connection with the cavity substrate 34 .
  • cavity The cover plate 32 and the cavity base plate 34 can be fixedly connected together through a welding (eg, brazing) process.
  • the cavity cover 32 also includes a first surface 324 and a second surface 326 arranged oppositely.
  • the first surface 324 is provided on the side of the cavity cover 32 facing the cavity substrate 34
  • the second surface 326 is provided on the cavity cover 32 .
  • 32 is the side facing away from the cavity substrate 34 .
  • the first surface 324 of the second fixing part 323 and the first surface 324 of the first fixing part 321 together form a cover pipe 322 .
  • the first fixing part 321 protrudes toward the direction of the cavity substrate 34 , so that both the first surface 324 and the second surface 326 form an uneven surface structure.
  • the first mouthguard 162 and the second mouthguard 164 are both fixed on the second surface 326 .
  • the phase change of the working medium can achieve rapid temperature equalization of the cavity component 30, which is beneficial to breaking through the thermal conductivity constraints of the cavity substrate 34's own material (such as aluminum alloy, etc.), and effectively reducing the thermal resistance of the cavity substrate 34 and the heat source component 103 temperature.
  • this application does not limit the cavity cover 32 and the cavity base plate 34 to be welded together by soldering.
  • the cavity cover 32 and the cavity base plate 34 can also be welded together by fusion welding, arc welding, pressure welding, gas welding, Resistance welding and other welding processes are used to weld them together. It can be understood that this application does not limit the cavity cover 32 and the cavity base plate 34 to be fixed together by welding, but the cavity cover 32 and the cavity base plate 34 are fixedly connected.
  • the cavity cover 32 and the two-phase tooth plate 12 are connected through a plug-in structure.
  • the second fixing portion 323 of the cavity cover 32 is provided with a plurality of connection through holes 328 that communicate with the heat dissipation cavity 300 .
  • the connection through hole 328 is used to plug into the second connecting portion 1244 of the two-phase tooth plate 12 , which is helpful to simplify the assembly between the two-phase tooth plate 12 and the cavity component 30 .
  • the first connecting part 1242 and the second connecting part 1244 are connected along the first direction, and the two-phase tooth plate 12 is directly inserted into the connecting through hole 328 along the first direction.
  • the heat dissipation pipe 122 on each two-phase gear plate 12 is provided with a flow channel opening 128 on the second connecting portion 1244 .
  • the second connection part 1244 is fixedly inserted into the connection through hole 328.
  • the micro-stripes 1247 on the second connection part 1244 are in contact with the inner wall of the connection through hole 328.
  • the flow channel opening 128 is connected with the heat dissipation cavity 300, thereby realizing a heat dissipation pipeline.
  • 122 is connected to the heat dissipation cavity 300, thereby realizing three-dimensional (3D) three-dimensional circulation of the working fluid.
  • the shape of the flow channel opening 128 may be circular, waist-circular, rectangular, etc.
  • the size of the connecting through hole 328 can be slightly larger than the size of the flow channel opening 128 to facilitate the insertion of the two-phase tooth plate 12 on the cavity cover 32 . It can be understood that the present application does not limit the size of the connecting through hole 328.
  • the cavity cover 32 can also have a certain degree of elasticity, and the two-phase tooth plate 12 can be inserted into the connecting through hole 328.
  • the gap range between the outer wall of the two-phase tooth plate 12 where the flow channel opening 128 is located and the inner wall of the connecting through hole 328 is less than 0.15 mm. This reduces shaking and loosening due to excessive gaps when the cavity cover 32 and the two-phase tooth plate 12 are combined together through a welding process, thus improving the reliability of the radiator 101 .
  • the second connecting part 1244 has a protruding end 1248 disposed protruding from the first surface 324 .
  • the protruding end 1248 protrudes from the first surface 324.
  • the protruding end 1248 and the first surface 324 together form a generally triangular space.
  • a first micro-slit is formed at the intersection of the protruding end 1248 and the first surface 324 (not shown in the figure). Show).
  • the first connecting portion 1242 protrudes from the second surface 326 .
  • the first connecting portion 1242 and the second surface 326 together form a space with a substantially triangular structure.
  • the intersection of the two-phase tooth plate 12 and the second surface 326 will form a third Two micro-slits (not shown).
  • the first surface 324 and the second surface 326 are coated with solder. Due to the capillary action of the first micro-slit jointly formed by the protruding end 1248 and the first surface 324, the melted solder on the first surface 324 will flow and accumulate along the first micro-slit jointly formed by the protruding end 1248 and the first surface 324.
  • a first weld 501 is formed. The first welding seam 501 is fixedly connected to the first surface 324 , and the first welding seam 501 is fixedly connected to the protruding end 1248 .
  • the second welding seam 503 is fixedly connected to the two-phase tooth plate 12 , and the second welding seam 503 is fixedly connected to the second surface 326 .
  • solder is formed on both the first surface 324 and the second surface 326 of the cavity cover 32 .
  • Welding seam through this double welding seam design, the connection stability between the two-phase tooth plate 12 and the cavity cover 32 can be improved, thereby greatly improving the reliability of the radiator 101.
  • the shapes of the first welding seam 501 and the second welding seam 503 shown in FIG. 7b are only exemplary and do not represent that the actually formed first welding seam 501 and the second welding seam 503 are triangular.
  • the inner wall of the connecting through hole 328 can also be provided with a plurality of micro-stripes 1247, and the micro-stripes 1247 on the inner wall of the connecting through hole 328 are in contact with the two-phase tooth plate 12, so that the second connecting portion 1244 and the connecting through hole 328 Multiple micro-slits are formed on the inner wall.
  • the solder is able to move directionally in the micro-slits. After the solder melts, under the capillary action of the micro-slit, it will further move toward the intersection and micro-slit between the two-phase tooth plate 12 and the cavity cover 32 , thereby further improving the connection between the two-phase tooth plate 12 and the cavity cover 32 .
  • the microstripes 1247 on the cavity cover 32 and the two-phase tooth plate 12 can be produced by rolling, hot pressing, etching, printing, etc.
  • the structure and shape of the two-phase tooth plate 12 are not limited in this application.
  • the two-phase tooth plate 12 can omit the limiting step 1245.
  • the length of the two-phase tooth plate 12 in the first direction is the same, and each two-phase tooth plate 12 has the same length.
  • the phase tooth plate 12 is inserted into the corresponding connection through hole 328.
  • the two-phase tooth plate 12 is fixedly connected to the cavity cover 32 by welding or other means.
  • the two-phase tooth plate 12 is provided with a heat dissipation pipeline 122 connected with the heat dissipation cavity 300. That is, Can.
  • the first surface 324 and the second surface 326 of the cavity cover 32 are coated with solder (such as solder and flux).
  • solder such as solder and flux.
  • the second connecting portion 1244 of each two-phase tooth plate 12 is inserted into the corresponding connecting through hole 328, and the protruding end 1248 is disposed protruding from the first surface 324.
  • the tooth plate component 10, the cavity cover 32, the cavity substrate 34, etc. are assembled in a tool, and the tool is pushed into a soldering furnace and welded to obtain the heat dissipation module 1013.
  • the inner wall of the heat dissipation cavity 300 may also be provided with a reinforcing structure 400 (as shown in FIG. 7a) to improve the heat dissipation capacity of the heat dissipation cavity 300.
  • the reinforcing structure 400 may be disposed on a side of the cavity base plate 34 facing the cavity cover 32 .
  • the reinforcing structure may include at least one of capillary structure (copper mesh), copper foam, grooves, and the like.
  • the liquid injection tube 40 is fixedly connected to the second surface 326 .
  • the liquid injection pipe 40 includes a main body 42 and a sleeve 44 .
  • the second surface 326 is provided with an opening 329 communicating with the heat dissipation cavity 300 .
  • the main body 42 is fixed on the opening 329. After the main tube 42 injects the working fluid into the heat dissipation cavity 300 is completed, the main tube 42 will be sealed to prevent the working fluid in the cavity component 30 from flowing out.
  • the sleeve 44 is fixedly sleeved on the main body 42 , and the sleeve 44 is fixedly connected to the second surface 326 of the cavity cover 32 .
  • the casing 44 is used to enhance the strength of the main pipe 42 and the connection strength between the main pipe 42 and the cavity cover 32 , and reduce the possibility of damage to the main pipe 42 during vibrations (such as caused by strong winds, earthquakes, etc.).
  • the main body 42 and the casing 44 can be made of the same material (such as aluminum tubes, etc.), and the main body 42 and the casing 44 can be fixed to the cavity cover 32 through integral welding (such as brazing and other welding processes), so that , simplifying the manufacturing process of the radiator 101.
  • the openings may be provided on the cavity substrate 34 , and the sleeve 44 may also be fixedly connected to the cavity substrate 34 .
  • the two-phase gear plate 12 when it is necessary to assemble the heat dissipation module 1013, the two-phase gear plate 12, the cavity cover 32, the cavity substrate 34, the liquid injection pipe 40 and the corresponding tooling are first assembled together and carried out as a whole. After welding, the first mouthguard 162, the second mouthguard 164 and the protective cover 14 are installed or riveted, and then the entire heat dissipation module 1013 is subjected to a pressure test and a helium test. If there is no problem, vacuuming is performed. Carry out working fluid filling and sealing, and finally conduct high-temperature aging testing.
  • the heat sink 101 since the thermal resistance from the first heat source device 1033 to the two-phase tooth plate 12 is greatly reduced, the overall heat dissipation capacity of the heat sink 101 is greatly increased. Compared with a conventional heat sink of the same volume, the heat sink 101 can increase the output power. Alternatively, when the output power of the heat sink is the same as that of a conventional heat sink, the heat sink 101 occupies a smaller volume.
  • the heat source component 103 and the heat sink 101 adopt a stacked structure, and the structure of the cavity substrate 34 is simplified, thereby reducing the cost of the heat sink 101.
  • the tooth plate component 10 and the cavity component 30 of the radiator 101 adopt a direct insertion double weld connection structure, which greatly improves the reliability of the radiator 101.
  • This application also provides a manufacturing method of the heat dissipation module 1013. Please refer to Figure 2a, Figure 7a, Figure 7b and Figure 9 together.
  • the manufacturing method includes the following steps:
  • Step 101 Coat solder on the first surface 324 and the second surface 326 of the cavity cover 32.
  • the first surface 324 and the second surface 326 are arranged oppositely.
  • Step 103 Insert each two-phase tooth plate 12 of the tooth plate component 10 into the corresponding connection through hole 328, and stack the cavity substrate 34 and the cavity cover plate 32 to form a prefabricated body.
  • Each two-phase tooth plate 12 has The protruding end 1248 protrudes from the first surface 324 .
  • the cavity base plate 34 and the cavity cover 32 together form a heat dissipation cavity 300 connected to the heat dissipation pipeline 122 .
  • the first surface 324 is disposed toward the cavity base plate 34 .
  • a micro-slit is formed at the intersection between the first surface 324 and the protruding end 1248 , and a micro-slit is formed at the intersection between each two-phase tooth plate 12 and the second surface 326 .
  • Step 105 put the prefabricated body into the welding furnace for welding to obtain the heat dissipation module 1013.
  • the solder forms a first weld 501 at the intersection of the protruding end 1248 and the first surface 324, and the solder forms a first weld 501 between the two-phase tooth plate 12 and the second surface.
  • the intersection of 326 forms a second weld 503.
  • the first weld 501 is fixedly connected to the first surface 324 and the protruding end 1248, and the second weld 503 is fixedly connected to the second surface 326 and the two-phase tooth plate.
  • the melted solder on the first surface 324 flows directionally along the micro-slit formed by the protruding end 1248 and the first surface 324 and accumulates to form the first weld 501 .
  • the melted solder on the second surface 326 flows along the two-phase tooth plate 12 and the first weld 501 .
  • the micro seams formed by the two surfaces 326 flow in a directional manner and accumulate to form the second weld seam 503 .
  • a second embodiment of the present application provides a heat dissipation module 1013b.
  • the heat dissipation module 1013b provided by the second embodiment has a structure similar to the heat dissipation module 1013 provided by the first embodiment.
  • the heat dissipation module 1013b includes the tooth plate component 10, the cavity component 30 and the liquid injection pipe 40.
  • the cavity component 30 and the tooth plate component 10 are fixedly connected and connected.
  • the liquid injection pipe 40 is fixedly connected to the cavity component 30 and is used to inject working fluid into the cavity component 30 .
  • the difference lies in at least the connection method between the two-phase tooth plate 12 and the cavity component 30 , as well as the structure of the cavity component 30 .
  • Each two-phase tooth plate 12 is provided with a guide pipe 129 connected with the heat dissipation pipe 122.
  • the flow passage opening 128 is provided on the guide pipe 129 and is connected to the corresponding connecting through hole 328.
  • the flow guide pipe 129 is connected with the heat dissipation cavity through the flow passage opening 128 . Gongzhijingsan After the heat pipe 122, the diversion pipe 129, and the flow channel opening 128, it enters the heat dissipation cavity 300 through the connecting through hole 328.
  • the second connecting portion 1244 is generally in a bent structure, and the second connecting portion 1244 is fixedly attached to the second surface 326 .
  • the connection area between the two-phase tooth plate 12 and the cavity cover 32 is bent, and the two-phase tooth plate 12 roughly forms an “L”-shaped structure.
  • the flow guide pipe 129 and the flow channel opening 128 are both provided on the second connecting portion 1244 for communicating with the heat dissipation cavity 300 of the cavity component 30 .
  • the number of the second connecting parts 1244 is multiple (four are used as an example in FIG. 12 ), and the plurality of second connecting parts 1244 are arranged at intervals on the first connecting part 1242 .
  • the number of flow channel openings 128 on each second connection part 1244 may be multiple (four are used as an example in the figure). In other embodiments of the present application, the number of the second connecting portion 1244 can be one or two. The number of the second connecting portion 1244 is not limited in this application. The number of the flow channel openings 128 on the second connecting portion 1244 can be one, two or more. Two, the number of flow passage openings 128 is not limited in this application.
  • the second connecting portion 1244 includes an extending sub-portion 1249 and a bending sub-portion 1250 that are connected and arranged.
  • the diversion pipeline 129 is distributed in the extension sub-part 1249 and the bending sub-part 1250.
  • the flow passage opening 128 is provided on the bending sub-portion 1250.
  • the bent sub-portion 1250 covers the second surface 326 .
  • the bent sub-portion 1250 is substantially flat on the second surface 326 of the cavity cover 32 , that is, the bent sub-portion 1250 and the second surface 326 are connected to form a flat overlapping structure.
  • the bent sub-portion 1250 can be fixedly combined with the second surface 326 through a welding process.
  • the coverage area of the solder can be increased, thereby increasing the width of the weld, which is beneficial to improving the connection between the two-phase tooth plate 12 and the cavity.
  • the cavity cover 32 is generally a flat plate structure.
  • the cavity cover 32 and the cavity substrate 34 together form a heat dissipation cavity.
  • the cavity cover 32 is provided with a plurality of connection through holes 328 penetrating the cavity cover 32 .
  • the flow passage openings 128 on the plurality of two-phase gear plates 12 correspond to the plurality of connecting through holes 328 in a one-to-one correspondence.
  • the shape of the connecting through hole 328 may be circular, elongated, etc., and the shape of the connecting through hole 328 is not limited in this application.
  • the cavity cover 32 may be made of aluminum alloy or the like.
  • the thickness of the cavity cover 32 ranges from 1 mm to 5 mm to improve the reliability of the radiator. This application does not limit the thickness range of the cavity cover plate 32 , and this application does not limit the molding process of the cavity cover plate 32 .
  • the cavity cover plate 32 can be formed by sheet metal, forging, machining and other processes.
  • the cavity substrate 34 is forged from an aluminum alloy block, and the cavity cover 32 is formed by stamping.
  • the thickness of the aluminum alloy block is greater than the thickness of the aluminum alloy plate.
  • a substrate pipeline 342 is formed on the side of the cavity substrate 34 facing the cavity cover 32 .
  • the substrate pipeline 342 is a cavity recessed into the interior of the cavity substrate 34 .
  • a series of fixed bosses 344 are provided on the inner wall of the substrate pipeline 342 .
  • the fixed boss 344 is fixedly connected to the first surface 324 of the cavity cover 32 .
  • the shape of the fixing boss 344 may be circular, rectangular, etc., and the shape of the fixing boss 344 is not limited in this application.
  • the fixed boss 344 will be combined with the cavity cover 32 through solder, and the substrate pipeline 342 can achieve rapid temperature equalization of the cavity substrate 34, thereby enabling rapid heat dissipation of the heat source components.
  • the cavity depth range of the substrate pipeline 342 along the first direction can be 1mm-5mm.
  • the cavity substrate 34 is made of aluminum alloy.
  • the cavity substrate 34 can be forged, machined, Forming by casting and other processes. This application does not limit the cavity depth range of the substrate pipeline 342 along the first direction. This application does not limit the molding process of the cavity substrate 34 .
  • a third embodiment of the present application provides a heat dissipation module.
  • the structure of the heat dissipation module 1013c provided by the third embodiment is similar to that of the heat dissipation module 1013 provided by the first embodiment.
  • the difference lies in at least two-phase teeth.
  • the heat dissipation pipes on the chip 12 are arranged in different areas, and the heat dissipation cavity 300 is arranged in different cavities.
  • the heat dissipation pipeline includes a plurality of sub-pipes 1222.
  • the two-phase gear plate 12 includes a first pipeline area 1201 and a second pipeline area 1203 that are connected and arranged. Both the first pipeline area 1201 and the second pipeline area 1203 are provided with sub-pipes. Line 1222.
  • the sub-pipeline 1222 of the first pipeline area 1201 and the sub-pipeline 1222 of the second pipeline area 1203 are isolated from each other (that is, not connected).
  • the working medium in the sub-pipe 1222 of the first piping area 1201 circulates in the sub-pipe 1222 of the first piping area 1201 .
  • the working fluid in the sub-pipeline 1222 of the second pipeline area 1203 circulates in the sub-pipeline 1222 of the second pipeline area 1203 .
  • the cavity component also includes a cavity dividing rib 38 provided in the heat dissipation cavity, thereby dividing the heat dissipation cavity 300 into a first sub-cavity 301 and a second sub-cavity 303 that are isolated from each other.
  • the sub-pipelines of the first pipeline area 1201 1222 is connected with the first sub-cavity 301
  • the sub-pipeline 1222 of the second pipeline area 1203 is connected with the second sub-cavity 303.
  • the working medium in the first sub-cavity 301 can circulate in the sub-pipeline 1222 of the first pipe area 1201 and the first sub-cavity 301
  • the working medium in the second sub-cavity 303 can circulate in the sub-pipeline 1222 of the second pipe area 1203 and the second sub-cavity 303 .
  • the cavity separation ribs 38 are protruding from the side of the cavity cover 32 facing the cavity base plate 34.
  • the cavity separation ribs 38 can extend along the second direction (the Y direction as shown in Figure 16).
  • the heat dissipation cavity 300 is divided into two parts in the third direction (Z direction as shown in FIG. 16).
  • the first sub-cavity 301 and the second sub-cavity 303 are isolated.
  • the cavity dividing ribs 38 can extend along the third direction (the Z direction as shown in FIG. 17 ), so that the heat dissipation cavity 300 can extend in the second direction (as shown in the Z direction in FIG. 17 ).
  • Y direction shown is divided into a first sub-cavity 301 and a second sub-cavity 303 that are isolated from each other.
  • the sub-pipeline 1222 of the first pipeline area 1201 is connected with the first sub-cavity 301.
  • the sub-tube of the second pipeline area 1203 Road 1222 is connected to the second sub-cavity 303.
  • the sub-pipeline 1222 of the first pipeline area 1201 is connected with the first sub-cavity 301
  • the sub-pipeline 1222 of the second pipeline area 1203 is connected with the second sub-cavity. Just connect with 303.
  • the cavity dividing ribs 38 can also be disposed on the cavity base plate 34 , or the cavity dividing ribs 38 can be disposed on the cavity cover 32 and the cavity base plate 34 .
  • the sub-pipeline 1222 of the first pipeline area 1201 is connected to the first sub-cavity 301, and the second pipeline area 1203
  • the sub-pipe 1222 is connected with the second sub-cavity 303, and different areas of the radiator are completely isolated, which reduces the impact of single-cavity or multi-cavity leakage on the heat dissipation performance of the heat dissipation module, achieves the goal of thermal isolation, and also improves heat dissipation. device reliability.
  • the heat dissipation pipeline 122 on the two-phase tooth plate 12 may not be arranged in separate zones, and the heat dissipation cavity may be arranged in separate cavities, which can reduce the impact of single-point leakage on the cavity component 30 on the overall radiator. Influence.
  • the heat dissipation cavity is not arranged in separate cavities, and the heat dissipation pipeline 122 on the two-phase tooth plate 12 can be arranged in zones.
  • the heat dissipation pipeline 122 includes a plurality of sub-pipes 1220.
  • the sheet 12 includes a first pipeline area 1201 and a second pipeline area 1203 that are connected and arranged.
  • the sub-pipeline 1220 of the first pipeline area 1201 and the sub-pipeline 1220 of the second pipeline area 1203 are located at The two phase tooth plates 12 are isolated from each other.
  • the number of cavity dividing ribs 38 may be two or more to divide the heat dissipation cavity into multiple sub-cavities.
  • the dividing ribs 38 can be arranged along the tooth length direction (third direction) of the two-phase tooth plates to achieve thermal isolation in the third direction.
  • the dividing ribs 38 can also be arranged along the tooth length direction of the vertical two-phase tooth plates to achieve thermal isolation in the first direction or the second direction. This application does not limit the installation direction of the cavity separation ribs.
  • the tooth length direction of the two-phase tooth plate refers to the tooth root to the tooth top.
  • connection and “connection” mentioned in this application include direct and indirect connections (connections) unless otherwise specified.

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Abstract

本申请提供一种散热器及设备。散热器包括主箱体及散热模组。主箱体包括第一安装面、第二安装面及至少一个通孔,第一安装面与第二安装面相对设置,所述散热模组设置在所述第一安装面上,所述第二安装面设有至少一个通孔及接触结构。所述至少一个通孔贯穿所述第二安装面与所述第一安装面。所述散热模组的一部分通过所述至少一个通孔用于与热源部件的至少一个第一热源器件接触以对所述至少一个第一热源器件进行散热;所述接触结构用于与所述热源部件的至少一个第二热源器件接触以对所述至少一个第二热源器件进行散热,有利于提升散热效率。

Description

散热器及设备
本申请要求在2022年7月5日交中国国家知识产权局、申请号为202210783301.0、申请名称为“两相散热器及电子装置”的中国专利申请,以及要求在2022年10月28日提交中国国家知识产权局、申请号为202211332021.4、申请名称为“散热器及设备”的中国专利申请的优先权其全部内容通过引用结合在本申请中。
技术领域
本申请涉及散热技术领域,特别涉及一种散热器及设备。
背景技术
随着移动通信基站热耗、集成度持续提升,产品面临高功率、高热密度的散热挑战。为了满足冰雪暑热、风沙盐雾等各种户外恶劣环境的运行要求,户外设备散热方式通常采用可进行自然散热的散热器,避免各种有源散热部件失效而导致的基站设备过热宕机,例如风扇故障等。
散热器通常由散热基板和齿片组成,齿片呈一定间距分布在基板上。热源部件通常贴在散热基板上,通过散热基板把热量传递到齿片,再通过自然对流和热辐射散发到外界环境中。由于散热器的制成材质热阻比较大,当热源部件的热耗较大时,从散热基板与热源部件接触面到散热齿片的齿根通常就有10多度的温差,齿根到齿顶又有几十度温差,散热齿与外部环境之间温差较小,影响了散热器的散热效率。
发明内容
本申请实施方式提供了一种能够提高散热效率的散热器及设备。
第一方面,本申请实施例提供一种散热器,包括散热模组及主箱体。主箱体包括第一安装面、第二安装面及至少一个通孔。第一安装面与第二安装面相对设置。所述散热模组设置在所述第一安装面上,所述第二安装面设有接触结构;所述至少一个通孔贯穿所述第二安装面与所述第一安装面,所述散热模组的一部分通过所述至少一个通孔用于与热源部件的至少一个第一热源器件接触以对所述至少一个第一热源器件进行散热;所述接触结构用于与所述热源部件的至少一个第二热源器件接触以对所述至少一个第二热源器件进行散热。
散热模组的一部分通过所述至少一个通孔用于与热源部件的至少一个第一热源器件接触,包括至少以下情形:散热模组的一部分穿过所述至少一个通孔以能够与热源部件的至少一个第一热源器件接触;热源部件的至少一个第一热源器件穿过所述至少一个通孔能够与散热模组的一部分接触;散热模组的一部分穿过所述至少一个通孔,至少一个第一热源器件穿过所述至少一个通孔,以能够实现散热模组的一部分与至少一个第一热源器件接触。
由于第一热源器件通过通孔与散热模组接触,进而大大缩短了散热模组与第一热源器件的换热路径,提高了散热器的散热效率。
由于第二热源器件与散热模组通过接触结构间接接触,使散热模组的工质亦可吸收第二热源器件产生的热量。
根据第一方面,在本申请的第一方面的一种实现方式中,所述主箱体还包括凹设于所述第二安装面上的凹陷部,所述至少一个通孔与所述接触结构均位于所述凹陷部内,所述接触结构凸设于所述凹陷部的内壁上,所述凹陷部用于收容所述第一热源器件与所述第二热源器件。
由于接触结构、第一热源器件的至少部分与第二热源器件的至少部分容纳于凹陷部内,减小了散热器及具有散热器的设备在第一方向上占用的尺寸,有利于散热器及具有散热器的设备的小型化。
根据第一方面,在本申请的第一方面的一种实现方式中,所述第一安装面与所述第二安装面沿第一方向设置,所述第二区域与所述第一区域沿不同于所述第一方向的第三方向排列设置,所述至少一个通孔与所述接触结构均位于所述第一区域,所述第二区域用于设置散热翅片。
通孔分布于第二安装面的局部区域而非进行整体挖孔,这样一来,有利于提高主箱体的强度。
在第二区域设置散热翅片有利于对热源部件对应第二区域的第三热源器件进行散热。由于散热翅片相对两相散热器的成本更低,有利于降低散热器的成本。
根据第一方面,在本申请的第一方面的一种实现方式中,所述主箱体包括支撑部及散热翅片, 所述第一安装面与所述第二安装面均设于所述支撑部上,所述散热翅片固定在所述第二区域的第一安装面上。
散热翅片可以对热源部件的第三热源器件等进行散热,提高了散热器的散热效率。
根据第一方面,在本申请的第一方面的一种实现方式中,所述主箱体通过压铸工艺形成。
散热模组需流通工质,散热模组对密封性、可靠性要求较高,例如,散热模组的制程包括机加(例如铣床加工)、焊接以使其满足可靠性要求,使得散热模组的制程较为复杂、难度较大,导致散热模组的制造成本较高。若散热模组的结构特征多,则无疑会增加散热模组的制备难度及制造成本,也有可能会影响散热模组的可靠性。
本申请中,将用于与第二热源器件接触的接触结构设于主箱体上,而主箱体采用压铸工艺形成。压铸工艺是将材料(例如铝合金)熔化后注入模具,形成所需要的结构件。主箱体上的接触结构可以在压铸过程中与主箱体的主体一体形成,制造难度较低、制造成本也低。而散热模组上不需设置与热源部件配合连接的结构,而是通过主箱体来支撑配合热源部件,实现散热模组与热源部件解耦,有利于简化散热模组的结构,方便散热模组的制造,使得散热模组能够适配更多的热源部件。
根据第一方面,在本申请的第一方面的一种实现方式中,散热模组为两相散热模组。散热模组包括:齿片部件,包括多个设置的两相齿片,每个所述两相齿片设有散热管路,所述散热管路用于流通工质;腔体部件,位于所述齿片部件与所述第一安装面之间,所述腔体部件与多个所述两相齿片固定连接,所述腔体部件与所述第一安装面固定连接,所述腔体部件设有与多个所述两相齿片的所述散热管路连通的散热腔体,所述散热腔体用于流通所述工质。
散热模组流通的工质为可相变的液体。工质能够吸收热量从液体变化为蒸汽。工质能够释放热量从蒸汽变化为液体。通过工质的相变和工质在散热模组流通的流通循环,能够实现散热模组的快速均温,减小热源部件到散热模组的等效热阻,从而大大提升了散热器的散热效率。
齿片部件与腔体部件连接设置,且两相齿片上的散热管路与散热腔体连通,进而形成工质能够立体循环的散热模组。通过工质的相变和工质在散热管路与散热腔体中的流通循环,能够实现两相齿片与腔体部件的快速均温,减小热源部件到散热模组的等效热阻,从而大大提升了散热器及散热模组的散热效率。
与传统的散热器相比较,在相同体积下提升模块的输出功率,或者相同输出功率下降低散热器的占用体积。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体部件包括层叠设置的腔体盖板与腔体基板,所述腔体盖板与多个所述两相齿片固定连接,所述腔体盖板与所述腔体基板固定连接并共同形成所述散热腔体,所述腔体基板位于所述腔体盖板背离所述齿片部件的一侧。
通过腔体盖板与腔体基板共同形成散热腔体,方便了腔体部件的制备。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体盖板上设有贯穿所述腔体盖板的多个连接通孔,每个所述两相齿片固定插接于对应的所述连接通孔中,所述散热管路设有流道口,所述流道口与所述散热腔体连通。
腔体盖板与两相齿片通过插接式结构实现连接,有利于提高腔体盖板与两相齿片的连接稳定性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体盖板包括相对设置的第一表面与第二表面,所述第一表面设于所述腔体盖板朝向所述腔体基板的一侧,所述连接通孔贯穿所述第一表面与所述第二表面,每个所述两相齿片具有突出端,所述突出端凸出所述第一表面设置,所述流道口位于所述突出端。所述腔体部件在所述突出端与所述第一表面的交接处形成第一焊缝,所述第一焊缝与所述第一表面固定连接,所述第一焊缝与所述突出端固定连接;所述腔体部件在每个所述两相齿片与所述第二表面的交接处形成第二焊缝,所述第二焊缝与所述第二表面固定连接,所述第二焊缝与所述第二表面固定连接。
突出端凸出第一表面设置,突出端与第一表面的交接处会形成第一微缝。两相齿片凸出第二表面设置,两相齿片与第二表面的交接处会形成第二微缝。
需对腔体盖板与两相齿片进行焊接时,可在第一表面、第二表面涂覆焊料。由于突出端与第一表面共同形成的第一微缝的毛细作用,第一表面上融化的焊料会沿突出端与第一表面共同形成的微缝定向流动并堆积形成第一焊缝。由于突出端突出第一表面设置,焊料难以透过突出端的阻拦进入流道口,降低了流道口被焊料堵塞的可能性。
由于两相齿片与第二表面共同形成的第二微缝的毛细作用,第二表面上融化的焊料会沿两相齿 片与第二表面共同形成的第二微缝定向流动并堆积形成第二焊缝。
利用腔体盖板上的第一表面与第二表面(腔体盖板的正反两面)上的焊料,在腔体盖板的第一表面与第二表面都形成焊缝,通过这种双焊缝设计,可以提高两相齿片与腔体盖板之间的连接稳定性,进而大幅提高散热模组的可靠性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述两相齿片包括连接设置的第一连接部与第二连接部,所述第二连接部穿设于对应的所述连接通孔内,所述突出端设于所述第二连接部远离所述第一连接部的一侧,所述第一连接部形成限位台阶,所述限位台阶与所述第二表面相抵持。
限位台阶用于对两相齿片相对腔体部件的位置进行限位,提高两相齿片与腔体部件之间的位置稳定性,进而提高散热模组的可靠性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,每个所述两相齿片的外壁设有多个微条纹,多个所述微条纹与所述腔体盖板接触。微条纹可以使两相齿片与腔体部件之间形成多个微缝。由于毛细作用,微缝会进一步促进焊料在微缝中定向移动。焊料融化后在微缝的毛细作用下,会进一步向两相齿片与腔体部件的交接处和微缝里移动,因而可以进一步提升两相齿片与腔体部件之间连接的可靠性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体盖板上设有与所述散热腔体连通的多个连接通孔,每个所述两相齿片上设有与所述腔体盖板固定连接的弯折次部,所述弯折次部上设有与所述散热管路连通的导流管路,所述导流管路与对应的连接通孔连通。
弯折次部大致平铺设置在腔体盖板上,即弯折次部与腔体盖板连接为平铺式搭接结构。弯折次部可通过焊接工艺与腔体盖板固定结合在一起。由于弯折次部与腔体盖板采用平铺式搭接结构固定在腔体盖板上,可以增加焊料的覆盖面积,进而增大焊缝宽度,有利于提高两相齿片与腔体盖板之间的连接稳定性及可靠性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体盖板通过冲压工艺形成,所述腔体盖板包括弯折连接的第一固定部及第二固定部,所述第一固定部朝向所述腔体基板凸出设置,所述第一固定部与所述腔体基板固定连接,所述第二固定部与所述腔体基板共同围成所述散热腔体。
腔体盖板无需设置与热源部件接触的特征结构,因此,腔体盖板可以采用冲压工艺一体形成,制造过程简单且成本低廉。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体部件还包括散热凸台,所述散热凸台固定连接于所述腔体基板背离所述齿片部件的一侧,所述散热凸台与所述腔体基板分体设置,所述散热凸台用于与所述第一热源器件接触。由于腔体基板与散热凸台分体设置,有利于降低腔体基板的制造难度。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述散热凸台与所述腔体基板通过焊接固定连接于一起。通过焊接将散热凸台固定于腔体基板上,有利于提高腔体基板与散热凸台之间的连接稳定性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体部件还包括设于散热腔体内的分腔隔筋,从而将所述散热腔体分隔成相互隔绝的第一子腔与第二子腔。
散热腔体呈分腔设置,可以减小了单点泄漏对整体散热器的影响。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述散热管路包括多个子管路,所述两相齿片包括连接设置的第一管路区域与第二管路区域,所述第一管路区域的子管路与所述第二管路区域的子管路在所述两相齿片上相互隔绝,所述第一管路区域的子管路与所述第一子腔相连通,所述第二管路区域的子管路与所述第二子腔相连通。
所述第一管路区域的子管路与所述第二管路区域的子管路在所述两相齿片上相互隔绝,是指所述第一管路区域的子管路与所述第二管路区域的子管路在所在的两相齿片上未设置管路进行连通。
由于两相齿片上的散热管路分区域设置及散热腔体分区域设置,实现第一管路区域的子管路与第一子腔的相连通,第二管路区域的子管路与第二子腔的相连通,亦实现了散热器的不同区域的完全隔离,从而降低单腔或多腔泄漏对散热模组散热性能的影响,达成热隔离的目标,亦提高了散热器的可靠性。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述散热模组还包括第一护齿 与第二护齿,沿多个所述两相齿片的排列方向,所述多个所述两相齿片位于所述第一护齿与所述第二护齿之间。
第一护齿与第二护齿用于保护多个两相齿片,以降低异常磕碰、周转等对多个两相齿片的影响。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述散热模组还包括保护盖板,所述保护盖板与多个所述两相齿片固定连接,所述齿片部件位于所述保护盖板与所述腔体部件之间。保护盖板用于保护多个两相齿片,以降低异常磕碰、周转等对多个两相齿片的影响
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述散热模组还包括注液管,所述注液管包括主管体及套管,所述腔体部件上设有开孔,所述主管体固定于所述开孔上,所述套管固定套设于所述主管体上,所述套管与所述腔体部件固定。套管用于增强主管体的强度及主管体与腔体部件之间的连接强度,降低震动(例如强风、地震等等引起的)时主管体被损坏的可能性。
根据第一方面,在一种可能的实现方式中,所述齿片部件与所述腔体部件沿第一方向设置,多个所述两相齿片沿不同于所述第一方向的第二方向设置,每个所述两相齿片在所述第三方向的高度高出所述腔体部件沿所述第三方向的高度,所述第三方向不同于所述第一方向,所述第三方向不同于所述第二方向。
每个两相齿片沿第三方向的高度高于腔体部件沿第三方向的高度,有利于增加两相齿片上的散热管路的面积及增大蒸汽的容纳空间(即增大两相齿片的蒸发腔的空间),从而有利于提高散热模组的散热效率,及提高两相齿片及腔体部件的均温性。在腔体部件与热源部件接触时,散热腔体内的工质受热沸腾,工质吸收热量从液体变换为蒸汽,蒸汽在第三方向从两相齿片的齿根的散热管路上升至两相齿片的齿顶的散热管路进行散热。
第二方面,一种设备,包括根据第一方面所述的散热器及热源部件,所述热源部件位于所述主箱体的第二安装面所在一侧,所述热源部件包括第一热源器件与第二热源器件,所述第一热源器件穿过所述散热模组的至少一个通孔与所述散热模组直接接触,所述第二热源器件与所述散热模组的接触结构接触。
齿片部件与腔体部件堆叠设置,且两相齿片上的散热管路与散热腔体连通,进而形成能够立体循环工质的散热器。通过工质的相变和工质在散热管路与散热腔体中的流通循环,能够实现两相齿片与腔体部件的快速均温,减小热源到散热器的等效热阻,大大提升了散热器的散热效率,从而提高了设备的可靠性。
第三方面,本申请实施例提供一种散热模组,包括:齿片部件,包括多个设置的两相齿片,每个所述两相齿片设有散热管路,所述散热管路用于流通工质;腔体部件,所述腔体部件与多个所述两相齿片固定连接,所述腔体部件设有与多个所述两相齿片的所述散热管路连通的散热腔体,所述散热腔体用于流通所述工质。
工质为可相变的液体。工质能够吸收热量从液体变化为蒸汽。工质能够释放热量从蒸汽变化为液体。
齿片部件与腔体部件连接设置,且两相齿片上的散热管路与散热腔体连通,进而形成工质能够立体循环的散热模组。通过工质的相变和工质在散热管路与散热腔体中的流通循环,能够实现两相齿片与腔体部件的快速均温,减小热源部件到散热模组的等效热阻,从而大大提升了散热模组的散热效率。
与传统的散热器相比较,在相同体积下提升模块的输出功率,或者相同输出功率下降低散热器的占用体积。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体部件包括层叠设置的腔体盖板与腔体基板,所述腔体盖板与多个所述两相齿片固定连接,所述腔体盖板与所述腔体基板固定连接并共同形成所述散热腔体,所述腔体基板位于所述腔体盖板背离所述齿片部件的一侧。
通过腔体盖板与腔体基板共同形成散热腔体,方便了腔体部件的制备。
根据第一方面,在本申请的第一方面的一种可能的实现方式中,所述腔体盖板上设有贯穿所述腔体盖板的多个连接通孔,每个所述两相齿片固定插接于对应的所述连接通孔中,所述散热管路设有流道口,所述流道口与所述散热腔体连通。
腔体盖板与两相齿片通过插接式结构实现连接,有利于提高腔体盖板与两相齿片的连接稳定性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述腔体盖板包括相对设置的第一表面与第二表面,所述第一表面设于所述腔体盖板朝向所述腔体基板的一侧,所述连接通孔贯穿所述第一表面与所述第二表面,每个所述两相齿片具有突出端,所述突出端凸出所述第一表面设置,所述流道口位于所述突出端。所述腔体部件在所述突出端与所述第一表面的交接处形成第一焊缝,所述第一焊缝与所述第一表面固定连接,所述第一焊缝与所述突出端固定连接;所述腔体部件在每个所述两相齿片与所述第二表面的交接处形成第二焊缝,所述第二焊缝与所述第二表面固定连接,所述第二焊缝与所述第二表面固定连接。
突出端凸出第一表面设置,突出端与第一表面的交接处会形成第一微缝。两相齿片凸出第二表面设置,两相齿片与第二表面的交接处会形成第二微缝。
需对腔体盖板与两相齿片进行焊接时,可在第一表面、第二表面涂覆焊料。由于突出端与第一表面共同形成的第一微缝的毛细作用,第一表面上融化的焊料会沿突出端与第一表面共同形成的微缝定向流动并堆积形成第一焊缝。由于突出端突出第一表面设置,焊料难以透过突出端的阻拦进入流道口,降低了流道口被焊料堵塞的可能性。
由于两相齿片与第二表面共同形成的第二微缝的毛细作用,第二表面上融化的焊料会沿两相齿片与第二表面共同形成的第二微缝定向流动并堆积形成第二焊缝。
利用腔体盖板上的第一表面与第二表面(腔体盖板的正反两面)上的焊料,在腔体盖板的第一表面与第二表面都形成焊缝,通过这种双焊缝设计,可以提高两相齿片与腔体盖板之间的连接稳定性,进而大幅提高散热模组的可靠性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述两相齿片包括连接设置的第一连接部与第二连接部,所述第二连接部穿设于对应的所述通槽内,所述突出端设于所述第二连接部远离所述第一连接部的一侧,所述第一连接部形成限位台阶,所述限位台阶与所述第二表面相抵持。
限位台阶用于对两相齿片相对腔体部件的位置进行限位,提高两相齿片与腔体部件之间的位置稳定性,进而提高散热模组的可靠性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,每个所述两相齿片的外壁设有多个微条纹,多个所述微条纹与所述腔体盖板接触。微条纹可以使两相齿片与腔体部件之间形成多个微缝。由于毛细作用,微缝会进一步促进焊料在微缝中定向移动。焊料融化后在微缝的毛细作用下,会进一步向两相齿片与腔体部件的交接处和微缝里移动,因而可以进一步提升两相齿片与腔体部件之间连接的可靠性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述腔体盖板上设有与所述散热腔体连通的多个连接通孔,每个所述两相齿片上设有与所述腔体盖板固定连接的弯折次部,所述弯折次部上设有与所述散热管路连通的导流管路,所述导流管路与对应的连接通孔连通。
弯折次部大致平铺设置在腔体盖板上,即弯折次部与腔体盖板连接为平铺式搭接结构。弯折次部可通过焊接工艺与腔体盖板固定结合在一起。由于弯折次部与腔体盖板采用平铺式搭接结构固定在腔体盖板上,可以增加焊料的覆盖面积,进而增大焊缝宽度,有利于提高两相齿片与腔体盖板之间的连接稳定性及可靠性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述腔体盖板通过冲压工艺形成,所述腔体盖板包括一体设置的第一固定部及第二固定部,所述第一固定部朝向所述腔体基板凸出设置,所述第一固定部与所述腔体基板固定连接,所述第二固定部与所述腔体基板共同围成所述散热腔体。
腔体盖板无需设置与热源部件接触的特征结构,因此,腔体盖板可以采用冲压工艺一体形成,制造过程简单且成本低廉。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述腔体部件还包括散热凸台,所述散热凸台固定连接于所述腔体基板背离所述齿片部件的一侧,所述散热凸台与所述腔体基板分体设置,所述散热凸台用于与所述第一热源器件接触。由于腔体基板与散热凸台分体设置,有利于降低腔体基板的制造难度。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述散热凸台与所述腔体基板通过焊接固定连接于一起。通过焊接将散热凸台固定于腔体基板上,有利于提高腔体基板与散热凸台之间的连接稳定性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述腔体部件还包括设于散热腔体内的分腔隔筋,从而将所述散热腔体分隔成相互隔绝的第一子腔与第二子腔。
散热腔体呈分腔设置,可以减小了单点泄漏对整体散热器的影响。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述散热管路包括多个子管路,所述两相齿片包括连接设置的第一管路区域与第二管路区域,所述第一管路区域的子管路与所述第二管路区域的子管路在所述两相齿片上相互隔绝,所述第一管路区域的子管路与所述第一子腔相连通,所述第二管路区域的子管路与所述第二子腔相连通。
所述第一管路区域的子管路与所述第二管路区域的子管路在所述两相齿片上相互隔绝,是指所述第一管路区域的子管路与所述第二管路区域的子管路在所在的两相齿片上不能进行液体流通。
由于两相齿片上的散热管路分区域设置及散热腔体分区域设置,实现第一管路区域的子管路与第一子腔的相连通,第二管路区域的子管路与第二子腔的相连通,实现散热器的不同区域的完全隔离,从而降低单腔或多腔泄漏对散热模组散热性能的影响,达成热隔离的目标,亦提高了散热器的可靠性。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述散热模组还包括第一护齿与第二护齿,沿多个所述两相齿片的排列方向,所述多个所述两相齿片位于所述第一护齿与所述第二护齿之间。
第一护齿与第二护齿用于保护多个两相齿片,以降低异常磕碰、周转等对多个两相齿片的影响。
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述散热模组还包括保护盖板,所述保护盖板与多个所述两相齿片固定连接,所述齿片部件位于所述保护盖板与所述腔体部件之间。保护盖板用于保护多个两相齿片,以降低异常磕碰、周转等对多个两相齿片的影响
根据第三方面,在本申请的第三方面的一种可能的实现方式中,所述散热模组还包括注液管,所述注液管包括主管体及套管,所述腔体部件上设有开孔,所述主管体固定于所述开孔上,所述套管固定套设于所述主管体上,所述套管与所述腔体部件固定。套管用于增强主管体的强度及主管体与腔体部件之间的连接强度,降低震动(例如强风、地震等等引起的)时主管体被损坏的可能性。
根据第三方面,在一种可能的实现方式中,所述齿片部件与所述腔体部件沿第一方向设置,多个所述两相齿片沿不同于所述第一方向的第二方向设置,每个所述两相齿片在所述第三方向的高度高出所述腔体部件沿所述第三方向的高度,所述第三方向不同于所述第一方向,所述第三方向不同于所述第二方向。
每个两相齿片沿第三方向的高度高于腔体部件沿第三方向的高度,有利于增加两相齿片上的散热管路的面积及增大蒸汽的容纳空间(即增大两相齿片的蒸发腔的空间),从而有利于提高散热模组的散热效率,提高了两相齿片及腔体部件的均温性。在腔体部件与热源部件接触时,散热腔体内的工质受热沸腾,工质吸收热量从液体变换为蒸汽,蒸汽在第三方向从两相齿片的齿根的散热管路上升至两相齿片的齿顶的散热管路进行散热。
第四方面,一种散热器,包括根据第三方面所述的散热模组及主箱体,所述散热模组的腔体部件与所述主箱体相接,所述主箱体用于支撑热源部件。
散热模组包括齿片部件及与齿片部件连接设置的腔体部件。两相齿片上的散热管路与散热腔体连通,进而使工质能够立体循环。通过工质的相变和工质在散热管路与散热腔体中的流通循环,能够实现两相齿片与腔体部件的快速均温,减小热源部件到散热模组的等效热阻,从而大大提升了散热器的散热效率。
根据第四方面,在本申请的第四方面的一种可能的实现方式中,所述主箱体包括相对设置的第一安装面与第二安装面,所述腔体部件与所述第一安装面相接,所述第二安装面用于安装所述热源部件,所述主箱体贯穿所述第一安装面与所述第二安装面设有至少一个通孔,所述至少一个通孔用于穿过所述热源部件的第一热源器件,以使所述第一热源器件与所述腔体部件能够直接接触。
第一热源器件可以为热源部件上的大功耗的器件。由于第一热源器件的部分可通过至少一个通孔与腔体部件直接接触,以使散热模组对大功耗的第一热源器件进行散热,进而大大缩短了散热器与第一热源器件的换热路径,提高了散热器的散热效率。
根据第四方面,在本申请的第四方面的一种可能的实现方式中,所述主箱体包括支撑部及散热翅片,所述支撑部设有所述第一安装面与所述第二安装面,所述散热翅片设于所述第一安装面上, 所述第二安装面用于支撑所述热源部件。
散热翅片可以对热源部件的其他热源器件进行散热,提高了散热器的散热效率。
第五方面,本申请还提供一种包括根据第二方面所述的散热器及热源部件,所述散热器用于为所述热源部件进行散热。
第六方面,本申请还提供一种散热模组的制造方法,包括以下步骤:
在腔体盖板的第一表面与第二表面涂覆焊料,第一表面与第二表面相对设置,腔体盖板上设有贯穿第一表面与第二表面的多个连接通孔。
将齿片部件的每个两相齿片插入对应的连接通孔及将腔体基板与腔体盖板层叠设置以形成预制体,每个两相齿片具有突出第一表面的突出端,腔体基板与腔体盖板共同围成与散热管路连通的散热腔体,第一表面朝向腔体基板设置。
将预制体放入焊炉进行焊接以得到散热模组,焊料在突出端与第一表面的交接处形成第一焊缝,焊料在两相齿片与第二表面的交接处形成第二焊缝,腔体基板与腔体盖板固定连接。
附图说明
图1为本申请第一实施例提供的设备的立体分解示意图;
图2a为本申请第一实施例提供的设备的剖视图;
图2b为本申请一实施例的主箱体的第二安装面的区域示意图;
图2c为本申请一热源部件的平面示意图;
图3为本申请第一实施例提供的散热器的部分结构示意图;
图4为图3所示的散热器的立体分解示意图;
图5a为本申请第一实施例提供的散热模组的示意图;
图5b为图5a所示的两相齿片的部分区域A的放大示意图;
图6a为本申请第一实施例提供的腔体盖板的平面图;
图6b为图6a所示的腔体盖板的剖视图;
图6c为图6b所示的腔体盖板的局部区域B放大示意图;
图7a为本申请第一实施例提供的齿片部件与腔体部件组装于一起的立体剖视图;
图7b为两相齿片与腔体盖板焊接于一起时的示意图;
图8为本申请第一实施例提供的散热器的部分区域放大示意图;
图9为本申请一实施例提供的散热模组的制造方法流程示意图;
图10为本申请第二实施例提供的散热模组的立体组装示意图;
图11为图10所示的散热模组的立体分解示意图;
图12为本申请第二实施例提供的两相齿片的立体示意图;
图13为本申请第二实施例提供的散热模组与腔体部件组装于一起的局部立体示意图;
图14为本申请第二实施例提供的腔体盖板、腔体基板的立体分解示意图;
图15为本申请第三实施例提供的散热模组的剖视图;
图16为本申请第三实施例提供的腔体盖板的一种可能结构示意图;
图17为本申请第三实施例提供的腔体盖板的另一种可能结构示意图。
具体实施方式
移动通信基站通常为堆叠式架构,包括散热器、收发信机(TRX)、屏蔽盖、电源、滤波器等多个部件,其中主要散热部件为散热器。散热器包括散热基板和齿片。齿片呈一定间距分布在基板上,考虑防腐、重量、成本等需求,齿片和基板的材料一般都为铝合金,可通过压铸、机加、冷嵌、焊接等工艺来加工实现。基站中的主要热耗部件,例如收发信机、电源都是贴在散热基板上,通过散热基板将热量传递到齿片,再通过自然对流和热辐射散发到外界环境中。
通常铝合金的导热系数有限,一般为140-210W/(mK),因而散热器自身热阻较大。当模块和器件热耗较大时,从散热基板与器件接触面到散热齿齿根部通常就有10多度的温差,齿根到齿顶又有几十度温差,散热齿与外部环境间温差较小,无法进行高效换热,散热器散热能力有限,因而如何提升散热器自身热传 导能力,减小散热器自身热阻,对于基站的散热能力提升是至关重要的。
其他与移动通信基站散热类似的设备还包括户外电源,小型光伏逆变器等。
现有散热基板受铝合金导热系数影响,导热能力有限,平面均温能力较弱,不利于高密热耗芯片向四周快速散热,严重制约散热器的散热效能提升。
虽然通过采用吹胀板可以实现齿片均温,但是对器件布局有明显约束,另外散热器基板到齿片导热路径较长,热阻较大,热性能提升依然有限。
基于此,提供一种组合式散热模组及其相关的设备。散热器包括散热模组及主箱体。主箱体包括第一安装面、第二安装面及至少一个通孔。第一安装面与第二安装面相对设置。所述散热模组设置在所述第一安装面上,所述第二安装面设有接触结构;所述至少一个通孔贯穿所述第二安装面与所述第一安装面,所述散热模组的一部分通过所述至少一个通孔用于与热源部件的至少一个第一热源器件接触以对所述至少一个第一热源器件进行散热;所述接触结构用于与所述热源部件的至少一个第二热源器件接触以对所述至少一个第二热源器件进行散热。
本申请可应用于各种设备的户外自然散热场景,例如无线通信基站、户外电源等。
请参阅图1与图2a,本申请第一实施例提供一种设备100,设备100包括散热器101及热源部件103。散热器101用于为热源部件103进行散热。热源部件103为工作时能够产生热量的部件。例如,热源部件103可以为收信机(receiver,RX)、发信机(transceiver,TX)、收发机(TRX)等等。
本实施方式中,热源部件103包括承载体1031及设于承载体1031上的第一热源器件1033、第二热源器件1035(如图2c所示)及第三热源器件1037(如图2c所示)。承载体1031可以为电路板(printed circuit boards,PCB)。
设备100可以为移动通信基站中的基站设备,例如,第一热源器件1033可以包括芯片等等。第一热源器件1033可以为热源部件103上的大功耗器件,例如,将在单位时间内(例如1秒或1分钟内)产生的热量不小于预设范围的器件作为第一热源器件1033,第二热源器件1035为在单位时间内产生的热量小于预设范围的器件,第三热源器件1037为在单位时间内产生的热量小于预设范围的器件。可以理解,本申请对第一热源器件1033、第二热源器件1035及第三热源器件1037在单位时间内产生的热量不作限定。本申请其他实施方式中,设备100不限定应用于移动通信基站,热源部件103还可以为电源、光伏逆变器等等。
散热器101包括主箱体1011与散热模组1013。主箱体1011用于支撑热源部件103。散热模组1013通过工质相变,以对热源部件103的第一热源器件1033及第二热源器件1035进行散热。本实施例中,热源部件103的第一热源器件1033与散热模组1013直接接触。可以理解,热源部件103的第一热源器件1033与散热模组1013还可以通过其他导热物进行间接接触。
主箱体1011包括支撑部1012及散热翅片1014。支撑部1012可以由铝合金等材质制成。本实施方式中,支撑部1012大致呈板状结构。可以理解,本申请对支撑部1012的材质、形状、尺寸不作限定。
支撑部1012包括第一安装面1015、第二安装面1016及至少一个通孔1017。第一安装面1015与第二安装面1016沿第一方向相对设置,第一方向可以为图1与图2a所示的X方向。第一安装面1015朝向散热模组1013设置。第一安装面1015用于安装散热模组1013及散热翅片1014。请结合参阅图2b,主箱体1011还包括连接设置的第一区域1020与第二区域1021。第一区域1020与第二区域1021沿不同于第一方向的第三方向设置,第三方向可以为图2b中所示的Z方向。本实施方式中,第一区域1020的数量为一个,第二区域1021的数量为两个,第一区域1020位于两个第二区域1021之间。图2b中示意的第二安装面1016上的区域划分及结构特征仅是示例性地,以方便说明与理解,并不代表实际产品。可以理解,本申请不限定第一区域1020的数量及第二区域1021的数量。
散热模组1013安装于第一区域1020的第一安装面1015上,散热翅片1014安装于第二区域1021的第一安装面1015上。散热翅片1014用于对热源部件103进行散热,进而提高了散热器101的散热效率。第三热源器件1037在承载体1031的位置对应散热翅片1014在主箱体1011上位置,即对应主箱体1011的第二区域1021设置。在第二区域1021设置散热翅片1014有利于对热源部件103对应第二区域1021的第三热源器件1037进行散热。由于散热翅片1014相对两相散热器的成本更低,有利于降低散热器101的成本。
第二安装面1016用于设置热源部件103。通孔1017贯穿第一安装面1015及第二安装面1016,用于穿过第一热源器件1033。第二安装面1016上设有接触结构1018。接触结构1018用于与第二热 源器件1035接触,以对第二热源器件1035进行散热。
其他实施方式中,接触结构1018还可以与第二热源器件1035间接接触。接触结构1018可以为凸起,例如,圆柱凸起,圆台,或其他规则、不规则形状的凸起等等。接触结构1018的数量可以为一个、两个或多个。接触结构1018的材料可以为铝合金或其他材料,例如,铜等。
由于第一热源器件1033通过通孔1017与散热模组1013直接接触,进而大大缩短了散热模组1013与第一热源器件1033的换热路径,提高了散热器101的散热效率。本申请的一些实施方式中,散热模组1013与热源部件103沿第一方向排列设置。通孔1017分布于第二安装面1016的局部区域而非进行整体挖孔,这样一来,有利于提高主箱体1011的强度。
由于第二热源器件1035与散热模组1013通过接触结构1018间接接触,第二热源使散热模组1013的工质亦可吸收第二热源器件1035产生的热量。
本申请的其他实施方式中,散热模组1013的一部分穿过至少一个通孔1017以能够与热源部件103的至少一个第一热源器件1033接触;或者,热源部件103的至少一个第一热源器件1033穿过至少一个通孔1017能够与散热模组1013的一部分接触;或者,散热模组1013的一部分穿过至少一个通孔1017,至少一个第一热源器件1033穿过至少一个通孔1017,以能够实现散热模组1013的一部分与至少一个第一热源器件1033接触。换而言之,散热模组1013的一部分通过至少一个通孔1017用于与热源部件103的至少一个第一热源器件1033接触以对至少一个第一热源器件1033进行散热。接触结构1018用于与热源部件103的至少一个第二热源器件1035接触以对至少一个第二热源器件1035进行散热。
主箱体1011还包括凹设于第二安装面1016上的凹陷部1030,至少一个通孔1017与接触结构1018位于凹陷部1030内。凹陷部1030位于第一区域1020。凹陷部1030用于收容第一热源器件1033与第二热源器件1035。接触结构1018凸设于凹陷部1030的内壁上。接触结构1018至少部分容纳于凹陷部1030上。由于接触结构1018、第一热源器件1033的至少部分与第二热源器件1035的至少部分容纳于凹陷部1030内,减小了设备100在第一方向上占用的尺寸,有利于设备100的小型化。本实施方式中,凹陷部1030在第二安装面1016所占区域为第一区域1020。本申请其他实施方式中,凹陷部1030可以延伸至第二区域1021。即凹陷部1030可以至少部分位于第一区域1020。
可以理解,凹陷部1030可以省略。
本实施方式中,主箱体1011通过压铸工艺制备形成,制造简单且成本低廉。压铸工艺是将材料(例如铝合金)熔化后注入模具,形成所需要的结构件。可以理解,散热翅片1014与支撑部1012可以一体制成,也可以分体制成。
散热模组需流通工质,散热模组对密封性、可靠性要求较高,例如,散热模组的制程包括机加(例如铣床加工)、焊接以使其满足可靠性要求,使得散热模组的制程较为复杂、难度较大。若散热模组的结构特征多,则无疑会增加散热模组的制备难度及制造成本,也有可能会影响散热模组的可靠性。
由于接触结构1018设于主箱体1011上而非设置在散热模组1013上,使得散热模组1013与热源部件103的布局解耦(无相互固定连接关系),简化了散热模组1013的结构,方便了散热模组1013的制造,降低散热模组1013的制造难度及成本,亦提高了散热模组1013的可靠性。由于用于与第二热源器件1035的接触结构1018设于主箱体1011上,主箱体1011采用压铸工艺形成,主箱体1011上的接触结构1018可以在压铸过程中与主箱体1011的主体一体形成,制造简单,成本较低。
散热器101还包括导热介质,导热介质填充于主箱体1011与散热模组1013之间的间隙,以减小散热模组1013与主箱体1011间的热阻,导热介质可以为硅脂、凝胶、石墨膜等。
主箱体1011与散热模组1013可通过螺纹、焊接等方式进行结合,本申请对主箱体1011与散热模组1013两者之间的连接方式不作限定。热源部件103可通过螺纹连接、粘接等方式固定在主箱体1011的支撑部1012上。
可以理解,散热翅片1014可以省略,接触结构1018可以省略接触凸台1026。本申请的其他实施方式中,一种散热器101包括主箱体1011与散热模组1013。主箱体1011包括相对设置的第一安装面1015与第二安装面1016,散热模组1013设置在第一安装面1015上,第二安装面1016上设有至少一个通孔1017及接触结构1018。至少一个通孔1017用于穿过热源部件103的第一热源器件1033,以使第一热源器件1033与散热模组1013能够直接接触,接触结构1018用于与热源部件103的第二热源器件1035接触。
可以理解,主箱体1011不限定采用压铸工艺,其也可以通过机加或者其他工艺制成。
散热模组1013包括齿片部件10、腔体部件30及注液管40。腔体部件30位于第一安装面1015与齿片部件10之间。腔体部件30与齿片部件10固定连接并相连通,用于流通工质。注液管40与腔体部件30固定连接,用于向腔体部件30注入工质。腔体部件30与主箱体1011的第一安装面1015固定连接,腔体部件30位于齿片部件10与主箱体1011之间。本申请的一些实施方式中,散热模组1013与腔体部件30沿第一方向排列设置。
本申请的其他实施方式中,散热模组1013可以脱离主箱体1011单独使用。
请一并参阅图3与图4,齿片部件10包括多个两相齿片12、保护盖板14及护齿16。多个两相齿片12固定于保护盖板14及腔体部件30上。在第一方向上,多个两相齿片12位于保护盖板14与腔体部件30之间,多个两相齿片12位于保护盖板14与主箱体1011的第一安装面1015之间。保护盖板14用于保护多个两相齿片12,以降低异常磕碰、周转等对多个两相齿片12的影响。保护盖板14在第一方向的厚度范围可以为0.5mm~1.5mm。可以理解,本申请对保护盖板14在第一方向的厚度范围不作限定。保护盖板14可以通过铆合、胶粘或焊接等方式与两相齿片12固定连接于一起。护齿16包括第一护齿162与第二护齿164。第一护齿162与第二护齿164均固定在腔体部件30上。在第二方向上,多个两相齿片12位于第一护齿162与第二护齿164之间。第二方向不同于第一方向,第二方向可以为如图2a、图3与图4所示的Y方向。第一护齿162与第二护齿164用于保护多个两相齿片12,以降低异常磕碰、周转等对多个两相齿片12的影响。
多个两相齿片12沿不同于第一方向的第二方向排列设置。两相齿片12可以采用铝板。两相齿片12在第二方向的厚度范围为0.6毫米(mm)~2mm。两相齿片12可通过吹胀、钣金冲压及焊接等工艺来制作。可以理解,本申请对两相齿片12的材质不作限定,本申请对两相齿片12的制造工艺不作限定,本申请对两相齿片12在第二方向的厚度范围不作限定。
请参阅图5a,两相齿片12上设有与腔体部件30连通的散热管路122,用于流通工质。工质可以在散热管路122与腔体部件30内循环流通。通过工质的相变和工质在散热管路122与腔体部件30内的流通循环,能够实现两相齿片12与腔体部件30的快速均温,减小热源部件103到散热模组1013的等效热阻,从而大大提升了散热器的散热效率。
散热管路122包括多个相连通的子管路1222。子管路1222的侧壁包括朝向两相齿片12的外部凸出设置的凸起结构。两相齿片12在第三方向上的高度高出腔体部件30在第三方向上的高度,以使两相齿片12在第三方向上至少部分凸出腔体部件30设置。第三方向可以为如图1、图2a、图3、图4、图5a所示的Z方向。第三方向不同于第一方向,第三方向不同于第二方向。本申请实施例中,第一方向大致与第二方向相垂直,第二方向与第三方向大致相垂直,第三方向与第一方向大致相垂直。两相齿片12在第三方向上凸出腔体部件30设置,有利于增加两相齿片12上的散热管路122的面积及增大蒸汽的容纳空间(即增大两相齿片12的蒸发腔的空间),从而有利于提高散热模组1013的散热效率,提高了两相齿片12及腔体部件30的均温性。
本申请的一些实施方式中,在第三方向上,两相齿片12包括连接设置的第一部分124与第二部分126。散热管路122分布在第一部分124与第二部分126。本申请的一些实施方式中,在第三方向上,沿第一部分124朝向第二部分126的方向(即以第一部分124所在位置为两相齿片12的底部),第二部分126的位置高于腔体部件30的位置高度,即第二部分126凸出腔体部件30设置。
本申请的一些实施方式中,第二部分126与第一部分124相接一端在第一方向的长度大致与第二部分126远离第一部分124在第一方向的长度大致相等,第二部分126沿第一方向的长度小于第一部分124沿第一方向的长度,使得第二部分126与第一部分124可围成避让空间,以避让散热翅片1014。
本申请的其他实施方式中,第二部分126沿第一方向的长度可以不小于第一部分124沿第一方向的长度,多个散热翅片1014可以与多个两相齿片12交错设置,例如,在第二方向上,两个相邻的两相齿片12之间的间隙内设有至少一个散热翅片1014。
在腔体部件30为热源部件103进行散热时,腔体部件30内的工质受热沸腾,工质吸收热量从液体变换为蒸汽,蒸汽沿第一部分124的散热管路122上升至第二部分126的散热管路122。蒸汽通过释放热量重新变为液体,最后在重力的作用下回流至腔体部件30。
第一部分124包括沿第一方向连接设置的第一连接部1242与第二连接部1244。第一连接部1242连接于第二部分126与第二连接部1244之间。第二连接部1244用于与腔体部件30连接并连通。
本申请的一些实施方式中,如图5b所示,第一连接部1242上设有限位台阶1245,用于与腔体 部件30相抵持,以对两相齿片12相对腔体部件30的位置进行限位,提高两相齿片12与腔体部件30之间的位置稳定性,进而提高散热器101的可靠性。本实施方式中,第二连接部1244的数量为两个,两个第二连接部1244间隔凸设在第一连接部1242上,进而形成了限位台阶1245。
本申请的一些实施方式中,第二连接部1244与腔体部件30通过钎焊工艺固定连接。可以理解,本申请不限定第二连接部1244与腔体部件30通过钎焊焊接在一起,例如,第二连接部1244与腔体部件30还可以通过熔焊、电弧焊、压焊、气焊、电阻焊等等焊接工艺焊接在一起。可以理解,本申请不限定第二连接部1244与腔体部件30通过焊接固定在一起,第二连接部1244与腔体部件30固定连接。
第二连接部1244的外壁上设有多个微条纹1247,微条纹1247与腔体部件30接触,使得第二连接部1244与腔体部件30之间形成多个微缝。由于毛细作用,微缝会进一步促进焊料在微缝中定向移动。焊料(如钎料)融化后在微缝的毛细作用下,会进一步向两相齿片12与腔体部件30的交接处和微缝里移动,因而可以进一步提升两相齿片12与腔体部件30之间连接的可靠性。第二连接部1244上的微条纹1247可以沿第一方向延伸,第二连接部1244上的微条纹1247也可以相对第一方向倾斜设置。
沿第三方向上,第一部分124远离第二部分126的一侧可视为两相齿片12的齿根,第二部分126远离第一部分124的一侧可视为两相齿片12的齿顶。当腔体部件30局部区域受热后,受热点附近的工质就会吸收热量从液体变化为蒸汽,蒸汽在压力差下会从腔体部件30扩散到两相齿片12,然后通过释放热量重新变为液体,最后在重力的作用下回流至腔体部件30。
通过工质的气液变化可以实现两相齿片12的快速均温,提高了两相齿片12的等效导热系数,减小了两相齿片12的齿根与两相齿片12的齿顶之间的温差,有效提升两相齿片12整体的换热效率,进而增强了散热器101的散热效率及散热能力。
腔体部件30设有散热腔体300。散热腔体300与各个两相齿片12的散热管路122连通,工质可以在多个两相齿片12的散热管路122与散热腔体300之间进行流通。
请再次参阅图2a与图4,腔体部件30包括腔体盖板32、腔体基板34及散热凸台36。腔体盖板32与腔体基板34沿第一方向层叠设置。腔体盖板32与腔体基板34固定连接并围成散热腔体300,方便了腔体部件30的制备。散热腔体300的数量可以为多个,多个散热腔体300相连通。可以理解,散热腔体300的数量可以为一个或两个,本申请对散热腔体300的数量不作限定。
腔体基板34位于腔体盖板32背离散热模组1013的一侧,即腔体盖板32位于散热模组1013与腔体基板34之间。散热凸台36固定设于腔体基板34背离腔体盖板32的一侧,以使第一热源器件1033与散热模组1013能够直接接触。散热凸台36可以与腔体基板34分体设置,以简化腔体基板34的结构,散热凸台36通过焊接、铆接或螺纹与腔体基板34固定结合在一起。本申请的其他实施方式中,散热凸台36与腔体基板34可以一体设置,或者,散热凸台36可以省略。
本申请的一些实施方式中,如图6a、图6b及图6c所示,腔体盖板32上设有各种盖板管路322,用于流通工质。腔体基板34可以近似看成平板结构。腔体盖板32与腔体基板34之间形成了各种连通的散热腔体300。腔体盖板32与腔体基板34均可通过钣金冲压形成,以降低腔体部件30的制造难度及制造成本。可以理解,腔体盖板32和腔体基板34还可通过锻造、压铸等其他工艺成型。
本申请的一些实施方式中,腔体基板34朝向腔体盖板32的正面大致为平面,腔体基板34背离腔体盖板32的背面大致为平面。由于腔体基板34的背面为平面,方便将散热凸台36设置于腔体基板34的背面上,减少腔体基板34的背面与散热凸台36的接触面之间的空气,进而减少散热模组1013与第一热源器件1033之间的热阻,提高了散热器101的散热效率。由于腔体基板34的背面为平面,方便腔体基板34与主箱体1011的第一安装面1015之间的接触,减少腔体基板34的背面与第一安装面1015之间的空气,进而减少散热模组1013与第二热源器件1035之间的热阻,进一步提高了散热器101的散热效率。
由于管路特征设置在腔体盖板32上,而非设置在腔体基板34上,腔体基板34为简单的平板结构,腔体基板34可选用制造成本较低的工艺制造(例如冲压),而不需选用成本较高的制造工艺(例如铣床加工)加工,降低了腔体基板34的加工成本。
可以理解,本申请对腔体盖板32和腔体基板34的成型工艺不作限定。本申请的其他实施方式中,腔体基板34上也可以设置凹槽等基板管路,腔体盖板32上的盖板管路322与腔体基板34的基板管路共同形成散热腔体300。
腔体盖板32通过钣金冲压工艺制成。腔体盖板32包括弯折连接的第一固定部321与第二固定部323,第一固定部321与第二固定部323一体连接。第一固定部321用于与腔体基板34固定连接。腔体 盖板32与腔体基板34可通过焊接(例如钎焊)工艺固定连接于一起。腔体盖板32还包括相对设置的第一表面324及第二表面326,第一表面324设于腔体盖板32朝向腔体基板34的一侧,第二表面326设于腔体盖板32背离腔体基板34的一侧。第二固定部323的第一表面324与第一固定部321的第一表面324共同围成盖板管路322。第一固定部321朝向腔体基板34的方向凸出设置,使得第一表面324与第二表面326均形成为凹凸不平的表面结构。第一护齿162与第二护齿164均固定在第二表面326上。
通过工质相变可以实现腔体部件30的快速均温,有利于突破腔体基板34自身材质(例如铝合金等)导热能力的约束,有效的降低腔体基板34的热阻和热源部件103的温度。
可以理解,本申请不限定腔体盖板32与腔体基板34通过钎焊焊接在一起,例如,腔体盖板32与腔体基板34还可以通过熔焊、电弧焊、压焊、气焊、电阻焊等等焊接工艺焊接在一起。可以理解,本申请不限定腔体盖板32与腔体基板34通过焊接固定在一起,腔体盖板32与腔体基板34固定连接。
本申请的一些实施方式中,腔体盖板32与两相齿片12通过插接式结构实现连接。腔体盖板32的第二固定部323设有多个与散热腔体300相连通的连接通孔328。连接通孔328用于插接两相齿片12的第二连接部1244,有利于简化两相齿片12与腔体部件30之间的组装。第一连接部1242与第二连接部1244沿第一方向连接,两相齿片12沿第一方向直插入连接通孔328。
请参阅图7a,每个两相齿片12上的散热管路122在第二连接部1244上设有流道口128。第二连接部1244固定插接在连接通孔328内,第二连接部1244上的微条纹1247与连接通孔328的内壁接触,流道口128与散热腔体300相连通,实现了散热管路122与散热腔体300的连通,进而实现工质的三维(3D)立体循环。流道口128的形状可以为圆形、腰圆形、长方形等。连接通孔328的尺寸可以比流道口128的尺寸略大,以方便两相齿片12插接于腔体盖板32上。可以理解,本申请对连接通孔328的尺寸不作限定,腔体盖板32也可以具备一定的弹性,两相齿片12可插接在连接通孔328内即可。
本申请的一些实施方式中,两相齿片12与腔体盖板32配合后,流道口128所在的两相齿片12的外壁与连接通孔328的内壁之间的间隙范围小于0.15mm,以降低在将腔体盖板32与两相齿片12通过焊接工艺结合在一起时因间隙过大而摇晃松动,进而提高了散热器101的可靠性。
本申请的一些实施方式中,请结合参阅图7a与图7b,第二连接部1244具有凸出第一表面324设置的突出端1248。突出端1248凸出第一表面324设置,突出端1248与第一表面324共同围成一大致呈三角结构的空间,突出端1248与第一表面324的交接处会形成第一微缝(图未示)。第一连接部1242凸出第二表面326设置,第一连接部1242与第二表面326共同围成一大致呈三角结构的空间,两相齿片12与第二表面326的交接处会形成第二微缝(图未示)。
需对腔体盖板32与两相齿片12进行焊接时,在第一表面324、第二表面326涂覆焊料。由于突出端1248与第一表面324共同形成的第一微缝的毛细作用,第一表面324上融化的焊料会沿突出端1248与第一表面324共同形成的第一微缝进行定向流动并堆积形成第一焊缝501。第一焊缝501与第一表面324固定连接,第一焊缝501与突出端1248固定连接。另外,由于突出端1248突出第一表面324设置,焊料难以透过第二连接部1244的阻拦进入流道口128,降低了流道口128被焊料堵塞的可能性。
由于两相齿片12与第二表面326共同形成的第二微缝的毛细作用,第二表面326上融化的焊料会沿两相齿片12与第二表面326共同形成的第二微缝定向流动并堆积形成第二焊缝503。第二焊缝503与两相齿片12固定连接,第二焊缝503与第二表面326固定连接。
利用腔体盖板32上的第一表面324与第二表面326(腔体盖板32的正反两面)上的焊料,在腔体盖板32的第一表面324与第二表面326都形成焊缝,通过这种双焊缝设计,可以提高两相齿片12与腔体盖板32之间的连接稳定性,进而大幅提高散热器101的可靠性。
图7b中所示的第一焊缝501、第二焊缝503的形状仅是示例性的,并不代表实际形成的第一焊缝501与第二焊缝503呈三角状。
可以理解,连接通孔328的内壁亦可以设有多个微条纹1247,连接通孔328的内壁上的微条纹1247与两相齿片12相接触,使得第二连接部1244与连接通孔328的内壁形成多个微缝。焊料能够在微缝中定向移动。焊料融化后在微缝的毛细作用下,会进一步向两相齿片12与腔体盖板32的交接处和微缝里移动,因而可以进一步提升两相齿片12与腔体盖板32之间所形成焊缝的可靠性。腔体盖板32和两相齿片12上的微条纹1247可通过轧制、热压、蚀刻、印制等方式来制作。
可以理解,本申请中对两相齿片12的结构与形状不作限定,例如,两相齿片12可以省略限位台阶1245,两相齿片12在第一方向上的长度一致,每个两相齿片12插入对应的连接通孔328,两相齿片12通过焊接等方式与腔体盖板32固定连接,两相齿片12设有与散热腔体300相连通的散热管路122即 可。
在制备散热模组1013时,腔体盖板32的第一表面324与第二表面326(即腔体盖板32的正反两面)涂覆有焊料(例如钎料和钎剂),将每个两相齿片12的第二连接部1244插入对应的连接通孔328,突出端1248凸出第一表面324设置。将齿片部件10、腔体盖板32与腔体基板34等组装在工装中,将工装推入焊炉中进行焊接以得到散热模组1013。
散热腔体300的内壁还可以设置加强结构400(如图7a所示),以提升散热腔体300的散热能力。加强结构400可以设置在腔体基板34朝向腔体盖板32的一面上。加强结构可以包括毛细结构(铜网)、泡沫铜、沟槽等中的至少一种。
请参阅图8,注液管40与第二表面326固定连接。注液管40包括主管体42及套管44。第二表面326上设有与散热腔体300相连通的开孔329。主管体42固定于开孔329上。主管体42向散热腔体300注入工质的工作完成后,主管体42会被封口,以防腔体部件30内的工质流出。套管44固定套设于主管体42上,套管44与腔体盖板32的第二表面326固定连接。套管44用于增强主管体42的强度以及主管体42与腔体盖板32之间的连接强度,降低震动(例如强风、地震等等引起的)时主管体42被损坏的可能性。主管体42、套管44可以为相同材质(例如铝管等),主管体42、套管44可以通过一体焊接(例如钎焊等焊接工艺)实现与腔体盖板32相固定,这样一来,简化了散热器101的制程。本申请的其他实施方式中,开孔可以设置在腔体基板34上,套管44也可以与腔体基板34固定连接。
本申请的一些实施方式中,需组装成散热模组1013时,先把两相齿片12、腔体盖板32、腔体基板34、注液管40和对应工装一起组装好并整体去进行焊接过炉,再把第一护齿162、第二护齿164和保护盖板14等安装或铆接好,然后把散热模组1013的整体进行耐压检测、氦检,没问题后再抽真空进行工质灌装和封口,最后进行高温老化测试。
本申请提供的散热器101,由于第一热源器件1033到两相齿片12的热阻大幅减小,散热器101的整体散热能力大幅增加,相较于常规的相同体积的散热器,散热器101可提升输出功率。或者,在与常规的散热器输出功率相同的情况下,散热器101所占用的体积更小。热源部件103与散热器101采用堆叠结构,并简化腔体基板34的结构,进而降低散热器101的成本。另外,散热器101的齿片部件10与腔体部件30通过采用直插式双焊缝连接结构,大幅提升了散热器101的可靠性。
本申请还提供一种散热模组1013的制造方法,请一并参阅图2a、图7a、图7b及图9,制造方法包括以下步骤:
步骤101,在腔体盖板32的第一表面324与第二表面326涂覆焊料,第一表面324与第二表面326相对设置,腔体盖板32上设有贯穿第一表面324与第二表面326的多个连接通孔328。
步骤103,将齿片部件10的每个两相齿片12插入对应的连接通孔328、将腔体基板34与腔体盖板32层叠设置以形成预制体,每个两相齿片12具有突出第一表面324的突出端1248,腔体基板34与腔体盖板32共同围成与散热管路122连通的散热腔体300,第一表面324朝向腔体基板34设置。
第一表面324与突出端1248的交接处形成微缝,每个两相齿片12与第二表面326的交接处形成微缝。
步骤105,将预制体放入焊炉进行焊接以得到散热模组1013,焊料在突出端1248与第一表面324的交接处形成第一焊缝501,焊料在两相齿片12与第二表面326的交接处形成第二焊缝503。
第一焊缝501与第一表面324及突出端1248固定连接,第二焊缝503与第二表面326及两相齿片固定连接。
第一表面324上融化的焊料沿突出端1248与第一表面324共同形成的微缝进行定向流动并堆积形成第一焊缝501,第二表面326上融化的焊料沿两相齿片12与第二表面326共同形成的微缝进行定向流动并堆积形成第二焊缝503。
可以理解,本申请对散热模组1013的制造方法中的步骤不作限定,例如,还可以包括冷却等。
请参阅图10与图11,本申请第二实施例提供一种散热模组1013b,第二实施例提供的散热模组1013b与第一实施例提供的散热模组1013的结构类似,散热模组1013b包括齿片部件10、腔体部件30及注液管40,腔体部件30与齿片部件10固定连接并相连通。注液管40与腔体部件30固定连接,用于向腔体部件30注入工质。不同至少在于,两相齿片12与腔体部件30之间的连接方式,以及腔体部件30的结构等。
请参阅图12与图13,每个两相齿片12上设有与散热管路122连通的导流管路129,流道口128设于导流管路129上并与对应的连接通孔328连通,导流管路129通过流道口128与散热腔体连通。工质经散 热管路122、导流管路129、流道口128后,经连接通孔328进入散热腔体300。
本申请的一些实施例中,第二连接部1244大致呈弯折结构,第二连接部1244固定贴附在第二表面326上。换而言之,两相齿片12与腔体盖板32的连接区域被折弯,两相齿片12大致形成“L”型结构。导流管路129与流道口128均设于第二连接部1244上,用于与腔体部件30的散热腔体300连通。第二连接部1244的数量为多个(图12中以四个进行示例),多个第二连接部1244间隔设置于第一连接部1242上。每个第二连接部1244上的流道口128的数量可以为多个(图中以四个进行示例)。本申请其他实施例中,第二连接部1244的数量可以为一个、两个,本申请对第二连接部1244的数量不作限定,第二连接部1244上的流道口128的数量可以为一个、两个,本申请对流道口128的数量不作限定。
较为具体的,第二连接部1244包括连接设置的延伸次部1249与弯折次部1250。导流管路129分布于延伸次部1249与弯折次部1250。流道口128设于弯折次部1250上。弯折次部1250盖设在第二表面326上。弯折次部1250大致平铺设置在腔体盖板32的第二表面326上,即弯折次部1250与第二表面326连接形成平铺式搭接结构。弯折次部1250可通过焊接工艺与第二表面326固定结合在一起。由于弯折次部1250与第二表面326采用平铺式搭接结构固定在第二表面326上,可以增加焊料的覆盖面积,进而增大焊缝宽度,有利于提高两相齿片12与腔体盖板32之间的连接稳定性及可靠性。
腔体盖板32大致为平板结构。腔体盖板32与腔体基板34共同围成散热腔体。腔体盖板32上设有贯穿腔体盖板32的多个连接通孔328。本申请中,多个两相齿片12上的流道口128与多个连接通孔328一一对应。连接通孔328的形状可以为圆形,长腰形等,本申请对连接通孔328的形状不作限定。
腔体盖板32的制成材料可以为铝合金等。腔体盖板32的厚度范围为1mm-5mm,以提高散热器的可靠性。本申请对腔体盖板32的厚度范围不作限定,本申请对腔体盖板32的成型工艺不作限定,腔体盖板32可采用钣金、锻造、机加等工艺成型。
本实施例中,腔体基板34通过铝合金块体锻造而成,腔体盖板32通过冲压形成。铝合金块体的厚度大于铝合金板的厚度。
请参阅图14,腔体基板34朝向腔体盖板32的一面上形成有基板管路342。本实施例中,基板管路342为向腔体基板34的内部凹陷的腔体。基板管路342的内壁上设有一系列的固定凸台344。固定凸台344与腔体盖板32的第一表面324固定连接。固定凸台344的形状可以为圆形、长方形等,本申请对固定凸台344的形状不作限定。
固定凸台344在焊接后会与腔体盖板32通过焊料结合在一起,而基板管路342可实现腔体基板34的快速均温,进而能够实现对热源部件进行快速散热。考虑焊接良率和工质用量,基板管路342沿第一方向的腔深范围可以为1mm-5mm,腔体基板34的制成材料为铝合金,腔体基板34可采用锻造、机加、铸造等工艺成型。本申请对基板管路342沿第一方向的腔深范围不作限定。本申请对腔体基板34的成型工艺不作限定。
由于固定凸台344的特征设置在腔体基板34上,而未设置在腔体盖板32上,使得在散热模组1013b需进行焊接时方便对腔体盖板32进行焊料涂覆,提升散热模组1013b的焊接可靠性。
请参阅图15,本申请第三实施例提供一种散热模组,第三实施例提供的散热模组1013c与第一实施例提供的散热模组1013的结构类似,不同至少在于,两相齿片12上的散热管路分区域设置,散热腔体300呈分腔设置。
散热管路包括多个子管路1222,两相齿片12包括连接设置的第一管路区域1201与第二管路区域1203,第一管路区域1201与第二管路区域1203均设有子管路1222。第一管路区域1201的子管路1222与第二管路区域1203的子管路1222相互隔绝(即不连通)。第一管路区域1201的子管路1222内的工质在第一管路区域1201的子管路1222流通。第二管路区域1203的子管路1222内的工质在第二管路区域1203的子管路1222流通。即第一管路区域1201的子管路1222与第二管路区域1203的子管路1222之间,实现第一管路区域1201的子管路1222与第二管路区域1203的子管路1222完全隔离。
腔体部件还包括设于散热腔体内的分腔隔筋38,从而将散热腔体300分隔成相互隔绝的第一子腔301与第二子腔303,第一管路区域1201的子管路1222与第一子腔301相连通,第二管路区域1203的子管路1222与第二子腔303相连通。第一子腔301内的工质可在第一管路区域1201的子管路1222与第一子腔301内进行循环流通。第二子腔303内的工质可在第二管路区域1203的子管路1222与第二子腔303内进行循环流通。
如图16所示,分腔隔筋38凸设于腔体盖板32上朝向腔体基板34的一面,分腔隔筋38可以沿第二方向(如图16所示的Y方向)延伸,使散热腔体300在第三方向(如图16所示的Z方向)上分隔成相互 隔绝的第一子腔301与第二子腔303。
本申请的其他实施方式中,如图17所示,分腔隔筋38可以沿第三方向(如图17所示的Z方向)延伸,使散热腔体300在第二方向(如图17所示的Y方向)分隔成相互隔绝的第一子腔301与第二子腔303,第一管路区域1201的子管路1222与第一子腔301连通,第二管路区域1203的子管路1222与第二子腔303连通。
可以理解,分腔隔筋38还可以沿其他方向延伸,第一管路区域1201的子管路1222与第一子腔301连通,第二管路区域1203的子管路1222与第二子腔303连通即可。
可以理解,分腔隔筋38还可以设置于腔体基板34上,或者分腔隔筋38可以设置在腔体盖板32及腔体基板34上。
由于两相齿片12上的散热管路分区域设置及散热腔体分区域设置,实现第一管路区域1201的子管路1222与第一子腔301的相连通,第二管路区域1203的子管路1222与第二子腔303的相连通,散热器的不同区域的完全隔离,降低单腔或多腔泄漏对散热模组散热性能的影响,达成热隔离的目标,亦提高了散热器的可靠性。
本申请的其他实施例中,两相齿片12上的散热管路122可以不分区设置,散热腔体呈分腔设置,可以减小了腔体部件30上的单点泄漏对整体散热器的影响。
本申请的其他实施例中,散热腔体不呈分腔设置,两相齿片12上的散热管路122可以分区设置,所述散热管路122包括多个子管路1220,所述两相齿片12包括连接设置的第一管路区域1201与第二管路区域1203,所述第一管路区域1201的子管路1220与所述第二管路区域1203的子管路1220在所在的两相齿片12上相互隔绝。
本申请的其他实施方式中,分腔隔筋38的数量可以为两个或多个,以将散热腔体分隔成多个子腔。分腔隔筋38可以沿两相齿片的齿长方向(第三方向)设置,以实现第三方向上的热隔离。分腔隔筋38也可以沿垂直两相齿片的齿长方向设置,以实现第一方向或第二方向上的热隔离。本申请对分腔隔筋的设置方向不作限定,两相齿片的齿长方向是指齿根到齿顶。
在不冲突与矛盾的情况下,本申请的第一实施例至本申请第三实施例可以相互结合。
本申请中所提到的方向用语,例如,“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧壁”等,仅是参考附加图式的方向,因此,使用的方向用语是为了更好、更清楚地说明及理解本申请,而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。
此外,本文中为部件所编序号本身,例如“第一”、“第二”等,仅用于区分所描述的对象,不具有任何顺序或技术含义。而本申请所说“连接”、“联接”,如无特别说明,均包括直接和间接连接(联接)。
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。

Claims (22)

  1. 一种散热器,其特征在于,包括:
    散热模组;
    主箱体,包括第一安装面、第二安装面及至少一个通孔,所述第一安装面与所述第二安装面相对设置,所述散热模组设置在所述第一安装面上,所述第二安装面设有接触结构;
    所述至少一个通孔贯穿所述第二安装面与所述第一安装面,所述散热模组的一部分通过所述至少一个通孔用于与热源部件的至少一个第一热源器件接触以对所述至少一个第一热源器件进行散热;
    所述接触结构用于与所述热源部件的至少一个第二热源器件接触以对所述至少一个第二热源器件进行散热。
  2. 根据权利要求1所述的散热器,其特征在于,所述主箱体还包括凹设于所述第二安装面上的凹陷部,所述至少一个通孔与所述接触结构均位于所述凹陷部内,所述接触结构凸设于所述凹陷部的内壁上;所述凹陷部用于收容所述第一热源器件与所述第二热源器件。
  3. 根据权利要求1或2所述的散热器,其特征在于,所述第一安装面与所述第二安装面沿第一方向设置,所述主箱体还包括第一区域与第二区域,所述第二区域与所述第一区域沿不同于所述第一方向的第三方向排列设置,所述至少一个通孔与所述接触结构均位于所述第一区域,所述第二区域用于设置散热翅片。
  4. 根据权利要求1所述的散热器,其特征在于,所述主箱体包括支撑部及散热翅片,所述第一安装面与所述第二安装面均位于所述支撑部上,所述散热翅片固定在所述第一安装面上。
  5. 根据权利要求1-4任意一项所述的散热器,其特征在于,所述主箱体通过压铸工艺形成。
  6. 根据权利要求1-5任意一项所述的散热器,其特征在于,所述散热模组为两相散热模组,包括:
    齿片部件,包括多个两相齿片,每个所述两相齿片设有散热管路,所述散热管路用于流通工质;及
    腔体部件,位于所述齿片部件与所述第一安装面之间,所述腔体部件与多个所述两相齿片固定连接,所述腔体部件与所述第一安装面固定连接,所述腔体部件设有与多个所述两相齿片的所述散热管路连通的散热腔体,所述散热腔体用于流通所述工质。
  7. 根据权利要求6所述的散热器,其特征在于,所述腔体部件包括层叠设置的腔体盖板与腔体基板,所述腔体盖板与多个所述两相齿片固定连接,所述腔体盖板与所述腔体基板固定连接并共同形成所述散热腔体,所述腔体基板位于所述腔体盖板背离所述齿片部件的一侧。
  8. 根据权利要求7所述的散热器,其特征在于,所述腔体盖板上设有贯穿所述腔体盖板的多个连接通孔,每个所述两相齿片固定插接于对应的所述连接通孔中,所述散热管路设有流道口,所述流道口与所述散热腔体连通。
  9. 根据权利要求8所述的散热器,其特征在于,所述腔体盖板包括相对设置的第一表面与第二表面,所述第一表面设于所述腔体盖板朝向所述腔体基板的一侧,所述连接通孔贯穿所述第一表面与所述第二表面,
    每个所述两相齿片具有突出端,所述突出端凸出所述第一表面设置,所述流道口位于所述突出端,
    所述腔体部件在所述突出端与所述第一表面的交接处形成第一焊缝,所述第一焊缝与所述第一表面固定连接,所述第一焊缝与所述突出端固定连接;
    所述腔体部件在每个所述两相齿片与所述第二表面的交接处形成第二焊缝,所述第二焊缝与所述第二表面固定连接,所述第二焊缝与所述第二表面固定连接。
  10. 根据权利要求9所述的散热器,其特征在于,每个所述两相齿片包括连接设置的第一连接部与第二连接部,所述第二连接部穿设于对应的所述连接通孔内,所述突出端设于所述第二连接部远离所述第一连接部的一侧,
    所述第一连接部形成限位台阶,所述限位台阶与所述第二表面相抵持。
  11. 根据权利要求8-10任意一项所述的散热器,其特征在于,每个所述两相齿片的外壁设有多个微条纹,多个所述微条纹与所述腔体盖板接触。
  12. 根据权利要求7所述的散热器,其特征在于,所述腔体盖板上设有与所述散热腔体连通的多个连接通孔,每个所述两相齿片上设有与所述腔体盖板固定连接的弯折次部,所述弯折次部上设有与所述散热管路连通的导流管路,所述导流管路与对应的连接通孔连通。
  13. 根据权利要求7所述的散热器,其特征在于,所述腔体盖板通过冲压工艺形成,所述腔体盖板包括弯折连接的第一固定部及第二固定部,所述第一固定部朝向所述腔体基板凸出设置,所述第一固定部与所述腔体基板固定连接,所述第二固定部与所述腔体基板共同围成所述散热腔体。
  14. 根据权利要求7-13任意一项所述的散热器,其特征在于,所述腔体部件还包括散热凸台,所述散热凸台固定连接于所述腔体基板背离所述齿片部件的一侧,所述散热凸台与所述腔体基板分体设置,所述散热凸台用于与所述第一热源器件接触。
  15. 根据权利要求14所述的散热器,其特征在于,所述散热凸台与所述腔体基板通过焊接固定连接于一起。
  16. 根据权利要求6-15任意一项所述的散热器,其特征在于,所述腔体部件还包括设于所述散热腔体内的分腔隔筋,从而将所述散热腔体分隔成相互隔绝的第一子腔与第二子腔。
  17. 根据权利要求15所述的散热器,其特征在于,所述散热管路包括多个子管路,所述两相齿片包括连接设置的第一管路区域与第二管路区域,所述第一管路区域的子管路与所述第二管路区域的子管路相互隔绝,所述第一管路区域的子管路与所述第一子腔相连通,所述第二管路区域的子管路与所述第二子腔相连通。
  18. 根据权利要求6-17任意一项所述的散热器,其特征在于,所述散热模组还包括第一护齿与第二护齿,沿多个所述两相齿片的排列方向,所述多个所述两相齿片位于所述第一护齿与所述第二护齿之间。
  19. 根据权利要求6-18任意一项所述的散热器,其特征在于,所述散热模组还包括保护盖板,所述保护盖板与多个所述两相齿片固定连接,所述齿片部件位于所述保护盖板与所述腔体部件之间。
  20. 根据权利要求6-19任意一项所述的散热器,其特征在于,所述散热模组还包括注液管,所述注液管包括主管体及套管,所述腔体部件上设有开孔,所述主管体固定于所述开孔上,所述套管固定套设于所述主管体上,所述套管与所述腔体部件固定。
  21. 根据权利要求6-20任意一项所述的散热器,其特征在于,所述齿片部件与所述腔体部件沿第一方向设置,多个所述两相齿片沿不同于所述第一方向的第二方向设置,每个所述两相齿片沿第三方向的高度高出所述腔体部件沿所述第三方向的高度。
  22. 一种设备,其特征在于,包括根据权利要求1-21任意一项所述的散热器及热源部件,所述热源部件位于所述主箱体的第二安装面所在一侧,所述热源部件包括第一热源器件与第二热源器件,所述第一热源器件穿过所述散热模组的至少一个通孔与所述散热模组直接接触,所述第二热源器件与所述散热模组的接触结构接触。
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