WO2024007400A1 - Led灯板结构 - Google Patents

Led灯板结构 Download PDF

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Publication number
WO2024007400A1
WO2024007400A1 PCT/CN2022/110048 CN2022110048W WO2024007400A1 WO 2024007400 A1 WO2024007400 A1 WO 2024007400A1 CN 2022110048 W CN2022110048 W CN 2022110048W WO 2024007400 A1 WO2024007400 A1 WO 2024007400A1
Authority
WO
WIPO (PCT)
Prior art keywords
led lamp
lamp beads
row
panel structure
pcb board
Prior art date
Application number
PCT/CN2022/110048
Other languages
English (en)
French (fr)
Inventor
张海波
何胜斌
顾伟
Original Assignee
江西兆驰晶显有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江西兆驰晶显有限公司 filed Critical 江西兆驰晶显有限公司
Priority to EP22919304.0A priority Critical patent/EP4325471A1/en
Priority to US18/221,277 priority patent/US20240014186A1/en
Publication of WO2024007400A1 publication Critical patent/WO2024007400A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present application relates to the field of LED display technology, and in particular to an LED light panel structure.
  • LED display screen is a flat-panel display, which is composed of small LED lamp beads and is used to display text, images, videos and other information.
  • LED electronic display screen integrates microelectronics technology, computer technology, and information processing. It has the advantages of bright colors, wide dynamic range, high brightness, long life, stable and reliable operation, etc. LED display screens are widely used in commercial media, cultural performance markets, sports venues, information dissemination, news releases, securities transactions, etc.
  • the scanning lines and data lines on the PCB board will cross. Therefore, the scanning lines are usually set on the surface of the PCB board, and the data lines are connected by adding via holes on the PCB board. It is arranged on the inner layer or bottom layer of the PCB board, so that the number of via holes is equal to the number of LED lamp beads on the PCB board. Since the number of via holes on the PCB board determines the yield rate of the PCB board, the more via holes, the higher the defective rate of the PCB board. Therefore, the inventor realized how to reduce the number of via holes on the PCB board to improve the quality of the PCB board. Improving the yield rate, reducing the waste of materials, and reducing the manufacturing cost of PCB boards are technical issues that need to be solved urgently.
  • this application provides an LED light panel structure, aiming to solve the technical problems in the existing technology that there are many via holes on the PCB board and the manufacturing cost is high.
  • an LED light panel structure which includes:
  • the PCB board is provided with several via holes;
  • a plurality of LED lamp beads are arranged on the PCB board, the LED lamp beads are arranged in an array in the first direction and the second direction; the adjacent plurality of LED lamp beads are arranged in sequence along the second direction. Form several luminous pixels;
  • Common terminals of several rows of LED lamp beads in the second direction are electrically connected through the via holes to form a scan line along the second direction;
  • the non-common terminals of each row of LED lamp beads in the first direction are electrically connected on the surface of the PCB board to form a data line along the first direction.
  • the common terminals of the first row of LED lamp beads in the second direction are electrically connected on the surface of the PCB board to form one of the scan lines.
  • the common terminals of the last row of LED lamp beads in the second direction are electrically connected on the surface of the PCB board to form one of the scan lines.
  • a plurality of two adjacent rows of LED lamp beads in the first direction form a first LED lamp bead row, and each row in the first LED lamp bead row
  • the data lines corresponding to the LED lamp beads pass through the first LED lamp bead row along the first direction.
  • the common terminals of several LED lamp beads in any row are electrically connected through the via holes, so as to realize the Several of the scan lines at corresponding positions in the first LED lamp bead row are located on the inner layer of the PCB board.
  • the common terminals of several LED lamp beads in any row are electrically connected through the via holes, so as to realize the Several of the scan lines at corresponding positions in the first LED lamp bead row are located on the bottom layer of the PCB board.
  • a plurality of two adjacent rows of LED lamp beads in the first direction form a second LED lamp bead row, and two rows of the second LED lamp bead row are The common terminals of adjacent LED lamp beads are electrically connected on the surface of the PCB board.
  • the light-emitting pixels are arranged in an array in the first direction and the second direction.
  • the first direction is a row direction
  • the second direction is a column direction
  • each of the light-emitting pixels is the same.
  • each of the light-emitting pixels includes a red LED lamp bead, a blue LED lamp bead, and a green LED lamp bead.
  • the LED lamp beads in each row in the first direction are LED lamp beads of the same luminous color.
  • the LED lamp beads are any one of red LED lamp beads, blue LED lamp beads, and green LED lamp beads.
  • each LED lamp bead is the same.
  • the common end of each LED lamp bead is a common anode.
  • the common end of each LED lamp bead is a common cathode.
  • the scan lines are column scan lines
  • the data lines are row data lines.
  • common ends of several groups of two adjacent rows of LED lamp beads are adjacent to each other.
  • non-common ends of several groups of two adjacent rows of LED lamp beads are adjacent.
  • the LED lamp beads are packaged on the PCB board in a COB manner or an SMD manner.
  • the LED lamp panel structure provided by the embodiment of the present application is to set a plurality of LED lamp beads arranged in an array in a first direction and a second direction on the PCB board, and the adjacent plurality of LED lamp beads are arranged in sequence along the second direction.
  • the common terminals of several rows of LED lamp beads in the second direction are electrically connected through the via holes to form a scan line along the second direction, and the non-common terminals of each row of LED lamp beads in the first direction are at
  • the surface layer of the PCB board is electrically connected to form a data line along the first direction, so that the number of via holes on the PCB board is less than the number of LED lamp beads, thereby improving the yield rate of the PCB board, reducing material waste, and reducing The manufacturing cost of PCB board.
  • Figure 1 is a schematic diagram of the structure of an LED light panel in the prior art
  • Figure 2 is another schematic diagram of the LED light panel structure in the prior art
  • Figure 3 is a schematic diagram of the structure of an LED light panel provided by an embodiment of the present application.
  • Figure 4 is a schematic diagram of the structure of an LED light panel provided by another embodiment of the present application.
  • Figure 5 is a schematic diagram of the structure of an LED light panel provided by another embodiment of the present application.
  • Figure 6 is a schematic diagram of the structure of an LED light panel provided by another embodiment of the present application.
  • Figure 7 is a schematic diagram of the structure of an LED light panel provided by another embodiment of the present application.
  • FIG. 8 is a schematic diagram of the structure of an LED light panel provided by another embodiment of the present application.
  • first direction and the second direction mentioned in the embodiments of the present application are perpendicular to each other.
  • the first direction can be the column direction or the row direction.
  • the second direction corresponds to the row direction or the column direction.
  • Direction, the first direction and the second direction can be interchanged in actual applications.
  • first direction is the x direction marked in Figure 1-7
  • the first LED lamp bead row and the second LED lamp bead row are both one column of LED lamp beads
  • the second direction is the x direction marked in Figure 1-7
  • the y direction that is, the third LED lamp bead line is a row of LED lamp beads.
  • the x direction in Figure 1-7 is the row direction
  • the y direction is the column direction.
  • FIG 1 is a schematic diagram of the structure of an LED light panel in the prior art.
  • a plurality of luminescent pixels 20 with the same structure are arranged in an array on the PCB board 10.
  • Each luminescent pixel 20 is composed of three LED lamp beads with different luminous colors, namely a red LED lamp bead and a blue LED lamp.
  • the LED lamp beads and the green LED lamp beads constitute a light-emitting pixel 20, so that the LED lamp beads and the light-emitting pixels 20 are arranged in an array on the PCB board 10.
  • the common terminals of all LED lamp beads in each row of luminous pixels 20 are electrically connected on the surface of the PCB board 10 to form a row scanning line, and the non-common terminals of the LED lamp beads in each column of luminous pixels 20 with the same luminous color pass through the PCB board.
  • the via hole 101 on the PCB 10 is electrically connected to the inner layer or bottom layer of the PCB board 10 to form a column data line.
  • the strobe chip scans the pixels on the PCB board 10 line by line through the scan lines 30 , and the driver chip applies different currents through the data lines 40 to obtain different colors in each light-emitting pixel 20 , and then on the PCB board 10 Get a complete image.
  • the number of vias 101 on the PCB board 10 is determined by the number of LED beads.
  • Each light-emitting pixel 20 requires three vias 101 to lead the data line 40 to the inside of the PCB board 10. layer or bottom layer.
  • FIG. 2 is another schematic diagram of the structure of an LED light panel in the prior art.
  • a plurality of luminescent pixels 20 with the same structure are arranged in an array on the PCB board 10.
  • Each luminescent pixel 20 is composed of three LED lamp beads with different luminous colors, namely a red LED lamp bead and a blue LED lamp.
  • the LED lamp beads and the green LED lamp beads constitute a light-emitting pixel 20, so that the LED lamp beads and the light-emitting pixels 20 are arranged in an array on the PCB board 10.
  • the common terminals of all the LED lamp beads in each row of luminescent pixels 20 are electrically connected at the inner layer or bottom layer of the PCB board 10 through the via holes 101 on the PCB board 10 to form a row scanning line, and the luminescent pixels 20 in each column emit the same light.
  • the non-common terminals of the colored LED lamp beads are electrically connected on the surface of the PCB board 10 to form a column data line 40 .
  • both data lines 40 need to pass through each column of the luminescent pixels 20 . between the positive and negative poles of one or more LED lamp beads.
  • each light-emitting pixel 20 in Figure 2 only requires one via hole 101, due to the constraints of the wiring rules of the PCB board 10, the data line 40 passing between the positive and negative electrodes of the LED lamp bead will inevitably increase the size of the LED lamp bead. size, which will cause a sharp increase in cost.
  • the distance between the positive and negative electrodes of the COB chip is only 75um, and the spacing between the pads generally designed on the PCB board 10 is smaller than the spacing between the pads on the COB chip. To prevent misalignment, this value is generally taken as 70um.
  • the line width and line spacing of the general traces are both 100um. If the two data lines 40 both pass between the positive and negative electrodes of the COB chip, then the line width and distance between the positive and negative electrodes of the COB chip will The distance must be at least 500um. At this time, the COB chip will definitely be much larger than the original 75um design size of the diode, which will make the diode very large and the manufacturing cost will rise sharply.
  • Figure 3 is a schematic diagram of the structure of an LED light panel provided by an embodiment of the present application
  • Figure 4 is a schematic diagram of the structure of an LED light panel provided by another embodiment of the present application.
  • an LED light panel structure includes:
  • the PCB board 10 is provided with several via holes 101;
  • a plurality of LED lamp beads 201 are arranged on the PCB board 10.
  • the LED lamp beads 201 are arranged in an array in the first direction and the second direction; the adjacent plurality of LED lamp beads 201 are arranged along the second direction.
  • the directions are arranged sequentially to form several light-emitting pixels 20;
  • the common terminals 2011 of several rows of LED lamp beads 201 in the second direction are electrically connected through the via holes 101 to form a scan line 30 along the second direction;
  • the non-common terminals 2012 of each row of LED lamp beads 201 in the first direction are electrically connected on the surface of the PCB board 10 to form a data line 40 along the first direction.
  • the LED lamp panel structure provided by the embodiment of the present application is to provide a plurality of LED lamp beads 201 arranged in an array in the first direction and the second direction on the PCB board 10.
  • the adjacent LED lamp beads 201 are arranged along the second direction.
  • the directions are arranged sequentially to form several light-emitting pixels 20.
  • the common terminals 2011 of several rows of LED lamp beads 201 in the second direction are electrically connected through the via holes 101 to form a scanning line 30 along the second direction.
  • Each row in the first direction The non-common terminals 2012 of the LED lamp beads 201 are electrically connected to the surface layer of the PCB board 10 to form a data line 40 along the first direction, thereby making the number of vias 101 on the PCB board 10 less than the number of LED lamp beads 201 .
  • the yield rate of the PCB board 10 is improved, the waste of materials is reduced, and the manufacturing cost of the PCB board 10 is reduced.
  • the common terminal 2011 of the LED lamp bead 201 is located on the left side of the LED lamp bead 201
  • the non-common terminal 2012 is located on the left side of the LED lamp bead 201.
  • the non-common terminals 2012 of each row of LED lamp beads 201 in the first direction are electrically connected on the surface of the PCB board 10, and a data line 40 is formed along the first direction.
  • the data line 40 can be directly connected between the two sides.
  • the wiring between the LED lamp beads 201 does not need to pass through the gap area between the cathode and anode of any LED lamp bead 201 on the PCB board 10.
  • the wiring in the second direction The common terminals 2011 of all the LED lamp beads 201 in the first row are electrically connected on the surface of the PCB board 10 and form a scanning line 30 along the second direction.
  • Each LED lamp bead 201 in the first row does not need to be configured with a via hole 101 , the common terminals 2011 of all the LED lamp beads 201 in the first row can be electrically connected on the surface of the PCB board 10 , thereby reducing the number of vias 101 on the PCB board 10 .
  • the common terminal 2011 of the LED lamp bead 201 is located on the right side of the LED lamp bead 201
  • the non-common terminal 2012 is located on the right side of the LED lamp bead 201.
  • the non-common terminals 2012 of each row of LED lamp beads 201 in the first direction are electrically connected on the surface of the PCB board 10, and a data line 40 is formed along the first direction.
  • the data line 40 can be directly connected between the two sides.
  • the wiring between the LED lamp beads 201 does not need to pass through the gap area between the cathode and anode of any LED lamp bead 201 on the PCB board 10.
  • the second direction The common terminals 2011 of all the LED lamp beads 201 in the last row are electrically connected on the surface of the PCB board 10 and form a scanning line 30 along the second direction.
  • Each LED lamp bead 201 in the last row also does not need to be configured with a via hole 101. This allows the common terminals 2011 of all the LED lamp beads 201 in the last row to be electrically connected on the surface of the PCB board 10 , thus reducing the number of vias 101 on the PCB board 10 .
  • each LED lamp bead 201 on the PCB board 10 can be an LED lamp bead of the same size, or it can be an LED lamp bead of different sizes.
  • the LED lamp beads 201 can be arranged on the PCB board 10 in the same way or in different ways. When there are LED lamp beads 201 arranged in different ways on the PCB board 10, there can be several groups of two adjacent ones in the second direction.
  • the common terminals 2011 of the row LED lamp beads 201 are adjacent or the non-common terminals 2012 are adjacent. As shown in Figure 5, the non-common terminal 2012 of the LED lamp beads 201 in the first row in the second direction may be adjacent to the non-common terminal 2012 of the LED lamp beads 201 in the second row.
  • the common terminal 2011 can be adjacent to the common terminal 2011 of the LED lamp beads 201 in the third row. It is also possible to realize that the common terminals 2011 of several rows of LED lamp beads 201 in the second direction can be electrically connected through the via hole 101 to connect along the second direction.
  • the non-common terminals 2012 of each row of LED lamp beads 201 in the first direction are electrically connected to the surface of the PCB board 10 to form a data line 40 along the first direction, thereby making via holes on the PCB board 10
  • the number 101 is less than the number of LED lamp beads 201 , thereby improving the yield rate of the PCB board 10 , reducing material waste, and reducing the manufacturing cost of the PCB board 10 .
  • the common terminal 2011 of the LED lamp beads 201 can be a common cathode or a common anode; the gap area between the two rows of LED lamp beads 201 in the first direction can be used for one data line 40 or two. Data line 40.
  • each row of LED lamp beads 201 in the first direction must have the same luminous color.
  • the LED lamp beads 201 thus change the scan lines 30 in the LED display screen from row scan lines to column scan lines, and the data lines 40 change from column data lines to row data lines.
  • first LED lamp bead row 210 several adjacent rows of LED lamp beads 201 in the first direction form a first LED lamp bead row 210 , and the LED lamps in each row of the first LED lamp bead row 210 are The data lines 40 corresponding to the beads 201 all pass through the first LED lamp bead row 210 along the first direction. Specifically, the data line 40 corresponding to each row of LED lamp beads 201 in the first LED lamp bead row 210 passes through the gap area of the two rows of LED lamp beads 201 in the first LED lamp bead row 210 along the first direction.
  • the common terminal 2011 of one row of LED lamp beads 201 in the first LED lamp bead row 210 is electrically connected to the common terminal 2011 of the row of LED lamp beads 201 above it on the surface of the PCB board 10, and the common terminal 2011 of the LED lamp bead 201 in the first row 210 is electrically connected.
  • the common terminal 2011 of another row of LED lamp beads 201 and the common terminal 2011 of the row of LED lamp beads 201 below can pass through the via hole 101 on the PCB board 10 to form the scan line 30 along the second direction, thereby further reducing the number of holes on the PCB board 10
  • the number of vias 101 improves the yield rate of the PCB board 10 .
  • the common terminals 2011 of several LED lamp beads 201 in any row are electrically connected through the via holes 101 to realize the first LED lamp bead row 210 .
  • Several of the scanning lines 30 at corresponding positions in the lamp bead row 210 are located on the inner layer or bottom layer of the PCB board 10 . Specifically, there is no need to configure a via hole 101 on the PCB board 10 for all the LED lamp beads 201 in the first LED lamp bead row 210.
  • the common terminal 2011 of some of the LED lamp beads 201 in the first LED lamp bead row 210 can be connected with The common terminals 2011 of the lower LED lamp beads 201 are routed on the surface of the PCB board 10, and the common terminals 2011 of the remaining LED lamp beads 201 in the first LED lamp bead row 210 can directly pass through the via holes 101 on the PCB board 10. Conduct wiring on the inner layer or bottom layer of the PCB board 10 .
  • first LED lamp bead rows 210 in the first direction are composed of two adjacent rows of LED lamp beads 201. There may be one set of first LED lamp bead rows 210 on the PCB board 10, or there may be multiple sets of first LED lamp bead rows 210.
  • One LED lamp bead row 210, the number of groups of the first LED lamp bead row 210 can be specifically selected according to the actual application, and is not specifically limited in this application.
  • any two adjacent rows of LED lamp beads 201 in the first direction can form the first LED lamp bead row 210.
  • the LED lamp beads 201 of the first row and the LED lamp beads 201 of the second row can be formed as shown in the figure. 3 and the first LED lamp bead row 210 shown in Figure 4, the second row of LED lamp beads 201, and the third row of LED lamp beads 201 can form the first LED lamp bead row 210 as shown in Figure 6.
  • the formation method of the LED lamp bead row 210 can be specifically selected according to the actual application, and is not specifically limited in this application.
  • the LED lamp beads 201 adjacent to the upper part of the first LED lamp bead row 210 can share a via hole 101 with the common terminal 2011 of the upper LED lamp bead 201, that is, the two common terminals 2011 are routed on the surface of the PCB board 10, and one of the common terminals 2011 passes through the via 101 on the PCB
  • the memory or bottom layer of the board 10 is electrically connected to the common terminals 2011 of other rows; if there are LED lamp beads 201 below the first LED lamp bead row 210, the LEDs adjacent to the lower ones in the first LED lamp bead row 210
  • the common terminal 2011 of the lamp bead 201 can share a via hole 101 with the common terminal 2011 of the LED lamp bead 201 below, that is, the two common terminals 2011 are routed on the surface of the PCB board 10, and one
  • a plurality of two adjacent rows of LED lamp beads 201 in the first direction form a second LED lamp bead row 220, and the second LED lamp
  • the common terminals 2011 of two adjacent rows of LED lamp beads 201 in the bead row 220 are electrically connected on the surface layer of the PCB board 10 .
  • the second LED lamp bead row 220 in the first direction can also be formed by two adjacent rows of LED lamp beads 201, and the gap area between the two adjacent rows of LED lamp beads 201 can be used for the two adjacent rows.
  • the common terminal 2011 of the LED lamp beads 201 is routed on the surface of the PCB board 10 to realize that two adjacent LED lamp beads 201 share a via hole 101 on the PCB board 10, thereby reducing the number of via holes 101 on the PCB board 10. , improve the yield rate of the PCB board 10 and reduce the manufacturing cost of the PCB board 10 .
  • all the second LED lamp bead rows 220 in the first direction are composed of two adjacent rows of LED lamp beads 201.
  • any two adjacent rows of LED lamp beads 201 can form the second LED lamp bead row 220.
  • the LED lamp beads 201 of the first row and the LED lamp beads 201 of the second row can be formed as shown in the figure.
  • the second row of LED lamp beads 220 shown in Figure 6, the second row of LED lamp beads 201, and the third row of LED lamp beads 201 can form the second row of LED lamp beads 220 as shown in Figures 3 and 4.
  • the number of groups of LED lamp bead rows 220 and the formation method of the second LED lamp bead row 220 can be specifically selected according to actual applications, and are not specifically limited in this application.
  • the common terminals 2011 of some of the LED lamp beads 201 in each row of the LED lamp beads 201 in the second direction can pass through the through holes 101 on the PCB board 10 to achieve the desired direction along the second direction.
  • the scan line 30 is formed, as shown in Figure 8. Except for the leftmost LED lamp bead 201 among the LED lamp beads 201 in each row, the common terminals 2011 of the remaining LED lamp beads 201 can pass through the via holes 101 on the PCB board 10.
  • the scanning line 30 is formed along the second direction.
  • the arrangement of LED lamp beads 201 in FIGS. 7 and 8 can reduce the number of vias 101 on the PCB board 10 .
  • the light-emitting pixels 20 are arranged in an array in the first direction and the second direction.
  • the LED lamp beads 201 can be any one of red LED lamp beads, blue LED lamp beads, and green LED lamp beads.
  • each luminescent pixel 20 can be the same, and each luminescent pixel 20 can be composed of It consists of red LED lamp beads, blue LED lamp beads, and green LED lamp beads.
  • the red LED lamp beads, blue LED lamp beads, and green LED lamp beads can be arranged vertically from top to bottom along the second direction, thereby making the LED
  • the left and right viewing angles of the display are symmetrical, and the finished LED display has the largest left and right viewing angles.
  • the LED lamp beads 201 in the LED lamp panel structure provided by the embodiment of the present application can be packaged on the PCB board 10 in a COB manner or in an SMD manner.
  • the actual application can be based on The selection is based on specific circumstances and is not specifically limited in this application.
  • each of the above units or structures can be implemented as an independent entity, or can be combined in any way to be implemented as the same or several entities.
  • each of the above units or structures please refer to the previous embodiments and will not be discussed here. Again.

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Abstract

一种LED灯板结构，其包括：PCB板（10），PCB板（10）上设置有若干个过孔（101）；设置在PCB板（10）上的多个LED灯珠，LED灯珠在第一方向、第二方向上呈阵排布；相邻的多个LED灯珠沿第二方向依次排列以形成若干个发光像素（20）；第二方向上若干行LED灯珠的共极端通过过孔（101）电连接以沿第二方向形成一条扫描线（30）；第一方向上每行LED灯珠的非共极端在PCB板（10）的表层电连接以沿第一方向形成一条数据线（40）。LED灯板结构可以使得PCB板（10）上过孔的数量少于LED灯珠的数量，从而提高了PCB板（10）的良品率，减少了物料的浪费，降低了PCB板（10）的制造成本。

Description

LED灯板结构 技术领域
本申请涉及LED显示技术领域，尤其涉及一种LED灯板结构。
 背景技术
LED显示屏是一种平板显示器，由一个个小的LED灯珠组成，用来显示文字、图像、视频等各种信息的设备。LED电子显示屏集微电子技术、计算机技术、信息处理于一体，具有色彩鲜艳、动态范围广、亮度高、寿命长、工作稳定可靠等优点。LED显示屏广泛应用于商业传媒、文化演出市场、体育场馆、信息传播、新闻发布、证券交易等。
现有的LED显示屏在设计过程中，PCB板上的扫描线和数据线会出现交叉的情形，故通常将扫描线设置在PCB板的表层，通过在PCB板上增加过孔以将数据线设置在PCB板的内层或底层，进而使得过孔的数量与PCB板上LED灯珠的数量相等。由于PCB板上过孔的数量决定着PCB板的良品率，过孔越多， PCB板的不良率越高，因此，发明人意识到，如何减少PCB板上过孔的数量，以提高PCB板的良品率，减少物料的浪费，降低PCB板的制造成本是目前亟待解决的技术问题。
 技术问题
针对现有技术的不足，本申请提供了一种LED灯板结构，旨在解决现有技术中PCB板上过孔较多，制造成本较高的技术问题。
 技术解决方案
为解决上述问题，本申请实施例提供了一种LED灯板结构，其包括：
PCB板，所述PCB板上设置有若干个过孔；
设置在所述PCB板上的多个LED灯珠，所述LED灯珠在第一方向、第二方向上呈阵列排布；相邻的多个所述LED灯珠沿第二方向依次排列以形成若干个发光像素；
所述第二方向上若干行所述LED灯珠的共极端通过所述过孔电连接以沿所述第二方向形成一条扫描线；
所述第一方向上每行所述LED灯珠的非共极端在所述PCB板的表层电连接以沿所述第一方向形成一条数据线。
优选地，在所述的LED灯板结构中，所述第二方向上第一行所述LED灯珠的共极端在所述PCB板的表层电连接以形成一条所述扫描线。
优选地，在所述的LED灯板结构中，所述第二方向上最后一行所述LED灯珠的共极端在所述PCB板的表层电连接以形成一条所述扫描线。
优选地，在所述的LED灯板结构中，所述第一方向上若干个相邻的两行所述LED灯珠形成第一LED灯珠行，所述第一LED灯珠行中每一行所述LED灯珠对应的所述数据线均沿所述第一方向穿过所述第一LED灯珠行。
更优选地，在所述的LED灯板结构中，在所述第一LED灯珠行中，任意一行中若干个所述LED灯珠的共极端通过所述过孔电连接，以实现所述第一LED灯珠行中对应位置上的若干条所述扫描线位于所述PCB板的内层。
更优选地，在所述的LED灯板结构中，在所述第一LED灯珠行中，任意一行中若干个所述LED灯珠的共极端通过所述过孔电连接，以实现所述第一LED灯珠行中对应位置上的若干条所述扫描线位于所述PCB板的底层。
优选地，在所述的LED灯板结构中，所述第一方向上若干个相邻的两行所述LED灯珠形成第二LED灯珠行，所述第二LED灯珠行中两行相邻的所述LED灯珠的共极端在所述PCB板的表层电连接。
优选地，在所述的LED灯板结构中，所述发光像素在第一方向、第二方向上呈阵列排布。
优选地，在所述的LED灯板结构中，所述第一方向为行方向，所述第二方向为列方向。
优选地，在所述的LED灯板结构中，各所述发光像素均相同。
优选地，在所述的LED灯板结构中，各所述发光像素包括红色LED灯珠、蓝色LED灯珠、绿色LED灯珠。
优选地，在所述的LED灯板结构中，所述第一方向上每行所述LED灯珠均为相同发光颜色的LED灯珠。
优选地，在所述的LED灯板结构中，所述LED灯珠为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
优选地，在所述的LED灯板结构中，各所述LED灯珠均相同。
优选地，在所述的LED灯板结构中，各所述LED灯珠的共极端为共阳极。
优选地，在所述的LED灯板结构中，各所述LED灯珠的共极端为共阴极。
优选地，在所述的LED灯板结构中，所述扫描线为列扫描线，所述数据线为行数据线。
优选地，在所述的LED灯板结构中，在所述第二方向上，若干个组相邻两行LED灯珠的共极端相邻。
优选地，在所述的LED灯板结构中，在所述第二方向上，若干个组相邻两行LED灯珠的非共极端相邻。
优选地，在所述的LED灯板结构中，所述LED灯珠以COB的方式或SMD的方式封装在所述PCB板上。
 有益效果
本申请实施例提供的LED灯板结构，通过在PCB板上设置多个按第一方向、第二方向进行阵列排布的LED灯珠，相邻的多个LED灯珠沿第二方向依次排列以形成若干个发光像素，第二方向上若干行LED灯珠的共极端通过所述过孔电连接以沿第二方向形成一条扫描线，第一方向上每行LED灯珠的非共极端在PCB板的表层电连接以沿第一方向形成一条数据线，进而可以使得PCB板上过孔的数量少于LED灯珠的数量，从而提高了PCB板的良品率，减少了物料的浪费，降低了PCB板的制造成本。
 附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中LED灯板结构的示意图；
图2为现有技术中LED灯板结构的另一示意图；
图3为本申请实施例提供的LED灯板结构的示意图；
图4为本申请另一实施例提供的LED灯板结构的示意图；
图5为本申请另一实施例提供的LED灯板结构的示意图；
图6为本申请另一实施例提供的LED灯板结构的示意图；
图7为本申请另一实施例提供的LED灯板结构的示意图；
图8为本申请另一实施例提供的LED灯板结构的示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“列”、“行”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在申请中，“一些实施例”一词用来表示“用作例子、例证或说明”。本申请中被描述为示例性的任何实施例不一定被解释为比其它实施例更优选或更具优势。为使本领域任何技术人员能够实现和使用本申请，给出了以下描述。在以下描述，为了解释的目的而列出了细节。应当明白的是，本领域普通技术人员可以认识到，在不使用这些特定细节的情况下也可以实现本申请。在其它实例中，不会对已知的结构和过程进行详细阐述，以避免不必要的细节使本申请的描述变得晦涩。因此，本申请并非旨在限于所示的实施例，而是与符合本申请所公开的原理的最广范围相一致。
需要说明的是，本申请实施例中提及的第一方向、第二方向互相垂直，第一方向可以为列方向，也可以为行方向，同样的，第二方向则对应为行方向或列方向，第一方向、第二方向在实际应用时可以进行互换。其中，当第一方向为图1-7中标识的x方向时，即第一LED灯珠行、第二LED灯珠行均为一列LED灯珠，第二方向为图1-7中标识的y方向，即第三LED灯珠行为一行LED灯珠，图1-7中的x方向为行方向，y方向为列方向。
请参阅图1，图1为现有技术中LED灯板结构的示意图。如图1所示，PCB板10上阵列排布有多个相同结构的发光像素20，每个发光像素20由三颗不同发光颜色的LED灯珠构成，即红色LED灯珠、蓝色LED灯珠、绿色LED灯珠构成一个发光像素20，从而使得LED灯珠以及发光像素20均以阵列的方式在PCB板10上进行排布。其中，每行发光像素20中所有LED灯珠的共极端在PCB板10的表层电连接以形成一条行扫描线，每列发光像素20中相同发光颜色的LED灯珠的非共极端通过PCB板10上的过孔101在PCB板10的内层或底层电连接以形成一条列数据线。其中，选通芯片通过扫描线30对PCB板10上的像素进行逐行扫描，驱动芯片通过数据线40施加不同的电流，以在每个发光像素20中得到不同颜色，进而在PCB板10上得到一幅完整的图像。
从图1中可以看出，PCB板10上过孔101的数量由LED灯珠的数量决定，每一个发光像素20需要三个过孔101，以实现将数据线40引至PCB板10的内层或底层。
请参阅图2，图2为现有技术中LED灯板结构的另一示意图。如图2所示，PCB板10上阵列排布有多个相同结构的发光像素20，每个发光像素20由三颗不同发光颜色的LED灯珠构成，即红色LED灯珠、蓝色LED灯珠、绿色LED灯珠构成一个发光像素20，从而使得LED灯珠以及发光像素20均以阵列的方式在PCB板10上进行排布。其中，每行发光像素20中所有LED灯珠的共极端通过PCB板10上的过孔101在PCB板10的内层或底层电连接以形成一条行扫描线，每列发光像素20中相同发光颜色的LED灯珠的非共极端在PCB板10的表层电连接以形成一条列数据线40。
从图2中可以看出，为了避免扫描线30和数据线40出现交叉的问题，同时为了减少PCB板10上过孔101的数量，每列发光像素20中由两条数据线40均需要穿过一个或多个LED灯珠的正负极之间。虽然图2中每个发光像素20只需要一个过孔101，但是由于PCB板10走线规则的约束，数据线40穿过LED灯珠的正负极之间势必会加大该LED灯珠的尺寸，从而会引起成本的急剧上升。以常用的COB芯片0408（4 mil×8 mil）为例，COB芯片的正负极之间的距离只有75um，而一般PCB板10上设计焊盘的间距要小于COB芯片上的焊盘间距以防止出现错位，因此该数值一般取70um。而按照PCB板10的工艺水平，一般的走线的线宽和线距均为100um，若两条数据线40均穿过COB芯片的正负极之间，则COB芯片的正负极之间的距离至少要500um，此时COB芯片必定会远远大于二极管原本的75um的设计尺寸，进而会使二极管变得非常大，制造成本急剧上升。
请参阅图3和图4，图3为本申请实施例提供的LED灯板结构的示意图；图4为本申请另一实施例提供的LED灯板结构的示意图。如图3和图4所示，一种LED灯板结构，其包括：
PCB板10，所述PCB板10上设置有若干个过孔101；
设置在所述PCB板10上的多个LED灯珠201，所述LED灯珠201在第一方向、第二方向上呈阵列排布；相邻的多个所述LED灯珠201沿第二方向依次排列以形成若干个发光像素20；
所述第二方向上若干行所述LED灯珠201的共极端2011通过所述过孔101电连接以沿所述第二方向形成一条扫描线30；
所述第一方向上每行所述LED灯珠201的非共极端2012在所述PCB板10的表层电连接以沿所述第一方向形成一条数据线40。
本申请实施例提供的LED灯板结构，通过在PCB板10上设置多个按第一方向、第二方向进行阵列排布的LED灯珠201，相邻的多个LED灯珠201沿第二方向依次排列以形成若干个发光像素20，第二方向上若干行LED灯珠201的共极端2011通过所述过孔101电连接以沿第二方向形成一条扫描线30，第一方向上每行LED灯珠201的非共极端2012在PCB板10的表层电连接以沿第一方向形成一条数据线40，进而可以使得PCB板10上过孔101的数量少于LED灯珠201的数量，从而提高了PCB板10的良品率，减少了物料的浪费，降低了PCB板10的制造成本。
具体的，当所有的LED灯珠201均以图3所示的方式进行排布时，即LED灯珠201的共极端2011位于LED灯珠201左侧，非共极端2012位于LED灯珠201的右侧，此时第一方向上每行LED灯珠201的非共极端2012之间均在PCB板10的表层电连接，并沿第一方向形成一条数据线40，数据线40可以直接在两个LED灯珠201之间进行走线，无需穿过PCB板10上任何一个LED灯珠201的阴极和阳极之间的间隙区域，通过在不增加LED灯珠201尺寸的前提下，第二方向上第一行所有LED灯珠201的共极端2011在PCB板10的表层电连接，并沿第二方向形成一条扫描线30，第一行中每个LED灯珠201均无需配置一个过孔101，便可以实现第一行所有LED灯珠201的共极端2011在PCB板10的表层进行电连接，进而减少PCB板10上过孔101的数量。
同样的，当所有的LED灯珠201均以图4所示的方式进行排布时，即LED灯珠201的共极端2011位于LED灯珠201右侧，非共极端2012位于LED灯珠201的左侧，此时第一方向上每行LED灯珠201的非共极端2012之间均在PCB板10的表层电连接，并沿第一方向形成一条数据线40，数据线40可以直接在两个LED灯珠201之间进行走线，无需穿过PCB板10上任何一个LED灯珠201的阴极和阳极之间的间隙区域，同样在不增加LED灯珠201尺寸的前提下，第二方向上最后一行所有LED灯珠201的共极端2011在PCB板10的表层电连接，并沿第二方向形成一条扫描线30，最后一行中每个LED灯珠201同样均无需配置一个过孔101，便可以实现最后一行所有LED灯珠201的共极端2011在PCB板10的表层进行电连接，进而减少PCB板10上过孔101的数量。
其中，本申请中PCB板10上每个LED灯珠201均可以为相同尺寸的LED灯珠，也可以为不相同尺寸的LED灯珠。LED灯珠201在PCB板10上排布的方式可以相同，也可以不相同，当PCB板上存在LED灯珠201的排布方式不相同时，第二方向上可以存在若干个组相邻两行LED灯珠201的共极端2011相邻或非共极端2012相邻。如图5所示，第二方向上第一行的LED灯珠201的非共极端2012可以与第二行的LED灯珠201的非共极端2012相邻，第二行的LED灯珠201的共极端2011可以与第三行的LED灯珠201的共极端2011相邻，同样也能实现第二方向上若干行LED灯珠201的共极端2011通过所述过孔101电连接以沿第二方向形成一条扫描线30，第一方向上每行LED灯珠201的非共极端2012在PCB板10的表层电连接以沿第一方向形成一条数据线40，进而可以使得PCB板10上过孔101的数量少于LED灯珠201的数量，从而提高了PCB板10的良品率，减少了物料的浪费，降低了PCB板10的制造成本。
同时，LED灯珠201的共极端2011可以为共阴极，也可以为共阳极；第一方向上两行LED灯珠201之间的间隙区域既可以用于一条数据线40，也可以放置两条数据线40。
另外，第一方向上每行LED灯珠201的非共极端2012在PCB板10的表层电连接以沿第一方向形成一条数据线40后，每行LED灯珠201均需为相同发光颜色的LED灯珠201，进而使得LED显示屏中的扫描线30由行扫描线变成了列扫描线，数据线40由列数据线变成了行数据线。
在一些实施例中，所述第一方向上若干个相邻的两行所述LED灯珠201形成第一LED灯珠行210，所述第一LED灯珠行210中每一行所述LED灯珠201对应的所述数据线40均沿所述第一方向穿过所述第一LED灯珠行210。具体的，第一LED灯珠行210中每一行LED灯珠201对应的数据线40沿第一方向穿过第一LED灯珠行210中两行LED灯珠201的间隙区域，此时便可以将第一LED灯珠行210中的其中一行LED灯珠201共极端2011与其上方一行的LED灯珠201共极端2011在PCB板10的表层进行电连接，而第一LED灯珠行210中的另一行LED灯珠201共极端2011与其下方一行的LED灯珠201共极端2011可以通过PCB板10上的过孔101以实现在沿第二方向形成扫描线30，进而可进一步减少PCB板10上过孔101的数量，提高PCB板10的良品率。
在一些具体实施例中，在所述第一LED灯珠行210中，任意一行中若干个所述LED灯珠201的共极端2011通过所述过孔101电连接，以实现所述第一LED灯珠行210中对应位置上的若干条所述扫描线30位于所述PCB板10的内层或底层。具体的，第一LED灯珠行210中无需为所有的LED灯珠201在PCB板10上均配置一个过孔101，第一LED灯珠行210中部分LED灯珠201的共极端2011可以与下方的LED灯珠201的共极端2011在PCB板10的表层走线，第一LED灯珠行210中剩下的LED灯珠201的共极端2011可直接通过PCB板10上的过孔101以在PCB板10的内层或底层进行走线。
可以理解，第一方向上所有的第一LED灯珠行210由两行相邻的LED灯珠201组成，PCB板10上可以存在一组第一LED灯珠行210，也可以存在多组第一LED灯珠行210，第一LED灯珠行210的组数可以根据实际应用进行具体选择，本申请不做具体限定。
还可以理解，第一方向上任意两行相邻的LED灯珠201均可以形成第一LED灯珠行210，第一行的LED灯珠201、第二行的LED灯珠201可以形成如图3和图4所示的第一LED灯珠行210，第二行的LED灯珠201、第三行的LED灯珠201可以形成如图6所示的第一LED灯珠行210，第一LED灯珠行210的形成方式可以根据实际应用进行具体选择，本申请不做具体限定。
同时，为了尽可能减少PCB板10上过孔101的数量，若第一LED灯珠行210的上方存在LED灯珠201时，第一LED灯珠行210中与上方相邻的LED灯珠201的共极端2011可以与上方的LED灯珠201的共极端2011共用一个过孔101，即两个共极端2011之间在PCB板10的表层走线，其中一个共极端2011通过过孔101在PCB板10的内存或底层与其他行的共极端2011实现电连接即可；若第一LED灯珠行210的下方存在LED灯珠201时，第一LED灯珠行210中与下方相邻的LED灯珠201的共极端2011可以与下方的LED灯珠201的共极端2011共用一个过孔101，即两个共极端2011之间在PCB板10的表层走线，其中一个共极端2011通过过孔101在PCB板10的内存或底层与其他行的共极端2011实现电连接即可。
在一些实施例中，在所述的LED灯板结构中，所述第一方向上若干个相邻的两行所述LED灯珠201形成第二LED灯珠行220，所述第二LED灯珠行220中两行相邻的所述LED灯珠201的共极端2011在所述PCB板10的表层电连接。
可以理解，第一方向上第二LED灯珠行220同样也可以由相邻两行的LED灯珠201形成，该两行相邻LED灯珠201之间的间隙区域可用于该两行相邻LED灯珠201的共极端2011在PCB板10的表层走线，以实现两个相邻的LED灯珠201共用PCB板10上的一个过孔101，进而减少PCB板10上过孔101的数量，提高PCB板10的良品率，降低PCB板10的制造成本。
还可以理解，第一方向上所有的第二LED灯珠行220由两行相邻的LED灯珠201组成，PCB板10上可以存在一组第二LED灯珠行220，也可以存在多组第二LED灯珠行220，任意两行相邻的LED灯珠201均可以形成第二LED灯珠行220，第一行的LED灯珠201、第二行的LED灯珠201可以形成如图6所示的第二LED灯珠行220，第二行的LED灯珠201、第三行的LED灯珠201可以形成如图3和图4所示的第二LED灯珠行220，第二LED灯珠行220的组数、第二LED灯珠行220的形成方式均可以根据实际应用进行具体选择，本申请不做具体限定。
在一些实施例中，如图7所示，第二方向上每行的LED灯珠201中部分LED灯珠201的共极端2011均可以通过PCB板10上的过孔101以实现沿第二方向形成扫描线30，如图8所示，每行的LED灯珠201中除去最左边的LED灯珠201外，其余的LED灯珠201共极端2011均可以通过PCB板10上的过孔101以实现沿第二方向形成扫描线30。与现有技术中LED灯珠201的排布方式相比，图7和图8中LED灯珠201的排布方式可以减少PCB板10上过孔101的数量。
在一些实施例中，所述发光像素20在第一方向、第二方向上呈阵列排布。其中，LED灯珠201可以为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种，本实施例中每个发光像素20可以均相同，且每个发光像素20可以由红色LED灯珠、蓝色LED灯珠、绿色LED灯珠组成，红色LED灯珠、蓝色LED灯珠、绿色LED灯珠可以沿第二方向依次从上往下进行竖向排列，进而使得LED显示屏的左右视角对称，做成成品后的LED显示屏左右视角最大。
可以理解，图3至图8中LED灯珠201的排布方式可以在实际应用中旋转90度，即图3-7中所形成的列扫描线变成行扫描线，行数据线变成列数据线，每个发光像素20中各LED灯珠201的则会变成横向排列。
还可以理解，本申请实施例提供的LED灯板结构中的LED灯珠201既可以以COB的方式封装在PCB板10上，也可以以SMD的方式封装在PCB板10上，实际应用可以根据具体情况进行选择，本申请不做具体限定。
具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的实施例，在此不再赘述。
以上对本申请实施例所提供的一种LED灯板结构进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种LED灯板结构，包括：
    PCB板，所述PCB板上设置有若干个过孔；
    设置在所述PCB板上的多个LED灯珠，所述LED灯珠在第一方向、第二方向上呈阵列排布；相邻的多个所述LED灯珠沿第二方向依次排列以形成若干个发光像素；
    所述第二方向上若干行所述LED灯珠的共极端通过所述过孔电连接以沿所述第二方向形成一条扫描线；
    所述第一方向上每行所述LED灯珠的非共极端在所述PCB板的表层电连接以沿所述第一方向形成一条数据线。
  2. 根据权利要求1所述的LED灯板结构，其中，所述第二方向上第一行所述LED灯珠的共极端在所述PCB板的表层电连接以形成一条所述扫描线。
  3. 根据权利要求1所述的LED灯板结构，其中，所述第二方向上最后一行所述LED灯珠的共极端在所述PCB板的表层电连接以形成一条所述扫描线。
  4. 根据权利要求1所述的LED灯板结构，其中，所述第一方向上若干个相邻的两行所述LED灯珠形成第一LED灯珠行，所述第一LED灯珠行中每一行所述LED灯珠对应的所述数据线均沿所述第一方向穿过所述第一LED灯珠行。
  5. 根据权利要求4所述的LED灯板结构，其中，在所述第一LED灯珠行中，任意一行中若干个所述LED灯珠的共极端通过所述过孔电连接，以实现所述第一LED灯珠行中对应位置上的若干条所述扫描线位于所述PCB板的内层。
  6. 根据权利要求4所述的LED灯板结构，其中，在所述第一LED灯珠行中，任意一行中若干个所述LED灯珠的共极端通过所述过孔电连接，以实现所述第一LED灯珠行中对应位置上的若干条所述扫描线位于所述PCB板的底层。
  7. 根据权利要求1所述的LED灯板结构，其中，所述第一方向上若干个相邻的两行所述LED灯珠形成第二LED灯珠行，所述第二LED灯珠行中两行相邻的所述LED灯珠的共极端在所述PCB板的表层电连接。
  8. 根据权利要求1所述的LED灯板结构，其中，所述发光像素在第一方向、第二方向上呈阵列排布。
  9. 根据权利要求1所述的LED灯板结构，其中，所述第一方向为行方向，所述第二方向为列方向。
  10. 根据权利要求1所述的LED灯板结构，其中，各所述发光像素均相同。
  11. 根据权利要求1所述的LED灯板结构，其中，各所述发光像素包括红色LED灯珠、蓝色LED灯珠、绿色LED灯珠。
  12. 根据权利要求1所述的LED灯板结构，其中，所述第一方向上每行所述LED灯珠均为相同发光颜色的LED灯珠。
  13. 根据权利要求1所述的LED灯板结构，其中，所述LED灯珠为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
  14. 根据权利要求1所述的LED灯板结构，其中，各所述LED灯珠均相同。
  15. 根据权利要求1所述的LED灯板结构，其中，各所述LED灯珠的共极端为共阳极。
  16. 根据权利要求1所述的LED灯板结构，其中，各所述LED灯珠的共极端为共阴极。
  17. 根据权利要求1所述的LED灯板结构，其中，所述扫描线为列扫描线，所述数据线为行数据线。
  18. 根据权利要求1所述的LED灯板结构，其中，在所述第二方向上，若干个组相邻两行LED灯珠的共极端相邻。
  19. 根据权利要求1所述的LED灯板结构，其中，在所述第二方向上，若干个组相邻两行LED灯珠的非共极端相邻。
  20. 根据权利要求1所述的LED灯板结构，其中，所述LED灯珠以COB的方式或SMD的方式封装在所述PCB板上。
PCT/CN2022/110048 2022-07-05 2022-08-03 Led灯板结构 WO2024007400A1 (zh)

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