WO2024004314A1 - 複合基板および１３族元素窒化物エピタキシャル成長用基板 - Google Patents

複合基板および１３族元素窒化物エピタキシャル成長用基板 Download PDF

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WO2024004314A1
WO2024004314A1 PCT/JP2023/014345 JP2023014345W WO2024004314A1 WO 2024004314 A1 WO2024004314 A1 WO 2024004314A1 JP 2023014345 W JP2023014345 W JP 2023014345W WO 2024004314 A1 WO2024004314 A1 WO 2024004314A1
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substrate
group
nitride semiconductor
element nitride
semiconductor substrate
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義孝 倉岡
隆史 吉野
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NGK Insulators Ltd
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Definitions

  • the present invention relates to a composite substrate including a Group 13 element nitride semiconductor substrate and a Group 13 element nitride epitaxial growth substrate.
  • Group 13 element nitride semiconductors are direct transition type with wide band gaps, high dielectric breakdown fields, and high saturated electron velocities, so they are being actively developed as semiconductor materials for high-frequency/high-power electronic devices. It is.
  • a high electron mobility transistor (HEMT) is a typical electronic device using a group 13 element nitride semiconductor.
  • HEMT high electron mobility transistor
  • Group 13 element nitride substrates such as gallium nitride, which can be expected to achieve high performance and high reliability by epitaxial growth of a channel layer with less lattice strain, has been progressed.
  • Such a Group 13 element nitride substrate, which serves as a substrate for epitaxial growth is manufactured by a vapor phase method or a liquid phase method.
  • the Group 13 element nitride substrate applied to the epitaxial growth of HEMT devices has sufficiently high resistivity. It is known that group 13 element nitride doped with iron or manganese has relatively high resistivity (Patent Document 1).
  • a group 13 element nitride substrate with high resistivity when a group 13 element nitride is doped with a transition element such as iron or manganese, a group 13 element nitride substrate with high resistivity can be obtained.
  • a gallium nitride layer is epitaxially grown on the epitaxial growth surface of this substrate, the dislocation density becomes lower than that of a gallium nitride layer grown using a high-resistance silicon carbide substrate, a sapphire substrate, or the like as a seed substrate.
  • the number of dislocations contained in the channel layer is reduced, and current collapse phenomena caused inside the gallium nitride crystal are less likely to occur, resulting in higher reliability due to suppression of current gain drop. is expected to be obtained.
  • Patent Document 2 a supporting substrate made of a material having higher thermal conductivity than the group 13 element nitride semiconductor substrate is bonded to the main surface of a group 13 element nitride semiconductor substrate to create a composite substrate. Growing an epitaxial layer on top of this is being considered.
  • the material for the support substrate a material that has higher thermal conductivity than the material for the group 13 element nitride semiconductor substrate and has a smaller difference in coefficient of thermal expansion is being considered.
  • a composite substrate is described in which a thermally conductive support substrate made of silicon carbide or diamond, which has high thermal conductivity, is bonded to a group 13 element nitride semiconductor substrate (Patent Document 2).
  • An object of the present invention is to grow an epitaxial film on the Group 13 element nitride semiconductor substrate in a composite substrate having a Group 13 element nitride semiconductor substrate and a supporting substrate bonded to the Group 13 element nitride semiconductor substrate.
  • the present invention aims to suppress the warping of the composite substrate and the in-plane sheet resistance distribution of the HEMT structure formed by epitaxial growth on the composite substrate.
  • the present invention provides a group 13 element nitride semiconductor substrate having a first main surface and a second main surface, and a bonding surface bonded to the first main surface of the group 13 element nitride semiconductor substrate.
  • a composite substrate having a supporting substrate comprising: The bonding region of the support substrate is made of silicon carbide, where the average micropipe density at the bonding surface of the support substrate is 10 cm -2 or more and 100 cm -2 or less, or the atomic ratio of nitrogen atoms to carbon atoms is 500 ppm or more, It is characterized by being made of synthetic diamond with a content of 2000 ppm or less.
  • the present invention relates to a substrate for epitaxial growth of a group 13 element nitride, which is made of the composite substrate and characterized in that the second main surface is an epitaxial growth surface of a group 13 element nitride.
  • the present inventor discovered that when an epitaxial film is grown on a group 13 element nitride semiconductor substrate, the composite substrate tends to warp, and that the HEMT structure formed by epitaxial growth on the composite substrate has an in-plane sheet resistance distribution.
  • the present inventor further investigated the material of the support substrate to be bonded to the Group 13 element nitride semiconductor substrate.
  • normal diamond or silicon carbide which is dense and has good crystallinity, was used as the material for the support substrate, but this was changed to silicon carbide, which has a high average micropipe density of 10 cm -2 or more at the joint surface of the support substrate.
  • synthetic diamond which has a high impurity concentration, with an atomic ratio of nitrogen atoms to carbon atoms of 500 ppm or more.
  • FIG. 3 is a plan view showing measurement points of micropipe density and sheet resistance value distribution.
  • FIG. 1(a) is a schematic diagram of a composite substrate 3 according to an embodiment of the present invention
  • FIG. 1(b) is a schematic diagram of a HEMT element 10.
  • Group 13 element nitride semiconductor substrate 2 has a first main surface 2a and a second main surface 2b facing opposite to the first main surface 2a.
  • Support substrate 1 is composed of base substrate 11 and bonding region 12, and bonding surface 1a of support substrate 1 is bonded to first main surface 2a of group 13 element nitride semiconductor substrate 2.
  • the second main surface 2b of the group 13 element nitride semiconductor substrate 2 is selected as the epitaxial growth surface, and an epitaxial film is formed on the second main surface 2b.
  • a buffer layer 4 is formed on the second main surface 2b of the group 13 element nitride semiconductor substrate 2, a channel layer 5 is formed on the buffer layer 4, A barrier layer 6 is formed on the channel layer 5 .
  • a predetermined electrode can be provided on the surface 6a of the barrier layer 6.
  • a source electrode 9, a gate electrode 8, and a drain electrode 7 are formed.
  • a HEMT element capable of high output operation can be realized.
  • a power amplifier that operates at high output, high frequency, and high efficiency required for next-generation wireless communication base stations can be realized.
  • the Group 13 element nitride semiconductor substrate is made of a Group 13 element nitride semiconductor.
  • the Group 13 element is a Group 13 element defined by IUPAC, and is particularly preferably gallium, aluminum and/or indium. Further, as the Group 13 element nitride semiconductor, a Group 13 element nitride semiconductor selected from gallium nitride, aluminum nitride, indium nitride, or a mixed crystal thereof is preferable.
  • the group 13 element nitride semiconductor substrate has a resistivity of 1 ⁇ 10 6 ⁇ cm or more at room temperature. That is, the Group 13 element nitride semiconductor substrate is semi-insulating. From this viewpoint, the resistivity of the Group 13 element nitride semiconductor substrate at room temperature is preferably 1 ⁇ 10 7 ⁇ cm or more, and more preferably 1 ⁇ 10 9 ⁇ cm or more. Further, the resistivity of a group 13 element nitride semiconductor substrate at room temperature is often 1 ⁇ 10 13 ⁇ cm or less.
  • the second main surface of the Group 13 element nitride semiconductor substrate has a dislocation density of 10 6 cm -2 or less.
  • This dislocation density is preferably 10 5 cm ⁇ 2 or less. Further, in practice, this dislocation density is often 10 5 cm -2 or more.
  • the second main surface (epitaxial growth surface) of the group 13 element nitride semiconductor substrate may be a group 13 element polar surface or may be a nitrogen polar surface.
  • the Group 13 element nitride semiconductor substrate is doped with one or more elements selected from the group consisting of manganese, iron, and zinc. As a result, the resistivity of the group 13 element nitride semiconductor substrate can be improved.
  • the manganese concentration in the Group 13 element nitride semiconductor is preferably 1 ⁇ 10 18 atoms/cm 3 to 1 ⁇ 10 19 atoms/cm 3 , and preferably 2 ⁇ 10 18 atoms/cm 2 to 1 ⁇ 10 19 atoms/cm 3 . More preferably, it is 5 ⁇ 10 18 atoms/cm 3 .
  • the iron concentration in the Group 13 element nitride semiconductor is preferably 8 ⁇ 10 16 atoms/cm 3 to 5 ⁇ 10 19 atoms/cm 3 , and preferably 5 ⁇ 10 17 atoms/cm 2 to More preferably, it is 1 ⁇ 10 19 atoms/cm 3 .
  • the zinc concentration in the Group 13 element nitride semiconductor is preferably 1 ⁇ 10 17 atoms/cm 3 to 3 ⁇ 10 18 atoms/cm 3 , and preferably 2 ⁇ 10 17 atoms/cm 3 . More preferably, it is 3 to 1 ⁇ 10 18 atoms/cm 3 .
  • the manganese concentration, iron concentration, and zinc concentration in the Group 13 element nitride semiconductor shall be measured by SIMS (secondary ion mass spectrometry).
  • Group 13 element nitride semiconductor may contain elements other than zinc, iron, and manganese.
  • the elements include hydrogen (H), oxygen (O), silicon (Si), and carbon (C).
  • the Group 13 element nitride semiconductor substrate can be manufactured using vapor phase methods such as metal organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxy (HVPE), pulse excitation deposition (PXD), MBE, and sublimation. Examples include liquid phase methods such as the ammonothermal method and the flux method. Particularly preferably, the Group 13 element nitride semiconductor substrate is manufactured by a flux method.
  • a seed substrate is immersed in a flux containing manganese, iron, and/or zinc, and group 13 element nitrides are grown on the seed substrate in a high-temperature, high-pressure atmosphere.
  • a semiconductor substrate is obtained.
  • a seed crystal film is provided on the surface of a support substrate made of sapphire, group 13 element nitride single crystal, etc. to form a seed substrate, and a group 13 element nitride semiconductor is grown on the seed crystal film. .
  • the material for the seed crystal film include AlxGa1-xN (0 ⁇ x ⁇ 1) and InxGa1-xN (0 ⁇ x ⁇ 1), and gallium nitride is particularly preferred.
  • the method for forming the seed crystal film is preferably a vapor phase growth method, and examples include metal organic chemical vapor deposition (MOCVD), hydride vapor phase epitaxy (HVPE), pulse excitation deposition (PXD), MBE, and sublimation. can. Particularly preferred is organometallic chemical vapor deposition.
  • the growth temperature is preferably 950 to 1100°C.
  • the type of flux is not particularly limited as long as it can grow a group 13 element nitride semiconductor.
  • the flux contains at least one of an alkali metal and an alkaline earth metal, and a flux containing sodium metal is particularly preferred.
  • Metal raw materials are mixed and used for flux.
  • the metal raw material simple metals, alloys, and metal compounds can be used, but simple metals are preferable from the viewpoint of handling.
  • the temperature for growing a group 13 element nitride semiconductor in the flux method and the holding time during growth are not particularly limited and can be changed as appropriate depending on the composition of the flux.
  • the growth temperature is preferably 800 to 950°C, more preferably 850 to 900°C.
  • a group 13 element nitride semiconductor is grown in an atmosphere containing a gas containing nitrogen atoms.
  • This atmosphere is preferably nitrogen gas, but may also be ammonia.
  • the pressure of the atmosphere is not particularly limited, but from the viewpoint of preventing flux evaporation, it is preferably 10 atm or more, more preferably 30 atm or more. However, if the pressure is high, the apparatus becomes large-scale, so the total pressure of the atmosphere is preferably 2000 atmospheres or less, and more preferably 500 atmospheres or less.
  • the gas other than the gas containing nitrogen atoms in the atmosphere is not limited, an inert gas is preferable, and argon, helium, and neon are particularly preferable.
  • a seed crystal film made of gallium nitride is grown on a sapphire substrate by MOCVD to obtain a seed substrate.
  • This type of substrate is placed in a crucible, and then, in this crucible, 10 to 50 mol% of metallic Ga, 50 to 90 parts by mass of metallic Na, 0.0001 to 0.0001 of metallic Mn, metallic Fe, and metallic Zn are placed in the crucible. Filled with 1 mol%.
  • This crucible is placed in a heating furnace, heated at a furnace temperature of 800° C.
  • the gallium nitride thus obtained is polished using diamond abrasive grains to flatten its surface.
  • the support substrate is bonded to the first main surface of the Group 13 element nitride semiconductor substrate.
  • the bonding region of the support substrate is made of silicon carbide whose average micropipe density at the bonding surface of the support substrate is 10 cm -2 or more and 100 cm -2 or less, or the atomic ratio of nitrogen atoms to carbon atoms is 500 ppm or more. It is made of synthetic diamond with a content of 2000 ppm or less.
  • silicon carbide which is the material for the bonding region of the supporting substrate
  • inferior quality silicon carbide so-called dummy grade, which has many dislocations, defects, and micropipes, it is possible to When an epitaxial film is grown on the composite substrate, warping of the composite substrate is suppressed, and the in-plane sheet resistance distribution of the HEMT structure formed on the composite substrate by epitaxial growth is suppressed.
  • the bonding region of the support substrate is made of silicon carbide having an average micropipe density at the bonding surface of 10 cm -2 or more and 100 cm -2 or less.
  • the average micropipe density of this silicon carbide is 10 cm -2 or more, it is possible to reduce the warping of the composite substrate after forming the HEMT structure, and it is also possible to reduce the variation in the in-plane sheet resistance of the HEMT structure.
  • the average micropipe density of silicon carbide at the joint surface is 30 cm ⁇ 2 or more.
  • the average micropipe density of silicon carbide exceeds 100 cm -2 , the warping of the composite substrate after forming the HEMT structure can be reduced, but the variation in the in-plane sheet resistance of the HEMT structure may increase. found. For this reason, the average micropipe density of silicon carbide is set to 100 cm -2 or less, and more preferably to 70 cm -2 or less.
  • Examples of the method for producing the silicon carbide include a sublimation method and a high temperature chemical vapor deposition (CVD) method.
  • Silicon carbide has various crystal polymorphisms (polytypes), and any polymorphism can be applied. However, from the viewpoint of thermal conductivity and ease of acquisition, 4H and 6H are preferable.
  • the present silicon carbide may be either single crystal or polycrystal, it is desirable that the bonding surface be smooth, and from this point of view, single crystal is preferable.
  • the bonding region of the support substrate is formed using the aforementioned synthetic diamond, point defects due to the inclusion of nitrogen atoms are generated inside the bonding region, resulting in the formation of an epitaxial film on the group 13 element nitride semiconductor substrate.
  • warpage of the composite substrate is suppressed, and in-plane sheet resistance distribution of the HEMT structure on the composite substrate is suppressed.
  • the bonding region of the support substrate is made of synthetic diamond in which the atomic ratio of nitrogen atoms to carbon atoms is 500 ppm or more and 2000 ppm or less.
  • the atomic ratio of nitrogen atoms to carbon atoms is 500 ppm or more and 2000 ppm or less.
  • the atomic ratio of nitrogen atoms to carbon atoms exceeds 2000 ppm, it is possible to reduce the warping of the composite substrate after forming the HEMT structure, but the variation in the in-plane sheet resistance of the HEMT structure may increase. found. For this reason, the atomic ratio of nitrogen atoms to carbon atoms is set to 2000 ppm or less, preferably 1500 ppm or less. Furthermore, in order to cause stress relaxation evenly within the plane, it is desirable that nitrogen atoms be uniformly dispersed in the synthetic diamond as isolated substitutional impurities.
  • Examples of methods for producing synthetic diamond used in the present invention include HPHT method, CVD method, etc., and CVD method is more preferable.
  • synthetic diamond may be either single crystal or polycrystal, it is desirable that the bonding surface be smooth, and from this point of view, single crystal is desirable because it can be polished to a flat surface.
  • the entire support substrate 1 as shown in FIG. 1(a) may be made of the silicon carbide or the synthetic diamond. That is, the entire base substrate 11 and bonding region 12 may be made of the silicon carbide or the synthetic diamond. However, the entire support substrate 1 does not need to be made of the silicon carbide or the synthetic diamond, and it is sufficient that the bonding region 12 including the bonding surface of the support substrate is made of at least the silicon carbide or the synthetic diamond. This "bonding region" indicates a range with a thickness of 100 ⁇ m when viewed from the bonding surface of the support substrate.
  • the base substrate 11 is made of a single crystal or a sintered body of silicon single crystal, silicon polycrystal, sapphire single crystal, alumina polycrystal, or aluminum nitride. It's okay to stay.
  • the bonding surface of the support substrate is preferably flattened by polishing such as CMP.
  • a flat surface can be formed by forming a thin film made of the silicon carbide or the synthetic diamond on the bonding surface of the support substrate by CVD.
  • the arithmetic mean roughness Ra of the bonding surface of the support substrate is preferably 5 nm or less, more preferably 0.5 nm or less.
  • Elements made by epitaxial growth using silicon carbide with a high micropipe density or synthetic diamond with a high nitrogen content are generally considered undesirable because their characteristics deteriorate.
  • an epitaxial film that acts as a functional layer of the element is formed on a group 13 element nitride semiconductor substrate with a low dislocation density that is bonded to the support substrate, there is an influence due to the poor material of the support substrate. does not directly affect the epitaxial film.
  • Group 13 element nitride semiconductor substrates require a short distance between the supporting substrate and the epitaxial film from the viewpoint of suppressing a decrease in operating efficiency due to temperature rise during operation of an epitaxial film formed on its epitaxial growth surface, for example, a HEMT element. It is preferable to do so.
  • the thickness of the group 13 element nitride semiconductor substrate is preferably 150 ⁇ m or less, more preferably 50 ⁇ m or less.
  • the Group 13 element nitride semiconductor substrate is bonded to the support substrate, there is no fear of breakage and it is easy to handle even after polishing the Group 13 element nitride semiconductor substrate to a thickness of 150 ⁇ m or less. Therefore, it is preferable to polish the Group 13 element nitride semiconductor substrate after bonding.
  • Direct bonding is preferable for bonding the group 13 element nitride semiconductor substrate and the support substrate, but indirect bonding may also be used using an intermediate layer made of an inorganic material that can withstand high temperatures. Direct bonding is performed by obtaining a clean surface by wet cleaning or the like, and then irradiating the bonding surface with a neutralizing beam to activate it.
  • a suitable example of the beam source is a saddle field type high speed atomic beam source.
  • the voltage during activation by beam irradiation is preferably 0.5 to 2.0 kV, and the current is preferably 50 to 200 mA.
  • it is preferable to use an inorganic SiOx-based material as the intermediate layer (x 1 to 2).
  • an SiOx-based glass film having an amorphous structure is formed by plasma CVD using a raw material gas containing a silicon compound, and then the group 13 element nitride semiconductor substrate is bonded to the base substrate.
  • Raw material gases containing silicon compounds include silane, disilane, hexamethyldisiloxane (HMDSO), tetramethyldisiloxane (TMDSO), methyltrimethoxysilane (MTMOS), methylsilane, dimethylsilane, trimethylsilane, diethylsilane, etc. I can give an example.
  • Examples of the functional layer provided on the Group 13 element nitride semiconductor substrate include a channel layer, a buffer layer, and a barrier layer, as well as a light emitting layer, a rectifying element layer, and a switching element layer.
  • a buffer layer 4, a channel layer 5, and a barrier layer 6 are formed on the second main surface 2b of the group 13 element nitride semiconductor substrate 2.
  • the buffer layer 4, channel layer 5, and barrier layer 6 can be formed by, for example, metal organic chemical vapor deposition (MOCVD).
  • MOCVD metal organic chemical vapor deposition
  • Layer formation by the MOCVD method uses organometallic raw material gases (TMG (trimethyl gallium), TMA (trimethyl aluminum), TMI (trimethyl indium), etc.) according to the target composition, ammonia gas, hydrogen gas, and nitrogen gas.
  • the Group 13 element is supplied into the reactor of the MOCVD furnace, and while heating the Group 13 element nitride semiconductor substrate placed in the reactor to a predetermined temperature, the Group 13 element is generated through a gas phase reaction between the organometallic raw material gas and ammonia gas corresponding to each layer. Nitride is generated sequentially.
  • Example 1 (Prototype of support substrate 1 made of silicon carbide) Using a sublimation method (PVT method), a supporting substrate made of a 3-inch semi-insulating 4H-SiC single crystal with a thickness of 0.5 mm was prepared so that the vanadium concentration was 1 ⁇ 10 17 to 1 ⁇ 10 18 cm ⁇ 3 . prepared.
  • the nine points shown in FIG. 2 were observed using a polarizing microscope, the micropipes within a 3 mm x 4 mm area were counted, and the average micropipe density was calculated. .
  • FIG. 1 Prototype of support substrate 1 made of silicon carbide
  • approximately the center of the joint surface 1a is set as P1, and four points P2 on a circle C1 with a radius of 30 mm from the center P1 and four points P3 on a circle C2 with a radius of 60 mm from the center P1 are used as measurement points.
  • the four points P2 on the circle C1 are located 90 degrees apart from each other, and the four points P3 on the circle C2 are located 90 degrees apart from each other.
  • the average micropipe density on the bonding surface 1a of the support substrate 1 was changed as shown in Table 1. However, the average micropipe density was adjusted by changing the vanadium concentration. Note that the presence or absence of micropipes can be confirmed by analyzing a birefringence image observed with a polarizing microscope.
  • a 3-inch gallium nitride substrate made of Fe-doped gallium nitride was fabricated. Specifically, a seed crystal film made of gallium nitride with a thickness of 2 ⁇ m was formed on the surface of a c-plane sapphire substrate with a diameter of 3 inches by MOCVD to serve as a seed substrate. A gallium nitride single crystal was formed on this seed substrate using the Na flux method. Specifically, an alumina crucible was filled with 50 g of metal Ga, 100 g of metal Na, and metal Fe, and the crucible was covered with an alumina lid.
  • the crucible was placed in a heating furnace, heated at an internal temperature of 850° C. and an internal pressure of 4.0 MPa for 100 hours, and then cooled to room temperature.
  • brown gallium nitride single crystals with a thickness of about 1000 ⁇ m were deposited on the surface of the seed substrate.
  • gallium nitride single crystal was polished using diamond abrasive grains to flatten its surface, and the total thickness of the gallium nitride single crystal formed on the base substrate was 700 ⁇ m. I made it.
  • a seed substrate was separated from a gallium nitride single crystal using a laser lift-off method to obtain a gallium nitride substrate.
  • a gallium nitride substrate having a thickness of 400 ⁇ m was obtained by polishing the first main surface and the second main surface of the gallium nitride substrate.
  • a resistivity of 10 7 ⁇ cm or more was obtained. Note that the resistivity of each gallium nitride substrate was measured by a capacitance method (COREMA-WT manufactured by SEMIMAP).
  • the above gallium nitride substrate 2 and each supporting substrate 1 were bonded by a direct bonding method. Specifically, the first principal surface (nitrogen polar surface) 2a of the gallium nitride substrate 2 and the bonding surface (silicon polar surface) 1a of the support substrate were respectively surface activated and directly bonded.
  • the second main surface 2b of the gallium nitride substrate 2 was used as a gallium polar surface and an epitaxial growth surface. Moreover, the warpage of the obtained composite substrate 3 was 5 ⁇ m or less in all cases.
  • HEMT structure as shown in FIG. 1(b) was epitaxially grown on the main surface 2b of the gallium nitride substrate 2 of this composite substrate by MOCVD.
  • the composition and thickness of each layer are as follows. (Composition) (Film thickness: nm) Buffer layer 4: GaN 500 Channel layer 5: GaN 150 Barrier layer 6: AlGaN (Al ratio is 0.2): film thickness is 20 nm
  • the obtained HEMT structure was taken out from the MOCVD apparatus, and the warpage of the composite substrate on which the HEMT structure was formed was measured.
  • the SORI value was measured using "FT-17" manufactured by NIDEK.
  • the distribution of sheet resistance values within the plane of the HEMT structure 10 was calculated.
  • the sheet resistance was measured in a non-contact manner using a measurement probe with a diameter of 14 mm using "NC-80MAP" manufactured by Napson.
  • the measurement points were 9 points shown in FIG. 2.
  • P1 is approximately the center of the surface 6a of the barrier layer 6, and four points P2 on a circle C1 with a radius of 30 mm from the center P1 and four points P3 on a circle C2 with a radius of 60 mm from the center P1 are used as measurement points.
  • the four points P2 on the circle C1 are located 90 degrees apart from each other, and the four points P3 on the circle C2 are located 90 degrees apart from each other.
  • In-plane sheet resistance distribution (Maximum value of sheet resistance - Minimum value of sheet resistance) / (Average value of sheet resistance)
  • Table 1 shows the measurement results of the in-plane sheet resistance distribution and warpage.
  • the in-plane sheet resistance distribution becomes small and warpage is also reduced. From this point of view, it is more preferable that the average micropipe density is 30 cm ⁇ 2 or more.
  • the reason why the in-plane distribution of sheet resistance became large when the average micropipe density was low is considered to be that due to the large warpage, an in-plane distribution of the composition of Al and the like occurred during the formation of the epitaxial film.
  • the average micropipe density at the bonding surface of silicon carbide, which is the material of the support substrate is 100 cm ⁇ 2 or less, the in-plane sheet resistance distribution becomes small. From this point of view, it is more preferable that the average micropipe density is 70 cm ⁇ 2 or more.
  • AFM atomic force microscope
  • the micropipe density is high, the density of micropipes at the bonding surface of the support substrate made of silicon carbide is also uneven, and the bonding surface of the support substrate and the first principal surface (bonding surface) of the gallium nitride substrate are uneven. It is thought that the stress relaxation between the layers becomes uneven in the plane, causing microcracks, and as a result, there are places where the two-dimensional electron gas is suppressed to a low level during the formation of the epitaxial film, and the in-plane sheet resistance distribution becomes large. It will be done. When the average micropipe density was 30 cm -2 or more and 70 cm -2 or more, the in-plane sheet resistance distribution after the epitaxial film was formed was less than 10%, and the SORI value was less than 10 ⁇ m.
  • Example 2 A single-crystal synthetic diamond layer was uniformly grown to a thickness of 0.1 mm on the (100) plane of a 3-inch silicon single-crystal substrate using the CVD method while adding a small amount of nitrogen gas. Next, the bonding surface of this synthetic diamond layer and the first main surface (nitrogen polar surface) of the gallium nitride substrate were bonded by a direct bonding method. Next, the silicon single crystal substrate was removed by etching using hydrofluoric acid. As a result, a composite substrate 3 consisting of a support substrate 1 made of synthetic diamond and a gallium nitride substrate was obtained.
  • the nitrogen content of the synthetic diamond constituting the support substrate was made much higher than that of ordinary products, to 500 ppm or more, thereby reducing warpage and in-plane sheet resistance distribution. From this point of view, it is more preferable that the nitrogen content of the synthetic diamond constituting the support substrate be 800 ppm or more. It is thought that increasing the nitrogen content of the synthetic diamond constituting the support substrate increases the number of micro defects, reduces warpage, and reduces the in-plane sheet resistance distribution.
  • the in-plane sheet resistance distribution of the HEMT structure was less than 10%, and the SORI value was less than 20 ⁇ m.

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