WO2024000422A1 - 一种显示装置及其制作方法 - Google Patents

一种显示装置及其制作方法 Download PDF

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Publication number
WO2024000422A1
WO2024000422A1 PCT/CN2022/102871 CN2022102871W WO2024000422A1 WO 2024000422 A1 WO2024000422 A1 WO 2024000422A1 CN 2022102871 W CN2022102871 W CN 2022102871W WO 2024000422 A1 WO2024000422 A1 WO 2024000422A1
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WO
WIPO (PCT)
Prior art keywords
area
display
layer
bending
driver chip
Prior art date
Application number
PCT/CN2022/102871
Other languages
English (en)
French (fr)
Inventor
石佳凡
田学伟
刘畅畅
郭远征
丁小琪
陈立强
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/025,385 priority Critical patent/US20240298483A1/en
Priority to PCT/CN2022/102871 priority patent/WO2024000422A1/zh
Priority to CN202280002041.7A priority patent/CN117642787A/zh
Publication of WO2024000422A1 publication Critical patent/WO2024000422A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display device and a manufacturing method thereof.
  • OLEDs Flexible organic light emitting diodes
  • OLEDs are bendable and are currently widely used in electronic products such as rigid mobile phones, foldable products, and wearable products.
  • the battery capacity needs to be increased, which requires more battery installation space. How to provide more space for batteries and increase battery capacity within the limited space of electronic products has become an urgent technical problem that needs to be solved.
  • the present disclosure provides a display device and a manufacturing method thereof, which are used to save the lateral space of the entire machine.
  • an embodiment of the present disclosure provides a display device, which includes:
  • Driver chips, flexible circuit boards and display panels including:
  • the display panel includes a display area and a binding area located on one side of the display area.
  • the binding area includes a first bending area, a first connecting area, a second bending area and second connection area;
  • the first connection area is located on the back side of the display area
  • the second connection area is located on a side of the first connection area away from the display area
  • the driver chip is in the first connection area.
  • the flexible circuit board is bound and connected to the display panel in the second connection area, and the driver chip is disposed in an area of the first connection area away from the display area. On one side, the flexible circuit board is located on the side of the driver chip away from the display area;
  • the display panel includes a flexible substrate, at least one insulating layer and at least one metal layer disposed on the flexible substrate; the at least one insulating layer and at least one metal layer are located in the first bending area and The second bending area has no pattern; the flexible substrate includes a first flexible base layer, a substrate metal layer and a second flexible base layer that are stacked in sequence, and the at least one metal layer passes through the at least one The via hole of the insulating layer is coupled to the substrate metal layer.
  • the flexible base further includes a support layer disposed on a side of the second flexible base layer facing away from the first flexible base layer.
  • the display panel is provided with a groove structure penetrating to the support layer in both the first bending area and the second bending area.
  • a device area is provided on a side of the flexible circuit board away from the display area, and the device area is configured to be coupled with at least one component.
  • the method further includes an adhesive glue located between the first connection area and the flexible circuit board, and the adhesive glue is arranged around the driver chip.
  • the orthographic projection of the driver chip on the display area overlaps with the orthographic projection of the device area on the display area, and points toward the device along the first connection area. In the direction of the area, the thickness of the adhesive glue is greater than the height of the driver chip.
  • the orthographic projection of the driving chip on the display area and the orthographic projection of the device area on the display area do not overlap with each other, and the device area is disposed on the driving chip. The side facing away from the second connection area.
  • the flexible circuit board along the direction of the first connection area pointing to the flexible circuit board, the flexible circuit board further includes an opening through the thickness direction, the opening is used to accommodate the driver chip.
  • the thickness of the adhesive glue is smaller than the height of the driver chip, and the height of the driver chip is smaller than the height of the driver chip. The depth of the opening.
  • embodiments of the present disclosure also provide a method for manufacturing a display device as described above, which includes:
  • the second connecting area is bent through the second bending area to a side of the first connecting area away from the display area.
  • Figure 1 is a schematic structural diagram of a flexible OLED module structure in the related art
  • Figure 2 is a schematic structural diagram of a flexible OLED display module provided by the inventor
  • Figure 3 is a schematic structural diagram of a display panel in which the first bending area and the second bending area are in an unbent state according to an embodiment of the present disclosure
  • Figure 4 is a schematic structural diagram of a display panel in which the first bending area and the second bending area are in a bending state according to an embodiment of the present disclosure
  • Figure 5 is a schematic cross-sectional structural diagram of area S in Figure 3;
  • Figure 6 is a schematic top view of the structure of the area S in Figure 3;
  • Figure 7 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 8 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 9 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 10 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 11 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • Figure 12 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • FIG. 13 is a method flow chart of one of the manufacturing methods of a display device provided by an embodiment of the present disclosure.
  • a flexible OLED module structure as shown in Figure 1 is often used.
  • 01 represents the bending area
  • 02 represents the integrated circuit (IC) chip
  • 03 represents the printed circuit (Flexible Printed Circuit, FPC)
  • 04 represents the display screen
  • 05 represents the device setting area
  • 06 represents the FPC adhesive.
  • This structure takes advantage of the bendability of the flexible display screen and folds the IC 02 and FPC 03 to the back of the display screen 04 through the bending area 01.
  • the battery is often placed on the side of the device setting area 05 of FPC 03 away from the display screen 04. Since the plane where FPC 03 is located overlaps with the battery space, the thickness of the battery is limited, especially when FPC 03 includes the device setting area 05 and FPC.
  • the overall thickness of adhesive glue 06, etc. can reach 1mm ⁇ 3mm.
  • the battery needs to be reduced in thickness by 1mm ⁇ 3mm, and the capacity is limited.
  • embodiments of the present disclosure provide a display device and a manufacturing method thereof, which are used to save the lateral space of the entire machine while taking into account the layout of relevant wiring and improving the performance of the display device.
  • FIG. 3 is a schematic structural diagram of a display panel in which the first bending area B1 and the second bending area B3 are in an unbent state according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of a display panel in which the first bending area B1 and the second bending area B3 are in a bent state.
  • the display panel includes:
  • the binding area B includes a first bending area B1, a first connecting area B2, and a first bending area B1, a first connecting area B2, and a first bending area B1 and a first connecting area B2 located in the direction away from the display area A.
  • first connection area B2 is located on the back side of the display area A, and the second connection area B4 is located on a side of the first connection area B2 away from the display area A.
  • the first connection area B2 is configured to be coupled to the driver chip, and the second connection area B4 is configured to be coupled to the flexible circuit board.
  • the display panel includes a display area A and a binding area B located on one side of the display area A.
  • the binding area B includes first bending areas arranged sequentially in a direction away from the display area A. B1, first connection area B2, second bending area B3 and second connection area B4.
  • the direction indicated by the arrow X is the direction of the binding area B away from the display area A.
  • the distribution of the first bending area B1, the first connection area B2, the second bending area B3 and the second connection area B4 in the display area A and the binding area B can also be set according to actual application needs.
  • the first connection area B2 is located on the back side of the display area A
  • the second connection area B4 is located on the side of the first connection area B2 away from the display area A.
  • the first connection area B2, the second bending area B3 and the second connection area B4 can be bent to the back of the display area A through the first bending area B1; further, through the second bending area
  • the folding area B3 bends the second connecting area B4 to a side of the first connecting area B2 away from the display area A.
  • the display panel in the embodiment of the present disclosure saves the lateral space of the display panel through the structural design of the first bending area B1 and the second bending area B3. .
  • the display panel includes a flexible substrate 10, at least one insulation layer and at least one metal layer disposed on the flexible substrate 10;
  • the at least one insulating layer and the at least one metal layer have no pattern in the first bending area B1 and the second bending area B3;
  • the flexible substrate 10 includes a first flexible substrate layer, a substrate metal layer 102 and a second flexible substrate 10 layer that are stacked in sequence.
  • the at least one metal layer is connected to the at least one insulating layer through a via hole.
  • the substrate metal layer 102 is coupled.
  • FIG. 5 shows a schematic cross-sectional structural view of the region S in FIG. 3
  • FIG. 6 shows a schematic top view structural view of the region S in FIG. 3
  • the display panel includes a flexible substrate 10, at least one insulation layer and at least one metal layer disposed on the flexible substrate 10.
  • at least one insulating layer may be made in the same layer as the relevant insulating layer located in the display area A
  • at least one metal layer may be made in the same layer as the relevant metal layer located in the display area A.
  • the at least one insulating layer may be at least one of the first gate insulating layer, the second gate insulating layer, the interlayer insulating layer 30, the passivation layer 50, the planarization layer and other insulating layers.
  • the at least one metal layer may be at least one of the first source and drain electrode layer 40 , the second source and drain electrode layer 70 and other metal layers.
  • at least one insulation layer and at least one metal layer can also be provided according to actual application requirements, which are not limited here.
  • the display panel in addition to the flexible substrate 10 , the display panel includes a second gate layer 102 , an interlayer insulating layer 30 , a first source-drain electrode layer 40 , a passivation layer layer 50 , the first planarization layer 60 , the second source-drain electrode layer 70 and the second planarization layer 80 .
  • the relevant film layers in the display panel can also be set according to actual application needs, such as the anode layer, the luminescent layer, the pixel definition layer, the cathode layer, etc.
  • the specific setting method can be implemented by referring to the relevant technology, and will not be described in detail here. .
  • At least one insulating layer and at least one metal layer have no pattern in the first bending area B1 and the second bending area B3.
  • they can be formed by exposure and etching.
  • the etching process removes the portions of at least one insulating layer and at least one metal layer in the first bending area B1 and the second bending area B3.
  • the display panel is in the first bending area B1 and the second bending area B3.
  • the corresponding area can form a groove structure that penetrates at least one insulation layer and at least one metal layer, thereby ensuring the bending performance of the display panel in the first bending area B1 and the second bending area B3.
  • the flexible substrate 10 includes a first flexible base layer 101 , a substrate metal layer 102 and a second flexible base layer 103 that are stacked in sequence. At least one metal layer passes through a via hole that penetrates at least one insulating layer. (shown as dashed boxes H1 and H2 in FIG. 5 ) is coupled to the substrate metal layer 102 . In this case, the bending area circuit can be directly provided on the substrate metal layer 102 between the first flexible base layer 101 and the second flexible base layer 103 .
  • the thickness of the first flexible base layer 101 and the second flexible base layer 103 may range from 5 ⁇ m to 10 ⁇ m.
  • the material of the first flexible base layer 101 and the second flexible base layer 103 may be at least one of polyimide (PI), polyethylene terephthalate (PET), and polycarbonate (PC).
  • the materials of the first flexible base layer 101 and the second flexible base layer 103 may be the same material, for example, both are PI; they may also be different materials, for example, the first flexible base layer 101 is PI, and the second flexible base layer 103 is made of PI.
  • the bottom layer 103 is PET.
  • those skilled in the art can also select the materials of the first flexible base layer 101 and the second flexible base layer 103 according to actual application needs, which are not limited here. In this case, the first flexible base layer 101 and the second flexible base layer 103 have high elongation at break, and will not break even when the first bending area B1 and the second bending area B3 are bent.
  • the substrate metal layer 102 may be a film layer made of a metal material with good electrical conductivity, such as copper.
  • the base metal layer 102 is located between the first flexible base layer 101 and the second flexible base layer 103, which is essentially a stress neutral layer, even when bending the first bending area B1 and the second bending area. At B3, the stress on the substrate metal layer 102 is smaller, ensuring the bending performance of the display panel. In actual research, the inventor found that through simulation, when the bending radius is 0.05 mm, the strain of the substrate metal layer 102 is less than 10% of its fracture threshold.
  • the first bending area B1 and the second bending area B3 do not require additional protective glue, ensuring the small radius bending of the display panel, for example, the bending radius is less than 0.1mm.
  • the display panel can be bent twice with a smaller radius, thereby saving lateral space.
  • holes can be provided in the vicinity of the first bending area B1 and the second bending area B3 Area C, in the perforation area C, the relevant film layer is perforated.
  • the distribution of the opened via holes may be as shown in FIG. 5 and FIG. 6 , where H1 represents a via hole penetrating the support layer 90 and the second flexible base layer 103 , H2 represents a via hole penetrating the interlayer insulating layer 30 .
  • area 1 can be used to lay out power traces, such as high-potential traces VDD, and another example, low-potential traces VSS.
  • Area 2 can be used to lay out drive signal lines, and can also be used to lay out control signal lines, such as data signal lines, and clock signal lines.
  • power traces such as high-potential traces VDD, and another example, low-potential traces VSS.
  • Area 2 can be used to lay out drive signal lines, and can also be used to lay out control signal lines, such as data signal lines, and clock signal lines.
  • control signal lines such as data signal lines, and clock signal lines.
  • At least one insulating layer and at least one metal layer have no pattern in the first bending area B1 and the second bending area B3.
  • the first bending area B1 and the second bending area B3 can only retain the first flexible base layer 101, the base metal layer 102 and the second flexible base layer 103, and the relevant insulating layers and insulating layers in the corresponding areas that are not resistant to bending
  • the metal layer can be removed through exposure and etching processes, thereby improving the bending performance of the display panel.
  • the flexible substrate 10 further includes a support layer 90 disposed on a side of the second flexible substrate layer 103 facing away from the first flexible substrate layer 101 .
  • the flexible substrate 10 further includes a support layer 90 disposed on a side of the second flexible base layer 103 facing away from the first flexible base layer 101 .
  • the support layer 90 can be a film layer made of inorganic insulating materials such as silicon oxide and silicon nitride, or a film layer made of inorganic materials such as PI, which can effectively isolate the erosion of the substrate metal layer 102 by water and oxygen.
  • the flatness of the subsequent film layer structure is ensured and the production efficiency of the display panel is improved.
  • the display panel is provided with a groove structure 100 penetrating to the support layer 90 in both the first bending area B1 and the second bending area B3.
  • the display panel has a groove structure 100 penetrating to the support layer 90 in both the first bending area B1 and the second bending area B3 .
  • the first bending area B1 and the second bending area B3 The orthographic projection on the flexible substrate 10 completely falls within the area of the orthographic projection of the groove structure 100 on the flexible substrate 10. This ensures that the display panel is in the first bending area B1 and the second bending area.
  • the bending performance of B3 improves the production efficiency of display panels.
  • the preparation process of the display panel corresponding to Figure 5 may be to sequentially form the flexible substrate 10 and the support layer 90; Form the pattern of the active layer on the side; in the perforation area C, form via holes through the support layer 90 and the second flexible base layer 103 in sequence; then, deposit the first gate insulating layer, the first gate layer, the second gate layer The electrode insulating layer, the second gate electrode layer 102 and the interlayer insulating layer 30 are formed; then, a via hole is formed through the interlayer insulating layer 30; then, the first source and drain electrode layer 40, the passivation layer 50, and the first planarization layer are deposited.
  • the relevant film layer shown in Figure 5 is a structure in the perforated area C near the first bending area B1 or the second bending area B3, the corresponding area is usually not provided with an active layer, a first gate insulating layer, a second The gate insulating layer and the first gate layer are not shown in the figure.
  • the relevant film layers of the first bending area B1 and the second bending area B3 can also be set according to actual application needs, which will not be described in detail here.
  • an embodiment of the present disclosure also provides a display device, which includes:
  • Driver chip 200 flexible circuit board 300 and display panel 400; wherein:
  • the display panel 400 includes a display area A and a binding area B located on one side of the display area A.
  • the binding area B includes a first bending area B1, a first bending area B1, the first connection area B2, the second bending area B3 and the second connection area B4;
  • the first connection area B2 is located on the back side of the display area A, and the second connection area B4 is located on a side of the first connection area B2 away from the display area A, and the driver chip 200 is on
  • the first connection area B2 is bonded and connected to the display panel 400, the flexible circuit board 300 is bonded and connected to the display panel 400 in the second connection area B4, and the driver chip 200 is disposed on the display panel 400.
  • the first connection area B2 is on the side facing away from the display area A, and the flexible circuit board 300 is located on the side of the driving chip 200 facing away from the display area A;
  • the display panel 400 includes a flexible substrate 10, at least one insulating layer and at least one metal layer disposed on the flexible substrate 10; the at least one insulating layer and at least one metal layer are formed on the first bend. Both the folding area B1 and the second bending area B3 have no pattern; the flexible substrate 10 includes a first flexible base layer, a substrate metal layer 102 and a second flexible base layer 10 layered in sequence, and the at least one layer The metal layer is coupled to the substrate metal layer 102 through a via hole penetrating the at least one insulating layer.
  • the display device in the embodiment of the present disclosure includes a driver chip 200 , a flexible circuit board 300 and a display panel 400 .
  • the driver chip 200 is bound and connected to the display panel 400 in the first connection area B2, and the flexible circuit board 300 is bound and connected to the display panel 400 in the second connection area B4, thereby ensuring the display function of the display panel 400.
  • the driver chip 200 is provided with the first connection area B2 on the side facing away from the display area A, and the flexible circuit board 300 is located on the side of the driving chip 200 facing away from the display area A, thus saving the lateral space of the display device and providing a larger capacity for subsequent installation.
  • the battery provides protection.
  • the display panel 400 in the display device provided by the embodiment of the present disclosure includes a flexible substrate 10, at least one insulating layer and at least one metal layer disposed on the flexible substrate 10;
  • the at least one insulating layer and the at least one metal layer have no pattern in the first bending area B1 and the second bending area B3;
  • the flexible substrate 10 includes a first flexible base layer 101 that is stacked in sequence.
  • the substrate metal layer 102 and the second flexible base layer 103, the at least one metal layer is coupled to the substrate metal layer 102 through a via hole penetrating the at least one insulating layer.
  • the flexible base 10 further includes a support layer 90 disposed on a side of the second flexible base layer 103 facing away from the first flexible base layer 101 .
  • the support layer 90 can be a film layer made of inorganic insulating materials such as silicon oxide and silicon nitride, or a film layer made of inorganic materials such as PI, which can effectively isolate the erosion of the substrate metal layer 102 by water and oxygen.
  • the flatness of the subsequent film layer structure is ensured, and the manufacturing yield of the display device is improved.
  • the display panel 400 is provided with a groove structure 100 penetrating to the support layer 90 in both the first bending area B1 and the second bending area B3.
  • the orthographic projection of the first bending area B1 and the second bending area B3 on the flexible substrate 10 completely falls within the area of the orthographic projection of the groove structure 100 on the flexible substrate 10. In this way, the display panel is ensured
  • the bending performance of 400 in the first bending area B1 and the second bending area B3 improves the manufacturing yield of the display device.
  • a device area D is provided on a side of the flexible circuit board 300 away from the display area A, and the device area D is configured to be coupled with at least one component.
  • a device area D is provided on a side of the flexible circuit board 300 away from the display area A, and the device area D is configured to be coupled with at least one component.
  • at least one component may be at least one of a resistor, a capacitor, an inductor, etc.
  • at least one component may be configured according to actual applications, and is not limited here.
  • the display device further includes an adhesive glue 500 located between the first connection area B2 and the flexible circuit board 300 , and the adhesive glue 500 is disposed around the driving chip 200 .
  • the display device further includes an adhesive glue 500 located between the first connection area B2 and the flexible circuit board 300 .
  • the adhesive glue 500 may be disposed on the back of the flexible circuit board 300 , that is, a flexible circuit is provided. The side of the panel 300 close to the display area A.
  • the adhesive glue 500 is arranged around the driver chip 200, thereby ensuring a stable connection between the flexible circuit board 300 and the display panel 400, and ensuring the performance of the display device.
  • the display device provided by the embodiments of the present disclosure may also include other film layer structures.
  • the display device provided by the embodiment of the present disclosure also includes a back film 600 disposed on the back of the display area A, the back of the first connection area B2, and the back of the second connection area B4, thereby ensuring that the display panel 400
  • the display device also includes a heat sink 700 disposed on the side of the back film 600 facing away from the display area A, thereby ensuring the heat dissipation efficiency of the display device and improving the performance of the display device.
  • the heat sink 700 may be a composite heat dissipation structure composed of mesh glue, foam, and copper foil; the display device also includes double-sided tape disposed on the side of the heat sink 700 away from the display area A. 800, the double-sided tape 800 is located between the heat sink 700 and the back film 600 provided on the back of the first connection area B2, ensuring the structural stability of the display device; the display device also includes a polarizer 900 located on the front of the display area A. On the one hand, the polarizer 900 reduces the reflection of the display panel 400 to external ambient light, improving the user experience.
  • An adhesive layer 1000 and a cover plate 1010 may also be disposed on the side of the polarizer 900 away from the display panel 400 in sequence.
  • the adhesive layer 1000 can be optically clear adhesive (OCA), which not only ensures the transparent display of the display device, but also ensures the structural stability of the display device.
  • OCA optically clear adhesive
  • the cover 1010 can not only protect the display device from damage, but also improve the performance of the display device by providing a coating with specific functions on the cover 1010 .
  • the coating may be one or more of an anti-glare (AG) protective film layer, an anti-fingerprint (AF), and an anti-ultraviolet (UV) protective film layer, which are not limited here.
  • AG anti-glare
  • AF anti-fingerprint
  • UV anti-ultraviolet
  • other film layers can also be provided according to actual application needs, which can be implemented with reference to related technologies, which will not be described in detail here.
  • the following arrangement can be used between the driver chip 200 and the device area D in the display device, but is not limited to the following arrangement.
  • the direction indicated by the arrow Y is the direction along the first connection area B2 toward the device area D.
  • the thickness of the adhesive glue 500 is d1, and the height of the driver chip 200 is d2, d1>d2, thereby ensuring that the adhesive glue 500 pairs well between the display panel 400 and the flexible circuit board 300.
  • the driver chip 200 is effectively avoided, thereby avoiding damage to the driver chip 200 and improving the performance of the display device.
  • the thickness of the adhesive glue 500 is greater than 300 ⁇ m, thereby leaving sufficient avoidance space for the driver chip 200 .
  • the specific thickness of the adhesive glue 500 can be set according to actual application needs, and is not limited here.
  • FIG. 11 is a top structural schematic diagram corresponding to FIG. 10 .
  • the orthographic projection of the driving chip 200 on the display area A and the orthographic projection of the device area D on the display area A do not overlap with each other, and the device area D is disposed on the driving chip. 200 is the side facing away from the second connection area B4.
  • the orthographic projection of the driver chip 200 on the display area A and the orthographic projection of the device area D on the display area A do not overlap with each other.
  • the device area D is disposed on the right side of the driver chip 200 .
  • the device area D is disposed on the side of the driver chip 200 away from the second connection area B4, thereby effectively saving the lateral space of the display device.
  • the flexible circuit board 300 along the direction of the first connection area B2 pointing to the flexible circuit board 300, the flexible circuit board 300 also includes an opening 301 through the thickness direction, The opening 301 is used to accommodate the driving chip 200 .
  • the direction indicated by the arrow Y is the direction toward the flexible circuit board 300 along the first connection area B2.
  • the flexible circuit board 300 further includes an opening 301 extending through the thickness direction, and the opening 301 is used to accommodate the driver chip 200 .
  • the opening 301 on the flexible circuit board 300 effectively avoids the driving chip 200, avoids damage to the driving chip 200, and ensures the performance of the display device.
  • the thickness of the adhesive glue 500 is less than the height of the driver chip 200 , and the thickness of the adhesive glue 500 is smaller than the height of the driver chip 200 .
  • the height of the driver chip 200 is smaller than the depth of the opening 301 .
  • the thickness of the adhesive 500 is d3, the height of the driver chip 200 is d2, the depth of the opening 301 is d4, and d3 ⁇ d2 ⁇ d4.
  • the thickness of the adhesive glue 500 can be reduced to 50 ⁇ m to 100 ⁇ m, thereby reducing the overall thickness of the display device.
  • the thickness of the adhesive glue 500 can be set according to the specific thickness parameters of the driver chip 200 and the flexible circuit board 300, and is not limited here.
  • the adhesive glue 500 can be bonded to the side of the flexible circuit board 300 opposite to the device area D in advance. In this case, only when bending the second bending area B3, there is a risk of the adhesive glue 500 being exposed. In the process of binding and connecting the second connection area B4 and the flexible circuit board 300, the adhesive glue 500 and There will be no problem of premature bonding due to interference between the driver chip 200 and surrounding areas. Compared with the structure shown in Figure 2, the binding accuracy is higher.
  • the display device provided by the embodiments of the present disclosure may be an OLED flexible display device
  • the corresponding product may be a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other device with a display function. product or part.
  • Other essential components of the display device are understood by those of ordinary skill in the art, and will not be described in detail here, nor should they be used to limit the present disclosure.
  • an embodiment of the present disclosure also provides a method for manufacturing the above-mentioned display device.
  • the manufacturing method includes:
  • S101 Bind and connect the driver chip to the display panel through the first connection area
  • S102 Bind and connect the flexible circuit board and the display panel through the second connection area
  • S104 Bend the second connection area to the side of the first connection area away from the display area through the second bending area.
  • step S101 may be executed first and then step S102; step S102 may be executed first and then step S101; or step S101 and step S101 may be executed simultaneously. Step S102.
  • the execution order of step S101 and step S102 can be set according to actual application needs, and is not limited here.
  • the film layer patterns of the display panel in each area are prepared using relevant manufacturing processes; then, the driver chip is bound and connected to the display panel through the first connection area B2; through the second connection area Area B4 binds and connects the flexible circuit board to the display panel; then, the first connection area B2, the second bending area B3 and the second connection area B4 are bent to the back of the display area A through the first bending area B1; Then, further, the second connection area B4 is bent to the side of the first connection area B2 away from the display area A through the second bending area B3.
  • the display device includes a driver chip 200, a flexible circuit board 300 and a display panel 400; wherein: the display panel 400 includes a display area A and is located on one side of the display area A.
  • the binding area B includes a first bending area B1, a first connection area B2, a second bending area B3 and a second connection area B4 arranged sequentially away from the display area A; wherein, the first The connection area B2 is located on the back of the display area A, and the second connection area B4 is located on the side of the first connection area B2 away from the display area A.
  • the driver chip 200 is bound and connected to the display panel 400 in the first connection area B2.
  • the flexible circuit board 300 is bonded and connected to the display panel 400 in the second connection area B4, and the driver chip 200 is located on the side of the first connection area B2 away from the display area A, and the flexible circuit board 300 is located on the side of the drive chip 200 away from the display area A. That is to say, the display panel is folded through the first bending area B1 and the second bending area B3 respectively, so that the first connection area B2 is located on the back of the display area A, and the second connection area B4 is located on the first connection area.
  • the display panel 400 includes a flexible substrate 10, at least one insulating layer and at least one metal layer disposed on the flexible substrate 10, and the at least one insulating layer and at least one metal layer are located in the first bending area B1 and the There are no patterns in the two bending areas, thus ensuring the bending performance of the display panel.
  • the flexible substrate 10 includes a first flexible base layer 101, a base metal layer 102 and a second flexible base layer 103 that are stacked in sequence. At least one metal layer communicates with the base metal layer through a via hole penetrating at least one insulating layer. 102 coupling takes into account the layout of the relevant wiring of the display device and improves the performance of the display device.

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Abstract

本公开提供了一种显示装置及其制作方法，显示装置包括驱动芯片、柔性电路板和显示面板；显示面板包括显示区和位于所述显示区一侧的绑定区，绑定区包括沿背离显示区的方向依次设置的第一弯折区、第一连接区、第二弯折区和第二连接区；驱动芯片在第一连接区与显示面板绑定连接，柔性电路板在第二连接区与显示面板绑定连接，且驱动芯片设置在第一连接区背离显示区的一侧，柔性电路板位于驱动芯片背离显示区的一侧；显示面板包括柔性基底、设置在柔性基底上的至少一层绝缘层和至少一层金属层；至少一层绝缘层和至少一层金属层在第一弯折区和第二弯折区均无图案；柔性基底包括依次层叠设置的第一柔性基底层、衬底金属层和第二柔性基底层。

Description

一种显示装置及其制作方法 技术领域
本公开涉及显示技术领域，特别涉及一种显示装置及其制作方法。
背景技术
柔性有机发光二极管(Organic Light Emitting Diode，OLED)具有可弯折的特点，目前广泛应用于刚性手机、折叠产品和穿戴产品等电子产品。为提升电子产品的续航能力，需增加电池容量，这样的话，就需要更多的电池安装空间。如何在电子产品有限的空间内，为电池提供更多空间，提升电池容量成为急需解决的技术问题。
发明内容
本公开提供了一种显示装置及其制作方法，用于节省整机横向空间。
第一方面，本公开实施例提供了一种显示装置，其中，包括：
驱动芯片、柔性电路板和显示面板；其中：
所述显示面板包括显示区和位于所述显示区一侧的绑定区，所述绑定区包括沿背离所述显示区的方向依次设置的第一弯折区、第一连接区、第二弯折区和第二连接区；
其中，所述第一连接区位于所述显示区的背面，且所述第二连接区位于所述第一连接区背离所述显示区的一侧，所述驱动芯片在所述第一连接区与所述显示面板绑定连接，所述柔性电路板在所述第二连接区与所述显示面板绑定连接，且所述驱动芯片设置在所述第一连接区背离所述显示区的一侧，所述柔性电路板位于所述驱动芯片背离所述显示区的一侧；
所述显示面板包括柔性基底、设置在所述柔性基底上的至少一层绝缘层和至少一层金属层；所述至少一层绝缘层和至少一层金属层在所述第一弯折区和所述第二弯折区均无图案；所述柔性基底包括依次层叠设置的第一柔性 基底层、衬底金属层和第二柔性基底层，所述至少一层金属层通过贯穿所述至少一层绝缘层的过孔与所述衬底金属层耦接。
在一种可能的实现方式中，所述柔性基底还包括设置在所述第二柔性基底层背离所述第一柔性基底层的一侧的支撑层。
在一种可能的实现方式中，所述显示面板在所述第一弯折区和所述第二弯折区均开设有贯穿至所述支撑层的凹槽结构。
在一种可能的实现方式中，所述柔性电路板背离所述显示区的一侧设置有器件区，所述器件区被配置为与至少一个元器件耦接。
在一种可能的实现方式中，还包括位于所述第一连接区和所述柔性电路板之间的粘接胶，且所述粘接胶围绕所述驱动芯片设置。
在一种可能的实现方式中，所述驱动芯片在所述显示区的正投影与所述器件区在所述显示区的正投影相互交叠，且沿所述第一连接区指向所述器件区的方向，所述粘接胶的厚度大于所述驱动芯片的高度。
在一种可能的实现方式中，所述驱动芯片在所述显示区的正投影与所述器件区在所述显示区的正投影互不交叠，且所述器件区设置在所述驱动芯片背离所述第二连接区的一侧。
在一种可能的实现方式中，沿所述第一连接区指向所述柔性电路板的方向，所述柔性电路板还包括贯穿厚度方向的开孔，所述开孔用于容置所述驱动芯片。
在一种可能的实现方式中，沿所述第一连接区指向所述柔性电路板的方向，所述粘接胶的厚度小于所述驱动芯片的高度，且所述驱动芯片的高度小于所述开孔的深度。
第二方面，本公开实施例还提供了一种如上面所述的显示装置的制作方法，其中，包括：
通过所述第一连接区将所述驱动芯片与所述显示面板绑定连接；
通过所述第二连接区将所述柔性电路板与所述显示面板绑定连接；
通过所述第一弯折区将所述第一连接区、所述第二弯折区和所述第二连 接区弯折至所述显示区的背面；
通过所述第二弯折区将所述第二连接区弯折至所述第一连接区背离所述显示区的一侧。
附图说明
图1为相关技术中柔性OLED模组结构的其中一种结构示意图；
图2为本发明人提供的一种柔性OLED显示模组的其中一种结构示意图；
图3为本公开实施例提供的一种显示面板中第一弯折区和第二弯折区处于未弯折状态下的其中一种结构示意图；
图4为本公开实施例提供的一种显示面板中第一弯折区和第二弯折区处于弯折状态下的其中一种结构示意图；
图5为图3中区域S的其中一种剖面结构示意图；
图6为图3中区域S的其中一种俯视结构示意图；
图7为本公开实施例提供的一种显示装置的其中一种结构示意图；
图8为本公开实施例提供的一种显示装置的其中一种结构示意图；
图9为本公开实施例提供的一种显示装置的其中一种结构示意图；
图10为本公开实施例提供的一种显示装置的其中一种结构示意图；
图11为本公开实施例提供的一种显示装置的其中一种结构示意图；
图12为本公开实施例提供的一种显示装置的其中一种结构示意图；
图13为本公开实施例提供的一种显示装置的其中一种制作方法的方法流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。并且在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。基于所 描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。
需要注意的是，附图中各图形的尺寸和形状不反映真实比例，目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。
在相关技术中，常采用如图1所示的柔性OLED模组结构。其中，01表示弯折区，02表示集成电路(Integrated Circuit，IC)芯片，03表示印刷电路(Flexible Printed Circuit，FPC)，04表示显示屏，05表示器件设置区，06表示FPC粘接胶。这种结构利用柔性显示屏可弯折的性能，通过弯折区01将IC 02以及FPC 03反折至显示屏04背面。电池常设置在FPC 03的器件设置区05背离显示屏04的一侧，由于FPC 03所处平面会和电池空间交叠，因此限制了电池的厚度，尤其是FPC 03包括器件设置区05和FPC粘接胶06等，整体厚度可达到1mm～3mm，相应地电池需缩减1mm～3mm的厚度，容量受限。
本发明人发现，可以采用图2所示的结构，将FPC 03反向绑定，将FPC 03粘接至IC 02位置，从而避让了电池空间。但这种反向绑定工艺难度大，主要体现在绑定前需将FPC粘接胶06裸露，而对位过程中，裸露的FPC粘接胶06会和IC 02及其周边区域干涉，有提前粘接的风险，影响绑定精度。
鉴于此，本公开实施例提供了一种显示装置及其制作方法，用于在节省整机横向空间的同时，兼顾相关走线的布局，提高了显示装置的使用性能。
在本公开实施例中，为了更加清楚地说明本公开实施例提供的显示装置的结构，首先对本公开实施例提供的显示装置所包括的显示面板进行简要的解释说明。结合图3和图4所示，其中，图3为本公开实施例提供的显示面板中第一弯折区B1和第二弯折区B3处于未弯折状态下的其中一种结构示意 图，图4为本公开实施例提供的显示面板中第一弯折区B1和第二弯折区B3处于弯折状态下的其中一种结构示意图。具体来讲，该显示面板包括：
显示区A和位于所述显示区A一侧的绑定区B，所述绑定区B包括沿背离所述显示区A的方向依次设置的第一弯折区B1、第一连接区B2、第二弯折区B3和第二连接区B4；
其中，所述第一连接区B2位于所述显示区A的背面，且所述第二连接区B4位于所述第一连接区B2背离所述显示区A的一侧，所述第一连接区B2被配置为与驱动芯片耦接，所述第二连接区B4被配置为与柔性电路板耦接。
仍结合图3和图4所示，显示面板包括显示区A和位于显示区A一侧的绑定区B，该绑定区B包括沿背离显示区A的方向依次设置的第一弯折区B1、第一连接区B2、第二弯折区B3和第二连接区B4。其中，箭头X所示方向为绑定区B沿背离显示区A的方向。当然，还可以根据实际应用需要来设置显示区A和绑定区B中第一弯折区B1、第一连接区B2、第二弯折区B3以及第二连接区B4的分布情况，在此不做限定。
仍结合图4所示，第一连接区B2位于显示区A的背面，且第二连接区B4位于第一连接区B2背离显示区A的一侧。在图3的前提下，通过第一弯折区B1可以将第一连接区B2、第二弯折区B3和第二连接区B4弯折至显示区A的背面；进一步地，通过第二弯折区B3将第二连接区B4弯折至位于第一连接区B2背离显示区A的一侧。如此一来，相较于图1来说，本公开实施例中的显示面板通过第一弯折区B1和第二弯折区B3的两次反折的结构设计，节省了显示面板的横向空间。
在本公开实施例中，所述显示面板包括柔性基底10、设置在所述柔性基底10上的至少一层绝缘层和至少一层金属层；
所述至少一层绝缘层和至少一层金属层在所述第一弯折区B1和所述第二弯折区B3均无图案；
所述柔性基底10包括依次层叠设置的第一柔性基底层、衬底金属层102和第二柔性基底10层，所述至少一层金属层通过贯穿所述至少一层绝缘层的 过孔与所述衬底金属层102耦接。
结合图5和图6所示，其中，图5所示为图3中区域S的其中一种剖面结构示意图，图6为图3中区域S的其中一种俯视结构示意图。在具体实施过程中，显示面板包括柔性基底10、设置在柔性基底10上的至少一层绝缘层和至少一层金属层。其中，至少一层绝缘层可以是与位于显示区A的相关绝缘层同层制作，至少一层金属层可以是与位于显示区A的相关金属层同层制作。至少一层绝缘层可以是第一栅极绝缘层、第二栅极绝缘层、层间绝缘层30、钝化层50、平坦化层等绝缘层中的至少一种。至少一层金属层可以是第一源漏电极层40、第二源漏电极层70等金属层中的至少一种。当然，还可以根据实际应用需要来设置至少一层绝缘层和至少一层金属层，在此不做限定。
在其中一种示例性实施例中，仍结合图5所示，除柔性基底10之外，显示面板包括第二栅极层102、层间绝缘层30、第一源漏电极层40、钝化层50、第一平坦化层60、第二源漏电极层70和第二平坦化层80。当然，还可以根据实际应用需要来设置显示面板中的相关膜层，比如，阳极层、发光层、像素界定层、阴极层等，具体设置方式可以参照相关技术来实现，在此不做详述。
在具体实施过程中，至少一层绝缘层和至少一层金属层在第一弯折区B1和第二弯折区B3均无图案，在其中一种示例性实施例中，可以通过曝光、刻蚀工艺去除至少一层绝缘层和至少一层金属层在第一弯折区B1和第二弯折区B3的部分，这样的话，显示面板在第一弯折区B1和第二弯折区B3的对应区域可以形成贯穿至少一层绝缘层和至少一层金属层的凹槽结构，从而保证了显示面板在第一弯折区B1和第二弯折区B3的弯折性能。
仍结合图5所示，柔性基底10包括依次层叠设置的第一柔性基底层101、衬底金属层102和第二柔性基底层103，至少一层金属层通过贯穿至少一层绝缘层的过孔(如图5中虚线框H1和H2所示)与衬底金属层102耦接。这样的话，可以直接将弯折区线路设置在第一柔性基底层101和第二柔性基底层103之间的衬底金属层102。其中，第一柔性基底层101和第二柔性基底层103 的厚度范围可以为5μm～10μm。第一柔性基底层101和第二柔性基底层103的材料可以为聚酰亚胺(PI)、聚对苯二甲酸乙二醇酯(PET)、聚碳酸酯(PC)中的至少一种。第一柔性基底层101和第二柔性基底层103的材料可以是相同材料，比如，二者均为PI；也还可以是不同材料，比如，第一柔性基底层101为PI，第二柔性基底层103为PET。当然，本领域技术人员还可以根据实际应用需要来选择第一柔性基底层101和第二柔性基底层103的材料，在此不做限定。这样的话，第一柔性基底层101和第二柔性基底层103的断裂伸长率高，即便是在弯折第一弯折区B1和第二弯折区B3时不会发生断裂。
此外，衬底金属层102可以是由导电性能良好的金属材料制成的膜层，比如，铜。而且，衬底金属层102位于第一柔性基底层101和第二柔性基底层103之间，其本质上属于应力中性层，即便是在弯折第一弯折区B1和第二弯折区B3时，衬底金属层102所受的应力较小，保证了显示面板的弯折性能。本发明人在实际研究中发现，通过模拟仿真，在弯折半径为0.05mm时，衬底金属层102应变小于其断裂阈值10％。而且，在具体实施过程中，第一弯折区B1和第二弯折区B3无需额外设置保护胶，保证了显示面板的小半径弯折，比如，弯折半径小于0.1mm。这样的话，通过本公开实施例所提供的柔性基底10，可以实现更小半径弯折的同时，达到对显示面板进行二次反折，进而节省横向空间的目的。
在具体实施过程中，为了将电信号引入衬底金属层102对应的金属走线，保证显示面板的使用性能，可以在第一弯折区B1和第二弯折区B3的附近区域开设打孔区C，在打孔区C内，对相关膜层进行打孔。在其中一种示例性实施例中，所开设的过孔的分布情况可以是如图5和图6所示的情况，其中，H1表示贯穿支撑层90和第二柔性基底层103的过孔，H2表示贯穿层间绝缘层30的过孔。在图6中，区域①可以用来布局电源走线，比如，高电位走线VDD，再比如，低电位走线VSS。区域②可以用来布局驱动信号线，还可以用来布局控制信号线，比如，数据信号线，再比如，时钟信号线。当然，可以根据实际应用需要来进行开孔以及走线的布局，在此不做限定。
需要说明的是，本公开实施例所提供的显示面板中，至少一层绝缘层和至少一层金属层在第一弯折区B1和第二弯折区B3均无图案，在实际制备过程中，第一弯折区B1和第二弯折区B3可以仅保留第一柔性基底层101、衬底金属层102和第二柔性基底层103，对相应区域中不耐弯折的相关绝缘层和金属层，可以通过曝光、刻蚀工艺进行去除，从而提高了显示面板的弯折性能。
在本公开实施例中，所述柔性基底10还包括设置在所述第二柔性基底层103背离所述第一柔性基底层101的一侧的支撑层90。
仍结合图5所示，柔性基底10还包括设置在第二柔性基底层103背离第一柔性基底层101的一侧的支撑层90。其中，支撑层90可以为氧化硅、氮化硅等无机绝缘材料制成的膜层，还可以为PI等无机材料制成的膜层，在有效隔离水氧对衬底金属层102的侵蚀的同时，保证了后续膜层结构的平整度，提高了显示面板的制作效率。
在本公开实施例中，所述显示面板在所述第一弯折区B1和所述第二弯折区B3均开设有贯穿至所述支撑层90的凹槽结构100。
仍结合图5所示，显示面板在第一弯折区B1和第二弯折区B3均开设有贯穿至支撑层90的凹槽结构100，第一弯折区B1和第二弯折区B3在柔性基底10上的正投影，完全落入凹槽结构100在柔性基底10上的正投影的区域范围内，如此一来，保证了显示面板在第一弯折区B1和第二弯折区B3的弯折性能，提高了显示面板的制作效率。
需要说明的是，为了保证显示面板中相关走线的布局，图5对应的显示面板的制备过程可以是，依次形成柔性基底10和支撑层90；在支撑层90背离衬底金属层102的一侧形成有源层的图案；在打孔区C，依次形成贯穿支撑层90和第二柔性基底层103的过孔；然后，沉积第一栅极绝缘层、第一栅极层、第二栅极绝缘层、第二栅极层102和层间绝缘层30；然后，形成贯穿层间绝缘层30的过孔；然后，沉积第一源漏电极层40、钝化层50、第一平坦化层60；然后，形成贯穿第一平坦化层60的过孔；然后，沉积第二源漏极 层；然后沉积第二平坦化层80；后续，完成发光功能层以及封装功能层的制备，具体制备工艺可以参照相关技术来实现，在此不做详述。由于图5所示的相关膜层为第一弯折区B1或第二弯折区B3附近的打孔区C内结构，相应区域通常未设置有源层、第一栅极绝缘层、第二栅极绝缘层和第一栅极层，故图中并未示意出这些膜层结构。当然，还可以根据实际应用需要对第一弯折区B1和第二弯折区B3的相关膜层进行设置，在此不做详述。
基于同一公开构思，结合图7和图5所示，本公开实施例还提供了一种显示装置，该显示装置包括：
驱动芯片200、柔性电路板300和显示面板400；其中：
所述显示面板400包括显示区A和位于所述显示区A一侧的绑定区B，所述绑定区B包括沿背离所述显示区A的方向依次设置的第一弯折区B1、第一连接区B2、第二弯折区B3和第二连接区B4；
其中，所述第一连接区B2位于所述显示区A的背面，且所述第二连接区B4位于所述第一连接区B2背离所述显示区A的一侧，所述驱动芯片200在所述第一连接区B2与所述显示面板400绑定连接，所述柔性电路板300在所述第二连接区B4与所述显示面板400绑定连接，且所述驱动芯片200设置在所述第一连接区B2背离所述显示区A的一侧，所述柔性电路板300位于所述驱动芯片200背离所述显示区A的一侧；
所述显示面板400包括柔性基底10、设置在所述柔性基底10上的至少一层绝缘层和至少一层金属层；所述至少一层绝缘层和至少一层金属层在所述第一弯折区B1和所述第二弯折区B3均无图案；所述柔性基底10包括依次层叠设置的第一柔性基底层、衬底金属层102和第二柔性基底10层，所述至少一层金属层通过贯穿所述至少一层绝缘层的过孔与所述衬底金属层102耦接。
需要说明的是，本公开实施例提供的显示装置所包括的显示面板400的具体结构可以参照前述部分的描述，在此不再赘述。此外，本公开实施例提供的显示装置解决问题的原理与前述显示面板400相似，因此该显示装置的实施可以参见前述显示面板400的实施，重复之处不再赘述。
仍结合图7所示，本公开实施例中的显示装置包括驱动芯片200、柔性电路板300和显示面板400。其中，驱动芯片200在第一连接区B2与显示面板400绑定连接，柔性电路板300在第二连接区B4与显示面板400绑定连接，从而保证了显示面板400的显示功能。而且，驱动芯片200设置第一连接区B2背离显示区A的一侧，柔性电路板300位于驱动芯片200背离显示区A的一侧，从而节省了显示装置的横向空间，为后续安装较大容量的电池提供了保障。
此外，仍结合图5所示，本公开实施例提供的显示装置中的显示面板400，包括柔性基底10、设置在所述柔性基底10上的至少一层绝缘层和至少一层金属层；所述至少一层绝缘层和至少一层金属层在所述第一弯折区B1和所述第二弯折区B3均无图案；所述柔性基底10包括依次层叠设置的第一柔性基底层101、衬底金属层102和第二柔性基底层103，所述至少一层金属层通过贯穿所述至少一层绝缘层的过孔与所述衬底金属层102耦接。如此一来，在保证显示面板400的弯折性能的同时，保证了对显示装置相关走线的布局，提高了显示装置的使用性能。
在具体实施过程中，仍结合图5所示，所述柔性基底10还包括设置在所述第二柔性基底层103背离所述第一柔性基底层101的一侧的支撑层90。其中，支撑层90可以为氧化硅、氮化硅等无机绝缘材料制成的膜层，还可以为PI等无机材料制成的膜层，在有效隔离水氧对衬底金属层102的侵蚀的同时，保证了后续膜层结构的平整度，提高了显示装置的制作良率。而且，仍结合图5所示，所述显示面板400在所述第一弯折区B1和所述第二弯折区B3均开设有贯穿至所述支撑层90的凹槽结构100。第一弯折区B1和第二弯折区B3在柔性基底10上的正投影，完全落入凹槽结构100在柔性基底10上的正投影的区域范围内，如此一来，保证了显示面板400在第一弯折区B1和第二弯折区B3的弯折性能，提高了显示装置的制作良率。
需要说明的是，对于图5中显示面板400的具体结构可以参照前述相关部分的描述，在此不做赘述。
在本公开实施例中，所述柔性电路板300背离所述显示区A的一侧设置有器件区D，所述器件区D被配置为与至少一个元器件耦接。
如图8所示，柔性电路板300背离显示区A的一侧设置有器件区D，该器件区D被配置为与至少一个元器件耦接。其中，至少一个元器件可以是电阻、电容、电感等中的至少一个，当然，可以根据实际应用来设置至少一个元器件，在此不做限定。
在本公开实施例中，显示装置还包括位于所述第一连接区B2和所述柔性电路板300之间的粘接胶500，且所述粘接胶500围绕所述驱动芯片200设置。
仍结合图8所示，显示装置还包括位于第一连接区B2和柔性电路板300之间的粘接胶500，该粘接胶500可以是设置在柔性电路板300的背面，即设置柔性电路板300的靠近显示区A的一侧。而且，粘接胶500围绕驱动芯片200设置，从而保证了柔性电路板300与显示面板400之间的稳定连接，保证了显示装置的使用性能。
需要说明的是，本公开实施例提供的显示装置除了包括上述提及的膜层之外，还可以包括其它膜层结构。结合图9至图12所示，本公开实施例提供的显示装置还包括设置在显示区A背面、第一连接区B2背面、第二连接区B4背面的背膜600，从而保证了显示面板400的支撑性能；显示装置还包括设置在背膜600背离显示区A一侧的散热片700，从而保证了显示装置的散热效率，提高了显示装置的使用性能。在其中一种示例性实施例中，散热片700可以是由网格胶、泡棉以及铜箔组成的复合散热结构；显示装置还包括设置在散热片700背离显示区A一侧的双面胶800，该双面胶800位于散热片700和设置在第一连接区B2背面的背膜600之间，保证了显示装置的结构稳定性；显示装置还包括位于显示区A正面的偏光片900。通过偏光片900一方面降低了显示面板400对外界环境光的反射，提高了用户的使用体验，另一方面避免了外界环境光对有机发光材料的影响，保证了有机发光材料的寿命，提高了显示装置的使用性能。偏光片900背离显示面板400的一侧还可以依次设置胶材层1000和盖板1010。其中，胶材层1000可以是光学胶 (Optically Clear Adhensive，OCA)，在保证显示装置透明显示的同时，保证了显示装置的结构稳定性。此外，通过盖板1010不仅可以保护显示装置免受损伤，而且还可以通过在盖板1010上设置具有特定功能的涂层来提高显示装置的使用性能。其中，涂层可以是抗眩光(AG)保护膜层、防指纹(AF)、防紫外线(UV)保护膜层中的一种或几种，在此不做限定。当然，还可以根据实际应用需要来设置其它膜层，可以参照相关技术来实现，在此不做详述。
仍结合图9至图12所示，显示装置中的驱动芯片200与器件区D之间的可以采用以下设置方式，但又不仅限于以下设置方式。
在其中一种示例性设置方式中，仍结合图9所示，所述驱动芯片200在所述显示区A的正投影与所述器件区D在所述显示区A的正投影相互交叠，且沿所述第一连接区B2指向所述器件区D的方向，所述粘接胶500的厚度大于所述驱动芯片200的高度。
仍结合图9所示，箭头Y所示的方向为沿第一连接区B2指向器件区D的方向。相应地，沿箭头Y所示方向，粘接胶500的厚度为d1，驱动芯片200的高度为d2，d1>d2，从而在保证粘接胶500对显示面板400和柔性电路板300之间的有效固定的同时，对驱动芯片200进行了有效避让，避免了驱动芯片200的损伤，提高了显示装置的使用性能。比如，粘接胶500的厚度大于300μm，从而为驱动芯片200预留出充足的避让空间。当然，可以根据实际应用需要来设置粘接胶500的具体厚度，在此不做限定。
在其中一种示例性设置方式中，结合图10和图11所示，其中，图11为图10对应的其中一种俯视结构示意图。具体来讲，所述驱动芯片200在所述显示区A的正投影与所述器件区D在所述显示区A的正投影互不交叠，且所述器件区D设置在所述驱动芯片200背离所述第二连接区B4的一侧。
在具体实施过程中，驱动芯片200在显示区A的正投影与器件区D在显示区A的正投影互不交叠，以图11为例，器件区D设置在驱动芯片200的右侧。而且，器件区D设置在驱动芯片200背离第二连接区B4的一侧，从而有效节省了显示装置的横向空间。
在其中一种示例性设置方式中，如图12所示，沿所述第一连接区B2指向所述柔性电路板300的方向，所述柔性电路板300还包括贯穿厚度方向的开孔301，所述开孔301用于容置所述驱动芯片200。
仍结合图12所示，箭头Y所示的方向为沿第一连接区B2指向柔性电路板300的方向。相应地，沿箭头Y所示方向，柔性电路板300还包括贯穿厚度方向的开孔301，开孔301用于容置驱动芯片200。如此一来，通过柔性电路板300上所开设的开孔301，有效地避让了驱动芯片200，避免了驱动芯片200的损伤，保证了显示装置的使用性能。
在具体实施过程中，仍结合图12所示，沿所述第一连接区B2指向所述柔性电路板300的方向，所述粘接胶500的厚度小于所述驱动芯片200的高度，且所述驱动芯片200的高度小于所述开孔301的深度。
仍结合图12所示，沿第箭头Y所示的方向，粘接胶500的厚度为d3，驱动芯片200的高度为d2，开孔301的深度为d4，而且，d3<d2<d4。如此一来，在有效避让驱动芯片200的同时，节省了显示装置的纵向空间，保证了显示装置的薄型化设计。在实际应用中，粘接胶500的厚度可以减薄至50μm～100μm，从而降低了显示装置的整体厚度。当然，对于粘接胶500的厚度可以根据驱动芯片200以及柔性电路板300的厚度具体参数来设置，在此不做限定。
需要说明的是，在制备本公开实施例提供的显示装置的过程中，可以预先将粘接胶500贴合在柔性电路板300与器件区D相对的一侧。这样的话，只有在弯折第二弯折区B3时，粘接胶500才有裸露的风险，在将第二连接区B4与柔性电路板300绑定连接的过程，避免了粘接胶500与驱动芯片200以及周边区域的干涉，不会有提前粘接的问题。相较于图2所示的结构来说，绑定精度更高。
在具体实施过程中，本公开实施例提供的显示装置可以是OLED柔性显示装置，对应的产品可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其 它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此就不做赘述，也不应作为对本公开的限制。
基于同一公开构思，如图13所示，本公开实施例还提供了一种上面所述的显示装置的制作方法，该制作方法包括：
S101：通过所述第一连接区将所述驱动芯片与所述显示面板绑定连接；
S102：通过所述第二连接区将所述柔性电路板与所述显示面板绑定连接；
S103：通过所述第一弯折区将所述第一连接区、所述第二弯折区和所述第二连接区弯折至所述显示区的背面；
S104：通过所述第二弯折区将所述第二连接区弯折至所述第一连接区背离所述显示区的一侧。
在具体实施过程中，对于步骤S101和步骤S102二者之间，可以是先执行步骤S101，再执行步骤S102；还可以是先执行步骤S102，再执行步骤S101；还可以是同时执行步骤S101和步骤S102。当然，可以根据实际应用需要来设置步骤S101和步骤S102的执行顺序，在此不做限定。
在其中一种示例性实施例中，首先，采用相关制作工艺制备好显示面板在各个区的膜层图案；然后，通过第一连接区B2将驱动芯片与显示面板绑定连接；通过第二连接区B4将柔性电路板与显示面板绑定连接；然后，通过第一弯折区B1将第一连接区B2、第二弯折区B3和第二连接区B4弯折至显示区A的背面；然后，再进一步地，通过第二弯折区B3将第二连接区B4弯折至第一连接区B2背离显示区A的一侧。
需要说明的是，在采用图12所示的显示装置时，需要预先在柔性电路板上沿贯穿厚度的方向设置用于容置驱动芯片的开孔。对应显示面板相关膜层的制作工艺可以参照前述显示面板部分的描述，在此不再赘述。
在本公开实施例提供的一种显示装置及其制作方法中，该显示装置包括驱动芯片200、柔性电路板300和显示面板400；其中：显示面板400包括显示区A和位于显示区A一侧的绑定区B，该绑定区B包括沿背离显示区A依次设置的第一弯折区B1、第一连接区B2、第二弯折区B3和第二连接区B4； 其中，第一连接区B2位于显示区A的背面，且第二连接区B4位于第一连接区B2背离显示区A的一侧，驱动芯片200在第一连接区B2与显示面板400绑定连接，柔性电路板300在第二连接区B4与显示面板400绑定连接，且驱动芯片200设置在第一连接区B2背离显示区A的一侧，柔性电路板300位于驱动芯片200背离显示区A的一侧。也就是说，通过第一弯折区B1和第二弯折区B3分别对显示面板进行反折处理，使得第一连接区B2位于显示区A的背面，第二连接区B4位于第一连接区B2背离显示区A的一侧，而且驱动芯片200位于第一连接区B2背离显示区A的一侧，柔性电路板300位于驱动芯片200背离显示区A的一侧，从而节省了显示装置的横向空间，进而为后续安装较大容量的电池提供了保障。而且，显示面板400包括柔性基底10、设置在该柔性基底10上的至少一层绝缘层和至少一层金属层，至少一层绝缘层和至少一层金属层在第一弯折区B1和第二弯折区均无图案，从而保证了显示面板的弯折性能。此外，柔性基底10包括依次层叠设置的第一柔性基底层101、衬底金属层102和第二柔性基底层103，至少一层金属层通过贯穿至少一层绝缘层的过孔与衬底金属层102耦接，兼顾了对显示装置相关走线的布局，提高了显示装置的使用性能。
尽管已描述了本公开的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本公开范围的所有变更和修改。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (10)

  1. 一种显示装置，其中，包括：
    驱动芯片、柔性电路板和显示面板；其中：
    所述显示面板包括显示区和位于所述显示区一侧的绑定区，所述绑定区包括沿背离所述显示区的方向依次设置的第一弯折区、第一连接区、第二弯折区和第二连接区；其中，所述第一连接区位于所述显示区的背面，且所述第二连接区位于所述第一连接区背离所述显示区的一侧，所述驱动芯片在所述第一连接区与所述显示面板绑定连接，所述柔性电路板在所述第二连接区与所述显示面板绑定连接，且所述驱动芯片设置在所述第一连接区背离所述显示区的一侧，所述柔性电路板位于所述驱动芯片背离所述显示区的一侧；
    所述显示面板包括柔性基底、设置在所述柔性基底上的至少一层绝缘层和至少一层金属层；所述至少一层绝缘层和至少一层金属层在所述第一弯折区和所述第二弯折区均无图案；所述柔性基底包括依次层叠设置的第一柔性基底层、衬底金属层和第二柔性基底层，所述至少一层金属层通过贯穿所述至少一层绝缘层的过孔与所述衬底金属层耦接。
  2. 如权利要求1所述的显示装置，其中，所述柔性基底还包括设置在所述第二柔性基底层背离所述第一柔性基底层的一侧的支撑层。
  3. 如权利要求2所述的显示装置，其中，所述显示面板在所述第一弯折区和所述第二弯折区均开设有贯穿至所述支撑层的凹槽结构。
  4. 如权利要求1-3任一项所述的显示装置，其中，所述柔性电路板背离所述显示区的一侧设置有器件区，所述器件区被配置为与至少一个元器件耦接。
  5. 如权利要求4所述的显示装置，其中，还包括位于所述第一连接区和所述柔性电路板之间的粘接胶，且所述粘接胶围绕所述驱动芯片设置。
  6. 如权利要求5所述的显示装置，其中，所述驱动芯片在所述显示区的正投影与所述器件区在所述显示区的正投影相互交叠，且沿所述第一连接区 指向所述器件区的方向，所述粘接胶的厚度大于所述驱动芯片的高度。
  7. 如权利要求5所述的显示装置，其中，所述驱动芯片在所述显示区的正投影与所述器件区在所述显示区的正投影互不交叠，且所述器件区设置在所述驱动芯片背离所述第二连接区的一侧。
  8. 如权利要求7所述的显示装置，其中，沿所述第一连接区指向所述柔性电路板的方向，所述柔性电路板还包括贯穿厚度方向的开孔，所述开孔用于容置所述驱动芯片。
  9. 如权利要求8所述的显示装置，其中，沿所述第一连接区指向所述柔性电路板的方向，所述粘接胶的厚度小于所述驱动芯片的高度，且所述驱动芯片的高度小于所述开孔的深度。
  10. 一种如权利要求1-9任一项所述的显示装置的制作方法，其中，包括：
    通过所述第一连接区将所述驱动芯片与所述显示面板绑定连接；
    通过所述第二连接区将所述柔性电路板与所述显示面板绑定连接；
    通过所述第一弯折区将所述第一连接区、所述第二弯折区和所述第二连接区弯折至所述显示区的背面；
    通过所述第二弯折区将所述第二连接区弯折至所述第一连接区背离所述显示区的一侧。
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CN105228335A (zh) * 2015-08-26 2016-01-06 昆山工研院新型平板显示技术中心有限公司 柔性线路板及其制造方法和显示装置
CN107484328A (zh) * 2017-08-30 2017-12-15 厦门天马微电子有限公司 一种显示装置
CN109240013A (zh) * 2018-11-27 2019-01-18 上海中航光电子有限公司 显示面板和显示装置
CN113066832A (zh) * 2021-03-17 2021-07-02 京东方科技集团股份有限公司 一种显示基板及显示装置
CN113725232A (zh) * 2020-12-25 2021-11-30 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置

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CN105228335A (zh) * 2015-08-26 2016-01-06 昆山工研院新型平板显示技术中心有限公司 柔性线路板及其制造方法和显示装置
CN107484328A (zh) * 2017-08-30 2017-12-15 厦门天马微电子有限公司 一种显示装置
CN109240013A (zh) * 2018-11-27 2019-01-18 上海中航光电子有限公司 显示面板和显示装置
CN113725232A (zh) * 2020-12-25 2021-11-30 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
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