WO2023284373A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2023284373A1
WO2023284373A1 PCT/CN2022/090391 CN2022090391W WO2023284373A1 WO 2023284373 A1 WO2023284373 A1 WO 2023284373A1 CN 2022090391 W CN2022090391 W CN 2022090391W WO 2023284373 A1 WO2023284373 A1 WO 2023284373A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
electronic components
conductive sheet
conductive
electronic device
Prior art date
Application number
PCT/CN2022/090391
Other languages
English (en)
French (fr)
Inventor
董晓勇
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US17/800,289 priority Critical patent/US20240130048A1/en
Priority to EP22741414.1A priority patent/EP4149095B1/en
Publication of WO2023284373A1 publication Critical patent/WO2023284373A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate

Definitions

  • the present application relates to the field of electronic technology, and in particular to an electronic device.
  • the thickness of electronic products mainly depends on the thickness of the camera, especially the rear camera.
  • it is mainly to dig holes on the main board (that is, the circuit board).
  • the area where the main board is dug is There is no way to route the wires.
  • the hole will inevitably cut off the charging path on the circuit board or the high current path for the power supply voltage (Voltage of Battery, VBAT) to supply power to other devices, which will cause these
  • the impedance of the path increases, the efficiency decreases, and the power consumption deteriorates.
  • the main purpose of the present application is to provide an electronic device.
  • the camera components can be supported, and the charging path or high current path can be shortened, thereby reducing impedance, improving efficiency, and preventing deterioration of power consumption.
  • the present invention adopts the following technical solutions:
  • the present application provides an electronic device, including: a circuit board and a camera assembly, the circuit board has a mounting hole penetrating through the thickness direction of the circuit board, and the mounting hole includes A first end and a second end arranged oppositely; the camera assembly includes a first part disposed in the mounting hole and a second part protruding from the first end of the mounting hole, the first part including a camera substrate Component; a support member disposed on the circuit board and located at the mounting hole, the first part is disposed on the support member, the support member includes at least one conductive sheet, and the at least one conductive sheet is also Coupling to the metal wires of the circuit board, the at least one conductive sheet and the camera substrate assembly are insulated from each other.
  • the support can not only support the camera assembly, but also couple the conductive sheet to the metal traces on the circuit board, such as connecting the conductive sheet to the large current power supply network on the circuit board (such as the VBUS line)
  • the formed high-current charging network is connected, thereby shortening the above-mentioned charging path and reducing impedance.
  • the conductive sheet and the camera substrate assembly are insulated from each other, it is also possible to prevent the conductive sheet from being coupled to the large current network in the camera substrate assembly.
  • the number of the conductive sheet is one; the support member further includes: an insulating layer disposed on the surface of the conductive sheet close to the first part, the insulating layer Insulating the conductive sheet from the camera substrate assembly.
  • An insulating layer can be provided only at the position where the conductive sheet is close to the surface of the first part and is in contact with the camera substrate assembly, so that the conductive sheet and the camera substrate assembly can be insulated.
  • each conductive sheet there are multiple conductive sheets, the multiple conductive sheets are insulated from each other, and each conductive sheet is coupled to a metal trace of the circuit board. Multiple high current paths can be implemented and the impedance of each high current path can be reduced.
  • the plurality of conductive sheets are arranged at intervals on a plane parallel to the surface of the circuit board, and there is a gap between every two adjacent conductive sheets;
  • the support member It also includes: an insulating casing, the plurality of conductive sheets are arranged in the insulating casing, and the plurality of conductive sheets are insulated from the camera substrate assembly through the insulating casing.
  • a plurality of conductive sheets By arranging a plurality of conductive sheets at intervals on a plane parallel to the surface of the circuit board, and having a gap between every two adjacent conductive sheets, a plurality of conductive sheets can be located in the same plane, and each phase Two adjacent conductive sheets are insulated from each other, and at the same time, a plurality of conductive sheets can be fixed together through the insulating shell to realize the integration of the support.
  • the structure of the insulating shell it can also ensure the insulation of multiple conductive sheets stacked with the whole machine, and can ensure the surface smoothness of the support, and improve the support flatness of the support to the camera assembly.
  • the insulating shell and the plurality of conductive sheets are integrally structured.
  • the insulating shell and multiple conductive sheets can be formed by an in-mold injection molding process.
  • An example of the insulating shell can be a plastic material. Set multiple conductive sheets in the mold and inject a layer of plastic on the outside of the multiple conductive sheets. The above integrated structure is obtained.
  • each set of electrical connection lines includes at least one metal trace; the first part of electronic components and the second part of electronic components are respectively located in the mounting holes along the reference direction
  • Each conductive sheet includes at least two connecting parts arranged on the opposite sides of the mounting hole along the reference direction; when the number of the conductive sheet is one, one conductive sheet is regarded as a group A part of the electrical connection line, and coupled with the first part of the electronic components and the second part of the electronic components through the at least one metal trace; in the case of multiple conductive sheets
  • Each conductive sheet is used as a part of a group of electrical connection lines, and is coupled with the first part of electronic components and the second part of electronic components through the at least one metal trace.
  • the first part of electronic components can include a charging chip, and the second part of electronic components can include a second connector connected to the charging FPC.
  • the internal power supply can be connected to the circuit board through the power connector, and the charging FPC can be connected through the second connector.
  • the charger is connected to the circuit board, and the other end of the charging FPC can be connected to the USB interface.
  • a conductive sheet can be used as a part of the charging network and connected to the high-current charging network formed by the VBUS line.
  • the first part of electronic components may include a power connector connected to the internal power supply
  • the second part of electronic components may include other electronic components that need to be powered by the internal power supply.
  • the internal power supply is connected to the circuit board through the power connector , a conductive strip can be used as a part of the power network, connected to the network formed by the internal power supply voltage VBAT to supply power to other electronic components.
  • the first part of the electronic components may include a charging chip and a power connector connected to the internal power supply
  • the second part of the electronic components may include a second connector connected to the charging FPC and other electronic components that need to be powered by the battery
  • the internal power supply is connected to the circuit board through the power connector
  • the charging FPC can be connected to the circuit board through the second connector
  • the other end of the charging FPC can be connected to the USB interface
  • a conductive sheet can be used as a part of the charging network, It is connected to the high-current charging network formed by the VBUS line, and the other conductive sheet, as a part of the power supply network, is connected to the network formed by the internal power supply voltage VBAT to supply power to other electronic components.
  • each connecting portion of each conductive sheet is a pin structure, and each pin structure is inserted on the circuit board and connected to the metal wiring inside the circuit board .
  • the connection part with pin structure can improve the connection stability between the conductive sheet and the circuit board, thereby improving the connection stability between the support part and the circuit board, preventing the support part from falling, and further improving the support stability of the support part.
  • the electronic device further includes: a shielding structure disposed between the conductive sheet and the first part, and the shielding structure and the conductive sheet are insulated from each other.
  • the large current signal flowing through the conductive sheet can be shielded to avoid interference to the current signal flowing through the camera substrate assembly of the camera assembly.
  • the circuit board includes: a first ground terminal
  • the camera substrate assembly includes: a second ground terminal
  • the shielding structure is connected to the first ground terminal and/or the second ground terminal terminal coupling.
  • the shielding structure is copper foil or conductive cloth.
  • An embodiment of the present application provides an electronic device.
  • the support can not only support the camera assembly, but also couple the conductive sheet to the metal traces on the circuit board, such as connecting the conductive sheet to the circuit board
  • the high-current power supply network on the circuit (such as the high-current charging network formed by the VBUS line) is connected, so that the above-mentioned charging path can be shortened and the impedance can be reduced.
  • the conductive sheet and the camera substrate assembly are insulated from each other, it is also possible to prevent the conductive sheet from being coupled to the large current network in the camera substrate assembly.
  • FIG. 1A is a structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 1B is a structural diagram of an electronic component provided by an embodiment of the present application.
  • FIG. 2A is a perspective view of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 2B is a side view of a circuit board provided by an embodiment of the present application.
  • FIG. 2C is a side view of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 3 is a side view of another circuit board assembly provided by the embodiment of the present application.
  • FIG. 4 is a top view of a circuit board assembly provided in the related art
  • FIG. 5 is a top view of another circuit board assembly provided by the related art.
  • FIG. 6 is a top view of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 7 is a top view of another circuit board assembly provided by an embodiment of the present application.
  • FIG. 8 is a top view of another circuit board assembly provided by an embodiment of the present application.
  • FIG. 9 is a top view of another circuit board assembly provided by an embodiment of the present application.
  • Fig. 10 is a structural diagram of an electrical connection line between a first part of electronic components and a second part of electronic components provided by an embodiment of the present application;
  • Fig. 11 is a structural diagram of another electrical connection line between the first part of electronic components and the second part of electronic components provided by the embodiment of the present application;
  • Fig. 12 is a structural diagram of another electrical connection line between the first part of electronic components and the second part of electronic components provided by the embodiment of the present application;
  • Fig. 13 is a structural diagram of another electrical connection line between the first part of electronic components and the second part of electronic components provided by the embodiment of the present application;
  • Fig. 14 is a structural diagram of yet another electrical connection line between the first part of electronic components and the second part of electronic components provided by the embodiment of the present application;
  • Fig. 15 is a side view of another circuit board assembly provided by the embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, unless otherwise specified, "plurality” means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other.
  • the term “coupled” may be used when describing some embodiments to indicate that two or more elements are in direct physical or electrical contact.
  • the terms “coupled” or “communicatively coupled” may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the context herein.
  • At least one of A, B and C has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, A and B A combination of A and C, a combination of B and C, and a combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • references herein include the stated value as well as mean values that are within acceptable deviations from the specified value, as determined by one of ordinary skill in the art. Determined taking into account the measurement in question and the errors associated with the measurement of a particular quantity (ie, limitations of the measurement system).
  • Exemplary embodiments are described herein with reference to cross-sectional and/or plan views that are idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Accordingly, variations in shape from the drawings as a result, for example, of manufacturing techniques and/or tolerances are contemplated.
  • example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will, typically, have curved features.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • Some embodiments of the present application provide an electronic device, including but not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computer, UMPC), handheld computers, walkie-talkies, netbooks, POS machines, personal Mobile or fixed terminals with circuit boards such as personal digital assistants (PDAs), driving recorders, wearable devices, or virtual reality devices.
  • PDAs personal digital assistants
  • the electronic device 01 mainly includes a display module 10 , a middle frame 20 and a casing 30 .
  • the middle frame 20 is disposed between the display module 10 and the casing 30 .
  • the display module 10 may include a liquid crystal display (liquid crystal display, LCD) screen, and a backlight module (back light unit, BLU) for providing a light source to the liquid crystal display.
  • the display module 10 may include an organic light emitting diode (OLED) display screen capable of realizing self-illumination.
  • OLED organic light emitting diode
  • the display module 10 may include a display and a touch device, the display is used to output display content to the user, and the touch device is used to receive a touch signal input by the user on the display.
  • the electronic device 01 further includes a plurality of electronic components 40 .
  • the electronic component 40 includes a packaging structure 410 and at least one chip 411 packaged in the packaging structure 410 .
  • the embodiment of the present application provides a circuit board assembly 50 disposed in an electronic device 01 as shown in FIG. 1A .
  • the circuit board assembly 50 may be disposed on a side surface of the middle frame 20 facing the casing 30 .
  • the circuit board assembly 50 includes the circuit board 1 as shown in FIG. 2A .
  • the circuit board 1 includes an upper surface A1 and a lower surface A2 oppositely disposed.
  • the electronic components 40 can be integrated on the upper surface A1 or the lower surface A2 of the circuit board 1 .
  • both the upper surface A1 and the lower surface A2 of the one-layer circuit board 1 are integrated with electronic components 40 .
  • the circuit board 1 may be a printed circuit board (printed circuit board, PCB). As shown in FIG. 2B , it can be known from the cross-sectional structure of the circuit board 1 that the circuit board 1 includes at least one insulating carrier 11 . Two adjacent layers of insulating carrier boards 11 are fixedly connected by an adhesive layer 12 .
  • the upper surface or the lower surface of the insulating carrier 11 is provided with metal traces 13 .
  • both the upper surface and the lower surface of the insulating carrier 11 are provided with metal traces 13 .
  • the metal traces 13 in the circuit board 1 are used to electrically connect a plurality of electronic components 40 integrated on the circuit board 1 .
  • the circuit board 1 is a main board, which plays the role of carrying the electronic components 40 and realizing the electrical connection between the electronic components 40 .
  • the electronic component 40 may include a camera assembly 2 , and an example of the camera assembly 2 may be a rear camera.
  • the circuit board 1 has a mounting hole P that runs through the thickness direction of the circuit board 1, and the mounting hole P includes The first end P1 and the second end P2 are oppositely arranged along the thickness direction of the circuit board 1 .
  • the camera assembly 2 includes a first portion 21 disposed in the mounting hole P and a second portion 22 protruding from the first end P1 of the mounting hole P, wherein the first portion 21 includes a camera substrate assembly 211 .
  • the second part 22 may include a photosensitive chip 221 and a lens assembly 222, and the lens assembly 222 may include a lens and a filter.
  • the photosensitive chip 221 is arranged on the camera substrate assembly 211 and is coupled to the camera substrate assembly 211 , and the optical filter and the lens are sequentially arranged along a direction away from the camera substrate assembly 211 .
  • the working principle of the camera assembly 2 is: after the circuit board 1 powers on the camera assembly 2, the lens acquires an optical image and projects the optical image onto the photosensitive chip 221, the image information is converted into a data signal by the photosensitive chip 221, and the data signal passes through
  • the data port of the camera substrate assembly 211 is sent to the circuit board 1, and the circuit board 1 transmits the data signal to the display module, and the display module displays the image information.
  • the photosensitive chip 221, the optical filter and the lens can all be arranged in the installation hole P or outside the installation hole P, or one part is arranged inside the installation hole P, and the other part is arranged outside the installation hole P.
  • FIG. 3 it is shown that the camera substrate assembly 211 is arranged in the mounting hole P, and the photosensitive chip 221, the optical filter and the lens are all arranged outside the mounting hole P.
  • a part of the camera substrate assembly 211 is arranged in the mounting hole P, and the other part can extend to one side of the mounting hole P and connect with the first connector.
  • the first connector 23 is connected to the circuit board 1 , so as to realize the electrical connection between the camera assembly 2 and the circuit board 1 .
  • the camera substrate assembly 211 is a rigid-flexible circuit board as an example.
  • the second end P2 of the mounting hole P is arranged close to the middle frame, and the camera substrate assembly 211 protrudes from the first end P1 of the mounting hole P, and extends to the position of the first connector 23 to connect with the first connector 23,
  • the first connection Device 23 can be BTB (Board to Board, board-to-board) connector, at this moment, camera assembly 2 is connected with circuit board 1 by the mode of BTB (Board to Board, board-to-board), and BTB connector is used for connecting two PCBs , so as to achieve mechanical and electrical connection, which is characterized by the pairing of male and female connectors, such as using a male connector to paste the circuit board 1 (or camera substrate assembly 211), and a female connector patch on the camera substrate assembly 211 (or on the circuit board 1) to realize the connection.
  • the support of the camera assembly 2 is mainly the support of the middle frame or the bracket, wherein the bracket in the bracket support can be fixed on the circuit board 1 by bonding or welding.
  • the circuit board assembly further includes: a support member 3 disposed on the circuit board 1 and located at the mounting hole P, and the first part 21 is disposed on the support member 3
  • the support member 3 includes at least one conductive sheet 31 , at least one conductive sheet 31 is also coupled to the metal wiring 13 of the circuit board 1 , and the at least one conductive sheet 31 is insulated from the camera substrate assembly 211 .
  • the conductive sheet 31 can be connected with one or A plurality of metal traces 13 are coupled.
  • each conductive sheet 31 can be coupled with one or more metal traces 13 of the circuit board 1, or multiple conductive sheets 31 can be connected to the circuit board 1.
  • the same metal wire 13 is coupled, at this time, a plurality of conductive plates 31 can be connected in series or in parallel.
  • the metal wiring 13 can be connected to the same signal port of two electronic components 40 (for one electronic component 40, the same signal port can include one or more pins), in the case of multiple metal wires 13, multiple metal wires 13 can be connected in parallel between the same signal ports of two electronic components 40 to complete the connection between the two electronic components 40 The transmission of the same signal between. In the case of multiple metal wires 13, the multiple metal wires 13 can be respectively connected between multiple pairs of signal ports of two electronic components 40, so as to complete the connection of different signals between the two electronic components 40. transmission.
  • the metal wire 13 connected between the charging chip 200 and the charging FPC can be one or more, wherein, as shown in FIG. 4 , the metal wire 13 connected between the charging chip 200 and the charging FPC One line 13 is taken as an example.
  • the metal lines 13 are respectively connected to a respective pin of the charging chip 200 and the charging FPC, and the VBUS line (the VBUS line is HOST /HUB to the power supply line of the USB device) for the transmission of the large current charging signal formed.
  • each metal wire 13 in the two metal wires 13 are respectively connected to one pin of the charging chip 200 and the charging FPC, and all pins of the charging chip 200 and the charging FPC used to connect the two metal wires 13 belong to the same signal port (for example, the second connector 400 has two two pins are used to transmit current, and there are two corresponding pins on the charging chip 200 to receive current), through these two metal wires 13, the transmission of the same signal (such as the large current charging signal formed by the VBUS line) is jointly realized, Understandably, the two metal wires 13 may not belong to the same signal port.
  • the electrical connection wires connected between the charging chip 200 and the charging FPC may include metal traces 13 arranged on the circuit board 1 and used to connect the circuit board 1
  • the metal wiring 13 connected between the charging chip 200 and the charging FPC as an example before the support 3 is set, after the support 3 is set, it can be regarded as The middle part of the metal wiring 13 is interrupted.
  • the number of the conductive sheet 31 can be one, and the conductive sheet 31 is used as a part for connecting the metal wiring 13 on the circuit board 1, and is arranged on the circuit board.
  • the metal trace 13 on 1 is coupled. As shown in FIG. 5 and FIG.
  • the first situation can be regarded as that the middle part of a plurality of metal traces 13 is all interrupted, at this moment, as shown in Figure 7, the number of conductive sheet is one, and this conductive sheet 31 is taken as a whole, It is coupled with the part of each metal trace 13 reserved on the circuit board 1, or, as shown in FIG. A part of the wire 13 is coupled with the part of the metal wire 13 disposed on the circuit board 1 .
  • a part of the plurality of metal wires 13 is still arranged in a winding manner, and the rest is interrupted.
  • the number of the conductive sheet 31 can be one, and the conductive sheet 31 as a whole is connected with the Parts of the interrupted metal wires 13 arranged on the circuit board 1 are coupled, or the number of conductive sheets 31 is multiple, and each conductive sheet 31 is a part of a metal wire 13 that is interrupted, It is coupled with the part of the metal wire 13 disposed on the circuit board 1 .
  • the multiple conductive sheets 31 can also be connected in series or in parallel to form one As a whole, and as a part of the metal wiring 13 , it is coupled with the part of the metal wiring 13 disposed on the circuit board 1 .
  • the supporting member 3 not only plays the role of supporting the camera assembly 2, but also couples the conductive sheet 31 and the metal wiring 13 on the circuit board 1, such as connecting the conductive sheet 31 and the large wire on the circuit board 1.
  • the current power supply network (such as the high-current charging network formed by the VBUS line) is connected, so that the above-mentioned charging path can be shortened and the impedance can be reduced.
  • the conductive sheet 31 and the camera substrate assembly 211 are insulated from each other, it is also possible to prevent the conductive sheet 31 from being coupled to the large current network in the camera substrate assembly 211 .
  • the first part 21 when the first part 21 is disposed on the support member 3 , the first part 21 can be fixed to the support member 3 through an adhesive layer 35 to prevent the camera assembly 2 from being displaced.
  • the adhesive layer 35 can be hot melt adhesive.
  • the number of conductive sheets 31 is one, and the support member 3 further includes: an insulating layer 32 disposed on the surface of the conductive sheet 31 close to the first part 21, the insulating layer 32 makes the conductive sheet 31 It is insulated from the camera substrate assembly 211.
  • the insulating layer 32 can be provided only at the position where the conductive sheet 31 is close to the surface of the first part 21 and in contact with the camera substrate assembly 211 , so as to insulate the conductive sheet 31 from the camera substrate assembly 211 .
  • the first part 21 can be pasted and fixed to the insulating layer 32 through the adhesive layer 35 .
  • the number of conductive sheets 31 is multiple, and the plurality of conductive sheets 31 are insulated from each other, and each conductive sheet 31 is coupled to a metal trace 13 of the circuit board 1 .
  • a plurality of conductive sheets 31 can be stacked on top of each other, and an insulating layer 32 is arranged between every two adjacent conductive sheets 31, so that multiple large current paths can be realized and the cost of each large current path can be reduced. impedance.
  • the support member 3 further includes: an insulating shell 33 , a plurality of conductive sheets 31 are disposed in the insulating shell 33 , and the plurality of conductive sheets 31 are insulated from the camera substrate assembly 211 through the insulating shell 33 .
  • the plurality of conductive sheets 31 can be positioned at In the same plane, each adjacent two conductive sheets 31 are insulated from each other, and at the same time, multiple conductive sheets 31 can be fixed together by the insulating shell 33 to realize the integration of the support member 3 .
  • the structure of the insulating shell 33 it is also possible to ensure the insulation of multiple conductive sheets 31 stacked with the whole machine, and to ensure the smoothness of the surface of the support member 3, thereby improving the support of the support member 3 to the camera assembly 2 flatness.
  • the first part 21 can be adhered and fixed to the insulating casing 33 through the adhesive layer 35 .
  • the insulating shell 33 and the plurality of conductive sheets 31 are integrated.
  • the insulating casing 33 and the plurality of conductive sheets 31 can be formed by an in-mold insert injection molding process.
  • the insulating casing 33 can be made of plastic material, and the plurality of conductive sheets 31 are placed in the mold. A layer of plastic is injected on the outside of the sheet 31 to obtain the above integrated structure.
  • the circuit board assembly 50 further includes: a first part of electronic components 401 and a second part of electronic components 402 arranged on the circuit board 1 , and a first part of electronic components connected to the first part At least one set of electrical connection lines 100 between the component 401 and the second part of electronic components 402 , each set of electrical connection lines 100 includes at least one metal wire 13 .
  • the first part of electronic components 401 and the second part of electronic components 402 are respectively located on opposite sides of the mounting hole P along the reference direction (direction shown by arrow b in FIG.
  • each conductive sheet 31 serves as a set of electrical connection lines 100 , and couple with the first part of electronic components 401 and the second part of electronic components 402 through at least two connection parts 311 and at least one metal wire 13 .
  • the first part of electronic components 401 may include a charging chip 200
  • the second part of electronic components 402 may include a second connector 400 connected to a charging FPC
  • the internal power supply can be connected to the circuit board 1 through the power connector 300
  • the charging FPC can be connected to the circuit board 1 through the second connector 400
  • the other end of the charging FPC can be connected to the USB interface, so that a conductive sheet 31 It can be used as a part of the charging network and connected to the high-current charging network formed by the VBUS line.
  • FIG. 10 and FIG. 11 the first part of electronic components 401 may include a charging chip 200
  • the second part of electronic components 402 may include a second connector 400 connected to a charging FPC
  • the first part of electronic components 401 may include a power connector 300 connected to an internal power supply
  • the second part of electronic components 402 may include other electronic components 40 that need to be powered by an internal power supply, such as a CPU, Power-consuming devices such as radio frequency modules, at this time
  • the internal power supply is connected to the circuit board 1 through the power connector 300, and a conductive sheet 31 can be used as a part of the power supply network, connected to other electronic components 40 formed by the internal power supply voltage VBAT. on the network.
  • a conductive sheet 31 can be used as a part of the power supply network, connected to other electronic components 40 formed by the internal power supply voltage VBAT. on the network.
  • the first part of electronic components 401 may include a charging chip 200 and a power connector 300 connected to an internal power supply
  • the second part of electronic components 402 may include a second connector connected to a charging FPC 400 and other electronic components 40 that need to be powered by the battery.
  • the internal power supply is connected to the circuit board 1 through the power connector 300, and the charging FPC can be connected to the circuit board 1 through the second connector 400, and the other end of the charging FPC Can be connected with the USB interface, one conductive sheet 31 can be used as a part of the charging network, connected to the large current charging network formed by the VBUS line, and the other conductive sheet 31 is used as a part of the power supply network, connected to the other charging network from the internal power supply voltage VBAT
  • the electronic components 40 are powered on the formed network.
  • the charging and/or power supply path can be shortened;
  • the wiring 13 can use the position of the mounting hole P to increase the thickness and width of the conductive sheet 31, thereby reducing the circuit impedance to the greatest extent, improving efficiency, and preventing deterioration of power consumption.
  • the above-mentioned corresponding power supply network impedance can be reduced by more than 60%.
  • one conductive sheet 31 can be arranged at the mounting hole P, and pass through at least two conductive sheets 31 arranged on opposite sides of the mounting hole P along the reference direction.
  • the connecting portion 311 is connected to the circuit board 1 .
  • FIG. 10 it shows that a conductive sheet 31 is connected to three connecting parts 311 (that is, three connection parts 311 (that is, 311a, 311b and 311c), using the conductive sheet 31 as a part of the first group of electrical connecting wires 100A to realize the charging of the VBUS line.
  • the power supply pin of the second connector 400 is connected to the pin 311a through the metal wire 13a of the circuit board 1, connected to the pin 311b through the metal wire 13b of the circuit board 1, and connected to the pin 311b through the metal wire 13b of the conductive sheet 31.
  • 311c is connected to the charging chip 200 through the metal wiring 13c of the circuit board, thereby forming the first group of electrical connection lines 100A, wherein the combination of 13a and 13c can be regarded as a metal wiring, and the combination of 13b and 13c can be regarded as It is another metal trace, and a conductive sheet 31 is used as a part of the first group of electrical connection wires 100A, and is coupled with the first part of electronic components 401 and the second part of electronic components 402 through three connection parts and two metal traces . As shown in FIG.
  • a conductive sheet 31 is connected to four connecting parts 311 of the conductive sheet 31 (ie 311a, 311b, 311c and 311d), the conductive sheet 31 is used as a part of the first group of electrical connecting wires 100A to realize the charging of the VBUS line.
  • the power supply pin of the second connector 400 is connected to the pin 311a through the metal wire 13a of the circuit board 1, connected to the pin 311b through the metal wire 13b of the circuit board 1, and connected to the pin 311b through the metal wire 13b of the conductive sheet 31.
  • first group of electrical connection lines 100A wherein, 13a and 13c can be regarded as one metal wiring, 13b and 13c can be regarded as another metal wiring, 13b and 13d can be regarded as another metal wiring.
  • 13a and 13c can be regarded as one metal wiring
  • 13b and 13c can be regarded as another metal wiring
  • 13b and 13d can be regarded as another metal wiring.
  • one conductive sheet 31 is coupled to the first part of electronic components 401 and the second part of electronic components 402 through four connection parts and three metal traces.
  • the plurality of conductive sheets 31 are all arranged at the installation hole P, and the plurality of conductive sheets 31 each include at least two conductive sheets arranged on opposite sides of the installation hole P along the reference direction. Connecting parts 311, and each conductive sheet 31 is connected to the circuit board 1 through at least two connecting parts 311.
  • a plurality of conductive sheets 31 may be arranged in a direction perpendicular to the reference direction.
  • FIG. 14 it shows that a conductive sheet 31 (such as the first conductive sheet 31A) is connected to the first conductive sheet 31A through the metal traces 13 (that is, 13b and 13d) provided on the circuit board 1.
  • connection parts such as 311b and 311d
  • the first conductive sheet 31A is used as a part of the first group of electrical connection lines 100A to realize VBUS line charging
  • another conductive sheet 31 such as the second conductive sheet 31B
  • the metal traces 13 (ie 13a and 13c) on the circuit board 1 are connected to the two connecting parts (such as 311a and 311c) of the second conductive sheet 31B, and the second conductive sheet 31B is used as the second group of electrical connection lines 100B. Part of it realizes the situation that the direct charging current supplies power to other electronic components 40 after passing through the charging chip 200 .
  • the power supply pin of the second connector 400 is connected to the pin 311b through the metal trace 13b of the circuit board 1, and connected to the charging chip 200 through the pin 311d and the metal trace 13d of the circuit board 1, thereby forming An electrical connection wire for VBUS charging, that is, the first group of electrical connection wires 100A, wherein the combination of 13b and 13d can be regarded as a metal trace, and the first conductive sheet 31A is a part of the first group of electrical connection wires 100A , coupled with the first part of electronic components 401 and the second part of electronic components 402 through two connecting parts and a metal wire.
  • the power supply pin of the charging chip 200 is connected to the pin 311c through the metal wire 13c of the circuit board 1, and connected to other electronic components 40 through the pin 311a and the metal wire 13a of the circuit board 1, thereby forming a line to realize direct charging.
  • the charging current supplies power to other electronic components 40 through the charging chip 200, that is, the second group of electrical connecting wires 100B, wherein the combination of 13a and 13c can be regarded as a metal wiring, and the second conductive sheet 31B As a part of the second group of electrical connection wires 100B, it is coupled with the first part of electronic components 401 and the second part of electronic components 402 through two connection parts and a metal trace.
  • the above-mentioned first part of electronic components 401 may also include a power connector 300 connected to an internal power supply. At this time, the internal power supply may be connected to the power connector 300.
  • the above-mentioned first The set of electrical connecting wires 100A may also include metal traces 13e connected between the charging chip 200 and the power connector 300 to complete charging of the internal power supply, and the second set of electrical connecting wires 100B may include metal wires 13e connected between the power connector 300 and the lead wires 13e.
  • a set of electrical connecting wires 100 forms a path between at least one pin of each of the two electronic components 40 .
  • the first group of electrical connection wires 100A forms a path between two pins of the second connector 400 and one pin of the charging chip 200 .
  • the first group of electrical connection wires 100A forms a path between the two pins of the second connector 400 and the two pins of the charging chip 200 .
  • the second set of electrical connection wires 100B forms a path between one pin of the electronic component 40 and one pin of the power connector 300 .
  • FIG. 10 the first group of electrical connection wires 100A forms a path between two pins of the second connector 400 and one pin of the charging chip 200 .
  • the first group of electrical connection wires 100A forms a path between the two pins of the second connector 400 and the two pins of the charging chip 200 .
  • the second set of electrical connection wires 100B forms a path between one pin of the electronic component 40 and one pin of the power connector 300 .
  • the first group of electrical connection wires 100A forms a path between a pin of the second connector 400 and a pin of the charging chip 200
  • the second group of electrical connection wires 100B forms a path between one pin of the electronic component 40 .
  • the first group of electrical connecting wires 100A forms a path between a pin of the electrical connector 400 and a pin of the charging chip 200
  • the second group of electrical connecting wires 100B forms a lead of the electronic component 40 . pin and a pin of the charging chip 200.
  • the above-mentioned charging chip 200 is used for converting the charging voltage of the VBUS line into a voltage (such as 5V, etc.) suitable for charging by an internal power supply.
  • the above-mentioned first part of electronic components 401 may also include a power management chip disposed on the circuit board 1, the power management chip is coupled with the internal power supply and other electronic components 40, and is used to supply power to the internal power supply to other electronic components 40 Make voltage distribution.
  • each conductive sheet 31 can be connected to the circuit board 1 through surface mounting, or can be connected to the circuit board 1 through pin pinning, which is not specifically limited here. .
  • each connection portion 311 of each conductive sheet 31 is welded to the metal wiring 13 formed on the surface of the circuit board 1 , and each conductive sheet
  • each connecting portion 311 is soldered to a metal trace formed inside the circuit board 1 .
  • each connection portion 311 of each conductive sheet 31 is a pin structure, and each pin structure is inserted on the circuit board 1 and connected to the inside of the circuit board 1
  • the metal trace connection can be connected with the metal trace by soldering.
  • the connection part 311 with a pin structure can improve the connection stability between the conductive sheet 31 and the circuit board 1, thereby improving the connection stability between the support member 3 and the circuit board 1, and preventing the support member 3 from falling , to further improve the support stability of the support member 3 .
  • the material of the conductive sheet 31 is not specifically limited, as long as the conductive sheet 31 can play the role of support and current transmission.
  • the conductive sheet 31 is a steel sheet.
  • the rigidity of the support member 3 can be ensured, the deformation of the support member 3 can be prevented, and the stability of the support can be improved.
  • the steel sheet has a relatively high thickness and width, when the steel sheet is used for large current transmission, it can play a role in reducing impedance.
  • the circuit board assembly 50 further includes: a shielding structure 34 disposed between the conductive sheet 31 and the first portion 21 , and the shielding structure 34 and the conductive sheet 31 are insulated from each other.
  • the large current signal flowing through the conductive sheet 31 can be shielded to avoid interference to the current signal flowing through the camera substrate assembly 211 of the camera assembly 2 .
  • the shielding structure 34 can be arranged between the support 3 and the first part 21. At this time, since the support 3 and the first part 21 are insulated from each other, the shielding structure 34 It can be arranged on the first part 21 or the support member 3 and be insulated from the conductive sheet 31 .
  • the shielding structure 34 can be arranged on the side of the insulating layer 32 away from the conductive sheet 31, and is insulated from the conductive sheet 31 by the insulating layer 32.
  • the support 3 also includes In the case of the insulating shell 33 , the shielding structure 34 may be disposed on a side of the insulating shell 33 away from the conductive sheet 31 , and be insulated from the conductive sheet 31 by the insulating shell 33 .
  • the shielding structure 34 may also be disposed on the side of the insulating shell 33 close to the conductive sheet 31 and insulated from the conductive sheet 31 .
  • the circuit board 1 includes a first ground terminal
  • the camera substrate assembly 211 includes a second ground terminal.
  • the shielding structure 34 is coupled to the first ground terminal and/or the second ground terminal.
  • the shielding effect can be achieved by coupling the shielding structure 34 to the first ground terminal and/or the second ground terminal.
  • the shielding structure 34 may be copper foil or conductive cloth.
  • the shielding structure 34 can be disposed on the surface of the first part 21 close to the support 2, and connected to the first part 21 through conductive adhesive (ie, the above-mentioned hot melt adhesive), so that the shielding structure 34 and the camera substrate assembly 211 electrical connection between.
  • conductive adhesive ie, the above-mentioned hot melt adhesive
  • the second ground end of the camera substrate assembly 211 can be arranged on the reinforcing steel sheet of the first connector 23, and the second ground end of the camera substrate assembly 211 can be connected to the first connector 23 through the reinforcing steel sheet. It is coupled with the first ground terminal, so that the shielding structure 34 is coupled with the first ground terminal and the second ground terminal.

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Abstract

本申请涉及电子技术领域，尤其涉及一种电子设备。可以对摄像头组件进行支撑，并可以缩短充电路径或者大电流路径，从而可以降低阻抗，提高效率，防止功耗恶化。一种电子设备，包括：电路板和摄像头组件，电路板具有贯穿电路板的厚度方向的安装孔，安装孔包括沿电路板的厚度方向相对设置的第一端和第二端；摄像头组件包括设置于安装孔中的第一部分和从安装孔的第一端伸出的第二部分，第一部分包括摄像头基板组件；设置于电路板上，且位于安装孔处的支撑件，第一部分设置于支撑件上，支撑件包括至少一个导电片，至少一个导电片还耦接至电路板的金属走线，至少一个导电片与摄像头基板组件之间相互绝缘。

Description

电子设备
本申请要求于2021年07月16日提交国家知识产权局、申请号为202110809106.6、发明名称为“电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及一种电子设备。
背景技术
随着智能手机、平板电脑等消费型电子产品的普及，“薄”已经称为当下电子产品设计的主要考虑因素之一。电子产品的厚度主要取决于摄像头的厚度，尤其是后置摄像头，为了减小后置摄像头的凸起，主要是在主板(也即电路板)上挖洞，此时，主板挖洞的区域是没有办法走线的，随着摄像头设置在挖洞处，挖洞势必会隔断电路板上的充电路径或者电源电压(Voltage of Battery，VBAT)为其他设备供电等的大电流路径，从而会导致这些路径的阻抗加大，效率降低，功耗恶化等。
发明内容
本申请的主要目的在于，提供一种电子设备。可以对摄像头组件进行支撑，并可以缩短充电路径或者大电流路径，从而可以降低阻抗，提高效率，防止功耗恶化。
为达到上述目的，本发明采用如下技术方案：
第一方面，本申请提供一种电子设备，包括：电路板和摄像头组件，所述电路板具有贯穿所述电路板的厚度方向的安装孔，所述安装孔包括沿所述电路板的厚度方向相对设置的第一端和第二端；所述摄像头组件包括设置于所述安装孔中的第一部分和从所述安装孔的第一端伸出的第二部分，所述第一部分包括摄像头基板组件；设置于所述电路板上，且位于所述安装孔处的支撑件，所述第一部分设置于所述支撑件上，所述支撑件包括至少一个导电片，所述至少一个导电片还耦接至所述电路板的金属走线，所述至少一个导电片与所述摄像头基板组件之间相互绝缘。通过设置支撑件，支撑件既起到支撑摄像头组件的作用，又可以将导电片和电路板上的金属走线耦接，如将导电片和电路板上的大电流电源网络(如VBUS线所形成的大电流充电网络)相连，从而可以缩短上述充电路径，降低阻抗。同时，由于导电片与摄像头基板组件之间相互绝缘，因此，还可以防止导电片与摄像头基板组件中的大电流网络耦接。
第一方面的一种实现方式中，所述导电片的个数为一个；所述支撑件还包括：设置于所述导电片靠近所述第一部份的表面的绝缘层，所述绝缘层使所述导电片和所述摄像头基板组件绝缘。可以仅在导电片靠近第一部分的表面且与摄像头基板组件接触位置处设置绝缘层，即可使导电片和摄像头基板组件绝缘。
第一方面的一种实现方式中，所述导电片的个数为多个，多个导电片之间相互绝缘，每个导电片耦接至所述电路板的一条金属走线。可以实现多条大电流路径，并降低每条大电流路径的阻抗。
第一方面的一种实现方式中，所述多个导电片在平行于所述电路板的表面的一个 平面上间隔排列，且每相邻的两个导电片之间具有间隙；所述支撑件还包括：绝缘外壳，所述多个导电片设置于所述绝缘外壳中，所述多个导电片通过所述绝缘外壳与所述摄像头基板组件绝缘。通过使多个导电片在平行于所述电路板的表面的平面上间隔排列，且每相邻的两个导电片之间具有间隙，可以使多个导电片位于同一平面内，并使每相邻的两个导电片之间相互绝缘，同时，还可以通过绝缘外壳将多个导电片固定在一起，实现支撑件的整体化。同时，通过对绝缘外壳的结构进行合理设置，还可以保证多个导电片与整机堆叠的绝缘问题，并能够保证支撑件的表面平整性，提高支撑件对摄像头组件的支撑平整度。
第一方面的一种实现方式中，所述绝缘外壳和所述多个导电片为一体结构。绝缘外壳和多个导电片可以通过模内嵌件注塑工艺形成，绝缘外壳示例的可以为塑胶材料，将多个导电片设置于模内，在多个导电片的外侧注塑一层塑胶，即可得到上述一体结构。
第一方面的一种实现方式中，还包括：设置于所述电路板上的第一部分电子元器件和第二部分电子元器件，以及连接在所述第一部分电子元器件和所述第二部分电子元器件之间的至少一组电连接线，每组电连接线包括至少一条金属走线；所述第一部分电子元器件和所述第二部分电子元器件分别位于所述安装孔沿参考方向的相对两侧；每个导电片包括设置于安装孔沿所述参考方向相对两侧的至少两个连接部；在所述导电片的个数为一个的情况下，一个该导电片作为一组电连接线中的一部分，并通过所述至少一条金属走线与所述第一部分电子元器件和所述第二部分电子元器件耦接；在所述导电片的个数为多个的情况下，每个导电片作为一组电连接线中的一部分，并通过所述至少一条金属走线与所述第一部分电子元器件和所述第二部分电子元器件耦接。第一部分电子元器件可以包括充电芯片，第二部分电子元器件可以包括与充电FPC连接的第二连接器，此时，内部电源可以通过电源连接器与电路板连接，充电FPC可以通过第二连接器与电路板连接，并且充电FPC的另一端可以与USB接口连接，这样，一个导电片可以作为充电网络的一部分，连接在VBUS线所形成的大电流充电网络上。或者，第一部分电子元器件可以包括与内部电源连接的电源连接器，第二部分电子元器件可以包括需要由内部电源供电的其他电子元器件，此时，内部电源通过电源连接器与电路板连接，一个导电片可以作为电源网络的一部分，连接在由内部电源电压VBAT向其他电子元器件供电所形成的网络上。又或者，第一部分电子元器件可以包括充电芯片，以及与内部电源连接的电源连接器，第二部分电子元器件可以包括与充电FPC连接的第二连接器和需要由电池供电的其他电子元器件，此时，内部电源通过电源连接器与电路板连接，充电FPC可以通过第二连接器与电路板连接，并且充电FPC的另一端可以与USB接口连接，一个导电片可以作为充电网络的一部分，连接在VBUS线所形成的大电流充电网络上，另一个导电片作为电源网络的一部分，连接在由内部电源电压VBAT向其他电子元器件供电所形成的网络上。
第一方面的一种实现方式中，每个导电片的每个连接部为引脚结构，每个引脚结构插设于所述电路板上，并与所述电路板内部的金属走线连接。采用引脚结构的连接部，可以提高导电片与电路板的连接稳定性，从而提高支撑件与电路板的连接稳定性，避免支撑件发生掉落，进一步提高支撑件的支撑稳固性。
第一方面的一种实现方式中，所述电子设备还包括：设置于所述导电片和所述第一部分之间的屏蔽结构，所述屏蔽结构和所述导电片之间相互绝缘。可以对流经导电片的大电流信号进行屏蔽，避免对流经摄像头组件的摄像头基板组件中的电流信号造成干扰。
第一方面的一种实现方式中，所述电路板包括：第一接地端，摄像头基板组件包括：第二接地端；所述屏蔽结构与所述第一接地端和/或所述第二接地端耦接。
第一方面的一种实现方式中，所述屏蔽结构为铜箔或导电布。
本申请的实施例提供一种电子设备，通过设置支撑件，支撑件既起到支撑摄像头组件的作用，又可以将导电片和电路板上的金属走线耦接，如将导电片和电路板上的大电流电源网络(如VBUS线所形成的大电流充电网络)相连，从而可以缩短上述充电路径，降低阻抗。同时，由于导电片与摄像头基板组件之间相互绝缘，因此，还可以防止导电片与摄像头基板组件中的大电流网络耦接。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A为本申请的实施例提供的一种电子设备的结构图；
图1B为本申请的实施例提供的一种电子元器件的结构图；
图2A为本申请的实施例提供的一种电路板组件的立体图；
图2B为本申请的实施例提供的一种电路板的侧视图；
图2C为本申请的实施例提供的一种电路板组件的侧视图；
图3为本申请的实施例提供的另一种电路板组件的侧视图；
图4为相关技术提供的一种电路板组件的俯视图；
图5为相关技术提供的另一种电路板组件的俯视图；
图6为本申请的实施例提供的一种电路板组件的俯视图；
图7为本申请的实施例提供的另一种电路板组件的俯视图；
图8为本申请的实施例提供的另一种电路板组件的俯视图；
图9为本申请的实施例提供的另一种电路板组件的俯视图；
图10为本申请的实施例提供的一种第一部分电子元器件和第二部分电子元器件之间的电连接线的结构图；
图11为本申请的实施例提供的另一种第一部分电子元器件和第二部分电子元器件之间的电连接线的结构图；
图12为本申请的实施例提供的另一种第一部分电子元器件和第二部分电子元器件之间的电连接线的结构图；
图13为本申请的实施例提供的另一种第一部分电子元器件和第二部分电子元器件之间的电连接线的结构图；
图14为本申请的实施例提供的又一种第一部分电子元器件和第二部分电子元器件之间的电连接线的结构图；
图15为本申请的实施例提供的又一种电路板组件的侧视图。
具体实施方式
下面将结合附图，对本申请一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本申请保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本申请的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用如“约”、“大致”或“近似”等描述包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们 的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
在本申请的描述中，需要理解的是，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本申请的一些实施例提供一种电子设备，包括但不限于为手机、平板电脑、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)、行车记录仪、可穿戴设备、或虚拟现实设备等具有电路板的移动或固定终端。
在本申请的一些实施例中，以手机为上述电子设备为例进行说明，如图1A所示，电子设备01主要包括显示模组10、中框20以及壳体30。中框20设置于显示模组10和壳体30之间。
其中，在本申请的一些实施例中，显示模组10可以包括液晶显示(liquid crystaldisplay，LCD)屏，以及用于向该液晶显示屏提供光源的背光模组(back light unit，BLU)。或者，在本申请的另一些实施例中，显示模组10可以包括能够实现自发光的有机发光二极管(organic light emitting diode，OLED)显示屏。应当理解的是，显示模组10可以包括显示器和触控器件，显示器用于向用户输出显示内容，触控器件用于接收用户在显示器上输入的触摸信号。
此外，为了使得电子设备01能够实现更多的功能，电子设备01还包括多个电子元器件40。
如图1B所示，在本申请的一些实施例中，电子元器件40包括封装结构410，以及封装于该封装结构410内的至少一个芯片411。
本申请实施例提供一种设置于电子设备01内的，如图1A所示的电路板组件50。
在本申请的一些实施例中，如图1A所示，电路板组件50可以设置于中框20朝向壳体30的一侧表面上。该电路板组件50包括如图2A所示的电路板1。电路板1包括相对设置的上表面A1和下表面A2。电子元器件40可以集成于电路板1的上表面A1，或者下表面A2。又或者，如图2C所示，一层电路板1的上表面A1和下表面A2均集成有电子元器件40。
在本申请的一些实施例中，电路板1可以为印刷电路板(printed circuitboard，PCB)。如图2B所示，由该电路板1的截面结构可知，该电路板1包括至少一层绝缘载板11。相邻两层绝缘载板11之间通过粘接层12固定连接。
在本申请的一些实施例中，绝缘载板11的上表面或下表面设置有金属走线13。或，在本申请的另一些实施例中，绝缘载板11的上表面和下表面均设置有金属走线13。该电路板1中的金属走线13用于将集成于该电路板1上的多个电子元器件40电连接。
在本申请的一些实施例中，电路板1为主板，起到承载电子元器件40和实现各个电子元器件40之间电连接的作用。
如图3所示，在本申请的一些实施例中，电子元器件40可以包括摄像头组件2，摄像头组件2示例的可以为后置摄像头。
本申请中，为了对摄像头组件2进行安装，减少摄像头组件2的凸起，如图3和图4所示，电路板1具有贯穿电路板1的厚度方向的安装孔P，该安装孔P包括沿电路板1的厚度方向相对设置的第一端P1和第二端P2。摄像头组件2包括设置于安装孔P中的第一部分21和从安装孔P的第一端P1伸出的第二部分22，其中，第一部分21包括摄像头基板组件211。第二部分22可以包括感光芯片221和镜头组件222，镜头组件222可以包括镜头和滤光片。
其中，感光芯片221设置于摄像头基板组件211上，并与摄像头基板组件211耦接，滤光片和镜头沿远离摄像头基板组件211的方向依次设置。摄像头组件2的工作原理为：在电路板1给摄像头组件2上电后，镜头获取光学图像，并将光学图像投射到感光芯片221上，图像信息被感光芯片221转换成数据信号，数据信号通过摄像头基板组件211的数据端口发送给电路板1，由电路板1将数据信号传送给显示模组，由显示模组对图像信息进行显示。
其中，感光芯片221、滤光片和镜头可以均设置在安装孔P内或者设置在安装孔P外，或者，一部分设置在安装孔P内，另一部分设置在安装孔P外，在此均不做具体限定，如图3所示，示出了摄像头基板组件211设置在安装孔P内，感光芯片221、滤光片和镜头均设置在安装孔P外的情形，由此，在摄像头组件2的高度固定的情况下，通过将摄像头基板组件211设置于安装孔P中，可以大大降低摄像头组件2凸出于电路板1表面的高度，从而降低电子设备的厚度。
需要说明的是，为了实现摄像头基板组件211与电路板1之间进行信号传输，摄像头基板组件211的一部分设置在安装孔P内，另一部分可以延伸至安装孔P的一侧与第一连接器23(见图4所示)连接，第一连接器23与电路板1连接，从而实现摄像头组件2与电路板1电连接。
其中，示例的，以摄像头基板组件211是刚性-柔性结合的电路板为例。安装孔P的第二端P2靠近中框设置，摄像头基板组件211从安装孔P的第一端P1伸出，并延伸至第一连接器23的位置与第一连接器23连接，第一连接器23可以是BTB(Board to Board，板对板)连接器，这时，摄像头组件2通过BTB(Board to Board，板对板)的方式与电路板1连接，BTB连接器用于连接两块PCB，使之实现机械和电气上的连接，其特点是公母连接器配对使用，如采用公型连接器贴电路板1(或者摄像头基板组件211)，母型连接器贴片在摄像头基板组件211(或者电路板1上)，实现连接。
基于上述，在相关技术中，由于安装孔P的存在，摄像头组件2的支撑，主要是中框支撑或支架支撑，其中，支架支撑中支架可以通过粘结或焊接固定在电路板1上。
以充电为例，由于安装孔P的存在，如图4和图5所示，电路板1上的用于形成充电路径的金属走线13不得不从安装孔P的上方绕一圈，造成充电路径变长，从而使得充电阻抗加大，效率降低，功耗恶化等。
在本申请的一些实施例中，如图3和图6所示，电路板组件还包括：设置于电路板1上，且位于安装孔P处的支撑件3，第一部分21设置于支撑件3上，支撑件3包括至少一个导电片31，至少一个导电片31还耦接至电路板1的金属走线13，至少一 个导电片31与摄像头基板组件211之间相互绝缘。
其中，导电片31为至少一个，是指，导电片31的个数可以为一个或多个，在导电片31的个数为一个的情况下，该导电片31可以与电路板1的一条或多条金属走线13耦接。在导电片31的个数为多个的情况下，每个导电片31可以分别与电路板1的一条或多条金属走线13耦接，也可以多个导电片31均与电路板1上的同一条金属走线13耦接，这时，多个导电片31可以串联或并联。
其中，在金属走线13为一条的情况下，该金属走线13可以连接在两个电子元器件40的同一信号端口(对于一个电子元器件40而言，同一信号端口可以包括一个或多个引脚)之间，在金属走线13为多条的情况下，多条金属走线13可以并联连接在两个电子元器件40的同一信号端口之间，以完成两个电子元器件40之间的同一信号的传输。在金属走线13为多条的情况下，多条金属走线13可以分别连接在两个电子元器件40的多对信号端口之间，以完成两个电子元器件40之间的不同信号的传输。
示例的，以两个电子元器件40分别为充电芯片200和充电FPC(Flexible Printed Circuit board，柔性印刷电路板)(如图4所示，仅示出了与充电FPC连接的第二连接器400的情形)为例，连接在充电芯片200和充电FPC之间的金属走线13可以是一条或者多条，其中，如图4所示，以连接在充电芯片200和充电FPC之间的金属走线13为一条为例，在未设置支撑件3之前，该金属走线13分别与充电芯片200和充电FPC各自的一个引脚连接，通过该金属走线13实现由VBUS线(VBUS线是HOST/HUB向USB设备供电的电源线)所形成的大电流充电信号的传输。如图5所示，以连接在充电芯片200和充电FPC之间的金属走线13为两条为例，在未设置支撑件3之前，这两条金属走线13中每条金属走线13分别与充电芯片200和充电FPC各自的一个引脚连接，用于连接这两条金属走线13的充电芯片200和充电FPC的所有引脚均属于同一信号端口(比如第二连接器400有两个引脚用于传输电流，充电芯片200上对应有两个引脚接收电流)，通过这两条金属走线13共同实现同一信号(如由VBUS线所形成的大电流充电信号)的传输，可以理解地，这两条金属走线13也可以不属于同一信号端口。
在设置支撑件3之后，结合图4和图6所示，连接在充电芯片200和充电FPC之间的电连接线可以包括设置于电路板1上的金属走线13和用于连接电路板1上的金属走线13的部分，这时，以未设置支撑件3之前，连接在充电芯片200和充电FPC之间的金属走线13为一条为例，在设置支撑件3之后，可以看作是该金属走线13的中部被打断，这时，导电片31的个数可以为一个，该导电片31作为用于连接电路板1上的金属走线13的部分，与设置于电路板1上的金属走线13耦接。结合图5和图7所示，以未设置支撑件3之前，连接在充电芯片200和充电FPC之间的金属走线13为多条为例，在设置支撑件3之后，有几种可能的情形，第一种情形，可以看作是多条金属走线13的中部均被打断，这时，如图7所示，导电片的个数为一个，一个该导电片31作为一个整体，与每条金属走线13保留设置于电路板1上的部分耦接，或者，如图8所示，导电片31的个数为多个，每个导电片31作为一条被打断的金属走线13中的一部分，与该条金属走线13设置在电路板1上的部分耦接。第二种情形，多条金属走线13中其中一部分仍采用绕线方式进行设置，其余部分被打断，这时，导电片 31的个数可以为一个，该导电片31作为一个整体，与被打断的金属走线13中设置于电路板1上的部分耦接，或者，导电片31的个数为多个，每个导电片31作为被打断的一条金属走线13的一部分，与该条金属走线13设置于电路板1上的部分耦接。
当然，在连接在充电芯片200和充电FPC之间的一条金属走线13被打断，且导电片31的个数为多个的情况下，多个导电片31也可以串联或并联连接为一个整体，并作为该金属走线13的一部分与该金属走线13设置于电路板1上的部分耦接。
在这些实施例中，支撑件3既起到支撑摄像头组件2的作用，又可以将导电片31和电路板1上的金属走线13耦接，如将导电片31和电路板1上的大电流电源网络(如VBUS线所形成的大电流充电网络)相连，从而可以缩短上述充电路径，降低阻抗。同时，由于导电片31与摄像头基板组件211之间相互绝缘，因此，还可以防止导电片31与摄像头基板组件211中的大电流网络耦接。
其中，需要说明的是，除上述所列举的大电流电源网络之外，本申请的实施例也可以用于其他大电流网络。
如图3所示，在第一部分21设置在支撑件3上时，上述第一部分21可以通过一层粘接层35与支撑件3固定，防止摄像头组件2发生移位。该粘接层35可以是热熔胶。
在一些实施例中，如图3所示，导电片31的个数为一个，支撑件3还包括：设置于导电片31靠近第一部分21的表面的绝缘层32，绝缘层32使导电片31和摄像头基板组件211绝缘。
在这些实施例中，可以仅在导电片31靠近第一部分21的表面且与摄像头基板组件211接触位置处设置绝缘层32，即可使导电片31和摄像头基板组件211绝缘。这时，第一部分21可以通过粘接层35与绝缘层32粘贴固定。
在另一些实施例中，如图8所示，导电片31的个数为多个，多个导电片31之间相互绝缘，每个导电片31耦接至电路板1的一条金属走线13。
在一些实施例中，多个导电片31可以相互层叠设置，且每相邻的两个导电片31之间设置有绝缘层32，可以实现多条大电流路径，并降低每条大电流路径的阻抗。
在一些实施例中，如图8所示，多个导电片31在平行于电路板1的表面的一个平面上(如图8中箭头a所示方向)间隔排列，且每相邻的两个导电片31之间具有间隙。如图9所示，支撑件3还包括：绝缘外壳33，多个导电片31设置于绝缘外壳33中，多个导电片31通过绝缘外壳33与摄像头基板组件211绝缘。
在这些实施例中，通过使多个导电片31在平行于电路板1的表面的平面上间隔排列，且每相邻的两个导电片31之间具有间隙，可以使多个导电片31位于同一平面内，并使每相邻的两个导电片31之间相互绝缘，同时，还可以通过绝缘外壳33将多个导电片31固定在一起，实现支撑件3的整体化。同时，通过对绝缘外壳33的结构进行合理设置，还可以保证多个导电片31与整机堆叠的绝缘问题，并能够保证支撑件3的表面平整性，提高支撑件3对摄像头组件2的支撑平整度。这时，第一部分21可以通过粘接层35与绝缘外壳33黏贴固定。
在一些实施例中，如图9所示，绝缘外壳33和多个导电片31为一体结构。在这些实施例中，绝缘外壳33和多个导电片31可以通过模内嵌件注塑工艺形成，绝缘外 壳33示例的可以为塑胶材料，将多个导电片31设置于模内，在多个导电片31的外侧注塑一层塑胶，即可得到上述一体结构。
在一些实施例中，如图10～图13所示，电路板组件50还包括：设置于电路板1上的第一部分电子元器件401和第二部分电子元器件402，以及连接在第一部分电子元器件401和第二部分电子元器件402之间的至少一组电连接线100，每组电连接线100包括至少一条金属走线13。第一部分电子元器件401和第二部分电子元器件402分别位于安装孔P沿参考方向(如图10中箭头b所示方向)的相对两侧，每个导电片31包括设置于安装孔P沿参考方向相对两侧的至少两个连接部311，在导电片31的个数为一个的情况下，一个该导电片31作为一组电连接线100中的一部分，并通过至少两个连接部311以及至少一条金属走线13与第一部分电子元器件401和第二部分电子元器件402耦接，在导电片31的个数为多个的情况下，每个导电片31作为一组电连接线100中的一部分，并通过至少两个连接部311以及至少一条金属走线13与第一部分电子元器件401和第二部分电子元器件402耦接。
在这些实施例中，示例的，如图10和图11所示，第一部分电子元器件401可以包括充电芯片200，第二部分电子元器件402可以包括与充电FPC连接的第二连接器400，此时，内部电源可以通过电源连接器300与电路板1连接，充电FPC可以通过第二连接器400与电路板1连接，并且充电FPC的另一端可以与USB接口连接，这样，一个导电片31可以作为充电网络的一部分，连接在VBUS线所形成的大电流充电网络上。或者，如图12所示，第一部分电子元器件401可以包括与内部电源连接的电源连接器300，第二部分电子元器件402可以包括需要由内部电源供电的其他电子元器件40，比如CPU，射频模块等耗电器件，此时，内部电源通过电源连接器300与电路板1连接，一个导电片31可以作为电源网络的一部分，连接在由内部电源电压VBAT向其他电子元器件40供电所形成的网络上。又或者，如图13所示，第一部分电子元器件401可以包括充电芯片200，以及与内部电源连接的电源连接器300，第二部分电子元器件402可以包括与充电FPC连接的第二连接器400和需要由电池供电的其他电子元器件40，此时，内部电源通过电源连接器300与电路板1连接，充电FPC可以通过第二连接器400与电路板1连接，并且充电FPC的另一端可以与USB接口连接，一个导电片31可以作为充电网络的一部分，连接在VBUS线所形成的大电流充电网络上，另一个导电片31作为电源网络的一部分，连接在由内部电源电压VBAT向其他电子元器件40供电所形成的网络上。
在这些实施例中，与相关技术中通过在安装孔P上方设置绕线相比，一方面可以缩短充电和/或供电路径，另一方面，采用导电片31代替设置在电路板1上的金属走线13，可以利用安装孔P位置增大导电片31的厚度和宽度，最大程度上减小电路阻抗，提高效率，防止功耗恶化。其中，示例的，上述对应的电源网络阻抗可以减小60％以上。
其中，需要说明的是，在导电片31的个数为一个的情况下，一个该导电片31可以设置在安装孔P处，并通过设置在安装孔P沿参考方向相对两侧的至少两个连接部311与电路板1连接。这里，如图10所示，示出了一个导电片31通过设置在电路板1上的金属走线13(也即13a、13b和13c)连接至导电片31的3个连接部311(也即 311a、311b和311c)，将导电片31作为第一组电连接线100A的一部分，实现VBUS线充电的情形。具体的，第二连接器400的电源引脚，经电路板1的金属走线13a连接到引脚311a，经电路板1的金属走线13b连接到引脚311b，经导电片31的引脚311c经电路板的金属走线13c，连接至充电芯片200，从而形成第一组电连接线100A，其中，13a和13c的组合可以看作是一条金属走线，13b和13c的组合可以看作是另一条金属走线，一个导电片31作为第一组电连接线100A的一部分，通过3个连接部与两条金属走线与第一部分电子元器件401和第二部分电子元器件402耦接。如图11所示，示出了一个导电片31通过设置在电路板1上的金属走线13(也即13a、13b、13c和13d)连接至导电片31的4个连接部311(也即311a、311b、311c和311d)，将导电片31作为第一组电连接线100A的一部分，实现VBUS线充电的情形。具体的，第二连接器400的电源引脚，经电路板1的金属走线13a连接到引脚311a，经电路板1的金属走线13b连接到引脚311b，经导电片31的引脚311c经电路板1的金属走线13c，以及经导电片31的引脚311d经电路板1的金属走线13d，连接至充电芯片200，从而形成第一组电连接线100A，其中，13a和13c可以看作是一条金属走线，13b和13c可以看作是另一条金属走线，13b和13d可以看作是又一条金属走线。一个导电片31作为第一组电连接线100A的一部分，通过4个连接部与三条金属走线与第一部分电子元器件401和第二部分电子元器件402耦接。在导电片31的个数为多个的情况下，多个导电片31均设置在安装孔P处，且多个导电片31均包括设置于安装孔P沿参考方向相对两侧的至少两个连接部311，且每个导电片31通过各自的至少两个连接部311与电路板1连接，此时，如图14所示，多个导电片31可以沿与参考方向垂直的方向排列。这里，如图14所示，示出了一个导电片31(如第一导电片31A)通过设置在电路板1上的金属走线13(也即13b和13d)连接至第一导电片31A的2个连接部(如311b和311d)，将第一导电片31A作为第一组电连接线100A的一部分，实现VBUS线充电，以及另一个导电片31(如第二导电片31B)通过设置在电路板1上的金属走线13(也即13a和13c)连接至第二导电片31B的2个连接部(如311a和311c)，将第二导电片31B作为第二组电连接线100B的一部分，实现直接充电的电流经充电芯片200后向其他电子元器件40供电的情形。具体的，第二连接器400的电源引脚，经电路板1的金属走线13b连接到引脚311b，经引脚311d以及电路板1的金属走线13d，连接到充电芯片200，从而形成一条实现VBUS充电的电连接线，也即第一组电连接线100A，其中，13b和13d的组合可以看作是一条金属走线，第一导电片31A作为第一组电连接线100A的一部分，通过2个连接部以及一条金属走线与第一部分电子元器件401和第二部分电子元器件402耦接。充电芯片200的供电引脚，经电路板1的金属走线13c连接到引脚311c，经引脚311a以及电路板1的金属走线13a，连接到其他电子元器件40，从而形成一条实现直接充电的电流经充电芯片200向其他电子元器件40供电的电连接线，也即第二组电连接线100B，其中，13a和13c的组合可以看作是一条金属走线，第二导电片31B作为第二组电连接线100B的一部分，通过2个连接部以及一条金属走线与第一部分电子元器件401和第二部分电子元器件402耦接。这是直接利用充电电流对用电器(也就是电子元器件40)进行供电的情形，在此期间，充电电流不流过内部电源。当然，在一些实施例中，如图13所示，上述第一部 分电子元器件401还可以包括与内部电源连接的电源连接器300，这时，内部电源可以与电源连接器300连接，上述第一组电连接线100A还可以包括连接在充电芯片200和电源连接器300之间的金属走线13e，以完成对内部电源充电，第二组电连接线100B可以包括连接在电源连接器300和引脚311c之间的金属走线13f，以实现通过内部电源(或直接充电的电流)向其他电子元器件40供电，其中，在通过直接充电的电流向其他电子元器件40供电的情况下，内部电源被拔出。
在上述实施例中，一组电连接线100形成两个电子元器件40的至少各一个引脚之间的通路。如图10所示，第一组电连接线100A形成第二连接器400的两个引脚和充电芯片200的一个引脚之间的通路。如图11所示，第一组电连接线100A形成第二连接器400的两个引脚和充电芯片200的两个引脚之间的通路。如图12所示，第二组电连接线100B形成电子元器件40的一个引脚和电源连接器300的一个引脚之间的通路。如图13所示，第一组电连接线100A形成第二连接器400的一个引脚和充电芯片200的一个引脚之间的通路，第二组电连接线100B形成电子元器件40的一个引脚和连接器300的一个引脚之间的通路。如图14所示，第一组电连接线100A形成电连接器400的一个引脚和充电芯片200的一个引脚之间的通路，第二组电连接线100B形成电子元器件40的一个引脚和充电芯片200的一个引脚之间的通路。
其中，上述充电芯片200用于对VBUS线的充电电压进行转换，转换成适于内部电源充电的电压(如5V等)。另外，上述第一部分电子元器件401还可以包括设置于电路板1上的电源管理芯片，电源管理芯片与内部电源和其他电子元器件40耦接，用于对内部电源向其他电子元器件40供电进行电压分配。
还需要说明的是，每个导电片31的至少两个连接部311可以通过表面贴装与电路板1连接，也可以通过引脚钉扎的方式与电路板1连接，在此不做具体限定。
在每个导电片31的至少两个连接部311通过表面贴装与电路板1连接的情况下，每个连接部311和形成在电路板1表面的金属走线13焊接，在每个导电片31的至少两个连接部311通过引脚钉扎的方式与电路板1连接的情况下，每个连接部311和形成在电路板1内部的金属走线焊接。
在一些实施例中，如图10～图14所示，每个导电片31的每个连接部311为引脚结构，每个引脚结构插设于电路板1上，并与电路板1内部的金属走线连接，可以通过焊接的方式和金属走线连接。在这些实施例中，采用引脚结构的连接部311，可以提高导电片31与电路板1的连接稳定性，从而提高支撑件3与电路板1的连接稳定性，避免支撑件3发生掉落，进一步提高支撑件3的支撑稳固性。
其中，对导电片31的材料不做具体限定，只要该导电片31可以起到支撑和电流传输的作用即可。
在一些实施例中，导电片31为钢片。可以保证支撑件3的刚性，防止支撑件3发生变形，可以提高支撑稳固性。同时，在钢片具有较高的厚度和宽度的情况下，钢片用于大电流传输时，可以起到降低阻抗的作用。
在一些实施例中，如图15所示，电路板组件50还包括：设置于导电片31和第一部分21之间的屏蔽结构34，屏蔽结构34与导电片31之间相互绝缘。可以对流经导电片31的大电流信号进行屏蔽，避免对流经摄像头组件2的摄像头基板组件211中的 电流信号造成干扰。
其中，需要说明的是，为了起到屏蔽作用，屏蔽结构34可以设置在支撑件3和第一部分21之间，这时，由于支撑件3与第一部分21之间相互绝缘，因此，屏蔽结构34可以设置在第一部分21或支撑件3上，并与导电片31相互绝缘。示例的，在支撑件3还包括绝缘层32的情况下，屏蔽结构34可以设置在绝缘层32远离导电片31的一侧，并通过绝缘层32与导电片31绝缘，在支撑件3还包括绝缘外壳33的情况下，屏蔽结构34可以设置在绝缘外壳33远离导电片31的一侧，并通过绝缘外壳33与导电片31绝缘。
当然，在绝缘外壳33与导电片31为非一体结构的情况下，屏蔽结构34也可以设置在绝缘外壳33靠近导电片31的一侧，并与导电片31之间相互绝缘。
在一些实施例中，电路板1包括第一接地端，摄像头基板组件211包括第二接地端。屏蔽结构34与第一接地端和/或第二接地端耦接。
在这些实施例中，通过将屏蔽结构34与第一接地端和/或第二接地端耦接，即可起到屏蔽作用。
在一些实施例中，屏蔽结构34可以为铜箔或导电布。
在这些实施例中，屏蔽结构34可以设置在第一部分21靠近支撑件2的表面，并通过导电胶(也即上述热熔胶)与第一部分21连接，以使得屏蔽结构34与摄像头基板组件211之间电连接。
其中，摄像头基板组件211的第二接地端可以设置在上述第一连接器23的补强钢片上，通过该补强钢片即可使摄像头基板组件211的第二接地端与第一连接器23和第一接地端耦接，从而实现屏蔽结构34与第一接地端和第二接地端耦接。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (12)

  1. 一种电子设备，其特征在于，包括：
    电路板，所述电路板具有贯穿所述电路板的厚度方向的安装孔，所述安装孔包括沿所述电路板的厚度方向相对设置的第一端和第二端；
    摄像头组件，所述摄像头组件包括设置于所述安装孔中的第一部分和从所述安装孔的第一端伸出的第二部分，所述第一部分包括摄像头基板组件；
    支撑件，所述支撑件设置于所述电路板上，且位于所述安装孔处，所述第一部分设置于所述支撑件上，所述支撑件包括至少一个导电片，所述至少一个导电片还耦接至所述电路板的金属走线，所述至少一个导电片与所述摄像头基板组件之间相互绝缘。
  2. 根据权利要求1所述的电子设备，其特征在于，
    所述导电片的个数为一个；
    所述支撑件还包括：设置于所述导电片靠近所述第一部分的表面的绝缘层，所述绝缘层使所述导电片和所述摄像头基板组件绝缘。
  3. 根据权利要求1所述的电子设备，其特征在于，
    所述导电片的个数为多个，多个导电片之间相互绝缘，每个导电片耦接至所述电路板的一条金属走线。
  4. 根据权利要求3所述的电子设备，其特征在于，
    所述多个导电片在平行于所述电路板的表面的一个平面上间隔排列，且每相邻的两个导电片之间具有间隙；
    所述支撑件还包括：绝缘外壳，所述多个导电片设置于所述绝缘外壳中，所述多个导电片通过所述绝缘外壳与所述摄像头基板组件绝缘。
  5. 根据权利要求4所述的电子设备，其特征在于，
    所述绝缘外壳和所述多个导电片为一体结构。
  6. 根据权利要求1～5任一项所述的电子设备，其特征在于，还包括：设置于所述电路板上的第一部分电子元器件和第二部分电子元器件，以及连接在所述第一部分电子元器件和所述第二部分电子元器件之间的至少一组电连接线，每组电连接线包括至少一条金属走线；
    所述第一部分电子元器件和所述第二部分电子元器件分别位于所述安装孔沿参考方向的相对两侧；
    一个所述导电片作为所述一组电连接线中的一部分，并通过所述至少一条金属走线与所述第一部分电子元器件和所述第二部分电子元器件耦接。
  7. 根据权利要求1-6任一项所述的电子设备，其特征在于，每个导电片包括设置于安装孔沿所述参考方向相对两侧的至少两个连接部；
    每个导电片的每个连接部为引脚结构，每个引脚结构插设于所述电路板上，并与所述电路板内部的金属走线连接。
  8. 根据权利要求1～5任一项所述的电子设备，其特征在于，所述电子设备还包括：设置于所述导电片和所述第一部分之间的屏蔽结构，所述屏蔽结构和所述导电片之间相互绝缘。
  9. 根据权利要求8所述的电子设备，其特征在于，
    所述电路板包括：第一接地端，所述摄像头基板组件包括：第二接地端；
    所述屏蔽结构与所述第一接地端和/或所述第二接地端耦接。
  10. 根据权利要求9所述的电子设备，其特征在于，
    所述屏蔽结构为铜箔或导电布。
  11. 根据权利要求6所述的电子设备，其特征在于，所述第一部分电子元器件包括充电芯片，所述第二部分电子元器件包括与USB端口连接的连接器。
  12. 根据权利要求6所述的电子设备，其特征在于，所述第一部分电子元器件包括充电芯片，所述第二部分电子元器件包括耗电器件。
PCT/CN2022/090391 2021-07-16 2022-04-29 电子设备 WO2023284373A1 (zh)

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