WO2023277442A1 - Connecteur pour connexion électrique - Google Patents

Connecteur pour connexion électrique Download PDF

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Publication number
WO2023277442A1
WO2023277442A1 PCT/KR2022/008875 KR2022008875W WO2023277442A1 WO 2023277442 A1 WO2023277442 A1 WO 2023277442A1 KR 2022008875 W KR2022008875 W KR 2022008875W WO 2023277442 A1 WO2023277442 A1 WO 2023277442A1
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WO
WIPO (PCT)
Prior art keywords
conductive
insulating
frame
ground
frame layer
Prior art date
Application number
PCT/KR2022/008875
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English (en)
Korean (ko)
Inventor
정영배
이병주
김언중
김규현
지주현
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Publication of WO2023277442A1 publication Critical patent/WO2023277442A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Definitions

  • the present invention electrically connects a test apparatus and a device under test.
  • a connector disposed between testing devices to electrically connect the device to be tested and the testing device is used in the related field.
  • pogo pin sheets, conductive rubber sheets and the like are known.
  • the conductive rubber sheet has a plurality of conductive parts each formed by a plurality of metal particles aggregated in the vertical direction, and a frame made of silicon rubber holding the plurality of conductive parts.
  • RF radio frequency
  • the conductive rubber sheet has better RF characteristics than the pogo pin sheet due to its small thickness, the conductive rubber sheet is used for RF inspection of semiconductor devices.
  • Japanese Unexamined Patent Publication No. 2004-335450 proposes a conductive connector capable of responding to a high frequency signal.
  • Conventional conductive rubber sheets have limitations in that they do not sufficiently suppress high-frequency RF noise and have large signal loss. Accordingly, the conventional conductive rubber sheet cannot be effectively used for high-frequency RF inspection of 40 GHz or higher. In addition, the conventional conductive rubber sheet does not have an impedance that matches the impedance of the device under test and the impedance of the test apparatus. If the conductive rubber sheet used for testing exhibits an impedance that does not match the impedance of the device under test and the testing apparatus, a large signal loss occurs due to signal reflection in the conductive rubber sheet. Since the conventional conductive rubber sheet exhibits unmatched impedance, it inevitably has poor RF characteristics.
  • the metal frame serving as a shielding layer against high-frequency RF noise is made of a thick metal layer, it is difficult to process through-holes accommodating the signal conductive part in a precise standard.
  • One embodiment of the present disclosure provides a connector for electrical connection suitable for high-frequency RF inspection without signal interference or noise.
  • One embodiment of the present disclosure provides a connector for electrical connection that has an impedance that matches the impedance of a device under test and that of a test apparatus and does not cause signal loss due to impedance mismatching.
  • a connector for electrical connection includes at least one signal conduction including a transmission part made of a plurality of first conductive particles and an insulating part integrally formed with the transmission part so as to surround the transmission part in a horizontal direction a portion, at least one ground conductive portion disposed to be spaced apart from the signal conductive portion in the horizontal direction, and maintaining the signal conductive portion and the ground conductive portion in the vertical direction and spaced apart from the ground conductive portion in the horizontal direction;
  • An electrically connected frame portion is included, and the frame portion includes a metal frame layer and an insulating frame layer that are alternately stacked in a vertical direction.
  • the metal frame layer and the insulating frame layer each have a first through hole accommodating the signal conductive portion and a second through hole accommodating the ground conductive portion, and the uppermost frame layer of the frame portion is larger than the second through hole. It has a third through hole having a diameter.
  • the ground conductive part includes second conductive particles and an elastic material holding the second conductive particles.
  • a connector for electrical connection according to an embodiment of the present invention further includes a ground terminal protecting part positioned in the third through hole and surrounding the ground conductive part.
  • the ground terminal protection unit has a circular ring shape or is composed of two or more insulating pieces spaced apart at predetermined intervals when viewed in plan view.
  • the second conductive particles and the elastic material may fill the space between the insulating pieces.
  • the metal frame layer may include a metal plate and a highly conductive metal film coated or plated on a surface of the metal plate.
  • the highly conductive metal is at least one of Au, Ag and Cu.
  • the third through hole of the uppermost frame layer has a reverse taper shape in which an inner diameter decreases from top to bottom, and an outer diameter of the ground terminal protecting portion decreases from top to bottom corresponding to the third through hole.
  • Each of the metal frame layer and the insulating frame layer has a first through hole accommodating the signal conductive part, and a portion of the metal frame layer and the insulating frame layer has a second through hole accommodating the ground conductive part.
  • a first groove and a second groove spaced apart in a vertical direction are formed, and the ground conductive part includes an upper ground conductive part positioned in the first groove and a lower ground conductive part positioned in the second groove.
  • the other part of the metal frame layer and the insulating frame layer does not have a second through hole accommodating the ground conductive part and contacts one end of the upper ground conductive part and the lower ground conductive part.
  • the signal conductive part is made of a transmission part and an insulating part surrounding the transmission part and formed integrally with the transmission part, and the signal conductive part is insulated from the electrically connected ground conductive part and the frame part. Therefore, signal interference or noise is remarkably reduced in the ground conductive portion and the frame portion, so that the signal conductive portion is not affected by signal interference or noise.
  • the transmission unit and the insulation unit are provided to the signal conducting unit at a ratio within a specific range so as to realize an impedance that matches the impedance of the device under test and the impedance of the test apparatus. Therefore, the connector of one embodiment does not have signal loss due to impedance mismatching, and can be effectively used for high-frequency RF inspection.
  • the frame is manufactured by dividing and stacking, the precision of the through hole where the signal conductive part and the ground conductive part are located is increased and the overall thickness of the connector can be freely selected, so that the connector can be designed and modified into various structures.
  • the elasticity of the connector can be improved by stacking the insulating frame layer between the metal frame layers.
  • FIG. 1 is a cross-sectional view schematically illustrating an example to which a connector according to an embodiment is applied.
  • Fig. 2 is a cross-sectional view showing a part of the connector of the first embodiment of the present invention.
  • Fig. 3 is a plan view showing part of the connector of the first embodiment of the present invention.
  • Fig. 4 is a cross-sectional perspective view showing a part of the connector of the first embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a connector of a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing a connector of a third embodiment of the present invention.
  • Fig. 7 is a cross-sectional view showing a connector of a fourth embodiment of the present invention.
  • FIG. 8 is a sectional view showing a connector of a fifth embodiment of the present invention.
  • FIG. 9 is a cross-sectional view schematically showing an example of manufacturing a connector of a third embodiment of the present invention.
  • Embodiments of the present disclosure are illustrated for the purpose of explaining the technical idea of the present disclosure.
  • the scope of rights according to the present disclosure is not limited to the specific description of the embodiments or these embodiments presented below.
  • Expressions such as 'first' and 'second' used in the present disclosure are used to distinguish a plurality of elements from each other, and do not limit the order or importance of the elements.
  • the direction indicator of 'upward' used in the present disclosure is based on the direction in which the connector is positioned relative to the test device, and the direction indicator of 'downward' means the opposite direction of the upward direction. It should be understood that the direction designator of 'up and down direction' used in the present disclosure includes an upward direction and a downward direction, but does not mean a specific one of the upward and downward directions.
  • Embodiments described below and examples shown in the accompanying drawings relate to connectors for electrical connection of two electronic devices.
  • one of the two electronic devices may be a testing device, and the other of the two electronic devices may be a device to be tested by the testing device.
  • the connectors of the embodiments may be used for electrical connection between the testing apparatus and the device under test during electrical testing of the device under test.
  • the connectors of the embodiments may be used for a final electrical inspection of the semiconductor device in a post-process during the manufacturing process of the semiconductor device.
  • examples of tests to which the connectors of the embodiments are applied are not limited to the aforementioned tests.
  • FIG. 1 shows an example to which a connector according to the first embodiment is applied, and in FIG. 1, a connector, a test apparatus, and a device under test are schematically illustrated for understanding of the embodiment.
  • the connector 100 is a sheet-like structure and is disposed between the test apparatus 10 and the device under test 20 .
  • the connector 100 may be positioned on the testing device 10 by the test socket 30 .
  • the test socket 30 may be removably mounted on the test device 10 .
  • the test socket 30 receives therein the device under test 20 carried to the testing apparatus 10 manually or by a carrying device and aligns the device under test 20 with respect to the connector 100 .
  • the connector 100 contacts the test apparatus 10 and the device under test 20 in the vertical direction (VD), and the test apparatus 10 and the device under test 20 are in contact with each other. are electrically connected to each other.
  • VD vertical direction
  • the device under test 20 may be a semiconductor device in which a semiconductor IC chip and a plurality of terminals are packaged in a hexahedral shape using a resin material.
  • the device under test 20 may be a semiconductor device used in a mobile communication device, but is not limited thereto.
  • the device under test 20 has a plurality of hemispherical terminals on its lower side.
  • the plurality of terminals of the device under test 20 may include a signal terminal 21 and a ground terminal 22 .
  • the inspection apparatus 10 may inspect various operating characteristics of the device under test 20 .
  • the testing apparatus 10 may have a board on which testing is performed, and a testing circuit 11 for testing a device to be tested may be provided on the board.
  • the test circuit 11 has a plurality of terminals electrically connected to the terminals 21 and 22 of the device under test through the connector 100 .
  • the terminal of the test device 10 may include a signal terminal 12 for transmitting a test signal and receiving a response signal, and a ground terminal 13 positioned around the signal terminal 12 .
  • the signal terminal 21 of the device under test 20 is electrically connected to the signal terminal 12 of the test apparatus 10 through the connector 100, and the ground terminal 22 of the device under test 20 is connected to the connector It is electrically connected to the ground terminal 13 of the inspection device 10 through 100.
  • the connector 100 electrically connects each terminal 21, 22 of the device under test and each terminal 12, 13 of the test device corresponding thereto in the vertical direction (VD).
  • the test of the device under test 20 is performed by the test apparatus 10 via the connector 100 .
  • the connector 100 may be disposed between the device under test 20 and the test apparatus 10 for a high-frequency RF test of the device under test 20 .
  • the connector 100 includes at least one signal conductive part 110 , at least one ground conductive part 120 , and a frame part 130 .
  • the signal conductive part 110 extends in the vertical direction VD and is configured to be conductive in the vertical direction VD.
  • the signal conductive part 110 contacts the signal terminal 21 of the device under test at its upper end and contacts the signal terminal 12 of the testing device at its lower end. Accordingly, a conductive path in the vertical direction is formed between the signal terminal 12 and the signal terminal 21 corresponding to one signal conductive part 110 via the signal conductive part 110 .
  • a test signal of the test apparatus may be transmitted from the signal terminal 12 to the signal terminal 21 of the device under test 20 through the signal conductor 110, and the response signal of the device under test 20 may be transmitted to the signal terminal. It can be transmitted from (21) to the signal terminal 12 of the test device 10 through the signal conductor 110.
  • the upper end of the signal conductive part 110 protrudes upward from the upper surface of the frame part 130 , and the lower end of the signal conductive part 110 protrudes downward from the lower surface of the frame part 130 .
  • the ground conductor 120 is disposed to be spaced apart from the signal conductor 110 in a horizontal direction HD orthogonal to the vertical direction VD.
  • the ground conductive part 120 is disposed in a through hole penetrating the frame part 130 in the vertical direction.
  • the upper end of the ground conductive part 120 protrudes upward from the upper surface of the frame part 130 , and the lower end of the ground conductive part 120 protrudes downward from the lower surface of the frame part 130 .
  • the upper end of the ground conductive part 120 protrudes upward from the upper surface of the frame part 130 , and the lower end of the ground conductive part 120 protrudes downward from the lower surface of the frame part 130 .
  • the frame part 130 maintains the signal conductive part 110 and the ground conductive part 120 in the vertical direction (VD) and separates them in the horizontal direction (HD).
  • the signal conductive part 110 is insulated from the frame part 130 and is not electrically connected to the ground conductive part 120 and the frame part 130 .
  • the upper end of the ground conductive part 120 protrudes upward from the upper surface of the frame part 130
  • the lower end of the ground conductive part 120 protrudes downward from the lower surface of the frame part 130 .
  • the ground conductive part 120 and the frame part 130 are electrically connected.
  • FIGS. 2 to 4 examples shown in FIGS. 2 to 4 are also referred to. 2 to 4 schematically show the shape, arrangement, and arrangement of components of the connector, and these are only examples selected for understanding the embodiment.
  • Fig. 2 is a cross-sectional view showing a part of the connector of the first embodiment
  • Fig. 3 is a plan view showing a part of the connector of the first embodiment
  • Fig. 4 is a cross-sectional perspective view showing a part of the connector of the first embodiment.
  • the signal conducting portion 110 performs signal transmission in the vertical direction VD between the testing apparatus and the device under test.
  • the signal conductive part 110 may have a cylindrical shape extending in the vertical direction VD.
  • the signal conductive unit 110 includes a transmission unit 111 that transmits signals and an insulation unit 112 that insulates the transmission unit 111 from the metal frame unit 130 in the horizontal direction (HD). .
  • the signal conductive portion 110 has the same diameter in the vertical direction VD within the frame portion 130 .
  • the signal conductive part 110 may have a larger diameter toward the center of the frame part 130 .
  • the transmission unit 111 is composed of a plurality of first conductive particles 113 arranged in a vertical direction VD and conductively contacted in the vertical direction VD.
  • the first conductive particles 113 contacted to be conductive in the vertical direction VD perform signal transmission in the vertical direction VD within the signal conductive part 110 .
  • the first conductive particle 113 may be a particle made of a highly conductive metal material.
  • the highly conductive metal material may be metal, but is not limited thereto.
  • the first conductive particles 113 may have a form in which the above highly conductive metal material is coated on a core particle made of a resin material or a metal material having elasticity.
  • the first conductive particles 113 include metal particles exhibiting magnetic properties such as iron (Fe), nickel (Ni), and cobalt (Co), or particles of an alloy thereof, or particles containing these metals, or these particles.
  • the transmission unit 111 may be formed of one or more conductive wires or a plurality of carbon nanotubes that are collected in the vertical direction (VD) and disposed to be conductively contacted in the vertical direction (VD).
  • the insulating part 112 is made of an elastic insulating material and has a cylindrical shape extending in the vertical direction (VD).
  • the insulating part 112 may have the same height as the height of the metal frame part 130 .
  • the insulating part 112 may have the same height as the transmission part 111 and protrude from the upper or lower surface of the frame part 130 . Accordingly, the insulating part 112 may have a height equal to or smaller than that of the transmission part 111 .
  • the elastic insulating material constituting the insulating part 112 includes an insulating material having a low dielectric constant.
  • the elastic insulating material constituting the insulating unit 112 may be an insulating material such as silicon rubber or Teflon, but is not limited thereto.
  • the insulating part 112 is integrally formed with the transmission part 111 to constitute the signal conducting part 110 .
  • the insulation unit 112 is formed to surround the transmission unit 111 in the horizontal direction (HD).
  • an elastic insulating material forming the insulation unit 112 may be filled between the first conductive particles 113 .
  • the insulating part 112 maintains the first conductive particles 113 in the shape of the transmission part 111, and the insulating part 112 is integrally with the elastic insulating material filled between the first conductive particles 113. It can be. Accordingly, the insulating portion 112 imparts elasticity to the signal conductive portion 110 in the vertical direction (VD) and the horizontal direction (HD). A portion of the signal conductive portion 110 in contact with the frame portion 130 is difficult to elastically deform due to the frame portion 130 .
  • the transmission unit 111 of the signal conducting unit 110 includes an upper end portion 114 protruding upward from the top surface of the frame portion 130 and a lower end portion 115 protruding downward from the lower surface of the frame portion 130.
  • the upper part 114 and the lower part 115 are part of the transmission part 111 of the signal conducting part 110.
  • the upper end of the upper end 114 includes the upper end of the transmission unit 111
  • the lower end of the lower end 115 includes the lower end of the transmission unit 111 .
  • Due to the elastic insulating material between the first conductive particles 113 included in the upper part 114 and the lower part 115, the upper part 114 and the lower part 115 of the signal conductive part are formed in the vertical direction (VD) and the horizontal direction (HD). ) can be elastically deformed.
  • VD vertical direction
  • HD horizontal direction
  • the upper end 114 and the lower end 115 may be elastically restored.
  • the transmission part 111 and the insulating part 112 of the signal conductive part 110 may protrude downward from the lower surface of the metal frame part 130 .
  • the insulating part 112 surrounding the transmission part 111 has a predetermined thickness, efficiently insulates the transmission part 111 from the frame part 130 and enables signal transmission without signal loss.
  • the maximum distance between both ends of the transmission unit 111 in the horizontal direction (HD) may be defined as the maximum width (W) of the transmission unit 111 .
  • the maximum distance between the both ends may mean a distance between first conductive particles that are most distant in a horizontal direction HD orthogonal to the central axis C of the transmission unit 111 .
  • the insulating part 112 has a thickness T in a radial direction with respect to the central axis C of the transmission part 111, that is, in the horizontal direction HD.
  • the ratio (W/T) of the maximum width (W) of the transmission part 111 to the thickness (T) of the insulating part 112 is 0.5 to 3.
  • the signal conductive part 110 has a coaxial structure, and the central axis of the insulating part 112 may coincide with the central axis C of the transmission part 111 .
  • the ground conductive part 120 is located around the signal conductive part 110 and is spaced apart from the signal conductive part 110 in the horizontal direction HD by the frame part 130 .
  • the transmission portion 111 is not short-circuited from the ground conductive portion 120 and the frame portion 130.
  • a plurality of ground conductive parts 120 may be arranged to be spaced apart from one signal conductive part 110 in a horizontal direction HD. As shown in FIG. 3, the plurality of ground conductive parts 120 are separated from one signal conductive part 110 by the frame part 130 in the horizontal direction HD, and one signal conductive part (110).
  • the planar arrangement of the signal conductor 110 and the ground conductor 120 shown in FIG. 3 is merely exemplary and is not limited to the planar arrangement shown in FIG. 3 .
  • the planar arrangement of the signal conductor 110 and the ground conductor 120 may vary according to the planar arrangement of the terminals of the device under test.
  • at least one or a plurality of ground conductive parts 120 may be horizontally spaced apart from the signal conductive part 110, and the interval between the plurality of ground conductive parts 120 may not be constant.
  • a plurality of groups each composed of a plurality of ground conductive parts 120 may be disposed apart from one signal conductive part 110 or from the plurality of signal conductive parts 110 in the horizontal direction.
  • a plurality of signal conductive parts 110 may form one group, and a plurality of ground conductive parts 120 may be horizontally spaced apart from the group and disposed around the group.
  • the ground conductor 120 is configured to be electrically conductive.
  • the ground conductive part 120 is electrically connected to the frame part 130 . Accordingly, the ground conductive part 120 and the metal frame part 130 are short-circuited from each other and can act as one short-circuit. Accordingly, the ground conductive part 120 is electrically connected to the frame part 130 .
  • a plurality of second conductive particles 123 that are collected and contacted to be conductive in the vertical direction (VD) of the ground conductive part 120 and an elastic material 124 maintaining the second conductive particles 123 in the vertical direction (VD) includes
  • the elastic material 124 is hardened between the second conductive particles 123 to maintain the second conductive particles 123 .
  • the elastic material 124 may have insulating properties or may have conductivity.
  • the elastic material 124 may include an elastic insulating material forming the insulating part 112 of the signal conductive part 110, but is not limited thereto.
  • the ground conductive part 120 has an upper end 125 protruding upward from the upper surface of the frame part 130 and a lower end 126 protruding downward from the lower surface of the frame part 130 .
  • the protruding height of the upper end 125 may be the same as that of the upper end 114 of the signal conducting part, and the protruding height of the lower end 126 may be the same as that of the lower end 115 of the signal conducting part.
  • the ground conductive part 120 Due to the upper end 125 and the lower end 126 of the ground conductive part 120, the ground conductive part 120 can be elastically deformed and elastically restored during inspection of the device under test.
  • the frame unit 130 may be formed of a flat plate and may be made of a metal material such as stainless steel or aluminum.
  • the frame portion 130 separates the signal conductive portion 110 and the ground conductive portion 120 apart.
  • the frame part 130 is electrically connected to the ground conductive part 120 and is short-circuited from the ground conductive part 120 .
  • the frame unit 130 may be connected to a test socket guide mounted on a board of the test device and grounded to the outside.
  • the ground range is extended from the connector 100 to the test socket guide, thereby further improving RF characteristics.
  • the frame unit 130 includes a metal frame layer 131 and an insulating frame layer 138 that are alternately stacked.
  • the metal frame layer 131 and the insulating frame layer 138 may be formed of 3 to 10 sheets.
  • the metal frame layer 131 and the insulating frame layer 138 may be coupled to each other by an adhesive.
  • the uppermost layer and the lowermost frame layer of the frame unit 130 may be the metal frame layer 131 , but are not limited thereto and may be formed of the insulating frame layer 138 .
  • the metal frame layer 131 may be, for example, a metal plate made of a metal material such as stainless steel or aluminum.
  • each metal frame layer 131 may include a highly conductive metal film coated on the surface of the metal plate by, for example, depositing or plating Au, Ag, or Cu.
  • a metal frame layer coated with or plated with highly conductive metal particles has better electromagnetic wave shielding properties than a metal frame layer made of only a stainless steel or aluminum metal plate.
  • Each metal frame layer 131 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive portion 111 .
  • Each of the first through holes 132 of the metal frame layer 131 have the same diameter and the same center and are aligned with each other to accommodate the signal conductive portion 110 .
  • each of the insulating frame layers 138 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive part 111 .
  • Each of the first through holes 132 of the insulating frame layer 138 has the same diameter and the same center and is aligned with each other to accommodate the signal conductive portion 110 .
  • the first through hole 132 of the metal frame layer 131 and the insulating frame layer 138 may have a larger diameter toward the center of the frame portion 130 .
  • the insulating frame layer 138 improves the operability of the connector by increasing the elasticity of the connector and distributes the pressure applied to the test apparatus 10 and the device under test 20 to prevent damage to the terminals of the device under test 20. prevent.
  • the insulating frame layer 138 may be a silicon material or a polyimide film.
  • each of the insulating frame layers may be made of different materials.
  • the insulating frame layer 138 is formed by depositing, for example, Au, Ag, or Cu on the surface of a polymer film.
  • a highly conductive metal layer 139 applied by plating may be included.
  • the insulating frame layer coated with highly conductive metal particles has better electromagnetic wave shielding properties than the insulating frame layer made of only the polymer film itself.
  • the metal film 139 may be formed on the wall surface of the insulating frame layer 138 by anodizing, sputtering, or evaporation.
  • an insulating oxide film of Al2O3, which is a non-conductor, may be formed by anodizing.
  • the insulating frame layer 138 may include a metal film 139 on upper and lower surfaces.
  • the insulating frame layer 138 is formed on the wall surface of the second through hole 135. It may not include a metal film.
  • the insulating frame layer 138 may be made of the same material as the insulating material 124 of the insulating part 112 .
  • the signal conductive portion 110 is not short-circuited from the ground conductive portion 120 and the metal frame portion 130 .
  • the metal frame layer 131 and the insulating frame layer 138 are drilled in the vertical direction (VD) accommodating the ground conductive part 120 and have second through holes 135 aligned with the same diameter and center. ) have each.
  • FIG. 5 is a cross-sectional view showing a portion of the connector of the second embodiment.
  • the ground conductive part 120 is formed in grooves respectively formed on the upper and lower surfaces of the frame part 130 . Accordingly, one end of the ground conductor 120 is positioned inside the frame unit 130 .
  • the upper end of the ground conductive part 120 protrudes upward from the upper surface of the frame part 130 , and the lower end of the ground conductive part 120 protrudes downward from the lower surface of the frame part 130 .
  • the signal conductive part 110 is insulated from the frame part 130 and is not electrically connected to the ground conductive part 120 and the frame part 130 .
  • the upper end of the ground conductive part 120 protrudes upward from the upper surface of the frame part 130
  • the lower end of the ground conductive part 120 protrudes downward from the lower surface of the frame part 130 .
  • the ground conductive part 120 and the frame part 130 are electrically connected.
  • the signal conducting portion 110 performs signal transmission in the vertical direction VD between the testing apparatus and the device under test.
  • the signal conductive part 110 may have a cylindrical shape extending in the vertical direction VD.
  • the signal conductive unit 110 includes a transmission unit 111 that transmits signals and an insulation unit 112 that insulates the transmission unit 111 from the frame unit 130 in the horizontal direction (HD).
  • the signal conductive part 110 has the same diameter in the vertical direction VD.
  • the signal conductive part 110 may have a larger diameter toward the center of the frame part.
  • the transmission unit 111 is composed of a plurality of first conductive particles 113 arranged in a vertical direction VD and conductively contacted in the vertical direction VD.
  • the first conductive particles 113 contacted to be conductive in the vertical direction VD perform signal transmission in the vertical direction VD within the signal conductive part 110 .
  • the insulating part 112 may have the same height as the metal frame part 130 . Also, although not shown, unlike FIG. 5 , the insulating part 112 may have the same height as the transmission part 111 and protrude from the upper or lower surface of the frame part 130 . Accordingly, the insulating part 112 may have a height smaller than or equal to the height of the transmission part 111 .
  • the insulating part 112 is integrally formed with the transmission part 111 to constitute the signal conducting part 110 .
  • the insulation unit 112 is formed to surround the transmission unit 111 in the horizontal direction (HD).
  • the elastic insulating material forming the insulation unit 112 may be filled between the first conductive particles 113 .
  • the insulating part 112 maintains the first conductive particles 113 in the shape of the transmission part 111, and the insulating part 112 is integral with the insulating material filled between the first conductive particles 113.
  • the insulating portion 112 imparts elasticity to the signal conductive portion 110 in the vertical direction (VD) and the horizontal direction (HD). A portion of the signal conductive portion 110 in contact with the frame portion 130 is difficult to elastically deform due to the frame portion 130 .
  • the transmission unit 111 of the signal conducting unit 110 includes an upper end portion 114 protruding upward from the top surface of the frame portion 130 and a lower end portion 115 protruding downward from the lower surface of the frame portion 130.
  • the ground conductive part 120 is located around the signal conductive part 110 and is spaced apart from the signal conductive part 110 in the horizontal direction HD by the frame part 130 .
  • the transmission portion 111 is not short-circuited from the ground conductive portion 120 and the frame portion 130.
  • a plurality of ground conductive parts 120 may be arranged to be spaced apart from one signal conductive part 110 in a horizontal direction HD.
  • the ground conductor 120 is configured to be electrically conductive.
  • the ground conductive part 120 is electrically connected to the frame part 130 . Accordingly, the ground conductive part 120 and the frame part 130 are short-circuited from each other and can act as one short-circuit.
  • each ground conductor 120 includes an upper ground conductor 121 and a lower ground conductor 122 .
  • the upper ground conductive part 121 and the lower ground conductive part 122 are aligned in the vertical direction VD and are spaced apart from each other in the vertical direction VD by the frame part 130 .
  • the upper ground conductive part 121 and the lower ground conductive part 122 are electrically connected to the frame part 130 .
  • the upper ground conductive part 121 and the lower ground conductive part 122 are collected to be conductive in the vertical direction (VD), and the plurality of second conductive particles 123 and the second conductive particles 123 in contact are vertically directed (VD).
  • the second conductive particles 123 constituting the upper ground conductive portion 121 and the lower ground conductive portion 122 may be the same as or different from the first conductive particles 113 described above.
  • the combination of the second conductive particles 123 contacted in the vertical direction (VD) is in contact with the frame portion 130 at the top or bottom thereof to form the upper ground conductive portion 121 and the lower ground conductive portion 122. It is electrically connected to the frame part 130. Therefore, the upper ground conductive part 121 and the lower ground conductive part 122 are short-circuited by the frame part 130 .
  • the elastic material 124 is hardened between the second conductive particles 123 to maintain the second conductive particles 123 .
  • the elastic material 124 may have insulating properties or may have conductivity.
  • the elastic material 124 may include an elastic insulating material forming the insulating part 112 of the signal conductive part 110, but is not limited thereto.
  • the upper ground conductive portion 121 has an upper end portion 125 protruding upward from the upper surface of the frame portion 130, and the lower ground conductive portion 122 has a lower portion 126 protruding downward from the lower surface of the frame portion 130.
  • the protruding height of the upper end 125 may be the same as that of the upper end 114 of the signal conducting part, and the protruding height of the lower end 126 may be the same as that of the lower end 115 of the signal conducting part.
  • the ground conductive part 120 Due to the upper end 125 of the upper ground conductive part 121 and the lower end 126 of the lower ground conductive part 122, the ground conductive part 120 can be elastically deformed and elastically restored during inspection of the device under test. there is.
  • the frame unit 130 includes a metal frame layer 131 and an insulating frame layer 138 that are alternately stacked.
  • the uppermost layer and the lowermost frame layer of the frame unit 130 may be the metal frame layer 131 , but are not limited thereto and may be formed of the insulating frame layer 138 .
  • the metal frame layer 131 may be, for example, a metal plate made of a metal material such as stainless steel or aluminum.
  • each metal frame layer 131 may include a highly conductive metal film coated or plated with, for example, Au, Ag, or Cu on the surface of the metal plate.
  • a metal frame layer coated with highly conductive metal particles has better electromagnetic wave shielding properties than a metal frame layer made of only a stainless steel or aluminum metal plate.
  • the frame portion 130 separates the signal conductive portion 110 and the ground conductive portion 120 apart.
  • the frame part 130 is electrically connected to the ground conductive part 120 and is short-circuited from the ground conductive part 120 .
  • Each metal frame layer 131 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive part 111 .
  • Each of the first through holes 132 of the metal frame layer 131 have the same diameter and the same center and are aligned with each other to accommodate the signal conductive portion 110 .
  • each of the insulating frame layers 138 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive portion 111 .
  • Each of the first through holes 132 of the insulating frame layer 138 has the same diameter and the same center and is aligned with each other to accommodate the signal conductive portion 110 .
  • the first through hole 132 of the metal frame layer 131 and the insulating frame layer 138 may have a larger diameter toward the center of the frame portion 130 .
  • the insulating frame layer 138 improves the operability of the connector by increasing the elasticity of the connector and distributes the pressure applied to the test apparatus 10 and the device under test 20 to prevent damage to the terminals of the device under test 20. prevent.
  • the insulating frame layer 138 may be a silicon material or a polyimide film.
  • each of the insulating frame layers may be made of different materials.
  • the insulating frame layer 138 may be made of the same material as the insulating material 124 of the insulating part 112 .
  • the insulating frame layer 138 may include a highly conductive metal film coated or plated with, for example, Au, Ag, or Cu on the surface of a polymer film.
  • the insulating frame layer coated with highly conductive metal particles has better electromagnetic wave shielding properties than the insulating frame layer made of only the polymer film itself.
  • the frame part 130 includes a first groove 133 concave downward from the upper surface; It has a second groove 134 concave upward from the lower surface.
  • the upper ground conductive part 121 is formed in the first groove 133 and the lower ground conductive part 122 is formed in the second groove 134 .
  • the other part of the metal frame layer 131 and the insulating frame layer 138 does not have the second through hole 135 accommodating the ground conductive part 120, and the upper ground conductive part 121 and the lower ground conductive part 120 are not provided. It is in contact with one end of the portion 122.
  • the first groove 133 and the second groove 134 are spaced apart in the vertical direction VD.
  • the upper ground conductive part 121 formed in the first groove 133 is electrically connected to the frame part 130 through the first groove 133
  • the lower ground conductive part 122 formed in the second groove 134 is electrically connected to the frame part 130 through the second groove 134. Accordingly, the upper ground conductive part 121 and the lower ground conductive part 122 may be short-circuited through the frame part 130 .
  • the signal conductive portion 110 is not short-circuited from the upper ground conductive portion 121, the lower ground conductive portion 122, and the frame portion 130.
  • Fig. 6 is a cross-sectional view showing a part of the connector of the third embodiment.
  • the upper end of the signal conductive part 110 is located on the same plane as the upper surface of the frame part 130, and the lower end of the signal conductive part 110 is on the same plane as the lower surface of the frame part 130. or may protrude from the lower surface of the metal frame unit 130.
  • the transmission unit 111 is illustrated as protruding together from the lower surface of the frame unit 130, but is not limited thereto, and the transmission unit 111 is not limited thereto.
  • the portion 111 may protrude from the lower surface of the frame portion 130 together with the insulating portion 112 .
  • the ground conductive part 120 may have a cylindrical shape extending in the vertical direction VD through the frame part 130 in the same manner as the signal conductive part 110 .
  • the upper end of the ground conductive part 120 is positioned on the same plane as the upper surface of the frame part 130, and the lower end of the ground conductive part 120 is positioned on the same plane as the lower surface of the frame part 130 or may protrude. .
  • the ground conductive part 120 further includes a ground terminal protection part 137 formed on the uppermost frame layer.
  • the frame unit 130 includes a metal frame layer 131 and an insulating frame layer 138 that are alternately stacked.
  • the metal frame layer 131 and the insulating frame layer 138 may be formed of 3 to 10 sheets.
  • Each metal frame layer 131 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive part 111 .
  • Each of the first through holes 132 of the metal frame layer 131 have the same diameter and the same center and are aligned with each other to accommodate the signal conductive portion 110 .
  • each of the insulating frame layers 138 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive part 111 .
  • Each of the first through holes 132 of the insulating frame layer 131 has the same diameter and the same center and is aligned with each other to accommodate the signal conductive portion 110 .
  • the frame part 130 has a second through hole 135 for accommodating the ground conductive part.
  • the ground conductive part is integrally formed without being divided into upper and lower parts. Accordingly, each of the metal frame layer 131 and the insulating frame layer 138 is drilled in the downward direction (VD) to accommodate the ground conductive part 120, and the second through holes 135 aligned with the same diameter and center have
  • the uppermost frame layer of the frame unit 130 has a third through hole 136 larger than the second through hole 135 formed in the remaining metal frame layer 131 or the insulating frame layer 138 .
  • the third through hole 136 has the same center as the second through hole 135 and has a larger diameter than the second through hole 135 to accommodate the ground conductive part 120 and the ground terminal protection part 137. .
  • the uppermost metal frame layer of the metal frame part 130 has a larger penetration than the second through hole 135 formed in the remaining metal frame layers instead of the third through hole 136 shown in FIG. can have a home
  • the through hole has the same center as the second through hole 135 and has a larger diameter than the second through hole 135 to accommodate the ground conductive part 120 and the ground terminal protecting part 137 .
  • the through hole is formed by etching or drilling the uppermost frame layer to a depth smaller than the thickness of the uppermost frame layer.
  • the insulating frame layer is a metal film 138 plated or deposited on the wall surface of the first through hole 132.
  • the metal film 139 may be formed on the wall surface of the insulating frame layer 138 by anodizing, sputtering, or evaporation.
  • the insulating frame layer 138 may include plating or deposition metal films 139 on upper and lower surfaces.
  • the insulating frame layer 138 is formed on the wall surface of the second through hole 135. It may not include a metal film.
  • the metal frame layer 131 may include a highly conductive metal film in the same manner as the insulating frame layer 138 .
  • the ground terminal protection part 137 is positioned to correspond to the third through hole 136 or the through groove and surrounds the ground conductive part 120 .
  • the ground terminal protection unit 137 may have a circular ring shape.
  • the shape of the ground terminal protection unit is not limited thereto, and a portion of the circular ring may be cut to form two or more insulating pieces in any one of a C-shape, a 'L' shape, and a 'C' shape.
  • the space between the insulating pieces may be filled with the second conductive particles 123 and the elastic material 124 .
  • the ground terminal protection unit 137 may be made of the same elastic insulating material as the insulating unit 112, but is not limited thereto and may be another elastic material.
  • ground terminal protection unit 137 may contact the upper surface of the insulating frame layer 138 under the uppermost metal frame layer.
  • the ground terminal protecting unit 137 serves as a guide member of the test socket to prevent damage to the ground terminal 22 when it comes into contact with the ground terminal 22 of the device under test 20 .
  • the transmission part 111 of the signal conducting part 110 protrudes downward from the lower surface of the frame part 130 .
  • the transmission part 111 of the signal conducting part 110 may protrude downward from the lower surface of the metal frame part 130 .
  • Fig. 7 is a cross-sectional view showing a part of the connector of the fourth embodiment.
  • the frame unit 130 includes a metal frame layer 131 and an insulating frame layer 138 that are alternately stacked.
  • the metal frame layer 131 and the insulating frame layer 138 may be formed of 3 to 10 sheets.
  • the uppermost layer and the lowermost layer of the frame unit 130 may be the metal frame layer 131 .
  • Each metal frame layer 131 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive part 111 .
  • Each of the first through holes 132 of the metal frame layer 131 have the same diameter and the same center and are aligned with each other to accommodate the signal conductive portion 110 .
  • each of the insulating frame layers 138 has a first through hole 132 at the same position in the vertical direction VD to accommodate the first conductive part 111 .
  • Each of the first through holes 132 of the insulating frame layer 138 has the same diameter and the same center and is aligned with each other to accommodate the signal conductive portion 110 .
  • the frame part 130 has a second through hole 135 for accommodating the ground conductive part.
  • the ground conductive part 120 is integrally formed without being divided into upper and lower parts. Accordingly, each of the metal frame layer 131 and the insulating frame layer 138 is drilled in the vertical direction (VD) to accommodate the ground conductive portion 120, and the second through holes 135 aligned with the same diameter and center have
  • the uppermost frame layer of the frame unit 130 has a third through hole 136 having a reverse taper shape with an inner diameter decreasing from top to bottom. This allows the ground terminal of the device under test 20 to easily contact the ground conductor 120 .
  • the ground conductive part 120 further includes a ground terminal protection part 137 formed on the uppermost frame layer.
  • the third through hole 136 has a larger diameter than the second through hole 135 at the upper end and has the same diameter as the second through hole 135 at the lower end.
  • the uppermost frame layer of the frame unit 130 may have a larger through hole than the second through hole 135 formed in the remaining frame layers instead of the third through hole 136 shown in FIG. 6 .
  • the through hole has the same center as the second through hole 135 at the upper end and has a larger diameter than the second through hole 135 to accommodate the ground conductive part 120 and the ground terminal protecting part 137 .
  • the through hole has a reverse taper shape in which the inner diameter decreases toward the lower end. In this case, the through hole is formed by etching or drilling the uppermost frame layer to a depth smaller than the thickness of the uppermost frame layer. Referring to FIG. It has a decreasing reverse taper shape and is disposed in the third through hole 136 or through groove (not shown) while surrounding the ground conductive portion 120 .
  • the ground terminal protection unit 137 may have a circular ring shape.
  • the shape of the ground terminal protection unit is not limited thereto, and a portion of the circular ring may be cut to form two or more insulating pieces in any one of a C-shape, a 'L' shape, and a 'C' shape.
  • the space between the insulating pieces may be filled with the second conductive particles 123 .
  • the ground terminal protection unit 137 may be made of the same elastic insulating material as the insulating unit 112, but is not limited thereto and may be other elastic materials.
  • ground terminal protection unit 137 contacts the upper surface of the insulating frame layer 138 under the uppermost metal frame layer.
  • the ground terminal protecting unit 137 serves as a guide member of the test socket to prevent damage to the ground terminal 22 when it comes into contact with the ground terminal 22 of the device under test 20 .
  • the insulating portion 112 has a plurality of pores 116 , and the pores 116 may be distributed throughout the insulating portion 112 .
  • the elastic insulating material constituting the insulating part 112 is partially deficient, pores 116 are formed in the insulating part 112 . Since the insulating portion 112 having pores 116 has a lower permittivity than the insulating portion having no pores, signal loss to the signal conductive portion 110 can be further reduced.
  • the first liquid material for forming the signal conductive part 110 includes an elastic insulating material constituting the insulating part 112 and in a liquid state, and first conductive particles dispersed in the elastic insulating material in a liquid state. and a foaming agent included in the liquid elastic insulating material.
  • the foaming agent reacts with the liquid elastic insulating material to generate gas.
  • the generated gas repels the liquid elastic insulating material.
  • a plurality of pores 116 may be formed throughout the insulating portion 112 by partially depleting the liquid elastic insulating material in the insulating portion 112 by the generated gas.
  • the pores of the insulating part 112 may be formed by mixing liquid silicon with hollow particles and hardening the mixture.
  • the insulating part of the signal conductive part has pores, a space is created for the conductive part to expand in the horizontal direction when the top is pressed, thereby improving the stroke of the connector and lowering the dielectric constant of the insulating part, which is advantageous for impedance matching.
  • a connector according to embodiments of the present invention is configured to exhibit an impedance that matches the impedance of the test circuit of the test apparatus and the impedance of the device under test. Since the ground conductive part 120 and the frame part 130 can function as one short circuit, the distance between the frame part 130 and the transmission part 111 of the signal conductive part 110 will affect the impedance of the connector. can In order to represent an impedance that matches the impedance of the test apparatus and the impedance of the device under test, the size of the transmission unit 111 and the size of the insulation unit 112 may be determined within a range of a specific ratio.
  • the transmission unit 111 and the insulation unit 112 constituting the coaxial structure are formed with dimensions determined by a specific ratio to eliminate signal loss due to impedance mismatching and to connect an impedance matching the impedance of the device under test and the test device to the connector ( 100) can be assigned.
  • the signal conductive part 110 may have an inner diameter D1 and an outer diameter D2.
  • the inner diameter D1 of the signal conductive part 110 may correspond to the maximum width W of the transmission part 111 in the horizontal direction HD
  • the outer diameter D2 of the signal conductive part 110 is may correspond to the width between both ends of the insulation part 112 (or the diameter of the through hole of the frame part 130) in the horizontal direction HD.
  • the impedance of the signal conducting part may be determined by the diameter of the transmission part (ie, the inner diameter D1) and the diameter of the insulating part (ie, the outer diameter D2).
  • the ratio of the inner diameter D1 to the outer diameter D2 is determined such that the impedance of the connector in one embodiment matches the impedance of the testing circuit of the testing device and the impedance of the device under test tested by the testing device.
  • the impedance value of the signal conductive part may be determined by the ratio of the inner diameter D1 to the outer diameter D2.
  • a device under test may have an impedance of about 50 ohms
  • a test circuit of a test apparatus may have an impedance of about 50 ohms to test the device under test.
  • the impedance of about 50 ohms of the device under test and the impedance of about 50 ohms of the test circuit may be impedances determined in consideration of signal transmission without distortion.
  • the connector of one embodiment can exhibit an impedance of about 50 ohms.
  • the connector of one embodiment when the connector of one embodiment is disposed between the device under test and the test apparatus, the impedance of the device under test, the impedance of the test apparatus, and the impedance of the connector are matched with each other.
  • the connector of one embodiment enables highly reliable, high-frequency RF inspection of a device under test without signal loss such as signal reflection.
  • the outer diameter D2 of the signal conductive part 110 may be 1.5 to 5 times the inner diameter D1 so as to be applied to various devices to be tested and testing apparatuses for inspecting the same. That is, the ratio of the inner diameter D1 to the outer diameter D2 may be determined within the range of 1:1.5 to 1:5. As a specific example, if the outer diameter D2 is four times the inner diameter D1, i.e. the ratio of the inner diameter D1 to the outer diameter D2 is 1:4, the connector of one embodiment will exhibit an impedance of about 50 ohms. can
  • the impedance when the outer diameter D2 is 4 times the inner diameter D1 can be checked with software capable of calculating impedance in a coaxial structure (eg, a coaxial line calculator).
  • the software Impedance was calculated under the condition that the dielectric constant of the insulating portion 112 was 2.95, the inner diameter D1 was 0.1 mm, and the outer diameter D2 was 0.4 mm. According to the calculation results under the above conditions, the impedance is It can be confirmed that it is about 50.
  • the parasitic capacitance is 118.222 pF/m
  • the inductance is 277.259 nH/m
  • the phase velocity is 174667 km/s
  • the time delay can be calculated as 5.719ns/m.
  • the connector of one embodiment enables high frequency RF inspection of 40 GHz or higher while achieving impedance matching without signal interference or noise and without signal loss.
  • the connector of one embodiment having a signal conductive part exhibiting an impedance of about 50 ohms can cover a high frequency band, and can be effectively applied to inspection of a semiconductor device of a mobile communication device operating in the high frequency band.
  • the dimensions of the inner diameter D1 and the outer diameter D2 are adjusted under the coaxial structure of the signal conductive part and the signal conductive part is not shorted with the ground conductive part and the frame part, so it can have improved RF characteristics.
  • FIG. 7 schematically shows an example of manufacturing the connector of the second embodiment, and the elements shown in Fig. 7 are only selected for understanding the embodiment.
  • First through holes 132 having the same diameter and center are formed at positions where the signal conductive part is to be formed.
  • the first through hole 132 may be formed by drilling or laser, for example.
  • the second through hole 135 in the metal frame layer 131 and the insulating frame layer 138 is spaced apart from the first through hole 132 in the horizontal direction HD so that the ground conductive part is formed in the same position as each other. It is formed with a diameter and a center.
  • the second through hole 135 may be formed by drilling or laser, for example.
  • a plating or deposition metal film 139 is formed on the wall surface of the first through hole 132 of the insulating frame layer 138 .
  • the metal film 139 may be formed on the wall surface of the insulating frame layer 138 by anodizing, sputtering, or evaporation.
  • an insulating oxide film of nonconductor Al2O3 may be formed by anodizing.
  • the insulating frame layer 138 may include plating or deposition metal films 139 on upper and lower surfaces.
  • the insulating frame layer 138 is formed on the wall surface of the second through hole 135.
  • the metal layer 139 may not be included.
  • a third through hole 136 larger than the second through hole 135 formed in the remaining metal frame layer 131 and the insulating frame layer 138 in the uppermost frame layer of the frame part 130 is formed. is formed
  • the third through hole 136 has the same center as the second through hole 135 and has a larger diameter than the second through hole 135 .
  • the uppermost frame layer of the frame unit 130 is formed on a mold having the same first through hole and second through hole to form the signal transmission unit 110 and the ground conductive unit 120 Equip
  • a first liquid material is injected into the uppermost frame layer and the first through hole of the mold, and a second liquid material is injected into the second through hole and the third through hole.
  • the first liquid material includes an elastic insulating material constituting the insulating part 112 of the signal conductive part 110 and in a liquid state, and first conductive particles 113 dispersed in the elastic insulating material in a liquid state. do.
  • the second liquid material includes an elastic material constituting the elastic material of the ground conductive part 120 and in a liquid state, and second conductive particles 123 dispersed therein.
  • the elastic insulating material of the first liquid material and the elastic material of the second liquid material may be the same.
  • the first conductive particle 113 and the second conductive particle 123 may be the same.
  • a magnetic field is applied in a vertical direction (VD) to the first liquid material injected into the first through hole and the second liquid material injected into the second through hole and the third through hole of the mold.
  • VD vertical direction
  • the first conductive particles 113 in the first liquid material are densely gathered in the vertical direction (VD) in the magnetic field and come into conductive contact
  • the second conductive particles 123 in the second liquid material They are densely gathered in the vertical direction (VD) in the magnetic field and contacted to be conductive.
  • the first conductive particles 113 densely collected and contacted in the vertical direction VD form the transmission part of the signal conductive part.
  • the second conductive particles 123 densely collected and contacted in the vertical direction VD may form the ground conductive part 120 .
  • the liquid elastic insulating material except for the first conductive particles 113 among the first liquid materials is hardened to form the insulating part 112 of the signal conductive part 110. .
  • the liquid elastic material disposed between the second conductive particles 123 among the second liquid materials is cured, and the second conductive particles 123 may be maintained in the vertical direction.
  • the liquid elastic material disposed between the second conductive particles 123 having the same diameter as the second through hole 135 is hardened in the third through hole 136 formed in the uppermost metal frame layer, so that the second conductive particle 123 ) and an insulating ring 137 larger than the diameter of the second through hole 135 is formed.
  • the uppermost frame layer coupled to the signal conductive part 110 , the insulating ring 137 , and the ground conductive part 120 is separated from the mold.
  • the metal frame layer 131 and the insulating frame layer 138 are alternately stacked by using an adhesive so that the centers of the first through hole 132 to the third through hole 136 coincide with each other.
  • the adhesive is any one of a conductive adhesive, an epoxy-based adhesive, and a silicone-based adhesive.
  • the signal conductive part 110 and the ground conductive part 120 coupled to the uppermost frame layer are inserted into the alternately stacked metal frame layer 131 and the insulating frame layer 138,
  • the uppermost frame layer is bonded to the metal frame layer 131 or the insulating frame layer 138 using an adhesive to complete the connector.
  • the connector for electrical connection according to the present invention is not affected by signal interference or noise, can be effectively used for high-frequency RF inspection, various structural and design modifications to the connector are possible, and the elasticity of the connector can be improved. Therefore, it can contribute to technological improvement in the field of connectors for electrical connection.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cable Accessories (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne un connecteur pour connexion électrique disposé entre un dispositif d'inspection et un dispositif inspecté. Le connecteur comprend une partie conductrice de signal, une partie conductrice de masse et une partie cadre. La partie conductrice de signal comprend une partie de transmission et une partie isolante. La partie de transmission est constituée d'une pluralité de premières particules conductrices qui sont mises en contact de manière conductrice. La partie isolante est formée d'un seul tenant avec la partie de transmission pour entourer la partie de transmission et a une épaisseur dans la direction horizontale qui est supérieure à la largeur maximale de la partie de transmission. La partie de cadre comprend une couche de cadre métallique et une couche de cadre isolante qui sont empilées en alternance dans la direction verticale tout en maintenant la partie conductrice de signal et la partie conductrice de masse dans la direction verticale et permettant à la partie conductrice de signal et à la partie conductrice de masse d'être espacées dans la direction horizontale.
PCT/KR2022/008875 2021-07-01 2022-06-22 Connecteur pour connexion électrique WO2023277442A1 (fr)

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