WO2017082510A1 - Prise d'essai comprenant un fil conducteur en caoutchouc silicone conducteur, et son procédé de fabrication - Google Patents

Prise d'essai comprenant un fil conducteur en caoutchouc silicone conducteur, et son procédé de fabrication Download PDF

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Publication number
WO2017082510A1
WO2017082510A1 PCT/KR2016/007185 KR2016007185W WO2017082510A1 WO 2017082510 A1 WO2017082510 A1 WO 2017082510A1 KR 2016007185 W KR2016007185 W KR 2016007185W WO 2017082510 A1 WO2017082510 A1 WO 2017082510A1
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WO
WIPO (PCT)
Prior art keywords
silicone rubber
bump
conductive
pad
film
Prior art date
Application number
PCT/KR2016/007185
Other languages
English (en)
Korean (ko)
Inventor
박성규
전진국
Original Assignee
주식회사 오킨스전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150159188A external-priority patent/KR101708487B1/ko
Priority claimed from KR1020160032394A external-priority patent/KR101735516B1/ko
Priority claimed from KR1020160032412A external-priority patent/KR101735521B1/ko
Priority claimed from KR1020160032391A external-priority patent/KR101726399B1/ko
Priority claimed from KR1020160032392A external-priority patent/KR101735520B1/ko
Application filed by 주식회사 오킨스전자 filed Critical 주식회사 오킨스전자
Publication of WO2017082510A1 publication Critical patent/WO2017082510A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Definitions

  • the present invention relates to a test socket in which a conductive silicone rubber supplements the conductive wire even when the conductive wire is broken in the conductive silicone rubber, and more particularly, to a semiconductor package manufacturing process.
  • a test socket for inspecting electrical characteristics before a semiconductor device to be manufactured is shipped, and a manufacturing method thereof.
  • semiconductor devices manufactured through a complicated process are inspected for characteristics and defective states through various electrical tests.
  • test socket is arranged between the semiconductor device and the test device.
  • test socket is provided with a conductive connector (wire or spring, etc.) for contacting terminals provided in the test device.
  • the conductive connector must be able to absorb the impact even in contact with the semiconductor device.
  • the conductive wire is broken by an impact by repeated tests, the function cannot be performed.
  • the conductive wire connects the upper and lower pads of the socket, when the length thereof becomes longer, the electrical path also becomes longer when a test at a high frequency is required, such as an RF (Radio Frequency) semiconductor device.
  • RF Radio Frequency
  • the thickness of the test socket becomes thin while the semiconductor device is light and thin.
  • the thickness of the socket becomes thin, the life is shortened by repeated tests.
  • the thickness of the socket can be freely adjusted, thereby extending the product cycle.
  • the present invention has been made to solve the problems of the prior art as described above, the object of the present invention is that even if the conductive wire is not directly connected to the upper and lower pads of the socket, it is possible to energize between the upper and lower pads, even in repeated tests Nevertheless, it is to provide a test socket and a method of manufacturing the same, in which break of the conductive wire is inherently prevented to extend the product life of the socket.
  • the test socket of the present invention is formed a plurality of first pad, a first conductive wire bonded to the first surface of the first pad, A plurality of through-holes formed on the first PCB film and corresponding to the first conductive wires are formed, and are installed on the insulated silicone rubber and the insulated silicone rubbers on which the first conductive wires are mounted.
  • the RF characteristic is improved even when a test is required at a high frequency.
  • the contact characteristics with the external terminals are improved, and in particular, recesses are formed around the upper and lower pads, so that individual contact characteristics are expected to be enhanced.
  • FIG. 1 is a partial cutaway perspective view showing the configuration of a test socket according to the present invention
  • 2A-2E are cross-sectional views illustrating the manufacturing method of FIG. 1.
  • Figure 3 is a top perspective view showing the configuration of a test socket including a stud bump according to the present invention.
  • Figure 4 is a bottom perspective view showing the configuration of a test socket including a stamped bump according to the present invention.
  • 5A to 5M are cross-sectional views illustrating the manufacturing process of FIG. 3.
  • 5N is a sectional view of a manufacturing process of FIG. 4.
  • FIG 6 and 7 are top and bottom perspective views respectively showing the configuration of the test socket according to the present invention.
  • 8A to 8M are cross-sectional views illustrating a manufacturing process of FIGS. 6 and 7.
  • FIG. 9 is a top perspective view showing a configuration of a test socket including a plate bump with a top bump and stud bump with a bottom bump according to an embodiment of the present invention.
  • FIG. 10 is a top perspective view showing the configuration of a test socket including a plate bump to the upper bump and a rubber bump to the lower bump according to another embodiment of the present invention.
  • 11A-11K are cross-sectional views illustrating the manufacturing process of FIG. 9.
  • 12A and 12B are top and bottom perspective views respectively illustrating a configuration of a test socket according to an embodiment of the present invention.
  • FIGS. 13A and 13B are top and bottom perspective views respectively illustrating a configuration of a test socket according to an exemplary embodiment of the present invention.
  • 14A and 14B are top and bottom perspective views respectively illustrating a configuration of a test socket according to an exemplary embodiment of the present invention.
  • 15A and 15B are top and bottom perspective views respectively illustrating the configuration of a test socket according to an embodiment of the present invention.
  • 16A to 16K are cross-sectional views illustrating the manufacturing process of FIG. 12A.
  • Embodiments described herein will be described with reference to plan and cross-sectional views, which are ideal schematic diagrams of the invention. Therefore, the shape of the exemplary diagram may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in forms generated according to manufacturing processes. Thus, the regions illustrated in the figures have schematic attributes, and the shape of the regions illustrated in the figures is intended to illustrate a particular form of region of the device and is not intended to limit the scope of the invention.
  • test socket having the configuration as described above will be described in detail with reference to the accompanying drawings.
  • a test socket 100 may include a first conductive film wire-bonded to a first surface of a first PCB film 110 on which a plurality of first pads 102 are formed, and a first surface of the first pad 102.
  • the plurality of through holes 122 formed on the wire 120 and the first PCB film 110 and corresponding to the first conductive wire 120 are formed, and the first conductive wire 120 is mounted on the through holes 122.
  • the second PCB film 140 is formed on the insulating silicone rubber 130, the insulating silicone rubber 130, a plurality of second pad 132 is formed, the second wire bonded to the first surface of the second pad 132
  • the conductive wire 150 includes a conductive silicon rubber 160 filled in the conductive wire 150 and the through hole 122 and supporting the first conductive wire 120 and the second conductive wire 150 and electrically connecting them.
  • the first bump 104 may be formed on the second surface of the first pad 102, and the second bump 134 may be formed on the second surface of the second pad 132.
  • the first and second bumps 104 and 134 are stud type bumps, some of which remain during wire necking.
  • These stud bumps function to enhance the contact characteristics of external studs when the stud is in contact with a semiconductor device or a test device. In addition, due to repeated tests, the stud bumps can gradually become flat. In particular, the stud bump process in the present invention is carried out automatically it is possible to mass production.
  • the first pad 102 is fastened to one end of the first conductive wire 120 by the first bonding junction (not shown). Or it may be fastened by a conductive adhesive or soldering.
  • the first pad 102 is connected to a semiconductor device (not shown) through the first bump 104.
  • the second pad 132 is fastened to one end of the second conductive wire 150 through the second bonding junction (not shown). Likewise, fastening through adhesive or soldering is not excluded. The second pad 132 may then contact the test device (not shown) through the second bump 134.
  • the first PCB film 110 or the second PCB film 140 is a rigid printed circuit board (RIGID PCB) or a flexible polyamide constituting a circuit by printing a copper (Cu) on an epoxy or phenol resin
  • RGID PCB rigid printed circuit board
  • PCB flexible printed circuit board
  • Cu copper
  • Au gold
  • Cu other conductive material on a polyimide film
  • the first and second PCB films 110 and 140 around the first and second pads 102 and 132 may be provided with recesses (not shown) to enhance individual contact characteristics. As such, the independent individual contacts of each pad by the recess can distribute the compressive load caused by the contact during the test process, thereby alleviating the impact on the conductive wire or the conductive silicone rubber.
  • the first conductive wire 120 or the second conductive wire 150 may be plated with conductive gold (Ag) or nickel (Ni).
  • the first and second conductive wires 120 and 150 of the present invention do not directly connect the first pad 102 and the second pad 132 between the first PCB substrate 110 and the second PCB substrate 140. It features.
  • the conductive connector When the conductive connector is used in combination with the conductive wires and the conductive silicone rubber, it prevents the cutting of the conductive wires and prevents short cuts even if they are cut. Short does not occur.
  • the insulating silicone rubber 130 is not limited to silicone rubber as long as it has a predetermined elasticity.
  • the heat resistant polymer material having a crosslinked structure may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber and other elastic rubber.
  • conductive silicone rubber 160 similarly to the insulating silicone rubber 130, silicone rubber, urethane rubber, epoxy rubber and other elastic rubber can be used.
  • conductive particles that are magnetically arranged may be blended therein.
  • the conductive particles may be composed of iron, nickel, or cobalt or other magnetic metals or two or more alloys.
  • the conductive core may be formed in a mixed form in which the conductive particles are plated.
  • the conductive silicone rubber 160 may be formed of a compound in which excessive filler such as carbon (C) is filled.
  • the conductive silicone rubber 160 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in the silicone rubber resin.
  • the aforementioned conductive powder among the unaligned conductive connectors may be a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) having magnetic properties, or may include two or more metals. . Comparing the conductive silicone rubber 160 with the conductive connector formed by magnetically arranging conductive particles on the silicone rubber resin, the manufacturing process is much simpler and the yield is improved.
  • FIGS. 2A to 2E a method for manufacturing a test socket according to the present invention will be described with reference to FIGS. 2A to 2E.
  • a first PCB film 110 is prepared.
  • a plurality of first pads 102 are formed on the first PCB film 110.
  • the first pad 102 may include a bonding pad manufactured by electroplating or electroless plating copper (Cu).
  • the flexible printed circuit board is easy to design a circuit pattern using screen printing or photolithography process, and has excellent workability, and roll-to-roll. roll) Most suitable for continuous processes.
  • the first conductive wire 120 is connected to the first PCB film 110 by using the first pad 102.
  • the first conductive wire 120 is in contact with the first pad 102.
  • a bonding junction may be formed.
  • the first conductive wire 120 may be composed of a single wire or a double wire.
  • an insulating silicon rubber 130 is installed on the first PCB film 110 on which the first conductive wire 120 is wire bonded.
  • the insulating silicone rubber 130 may be prepared separately in advance.
  • the insulating silicone rubber 130 may be patterned into a predetermined shape using a mold. For example, pins are formed in the mold at regular intervals and sizes. When the liquid insulating silicone rubber is injected therein, the liquid silicone rubber is injected only to the portions except the pins, thereby forming the insulating silicone rubber 130 having the through holes 122.
  • the through hole 122 may be formed after completion of the insulating silicone rubber 130 by a laser process or the like.
  • the first conductive wire 120 is mounted in the plurality of through holes 122 corresponding thereto.
  • a second PCB film 140 is installed on the top surface of the insulating silicone rubber 130.
  • the second PCB film 140 may be prepared as follows.
  • a plurality of second pads 132 are formed on the second PCB film 140.
  • the second pad 132 may include a bonding pad manufactured by electroplating or electroless plating copper (Cu).
  • the second PCB film 140 may be a flexible printed circuit board.
  • the second conductive wire 150 is connected to the second PCB film 140 by using the second pad 132.
  • the second conductive wire 150 is in contact with the second pad 132. As a result, a bonding junction may be formed.
  • the first and second conductive wires 120 and 150 are mounted in the through hole 122, and the first and second PCB films 110 and 140 are disposed below the insulating silicon rubber 130.
  • the through hole 122 is filled with a liquid conductive silicone rubber.
  • the through-hole 122 is filled and cured with a liquid silicone rubber in which conductive particles are dispersed and impregnated at a predetermined pressure. After curing, the conductive silicone rubber 160 supports the first and second conductive wires 120 and 150 to form an electrical connection therebetween.
  • a bump process is performed on the second surface of the first pad 102 and the second surface of the second pad 132, respectively.
  • the stud type first and second bumps 104 and 134 may be formed by forming a connector in which a part of the wires persists in the bumps.
  • a recess may be formed to enhance the independent contact characteristics of the first and second pads 102 and 132 before and after the bump process.
  • the test socket 200 of the present invention a plurality of bottom pad 202 is formed on the bottom PCB film 210, bottom PCB film 210 formed with a predetermined rule and bottom pad ( Insulating silicone rubber 230, a plurality of through holes 224 are formed to correspond to the 202, the top PCB film 240, the top pad is installed on the insulating silicone rubber 230, the top pad 232 is formed ( A conductive silicone rubber that is wire-bonded to the inner surface of the wire 232 and the through-hole 224, and electrically connects the pads 202 and 232 while supporting the conductive wire bump 260 ( 270).
  • the bottom pad 202 may be in contact with a semiconductor device (not shown) through the bottom stud bump 204.
  • the top pad 232 may be inspected by contacting the test device (not shown) through the top stud bump 234.
  • a coining bump 206 may be installed in the bottom pad 202 to enhance contact characteristics with the semiconductor device. Since the stamped bumps 206 have a large surface area compared to the studs, various shaped edges can be formed to complement the contact characteristics. Although not shown in the figure, the top pad 232 may also be provided with a stamped bump 206 to enhance contact characteristics with the test device.
  • the present invention may further include a double-sided adhesive film to strengthen the bonding force between the insulating silicone rubber 230 and the PCB films 210 and 240 and to strengthen the durability of the entire test socket 200. That is, the bottom double-sided adhesive film 220 is installed between the bottom PCB film 210 and the insulating silicon rubber 230, and bonded between the bottom PCB film 210 and the insulating silicon rubber 230 and the top PCB film 250, both It includes a top double-sided adhesive film 250 for bonding.
  • the bottom or top PCB films 210 and 240 are rigid printed circuit boards (RIGID PCBs) or polyamide films having excellent ductility, which are formed by printing copper on epoxy or phenol resins.
  • RGID PCBs rigid printed circuit boards
  • PCB flexible printed circuit board
  • Cu copper
  • Au gold
  • other conductive material on the film may be used.
  • the bottom or top double-sided adhesive films 220 and 250 may be made of a polyimide film (PI) film having a thin thickness and excellent wear resistance.
  • PI polyimide film
  • the present invention is not necessarily limited thereto, and if it is a plastic film, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphthalamide (PPA), polysulfone (PSU), polyether sulfone (PES), poly It can be made of etherimide (PEI) or polyethylene-2,6-naphthalenedicarboxylate (PEN) film.
  • the insulating silicone rubber 230 is not limited to silicone rubber as long as it has a predetermined elasticity.
  • the heat resistant polymer material having a crosslinked structure may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber and other elastic rubber.
  • the conductive silicone rubber 270 may use a silicone rubber, a urethane rubber, an epoxy rubber or other elastic rubber.
  • conductive particles that are magnetically arranged may be blended therein.
  • the conductive particles may be composed of iron, nickel, or cobalt or other magnetic metals or two or more alloys.
  • the conductive core may be formed in a mixed form in which the conductive particles are plated.
  • the conductive silicone rubber 270 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in the silicone rubber resin.
  • the aforementioned conductive powder among the unaligned conductive connectors may be a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) having magnetic properties, or may include two or more metals. .
  • the top pad 232 has bumps formed on both the inner surface and the outer surface.
  • top stud bumps 234 are formed on the outer surface.
  • Conductive wire bumps 260 are formed on the inner surface.
  • the top stud bump 234 is a stud type bump in which a portion of the top stud bump remains.
  • the length of the stud is adjustable according to the contact characteristics.
  • the top stud bump 234 functions to enhance the contact characteristics of the stud with the external terminal when contacted with the semiconductor device or the test device.
  • the conductive wire bump 260 may be formed.
  • the stamped bump 206 of FIG. 4 provides a constant pressure on the bottom stud bump 204 to flatten the stud.
  • the conductive wire bump 260 may be further plated with conductive gold (Au) or nickel (Ni).
  • the conductive wire bump 260 is not directly connected to the bottom pad 202. Since the conductive wire bump 260 of the present invention electrically connects the pads 202 and 232 in cooperation with the conductive silicone rubber 270, the conductive wire bump 260 may be broken or broken in the conductive wire bump 260 by repeated tests. When an accident such as breakage occurs, the conductive silicon rubber 270 is connected, and the conductive silicone rubber 270 can increase the current capacity through the conductive wire bump 260, thereby effectively.
  • independent individual contacts are conducted for each conductive wire bump 260.
  • a plurality of pads 202 and 232 that are completely or incompletely independent from the top PCB film 240 so as to exclude mutual interference between stud bumps 204 and 234 or stamped bumps 206 that are arranged with certain rules. Can provide PCB land.
  • the recess is formed by elongating a portion of the top PCB film 240 through a laser cutting process or an etching process, thereby extending in a straight or curved form. This allows a plurality of stud bumps 204 and 234 or stamped bumps 206 to be partitioned through the recesses and become independent.
  • the recess is formed to a predetermined depth so that at least both the PCB films 210 and 240 and the double-sided adhesive films 220 and 250 are removed.
  • the insulating silicon rubber 230 is exposed through laser cutting or the like.
  • the recess is filled with soft silicone rubbers 222 and 252. It can be filled using spin coating. In this case, the hardness of the soft silicone rubbers 222 and 252 may be smaller than that of the insulating silicone rubber 230.
  • the present invention further shortens the distance between the stud bumps 204 and 234 or the stamped bumps 206 in order to enhance the contact characteristics in response to the fine pitch of the semiconductor device to be inspected.
  • the spacing of the recesses that ensures individual contacts of the bumps 206 is also small. Therefore, the neighboring recesses tend to overlap each other.
  • the top soft silicone rubber 252 or the bottom soft silicone rubber 222 filled in the recess prevents the PCB films 240 and 210 and the insulating silicone rubber 230 from being separated and separated by an impact by repeated tests. It performs the function.
  • the top or bottom double-sided adhesive films 250 and 220 are used to enhance the assemblability of the top PCB film 240 and the insulating silicone rubber 230, but the stud bumps 234 and 204 or the stamped bumps ( The gaps between the 206s become narrow and tend to be separated arbitrarily, thereby making use of the soft silicone rubbers 252 and 222.
  • a ball guide film may be further included on the outer surface of the PCB film 210 or 240 to guide the ball of the semiconductor device or the test device from mismatching with the stud bumps 204 and 234. have. Therefore, the ball guide film prevents the ball from being detached after contact of the ball.
  • FIGS. 5A to 5N a method for manufacturing a test socket according to the present invention will be described with reference to FIGS. 5A to 5N.
  • a top PCB film 240 is prepared.
  • a plurality of top pads 232 are formed on the top PCB film 240.
  • the top pad 232 may be a bonding pad manufactured by electroplating or electroless plating copper (Cu).
  • top stud bumps 234 are formed on the outer surface of the top PCB film 240. Wire bonding is used for the top pad 232, but the length of the top pad 232 is shortened to form the top stud bump 234.
  • conductive wire bumps 260 are formed on the inner surface of the top PCB film 240.
  • the wire pad is used for the top pad 232, but the length of the top pad 232 is extended to form the conductive wire bump 260.
  • the top double-sided adhesive film 250 is attached to the inner surface of the top PCB film 240.
  • a bottom PCB film 210 is prepared.
  • a plurality of bottom pads 202 are formed on the bottom PCB film 210.
  • the bottom pad 202 may include a bonding pad manufactured by electroplating or electroless plating copper (Cu).
  • a bottom stud bump 204 is formed on the inner surface of the bottom PCB film 210. Wire bonding is used for the bottom pad 202, but the length thereof is shortened to form stud bumps. Applying pressure to the studs again and performing a planarization or other coining process can form a stamped bump (106 in FIG. 5N).
  • the bottom double-sided adhesive film 220 is attached to the inner surface of the bottom PCB film 210.
  • an insulating silicon rubber 230 is installed on the bottom PCB film 210.
  • the bottom double-sided adhesive film 220 is bonded to the bottom PCB film 210 and the insulating silicone rubber 230.
  • the insulating silicone rubber 230 may be previously prepared separately from this. Although not shown, the insulating silicone rubber 230 may be patterned into a predetermined shape using a mold. For example, pins are formed in the mold at regular intervals and sizes. When the liquid insulating silicone rubber is injected therein, the liquid silicone rubber may be injected only in the portion except the pin to form the insulating silicone rubber 230 having the through hole 224.
  • the through hole 224 may be formed after completion of the insulating silicone rubber 230 by a laser process or the like.
  • the conductive wire bumps 160 of FIG. 5H are mounted in the plurality of through holes 224 corresponding thereto.
  • the conductive silicon rubber 270 is filled in the through hole 224.
  • the conductive liquid silicone rubber is filled and cured in the through hole 224 at a predetermined pressure to complete the conductive silicone rubber 270.
  • the conductive silicone rubber 270 supports the conductive wire bump 260, and the conductive wire bump 260 complements the electrical connection of the conductive silicone rubber 270.
  • the top PCB film 240 is installed on the top surface of the insulating silicon rubber 230.
  • the conductive wire bump 260 is inserted through the conductive silicone rubber 270. Insertion of the conductive wire bumps 260 before the conductive silicone rubber 270 is fully cured can facilitate assembly.
  • the top PCB film 240 and the insulating silicon rubber 230 are combined using the top double-sided adhesive film 250.
  • a top PCB land is formed by forming a recess on the top PCB film 240 that independently defines the top stud bump 234. At least insulating silicon rubber 230 is exposed through laser cutting. This eliminates interference between adjacent top pads 232.
  • the soft liquid silicone rubber is filled and cured in the recess to form the top soft silicone rubber 252.
  • the top soft silicon rubber 252 may fix the top PCB film 240, the top double-sided adhesive film 250, and the insulating silicon rubber 230 integrally.
  • the spin coating method can be used to fill the liquid soft silicone rubber. Since the top soft silicone rubber 252 is softer than the insulating silicone rubber 230, the top soft silicone rubber 252 is easily filled in the recess by spin coating. If desired, the top soft silicone rubber 252 may be covered except for the bump area of the top stud bump 234.
  • a bottom PCB land is formed by forming a recess on the bottom PCB film 210 to independently partition the bottom pad 202. Laser cutting is performed until the insulating silicone rubber 230 is exposed.
  • a bottom soft silicone rubber 222 is filled in the recess. This eliminates interference between adjacent bottom stud bumps 204.
  • the bottom stud bump 204 is pressed to form a bump 206 having a flat surface pressure.
  • the test socket 300 of the present invention is installed on the bottom PCB film 310 and the bottom PCB film 310 in which a plurality of hole pads 302 are disposed at regular intervals, and the hole pad 302.
  • Insulating silicone rubber 330 in which a plurality of through holes 324 are formed, top PCB film 340 and bonding pads 332 formed on the insulating silicone rubber 330 and forming a bonding pad 332.
  • Conductive silicon wires 370 that are wire-bonded to the inner surface of the Cs, and the through-holes 324, and conductive silicon rubbers 370 that electrically connect the pads 302 and 332 while supporting the conductive wire bumps 360. ).
  • the bonding pads 332 may be contacted with a test device (not shown) through a top stud bump 334 to perform the inspection.
  • the hole pad 302 may be in contact with a semiconductor device (not shown) through a rubber bump 304 in which a portion of the conductive silicone rubber 370 protrudes through the hole. .
  • the present invention may further include a double-sided adhesive film to strengthen the bonding force between the insulating silicone rubber 330 and the PCB film (310, 340) and to strengthen the durability of the entire test socket (300). That is, the bottom double-sided adhesive film 320 is installed between the bottom PCB film 310 and the insulating silicon rubber 330 to bond the two, and is installed between the insulating silicon rubber 330 and the top PCB film 350 and both It includes a top double-sided adhesive film 350 for bonding.
  • a double-sided adhesive film to strengthen the bonding force between the insulating silicone rubber 330 and the PCB film (310, 340) and to strengthen the durability of the entire test socket (300). That is, the bottom double-sided adhesive film 320 is installed between the bottom PCB film 310 and the insulating silicon rubber 330 to bond the two, and is installed between the insulating silicon rubber 330 and the top PCB film 350 and both It includes a top double-sided adhesive film 350 for bonding.
  • the bottom or top PCB films 310 and 340 are rigid printed circuit boards (RIGID PCBs) or polyamide films having excellent flexibility by printing copper on epoxy or phenol resins.
  • RGID PCBs rigid printed circuit boards
  • PCB flexible printed circuit board that forms various circuit patterns by copper (Cu), gold (Au), or other conductive material on the film may be used.
  • the bottom or top double-sided adhesive films 320 and 350 may be formed of a polyimide film (PI) film having a thin thickness and excellent wear resistance.
  • PI polyimide film
  • the present invention is not necessarily limited thereto, and if it is a plastic film, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphthalamide (PPA), polysulfone (PSU), polyether sulfone (PES), poly It can be made of etherimide (PEI) or polyethylene-2,6-naphthalenedicarboxylate (PEN) film.
  • the insulating silicone rubber 330 is not limited to silicone rubber as long as it has a predetermined elasticity.
  • the heat resistant polymer material having a crosslinked structure may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber and other elastic rubber.
  • the conductive silicone rubber 370 may use a silicone rubber, a urethane rubber, an epoxy rubber or other elastic rubber.
  • conductive particles that are magnetically arranged may be blended therein.
  • the conductive particles may be composed of iron, nickel, or cobalt or other magnetic metals or two or more alloys.
  • the conductive core may be formed in a mixed form in which the conductive particles are plated.
  • the conductive silicone rubber 370 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in the silicone rubber resin.
  • the aforementioned conductive powder among the unaligned conductive connectors may be a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) having magnetic properties, or may include two or more metals. .
  • the bonding pads 332 are formed with bumps on both inner and outer surfaces.
  • top stud bumps 334 are formed on the outer surface.
  • Conductive wire bumps 360 are formed on the inner surface.
  • the top stud bump 334 is a stud type bump in which a portion of the top stud bump remains.
  • the length of the stud is adjustable according to the contact characteristics.
  • the top stud bump 334 functions to enhance the contact characteristics of the stud with the external terminal when contacted with the semiconductor device or the test device. Therefore, the length of the stud can be lengthened to form the conductive wire bumps 360.
  • a constant pressure may be provided to the top stud bump 334 to flatten the stud to form a coining bump.
  • the conductive wire bump 360 may be further plated with conductive gold (Au) or nickel (Ni).
  • the conductive wire bump 360 is not directly connected to the bottom pad 302. Since the conductive wire bumps 360 of the present invention electrically connect the pads 302 and 332 in cooperation with the conductive silicone rubber 370, the conductive wire bumps 360 may be broken in the conductive wire bumps 360 by repeated tests. When an accident such as breakage occurs, the conductive silicon rubber 370 is connected, and the conductive silicon rubber 370 can increase the current capacity through the conductive wire bumps 360, which is effective.
  • independent individual contacts are conducted for each conductive wire bump 360.
  • a plurality of PCB lands that are fully or incompletely independent of the hole pads 302 from the bottom PCB film 340 may be provided to exclude mutual interference between multiple rubber bumps 304 arranged with certain rules.
  • the recess is formed by extending a portion of the bottom PCB film 310 through a laser cutting process or an etching process to form a straight line or a curved line.
  • the plurality of rubber bumps 304 are partitioned through the recesses and become independent.
  • the recess is formed to a predetermined depth such that at least the bottom PCB film 310 and the bottom double-sided adhesive film 320 are removed.
  • the insulating silicon rubber 330 is exposed through laser cutting or the like.
  • the recess is filled with soft silicone rubber 322. It can be filled using spin coating. In this case, the hardness of the soft silicone rubber 322 used may be smaller than that of the insulating silicone rubber 330.
  • the distance between the rubber bumps 304 is further shortened to enhance the contact characteristics in response to the fine pitch of the semiconductor device to be inspected.
  • the distance between the recesses that guarantee the individual contacts of the rubber bumps 304 is also small. You lose. Therefore, the neighboring recesses tend to overlap each other.
  • the soft silicon rubber 322 filled in the recess serves to prevent the bottom PCB film 310 and the insulating silicon rubber 330 from being separated and separated by an impact by repeated tests.
  • the bottom double-sided adhesive film 320 is used to reinforce the assemblability of the bottom PCB film 310 and the insulating silicone rubber 330, but the gap between the rubber bumps 304 becomes narrow, so that they are randomly separated. This tends to be replenished using soft silicone rubber 322.
  • top surface adhesive film 380 having a ball guide function of guiding the conductive ball of the external device so as not to mismatch with the stud bump 334 may be further included on the outer surface of the top PCB film 340. Therefore, the top surface adhesive film 380 prevents the ball from being randomly separated after the contact of the conductive ball.
  • FIGS. 8A to 8M a method for manufacturing a test socket according to the present invention will be described with reference to FIGS. 8A to 8M.
  • a top PCB film 340 is prepared.
  • a plurality of bonding pads 332 are formed on the top PCB film 340.
  • the bonding pad 332 may be a bonding pad manufactured by electroplating or electroless plating copper (Cu).
  • top stud bumps 334 are formed on the outer surface of the top PCB film 340. Wire bonding is used for the bonding pads 332, but the length of the bonding pads 332 is shortened to form the stud bumps 334.
  • conductive wire bumps 360 are formed on the inner surface of the top PCB film 340. Wire bonding is used for the bonding pad 332, but the length of the bonding pad 332 is extended to form the conductive wire bump 360.
  • the top double-sided adhesive film 350 is attached to the inner surface of the top PCB film 340.
  • a bottom PCB film 310 is prepared.
  • the bottom PCB film 310 has a plurality of holes (not shown) corresponding to the bonding pads 332. Therefore, a plurality of hole pads 302 are formed in the bottom PCB film 310.
  • the hole pad 302 may be manufactured by electroplating or electroless plating copper (Cu) on the hole edge of the bottom PCB film 310, similarly to the bonding pad 332.
  • the bottom double-sided adhesive film 320 is attached to the inner surface of the bottom PCB film 310.
  • an insulating silicone rubber 330 may be prepared.
  • the insulating silicone rubber 330 may be patterned into a predetermined shape using a mold. For example, pins are formed in the mold at regular intervals and sizes. When the liquid insulating silicone rubber is injected therein, the liquid silicone rubber may be injected only in the portion except the pin to form the insulating silicone rubber 330 having the through hole 324.
  • the through hole 324 may be formed after completion of the insulating silicone rubber 330 by a laser process or the like.
  • the conductive wire bumps 360 to be described later are mounted in the plurality of through holes 324 corresponding thereto.
  • an insulating silicon rubber 330 is installed on the bottom PCB film 310.
  • the bottom double-sided adhesive film 320 is bonded to the bottom PCB film 310 and the insulating silicone rubber 330.
  • the conductive silicon rubber 370 is filled in the through hole 324.
  • the conductive liquid silicone rubber is filled and cured in the through hole 324 at a predetermined pressure to complete the conductive silicone rubber 370.
  • the conductive silicone rubber 370 supports the conductive wire bumps 360, and the conductive wire bumps 360 compensate for the electrical connection of the conductive silicone rubber 370.
  • a jig (Z) is installed below the bottom PCB film 310. Grooves are formed on the surface of the jig Z corresponding to the through hole 324 to determine the shape of the rubber bump 304.
  • the liquid conductive silicone rubber is injected into the through hole 324 at a constant pressure, a portion of the liquid conductive silicone rubber protrudes through the hole pad 302 to form the rubber bump 304. Remove the jig (Z).
  • a top PCB film 340 is installed on the top surface of the insulating silicon rubber 330.
  • the conductive wire bump 360 is inserted through the conductive silicone rubber 370. Insertion of the conductive wire bumps 360 before the conductive silicone rubber 370 is fully cured may facilitate assembly.
  • top PCB film 340 and the insulating silicon rubber 330 are combined using the top double-sided adhesive film 350.
  • the top surface adhesive film 380 is attached to the top surface of the top double-sided adhesive film 350.
  • the top double-sided adhesive film 350 is coated with an adhesive material on both sides, whereas the top one-sided adhesive film 380 is coated with a single sided adhesive material.
  • a bottom PCB land is formed by forming a recess on the bottom PCB film 310 that independently partitions the hole pad 302. Laser cutting is performed until the insulating silicone rubber 330 is exposed. At least the insulating silicone rubber 330 is exposed through laser cutting. This eliminates interference between adjacent hole pads 302.
  • the recess is filled with a soft silicone rubber 322.
  • a soft silicone rubber 322 may integrally fix the bottom PCB film 310, the bottom double-sided adhesive film 320, and the insulating silicone rubber 330.
  • the spin coating method may be used to fill the liquid soft silicone rubber. Since the soft silicone rubber 322 has a lower hardness than the insulating silicone rubber 330, the soft silicone rubber 322 is easily filled in the recess by spin coating. If desired, the soft silicone rubber 322 may be covered except for the bump area of the rubber bump 334.
  • FIG. 9 is a perspective view of a configuration of a test socket in which the bump includes a plate bump and a lower bump includes a stud bump according to the present invention
  • FIG. 10 is a configuration of a test socket in which the lower bump includes a rubber bump. Shown in perspective view.
  • the test socket 400 of the present invention includes a bottom PCB film 410 in which a plurality of bottom pads 402 are constantly arranged, and a bottom connected to an outer surface of the bottom pad 402.
  • a conductive silicon rubber 440 connected to the upper surface of the conductive silicon rubber 440, a top bump 450 connected to the top surface of the conductive silicone rubber 440, and a wire bonded to the inner surface of the top bump 450 and inserted into the conductive silicone rubber 440.
  • Wire 460 Wire 460.
  • the top bump 450 may include a metal plate bump.
  • the lower bump 404 may include a stud bump or a rubber bump.
  • the bottom pad 402 may include a bonding pad
  • the bottom bump 404 may include a stud bump
  • the bottom pad 402 may include a hole pad
  • the bottom bump 404 may include a rubber bump.
  • test socket 400 is in contact with a semiconductor device (not shown) through a bottom stud bump 404 and a test device (not shown) through a top stud bump 450. Inspection can be performed by contacting
  • the bottom PCB film 410 is formed on a rigid printed circuit board (RIGID PCB) or a polyimide film having excellent ductility by forming copper by printing copper on epoxy or phenol resin.
  • RIGID PCB rigid printed circuit board
  • Polyimide film having excellent ductility by forming copper by printing copper on epoxy or phenol resin.
  • Flexible PCBs that form various circuit patterns by copper (Cu), gold (Au), or other conductive materials may be used.
  • test socket 400 of the present invention does not include the top PCB film. This is because the top bump 450 is formed through the sacrificial substrate, and the sacrificial substrate is removed during the manufacturing process. It also does not include a separate top pad.
  • the insulating silicone rubber 430 is not limited to silicone rubber as long as it has a predetermined elasticity.
  • the heat resistant polymer material having a crosslinked structure may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber and other elastic rubber.
  • conductive silicone rubber 440 similar to the insulating silicone rubber 430, silicone rubber, urethane rubber, epoxy rubber or other elastic rubber can be used.
  • conductive particles that are magnetically arranged may be blended therein.
  • the conductive particles may be composed of iron, nickel, or cobalt or other magnetic metals or two or more alloys.
  • the conductive core may be formed in a mixed form in which the conductive particles are plated.
  • the conductive silicone rubber 440 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in the silicone rubber resin.
  • the aforementioned conductive powder among the unaligned conductive connectors may be a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) having magnetic properties, or may include two or more metals. .
  • the conductive wire 460 may be further plated with conductive gold (Au) or nickel (Ni).
  • the conductive wire 460 is not directly connected to the bottom bump 404. Since the conductive wire 460 of the present invention electrically connects the bumps 404 and 450 in cooperation with the conductive silicone rubber 440, the conductive wire 460 may be broken or broken in the conductive wire 460 by repeated tests. When an accident occurs, the conductive silicon rubber 440 is connected, and the conductive silicon rubber 440 may increase the current capacity through the conductive wire 460, thereby obtaining mutual synergistic effects.
  • the top bump 450 includes a metal plate bump, and a conductive wire 460 extends on an inner surface of the metal plate bump.
  • the conductive wire 460 extends the wire by using wire bonding after the top bump 450 is formed, and a part of the wire remains long when the wire is necked.
  • the length of the length can be adjusted through the wire necking process.
  • the upper surface of the top bump 450 is formed of a flat metal plate bump, contact characteristics may be enhanced through various patterns on the upper surface.
  • the top bump 450 may be provided with a step having a height.
  • the conductive balls of the external device can be stably mounted thereto. That is, since the contact between the conductive ball and the natural oxide film of the conductive ball is broken or penetrated at the boundary of the step, the overall contactability can be improved.
  • embossing may be formed on the surface.
  • the embossing forms a protruding region, and since there are a plurality of protruding regions uniformly in the entire region, the contact fail can be minimized even if a horizontal deviation occurs due to different sizes of the conductive balls. have.
  • the surface of the top bump 450 may be provided with a pattern having a predetermined shape.
  • the lower PCB film 410 may make individual contacts of the lower bumps 404.
  • PCB lands can be formed that separate each bump through a recess to disperse the compressive load upon contact for testing and to eliminate interference between adjacent bumps by the PCB film.
  • a separate PCB film is not included in the upper portion, since the interference of neighboring bumps does not occur, separate PCB lands do not need to be separated.
  • the lower PCB film 410 may further include a double-sided adhesive film for reinforcing adhesion with the insulating silicone rubber 430.
  • a double-sided adhesive film for reinforcing adhesion with the insulating silicone rubber 430.
  • the double-sided adhesive film may be omitted.
  • a sacrificial substrate C is formed.
  • the sacrificial substrate C is formed to have a predetermined thickness by electroplating copper (Cu) or by depositing other metals.
  • the sacrificial substrate C uses a metal having an etch ratio with respect to the bump 450 because it is provided during the process to form the top bump (150 in FIG. 9) and is later removed.
  • the sacrificial substrate C is formed using copper (Cu).
  • the copper Cu may be formed by electroplating or electroless plating.
  • a part of the sacrificial substrate C is removed to form bump grooves Ch having a predetermined depth at regular intervals.
  • a portion of the sacrificial substrate C may be etched using a mask or a portion of the sacrificial substrate C may be removed using a laser.
  • the constant spacing may be changed according to the design of the top bump 450.
  • a seed bump 452 having a predetermined thickness is formed in the bump groove Ch.
  • Nickel (Ni) may be deposited to form the seed bump 452.
  • the top bump 450 is plated using the seed bump 452.
  • a conductive wire 460 is formed on the inner surface of the top bump 450 using wire bonding.
  • the bottom PCB film 410 is separately prepared.
  • a plurality of bottom pads 402 are formed on the bottom PCB film 410.
  • the bottom pad 402 may include a bonding pad manufactured by electroplating or electroless plating copper (Cu) similarly to the top pad 450.
  • a hole pad may be included.
  • stud bumps 404 are formed on the inner surface of the bottom PCB film 410.
  • the bottom pad 402 is formed using wire bonding.
  • an insulating silicon rubber 430 is installed on the inner surface of the bottom PCB film 410.
  • the bottom PCB film 410 and the insulating silicone rubber 430 may be combined using a double-sided adhesive film.
  • the insulating silicone rubber 430 may be separately prepared in advance.
  • the insulating silicone rubber 430 may be patterned into a predetermined shape using a mold.
  • pins are formed in the mold at regular intervals and sizes.
  • the liquid silicone rubber may be injected only in the portion except the pin to form the insulating silicone rubber 430 having the through hole 424.
  • the through hole 424 may be formed after completion of the insulating silicone rubber 430 by a laser process or the like. As a result, the conductive wire 160 of FIG. 9 is mounted in the plurality of through holes 424 corresponding thereto.
  • the conductive silicon rubber 440 is filled in the through hole 424.
  • the conductive liquid silicone rubber is filled and cured in the through hole 424 at a predetermined pressure to complete the conductive silicone rubber 440.
  • a sacrificial substrate C is installed on an upper surface of the insulating silicon rubber 430.
  • the conductive wire 460 is inserted through the conductive silicone rubber 440. Insertion of the conductive wire 460 before the conductive silicone rubber 440 is fully cured may facilitate assembly.
  • the conductive connector is completed by the bottom bump 404 and the top bump 450 on the top and bottom surfaces of the conductive silicone rubber 440, respectively.
  • the sacrificial substrate C is removed. Since the sacrificial substrate C including copper (Cu) has a high etching ratio compared to the seed bump 452 including nickel (Ni) or the top bump 450 including gold (Au), the sacrificial substrate C may be easily formed by an etching solution. Can be removed.
  • the conductive balls may be stably seated, and electrical contact properties may be enhanced.
  • recesses can be formed around each bump for individual contact of the lower bumps 404 and filled with soft silicone rubber in the recesses to eliminate interference between adjacent bumps.
  • the test socket 500 of the present invention includes a bottom bump that passes through a bottom PCB film 510 and a hole pad 502 in which a plurality of hole pads 502 are constantly arranged.
  • 520 an insulating silicone rubber 530 installed on the bottom PCB film 510 and formed with a plurality of through holes 524, a conductive filled with the through holes 524, and having a bottom surface connected to the bottom bump 520.
  • Top PCB film 552 installed on silicon rubber 540, insulating silicon rubber 530 and formed with top bump 550, and wire bonded and conductive silicon rubber 540 on the inner surface of top bump 550.
  • a conductive wire 560 that is inserted into, but not in direct contact with, the bottom bump 520.
  • the bottom bump 520 is wire bonded to a plate bump 520a connected to a conductive ball (not shown) of an external device, and the plate bump 520a and the hole pad 502. And a stamped stud 520b that passes through and couples with the conductive silicone rubber 540.
  • a typical stud is in the form of a wire of a predetermined length
  • the stamped stud 520b is pressed at a predetermined pressure to have a flat surface.
  • the top bump 550 may include a wire bump.
  • Wire bumps are formed by wire bonding on bonding pads 554.
  • the length of the stud may be increased to form a wire bump.
  • the length of the studs forming the wire bumps can be adjusted according to the contact characteristics.
  • the bottom bump 520 is wire bonded to the plate bump 520a that couples with the conductive silicone rubber 540, and the plate bump 520a and exposed through the hole pad 502. This includes the wire stud 520c connected to the conductive ball of the external device.
  • the top bump 550 may include a wire bump as described above.
  • the test socket 500 of the present invention may include a bottom bump coupled through a bottom PCB film 510 and a hole pad 502 in which a plurality of hole pads 502 are constantly arranged.
  • 520 an insulating silicone rubber 530 installed on the bottom PCB film 510 and formed with a plurality of through holes 524, a conductive filled with the through holes 524, and having a bottom surface connected to the bottom bump 520.
  • the bottom bump 520 is wire-bonded to the conductive silicon rubber 540 and wire-bonded to the silicon bump 540, the top bump 550 connected to the top surface of the conductive silicon rubber 540, and the inner surface of the top bump 550.
  • Conductive wire 560 not in direct contact with the wire.
  • the bottom bump 520 is wire-bonded to the plate bump 520a connected to the conductive ball of the external device and the plate bump 520a and passed through the hole pad 502 to conduct conductive silicon.
  • the top bump 550 may include a metal plate bump.
  • the metal plate bumps are flat on the upper surface, contact characteristics can be enhanced through various patterns on the upper surface.
  • the bump can be provided with a step having a height.
  • the conductive balls of the external device can be stably mounted thereto. That is, since the contact between the conductive ball and the natural oxide film of the conductive ball is broken or penetrated at the boundary of the step, the overall contactability can be improved.
  • embossing may be formed on the surface.
  • the embossing forms a protruding region, and since there are a plurality of protruding regions uniformly in the entire region, the contact fail can be minimized even if a horizontal deviation occurs due to the different sizes of the conductive balls. have.
  • the bottom bump 520 is wire bonded to the plate bump 520a that couples with the conductive silicone rubber 540, and the plate bump 520a and exposed through the hole pad 502. This includes the wire stud 520c connected to the conductive ball of the external device.
  • the top bump 550 may include metal plate bumps as described above.
  • test socket 500 is in contact with the semiconductor device (not shown) through the bottom bump 520 and in contact with the test device (not shown) through the top bump 550 to perform the inspection of the semiconductor device. can do.
  • the bottom PCB film 510 is printed on a rigid printed circuit board (RIGID PCB) or a polyimide film having excellent ductility by forming copper by printing copper on epoxy or phenol resin.
  • RIGID PCB rigid printed circuit board
  • Polyimide film having excellent ductility by forming copper by printing copper on epoxy or phenol resin.
  • Flexible PCBs that form various circuit patterns by copper (Cu), gold (Au), or other conductive materials may be used.
  • the insulating silicone rubber 530 is not limited to silicone rubber as long as it has a predetermined elasticity.
  • the heat resistant polymer material having a crosslinked structure may include polybutadiene rubber, urethane rubber, natural rubber, polyisoprene rubber and other elastic rubber.
  • the conductive silicone rubber 540 may use a silicone rubber, a urethane rubber, an epoxy rubber or other elastic rubber.
  • conductive particles that are magnetically arranged may be blended therein.
  • the conductive particles may be composed of iron, nickel, or cobalt or other magnetic metals or two or more alloys.
  • the conductive core may be formed in a mixed form in which the conductive particles are plated.
  • the conductive silicone rubber 540 may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in the silicone rubber resin.
  • the aforementioned conductive powder among the unaligned conductive connectors may be a single metal of silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) having magnetic properties, or may include two or more metals. .
  • the conductive wire 560 may be further plated with conductive gold (Au) or nickel (Ni).
  • the conductive wire 560 is not directly connected to the bottom bump 504. Since the conductive wire 560 of the present invention electrically connects the bumps 504 and 550 in cooperation with the conductive silicone rubber 540, the conductive wire 560 may be broken or broken by the repeated test. When an accident occurs, the conductive silicon rubber 540 is connected, and the conductive silicone rubber 540 may increase the current capacity through the conductive wire 560, thereby obtaining mutual synergy.
  • the lower PCB film 510 may make individual contacts of the lower bump 504.
  • PCB lands can be formed that separate each bump through a recess to disperse the compressive load upon contact for testing and to eliminate interference between adjacent bumps by the PCB film.
  • a separate PCB film is not included in the upper portion, since the interference of neighboring bumps does not occur, separate PCB lands do not need to be separated.
  • the lower PCB film 510 may further include a double-sided adhesive film for reinforcing adhesion with the insulating silicone rubber 530.
  • a double-sided adhesive film for reinforcing adhesion with the insulating silicone rubber 530.
  • the double-sided adhesive film may be omitted.
  • FIGS. 16A to 16K a method for manufacturing a test socket according to the present invention will be described with reference to FIGS. 16A to 16K.
  • a sacrificial substrate C is formed.
  • the sacrificial substrate C is formed to have a predetermined thickness by electroplating copper (Cu) or by depositing other metals.
  • the sacrificial substrate C uses a metal having an etch ratio with respect to the bump since it is provided during the process to form the bottom bump and is later removed.
  • the sacrificial substrate C is formed using copper (Cu).
  • the copper Cu may be formed by electroplating or electroless plating.
  • a part of the sacrificial substrate C is removed to form bump grooves Ch having a predetermined depth at regular intervals.
  • a portion of the sacrificial substrate C may be etched using a mask or a portion of the sacrificial substrate C may be removed using a laser.
  • the predetermined interval may be changed according to the design of the bottom bump 520.
  • a seed bump 522 having a predetermined thickness is formed in the bump groove Ch.
  • the nickel (Ni) may be deposited to form the seed bump 522.
  • the bottom bump 520 is plated using the seed bump 522. As described above, the bottom bump 520 may use the metal plate bump 520a.
  • stud bumps are formed on the inner surface of the bottom bump 520 using wire bonding.
  • the stud bumps are wire-bonded to the plate bumps 520a.
  • a bottom PCB film 510 including the hole pads 502 at the above intervals is prepared.
  • the plate bump 520a is then exposed out of the hole pad 502 and the stud passes through the hole pad 502.
  • the stud is pressed and fastened to the hole pad 502.
  • various patterns are formed by using a press in a subsequent process so that the conductive balls can be stably seated, and electrical contact characteristics can be enhanced.
  • the sacrificial substrate C is removed to provide a bottom PCB film 510 including the plate bumps 520a.
  • the sacrificial substrate C including copper (Cu) is easily etched by the etching solution because the etching ratio is higher than that of the seed bump 522 including nickel (Ni) or the plate bump 520a including gold (Au). Can be removed.
  • an insulating silicon rubber 530 having a through hole 524 is separately prepared, and the insulating silicon rubber 530 is attached to the bottom PCB film 510.
  • the insulating silicone rubber 530 may be previously patterned into a predetermined shape using a mold.
  • the conductive silicon rubber 540 is filled in the through hole 524 to form a plate bump 520a and a connector.
  • the conductive silicone rubber 540 is completed by filling and curing the conductive liquid silicone rubber at a predetermined pressure in the through hole 524.
  • the top PCB film 552 is attached on the insulating silicon rubber 530 to complete the test socket.
  • a double-sided adhesive film may be interposed between the top PCB film 552 and the insulating silicone rubber 530.
  • a recess may be formed around each bump for individual contact of the top PCB film 552 and filled with a soft silicone rubber in the recess to eliminate interference between adjacent bumps.
  • the present invention can be used to inspect the electrical characteristics before shipping the semiconductor device manufactured through the semiconductor package manufacturing process.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne une prise d'essai qui comprend : un premier film de carte de circuits imprimés (PCB) ayant une pluralité de premières pastilles; un premier fil conducteur lié à des premières surfaces des premières pastilles; du caoutchouc silicone isolant disposé sur le premier film de PCB, ayant une pluralité de trous traversants formés pour correspondre au premier fil conducteur, et ayant le premier fil conducteur chargé dans les trous traversant; un second film de PCB sur le caoutchouc silicone isolant et ayant une pluralité de secondes pastilles formés sur ce dernier; un second fil conducteur lié à des premières surfaces des secondes pastilles; et du caoutchouc silicone conducteur remplissant les trous traversants et connectant électriquement les premier et second fils conducteurs.
PCT/KR2016/007185 2015-11-12 2016-07-04 Prise d'essai comprenant un fil conducteur en caoutchouc silicone conducteur, et son procédé de fabrication WO2017082510A1 (fr)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
KR10-2015-0159188 2015-11-12
KR1020150159188A KR101708487B1 (ko) 2015-11-12 2015-11-12 도전 실리콘 고무 안에 더블 도전 와이어를 포함하는 테스트 소켓, 및 그 제조 방법
KR10-2016-0032394 2016-03-17
KR1020160032394A KR101735516B1 (ko) 2016-03-17 2016-03-17 러버 범프를 포함하는 테스트 소켓 및 그 제조 방법
KR1020160032412A KR101735521B1 (ko) 2016-03-17 2016-03-17 스터드 범프를 포함하는 테스트 소켓 및 그 제조 방법
KR10-2016-0032392 2016-03-17
KR1020160032391A KR101726399B1 (ko) 2016-03-17 2016-03-17 바텀 메탈 플레이트 범프를 포함하는 테스트 소켓 및 그 제조 방법
KR10-2016-0032391 2016-03-17
KR1020160032392A KR101735520B1 (ko) 2016-03-17 2016-03-17 탑 메탈 플레이트 범프를 포함하는 테스트 소켓 및 그 제조 방법
KR10-2016-0032412 2016-03-17

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Publication Number Publication Date
WO2017082510A1 true WO2017082510A1 (fr) 2017-05-18

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PCT/KR2016/007185 WO2017082510A1 (fr) 2015-11-12 2016-07-04 Prise d'essai comprenant un fil conducteur en caoutchouc silicone conducteur, et son procédé de fabrication

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CN111830291A (zh) * 2019-04-17 2020-10-27 株式会社Isc 适用于极低温的测试连接器
EP3669195A4 (fr) * 2017-11-07 2020-11-18 Leeno Industrial Inc. Ensemble sonde de test et prise de test
CN116061385A (zh) * 2023-03-15 2023-05-05 杭州芯云半导体技术有限公司 一种高电流释放测试座的制造方法及测试座

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JPH11273819A (ja) * 1997-12-26 1999-10-08 Unitechno Kk 電子部品用接触子
US6407563B2 (en) * 1999-03-12 2002-06-18 Oki Electric Industry Co, Ltd. Semiconductor device test apparatus
KR20060072916A (ko) * 2004-12-24 2006-06-28 주식회사 파이컴 감지용 프로브를 포함하는 프로브 카드 제작 방법 및 그프로브 카드, 프로브카드 검사 시스템
KR20110002584A (ko) * 2009-07-02 2011-01-10 남재우 반도체소자 테스트에 사용되는 ｍｅｍｓ 기술로 제조한 테스트 소켓
US20130069683A1 (en) * 2011-09-15 2013-03-21 Taiwan Semiconductor Manufacturing Co., Ltd. Test probe card

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JPH11273819A (ja) * 1997-12-26 1999-10-08 Unitechno Kk 電子部品用接触子
US6407563B2 (en) * 1999-03-12 2002-06-18 Oki Electric Industry Co, Ltd. Semiconductor device test apparatus
KR20060072916A (ko) * 2004-12-24 2006-06-28 주식회사 파이컴 감지용 프로브를 포함하는 프로브 카드 제작 방법 및 그프로브 카드, 프로브카드 검사 시스템
KR20110002584A (ko) * 2009-07-02 2011-01-10 남재우 반도체소자 테스트에 사용되는 ｍｅｍｓ 기술로 제조한 테스트 소켓
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3669195A4 (fr) * 2017-11-07 2020-11-18 Leeno Industrial Inc. Ensemble sonde de test et prise de test
US11639945B2 (en) 2017-11-07 2023-05-02 Leeno Industrial Inc. Test probe assembly and test socket
CN111830291A (zh) * 2019-04-17 2020-10-27 株式会社Isc 适用于极低温的测试连接器
CN111830291B (zh) * 2019-04-17 2023-04-07 株式会社Isc 适用于极低温的测试连接器
CN116061385A (zh) * 2023-03-15 2023-05-05 杭州芯云半导体技术有限公司 一种高电流释放测试座的制造方法及测试座

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