WO2023246434A1 - 一种显示基板、显示装置 - Google Patents

一种显示基板、显示装置 Download PDF

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Publication number
WO2023246434A1
WO2023246434A1 PCT/CN2023/096939 CN2023096939W WO2023246434A1 WO 2023246434 A1 WO2023246434 A1 WO 2023246434A1 CN 2023096939 W CN2023096939 W CN 2023096939W WO 2023246434 A1 WO2023246434 A1 WO 2023246434A1
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WO
WIPO (PCT)
Prior art keywords
area
display
bank
layer
display area
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Application number
PCT/CN2023/096939
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English (en)
French (fr)
Inventor
刘莹
张波
金鑫
范磊
范春芳
柳菲
李良云
任秦博
高营昌
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Publication of WO2023246434A1 publication Critical patent/WO2023246434A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present application relates to the field of display technology, and in particular, to a display substrate and a display device.
  • OLED Organic Light Emitting Diode, organic light emitting diode
  • Dams, metal lines, etc. can be set in the non-display area.
  • a display substrate in one aspect, includes: a display area and a non-display area surrounding the display area.
  • the non-display area includes a first bank area, and the first bank area surrounds the display area. set up;
  • the first bank area includes a bank and at least one blocking unit located on a side of the bank away from the display area, the bank and the blocking unit are provided at least in part of the first bank area, and the blocking unit Cell patterning.
  • the first dam area includes one of the dams.
  • the non-display area further includes a driving circuit area, the driving circuit area is located on a side of the first bank area away from the display area;
  • the bank and the blocking unit are provided at least on a side of the first bank area close to the driving circuit area.
  • the dam and the blocking unit are provided throughout the first dam area and around the display area.
  • the blocking unit adjacent to the embankment among at least one of the blocking units is connected to the embankment.
  • each blocking unit includes patterned protrusions.
  • the non-display area further includes a substrate, and the patterned protrusions are provided on the substrate;
  • the protrusion includes a first flat portion and/or a first pixel defining portion.
  • the first flat portion is patterned
  • the first pixel defining portion is patterned.
  • the protrusion includes the first flat portion and the first pixel definition portion
  • the protrusion includes the first flat portion and the first pixel definition portion that are stacked on the substrate in sequence.
  • Pixel definition part the first flat part is patterned and/or the first pixel definition part is patterned.
  • the non-display area further includes an encapsulation layer disposed on a side of the patterned protrusion away from the substrate, and the encapsulation layer covers the protrusion.
  • the first dam area includes two blocking units.
  • the shape of the orthographic projection of the patterned protrusions in a direction perpendicular to the substrate includes a planar shape or an annular shape.
  • the bank region includes a plurality of patterned protrusions, and at least part of the Adjacent patterned protrusions are connected.
  • the height range of the patterned protrusions along a cross section perpendicular to the substrate includes 1.5-3 ⁇ m.
  • the width range of the orthographic projection of the patterned protrusions in the direction perpendicular to the substrate includes 11-25 ⁇ m.
  • the width of the annular inner ring is along a direction parallel to the substrate. Range includes 5-15 ⁇ m.
  • the non-display area also includes a crack dam area surrounding the The first dam area is set and disconnected in the driving circuit area;
  • the crack dam region includes at least one groove disposed around the first dam region and interrupted at the drive circuit region.
  • the non-display area further includes: a buffer layer, a gate insulating layer and an interlayer dielectric layer that are stacked in sequence; the interlayer dielectric layer, the gate insulating layer and the buffer layer are all located on the display area, the first dam area and the crack dam area;
  • the groove penetrates at least the portion of the interlayer dielectric layer located in the crack bank area.
  • the display substrate further includes: a substrate and a driving unit and a touch unit provided on the substrate;
  • the driving unit is located in the display area, and the touch unit is located in the display area and the non-display area and covers the driving unit.
  • the touch unit includes a first touch layer, a first insulating layer, a second touch layer and a second insulating layer that are sequentially stacked on the driving unit; the first touch The touch layer and the second touch layer are both located in the display area, and the first insulating layer and the second insulating layer are located in the display area and the non-display area;
  • one of the first touch layer and the second touch layer is a metal mesh electrode layer, and the other is a bridge metal layer.
  • a display device including the above display substrate.
  • Figure 1 is a schematic structural diagram of a related technology display substrate
  • Figure 2 is the Ink cutoff diagram of a related technology
  • Figure 3 is the Ink cutoff diagram of another related technology
  • Figure 4 is a top view of a display substrate provided by an embodiment of the present application.
  • Figure 5 is a schematic structural diagram of a display substrate provided by an embodiment of the present application.
  • Figure 6 is a partial structural schematic diagram of a display substrate provided by an embodiment of the present application.
  • Figure 7 is a partial structural schematic diagram of a display substrate provided by another embodiment of the present application.
  • Figure 8 is a partial structural schematic diagram of a display substrate provided by yet another embodiment of the present application.
  • Figure 9 is a cross-sectional view of a patterned protrusion provided by an embodiment of the present application.
  • Figure 10 is a schematic structural diagram of a display substrate provided by another embodiment of the present application.
  • Figure 11 is a schematic structural diagram of a touch unit and an anti-static layer provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of a touch unit provided by an embodiment of the present application.
  • the orientation or positional relationship indicated by the terms "on” and the like is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply what is meant. Devices or elements must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limiting.
  • OLED display devices have become a very popular emerging display product at home and abroad. This is Because OLED display devices have the advantages of self-illumination, wide viewing angle, short response time, high luminous efficiency, wide color gamut, and low operating voltage.
  • FIG. 1 shows a partial structure of an OLED display device in the related art.
  • the OLED display device includes a display area AA and a non-display area BB connected to the display area AA.
  • the non-display area BB includes a PI (Polyimide, polyimide) layer 1, and the PI layer 1 is stacked in sequence.
  • an IJP (Ink Jet Printing) layer 10 is usually provided on the first CVD layer 9.
  • the material of the IJP layer 10 is an organic material, such as Ink (ink).
  • a second CVD layer (not shown in the figure) is formed on the IJP layer 10, so that the OLED display device is packaged through the first CVD layer 9, the IJP layer 10 and the second CVD layer.
  • a Dam (dam) structure is usually used to fix the Ink within a certain spatial range, thereby avoiding the Overflow problem of the Ink.
  • Related technologies often use a double Dam structure (Dam1 and Dam2 shown in Figure 1) to block Ink. This is because it is usually hoped that Ink will be cut off within Dam1.
  • Dam1 can completely block Ink from overflow.
  • Ink often crosses Dam1 due to process fluctuations.
  • the Overflow ends in Dam2 after passing through Dam2 (generally, Ink after passing through two Dams will basically not overflow Dam2).
  • two Dams are often set up to prevent Ink from overflowing.
  • Dam1 close to the display area AA blocks most of the Ink, and Dam2 far away from the display area AA acts as an insurance.
  • an embodiment of the present application provides a display substrate, as shown in Figure 4,
  • the display substrate includes: a display area AA and a non-display area surrounding the display area AA.
  • the non-display area includes a first bank area BB1, and the first bank area BB1 is arranged around the display area AA.
  • the first bank area BB1 includes a bank 30 and at least one blocking unit 31 located on the side of the bank 30 away from the display area AA.
  • the bank 30 and the blocking unit 31 are provided at least in part of the first bank area BB1 , and the blocking unit 31 is patterned.
  • the above-mentioned display substrate may be an OLED display substrate, and the specific type of the display substrate is not limited here.
  • the above-mentioned display area is also called the active display area (Active Area; AA area for short), which refers to the area where multiple pixels are set for display; the non-display area is generally used to set drive wiring, drive circuits, etc., such as: GOA (Gate Driver on Array, array substrate row drive) drive circuit.
  • the non-display area is an annular area surrounding the display area, which matches the shape of the display area.
  • the shape of the display area is rectangular, and the shape of the non-display area is a rectangular ring; the shape of the display area is circular, and the shape of the non-display area is circular.
  • the shape is circular.
  • the above-mentioned first dam area includes a dam and at least one blocking unit.
  • the dams and blocking units here are configured to prevent ink from overflowing when organic layers such as organic light-emitting functional layers and organic encapsulation layers are formed by inkjet printing, so that the above-mentioned dams and blocking units can solve the problem of ink overflowing when forming organic layers by inkjet printing. Problems with water vapor and oxygen intrusion.
  • the first dam area may include a blocking unit; or, in order to better improve the effect of preventing ink overflow and achieve a narrower frame,
  • the above-mentioned first bank area may include two barrier units.
  • the first bank area may also include more than three barrier units, which is specifically determined by the amount of organic material of the organic layer of the display substrate, the width of the non-display area, etc.
  • FIG. 5 illustrates an example in which the first dam area includes three blocking units 31 . In this case, while achieving a narrower frame of the display substrate, it can also ensure that the organic material in the organic layer does not overflow.
  • each of the above-mentioned blocking units may have a single-layer structure; or, each of the above-mentioned blocking units may have a multi-layer structure.
  • FIG. 5 illustrates an example in which each blocking unit includes a patterned first pixel definition portion 312 .
  • the first dam area may include one dam; or, in order to improve the effect of preventing ink spillage, the first dam area may include multiple dams, such as two dams.
  • FIG. 5 takes the first dam area including a dam 30 as an example. At this time, the dam 30 can block the organic encapsulation layer 20 and effectively achieve a narrower frame.
  • FIG. 5 illustrates an example in which the bank 30 includes a second flat portion 301 and a second pixel definition portion 302 that are stacked in sequence.
  • the above-mentioned embankments and at least one blocking unit are disposed in at least part of the first embankment area.
  • the above-mentioned embankments and at least one blocking unit can be disposed in part of the first embankment area, that is, around the display area.
  • Part of the area AA is provided; or, in order to achieve a better ink overflow prevention effect and achieve a narrower frame in the entire non-display area, the above-mentioned banks and at least one blocking unit can be disposed in the entire first bank area, that is, surrounding Display area AA circle setting.
  • FIG. 4 shows an example in which the above-mentioned one bank 30 and one blocking unit 31 are arranged around the display area AA;
  • FIG. 5 shows that the above-mentioned one bank 30 and three blocking units 31 are arranged in the first bank area close to the driving circuit area.
  • One side is shown as an example. At this time, a narrower frame can be achieved on the side of the first bank area close to the driving circuit area.
  • the above-mentioned patterning of the barrier unit refers to forming the required barrier unit through exposure through a patterning process.
  • the patterning process here includes processes such as masking, exposure, development, etching, and stripping.
  • Embodiments of the present application provide a display substrate.
  • the display substrate includes: a display area and a non-display area surrounding the display area.
  • the non-display area includes a first bank area, and the first bank area is arranged around the display area; the first bank area includes a bank.
  • at least one barrier unit located on the side of the first bank area away from the display area, the bank and the barrier unit are provided at least in part of the first bank area, and the barrier unit is patterned.
  • This can more effectively shorten the width of the non-display area to achieve narrower borders, thereby greatly increasing the screen-to-body ratio.
  • the display substrate shown in Figure 5 is taken as an example to illustrate the principle of achieving a narrower frame.
  • the display substrate includes a dam 30.
  • the display substrate also includes three patterned blocking units 31. Since the blocking units 31 are patterned, they must It occupies much less space than Dam, and the edges of the patterned barrier unit 31 are irregular. If a small amount of organic material in the organic encapsulation layer 20 still overflows the dam 30, the edge of the patterned barrier unit 31 can further block the organic material. Then, on the basis of better preventing organic materials from overflowing, the display substrate of the present application can also achieve a narrower frame, thereby increasing the screen-to-body ratio and providing a better user experience.
  • the first dam area includes a dam. .
  • the location of the above-mentioned dam in the first dam area is not specifically limited here.
  • the above-mentioned one bank can be disposed in part of the first bank area, that is, it is disposed around part of the display area AA; or, the above-mentioned one bank can be disposed in the entire first bank area, that is, it is disposed in a circle around the display area AA.
  • Figure 4 takes the above-mentioned one bank 30 being arranged around the display area AA as an example;
  • Figure 5 shows the above-mentioned one bank 30 being arranged on the side of the first bank area close to the driving circuit area. At this time, the first bank area can be made close to the driving circuit area. Narrow bezels are achieved on one side of the circuit area.
  • the above-mentioned embankment may be a single-layer structure; or the above-mentioned embankment may be a multi-layer structure.
  • FIG. 5 illustrates an example in which the bank 30 includes a second flat portion 301 and a second pixel definition portion 302 that are stacked in sequence.
  • the non-display area also includes a driving circuit area BB2.
  • the driving circuit area BB2 is located on the side of the first bank area BB1 away from the display area AA.
  • the bank 30 and the blocking unit 31 are provided at least on a side of the first bank area close to the driving circuit area. Therefore, at least one side of the driving circuit area of the display substrate can achieve a narrower frame, and the manufacturing process can be simplified, which is more conducive to actual production and application, and is simple and easy to implement.
  • the above-mentioned drive circuit area is also called a fanout area, which is an area where drive circuits, leads, etc. are installed.
  • the above-mentioned banks and blocking units are provided at least on the side of the first dam area close to the driving circuit area.
  • the above-mentioned banks and blocking units can be provided only on the side of the first bank area close to the driving circuit area.
  • only the display substrate can be to achieve a narrower frame on the side of the driving circuit area;
  • the above-mentioned dams and blocking units can be provided on the side of the first dam area close to the driving circuit area, and on the side of the first dam area not close to the driving circuit area,
  • the above-mentioned embankments and blocking units can be provided in the entire first embankment area, in which case the entire display substrate can achieve a narrower frame.
  • FIG. 5 illustrates an example in which the bank 30 and the blocking unit 31 are only disposed on the side of the first bank area close to the driving circuit area.
  • the display substrate further includes a substrate 11 and a first gate line layer 12 , a first insulating layer 13 , a second gate line layer 14 , a second insulating layer 15 , and are sequentially stacked on the substrate 11 .
  • the source and drain wiring layer 16 and the interlayer dielectric layer 17 only the content related to the invention is introduced here. The rest of the structure can be obtained by referring to related technologies, and will not be described in detail here.
  • the dam 30 and the blocking unit 31 are provided in the entire first dam area and around the display area.
  • FIG. 4 illustrates an example in which the above-mentioned one bank 30 and one blocking unit 31 are arranged around the display area AA.
  • the number of the above-mentioned blocking units can also be multiple, which shall be determined by the actual application.
  • At least one blocking unit adjacent to the embankment is connected to the embankment.
  • the blocking units other than the blocking units adjacent to the embankment may be arranged adjacent to the blocking units adjacent to the embankment; or, the blocking units other than the blocking units adjacent to the embankment may be arranged adjacent to the blocking units adjacent to the embankment.
  • the blocking unit adjacent to the embankment in at least one blocking unit can also be spaced apart from the embankment.
  • Figure 5 takes the blocking unit 31 and the embankment 30 as being spaced apart, and the adjacent blocking units 31 are all spaced apart as an example. Show. There is no specific limit on the distance between the blocking unit adjacent to the embankment and the embankment, as long as the distance is smaller than the distance between Dam1 and Dam2 in the related art.
  • each blocking unit includes patterned protrusions. This manufacturing process is more convenient, simple and easy to implement.
  • the specific structure of the patterned protrusions is not limited here.
  • the above-mentioned patterned protrusions may include a single-layer structure, such as a layer of flat portions or a layer of pixel-defining portions; or the above-mentioned patterned protrusions may include a multi-layer structure, such as including flat portions stacked in sequence. and pixel definition department, etc.
  • FIG. 5 illustrates an example in which each patterned protrusion includes a first pixel definition portion 312 .
  • the height of the above-mentioned protrusion in the direction perpendicular to the substrate is not specifically limited here.
  • the height range of the above-mentioned protrusion along the direction perpendicular to the substrate may include 1.5-3 ⁇ m.
  • the width of the above-mentioned protrusion in the direction parallel to the substrate may include 11-25 ⁇ m.
  • the shape of the above-mentioned protrusions is not specifically limited here.
  • the above-mentioned protrusions may include rhombus pillars, cylinders, cylindrical rings, etc.
  • the non-display area also includes a substrate 11 , and patterned protrusions are provided on the substrate 11 ; the protrusions include a first flat part and/or a first pixel defining part 312 .
  • the protrusions can be patterned while making the flat layer and/or the pixel definition layer, which is simple and easy to implement.
  • the material of the substrate is not limited here, and it may include rigid materials, such as glass; or it may also include flexible materials, such as polyimide (PI).
  • rigid materials such as glass
  • flexible materials such as polyimide (PI).
  • the material of the first flat portion is not specifically limited here.
  • the material of the first flat portion may include organic materials.
  • the material of the first flat portion may include any one of thermally cured polyimide materials, epoxy materials, and acrylic materials.
  • the material of the first pixel definition part is not specifically limited here.
  • the material of the first pixel definition part may include an organic material.
  • the material of the first pixel definition part may include any one of thermally cured polyimide materials, epoxy materials, and acrylic materials.
  • the present application provides the first patterned raised structure.
  • the first flat part is patterned.
  • the blocking unit only includes one layer of structure, which is more conducive to achieving a narrower frame.
  • the present application provides a second structure of patterned protrusions.
  • the protrusion includes the first pixel defining portion 312, A pixel definition portion 312 is patterned.
  • the blocking unit only includes one layer of structure, which is more conducive to achieving a narrower frame.
  • the present application provides a third patterned raised structure.
  • the protrusion includes a first flat portion and a first pixel defining portion
  • the protrusion includes a first flat portion and a first pixel defining portion that are sequentially stacked on the substrate, and the first flat portion is patterned .
  • the present application provides a fourth patterned raised structure.
  • the protrusion includes a first flat portion and a first pixel defining portion
  • the protrusion includes a first flat portion and a first pixel defining portion that are sequentially stacked on the substrate, and the first pixel defining portion pattern change.
  • the present application provides a fifth patterned raised structure.
  • the protrusion includes a first flat portion and a first pixel defining portion that are sequentially stacked on the substrate, and the first flat portion is patterned and the first pixel defining portion is patterned.
  • the non-display area also includes a packaging unit disposed on the side of the patterned protrusion away from the substrate 11 , and the packaging unit covers the protrusion.
  • a packaging unit disposed on the side of the patterned protrusion away from the substrate 11 , and the packaging unit covers the protrusion.
  • the above-mentioned packaging unit may include a single-layer structure, for example, it may include a layer of first inorganic encapsulation layer 19 as shown in FIG.
  • the above-mentioned encapsulation unit may include a multi-layer structure, For example, it may include a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer that are stacked in sequence, wherein the first inorganic encapsulation layer and the second inorganic encapsulation layer are configured to encapsulate the first dam region; the organic encapsulation layer is in the first The dyke area is disconnected.
  • first inorganic encapsulation layer and the second inorganic encapsulation layer are not limited.
  • the materials of the first inorganic encapsulation layer and the second inorganic encapsulation layer may include any one of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON) or aluminum oxide (AlOx).
  • the above-mentioned first inorganic encapsulation layer and the second inorganic encapsulation layer can be formed by a chemical vapor deposition process, but are not limited thereto, or they can also be formed by a physical vapor deposition process.
  • the organic encapsulation layer can be produced using an inkjet printing process, but is not limited to this, or a spraying process can also be used. In the process of making the organic encapsulation layer, since the organic encapsulation material has a certain fluidity, it is necessary to set up a dam and a blocking unit in the first dam area to prevent the organic encapsulation material from overflowing, thereby avoiding the problem of encapsulation failure.
  • the first dam area includes two blocking units.
  • the structures of the above two blocking units may be the same, for example, both include a single-layer structure or both include a multi-layer structure; or, the structures of the above-mentioned two barrier units may be different, for example, one barrier unit may include a single-layer structure, and the other may include a multi-layer structure.
  • the barrier unit includes a multi-layer structure.
  • the shape of the orthographic projection of the patterned protrusions in the direction perpendicular to the substrate includes a planar shape or an annular shape.
  • the specific shape of the orthographic projection of the above-mentioned protrusion in the direction perpendicular to the substrate is not limited here.
  • the specific shape of the orthographic projection of the above-mentioned patterned protrusions in the direction perpendicular to the substrate may include a single regular figure, such as a rhombus or rhombus ring, a rectangular or rectangular ring, a circle or annular ring, a triangle or a triangular ring, Ellipse or elliptical ring, etc.; alternatively, the specific shape of the orthographic projection of the above-mentioned patterned protrusions in the direction perpendicular to the substrate may include a combination of various regular graphics, such as a combination of rhombus rings and rectangular rings, circular rings and ellipses.
  • Figure 6 uses the shape of the orthographic projection of the above-mentioned protrusion in the direction perpendicular to the substrate to include a diamond ring
  • Figure 7 uses the shape of the above-mentioned protrusion as the orthographic projection in the direction perpendicular to the substrate to include a circular ring
  • Figure 8 uses the shape of the above-mentioned protrusion to form a circular ring
  • the shape of the orthographic projection in the direction perpendicular to the substrate includes a rectangular ring as an example.
  • the bank region includes a plurality of patterned protrusions, and at least Some adjacent patterned bumps are connected.
  • the patterned raised edges prevent ink from overflowing, but if the ink overflows over the patterned raised edges, the raised hollow ring can further prevent ink from overflowing, which is effective in many aspects. Block ink spills.
  • connection of at least some adjacent patterned protrusions means that part of the adjacent patterned protrusions are connected; or, all adjacent patterned protrusions are connected.
  • Figures 6 to 8 all illustrate the connection of some adjacent patterned protrusions as an example.
  • the pattern formed by connecting at least some adjacent patterned protrusions there is no specific limitation on the pattern formed by connecting at least some adjacent patterned protrusions.
  • at least part of the connected pattern of adjacent patterned protrusions may be a regular pattern, such as a rectangular ring, a diamond ring, etc.; or, at least part of the connected pattern of adjacent patterned protrusions may be an irregular pattern.
  • Figures 6 to 8 all illustrate an example in which the pattern formed by connecting some adjacent patterned protrusions is an irregular pattern.
  • the positions of the connected partially adjacent patterned protrusions and the banks are not specifically limited.
  • the connected portions of adjacent patterned protrusions can be disposed adjacent to banks, in which case the connected portions of adjacent patterned protrusions can be connected to/spaced apart from the banks; or, the connected portions of adjacent patterned protrusions can be disposed adjacent to banks.
  • Other patterned protrusions can also be provided between the protrusions and the banks.
  • the positions of all the connected adjacent patterned protrusions and the banks are not specifically limited.
  • all connected adjacent patterned protrusions are arranged at intervals from the banks; or, all connected adjacent patterned protrusions are arranged connected to the banks.
  • the height d3 of the patterned protrusions along the cross section perpendicular to the substrate ranges from 1.5 to 3 ⁇ m.
  • the height of Dam2 along the cross section perpendicular to the substrate is relatively high, often higher than the height of Dam1 along the cross section perpendicular to the substrate, so this application sets the height range of the patterned protrusions along the cross section perpendicular to the substrate. Including 1.5-3 ⁇ m, so that the height of the blocking unit along the cross section perpendicular to the substrate is lower than the height of the embankment to better achieve a narrow frame.
  • the height range of the patterned protrusions along the cross section perpendicular to the substrate may include 1.5 ⁇ m, 2 ⁇ m, 2.5 ⁇ m, or 3 ⁇ m, etc.
  • the orthographic projection width (d1+2d2) of the patterned protrusions in the direction perpendicular to the substrate ranges from 11 to 25 ⁇ m.
  • the width of the orthographic projection of Dam2 in the direction perpendicular to the substrate is wider, often larger than the width of the orthographic projection of Dam1 in the direction perpendicular to the substrate, so this application sets the patterned protrusions in the direction perpendicular to the substrate.
  • the width range of the orthographic projection includes 11-25 ⁇ m, so that the width of the orthographic projection of the blocking unit in the direction perpendicular to the substrate is smaller than the width of the embankment, and even smaller than the width of the orthographic projection of Dam2 in the direction perpendicular to the substrate in the related art, and more Nice implementation of narrow borders.
  • the width range of the orthographic projection of the patterned protrusions in the direction perpendicular to the substrate may include 11 ⁇ m, 15 ⁇ m, 20 ⁇ m, or 25 ⁇ m, etc.
  • the width d1 of the ring-shaped inner ring along the direction parallel to the substrate ranges Includes 5-15 ⁇ m.
  • the width of the orthographic projection of the blocking unit in the direction perpendicular to the substrate is smaller to better realize a narrow frame.
  • the width range of the above-mentioned annular inner ring along the direction parallel to the substrate may include 5 ⁇ m, 8 ⁇ m, 11 ⁇ m, or 15 ⁇ m, etc.
  • the range of d2 includes 3-5 ⁇ m, and may specifically be 3 ⁇ m, 4 ⁇ m or 5 ⁇ m.
  • the non-display area also includes a crack bank area BB3.
  • the crack bank area BB3 is arranged around the first bank area BB1 and is disconnected in the drive circuit area BB2; the crack bank area BB3
  • the area BB3 includes at least one groove, which is provided around the first bank area BB1 and is interrupted in the drive circuit area BB2.
  • the crack bank area BB3 includes at least one groove 33.
  • the groove 33 is arranged around the first bank area BB1 and is disconnected in the driving circuit area BB2.
  • FIG. 10 takes three grooves 33 arranged at continuous intervals as an example.
  • This groove can reduce and disperse the stress generated during cutting, thereby reducing the risk of cracks during cutting, so the groove can also be called Crack Dam.
  • the depth of the groove along the direction perpendicular to the substrate is not limited and can be determined according to actual conditions.
  • the disconnection position of the groove corresponds to the drive circuit area (fanout area) on the bending area; If the drive circuit area adopts a non-pad bending structure, the disconnection position of the groove corresponds to the pad area (binding area).
  • the non-display area also includes: a buffer layer 21 , a gate insulating layer 22 and an interlayer dielectric layer 17 that are stacked in sequence; an interlayer dielectric layer 17 , a gate insulating layer 22 and a buffer layer 21 All three are located in the display area AA, the first bank area BB1 and the crack bank area BB3; the groove at least penetrates the part of the interlayer dielectric layer 17 located in the crack bank area BB3.
  • the groove 33 can only penetrate the part of the interlayer dielectric layer 17 located in the crack bank area BB3 as shown in FIG. 10; or the groove can also penetrate both the interlayer dielectric layer and the gate insulating layer located in the crack bank. part of the crack dam area; alternatively, the groove may also penetrate the parts of the interlayer dielectric layer, gate insulating layer and buffer layer located in the crack dam area, which is not limited here.
  • the display substrate also includes: a substrate 11 and a driving unit 40 and a touch unit 41 provided on the substrate 11 ; the driving unit 40 is located in the display area AA, and the touch unit 41 is located in the display area. AA and non-display area BB, and cover the driving unit 40 .
  • the touch unit may adopt a mutual capacitive touch structure or a self-capacitive touch structure.
  • the mutual capacitive touch structure or the self-capacitive touch structure can be obtained according to relevant technologies and will not be described in detail here.
  • the touch unit 41 includes a first touch layer 411 , a first insulation layer 412 , a second touch layer 413 and a second insulation layer that are sequentially stacked on the driving unit 40 414;
  • the first touch layer 411 and the second touch layer 413 are both located in the display area AA, and the first insulating layer 412 and the second insulating layer 414 are located in the display area AA and the non-display area BB; wherein, the first touch layer 411 and the second touch layer 413 are located in the display area AA and the non-display area BB.
  • One of the control layer 411 and the second touch layer 413 is a metal grid electrode layer, and the other is a bridge metal layer.
  • the first touch layer may be a metal grid electrode layer, and the second touch layer may be a bridging metal layer; or the first touch layer may be a bridging metal layer, and the second touch layer may be Metal grid electrode layer. In order to get better touch effect, you can choose the latter.
  • the metal grid electrode layer 415 may include a driving electrode (TX electrode) 4151 and a sensing electrode (RX electrode) 4152.
  • TX electrode driving electrode
  • RX electrode sensing electrode
  • Each column of driving electrodes 4151 is directly connected and electrically connected to the touch driving unit 416 through a TX line.
  • Each row of sensing electrodes 4152 is electrically connected to the bridge metal layer through via holes penetrating the first insulating layer, and is electrically connected to the touch driving unit 416 through the RX line.
  • the metal grid electrode layer 415 can be located in the display area, and the TX line, RX line, and touch driving unit can be located in the non-display area.
  • the structure of the touch unit belongs to the FMLOC (Flexible Multi-Layer On Cell, flexible multi-layer structure) touch structure, which can reduce the thickness of the screen, thereby facilitating folding; at the same time, there is no fit tolerance, which can reduce the frame width; in addition, it can also reduce the risk of cracks.
  • FMLOC Flexible Multi-Layer On Cell, flexible multi-layer structure
  • the material of the first insulating layer and the second insulating layer may be any one of silicon nitride, silicon oxide, or silicon oxynitride.
  • the display substrate provided by the embodiments of the present application can more effectively shorten the width of the non-display area to achieve a narrower frame, thereby greatly increasing the screen-to-body ratio.
  • An embodiment of the present application also provides a display device, including the above display substrate.
  • the above-mentioned display device may be a display device with a touch function, or a display device with a folding or curling function, or a display device with both a touch function and a folding function, which is not limited here.
  • the display device may be a flexible display device (also called a flexible screen) or a rigid display device (ie, a display screen that cannot be bent), which is not limited here.
  • the above-mentioned display device may be an OLED display device, a Micro LED display device or a Mini LED display device.
  • the above-mentioned display device can be any product or component with a display function such as a television, a digital camera, a mobile phone, a tablet computer, etc.; the above-mentioned display device can also be used in fields such as identity recognition, medical equipment, etc.
  • Products that have been promoted or have good promotion prospects include Security identity authentication, smart door locks, medical image collection, etc.
  • the display device has the advantages of very narrow frame, good packaging effect, low cost, good display effect, long life, high stability, high contrast, good imaging quality, and high product quality. point.
  • an embodiment means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application.

Abstract

本申请提供了一种显示基板、显示装置，涉及显示技术领域，该显示基板可以有效缩短非显示区的宽度，以实现窄边框，进而提高屏占比。该显示基板包括：显示区和围绕所述显示区的非显示区，所述非显示区包括第一堤坝区，所述第一堤坝区环绕所述显示区设置；所述第一堤坝区包括堤坝、以及位于所述堤坝远离所述显示区一侧的至少一个阻挡单元，所述堤坝和所述阻挡单元至少设置在部分所述第一堤坝区、且所述阻挡单元图案化。

Description

一种显示基板、显示装置
相关申请的交叉引用
本申请要求在2022年06月20日提交中国专利局、申请号为202210698193.7、发明名称为“一种显示基板、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示基板、显示装置。
背景技术
随着科技的发展，OLED(Organic Light Emitting Diode，有机发光二极管)显示装置受到越来越广泛的应用。堤坝、金属线等均可以设置在非显示区。
发明内容
本申请的实施例采用如下技术方案：
一方面，提供了一种显示基板，该显示基板包括：显示区和围绕所述显示区的非显示区，所述非显示区包括第一堤坝区，所述第一堤坝区环绕所述显示区设置；
所述第一堤坝区包括堤坝、以及位于所述堤坝远离所述显示区一侧的至少一个阻挡单元，所述堤坝和所述阻挡单元至少设置在部分所述第一堤坝区、且所述阻挡单元图案化。
可选的，所述第一堤坝区包括一个所述堤坝。
可选的，所述非显示区还包括驱动电路区，所述驱动电路区位于所述第一堤坝区远离所述显示区的一侧；
所述堤坝和所述阻挡单元至少设置在所述第一堤坝区靠近所述驱动电路区的一侧。
可选的，所述堤坝和所述阻挡单元设置在整个所述第一堤坝区、且围绕所述显示区设置。
可选的，至少一个所述阻挡单元中与所述堤坝相邻的所述阻挡单元，与所述堤坝相连。
可选的，各所述阻挡单元包括图案化的凸起。
可选的，所述非显示区还包括衬底，图案化的所述凸起设置在所述衬底上；
所述凸起包括第一平坦部和/或第一像素定义部。
可选的，在所述凸起包括所述第一平坦部的情况下，所述第一平坦部图案化；
或者，在所述凸起包括所述第一像素定义部的情况下，所述第一像素定义部图案化。
可选的，在所述凸起包括所述第一平坦部和所述第一像素定义部的情况下，所述凸起包括依次层叠设置在所述衬底上的第一平坦部和第一像素定义部，所述第一平坦部图案化和/或所述第一像素定义部图案化。
可选的，所述非显示区还包括设置在图案化的所述凸起远离所述衬底一侧的封装层，所述封装层覆盖所述凸起。
可选的，所述第一堤坝区包括两个所述阻挡单元。
可选的，图案化的所述凸起在垂直于所述衬底方向上的正投影的形状包括面状或者环状。
可选的，在图案化的所述凸起在垂直于所述衬底方向的正投影的形状包括环状的情况下，所述堤坝区包括多个图案化的所述凸起、且至少部分相邻图案化的所述凸起相连。
可选的，图案化的所述凸起沿垂直于所述衬底的截面的高度范围包括1.5-3μm。
可选的，图案化的所述凸起在垂直于所述衬底方向上的正投影的宽度范围包括11-25μm。
可选的，在图案化的所述凸起在垂直于所述衬底方向上的正投影的形状包括环状的情况下，所述环状的内环沿平行于所述衬底方向的宽度范围包括5-15μm。
可选的，所述非显示区还包括裂纹堤坝区，所述裂纹堤坝区围绕所 述第一堤坝区设置、且在所述驱动电路区断开；
所述裂纹堤坝区包括至少一个凹槽，所述凹槽围绕所述第一堤坝区设置、且在所述驱动电路区断开。
可选的，所述非显示区还包括：依次叠层设置的缓冲层、栅绝缘层和层间介质层；所述层间介质层、所述栅绝缘层和所述缓冲层三者均位于所述显示区、所述第一堤坝区和所述裂纹堤坝区；
所述凹槽至少贯通所述层间介质层位于所述裂纹堤坝区的部分。
可选的，所述显示基板还包括：衬底以及设置在所述衬底上的驱动单元和触控单元；
所述驱动单元位于所述显示区，所述触控单元位于所述显示区和所述非显示区、且覆盖所述驱动单元。
可选的，所述触控单元包括依次叠层设置在所述驱动单元之上的第一触控层、第一绝缘层、第二触控层和第二绝缘层；所述第一触控层和所述第二触控层均位于所述显示区，所述第一绝缘层和所述第二绝缘层位于所述显示区和所述非显示区；
其中，所述第一触控层和所述第二触控层两者中的一个为金属网格电极层，另一个为桥接金属层。
另一方面，提供了一种显示装置，包括上述的显示基板。
上述说明仅是本申请技术方案的概述，为了能够更清楚了解本申请的技术手段，而可依照说明书的内容予以实施，并且为了让本申请的上述和其它目的、特征和优点能够更明显易懂，以下特举本申请的具体实施方式。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一种相关技术的显示基板的结构示意图；
图2为一种相关技术的Ink截止图；
图3为另一种相关技术的Ink截止图；
图4为本申请实施例提供的一种显示基板的俯视图；
图5为本申请实施例提供的一种显示基板的结构示意图；
图6为本申请实施例提供的一种显示基板的局部结构示意图；
图7为本申请另一实施例提供的一种显示基板的局部结构示意图；
图8为本申请又一实施例提供的一种显示基板的局部结构示意图；
图9为本申请实施例提供的一种图案化的凸起的截面图；
图10为本申请另一实施例提供的一种显示基板的结构示意图；
图11为本申请实施例提供的一种触控单元和防静电层的结构示意图；
图12为本申请实施例提供的一种触控单元的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的实施例中，采用“第一”等字样对功能和作用基本相同的相同项或相似项进行区分，仅为了清楚描述本申请实施例的技术方案，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。
在本申请的实施例中，“至少一个”的含义是一个或一个以上，除非另有明确具体的限定。
在本申请的实施例中，术语“上”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
近年来，OLED显示装置成为国内外非常热门的新兴显示产品，这是 因为OLED显示装置具有自发光、广视角、反应时间短、发光效率高、色域广、工作电压低等优点。
图1示出了相关技术中OLED显示装置的局部结构。参考图1所示，OLED显示装置包括显示区AA和与显示区AA相连的非显示区BB，非显示区BB包括PI(Polyimide，聚酰亚胺)层1、以及依次层叠设置在PI层1上的第一Gate(栅极)线2、第二Gate线3、ILD(Inter Level Dielectric，层间介质)层4、第一PLN(Planarization Layer，平坦化)层5、SD(源漏)层6、第二PLN层7、PDL(Pixel Define Layer，像素定义)层8和第一CVD(Chemical Vapor Deposition，化学气相沉积)层9。目前的OLED显示装置中，参考图1所示，通常会在第一CVD层9上设置有IJP(Ink Jet Printing，喷墨打印)层10，IJP层10的材料为有机材料，例如Ink(墨水)，并在IJP层10上制得第二CVD层(图中未示出)，从而通过第一CVD层9、IJP层10和第二CVD层实现对OLED显示装置的封装。
在OLED显示装置的柔性薄膜封装中，通常采用Dam(堤坝)结构将Ink固定在一定空间范围内，从而避免Ink出现Overflow(溢出)问题。相关技术常采用双Dam结构(图1所示的Dam1和Dam2)阻挡Ink，这是因为：通常希望Ink截止在Dam1内，如图2所示，Dam1可以完全阻挡Ink出现Overflow。但是，在实际工艺过程中，时常会由于工艺波动导致Ink越过Dam1，如图3所示，Overflow到Dam2后截止在Dam2内(一般经过两个Dam后的Ink基本不会再溢出Dam2)。那么相关技术中常设置两个Dam以避免Ink溢出，这里靠近显示区AA的Dam1起到阻挡大部分Ink的作用，远离显示区AA的Dam2起到保险的作用。
随着技术的进步，显示装置的屏幕越来越大，例如全面屏显示装置，此时迫切希望显示装置有更窄的边框。但是，由于相关技术中双Dam结构中的每一个Dam都需要占据较大的空间、且两个Dam之间还需要保证一定的间距，导致无法进一步实现更窄的边框。也就是说，设置在非显示区的堤坝、金属线等结构会影响非显示区的宽度设计，导致显示装置较难实现窄边框，使得显示装置的屏占比较低，用户体验差。基于上述，本申请的实施例提供一种显示基板、显示装置，该显示基板可以有效缩短非显示区的宽度，以实现窄边框，进而提高屏占比。
为达到上述目的，本申请实施例提供了一种显示基板，参考图4所示， 该显示基板包括：显示区AA和围绕显示区AA的非显示区，非显示区包括第一堤坝区BB1，第一堤坝区BB1环绕显示区AA设置。
参考图4和图5所示，第一堤坝区BB1包括堤坝30、以及位于堤坝30远离显示区AA一侧的至少一个阻挡单元31，堤坝30和阻挡单元31至少设置在部分第一堤坝区BB1、且阻挡单元31图案化。
上述显示基板可以是OLED显示基板，这里对显示基板的具体类型不做限定。
上述显示区也称为有效显示区(Active Area；简称AA区)，是指其中设置有多个像素用于实现显示的区域；非显示区一般用于设置驱动走线、驱动电路等，例如：GOA(Gate Driver on Array，阵列基板行驱动)驱动电路。非显示区为围绕显示区的环形区域，其与显示区的形状相匹配，例如，显示区的形状为矩形，非显示区域的形状为矩形环状；显示区的形状为圆形，非显示区的形状为圆环形。
上述第一堤坝区包括堤坝和至少一个阻挡单元。这里的堤坝和阻挡单元被配置为可以防止喷墨打印形成有机发光功能层、有机封装层等有机层时墨水溢出，从而能够通过上述堤坝和阻挡单元解决喷墨打印形成有机层时墨水溢出导致的水汽和氧气等入侵问题。
这里对于上述第一堤坝区包括的阻挡单元的数量、结构等均不做限定。示例地，为了进一步提高防墨水溢出的效果，且实现更窄的边框，上述第一堤坝区可以包括一个阻挡单元；或者，为了更好的提高防墨水溢出的效果，且实现较窄的边框，上述第一堤坝区可以包括两个阻挡单元，当然第一堤坝区也可以包括三个以上阻挡单元，具体以显示基板的有机层的有机材料量、非显示区的宽度等进行确定。图5以第一堤坝区包括三个阻挡单元31为例进行绘示，此时在可以实现显示基板更窄的边框的同时，还能够确保有机层中的有机材料不溢出。
这里对于上述各阻挡单元的具体结构不做限定。示例地，上述各阻挡单元可以为单层结构；或者，上述各阻挡单元可以为多层结构。图5以各阻挡单元包括图案化的第一像素定义部312为例进行绘示。
这里对于上述第一堤坝区包括的堤坝的数量、结构等均不做具体限定。示例地，为了实现更窄的边框，上述第一堤坝区可以包括一个堤坝；或者，为了提高防墨水溢出的效果，上述第一堤坝区可以包括多个堤坝，例如两 个堤坝。图5以第一堤坝区包括一个堤坝30为例进行绘示，此时堤坝30能够阻挡住有机封装层20，又能够有效的实现更窄的边框。
这里对于上述堤坝的具体结构不做限定。示例地，上述堤坝可以为单层结构；或者，上述堤坝可以为多层结构。图5以堤坝30包括依次层叠设置的第二平坦部301和第二像素定义部302为例进行绘示。
上述堤坝和至少一个阻挡单元至少设置在部分第一堤坝区是指：为了使得部分非显示区实现更窄的边框，上述堤坝和至少一个阻挡单元可以均设置在部分第一堤坝区，即围绕显示区AA的部分设置；或者，为了实现更好的防墨水溢出的效果、且使得整个非显示区实现更窄的边框，上述堤坝和至少一个阻挡单元可以均设置在全部第一堤坝区，即围绕显示区AA一圈设置。图4以上述一个堤坝30和一个阻挡单元31均围绕显示区AA一圈设置为例进行绘示；图5以上述一个堤坝30和三个阻挡单元31均设置在第一堤坝区靠近驱动电路区一侧为例进行绘示，此时可以使第一堤坝区靠近驱动电路区的一侧实现更窄的边框。
上述阻挡单元图案化是指：通过构图工艺曝光形成所需要的阻挡单元，这里的构图工艺包括掩膜、曝光、显影、刻蚀和剥离等工艺。
本申请的实施例提供了显示基板，该显示基板包括：显示区和围绕显示区的非显示区，非显示区包括第一堤坝区，第一堤坝区环绕显示区设置；第一堤坝区包括堤坝、以及位于第一堤坝区远离显示区一侧的至少一个阻挡单元，堤坝和阻挡单元至少设置在部分第一堤坝区、且阻挡单元图案化。从而可以更加有效的缩短非显示区的宽度，以实现更窄的边框，进而极大提高了屏占比。现以图5所示的显示基板为例说明能够实现更窄的边框的原理。参考图5所示，一方面，显示基板包括一个堤坝30，这与图1所示的相关技术设置了两个Dam(Dam1和Dam2)相比，少设置了一个Dam，从而有效减少了Dam占据的非显示区的空间，同时堤坝30还能够阻挡有机封装层20中大部分的有机材料溢出；另一方面，显示基板还包括三个图案化的阻挡单元31，由于阻挡单元31图案化，必然比Dam占据的空间小很多，同时图案化的阻挡单元31的边缘不规则，若有机封装层20中的有机材料仍有少量溢出堤坝30，图案化的阻挡单元31的边缘可以进一步截止有机材料。那么，本申请的显示基板在能够实现较好的防止有机材料溢出的基础上，还可以实现更窄的边框，进而提高屏占比，用户体验佳。
可选的，为了在能够实现较好的防止有机材料溢出的效果的基础上，还使得显示基板进一步实现更窄的边框的效果，参考图4和图5所示，第一堤坝区包括一个堤坝。
这里对于上述一个堤坝在第一堤坝区的位置不做具体限定。示例地，上述一个堤坝可以设置在部分第一堤坝区，即围绕显示区AA的部分设置；或者，上述一个堤坝可以设置在全部第一堤坝区，即围绕显示区AA一圈设置。图4以上述一个堤坝30围绕显示区AA一圈设置为例进行绘示；图5以上述一个堤坝30设置在第一堤坝区靠近驱动电路区一侧，此时可以使得第一堤坝区靠近驱动电路区的一侧实现更窄的边框。
这里对于上述一个堤坝的具体结构不做限定。示例地，上述堤坝可以为单层结构；或者，上述堤坝可以为多层结构。图5以堤坝30包括依次层叠设置的第二平坦部301和第二像素定义部302为例进行绘示。
可选的，参考图4所示，非显示区还包括驱动电路区BB2，驱动电路区BB2位于第一堤坝区BB1远离显示区AA的一侧。
参考图5所示，堤坝30和阻挡单元31至少设置在第一堤坝区靠近驱动电路区的一侧。从而可以至少使得显示基板的驱动电路区一侧实现更窄的边框，并简化制作工艺，更有利于实际生产应用，简单易实现。
上述驱动电路区也叫扇出(Fanout)区，是设置驱动电路、引线等的区域。
上述堤坝和阻挡单元至少设置在第一堤坝区靠近驱动电路区的一侧是指：上述堤坝和阻挡单元可以仅设置在第一堤坝区靠近驱动电路区的一侧，此时仅可以使得显示基板的驱动电路区一侧实现更窄的边框；或者，上述堤坝和阻挡单元可以设置在第一堤坝区靠近驱动电路区的一侧、以及设置在第一堤坝区不靠近驱动电路区的一侧，例如上述堤坝和阻挡单元可以设置在整个第一堤坝区，此时可以使得整个显示基板实现更窄的边框。
需要说明的是，图5以堤坝30和阻挡单元31仅设置在第一堤坝区靠近驱动电路区的一侧为例进行绘示。参考图5所示，显示基板还包括衬底11、以及依次层叠设置在衬底11上的第一栅线层12、第一绝缘层13、第二栅线层14、第二绝缘层15、源漏走线层16和层间介质层17，这里仅介绍与发明点相关的内容，其余结构可以参考相关技术获取，这里不再详细说明。
可选的，为了使得显示基板的四周均实现更窄的边框，参考图4所示，堤坝30和阻挡单元31设置在整个第一堤坝区、且围绕显示区设置。
图4以上述一个堤坝30和一个阻挡单元31围绕显示区AA一圈设置为例进行绘示。当然，上述阻挡单元还可以为多个，具体以实际应用为准。
可选的，为了使得显示基板更进一步实现更窄的边框，至少一个阻挡单元中与堤坝相邻的阻挡单元，与堤坝相连。
在上述显示基板包括多个阻挡单元的情况下，这里对于除与堤坝相邻的阻挡单元以外的阻挡单元的设置方式不做具体限定。示例地，除与堤坝相邻的阻挡单元以外的阻挡单元可以和与堤坝相邻的阻挡单元相邻设置；或者，除与堤坝相邻的阻挡单元以外的阻挡单元可以和与堤坝相邻的阻挡单元间隔设置。
相关技术中，参考图1所示，双Dam结构的Dam1和Dam2不能相连，二者之间必须具有一定的间距，这样势必会增大Dam占据的空间。本申请实施例提供的显示基板中，由于阻挡单元图案化，因而图案化的阻挡单元可以与Dam相连，这样通过设置靠近堤坝的阻挡单元与该堤坝相连，更加减小了堤坝和阻挡单元占据的空间，进一步实现了更窄的边框。
需要说明的是，至少一个阻挡单元中与堤坝相邻的阻挡单元还可以与该堤坝间隔设置，图5以阻挡单元31与堤坝30间隔设置、且相邻阻挡单元31均间隔设置为例进行绘示。对于与堤坝相邻的阻挡单元与该堤坝的间隔距离不做具体限定，只要使得该距离小于相关技术中Dam1和Dam2之间的间距即可。
可选的，参考图5所示，各阻挡单元包括图案化的凸起。这样制作工艺较为方便，简单易实现。
这里对于上述图案化的凸起的具体结构不做限定。示例地，上述图案化的凸起可以包括单层结构，例如包括一层平坦部或一层像素定义部；或者，上述图案化的凸起可以包括多层结构，例如包括依次层叠设置的平坦部和像素定义部等。图5以各图案化的凸起包括第一像素定义部312为例进行绘示。
这里对于上述凸起沿垂直于衬底方向的高度不做具体限定。示例地，上述凸起沿垂直于衬底方向的高度范围可以包括1.5-3μm。
这里对于上述凸起沿平行于衬底方向的宽度不做具体限定。示例地，上述凸起沿平行于衬底方向的宽度范围可以包括11-25μm。
这里对于上述凸起的形状不做具体限定。示例地，上述凸起可以包括菱形柱、圆柱、圆柱环等等。
可选的，参考图5所示，非显示区还包括衬底11，图案化的凸起设置在衬底11上；凸起包括第一平坦部和/或第一像素定义部312。从而可以在制作平坦层和/或像素定义层的同时图案化形成凸起，简单易实现。
这里对于上述衬底的材料不做限定，其可以包括刚性材料，例如：玻璃；或者，还可以包括柔性材料，例如：聚酰亚胺(PI)。
这里对于上述第一平坦部的材料不做具体限定，示例地，第一平坦部的材料可以包括有机材料。具体的，第一平坦部的材料可以包括热固化的聚酰亚胺类材料、环氧类材料、丙烯酸类材料中的任一种。
这里对于上述第一像素定义部的材料不做具体限定，示例地，第一像素定义部的材料可以包括有机材料。具体的，第一像素定义部的材料可以包括热固化的聚酰亚胺类材料、环氧类材料、丙烯酸类材料中的任一种。
本申请提供了第一种图案化凸起的结构。为了使得阻挡单元沿垂直于衬底方向的高度和沿平行于衬底方向的宽度均较小，可选的，在凸起包括第一平坦部的情况下，第一平坦部图案化。此时阻挡单元仅包括一层结构，更有利于实现更窄的边框。
本申请提供了第二种图案化凸起的结构。为了使得阻挡单元沿垂直于衬底方向的高度和沿平行于衬底方向的宽度均较小，可选的，参考图5所示，在凸起包括第一像素定义部312的情况下，第一像素定义部312图案化。此时阻挡单元仅包括一层结构，更有利于实现更窄的边框。
本申请提供了第三种图案化凸起的结构。可选的，在凸起包括第一平坦部和第一像素定义部的情况下，凸起包括依次层叠设置在衬底上的第一平坦部和第一像素定义部，第一平坦部图案化。
本申请提供了第四种图案化凸起的结构。可选的，在凸起包括第一平坦部和第一像素定义部的情况下，凸起包括依次层叠设置在衬底上的第一平坦部和第一像素定义部，第一像素定义部图案化。
本申请提供了第五种图案化凸起的结构。可选的，在凸起包括第一平 坦部和第一像素定义部的情况下，凸起包括依次层叠设置在衬底上的第一平坦部和第一像素定义部，第一平坦部图案化和第一像素定义部图案化。
可选的，参考图5所示，非显示区还包括设置在图案化的凸起远离衬底11一侧的封装单元，封装单元覆盖凸起。从而能够对显示基板进行封装，有效阻挡水汽、氧气等侵蚀显示基板。
这里对于上述封装单元的结构不做具体限定。示例地，上述封装单元可以包括单层结构，例如可以包括图5所示的一层第一无机封装层19，第一无机封装层19覆盖凸起；或者，上述封装单元可以包括多层结构，例如可以包括依次层叠设置的第一无机封装层、有机封装层和第二无机封装层，其中第一无机封装层和第二无机封装层被配置为封装第一堤坝区；有机封装层在第一堤坝区断开。
对于上述第一无机封装层和第二无机封装层的具体材料不做限定。示例地，上述第一无机封装层和第二无机封装层的材料均可以包括氮化硅(SiNx)、氧化硅(SiOx)、氮氧化硅(SiON)或者氧化铝(AlOx)中的任一种，以及氮化硅(SiNx)、氧化硅(SiOx)、氮氧化硅(SiON)或者氧化铝(AlOx)中一种或多种的组合。
上述第一无机封装层和第二无机封装层可以采用化学气相沉积工艺制作形成，但不限于此，或者，也可采用物理气相沉积工艺等形成。有机封装层可以采用喷墨打印工艺制作，但不限于此，或者，也可采用喷涂工艺等。在制作有机封装层的过程中，由于有机封装材料具有一定的流动性，因此，需要在第一堤坝区设置堤坝和阻挡单元，以阻挡有机封装材料溢出，从而避免封装失效的问题。
可选的，为了提高防墨水溢出的效果，且实现窄边框，第一堤坝区包括两个阻挡单元。
这里对于上述两个阻挡单元的结构不做具体限定。示例地，上述两个阻挡单元的结构可以均相同，例如均包括单层结构或均包括多层结构；或者，上述两个阻挡单元的结构可以不同，例如一个阻挡单元包括单层结构、另一个阻挡单元包括多层结构。
可选的，参考图6-8所示，图案化的凸起在垂直于衬底方向上的正投影的形状包括面状或者环状。
这里对于上述凸起在垂直于衬底方向上的正投影的具体形状不做限定。示例地，上述图案化的凸起在垂直于衬底方向上的正投影的具体形状可以包括单一规则图形，例如菱形或菱形环、矩形或矩形环、圆形或圆环、三角形或三角环、椭圆或椭圆环等等；或者，上述图案化的凸起在垂直于衬底方向上的正投影的具体形状可以包括多种规则图形的组合，例如菱形环和矩形环的组合、圆环和椭圆环的组合、三角形和矩形环的组合等等。图6以上述凸起在垂直于衬底方向上的正投影的形状包括菱形环；图7以上述凸起在垂直于衬底方向上的正投影的形状包括圆环；图8以上述凸起在垂直于衬底方向上的正投影的形状包括矩形环为例进行绘示。
可选的，参考图6-8所示，在图案化的凸起在垂直于衬底方向上的正投影的形状包括环状的情况下，堤坝区包括多个图案化的凸起、且至少部分相邻图案化的凸起相连。从而不仅可以通过图案化的凸起的边缘阻挡墨水溢出，且在若墨水溢过图案化的凸起的边缘的情况下，凸起的中空环还能够进一步阻挡墨水溢出，这样从多方面有效的阻挡墨水溢出。
上述至少部分相邻图案化的凸起相连是指：部分相邻图案化的凸起相连；或者，全部相邻图案化的凸起相连。图6-图8均以部分相邻图案化的凸起相连为例进行绘示。
这里对于至少部分相邻图案化的凸起相连后的图案不做具体限定。示例地，至少部分相邻图案化的凸起相连后的图案可以为规则图形，例如矩形环、菱形环等；或者，至少部分相邻图案化的凸起相连后的图案可以为不规则图形。图6-图8均以部分相邻图案化的凸起相连后的图案为不规则图形为例进行绘示。
在部分相邻图案化的凸起相连的情况下，对于相连的部分相邻图案化的凸起与堤坝的位置不做具体限定。示例地，相连的部分相邻图案化的凸起可以与堤坝相邻设置，此时相连的部分相邻图案化的凸起可以与堤坝相连/间隔设置；或者，相连的部分相邻图案化的凸起与堤坝之间还可以设置有其它的图案化的凸起。
在上述全部相邻图案化的凸起相连的情况下，对于相连的全部相邻图案化的凸起与堤坝的位置不做具体限定。示例地，相连的全部相邻图案化的凸起与堤坝间隔设置；或者，相连的全部相邻图案化的凸起与堤坝相连设置。
可选的，参考图9所示，图案化的凸起沿垂直于衬底的截面的高度d3范围包括1.5-3μm。相关技术中，Dam2沿垂直于衬底的截面的高度较高，常高于Dam1沿垂直于衬底的截面的高度，那么本申请设置图案化的凸起沿垂直于衬底的截面的高度范围包括1.5-3μm，使得阻挡单元沿垂直于衬底的截面的高度低于堤坝的高度，以更好的实现窄边框。
这里对于上述图案化的凸起沿垂直于衬底的截面的高度范围不做具体限定。示例地，上述图案化的凸起沿垂直于衬底的截面的高度可以包括1.5μm、2μm、2.5μm或者3μm等等。
可选的，参考图9所示，图案化的凸起在垂直于衬底方向上的正投影的宽度(d1+2d2)范围包括11-25μm。相关技术中，Dam2在垂直于衬底方向的正投影的宽度较宽，常大于Dam1在垂直于衬底方向的正投影的宽度，那么本申请设置图案化的凸起在垂直于衬底方向上的正投影的宽度范围包括11-25μm，使得阻挡单元在垂直于衬底方向的正投影的宽度小于堤坝的宽度，更小于相关技术中Dam2在垂直于衬底方向的正投影的宽度，以更好的实现窄边框。
这里对于上述图案化的凸起在垂直于衬底方向上的正投影的宽度范围不做具体限定。示例地，上述图案化的凸起在垂直于衬底方向上的正投影的宽度可以包括11μm、15μm、20μm或者25μm等等。
可选的，参考图9所示，在图案化的凸起在垂直于衬底方向上的正投影的形状包括环状的情况下，环状的内环沿平行于衬底方向的宽度d1范围包括5-15μm。从而使得阻挡单元在垂直于衬底方向的正投影的宽度较小，以更好的实现窄边框。
这里对于上述环状的内环沿平行于衬底方向的宽度范围不做具体限定。示例地，上述环状的内环沿平行于衬底方向的宽度可以包括5μm、8μm、11μm或者15μm等等。
需要说明的是，根据上述图案化的凸起在垂直于衬底方向上的正投影的宽度(d1+2d2)范围、以及环状的内环沿平行于衬底方向的宽度d1范围，可以得到如图6-图8所示的d2的范围包括3-5μm，具体可以为3μm、4μm或者5μm。
可选的，参考图4所示，非显示区还包括裂纹堤坝区BB3，裂纹堤坝区BB3围绕第一堤坝区BB1设置、且在驱动电路区BB2断开；裂纹堤坝 区BB3包括至少一个凹槽，凹槽围绕第一堤坝区BB1设置、且在驱动电路区BB2断开。
图4结合图10所示，裂纹堤坝区BB3包括至少一个凹槽33，凹槽33围绕第一堤坝区BB1设置、且在驱动电路区BB2区断开。
上述凹槽的数量不做限定，图10以连续间隔设置的三个凹槽33为例进行绘示。该凹槽能够减小并分散切割时产生的应力，从而降低切割时产生的裂纹(crack)风险，因此该凹槽还可称为Crack Dam。该凹槽沿垂直于衬底方向的深度不做限定，可以根据实际情况确定。
需要说明的是，若该驱动电路区采用pad bending结构(即将pad区弯折至基板的非显示面)，则该凹槽的断开位置对应弯折区上的驱动电路区(fanout区)；若该驱动电路区采用非pad bending结构，则该凹槽的断开位置对应pad区(绑定区)。
可选的，参考图10所示，非显示区还包括：依次叠层设置的缓冲层21、栅绝缘层22和层间介质层17；层间介质层17、栅绝缘层22和缓冲层21三者均位于显示区AA、第一堤坝区BB1和裂纹堤坝区BB3；凹槽至少贯通层间介质层17位于裂纹堤坝区BB3的部分。
需要说明的是，凹槽33可以如图10所示仅贯通层间介质层17位于裂纹堤坝区BB3区的部分；或者，凹槽还可以贯通层间介质层和栅绝缘层两者位于裂纹堤坝区的部分；或者，凹槽还可以贯通层间介质层、栅绝缘层和缓冲层三者位于裂纹堤坝区的部分，这里不做限定。
可选的，参考图11所示，显示基板还包括：衬底11以及设置在衬底11上的驱动单元40和触控单元41；驱动单元40位于显示区AA，触控单元41位于显示区AA和非显示区BB、且覆盖驱动单元40。
上述触控单元的结构不做限定，示例地，该触控单元可以采用互容式触控结构，或者自容式触控结构。互容式触控结构或者自容式触控结构可以根据相关技术获得，这里不再详细说明。
可选的，参考图11所示，触控单元41包括依次叠层设置在驱动单元40之上的第一触控层411、第一绝缘层412、第二触控层413和第二绝缘层414；第一触控层411和第二触控层413均位于显示区AA，第一绝缘层412和第二绝缘层414位于显示区AA和非显示区BB；其中，第一触 控层411和第二触控层413两者中的一个为金属网格电极层，另一个为桥接金属层。
上述第一触控层可以为金属网格电极层，同时，第二触控层可以为桥接金属层；或者，上述第一触控层可以为桥接金属层，同时，第二触控层可以为金属网格电极层。为了获得较好的触控效果，可以选择后者。
参考图12所示，金属网格电极层415可以包括驱动电极(TX电极)4151和感应电极(RX电极)4152，每一列驱动电极4151直接相连，并通过TX线与触控驱动单元416电连接；每一行感应电极4152通过贯穿第一绝缘层的过孔与桥接金属层电连接，并通过RX线与触控驱动单元416电连接。其中，金属网格电极层415可以位于显示区，TX线、RX线、触控驱动单元可以位于非显示区。该触控单元的结构属于FMLOC(Flexible Multi-Layer On Cell，柔性多层结构)触控结构，该触控结构可以减小屏幕厚度，进而有利于折叠；同时没有贴合公差，可减小边框宽度；另外，还可以减少crack(裂纹)风险。
上述第一绝缘层和第二绝缘层的材料可以是氮化硅、氧化硅或者氮氧化硅的任一种。
本申请的实施例提供的显示基板可以更加有效缩短非显示区的宽度，以实现更窄的边框，进而极大提高了屏占比。
本申请实施例还提供了一种显示装置，包括上述的显示基板。
上述显示装置可以是具有触控功能的显示装置，或者，还可以是具有折叠或卷曲功能的显示装置，或者还可以是同时具有触控功能和折叠功能的显示装置，这里不做限定。该显示装置可以是柔性显示装置(又称柔性屏)，也可以是刚性显示装置(即不能折弯的显示屏)，这里不做限定。
上述显示装置可以是OLED显示装置、Micro(微)LED显示装置或者Mini(小)LED显示装置。
上述显示装置可以是电视、数码相机、手机、平板电脑等任何具有显示功能的产品或者部件；上述显示装置还可以应用于身份识别、医疗器械等领域，已推广或具有很好推广前景的产品包括安防身份认证、智能门锁、医疗影像采集等。该显示装置具有边框非常窄、封装效果好、成本低、显示效果好、寿命长、稳定性高、对比度高、成像质量好、产品品质高等优 点。
本文中所称的“实施例”意味着，结合实施例描述的特定特征、结构或者特性包括在本申请的至少一个实施例中。
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本申请的实施例可以在没有这些具体细节的情况下被实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (21)

  1. 一种显示基板，其特征在于，包括：
    显示区；和
    围绕所述显示区的非显示区，包括第一堤坝区，所述第一堤坝区环绕所述显示区设置；
    其中所述第一堤坝区包括堤坝、以及位于所述堤坝远离所述显示区一侧的至少一个阻挡单元，所述堤坝和所述阻挡单元至少设置在部分所述第一堤坝区、且所述阻挡单元图案化。
  2. 根据权利要求1所述的显示基板，其特征在于，所述第一堤坝区包括一个所述堤坝。
  3. 根据权利要求2所述的显示基板，其特征在于，所述非显示区还包括驱动电路区，所述驱动电路区位于所述第一堤坝区远离所述显示区的一侧；以及
    所述堤坝和所述阻挡单元至少设置在所述第一堤坝区靠近所述驱动电路区的一侧。
  4. 根据权利要求3所述的显示基板，其特征在于，所述堤坝和所述阻挡单元设置在整个所述第一堤坝区、且围绕所述显示区设置。
  5. 根据权利要求2所述的显示基板，其特征在于，至少一个所述阻挡单元中与所述堤坝相邻的所述阻挡单元，与所述堤坝相连。
  6. 根据权利要求2所述的显示基板，其特征在于，各所述阻挡单元包括图案化的凸起。
  7. 根据权利要求6所述的显示基板，其特征在于，所述非显示区还包括衬底，图案化的所述凸起设置在所述衬底上；以及
    所述凸起包括第一平坦部和/或第一像素定义部。
  8. 根据权利要求7所述的显示基板，其特征在于，在所述凸起包括所述第一平坦部的情况下，所述第一平坦部图案化；或者
    在所述凸起包括所述第一像素定义部的情况下，所述第一像素定义部图案化。
  9. 根据权利要求7所述的显示基板，其特征在于，在所述凸起包括 所述第一平坦部和所述第一像素定义部的情况下，所述凸起包括依次层叠设置在所述衬底上的第一平坦部和第一像素定义部，所述第一平坦部图案化和/或所述第一像素定义部图案化。
  10. 根据权利要求7所述的显示基板，其特征在于，所述非显示区还包括设置在图案化的所述凸起远离所述衬底一侧的封装层，所述封装层覆盖所述凸起。
  11. 根据权利要求2所述的显示基板，其特征在于，所述第一堤坝区包括两个所述阻挡单元。
  12. 根据权利要求7所述的显示基板，其特征在于，图案化的所述凸起在垂直于所述衬底方向上的正投影的形状包括面状或者环状。
  13. 根据权利要求12所述的显示基板，其特征在于，在图案化的所述凸起在垂直于所述衬底方向的正投影的形状包括环状的情况下，所述堤坝区包括多个图案化的所述凸起、且至少部分相邻图案化的所述凸起相连。
  14. 根据权利要求12所述的显示基板，其特征在于，图案化的所述凸起沿垂直于所述衬底的截面的高度范围包括1.5-3μm。
  15. 根据权利要求12所述的显示基板，其特征在于，图案化的所述凸起在垂直于所述衬底方向上的正投影的宽度范围包括11-25μm。
  16. 根据权利要求12所述的显示基板，其特征在于，在图案化的所述凸起在垂直于所述衬底方向上的正投影的形状包括环状的情况下，所述环状的内环沿平行于所述衬底方向的宽度范围包括5-15μm。
  17. 根据权利要求2所述的显示基板，其特征在于，所述非显示区还包括裂纹堤坝区，所述裂纹堤坝区围绕所述第一堤坝区设置、且在所述驱动电路区断开；以及
    所述裂纹堤坝区包括至少一个凹槽，所述凹槽围绕所述第一堤坝区设置、且在所述驱动电路区断开。
  18. 根据权利要求17所述的显示基板，其特征在于，所述非显示区还包括：依次叠层设置的缓冲层、栅绝缘层和层间介质层；所述层间介质层、所述栅绝缘层和所述缓冲层三者均位于所述显示区、所述第一堤坝区和所述裂纹堤坝区；以及
    所述凹槽至少贯通所述层间介质层位于所述裂纹堤坝区的部分。
  19. 根据权利要求1所述的显示基板，其特征在于，所述显示基板还包括：衬底以及设置在所述衬底上的驱动单元和触控单元；以及
    所述驱动单元位于所述显示区，所述触控单元位于所述显示区和所述非显示区、且覆盖所述驱动单元。
  20. 根据权利要求19所述的显示基板，其特征在于，所述触控单元包括依次叠层设置在所述驱动单元之上的第一触控层、第一绝缘层、第二触控层和第二绝缘层；所述第一触控层和所述第二触控层均位于所述显示区，所述第一绝缘层和所述第二绝缘层位于所述显示区和所述非显示区；
    其中，所述第一触控层和所述第二触控层两者中的一个为金属网格电极层，另一个为桥接金属层。
  21. 一种显示装置，其特征在于，包括权利要求1-20任一项所述的显示基板。
PCT/CN2023/096939 2022-06-20 2023-05-29 一种显示基板、显示装置 WO2023246434A1 (zh)

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