WO2023245881A1

WO2023245881A1 - Transmission structure

Info

Publication number: WO2023245881A1
Application number: PCT/CN2022/118597
Authority: WO
Inventors: 戴佳; 朱鹤囡; 董雪迪; 林佳继
Original assignee: 拉普拉斯(无锡)半导体科技有限公司
Priority date: 2022-06-23
Filing date: 2022-09-14
Publication date: 2023-12-28
Also published as: CN217869073U

Abstract

The present application discloses a transmission structure, comprising a positioning supporting mechanism and a power mechanism. The positioning supporting mechanism comprises a rack, and the rack is fixedly arranged on a carrier device in a vacuum chamber. The power mechanism comprises a power gear, and the rack is engaged with the power gear.

Description

Transmission structure

This disclosure claims priority from Chinese patent application No. 202221583813.4, filed with the China Patent Office on June 23, 2022, the entire content of which is incorporated into this application by reference.

Technical field

This application belongs to the field of photovoltaic equipment, and relates to, for example, a transmission structure.

Background technique

The core process of the heterojunction solar cell manufacturing process includes the thin film deposition process, which includes multiple coating processes such as I-type intrinsic amorphous silicon film, P-type amorphous silicon film, and N-type amorphous silicon film. The carrier device loaded with silicon wafers is driven by the driving mechanism of the cavity to transfer between various coating processes to complete the process of silicon wafer thin film deposition.

Contents of the invention

The present application provides a transmission structure to improve the transmission efficiency of transmitting power to a board-carrying device, so as to improve the operating stability of the board-carrying device.

This application provides a transmission structure, which includes a positioning support mechanism and a power mechanism. The positioning support mechanism includes a rack. The rack is arranged on a carrier device in a vacuum chamber. The power mechanism includes a power gear, and the rack is meshed with the power gear.

Description of the drawings

Figure 1 is a schematic diagram of the vacuum coating equipment of this application;

Figure 2 is a schematic assembly diagram of the vacuum chamber, variable pitch structure, carrier device and transmission structure of the present application;

Figure 3 is a schematic diagram of the carrier device and silicon wafer assembly of the present application;

Figure 4 is a schematic diagram of the vacuum chamber of this application;

Figure 5 is a front view of the vacuum chamber of the present application;

Figure 6 is a top view of the vacuum chamber of the present application;

Figure 7 is a schematic diagram of the assembly of the transmission structure and carrier device of the present application;

Figure 8 is an enlarged schematic diagram of A in Figure 7;

Figure 9 is a side view of the transmission structure of the present application;

Figure 10 is an enlarged schematic diagram of B in Figure 7;

Figure 11 is a schematic diagram of the assembly of the transmission structure, carrier plate device and vacuum chamber of this application;

Figure 12 is a side view of the assembly of the transmission structure, carrier plate device and vacuum chamber of this application;

Figure 13 is a schematic diagram of the variable pitch structure of the present application;

Figure 14 is a schematic diagram of the assembly of the variable pitch structure and the carrier device of the present application;

Figure 15 is a schematic assembly diagram of the vacuum chamber, variable pitch structure and carrier device of the present application;

Figure 16 is a front view of the vacuum chamber in Embodiment 2 of the present application.

Logo in the picture:

2. Heating device; 5. Special gas spray device; 6. Valve chamber; 7. Silicon wafer; 10. Second valve; 11. First valve; 12. Loading preheating vacuum chamber; 13. First coating vacuum Cavity; 14. Vacuum chamber; 15. Second coating vacuum chamber; 16. Carrier plate conversion vacuum chamber; 17. Third coating vacuum chamber; 18. Fourth coating vacuum chamber; 19. Unloading and heat dissipation Vacuum chamber; 140, chamber frame; 141, first chamber door; 142, second chamber door; 143, third chamber door; 144, fourth chamber door; 145, beam frame; 146, dry pump docking flange ; 147. Partition plate; 148. Hinge; 149. Butt flange; 3. Carrier plate device; 30. Frame; 301. Upper frame plate; 302. Lower frame plate; 4. Transmission structure; 41. Positioning support mechanism; 411 , bracket; 412, wheel mounting frame; 413, support wheel; 414, positioning wheel; 415, rack; 416, support plate; 42, power mechanism; 421, motor component; 422, magnetic fluid; 423, coupling; 424. Power gear; 425. Bearing seat; 426. Power rotating shaft; 43. Positioning mechanism; 431. Positioning bracket; 432. Positioning fixed plate; 433. Positioning rod; 8. Variable pitch structure; 81. Variable pitch power component; 82 , variable pitch transmission component; 821, screw nut; 822, screw rod; 823, fixed seat; 824, isolation plate; 83, telescopic component; 831, moving flange; 832, bellows; 833, fixed flange; 84 , docking component; 841, docking rod; 842, docking block; 85, mounting bracket; 86, first bearing; 87, sliding device; 872, fixed plate; 871, slider; 88, sensor; 434, roller; 417 , support component; 430, positioning component; 1401, cavity; 1480, connecting mechanism; 1410, front chamber door component; 1430, rear chamber door component; 150, sealing ring; 810, motor.

Detailed ways

The following illustrates the embodiments of the present application through examples. Those skilled in the art can understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different implementations.

It should be noted that the illustrations provided in the following embodiments only illustrate the basic concept of the present application in a schematic manner, so the illustrations only show the components related to the present application and are not based on the number, shape and number of components during actual implementation. Dimension drawing, in actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complex.

All directional indications (such as up, down, left, right, front, back, transverse, longitudinal, etc.) in the embodiments of this application are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture. , if the specific posture changes, the directional indication also changes accordingly.

Due to installation errors and other reasons, the parallel relationship referred to in the embodiments of this application may actually be an approximately parallel relationship, and the vertical relationship may actually be an approximately vertical relationship.

The driving mechanism of the cavity in the related art has the following problems: First, the driving mechanism in the related art is mostly suitable for small-volume equipment, and the driving mechanism is set below the carrier device. The mass-production machine is more configured than the small-volume equipment. For large-sized board carrier devices, this driving method will lead to poor operational stability of mass-produced airborne board devices and easily cause debris; secondly, the carrier board devices in related technologies mainly rely on appearance positioning in the cavity, which affects the accuracy of the workpiece. The requirements are high, and the positioning accuracy of the operation is low when the driving mechanism drives the carrier plate device; thirdly, the driving mechanism in the related technology is mainly the roller structure and the conveyor belt transmission structure, and the roller structure relies on the rubber on the roller and the carrier. The friction force of the plate device drives the plate carrier device, and the conveyor belt transmission structure relies on the friction between the belt and the plate carrier device to drive the plate carrier device, and the transmission efficiency is low; fourth, the roller structure drives the plate carrier device through friction, causing the operation of the plate carrier device to The speed is quite different from the theoretical speed, and the optimization space for speed adjustment of the carrier device is limited.

Example 1:

As shown in Figure 1-15, a vacuum coating equipment includes a heating device 2, a carrier device 3, a special gas spray device 5, a valve chamber 6, a process chamber, a transmission structure 4 and a variable pitch structure 8. The heating device 2 is set to heat the process chamber so that the temperature of the process chamber reaches the reaction temperature of the silicon wafer 7 and the gas. The carrier device 3 loads the silicon wafer 7. The process chamber includes a preheating vacuum chamber 12 and a coating vacuum chamber. 1. Coating vacuum chamber 2. Carrier plate conversion vacuum chamber 16 and discharge heat dissipation vacuum chamber 19. The valve chamber 6 is connected between the vacuum chambers of the process chamber. The carrier plate conversion vacuum chamber 16 is connected to the coating Between the first vacuum chamber and the second coating vacuum chamber, the carrier switching vacuum chamber 16 is used for switching the coating surface of the silicon wafer.

The valve chamber 6, the coating vacuum chamber 1, the coating vacuum chamber 2 and the carrier plate conversion vacuum chamber 16 form a silicon wafer coating production line. Through a silicon wafer coating production line, the double-sided coating of the silicon wafer 7 and the conversion of the silicon wafer coating surface are realized. , reducing the space occupied by the silicon wafer coating production line. In this embodiment, the silicon wafer coating production line may also include a loading preheating vacuum chamber 12 and a discharging heat dissipation vacuum chamber 19 to realize the steps of preheating, coating, and The coating surface is converted to a complete coating process with unloading.

In this embodiment, the y direction in FIG. 1 is the moving direction of the carrier device 3, and the x direction in FIG. 1 is perpendicular to the moving direction of the carrier device 3.

The process chamber includes a loading preheating vacuum chamber 12 composed of a plurality of vacuum chambers 14, a coating vacuum chamber 1, a coating vacuum chamber 2, a carrier plate conversion vacuum chamber 16 and an unloading heat dissipation vacuum chamber 19. The coating The first vacuum chamber includes a first coating vacuum chamber 13 and a second coating vacuum chamber 15 . The second coating vacuum chamber includes a third coating vacuum chamber 17 and a fourth coating vacuum chamber 18 . The first coating vacuum chamber 13 The second coating vacuum chamber 15 is used for coating on one side of the silicon wafer 7, the third coating vacuum chamber 17 and the fourth coating vacuum chamber 18 are used for coating on the other side of the silicon wafer 7, between the vacuum chambers A valve chamber 6 is provided. The valve chamber 6 isolates adjacent vacuum chambers from each other to avoid process contamination. The loading preheating vacuum chamber 12 is provided with a first valve 11, and the unloading and cooling vacuum chamber 19 is provided with a second valve 10. , the first valve 11 and the second valve 10 isolate the equipment from the atmospheric environment.

Load preheating vacuum chamber 12, valve chamber 6, first coating vacuum chamber 13, valve chamber 6, second coating vacuum chamber 15, valve chamber 6, carrier plate conversion vacuum chamber 16, valve chamber 6, third The coating vacuum chamber 17, the valve chamber 6, the fourth coating vacuum chamber 18, the valve chamber 6 and the discharge heat dissipation vacuum chamber 19 are connected in sequence to form a production line of vacuum coating equipment. The carrier device 3 for loading the silicon wafer 7 passes through the transmission structure 4 drives and runs along the production line, forming the running path of the carrier device 3. In this embodiment, the preheating vacuum chamber 12, the valve chamber 6, the first coating vacuum chamber 13, the valve chamber 6, and the second coating vacuum chamber 15 are loaded. , valve chamber 6, carrier plate conversion vacuum chamber 16, valve chamber 6, third coating vacuum chamber 17, valve chamber 6, fourth coating vacuum chamber 18, valve chamber 6 and discharge cooling vacuum chamber 19 are optional Distributed in the form of an assembly line, the running path of the carrier device 3 is shortened and the floor space of the equipment is reduced.

The heating device 2 includes a heater 21 and a heat source 22. The loading preheating vacuum chamber 12, the coating vacuum chamber 1, the coating vacuum chamber 2 and the carrier conversion vacuum chamber 16 are provided with a pair of heaters 21. A pair of heaters 21 It is arranged symmetrically with respect to the center line of the equipment. In this embodiment, the direction of the center line of the equipment is the y direction. The center line of each vacuum chamber is collinear with the center line of the equipment. The heat source 22 is arranged between the coating vacuum chamber one and the coating vacuum chamber two. On the center line, a pair of special gas spray devices 5 are provided in the coating vacuum chamber one and the coating vacuum chamber two, and the pair of special gas spray devices 5 are arranged symmetrically with respect to the heat source 22.

The transmission structure 4 runs through the production line, and there is a pair of transmission structures 4. The pair of transmission structures 4 are arranged symmetrically with respect to the center line of the equipment. One transmission structure 4 controls the operation of at least one carrier device 3, and at least one transmission structure 4 has A dry carrier plate device 3 is distributed along the operating path. The operating path of the carrier plate device 3 is located between the special gas spray device 5 and the heater 21. The special gas spray device 5 is used for spraying special gas. This embodiment The special gases refer to special gases used in semiconductors, including, for example, nitrogen-based gases, silicon-based gases, oxygen and other special gases.

As shown in Figure 1, the loading preheating vacuum chamber 12 and the carrier plate conversion vacuum chamber 16 are sequentially distributed along the center line of the vacuum chamber to the direction outside the vacuum chamber. The transmission structure 4 and the heater 21 are sequentially distributed. The coating vacuum chamber The first and second coating vacuum chambers distribute the heat source 22, the special gas spray device 5, the transmission structure 4 and the heater 21 in sequence along the center line of the vacuum chamber to the direction outside the vacuum chamber. The heater 21 of each vacuum chamber is , heat source 22 and special gas spray device 5 operate independently.

As shown in Figure 3, the carrier device 3 includes a frame 30, a clamping slot 31 and a clamping pin 32. The silicon wafer 7 is arranged in the clamping slot 31 through the clamping pin 32. There is no large area of obstruction on both sides of the silicon wafer 7, which increases the coating The effective area ratio realizes the requirement of double-sided coating. The size and quantity of silicon wafers 7 loaded in the carrier device 3 can be set according to the customer's production requirements.

As shown in Figure 4-6, the vacuum chamber 14 of this embodiment is a multifunctional vacuum chamber. The vacuum chamber 14 can be configured to load a preheating vacuum chamber 12, a coating vacuum chamber 1, a coating vacuum chamber 2, a loading vacuum chamber The plate converts the vacuum chamber 16 and the discharge and heat dissipation vacuum chamber 19. The vacuum chamber 14 can be used for different processes of coating, thus meeting the needs of multi-functional use of the vacuum chamber.

The vacuum chamber 14 includes a chamber frame 140, a front chamber door assembly 1410 and a rear chamber door assembly 1430. The front chamber door assembly 1410 and the rear chamber door assembly 1430 are arranged on both sides of the chamber frame 140. The front chamber door assembly 1410 and the rear chamber door assembly 1410 are At least one of the door assemblies 1430 is configured as a multi-chamber door structure.

The front chamber door assembly 1410 and the rear chamber door assembly 1430 are distributed along the x direction. The z direction in Figure 4 is the height direction of the vacuum chamber. The y direction in Figure 4 is the moving direction of the carrier device 3. The y direction is the height direction of the vacuum chamber. Longitudinal direction.

In this embodiment, the cavity frame 140 is configured as a vertical square structure. A process chamber is provided in the cavity frame 140. The silicon wafer 7 is subjected to a coating process in the process chamber. Partition plates 147 are provided on both sides of the cavity frame 140. The plate 147 is provided with a beam frame 145. The beam frames 145 on both sides can be optionally arranged symmetrically. The beam frame 145 is provided with at least one reinforcing rib. The beam frame 145 is provided with at least one dry pump docking flange 146 and at least one dry pump. The docking flanges 146 are distributed along the height direction of the vacuum chamber.

In this embodiment, the dry pump docking flange 146 is provided on the beam frame 145, which no longer interferes with the opening of the chamber door, thereby improving maintenance efficiency.

The cavity frame 140 is configured as a multi-cavity door structure on at least one side. For example, the front cavity door assembly 1410 is configured as a single-cavity door structure, the rear cavity door assembly 1430 is configured as a multi-cavity door structure, or the front cavity door assembly 1410 is configured as a multi-cavity door. structure, the rear cavity door assembly 1430 is configured as a single cavity door structure, or the front cavity door assembly 1410 and the rear cavity door assembly 1430 are both configured as a multi-chamber door structure.

In this embodiment, at least one connection mechanism 1480 is provided between the front door assembly 1410 and the cavity frame 140, and at least one connection mechanism 1480 is provided between the rear cavity door assembly 1430 and the cavity frame 140. The connection mechanism 1480 can be a hinge. 148. The front chamber door assembly 1410 includes at least one chamber door, and the at least one chamber door is distributed along the y direction. In this embodiment, the number of chamber doors is set to two, including a first chamber door 141 and a second chamber door 142. The first chamber door 141 and The second cavity door 142 is distributed along the y direction; the rear cavity door assembly 1430 includes at least one cavity door, and at least one cavity door is distributed along the y direction. In this embodiment, the number of cavity doors is set to two, including the third cavity door 143 and the fourth cavity door 143 . The cavity door 144, the third cavity door 143 and the fourth cavity door 144 are distributed along the y direction; at least one of the front cavity door assembly 1410 and the rear cavity door assembly 1430 opens or closes the cavity door in the y direction, and the first cavity door 141 , the second cavity door 142, the third cavity door 143 and the fourth cavity door 144 are respectively connected to the cavity frame 140 through hinges 148, the first cavity door 141, the second cavity door 142, the third cavity door 143 and the fourth cavity The number of hinges 148 on any chamber door in the door 144 can be optionally set to 3 pieces. The 3 pieces of hinges 148 are evenly distributed along the height direction of the vacuum chamber to prevent the hinges 148 from deforming and ensure that the front chamber door assembly 1410 and the rear chamber door assembly 1430 Strength of connection to cavity frame 140.

In this embodiment, the partition 147 is disposed between adjacent doors of at least one of the front door assembly 1410 and the rear door assembly 1430 .

The width of the cavity door in this embodiment is not greater than 1.5 meters (m), for example, 1.3 m, and the width direction of the cavity door is the y direction. Compared with the single-side single-chamber door structure of the cavity frame 140 in the related art, this embodiment The structure of the multi-cavity door reduces the mass of a single door, reduces the load on the hinge 148, and extends the service life of the hinge 148. At the same time, the size of the door is reduced, thereby reducing the difficulty of production and processing. Under the same conditions, The smaller size is less likely to deform, which can improve the strength and lifespan of the chamber door of this embodiment, and has better sealing performance, which can effectively ensure the vacuum degree of the vacuum chamber.

In this embodiment, the first chamber door 141 and the second chamber door 142 of the front chamber door assembly 1410, and the third chamber door 143 and the fourth chamber door 144 of the rear chamber door assembly 1430 are opened simultaneously, which increases equipment maintenance. space, which is convenient for staff to operate and improves maintenance efficiency; the area occupied by the opening of the chamber door in this embodiment is half or less of the structure in the related art, which reduces the occupied area of the equipment.

In this embodiment, the cavity frame 140, the front cavity door assembly 1410 and the rear cavity door assembly 1430 can be made of aluminum, aluminum alloy, stainless steel, etc.

The multi-cavity door structure of the vacuum chamber of this embodiment can be applied to the cavities of other equipment, not limited to vacuum coating equipment.

As shown in Figures 7-12, the transmission structure 4 includes a positioning support mechanism 41, a power mechanism 42 and a positioning mechanism 43. The positioning support mechanism 41 includes a rack 415. The rack 415 is provided on the carrier device 3. The power mechanism 42 includes a power gear. 424, the rack 415 is meshed with the power gear 424.

The carrier device 3 includes a frame 30. The frame 30 includes an upper frame plate 301 and a lower frame plate 302. The upper frame plate 301 and the lower frame plate 302 are distributed along the up and down direction, and the up and down direction is the z direction in the figure.

Optionally, the positioning support mechanism 41 also includes a bracket 411, a support assembly 417, and a support plate 416. The length direction of the bracket 411 is parallel to the moving direction of the carrier device 3. The bracket 411 is connected to the top inside the vacuum chamber, and the support plate 416 is connected to the carrier board device 3 . In one embodiment, the positioning support mechanism 41 includes a bracket 411, a support assembly 417, a rack 415 and a support plate 416. The length direction of the bracket 411 is parallel to the moving direction of the carrier device 3. The bracket 411 is disposed on the top of the vacuum chamber. .

The support component 417 is provided with at least one support component 417 along the moving direction of the carrier device 3 and is provided on the bracket 411. The support component 417 includes a wheel mounting bracket 412, a support wheel 413 and a positioning wheel 414. The support wheel 413 and the positioning wheel 414 Provided on wheel mounting bracket 412.

Optionally, the support wheel 413 is located under the support plate 416, and the support wheel 413 is in contact with the support plate 413. The positioning wheel 414 is located under the rack 415, and the positioning wheel 414 is connected with the rack 415 in a slot. In one embodiment, the rack 415 and the support plate 416 are respectively disposed on both sides of the upper frame plate 301 , the length direction of the rack 415 is parallel to the moving direction of the plate carrier device 3 , and at least one support plate 416 is along the direction of the plate carrier device 3 distribution of the moving direction, the rack 415 and the positioning wheel 414 are located on the same side, the support plate 416 and the support wheel 413 are located on the same side, the lower end surface of the rack 415 is provided with a clamping block, the positioning wheel 414 is provided with a clamping groove, the cross section of the clamping block The cross-sectional shape is the same as that of the card slot. For example, the card block is set to a V-shaped structure, the card slot is set to a V-shaped groove, the card block is buckled into the card slot, and the two form a card slot connection, or the lower end surface of the rack 415 is provided with a card slot. (not marked in the figure), the positioning wheel 414 is provided with a clamping block, and the two can still form a slot connection. Optionally, the positioning wheel 414 adopts a V-shaped wheel in the related art, and the clamping block of the rack 415 is set to a V-shaped structure. , through the connection between the rack 415 and the slot of the positioning wheel 414, the positioning of the board carrier device 3 is realized, so that the positioning of the board carrier device 3 no longer relies on the appearance positioning, which improves the positioning accuracy of the board carrier device 3 and reduces the overall processing time. The processing difficulty of the parts is reduced, and the equipment cost is reduced.

The support wheel 413 is located on the lower side of the support plate 416. During the operation of the carrier device 3, the support wheel 413 and the support plate 416 remain in a fit state. The support wheel 413 supports the support plate 416. Through the connection between the rack 415 and the positioning wheel 414 The meshing effect and the support of the support wheel 413 and the support plate 416 realize the suspension support of the plate carrier device 3 .

The power mechanism 42 includes a motor assembly 421, a magnetic fluid 422, a coupling 423, a power gear 424, a bearing seat 425 and a power rotating shaft 426. The bearing seat 425 is connected to the chamber of the vacuum chamber. A pair of bearing seats 425 is provided. The pair of bearing seats 425 is located on both sides of the positioning support mechanism 41 and is arranged on the top of the vacuum chamber. The chamber of the vacuum chamber is the working area and moving area of the silicon wafer. The power rotating shaft 426 penetrates a pair of bearing seats 425 and is rotationally connected with the pair of bearing seats 425. The axis of the power rotating shaft 426 is perpendicular to the moving direction of the carrier device 3. A power gear 424 is provided on the outer surface of the power rotating shaft 426. The power gear 424 and the rack 415 Engage to achieve motion transmission. One end of the power rotating shaft 426 is connected to the magnetic fluid 422 through the coupling 423. The magnetic fluid 422 is connected to the motor assembly 421 through a fastening mechanism. The axis of the power rotating shaft 426, the axis of the coupling 423, and the magnetic fluid The axis of 422 and the axis of motor assembly 421 are collinear. As shown in Figure 11, the coupling 423, power gear 424, bearing seat 425 and power rotating shaft 426 are located inside the vacuum chamber, the motor assembly 421 and the magnetic fluid 422 are located outside the vacuum chamber, and the mounting surface of the magnetic fluid 422 is in contact with the vacuum chamber. The outer surface of the body is connected, that is, the mounting surface 4221 of the magnetic fluid 422 is connected to the chamber frame 140 of the vacuum chamber. The magnetic fluid 422 is used to isolate the inside and outside of the vacuum chamber to ensure the sealing in the chamber. The motor assembly 421 will power the vacuum chamber. It is transferred to the inside of the vacuum chamber through the magnetic fluid 422.

In one embodiment, as shown in FIG. 8 , the magnetic fluid 422 may be in the shape of a magnetically permeable metal cylinder.

In one embodiment, the magnetic fluid 422 and the motor assembly 421 are connected through fastening mechanisms such as bolts.

In this embodiment, the power mechanism 42 drives the plate carrier device 3 to move through the meshing effect of the power gear 424 and the rack 415. The transmission efficiency of the power gear 424 and the rack 415 is higher than the transmission using a roller structure in the related art. efficiency, and the positioning accuracy of the power gear 424 and the rack 415 transmission is high. The operating position of the carrier device 3 in the cavity has a small difference from the theoretical value, which is conducive to the refined management of the entire equipment. The meshing of the power gear 424 and the rack 415 It is located at the top of the carrier device 3. For large carrier boards of mass production machines, the operational stability of the carrier device 3 is improved, effectively reducing the risk of silicon chip fragments.

Optionally, at least one power mechanism 42 is provided, and at least one power mechanism 42 along the moving direction of the carrier device 3 is provided in the vacuum chamber. In this embodiment, at least one power mechanism 42 is provided, and at least one power mechanism 42 along the moving direction of the carrier device 3 is distributed in the vacuum chamber 14 . A support component 417 is distributed on the bracket 411 to ensure the positioning function and power transmission requirements of the carrier device 3 during operation.

Optionally, the positioning mechanism 43 is provided at the bottom of the vacuum chamber, the positioning support mechanism 41 is connected to the upper end of the plate carrier device 3 , and the positioning mechanism 43 is connected to the lower end of the plate carrier device 3 . As shown in Figure 7, the distance between the positioning mechanism 43 and the positioning support mechanism 41 matches the size of the plate carrier device 3 in the chamber height direction of the vacuum chamber. The positioning support mechanism 41 is connected to the upper frame plate 301 of the plate carrier device 3. The upper end of the plate carrier device 3 is positioned and supported. The positioning mechanism 43 is connected to the lower frame plate 302 of the plate carrier device 3 to position the lower end of the plate carrier device 3 .

The positioning mechanism 43 includes a positioning bracket 431 and a positioning assembly 430. The length direction of the positioning bracket 431 is parallel to the moving direction of the carrier device 3. The positioning bracket 431 is connected to the bottom inside the vacuum chamber 14, and the positioning bracket 431 is arranged parallel to the bracket 411. .

Optionally, the positioning component 430 is provided with at least one positioning component 430 arranged on the positioning bracket 431 along the moving direction of the carrier device 3. The positioning component 430 includes a positioning fixing plate 432 and a positioning rod 433. For example, the positioning component 430 includes a positioning bracket 431. Fixed plate 432 and a pair of positioning rods 433. The positioning rods 433 are equipped with rollers 434. The rollers 434 are in contact with the end surfaces of the plate carrier device 3. The size of the lower end of the plate carrier device 3 gradually decreases at both ends in its moving direction. In one embodiment, a pair of positioning rods 433 are symmetrically located on both sides of the positioning fixed plate 432, and the distance between the rollers 434 is greater than the width of the lower frame plate 302. When the power mechanism 42 drives the plate carrier device 3 to move, the plate carrier device 3 The lower frame plate 302 moves between a pair of positioning rods 433 of the positioning assembly 430, and the roller 434 contacts the end surface of the lower frame plate 302, thereby positioning and limiting the movement of the plate carrier device 3, so that the plate carrier device 3 is moving remain stable during the process.

In order to ensure that the lower frame plate 302 of the carrier device 3 can accurately enter between the pair of positioning rods 433 of the positioning assembly 430, the lower frame plate 302 is provided with a pointed structure at both ends of the moving direction, that is, the two ends of the lower frame plate 302 are The size is gradually reduced, so that it can be easily and accurately entered between a pair of positioning rods 433 between different positioning assemblies 430 .

In this embodiment, the transmission structure 4 uses the support wheel 413 to support the support plate 416 and the positioning wheel 414 to support the rack 415 to support and position the plate carrier device 3, thereby realizing the suspension and support of the plate carrier device 3, and Through the positioning effect of the positioning mechanism 43 on the lower frame plate 302, the carrier device 3 is positioned and limited. The motor assembly 421 starts to drive the power gear 424 to rotate through the magnetic fluid 422 and the coupling 423. The power gear 424 meshes with the rack 415. Connection, the rotation of the power gear 424 drives the rack 415 to run along the moving space, thereby realizing the movement of the carrier device 3 between different vacuum chambers.

The transmission structure 4 of this embodiment can be used for power transmission of its equipment, and is not limited to vacuum coating equipment.

As shown in Figures 13-15, the variable pitch structure 8 includes a variable pitch power component 81, a variable pitch transmission component 82, a telescopic component 83 and a docking component 84. The variable pitch power component 81 is connected to the variable pitch transmission component 82. The variable pitch transmission component 82 is connected to the telescopic component 83, and the telescopic component 83 is connected to the docking component 84. The variable-pitch power component 81 controls the movement of the carrier device 3 through the variable-pitch transmission component 82, the telescopic component 83, and the docking component 84, for example, controlling the carrier device 3 The distance between the loaded silicon wafer 7 and at least one of the special gas spray device 5 and the heat source 22 is set.

The variable pitch structure 8 is arranged on the vacuum chamber 14. The variable pitch structure 8 also includes a mounting bracket 85. The variable pitch power component 81 and the variable pitch transmission component 82 are arranged on the mounting bracket 85. The mounting bracket 85 is arranged outside the vacuum chamber 14. On the side, the outer surface of the vacuum chamber 14 is located outside the vacuum chamber 14 .

The variable-pitch power assembly 81 includes a motor 810 . The output shaft of the motor 810 is connected to the variable-pitch transmission assembly 82 through a first bearing 86 and transmits power to the variable-pitch transmission assembly 82 .

The variable pitch transmission assembly 82 includes a screw nut 821, a screw rod 822 and a pair of fixed seats 823. The pair of fixed seats 823 are provided on the mounting bracket 85. The first end of the screw rod 822 is rotationally connected to a fixed seat 823. The second end of 822 rotates through another fixed seat 823 and is connected to the first bearing 86. The variable pitch power assembly 81 transmits power to the screw 822 through the first bearing 86. The screw nut 821 is spirally connected to the screw 822. And the screw nut 821 is slidingly connected to the mounting bracket 85. When the screw rod 822 rotates, the screw nut 821 moves along the axial direction of the screw rod 822.

The variable-pitch transmission assembly 82 also includes an isolation plate 824. The isolation plate 824 is connected to the installation bracket 85 and the variable-pitch power assembly 81. The isolation plate 824, the installation bracket 85 and the variable-pitch power assembly 81 form an isolation space. The wires of the variable-pitch transmission assembly 82 The lever nut 821, the screw rod 822 and a pair of fixed seats 823 are located in the isolation space, and the isolation plate 824 plays a certain protective role on the variable pitch transmission assembly 82.

The variable pitch structure 8 also includes at least one sensor 88 . The sensor 88 is used to sense the position of the screw nut 821 to prevent the screw nut 821 from colliding with the fixed base 823 .

The telescopic component 83 includes a movable flange 831, a bellows 832 and a fixed flange 833. The two ends of the bellows 832 are connected to the movable flange 831 and the fixed flange 833. The fixed flange 833 is connected to the outer surface of the vacuum chamber 14. The flange 149 is connected, and a sealing ring 150 is provided between the fixed flange 833 and the butt flange 149 to ensure the sealing of the bellows 832 and the vacuum chamber 14, so that the bellows 832 and the vacuum chamber 14 are in the same vacuum environment. The flange 831 is connected to the screw nut 821 , and the telescopic assembly 83 is located outside the vacuum chamber 14 .

The docking assembly 84 includes a docking rod 841 and a docking block 842. The first end of the docking rod 841 is inserted into the bellows 832 and connected to the moving flange 831. The second end of the docking rod 841 is connected to the docking block 842. The docking block 842 is located in the vacuum chamber 14 Inside, the carrier device 3 loads the silicon wafer 7. The carrier device 3 is arranged in the cavity 1401 of the vacuum chamber 14 through the positioning support mechanism 41 and the positioning mechanism 43. The positioning support mechanism 41 includes a bracket 411, and the positioning mechanism 43 includes a positioning bracket 431. , the length direction of the bracket 411 and the positioning bracket 431 is parallel to the running path of the carrier device 3 between different vacuum chambers 14 , the docking block 842 is connected to the bracket 411 and the positioning bracket 431 respectively, and the bracket 411 and the positioning bracket 431 are connected to the vacuum chamber. A sliding device 87 is provided between 14. The sliding device 87 includes a fixed plate 872 and a sliding block 871. The fixed plate 872 is connected to the vacuum chamber 14. The sliding block 871 is connected to the bracket 411 and the positioning bracket 431 respectively. The sliding block 871 is connected to the bracket 411 and the positioning bracket 431. The fixed plate 872 is slidingly connected.

During the implementation of the variable pitch structure 8, the variable pitch power component 81 is started to drive the screw rod 822 to rotate. The rotation of the screw rod 822 causes the screw nut 821 to move along the axial direction of the screw rod 822. The movement of the screw nut 821 simultaneously drives the moving flange 831. Along the axial movement of the screw rod 822, the movement of the movable flange 831 drives the docking block 842 to move, and the movement of the docking block 842 drives the bracket 411 to move. The plate carrier device 3 is suspended and supported on the bracket 411. The movement of the bracket 411 drives the plate carrier device 3 to move synchronously. , thereby realizing the adjustment of the distance between the silicon wafer 7 loaded in the carrier device 3 and at least one of the special gas spray device 5 and the heat source 22. In this embodiment, the distance between the silicon wafer 7 and the special gas spray device is adjusted through the variable pitch transmission assembly 82. The distance between at least one of the shower device 5 and the heat source 22 is adjusted. The adjustment range is wide, which can meet the distance requirements of different silicon wafers and different processes; in this embodiment, the fixed flange 833 of the telescopic component 83 and the vacuum chamber The butt flange 149 on the outer side of 14 is connected. A sealing ring 150 is provided between the fixed flange 833 and the butt flange 149 to ensure the sealing between the bellows 832 and the vacuum chamber 14, and the moving flange 831 and the variable pitch transmission assembly 82. The connection realizes the reciprocating movement of the carrier device 3 in the axial direction, and adjusts the distance between the silicon wafer 7 and at least one of the special gas spray device 5 and the heat source 22 .

As shown in Figure 14, there are multiple variable pitch structures 8. The multiple variable pitch structures 8 are distributed at the upper and lower ends of the vacuum chamber 14 along the height direction of the vacuum chamber 14. The multiple variable pitch structures 8 are installed along the carrier plate. The running path distribution of 3 ensures that the carrier device 3 remains stable during the spacing adjustment process.

The variable pitch structure 8 of this embodiment can be used for variable pitch adjustment of its equipment, and is not limited to vacuum coating equipment.

As shown in Figure 15, a pair of carrier devices 3 are generally disposed in the vacuum chamber 14. The carrier devices 3 are arranged symmetrically with respect to the axis of the vacuum chamber 14, and a plurality of variable pitch structures 8 are respectively provided on the chamber doors of the vacuum chamber 14. On both sides, a plurality of pitch-variable structures 8 respectively adjust the distance between a pair of carrier plate devices 3 and at least one of the special gas spray device 5 and the heat source 22 .

In other embodiments, the docking block 842 of the docking assembly 84 may be directly connected to the carrier device 3 .

During the implementation process of this embodiment, the silicon wafer 7 is loaded on the carrier device 3. The positioning support mechanism 41 suspends, supports and positions the carrier device 3. The positioning mechanism 43 positions and limits the carrier device 3 below. The power mechanism 42 The carrier device 3 is driven to move along the operating path, and the power mechanism 42 transports the carrier device 3 to the loading preheating vacuum chamber 12. The heater 21 in the loading preheating vacuum chamber 12 is started, and the heat radiation of the heater 21 affects the load. The silicon wafers 7 loaded in the plate device 3 are preheated before the coating process; the power mechanism 42 transports the plate carrier device 3 to the first coating vacuum chamber 13, and the transmission structure 4 is started to transfer the silicon wafers 7 loaded in the plate carrier device 3 to the first coating vacuum chamber 13. The distance between the special gas spray device 5 and the heat source 22 in the first coating vacuum chamber 13 is adjusted to the set value. The heater 21 in the first coating vacuum chamber 13 is started, the heat source 22 is started, and the special gas spray device 5 The released special gas is decomposed by the heat source 22, and an intrinsic amorphous silicon film is coated on one side of the silicon wafer 7; the power mechanism 42 transports the carrier device 3 to the second coating vacuum chamber 15, and the transmission structure 4 is started to move the carrier device 3. The distance between the loaded silicon wafer 7 and the special gas spray device 5 and heat source 22 in the second coating vacuum chamber 15 is adjusted to the set value. The heater 21 in the second coating vacuum chamber 15 is started, and the heat source 22 is started. , the special gas released by the special gas spray device 5 is decomposed by the heat source 22, and an N-type doped silicon-based film is plated on one side of the silicon wafer 7; the power mechanism 42 transports the carrier device 3 to the carrier conversion vacuum chamber 16, carrying A conversion mechanism is provided in the plate conversion vacuum chamber 16. Through the conversion mechanism, the plate carrier device 3 on one side of the transmission structure 4 is converted to the other side transmission structure 4, and the positions of the plate carrier devices 3 on both sides of the transmission structure 4 are replaced. The coated surface of the silicon wafer loaded in the carrier device 3 faces outside the cavity, and the uncoated surface faces the heat source 22; the power mechanism 42 transports the converted carrier device 3 to the third coating vacuum chamber 17, and the transmission structure 4 starts to The distance between the silicon wafer 7 loaded in the carrier device 3 and the special gas spray device 5 and heat source 22 in the third coating vacuum chamber 17 is adjusted to the set value, and the heater 21 in the third coating vacuum chamber 17 is started. The heat source 22 is started, and the special gas released by the special gas spray device 5 is decomposed by the heat source 22, and an intrinsic amorphous silicon film is coated on the other side of the silicon wafer 7, that is, the uncoated side; the power mechanism 42 transports the carrier device 3 to the third The fourth coating vacuum chamber 18, the transmission structure 4 is started, and the distance between the silicon wafer 7 loaded in the carrier device 3 and the special gas spray device 5 and heat source 22 in the fourth coating vacuum chamber 18 is adjusted to the set value. The heater 21 in the four-coating vacuum chamber 18 is started, the heat source 22 is started, the special gas released by the special gas spray device 5 is decomposed by the heat source 22, and a P-type doped silicon-based film is plated on the other side of the silicon wafer 7; power mechanism 42. Transport the coated carrier device 3 to the unloading heat dissipation vacuum chamber 19. A cooling structure is provided in the unloading heat dissipation vacuum chamber 19. The cooling structure provides normal temperature gas to dissipate and cool the silicon wafer. After the cooling is completed, the power mechanism 42 drives the carrier. Board device 3 flows out of the device.

This embodiment relies on the carrier device 3 capable of double-sided coating and the carrier switching vacuum chamber 16 to realize the function of double-sided coating of the silicon wafer 7 on a closed production line, and during the coating process, the silicon wafer 7 is placed on the carrier. The conversion vacuum chamber 16 realizes the conversion of the silicon wafer coating surface, and the silicon wafer is no longer in contact with the atmosphere, eliminating the adverse effects of water vapor, oxygen, dust and other factors in the air on the performance of the silicon wafer 7, and improving the production quality of the silicon wafer 7 .

In this embodiment, the overall vacuum chamber is distributed in the form of an assembly line, which shortens the operating path of the carrier device 3. At the same time, there is no need to add an additional automated turning mechanism to convert the silicon wafer coating surface, which reduces equipment costs and saves equipment space. area, improves the usage efficiency of the customer's site, and achieves the effects of high equipment process integration, high equipment operation efficiency and low equipment cost.

Other connection methods that enable the rack 415 to cooperate with the positioning wheel 414 and make the rack 415 and the positioning wheel 414 relatively movable are also within the protection scope of this application.

Example 2:

As shown in FIG. 16 , the difference between this embodiment and Embodiment 1 is that in Embodiment 1, the first door 141 and the second door 142 of the front door assembly 1410 are distributed along the y direction, and the first door 141 and the second door 142 of the rear door assembly 1430 are distributed along the y direction. The three chamber doors 143 and the fourth chamber door 144 are distributed along the y direction. At least one of the front chamber door assembly 1410 and the rear chamber door assembly 1430 opens or closes the chamber door in the y direction. In this embodiment, the front chamber door assembly The first cavity door 141 and the second cavity door 142 of 1410 are distributed along the z direction, the third cavity door 143 and the fourth cavity door 144 of the rear cavity door assembly 1430 are distributed along the z direction, the front cavity door assembly 1410 and the rear cavity door assembly 1430 are distributed along the z direction. At least one of 1430 opens or closes the chamber door in the z direction.

Embodiment three:

The difference between this embodiment and Embodiment 1 is that in Embodiment 1, the valve chamber 6, the coating vacuum chamber 1, the coating vacuum chamber 2 and the carrier conversion vacuum chamber 16 form a silicon wafer coating production line, while in this embodiment , the valve chamber 6, the coating vacuum chamber 1, the coating vacuum chamber 2 and the carrier conversion vacuum chamber 16 form multiple silicon wafer coating production lines, one production line can be used for coating on one side of the silicon wafer 7, and one growth line can be used for Coating on the other side of the silicon wafer 7. In addition, the carrier plate conversion vacuum chamber 16 can also form a growth line for conversion of the silicon wafer coating surface. The silicon wafer 7 is coated in the sealed carrier plate conversion vacuum chamber 16. After conversion, the silicon wafer 7 is no longer in contact with the atmosphere, eliminating the adverse effects of water vapor, oxygen, dust and other factors in the air on the performance of the silicon wafer 7, and improving the production quality of the silicon wafer 7.

In other embodiments, the variable-pitch transmission assembly 82 may adopt a rack-and-pinion transmission structure. The gear and the rack are meshed and connected. The rack is connected to the moving flange 831 . The variable-pitch power assembly 81 drives the gear to rotate, and the gear drives the rack through meshing. Move, the movement of the rack drives the movement of the moving flange 831, and the subsequent spacing adjustment process is the same as in the first embodiment, and will not be described in detail here; or the variable pitch transmission assembly 82 can adopt a gear transmission belt transmission structure, and the gear drives the transmission belt transmission. The moving method The flange 831 is arranged on the transmission belt, the variable pitch power assembly 81 drives the gear to rotate, the gear drives the transmission belt to move, the movement of the transmission belt drives the moving flange 831 to move, the subsequent spacing adjustment process is the same as in the first embodiment, and will not be described in detail here; The pitch transmission component 82 can adopt a cam structure. The variable pitch power component 81 is connected to the active end of the cam, and the driven end of the cam is connected to the moving flange 831. The variable pitch power component 81 drives the cam to rotate, and the driven end of the cam drives the moving method. The orchid 831 moves, and the subsequent spacing adjustment process is the same as that in Embodiment 1, and will not be described again.

In other embodiments, the telescopic assembly 83 may adopt a multi-layer sleeve structure, the outer sleeve is connected to the vacuum chamber 14, the inner sleeve is located inside the outer sleeve, and the inner sleeve is slidingly connected to the outer sleeve. To maintain sealing, the first end of the inner sleeve is connected to the docking rod 841, and the second end of the inner sleeve is connected to the variable pitch transmission assembly 82, so that the docking rod 841 can be moved through the multi-layer sleeve structure.

In summary, the benefits of this application include:

1) This application transmits the power of the power mechanism to the carrier device through the meshing connection of the power gear and the rack, which not only improves the transmission efficiency, but also has a small difference between the operating position of the carrier device in the cavity and the theoretical value, which is beneficial to the overall equipment. Delicate management.

2) In this application, the meshing position of the power gear and the rack is located at the top of the carrier device. For mass production machines, the operational stability of the carrier device is improved, effectively reducing the risk of silicon wafer fragments.

3) In this application, the rack and the positioning wheel are connected by slots to realize the positioning and support of the plate carrier device, so that the positioning of the plate carrier device no longer relies on the shape positioning, which improves the positioning accuracy of the operation of the plate carrier device and reduces the overall cost. The processing difficulty of the workpiece is reduced, which reduces the equipment cost.

4) In this application, at least one power mechanism along the moving direction of the carrier device is fixed in the vacuum chamber, and at least one support component along the moving direction of the carrier device is fixed on the bracket, thereby ensuring the positioning of the carrier device during operation. function and transmission power requirements.

5) In this application, at least one positioning component is fixed on the positioning bracket along the moving direction of the board carrier device. The positioning component positions and limits the board carrier device below the board carrier device to ensure the stability of the board carrier device during operation. .

Claims

A transmission structure includes a positioning support mechanism and a power mechanism. The positioning support mechanism includes a rack. The rack is arranged on a carrier device in a vacuum chamber. The power mechanism includes a power gear. The rack is connected to the The power gear meshing connection.
The transmission structure according to claim 1, wherein the positioning support mechanism further includes a bracket, a support assembly and a support plate, the length direction of the bracket is parallel to the moving direction of the plate carrier device, and the bracket is parallel to the moving direction of the plate carrier device. The top inside the vacuum chamber is connected, and the support plate is connected with the carrier plate device.
The transmission structure according to claim 2, wherein the support component is provided with at least one support component, and at least one support component along the moving direction of the carrier device is disposed on the bracket.
The transmission structure according to claim 1, wherein at least one of the power mechanisms is provided, and at least one of the power mechanisms along the moving direction of the carrier device is disposed in the vacuum chamber.
The transmission structure according to claim 2 or 3, wherein the support assembly includes a wheel mounting frame, a supporting wheel and a positioning wheel, the supporting wheel and the positioning wheel are provided on the wheel mounting frame, the supporting wheel Located below the support plate, the support wheel fits the support plate, the positioning wheel is located below the rack, and the positioning wheel is connected with the rack in a slot.
The transmission structure according to claim 1 or 4, wherein the power mechanism further includes a motor assembly, magnetic fluid, a coupling, a bearing seat and a power rotating shaft, the bearing seat is connected to the chamber of the vacuum chamber , the power gear is arranged on the outer surface of the power rotating shaft, the power rotating shaft is connected to the magnetic fluid through the coupling, and the magnetic fluid is connected to the motor assembly through a fastening mechanism.
The transmission structure according to claim 6, wherein the coupling, the power gear, the bearing seat and the power rotating shaft are located inside the vacuum chamber, and the motor assembly and the magnetic fluid are located inside the vacuum chamber. Outside the vacuum chamber, the mounting surface of the magnetic fluid is connected to the outer surface of the vacuum chamber.
The transmission structure according to claim 1, further comprising a positioning mechanism, the positioning mechanism is arranged at the bottom of the chamber of the vacuum chamber, the positioning support mechanism is connected to the upper end of the carrier device, the positioning mechanism The mechanism is connected to the lower end of the carrier device.
The transmission structure according to claim 1 or 8, wherein the positioning mechanism includes a positioning bracket and a positioning assembly, the length direction of the positioning bracket is parallel to the moving direction of the carrier device, and the positioning bracket is parallel to the positioning assembly. Bottom connection inside the vacuum chamber.
The transmission structure according to claim 9, wherein the positioning component is provided with at least one positioning component, and at least one positioning component is arranged on the positioning bracket along the moving direction of the plate carrier device, and the positioning component includes a positioning fixation plate and a positioning rod, the positioning rod is provided with a roller, the roller is in contact with the end surface of the plate carrier device, and the size of the lower end of the plate carrier device gradually decreases at both ends in its moving direction.