WO2023245360A1

WO2023245360A1 - Heat dissipation part and manufacturing method therefor, middle frame part, housing part, and terminal device

Info

Publication number: WO2023245360A1
Application number: PCT/CN2022/099924
Authority: WO
Inventors: 陈安琪; 黄犊子; 刘明艳
Original assignee: 北京小米移动软件有限公司
Priority date: 2022-06-20
Filing date: 2022-06-20
Publication date: 2023-12-28
Also published as: CN117652213A

Abstract

The present disclosure relates to a heat dissipation part and a manufacturing method therefor, a middle frame part, a housing part, and a terminal device. The heat dissipation part comprises a heat dissipation assembly and a heat dissipation fan assembly; the heat dissipation assembly comprises an evaporator and a condenser, and the condenser and the evaporator are communicated by means of a pipe to form a loop; the heat dissipation fan assembly and the heat dissipation assembly are stacked in a first preset direction, and the orthographic projections of the heat dissipation fan assembly and the condenser in the first preset direction at least partially overlap. According to the described structure, the heat dissipation fan assembly and the heat dissipation assembly are stacked in the first preset direction, and the orthographic projections of the heat dissipation fan assembly and the condenser in the first preset direction at least partially overlap, so that the heat dissipation part can dissipate heat well by means of cooperation of the heat dissipation assembly and the heat dissipation fan assembly, and when the heat dissipation part is assembled in a terminal device, the heat dissipation fan assembly does not occupy the space near heat source devices such as a CPU, thereby facilitating the overall thinning of the terminal device.

Description

Heat dissipation components and manufacturing methods thereof, middle frame components, housing components and terminal equipment

Technical field

The present disclosure relates to the field of terminal equipment, and in particular, to a heat dissipation component and a manufacturing method thereof, a middle frame component, a housing component and a terminal device.

Background technique

Terminal devices such as mobile phones and tablets have become indispensable technological products in people's life, study and entertainment. With the development of terminal equipment, the number of cores of the CPU (Central Processing Unit, central processing unit) used by it has increased, and its performance has increased day by day, causing the terminal equipment to generate more and more heat. Especially in recent years, temperature rise experience has gradually become an important consideration for consumers when purchasing terminal equipment. In the related art, in order to dissipate heat from terminal equipment, a cooling fan structure is provided on one side of a heat source device such as a CPU. However, the arrangement of the cooling fan structure increases the thickness of the terminal device and also occupies the space of the motherboard area, which is not conducive to the thin and light design of the terminal device.

Contents of the invention

In view of this, embodiments of the present disclosure propose a heat dissipation component and a manufacturing method thereof, a middle frame component, a housing component and a terminal device to solve some or all of the above technical problems.

According to a first aspect of an embodiment of the present disclosure, a heat dissipation component is proposed, and the heat dissipation component includes:

The heat dissipation component includes an evaporator and a condenser, and the condenser and the evaporator are connected through pipes to form a loop;

The heat dissipation fan assembly is stacked with the heat dissipation assembly in the first preset direction, and the orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction at least partially overlaps.

According to a second aspect of the embodiment of the present disclosure, a manufacturing method of a heat dissipation component is proposed. The manufacturing method is used to manufacture the heat dissipation component as described above; the manufacturing method includes:

providing a first cover plate and a second cover plate;

forming a capillary structure on at least one of the first cover plate and the second cover plate;

Assemble the first cover plate and the second cover plate to form the heat dissipation assembly;

A cooling fan assembly is provided; wherein the cooling fan assembly and the heat dissipation assembly are stacked in a first preset direction, and at least part of the orthographic projection of the cooling fan assembly and the condenser in the first preset direction is overlapping.

According to a third aspect of the embodiment of the present disclosure, a middle frame component is proposed, including a middle frame and a heat dissipation component as described above, and the heat dissipation component is provided on the middle frame.

According to a fourth aspect of the embodiment of the present disclosure, a housing component is proposed, including a housing and a heat dissipation component as described above. The heat dissipation component is disposed inside the housing, and the heat dissipation fan assembly is located on the heat dissipation component. The side of the assembly facing away from the housing.

According to a fifth aspect of the embodiment of the present disclosure, a terminal device is proposed, including the heat dissipation component as described above. The terminal device further includes a heat source area, and the heat source area is in the positive direction of the heat dissipation component in a first preset direction. The projections at least partially overlap, and the orthographic projections of the cooling fan assembly and the heat source area in the first preset direction do not overlap, and the orthographic projections of the cooling fan assembly and the condenser in the first preset direction at least partial overlap;

The terminal equipment includes a housing, and the housing is provided with an air inlet and an air outlet.

The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: by being stacked with the heat dissipation assembly in a first preset direction, and the heat dissipation fan assembly and the condenser in the first preset direction. The orthographic projection at least partially overlaps, so that the heat dissipation component can dissipate heat well with the cooperation of the heat dissipation assembly and the cooling fan assembly, and when assembled in the terminal device, the cooling fan assembly will not occupy the space near the heat source device such as the CPU, thus having It is conducive to the overall thinning of terminal equipment.

It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and do not limit the present disclosure.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting any creative effort.

Figure 1 is a schematic structural diagram of a heat dissipation structure according to an exemplary embodiment of the present disclosure;

Figure 2 is a structural schematic diagram and partial cross-sectional view of a heat dissipation structure according to an exemplary embodiment of the present disclosure, wherein; the partial cross-sectional view in Figure 2 illustrates the internal structure of each part of the heat dissipation component;

Figure 3 is a schematic structural diagram of another heat dissipation structure according to an exemplary embodiment of the present disclosure;

Figure 4 is a side view of position A shown in Figure 3;

Figure 5 is a schematic structural diagram of yet another heat dissipation structure according to an exemplary embodiment of the present disclosure;

Figure 6 is a schematic structural diagram of a middle frame component according to an exemplary embodiment of the present disclosure;

Figure 7 is a partial structural schematic diagram of a terminal device according to an exemplary embodiment of the present disclosure;

Figure 8 is a cross-sectional view of the terminal equipment shown in Figure 7;

Figure 9 is a partial structural schematic diagram of another terminal device according to an exemplary embodiment of the present disclosure;

Figure 10 is a cross-sectional view of the terminal equipment shown in Figure 9;

Figure 11 is a partial structural schematic diagram of yet another terminal device according to an exemplary embodiment of the present disclosure;

FIG. 12 is a method flow chart of a manufacturing method of a heat dissipation component according to an exemplary embodiment of the present disclosure.

Figure 13 is a schematic structural diagram of a first cover plate and a second cover plate according to an exemplary embodiment of the present disclosure.

Detailed ways

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this disclosure.

The terminology used in the embodiments of the present disclosure is for the purpose of describing specific embodiments only and is not intended to limit the embodiments of the present disclosure. As used in the embodiments of the present disclosure and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

The heat dissipation component, the middle frame component, the housing component and the terminal equipment will be described in detail below with reference to FIGS. 1 to 11 .

Please refer to FIG. 1 , and when necessary, in combination with FIG. 2 , the heat dissipation component 100 includes a heat dissipation component a and a heat dissipation fan component b. The heat dissipation assembly a includes an evaporator 10 and a condenser 20. The condenser 20 and the evaporator 10 are connected through pipes to form a loop, and a working fluid (not shown) for heat dissipation flows in the loop. The cooling fan assembly b and the cooling assembly a are stacked in the first preset direction, and the orthographic projections of the cooling fan assembly b and the condenser 20 in the first preset direction at least partially overlap.

In some embodiments, the condenser 20 may be disposed at the opposite end of the evaporator 10 . The fact that the condenser 20 is disposed at the opposite end of the evaporator 10 may be understood to mean that the evaporator 10 and the condenser 20 are spaced apart along the second preset direction. That is, the evaporator 10 and the condenser 20 are located at two ends facing away from each other in the second preset direction. For example, the second preset direction may be the length direction L of the heat dissipation component 100 . The working fluid may be water or other fluids with heat dissipation functions such as refrigerants that can be used in the heat dissipation structure. When the working fluid circulates in the heat dissipation component a, it absorbs heat and vaporizes when flowing through the evaporator 10, and can release heat and liquefy when flowing through the condenser 20.

It should be explained that the heat dissipation fan assembly b and the heat dissipation assembly a are stacked in a first preset direction. It can be understood that the heat dissipation fan assembly b is stacked on at least one side of the heat dissipation assembly a along the first preset direction. The heat dissipation end of the fan assembly b faces the side of the heat dissipation assembly a, and the heat dissipation fan assembly b and the heat dissipation assembly a may or may not be connected. The first preset direction can be understood as the thickness direction T of the heat dissipation component 100 .

In some embodiments, by stacking the cooling fan assembly b and the cooling assembly a in the first preset direction, and at least partially overlapping the orthographic projections of the cooling fan assembly b and the condenser 20 in the first preset direction, it is possible to With the cooperation of the heat dissipation component a and the cooling fan component b, the heat dissipation is better, and when assembled in a terminal device, the cooling fan component does not occupy the space near the heat source device such as the CPU, which is beneficial to the overall thinning of the terminal device.

Based on the above embodiment, the cooling fan assembly b includes a cooling fan 71 and a cooling fin 72 . The cooling fan 71 has a cooling fan outlet 711 , and the cooling fan outlet 711 is arranged toward the cooling fins 72 , so that the air flow blown out by the cooling fan outlet 711 can blow toward the cooling fins 72 , thereby blowing the cooling fins 72 and their surroundings. Heat is blown away for excellent heat dissipation. Optionally, the heat dissipation fins 72 can be disposed directly opposite the heat dissipation fan outlet 711 .

In some embodiments, the heat dissipation fins 72 are provided on the heat dissipation component a to guide the heat on the heat dissipation component a to the heat dissipation fins 72 to dissipate heat through the air flow blown by the cooling fan 71 . Furthermore, the heat dissipation fins 72 may be provided on the heat dissipation component a through at least one of welding, bonding or plugging. The heat dissipation fins 72 may be made of copper, stainless steel, aluminum or other materials with thermal conductivity, and the heat dissipation fins 72 may be serrated heat sinks or other heat sink structures.

In some embodiments, the cooling fan 71 may be a centrifugal fan or an axial fan, such as a micro turbofan. The size of the cooling fan 71 in the second preset direction is less than or equal to 20 mm. The size of the cooling fan 71 in the third preset direction is less than or equal to 20mm. Wherein, the second preset direction and the third preset direction are perpendicular. For example, the second preset direction may be the length direction L of the heat dissipation component 100 , and the third preset direction may be the width direction W of the heat dissipation component 100 . Correspondingly, the first preset direction forms an included angle with the plane determined by the second preset direction and the third preset direction. For example, the first preset direction may be perpendicular to the second preset direction and the third preset direction. determined plane.

Based on the above embodiments, the heat dissipation component a may include a first pipe 30 . Evaporator 10 has opposing input 101 and output 102 ends. Condenser 20 has opposing inlet 201 and outlet 202 ends. The first pipe 30 communicates with the output end 102 of the evaporator 10 and the inlet end 201 of the condenser 20 . At least part of the inner wall of the first pipe 30 is provided with a capillary structure, and the capillary structure in the first pipe 30 can be used to store working fluid.

In this way, by arranging the capillary structure in at least part of the inner wall of the first pipe 30, it can be beneficial to store the liquid working fluid present in the first pipe 30, and prevent the formation of liquid droplets in the first pipe and affect the flow of liquid in the first pipe. The flow of steam improves the stability of the heat dissipation component.

Based on the above embodiment, the heat dissipation component a also includes a second pipe 40 and a compensation cavity 50 . The second pipe 40 communicates with the outlet end 202 of the condenser 20 and the input end 101 of the evaporator 10 . The compensation chamber 50 is located between the second pipe 40 and the evaporator 10 and the inner cavity of the compensation chamber 50 is filled with a capillary structure. The working fluid can circulate in the evaporator 10 , the first pipe 30 , the condenser 20 , the second pipe 40 and the liquid replenishing chamber 50 .

It should be noted that the relative positions between the various parts of the evaporator 10, the first pipe 30, the condenser 20, the second pipe 40 and the liquid replenishing chamber 50 can be determined according to the size of the terminal equipment to be heat dissipated. For example: the entire size of the heat dissipation component a along the third preset direction may be 30mm-70mm. The size of the compensation cavity 50 in the second preset direction may be 50mm-120mm. The size of the heat dissipation component a in the first preset direction may be 0.2mm-1mm.

In some embodiments, as shown in FIG. 2 , the inner cavity of the compensation chamber 50 is covered with capillary structures 65 to form a steam retaining wall to prevent steam in the second pipe from flowing into the evaporator 10 , thus avoiding evaporation caused by steam flowing into the evaporator 10 . adverse effects brought about by the device 10.

In some embodiments, the size of the compensation cavity 50 along the third preset direction may be 3mm-20mm. The size of the compensation cavity 50 along the second preset direction may be 30mm-20mm.

Please continue to refer to FIG. 2 . In some embodiments, the evaporator 10 has a first evaporator side wall 11 and a second evaporator side wall 12 that are oppositely arranged along a first preset direction. A capillary structure 61 is provided on the side wall 12 of the second evaporator.

The size of the evaporator 10 along the third preset direction may be 10mm-40mm. The size of the evaporator 10 along the second preset direction may be 10mm-40mm.

The size range of the inner cavity of the evaporator 10 along the first preset direction is 0.1mm-0.9mm. The thickness of the capillary structure 61 can be set to 0.03mm-0.3mm.

Of course, in some other embodiments, the capillary structure may be provided on the side wall of the second evaporator without the capillary structure being provided on the side wall of the first evaporator. For details about the capillary structure provided on the side wall of the second evaporator, refer to the above related description. It should be noted that when the heat dissipation component is used in terminal equipment, the side wall of the evaporator is provided with a capillary structure, which can be arranged on the side closer to the heat source to store the working fluid in the capillary structure, which is beneficial to improving evaporation. The evaporation effect of the heat sink improves the heat dissipation effect of the heat dissipation component.

Please continue to refer to FIG. 2 . The first pipeline 30 has a first pipeline side wall 31 and a second pipeline side wall 32 arranged oppositely along the first preset direction. The inner wall of the first pipeline side wall 31 is provided with a capillary structure 631 , the inner wall of the second pipe side wall 32 is provided with a capillary structure 632.

The first preset direction can also be understood as the thickness direction T of the heat dissipation component a.

The size of the first pipe 20 along the third preset direction may be 5mm-40mm. The size of the first pipe 20 along the second preset direction may be 50mm-120mm.

Here, the size range of the inner cavity of the first pipe 30 along the first preset direction is 0.1mm-0.9mm. The thickness of the capillary structure 631 can be set to 0.001mm-0.3mm, and the thickness of the capillary structure 632 can be set to 0.001mm-0.3mm.

In some embodiments, the inner cavity of the first pipe 30 has a first capillary structure area with a capillary structure and a first expansion cavity area 3013 located outside the first capillary structure area. The first capillary structure area here includes the

capillary structure areas

3011 and 3012 in which the capillary structure 631 is provided.

The size of the first expansion cavity area 3013 along the first preset direction is larger than the size of the first capillary structure area along the first preset direction to provide sufficient circulation of the vaporized working fluid, which is beneficial to ensuring the heat dissipation component a heat dissipation efficiency.

Here, the size of the first expansion cavity region 3013 along the first preset direction is greater than the size of the first capillary structure region along the first preset direction, which can be understood as D3>D1+D2.

In some embodiments, the ratio between the size of the first expansion cavity region 3013 along the first preset direction and the size of the first capillary structure region along the first preset direction is greater than 2, which is more conducive to ensuring that There is enough space in the first pipe 30 for the vaporized working fluid to circulate.

Here, the ratio between the size of the first expansion cavity region 3013 along the first preset direction and the size of the first capillary structure region along the first preset direction is greater than 2, which can be understood as D3>2(D1+D2 ).

Of course, in some other embodiments, the capillary structure may also be provided only on the inner wall of the first pipe side wall or the inner wall of the second pipe side wall. Optionally, the thickness of the capillary structure can be set to 0.001mm-0.3mm. The specific characteristics of the capillary structure and the first pipe can be referred to the above description.

Please continue to refer to FIG. 2 . The second pipeline 40 has a third pipeline side wall 41 and a fourth pipeline side wall 42 arranged oppositely along the first preset direction. The inner wall of the third pipeline side wall 41 is provided with a capillary. Structure 641, the inner wall of the fourth pipe side wall 42 is provided with a capillary structure 642.

The size of the second pipe 40 along the third preset direction may be 5mm-30mm. The size of the second pipe 40 along the second preset direction may be 50mm-120mm. The thickness of the capillary structure 641 and the capillary structure 642 can be set to 0.05mm-1mm respectively. It should be noted that the size range of the second pipe 40 can be adjusted according to actual needs. The above description of the size range of the second pipe 40 is only an example and not a limitation.

In some embodiments, the inner cavity of the second pipe 40 has a second capillary structure area (including the two areas indicated by 4011 and 4012) with a capillary structure and a second expansion chamber located outside the second capillary structure area. Area 4013, this leaves the second pipe with expansion space, so that the working fluid can flow more smoothly, and can prevent the working fluid from freezing and expanding the pipe.

In some embodiments, the size of the second expansion chamber area 4013 in the first preset direction may be 0.03mm-0.5mm, which can well prevent the working fluid from freezing and expanding the tube.

Of course, in other embodiments, a capillary structure may be provided on the inner wall of one of the third pipe side wall and the fourth pipe side wall.

In addition, in some embodiments, the inner cavity of the second pipe 40 may be filled with capillary structures.

Please continue to refer to FIG. 2 , the condenser 20 has a first condenser side wall 21 and a second condenser side wall 22 arranged oppositely along a first preset direction. The first condenser side wall 21 is provided with a capillary structure 621, and the inner wall of the second condenser side wall 22 is provided with a capillary structure 622.

The first preset direction can also be understood as the thickness direction T of the heat dissipation component a. Here, the thickness of both the capillary structure 621 and the capillary structure 622 can be controlled at 0.001mm-0.3mm.

The size of the condenser 20 along the third preset direction (can be understood as the width size) may be 30mm-70mm. The size of the condenser 20 along the second preset direction (can be understood as the length size) may be 10mm-50mm.

Of course, in some other embodiments, the capillary structure may also be provided only on the inner wall of one of the first condenser side wall and the second condenser side wall. Optionally, the size of the capillary structure can be controlled within 0.001mm-0.3mm. For other details of the capillary structure, please refer to the relevant description above.

Please continue to refer to FIG. 2 . In some embodiments, the heat dissipation assembly a has a first cover plate 1001 and a second cover plate 1002 that are stacked along the thickness direction T. The first cover plate 1001 and the second cover plate 1002 At least one is provided with a capillary structure to form the evaporator 10 , the condenser 20 , the first pipe 30 , the second pipe 40 and the compensation chamber 50 .

Here, the materials of the first cover plate 1001 and the second cover plate 1002 include but are not limited to one or a combination of copper, stainless steel, titanium alloy, etc.

In some embodiments, at least one of the first cover plate 1001 and the second cover plate 1002 is provided with a plurality of support pillars 1003 spaced apart to support the first cover plate 1001 and the second cover plate 1002 to ensure heat dissipation. The shape of the inner cavity of the assembly prevents the adverse effects caused by deformation of the first cover plate 1001 and the second cover plate 1002. A plurality of support columns 1003 are located in the inner cavity of at least one of the evaporator 10 , the condenser 20 , the first pipe 30 , the second pipe 40 and the compensation chamber 50 .

For example, as shown in FIG. 2 , support columns 1003 are provided in the inner cavities of the evaporator 10 , the condenser 20 , the first pipe 30 , the second pipe 40 and the compensation chamber 50 .

Referring to FIG. 1 , an opening 103 is provided between the first pipe 30 and the second pipe 40 . The opening 103 penetrates the first cover plate 1001 and the second cover plate 1002 .

In some embodiments, along the direction from the first pipe 30 to the second pipe 40 , the size of the end of the opening 103 close to the evaporator 10 is larger than the size of the end of the opening 103 close to the condenser 20 , so that the size of the structure close to the end of the evaporator 10 is Provide enough space for thermal expansion.

Please refer to FIG. 1 . In some embodiments, along the direction from the first pipe 30 to the second pipe 40 , the minimum size D4 of the opening 103 is greater than or equal to 0.1 mm to ensure the existence of the opening 103 for heat dissipation. Component a reserves a certain amount of expansion space when it expands due to heat.

In some embodiments, along the direction from the first pipe 30 toward the second pipe 40, the minimum size of the opening 103 is less than or equal to 2 cm, so that the opening 103 is not too large, so that in this direction, the heat dissipation assembly a The size is not too big.

In some embodiments, the capillary structure includes one or a combination of one or more of a metal mesh capillary structure, a metal wire braided rope capillary structure, an etched groove capillary structure, a metal powder sintered capillary structure, and a foam metal capillary structure.

In some embodiments, the side edge of the heat dissipation component a is provided with an outwardly extending first mounting portion (ie, a skirt structure) for assembly with other surrounding structures.

It should be noted that in some embodiments, the size of the heat dissipation component a in the first preset direction is smaller than the size of the heat dissipation fan component b in the first preset direction, so as to facilitate the terminal equipment provided with the heat dissipation component 100 Overall thickness control.

Referring to Figures 3 and 4, this application provides another heat dissipation component 200. The structure is substantially the same as that of the heat dissipation assembly 100 described above. For the same or similar features, please refer to the relevant description of the heat dissipation component 100 mentioned above. Only the main differences are described here. The difference between the heat dissipation component a in this heat dissipation component 100 and the heat dissipation component a in the above-mentioned heat dissipation component 100 is that the opening 103 is narrowed as a whole in the direction of the first pipe toward the second pipe, so that the heat dissipation component a (that is, the heat dissipation component 100 ) The overall size in this direction can be smaller, which can provide enough space for other surrounding structures during assembly, and is also conducive to the control of the overall size of the assembled product in the direction from the first pipe to the second pipe. Conducive to miniaturization of assembled products.

Please refer to FIG. 4 , which illustrates the first mounting part 1004 . The first mounting portion 1004 is provided on the side edge of the first cover 1001 . Of course, in other embodiments, the first mounting portion can also be provided on the edge of the second cover plate. Or both the first cover plate and the second cover plate are provided with first mounting portions on their side edges.

Referring to FIG. 5 , this application provides another heat dissipation component 300 . The structure is substantially the same as that of the heat dissipation component 100 described above. For the same or similar features, please refer to the relevant description of the heat dissipation component 100 mentioned above. Only the main differences are described here. The difference between the heat dissipation component a in the heat dissipation component 300 and the heat dissipation component a in the heat dissipation component 100 mentioned above is that the size of the opening 103 in the direction of the first pipe toward the second pipe is larger to form an escape opening at the opening 103. This is to facilitate avoidance of structures corresponding to the escape opening during assembly, such as avoidance of wireless charging structures such as wireless charging coils.

This application also provides a middle frame component. Referring to FIG. 6 , the middle frame component includes a middle frame 400 and the

heat dissipation component

100 or 200 as described above. The

heat dissipation component

100 or 200 is disposed on the middle frame 400. Here, the heat dissipation component 200 is disposed in the middle frame 400 as an example.

The middle frame 400 is provided with a through hole 401 . At least part of the heat dissipation component 200 is embedded in the through hole 401, and a first mounting portion 1004 extending outward is provided on the side edge of the heat dissipation component a. The heat dissipation component 200 overlaps the middle frame 400 through the first mounting portion 1004 .

As shown in FIG. 11 , the present application provides a housing component, which includes a housing 600 and a heat dissipation component 300 as described above. The heat dissipation component 300 is disposed inside the casing 600 , and the heat dissipation fan assembly b is located on the side of the heat dissipation assembly a away from the casing 600 . Of course, the heat dissipation component 300 here can also be replaced by the heat dissipation component 100, the heat dissipation component 200 or other similar heat dissipation components or heat dissipation components.

Referring to FIG. 7 and FIG. 8 , this application further provides a terminal device 1000 , which includes the above-mentioned heat dissipation component 200 . In some other embodiments, the heat dissipation component 200 can also be replaced by the heat dissipation component 100 or the heat dissipation component 300 .

In some embodiments, the terminal device 1000 further includes a heat source area 700. The orthographic projections of the heat source area 700 and the heat dissipation component a in the first preset direction at least partially overlap, and the orthographic projections of the heat dissipation fan component b and the heat source area 700 in the first preset direction do not overlap, and the heat dissipation fan component b and the condenser 20 Orthographic projections in the first preset direction at least partially overlap.

The terminal device 1000 includes a housing 600, and the housing 600 is provided with an air inlet 1008 and an air outlet 1007.

The cooling fan air outlet 711 of the cooling fan assembly b here can be disposed toward the air outlet 1007. Preferably, the cooling fan air outlet 711 of the cooling fan assembly b can be disposed directly opposite the air outlet 1007 (as shown in FIG. 7 ). The cooling fan air outlet 711 of the cooling fan assembly b mentioned here can be disposed directly opposite the air outlet 1007. It can be understood that the cooling fan air outlet 711 and the air outlet 1007 are in the first preset direction, the second preset direction and the third preset direction. The midpoint (or center) in at least one of the three preset directions is aligned. Of course, the air outlet 1007 and the cooling fan air outlet 711 may be offset from each other.

In some embodiments, an airflow pipeline (not shown) is provided between the cooling fan assembly b and the air outlet 1007 , and the airflow guided by the cooling fan assembly b flows to the air outlet 1007 through the airflow pipeline.

Here, one end of the air flow pipeline is connected to the casing 600 where the air outlet 1007 is located, and the other end is connected to the heat dissipation fins 72 or the periphery of the heat dissipation fan air outlet 711 .

Specifically, the housing 600 has a side wall 602 and a back wall 601. The air outlet 1007 can be provided on the side wall 602.

In some embodiments, the air inlet 1008 is provided on the side wall 602. Preferably, the air inlet 1008 may be located at the opposite end of the air outlet 1007. In some other embodiments, the air inlet can also be provided at other locations on the side wall 602 . In some other embodiments, the air inlet can also be located in other areas, such as on the back wall 601 .

It should be noted that dust-proof nets may also be provided at the air inlet 1008 and the air outlet 1007. Fluoride can be sprayed on the dustproof net to form a hydrophobic coating to facilitate the waterproofing of the air inlet 1008 and the air outlet 1007 .

In some embodiments, the first preset direction mentioned here can be understood as the thickness direction T0 of the terminal device 1000 shown in FIG. 8 . The thickness direction T0 of the terminal device 1000 is consistent with the thickness direction T of the heat dissipation member 200 .

Optionally, the length direction L0 of the terminal device 1000 is consistent with the length direction L of the heat dissipation component 200 , and the width direction W0 of the terminal device 1000 is consistent with the width direction W of the heat dissipation component 200 .

In some embodiments, the heat source area 700 is provided with at least one heat source device, such as a central processing unit (CPU) 701 and a control circuit board (PCB) 702 of the terminal device 1000 . The heat source device is arranged corresponding to the evaporator 10 of the heat dissipation assembly a, that is, the orthographic projection of the heat source device and the evaporator 10 of the heat dissipation assembly a at least partially overlaps in the first preset direction to dissipate heat through the evaporator 20 .

The terminal device 1000 includes a middle frame 400 and a screen 500 . The middle frame 400, the heat dissipation component a and the heat source device are arranged between the screen 500 and the casing 600.

The middle frame 400 , the heat dissipation component a and the heat source device mentioned here are disposed between the screen 500 and the back wall 601 of the housing 600 .

The heat dissipation component a is provided on the middle frame 400 , and the heat dissipation component a is located between the heat source device and the screen 500 .

The terminal device 1000 may also include a battery 800 . The battery 800 can be disposed corresponding to the condenser of the heat dissipation component a. That is, the orthographic projections of the battery 800 and the condenser of the heat dissipation assembly a in the first preset direction at least partially overlap.

Please refer to FIGS. 9 and 10 . This application also provides a terminal device 2000 . Compared with the above-mentioned terminal device 1000 , the terminal device 2000 is equipped with a heat dissipation component a. If the terminal device 2000 is identical or similar to the terminal device 1000 described above, please refer to the above related descriptions. The heat dissipation component a is disposed inside the casing 600 , and the middle frame 400 and the heat source device are located on the side of the heat dissipation component a away from the back wall of the casing 600 .

In some embodiments, the terminal device 2000 is provided with a wireless charging structure 900 located opposite the heat source area 700, such as a wireless charging coil. The evaporator 10, condenser 20 and pipes (including the first pipe 30 and the second pipe 40) of the heat dissipation assembly a surround an escape opening (can be understood as the opening 103 shown in Figure 5) located in the middle of the heat dissipation assembly a. The wireless charging structure 900 is provided corresponding to the avoidance opening so as to be applied to wireless charging terminal equipment. The wireless charging structure 900 mentioned here is arranged corresponding to the escape opening, which can be understood as the orthographic projection of the wireless charging structure 900 along the first preset direction is at least partially located in the escape opening. Preferably, all orthographic projections of the wireless charging structure 900 along the first preset direction are located in the avoidance opening to ensure the efficiency of wireless charging.

Continuing to refer to Figures 8 and 9, the cooling fan assembly b is located on the side of the heat dissipation assembly a away from the screen in the first preset direction, and the cooling fan assembly b and the condenser are located on the wireless charging structure 900 in the second preset direction. On the side away from the evaporator, the first pipe 30 and the second pipe 40 respectively do not overlap with the orthographic projection of the wireless charging structure 900 in the first pre-grinding direction.

Please refer to FIG. 11 . This application also provides a terminal device 3000. Compared with the above-mentioned terminal device 2000, the terminal device 3000 has a heat dissipation component 300 provided inside the housing 600. A heat dissipation component is disposed between the heat source device and the screen. For other similarities, please refer to the above related descriptions.

In addition, it should be noted that in other terminal equipment, only one heat dissipation component located only between the heat source device and the casing may be provided. The heat dissipation component disposed between the heat source device and the housing can also be replaced by the heat dissipation component 100, the heat dissipation component 200 or other heat dissipation components. The terminal equipment replaced by the heat dissipation component 100 and the heat dissipation component 200 may not be an unlimited charging terminal device.

It should be noted that the terminal equipment mentioned here can be electronic terminals such as mobile phones, tablet computers, and laptop computers.

This application also provides a method for manufacturing a heat dissipation component. Please refer to FIG. 12 and, if necessary, in conjunction with FIG. 13 , the manufacturing method can be used to manufacture the heat dissipation component as described above. The manufacturing method includes the following steps S101, S103 and S105:

In step S101, a first cover plate and a second cover plate are provided;

In step S103, a capillary structure is formed on at least one of the first cover plate and the second cover plate;

In step S105, the first cover plate and the second cover plate are assembled together to form the heat dissipation assembly;

In step S107, a cooling fan assembly is provided; wherein the cooling fan assembly and the heat dissipation assembly are stacked in a first preset direction, and the cooling fan assembly and the condenser are in a first preset direction. The orthographic projections of at least partially overlap.

As shown in FIG. 13 , in step S101 , a first cover plate 1001 and a second cover plate 1002 are provided. It should be noted that the first cover plate 1001 and the second cover plate 1002 are cover plates that respectively form the heat dissipation component a. The covers of other heat dissipation components can be set according to specific conditions.

In some embodiments, forming a capillary structure on at least one of the first cover plate and the second cover plate in step S103 may include:

The capillary structure 60 is formed on at least one of the first cover plate 1001 and the cover plate 1002 by using at least one of etching and sintering methods.

Further, in some embodiments, after providing the first cover plate 1001 and the second cover plate 1002, the method includes:

At least one of etching and sintering is used to form support pillars on at least one of the first cover plate 1001 and the second cover plate 1002 . Here the support pillars can be formed simultaneously with the capillary structure.

In some embodiments, after the first cover plate 1001 and the second cover plate 1002 are assembled together, the method further includes the following steps S1051 and S152:

In step S1051, working fluid is injected.

In step S1052, the place where the working fluid is injected is sealed.

The working fluid mentioned here can be water. Of course, other refrigerants that can be used in the heat dissipation structure can also be used.

In some embodiments, as shown in FIG. 13 , a first liquid injection part 1005 for forming a liquid injection structure extends outward at one end of the first cover plate 1001 , and a first liquid injection part 1005 for forming a liquid injection structure extends outward at one end of the second cover plate 1002 . The second liquid injection part 1006 corresponds to the first liquid injection part 1005. The structures of the first liquid injection part 1005 and the second liquid injection part 1006 are basically the same.

After forming the capillary structure in step S103, the method further includes the following step S104

Step S104: Assemble the first liquid injection part and the second liquid injection part correspondingly (ie, align and assemble) to form a liquid injection structure.

The liquid injection structure has an inner cavity of the liquid injection structure that communicates with the heat dissipation component and the outside world. Here, the inner cavity of the liquid injection structure is connected with the inner cavity of the evaporator.

This step S104 can be implemented simultaneously with the assembly of the first cover plate 1001 and the second cover plate 1002 in step S105.

Correspondingly, step S1051 can be implemented through the following steps:

Working fluid is injected through the liquid injection structure.

Correspondingly, after injecting the working fluid into the interior through the liquid injection structure, the method includes:

The liquid injection structure is removed, and vacuum sealing is performed on the liquid injection structure.

It should be noted that for injecting working fluid through such an epitaxial liquid injection structure, in some embodiments, the sealing of the injected working fluid in step S1052 can be achieved in the following two steps: first, inject liquid The outer end of the structure (that is, the end of the liquid injection structure facing away from the heat dissipation component) is vacuum sealed; then the liquid injection structure is removed, and the connection to the liquid injection structure on the edge of the heat dissipation component is vacuum sealed.

After vacuum sealing the outer end of the liquid injection structure, the heat dissipation assembly can be operated, such as adjusting the evaporator end of the heat dissipation assembly to face upward, so that the air reserved in the inner cavity of the heat dissipation assembly flows into the inner end of the liquid injection structure. Then the liquid injection structure is removed. Sealing in this manner in step S1052 is beneficial to improving the vacuum degree in the inner cavity of the heat dissipation component and preventing excessive air from being mixed into the inner cavity of the heat dissipation component and affecting the heat dissipation effect.

It should be noted that after vacuum sealing, this method can also include multiple methods of product testing of the heat dissipation components.

Please refer to FIGS. 1 to 3 and FIG. 5 . In some embodiments, the cooling fan assembly b includes a cooling fan 71 and a cooling fin 72 . The cooling fan 71 has a cooling fan outlet 711 . The cooling fan outlet 711 is arranged toward the cooling fins 72 so that the air flow blown out by the cooling fan outlet 711 can blow toward the cooling fins 72, thereby blowing away the heat from the cooling fins 72 and their vicinity to achieve good heat dissipation. . Optionally, the heat dissipation fins 72 can be disposed directly opposite the heat dissipation fan outlet 711 .

In step S107, in some embodiments, the heat dissipation fan 71 and the heat dissipation fin 72 can be respectively disposed at preset positions of the heat dissipation component a. Among them, the heat dissipation fins 72 are provided on the heat dissipation component a by welding, bonding or plugging. The cooling fan 71 can also be arranged in a similar manner.

In some other embodiments, the heat dissipation fan 71 and the heat dissipation fins 72 can also be assembled together and then disposed on the heat dissipation component a.

In the present disclosure, the structural embodiments and method embodiments may complement each other without conflict.

.

Other embodiments of the disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. The present disclosure is intended to cover any variations, uses, or adaptations of the disclosure that follow the general principles of the disclosure and include common common sense or customary technical means in the technical field that are not disclosed in the disclosure. . It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise structures described above and illustrated in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the disclosure is limited only by the appended claims.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations are mutually exclusive. any such actual relationship or sequence exists between them. The terms "comprises," "comprises," or any other variation thereof are intended to cover a non-exclusive inclusion such that a process, method, article or apparatus including a list of elements includes not only those elements but also others not expressly listed elements, or elements inherent to such process, method, article or equipment. Without further limitation, an element defined by the statement "comprises a..." does not exclude the presence of additional identical elements in a process, method, article, or apparatus that includes the stated element.

The methods and devices provided by the embodiments of the present disclosure have been introduced in detail above. Specific examples are used in this article to illustrate the principles and implementations of the present disclosure. The description of the above embodiments is only used to help understand the methods and methods of the present disclosure. The core idea; at the same time, for those of ordinary skill in the art, there will be changes in the specific implementation and application scope based on the ideas of this disclosure. In summary, the content of this description should not be understood as a limitation of this disclosure. .

Claims

A heat dissipation component, characterized in that the heat dissipation component includes:

The heat dissipation component includes an evaporator and a condenser, and the condenser and the evaporator are connected through pipes to form a loop;

The heat dissipation fan assembly is stacked with the heat dissipation assembly in the first preset direction, and the orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction at least partially overlaps.
The heat dissipation component of claim 1, wherein the heat dissipation fan assembly includes a heat dissipation fan and a heat dissipation fin, the heat dissipation fan has a heat dissipation fan air outlet, and the heat dissipation fan air outlet is disposed toward the heat dissipation fin. .
The heat dissipation component of claim 2, wherein the size of the heat dissipation fan in the second preset direction is less than or equal to 20 mm; the size of the heat dissipation fan in the third preset direction is less than or equal to 20 mm; Wherein, the second preset direction and the third preset direction are perpendicular.
The heat dissipation component according to any one of claims 1 to 3, wherein the heat dissipation assembly includes a first pipe, the evaporator has an output end, the condenser has an inlet end, and the first pipe communicates with the The output end of the evaporator and the inlet end of the condenser; at least part of the inner wall of the first pipe is provided with a capillary structure.
The heat dissipation component according to claim 4, characterized in that the heat dissipation assembly further includes:

a second pipe, the evaporator has an input end opposite to the output end, the condenser has an outlet end opposite to the inlet end, and the second pipe communicates with the outlet end of the condenser and the The input end of the evaporator;

a compensation chamber, the compensation chamber is located between the second pipe and the evaporator and the inner cavity of the compensation chamber is filled with a capillary structure;

Working fluid circulates in the evaporator, the first pipe, the condenser, the second pipe and the liquid replenishing chamber.
The heat dissipation component of claim 5, wherein the inner cavity of the compensation cavity is filled with capillary structures to form a vapor barrier.
The heat dissipation component according to any one of claims 4 to 6, wherein the evaporator has a first evaporator side wall and a second evaporator side wall that are oppositely arranged along a first preset direction, and the A capillary structure is provided on the side wall of the second evaporator.
The heat dissipation component according to any one of claims 4 to 6, wherein the first pipe has a first pipe side wall and a second pipe side wall that are oppositely arranged along a first preset direction, and the first pipe side wall is disposed oppositely in a first preset direction. The inner wall of at least one of a pipe side wall and the second pipe side wall is provided with a capillary structure.
The heat dissipation component according to claim 8, wherein the inner cavity of the first pipe has a first capillary structure area with a capillary structure and a first expansion cavity area located outside the first capillary structure area, The size of the first expansion cavity region along the first preset direction is greater than the size of the first capillary structure region along the first preset direction.
The heat dissipation component according to claim 9, wherein: The ratio is greater than 2.
The heat dissipation component according to any one of claims 5 to 10, characterized in that the second pipe has a third pipe side wall and a fourth pipe side wall arranged oppositely along the first preset direction; wherein, the A capillary structure is provided on the inner wall of at least one of the third pipe side wall and the fourth pipe side wall.
The heat dissipation component according to claim 11, wherein the inner cavity of the second pipe has a second capillary structure area provided with a capillary structure and a second expansion cavity area located outside the second capillary structure area; or,

The inner cavity of the second pipe is covered with capillary structures.
The heat dissipation component according to any one of claims 4 to 12, wherein the condenser has a first condenser side wall and a second condenser side wall that are oppositely arranged along a first preset direction, and the A capillary structure is provided on an inner wall of at least one of the first condenser side wall and the second condenser side wall.
The heat dissipation component according to any one of claims 5 to 13, wherein the heat dissipation assembly has a first cover plate and a second cover plate that are stacked in a thickness direction, and the first cover plate and the At least one of the second cover plates is provided with a capillary structure to form the evaporator, condenser, first pipe, second pipe and compensation cavity.
The heat dissipation component of claim 14, wherein at least one of the first cover plate and the second cover plate is provided with a plurality of spaced support pillars, and the plurality of support pillars are located on the evaporator. in the inner cavity of at least one of the condenser, the first pipe, the second pipe and the compensation chamber.
The heat dissipation component according to claim 14 or 15, characterized in that an opening is provided between the first pipe and the second pipe, and the opening penetrates the first cover plate and the second cover plate. .
The heat dissipation component of claim 16, wherein along the direction of the first pipe toward the second pipe, the size of the opening close to the end of the evaporator is larger than the size of the opening close to the end of the evaporator. Dimensions of one end of the condenser.
The heat dissipation component of claim 16, wherein the minimum size of the opening is greater than or equal to 0.1 mm along the direction from the first pipe toward the second pipe.
The heat dissipation component of claim 18, wherein the minimum size of the opening is less than or equal to 2 cm along the direction from the first pipe toward the second pipe.
The heat dissipation component according to any one of claims 4 to 19, characterized in that the capillary structure includes a metal mesh capillary structure, a metal wire braided rope capillary structure, an etched groove capillary structure, a metal powder sintered capillary structure and a foam metal. One or a combination of multiple capillary structures.
The heat dissipation component according to any one of claims 1 to 20, wherein a first mounting portion extending outward is provided on a side edge of the heat dissipation component.
A method of manufacturing a heat dissipation component, characterized in that the manufacturing method is used to manufacture the heat dissipation component according to any one of claims 1 to 21; the manufacturing method includes:

providing a first cover plate and a second cover plate;

forming a capillary structure on at least one of the first cover plate and the second cover plate;

Assemble the first cover plate and the second cover plate to form the heat dissipation assembly;

A cooling fan assembly is provided; wherein the cooling fan assembly and the heat dissipation assembly are stacked in a first preset direction, and at least part of the orthographic projection of the cooling fan assembly and the condenser in the first preset direction is overlapping.
The method of manufacturing a heat dissipation component according to claim 22, wherein forming a capillary structure on at least one of the first cover plate and the second cover plate includes:

A capillary structure is formed on at least one of the first cover plate and the cover plate by etching and/or sintering.
The method of manufacturing a heat dissipation component according to claim 22 or 23, wherein after providing the first cover plate and the second cover plate, the method includes:

Using etching and/or sintering, support pillars are formed on at least one of the first cover plate and the second cover plate.
The manufacturing method of a heat dissipation component according to any one of claims 22 to 24, wherein after the first cover plate and the second cover plate are assembled together, the method further includes:

Inject working fluid;

Seal the place where the working fluid is injected.
The method of manufacturing a heat dissipation component according to claim 25, wherein a first liquid injection part for forming a liquid injection structure extends outward from one end of the first cover plate, and one end of the second cover plate is provided with a first liquid injection part for forming a liquid injection structure. There is a second liquid injection part extending outward and corresponding to the first liquid injection part;

After forming the capillary structure, the method further includes:

Assemble the first liquid injection part and the second liquid injection part correspondingly to form a liquid injection structure;

The injected working fluid includes:

Working fluid is injected through the liquid injection structure.
The method of manufacturing a heat dissipation component according to claim 26, wherein after injecting the working fluid into the interior through the liquid injection structure, the method includes:

The liquid injection structure is removed, and vacuum sealing is performed on the liquid injection structure.
A middle frame component, characterized in that it includes: a middle frame and the heat dissipation component according to any one of claims 1 to 20, and the heat dissipation component is provided on the middle frame.
The middle frame component of claim 28, wherein the middle frame is provided with a through hole, at least part of the heat dissipation component is embedded in the through hole, and the side edge of the heat dissipation component is provided with a through hole. A first mounting portion extends outward, and the heat dissipation component overlaps the middle frame through the first mounting portion.
A casing component, characterized in that it includes a casing and a heat dissipation component according to any one of claims 1 to 21, the heat dissipation component is arranged inside the casing, and the heat dissipation fan assembly is located at the The heat dissipation component is on the side facing away from the housing.
A terminal device, characterized in that it includes: the heat dissipation component according to any one of claims 1 to 21, the terminal device further includes a heat source area, the heat source area and the heat dissipation component are in a first preset position. The orthographic projections of the directions at least partially overlap, and the orthographic projections of the cooling fan assembly and the heat source area in the first preset direction do not overlap, and the orthographic projections of the cooling fan assembly and the condenser in the first preset direction do not overlap. Orthographic projections overlap at least partially;

The terminal equipment includes a housing, and the housing is provided with an air inlet and an air outlet.
The terminal device according to claim 31, wherein the cooling fan assembly is disposed directly opposite the air outlet; and/or,

An airflow duct is provided between the cooling fan assembly and the air outlet, and the airflow guided by the cooling fan assembly flows to the air outlet through the airflow duct.
The terminal equipment according to claim 31 or 32, characterized in that the heat source area is provided with at least one heat source device, and the orthogonal projection of the heat source device and the evaporator of the heat dissipation assembly in the first preset direction is at least partially overlap to dissipate heat through the evaporator.
The terminal device according to any one of claims 31 to 33, characterized in that it includes: a middle frame and a screen; the middle frame, the heat dissipation component and the heat source device are provided on the screen and the casing. between;

The heat dissipation component is provided on the middle frame, and the heat dissipation component is located between the heat source device and the screen;

Or, the heat dissipation component is provided inside the housing, the heat dissipation fan component is located on a side of the heat dissipation component away from the housing, and the middle frame and the heat source device are located on the side of the heat dissipation component away from the housing. side of the casing.
The terminal equipment according to any one of claims 31 to 33, characterized in that the terminal equipment is provided with a wireless charging structure located at the opposite end of the heat source area, and the evaporator, condenser and pipe of the heat dissipation component form a An escape opening is located in the middle of the heat dissipation component, and the wireless charging structure is arranged corresponding to the escape opening.