CN117652213A

CN117652213A - Heat dissipation member, method for manufacturing the same, center member, case member, and terminal device

Info

Publication number: CN117652213A
Application number: CN202280004483.5A
Authority: CN
Inventors: 陈安琪; 黄犊子; 刘明艳
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2022-06-20
Filing date: 2022-06-20
Publication date: 2024-03-05
Also published as: WO2023245360A1

Abstract

The present disclosure relates to a heat radiating member, a method of manufacturing the same, a middle frame member, a housing member, and a terminal device. The heat dissipation component comprises a heat dissipation component and a heat dissipation fan component, wherein the heat dissipation component comprises an evaporator and a condenser, and the condenser and the evaporator are communicated through a pipeline to form a loop; the heat dissipation fan assembly and the heat dissipation assembly are stacked in a first preset direction, and the orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction is at least partially overlapped. According to the structure, the heat dissipation assembly is arranged in the first preset direction in a stacked mode, and the orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction is at least partially overlapped, so that the heat dissipation component can well dissipate heat under the cooperation of the heat dissipation assembly and the heat dissipation fan assembly, and when the heat dissipation fan assembly is assembled in a terminal device, the heat dissipation fan assembly does not occupy the space near a heat source device such as a CPU (Central processing unit), and therefore the whole thinning of the terminal device is facilitated.

Description

Heat dissipation member, method for manufacturing the same, center member, case member, and terminal device

Technical Field

The disclosure relates to the field of terminal equipment, in particular to a heat dissipation component, a manufacturing method thereof, a middle frame component, a shell component and terminal equipment.

Background

Terminal devices such as mobile phones and tablet computers have become indispensable technological products in the life, study and entertainment processes of people. With the development of terminal equipment, the number of cores of a used CPU (Central Processing Unit ) is increased, and the performance is increasingly enhanced, so that the heating value of the terminal equipment is increasingly larger. Especially in recent years the experience of temperature rise has become an important consideration for consumers to purchase terminal devices. In the related art, a heat radiation fan structure is provided on one side of a heat source device such as a CPU in order to radiate heat from a terminal device. However, the thickness of the terminal device is increased due to the arrangement of the heat dissipation fan structure, and the space of the main board area is occupied, which is not beneficial to the light and thin design of the terminal device.

Disclosure of Invention

In view of the above, embodiments of the present disclosure provide a heat dissipation component, a manufacturing method thereof, a middle frame component, a housing component and a terminal device to solve some or all of the above technical problems.

According to a first aspect of embodiments of the present disclosure, there is provided a heat dissipation member including:

The heat dissipation assembly comprises an evaporator and a condenser, wherein the condenser and the evaporator are communicated through a pipeline to form a loop;

and the radiating fan assembly is overlapped with the radiating assembly in a first preset direction, and the orthographic projection of the radiating fan assembly and the condenser in the first preset direction is at least partially overlapped.

According to a second aspect of the embodiments of the present disclosure, there is provided a method of manufacturing a heat dissipating component for manufacturing the heat dissipating component as described above; the manufacturing method comprises the following steps:

providing a first cover plate and a second cover plate;

forming a capillary structure on at least one of the first cover plate and the second cover plate;

assembling the first cover plate and the second cover plate in a butt joint way to form the heat dissipation assembly;

setting a heat radiation fan assembly; the heat dissipation fan assembly and the heat dissipation assembly are arranged in a stacked mode in a first preset direction, and orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction is at least partially overlapped.

According to a third aspect of the embodiments of the present disclosure, a middle frame component is provided, including a middle frame and a heat dissipation component as described above, where the heat dissipation component is disposed on the middle frame.

According to a fourth aspect of the embodiments of the present disclosure, a housing component is provided, including a housing and a heat dissipation component as described above, where the heat dissipation component is disposed inside the housing, and the heat dissipation fan assembly is located on a side of the heat dissipation assembly facing away from the housing.

According to a fifth aspect of embodiments of the present disclosure, there is provided a terminal device including the heat dissipating component as described above, the terminal device further including a heat source region at least partially overlapping with an orthographic projection of the heat dissipating component in a first preset direction, and the heat dissipating fan assembly at least partially overlapping with an orthographic projection of the heat source region in the first preset direction, and the heat dissipating fan assembly at least partially overlapping with an orthographic projection of the condenser in the first preset direction;

the terminal equipment comprises a shell, wherein the shell is provided with an air inlet and an air outlet.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: through with the radiating component stacks the setting in first default direction, just radiating fan component with the condenser is at least partly overlapped in first default direction's orthographic projection for radiating component can dispel the heat well under radiating component and radiating fan component's cooperation, and when assembling in terminal equipment, radiating fan component can not occupy the space near heat source devices such as CPU, thereby is favorable to terminal equipment whole attenuate.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.

FIG. 1 is a schematic diagram of a heat dissipating structure according to an exemplary embodiment of the present disclosure;

FIG. 2 is a schematic structural view and a partial cross-sectional view of a heat dissipating structure according to an exemplary embodiment of the present disclosure; FIG. 2 is a partial cross-sectional view illustrating the internal structure of portions of the heat dissipating assembly;

FIG. 3 is a schematic diagram of another heat dissipating structure according to an exemplary embodiment of the present disclosure;

FIG. 4 is a side view at A shown in FIG. 3;

FIG. 5 is a schematic structural view of yet another heat dissipating structure shown in an exemplary embodiment of the present disclosure;

FIG. 6 is a schematic illustration of a structure of a middle frame member according to an exemplary embodiment of the present disclosure;

Fig. 7 is a schematic view of a part of a structure of a terminal device according to an exemplary embodiment of the present disclosure;

fig. 8 is a cross-sectional view of the terminal device shown in fig. 7;

fig. 9 is a partial structure diagram of another terminal device shown in an exemplary embodiment of the present disclosure;

fig. 10 is a cross-sectional view of the terminal device shown in fig. 9;

fig. 11 is a partial structure diagram of still another terminal device shown in an exemplary embodiment of the present disclosure;

fig. 12 is a method flow diagram of a method of manufacturing a heat sink member according to an exemplary embodiment of the present disclosure.

Fig. 13 is a schematic structural view of a first cover plate and a second cover plate according to an exemplary embodiment of the present disclosure.

Detailed Description

The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.

The terminology used in the embodiments of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the disclosure. As used in this disclosure of embodiments and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

The heat dissipation member, the middle frame member, the housing member, and the terminal device will be described in detail with reference to fig. 1 to 11.

Referring to fig. 1, and as necessary, in conjunction with fig. 2, the heat dissipation component 100 includes a heat dissipation assembly a and a heat dissipation fan assembly b. The heat radiation assembly a includes an evaporator 10 and a condenser 20, and the condenser 20 and the evaporator 10 are connected by a pipe to form a loop in which a working fluid (not shown) for heat radiation is circulated. The heat dissipation fan assembly b and the heat dissipation assembly a are stacked in the first preset direction, and the orthographic projection of the heat dissipation fan assembly b and the condenser 20 in the first preset direction is at least partially overlapped.

In some embodiments, the condenser 20 may be disposed at an opposite end of the evaporator 10, wherein the condenser 20 is disposed at the opposite end of the evaporator 10 may be understood as the evaporator 10 is disposed at a distance from the condenser 20 along the second predetermined direction. I.e. the evaporator 10 and the condenser 20 are located at opposite ends from each other in a second predetermined direction. For example, the second preset direction may be a length direction L of the heat dissipating part 100. The working fluid may be water or other fluid with heat dissipation function such as refrigerant used in the heat dissipation structure. The working fluid is vaporized by heat absorption through the evaporator 10 while circulating in the heat dissipating assembly a, and liquefied by heat release while flowing through the condenser 20.

It should be explained that the heat dissipation fan assembly b and the heat dissipation assembly a are stacked in the first preset direction, and it is understood that the heat dissipation fan assembly b is stacked on at least one side of the heat dissipation assembly a along the first preset direction, the heat dissipation end of the heat dissipation fan assembly b faces to the side of the heat dissipation assembly a, and the heat dissipation fan assembly b and the heat dissipation assembly a may be connected or disconnected. Wherein the first preset direction may be understood as a thickness direction T of the heat sink 100.

In some embodiments, the heat dissipation fan assembly b and the heat dissipation assembly a are stacked in the first preset direction, and the orthographic projection of the heat dissipation fan assembly b and the condenser 20 in the first preset direction is at least partially overlapped, so that heat can be better dissipated under the cooperation of the heat dissipation assembly a and the heat dissipation fan assembly b, and when the heat dissipation fan assembly is assembled in a terminal device, the heat dissipation fan assembly does not occupy the space near a heat source device such as a CPU, and thus the whole thinning of the terminal device is facilitated.

On the basis of the above-described embodiment, the heat radiation fan assembly b includes the heat radiation fan 71 and the heat radiation fins 72. The heat dissipation fan 71 has a heat dissipation fan air outlet 711, and the heat dissipation fan air outlet 711 is disposed towards the heat dissipation fins 72, so that the air flow blown out by the heat dissipation fan air outlet 711 can blow to the heat dissipation fins 72, thereby blowing away the heat of the heat dissipation fins 72 and the vicinity thereof, so as to achieve heat dissipation well. Alternatively, the heat radiating fins 72 may be disposed opposite to the heat radiating fan outlet 711.

In some embodiments, the heat dissipating fins 72 are disposed on the heat dissipating component a to guide the heat on the heat dissipating component a onto the heat dissipating fins 72 for dissipating the heat by the air flow blown by the heat dissipating fan 71. Further, the heat dissipation fins 72 may be disposed on the heat dissipation assembly a by at least one of welding, bonding, plugging, etc. The heat dissipation fins 72 may be made of copper, stainless steel, aluminum or other materials with heat conduction function, and the heat dissipation fins 72 may be zigzag heat dissipation fins or other heat dissipation fin structures.

In some embodiments, the cooling fan 71 may be a centrifugal fan or an axial flow fan, such as a micro turbo fan. The dimension of the heat radiation fan 71 in the second preset direction is less than or equal to 20mm. The dimension of the heat radiation fan 71 in the third preset direction is less than or equal to 20mm. The second preset direction is perpendicular to the third preset direction. For example: the second preset direction may be a length direction L of the heat dissipating part 100, and the third preset direction may be a width direction W of the heat dissipating part 100. Correspondingly, the first preset direction forms an included angle with a plane determined by the second preset direction and the third preset direction, for example, the first preset direction may be perpendicular to the plane determined by the second preset direction and the third preset direction.

On the basis of the above embodiment, the heat radiating assembly a may include the first duct 30. The evaporator 10 has opposite input 101 and output 102. The condenser 20 has opposite inlet and outlet ends 201, 202. The first conduit 30 communicates between the output 102 of the evaporator 10 and the inlet 201 of the condenser 20. At least part of the inner wall of the first duct 30 is provided with a capillary structure, which capillary structure in the first duct 30 may be used for storing a working fluid.

In this way, by providing the capillary structure in at least a portion of the inner wall of the first conduit 30, it is possible to advantageously store the liquid working fluid present in the first conduit 30, preventing the formation of droplets in the first conduit from affecting the flow of vapor in the first conduit, thereby improving the stability of the operation of the heat dissipating assembly.

On the basis of the above embodiment, the heat dissipation assembly a further comprises a second pipe 40 and a compensation chamber 50. The second conduit 40 communicates between the outlet end 202 of the condenser 20 and the inlet end 101 of the evaporator 10. The compensation chamber 50 is located between the second pipe 40 and the evaporator 10 and the inner cavity of the compensation chamber 50 is filled with a capillary structure. The working fluid may circulate within the evaporator 10, the first conduit 30, the condenser 20, the second conduit 40, and the fluid replacement chamber 50.

It should be noted that the relative positions of the evaporator 10, the first pipe 30, the condenser 20, the second pipe 40 and the liquid replenishing chamber 50 may be determined according to the size of the terminal device to be cooled. For example: the dimension of the entirety of the heat dissipation assembly a in the third preset direction may be 30mm to 70mm. The size of the compensation chamber 50 in the second preset direction may be 50mm-120mm. The heat dissipation assembly a may have a size of 0.2mm to 1mm in the first preset direction.

In some embodiments, as shown in fig. 2, the capillary structure 65 is disposed in the inner cavity of the compensation chamber 50 to form a vapor barrier, so as to prevent the vapor in the second pipe from flowing into the evaporator 10, which can avoid adverse effects caused by the vapor flowing into the evaporator 10.

In some embodiments, the compensation chamber 50 may have a dimension in the third predetermined direction of 3mm-20mm. The compensation chamber 50 may have a dimension in the second predetermined direction of 30mm-20mm.

With continued reference to fig. 2, in some embodiments, the evaporator 10 has a first evaporator side wall 11 and a second evaporator side wall 12 disposed opposite in a first predetermined direction. The second evaporator side wall 12 is provided with a capillary structure 61.

The evaporator 10 may have a size of 10mm-40mm in the third predetermined direction. The evaporator 10 may have a size of 10mm-40mm in the second predetermined direction.

The size of the inner cavity of the evaporator 10 along the first preset direction ranges from 0.1mm to 0.9mm. The thickness of the capillary structure 61 may be set to 0.03mm to 0.3mm.

Of course, in other embodiments, the wicking structure may be provided on the second evaporator side wall, while the wicking structure is not provided on the first evaporator side wall. The specific case of the capillary structure provided on the side wall of the second evaporator can be referred to the above-mentioned related description. It should be noted that, when the heat dissipation assembly is used in a terminal device, the side wall of the evaporator provided with the capillary structure may be disposed on a side closer to the heat source, so as to store the working fluid in the capillary structure, which is favorable for improving the evaporation effect of the evaporator, thereby improving the heat dissipation effect of the heat dissipation assembly.

As further shown in fig. 2, the first duct 30 has a first duct sidewall 31 and a second duct sidewall 32 disposed opposite to each other along a first predetermined direction, the inner wall of the first duct sidewall 31 is provided with a capillary structure 631, and the inner wall of the second duct sidewall 32 is provided with a capillary structure 632.

The first predetermined direction can also be understood as the thickness direction T of the heat dissipating component a.

The first conduit 20 may have a dimension in the third predetermined direction of 5mm to 40mm. The first duct 20 may have a size of 50mm-120mm in the second predetermined direction.

The first conduit 30 has an inner cavity with a dimension in the range of 0.1mm to 0.9mm in the first predetermined direction. The thickness of the capillary structure 631 may be set to 0.001mm to 0.3mm, and the thickness of the capillary structure 632 may be set to 0.001mm to 0.3mm.

In some embodiments, the inner lumen of the first conduit 30 has a first wicking structure region in which the wicking structure is disposed and a first expansion chamber region 3013 located outside of the first wicking structure region. The first wick region here includes wick regions 3011 and 3012 in which the wick 631 is disposed.

The size of the first expansion chamber region 3013 along the first preset direction is greater than the size of the first capillary structure region along the first preset direction, so as to provide sufficient circulation of vaporized working fluid, which is beneficial to ensuring the heat dissipation efficiency of the heat dissipation component a.

Here, the dimension of the first expansion chamber region 3013 in the first preset direction is greater than the dimension of the first capillary structure region in the first preset direction, which may be understood as d3 > d1+d2.

In some embodiments, the ratio between the dimension of the first expansion chamber region 3013 along the first preset direction and the dimension of the first capillary structure region along the first preset direction is greater than 2, which is more advantageous to ensure that there is enough space in the first conduit 30 for the vaporized working fluid to circulate.

Here, the ratio between the dimension of the first expansion chamber region 3013 in the first preset direction and the dimension of the first capillary structure region in the first preset direction is greater than 2, which can be understood as D3 > 2 (d1+d2).

Of course, in other embodiments, the capillary structure may be provided only on the inner wall of the first duct side wall or the inner wall of the second duct side wall. Alternatively, the thickness of the capillary structure may be set to 0.001mm-0.3mm. The specific features of the capillary structure and the first conduit are described above.

With continued reference to fig. 2, the second duct 40 has a third duct sidewall 41 and a fourth duct sidewall 42 disposed opposite to each other along the first predetermined direction; wherein, the inner wall of the third pipeline sidewall 41 is provided with a capillary structure 641, and the inner wall of the fourth pipeline sidewall 42 is provided with a capillary structure 642.

The second duct 40 may have a dimension in the third predetermined direction of 5mm-30mm. The second duct 40 may have a size of 50mm-120mm in the second preset direction. The thicknesses of the capillary structures 641 and 642 may be set to 0.05mm to 1mm, respectively. It should be noted that the size range of the second pipe 40 may be adjusted according to actual requirements, and the above description about the size range of the second pipe 40 is only an example and not a limitation.

In some embodiments, the inner cavity of the second conduit 40 has a second capillary structure region (including two regions indicated by 4011 and 4012) in which the capillary structure is disposed and a second expansion chamber region 4013 outside the second capillary structure region, so that the second conduit leaves an expansion space for a more unobstructed flow of the working fluid and can prevent the working fluid from icing the tube.

In some embodiments, the second expansion chamber region 4013 may have a dimension in the first predetermined direction of 0.03mm to 0.5mm to provide good protection against icing of the tube by the working fluid.

Of course, in other embodiments, a capillary structure may be provided on an inner wall of one of the third and fourth conduit sidewalls.

Furthermore, in still other embodiments, the lumen of the second conduit 40 may be filled with a capillary structure.

With continued reference to fig. 2, the condenser 20 has a first condenser side wall 21 and a second condenser side wall 22 disposed opposite in a first predetermined direction. The first condenser side wall 21 is provided with a capillary structure 621, and the inner wall of the second condenser side wall 22 is provided with a capillary structure 622.

The first predetermined direction can also be understood as the thickness direction T of the heat dissipating component a. Here, the thickness of both the capillary structure 621 and the capillary structure 622 may be controlled to be 0.001mm to 0.3mm.

The condenser 20 may have a dimension (which may be understood as a width dimension) in a third predetermined direction of 30mm-70mm. The condenser 20 may have a dimension (which may be understood as a length dimension) in the second predetermined direction of 10mm to 50mm.

Of course, in other embodiments, the capillary structure may be provided on the inner wall of only one of the first condenser side wall and the second condenser side wall. Alternatively, the size of the capillary structure may be controlled to be in the range of 0.001mm to 0.3mm. For other details of the capillary structure reference is made to the above-mentioned related description.

With continued reference to fig. 2, in some embodiments, the heat dissipating component a has a first cover plate 1001 and a second cover plate 1002 stacked in a thickness direction T, and at least one of the first cover plate 1001 and the second cover plate 1002 has a capillary structure to form the evaporator 10, the condenser 20, the first duct 30, the second duct 40, and the compensation chamber 50.

The materials of the first cover plate 1001 and the second cover plate 1002 include, but are not limited to, one or more of copper, stainless steel, titanium alloy, and the like.

In some embodiments, a plurality of support columns 1003 are provided on at least one of the first cover plate 1001 and the second cover plate 1002 at intervals to support the first cover plate 1001 and the second cover plate 1002 to ensure the shape of the inner cavity of the heat dissipating assembly, and to prevent adverse effects caused by deformation of the first cover plate 1001 and the second cover plate 1002. A plurality of support columns 1003 are located in the interior cavity of at least one of the evaporator 10, condenser 20, first conduit 30, second conduit 40, and compensation chamber 50.

As shown in fig. 2, the inner cavities of the evaporator 10, the condenser 20, the first pipe 30, the second pipe 40 and the compensation chamber 50 are provided with support columns 1003.

Referring to fig. 1, an opening 103 is disposed between the first pipe 30 and the second pipe 40. The opening 103 penetrates the first cover plate 1001 and the second cover plate 1002.

In some embodiments, the dimension of the opening 103 near the end of the evaporator 10 is greater than the dimension of the opening 103 near the end of the condenser 20 in the direction of the first conduit 30 toward the second conduit 40 to provide sufficient space for thermal expansion of the structure near the end of the evaporator 10.

Referring to fig. 1, in some embodiments, a minimum dimension D4 of the opening 103 is greater than or equal to 0.1mm along the direction of the first conduit 30 toward the second conduit 40, so as to ensure that the opening 103 exists to reserve a certain expansion space for the heat dissipating component a when it expands under heat.

In some embodiments, the smallest dimension of the aperture 103 is less than or equal to 2cm in the direction of the first conduit 30 toward the second conduit 40, such that the aperture 103 is not too large, such that the dimension of the heat dissipating assembly a is not too large in that direction.

In some embodiments, the capillary structure comprises a combination of one or more of a metal mesh capillary structure, a metal wire braided rope capillary, an etched grooved capillary structure, a metal powder sintered capillary structure, and a foam metal capillary structure.

In some embodiments, the side edge of the heat dissipating component a is provided with a first mounting portion (i.e. a skirt structure) extending outwards for assembly with other peripheral structures.

It should be noted that, in some embodiments, the dimension of the heat dissipating component a in the first preset direction is smaller than the dimension of the heat dissipating fan component b in the first preset direction, so as to facilitate overall thickness control of the terminal device provided with the heat dissipating component 100.

Referring to fig. 3 and 4, the present application further provides a heat dissipation component 200. The structure of the heat dissipation assembly 100 is substantially the same as that described above. The same or similar features may be referred to in the description of the heat dissipating assembly 100 described above. Only the main differences are described here. The difference between the heat dissipating component a in the heat dissipating component 100 and the heat dissipating component a in the heat dissipating component 100 is that the opening 103 is integrally narrowed in the direction of the first pipe toward the second pipe, so that the overall dimension of the heat dissipating component a (i.e., the heat dissipating component 100) in the direction can be smaller, and when in assembly, enough space can be provided for other surrounding structures, which is also beneficial to controlling the overall dimension of the assembled product in the direction of the first pipe toward the second pipe, and is beneficial to miniaturization of the assembled product.

Referring to fig. 4, fig. 4 illustrates a first mounting portion 1004. The first mounting portion 1004 is provided at a side edge of the first cover plate 1001. Of course, in other embodiments, the first mounting portion may also be disposed at an edge of the second cover plate. Or the side edges of the first cover plate and the second cover plate are respectively provided with a first mounting part.

Referring to fig. 5, the present application further provides a heat dissipation component 300. The structure of the heat sink 100 is substantially the same as that described above. The same or similar points are referred to in the description of the heat dissipation member 100 above. Only the main differences are described here. The heat dissipation component a in the heat dissipation component 300 is different from the heat dissipation component a in the heat dissipation component 100, where the size of the opening 103 in the direction of the first pipe towards the second pipe is larger, so that an avoidance opening is formed at the opening 103, so that a structure corresponding to the avoidance opening can be avoided during assembly, for example, a wireless charging structure such as a wireless charging coil is avoided.

The application further provides a middle frame component. Referring to fig. 6, the middle frame member includes a middle frame 400 and the heat dissipation member 100 or 200 as described above. The heat sink member 100 or 200 is provided on the middle frame 400, and here, the heat sink member 200 is provided in the middle frame 400 as an example.

The middle frame 400 is provided with a through hole 401. At least a portion of the heat dissipation member 200 is embedded in the through hole 401, and the side edge of the heat dissipation assembly a is provided with a first mounting portion 1004 extending outward. The heat sink member 200 is overlapped with the middle frame 400 by the first mounting portion 1004.

As shown in connection with fig. 11, the present application provides a housing component comprising a housing 600 and a heat dissipating component 300 as described above. The heat dissipation component 300 is disposed inside the housing 600, and the heat dissipation fan assembly b is disposed on a side of the heat dissipation assembly a facing away from the housing 600. Of course, the heat dissipating component 300 herein may also be replaced with the heat dissipating component 100, the heat dissipating component 200, or other similar heat dissipating components or heat dissipating assemblies.

Referring to fig. 7 and 8, the present application further provides a terminal device 1000, which includes the above-mentioned heat dissipation component 200. In other embodiments, heat sink 200 may be replaced with heat sink 100 or heat sink 300.

In some embodiments, terminal device 1000 can further include a heat source region 700. The front projection of the heat source area 700 and the heat dissipating component a in the first preset direction at least partially overlaps, and the front projection of the heat dissipating fan component b and the heat source area 700 in the first preset direction does not overlap, and the front projection of the heat dissipating fan component b and the condenser 20 in the first preset direction at least partially overlaps.

Terminal device 1000 includes a housing 600, housing 600 having an air inlet 1008 and an air outlet 1007.

The cooling fan outlet 711 of the cooling fan assembly b herein may be provided toward the outlet 1007. Preferably, the cooling fan outlet 711 of the cooling fan assembly b may be disposed opposite to the outlet 1007 (as shown in fig. 7). The heat dissipation fan outlet 711 of the heat dissipation fan assembly b may be disposed opposite to the outlet 1007, which may be understood that the heat dissipation fan outlet 711 and the outlet 1007 are aligned at a midpoint (or a center) of at least one of the first preset direction, the second preset direction, and the third preset direction. Of course, the air outlet 1007 and the air outlet 711 of the cooling fan may not be disposed opposite to each other.

In some embodiments, an airflow pipeline (not shown) is disposed between the cooling fan assembly b and the air outlet 1007, and the airflow guided by the cooling fan assembly b flows to the air outlet 1007 through the airflow pipeline.

Here, one end of the air flow pipe is connected to the housing 600 where the air outlet 1007 is located, and the other end is connected to the heat radiating fin 72 or to the periphery of the air outlet 711 of the heat radiating fan.

Specifically, the housing 600 has a side wall 602 and a back wall 601. The air outlet 1007 may be provided on the sidewall 602.

In some embodiments, the air inlet 1008 is provided on the sidewall 602. Preferably, the inlet vent 1008 may be located opposite the outlet vent 1007. In other embodiments, the air inlet may be located at other locations on the sidewall 602. In other embodiments, the intake vent may also be located in other areas, such as on the back wall 601.

The air inlet 1008 and the air outlet 1007 may be further provided with a dust screen. The dust screen may be sprayed with fluoride to form a hydrophobic coating to facilitate waterproofing at the air inlet 1008 and air outlet 1007.

In some embodiments, the first preset direction may be understood as a thickness direction T0 of the terminal device 1000 shown in fig. 8. The thickness direction T0 of the terminal device 1000 coincides with the thickness direction T of the heat sink 200.

Alternatively, the length direction L0 of the terminal device 1000 coincides with the length direction L of the heat sink member 200, and the width direction W0 of the terminal device 1000 coincides with the width direction W of the heat sink member 200.

In some embodiments, heat source region 700 is provided with at least one heat source device, such as a Central Processing Unit (CPU) 701 of terminal device 1000, a control circuit board (PCB) 702. The heat source device is disposed corresponding to the evaporator 10 of the heat dissipation assembly a, that is, the heat source device at least partially overlaps with the orthographic projection of the evaporator 10 of the heat dissipation assembly a in the first preset direction, so as to dissipate heat through the evaporator 20.

The terminal device 1000 includes a middle frame 400 and a screen 500. The middle frame 400, the heat dissipation assembly a and the heat source device are disposed between the screen 500 and the case 600.

The middle frame 400, the heat dissipation assembly a and the heat source device are disposed between the screen 500 and the back wall 601 of the housing 600.

The heat dissipation assembly a is disposed on the middle frame 400, and the heat dissipation assembly a is located between the heat source device and the screen 500.

The terminal device 1000 can also include a battery 800. The battery 800 may be disposed corresponding to the condenser of the heat dissipation assembly a. I.e. the battery 800 at least partially overlaps the orthographic projection of the condenser of the heat dissipating assembly a in the first preset direction.

Referring to fig. 9 and 10, the present application further provides a terminal device 2000, where a heat dissipation component a is added to the terminal device 2000 compared to the terminal device 1000. The terminal device 2000 may be the same as or similar to the terminal device 1000 described above with reference to the related description. The heat dissipation component a is disposed inside the housing 600, and the middle frame 400 and the heat source device are disposed on a side of the heat dissipation component a facing away from the back wall of the housing 600.

In some embodiments, terminal device 2000 is provided with a wireless charging structure 900, such as a wireless charging coil, located opposite heat source region 700. The evaporator 10, the condenser 20 and the pipes (including the first pipe 30 and the second pipe 40) of the heat dissipation assembly a enclose an avoidance port (which can be understood as an opening 103 shown in fig. 5) in the middle of the heat dissipation assembly a, and the wireless charging structure 900 is correspondingly arranged with the avoidance port so as to be applied to an unlimited charging terminal device. The wireless charging structure 900 is disposed corresponding to the avoidance opening, which may be understood that the orthographic projection of the wireless charging structure 900 along the first preset direction is at least partially located in the avoidance opening. Preferably, the orthographic projection of the wireless charging structure 900 along the first preset direction is located in the avoidance port, so as to ensure the efficiency of wireless charging.

With continued reference to fig. 8 and 9, the cooling fan assembly b is located on a side of the cooling assembly a facing away from the screen in the first preset direction, the cooling fan assembly b and the condenser are located on a side of the wireless charging structure 900 facing away from the evaporator in the second preset direction, and the first pipe 30 and the second pipe 40 do not overlap with orthographic projection of the wireless charging structure 900 in the first preset direction.

Referring to fig. 11, the present application further provides a terminal device 3000, and the terminal device 3000 is provided with a heat dissipation member 300 inside the housing 600, compared to the terminal device 2000. And a heat dissipation assembly is provided between the heat source device and the screen, and other similar points are described with reference to the above.

In addition, in other terminal devices, only a heat dissipation member may be provided between the heat source device and the housing. The heat sink member disposed between the heat source device and the housing may also be replaced with the heat sink member 100, the heat sink member 200, or other heat sink members. The terminal device replaced with the heat radiating member 100, 200 may not be an unlimited charging terminal device.

The terminal device may be an electronic terminal such as a mobile phone, a tablet computer, or a notebook computer.

The application further provides a manufacturing method of the heat dissipation assembly. Referring to fig. 12, and in conjunction with fig. 13 when necessary, the manufacturing method can be used to fabricate a heat dissipating assembly as described above. The manufacturing method comprises the following steps of S101, S103 and S105:

in step S101, a first cover plate and a second cover plate are provided;

in step S103, a capillary structure is formed on at least one of the first cover plate and the second cover plate;

in step S105, assembling the first cover plate and the second cover plate in a butt joint manner to form the heat dissipation assembly;

in step S107, a heat radiation fan assembly is provided; the heat dissipation fan assembly and the heat dissipation assembly are arranged in a stacked mode in a first preset direction, and orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction is at least partially overlapped.

As shown in conjunction with fig. 13, in step S101, a first cover plate 1001 and a second cover plate 1002 are provided. The first cover 1001 and the second cover 1002 are covers that form the heat dissipation assembly a. The cover plates of other heat dissipation components can be arranged according to specific conditions.

In some embodiments, the forming a capillary structure on at least one of the first cover plate and the second cover plate in step S103 may include:

The capillary structure 60 is formed on at least one of the first cover plate 1001 and the cover plate 1002 by at least one of etching and sintering.

Further, in some embodiments, after providing the first cover plate 1001 and the second cover plate 1002, the method includes:

support columns are formed on at least one of the first cover plate 1001 and the second cover plate 1002 by at least one of etching and sintering. The support columns may be formed simultaneously with the capillary structure.

In some embodiments, after the first cover plate 1001 and the second cover plate 1002 are assembled in apposition, the method further includes the following steps S1051 and S152:

in step S1051, a working fluid is injected.

In step S1052, the portion where the working fluid is injected is sealed.

The working fluid may be water. Of course, other refrigerants that can be used in the heat dissipating structure can be used.

In some embodiments, as shown in fig. 13, a first liquid injection portion 1005 for forming a liquid injection structure extends outwards from one end of the first cover plate 1001, and a second liquid injection portion 1006 extending outwards and corresponding to the first liquid injection portion 1005 is provided on one end of the second cover plate 1002. The first liquid injection part 1005 and the second liquid injection part 1006 have substantially the same structure.

After the capillary structure is formed in step S103, the method further includes the following step S104

Step S104: and correspondingly assembling (namely, aligning and assembling) the first liquid injection part and the second liquid injection part to form a liquid injection structure.

The liquid injection structure is provided with an inner cavity of the liquid injection structure communicated with the heat dissipation assembly and the outside. The inner cavity of the liquid injection structure is communicated with the inner cavity of the evaporator.

The step S104 may be implemented synchronously with the assembling of the first cover plate 1001 and the second cover plate 1002 in the step S105.

Accordingly, the step S1051 may be implemented as follows:

and injecting working fluid through the liquid injection structure.

Accordingly, after the working fluid is injected into the interior through the liquid injection structure, the method includes:

and removing the liquid injection structure, and vacuum sealing the liquid injection structure.

It should be noted that, for the injection of the working fluid through such an epitaxial injection structure, in some embodiments, the sealing of the injection of the working fluid at step S1052 may be implemented in the following two steps: firstly, vacuum sealing is carried out on the outer end of the liquid injection structure (namely, one end of the liquid injection structure, which is far away from the heat dissipation component); and then removing the liquid injection structure, and vacuum sealing the joint connected with the liquid injection structure on the edge of the heat radiation component.

The outer end of the liquid injection structure can be subjected to vacuum sealing, and then the heat radiation assembly can be operated, for example, one end of the evaporator of the heat radiation assembly is adjusted to face upwards, and air reserved in the inner cavity of the heat radiation assembly flows into the inner end of the liquid injection structure. And then removing the liquid injection structure. The step S1052 is performed in such a way, which is beneficial to improving the vacuum degree in the inner cavity of the heat dissipation assembly and avoiding the influence on the heat dissipation effect due to the excessive air mixed in the inner cavity of the heat dissipation assembly.

It should be noted that after vacuum sealing, the method may further include a plurality of methods for testing the heat dissipating component.

Referring to fig. 1 to 3 and 5, in some embodiments, the heat dissipation fan assembly b includes a heat dissipation fan 71 and a heat dissipation fin 72. The heat radiation fan 71 has a heat radiation fan outlet 711. The heat dissipation fan air outlet 711 is disposed towards the heat dissipation fins 72, so that the air flow blown out by the heat dissipation fan air outlet 711 can be blown to the heat dissipation fins 72, thereby blowing away the heat of the heat dissipation fins 72 and the vicinity thereof, so as to well achieve heat dissipation. Alternatively, the heat radiating fins 72 may be disposed opposite to the heat radiating fan outlet 711.

In step S107, in some embodiments, the heat dissipation fans 71 and the heat dissipation fins 72 may be respectively provided at preset positions of the heat dissipation assembly a. The heat dissipation fins 72 are disposed on the heat dissipation component a by welding, bonding or plugging. The heat radiation fan 71 may be provided in a similar manner.

In other embodiments, the heat dissipating fan 71 and the heat dissipating fins 72 may be assembled together and then mounted on the heat dissipating component a.

In the present disclosure, the structural embodiments and method embodiments may be complementary to each other without conflict

。

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing has outlined the detailed description of the method and apparatus provided by the embodiments of the present disclosure, and the detailed description of the principles and embodiments of the present disclosure has been provided herein with the application of the specific examples, the above examples being provided only to facilitate the understanding of the method of the present disclosure and its core ideas; meanwhile, as one of ordinary skill in the art will have variations in the detailed description and the application scope in light of the ideas of the present disclosure, the present disclosure should not be construed as being limited to the above description.

Claims

A heat sink member, the heat sink member comprising:

the heat dissipation assembly comprises an evaporator and a condenser, wherein the condenser and the evaporator are communicated through a pipeline to form a loop;

and the radiating fan assembly is overlapped with the radiating assembly in a first preset direction, and the orthographic projection of the radiating fan assembly and the condenser in the first preset direction is at least partially overlapped.
The heat dissipating component of claim 1, wherein the heat dissipating fan assembly comprises a heat dissipating fan having a heat dissipating fan outlet disposed toward the heat dissipating fin and a heat dissipating fin.
The heat sink member of claim 2, wherein a dimension of the heat dissipating fan in the second preset direction is less than or equal to 20mm; the dimension of the cooling fan in the third preset direction is smaller than or equal to 20mm; wherein the second preset direction is perpendicular to the third preset direction.
A heat sink according to any one of claims 1 to 3, wherein the heat dissipating assembly comprises a first conduit, the evaporator having an output end, the condenser having an inlet end, the first conduit communicating the output end of the evaporator with the inlet end of the condenser; at least part of the inner wall of the first pipeline is provided with a capillary structure.
The heat dissipating component of claim 4, wherein the heat dissipating assembly further comprises:

a second conduit, the evaporator having an input end opposite the output end, the condenser having an outlet end opposite the inlet end, the second conduit communicating the outlet end of the condenser and the input end of the evaporator;

the compensation cavity is positioned between the second pipeline and the evaporator, and a capillary structure is filled in the inner cavity of the compensation cavity;

And the working fluid circulates in the evaporator, the first pipeline, the condenser, the second pipeline and the fluid supplementing cavity.
The heat dissipating component of claim 5, wherein the interior of said compensating cavity is filled with capillary structures forming vapor barriers.
The heat sink of any one of claims 4 to 6, wherein the evaporator has a first evaporator side wall and a second evaporator side wall disposed opposite each other in a first predetermined direction, and the second evaporator side wall has a capillary structure disposed thereon.
The heat dissipating component of any one of claims 4 to 6, wherein the first duct has a first duct side wall and a second duct side wall disposed opposite to each other in a first predetermined direction, and an inner wall of at least one of the first duct side wall and the second duct side wall is provided with a capillary structure.
The heat dissipating component of claim 8, wherein the interior cavity of the first conduit has a first capillary structure region in which the capillary structure is disposed and a first expansion chamber region outside the first capillary structure region, the first expansion chamber region having a dimension in a first predetermined direction that is greater than a dimension of the first capillary structure region in the first predetermined direction.
The heat sink of claim 9, wherein a ratio between a dimension of the first expansion chamber region along the first predetermined direction and a dimension of the first capillary structure region along the first predetermined direction is greater than 2.
The heat radiation member according to any one of claims 5 to 10, wherein the second duct has third duct side walls, fourth duct side walls which are disposed opposite to each other in the first predetermined direction; and a capillary structure is arranged on the inner wall of at least one of the third pipeline side wall and the fourth pipeline side wall.
The heat sink of claim 11 wherein the interior cavity of the second conduit has a second wicking structure area within which the wicking structure is disposed and a second expansion chamber area outside of the second wicking structure area; or alternatively, the first and second heat exchangers may be,

and the inner cavity of the second pipeline is fully distributed with a capillary structure.
The heat sink of any one of claims 4 to 12, wherein the condenser has first and second condenser side walls disposed opposite each other in a first predetermined direction, and wherein a capillary structure is provided on an inner wall of at least one of the first and second condenser side walls.
The heat dissipating component of any one of claims 5 to 13, wherein the heat dissipating assembly has a first cover plate and a second cover plate stacked in a thickness direction, and at least one of the first cover plate and the second cover plate is provided with a capillary structure forming the evaporator, the condenser, the first duct, the second duct, and the compensation chamber.
The heat dissipating component of claim 14, wherein at least one of said first cover plate and said second cover plate is provided with a plurality of spaced support columns, said plurality of support columns being located in an interior cavity of at least one of said evaporator, condenser, first conduit, second conduit, and compensation chamber.
The heat sink as in claim 14 or 15, wherein an aperture is provided between the first conduit and the second conduit, the aperture extending through the first cover plate and the second cover plate.
The heat sink of claim 16 wherein the size of said opening proximate to one end of said evaporator is greater than the size of said opening proximate to one end of said condenser in the direction of said first conduit toward said second conduit.
The heat sink of claim 16, wherein the smallest dimension of the aperture is greater than or equal to 0.1mm in a direction of the first conduit toward the second conduit.
The heat sink of claim 18, wherein the smallest dimension of the aperture is less than or equal to 2cm in a direction of the first conduit toward the second conduit.
The heat sink of any one of claims 4 to 19, wherein the wicking structure comprises a combination of one or more of a metal mesh wicking structure, a metal wire braided rope wicking structure, an etched groove wicking structure, a metal powder sintered wicking structure, and a foam metal wicking structure.
The heat sink member of any one of claims 1 to 20, wherein the side edge of the heat sink assembly is provided with an outwardly extending first mounting portion.
A method of manufacturing a heat sink member, characterized in that the method is used to manufacture a heat sink member as claimed in any one of claims 1 to 21; the manufacturing method comprises the following steps:

providing a first cover plate and a second cover plate;

forming a capillary structure on at least one of the first cover plate and the second cover plate;

assembling the first cover plate and the second cover plate in a butt joint way to form the heat dissipation assembly;

setting a heat radiation fan assembly; the heat dissipation fan assembly and the heat dissipation assembly are arranged in a stacked mode in a first preset direction, and orthographic projection of the heat dissipation fan assembly and the condenser in the first preset direction is at least partially overlapped.
The method of manufacturing a heat sink as claimed in claim 22, wherein the forming a capillary structure on at least one of the first cover plate and the second cover plate includes:

and forming a capillary structure on at least one of the first cover plate and the cover plate by adopting an etching mode and/or a sintering mode.
The method of manufacturing a heat sink member according to claim 22 or 23, wherein after providing the first cover plate and the second cover plate, the method includes:

and forming a support column on at least one of the first cover plate and the second cover plate by adopting an etching mode and/or a sintering mode.
The method of manufacturing a heat sink member according to any one of claims 22 to 24, wherein after assembling the first cover plate and the second cover plate in a butt-joint manner, the method further includes:

injecting a working fluid;

sealing the injection place of the working fluid.
The method of manufacturing a heat sink according to claim 25, wherein a first liquid injection portion for forming a liquid injection structure is extended outwardly from one end of the first cover plate, and a second liquid injection portion is provided at one end of the second cover plate, which extends outwardly and corresponds to the first liquid injection portion;

After forming the capillary structure, the method further comprises:

correspondingly assembling the first liquid injection part and the second liquid injection part to form a liquid injection structure;

the injecting the working fluid includes:

and injecting working fluid through the liquid injection structure.
The method of manufacturing a heat sink as claimed in claim 26, wherein after the working fluid is injected into the interior through the liquid injection structure, the method comprises:

and removing the liquid injection structure, and vacuum sealing the liquid injection structure.
A center frame assembly, comprising: a center frame and the heat dissipation member according to any one of claims 1 to 20, the heat dissipation member being provided on the center frame.
The center frame member of claim 28, wherein the center frame is provided with a through hole, at least a portion of the heat dissipating member is embedded in the through hole, and a side edge of the heat dissipating member is provided with a first mounting portion extending outward, and the heat dissipating member is overlapped with the center frame by the first mounting portion.
A housing component comprising a housing and a heat sink as claimed in any one of claims 1 to 21, the heat sink being disposed inside the housing and the heat sink fan assembly being located on a side of the heat sink assembly facing away from the housing.
A terminal device, comprising: the heat sink of any one of claims 1-21, the terminal device further comprising a heat source region at least partially overlapping with an orthographic projection of the heat sink assembly in a first preset direction, and the heat sink fan assembly does not overlap with an orthographic projection of the heat source region in the first preset direction, and the heat sink fan assembly at least partially overlaps with an orthographic projection of the condenser in the first preset direction;

the terminal equipment comprises a shell, wherein the shell is provided with an air inlet and an air outlet.
The terminal device of claim 31, wherein the radiator fan assembly is disposed directly opposite the air outlet; and/or the number of the groups of groups,

an air flow pipeline is arranged between the cooling fan assembly and the air outlet, and air flow guided by the cooling fan assembly flows to the air outlet through the air flow pipeline.
A terminal device according to claim 31 or 32, wherein the heat source region is provided with at least one heat source device which at least partially overlaps with an orthographic projection of the evaporator of the heat dissipating assembly in a first predetermined direction for dissipating heat through the evaporator.
The terminal device according to any of the claims 31 to 33, characterized in that the comprises: a middle frame and a screen; the middle frame, the heat dissipation part and the heat source device are arranged between the screen and the shell;

the heat dissipation component is arranged on the middle frame, and the heat dissipation component is positioned between the heat source device and the screen;

or, the heat dissipation component is arranged on the inner side of the shell, the heat dissipation fan component is positioned on one side of the heat dissipation component, which is away from the shell, and the middle frame and the heat source device are positioned on one side of the heat dissipation component, which is away from the shell.
A terminal device according to any one of claims 31 to 33, wherein the terminal device is provided with a wireless charging structure at opposite ends of the heat source region, the evaporator, condenser and pipeline of the heat sink assembly enclosing an avoidance port in the middle of the heat sink assembly, the wireless charging structure being arranged in correspondence with the avoidance port.