WO2023241486A1 - 天线散热组件及基站 - Google Patents

天线散热组件及基站 Download PDF

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Publication number
WO2023241486A1
WO2023241486A1 PCT/CN2023/099452 CN2023099452W WO2023241486A1 WO 2023241486 A1 WO2023241486 A1 WO 2023241486A1 CN 2023099452 W CN2023099452 W CN 2023099452W WO 2023241486 A1 WO2023241486 A1 WO 2023241486A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
base station
antenna
heat
transceiver
Prior art date
Application number
PCT/CN2023/099452
Other languages
English (en)
French (fr)
Inventor
卜力
廖若辰
陈海波
刘水平
林志滨
段凯文
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2023241486A1 publication Critical patent/WO2023241486A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures

Definitions

  • the embodiments of this application relate to the field of 5G communication technology, and in particular to an antenna heat dissipation component and a base station.
  • 5G Fifth Generation Mobile Communication Technology
  • 5G is an active antenna.
  • the antenna will inevitably generate heat when it is working. A large amount of heat accumulates inside the base station. If heat dissipation is not carried out in time, it will affect the normal operation of the electronic components inside the base station and greatly reduce the practicality of the base station.
  • Embodiments of the present application provide an antenna heat dissipation component and a base station.
  • an antenna heat dissipation component including: a reflection plate; a plurality of heat dissipation fins, the heat dissipation fins being disposed on the reflection plate; a plurality of vibrator units, the vibrator units being disposed on the Between the heat sinks, the heat sinks and the reflection plate are both made of metal.
  • embodiments of the present application provide a base station, including the antenna heat dissipation component described in the first aspect.
  • Figure 1 is a schematic structural diagram of an antenna heat dissipation component provided by an embodiment of the present application
  • Figure 2 is a three-dimensional schematic diagram of the heat dissipation structure of a base station provided by an embodiment of the present application;
  • Figure 3 is a schematic cross-sectional view of the heat dissipation structure of a base station provided by an embodiment of the present application.
  • 5G is an active antenna.
  • the antenna will inevitably generate heat when it is working. A large amount of heat accumulates inside the base station. If heat dissipation is not carried out in time, it will affect the normal operation of the electronic components inside the base station and greatly reduce the practicality of the base station.
  • the heat dissipation teeth on the back of the casing are usually used for single-sided heat dissipation, and the heat dissipation efficiency is low. Since the front of the base station is covered with a sealed radome to protect the antenna oscillator, the heat generated by the base station cannot be dissipated to the outside world through the antenna.
  • inventions of the present application provide an antenna heat dissipation component and a base station.
  • the antenna heat dissipation component includes a reflection plate, a plurality of heat sinks and a plurality of vibrator units.
  • the heat sinks are provided on the reflection plate.
  • the vibrator unit is arranged between adjacent heat sinks, and the heat sinks and reflection plates are both made of metal.
  • the antenna heat dissipation component of the present application not only has multiple heat sinks, but also the heat sinks and reflection plates are made of metal, which increases the heat conduction area of the entire antenna component, so that the entire antenna can be used for heat dissipation of the base station.
  • the heat generated by the base station can be dissipated to the outside world through the antenna heat dissipation component, thereby realizing double-sided heat dissipation of the base station equipment.
  • the double-sided heat dissipation method can reduce the heat dissipation area of the existing chassis, thereby reducing the cost of the base station, reducing the weight of the base station, achieving miniaturization and lightweight of the product, and greatly improving the competitiveness of the product.
  • FIG. 1 is a schematic structural diagram of an antenna heat dissipation component provided by an embodiment of the present application.
  • the antenna heat dissipation assembly 10 can be installed on the base station as a heat sink.
  • the antenna heat dissipation assembly 10 includes a reflection plate 03, a plurality of heat sinks 02 and a plurality of oscillator units 01, wherein the heat sink 02 is provided on the reflection plate 03, and the oscillator unit 01 is provided Between adjacent heat sinks 02, the heat sink 02 and the reflection plate 03 are both made of metal.
  • the reflection plate 03 can also be used for heat dissipation, thereby increasing the heat conduction area of the entire antenna assembly, making the entire Antennas can be used for heat dissipation of base stations.
  • the vibrator unit 01 also has a certain heat dissipation effect.
  • the vibrator unit 01 can be made of alloy materials or other materials (such as plastic, PCB, etc.) to achieve heat dissipation.
  • multiple vibrator units 01 and heat sinks 02 are placed on the upper surface of the reflection plate 03.
  • the heat sinks 02 and the reflection plate 03 can be integrated to facilitate mass production.
  • the heat sinks 02 can be arranged at equidistant intervals on the upper surface of the reflection plate 03 , and multiple heat sinks 02 are parallel to each other, and the vibrator units 01 are arranged between adjacent heat sinks 02 to facilitate heat dissipation. . It should be noted that the arrangement of the heat sink 02 can be flexibly adjusted according to the actual layout of the vibrator unit 01 .
  • the height of the heat sink 02 ranges from 0.1 to 0.25 operating wavelengths to avoid electromagnetic interference to the vibrator unit 01 on the reflective plate 03 .
  • the operating wavelength is determined by the center frequency point of the base station's operating frequency band, and is the wavelength of the electromagnetic wave along the propagation direction.
  • the base station can adopt a radome-less design, and the outer surface of the vibrator unit 01 is coated with a waterproof film to directly dissipate the heat introduced into the antenna heat dissipation assembly 10 to the outside world, thereby achieving the purpose of heat dissipation.
  • the heat generated by the base station can be dissipated to the outside world through the antenna heat dissipation assembly 10, thereby achieving basic Double-sided cooling of station equipment.
  • the double-sided heat dissipation method can reduce the heat dissipation area of the existing chassis 40, thereby reducing the cost of the base station, reducing the weight of the base station, achieving miniaturization and lightweight of the product, and greatly improving the competitiveness of the product.
  • Figure 2 is a schematic diagram of the heat dissipation structure of a base station provided by an embodiment of the present application.
  • the base station includes the above-mentioned antenna heat dissipation component 10.
  • the base station since the base station adopts the above-mentioned antenna heat dissipation component 10, the base station can achieve the same technical effect as the above-mentioned antenna heat dissipation component 10.
  • the antenna heat dissipation component 10 in this base station includes a reflection plate 03, a plurality of heat sinks 02 and a plurality of oscillator units 01.
  • the heat sink 02 is arranged on the reflection plate 03, and the oscillator unit 01 is arranged between adjacent heat sinks 02.
  • the heat sink 02 and the reflection plate 03 are both made of metal.
  • the antenna heat dissipation component 10 of the present application not only has multiple heat sinks 02, but also the heat sinks 02 and the reflection plate 03 are made of metal, which increases the heat conduction area of the entire antenna component, so that the entire antenna can be used for base stations.
  • the heat generated by the base station can be dissipated to the outside world through the antenna heat dissipation component 10, and then Realize double-sided heat dissipation of base station equipment.
  • the double-sided heat dissipation method can reduce the heat dissipation area of the existing chassis 40, thereby reducing the cost of the base station, reducing the weight of the base station, achieving miniaturization and lightweight of the product, and greatly improving the competitiveness of the product.
  • Figure 3 is a schematic diagram of the heat dissipation structure of a base station provided by an embodiment of the present application.
  • the base station also includes a transceiver board 20 and a casing 40.
  • the antenna heat dissipation component 10 is disposed above the transceiver board 20, and the casing 40 is disposed below the transceiver board 20.
  • a plurality of heat dissipation teeth 41 are provided at the bottom of the casing 40.
  • the components on the transceiver board 20 can dissipate heat through the antenna heat dissipation assembly 10 above and the multiple heat dissipation teeth 41 provided at the bottom of the chassis 40 below, thereby realizing double-sided heat dissipation of the base station equipment.
  • the transceiver board 20 and the antenna heat dissipation assembly 10 are in contact with each other through silicone grease, which can speed up heat conduction and further improve the heat dissipation effect. It should be noted that in addition to silicone grease, other thermally conductive adhesives can also be used.
  • a transceiver chip 21 is provided on the lower surface of the transceiver board 20 , and the heat generated by the transceiver chip 21 is directly introduced into the casing 40 for heat dissipation.
  • the heat dissipation teeth 41 are provided at the bottom of the casing 40, so the heat on the casing 40 is transferred to the heat dissipation teeth 41, and the heat is dissipated to the outside through the heat dissipation teeth 41.
  • the transceiver chip 21 is in contact with the chassis 40 through silicone grease, which can speed up heat conduction and further improve the heat dissipation effect. It should be noted that in addition to silicone grease, other thermally conductive adhesives can also be used.
  • a power amplifier 23 and a filter 22 are also provided on the lower surface of the transceiver board 20 .
  • the transceiver chip 21 , the power amplifier 23 and the filter 22 are surface-mounted and soldered. Being electrically connected to the transceiver board 20 can reduce path loss while reducing base station cost and weight, thereby improving product competitiveness.
  • the heat generated by the power amplifier 23 is transferred to the antenna heat dissipation component through the transceiver board 20 10, that is, on the reflection plate 03, several vibrator units 01 and several heat sinks 02, the heat dissipation efficiency at the location of the power amplifier 23 is improved, thereby preventing the power amplifier 23 from being overheated during operation and causing a reduction in its working performance.
  • the filter 22 is electrically connected to the antenna heat dissipation assembly 10 through the connector 30 .
  • the signal output by the transceiver chip 21 passes through the transceiver board 20 and the power amplifier 23 in sequence; the signal comes out of the power amplifier 23 and enters the filter 22 via the transceiver board 20.
  • the output signal of the filter 22 enters the connector 30 via the transceiver board 20. Finally, it enters the antenna and radiates outward.
  • the base station may include an antenna heat dissipation component 10, a transceiver board 20, a transceiver chip 21, a filter 22, a power amplifier 23 and a chassis 40, where the power amplifier 23 , transceiver chip 21.
  • the filter 22 is located on the lower surface of the transceiver board 20 so that the heat generated by the transceiver chip 21 can be introduced into the casing 40 for heat dissipation, and the heat generated by the power amplifier 23 can be guided into the antenna heat dissipation assembly 10 through the transceiver board 20 for heat dissipation. This enables double-sided heat dissipation of base station equipment.
  • the transceiver chip 21, the power amplifier 23, and the filter 22 are disposed on the lower surface of the transceiver board 20, and the heat generated by the transceiver chip 21 is directly introduced into the casing 40 for heat dissipation.
  • the heat dissipation teeth 41 are provided at the bottom of the casing 40, so the heat on the casing 40 is transferred to the heat dissipation teeth 41, and the heat is dissipated to the outside through the heat dissipation teeth 41.
  • the heat generated by the power amplifier 23 is sequentially introduced to the antenna heat dissipation assembly 10 through the transceiver board 20 for heat dissipation, thereby realizing double-sided heat dissipation on the upper and lower sides of the base station, improving the heat dissipation efficiency of the power amplifier chip and the transceiver chip 21, and at the same time reducing the cost of the base station.
  • the weight of the base station greatly improves product competitiveness.
  • Embodiments of the present application include: an antenna heat dissipation component and a base station.
  • the antenna heat dissipation component includes a reflection plate, a plurality of heat sinks and a plurality of vibrator units, wherein the heat sinks are arranged on the reflection plate, and the vibrator units are arranged between adjacent heat sinks.
  • Both the heat sink and the reflector are made of metal.
  • the antenna heat dissipation component of the present application not only has multiple heat sinks, but also the heat sinks and reflection plates are made of metal, which increases the heat conduction area of the entire antenna component, so that the entire antenna can be used for heat dissipation of the base station.
  • the heat generated by the base station can be dissipated to the outside world through the antenna heat dissipation component, thereby realizing double-sided heat dissipation of the base station equipment.
  • the double-sided heat dissipation method can reduce the heat dissipation area of the existing chassis, thereby reducing the cost of the base station, reducing the weight of the base station, achieving miniaturization and lightweight of the product, and greatly improving the competitiveness of the product.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Transmitters (AREA)
  • Details Of Aerials (AREA)

Abstract

本申请公开了天线散热组件及基站，天线散热组件（10）包括反射板（03）、多个散热片（02）和多个振子单元（01），其中，散热片（02）设置于反射板（03）上，振子单元（01）设置于相邻散热片（02）之间，散热片（02）与反射板（03）均由金属制成。

Description

天线散热组件及基站
相关申请的交叉引用
本申请基于申请号为202210678360.1、申请日为2022年06月16日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请实施例涉及5G通信技术领域，特别是涉及一种天线散热组件及基站。
背景技术
随着5G(5th Generation Mobile Communication Technology，第五代移动通信技术)技术的快速发展，对无线基站集成度的要求则越来越高。5G是有源天线,天线在工作时必然会产生热量，基站的内部积聚大量的热量，若不及时进行散热工作，会影响基站内部电子元件的正常工作，大大降低基站的实用性。
现有的基站设备中的通常是采用机壳背部的散热结构进行单面散热，其散热效率低。而基站正面由于覆盖有保护天线振子的密封天线罩，基站产生的热量无法通过天线散发到外界中。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种天线散热组件及基站。
第一方面，本申请实施例提供了一种天线散热组件，包括：反射板；多个散热片，所述散热片设置于所述反射板上；多个振子单元，所述振子单元设置于所述散热片之间，所述散热片与所述反射板均由金属制成。
第二方面，本申请实施例提供了一种基站，包括有如上第一方面所述的天线散热组件。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1为本申请一个实施例提供的一种天线散热组件的结构示意图；
图2为本申请一个实施例提供的一种基站的散热结构立体示意图；
图3为本申请一个实施例提供的一种基站的散热结构剖视示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申 请进行进一步详细说明。应当理解，此处所描述的实施例仅用以解释本申请，并不用于限定本申请。
应了解，在本申请实施例的描述中，多个(或多项)的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到“第一”、“第二”等只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
随着5G技术的快速发展，对无线基站集成度的要求则越来越高。5G是有源天线,天线在工作时必然会产生热量，基站的内部积聚大量的热量，若不及时进行散热工作，会影响基站内部电子元件的正常工作，大大降低基站的实用性。
现有的基站设备中的通常是采用机壳背部的散热齿进行单面散热，其散热效率低。而基站正面由于覆盖有保护天线振子的密封天线罩，基站产生的热量无法通过天线散发到外界中。
针对一些情形下存在上述的问题，本申请实施例提供了一种天线散热组件及基站，其中，天线散热组件包括反射板、多个散热片和多个振子单元，其中，散热片设置于反射板上，振子单元设置于相邻散热片之间，散热片与反射板均由金属制成。基于此，本申请的天线散热组件不但具有多个散热片，且散热片与反射板均由金属制成，增加了整个天线组件的导热面积，使得整个天线都可以用于基站的散热，基于此，相对于现有的基站设备采用机壳背部的散热结构进行单面散热，借助本天线散热组件，可以使基站产生的热量能够通过天线散热组件散发到外界中，进而实现基站设备的双面散热。而且，采用双面散热的方式可以减少现有机壳的散热面积，从而降低基站的成本，减轻基站的重量，实现产品的小型化和轻量化，以大幅提高产品的竞争力。
如图1所示，图1是本申请一个实施例提供的一种天线散热组件的结构示意图。天线散热组件10可以作为散热器安装于基站上，天线散热组件10包括反射板03、多个散热片02和多个振子单元01，其中，散热片02设置于反射板03上，振子单元01设置于相邻散热片02之间，散热片02与反射板03均由金属制成，因此，除了散热片02，反射板03也可以用于散热，从而增加了整个天线组件的导热面积，使得整个天线都可以用于基站的散热。需要说明的是，振子单元01也具有一定的散热作用，振子单元01可以由合金材料制成，也可以由其他材料(如塑料、PCB等)制成，以实现散热。
在一示例性的实施方式中，多个振子单元01和散热片02置于反射板03的上表面，散热片02和反射板03可以采用一体化制成，以便于批量化生产制成。
在一示例性的实施方式中，散热片02可以等距间隔设置在反射板03上表面，且多个散热片02相互平行，振子单元01排布于相邻散热片02之间，以利于散热。需要说明的是，可以根据振子单元01实际的布局形式，灵活调整散热片02的排布方式。
在一示例性的实施方式中，散热片02的高度介乎于0.1至0.25个工作波长，避免对反射板03上的振子单元01造成电磁干扰。需要说明的是，工作波长由基站工作频段的中心频点决定，且为电磁波沿传播方向上的波长。
在一示例性的实施方式中，基站可以采用无天线罩设计，在振子单元01的外表面涂有防水薄膜，将导入到天线散热组件10上热量直接散发到外界中，从而实现散热的目的。
基于此，相对于现有的基站设备采用机壳40背部的散热结构进行单面散热，借助本天线散热组件10，可以使基站产生的热量能够通过天线散热组件10散发到外界中，进而实现基 站设备的双面散热。而且，采用双面散热的方式可以减少现有机壳40的散热面积，从而降低基站的成本，减轻基站的重量，实现产品的小型化和轻量化，以大幅提高产品的竞争力。
如图2所示，图2是本申请一个实施例提供的一种基站的散热结构示意图。该基站包括有上述的天线散热组件10。
在一实施例中，由于基站采用了上述的天线散热组件10，因此，本基站能够取得与上述天线散热组件10同样的技术效果。本基站中的天线散热组件10包括反射板03、多个散热片02和多个振子单元01，其中，散热片02设置于反射板03上，振子单元01设置于相邻散热片02之间，散热片02与反射板03均由金属制成。基于此，本申请的天线散热组件10不但具有多个散热片02，且散热片02与反射板03均由金属制成，增加了整个天线组件的导热面积，使得整个天线都可以用于基站的散热，基于此，相对于现有的基站设备采用机壳40背部的散热结构进行单面散热，借助本天线散热组件10，可以使基站产生的热量能够通过天线散热组件10散发到外界中，进而实现基站设备的双面散热。而且，采用双面散热的方式可以减少现有机壳40的散热面积，从而降低基站的成本，减轻基站的重量，实现产品的小型化和轻量化，以大幅提高产品的竞争力。
在一示例性的实施方式中，如图3所示，图3是本申请一个实施例提供的一种基站的散热结构示意图。基站还包括有收发信板20和机壳40，天线散热组件10设置于收发信板20上方，机壳40设置于收发信板20下方，机壳40底部设置有多个散热齿41。基于此，收发信板20上的元器件可以分别通过上方的天线散热组件10和下方的机壳40底部设置的多个散热齿41进行散热，进而实现基站设备的双面散热。
在一示例性的实施方式中，收发信板20与天线散热组件10通过硅脂接触，可以加快热传导，以进一步提高散热效果。需要说明的是，除了硅脂，也可以采用其他导热胶。
在一示例性的实施方式中，如图3所示，收发信板20下表面设置有收发信芯片21，收发信芯片21产生的热量直接导入机壳40进行散热。机壳40底部设置散热齿41，因此将机壳40上的热量传递到散热齿41上，通过散热齿41将热量散发到外界中。收发信芯片21与机壳40通过硅脂接触，可以加快热传导，以进一步提高散热效果。需要说明的是，除了硅脂，也可以采用其他导热胶。
在一示例性的实施方式中，如图3所示，收发信板20下表面还设置有功率放大器23和滤波器22，收发信芯片21、功率放大器23和滤波器22采用表贴焊接的方式与收发信板20电连接，可以减少路损的同时降低基站成本和重量，提升产品竞争力。
在一示例性的实施方式中，在实际应用中，基站工作时，因为功率放大器23会产生热量，导致内部温度较高，通过将功率放大器23产生的热量经过收发信板20传递到天线散热组件10，即反射板03、若干振子单元01以及若干个散热片02上，提高功率放大器23所在位置的散热效率，从而避免功率放大器23在工作时温度过高而导致其工作性能降低。
在一示例性的实施方式中，如图3所示，滤波器22通过连接器30与天线散热组件10电连接。收发信芯片21输出的信号依次通过收发信板20、功率放大器23；信号从功率放大器23出来，经由收发信板20进入滤波器22，滤波器22输出信号经由收发信板20进入连接器30，最后进入天线向外辐射出去。
在一示例性的实施方式中，如图3所示，基站可以包括天线散热组件10、收发信板20、收发信芯片21、滤波器22、功率放大器23和机壳40，其中，功率放大器23、收发信芯片 21、滤波器22位于收发信板20的下表面，以便收发信芯片21产生的热量导入机壳40进行散热，而功率放大器23产生的热量可以经过收发信板20导入天线散热组件10进行散热，进而实现基站设备的双面散热。
基于此，将收发信芯片21、功率放大器23、滤波器22设置于收发信板20的下表面，通过收发信芯片21产生的热量直接导入机壳40进行散热。机壳40底部设置散热齿41，因此将机壳40上的热量传递到散热齿41上，通过散热齿41将热量散发到外界中。功率放大器23产生的热量依次经过收发信板20导入到天线散热组件10进行散热，进而实现基站上下的双面散热，提高功放芯片和收发信芯片21的散热效率的同时，降低基站的成本，减轻基站的重量，大幅提高产品竞争力。
本申请实施例包括：天线散热组件及基站，天线散热组件包括反射板、多个散热片和多个振子单元，其中，散热片设置于反射板上，振子单元设置于相邻散热片之间，散热片与反射板均由金属制成。基于此，本申请的天线散热组件不但具有多个散热片，且散热片与反射板均由金属制成，增加了整个天线组件的导热面积，使得整个天线都可以用于基站的散热，基于此，相对于现有的基站设备采用机壳背部的散热齿进行单面散热，借助本天线散热组件，可以使基站产生的热量能够通过天线散热组件散发到外界中，进而实现基站设备的双面散热。而且，采用双面散热的方式可以减少现有机壳的散热面积，从而降低基站的成本，减轻基站的重量，实现产品的小型化和轻量化，以大幅提高产品的竞争力。
以上是对本申请的一些实施进行了说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请范围的共享条件下还可作出种种等同的变形或替换，这些等同的变形或替换均包括在本申请权利要求所限定的范围内。

Claims (10)

  1. 一种天线散热组件，包括：
    反射板；
    多个散热片，所述散热片设置于所述反射板上；
    多个振子单元，所述振子单元设置于相邻所述散热片之间，所述散热片与所述反射板均由金属制成。
  2. 根据权利要求1所述的天线散热组件，其中，所述散热片与所述反射板一体成型。
  3. 根据权利要求1所述的天线散热组件，其中，多个所述散热片等距间隔设置在所述反射板上表面，多个所述散热片相互平行。
  4. 根据权利要求1或3所述的天线散热组件，其中，所述散热片的高度介乎于0.1至0.25个工作波长。
  5. 一种基站，所述基站包括有如权利要求1至4任意一项所述的天线散热组件。
  6. 根据权利要求5所述的基站，其中，还包括有收发信板和机壳，所述天线散热组件设置于所述收发信板上方，所述机壳设置于所述收发信板下方，所述机壳底部设置有多个散热齿。
  7. 根据权利要求6所述的基站，其中，所述收发信板与所述天线散热组件通过硅脂接触。
  8. 根据权利要求6所述的基站，其中，所述收发信板下表面设置有收发信芯片，所述收发信芯片与所述机壳通过硅脂接触。
  9. 根据权利要求8所述的基站，其中，所述收发信板下表面还设置有功率放大器和滤波器，所述收发信芯片、所述功率放大器和所述滤波器采用表贴焊接的方式与所述收发信板电连接。
  10. 根据权利要求9所述的基站，其中，还包括连接器，所述滤波器通过所述连接器与所述天线散热组件电连接。
PCT/CN2023/099452 2022-06-16 2023-06-09 天线散热组件及基站 WO2023241486A1 (zh)

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CN110311222A (zh) * 2019-04-30 2019-10-08 深圳市大富科技股份有限公司 一种用于基站的有源天线单元及天线单元
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Publication number Priority date Publication date Assignee Title
CN102035061A (zh) * 2010-12-10 2011-04-27 广东通宇通讯股份有限公司 一种一体化设计的有源天线散热器
CN105048053A (zh) * 2015-07-03 2015-11-11 普联技术有限公司 集成散热功能的天线装置
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CN110311222A (zh) * 2019-04-30 2019-10-08 深圳市大富科技股份有限公司 一种用于基站的有源天线单元及天线单元
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