WO2023233534A1 - Module optique - Google Patents
Module optique Download PDFInfo
- Publication number
- WO2023233534A1 WO2023233534A1 PCT/JP2022/022172 JP2022022172W WO2023233534A1 WO 2023233534 A1 WO2023233534 A1 WO 2023233534A1 JP 2022022172 W JP2022022172 W JP 2022022172W WO 2023233534 A1 WO2023233534 A1 WO 2023233534A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical
- fiber
- integrated circuit
- substrate
- fiber block
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 230
- 239000000835 fiber Substances 0.000 claims abstract description 48
- 239000013307 optical fiber Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 41
- 239000011521 glass Substances 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003550 marker Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
Definitions
- the optical module 40 does not require a separate substrate corresponding to the second substrate 21 of the optical module 20 of the first embodiment. That is, it is advantageous from the viewpoint of reducing the number of parts.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
L'invention concerne un module optique de type connexion de surface d'extrémité capable de former une connexion optique hautement précise tout en supprimant un endommagement des surfaces d'extrémité optique en raison de la butée des surfaces d'extrémité optique. Le module optique selon la présente invention est d'un type connexion de surface d'extrémité dans lequel un guide d'ondes optique disposé dans un circuit intégré optique et une fibre optique disposée dans un bloc de fibres forment une connexion optique au niveau de surfaces d'extrémité optiques respectives. Le bloc de fibres a une partie en saillie faisant saillie à partir de la surface d'extrémité optique de celui-ci vers la surface supérieure du circuit intégré optique lorsque le bloc de fibres est connecté au circuit intégré optique. La formation de la connexion optique entre le guide d'ondes optique et la fibre optique comprend la mise en butée de la surface inférieure de la partie en saillie et de la surface supérieure du circuit intégré optique avant que les surfaces d'extrémité optique ne soient connectées.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/022172 WO2023233534A1 (fr) | 2022-05-31 | 2022-05-31 | Module optique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/022172 WO2023233534A1 (fr) | 2022-05-31 | 2022-05-31 | Module optique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023233534A1 true WO2023233534A1 (fr) | 2023-12-07 |
Family
ID=89025994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2022/022172 WO2023233534A1 (fr) | 2022-05-31 | 2022-05-31 | Module optique |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2023233534A1 (fr) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1195062A (ja) * | 1997-09-16 | 1999-04-09 | Kyocera Corp | 光接続構造 |
| JP2000171668A (ja) * | 1998-12-09 | 2000-06-23 | Fujitsu Ltd | フェルールアセンブリ及び光モジュール |
| JP2000314819A (ja) * | 1999-04-28 | 2000-11-14 | Mitsubishi Electric Corp | ファイバ端末、そのファイバ端末の組立方法および光結合装置 |
| JP2002090578A (ja) * | 2000-09-18 | 2002-03-27 | Fujitsu Ltd | フェルールアセンブリ及び光モジュール |
| JP2014164270A (ja) * | 2013-02-27 | 2014-09-08 | Sumitomo Bakelite Co Ltd | フェルール、光電気混載基板および電子機器 |
| US10209452B1 (en) * | 2018-03-12 | 2019-02-19 | Cloud Light Technology Limited | Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package |
| US20200096715A1 (en) * | 2017-05-23 | 2020-03-26 | Huawei Technologies Co., Ltd. | Optical Module Structure and Fabrication Method for Optical Module Structure |
-
2022
- 2022-05-31 WO PCT/JP2022/022172 patent/WO2023233534A1/fr unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1195062A (ja) * | 1997-09-16 | 1999-04-09 | Kyocera Corp | 光接続構造 |
| JP2000171668A (ja) * | 1998-12-09 | 2000-06-23 | Fujitsu Ltd | フェルールアセンブリ及び光モジュール |
| JP2000314819A (ja) * | 1999-04-28 | 2000-11-14 | Mitsubishi Electric Corp | ファイバ端末、そのファイバ端末の組立方法および光結合装置 |
| JP2002090578A (ja) * | 2000-09-18 | 2002-03-27 | Fujitsu Ltd | フェルールアセンブリ及び光モジュール |
| JP2014164270A (ja) * | 2013-02-27 | 2014-09-08 | Sumitomo Bakelite Co Ltd | フェルール、光電気混載基板および電子機器 |
| US20200096715A1 (en) * | 2017-05-23 | 2020-03-26 | Huawei Technologies Co., Ltd. | Optical Module Structure and Fabrication Method for Optical Module Structure |
| US10209452B1 (en) * | 2018-03-12 | 2019-02-19 | Cloud Light Technology Limited | Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package |
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