WO2023228324A1 - 焼結体及び切削工具 - Google Patents

焼結体及び切削工具 Download PDF

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Publication number
WO2023228324A1
WO2023228324A1 PCT/JP2022/021417 JP2022021417W WO2023228324A1 WO 2023228324 A1 WO2023228324 A1 WO 2023228324A1 JP 2022021417 W JP2022021417 W JP 2022021417W WO 2023228324 A1 WO2023228324 A1 WO 2023228324A1
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Prior art keywords
sintered body
binder
diamond particles
less
cutting edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/021417
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English (en)
French (fr)
Japanese (ja)
Inventor
大起 松井
大継 岩崎
裕介 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Hardmetal Corp
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Sumitomo Electric Hardmetal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Hardmetal Corp filed Critical Sumitomo Electric Hardmetal Corp
Priority to CN202280096151.4A priority Critical patent/CN119156360A/zh
Priority to US18/866,097 priority patent/US20250320583A1/en
Priority to KR1020247038143A priority patent/KR20250006146A/ko
Priority to JP2022563070A priority patent/JP7318172B1/ja
Priority to EP22943727.2A priority patent/EP4534223A4/en
Priority to PCT/JP2022/021417 priority patent/WO2023228324A1/ja
Publication of WO2023228324A1 publication Critical patent/WO2023228324A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
    • B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
    • C—CHEMISTRY; METALLURGY
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/528—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from carbonaceous particles with or without other non-organic components
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/6303—Inorganic additives
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
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    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
    • C04B2235/421—Boron
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    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
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    • C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
    • C04B2235/422—Carbon
    • C04B2235/427—Diamond
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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    • C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2235/72—Products characterised by the absence or the low content of specific components, e.g. alkali metal free alumina ceramics
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    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B35/645—Pressure sintering
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    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/008—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds other than carbides, borides or nitrides

Definitions

  • the present disclosure relates to a sintered body and a cutting tool.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2008-133172 describes a sintered body.
  • the sintered body described in Patent Document 1 is formed by mixing boron-doped diamond powder and carbonate powder, and heating and pressurizing the mixture.
  • Patent Document 2 Japanese Unexamined Patent Publication No. 58-199777 describes a sintered body.
  • the sintered body described in Patent Document 2 is formed by mixing diamond powder and catalyst metal powder, and heating and pressurizing the mixture.
  • the catalytic metal powder includes boron carbide-added powder and metal powder (iron, nickel, cobalt, etc.).
  • the sintered body of the present disclosure includes diamond particles and a binding material.
  • the boron concentration in the diamond particles is 0.001 mass percent or more and 0.1 mass percent or less.
  • the boron concentration in the binder is 0.01 mass percent or more and 0.5 mass percent or less.
  • FIG. 1 is a plan view of the cutting insert 100.
  • FIG. 2 is a perspective view of the cutting insert 100.
  • FIG. 3 is a process diagram showing a method for manufacturing the sintered body forming the cutting edge portion 20. As shown in FIG.
  • a sintered body includes diamond particles and a binding material.
  • the boron concentration in the diamond particles is 0.001 mass percent or more and 0.1 mass percent or less.
  • the boron concentration in the binder is 0.01 mass percent or more and 0.5 mass percent or less.
  • the boron concentration in the binder may be 0.05 mass percent or more and 0.5 mass percent or less.
  • the sintered body of (1) or (2) above may further include a compound precipitated in the binder.
  • the compound may contain at least two or more of cobalt, boron, and carbon.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when subjected to X-ray diffraction may be 0.15 or less.
  • the compound may be at least one of Co 22 B 4 C 2 , W 2 Co 21 B 6 , W 2 Co 2 B 6 and CoWB.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when performing X-ray diffraction is 0.01 or more and 0.15 or less. You can.
  • the resistivity measured with the binder removed may be 3.0 ⁇ cm or less.
  • the average particle size of the diamond particles may be 0.5 ⁇ m or more and 50 ⁇ m or less.
  • the proportion of diamond particles in the sintered body may be 80 volume percent or more and 99 volume percent or less.
  • the binder may contain at least one selected from the group consisting of simple metals, alloys, and intermetallic compounds.
  • the elemental metals, alloys and intermetallic compounds are selected from the group consisting of elements of group 4 of the periodic table, elements of group 5 of the periodic table, elements of group 6 of the periodic table, iron, aluminum, silicon, cobalt and nickel. It may contain at least one kind of metal element.
  • the binder may contain at least cobalt.
  • the cutting tool includes a cutting edge portion.
  • the cutting edge portion is formed of the sintered body of (1) to (9) above.
  • the tool life can be improved.
  • the cutting tool according to the embodiment is, for example, the cutting insert 100.
  • the cutting tool according to the embodiment is not limited to the cutting insert 100, the cutting insert 100 will be described below as an example of the cutting tool according to the embodiment.
  • Other examples of cutting tools according to embodiments include drills, end mills, wear-resistant tools, and the like.
  • FIG. 1 is a plan view of the cutting insert 100.
  • FIG. 2 is a perspective view of the cutting insert 100.
  • the cutting insert 100 includes a base material 10 and a cutting edge portion 20.
  • the cutting insert 100 has a polygonal shape (for example, a triangular shape) in plan view.
  • the polygonal shape does not have to be a strict polygonal shape (triangular shape). More specifically, the corners of the cutting insert 100 in plan view may be rounded.
  • the base material 10 has a polygonal shape (for example, a triangular shape) in plan view.
  • the base material 10 has a top surface 10a, a bottom surface 10b, and side surfaces 10c.
  • the top surface 10a and the bottom surface 10b are end surfaces of the base material 10 in the thickness direction.
  • the bottom surface 10b is a surface opposite to the top surface 10a in the thickness direction of the base material 10.
  • the side surface 10c is a surface continuous with the top surface 10a and the bottom surface 10b.
  • the top surface 10a has a mounting portion 10d.
  • the attachment portion 10d is located at a corner of the top surface 10a in plan view.
  • the distance between the top surface 10a and the bottom surface 10b at the attachment part 10d is smaller than the distance between the top surface 10a and the bottom surface 10b at other parts than the attachment part 10d. That is, there is a step between the attachment portion 10d and the portion of the top surface 10a other than the attachment portion 10d.
  • a through hole 11 is formed in the base material 10.
  • the through hole 11 penetrates the base material 10 in the thickness direction.
  • the through hole 11 is formed at the center of the base material 10 in plan view.
  • the cutting insert 100 is used for cutting, for example, by inserting a fixing member (not shown) into the through hole 11 and fastening the fixing member to a tool holder (not shown).
  • the through hole 11 may not be formed in the base material 10.
  • the base material 10 is made of cemented carbide, for example.
  • Cemented carbide is a composite material made by sintering carbide particles and a binder.
  • the carbide particles are, for example, particles of tungsten carbide, titanium carbide, tantalum carbide, or the like.
  • This binding material is, for example, cobalt, nickel, iron, or the like.
  • the base material 10 may be formed of a material other than cemented carbide.
  • the cutting edge portion 20 is attached to the attachment portion 10d.
  • the cutting edge portion 20 is attached to the base material 10 by, for example, brazing.
  • the cutting edge portion 20 has a rake face 20a, a flank face 20b, and a cutting edge 20c.
  • the rake surface 20a continues to a portion of the top surface 10a other than the attachment portion 10d.
  • the flank surface 20b is continuous with the side surface 10c.
  • the cutting edge 20c is formed on the ridgeline between the rake face 20a and the flank face 20b.
  • a back metal 21 may be disposed on the bottom surface of the cutting edge portion 20 (the surface opposite to the rake surface 20a).
  • the back metal 21 is made of, for example, cemented carbide.
  • the cutting edge portion 20 is formed of a sintered body containing diamond particles and a binder.
  • the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20 is preferably 0.5 ⁇ m or more and 50 ⁇ m or less.
  • the proportion (volume ratio) of diamond particles in the sintered body constituting the cutting edge portion 20 is preferably 80 volume percent or more and 99 volume percent or less.
  • the binding material contains cobalt, for example.
  • the binding material may contain tungsten and titanium in addition to cobalt.
  • the component with the highest content in the binder is preferably cobalt.
  • the average particle size of diamond particles in the sintered body constituting the cutting edge portion 20 is calculated by the following method.
  • a sample including a cross section is cut out from an arbitrary position of the cutting edge part 20. This sample cutting is performed using, for example, a focused ion beam device, a cross polisher device, or the like.
  • the cross section of the cut sample is observed using a scanning electron microscope (SEM).
  • SEM image a backscattered electron image (hereinafter referred to as "SEM image") of the cut out cross section of the sample is obtained.
  • the magnification is adjusted so that 100 or more diamond particles are included within the measurement field of view.
  • SEM images are acquired at five locations within the cross section of the cut sample.
  • the particle size distribution of diamond particles contained within the measurement field of view is obtained.
  • the particle size distribution of the diamond particles is a number-based distribution. This image processing is performed using, for example, WinROOF ver. manufactured by Mitani Shoji Co., Ltd. 7.4.5, WinROOF2018, etc.
  • the particle size of each diamond particle is obtained by calculating the equivalent circle diameter from the area of each diamond particle obtained as a result of image processing. Note that when obtaining the particle size distribution of diamond particles, diamond particles that are partially outside the measurement field of view are not taken into account.
  • the median diameter of the diamond particles contained within the measurement field of view is determined from the distribution of particle sizes of the diamond particles contained within the measurement field of view obtained as described above.
  • the value obtained by averaging the determined median diameter for the five SEM images is considered to be the average particle diameter of the diamond particles in the sintered body constituting the cutting edge portion 20.
  • the proportion of diamond particles in the sintered body constituting the cutting edge portion 20 is calculated by the following method.
  • a sample including a cross section is cut out from an arbitrary position of the cutting edge portion 20. This sample cutting is performed using, for example, a focused ion beam device, a cross polisher device, or the like.
  • the cross section of the cut sample is observed by SEM.
  • SEM SEM image of the cross section of the cut sample is obtained.
  • the magnification is adjusted so that 100 or more diamond particles are included within the measurement field of view.
  • SEM images are acquired at five locations within the cross section of the cut sample.
  • the proportion of diamond particles contained within the measurement field of view is calculated.
  • This image processing is performed using, for example, WinROOF ver. manufactured by Mitani Shoji Co., Ltd. 7.4.5, WinROOF2018, etc. to perform binarization processing of the SEM image.
  • the dark field in the SEM image after the binarization process corresponds to the area where diamond particles are present.
  • the value obtained by dividing the area of this dark field by the area of the measurement region is considered to be the volume ratio of the diamond particles in the sintered body constituting the cutting edge portion 20.
  • the boron concentration in the diamond particles is 0.001 mass percent or more and 0.1 mass percent or less.
  • the boron concentration in the binder is 0.01 mass percent or more and 0.5 mass percent or less.
  • the boron concentration in the binder is preferably equal to or higher than the boron concentration in the diamond particles (that is, the value obtained by subtracting the boron concentration in the diamond particles from the boron concentration in the binder is preferably 0 mass percent or higher). preferable).
  • the boron concentration in the binder may be 0.05 mass percent or more and 0.5 mass percent or less.
  • the boron concentration in the diamond particles and the boron concentration in the binder are measured by the following method.
  • a sample is cut out from an arbitrary position on the cutting edge portion 20.
  • the cut sample is treated with acid.
  • acid treatment substantially all of the binder components contained in the sample are dissolved in the acid. That is, the sample after this acid treatment consists essentially of diamond particles only.
  • the above acid treatment is performed using an aqueous solution of fluoronitric acid.
  • This fluoronitric acid aqueous solution is produced by mixing a 50 percent aqueous solution of hydrogen fluoride and a 60 percent aqueous solution of nitric acid at a ratio of 1:1.
  • the above acid treatment is performed by immersing the sample in the above-mentioned aqueous fluorinic acid solution and holding it at 200° C. for 48 hours.
  • the boron concentration in the diamond particles is measured by performing glow discharge mass spectrometry on the acid-treated sample. Further, the boron concentration in the binder is measured by performing inductively coupled plasma analysis on the acid used in the acid treatment.
  • a compound may be precipitated in the conjugate.
  • the compound precipitated in the bond contains at least two of cobalt, boron, and carbon.
  • the compound precipitated in the bond is, for example, at least one of Co 22 B 4 C 2 , W 2 Co 21 B 6 , W 2 Co 2 B 6 and CoWB.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond is, for example, 0.15 or less.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction is performed on the sintered body constituting the cutting edge portion 20 is preferably 0.01 or more and 0.15 or less. .
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction is performed on the sintered body constituting the cutting edge portion 20 is, for example, greater than zero.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction is performed on the sintered body constituting the cutting edge portion 20 is determined by the following method.
  • Second, the composition of the diamond particles and binder in the above cross section is determined by X-ray diffraction.
  • an X-ray diffraction pattern can be obtained by analyzing the above cross section using an X-ray diffraction method.
  • Analysis by X-ray diffraction method uses the conditions that the characteristic X-ray is a Cu-K ⁇ ray with a wavelength of 1.54 angstroms, the tube voltage is 40 kV, the tube current is 15 mA, the filter is a multilayer mirror, and the optical system is a focusing method. It was carried out by the ⁇ -2 ⁇ method.
  • the peak intensity (peak height, cps) derived from each component is determined.
  • the peak intensity is determined using the first peak of each component.
  • the sintered body constituting the cutting edge portion 20 is A value is obtained by dividing the peak intensity of the compound by the peak intensity of diamond during diffraction.
  • the resistivity of the sintered body forming the cutting edge portion 20 after the binder is removed is preferably 3.0 ⁇ cm or more.
  • the binding material is removed by acid treatment similar to that used when measuring the boron concentration in diamond particles.
  • the resistivity of the sintered body is measured by a four-terminal method.
  • the resistivity of the sintered body is measured using a KEITHLEY 182 SENSITIVE DIGITAL VOLTMETER as a measuring device under conditions of a measurement temperature of 22° C., a measurement humidity of 60%, and an electrode spacing of 0.5 mm.
  • a 4-point probe manufactured by NTT Advanced Technology is used as the probe of the measurement device.
  • a sample of 3 mm x 1 mm x 6 mm is cut out from the sintered body constituting the cutting edge portion 20 and used for resistivity measurement.
  • the diamond powder prepared in the powder preparation step S1 does not contain boron, and boron is incorporated into the diamond particles in the sintering step S3, so boron is unevenly distributed near the surface of the diamond particles. Therefore, if the boron concentration in the diamond particles is the same, the resistivity of the sintered body constituting the cutting edge portion 20 after removing the binder will be the same as that of the sintered diamond powder doped with boron. The resistivity is smaller than that of the sintered body.
  • FIG. 3 is a process diagram showing a method for manufacturing the sintered body forming the cutting edge portion 20. As shown in FIG. As shown in FIG. 3, the method for manufacturing the sintered body constituting the cutting edge portion 20 includes a powder preparation step S1, a powder mixing step S2, and a sintering step S3.
  • the diamond powder is a diamond powder
  • the binder powder is a powder made of a material constituting the binder.
  • the boron-doped powder is boron or boron oxide powder.
  • the proportions of the diamond powder, the binder powder, and the boron-added powder are appropriately selected depending on the volume ratio of the diamond particles in the sintered body constituting the cutting edge portion 20 and the boron concentration in the diamond particles and the binder. .
  • the powder mixing step S2 is divided into, for example, a first step and a second step performed after the first step.
  • the boron-added powder is pulverized.
  • the boron-added powder is pulverized, for example, so that the average particle size of the boron-added powder is 5 ⁇ m or less.
  • the pulverization of the boron-added powder may be performed after mixing the boron-added powder with diamond powder and binder powder.
  • the boron-added powder is preferably pulverized so that the average particle size of the boron-added powder is 0.5 ⁇ m or less.
  • the average particle size of the boron-added powder is measured using, for example, a particle size distribution measuring device such as Microtrac. As the average particle size of the boron-added powder after pulverization becomes smaller, boron is more easily incorporated into the diamond particles in the sintering step S3.
  • diamond powder, binder powder, and pulverized boron-added powder are mixed. This mixing is performed using, for example, an attritor or a ball mill. However, the mixing method is not limited to these. In the following, a mixture of diamond powder, binder powder, and boron-added powder will be referred to as a "mixed powder.”
  • the mixed powder is sintered.
  • This sintering is performed by placing the mixed powder in a container and holding the mixed powder at a predetermined sintering temperature under a predetermined sintering pressure.
  • This container is made of a high melting point metal such as tantalum or niobium in order to prevent impurities from entering the mixed powder (sintered body).
  • the sintering temperature is appropriately selected depending on the boron concentration in the diamond particles and the boron concentration in the binder.
  • the sintering temperature is, for example, 1500°C or more and 1700°C or less.
  • the sintering pressure is, for example, 4.5 GPa or more and 6.5 GPa or more.
  • the holding time is, for example, 40 minutes or more and less than 60 minutes.
  • the presence of boron in the diamond particles improves the oxidation resistance of the diamond particles, and as a result, the wear resistance of the cutting edge portion 20 is improved.
  • boron concentration in the diamond particles is less than 0.001 mass percent, boron has a poor effect of improving the oxidation resistance of the diamond particles.
  • the boron concentration in the diamond particles exceeds 0.1 mass percent, the amount of boron in the diamond particles becomes excessive, the hardness of the diamond particles decreases, and the wear resistance of the cutting edge portion 20 decreases.
  • the binder powder is melted, and the boron-added powder is dissolved in the molten binder. Then, a portion of the diamond powder is dissolved into the molten binder, and the diamond particles are redeposited, thereby progressing the bonding (necking) between the diamond particles. Since boron in the dissolved binder acts as a sintering aid, when the boron concentration in the binder is less than 0.01 mass percent, necking between diamond particles is less likely to occur. Furthermore, according to the findings of the present inventors, when the boron concentration in the binder exceeds 0.5 mass percent, compounds containing cobalt, boron, carbon, etc. tend to precipitate in the binder. Compounds in the binder reduce the strength and wear resistance of the binder.
  • the boron concentration in the diamond particles contained in the sintered body constituting the cutting edge portion 20 is 0.001 mass percent or more and 0.1 mass percent or less, so the hardness of the diamond particles is maintained. At the same time, the oxidation resistance of diamond particles has been improved.
  • the boron concentration in the binder contained in the sintered body constituting the cutting edge portion 20 is 0.01 mass percent or more and 0.5 mass percent or less, the neck gloss strength between the diamond particles is reduced. In addition, the strength of the bonding material can be ensured.
  • the wear resistance of the cutting edge portion 20 is improved.
  • the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20 is less than 0.5 ⁇ m, the surface area of the diamond particles becomes large, so that oxidation on the surface of the diamond particles tends to proceed. If the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20 is more than 50 ⁇ m, the toughness of the sintered body forming the cutting edge portion 20 decreases, and chipping is likely to occur. Therefore, by setting the average particle size of the diamond particles in the sintered body constituting the cutting edge portion 20 to 0.5 ⁇ m or more and 50 ⁇ m or less, the wear resistance of the cutting edge portion 20 is further improved.
  • the proportion of diamond particles in the sintered body constituting the cutting edge portion 20 is less than 80 volume percent, the hardness of the cutting edge portion 20 decreases. Therefore, by setting the proportion of diamond in the sintered body constituting the cutting edge part 20 to 80 volume percent or more and 99 volume percent or less, the wear resistance of the cutting edge part 20 is further improved.
  • triboplasma When the blade edge part 20 is charged due to contact between the blade edge part 20 and the workpiece, triboplasma may be generated between the blade edge part 20 and the workpiece, and the wear of the blade edge part 20 may progress more easily. If the resistivity of the sintered body constituting the cutting edge portion 20 measured after removing the binder is 3.0 ⁇ cm or less, the cutting edge portion 20 is unlikely to be charged by contact with the workpiece material. Therefore, it is possible to suppress the progress of wear of the cutting edge portion 20 due to the generation of triboplasma.
  • Example 2 In order to evaluate the relationship between the particle size of the boron-added powder prepared in the powder preparation step S1 and the boron concentration in the binder contained in the sintered body constituting the cutting edge portion 20, the sintered body was Sample 1 and sample 2 were prepared as samples. As shown in Table 1, in Sample 1 and Sample 2, the ratio of the mass of the boron-added powder to the mass of the binder powder (the value obtained by dividing the mass of the boron-added powder by the mass of the binder powder), The pressure, sintering temperature and sintering time were the same. However, in Sample 1, the average particle size of the boron-added powder was 5 ⁇ m or less, while in Sample 2, the average particle size of the boron-added powder was more than 5 ⁇ m.
  • the boron concentration in the binder was in the range of 0.01 mass percent or more and 0.5 mass percent or less.
  • the boron concentration in the binder was not within the range of 0.01 mass percent or more and 0.5 mass percent or less.
  • the boron concentration in the diamond particles was within the range of 0.001 mass percent or more and 0.1 mass percent or less. This comparison revealed that by setting the average particle size of the boron-added powder to 5 ⁇ m or less, the boron concentration in the binder can be set to 0.01 mass percent or more and 0.5 mass percent or less.
  • Sample 24 was prepared from sample 3. In samples 3 to 24, as shown in Table 2, the boron concentration in the diamond particles and the binder contained in the sintered body constituting the cutting edge portion 20 was changed.
  • Condition A is that the boron concentration in the diamond particles is 0.001 mass percent or more and 0.1 mass percent or more, and the boron concentration in the binder is 0.01 mass percent or more and 0.1 mass percent or less.
  • condition B In samples 3 to 18, both condition A and condition B were satisfied. In samples 19 to 24, at least one of condition A and condition B was not satisfied.
  • cutting inserts were prepared in which cutting edge portions 20 were formed using Samples 3 to 24.
  • This cutting insert had a shape corresponding to cutting insert SNEW1204ADFR manufactured by Sumitomo Electric Hard Metal Co., Ltd. Further, this cutting insert was attached to a holder RF4160R manufactured by Sumitomo Electric Hard Metal Co., Ltd., and then subjected to milling. This milling process was performed at a feed rate of 0.2 mm/t and a depth of cut of 0.6 mm. This cutting process was a dry process without supplying coolant.
  • the dimensions of the work material subjected to this cutting process were 90 mm x 90 mm x 90 mm, and the material of the work material subjected to this cutting process was glass-containing resin. In the cutting test, evaluation was made based on the number of passes completed until the average flank wear amount reached 250 ⁇ m.
  • Condition C is that the average particle size of the diamond particles is 0.5 ⁇ m or more and 50 ⁇ m or less.
  • Condition D is that the proportion of diamond particles in the sintered body is 80 volume percent or more and 99 volume percent or less. In samples 3 to 15, in addition to conditions A and B, conditions C and D were satisfied. In Samples 16 to 18, Condition A and Condition B were satisfied, but either Condition C or Condition D was not satisfied.
  • Table 3 also shows the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction was performed.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction was performed was 0.15 or less.
  • the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction is performed is 0.15. It was super. From this, by setting the boron concentration in the binder to 0.5% by mass or less, the value obtained by dividing the peak intensity of the compound by the peak intensity of diamond when X-ray diffraction is performed is 0.15 or less. In other words, it has become clear that it is possible to suppress the precipitation of compounds in the binder.
  • Sample 25 and Sample 26 were prepared as sintered body samples in order to evaluate the effect of pre-doping diamond powder with boron on the resistivity of the sintered body after the binder was removed. As shown in Table 4, Sample 25 and Sample 26 had the same boron concentration in the diamond particles and the boron concentration in the binder. Sample 25 was formed using diamond powder that was not doped with boron. Sample 26 had half of the diamond powder pre-doped with boron.
  • the binding material contained in the sintered body constituting the cutting edge portion 20 may include at least one selected from the group consisting of simple metals, alloys, and intermetallic compounds.
  • These simple metals, alloys, and intermetallic compounds include elements from group 4 of the periodic table (e.g., titanium, zirconium, hafnium), elements from group 5 of the periodic table (e.g., vanadium, tantalum, niobium), and elements from group 6 of the periodic table. (for example, chromium, molybdenum, tungsten), aluminum, iron, silicon, cobalt, and nickel.
  • the above-mentioned periodic table means a so-called long-period type periodic table.
  • the cutting insert 100 may be formed of the same sintered body as the cutting edge portion 20 except for the cutting edge portion 20.

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US18/866,097 US20250320583A1 (en) 2022-05-25 2022-05-25 Sintered material and cutting tool
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