WO2023227048A1 - 一种摄像头组件、摄像头组件的制备方法和电子设备 - Google Patents

一种摄像头组件、摄像头组件的制备方法和电子设备 Download PDF

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Publication number
WO2023227048A1
WO2023227048A1 PCT/CN2023/096183 CN2023096183W WO2023227048A1 WO 2023227048 A1 WO2023227048 A1 WO 2023227048A1 CN 2023096183 W CN2023096183 W CN 2023096183W WO 2023227048 A1 WO2023227048 A1 WO 2023227048A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
camera assembly
photosensitive chip
lens
package
Prior art date
Application number
PCT/CN2023/096183
Other languages
English (en)
French (fr)
Inventor
易源
唐辉俊
陈金榜
全腾
魏金强
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023227048A1 publication Critical patent/WO2023227048A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to a camera assembly, a preparation method of the camera assembly, and electronic equipment.
  • a laptop computer is generally equipped with at least one camera component; as laptop computers become thinner and lighter and have a higher screen-to-body ratio design, traditional camera components have taken up a lot of space and have become a problem for laptop computers. Thinness and high screen-to-body ratio design pose obvious constraints.
  • the thickness and size of the notebook computer will be relatively large.
  • the width of the camera component is large, it will occupy a larger space, which is not conducive to improving the screen-to-body ratio of the display.
  • the present application provides a camera assembly, a preparation method of the camera assembly, and electronic equipment that are beneficial to reducing space occupation.
  • this application provides a camera assembly, which may include a circuit board, a photosensitive chip, a package and a lens.
  • the circuit board has a hollow portion.
  • the photosensitive chip is electrically connected to the circuit board and fixed in the hollow part through the package body.
  • the package body has a first mounting surface, and one end of the lens faces the photosensitive chip and is fixedly attached to the first mounting surface.
  • the camera assembly provided by this application, by providing a hollow portion in the circuit board and arranging the photosensitive chip in the hollow portion, it is helpful to reduce the height dimension of the camera assembly.
  • the lens after the lens is fixedly connected to the circuit board through the package, it also helps to reduce the width and size of the camera component, which is conducive to the miniaturization and thinning design of the camera component, and can reduce the space occupied by the camera component.
  • the circuit board may have a long strip structure, that is, the length dimension of the circuit board is greater than the width dimension.
  • the width size of the circuit board and the width size of the lens can be the same, so as to reduce the width size of the camera assembly.
  • the camera assembly may further include a filter.
  • the package body may also have a second mounting surface, and the optical filter may be fixed on the second mounting surface.
  • the package may also include a light filter material, and the package may cover the light-receiving surface of the photosensitive chip. That is, the package can function as a filter. Therefore, in practical applications, the setting of the filter can be omitted, which helps to simplify the number of components of the camera component and reduces the difficulty and cost of manufacturing the camera component.
  • a portion of the package body may be located outside the hollow, wherein the first mounting surface may be located outside the package The surface of the body facing away from the circuit board.
  • the second mounting surface may also be located on a surface of the package facing away from the circuit board.
  • the surface facing away from the circuit board may be a stepped surface.
  • the distance between the first mounting surface and the circuit board may be greater than the distance between the second mounting surface and the circuit board. That is, the first mounting surface is further away from the circuit board than the second mounting surface.
  • the hollowed out portion may be a groove or a through hole. That is, the hollowed-out portion may or may not penetrate the thickness of the circuit board.
  • the pad of the circuit board may be located on the bottom wall of the groove. After placing the photosensitive chip in the hollow part, the electrical connection between the photosensitive chip and the circuit board can be achieved.
  • the soldering pad can also be located on the first surface of the circuit board or at other locations, which will not be described in detail here.
  • the soldering pad of the circuit board may be located on the first board surface.
  • the photosensitive chip and the circuit board can be connected through a connecting wire, that is, one end of the connecting wire can be connected to the pad, and the other end can be connected to the photosensitive chip.
  • the encapsulation body can also encapsulate the connection lines. That is, the connecting wires can be wrapped in the package, so that the package forms a protective effect on the connecting wires.
  • the first surface of the circuit board may also be provided with a sinking groove, the hollowed part may be located in the sinking groove, and the soldering pad of the circuit board may be located on the inner wall of the sinking groove.
  • the package When configuring the package, the package can be filled with hollows to ensure the connection strength between the photosensitive chip and the circuit board and to improve the structural strength of the circuit board itself.
  • the camera assembly may further include a support plate.
  • the support plate can be disposed on the second board surface of the circuit board (the surface away from the first board surface) and is fixedly connected to the circuit board. By providing the support plate, the structural strength of the circuit board can be improved.
  • this application also provides a method for preparing a camera assembly, which may include:
  • a circuit board assembly is provided; the circuit board assembly includes at least two circuit boards arranged flatly along a first direction, and there are connecting ribs between two adjacent circuit boards.
  • a hollowed-out portion is provided on the first surface of the circuit board; in the first direction, the projection of the hollowed-out portion is located within the connecting rib.
  • a photosensitive chip is arranged in the hollowed-out portion, and the photosensitive chip and the circuit board are electrically connected.
  • the photosensitive chip is packaged in the hollow part using a package body.
  • a support plate can also be provided on the second surface of the circuit board to enhance the structural strength of the circuit board.
  • the support plate can be included or removed from the final camera assembly.
  • the optical filter and the package can also be fixedly connected.
  • the lens can also be connected to the package to avoid the use of structures such as brackets, helping to reduce the size of the camera assembly.
  • this application also provides an electronic device, which may include the above-mentioned camera assembly or the camera assembly produced by the above-mentioned preparation method.
  • the electronic device may include a housing, and the camera assembly may be disposed in the housing.
  • the electronic device may specifically be a laptop computer, a tablet computer, a television, a smart watch, etc. This application does not limit the specific type of the electronic device. By using the camera assembly provided by this application, it is beneficial to the miniaturization and thinning design of electronic equipment.
  • Figure 1 is a schematic three-dimensional structural diagram of a notebook computer provided by an embodiment of the present application.
  • Figure 2 is a top view of a conventional camera assembly provided by the present application.
  • Figure 3 is a cross-sectional view along line A-A in Figure 2;
  • Figure 4 is a top view of a camera assembly provided by an embodiment of the present application.
  • Figure 5 is a B-B cross-sectional view of Figure 4.
  • Figure 6 is a schematic cross-sectional structural diagram of a lens provided by an embodiment of the present application.
  • Figure 7 is a partial top view of a camera assembly provided by an embodiment of the present application.
  • Figure 8 is a C-C cross-sectional view of Figure 7;
  • Figure 9 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 10 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 11 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 12 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 13 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 14 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 15 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 16 is a cross-sectional view of a partial structure of another camera assembly provided by an embodiment of the present application.
  • Figure 17 is a flow chart of a method for manufacturing a camera assembly provided by an embodiment of the present application.
  • Figure 18 is a partial plan view of a circuit board assembly provided by an embodiment of the present application.
  • Figure 19 is a partial plan view of a circuit board assembly provided with a hollow portion according to an embodiment of the present application.
  • Figure 20 is a cross-sectional view of a partial structure of a camera assembly provided by an embodiment of the present application.
  • Figure 21 is a cross-sectional view of a partial structure of a camera assembly provided by an embodiment of the present application.
  • Figure 22 is a partial plan view of a circuit board assembly provided with electrical components according to an embodiment of the present application.
  • Figure 23 is a schematic cross-sectional structural diagram of a camera assembly provided by an embodiment of the present application.
  • Figure 24 is a schematic plan view of a camera assembly provided by an embodiment of the present application.
  • the notebook computer may include a system end 01 and a display end 02.
  • the system end 01 and the display end 02 may be connected through a hinge (not shown in the figure) and other structures, so that the system end 01 and the display end 02 Ability to open or close relative to each other so that Realize the foldable function of notebook computers.
  • the system end 01 may generally include a bottom case 011, a keyboard 012, a touch panel 013, and components such as a motherboard, a processor, and a battery located inside the bottom case 011.
  • the display terminal 02 may generally include a top cover 021, a display screen 022 and other components.
  • the camera assembly 10 can be disposed on the display end 02 .
  • the camera assembly 10 can be disposed within the frame 023 of the upper cover 021 .
  • the frame 023 can provide sufficient installation space for the camera assembly 10 and can provide good protection for the camera assembly 10 .
  • the user can adjust the direction of the camera assembly 10 by adjusting the orientation of the display end 02 to obtain a desired shooting angle, thus providing a flexible usage experience.
  • the plane where the display screen 022 is located can also be called side B.
  • the screen-to-body ratio of the display screen 022 refers to the ratio of the display area of the display screen 022 to side B.
  • it is usually achieved by reducing the value of the width dimension d1 of the frame 023.
  • the camera assembly 10 is disposed in the frame 023 , and the width d1 of the frame 023 is usually larger than the width of the camera assembly 10 .
  • the width dimension of the camera assembly 10 will restrict the width dimension d1 of the frame 023 and affect the further narrowing of the frame 023 . Therefore, reducing the width size of the camera assembly 10 will help increase the screen-to-body ratio of the display screen 022 .
  • the camera assembly 10 provided in the embodiment of the present application can also be used in electronic devices such as tablet computers, televisions, or smart watches to realize the image capturing function.
  • This application does not limit the specific application scenarios of the camera assembly 10.
  • Figure 2 is a top view of a conventional camera assembly 03 provided by the present application
  • Figure 3 is a cross-sectional view along line A-A of Figure 2.
  • the camera assembly 03 may include a circuit board 031, a photosensitive chip 032, a filter 033 and a lens 034 which are stacked in sequence.
  • the lens 034 is fixed on the circuit board 031 through the bracket 035.
  • the width dimension d2 of the bracket 035 is usually larger and larger than the width dimension of the lens 034. Therefore, the width dimension of the camera assembly 03 will be increased.
  • the bracket 035 is connected to the circuit board 031. Therefore, the circuit board 031 needs to have a width large enough for installing the bracket 035. Therefore, the width of the circuit board 031 will be increased.
  • the width dimension of the circuit board 031 is not smaller than the width dimension d2 of the bracket 035 .
  • the height dimension h of the camera assembly 03 is usually larger.
  • the lens 034 and the filter 033 are connected to the circuit board 031 through the bracket 035, which will further increase the height dimension h of the camera assembly 03.
  • this application provides a camera assembly that helps achieve miniaturization and thinness design.
  • the camera assembly 10 may include: a circuit board 11 , a photosensitive chip 12 , a package 13 and a lens 14 .
  • the circuit board 11 has a first board surface 111 (upper board surface in Figure 5 ), and the first board surface 111 has a hollow portion 110 (dashed line frame in Figure 5 ).
  • the photosensitive chip 12 is electrically connected to the circuit board 11 and fixed in the hollow portion 110 through the package 13 .
  • the package 13 has a first mounting surface 131 .
  • One end of the lens 14 faces the photosensitive chip 12 and is fixedly attached to the first mounting surface 131 .
  • the camera assembly 10 provided in this application, by providing a hollow portion 110 in the circuit board 11 and arranging the photosensitive chip 12 in the hollow portion 110, it helps to reduce the height dimension H of the camera assembly 10 .
  • the lens 14 after the lens 14 is fixedly connected to the circuit board 11 through the package 13 , it also helps to reduce the width dimension D of the camera assembly 10 .
  • the lens 034 needs to be fixed by the bracket 035 on the circuit board 031 to ensure the minimum distance between the lens 034 and the photosensitive chip 032, and to achieve a fixed connection between the lens 034 and the circuit board 031.
  • the camera assembly 10 provided by the present application, by providing a first mounting surface 131 in the package 13 , a fixed connection between the package 13 and the lens 14 can be achieved. Moreover, by properly setting the distance between the first mounting surface 131 and the circuit board 11 (or the photosensitive chip 12 ), the minimum distance between the lens 14 and the photosensitive chip 12 can be ensured.
  • a part of the package body 13 may protrude from the hollow portion 110 .
  • the first mounting surface 131 may be located on a surface of the package body 13 facing away from the circuit board 11 .
  • the package 13 can not only realize the fixed connection between the photosensitive chip 12, the lens 14 and the circuit board 11, but also effectively control the position and progress between the photosensitive chip 12 and the lens 14, which is beneficial to ensure The quality of the camera assembly 10.
  • the circuit board 11 is in a long strip shape, that is, the width dimension of the circuit board 11 is small and the length dimension is large.
  • the elongated circuit board 11 can provide a larger board area within a limited width dimension, and can be used to provide more layout area for electrical components.
  • the photosensitive chip 12 and the circuit board can also be Filling the gaps between the circuit boards 11 will help improve the structural strength of the circuit board 11 and ensure the structural safety of the camera assembly 03.
  • FIG. 6 it is a schematic cross-sectional structural diagram of a lens 14 provided in an embodiment of the present application.
  • the lens 14 may include a lens barrel 141 and a plurality of lenses 142 (five are shown in FIG. 6 ) located within the lens barrel 141 .
  • the plurality of lenses 142 may include plane mirrors, convex lenses or concave lenses, etc.
  • the present application does not limit the number, arrangement position and shape of the lenses 142 .
  • the main function of the lens barrel 141 is to provide a mounting position for the lens 142 and to form a plurality of lenses 142 into an integrated structure.
  • the lens barrel 141 may be a cylindrical structure with both ends open, wherein the cross-sectional shape of the lens barrel 141 may be circular, rectangular, elliptical, or irregular.
  • Light can enter the lens 14 from one end of the lens barrel 141, be processed by the lens 142 in the lens barrel 141, and then enter from the other end of the lens barrel 141.
  • the lens 14 may also include structural components such as a protective shell or a shielding cover. This application does not limit the specific structure of the lens 14 .
  • glue 143 can be applied to one end of the lens barrel 141 , and then the end coated with glue 143 is directly connected to the first mounting surface 131 of the package 13 .
  • a mounting surface 131 is attached. After the glue 143 is solidified, the fixed connection between the lens 14 and the package body 13 can be achieved.
  • the lens 14 and the package body 13 can also be fixedly connected through welding and other processes. This application does not limit the connection method between the lens 14 and the package body 13 .
  • the circuit board 11 can be a Printed Circuit Board (PCB) or a Flexible Printed Circuit (FPC), etc.
  • the circuit board 11 can be a single-layer board or a multi-layer board. This application does not limit the specific type of circuit board 11.
  • the photosensitive chip 12 is a device that converts an optical image into an electrical signal.
  • the optical signal can be converted into an electrical signal.
  • the light-receiving surface 120 may specifically include a charge-coupled device (CCD) or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS).
  • CCD charge-coupled device
  • CMOS complementary metal oxide semiconductor
  • the specific type of the photosensitive chip 12 can be reasonably selected according to actual needs, and this application does not limit this.
  • the camera assembly 10 may also include a filter 15 .
  • the filter 15 can be an infrared filter 15 , that is, the filter 15 can effectively filter infrared light in a certain wavelength band to weaken the infrared light propagated to the photosensitive chip 12 .
  • the specific type of the filter 15 is not limited in this application.
  • the package body 13 also has a second mounting surface 132, and the optical filter 15 can be fixed on the second mounting surface 132.
  • glue can be applied to the surface of the filter 15 facing the second mounting surface 132, and then the glue-coated surface is directly attached to the second mounting surface 132. After the glue solidifies, the lens can be realized. 14 and the fixed connection between the package body 13.
  • the filter 15 and the package 13 can also be fixedly connected by welding or other processes. This application does not specifically limit the connection method between the filter 15 and the package 13 .
  • a part of the package body 13 (the part on the upper side of the first board surface 111 in FIG. 5 ) may protrude from the hollow portion 110 .
  • the second mounting surface 132 may be located on a surface of the package body 13 facing away from the circuit board 11 .
  • the surface of the package body 13 facing away from the circuit board 11 may be a stepped surface.
  • the distance between the first mounting surface 131 and the circuit board 11 may be greater than the distance between the second mounting surface 132 and the circuit board 11 . That is, the first mounting surface 131 is further away from the circuit board than the second mounting surface 132 , so that the filter 15 can be disposed between the lens 14 and the photosensitive chip 12 .
  • the height difference between the first mounting surface 131 and the second mounting surface 132 can be reasonably set according to actual needs (such as the thickness of the filter 15 ), which will not be described again here.
  • the first mounting surface 131 and the second mounting surface 132 can be produced together according to actual size requirements.
  • the photosensitive chip 12 may be packaged first, and then the formed package body 13 may be stacked, cut or ground to prepare the first mounting surface 131 and the second mounting surface 132 .
  • the photosensitive chip 12, the lens 14 and the filter 15 can all be fixedly connected to the circuit board 11 through the package 13, which can effectively simplify the production process and facilitate the improvement of production. efficiency.
  • the material of the package 13 may be ceramic, silica, or polymer. In specific applications, the material and preparation process of the package 13 may be reasonably selected and adjusted according to actual needs, which will not be described in detail here.
  • the specific structure of the hollow portion 110 may be diverse.
  • the hollow portion 110 may be a through hole. That is, the hollow portion 110 penetrates the first board surface 111 and the second board surface 112 of the circuit board 11 , where the first board surface 111 and the second board surface 112 are the board surfaces of the circuit board 11 that are away from each other.
  • the distance L1 between one side of the hollow portion 110 and one side of the circuit board 11 may be 0.2 mm to 2 mm.
  • the distance L2 between the other side of the hollow portion 110 and the other side of the circuit board 11 may be 0.2mm-2mm.
  • L1 and L2 may be equal or unequal.
  • L1 may also be zero.
  • L2 can be zero.
  • the photosensitive chip 12 and the circuit board 11 can be electrically connected through a connecting wire 16 .
  • the first surface 111 of the circuit board 11 may be provided with a soldering pad 113 .
  • One end of the connecting wire 16 (also called a gold wire) can be welded to the pad 113 of the circuit board 11 , and the other end can be welded to the pin of the photosensitive chip 12 to achieve a conductive connection between the photosensitive chip 12 and the circuit board 11 .
  • the first board surface 111 has a sinking groove 114 , the hollow portion 110 is located in the sinking groove 114 , and the pad 113 is located on the inner wall of the sinking groove 114 .
  • the hollow portion 110 is a through-hole structure.
  • the hollow portion 110 is provided on the bottom wall of the sinking groove 114 and penetrates the thickness of the sinking groove 114 , and the soldering pad 113 is located on the bottom wall of the sinking groove 114 .
  • the thickness of the bottom wall of the sink 114 and the thickness of the photosensitive chip 12 may be the same or different, and this application does not specifically limit this.
  • the bonding pad 113 can also be provided on the side wall of the sinking groove 114 , and the height of the gold wire can also be reduced, which will not be described again here.
  • the camera assembly 10 may also include a support plate 17 .
  • the support plate 17 is disposed on the second surface 112 of the circuit board 11 and is fixedly connected to the circuit board 11 .
  • the structural strength of the circuit board 11 can be improved.
  • the support plate 17 can effectively disperse the external force to reduce the force on the circuit board 11, thereby preventing the circuit board 11 from being damaged. being bent or broken, etc.
  • the photosensitive chip 12 can also be attached and fixed to the support plate 17 , thereby improving the connection stability between the photosensitive chip 12 and the circuit board 11 .
  • the support plate 17 is also helpful in ensuring the positional accuracy between the photosensitive chip 12 and the circuit board 11 .
  • the support plate 17 can be attached to the second surface 112 of the circuit board 11 .
  • the photosensitive chip 12 is placed in the hollow portion 110 , and the photosensitive chip 12 is bonded to the support plate 17 , so that the back surface of the photosensitive chip 12 (the surface away from the light-receiving surface 120 ) can be aligned with the second surface of the substrate. 112 remains flat to improve the relative position accuracy between the photosensitive chip 12 and the circuit board 11 .
  • the rigidity of the support plate 17 may be greater than, equal to, or less than the rigidity of the circuit board 11 .
  • the support plate 17 can be a plate structure with a significant thickness, or a membrane structure with a smaller thickness, etc. This application does not limit the material and specific dimensions of the support plate 17 .
  • the support plate 17 in a specific preparation process, before arranging the hollow portion 110 , can be disposed on the second surface 112 of the circuit board 11 to avoid bending or breaking of the circuit board 11 . After the package 13 is prepared, the support plate 17 can be removed to prevent the support plate 17 from increasing the height of the camera assembly 10 . Of course, in other embodiments, the support plate 17 may not be removed, thereby ensuring the structural safety of the circuit board 11 .
  • the hollow portion 110 may also be a groove. That is, the hollow portion 110 does not penetrate to the second board surface 112 of the circuit board 11 .
  • the soldering pad 113 can be located on the first surface 111 of the circuit board 11 , and the photosensitive chip 12 and the circuit board 11 can be electrically connected through the connecting wire 16 .
  • the pad 113 may also be located on the bottom wall of the groove. During production, surface mounting and other processes can be used to realize the electrical connection between the photosensitive chip 12 and the circuit board 11 .
  • the depth dimension of the groove may be larger than the height dimension of the photosensitive chip 12 . That is, the photosensitive chip 12 does not protrude from the groove.
  • the depth dimension of the groove may also be smaller than the height dimension of the photosensitive chip 12 . That is, the photosensitive chip 12 can protrude from the groove.
  • the depth dimension of the groove and the height dimension of the photosensitive chip 12 may also be substantially the same. No further details will be given here.
  • the specific structure of the package 13 may also be diverse.
  • the package 13 can be filled between the side walls of the photosensitive chip 12 and the side walls of the hollow portion 110 .
  • the packaging body 13 can also package the connecting wire 16 .
  • the connection wires 16 can be wrapped in the package body 13 so that the package body 13 forms a protective effect on the connection wires 16 .
  • the package body 13 can also be located on the first board surface 111 of the circuit board 11 .
  • the package 13 can also cover the light-receiving surface 120 of the photosensitive chip 12 , thereby enhancing the protection of the photosensitive chip 12 , and also improving the connection between the photosensitive chip 12 and the circuit board 11 stability.
  • the package body 13 can be made of a material with good light transmittance to prevent the package body 13 from adversely affecting the working performance of the photosensitive chip 12 .
  • the package 13 may have a light filter material.
  • the package 13 can effectively filter light in a specific wavelength band.
  • the package 13 can function as a filter. Therefore, in practical applications, the arrangement of the optical filter can be omitted, which helps to simplify the number of components of the camera assembly 10 and reduces the manufacturing difficulty and cost of the camera assembly 10 .
  • embodiments of the present application also provide a method for preparing a camera assembly, which may include the following steps:
  • Step S100 Provide a circuit board assembly.
  • the circuit board assembly includes at least two circuit boards arranged flatly along the first direction, and between the two adjacent circuit boards There are connecting ribs in between.
  • Step S200 Create a hollow portion on the first surface of the circuit board.
  • the projection of the hollowed out part is located within the connecting rib
  • Step S300 Set a photosensitive chip in the hollowed-out part, and electrically connect the photosensitive chip and the circuit board.
  • Step S400 Use an encapsulator to encapsulate the photosensitive chip in the hollow part.
  • Step S500 Remove connecting ribs.
  • the circuit board assembly 20 includes six circuit boards arranged sequentially along the first direction, namely circuit board 11a, circuit board 11b, circuit board 11c, circuit board 11d, circuit board 11e and Circuit board 11f.
  • adjacent circuit boards are connected through connecting ribs, so that multiple circuit boards can be connected into an integrated structure to facilitate transportation or other subsequent manufacturing processes.
  • the circuit board 11a and the circuit board 11b are connected through the connecting rib 21b
  • the circuit board 11b and the circuit board 11c are connected through the connecting rib 21c
  • the circuit board 11c and the circuit board 11d are connected through the connecting rib 21d.
  • the circuit board 11d and the circuit board 11e are connected through the connecting rib 21e
  • the circuit board 11e and the circuit board 11f are connected through the connecting rib 21f.
  • the circuit board assembly 20 in the first direction, is provided with protective strips 22 a and 22 b on both sides.
  • a connecting rib 21a is provided between the protective strip 22a and the circuit board 11a, and the connecting rib 21g is also connected between the protective strip 22b and the circuit board 11f.
  • the production equipment such as a robotic arm, etc.
  • the protection strip can also be omitted.
  • auxiliary ribs 23 are also shown. These ribs 23 help ensure the stability of the connection between two adjacent circuit boards. In practical applications, the ribs 23 only need to ensure the stability of the connection between two adjacent circuit boards, or the stability of the connection between the circuit board and the protective strip. That is, in the second direction, the size of the ribs 23 can be smaller than the size of the connecting ribs (such as the connecting ribs 21a), so as to facilitate subsequent cutting of the ribs 23. In practical applications, the number and position of the ribs 23 can be reasonably set according to actual needs, and this application does not limit this.
  • circuit board assembly 20 can be provided by a circuit board manufacturer. That is, the gap between two adjacent circuit boards can be made by the circuit board manufacturer to reduce subsequent cutting time.
  • the circuit board assembly 20 may also include two, three or more circuit boards. This application does not limit the specific number of circuit boards.
  • laser cutting or knife cutting can be used to provide a hollow portion 110a in the circuit board 11a, a hollow portion 110b in the circuit board 11b, a hollow portion 110c in the circuit board 11c, and a hollow portion 110c in the circuit board 11c.
  • a hollow portion 110d is provided in 11d
  • a hollow portion 110e is provided in the circuit board 11e
  • a hollow portion 110f is provided in the circuit board 11f.
  • the projection of the hollowed out portion is located within the connecting rib.
  • the hollowed-out portion 110a After the hollowed-out portion 110a is completed, there are still enough connecting portions between the circuit board 11a and the connecting ribs 21a, thereby preventing the circuit board 11a from breaking or other problems.
  • the width dimension L3 between the sides of the hollowed out portion 110a and the side of the circuit board 11 will be smaller. Small (such as less than 2 mm), therefore, there is insufficient material to ensure the structural strength of the circuit board 11a.
  • defects such as breakage may easily occur, which will affect the smooth progress of subsequent manufacturing processes and reduce the manufacturing quality of the camera assembly.
  • the length of the connecting rib ie, the size in the second direction
  • the length of the connecting rib can be reasonably set according to the actual size of the hollowed out portion, which will not be described again here.
  • the hollow portion 110 may also include: arranging the support plate 17 on the second board surface 112 of the circuit board 11 .
  • the first plate surface 111 and the second plate surface 112 are away from each other.
  • the structural strength of the circuit board 11 (or circuit board assembly 20) can be improved by providing the support plate 17.
  • the support plate 17 can effectively disperse the external force to reduce the force on the circuit board 11. , thereby preventing the circuit board 11 from being bent or broken.
  • the photosensitive chip 12 and the circuit board 11 can be electrically connected through a connecting wire 16 (or gold wire).
  • a connecting wire 16 or gold wire
  • one end of the connecting wire 16 can be welded to the pad 113 of the circuit board 11
  • the other end of the connecting wire 16 can be welded to the pin of the photosensitive chip 12 to realize the electrical connection between the photosensitive chip 12 and the circuit board 11 . connect.
  • the photosensitive chip 12 and the circuit board 11 can also be electrically connected using surface mounting or other processes. This application does not limit the specific manner of electrical connection between the photosensitive chip 12 and the circuit board 11 .
  • packaging the photosensitive chip 12 ceramics, silicon dioxide or polymers can be used as packaging materials. After the packaging material is cured, the package body 13 can be formed, and the photosensitive chip 12 and the circuit can be realized. Fixed connection between plates 11.
  • the package body can cover the area M where each hollow portion 110 is located (the dotted box in FIG. 22 ), so as to facilitate large-scale manufacturing and mass production.
  • the overall structural strength of the circuit board assembly 20 can also be improved through the package.
  • electrical components 24 such as capacitors, resistors, or inductors may also be provided on the circuit board 11 . Therefore, in the actual preparation process, after the photosensitive chip 12 is packaged, electrical components can also be provided on the circuit board 11 using surface mounting and other processes.
  • the camera assembly 10 may also include a filter 15 .
  • the optical filter 15 can also be disposed on the second mounting surface 132 of the package body 13 . It can be understood that in the actual manufacturing process, the package 13 can also be used to replace the filter 15 .
  • the encapsulation material may be covered to the light-receiving surface 120 of the photosensitive chip 12 .
  • the specific components of the packaging material can be reasonably selected so that the packaging body 13 has a light filtering effect.
  • the lens 14 and the package body 13 can also be connected.
  • a first mounting surface 131 for mounting the lens 14 may be provided in the package body 13 .
  • glue can be applied to one end of the lens 14 , and then the glue-coated end is attached to the first mounting surface 131 to achieve a fixed connection between the package body 13 and the lens 14 .
  • laser cutting or knife cutting can be used to remove the connecting ribs and divide multiple circuit boards into independent units.
  • the package body 13 can cover the entire area M, when cutting the connecting ribs, the package body 13 can also be cut at the same time.
  • the support plate 17 can also be removed to prevent the support plate 17 from increasing the height of the camera assembly 10 .
  • the support plate 17 may not be removed, thereby ensuring the structural safety of the circuit board 11 .

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  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
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  • Camera Bodies And Camera Details Or Accessories (AREA)
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Abstract

本申请提供了一种摄像头组件、摄像头组件的制备方法和电子设备，涉及电子设备技术领域，以解决摄像头组件尺寸较大的问题。本申请提供的摄像头组件包括电路板、感光芯片、封装体和镜头；电路板具有挖空部；感光芯片与电路板电连接，并通过封装体固定在挖空部内，封装体具有第一安装面，镜头的一端朝向感光芯片，并与第一安装面固定贴合。在本申请提供的摄像头组件中，通过在电路板中设置挖空部，并将感光芯片设置在挖空部内，有助于降低摄像头组件的高度尺寸，另外，镜头通过封装体与电路板进行固定连接后，还有助于降低摄像头组件的宽度尺寸，有利于实现摄像头组件的小型化、轻薄化设计，能降低摄像头组件的空间占用量。

Description

一种摄像头组件、摄像头组件的制备方法和电子设备
相关申请的交叉引用
本申请要求在2022年05月27日提交中国专利局、申请号为202210593622.4、申请名称为“一种摄像头组件、摄像头组件的制备方法和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种摄像头组件、摄像头组件的制备方法和电子设备。
背景技术
随着技术的不断发展，电子设备的形态逐渐朝着轻薄化或高屏占比的方向进行发展。摄像头组件作为电子设备中的重要组成部件，能起到图像采集的功能。例如，在笔记本电脑中，为了实现拍摄功能，一般都会配备至少一个摄像组件；随着笔记本电脑的轻薄化和高屏占比设计，传统的摄像组件由于空间占用量较大，已对笔记本电脑的轻薄化和高屏占比设计形成了明显的制约。
例如，由于摄像组件的厚度较大，导致笔记本电脑的厚度尺寸会比较大。另外，当摄像组件的宽度尺寸较大时，会增加占用较大的空间，不利于提升显示屏的屏占比。
发明内容
本申请提供了一种有利于降低空间占用量的摄像头组件、摄像头组件的制备方法和电子设备。
第一方面，本申请提供了一种摄像头组件，可以包括电路板、感光芯片、封装体和镜头。具体的，电路板具有挖空部。感光芯片与电路板电连接，并通过封装体固定在挖空部内。封装体具有第一安装面，镜头的一端朝向感光芯片，并与第一安装面固定贴合。在本申请提供的摄像头组件中，通过在电路板中设置挖空部，并将感光芯片设置在挖空部内，有助于降低摄像头组件的高度尺寸。另外，镜头通过封装体与电路板进行固定连接后，还有助于降低摄像头组件的宽度尺寸，有利于实现摄像头组件的小型化、轻薄化设计，能降低摄像头组件的空间占用量。
在具体设置时，电路板可以是长条状结构，即电路板的长度尺寸大于宽度尺寸。其中，电路板的宽度尺寸与镜头的宽度尺寸可以相同，以便于降低摄像头组件的宽度尺寸。
在一种示例中，摄像头组件中还可以包括滤光片。封装体还可以具有第二安装面，滤光片可以固定在第二安装面。当然，在一些实施方式中，封装体中也可以包括滤光材料，并且，封装体可以封盖感光芯片的受光面。即封装体可以起到滤光片的作用，因此，在实际应用中，可以省略滤光片的设置，有助于简化摄像头组件的组成部件的数量，能降低摄像头组件的制作难度和成本。
在一种示例中，封装体的一部分可以位于挖空部外，其中，第一安装面可以位于封装 体的背离电路板的表面。
或者，第二安装面也可以位于封装体背离电路板的表面。
在具体应用时，该背离电路板的表面可以是阶梯面。例如，第一安装面与电路板之间的距离可以大于第二安装面与电路板之间的距离。即第一安装面相比于第二安装面远离电路板。
另外，在实际应用中，挖空部可以是凹槽，也可以是通孔。即挖空部可以贯穿电路板的厚度，也可以不贯穿电路板的厚度。
当挖空部为凹槽时，电路板的焊盘可以位于凹槽的底壁。将感光芯片放置在挖空部内后，可以实现感光芯片与电路板之间的电连接。当然，焊盘也可以位于电路板的第一板面或其他位置，在此不作赘述。
当挖空部为通孔时，电路板的焊盘可以位于第一板面。感光芯片与电路板之间可以通过连接线进行连接，即连接线的一端可以与焊盘连接，另一端可以与感光芯片连接。
在一种示例中，封装体还可以对连接线进行封装。即连接线可以被包裹在封装体内，以使封装体对连接线形成保护作用。
在一种示例中，电路板的第一板面还可以设置沉槽，挖空部可以位于沉槽内，电路板的焊盘可以位于沉槽的内壁。
通过设置沉槽，并将焊盘设置在沉槽的内壁，有助于降低连接线的高度，能防止连接线造受刮擦等，从而能提升连接线的安全性。另外，也有助于降低摄像头组件的高度尺寸。
在对封装体进行具体设置时，封装体可以布满挖空部，以保证感光芯片与电路板之间的连接强度，并提升电路板本身的结构强度。
在另一种示例中，摄像头组件还可以包括支撑板。支撑板可以设置在电路板的第二板面(与第一板面相背离的面)，并与电路板固定连接，通过设置支撑板可以提升电路板的结构强度。
第二方面，本申请还提供了一种摄像头组件的制备方法，可以包括：
提供电路板组件；所述电路板组件包括沿第一方向平铺设置的至少两个电路板，相邻的两个所述电路板之间具有连接筋。
在所述电路板的第一板面开设挖空部；其中，在所述第一方向上，所述挖空部的投影位于所述连接筋内。
在所述挖空部内设置感光芯片，并电连接所述感光芯片和所述电路板。
使用封装体将所述感光芯片封装在所述挖空部内。
去除所述连接筋。
在本申请提供的制备方法中，通过在电路板之间设置连接筋，有利于保证相邻的电路板之间的连接强度。另外，在对挖空部进行制备时，由于挖空部的边缘具有足够多的电路板材料，因此，能够保持一定的结构强度。
在具体制备时，在开设挖空部之前，还可以在电路板的第二板面设置支撑板，以提升电路板的结构强度。
另外，在最终的摄像头组件中，可以包括支撑板，也可以去除支撑板。
另外，在进行制备时，还可以将滤光片与封装体进行固定连接。
也可以将镜头与封装体进行连接，以避免使用支架等结构，有助于降低摄像头组件的尺寸。
第三方面，本申请还提供了一种电子设备，可以包括上述的摄像头组件或者，由上述的制备方法制得的摄像头组件。电子设备可以包括壳体，摄像头组件可以设置在壳体内。其中，电子设备具体可以是笔记本电脑、平板电脑、电视或智能手表等，本申请对电子设备的具体类型不作限制。通过采用本申请提供的摄像头组件，有利于电子设备的小型化、轻薄化设计。
附图说明
图1为本申请实施例提供的一种笔记本电脑的立体结构示意图；
图2为本申请提供的一种常规的摄像头组件的俯视图；
图3为图2的A-A向截面图；
图4为本申请实施例提供的一种的摄像头组件的俯视图；
图5为图4的B-B向截面图；
图6为本申请实施例提供的一种镜头的剖面结构示意图；
图7为本申请实施例提供的一种摄像头组件的局部俯视图；
图8为图7的C-C向截面图；
图9为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图10为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图11为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图12为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图13为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图14为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图15为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图16为本申请实施例提供的另一种摄像头组件的部分结构的截面图；
图17为本申请实施例提供的一种摄像头组件的制备方法的流程图；
图18为本申请实施例提供的一种电路板组件的局部平面图；
图19为本申请实施例提供的一种电路板组件中设有挖空部的局部平面图；
图20为本申请实施例提供的一种摄像头组件的部分结构的截面图；
图21为本申请实施例提供的一种摄像头组件的部分结构的截面图；
图22为本申请实施例提供的一种电路板组件中设有电器元件后的局部平面图；
图23为本申请实施例提供的一种摄像头组件的剖面结构示意图；
图24为本申请实施例提供的一种摄像头组件的平面结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的摄像头组件，下面首先介绍一下其应用场景。
如图1所示，为本申请实施例提供的一种笔记本电脑的立体结构示意图。具体的，笔记本电脑可以包括系统端01和显示端02，系统端01和显示端02之间可以通过铰链(图中未示出)等结构进行连接，以使系统端01和显示端02之间能够相对开闭或闭合，从而 实现笔记本电脑的可折叠功能。其中，系统端01通常可以包括底壳011、键盘012、触控板013以及位于底壳011内部的主板、处理器、电池等器件。显示端02通常可以包括上盖021、显示屏022等器件。
其中，摄像头组件10可以设置在显示端02。在具体设置时，摄像头组件10可以设置在上盖021的边框023内，边框023可以为摄像头组件10提供足够的安装空间，并且，能够对摄像头组件10起到良好的保护作用。另外，当用户在使用笔记本电脑时，用户可以通过调整显示端02的朝向来调节摄像头组件10的方向，以获得所需的拍摄视角，因此，具有灵活的使用体验。
显示屏022所在的平面也可以称为B面，显示屏022的屏占比指的是显示屏022的显示区域与B面的比值。在实际应用中，为了提升显示屏022的屏占比通常是通过降低边框023的宽度尺寸d1的数值来实现。摄像头组件10设置在边框023中，边框023的宽度尺寸d1通常会大于摄像头组件10的宽度尺寸。或者，可以理解的是，摄像头组件10的宽度尺寸会对边框023的宽度尺寸d1形成制约，影响边框023的进一步缩窄。因此，降低摄像头组件10的宽度尺寸将有助于提升显示屏022的屏占比。
当然，本申请实施例提供的摄像头组件10也可以应用在平板电脑、电视或智能手表等电子设备中，以实现图像拍摄的功能。本申请对摄像头组件10的具体应用场景不作限制。
如图2和图3所示，图2为本申请提供的一种常规的摄像头组件03的俯视图，图3为图2的A-A向截面图。
摄像头组件03可以包括依次层叠设置的电路板031、感光芯片032、滤光片033和镜头034。镜头034通过支架035固定在电路板031上。其中，支架035的宽度尺寸d2通常较大，且大于镜头034的宽度尺度，因此，会增加摄像头组件03的宽度尺寸。另外，支架035与电路板031连接，因此，电路板031需要具有足够大的宽度尺寸用于安装支架035，因此，会增加电路板031的宽度尺寸。或者，可以理解的是，在实际应用中电路板031的宽度尺寸不小于支架035的宽度尺寸d2。
另外，如图3所示，由于感光芯片032与电路板031之间采用层叠的方式进行设置，因此，设像头组件03的高度尺寸h通常会较大。另外，镜头034、滤光片033通过支架035与电路板031进行连接，也会进一步增加摄像头组件03的高度尺寸h。
为此，本申请提供了一种有助于实现小型化、轻薄化设计的摄像头组件。
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图和具体实施例对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”和“该”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”是指一个、两个或两个以上。
在本说明书中描述的参考“一个实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施方式中”、“在另外的实施方式中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另 外特别强调。术语“包括”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
如图4和图5所示，在本申请提供的一种示例中，摄像头组件10可以包括：电路板11、感光芯片12、封装体13和镜头14。具体的，电路板11具有第一板面111(图5中的上板面)，第一板面111具有挖空部110(如图5中虚线框)。感光芯片12与电路板11电连接，并通过封装体13固定在挖空部110内。封装体13具有第一安装面131，镜头14的一端朝向感光芯片12，并与第一安装面131固定贴合。
具体来说，在本申请提供的摄像头组件10中，通过在电路板11中设置挖空部110，并将感光芯片12设置在挖空部110内，有助于降低摄像头组件10的高度尺寸H。另外，镜头14通过封装体13与电路板11进行固定连接后，还有助于降低摄像头组件10的宽度尺寸D。
例如，请结合参阅图3和图5。在图3中，由于镜头034是通过支架035固定在电路板031上的，因此，摄像头组件03以及电路板031的宽度尺寸约等于支架035的宽度尺寸d2，且大于镜头034的宽度尺寸。如图5所示，在本申请实施例提供的摄像头组件10中，由于省略了图3中的支架035，因此，摄像头组件10以及电路板11的宽度尺寸约等于镜头14的宽度尺寸。因此，通过在封装体13中设置第一安装面131，可以实现镜头14与电路板11之间的固定连接，可以省略设置支架035，有助于降低摄像头组件10的宽度尺寸D。
如图3所示，需要说明的是，在实际应用中，由于镜头034与感光芯片032之间的距离需要大于某一设定值，因此，在实际应用中，需要通过支架035将镜头034固定在电路板031上，以保证镜头034与感光芯片032之间的最小距离，并实现镜头034与电路板031之间的固定连接。
如图5所示，在本申请提供的摄像头组件10中，通过在封装体13中设置第一安装面131，可以实现封装体13与镜头14之间的固定连接。并且，通过对第一安装面131与电路板11(或感光芯片12)之间的距离进行合理设置后，可以保证镜头14与感光芯片12之间的最小距离。
在对封装体13进行设置时，封装体13的一部分(如图5中第一板面111上侧的部分)可以伸出于挖空部110。第一安装面131可以位于封装体13背离电路板11的表面。通过对封装体13伸出于挖空部110的长度进行控制，便可以对第一安装面131与电路板11之间的距离进行有效控制。
概括来说，通过设置封装体13不仅能够实现感光芯片12、镜头14以及电路板11之间的固定连接，还能够对感光芯片12和镜头14之间的位置进度进行有效的控制，有利于保证摄像头组件10的品质。
另外，如图4和图5所示，在本申请提供的一种示例中，电路板11为长条形，即电路板11的宽度尺寸较小，长度尺寸较大。长条形的电路板11可以在有限的宽度尺寸下提供更大面积的板面，可用于为电器元件提供更多的布板面积。另外，在实际应用中，也便于将摄像头组件10应用在比较狭窄的空间内。可以理解的是，为了较大限度的缩减摄像头组件10的宽度尺寸D，电路板11的宽度尺寸与镜头14的宽度尺寸可以相同。可以理解的是，该宽度尺寸相同指的是大致相同，在工程实现上可以存在尺寸误差。
另外，将封装体13填充在电路板11的挖空部110后，还能对感光芯片12与电路板 11之间的缝隙进行填充，有利于提升电路板11的结构强度，保证摄像头组件03的结构安全性。
如图6所示，为本申请实施例提供的一种镜头14的剖面结构示意简图。镜头14可以包括镜筒141和位于镜筒141内的多个透镜142(图6中示出有5个)。其中，在多个透镜142中，可以包括平面镜、凸透镜或凹透镜等，本申请对透镜142的数量、设置位置和形状不作限定。镜筒141的主要作用是为透镜142提供安装位置，并将多个透镜142组成一体结构。镜筒141可以是两端开口的筒形结构，其中，镜筒141的截面形状可以是圆形、矩形、椭圆形或不规则形状等。光线可由镜筒141的一端进入镜头14内，经镜筒141内的透镜142进行处理后，由镜筒141的另一端射入。当然，在另外的实施方式中，镜头14也可以包括保护壳或屏蔽罩等结构件，本申请对镜头14的具体结构不作限定。
如图5和图6所示，将镜头14固定在封装体13的第一安装面131上时，可以在镜筒141的一端涂覆胶水143，然后将涂覆有胶水143的一端直接与第一安装面131进行贴合。当胶水143凝固后便可实现镜头14与封装体13之间的固定连接。
当然，在其他示例中，镜头14与封装体13之间还可以通过焊接等工艺进行固定连接，本申请对镜头14与封装体13之间的连接方式不作限定。
其中，电路板11可以是印制电路板(Printed Circuit Board，PCB)也可以是柔性电路板(Flexible Printed Circuit，FPC)等，另外，电路板11可以是单层板也可以是多层板，本申请对电路板11的具体类型不作限制。
感光芯片12是一种将光学图像转换成电信号的器件，当光线照射在感光芯片12的受光面120时，可以将光信号转换为电信号。在受光面120具体可以包括电荷耦合元件(Charge-coupled Device，CCD)或互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，CMOS)等。在实际应用中，可以根据实际需求对感光芯片12的具体类型进行合理选择，本申请对此不作限定。
另外，如图5所示，在实际应用中，摄像头组件10还可以包括滤光片15。其中，滤光片15可以是红外滤光片15，即滤光片15可以对某波段的红外光进行有效过滤，以减弱传播至感光芯片12的红外光。当然，在具体应用时，滤光片15的具体类型本申请不作限制。
另外，在本申请提供的实施例中，封装体13还具有第二安装面132，滤光片15可以固定在第二安装面132。在具体设置时，可以在滤光片15朝向第二安装面132的表面涂覆胶水，然后将涂覆有胶水的表面直接与第二安装面132进行贴合，当胶水凝固后便可实现镜头14与封装体13之间的固定连接。当然，在其他的实施方式中，滤光片15与封装体13之间也可以采用焊接等工艺进行固定连接，本申请对滤光片15与封装体13之间的连接方式不作具体限定。
在对封装体13进行设置时，封装体13的一部分(如图5中第一板面111上侧的部分)可以伸出于挖空部110。第二安装面132可以位于封装体13背离电路板11的表面。
在图5中提供的示例中，封装体13背离电路板11的表面可以是阶梯面。例如，第一安装面131与电路板11之间的距离可以大于第二安装面132与电路板11之间的距离。即第一安装面131相比于第二安装面132远离电路板，以便于将滤光片15设置在镜头14与感光芯片12之间。在实际应用中，可以根据实际需求(如滤光片15的厚度尺寸)对第一安装面131与第二安装面132之间的高度差进行合理设置，在此不作赘述。
在对感光芯片12进行封装时，可以根据实际的尺寸需求一并制作出第一安装面131和第二安装面132。或者，也可以先对感光芯片12进行封装，然后在对成型的封装体13进行堆料、切割或磨削等，以制备出第一安装面131和第二安装面132。或者，可以理解的是，在本申请提供的示例中，感光芯片12、镜头14和滤光片15均可以通过封装体13与电路板11进行固定连接，能有效的简化制作流程，便于提升制作效率。另外，还能够避免引入额外的支架结构，有利于实现摄像头组件10的轻量化、小型化设计。
其中，封装体13的材料可以是陶瓷、二氧化硅或聚合物等，在具体应用时，可以根据实际需求对封装体13的材料和制备工艺进行合理选择和调整，在此不作赘述。
在具体应用时，挖空部110的具体结构可以是多样的。
例如，如图7和图8所示，在本申请提供的一种示例中，挖空部110可以是通孔。即挖空部110贯穿电路板11的第一板面111和第二板面112，其中，第一板面111和第二板面112为电路板11的相背离的板面。
如图7所示，在具体实施时，挖空部110的其中一个侧边与电路板11的其中一个侧边之间的距离L1可以是0.2mm-2mm。挖空部110的另一个侧边与电路板11的另一个侧边之间的距离L2可以是0.2mm-2mm。其中，L1与L2可以相等也可以不相等。或者，在另外的实施方式中，L1也可以为零。或者，L2也可以为零。
感光芯片12与电路板11之间可以通过连接线16进行导电连接。具体来说，电路板11第一板面111可以设置焊盘113。连接线16(也可以称为金线)的一端可以与电路板11的焊盘113焊接，另一端与感光芯片12的引脚焊接，以实现感光芯片12与电路板11之间的导电连接。
或者，如图9所示，在本申请提供的另一种示例中，第一板面111具有沉槽114，挖空部110位于沉槽114内，焊盘113位于沉槽114的内壁。
具体来说，在本申请提供的示例中，挖空部110为通孔结构。挖空部110设置在沉槽114的底壁并贯通沉槽114的厚度，焊盘113位于沉槽114的底壁。通过设置沉槽114，并将焊盘113设置在沉槽114的底壁，有助于降低连接线16的高度，能防止连接线16造受刮擦等，从而能提升连接线16的安全性。另外，也有助于降低摄像头组件10的高度尺寸。
在具体设置时，沉槽114的底壁的厚度尺寸与感光芯片12的厚度尺寸可以相同，也可以不相同，本申请对此不作具体限定。
或者，在其他的示例中，焊盘113也可以设置在沉槽114的侧壁，同样也可以降低金线的高度，在此不作赘述。
另外，如图10所示，在本申请提供的另一种示例中，摄像头组件10还可以包括支撑板17。支撑板17设置在电路板11的第二板面112，并与电路板11固定连接。通过设置支撑板17可以提升电路板11的结构强度，当电路板11遭受外力时，支撑板17能够对外力进行有效的分散，以降低电路板11所受到的作用力，从而能防止电路板11被弯曲或折断等。其中，感光芯片12也可以与支撑板17贴合固定，从而可以提升感光芯片12与电路板11之间的连接稳定性。
另外，通过设置支撑板17还有利于保证感光芯片12与电路板11之间的位置精度。例如，对感光芯片12和电路板11进行装配时，可以将支撑板17贴合在电路板11的第二板面112。将感光芯片12放置在挖空部110内，并使感光芯片12与支撑板17进行贴合，从而能够使感光芯片12的背面(与受光面120相背离的表面)与基板的第二板面112保持平 齐的状态，以提升感光芯片12和电路板11之间的相对位置精度。
在具体应用时，支撑板17的刚性可以大于、等于或小于电路板11的刚性。另外，支撑板17可以是具有明显厚度的板结构，也可以是厚度较小的膜结构等，本申请对支撑板17的材料和具体尺寸不作限制。另外，在具体的制备工艺中，在对挖空部110进行设置之前，可以将支撑板17设置在电路板11的第二板面112，以避免电路板11发生弯折或折断等情况。当制备完封装体13后，可以将支撑板17进行去除，以避免支撑板17增加摄像头组件10的高度尺寸。当然，在另外的实施方式中，支撑板17也可以不进行去除，从而能够保证电路板11的结构安全性。
如图11所示，在本申请提供的另一种示例中，挖空部110也可以是凹槽。即挖空部110未贯穿至电路板11的第二板面112。
在具体设置时，焊盘113可以位于电路板11的第一板面111，感光芯片12与电路板11之间可以通过连接线16进行电连接。
或者，如图12所示，焊盘113也可以位于凹槽的底壁。在进行制作时，可以采用表贴等工艺实现感光芯片12与电路板11之间的电连接。
在具体设置时，凹槽的深度尺寸可以大于感光芯片12的高度尺寸。即感光芯片12未伸出于凹槽。
或者，凹槽的深度尺寸也可以小于感光芯片12的高度尺寸。即感光芯片12可以伸出于凹槽。
当然，在另外的实施方式中，凹槽的深度尺寸与感光芯片12的高度尺寸也可以大致相同。在此不作赘述。
在对封装体13进行设置时，封装体13的具体结构也可以是多样的。
如图13所示，在本申请提供的一种示例中，封装体13可以填充在感光芯片12的侧壁与挖空部110的侧壁之间。
或者，如图14所示，封装体13还可以对连接线16进行封装。连接线16可以被包裹在封装体13内，以使封装体13对连接线16形成保护作用。
或者，如图15所示，封装体13还可以位于电路板11的第一板面111。
或者，如图16所示，封装体13也可以覆盖至感光芯片12的受光面120，从而能够加强对感光芯片12的保护作用，另外，也能够提升感光芯片12与电路板11之间的连接稳定性。
在具体应用时，封装体13可以由透光性良好的材料制作而成，以避免封装体13对感光芯片12的工作性能造成不良影响。
或者，在一些实施方式中，封装体13中可以具有滤光材料。例如，封装体13可以对特定波段的光线进行有效过滤。或者，可以理解的是，封装体13可以起到滤光片的作用。因此，在实际应用中，可以省略滤光片的设置，有助于简化摄像头组件10的组成部件的数量，能降低摄像头组件10的制作难度和成本。
在对摄像头组件10进行制作时，可以采用多种不同的工艺流程。
例如，如图17所示，本申请实施例还提供了一种摄像头组件的制备方法，可以包括以下步骤：
步骤S100：提供电路板组件。
其中，电路板组件包括沿第一方向平铺设置的至少两个电路板，相邻的两个电路板之 间具有连接筋。
步骤S200：在电路板的第一板面开设挖空部。
其中，在第一方向上，挖空部的投影位于连接筋内；
步骤S300：在挖空部内设置感光芯片，并电连接感光芯片和电路板。
步骤S400：使用封装体将感光芯片封装在挖空部内。
步骤S500：去除连接筋。
具体的，请结合图18至图24。
在本申请提供的一种示例中，电路板组件20中包括6个沿第一方向依次排列的电路板，分别为电路板11a、电路板11b、电路板11c、电路板11d、电路板11e和电路板11f。另外，相邻的电路板之间通过连接筋进行连接，以使多个电路板能够连接为一体结构，便于运输或后续的其他制作流程。具体的，电路板11a与电路板11b之间通过连接筋21b进行连接，电路板11b与电路板11c之间通过连接筋21c进行连接，电路板11c与电路板11d之间通过连接筋21d进行连接，电路板11d与电路板11e之间通过连接筋21e进行连接，电路板11e与电路板11f之间通过连接筋21f进行连接。
另外，在图18中提供的示例中，在第一方向上，电路板组件20的两侧设有保护条22a和保护条22b。在保护条22a与电路板11a之间设有连接筋21a，在保护条22b与电路板11f之间也通过连接筋21g进行连接。在实际的制备流程中，制作设备(如机械臂等)可以作用于保护条22a或保护条22b，以避免接触电路板，从而能够保证电路板的制作品质。当然，在其他的示例中，保护条也可以省略设置。
另外，在图18中的示例中，还示出了多个辅助的筋条23。这些筋条23有助于保证相邻的两个电路板之间的连接稳定性。在实际应用中，筋条23只需要保证相邻的两个电路板之间的连接稳定性，或者，电路板与保护条之间的连接稳定性即可。即在第二方向上，筋条23的尺寸可以小于连接筋(如连接筋21a)的尺寸，以便于后续对筋条23进行切割。在实际应用中，可以根据实际需求对筋条23的设置数量和位置进行合理设置，本申请对此不作限定。
可以理解的是，在上述的电路板组件20中，可以由电路板的生产厂家进行提供。即相邻的两个电路板之间的缝隙可以由电路板的生产厂家进行制作，以便于缩减后续的切割时间。
另外，在实际应用中，电路板组件20中也可以包括两个、三个或者更多个电路板，本申请对电路板的具体数量不作限制。
请参阅图19，可以采用激光切割或刀具切割等方式在电路板11a中设置挖空部110a，在电路板11b中设置挖空部110b，在电路板11c中设置挖空部110c，在电路板11d中设置挖空部110d，在电路板11e中设置挖空部110e，在电路板11f中设置挖空部110f。其中，在第一方向上，挖空部的投影位于连接筋内。具体的，以挖空部110a和连接筋21a为例。在第一方向上，挖空部110a的投影位于连接筋21a内。当挖空部110a制作完成后，电路板11a与连接筋21a之间仍有足够多的连接部分，从而能够防止电路板11a产生断裂等不良情况。或者，可以理解的是，在第一方向上，若挖空部110a的投影没有落在连接筋21内，则挖空部110a的侧边与电路板11的侧边之间的宽度尺寸L3较小(如小于2mm)，因此，没有充足的材料来保证电路板11a的结构强度。当电路板组件20被搬运时，很容易出现断裂等不良情况，会影响后续的制作工序的顺利进行，也会降低摄像头组件的制作品质。
可以理解的是，在实际的制备过程中，可以根据挖空部的实际尺寸对连接筋的长度(即在第二方向上的尺寸)进行合理设置，在此不作赘述。
另外，如图20所示，在开设挖空部110之前还可以包括：将支撑板17设置在电路板11的第二板面112。其中，第一板面111与第二板面112相背离。通过设置支撑板17可以提升电路板11(或电路板组件20)的结构强度，当电路板11遭受外力时，支撑板17能够对外力进行有效的分散，以降低电路板11所受到的作用力，从而能防止电路板11被弯曲或折断等。
感光芯片12和电路板11之间可以通过连接线16(或金线)进行电连接。例如，可以将连接线16的一端与电路板11的焊盘113进行焊接，将连接线16的另一端与感光芯片12的引脚进行焊接，以实现感光芯片12与电路板11之间的电连接。当然，在其他的制备方法中，感光芯片12与电路板11之间也可以采用表贴等工艺进行电连接。本申请对感光芯片12与电路板11之间实现电连接的具体方式不作限定。
如图21所示，在对感光芯片12进行封装时，可以使用陶瓷、二氧化硅或聚合物等作为封装材料，当封装材料固化后便可成型为封装体13，并实现感光芯片12与电路板11之间的固定连接。
如图22所示，在进行封装时，封装体可以覆盖至每个挖空部110的所在区域M(如图22中的虚线框)，以便于实现大规模制作和批量生产。另外，通过封装体还能够提升电路板组件20的整体结构强度。
当然，在其他的制备工艺中，封装体的设置位置可以根据实际需求进行合理设置，在此不作赘述。
另外，如图22所示，在实际应用中，电路板11中还可以设置电容、电阻或电感等电器元件24。因此，在实际的制备过程中，当感光芯片12被封装后，还可以采用表贴等工艺在电路板11上设置电器元件。
另外，如图23所示，在实际应用中，摄像头组件10还可以包括滤光片15。在封装体13制备完成后，还可以将滤光片15设置在封装体13的第二安装面132。可以理解的是，在实际的制备工艺中，也可以使用封装体13来替代滤光片15。例如，可以将封装材料覆盖至感光芯片12的受光面120。在实际应用中，可以对封装材料的具体组分进行合理选择，以使封装体13具有滤光的作用。
另外，在其他的制备方法中，在封装体13制备完成后，还可以将镜头14与封装体13进行连接。在具体实施时，可以在封装体13中设置用于安装镜头14的第一安装面131。在对镜头14进行安装时，可以在镜头14的一端涂覆胶水，然后将涂覆有胶水的一端与第一安装面131进行贴合，以实现封装体13与镜头14之间的固定连接。
请结合参阅图22和图24。最后，可以采用激光切割或刀具切割等方式对连接筋进行切除，将多个电路板分割为独立的单元。
可以理解的是，由于封装体13可以布满整个区域M，因此，在对连接筋进行切割时，也可以同时对封装体13进行切割。
另外，当采用支撑板17后，还可以对支撑板17进行去除，以避免支撑板17增加摄像头组件10的高度尺寸。当然，在另外的实施方式中，支撑板17也可以不进行去除，从而能够保证电路板11的结构安全性。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本 技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (17)

  1. 一种摄像头组件，其特征在于，包括：
    电路板，具有挖空部；
    感光芯片，设置在所述挖空部内，并与所述电路板电连接；
    封装体，用于将所述感光芯片封装在所述挖空部内；
    所述封装体具有第一安装面；
    镜头，所述镜头的一端朝向所述感光芯片，并与所述第一安装面固定贴合。
  2. 根据权利要求1所述的摄像头组件，其特征在于，还包括滤光片；
    所述封装体具有第二安装面，所述滤光片位于所述镜头与所述感光芯片之间，并且，所述滤光片与所述第二安装面固定贴合。
  3. 根据权利要求2所述的摄像头组件，其特征在于，所述封装体的一部分位于所述挖空部外；
    其中，所述第一安装面位于所述封装体的背离所述电路板的表面。
  4. 根据权利要求3所述的摄像头组件，其特征在于，所述第二安装面位于所述封装体的背离所述电路板的表面；
    所述第一安装面相比于所述第二安装面远离所述电路板。
  5. 根据权利要求1至4中任一项所述的摄像头组件，其特征在于，所述挖空部为凹槽或通孔。
  6. 根据权利要求5所述的摄像头组件，其特征在于，所述挖空部为凹槽，所述凹槽的底壁设有焊盘，所述感光芯片与所述焊盘电连接。
  7. 根据权利要求1至5中任一项所述的摄像头组件，其特征在于，所述摄像头组件还包括连接线；
    所述电路板具有焊盘；
    所述连接线的一端与所述焊盘连接，另一端与所述感光芯片连接；
    其中，所述连接线包裹在所述封装体内。
  8. 根据权利要求7所述的摄像头组件，其特征在于，所述电路板具有第一板面，所述挖空部和所述焊盘位于所述第一板面。
  9. 根据权利要求7所述的摄像头组件，其特征在于，所述电路板具有沉槽，所述挖空部位于所述沉槽内，所述焊盘位于所述沉槽的内壁。
  10. 根据权利要求1至9中任一项所述的摄像头组件，其特征在于，所述电路板为长条形，所述镜头的宽度尺寸与所述电路板的宽度尺寸相同。
  11. 根据权利要求1至10中任一项所述的摄像头组件，其特征在于，还包括支撑板；
    所述电路板具有第一板面和第二板面，所述第二板面和所述第一板面相背离；
    所述挖空部位于所述第一板面，所述支撑板位于所述第二板面。
  12. 一种摄像头组件的制备方法，其特征在于，包括：
    提供电路板组件；所述电路板组件包括沿第一方向平铺设置的至少两个电路板，相邻的两个所述电路板之间具有连接筋；
    在所述电路板的第一板面开设挖空部；其中，在所述第一方向上，所述挖空部的投影位于所述连接筋内；
    在所述挖空部内设置感光芯片，并电连接所述感光芯片和所述电路板；
    使用封装体将所述感光芯片封装在所述挖空部内；
    去除所述连接筋。
  13. 根据权利要求12所述的制备方法，其特征在于，所述在所述电路板的第一板面开设挖空部之前还包括：
    将支撑板设置在所述电路板的第二板面，其中，所述第一板面与所述第二板面相背离。
  14. 根据权利要求12所述的制备方法，其特征在于，所述使用封装体将所述感光芯片封装在所述挖空部内后还包括：
    去除所述支撑板。
  15. 根据权利要求12至14中任一项所述的制备方法，其特征在于，还包括：
    提供滤光片，将所述滤光片与所述封装体固定连接。
  16. 根据权利要求12至15中任一项所述的制备方法，其特征在于，还包括：
    提供镜头，将所述镜头与所述封装体固定连接。
  17. 一种电子设备，其特征在于，包括如权利要求1至11中任一项所述的摄像头组件，或者，包括如权利要求12至16中任一项所述的制备方法制得的摄像头组件；
    所述电子设备包括外壳，所述摄像头组件设置在所述外壳内。
PCT/CN2023/096183 2022-05-27 2023-05-25 一种摄像头组件、摄像头组件的制备方法和电子设备 WO2023227048A1 (zh)

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