WO2022241741A1 - 一种电路板组件、摄像模组及电子设备 - Google Patents

一种电路板组件、摄像模组及电子设备 Download PDF

Info

Publication number
WO2022241741A1
WO2022241741A1 PCT/CN2021/094999 CN2021094999W WO2022241741A1 WO 2022241741 A1 WO2022241741 A1 WO 2022241741A1 CN 2021094999 W CN2021094999 W CN 2021094999W WO 2022241741 A1 WO2022241741 A1 WO 2022241741A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
flexible connecting
reference plane
flexible
connecting strip
Prior art date
Application number
PCT/CN2021/094999
Other languages
English (en)
French (fr)
Inventor
马忠科
陈小凤
Original Assignee
欧菲光集团股份有限公司
南昌欧菲光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 欧菲光集团股份有限公司, 南昌欧菲光电技术有限公司 filed Critical 欧菲光集团股份有限公司
Priority to PCT/CN2021/094999 priority Critical patent/WO2022241741A1/zh
Publication of WO2022241741A1 publication Critical patent/WO2022241741A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32—Means for focusing
    • G03B13/34—Power focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules

Definitions

  • the invention relates to the technical field of imaging devices, in particular to a circuit board assembly, a camera module and electronic equipment.
  • the camera module generally includes a lens and an image sensor.
  • the lens is located on one side of the imaging surface of the image sensor. The light entering from the lens reaches the imaging surface of the image sensor and forms an image on the imaging surface.
  • the image sensor is installed on the movable circuit board, and the movable circuit board moves laterally (in a direction perpendicular to the optical axis) relative to the fixed circuit board, so as to realize the anti-shake effect of the chip.
  • the movable circuit board and the fixed circuit board are connected by a flexible board.
  • the current design of the flexible board width is relatively large, which will bring a certain resistance when the movable circuit board moves laterally, which is not conducive to improving the mold Group responsiveness, as well as reducing the overall horizontal size. How to reduce the resistance of the movable circuit board and realize the miniaturization of the module under the premise of maintaining the electrical connection has become an urgent problem to be solved.
  • the invention discloses a circuit board assembly, a camera module and electronic equipment, which are used for reducing the resistance when the second circuit board moves laterally without increasing the lateral dimension.
  • the present invention provides the following technical solutions:
  • a circuit board assembly in a first aspect, includes: a first circuit board, a second circuit board, and a plurality of flexible connecting strips; the first circuit board has opposite first surfaces and second surfaces; The second circuit board has an opposite third surface and a fourth surface, and an outer peripheral surface connecting the third surface and the fourth surface, the orientation of the third surface is the same as that of the first surface Same, the orientation of the fourth surface is the same as that of the second surface, the third surface and the fourth surface are both rectangular, first, when the circuit board assembly is assembled with the image sensor, it is convenient Adapt to the shape of the image sensor, secondly, when forming the second circuit board by cutting and molding, it is only necessary to cut the motherboard along two vertical directions, which is beneficial to reduce the Difficulty in cutting, thirdly, when cutting to form the second circuit board, the utilization rate of the motherboard is higher, and the leftovers produced are less; and the third surface is provided with an electrical connection structure for fixing and electrically connecting with the image sensor, In order to fix and electrically
  • the overall size of the circuit board assembly can basically remain unchanged, even if it is integrated with the size of the optical image stabilization motor, the optical The size of the anti-shake motor can also basically remain unchanged, so that the size change of the image sensor is not easy to cause the size change of other components, and the adaptation is more flexible.
  • the middle part of the first circuit board has a first hollow;
  • the outer peripheral surface of the second circuit board is at least partially opposite to the inner peripheral surface surrounding the first hollow part, and the first circuit board and the second circuit board are on the reference surface
  • There is an annular gap between the orthographic projections by hiding the second circuit board at least partially in the first hollow part, the space occupied by the circuit board assembly in the direction perpendicular to the reference plane can be reduced.
  • the first hollow part is rectangular to match the shape of the second circuit board to improve the space utilization of the first hollow part, and when processing the first hollow part, only It needs to be cut along two straight lines perpendicular to each other to reduce the difficulty of cutting, and the inner peripheral surface surrounding the first hollow part has first sub-sides corresponding to each side of the first surface;
  • the first end of the flexible connecting strip is connected to one of the first sub-sides, so that the stress on the flexible connecting strip is distributed along two directions parallel to the reference plane and perpendicular to each other.
  • each flexible connecting strip is formed with a first corner structure bent from the extending direction of the flexible connecting strip to the first circuit board, so as to facilitate flexible arrangement The connection position between the first end of the flexible connecting band and the first sub-side.
  • the orthographic projection of each of the flexible connecting bands on the reference plane is located in the annular gap; the second end of each of the flexible connecting bands is connected to the outer peripheral surface , in order to reduce the occupied space of the flexible connecting strip in the direction perpendicular to the reference plane.
  • the outer peripheral surface has a second sub-side that corresponds to each side of the first surface; in the two opposite second sub-sides, each Each of the second sub-sides is connected to at least two of the flexible connecting strips, so as to increase the amount of outgoing wires of the two opposite second sub-sides, thereby increasing the bonding strength between the second sub-sides and the flexible connecting strips; and,
  • the above-mentioned two second sub-sides that increase the outlet amount are opposite, which can improve the force balance of the second circuit board.
  • the flexible connecting bands respectively connected to the two second sub-sides are symmetrical about the axis of symmetry of the two second sub-sides, so that The second circuit board can further be stressed in a balanced manner.
  • each flexible connecting strip is formed with a second corner structure bent from the extending direction of the flexible connecting strip to the second circuit board, so as to facilitate flexible arrangement The connection position between the second end of the flexible connecting band and the second sub-side.
  • the second surface is located on the side of the fourth surface away from the third surface; along the normal direction of the reference plane, the flexible connecting strip Located on the side of the fourth surface away from the third surface, the orthographic projection of the plurality of bending structures of each of the flexible connecting strips on the reference plane is the same as that of the fourth surface on the reference plane.
  • the orthographic projections on the surface at least partially overlap, and are connected to the inner peripheral surface surrounding the first hollow part through the first end, and connected to the fourth surface through the second end, so that the On the premise of maintaining the overall size of the circuit board assembly, increasing the size of the second circuit board facilitates setting a larger size image sensor.
  • the thickness of the flexible connecting strip is smaller than the thickness of the first circuit board, and the flexible connecting strip is interposed between the second surface and the fourth surface , does not occupy additional space in the normal direction of the reference plane; and, the first end is connected to the inner peripheral surface, and the minimum distance from the first end to the second surface is smaller than the first end to the second surface
  • the minimum distance from the first surface is to reserve a wider dimension between the first end and the first surface on the inner peripheral surface to be opposite to the outer peripheral surface of the first hollow part, which is beneficial to reduce the circuit board assembly. thickness, and to ensure a flexible connection.
  • the third surface is higher than the first surface; along the normal direction of the reference plane, the flexible connecting strip is located on the side of the first surface away from the second surface, each The second ends of each of the flexible connecting strips are connected to the outer peripheral surface, and the orthographic projections of the plurality of bending structures of the flexible connecting strip on the reference plane at least partially overlap with the first surface, And connected to the first surface through the first end.
  • the size of the second circuit board is increased to facilitate the installation of a larger size image sensor.
  • the thickness of the flexible connecting strip is smaller than the thickness of the second circuit board, and the flexible connecting strip is interposed between the first surface and the third surface No extra space on the normal direction of the reference surface will be occupied; and the second end is connected to the outer peripheral surface, and the minimum distance from the second end to the third surface is smaller than the second end to the third surface.
  • the minimum distance to the fourth surface In order to reserve a wider dimension between the second end and the fourth surface on the outer peripheral surface to be opposite to the inner peripheral surface of the first hollow part, it is beneficial to reduce the thickness of the circuit board assembly and ensure flexible connection.
  • the plane where the first surface is located is opposite to the plane where the fourth surface is located; the first end of each of the flexible connecting bands is connected to the first surface, and the second end is connected to the fourth surface connected, and the orthographic projection of the plurality of bending structures of the flexible connecting strip on the reference plane at least partially overlaps the orthographic projection of the fourth surface on the reference plane. It can avoid opening holes in the first circuit board, improve the structural stability of the first circuit board, and reduce the difficulty of the process, and the second circuit board directly plays a sealing role, which can avoid the need for a second circuit board on the second surface of the first circuit board. Set the reinforcement board on the side.
  • a second hollow part extending along the extending direction of the flexible connecting strip is provided in the middle of each flexible connecting strip, so that the width of the flexible connecting strip in a direction parallel to the reference plane can be reduced to improve flexibility.
  • the softness of the connecting belt reduces the resistance to be overcome when it deforms.
  • each of the flexible connecting strips extends along a direction parallel to the reference plane, so as to arrange more traces on the surface of the flexible connecting strip parallel to the reference plane, compared to the The wiring is arranged on the surface perpendicular to the reference plane, so that the wiring will not be twisted and easily broken.
  • each of the flexible connecting strips extends helically around the central axis of the second circuit board, the central axis is perpendicular to the third surface, and passes through the geometry of the third surface. center; and, the projection of each flexible connecting strip in the width direction overlaps with the projection of the other flexible connecting strip in the width direction, wherein the width direction refers to parallel to the reference plane and perpendicular to The direction of the extension direction of the flexible connecting strip is beneficial to increase the length of the flexible connecting strip, so that when the flexible connecting strip is deformed, the deformation amount of each cross section is reduced, thereby helping to reduce the resistance when the flexible connecting strip is deformed.
  • the angle between the first end and the second end of each flexible connection band and the central axis is between 90° and 180°, wherein the connection The line is parallel to the reference plane.
  • a camera module in a second aspect, includes a lens, an image sensor, a drive assembly, and the circuit board assembly described in any one of the above technical solutions, wherein the image sensor is arranged on the third surface, and The electrical connection structure is electrically connected to the second circuit board, the lens is arranged on the side of the image sensor away from the second circuit board; the driving assembly is used to support the second circuit board The lens is located on a side close to the image sensor, and is used to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference plane, so as to realize the anti-shake function.
  • the driving component supports the second circuit board on the lens, so that the second circuit board has the flexibility of lateral movement, and can drive the second circuit board to move in a direction parallel to the reference plane to realize the anti-shake function
  • the image sensor is electrically connected to the second circuit board through the electrical connection structure, and the light entering through the lens can be incident on the image sensor for imaging.
  • the drive assembly includes: a support component and a lateral drive component, the lateral drive component is connected to a side of the lens close to the image sensor, and is used to move the support component along a direction parallel to the reference plane The direction of moving relative to the first circuit board, the supporting part is used to support the second circuit board on the lateral driving part, which is beneficial to improve integration and reduce assembly difficulty.
  • the drive assembly includes: a support component and a lateral drive component; wherein the support component is used to support the second circuit board on the side of the lens close to the image sensor; the lateral drive The component is used to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference plane, and the supporting component and the lateral driving component are independently provided, which is beneficial to separate manufacturing and reduces component costs.
  • the lateral driving component includes a coil and a magnet, wherein the coil is arranged on the second circuit board, and the magnet is arranged on the first circuit board; or, the magnet is arranged on the first circuit board.
  • the coil is arranged on the first circuit board; the coil is used to attract or repel each other with the magnet, so as to drive the second circuit board relative to the first circuit board in a direction parallel to the reference plane move.
  • the horizontal driving part includes an optical anti-shake motor, which has a good anti-shake effect
  • the support part includes a suspension wire, which can have a certain supporting effect and make the movable circuit board move in the lateral direction. has a certain degree of freedom.
  • the camera module further includes a filter holder and an infrared cut filter, the infrared cut filter is located between the lens and the image sensor, and the filter holder filters the infrared cut filter
  • the sheet is supported on the third surface; the support member is connected between the lens and the filter holder.
  • the support component is indirectly connected to the second circuit board by using the filter holder, which is beneficial to reduce the occupied area of the third surface.
  • the camera module further includes a gold wire, and the image sensor is electrically connected to the electrical connection structure through the gold wire, so as to realize conduction between the image sensor and the electrical connection structure.
  • the camera module further includes a reinforcing plate, and the reinforcing plate is arranged on a side of the first circuit board away from the lens. surface, and the reinforcing plate covers the hollow structure to prevent dust from entering the camera module through the first hollow.
  • an electronic device in a third aspect, includes a casing and the camera module provided by the above technical solution, and the camera module is arranged in the casing.
  • FIG. 1 is a cross-sectional view of the first camera module provided by the embodiment of the present application.
  • Fig. 2a to Fig. 2c show the structural representation of the first kind of circuit board assembly in the embodiment shown in Fig. 1;
  • Fig. 3 shows the structural representation of the second circuit board assembly in the embodiment shown in Fig. 1;
  • Fig. 4 shows the structural representation of the third circuit board assembly in the embodiment shown in Fig. 1;
  • Fig. 5 a to Fig. 5 c show the structure diagram of the fourth circuit board assembly in the embodiment shown in Fig. 1;
  • Figure 5d is a partial enlarged view of R1 in Figure 5c;
  • Figure 5e is a partial enlarged view of R2 in Figure 5c;
  • 6a to 6c show a schematic structural view of the fifth circuit board assembly in the embodiment shown in FIG. 1;
  • Figure 6d is a partial enlarged view of R3 in Figure 6b;
  • Figure 6e is a partial enlarged view of R4 in Figure 6b;
  • Fig. 7 a shows the structural representation of the sixth circuit board assembly in the embodiment shown in Fig. 1;
  • Figure 7b shows a schematic structural view of the seventh circuit board assembly in the embodiment shown in Figure 1;
  • Fig. 8a is a cross-sectional view of the second camera module provided by the embodiment of the present application.
  • Figure 8b shows a schematic structural view of the first circuit board assembly in the embodiment shown in Figure 8a;
  • Figure 8c shows a schematic structural view of the second circuit board assembly in the embodiment shown in Figure 8a;
  • Fig. 8d shows a schematic structural view of the third circuit board assembly in the embodiment shown in Fig. 8a.
  • the camera module includes a circuit board assembly, which includes a first circuit board 8 , a second circuit board 10 and a connection assembly 4 .
  • the first circuit board 8 is used as a fixed circuit board, and the middle part is provided with a first hollow part U1;
  • the second circuit board 10 is used as a movable circuit board, located in the first hollow part U1, and the image sensor 2 is bonded to the second circuit board by glue 1 10, the image sensor 2 is connected to the second circuit board 10 through the gold wire 7,
  • the circuit board assembly also includes an electrical connection arranged on the surface of the second circuit board 10 (specifically the third surface B1 proposed later) structure, the electrical connection structure can be a plurality of pads scattered and distributed, and the gold wire 7 is electrically connected to the second circuit board 10 by connecting with the pads, but the specific form of the electrical connection structure is not limited to the pads, and can also be It is other structure with electrical connection effect, electronic devices 17 such as capacitance and inductance can also be provided on the second circuit board 10; 9 has
  • the first circuit board 8 is upside down with a groove-shaped first bracket 12, the vertical part of the first bracket 12 extends along the edge of the first circuit board 8, and the second circuit board 10 is upside down with a groove-shaped second bracket 11.
  • the vertical part of the second bracket 11 extends along the edge of the second circuit board 10, the position where the first bracket 12 is opposite to the second circuit board 10 is provided with an opening, and the position where the second bracket 11 is opposite to the image sensor 2 is provided with Opening, the above-mentioned opening of the second bracket 11 is provided with an infrared cut-off filter 13;
  • 16 connections, the suspension wire 16 mainly plays a supporting role as a supporting component, and supports the second circuit board 10 on the side of the lens 15 close to the image sensor 2, but this "support" is an indirect support.
  • the edge of the first circuit board 8 is provided with a magnet 5, and the magnet 5 is located on the surface (first surface A1) of the first circuit board 8 close to the lens 15, and inside the first bracket 12, on the third surface B1 of the second circuit board 10.
  • a coil 6 is provided on the edge, and the coil 6 is located inside the second support 11 .
  • the magnet 5 and the coil 6 form at least a part of the structure of the transverse drive part, and the support part and the transverse drive part exemplarily form at least a part of the structure of the drive assembly.
  • the positions of the magnet 5 and the coil 6 can be interchanged, that is, the coil 6 is located on the first surface A1 of the first circuit board 8, the magnet 5 is located on the third surface B1 of the second circuit board 10, and other magnetic first surfaces can also be used.
  • a driving part utilizes magnetic force to drive the second driving part to move laterally.
  • the top of the first bracket 12 is provided with an auto-focus motor 14, the auto-focus motor 14 can be a voice coil motor specifically, the inner side of the auto-focus motor 14 is provided with a lens 15, and the lens 15 along the optical axis of the auto-focus motor 14 is away from or close to the image Sensor 2, to adjust image distance, auto-focus motor 14 also can be other driving devices with longitudinal driving function, wherein, lens 15, infrared cut-off filter 13 and image sensor 2 are arranged in sequence along the optical axis direction, light enters by lens 15 Then pass through the infrared cut filter 13 and the image sensor 2 in sequence.
  • the infrared cut filter 13 can filter out the infrared interference in the environment.
  • the autofocus motor 14 is directly connected to the first bracket 12, and the suspension wire 16 supports the second bracket 11 on the first bracket 12, thereby realizing that the suspension wire 16 indirectly supports the second circuit board 10 on the lens 15 toward the image sensor 2 side.
  • the suspension wire 16 is not directly connected to the second bracket 11, which can save space on the surface of the second circuit board 10 (specifically, the third surface B1 hereinafter), and is beneficial to arrange more components or add image sensors on the third surface B1. 2 dimensions.
  • the first circuit board 8 and the second circuit board 10 are connected through the connecting component 4 to carry the wiring between the two circuit boards.
  • the driving assembly is not limited to the above-mentioned form, and the optical anti-shake motor is used as the lateral driving component instead of the combination of the magnet 5 and the coil 6 in the previous embodiment, and the optical anti-shake motor drives the second circuit board 10 to face each other in a direction parallel to the reference plane. Move on the first circuit board 8 .
  • the optical anti-shake motor and the suspension wire 16 are set independently, which is conducive to simplifying the structure of parts and reducing costs compared with integration.
  • the suspension wire can also be integrated with the optical anti-shake motor, and the optical anti-shake motor is connected (may be indirectly) to the side of the lens 15 facing the image sensor 2, and the optical anti-shake motor drives the suspension wire to move parallel to the reference plane, and the suspension wire Connect with the second bracket 11, support the second circuit board 10 on the optical anti-shake motor, the optical anti-shake motor is connected with the first bracket 12, the integration of the optical anti-shake motor and the suspension wire is beneficial to improve the integration and reduce the difficulty of assembly .
  • the optical anti-shake motor can also be replaced with other lateral driving components such as ceramic motors or SMA (shapememoryalloys, shape memory alloys), and the suspension wire can also be replaced with other supporting components such as shrapnel, silicon wafers and films.
  • lateral driving components such as ceramic motors or SMA (shapememoryalloys, shape memory alloys)
  • SMA shapememoryalloys, shape memory alloys
  • the suspension wire can also be replaced with other supporting components such as shrapnel, silicon wafers and films.
  • the driving assembly is used to support the second circuit board 10 on the side of the lens 15 close to the image sensor 2 and is used to drive the second circuit board 10 to move relative to the first circuit board 8 along a direction parallel to the reference plane.
  • connection assembly 4 In order to reduce the resistance caused by the material stress of the connection assembly 4 during the movement of the second circuit board 10 relative to the first circuit board 8 , possible specific forms of the connection assembly 4 are introduced below.
  • the first circuit board 8 has an opposite first surface A1 and a second surface A2, and an outer peripheral surface A4 connecting the first surface A1 and the second surface A2; and the first circuit board 8 has The first hollow part U1 passing through the first surface A1 and the second surface A2 along the direction perpendicular to the first surface A1, the first hollow part U1 is rectangular, when there is the first hollow part U1, through the second surface A2 is provided with a reinforcement plate 9, the reinforcement plate 9 covers the above-mentioned first hollow portion U1, and can seal the cover of the first hollow portion U1, thereby sealing the camera module and preventing dust from entering the camera module through the first hollow portion U1 , to prevent dust from affecting the imaging quality, and even reduce the life of the camera module, wherein the reinforcing plate 9 can be connected with the first circuit board 8 by thermocompression bonding, bonding, etc.; the second circuit board 10 has a third The surface B1 and the fourth surface B2, and the peripheral surface B3 connecting the third surface B1 and the fourth surface
  • the third when cutting to form the second circuit board 10, the utilization rate of the mother board is higher, and the leftovers produced are less and the first hollow part U1 is rectangular to match the shape of the second circuit board 10 to improve the space utilization rate of the first hollow part U1, and when processing the first hollow part U1, it is only necessary to
  • the first circuit board 8 is cut in two straight-line directions to reduce the difficulty of cutting; the four sides of the first surface A1 and the four sides of the second surface A2 are parallel to each other, wherein the first surface A1 is adjacent to each other perpendicular to each other.
  • one side is parallel to the X-axis
  • the other side is perpendicular to the Y-axis
  • the four sides of the third surface B1 and the four sides of the fourth surface B2 are parallel to each other and cooperate to form the outer circumference A second sub-side in the surface B3
  • the contour surface of the first hollow part U1 is marked as the inner peripheral surface A3
  • the inner peripheral surface A3 includes a first sub-side that is parallel to the four sides of the first surface A1 one by one
  • the orientation of the third surface B1 is the same as that of the first surface A1, and the orientation of the fourth surface B2 is the same as that of the second surface A2; wherein, part or all of the first circuit board 8 is placed in the first hollow part U1 , in order to reduce the space occupied in the direction of the optical axis, the four second sub-sides of the outer peripheral surface B3 are parallel to the four first sub-sides of the first hollow part U1 in one-to-one correspondence, forming a certain gap.
  • the orthographic projection of the second circuit board 10 on the reference plane is located within the range of the orthographic projection outer contour of the first circuit board 8 on the reference plane, preventing the second circuit board 10 from having part or all of its structures located on the first circuit board 8 in the direction of the reference plane.
  • the connecting assembly 4 includes flexible connecting strips 4e, 4f, 4g and 4h, one of the two ends of each flexible connecting strip is called the first end, and the other end is called the second end, and each flexible connecting strip is wound around the second circuit board.
  • the central axis L extends spirally, and the central axis L is perpendicular to the third surface B1, and when the third surface B1 is a centrosymmetric figure, the central axis L passes through the geometric center of the third surface B1, but it should be understood that the third surface B1 is different from the centrosymmetric figure Compared with allowing certain engineering errors, the first end of each flexible connecting strip is connected to the inner peripheral surface A3; specifically, the first end of the flexible connecting strip and the inner peripheral surface A3 can be integrally connected, directly using
  • Each flexible connection strip and the first circuit board 8 are formed in one piece, no additional connection structure is needed between the first end of the flexible connection strip and the inner peripheral surface A3, which reduces the space occupied in the XYZ direction and reduces the process flow,
  • the insulating layer of the flexible connecting strip and the insulating layer of the first circuit board 8 are formed simultaneously during injection molding, and the metal conductive layer of the flexible connecting strip and the first circuit board 8 are formed simultaneously.
  • the metal guide layer of the plate 8 is formed by etching the same unspliced metal; or, the first end of the flexible connecting strip and the inner peripheral surface A3 can also be formed by ACF (Anisotropic Conductive Film, anisotropic conductive film) ) process connection, wherein, compared with the traditional welding process, the welding temperature required by the ACF process is lower, which is conducive to avoiding the situation that the first circuit board 8 is scalded due to the higher welding temperature, or the flexible connection belt of the FPC is heated.
  • the above two situations will affect the positioning accuracy when the first circuit board 8 is connected to other devices; in addition, due to the ACF process, the anisotropic conductive adhesive film can not only realize the flexible connection made of FPC
  • the bonding between the tape and the first circuit board 8 can also achieve longitudinal electrical conduction, which is beneficial to the precise positioning of the flexible connecting tape made of FPC and the first circuit board 8 .
  • the second end is connected to the outer peripheral surface B3 through an anisotropic conductive adhesive film process or an integrated connection. For its function and effect, refer to the connection between the flexible connection belt and the first circuit board 8 described above.
  • each flexible connection Belt and first circuit board 8 and the connection mode of second circuit board 10 function, effect all can refer to the connection mode of aforementioned flexible connection belt and first circuit board 8;
  • the effect of the flexible connection of the two circuit boards 10 makes the second circuit board 10 have a degree of freedom to move in a direction parallel to the reference plane, and the first circuit board 8 and the second circuit board 8 can be connected by wiring on the flexible connecting strip 4e.
  • the circuit board 10 is electrically connected to achieve conduction; the flexible connecting strips 4e, 4f, 4g and 4h are located between the outer peripheral surface B3 and the four first sub-sides of the first hollow part U1, so that the flexible connecting strips 4e, 4f, 4g
  • the projections of 4h and 4h on the reference plane are located in the above-mentioned annular gap Q, so as to reduce the space occupied by the flexible connecting strips 4e, 4f, 4g and 4h in the direction of the optical axis.
  • the flexible connecting strips 4e, 4f, 4g and 4h all use flexible printed circuit boards (FPC, Flexible Printed Circuit). As for the reed, it basically has no elasticity.
  • the size of the second circuit board 10 can be directly increased. Even if the size of the flexible circuit board is reduced, it will not Increase the reset force of the second circuit board 10, on the contrary, the image sensor 2 becomes smaller, the size of the flexible circuit board increases, and the reset force of the second circuit board 10 will not be reduced, therefore, the overall size of the circuit board assembly can be kept substantially constant. Even if it is integrated with the size of the optical image stabilization motor, the size of the optical image stabilization motor can basically remain unchanged. Therefore, the size change of the image sensor 2 is not easy to cause the size change of other components, and the adaptation is more flexible.
  • the first end of the flexible connection strip 4e forms a first corner structure V1 bent from the extension direction of the flexible connection strip 4e to the first circuit board 8, and the second end forms a self-contained corner structure V1.
  • the extension direction of the flexible connecting strip 4e is bent toward the second corner structure V2 of the second circuit board 10.
  • the first corner structure V1 and the second corner structure V2 The middle part of the structure V2 first extends to the right, and then extends downward to connect with the second corner structure V2.
  • the first corner structure V1 bends to the upper first sub-side of the inner peripheral surface A3 of the first circuit board 8, and Connected with its middle position, the second corner structure V2 bends to the left to connect to the middle part (not necessarily the middle position) of the second sub-side on the right side of the outer peripheral surface B3 of the second circuit board 10, wherein the first corner structure V1 has It is beneficial for the flexible connection strip 4e to flexibly select the connection position with the corresponding first sub-side, instead of extending along a straight line. Similarly, the second corner structure V2 is conducive to the flexible connection strip 4e to flexibly select the connection with the corresponding second sub-side Location.
  • each flexible connecting strip is parallel to the reference plane (allowing for engineering errors) to the reference plane.
  • the reference plane allowing for engineering errors
  • the flexible connection strip 4e rotates 90°, 180° and 270° sequentially around the central axis L of the second circuit board 10 to obtain the flexible connection strips 4f, 4g and 4h respectively, so that every two adjacent flexible connection strips in the width direction (perpendicular to the extension direction of the flexible connecting strip and parallel to the reference plane) has no overlapping projections, which can prevent adjacent flexible connecting strips from interfering with each other.
  • the flexible connecting strip 4e has a strip-like structure with a small width, therefore, only a small material stress needs to be overcome when bending, and a plurality of flexible connecting strips can be respectively arranged to meet the total number of wiring; the flexible connection
  • the belt 4e is roughly L-shaped, and the flexible connecting belt 4e has a kink angle of approximately 90°. A certain degree of redundancy can be provided between the first end and the second end, and the overall length of the flexible connecting belt can be increased without increasing the lateral dimension, and the deformation amount per unit size can be reduced.
  • On the first circuit board 8 does not need to overcome relatively large resistance when moving in the direction in the XY plane relative to the second circuit board 10 .
  • the flexible connecting strip 4e it should be understood that it is not necessary for the flexible connecting strip 4e to be roughly L-shaped.
  • the flexible connecting strip 4e can also be It has the effect of reducing the resistance, but the flexible connecting strip 4e extending along the X direction or the Y direction in the form of FIG. 2a can ensure that the stress of the flexible connecting strip 4e is basically distributed along the direction in the XY plane.
  • the flexible connecting strip 4e includes multiple bending structures W1
  • the resistance required to overcome the deformation of the flexible connecting strip 4e can also be improved to be smaller, as long as the flexible connecting strip 4e includes at least one bending structure W1.
  • the first end of the flexible connecting band 4e is connected to a first sub-side of the inner peripheral surface A3 of the first hollow part U1, instead of setting a chamfer at the corner of the inner peripheral surface A3, and is connected to the chamfered position, so that the flexibility
  • the stress on the connecting strip 4e is distributed along two directions parallel to the reference plane and perpendicular to each other.
  • connecting assembly 4 includes 4 flexible connecting strips, and there may be 3, 5 or even more flexible connecting strips.
  • the flexible connecting strip is arranged between the inner peripheral surface A3 and the outer peripheral surface B3, and the second circuit board 10 can be hidden in the first hollow part U1 of the first circuit board 8, so that It is beneficial to reduce the thickness of the circuit board assembly.
  • the difference from Fig. 2a to Fig. 2c is that the flexible connecting strips 4e and 4g are respectively replaced by flexible connecting strips 4e' and 4g', and the flexible connecting strips 4e' and the flexible connecting strips 4f are related to the second circuit board 10.
  • the axis of symmetry parallel to the X direction is symmetrical, and the flexible connection strip 4g' and the flexible connection strip 4h are symmetrical about the axis of symmetry parallel to the X direction of the second circuit board 10.
  • This distribution form of the connection components 4 is beneficial to each flexible connection strip
  • the symmetry of stress distribution is conducive to balance.
  • each second sub-side of the outer peripheral surface B3 is connected with two flexible connecting bands, such as the upper side is connected with the flexible connecting bands 4e' and 4h, and the lower side is connected with the flexible connecting bands 4f and 4g', so as to increase the The amount of wires on the two oppositely arranged second sub-sides, and it can be known that the flexible connecting bands 4e' and 4h are arranged symmetrically with the flexible connecting bands 4f and 4g' in a one-to-one correspondence with respect to the symmetry axes of the upper side and the lower side, It is beneficial to improve the force balance of the second circuit board 10, wherein the number of flexible connecting bands connecting the upper side and the lower side is not limited to 2, but can be more than 2, such as 3 or 4.
  • each second sub-side is connected with two or more flexible connecting bands, it is beneficial to increase the amount of wires on the second sub-side, thereby increasing the The bonding strength between the second sub-sides and the flexible connecting strip, and the relative arrangement of the two second sub-sides with a large amount of outgoing wires is beneficial to the force balance of the second circuit board.
  • the difference is that the second end of the flexible connecting band 4a is bent to the second corner structure V2 of the first sub-side on the right side of the outer peripheral surface B3 and the second corner structure V2 on the right side of the outer peripheral surface B3 of the second circuit board 10 .
  • the upper ends of the two sub-sides are connected, and extend downward and then to the left until the first end of the flexible connecting band 4a is close to the lower end of the first sub-side on the left side of the inner peripheral surface A3 of the first hollow part U1. location connection.
  • the structure of the connection assembly 4 overlaps every two adjacent flexible connection strips in the width direction.
  • “Width direction” refers to the direction parallel to the reference plane and perpendicular to the extension direction of the flexible connection strips, but it is beneficial to increase the width of each flexible connection strip.
  • the length of the flexible connecting band reduces the deformation amount of a single cross-sectional area and reduces the resistance during deformation.
  • the flexible connecting strips 4b, 4c and 4d have a similar structure to the flexible connecting strip 4a, and are connected in a similar manner.
  • the flexible connecting strip 4a is rotated 90°, 180° and 270° around the axis of the geometric center of the second circuit board 10, respectively. Flexible connection strips 4b, 4c and 4d are obtained.
  • the included angles between the first end and the second end of each flexible connecting band and the line connecting the central axis L are between 90° and 180°, specifically 90°, 95° , 100°, 120°, 150°, 175° or 180°, wherein the above-mentioned included angle corresponding to the flexible connecting strip 4a is about 175°, so as to ensure that two adjacent flexible connecting strips can overlap in the width direction, and Do not overlap with the third flexible connecting belt in the width direction, and avoid excessively increasing the size occupied by the camera flexible connecting belt in the direction of the reference plane.
  • the difference from Figures 2a to 2c is that, along the normal direction of the reference surface (in this figure, the direction of the optical axis), the second surface A2 is located on the side of the fourth surface B2 away from the third surface B1 One side; the fourth surface B2 is dislocated relative to the second surface A2 along the direction of the optical axis to the direction of the plane where the third surface B1 is located, so that the plane where the fourth surface B2 is located is located between the plane where the second surface A2 is located and the plane where the third surface B1 is located Between the planes, in this way, the fourth surface B2 is concave relative to the second surface A2, and can accommodate the connection assembly 4.
  • the connection assembly 4 includes flexible connection strips 4q, 4r, 4s and 4t, and the flexible connection strips 4q, 4r, 4s and 4t
  • the structure of can refer to the flexible connection strips 4a, 4b, 4c and 4d in turn. Take the flexible connecting strip 4q and the flexible connecting strip 4a as an example to illustrate the difference.
  • the flexible connecting strip 4q is attached (only kept attached, not fixed by bonding) on the fourth surface B2, and the second end (refer to position J) is attached to the fourth surface B2.
  • the fourth surface B2 is fixed and electrically connected (the flexible connecting strip 4r will be used as an example later, and the way of fixing and electrically connecting here will be described in conjunction with FIG.
  • the first end (refer to position I) and the inner peripheral surface A3 A first sub-side connection is no longer located in the gap between the outer peripheral surface B3 and the inner peripheral surface A3, wherein at least the orthographic projection of the bending structure W2 of the flexible connecting band 4q on the reference plane is located on the fourth surface B2 In the orthographic projection on the reference plane, at this time, the gap between the outer peripheral surface B3 and the inner peripheral surface A3 can be reduced, and the size of the second circuit board 10 can be increased without increasing the overall size of the circuit board assembly.
  • the flexible connecting band need not be arranged in the annular gap between the inner peripheral surface A3 and the outer peripheral surface B3, the second end and the fourth surface B2
  • the flexible connecting strip 4q has multiple bending structures W2, as long as it is ensured that the orthographic projections of the above-mentioned multiple bending structures W2 on the reference plane overlap at least partially with the orthographic projection of the fourth surface B2 on the reference plane, the reduction can be achieved.
  • the flexible connecting strips 4r, 4s and 4t have similar deformations with respect to the flexible connecting strips 4b, 4c and 4d respectively.
  • the end surface of the first end of the flexible connecting strip 4r is connected to the inner peripheral surface A3.
  • the thickness dimension of the flexible connecting strip 4r is smaller than the thickness dimension of the first circuit board 8, and the flexible connecting strip 4r is interposed between the second surface A2 and the second surface A2.
  • the flexible connection strip 4r is hidden in the accommodation space formed by the fourth surface B2 being concave relative to the second surface A2 in the normal direction of the reference plane, without occupying additional space normal to the reference plane.
  • the minimum distance h2 from the first end of the flexible connecting strip 4r to the second surface A2 is smaller than the minimum distance h1 from the first end to the first surface A1, so that the inner peripheral surface of the first hollow part U1 A wide dimension h1 is reserved between the first end and the first surface A1 to be opposite to the outer peripheral surface B3, which is beneficial to reduce the overall thickness of the circuit board assembly and ensure flexible connection.
  • connection pad E1 is provided between the second end of the flexible connection strip 4r and the fourth surface B2.
  • the connection pad E1 can be a metal sheet or a metal solder, and the second end of the flexible connection strip 4r can be connected to the second end of the flexible connection strip 4r.
  • the terminal is fixed and electrically connected to the pad on the fourth surface B1.
  • the connection pad E1 raises the second end of the flexible connection strip 4r, so that the part between the first end and the second end of the flexible connection strip 4r can have a certain distance from the fourth surface B2, so that the flexible connection strip 4r can be deformed more flexibly.
  • the difference from Figures 2a to 2c is that along the normal direction of the reference surface (in this figure, the direction of the optical axis), the third surface B1 is higher than the first surface A1, where the third surface B1 is The plane is located on the side of the first surface B1 away from the second surface A2, and the positional relationship between the first circuit board 8 and the second circuit board 10 in Figures 6a to 6b is the same as that in Figures 5a to 5b, specifically, The first circuit board 8 and the second circuit board 10 have the same thickness, and the second circuit board 10 moves along the direction of the second surface A2 pointing to the first surface A1 for a part distance, which is less than the board thickness of the first circuit board 8 .
  • the connecting assembly 4 includes flexible connecting strips 4i, 4j, 4k and 4l.
  • the structures of the flexible connecting strips 4i, 4j, 4k and 4l can be referred to in turn for the flexible connecting strips 4e, 4f, 4g and 4h in FIGS. 2a to 2c, but also Other configurations are possible.
  • the second end of the flexible connecting strip 4i is connected to a second sub-side of the outer peripheral surface B3, which is convenient to reduce the thickness in the direction perpendicular to the reference plane, and the bending structure W3 of the flexible connecting strip 4i is in line with
  • the first surface A1 is attached, and the first end is bonded to the first surface A1 by means of bonding, instead of being connected to the inner peripheral surface A3, so the operable space is large, the process difficulty is reduced, and the yield rate is improved.
  • the flexible connecting strip 4i has multiple bending structures W3
  • the size of the flexible connecting belt can be increased, therefore, its softness is further improved, and the resistance is reduced.
  • the second circuit board It is more flexible to move in the XY plane.
  • the fourth surface B2 is located between the first surface A1 and the second surface A2 in the normal direction of the reference surface, which is beneficial to provide an accommodation space on the side of the fourth surface B2 away from the third surface B1, and some elements can be set. device.
  • the end surface of the second end of the flexible connection strip 4k is connected to the outer peripheral surface B3, wherein it can be integrally formed with the second circuit board 10, along the normal direction of the reference surface (here is the direction of the optical axis L), the thickness of the flexible connecting strip 4k is less than the thickness of the second circuit board 10, and the flexible connecting strip 4k is between the first surface and the third surface B1 of A1, so that the flexible connecting strip 4k is on the reference surface
  • connection pad E2 is provided between the first end of the flexible connection strip 4k and the first surface A1, the connection pad E2 can be a metal sheet, or a metal solder, and the first end of the flexible connection strip 4k can be The terminal is fixed and electrically connected to the pad on the first surface A1.
  • the connection pad E2 raises the first end of the flexible connection strip 4k, so that the part between the first end and the second end of the flexible connection strip 4k can have a certain distance from the first surface A1, so that the flexible connection strip 4k can be deformed more flexibly.
  • the structure of the flexible connecting strip can have some deformations
  • the connecting assembly 4 comprises flexible connecting strips 4m, 4n, 4o and 4p, the setting positions of the flexible connecting strips 4m, 4n, 4o and 4p Refer to the flexible connecting strips 4i, 4j, 4k and 4l in Fig. 6a to Fig. 6c for the connection method at both ends, but refer to 4q, 4r, 4s and 4t in Fig. 4 for the winding structure.
  • a second hollow part U2 extending along the extending direction of the flexible connecting strip is provided in the middle of each flexible connecting strip (such as 4q), and the second hollow part U2 is distributed in a strip shape
  • the middle position of the flexible connecting strip can reduce the width of the flexible connecting strip in the direction parallel to the reference plane, so as to improve the softness of the flexible connecting strip and reduce the resistance to be overcome when it is deformed.
  • the first circuit board 8 has a first hollow part U1, and, in the normal direction of the reference plane, the second circuit board 10 at least partially extends into the first hollow part U1 so that in a direction parallel to the reference plane, the outer peripheral surface B3 of the second circuit board 10 is at least partially opposite to the inner peripheral surface A3 surrounding the first hollow portion U1, that is, in a direction parallel to the reference plane
  • the projection of the upper second circuit board 10 at least partially overlaps the projection of the first circuit board 8 .
  • the first circuit board 8 and the second circuit board 10 are arranged side by side along the optical axis direction, instead of the second circuit board 10 being partially or completely arranged in the first hollow part U1 of the first circuit board 8 .
  • the fourth surface B2 is located on a side where the plane of the first surface B1 is away from the plane of the second surface A2, and the plane of the fourth surface B2 is opposite to the plane of the second surface A2.
  • the flexible connecting strip (such as 4q) extends to the first surface A1; in the middle of each flexible connecting strip (such as 4q), there is a second hollow part U2 extending along the extending direction of the flexible connecting strip, and the second hollow part U2 is in the shape of a strip.
  • the flexible connecting strip is not limited in the hollow structure U1 , and has a greater degree of freedom of movement, which is beneficial to further increase the degree of freedom of the second circuit board 10 .
  • the structural strength of the first circuit board 8 is greater.
  • the lateral movable space of the second circuit board 10 is no longer limited to the first hollow part U1, but expanded to the entire area of the first circuit board 8, which is beneficial to further improve the anti-shake performance.
  • the size of the second circuit board 10 is not limited to the first hollow part U1, but only needs to be smaller than the first circuit board 8, which means that a larger second circuit board 10 can be provided, which is conducive to placing the third surface B1 more Large image sensor2.
  • Fig. 8c the difference from Fig. 8b is that there is no second hollow part U2, which is beneficial, and the orthographic projection of each flexible connecting strip on the reference plane is completely within the range of the orthographic projection of the third surface on the reference plane.
  • a first hollow part U1 is added at the position where the first circuit board 8 is opposite to the second circuit board 10, but the first circuit board 8 is not located therein, and the first hollow part U1 can achieve weight reduction. Effect.
  • the resistance of the second circuit board 10 to move in the direction in the XY plane can be reduced under the condition of additionally occupying the space in the direction in the XY plane: the plane where the second surface A2 is located and the plane where the third surface B1 is located Arranged facing each other; the first end of each flexible connecting strip is connected to the second surface A2, the second end is connected to the third surface B1, and the orthographic projection of the multiple bending structures of the flexible connecting strip on the reference plane is consistent with the second surface
  • the orthographic projections of A2 on the reference plane overlap at least partially.
  • a circuit board assembly which includes the first circuit board 8, the second circuit board 10 and the connection assembly in the aforementioned camera module embodiment, its structure and effect can refer to the aforementioned implementation Description of the example.
  • an electronic device which can be a mobile phone or a tablet computer, which includes the camera module provided in the foregoing embodiment.
  • the camera module provided in the foregoing embodiment.
  • the effect of the prior art please refer to the effect of the embodiment of the camera module analyze.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

本发明涉及成像装置技术领域，公开一种电路板组件、摄像模组及电子设备，该电路板组件包括：第一电路板、第二电路板和多个柔性连接带；第一电路板具有相对的第一表面和第二表面；第二电路板具有相对的第三表面和第四表面，以及，连接第三表面和第四表面的外周面，第三表面的朝向与第一表面的朝向相同，第四表面的朝向与第二表面的朝向相同，第三表面和第四表面均为矩形，以便于与图像传感器的形状适配；参考面为第一表面所在平面；柔性连接带为柔性电路板，且具有至少一个弯折结构，有一定冗余度，可减小变形阻力，柔性连接带第一端与第一电路板通过ACF工艺或一体式连接、第二端与第二电路板通过ACF工艺或一体式连接。

Description

一种电路板组件、摄像模组及电子设备 技术领域
本发明涉及成像装置技术领域，特别涉及一种电路板组件、摄像模组及电子设备。
背景技术
摄像模组一般包括镜头和图像传感器，镜头位于图像传感器的成像面一侧，由镜头进入的光线到达图像传感器的成像面，在成像面成像。
图像传感器安装于活动电路板上，活动电路板相对于固定电路板横向(垂直于光轴的方向上)移动，以能够实现芯片防抖的效果。活动电路板和固定电路板之间通过软板连接，为保证足够的走线宽度，目前，软板宽度设计的比较大，在活动电路板横向移动时会带来一定的阻力，不利于提高模组的响应速度，以及降低整体的横向尺寸。如何在保持电连接的前提下降低活动电路板的阻力并实现模组小型化已经成为了当下亟待解决的问题。
发明内容
本发明公开了一种电路板组件、摄像模组及电子设备，用于在不增加横向尺寸的前提下，降低第二电路板横向移动时的阻力。
为达到上述目的，本发明提供以下技术方案：
第一方面，提供一种电路板组件，该电路板组件包括：第一电路板、第二电路板和多个柔性连接带；所述第一电路板具有相对的第一表面和第二表面；所述第二电路板具有相对的第三表面和第四表面，以及，连接所述第三表面和所述第四表面的外周面，所述第三表面的朝向与所述第一表面的朝向相同，所述第四表面的朝向与所述第二表面的朝向相同，所述第三表面和所述第四表面均为矩形，第一，当所述电路板组件与图像传感器组装时，便于与图像传感器的形状适配，第二，当以剪裁成型的方式形成第二电路板时， 仅需沿垂直的两个方向的轨迹剪裁母板，相对于沿曲线或不规则轨迹剪裁有利于降低剪裁难度，第三，在剪裁形成第二电路板时，母板的利用率较高，产生的边角料较少；且所述第三表面设有用于与图像传感器固定并电连接的电连接结构，以便于通过该电连接结构将图像传感器固定并电连接于与第三表面；所述第二电路板在参考面上的正投影位于所述第一电路板在所述参考面上的正投影外轮廓的范围内，以避免第二电路板在平行于参考面的方向上额外占用空间，减小电路板组件在垂直于光轴的方向上的尺寸，其中，所述参考面为所述第一表面所在平面；所述柔性连接带为柔性电路板，并具有至少一个弯折结构，且所述柔性连接带的第一端与所述第一电路板通过异方性导电胶膜工艺或一体式连接、第二端与所述第二电路板通过异方性导电胶膜工艺或一体式连接，以实现所述第一电路板和所述第二电路板的柔性连接和电连接，其中，柔性连接带呈带状，第二电路板相对于第一电路板横向移动时，柔性连接带变形时仅需要克服较小的材料应力，且由于柔性连接带具有折弯结构，产生一定冗余度，在不增大横向尺寸的前提下能增加柔性连接带的整体长度，减小单位尺寸下的形变量，可以进一步减小柔性连接带变形时的阻力；当柔性连接带选取为柔性电路板时，该柔性电路板起到将第一电路板和第二电路板柔性连接和电连接的作用，基本不具有弹性，当图像传感器的尺寸发生变化，例如尺寸增加，可以直接通过增加第二电路板的尺寸，柔性电路板的尺寸即便因此缩小，也基本不会影响第二电路板的弹性复位力，因此，电路板组件整体尺寸可以基本保持不变，即便与光学防抖马达尺寸相关地集成，光学防抖马达的尺寸也可以基本保持不变，从而，图像传感器的尺寸变化不易引起其它部件的尺寸变化，适配更灵活。
柔性连接带连接第一电路板和第二电路板的方式可以有多种，在一个具体的可实施方案中，所述第一电路板中部具有第一镂空部；沿平行于所述参考面的方向，所述第二电路板的外周面至少部分地与围成所述第一镂空部的内周面相对设置，所述第一电路板与所述第二电路板在所述参考面上的正投影之间存在环形间隙；通过将第二电路板至少部分隐藏于第一镂空部内，可 以减小电路板组件在垂直于参考面的方向上占用的空间。
在一个具体的可实施方案中，所述第一镂空部呈矩形，以与第二电路板的形状相适配，提高第一镂空部的空间利用率，并且在加工第一镂空部时，仅需沿相互垂直的两个直线方向剪裁，降低剪裁难度，围成所述第一镂空部的内周面具有与所述第一表面的每条侧边一一对应的第一子侧面；所述柔性连接带的第一端与一个所述第一子侧面连接，以使柔性连接带所受应力均沿平行于参考面且相互垂直的两个方向分布。
在一个具体的可实施方案中，每个所述柔性连接带的第一端形成有自所述柔性连接带的延伸方向向所述第一电路板弯折的第一拐角结构，以便于灵活设置柔性连接带的第一端与第一子侧面的连接位置。
在一个具体的可实施方案中，每个所述柔性连接带在所述参考面上的正投影均位于所述环形间隙内；每个所述柔性连接带的第二端与所述外周面连接，以减少柔性连接带在垂直于参考面方向上的占用空间。
其中，在一个更具体的可实施方案中，所述外周面具有与所述第一表面的每条侧边一一对应的第二子侧面；相对的两个所述第二子侧面中，每个所述第二子侧面至少与两个所述柔性连接带连接，以增加该相对的两个第二子侧面的出线量，从而增加该第二子侧面与柔性连接带的接合强度；并且，上述增加出线量的两个第二子侧面是相对的，可以提高第二电路板的受力平衡程度。
在所述相对的两个所述第二子侧面中，分别与两个所述第二子侧面连接的柔性连接带一一对应地关于两个所述第二子侧面的对称轴对称，以使第二电路板可以进一步地平衡地受力。
在一个具体的可实施方案中，每个所述柔性连接带的第二端形成有自所述柔性连接带的延伸方向向所述第二电路板弯折的第二拐角结构，以便于灵活设置柔性连接带的第二端与第二子侧面的连接位置。
可选地，沿所述参考面的法向方向上，所述第二表面位于所述第四表面远离第三表面的一侧；沿所述参考面的法向方向上，所述柔性连接带位于所 述第四表面远离所述第三表面的一侧，每个所述柔性连接带的多个所述弯折结构在所述参考面上的正投影与所述第四表面在所述参考面上的正投影至少部分重叠，且通过所述第一端与围成所述第一镂空部的内周面连接、并通过所述第二端与所述第四表面连接，以在不改变电路板组件的整体尺寸的前提下，增加第二电路板的尺寸，便于设置更大尺寸的图像传感器。
可选地，沿所述参考面的法向上，所述柔性连接带的厚度小于所述第一电路板的厚度，所述柔性连接带介于所述第二表面和所述第四表面之间，不额外再占用参考面法向上的额外空间；且，所述第一端连接于所述内周面，且所述第一端至所述第二表面的最小距离小于所述第一端至所述第一表面的最小距离，以便于在内周面上该第一端与第一表面之间预留较宽的尺寸来与第一镂空部的外周面相对设置，有利于降低电路板组件的厚度，并且，确保柔性连接。
可选地，所述第三表面高于所述第一表面；沿所述参考面的法向方向上，所述柔性连接带位于所述第一表面背离所述第二表面的一侧，每个所述柔性连接带的第二端与所述外周面连接，且所述柔性连接带的多个所述弯折结构在所述参考面上的正投影与所述第一表面至少部分重叠，且通过所述第一端与所述第一表面连接。以在不改变电路板组件的整体尺寸的前提下，增加第二电路板的尺寸，便于设置更大尺寸的图像传感器。
可选地，沿所述参考面的法向上，所述柔性连接带的厚度小于所述第二电路板的厚度，且所述柔性连接带介于所述第一表面和所述第三表面之间，不额外再占用参考面法向上的额外空间；且，所述第二端连接于所述外周面，所述第二端至所述第三表面的最小距离小于所述第二端至所述第四表面的最小距离。以便于在外周面上该第二端与第四表面之间预留较宽的尺寸来与第一镂空部的内周面相对设置，有利于降低电路板组件的厚度，并且，确保柔性连接。
可选地，所述第一表面所在平面与所述第四表面所在平面相向设置；每个所述柔性连接带的第一端与所述第一表面连接、第二端与所述第四表面连 接，且所述柔性连接带的多个所述弯折结构在所述参考面上的正投影与所述第四表面在所述参考面上的正投影至少部分重叠。可以避免在第一电路板开孔，提高第一电路板的结构稳定性，并且降低工艺难度，并且，第二电路板直接起到密封作用，可以免去在第一电路板的第二表面一侧设置保强板。
可选地，在每个所述柔性连接带中部设有沿所述柔性连接带延伸方向延伸的第二镂空部，如此能降低柔性连接带的在平行于参考面方向上的宽度，以提高柔性连接带的柔软度，降低其变形时所需克服的阻力。
在一个具体的可实施方案中，每个所述柔性连接带沿平行于所述参考面的方向延伸，以便于在柔性连接带平行于参考面的表面上设置较多的走线，相对于在垂直于参考面的表面上设置走线，走线不至于发生拧转而易断裂。
在一个具体的可实施方案中，每个所述柔性连接带绕所述第二电路板的中心轴线螺旋延伸，所述中心轴线垂直于所述第三表面，且经过所述第三表面的几何中心；且，每个柔性连接带在宽度方向上的投影与另一个所述柔性连接带在宽度方向上的投影有交叠，其中，所述宽度方向是指平行于所述参考面且垂直于所述柔性连接带的延伸方向的方向，有利于增加柔性连接带的长度，从而，当柔性连接带变形时每个横截面的形变量减少，从而，有利于降低柔性连接带变形时的阻力。
在一个具体的可实施方案中，每个所述柔性连接带的第一端和第二端分别与所述中心轴线的连线夹角介于90°至180°之间，其中，所述连线平行于所述参考面。以确保相邻两个柔性连接带在宽度方向上可以有重叠，且不至于与第三个柔性连接带在宽度方向上有重叠，避免过度增加摄像柔性连接带在参考面方向占用的尺寸。
第二方面，提供一种摄像模组，该摄像模组包括镜头、图像传感器、驱动组件和上述任一项技术方案所述的电路板组件，其中，所述图像传感器设置于第三表面，并通过所述电连接结构与所述第二电路板电连接，所述镜头设置于所述图像传感器背离所述第二电路板的一侧；所述驱动组件用于将所述第二电路板支撑于所述镜头靠近所述图像传感器的一侧、并用于驱动所述 第二电路板沿平行于参考面的方向相对于所述第一电路板移动，以实现防抖功能。
在上述摄像模组中，驱动组件将第二电路板支撑于镜头，便于第二电路板具有横向移动的灵活度，且可以驱动第二电路板沿平行于参考面的方向移动，实现防抖功能；图像传感器通过电连接结构实现与第二电路板电连接，经过镜头进入的光线可以入射至图像传感器成像。
可选地，所述驱动组件包括：支撑部件和横向驱动部件，所述横向驱动部件连接于所述镜头靠近所述图像传感器的一侧、并用于将所述支撑部件沿平行于所述参考面的方向相对于所述第一电路板移动，所述支撑部件用于将所述第二电路板支撑于所述横向驱动部件，有利于提高集成度，降低组装难度。
可选地，所述驱动组件包括：支撑部件和横向驱动部件；其中，所述支撑部件用于将所述第二电路板支撑于所述镜头靠近所述图像传感器的一侧；所述横向驱动部件用于驱动所述第二电路板沿平行于参考面的方向相对于所述第一电路板移动，支撑部件和横向驱动部件独立设置，有利于分别制造，降低零部件成本。
可选地，所述横向驱动部件包括线圈和磁铁，其中，所述线圈设置于所述第二电路板，所述磁铁设置于所述第一电路板；或者，所述磁铁设置于所述第二电路板，所述线圈设置于所述第一电路板；所述线圈用于与所述磁铁相吸或相斥，以带动第二电路板在平行于参考面的方向相对于第一电路板移动。
可选地，所述横向驱动部件包括光学防抖马达，光学防抖马达具有良好的防抖作用，所述支撑部件包括悬丝，悬丝可以具有一定的支撑作用，并使活动电路板在横向上具有一定自由度。
可选地，所述摄像模组还包括滤片支架和红外截止滤波片，所述红外截止滤波片位于所述镜头和所述图像传感器之间，且所述滤片支架将所述红外截止滤波片支撑于所述第三表面上；所述支撑部件连接于所述镜头和所述滤 片支架之间。支撑部件利用滤片支架间接与第二电路板连接，有利于减少占用第三表面的面积。
可选地，所述摄像模组还包括金线，所述图像传感器通过所述金线与所述电连接结构电连接，实现图像传感器与电连接结构的导通。
可选地，当所述第一电路板设有所述第一镂空部时，所述摄像模组还包括保强板，所述保强板设置在所述第一电路板背离所述镜头的表面，且所述保强板覆盖所述镂空结构，以防止灰尘通过第一镂空部进入摄像模组。
第三方面，提供一种电子设备，该电子设备包括壳体及上述技术方案提供的摄像模组，所述摄像模组设置于所述壳体内。
与现有技术相比，所述电子设备与所述的摄像模组所具有的优势相同，在此不再赘述。
附图说明
图1为本申请实施例提供的第一种摄像模组的剖视图；
图2a至图2c表示出图1所示实施例中第一种电路板组件的结构示意图；
图3表示出图1所示实施例中第二种电路板组件的结构示意图；
图4表示出图1所示实施例中第三种电路板组件的结构示意图；
图5a至图5c表示出图1所示实施例中第四种电路板组件的结构示意图；
图5d为图5c中R1处局部放大图；
图5e为图5c中R2处局部放大图；
图6a至图6c表示出图1所示实施例中第五种电路板组件的结构示意图；
图6d为图6b中R3处局部放大图；
图6e为图6b中R4处局部放大图；
图7a表示出图1所示实施例中第六种电路板组件的结构示意图；
图7b表示出图1所示实施例中第七种电路板组件的结构示意图；
图8a为本申请实施例提供的第二种摄像模组的剖视图；
图8b表示出图8a所示实施例中第一种电路板组件的结构示意图；
图8c表示出图8a所示实施例中第二种电路板组件的结构示意图；
图8d表示出图8a所示实施例中第三种电路板组件的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。本申请实施例中的“上”、“下”、“左”和“右”等方位词均是指在相应附图中的相应方向。应当理解，图1仅意在表示出摄像模组的整体框架结构，电路板组件的具体结构并不完全一一地与图2a至图2c、图3、图4、图5a至图5e、图6a至图6e、以及图7a至图7b中的电路板组件结构一致，电路板组件的具体结构以图2a至图2c、图3、图4、图5a至图5e、图6a至图6e、以及图7a至图7b中的电路板组件结构为准。并且，下述实施例中，“垂直”和“平行”等方位关系词均允许存在工程上允许的误差。各附图中，除了图1和图8a以外，其余各图中的填充均不表示剖面，仅用于表示实体结构，以与镂空等虚体结构区分。
下面首先介绍本申请实施例提供的摄像模组。
参考图1，摄像模组包括电路板组件，电路板组件包括第一电路板8、第二电路板10和连接组件4。第一电路板8作为固定电路板，中部设有第一镂空部U1；第二电路板10作为活动电路板，位于第一镂空部U1中，图像传感器2通过胶水1粘结在第二电路板10的表面，图像传感器2通过金线7与第二电路板10连接，具体地，电路板组件还包括设置在第二电路板10表面(具体是后文提出的第三表面B1)的电连接结构，该电连接结构可以是分散分布地多个焊盘，金线7通过与焊盘连接实现与第二电路板10的电连接，但电连接结构的具体形式并不限于焊盘，也可以是其它具有电连接作用的结构，第二电路板10上还可以设有电容电感等电子器件17；第一电路板8和第二电路板10的底侧设有保强板9，保强板9具有保强和模组密封的作用。第一电路板8上倒扣有槽状 的第一支架12，第一支架12的竖直部分沿第一电路板8的边缘延伸，第二电路板10上倒扣有槽状的第二支架11，第二支架11的竖直部分沿第二电路板10的边缘延伸，第一支架12与第二电路板10相对的位置设有开口，第二支架11与图像传感器2相对的位置设有开口，第二支架11的上述开口处设有红外截止滤波片13；且第二支架11向内侧延伸至与第一支架12相对的位置，第二支架11与第一支架12之间通过悬丝16连接，悬丝16作为支撑部件主要起到支撑作用，将第二电路板10支撑于镜头15靠近图像传感器2的一侧，只是此“支撑”为间接支撑，除了采用悬丝外，也可以采用弹片、硅片和薄膜等其它具有支撑作用的支撑结构。第一电路板8的边缘设有磁铁5，磁铁5位于第一电路板8靠近镜头15的面(第一表面A1)，且第一支架12内侧，第二电路板10的第三表面B1的边缘设有线圈6，线圈6位于第二支架11内侧。磁铁5和线圈6组成横向驱动部件的至少部分结构，支撑部件和横向驱动部件示例性地组成驱动组件的至少一部分结构，同时具有横向驱动和支撑作用，通过磁铁5和线圈6之间的洛伦兹力相吸或相斥驱动第二电路板10沿平行于参考面的方向相对于第二电路板10移动，该参考面可以是第一电路板8背离保强板9的面(后文的第一表面A1)所在平面，其中，可以通过改变线圈6的通电电流方向实现磁铁5和线圈6相吸或相斥的切换。其中，磁铁5和线圈6的位置可以互换，即线圈6位于第一电路板8的第一表面A1，磁铁5位于第二电路板10的第三表面B1，也可以利用其它具有磁性的第一驱动件利用磁力驱动第二驱动件横向移动。
第一支架12的上方设有自动对焦马达14，自动对焦马达14具体可以为音圈马达，该自动对焦马达14内侧设有镜头15，自动对焦马达14沿光轴方向的镜头15远离或者靠近图像传感器2，以调节像距，自动对焦马达14也可以是其它具有纵向驱动功能的驱动装置，其中，镜头15、红外截止滤波片13和图像传感器2沿光轴方向依次排列，光线由镜头15进入后依次经过红外截止滤波片13和图像传感器2。红外截止滤波片13可以滤除环境中的红外线干扰。自动对焦马达14与第一支架12直接连接，悬丝16将第二支架11支撑于第一支架12，从而，实现了悬丝16将第二电路板10间接地支撑于镜头15朝向图像传感器2的 一侧。悬丝16没有直接与第二支架11连接，可以节省第二电路板10表面(具体为后文的第三表面B1)的空间，有利于在第三表面B1多布置其余元器件或增加图像传感器2的尺寸。
为了实现第一电路板8和第二电路板10之间的导通，第一电路板8和第二电路板10通过连接组件4连接，以承载两个电路板之间的走线。
其中，驱动组件不限于上述形式，利用光学防抖马达作为横向驱动部件，替代前述实施例中磁铁5和线圈6的组合，光学防抖马达驱动第二电路板10沿平行于参考面的方向相对于第一电路板8移动。光学防抖马达和悬丝16分别独立设置，相对于集成，有利于简化零部件结构，降低成本。
但是，悬丝也可以集成与光学防抖马达中，光学防抖马达连接(可以是间接)于镜头15朝向图像传感器2的一侧，光学防抖马达驱动悬丝平行于参考面运动，悬丝与第二支架11连接，将第二电路板10支撑于光学防抖马达，光学防抖马达与第一支架12连接，光学防抖马达和悬丝集成于一体有利于提高集成度，降低组装难度。
光学防抖马达也可以替换为陶瓷马达或SMA(shapememoryalloys，形状记忆合金)等其它横向驱动部件，悬丝还可以替换为弹片、硅片和薄膜等其它支撑部件。
总之，驱动组件用于将第二电路板10支撑于镜头15靠近图像传感器2的一侧、并用于驱动的、第二电路板10沿平行于参考面的方向相对于第一电路板8移动。
为了减小第二电路板10相对于第一电路板8移动的过程中连接组件4因材料应力带来的阻力，下面对连接组件4可能的具体形式分别进行介绍。
结合图2a至图2c，第一电路板8具有相对的第一表面A1和第二表面A2，以及，连接第一表面A1和第二表面A2的外周面A4；而该第一电路板8具有沿垂直于第一表面A1的方向贯穿第一表面A1和第二表面A2的第一镂空部U1，该第一镂空部U1呈矩形，当具有该第一镂空部U1时，通过在第二表面A2设置保强板9，保强板9覆盖上述第一镂空部U1，可以密封盖第一镂空部U1，从而，密 封摄像模组，可以防止灰尘由该第一镂空部U1进入摄像模组内，避免尘埃影响成像质量，甚至降低摄像模组的寿命，其中，保强板9可以通过热压接、粘结等方式与第一电路板8连接；第二电路板10具有相对设置的第三表面B1和第四表面B2，以及，连接第三表面B1和第四表面B2的外周面B3；第一表面A1和第二表面A2均呈矩形；第三表面B1和第四表面B2均呈矩形；第一，当图像传感器2与第三表面B1组装时，便于与图像传感器2的形状适配，节省空间；第二，当以剪裁成型的方式形成第二电路板10时，仅需沿垂直的两个方向的轨迹剪裁母板，相对于沿曲线或不规则轨迹剪裁有利于降低剪裁难度，第三，在剪裁形成第二电路板10时，母板的利用率较高，产生的边角料较少；而第一镂空部U1呈矩形，以与第二电路板10的形状相适配，提高第一镂空部U1的空间利用率，并且在加工第一镂空部U1时，仅需沿相互垂直的两个直线方向剪裁第一电路板8，降低剪裁难度；第一表面A1的四个边和第二表面A2的四个边一一对应平行，其中，以第一表面A1相互垂直的相邻侧边中，一个侧边平行于X轴，另一个侧边垂直于Y轴，第三表面B1的四个侧边和第四表面B2的四个侧边一一对应的平行、并配合形成外周面B3中的一个第二子侧面，且第一镂空部U1的轮廓面记为内周面A3，内周面A3包括与第一表面A1的四条侧边一一对应平行的第一子侧面；第三表面B1的朝向与第一表面A1的朝向相同，第四表面B2的朝向与第二表面A2的朝向相同；其中，将第一电路板8部分或全部的放置于第一镂空部U1内，以减小在光轴方向上占用空间，外周面B3中的四个第二子侧面与第一镂空部U1的四个第一子侧面一一对应的平行，形成一定间隙。下面以第一表面A1所在平面作为参考面(XY轴所在面，且垂直于光轴)，对一些位置关系进行说明。
第二电路板10在参考面上的正投影位于第一电路板8在参考面上的正投影外轮廓的范围内，防止第二电路板10在参考面的方向上有部分或全部结构位于第一电路板8以外，有利于电路板组件在XY平面内的方向上(垂直于光轴的方向)上实现小型化。
由于外周面B3与内周面A3之间形成一定间隙，第一电路板8与第二电路板 10参考面上的正投影之间存在环形间隙(记为Q)。
连接组件4包括柔性连接带4e、4f、4g和4h，每条柔性连接带两端中的一端称为第一端、另一端称为第二端，每个柔性连接带绕第二电路板的中心轴线L螺旋延伸，中心轴线L垂直于第三表面B1，且第三表面B1为中心对称图形时，中心轴线L经过第三表面B1的几何中心，但应当理解第三表面B1与中心对称图形相比允许存在一定工程上允许的误差，每条柔性连接带的第一端与内周面A3连接；具体地，柔性连接带的第一端与内周面A3可以是一体式连接，直接采用一体成型的方式形成各柔性连接带和第一电路板8，柔性连接带的第一端与内周面A3之间无需额外的连接结构，减少在XYZ方向上占用的空间，减少工艺流程，其中，“一体成型”是指相互连接的两结构(柔性连接带和第一电路板8)中，一个结构的至少部分与另一个结构的至少部分是通过同时注塑、挤压等工艺同时成型的，而没有后期的焊接、粘结等后期拼接工艺，例如，柔性连接带的绝缘层和第一电路板8的绝缘层是在注塑的时候同时成型的，柔性连接带的金属导电层和第一电路板8的金属导层是由同一块未经拼接的金属刻蚀形成的；或者，柔性连接带的第一端与内周面A3也可以是通过ACF(Anisotropic Conductive Film，异方性导电胶膜)工艺连接，其中，与传统焊接工艺相比，ACF工艺需要的焊接温度更低，有利于避免因较高的焊接温度导致第一电路板8烫伤的情况，或者，FPC的柔性连接带因受热导致弯曲变形的情况，上述两种情况都将影响第一电路板8连接与其他器件连接时的定位精度；另外，由于ACF工艺中，异方性导电胶膜不但可以实现FPC制成的柔性连接带与第一电路板8的粘结，还可以实现纵向电导通，有利于FPC制成的柔性连接带与第一电路板8精确定位。类似地，第二端与外周面B3通过异方性导电胶膜工艺或一体式连接，其功能和效果参考前述柔性连接带与第一电路板8的连接，后文各实施例中各柔性连接带与第一电路板8和第二电路板10的连接方式、功能、作用均可参考前述柔性连接带与第一电路板8的连接方式；柔性连接带4e具有使第一电路板8和第二电路板10柔性连接的作用，使第二电路板10有在平行于参考面的方向上移动的自由度，并且，通过在柔性连接带4e上走 线可以使第一电路板8和第二电路板10电连接以实现导通；柔性连接带4e、4f、4g和4h位于外周面B3和第一镂空部U1的四个第一子侧面之间，从而，柔性连接带4e、4f、4g和4h在参考面上的投影位于上述环形间隙Q内，以减少柔性连接带4e、4f、4g和4h在光轴方向上的占用空间。柔性连接带4e、4f、4g和4h均选用柔性电路板(FPC，Flexible Printed Circuit)，该柔性电路板起到将第一电路板8和第二电路板10柔性连接和电连接的作用，相对于簧片，基本不具有弹性，当图像传感器2的尺寸发生变化，如图像传感器2的尺寸增加，可以直接通过增加第二电路板10的尺寸，柔性电路板的尺寸即便因此缩小，也不会增加第二电路板10的复位力，反之，图像传感器2变小，柔性电路板的尺寸增加，也不会减小第二电路板10的复位力，因此，电路板组件整体尺寸可以基本保持不变，即便与光学防抖马达尺寸相关地集成，光学防抖马达的尺寸也可以基本保持不变，从而，图像传感器2的尺寸变化不易引起其它部件的尺寸变化，适配更灵活。
参考图2a，以柔性连接带4e为例，柔性连接带4e的第一端形成自柔性连接带4e的延伸方向向第一电路板8弯折的第一拐角结构V1，第二端形成有自该柔性连接带4e的延伸方向向第二电路板10弯折的第二拐角结构V2，由第一拐角结构V1向第二拐角结构V2延伸的过程中，该第一拐角结构V1和第二拐角结构V2的中间部分先向沿向右延伸，再向下延伸与第二拐角结构V2连接，第一拐角结构V1弯向第一电路板8的内周面A3的上侧第一子侧面，并与其中部位置连接，第二拐角结构V2向左弯向第二电路板10的外周面B3的右侧的第二子侧面的中部(并非一定是中间位置)连接，其中，第一拐角结构V1有利于柔性连接带4e灵活地选择与相应第一子侧面的连接位置，而不是一直沿直线延伸，类似地，第二拐角结构V2有利于柔性连接带4e灵活地选择与相应第二子侧面的连接位置。此外，在图2a至图2c中，每个柔性连接带均平行(允许存在工程意义上的额误差)于参考面，相对于垂直于参考面的情况，可以直接在平行于参考面上第一电路板8和第二电路板10之间无需扭转的走线，而若柔性连接带垂直于参考面，则走线需要拧转，易发生断裂。
柔性连接带4e绕第二电路板10的中心轴线L依次旋转90°、180°和270°可分别得到柔性连接带4f、4g和4h，如此，每相邻的两条柔性连接带在宽度方向(垂直于柔性连接带的延伸方向，且平行于参考面)上的投影无交叠，可防止相邻的柔性连接带相互干扰。
在图2a中，柔性连接带4e呈带状结构，宽度较小，因此，在弯曲时仅需要克服较小的材料应力，而分别设置多条柔性连接带可以满足总的走线数量；柔性连接带4e大致呈L形，柔性连接带4e具有大致呈90°的折角，该折角形成一个弯折结构W1，无论是驱动第二电路板10沿着上下、还是左右方向运动，柔性连接带4e的第一端和第二端之间均可提供一定的冗余度，在不增大横向尺寸的前提下能增加柔性连接带的整体长度，减小单位尺寸下的形变量，在第一电路板8相对于第二电路板10在XY平面内的方向上移动时无需克服较大的阻力。
应当理解的是，柔性连接带4e大致呈L形并不是必须的，当柔性连接带4e包括多个弯折结构W1，或者每个折弯结构的夹角不成90°，柔性连接带4e也可以有减小阻力的作用，但柔性连接带4e以图2a中的形式基本沿着X方向或Y方向延伸可以确保柔性连接带4e的应力基本沿着XY平面内的方向上分布。当柔性连接带4e包括多个弯折结构W1，也可以提高柔性连接带4e变形所需克服的阻力更小，柔性连接带4e包括至少一个弯折结构W1即可。
柔性连接带4e的第一端与第一镂空部U1的内周面A3一个第一子侧面连接，而不是在内周面A3拐角处设置倒角，并与该倒角位置连接，以使柔性连接带4e所受应力均沿平行于参考面且相互垂直的两个方向分布。
连接组件4包括4条柔性连接带仅仅是示例性地，还可以是3条、5条甚至以上数量的多条柔性连接带。
在图2a至图2c对应的实施例中，柔性连接带设置于内周面A3和外周面B3之间，第二电路板10可以隐藏于第一电路板8的第一镂空部U1中，有利于降低电路板组件的厚度。
参考图3，与图2a至图2c的区别在于，柔性连接带4e和4g分别被替换为柔 性连接带4e’和4g’，柔性连接带4e’与柔性连接带4f关于第二电路板10的平行于X方向的对称轴对称，柔性连接带4g’与柔性连接带4h关于第二电路板10的平行于X方向的对称轴对称，连接组件4的该种分布形式有利于各个柔性连接带中应力分布的对称，有利于平衡。在该结构中，外周面B3的每个第二子侧面与两个柔性连接带连接，如上侧面与柔性连接带4e’和4h连接，下侧面与柔性连接带4f和4g’连接，以增加该两个相对设置的第二子侧面的出线量，并且，可以知晓柔性连接带4e’和4h分别一一对应地与柔性连接带4f和4g’关于上侧面和下侧面的对称轴而对称设置，有利于提高第二电路板10的受力平衡程度，其中，上侧面和下侧面连接的柔性连接带的数量不限于2条，可以是2条以上，如3条和4条等。这仅仅是示例性地，只要在相对的第二子侧面中，每个第二子侧面与两个或以上的柔性连接带连接，即有利于增加上述第二子侧面的出线量，从而增加该第二子侧面与柔性连接带的接合强度，并且出线量多的两个第二子侧面相对设置有利于第二电路板受力平衡。
参考图4，区别在于，柔性连接带4a的第二端通过弯向外周面B3的右部的第一子侧面的第二拐角结构V2与第二电路板10的外周面B3的右侧的第二子侧面的上端位置连接，并一直向下延伸再向左侧延伸直到柔性连接带4a的第一端与第一镂空部U1的内周面A3的左侧的第一子侧面的靠近下端的位置连接。该连接组件4的结构每相邻两个柔性连接带在宽度方向上有交叠，“宽度方向”是指平行于参考面且垂直于柔性连接带的延伸方向的方向，但有利于增加每个柔性连接带的长度，单个横截面积的形变量减小，降低变形时的阻力。柔性连接带4b、4c和4d与柔性连接带4a具有类似的结构，且连接方式相似，柔性连接带4a绕第二电路板10的几何中心的轴线依次旋转90°、180°和270°可分别得到柔性连接带4b、4c和4d。每个柔性连接带的第一端和第二端分别与中心轴线L连线(连线均与参考面平行)的夹角介于90°至180°之间，具体可以是90°、95°、100°、120°、150°、175°或180°，其中，柔性连接带4a对应的上述夹角约为175°，以确保相邻两个柔性连接带在宽度方向上可以有重叠，且不至于与第三个柔性连接带在宽度方向上有重叠，避免过度增加摄像柔性连接带 在参考面方向占用的尺寸。
结合图5a至图5c，与图2a至图2c的区别在于，沿参考面的法向方向(此图中即光轴方向)上，第二表面A2位于第四表面B2远离第三表面B1的一侧；第四表面B2相对于第二表面A2沿着光轴的方向向第三表面B1所在平面的方向错位，使第四表面B2所在平面位于第二表面A2所在平面和第三表面B1所在平面之间，如此，第四表面B2相对于第二表面A2内凹，可以容纳连接组件4，连接组件4包括柔性连接带4q、4r、4s和4t，柔性连接带4q、4r、4s和4t的结构可依次参考柔性连接带4a、4b、4c和4d。以柔性连接带4q和柔性连接带4a为例说明区别，柔性连接带4q贴附(仅保持贴附，不通过粘结等方式固定)于第四表面B2，第二端(参考J位置)与第四表面B2固定并电连接(后文会以柔性连接带4r为例，并结合图5d来说明此处固定并电连接的方式)，第一端(参考I位置)与内周面A3的一个第一子侧面连接，而不再位于外周面B3和内周面A3之间的间隙中，其中，至少保证柔性连接带4q的弯折结构W2在参考面上的正投影位于第四表面B2在参考面上的正投影内，此时，外周面B3和内周面A3之间的间隙可缩小，在不增加电路板组件整体大小的情况下，第二电路板10的尺寸可以增加，可以放置更大尺寸的图像传感器2，从而，提升图像传感器2的性能；并且，柔性连接带不必设置于内周面A3与外周面B3之间的环形间隙中，第二端与第四表面B2的连接时，第一端与内周面A3连接时，操作空间均增大，降低工艺难度，提高良率；并且柔性连接带的尺寸可以设置地更大，其柔软度增加，阻力降低，第二电路板10横向移动时更加灵活。柔性连接带4q具有多个弯折结构W2时，只要确保上述多个弯折结构W2在参考面上的正投影与第四表面B2在参考面上的正投影至少有部分重叠，即可达到减小电路板组件在XY平面内的方向上的尺寸的效果。柔性连接带4r、4s和4t分别相对于柔性连接带4b、4c和4d具有类似的变形。
结合图5c和图5d，以柔性连接带4r为例，柔性连接带4r的第一端的端面与内周面A3连接。并且，沿参考面的法向(此处为光轴L的方向)，柔性连接带4r的厚度尺寸小于第一电路板8的厚度尺寸，并且，柔性连接带4r介于第二表 面A2和第四表面B2之间，使柔性连接带4r在参考面的法向上隐藏于第四表面B2相对于第二表面A2内凹形成的容纳空间中，不额外占用参考面法向上的空间。继续结合图5c及图5e，柔性连接带4r第一端至第二表面A2的最小距离h2小于第一端至第一表面A1的最小距离h1，以便于在第一镂空部U1的内周面上该第一端与第一表面A1之间预留较宽的尺寸h1来与外周面B3相对设置，有利于降低电路板组件的整体厚度，并且，确保柔性连接。
结合图5d和图5e，柔性连接带4r的第二端与第四表面B2之间设置有连接垫E1，连接垫E1可以是金属片，或者金属焊肉，可以将柔性连接带4r的第二端与第四表面B1上的焊盘固定并电连接。连接垫E1将柔性连接带4r的第二端垫高，以便于柔性连接带4r的第一端和第二端之间的部分可以与第四表面B2之间有一定距离，以使柔性连接带4r可以更加灵活地变形。
以上仅以柔性连接带4r举例，其余的柔性连接带也可以有类似结构和连接方式。
参考图6a至6b，与图2a至图2c的区别在于，沿参考面的法向方向(此图中即光轴方向)上，第三表面B1高于第一表面A1，第三表面B1所在平面位于第一表面B1背离第二表面A2的一侧，图6a至图6b的第一电路板8和第二电路板10的位置关系与图5a至5b的位置关系是相同的，具体可以是第一电路板8和第二电路板10具有相同的厚度，而第二电路板10沿着第二表面A2指向第一表面A1的方向移动部分距离，该距离小于第一电路板8的板厚。连接组件4包括柔性连接带4i、4j、4k和4l，柔性连接带4i、4j、4k和4l的结构可依次参考图2a至图2c中的柔性连接带4e、4f、4g和4h，但也可以是其它结构。
以柔性连接带4i为例，柔性连接带4i的第二端与外周面B3的一个第二子侧面连接，便于降低垂直于参考面方向上的厚度，且柔性连接带4i的弯折结构W3与第一表面A1贴附，且第一端与第一表面A1通过粘结等方式粘结，而不用与内周面A3连接，可操作空间大，降低工艺难度，提高良率。当柔性连接带4i具有多个弯折结构W3时，多个弯折结构W3在参考面上的正投影与第一表面A1至少部分重叠即可，也可以如图5a至图5c类似，减小电路板组件在平行于 参考面方向上的尺寸。
其中，相对于将柔性连接带设置于内周面A3和外周面B3之间的环形间隙中相比，柔性连接带的尺寸可以增加，因此，其柔软度进一步提高，阻力降低，第二电路板在XY所在平面内移动更加灵活。此外，在参考面的法向上第四表面B2位于第一表面A1和第二表面A2之间，有利于在第四表面B2背离第三表面B1的一侧提供了容置空间，可以设置一些元器件。
结合6b和图6d，以柔性连接带4k为例，柔性连接带4k的第二端的端面与外周面B3连接，其中，可以与第二电路板10一体成型，沿参考面的法向上(此处为光轴L的方向)，柔性连接带4k的厚度小于第二电路板10的厚度，且柔性连接带4k介于第一表面和A1第三表面B1之间，使柔性连接带4k在参考面的法向上隐藏于第一表面A1相对于第三表面B1凹陷形成的容置空间，不额外占用参考面法向上的空间；且，柔性连接带4k的第二端至第三表面B1的最小距离(记为h3，因柔性连接带的顶面与第三表面B1平齐，h3＝0，故图中未标出)小于柔性连接带4k的第二端至第四表面B2的最小距离h4。以便于在内周面A3上柔性连接带4k的该第二端与第四表面B2之间预留较宽的尺寸h4来与第一镂空部U1的内周面A3相对设置，有利于降低电路板组件的整体厚度，并且，确保柔性连接。
结合图6b和图6e，柔性连接带4k的第一端与第一表面A1之间设置有连接垫E2，连接垫E2可以是金属片，或者金属焊肉，可以将柔性连接带4k的第一端与第一表面A1上的焊盘固定并电连接。连接垫E2将柔性连接带4k的第一端垫高，以便于柔性连接带4k的第一端和第二端之间的部分可以与第一表面A1之间有一定距离，以使柔性连接带4k可以更加灵活地变形。
以上仅以柔性连接带4k举例，其余的柔性连接带也可以有类似结构和连接方式。
图6a至图6c中，柔性连接带的结构可以有一些变形，参考图7a，连接组件4包括柔性连接带4m、4n、4o和4p，柔性连接带4m、4n、4o和4p的设置位置和两端的连接方式可以参考图6a至图6c中的柔性连接带4i、4j、4k和4l，但其 绕线结构可以参考图4中4q、4r、4s和4t。
参考图7b，在图7a的基础上，在每个柔性连接带(如4q)中部设有沿该柔性连接带延伸方向延伸的第二镂空部U2，第二镂空部U2呈条状地分布于柔性连接带的中间位置，能降低柔性连接带的在平行于参考面方向上的宽度，以提高柔性连接带的柔软度，降低其变形时所需克服的阻力。
在图1至图7b对应的实施例中，第一电路板8均具有第一镂空部U1，并且，在参考面的法向上，第二电路板10至少部分地伸入第一镂空部U1内，以使在平行于参考面的方向上，第二电路板10的外周面B3至少部分地与围成第一镂空部U1的内周面A3相对设置，也就是，在平行于参考面的方向上第二电路板10的投影与第一电路板8的投影至少部分的重叠。
参考图8a和图8b，第一电路板8与第二电路板10沿光轴方向并排设置，而不是第二电路板10部分或全部地设置在第一电路板8的第一镂空部U1内。与第四表面B2位于第一表面B1所在平面背离第二表面A2所在平面的一侧，第四表面B2所在平面与第二表面A2所在平面相向设置。柔性连接带(如4q)延伸至第一表面A1上；在每个柔性连接带(如4q)中部设有沿该柔性连接带延伸方向延伸的第二镂空部U2，第二镂空部U2呈条状地分布于柔性连接带的中间位置，以提高柔性连接带的柔软度，降低其变形时所需克服的阻力。并且，通过观察图8a，当第一电路板8不设置有第一镂空部U1时，因为第一电路板8本身具有保强和密封的作用，第一电路板8底面的保强板可以不必设置，简化了工艺步骤。并且，与图2a至图2c的实施例对比，柔性连接带的两端连接时操作空间较大。且柔性连接带的尺寸可以进一步增加，有利于降低第二电路板10横向移动阻力。并且，与图5a至图5c对应的实施例相比，柔性连接带不局限于镂空结构U1内，可活动自由度更大，有利于进一步增加第二电路板10的自由度。并且，由于不设置第一镂空部U1，第一电路板8的结构强度更大。并且，第二电路板10的横向活动空间不再局限于第一镂空部U1，而是扩大到了第一电路板8的整个面积，有利于进一步提高防抖性能。此外，第二电路板10的尺寸不限于第一镂空部U1，而只要比第一电路板8小即可，相当于可以设置更大 的第二电路板10，有利于第三表面B1放置更大的图像传感器2。
或者，如图8c，与图8b的区别在于没有设置第二镂空部U2，有利于，并且，每个柔性连接带在参考面的正投影完全位于第三表面在参考面的正投影范围内。
再或者，如图8d，在第一电路板8与第二电路板10相对的位置增设第一镂空部U1，但第一电路板8并不位于其中，第一镂空部U1可以达到减重的效果。
只要满足下列条件也可以在额外占用XY平面内的方向上的空间的情况下降低第二电路板10在XY平面内的方向上移动的阻力：第二表面A2所在平面与第三表面B1所在平面相向设置；每个柔性连接带的第一端与第二表面A2连接、第二端与第三表面B1连接，且柔性连接带的多个弯折结构在参考面上的正投影与第二表面A2在参考面上的正投影至少部分重叠。
基于相同的发明构思，提供了一种电路板组件，该电路板组件包括前述摄像模组实施例中的第一电路板8、第二电路板10和连接组件，其结构和效果可参考前述实施例的有关描述。
基于相同的发明构思，提供了一种电子设备，该电子设备可以是手机或者平板电脑，其包括前述实施例提供的摄像模组，相对于现有技术的效果可参考摄像模组实施例的效果分析。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (26)

  1. 一种电路板组件，其特征在于，包括：第一电路板、第二电路板和多个柔性连接带；
    所述第一电路板具有相对的第一表面和第二表面；
    所述第二电路板具有相对的第三表面和第四表面，以及，连接所述第三表面和所述第四表面的外周面，所述第三表面的朝向与所述第一表面的朝向相同，所述第四表面的朝向与所述第二表面的朝向相同，所述第三表面和所述第四表面均为矩形，且所述第三表面设有用于与图像传感器电连接的电连接结构；
    所述第二电路板在参考面上的正投影位于所述第一电路板在所述参考面上的正投影外轮廓的范围内，其中，所述参考面为所述第一表面所在平面；
    所述柔性连接带为柔性电路板，并具有至少一个弯折结构，所述柔性连接带的第一端与所述第一电路板通过异方性导电胶膜工艺或一体式连接、第二端与所述第二电路板通过异方性导电胶膜工艺或一体式连接，以实现所述第一电路板和所述第二电路板的柔性连接和电连接。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述第一电路板中部具有第一镂空部，沿平行于所述参考面的方向，所述第二电路板的外周面至少部分地与围成所述第一镂空部的内周面相对设置，所述第一电路板与所述第二电路板在所述参考面上的正投影之间存在环形间隙。
  3. 根据权利要求2所述的电路板组件，其特征在于，所述第一镂空部呈矩形，围成所述第一镂空部的内周面具有与所述第一表面的每条侧边一一对应的第一子侧面；
    所述柔性连接带的第一端与一个所述第一子侧面连接。
  4. 根据权利要求3所述的电路板组件，其特征在于，每个所述柔性连接带的第一端形成有自所述柔性连接带的延伸方向向所述第一电路板弯折的第一拐角结构。
  5. 根据权利要求3所述的电路板组件，其特征在于，每个所述柔性连接带在所述参考面上的正投影均位于所述环形间隙内；
    每个所述柔性连接带的第二端与所述外周面连接。
  6. 根据权利要求5所述的电路板组件，其特征在于，所述外周面具有与所述第一表面的每条侧边一一对应的第二子侧面；
    相对的两个所述第二子侧面中，每个所述第二子侧面至少与两个所述柔性连接带连接。
  7. 根据权利要求6所述的电路板组件，其特征在于，在所述相对的两个所述第二子侧面中，分别与两个所述第二子侧面连接的柔性连接带一一对应地关于两个所述第二子侧面的对称轴对称。
  8. 根据权利要求6所述的电路板组件，其特征在于，每个所述柔性连接带的第二端形成有自所述柔性连接带的延伸方向向所述第二电路板弯折的第二拐角结构。
  9. 根据权利要求2所述的电路板组件，其特征在于，沿所述参考面的法向方向上，所述第二表面位于所述第四表面远离所述第三表面的一侧；
    沿所述参考面的法向方向上，所述柔性连接带位于所述第四表面背离所述第三表面的一侧，每个所述柔性连接带的多个所述弯折结构在所述参考面上的正投影与所述第四表面在所述参考面上的正投影至少部分重叠，且通过所述第一端与围成所述第一镂空部的内周面连接、并通过所述第二端与所述第四表面连接。
  10. 根据权利要求9所述的电路板组件，其特征在于，沿所述参考面的法向上，所述柔性连接带的厚度小于所述第一电路板的厚度，所述柔性连接带介于所述第二表面和所述第四表面之间；且，
    所述第一端连接于所述内周面，且所述第一端至所述第二表面的最小距离小于所述第一端至所述第一表面的最小距离。
  11. 根据权利要求2所述的电路板组件，其特征在于，所述第三表面高于所述第一表面；
    沿所述参考面的法向方向上，所述柔性连接带位于所述第一表面背离所述第二表面的一侧，每个所述柔性连接带的第二端与所述外周面连接，且所述柔性连接带的多个所述弯折结构在所述参考面上的正投影与所述第一表面至少部分重叠，且通过所述第一端与所述第一表面连接。
  12. 根据权利要求11所述的电路板组件，其特征在于，沿所述参考面的法向上，所述柔性连接带的厚度小于所述第二电路板的厚度，且所述柔性连接带介于所述第一表面和所述第三表面之间；且，
    所述第二端至所述第三表面的最小距离小于所述第二端至所述第四表面的最小距离。
  13. 根据权利要求1所述的电路板组件，其特征在于，所述第一表面所在平面与所述第四表面所在平面相向设置；
    每个所述柔性连接带的第一端与所述第一表面连接、第二端与所述第四表面连接，且所述柔性连接带的多个所述弯折结构在所述参考面上的正投影与所述第四表面在所述参考面上的正投影至少部分重叠。
  14. 根据权利要求1所述的电路板组件，其特征在于，在每个所述柔性连接带中部设有沿所述柔性连接带延伸方向延伸的第二镂空部。
  15. 根据权利要求1所述的电路板组件，其特征在于，每个所述柔性连接带沿平行于所述参考面的方向延伸。
  16. 根据权利要求15所述的电路板组件，其特征在于，每个所述柔性连接带绕所述第二电路板的中心轴线螺旋延伸，所述中心轴线垂直于所述第三表面，且经过所述第三表面的几何中心；且，
    每个柔性连接带在宽度方向上的投影与另一个所述柔性连接带在宽度方向上的投影有交叠，其中，所述宽度方向是指平行于所述参考面且垂直于所述柔性连接带的延伸方向的方向。
  17. 根据权利要求16所述的电路板组件，其特征在于，每个所述柔性连接带的第一端和第二端分别与所述中心轴线的连线的夹角介于90°至180°之间，其中，所述连线平行于所述参考面。
  18. 一种摄像模组，其特征在于，包括镜头、图像传感器、驱动组件和权利要求1至17任一项所述的电路板组件，其中，
    所述图像传感器设置于第三表面，并通过所述电连接结构与所述第二电路板电连接，所述镜头设置于所述图像传感器背离所述第二电路板的一侧；
    所述驱动组件用于将所述第二电路板支撑于所述镜头靠近所述图像传感器的一侧、并用于驱动所述第二电路板沿平行于参考面的方向相对于所述第一电路板移动，以实现防抖功能。
  19. 根据权利要求18所述的摄像模组，其特征在于，所述驱动组件包括：支撑部件和横向驱动部件，所述横向驱动部件连接于所述镜头靠近所述图像传感器的一侧、并用于将所述支撑部件沿平行于所述参考面的方向相对于所述第一电路板移动，所述支撑部件用于将所述第二电路板支撑于所述横向驱动部件。
  20. 根据权利要求18所述的摄像模组，其特征在于，所述驱动组件包括：支撑部件和横向驱动部件；其中，
    所述支撑部件用于将所述第二电路板支撑于所述镜头靠近所述图像传感器的一侧；
    所述横向驱动部件用于驱动所述第二电路板沿平行于参考面的方向相对于所述第一电路板移动。
  21. 根据权利要求20所述的摄像模组，其特征在于，所述横向驱动部件包括线圈和磁铁，其中，
    所述线圈设置于所述第二电路板，所述磁铁设置于所述第一电路板；或者，所述磁铁设置于所述第二电路板，所述线圈设置于所述第一电路板；
    所述线圈用于与所述磁铁相吸或相斥。
  22. 根据权利要求19或20所述的摄像模组，其特征在于，所述横向驱动部件包括光学防抖马达，所述支撑部件包括悬丝。
  23. 根据权利要求19或20所述的摄像模组，其特征在于，所述摄像模组还包括滤片支架和红外截止滤波片，所述红外截止滤波片位于所述镜头和所 述图像传感器之间，且所述滤片支架将所述红外截止滤波片支撑于所述第三表面上；
    所述支撑部件连接于所述镜头和所述滤片支架之间。
  24. 根据权利要求18所述的摄像模组，其特征在于，所述摄像模组还包括金线，所述图像传感器通过所述金线与所述电连接结构电连接。
  25. 根据权利要求18所述的摄像模组，其特征在于，当所述第一电路板设有所述第一镂空部时，所述摄像模组还包括保强板，所述保强板设置在所述第一电路板背离所述镜头的表面，且所述保强板覆盖所述镂空结构。
  26. 一种电子设备，其特征在于，包括壳体及权利要求18至25任一项所述的摄像模组，所述摄像模组设置于所述壳体内。
PCT/CN2021/094999 2021-05-20 2021-05-20 一种电路板组件、摄像模组及电子设备 WO2022241741A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/094999 WO2022241741A1 (zh) 2021-05-20 2021-05-20 一种电路板组件、摄像模组及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/094999 WO2022241741A1 (zh) 2021-05-20 2021-05-20 一种电路板组件、摄像模组及电子设备

Publications (1)

Publication Number Publication Date
WO2022241741A1 true WO2022241741A1 (zh) 2022-11-24

Family

ID=84141057

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/094999 WO2022241741A1 (zh) 2021-05-20 2021-05-20 一种电路板组件、摄像模组及电子设备

Country Status (1)

Country Link
WO (1) WO2022241741A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111654612A (zh) * 2020-06-17 2020-09-11 维沃移动通信有限公司 摄像模组及电子设备
CN211830943U (zh) * 2020-05-28 2020-10-30 维沃移动通信有限公司 摄像模组及电子设备
CN111917955A (zh) * 2020-08-05 2020-11-10 东莞市亚登电子有限公司 摄像模组和具有其的摄像设备
CN213028217U (zh) * 2020-07-27 2021-04-20 东莞市亚登电子有限公司 摄像模块及具有其的电子设备
CN112702498A (zh) * 2020-12-29 2021-04-23 维沃移动通信有限公司 摄像头模组及电子设备
CN112969296A (zh) * 2021-03-26 2021-06-15 南昌欧菲光电技术有限公司 一种柔性电路板、摄像模组及柔性电路板的组装方法
CN113114919A (zh) * 2021-05-19 2021-07-13 江西晶浩光学有限公司 一种电路板组件、摄像模组及电子设备
CN113132607A (zh) * 2021-05-08 2021-07-16 南昌欧菲光电技术有限公司 一种柔性电路板、摄像模组及电子设备

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211830943U (zh) * 2020-05-28 2020-10-30 维沃移动通信有限公司 摄像模组及电子设备
CN111654612A (zh) * 2020-06-17 2020-09-11 维沃移动通信有限公司 摄像模组及电子设备
CN213028217U (zh) * 2020-07-27 2021-04-20 东莞市亚登电子有限公司 摄像模块及具有其的电子设备
CN111917955A (zh) * 2020-08-05 2020-11-10 东莞市亚登电子有限公司 摄像模组和具有其的摄像设备
CN112702498A (zh) * 2020-12-29 2021-04-23 维沃移动通信有限公司 摄像头模组及电子设备
CN112969296A (zh) * 2021-03-26 2021-06-15 南昌欧菲光电技术有限公司 一种柔性电路板、摄像模组及柔性电路板的组装方法
CN113132607A (zh) * 2021-05-08 2021-07-16 南昌欧菲光电技术有限公司 一种柔性电路板、摄像模组及电子设备
CN113114919A (zh) * 2021-05-19 2021-07-13 江西晶浩光学有限公司 一种电路板组件、摄像模组及电子设备

Similar Documents

Publication Publication Date Title
TW201415877A (zh) 防手震之整合式基板結構
EP3706405B1 (en) Image capture module of electronic device
CN215073101U (zh) 一种柔性电路板及摄像模组
JPH1131717A (ja) 半導体チップ及びそれを備えた表示装置
TW202107189A (zh) 攝像頭裝置及移動終端
WO2022241741A1 (zh) 一种电路板组件、摄像模组及电子设备
CN112969296A (zh) 一种柔性电路板、摄像模组及柔性电路板的组装方法
JP2022168758A (ja) フレキシブル配線板、モジュール、及び電子機器
EP4216535A1 (en) Camera module and electronic device
CN113259568A (zh) 一种电路板组件、摄像模组及电子设备
JPH10244791A (ja) カード型電子装置
CN216291602U (zh) 电路板组件、摄像模组和电子设备
CN215420435U (zh) 一种电路板组件、摄像模组及电子设备
WO2019077990A1 (ja) 基板積層体、および、撮像装置
JP3609980B2 (ja) 撮像装置および携帯電話機
TW202244591A (zh) 非迴焊式感測鏡頭
CN216291124U (zh) 摄像模组和电子设备
CN113206938B (zh) 分体双摄模组和感光组件及制造方法和电子设备
WO2022241684A1 (zh) 一种电路板组件、摄像模组及电子设备
CN216531447U (zh) 摄像模组和电子设备
TWI805404B (zh) 鏡頭模組及電子裝置
KR20050117371A (ko) 이미지 센서 모듈 및 그 제조 방법
CN217283086U (zh) 电路板、底座、摄像模组及电子设备
WO2023179441A1 (zh) 一种摄像头模组
WO2023036295A1 (zh) 用于摄像模组的线路板及相应的摄像模组

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21940195

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE