WO2023223969A1 - Languette conductrice pour batteries à électrolyte non aqueux - Google Patents

Languette conductrice pour batteries à électrolyte non aqueux Download PDF

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Publication number
WO2023223969A1
WO2023223969A1 PCT/JP2023/017943 JP2023017943W WO2023223969A1 WO 2023223969 A1 WO2023223969 A1 WO 2023223969A1 JP 2023017943 W JP2023017943 W JP 2023017943W WO 2023223969 A1 WO2023223969 A1 WO 2023223969A1
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Prior art keywords
lead conductor
plating
plating layer
lead
sealing material
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PCT/JP2023/017943
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English (en)
Japanese (ja)
Inventor
竜 村上
燎平 大澤
晃一 片山
淳雄 大江
高志 大内
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Ｊｘ金属株式会社
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Publication of WO2023223969A1 publication Critical patent/WO2023223969A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/105—Pouches or flexible bags
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/172—Arrangements of electric connectors penetrating the casing
    • H01M50/174—Arrangements of electric connectors penetrating the casing adapted for the shape of the cells
    • H01M50/178—Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/183—Sealing members
    • H01M50/184—Sealing members characterised by their shape or structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/183—Sealing members
    • H01M50/186—Sealing members characterised by the disposition of the sealing members
    • H01M50/188—Sealing members characterised by the disposition of the sealing members the sealing members being arranged between the lid and terminal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/249—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders specially adapted for aircraft or vehicles, e.g. cars or trains
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/533—Electrode connections inside a battery casing characterised by the shape of the leads or tabs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • H01M50/534—Electrode connections inside a battery casing characterised by the material of the leads or tabs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/552—Terminals characterised by their shape
    • H01M50/553—Terminals adapted for prismatic, pouch or rectangular cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/552—Terminals characterised by their shape
    • H01M50/553—Terminals adapted for prismatic, pouch or rectangular cells
    • H01M50/557—Plate-shaped terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/543—Terminals
    • H01M50/562—Terminals characterised by the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/571—Methods or arrangements for affording protection against corrosion; Selection of materials therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a tab lead for a non-aqueous electrolyte battery, and a non-aqueous electrolyte battery using the tab lead.
  • the structure of a nonaqueous electrolyte battery is such that a stacked electrode group in which a positive electrode plate and a negative electrode plate are laminated via a separator and an electrolyte are housed in an exterior case made of a multilayer film, etc., and connected to the positive electrode plate and the negative electrode plate.
  • a structure in which each tab lead is hermetically sealed and taken out to the outside is known.
  • the exterior case is hermetically sealed by, for example, sealing the peripheral seal portions of two laminate films cut into rectangular shapes by thermal welding.
  • a tab lead is composed of a lead conductor and a sealing material.
  • the lead conductor is a conductor that is connected to the positive electrode plate or the negative electrode plate to extract current to the outside of the sealed battery.
  • the sealing material is an insulating resin portion provided on the lead conductor, and is provided in order to prevent short circuit between the lead conductor and the multilayer film and ensure the sealing performance of the battery.
  • a sealing material is applied to the part taken out from the outer case by thermal welding, etc. to ensure the airtightness of the battery, and at the same time, electrical connections from the laminated electrode group housed inside the outer case to the outside are made using lead conductors. It is secured.
  • Patent Document 1 discloses a nonaqueous electrolyte battery and a tab lead having such a structure in FIGS. 2 and 3 of Patent Document 1.
  • a pouch-type nonaqueous electrolyte battery (LiB) is equipped with a tab lead for extracting power from the battery cell, and the tab lead is welded to the packaging material via a sealing material. It is required that the electrolyte does not leak out of the pouch, but Patent Document 1 discloses that by controlling the surface roughness Ra of the lead conductor of the tab lead to 0.1 to 0.3 ⁇ m, the contact between the lead conductor and the sealing material is improved. Discloses technology to increase adhesion.
  • the welding of the sealing material and the packaging material is the welding of the resin material to the resin material, so it is relatively easy to make this strong, but the adhesion between the lead conductor and the sealing material is a metal Since this depends on the close contact between the material and the resin material, it is technically difficult to make this strong.
  • the present inventor has been diligently researching and developing means to further enhance the adhesion between the lead conductor of the tab lead and the sealing material, and once focused on controlling the surface roughness Ra of the lead conductor of the tab lead.
  • the surface roughness Ra of the lead conductor which has been believed to be an indicator of adhesion, has a weak correlation with the actual adhesion.
  • the inventor found that even if the surface roughness Ra of the lead conductor was controlled, the adhesion between the lead conductor and the sealing material could not be accurately controlled.
  • an object of the present invention is to provide a means for controlling the adhesion between a lead conductor and a sealing material more accurately than before.
  • the present inventor discovered that by adopting the index described below in place of the surface roughness Ra of the lead conductor, the adhesion between the lead conductor and the sealing material could be managed more accurately than before, and the present invention was realized. reached.
  • the inventors have discovered that by controlling this index within a specific range, it is possible to stably increase the adhesion force in a region where the adhesion force between the lead conductor and the sealing material is high.
  • the present invention includes the following (1): (1) A metal lead conductor used in a tab lead for an electrochemical device comprising a metal lead conductor and an insulating resin sealant, A lead conductor having a surface in contact with a sealant on the surface of the lead conductor, the surface having a roughness parameter Svk in a range of 0.175 [ ⁇ m] or more.
  • the adhesion between the lead conductor and the sealing material can be managed more accurately than before.
  • a tab lead in which the lead conductor and the sealing material are in close contact with each other with high adhesion force can be stably obtained.
  • FIG. 1 is a graph illustrating the results of peel strength measurements.
  • FIG. 2 is a graph showing the results of examining the electrolyte resistance of Ni--P plating.
  • the lead conductor of the present invention is a metal lead conductor used in a tab lead for an electrochemical device, which includes a metal lead conductor and an insulating resin sealant, and includes:
  • the lead conductor has a surface having a roughness parameter Svk in a range of 0.175 [ ⁇ m] or more as a surface that comes into contact with the sealing material. More preferably, the lead conductor has a surface having a roughness parameter Svk in the range of 0.18 to 0.25 [ ⁇ m] as the surface that comes into contact with the sealing material.
  • the lead conductor of the present invention has the above-mentioned surface as a surface that comes into contact with the sealing material on the surface of the lead conductor, so that when manufacturing a tab lead by bringing the lead conductor into close contact with the sealing material made of insulating resin, the lead conductor and the sealing material can be brought into contact with each other.
  • the adhesion force can be managed more accurately than before, and the adhesion force can be stably increased in areas where the adhesion force between the lead conductor and the sealing material is high.
  • the metal of the metal lead conductor can be, for example, copper, copper alloy, nickel, nickel alloy, aluminum, aluminum alloy, titanium, or titanium alloy.
  • the metal lead conductor can have a structure including the above metal as a base material and a surface treatment layer formed on the base material.
  • an insulating resin selected from thermoplastic polyolefins such as polypropylene, acid-modified polypropylene, polyethylene, and acid-modified polyethylene can be used as the insulating resin of the insulating resin sealing material.
  • thermoplastic polyolefins such as polypropylene, acid-modified polypropylene, polyethylene, and acid-modified polyethylene
  • a single-layer or multi-layer sealing material containing these insulating resins can be used.
  • a multilayer sealing material in which a heat-resistant resin is sandwiched between maleic acid-modified polypropylene layers with high adhesiveness can be used.
  • a crosslinked polyolefin can be used as the heat-resistant resin.
  • a known method can be used for crosslinking the polyolefin.
  • the metal lead conductor is used as a tab lead for an electrochemical device.
  • An electrochemical device is a device that supplies an electrical signal or electrical energy through an electrochemical reaction, and includes, for example, a non-aqueous electrolyte battery such as a lithium ion battery.
  • An electrochemical device includes a conductive terminal for outputting a potential or current to the outside, and the member used as the conductive terminal is a tab lead.
  • the tab lead includes a lead conductor for conductivity and a sealing material for sealing by being welded to the inside of the packaging material of the electrochemical device.
  • a sealing material is adhered to a portion of the surface of the lead conductor constituting the tab lead that is to be sealed by welding to the inside of the packaging material.
  • the surface of the lead conductor that comes into contact with the sealing material has a property that improves the adhesion with the sealing material. That is, in a preferred embodiment, the lead conductor has a surface having a roughness parameter Svk within the range described below, as the surface that comes into contact with the sealing material on the surface of the lead conductor.
  • the roughness parameter Svk (average depth of protruding valleys) corresponds to a parameter representing the average depth of protruding valleys in the load curve obtained by three-dimensionally measuring surface roughness, and is specified in ISO 25178. has been done.
  • the surface roughness Svk is controlled within a predetermined range by roughening plating, but in other embodiments, surface roughness Svk may be controlled by etching, sandblasting, or other known methods, or a combination thereof ( For example, the surface roughness may be controlled within a predetermined range by normal plating followed by etching (not roughening plating).
  • the roughness parameter Svk is, for example, in a range of 0.175 [ ⁇ m] or more, preferably 0.18 to 0.25 [ ⁇ m], from the viewpoint of increasing the adhesion between the lead conductor and the sealing material. can be in the range of If the roughness parameter Svk is too small, the anchoring effect may become small and the adhesion with the sealing material may decrease. On the other hand, if the roughness parameter Svk is too large, the tip of the convex portion on the surface of the lead conductor becomes too tapered, resulting in a decrease in strength, which may actually reduce the adhesion with the sealing material.
  • the roughness parameter Svk is, for example, 0.175 [ ⁇ m] or more, 0.18 [ ⁇ m] or more, 0.19 [ ⁇ m] or more, for example, 0.25 [ ⁇ m] or less, 0.24 [ ⁇ m] or less, 0.23 [ ⁇ m] or less, 0.22 [ ⁇ m] or less, 0.21 [ ⁇ m] or less, or 0.20 [ ⁇ m] or less.
  • the surface of the lead conductor that comes into contact with the sealing material is provided as a surface treatment layer. That is, in a preferred embodiment, the lead conductor includes a base material and a surface treatment layer formed on the base material.
  • the surface treatment layer can be a layer consisting of a single layer or multiple plating layers.
  • the surface treatment layer can have a first plating layer formed on the base material and a second plating layer formed on the first plating layer.
  • the surface treatment layer can be a layer consisting of a first plating layer formed on the base material and a second plating layer formed on the first plating layer.
  • the surface of the surface treatment layer can have a surface roughness parameter Svk that satisfies the range described above for the surface of the lead conductor that comes into contact with the sealant.
  • the first plating layer may be a plating layer containing at least one metal selected from, for example, Ni, Cu, Ag, and Co. From the viewpoint of electrolyte resistance, a plating layer containing Ni or a plating layer containing Co can be used. From the viewpoint of controlling surface roughness, a plating layer containing at least one of Ni, Cu, and Ag can be used.
  • the first plating layer can preferably be a roughened Ni plating layer.
  • the roughened Ni plating layer can be provided by a known method, and specifically, can be provided by a method described later in the Examples.
  • the first plating layer has a thickness of, for example, 0.1 to 3 [ ⁇ m], preferably 0.5 to 2 [ ⁇ m], and more preferably 1.0 to 1.5 [ ⁇ m]. It can be a layer. If the thickness of the first plating layer is too thin, it will be difficult to control the roughness parameter Svk to 0.175 [ ⁇ m] or more. On the other hand, if the first plating layer is too thick, productivity and workability will decrease.
  • the surface of the first plating layer can have a surface roughness parameter Svk that satisfies the range described above for the surface of the lead conductor that comes into contact with the sealing material.
  • the second plating layer can be a plating layer containing at least one metal selected from Ni, Cr, Mo, Zr, and Co, preferably Ni. It can be a plating layer containing.
  • the second plating layer can be, for example, a Cr plating layer, a Co plating layer, or a Ni-P plating layer, preferably a Ni-P plating layer.
  • the Ni--P plating layer can be provided by a known method, and specifically, can be provided by a method described later in the Examples.
  • the surface roughness of the surface treatment layer is controlled and high adhesion strength between the lead conductor and the sealing material is achieved. Further, by using the above-mentioned plating layer as the second plating layer, high electrolyte resistance is achieved. Note that in other embodiments, the surface roughness may be controlled by etching or the like after providing the second plating layer on the surface of the lead conductor without providing the first plating layer (roughening plating layer). .
  • the second plating layer has a thickness of, for example, 0.1 to 3.0 [ ⁇ m], preferably 0.3 to 2.0 [ ⁇ m], more preferably 0.5 to 1.0 [ ⁇ m]. ] can be made into a layer of thickness. If the thickness of the second plating layer is too thin, it will be difficult to ensure the necessary electrolyte resistance. On the other hand, if the second plating layer is too thick, not only productivity and workability will decrease, but also the surface roughness parameter Svk of the surface treatment layer will tend to decrease.
  • the Ni-P plating layer has a P content of, for example, 4 to 18 wt%, preferably 6 to 18 wt%, or, for example, 6 to 10 wt%, preferably 6.5 to 9.4 wt%. %.
  • the surface of the second plating layer can have a surface roughness parameter Svk that satisfies the range described above for the surface of the lead conductor that comes into contact with the sealing material.
  • Nonaqueous electrolyte battery also resides in a tab lead comprising the above lead conductor, an electrochemical device including the tab lead, and a non-aqueous electrolyte battery including the tab lead.
  • the nonaqueous electrolyte battery according to the present invention has excellent reliability derived from the tab lead part, that is, stable and high sealing performance and durability, so it can be used in electric transportation equipment, drones, robots, electric vehicles, etc. using nonaqueous electrolyte batteries. Tools and other equipment also have the excellent reliability derived from non-aqueous electrolyte batteries. Therefore, the present invention also applies to these electric transportation devices, drones, robots, power tools, etc.
  • the present invention includes the following (1).
  • a metal lead conductor used in a tab lead for an electrochemical device comprising a metal lead conductor and an insulating resin sealant, A lead conductor having a surface in contact with a sealant on the surface of the lead conductor, the surface having a roughness parameter Svk in a range of 0.175 [ ⁇ m] or more.
  • the lead conductor has a base material and a surface treatment layer formed on the base material, The lead conductor according to (1), wherein the surface in contact with the sealing material of the surface treatment layer has a surface having a roughness parameter Svk in a range of 0.175 [ ⁇ m] or more.
  • the surface treatment layer has a first plating layer formed on the base material and a second plating layer formed on the first plating layer.
  • the second plating layer contains at least one of Ni, Cr, Mo, Zr, and Co.
  • the lead conductor according to (6), wherein the second plating layer has a P content of 6 wt% or more.
  • Base material Copper plate (C1020-O) (60 x 45 x 0.2 mm) (oxygen-free copper, purity 99.96% or more)
  • Ni-P plating Both the front and back surfaces of the roughened Ni-plated substrate were Ni--P plated under the following conditions.
  • the plating thickness was controlled by appropriately adjusting the current application time. As an example, when the current application time was 90 seconds under the following conditions, about 1 ⁇ m of Ni--P plating was formed. The P concentration in the Ni--P plating was 11 wt%. In this way, roughened Ni plating and Ni--P plating samples were obtained with various thicknesses. The roughened Ni-plated and Ni--P plated samples were used as lead conductors for subsequent tests.
  • Ni sulfate bath Ni(II) sulfate hexahydration: 220 to 280 g/L (Ni concentration 4 to 6 wt%)
  • Phosphorous acid 68-92g/L (P concentration 6-8wt%)
  • Current density 10A/ dm2 Temperature: 60°C
  • the plating thicknesses of roughened Ni plating and Ni--P plating were measured under the following conditions. Specifically, the first plating thickness was measured after roughening Ni plating, and the second plating thickness was measured after Ni--P plating. The value obtained by subtracting the first plating thickness from the second plating thickness was defined as the Ni--P plating thickness.
  • Measuring device High performance fluorescent X-ray film thickness meter SFT9550X (manufactured by SII Nano Technology Co., Ltd.) Measurement method: FP method Measurement location: Center of sample
  • the P concentration was measured using an EPMA electron probe microanalyzer (JXA-8500F, manufactured by JEOL Ltd.) under the following conditions.
  • Standard sample InP wafer (P concentration 50 at%), crystal used: PETH, X-ray used: K ⁇ , acceleration voltage 15 kV, irradiation current 1 ⁇ 10 ⁇ 7 A, beam diameter 10 ⁇ m.
  • the X-ray intensity at the P peak position (197.235 mm) of the standard sample was measured five times, and the average value was calculated.
  • Roughness parameters were measured with the following equipment. Measuring device: OPTELICS HYBRID L3 manufactured by lazertec
  • the measurement was performed on the plating surface of the plated base material with a measurement field of view of 200 x 200 ⁇ m, and 9 points in the sample were measured so that there was no bias in the measurement points.
  • the average value of the three points excluding three points was used as the roughness. Details of the measurement conditions are shown in Tables 2 and 3. The obtained roughness parameters are summarized in Table 1.
  • a more specific procedure is to peel off a portion of the front sealing material between the front and back sealing materials, and using that as a starting point, move the electric measuring stand in a constant direction of 180 degrees (longitudinal direction of the lead conductor).
  • the peeling strength was calculated by moving at a high speed and reading the average value of the load in the peeling distance section where the load was stable from the start of peeling.The same operation was performed on the back side, and the average was taken to calculate the peel strength.
  • Example 3 For example, in the sample of Example 3, the average value of the load in the area where the peeling distance was 10 to 30 mm was calculated. On the other hand, in Example 2, the average value of the load in the section where the peeling distance was 5 to 10 mm was used.
  • FIG. 1 A graph of an example of peel strength measurement is shown in FIG.
  • the horizontal axis is peeling distance (mm)
  • the vertical axis is load (N/cm).
  • Ni-P plating electrolyte resistance The electrolyte resistance of Ni--P plating was investigated through the following experiment.
  • a copper substrate (45 x 60 x 0.2 mm) was coated with Ni--P plating with different P contents to a thickness of 1 ⁇ m without roughening Ni plating, and the weight change before and after immersion in the electrolytic solution was measured.
  • the same substrate was provided with a 2 ⁇ m thick Ni plating instead of the Ni--P plating, and the weight change before and after immersion in the electrolytic solution was measured.
  • Electrolyte EC (ethylene carbonate): DMC (dimethyl carbonate): DEC (diethyl carbonate) (1:1:1 [v/vol%]) + LiPF 6 (lithium hexafluorophosphate) (1 mol/L) + H 2 O 1000 ppm Temperature: 80°C Soaking time: 1 week Pouch: Yes (resistance in electrolyte sealed in pouch was investigated)
  • Figure 2 and Table 5 show graphs of the results of studying the electrolyte resistance of Ni--P plating.
  • the horizontal axis of the graph in FIG. 2 is the average P content of the plating, and the vertical axis is the ratio of weight change of the plating sample before and after immersion in the electrolytic solution. If the electrolyte resistance is low, the surface will be corroded by the electrolyte and the weight will decrease after immersion. Therefore, the lower the weight change ratio, the higher the electrolyte resistance.
  • Weight change ratio (Weight of Ni-P plating sample before immersion” - "Weight of Ni-P plating sample after immersion") / ⁇ ("Weight of Ni-plating sample before immersion” - "Weight of Ni-P plating sample after immersion”) Weight of Ni plating sample”) ⁇ 0.5 ⁇
  • ⁇ 0.5 is added for standardization because the thickness of the Ni plating is 2 ⁇ m and the thickness of the Ni-P plating is 1 ⁇ m.
  • the electrolyte resistance is excellent when the weight change ratio before and after the immersion test is, for example, 0.5 or less, preferably 0.4 or less. can do.
  • the amount of weight change is smaller than when only Ni plating is performed, that is, the electrolyte resistance It can be seen that this has improved. Furthermore, as shown in the graph of FIG. 2 and Table 5, the amount of weight change changed in approximately three stages (P concentration less than 6 wt%, 6 to 10 wt%, and more than 10 wt%) depending on the P content.
  • the weight change ratio (that is, electrolyte resistance) was greatly improved compared to when the P content was less than 6 wt%. Furthermore, within the P content range of 6 to 10 wt%, the amount of weight change, that is, the electrolyte resistance was almost constant. In the region where the P content exceeds 10 wt%, the weight change decreases again, that is, the electrolyte resistance improves.
  • Ni--P surface structure observed in the SEM image changed at the above three levels of P concentration. More specifically, the occurrence of pores was confirmed in regions where the average P content was less than 6 wt%. Further, in the region where the average P content was 6 to 10 wt%, some corrosion was observed along the grooves derived from the rolling marks, and in the region where the average P content was higher than 10 wt%, almost no corrosion was observed.
  • the P concentration in the Ni-P plating layer is preferably 4 to 18 wt%. This is because if the P concentration is 4 wt%, the electrolyte resistance may be reduced, and if the P concentration is 18 wt% or more, the productivity may be significantly reduced.
  • the P concentration in the Ni--P plating layer can be more preferably 6 to 10 wt%.
  • the electrolyte resistance is significantly improved, and within this P concentration range, the electrolyte resistance is almost constant and corrosion is almost not observed. This is because lead conductors with excellent quality stability can be provided.
  • the P concentration in the Ni--P plating layer can be set to 6.5 to 9.4 wt%.
  • the P concentration in the Ni--P plating layer is not uniform within the surface and may vary to some extent. Therefore, by setting the P concentration within this range, uniform electrolyte resistance can be achieved within the surface.
  • the adhesion between the lead conductor and the sealing material can be managed more accurately than before.
  • a tab lead in which the lead conductor and the sealing material are in close contact with each other with high adhesion force can be stably obtained.
  • the present invention is an industrially useful invention.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

La présente invention concerne un conducteur métallique qui est utilisé avec une languette conductrice pour des dispositifs électrochimiques, la languette conductrice comprenant un conducteur métallique et un matériau d'étanchéité qui est formé d'une résine isolante, une surface du conducteur, à savoir la surface venant en contact avec le matériau d'étanchéité, ayant un paramètre de rugosité Svk supérieur ou égal à 0,175 (µm), ce qui permet de réguler l'adhérence entre le conducteur et le matériau d'étanchéité d'une manière plus précise que jamais auparavant.
PCT/JP2023/017943 2022-05-16 2023-05-12 Languette conductrice pour batteries à électrolyte non aqueux WO2023223969A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017175A (ja) * 2012-07-10 2014-01-30 Sumitomo Electric Ind Ltd リード導体、及び電力貯蔵デバイス
JP2014086139A (ja) * 2012-10-19 2014-05-12 Sumitomo Electric Ind Ltd タブリード及びタブリードの製造方法並びに電気化学デバイス
JP2019104949A (ja) * 2017-12-08 2019-06-27 東洋鋼鈑株式会社 表面処理鋼板およびその製造方法
WO2020017655A1 (fr) * 2018-07-19 2020-01-23 東洋鋼鈑株式会社 Feuille plaquée de nickel rugosifiée

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014017175A (ja) * 2012-07-10 2014-01-30 Sumitomo Electric Ind Ltd リード導体、及び電力貯蔵デバイス
JP2014086139A (ja) * 2012-10-19 2014-05-12 Sumitomo Electric Ind Ltd タブリード及びタブリードの製造方法並びに電気化学デバイス
JP2019104949A (ja) * 2017-12-08 2019-06-27 東洋鋼鈑株式会社 表面処理鋼板およびその製造方法
WO2020017655A1 (fr) * 2018-07-19 2020-01-23 東洋鋼鈑株式会社 Feuille plaquée de nickel rugosifiée

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