WO2023218607A1 - 光回路チップ - Google Patents

光回路チップ Download PDF

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Publication number
WO2023218607A1
WO2023218607A1 PCT/JP2022/020083 JP2022020083W WO2023218607A1 WO 2023218607 A1 WO2023218607 A1 WO 2023218607A1 JP 2022020083 W JP2022020083 W JP 2022020083W WO 2023218607 A1 WO2023218607 A1 WO 2023218607A1
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WO
WIPO (PCT)
Prior art keywords
optical
refractive index
alignment
layer
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/020083
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English (en)
French (fr)
Japanese (ja)
Inventor
悠介 那須
貴 山田
清史 菊池
百合子 川村
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NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP2024520184A priority Critical patent/JP7828014B2/ja
Priority to PCT/JP2022/020083 priority patent/WO2023218607A1/ja
Publication of WO2023218607A1 publication Critical patent/WO2023218607A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device

Definitions

  • the present disclosure relates to an optical circuit chip included in an optical module.
  • optical components are constructed from integrated optical circuits in order to meet the demands for further miniaturization, lower cost, and higher capacity.
  • integrated optical circuits can be constructed based on various materials, Si photonics using silicon (Si) as a core material has been attracting attention in recent years. Silicon has a higher refractive index than known low refractive index materials, and Si photonics has stronger optical confinement than optical circuits made of low refractive index materials, making it possible to reduce the allowable bending radius of optical waveguides. .
  • Si photonics can realize various circuit elements such as optical couplers, multiplexers, filters, modulators, and optical receivers that make up optical circuits, and can further miniaturize optical circuits that integrate these on a single chip. be able to.
  • terminals that can input and output light and electricity are provided on the Si photonics chip.
  • a Si photonics chip capable of inputting and outputting light, etc. is connected to an optical fiber of a fiber array to constitute an optical module.
  • the Si photonics chip and the optical fiber be connected so that the optical loss due to the connection is sufficiently low.
  • Alignment when connecting optical fibers is performed, for example, by active alignment, which searches for the optimal alignment position by injecting light into the optical fiber and monitoring the intensity of the light that is transmitted or reflected through the optical circuit in the Si photonics chip. be exposed. Active alignment is described in, for example, Non-Patent Document 1.
  • FIG. 1 is a top view for explaining the connection between a known Si photonics chip C and an optical fiber 21.
  • the optical waveguide of the Si photonics chip C includes a plurality of input/output sections 11.
  • An optical fiber 23 including a core 21 and a cladding layer is fixed to a fiber array F.
  • the optical fibers 23 are fixed by passing the optical fibers 23 through the fiber array F and applying adhesive 22 around them.
  • an SSC spot Size Converter
  • the fiber array F can take various assembly forms, such as a lensed fiber array.
  • the optical module In assembling the optical module, it is necessary to accurately align the core 21 of the optical fiber 23 and the input/output section 11, and to efficiently input light from a laser light source (not shown) into the optical waveguide.
  • the required alignment accuracy is at least about 0.1 ⁇ m to 1.0 ⁇ m.
  • Such high-precision alignment is difficult to achieve with alignment using image processing, so active alignment is performed by actually inputting light from the optical fiber 23 to the input/output section 11 and monitoring the coupling loss. It will be done.
  • incident light is observed by a photodetector or the like provided in the Si photonics chip C to align the Si photonics chip C and the fiber array F.
  • observing light using a photodetector has the disadvantage that it is necessary to drive the photodetector in the optical circuit while allowing the light to enter, and this operation is complicated.
  • optical circuits using Si photonics have a very large refractive index and are highly confining of light.
  • the mode field diameter of the optical waveguide used in the optical circuit is as small as several 100 nm, which is significantly different from the mold diameter of the optical fiber 21, which is about several ⁇ m to 10 ⁇ m.
  • SSC SSC in the input/output section 11 to enlarge the mode field diameter and bring it closer to the mold field diameter of the optical fiber 21, such technology also makes it difficult to connect the Si photonics chip C and the optical fiber 23. It is difficult to reduce losses sufficiently.
  • the present disclosure aims to solve these problems, and relates to an optical circuit chip that can connect a photonics chip and an optical fiber with high accuracy and easily, and has low coupling loss.
  • an optical circuit chip including an optical circuit connected to a fiber array, the optical circuit chip having a first layer and a refractive index higher than that of the first layer. a second layer with a low refractive index, and a third layer that includes the first layer and the second layer and has a lower refractive index than the second layer; a first optical waveguide connected to the optical circuit formed in the second layer; a second optical waveguide formed in the second layer and connected to the first optical waveguide; , at least a pair of alignment waveguides having one end connected to an end surface of the substrate facing the fiber array.
  • the photonics chip and the optical fiber can be easily connected with high precision, and an optical module with low coupling loss can be provided.
  • FIG. 2 is a top view for explaining the connection between a known Si photonics chip and an optical fiber.
  • (a) is a top view for explaining the substrate of the first embodiment, and (b) is a cross-sectional view.
  • (a) is a top view for explaining the optical module of the first embodiment, and (b) is a cross-sectional view.
  • (a) is a top view for explaining the effects of the first embodiment, and (b) is a cross-sectional view.
  • (a) is a top view for explaining the optical module of the second embodiment, and (b) is a cross-sectional view.
  • (a) is a top view for explaining the configuration of an optical module according to a third embodiment, and (b) to (d) are top views for explaining alignment performed in the optical module.
  • (a) and (b) are both diagrams for explaining the process of aligning the optical module of the fourth embodiment.
  • the optical module of the embodiment includes a substrate and an optical circuit mounted on the substrate. The drawings will be described below with the direction in which the optical circuit is mounted relative to the substrate as "up”.
  • FIGS. 2(a) and 2(b) are diagrams for explaining the structure of the substrate of the optical module 10 of the first embodiment.
  • the optical module 10 has an optical circuit chip 2 and a fiber array 4, and FIG. 2(a) is a schematic top view showing a state in which the optical circuit chip 2 and the fiber array 4 are aligned, and FIG. ) is a schematic cross-sectional view along arrows IIb and IIb in FIG. 2(a).
  • the optical module 10 according to the first embodiment of the present disclosure includes a high refractive index layer 207 that is a first layer, and a low refractive index layer 206 that is a second layer having a lower refractive index than this high refractive index layer 207. and, including.
  • the optical module 10 includes a high refractive index layer 207 and a low refractive index layer 206, and further includes a lower cladding layer 208 and an upper cladding layer 209, which are third layers having a lower refractive index than the low refractive index layer 206.
  • the high refractive index layer 207, the low refractive index layer 206, the lower cladding layer 208, and the upper cladding layer 209 constitute the substrate 1 of the optical circuit chip 2, and this substrate 1 is a planar optical circuit board.
  • the fiber array 4 has a base 405, a stepped portion 405a formed on the base 405, and four optical fibers 403 passing through the stepped portion 405a.
  • the four optical fibers 403 have a core 401 and are fixed to the base 405 in parallel with an adhesive 402 applied between the core 401 and the stepped portion 405a.
  • the light incident from the optical fiber 403 passes through the low refractive index cores 202a to 202d of the optical circuit chip 2, and propagates to the high refractive index core 201.
  • the high refractive index core 201 functions as an input/output section connected to an optical circuit (not shown).
  • the optical circuit chip 2 has a lower cladding layer 208 formed on a Si substrate 200 serving as a circuit support substrate, and a high refractive index layer 207 is formed on the lower cladding layer 208.
  • the high refractive index layer 207 is processed into the high refractive index core 201 by known photolithography and etching.
  • a low refractive index layer 206 is formed on the high refractive index core 201.
  • Low refractive index cores 202a, 202b, 202c, and 202d, which are second optical waveguides, are formed in the low refractive index layer 206 by known photolithography and etching. Note that the low refractive index cores 202a to 202d are formed by processing the low refractive index layer 206 by known photolithography and etching.
  • the above process may be performed, for example, by depositing the lower cladding layer 208 on the Si substrate 200, and further forming and etching the high refractive index layer 207 to form the high refractive index core 201. Furthermore, a lower cladding layer 208 and an upper cladding layer 209 are deposited from above the high refractive index core 201, and a part of the upper cladding layer 209 is etched and removed in accordance with the low refractive index cores 202a to 202d. A layer 206 may also be deposited. An upper cladding layer 209 is further deposited on the low refractive index cores 202a to 202d.
  • the high refractive index core 201, the low refractive index core 202a, etc. are arranged with a part of the upper cladding layer 209 sandwiched therebetween.
  • Light output from an optical circuit (not shown) is propagated from the high refractive index core 201 through the upper cladding layer 209 to the low cladding layer 202a and the like.
  • the low refractive index cores 202a to 202d are SSCs, and the light output from the optical fiber side of the optical module 10 is transmitted to the high refractive index core 201, the lower cladding layer 208, and the upper cladding layer 209.
  • Optical coupling is achieved by changing the spot size of the light so that it can be coupled to the optical waveguide with low loss. Such a configuration is effective in reducing the connection loss of the optical module 10 in the first embodiment.
  • the high refractive index layer 207 is a layer whose basic optical waveguide structure is made of Si, and its refractive index is approximately equal to that of Si.
  • the low refractive index layer 206 may be an insulating layer having a refractive index lower than that of Si, and for example, SiN, SiO x , or SiNO is used.
  • the lower cladding layer 208 and the upper cladding layer 209 may be made of, for example, SiO 2 which is known as a material for cladding layers. According to such a layer structure, an optical waveguide structure having a double core layer is realized.
  • the distance between the high refractive index layer 207 and the low refractive index layer 206 is preferably set to an interlayer distance that allows adiabatic coupling of light in consideration of coupling loss. Furthermore, it is preferable that the optical waveguide structure including the high refractive index core 201 and the low refractive index core 202d has a structure with small coupling loss.
  • the optical waveguide structure has a double structure of a high optical refractive index core 201 and a low refractive index core 202d, and the side facing the optical circuit chip 4 of the low refractive index layer 202d in FIG. 2 is an optical fiber. 403, and at the same time, the mode field diameter is set such that the side of the low refractive index layer 202d facing the optical circuit (not shown) can be optically coupled with the optical waveguide used in the optical circuit with low loss. Designed. Furthermore, in the first embodiment, the low refractive index layer 202d is made of SSC, so that the spot size gradually changes in the direction in which the light travels.
  • the mode field diameter of the optical waveguide used in the optical circuit of the optical circuit chip 2 can be adjusted with higher accuracy and the connection loss with the fiber array 4 can be further reduced.
  • the optical circuit chip 2 whose mode field diameter is enlarged has improved connection tolerance between the low refractive index cores 202a to 202d and the optical fiber 403, and the alignment precision required when connecting the optical fibers can be greatly relaxed.
  • FIG. 3(a) and 3(b) are both diagrams for explaining the optical module 20 of the first embodiment, and FIG. 3(a) is a top view of the optical module 20, and FIG. b) is a sectional view taken along arrow lines IIIb and IIIb in FIG. 3(a).
  • the optical module of the first embodiment includes an optical circuit chip 3 and a fiber array 5.
  • the optical circuit chip 3 includes a Si substrate 300, a high refractive index core 301 formed by a high refractive index layer 307, and low refractive index cores 302a to 302d formed by a low refractive index layer 306.
  • the optical circuit chip 3 includes a lower cladding layer 308 that includes a pair of alignment cores 302e and 302f, which are alignment waveguides, in a low refractive index layer 306, a high refractive index core 301, and low refractive index cores 302a to 302d; An upper cladding layer 309 is provided.
  • the alignment core 302e has one end eE1 connected to the end face 3E of the optical circuit chip 3 facing the fiber array 5, and the other end eE2 connected to one end fE2 of the alignment core 302f.
  • the other end fE1 of the alignment core 302f is connected to the end surface 3E.
  • the end eE2 and the end fE2 are connected by an optical waveguide 305.
  • the alignment cores 302e, 302f and the optical waveguide 305 are all formed within the low refractive index layer 306, and connections are made within the low refractive index layer 306.
  • the fiber array 5 includes a stepped portion 505a on the base 505, and six optical fibers 503 corresponding to the low refractive index cores 302a to 302d and alignment cores 302e and 302f of the optical circuit chip.
  • Each optical fiber 503 has a core 501, passes through a stepped portion 505a, and is fixed to a base 505 with an adhesive 502.
  • Alignment of the optical module 20 of the first embodiment is performed by inputting light from a not-shown light source such as a laser through the optical fiber 503 connected to the alignment core 302e.
  • the light incident on the optical fiber 503 propagates to the alignment core 302e, passes through the optical waveguide 305, and enters the alignment core 302f.
  • the light is emitted from the alignment core 302f through the optical fiber 503, and is monitored by, for example, a d-light power meter.
  • Alignment is performed by adjusting the relative positions of the optical fiber 503 and the optical circuit chip 3 so that the intensity of the monitored light is maximized.
  • the pitch of the optical fiber 503 corresponds to the pitch of the low refractive index cores 302a to 302d, and the optical axes of the low refractive index cores 302a to 302d and the optical fiber 503 are aligned by alignment using the alignment cores 302e and 302f. Connected. This adjustment will be referred to as “alignment” hereinafter.
  • FIGS. 4A and 4B are diagrams for explaining an optical module in which an alignment core is formed in a high refractive index layer.
  • FIG. 4(a) is a top view
  • FIG. 4(b) is a cross-sectional view of this optical module along arrows IVb and IVb shown in FIG. 4(a).
  • a high refractive index core 301, alignment cores 302e and 302f, and an optical waveguide 305 are all formed in a high refractive index layer.
  • the high refractive index core 301 and the optical waveguide 305 intersect, and a large optical loss occurs in the high refractive index core 301.
  • the optical module 20 of the first embodiment has a dual core structure including a high refractive index core 301 and low refractive index cores 302a to 302d. Then, the optical module 20 forms the low refractive index cores 302a to 302d, the alignment cores 302e and 302f, and the optical waveguide 305 in the low refractive index layer 306 to avoid intersection between the optical waveguide 305 and the high refractive index core 301. . With such a configuration, the first embodiment can prevent optical loss in the high refractive index core 301.
  • the optical module 20 can receive and monitor light using only the light source of the alignment device and an optical power meter. Therefore, alignment between the optical circuit chip 3 and the fiber array 5 can be simplified. Furthermore, the optical module 20 of the first embodiment does not require a photodetector to be provided in the optical circuit, and is effective in downsizing and simplifying the optical circuit of the optical circuit chip 3.
  • FIGS. 5A and 5B are diagrams showing an optical module 30 of the second embodiment.
  • FIGS. 5A and 5B are top views showing the optical circuit chip 6 and the fiber array 7 during alignment.
  • the optical circuit chip 6 includes a high refractive index core 601 and low refractive index cores 602a, 602b, 602c, and 602d.
  • the low refractive index cores 602a to 602d have an SSC structure.
  • the optical circuit chip 6 includes alignment cores 602e and 602f, and the alignment cores 602e and 602f are connected by an optical waveguide 601.
  • the fiber array 7 includes a base 705 having a stepped portion 705a, and optical fibers 703 that penetrate the stepped portion 705a and are arranged in parallel.
  • Optical fiber 703 includes a core 701 and is fixed to base 705 with adhesive 702 .
  • the distance between the pair of alignment cores 602e and 602f is equal to the distance between any two of the plurality of optical fibers 703.
  • the optical circuit chip 6 and fiber array 7 configured as described above are aligned as follows. As shown in FIG. 5A, first, the optical circuit chip 6 and the fiber array 7 are aligned using the alignment cores 602e and 602f and the optical fiber 703. After the alignment is completed, the fiber array 7 is moved in the ⁇ X direction shown in FIG. 5(a), and the low refractive index cores 602a to 602d and the optical fibers 703 are connected as shown in FIG. 5(b).
  • the fiber array 7 is moved by a known length after alignment, and the low refractive index cores 602a to 602d and the optical fibers 703 can be connected so that their optical axes coincide.
  • the known length may be, for example, a designed value of the distance between the alignment core 602e and the low refractive index core 602a of the optical circuit chip 6.
  • the cost of the fiber array 7 can be reduced compared to the first embodiment.
  • FIG. 6(a), FIG. 6(b), FIG. 6(c), and FIG. 6(d) are all top views for explaining the optical module 40 of the third embodiment.
  • FIG. 6(a) explains the configuration of the optical module
  • FIGS. 6(b) to 6(d) explain the alignment performed in the optical module 40.
  • the third embodiment like the second embodiment, does not provide alignment optical fibers on the side of the fiber array 7, and can perform alignment with higher precision than the second embodiment. enable.
  • the optical module 40 includes an optical circuit chip 8 and a fiber array 7, as shown in FIGS. 6(b) to 6(d).
  • the optical circuit chip 8 has four high refractive index cores 801 and four low refractive index cores 802a to 802d.
  • the optical circuit chip 8 has two pairs of alignment cores 802e and 802f, and alignment cores 802g and 802h.
  • the alignment cores 802e and 802f are connected by an optical waveguide 805A, and the alignment cores 802g and 802h are connected by an optical waveguide 805B.
  • the low refractive index cores 802a to 802d constitute an SCC.
  • a circuit consisting of alignment cores 802e and 802f and an optical waveguide 805A is adjusted by an alignment circuit A, and a circuit consisting of alignment cores 802g and 802h and an optical waveguide 805B is adjusted. Also referred to as core circuit B.
  • the light input/output circuit including the low refractive index cores 802a to 802d and the alignment circuit B are shifted by a distance L in the -X direction, and the alignment circuit B is shifted in the X direction. are arranged so as to be shifted by a distance L.
  • alignment circuit A is used to align the optical circuit chip 8 and the fiber array 7
  • alignment circuit B is used to align the optical circuit chip 8 and the fiber array 7. 7. Then, the optical circuit chip 8 and the fiber array 7 are connected at the center of the optimal position determined by two alignments.
  • both the optical waveguides 805A and 805B are formed within the low refractive index layer, they may intersect with each other.
  • the optical waveguides 805A and 805B do not affect the connection loss unless they intersect the high refractive index core 801. Further, optical loss due to the intersection of the optical waveguides 805A and 805B does not affect the alignment accuracy with the optical circuit chip 8 and the fiber array 7.
  • the spacing between any two of the optical fibers 703 matches the spacing between the alignment cores of the optical circuit chip 8.
  • the optical circuit chip 8 and the fiber array 7 are aligned using the alignment circuit A. Alignment is performed by monitoring the light entering and exiting through the low refractive index core 802e, the optical waveguide 805A, and the low refractive index core 802f.
  • the optical circuit chip 8 and the fiber array 7 are aligned using the alignment circuit B, as shown in FIG. 6(c).
  • the fiber array 7 is moved in the -X direction in FIG. 6(a) using a stage (not shown).
  • Alignment by the alignment circuit B is performed by monitoring the light incident and emitted through the low refractive index core 802g, the optical waveguide 805B, and the low refractive index core 802h.
  • the optimum position of the fiber array 7 with respect to the optical circuit chip 8 determined in the alignment circuit A is determined in the alignment circuit B. This is different from the determined optimal position of the fiber array 7.
  • the fiber array 7 is connected to the optical circuit chip 8 at the center of the optimal alignment position determined by alignment performed twice.
  • the optimal position determined by alignment using alignment circuits A and B is based on the relative position of optical circuit chip 8 and fiber array 7. If the optimum position is expressed, for example, only on the X axis, the center of the optimum position may be, for example, the center point of two optimum positions expressed by the coordinates of the stage.
  • connection position between the optical circuit chip 8 and the fiber array 7 can be determined based on the relative positional relationship between the two. Therefore, in the third embodiment, even if the absolute precision of the amount of movement of the stage that moves the fiber array 7 is not high enough, the optical circuit chip 8 and the fiber array 7 can be properly aligned and the optical loss can be reduced. It is possible to realize connections with fewer connections.
  • the third embodiment can improve alignment accuracy compared to the second embodiment in which the fiber array is moved from a position determined by alignment based on the absolute moving distance of the stage. Most known stages have higher accuracy in relative position than in absolute position, and therefore the third embodiment is effective in realizing an optical module 40 with low coupling loss.
  • the fourth embodiment differs from the first embodiment in that alignment cores 112e and 112f are composed of one SSC and a reflection circuit.
  • the reflection circuit for example, a loopback mirror or the like is suitably used.
  • a reflection circuit for alignment it is necessary to form the reflection circuit sufficiently separated from the main circuit in order to avoid intersection with the light input/output circuit (main circuit).
  • the reflection circuit is a relatively large circuit, separating it from the main circuit increases the size of the optical circuit chip. Further, as the centering circuit and the main circuit are separated from each other, the amount of movement of the final fiber array increases, and the accuracy of alignment decreases.
  • the alignment circuit including the reflection circuit is formed in the low refractive index layer, and the main circuit is formed in the high refractive index layer.
  • FIGS. 7(a) and 7(b) are top views for explaining the optical module 50 of the fourth embodiment, each showing an alignment process.
  • the optical module 50 includes an optical circuit chip 12 and a fiber array 7.
  • the optical circuit chip 12 includes a high refractive index core 111 formed in a high refractive index layer, low refractive index cores 112a to 112d formed in a low refractive index, alignment cores 112e and 112f, and reflection circuits 121 and 122. ing.
  • the alignment core 112e and the reflection circuit 121, and the alignment core 112f and the reflection circuit 122 each constitute an alignment circuit.
  • light enters the alignment core 112e from the optical fiber 703, and the reflected light is monitored to perform alignment.
  • the alignment circuit and the main circuit are separated from each other in the surface direction of the optical circuit chip 12 as well as in the thickness direction, thereby making it possible to prevent the optical circuit chip 12 from increasing in area. .
  • the inclination and position of the fiber array 7 can be controlled. This makes it possible to grasp the connection loss with the optical circuit chip 12 and reduce the connection loss with the optical circuit chip 12.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
PCT/JP2022/020083 2022-05-12 2022-05-12 光回路チップ Ceased WO2023218607A1 (ja)

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JP2024520184A JP7828014B2 (ja) 2022-05-12 2022-05-12 光回路チップ
PCT/JP2022/020083 WO2023218607A1 (ja) 2022-05-12 2022-05-12 光回路チップ

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07248427A (ja) * 1994-03-09 1995-09-26 Nippon Telegr & Teleph Corp <Ntt> 光導波路・光ファイバ接続方法および接続装置
JPH07318749A (ja) * 1994-05-20 1995-12-08 Furukawa Electric Co Ltd:The 光導波路と光ファイバの調心方法
JPH08152538A (ja) * 1994-11-30 1996-06-11 Kyocera Corp 光導波路の結合構造
US20150247974A1 (en) * 2014-02-28 2015-09-03 Teraxion Inc. Spot-size converter for optical mode conversion and coupling between two waveguides
JP2016024439A (ja) * 2014-07-24 2016-02-08 日本電信電話株式会社 光回路部品、および光回路部品と光ファイバとの接続構造
DE202008018635U1 (de) * 2008-02-29 2017-02-08 Google Inc. Optischer Modenwandler, insbesondere für die Kopplung eines Lichtwellenleiters und eines Hochindexkontrast-Wellenleiters
JP2017534081A (ja) * 2014-11-11 2017-11-16 フィニサー コーポレイション ２段の断熱結合されたフォトニック・システム
JP2018005067A (ja) * 2016-07-06 2018-01-11 日本電気株式会社 アライメント用光学測定素子及び該光学測定素子を用いた光プローブのアライメント方法
WO2018084238A1 (ja) * 2016-11-07 2018-05-11 Ｎｔｔエレクトロニクス株式会社 光回路基板、光デバイス、およびアライメント方法
WO2020059639A1 (ja) * 2018-09-19 2020-03-26 日本電信電話株式会社 光回路および光接続構造体

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07248427A (ja) * 1994-03-09 1995-09-26 Nippon Telegr & Teleph Corp <Ntt> 光導波路・光ファイバ接続方法および接続装置
JPH07318749A (ja) * 1994-05-20 1995-12-08 Furukawa Electric Co Ltd:The 光導波路と光ファイバの調心方法
JPH08152538A (ja) * 1994-11-30 1996-06-11 Kyocera Corp 光導波路の結合構造
DE202008018635U1 (de) * 2008-02-29 2017-02-08 Google Inc. Optischer Modenwandler, insbesondere für die Kopplung eines Lichtwellenleiters und eines Hochindexkontrast-Wellenleiters
US20150247974A1 (en) * 2014-02-28 2015-09-03 Teraxion Inc. Spot-size converter for optical mode conversion and coupling between two waveguides
JP2016024439A (ja) * 2014-07-24 2016-02-08 日本電信電話株式会社 光回路部品、および光回路部品と光ファイバとの接続構造
JP2017534081A (ja) * 2014-11-11 2017-11-16 フィニサー コーポレイション ２段の断熱結合されたフォトニック・システム
JP2018005067A (ja) * 2016-07-06 2018-01-11 日本電気株式会社 アライメント用光学測定素子及び該光学測定素子を用いた光プローブのアライメント方法
WO2018084238A1 (ja) * 2016-11-07 2018-05-11 Ｎｔｔエレクトロニクス株式会社 光回路基板、光デバイス、およびアライメント方法
WO2020059639A1 (ja) * 2018-09-19 2020-03-26 日本電信電話株式会社 光回路および光接続構造体

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