WO2023213247A1 - 散热结构和具有散热结构的待散热设备 - Google Patents

散热结构和具有散热结构的待散热设备 Download PDF

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Publication number
WO2023213247A1
WO2023213247A1 PCT/CN2023/091738 CN2023091738W WO2023213247A1 WO 2023213247 A1 WO2023213247 A1 WO 2023213247A1 CN 2023091738 W CN2023091738 W CN 2023091738W WO 2023213247 A1 WO2023213247 A1 WO 2023213247A1
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WIPO (PCT)
Prior art keywords
heat dissipation
heat
dissipation structure
gravity
conductive base
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PCT/CN2023/091738
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English (en)
French (fr)
Inventor
肖攀
陈国强
张宁
冯甲
郝旭峰
Original Assignee
中兴通讯股份有限公司
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Publication of WO2023213247A1 publication Critical patent/WO2023213247A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • Embodiments of the present disclosure relate to, but are not limited to, the field of heat dissipation technology, and in particular, to a heat dissipation structure and a heat dissipation device having the heat dissipation structure.
  • the present disclosure provides a heat dissipation structure and heat dissipation equipment to solve the problem of uneven heat dissipation effect of the heat dissipation structure of existing communication equipment and avoid insufficient heat dissipation capability and excessive temperature in the upper part of the communication equipment.
  • an embodiment of the present disclosure provides a heat dissipation structure for use in a device to be heat dissipated.
  • the device to be heat dissipated has a heating component, wherein the heat dissipation structure includes a thermal conductive base and a plurality of heat dissipation fins; At least a part is configured to be in contact with the heat-generating component of the device to be heat-dissipated; the plurality of heat sinks are provided on the thermally conductive base, and when the heat dissipation structure is used, the plurality of heat sinks are arranged to be in contact with gravity.
  • the heat dissipation channel extends along the gravity direction, and the width of at least part of the heat dissipation channel increases along the gravity direction, so that the heat dissipation channel is at the uppermost end along the gravity direction.
  • the width at is less than the width at the lowest end.
  • embodiments of the present disclosure provide a device to be heat dissipated, including a heating component and any heat dissipation structure of the embodiment of the present disclosure, wherein a thermal conductive channel is formed between the thermal conductive base and the heating component; during normal use , one end of the device to be heat dissipated is set upward.
  • Figure 1 is a schematic front view of a heat dissipation structure in some related technologies
  • Figure 2 is a schematic three-dimensional structural diagram of a heat dissipation structure provided by an embodiment of the present disclosure
  • Figure 3 is a schematic front view of the heat dissipation structure of Figure 2;
  • Figure 4 is a schematic three-dimensional structural diagram of another heat dissipation structure provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic front view of the heat dissipation structure of Figure 4.
  • Figure 6 is a schematic three-dimensional structural diagram of yet another heat dissipation structure provided by an embodiment of the present disclosure.
  • Figure 7 is a schematic front view of the heat dissipation structure of Figure 6;
  • Figure 8 is a block diagram of a device to be heat dissipated according to an embodiment of the present disclosure
  • plan and/or cross-sectional illustrations are schematic illustrations of the disclosure. Accordingly, example illustrations may be modified based on manufacturing techniques and/or tolerances.
  • the present disclosure is not limited to the embodiments shown in the drawings but includes modifications of configurations formed based on manufacturing processes. Accordingly, the regions illustrated in the figures are of a schematic nature and the shapes of the regions shown in the figures are illustrative of the specific shapes of regions of the element and are not intended to be limiting.
  • certain equipment such as communication equipment
  • its heat dissipation structure can adopt a straight tooth design.
  • a thermally conductive base 1 such as a thermally conductive substrate
  • a thermally conductive base 1 such as a thermally conductive substrate
  • the heat sink 2 is parallel to the direction of gravity, so that the heated air will flow upward along the heat dissipation channel 3 between the heat sink 2 (arrow in Figure 1), and take away the heat.
  • embodiments of the present disclosure provide a heat dissipation structure for use in a device to be heat dissipated, where the device to be heat dissipated has a heat-generating component.
  • the heat dissipation structure of the embodiment of the present disclosure is used in devices to be heat dissipated with heat-generating components (such as chips, etc.) that generate heat to dissipate the heat generated by the heat-generating components.
  • heat-generating components such as chips, etc.
  • the device to be heat dissipated has a predetermined setting mode, that is, during normal use, one end of the device to be heat dissipated can be set upward (such as hanging installation). .
  • the device to be heat dissipated may be a communication device, such as an AAU (Active Antenna Processing Unit) device, an RRU (Remote Radio Unit) device, etc. It should be understood that the form of the device to be heat dissipated is not limited to this, and it can also be any other device that requires heat dissipation.
  • AAU Active Antenna Processing Unit
  • RRU Remote Radio Unit
  • the heat dissipation structure of the embodiment of the present disclosure includes a thermally conductive base 1 and a plurality of heat sinks 2; at least part of the thermally conductive base 1 is configured to contact the heating components of the device to be heat dissipated; a plurality of heat dissipation fins are provided on the thermally conductive base 1 and when the heat dissipation structure is in use, the plurality of heat dissipation fins 2 are arranged to form a heat dissipation flow between adjacent heat dissipation fins 2 in a direction perpendicular to the direction of gravity (ie, the vertical direction).
  • the heat dissipation channel 3 extends along the direction of gravity, and at least part of the width of the heat dissipation channel 3 increases along the direction of gravity. That is to say, the width of the heat dissipation channel 3 at the uppermost end along the direction of gravity is smaller than the width at the lowermost end.
  • the heat dissipation structure of the embodiment of the present disclosure has a thermal conductive base 1, and the thermal conductive base 1 can form a thermal conductive channel with the heating component (for example, the thermal conductive base 1 can be in direct contact with the heating component, or in contact with the shell housing the heating component) ), so that the heat generated by the heating component can be conducted to the thermally conductive substrate 1 .
  • the thermally conductive base 1 is provided with a plurality of protruding heat sinks 2, so the heat from the thermally conductive base 1 can continue to be conducted to the heat sinks 2.
  • the sides of the heat sink 2 and the surface of the thermally conductive base 1 define a heat dissipation channel 3 for air flow (that is, the heat dissipation channel 3 is the interval between adjacent heat sinks 2), so the heat can pass through the sides of the heat sink 2 and The surface of the thermal conductive base 1 is conducted to the air in the heat dissipation channel 3 .
  • the heat dissipation channel 3 extends along the direction of gravity, and at least part (of course, it can be all) of the heat dissipation channel 3 is as wide as the width (that is, the distance between adjacent heat sinks 2 on both sides) increases along the direction of gravity, that is, for any two positions of the heat dissipation channel 3, the width at the lower position is at least not less than the width at the upper position; moreover, the heat dissipation channel 3 is wider at least at the lower end than at the upper end, so Therefore, the heat dissipation flow channel 3 is in the form of "narrow at the top and wide at the bottom" as a whole.
  • the heat dissipation channel 3 "extends" along the direction of gravity means that the heat dissipation channel 3 is “wholly" strip-shaped in the direction of gravity, but it does not mean that the heat dissipation channel 3 must be a completely regular shape, nor does it mean that the heat dissipation channel 3 "extends” along the direction of gravity.
  • the axis representing the heat dissipation channel 3 must be completely parallel to the direction of gravity, but a small angle is allowed between the axis of the extension direction of the heat dissipation channel 3 and the direction of gravity (for example, the angle does not exceed 15 degrees, or does not exceed 10 degrees , or no more than 5 degrees, etc.).
  • the heat dissipation flow channel 3 of the heat dissipation structure extends along the direction of gravity, so the air absorbs heat and flows along the heat dissipation flow.
  • the channel 3 gradually rises and heats up gradually; in the embodiment of the present disclosure, the heat dissipation channel 3 is in the form of "narrow at the top and wide at the bottom", that is, a structure similar to a "chimney", which will produce a "suction" effect on the air.
  • the heat dissipation structure of the embodiment of the present disclosure can enhance the heat dissipation effect of its upper part while the overall size remains unchanged (that is, the heat exchange area remains unchanged), and compensate for the decrease in heat dissipation capacity caused by the higher air temperature in the upper part.
  • each position of the equipment to be cooled can obtain good and uniform heat dissipation capabilities, ensuring that components at each position are not overheated, improving the heat dissipation performance of the equipment to be heat dissipated, and extending its service life.
  • the thermally conductive base 1 is a plate-shaped thermally conductive substrate, and all heat sinks 2 are connected to the same side of the thermally conductive substrate.
  • the thermally conductive base 1 can be a "flat plate", so that each heat sink 2 can be provided on the same side of the "flat plate", and on the other side of the "flat plate” Can be used to contact heating parts.
  • the "flat plate” is basically parallel to the direction of gravity, and the heat dissipation flow channel 3 is also basically parallel to the "flat plate”.
  • the form of the thermally conductive base 1 is not limited to this.
  • the thermal conductive base 1 can also be a hollow cylinder, and the heat sink 2 is arranged outside the hollow cylinder.
  • the axis of the cylinder is parallel to the direction of gravity.
  • the plurality of heat sinks 2 are perpendicular to the surface of the thermally conductive base 1 . Specifically, the plurality of heat sinks 2 are perpendicular to the cross section of the cylindrical thermal conductive base 1 .
  • the plurality of heat dissipation fins 2 are allowed to extend in the direction of gravity.
  • multiple heat sinks 2 can be perpendicular to the surface (or the cross section of the cylinder) of the thermally conductive base 1 where they are located (such as perpendicular to the above "flat plate"), And when the heat dissipation device is in normal use, the heat sink 2 extends along the direction of gravity. Therefore, by changing the width of the heat sink 2 itself (that is, the size between the two sides of the heat sink 2), the width of the heat dissipation flow channel 3 can be adjusted accordingly.
  • the heat sink 2 can be “wide at the top and narrow at the bottom", so that the heat dissipation flow channel 3 located between the heat sink 2 is “narrow at the top and wide at the bottom”.
  • the form of the heat sink 2 is not limited to this.
  • the width of the heat sink 2 itself can remain unchanged, but when the heat dissipation device is in normal use, the heat sink 2 is "tilted” relative to the direction of gravity, and the width of the heat dissipation channel 3 is changed through different "tilt angles" of the heat sink 2.
  • At least part of the heat sink 2 has a trapezoidal cross-section in a standard (reference) plane, where the standard plane is parallel to the section or surface at the connection between the thermally conductive base 1 and the heat sink 2; when the heat dissipation structure is used normally When , the lower bottom edge of the trapezoid corresponds to the uppermost end of the heat sink 2 along the direction of gravity.
  • each heat sink 2 can be "trapezoidal", and when the heat dissipation device is in normal use, the long side of the trapezoid faces upward, so that adjacent The distance between the trapezoids (that is, the width of the heat dissipation channel 3) becomes narrower as it goes upward.
  • each heat sink 2 cross section can be the same, and can be an isosceles trapezoid.
  • the upper and lower bottom edges of the trapezoid can be perpendicular to the direction of gravity.
  • the specific shape of the longitudinal section of the heat sink 2 is not limited to a trapezoidal form.
  • the side edges of the longitudinal section of the heat sink 2 may also be arcs. shape, ladder shape and other forms.
  • the plurality of heat sinks 2 may include a first heat sink 21 and a second heat sink 22.
  • the first heat sink 21 has a rectangular cross-section in a standard plane
  • the second heat sink 22 has a cross-section in a standard plane. It is trapezoidal, and the standard plane is parallel to the cross section or surface of the connection between the thermal conductive base 1 and the heat sink 2.
  • the first heat sink 21 is located below the second heat sink 22 in the direction of gravity, and the lower bottom edge of the trapezoid corresponds to the uppermost end of the second heat sink 22 in the direction of gravity.
  • the heat sink 2 can be divided into "two groups", in which the longitudinal section of the first heat sink 21 is rectangular, and the longitudinal section of the second heat sink 22 is trapezoid.
  • the first heat sink 21 is downward, so the width of the heat dissipation flow channels 3 between adjacent first heat sink fins 21 (ie, the lower heat dissipation flow channels 3) is equal; and the second heat sink fins 22 on the top, so the heat dissipation flow channels 3 between the adjacent second heat dissipation fins 22 (that is, the heat dissipation flow channels 3 on the top) are in the form of "narrow at the top and wide at the bottom".
  • the cross-sectional shape of the heat sink 2 is not limited to the above examples.
  • the first heat sink and the second heat sink are directly connected together, so that the cross section of the heat sink 2 is a combined shape in which the lower part is rectangular and the upper part is trapezoidal.
  • At least part of the heat sink 2 has a cavity 4 located in the heat sink 2 in the form of a recess on the side away from the thermally conductive base 1, and the outer wall of the heat sink 2 is provided with a first opening 41 and a second opening 42.
  • One opening 41 and a second opening 42 are respectively connected to the cavity 4; when the heat dissipation structure is in normal use, the first opening 41 is connected to the lowermost end of the cavity 4 along the direction of gravity, and the second opening 42 is connected to the edge of the cavity 4. The uppermost point in the direction of gravity.
  • the interior of the heat sink 2 may be “hollow”, or the “outer wall” of the heat sink 2 and the surface of the thermally conductive base 1 define a hollow space inside the heat sink 2 .
  • the outer wall of the heat sink 2 has a first opening 41 and a second opening 42 communicating with the cavity 4 .
  • the first opening 41 is connected to the lowermost end of the cavity 4
  • the second opening 42 is connected to the uppermost end of the cavity 4 .
  • air can also enter the cavity 4 from the first opening 41 and then flow out from the second opening 42 . Therefore, the above cavity 4 is actually a channel for air circulation, which can increase the actual heat exchange area and improve the heat exchange effect without changing the number and size of the heat sink 2 .
  • first opening 41 and the second opening 42 are various.
  • the cavity 4 is located in the portion of the heat sink 2 above the partition
  • the first opening 41 is located at the lowermost end of the portion of the heat sink 2 above the partition.
  • the two openings 42 are located at the uppermost end of the portion of the heat sink 2 above the partition.
  • the first opening 41 and the second opening 42 may also be located on the “side” of the heat sink 2 .
  • the cross-section of the cavity 4 in a standard plane is a trapezoid, and the standard plane is parallel to the cross section or surface of the connection between the thermal conductive base 1 and the heat sink 2; when the heat dissipation structure is in normal use, the lower bottom edge of the trapezoid Corresponding to the uppermost end of the heat sink 2 in the direction of gravity.
  • the longitudinal section of the above cavity 4 can also be a trapezoid, and when the heat dissipation device is in normal use, the trapezoid also has the lower bottom facing upward, that is, the cavity 4 is "Wide at the top and narrow at the bottom", or "funnel-shaped", so that the thickness of each position of the outer wall of the heat sink 2 can be basically the same.
  • the longitudinal section of the cavity 4 can also be in other forms.
  • the longitudinal section of the cavity 4 is also a rectangle, or it is also a trapezoid with "narrow at the top and wide at the bottom", etc.
  • the heat dissipation structure also includes auxiliary heat dissipation teeth 5; the auxiliary heat dissipation teeth 5 are connected to the thermal conductive base 1, and the auxiliary heat dissipation teeth 5 are spaced apart from the heat dissipation fins 2, and the auxiliary heat dissipation teeth 5 protrude relative to the thermal conductive base 1 is less than the protruding height of the heat sink 2 relative to the thermal conductive base 1, or the protruding height of the auxiliary heat dissipation teeth 5 relative to the thermal conductive base 1 can be consistent with the protruding height of the heat sink 2 relative to the thermal conductive base 1; when the heat dissipation structure is in normal use,
  • the auxiliary heat dissipation teeth 5 extend along the direction of gravity, and are located at the lower part of the heat dissipation channel 3 along the direction of gravity.
  • auxiliary heat dissipation teeth 5 may also be provided between the heat sinks 2 (that is, in the heat dissipation channels 3 ).
  • the height of the auxiliary heat dissipation teeth 5 is smaller than that of the heat sink 2 The height is small, and it also extends along the direction of gravity when the cooling equipment is in normal use (so the auxiliary heat dissipation teeth 5 are also called “short straight teeth"), and the auxiliary heat dissipation teeth 5 are located in the "wider" lower part of the heat dissipation channel 3 Location.
  • the auxiliary heat dissipation teeth 5 can increase the heat dissipation area and further improve the heat dissipation effect without substantially affecting the air flow in the heat dissipation channel 3 (because the heat dissipation channel 3 is wider at its location).
  • auxiliary heat dissipation teeth 5 may also have different widths at different positions, for example, their longitudinal sections
  • the surface can also be a trapezoid with "wide at the top and narrow at the bottom”.
  • the various shapes of the heat sink 2, the cavity 4 in the heat sink 2, and the auxiliary heat dissipation teeth 5 can be independent of each other and can be combined in any way.
  • the disclosed embodiments are not limited to any specific combination.
  • embodiments of the present disclosure provide a device to be heat dissipated.
  • the device to be heat dissipated includes a heat-generating component and any heat dissipation structure according to the embodiment of the present disclosure.
  • a heat conduction channel is formed between the heat-conducting base body of the heat-dissipating structure and the heat-generating component.
  • the device to be heat dissipated in the embodiment of the present disclosure includes a heating component (such as a chip, etc.) that generates heat, and a heat conduction channel is formed between the thermal conductive base of the above heat dissipation structure and the heating component, so that the heat generated by the heating component can be dissipated.
  • a heating component such as a chip, etc.
  • the equipment requiring heat dissipation also has a predetermined setting method, that is, during normal use, one end of the equipment to be heat dissipated can be set upward (such as hanging installation).
  • the device to be heat dissipated may be a communication device, such as an AAU device, an RRU device, etc.
  • the form of the device to be heat dissipated is not limited to this, and it can also be any other device that requires heat dissipation.
  • the device to be heat dissipated further includes a casing; the heat-generating component is provided in the casing, and at least a part of the casing can be configured as a thermally conductive base of the heat dissipation structure or be in direct contact with the thermally conductive base of the heat dissipation structure.
  • the heat dissipation structure can form an integrated structure with the casing of the device to be heat dissipated. That is, the casing is also the thermal conductive base of the heat dissipation structure, and the heat sink is connected to the casing.
  • the form of the heat dissipation structure is not limited to this.
  • the heat dissipation structure can also be a structure connected to the shell of the device to be heat dissipated, that is, the thermal conductive base of the heat dissipation structure can be in contact with the shell to form a heat conduction channel; for another example, the device to be heat dissipated can also be in direct contact with a heating component. And form a thermal conduction channel.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本公开的实施例提供了一种散热结构，用于待散热设备中，所述待散热设备具有发热部件，其中，所述散热结构包括导热基体和多个散热片；所述导热基体的至少一部分被构造成与所述待散热设备的发热部件接触；在所述导热基体上设置所述多个散热片，且在所述散热结构使用时，所述多个散热片排列成在与重力方向垂直的方向上在相邻的所述散热片之间形成散热流道，所述散热流道沿所述重力方向延伸，至少部分所述散热流道的宽度沿所述重力方向增加，使得所述散热流道在沿所述重力方向的最上端处的宽度小于最下端处的宽度。本公开还提供了一种具有上述散热结构的待散热设备。

Description

散热结构和具有散热结构的待散热设备
相关公开的交叉引用
本公开要求在2022年5月6日提交国家知识产权局、公开号为CN202210485317.3、发明名称为“散热结构、需散热设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本公开中。
技术领域
本公开的实施例涉及但不限于散热技术领域，特别涉及一种散热结构和具有该散热结构的待散热设备。
背景技术
伴随着通信技术、芯片技术等的发展，通信设备对散热的需求也越来越高，若散热不充分会导致部件温度过高，影响设备的性能和使用寿命。
但是，现有通信设备的散热结构的散热效果不均匀，导致通信设备上部的解热能力不足，温度过高。
发明内容
本公开提供一种散热结构、待散热设备，解决现有通信设备的散热结构的散热效果不均匀的问题，避免通信设备上部的解热能力不足以及温度过高。
第一方面，本公开实施例提供一种散热结构，用于待散热设备中，所述待散热设备具有发热部件，其中，所述散热结构包括导热基体和多个散热片；所述导热基体的至少一部分被构造成与所述待散热设备的发热部件接触；在所述导热基体上设置所述多个散热片，且在所述散热结构使用时，所述多个散热片排列成在与重力方向垂直的方向上在相邻的所述散热片 之间形成散热流道，所述散热流道沿所述重力方向延伸，至少部分所述散热流道的宽度沿所述重力方向增加，使得所述散热流道在沿所述重力方向的最上端处的宽度小于最下端处的宽度。
第二方面，本公开实施例提供一种待散热设备，包括发热部件和本公开实施例的任意一种散热结构，其中，所述导热基体与所述发热部件间形成导热通道；在正常使用时，所述待散热设备的一端设置成朝上。
附图说明
在本公开实施例的附图中：
图1为一些相关技术中的一种散热结构的正视结构示意图；
图2为本公开实施例提供的一种散热结构的立体结构示意图；
图3为图2的散热结构的正视结构示意图；
图4为本公开实施例提供的另一种散热结构的立体结构示意图；
图5为图4的散热结构的正视结构示意图；
图6为本公开实施例提供的再一种散热结构的立体结构示意图；
图7为图6的散热结构的正视结构示意图；
图8为本公开实施例提供的一种待散热设备的组成框图；
具体实施方式
为使本领域的技术人员更好地理解本公开的技术方案，下面结合附图对本公开实施例提供的散热结构、待散热设备进行详细描述。
在下文中将参考附图更充分地描述本公开，但是所示的实施例可以以不同形式来体现，且本公开不应当被解释为限于以下阐述的实施例。反之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
本公开实施例的附图用来提供对本公开实施例的进一步理解，并且构成说明书的一部分，与详细实施例一起用于解释本公开，并不构成对本公开的限制。通过参考附图对详细实施例进行描述，以上和其它特征和优点对本领域技术人员将变得更加显而易见。
本公开可借助本公开的理想示意图而参考平面图和/或截面图进行描述。因此，可根据制造技术和/或容限来修改示例图示。
在不冲突的情况下，本公开各实施例及实施例中的各特征可相互组合。
本公开所使用的术语仅用于描述特定实施例，且不意欲限制本公开。如本公开所使用的术语“和/或”包括一个或多个相关列举条目的任何和所有组合。如本公开所使用的单数形式“一个”和“该”也意欲包括复数形式，除非上下文另外清楚指出。如本公开所使用的术语“包括”、“由……制成”，指定存在所述特征、整体、步骤、操作、元件和/或组件，但不排除存在或添加一个或多个其它特征、整体、步骤、操作、元件、组件和/或其群组。
除非另外限定，否则本公开所用的所有术语(包括技术和科学术语)的含义与本领域普通技术人员通常理解的含义相同。还将理解，诸如那些在常用字典中限定的那些术语应当被解释为具有与其在相关技术以及本公开的背景下的含义一致的含义，且将不解释为具有理想化或过度形式上的含义，除非本公开明确如此限定。
本公开不限于附图中所示的实施例，而是包括基于制造工艺而形成的配置的修改。因此，附图中例示的区具有示意性属性，并且图中所示区的形状例示了元件的区的具体形状，但并不是旨在限制性的。
在一些相关技术中，某些设备(如通信设备)待要以特定方式挂装，而其散热结构可采用直齿设计。例如，参照图1，散热结构的导热基体1(如导热基板)上设有多个等间隔、等宽的散热片2。当通信设备挂装时，散热片2平行于重力方向，从而空气受热后会沿散热片2间的散热流道3上升流动(如图1中的箭头)，并带走热量。
空气在流动过程中会被逐渐加热，越靠上则空气温度越高。故散热结 构在越靠近上端所处的环境温度越高，能散出的热量越少，产生严重的热级联效应。这导致设备中上的部件的解热能力不足，部件温度过高。尤其是，对高度较大的设备和在中上部密集设置有发热部件的设备问题就更严重。
第一方面，本公开实施例提供一种散热结构，用于待散热设备中，所述待散热设备具有发热部件。
本公开实施例的散热结构用于具有会产生热量的发热部件(如芯片等)的待散热设备中，以对发热部件产生的热量进行散热。
其中，待散热设备有预定设置方式，即，在正常使用时，待散热设备的一端可以设置成朝上(如挂装)。。
在一些实施例中，待散热设备可为通信设备，例如是AAU(有源天线处理单元)设备、RRU(射频拉远单元)设备等。应当理解，待散热设备的形式不限于此，其也可为任何需要散热的其它设备。
参照图2至图7，本公开实施例的散热结构包括导热基体1和多个散热片2；导热基体1的至少一部分被构造成与待散热设备的发热部件接触；在导热基体1上设置多个散热片2，且在所述散热结构使用时，所述多个散热片2排列成在与重力方向(即，竖直方向)垂直的方向上在相邻的散热片2之间形成散热流道3，散热流道3沿重力方向延伸，至少部分散热流道3的宽度沿重力方向增加，也就是说，散热流道3在沿重力方向的最上端处的宽度小于最下端处的宽度。
参照图2至图7，本公开实施例的散热结构具有导热基体1，导热基体1能与发热部件间形成导热通道(如导热基体1可与发热部件直接接触，或与容纳发热部件的外壳接触)，从而发热部件产生的热量可传导至导热基体1上。而导热基体1上设有多个凸出的散热片2，故导热基体1的热量可继续传导至散热片2上。而散热片2的侧面以及导热基体1的表面限定出用于空气流动的散热流道3(即散热流道3也就是相邻散热片2的间隔)，故热量可通过散热片2的侧面和导热基体1的表面传导至散热流道3内的空气中。
当待散热设备正常使用时，散热流道3是沿重力方向延伸的，且其中至少部分(当然也可为全部)散热流道3的宽度(即两侧相邻的散热片2间的距离)沿重力方向增加，即，对散热流道3的任意两个位置，靠下位置处的宽度至少不小于靠上位置的宽度；而且，散热流道3至少在最下端要比最上端宽，由此，散热流道3整体是“上窄下宽”的形式。
应当理解，散热流道3沿重力方向“延伸”是指，散热流道3“整体上”在沿重力方向上呈条状，但并不代表散热流道3必须是完全规则的形状，也不代表散热流道3的轴线必须与重力方向完全平行，而是允许散热流道3的延伸方向的轴线与重力方向间存在较小的夹角(如夹角不超过15度，或不超过10度，或不超过5度等)。
应当理解，本公开实施例中的“上”、“下”都是以重力方向为基准而言的，即，顺着重力方向是“下”，而背离重力方向的方向是“上”。
根据本公开实施例，当待散热设备(如通信设备)正常使用(例如，按照一定方式设置)时，散热结构的散热流道3是沿重力方向延伸的，故空气吸收热量后会沿散热流道3逐渐上升，并逐渐升温；本公开实施例中散热流道3为“上窄下宽”的形式，也就是类似于“烟囱”的结构，这种结构会对空气产生“抽吸”作用，使散热流道3中越向上处的空气流速越快，而空气流动越快显然就可在相同时间内带走越多的热量。因此，本公开实施例的散热结构可在整体尺寸不变(也就是换热面积不变)的情况下加强其上部的散热效果，弥补因其上部空气温度较高而导致的散热能力下降。最终，待散热设备的各位置均可以获得良好、均匀的解热能力，保证各位置的部件都不过热，改善待散热设备的解热性能，延长其使用寿命。
在一些实施例中，导热基体1为板状的导热基板，所有散热片2连接在导热基板的同一侧。
作为本公开实施例的一种方式，参照图2至图7，导热基体1可以是一个“平板”，从而各散热片2可设于该“平板”的同一侧，“平板”另一侧则可用于接触发热部件。而待散热设备正常使用时，“平板”则基本平行于重力方向，散热流道3也是基本平行于该“平板”的。
应当理解，导热基体1的形式不限于此。例如，导热基体1也可为空心的圆柱体，而散热片2则设于空心圆柱体的外侧。待散热设备正常使用时该圆柱体的轴线平行于重力方向。
在一些实施例中，多个散热片2垂直于导热基体1的表面。具体地说，多个散热片2垂直于圆柱体的导热基体1的切面。待散热设备按照一定方式设置时，即在所述散热结构使用时，允许多个散热片2沿重力方向延伸。
作为本公开实施例的一种方式，参照图2至图7，多个散热片2可与其所在位置的导热基体1的表面(或者圆柱体的切面)垂直(如垂直于以上“平板”)，且待散热设备正常使用时散热片2沿重力方向延伸。因此，通过散热片2本身宽度(即散热片2两侧面之间的尺寸)的变化，可相应调整散热流道3的宽度。
也就是说，散热片2可以是“上宽下窄”的，以使位于散热片2之间的散热流道3“上窄下宽”。
应当理解，散热片2的形式不限于此。例如，散热片2本身可以宽度不变，而待散热设备正常使用时，散热片2则相对重力方向“倾斜”设置，并通过散热片2的不同“倾斜角度”改变散热流道3的宽度。
在一些实施例中，至少部分散热片2在标准(参考)平面中的截面为梯形，其中，标准平面平行于导热基体1与散热片2连接处的切面或表面；在所述散热结构正常使用时，梯形的下底边对应散热片2沿重力方向的最上端。
作为本公开实施例的一种方式，参照图2和图3，每一个散热片2的纵截面可以是“梯形”的，且待散热设备正常使用时梯形的长边朝上，以使相邻梯形之间的间隔(即散热流道3的宽度)越向上越窄。
进一步的，各散热片2截面的梯形的形状可相同，可以是等腰梯形，待散热设备正常使用时梯形的上底边和下底边可垂直于重力方向。
应当理解，只要散热片2整体沿重力方向延伸，且通过自身宽度的改变使散热流道3的宽度符合以上要求就是可行的，而散热片2的纵截面的具体形状不限于梯形的形式。例如，散热片2的纵截面的侧边也可以是弧 形、阶梯形等其它形式。
在一些实施例中，多个散热片2可以包括第一散热片21和第二散热片22，第一散热片21在标准平面中的截面为矩形，第二散热片22在标准平面中的截面为梯形，标准平面平行于导热基体1与散热片2连接处的切面或表面。在所述散热结构正常使用时，第一散热片21沿重力方向位于第二散热片22下方，梯形的下底边对应第二散热片22沿重力方向的最上端。
作为本公开实施例的另一种方式，参照图4和图5，散热片2可分为“两组”，其中第一散热片21的纵截面为矩形，第二散热片22的纵截面为梯形。而待散热设备正常使用时，第一散热片21在下，故相邻的第一散热片21间的散热流道3(即在下的散热流道3)各处宽度相等；而第二散热片22在上，故相邻的第二散热片22间的散热流道3(即在上的散热流道3)为“上窄下宽”的形式。
应当理解，散热片2截面的形状也不限于以上例子。例如，第一散热片可第二散热片直接连接在一起，从而散热片2的截面是下部为矩形而上部为梯形的组合形状。
在一些实施例中，至少一部分散热片2在背离导热基体1一侧具有以凹陷形式位于散热片2内的空腔4，散热片2的外壁开设有第一开口41和第二开口42，第一开口41和第二开口42分别与空腔4连通；在所述散热结构正常使用时，第一开口41连通至空腔4沿重力方向的最下端，第二开口42连通至空腔4沿重力方向的最上端。
作为本公开实施例的一种方式，参照图6和图7，散热片2内部可以是“空心”的，或者说散热片2的“外壁”与导热基体1表面限定出散热片2内部的空腔4，且散热片2外壁有与空腔4连通的第一开口41和第二开口42。待散热设备正常使用时，第一开口41连通空腔4的最下端，第二开口42连通空腔4的最上端。按照这种方式，空气除沿散热流道3流动外，也可从第一开口41进入空腔4，再从第二开口42流出。因此，以上空腔4实际也是空气流通的通道，能在不改变散热片2数量、尺寸的情况下，增加实际的换热面积，改善换热效果。
其中，以上第一开口41、第二开口42的具体形式是多样的。例如，可参照图6和图7，散热片2中部有隔断，空腔4位于散热片2在隔断上方的部分中，且第一开口41位于散热片2在隔断上方的部分的最下端，第二开口42位于散热片2在隔断上方的部分的最上端。或者，第一开口41、第二开口42也可位于散热片2的“侧面”。
在一些实施例中，空腔4在标准平面中的截面为梯形，标准平面平行于导热基体1与散热片2连接处的切面或表面；在所述散热结构正常使用时，梯形的下底边对应散热片2沿重力方向的最上端。
作为本公开实施例的一种方式，参照图6和图7，以上空腔4的纵截面可以也是梯形，而待散热设备正常使用时，该梯形也是下底边朝上，即空腔4是“上宽下窄”的，或者说是“漏斗形”的，这样可使散热片2外壁各位置的厚度基本相同。
应当理解，空腔4的纵截面也可为其它形式。例如，空腔4的纵截面也为矩形，或者也是“上窄下宽”梯形等。
在一些实施例中，散热结构还包括辅助散热齿5；辅助散热齿5连接在导热基体1上，且辅助散热齿5与散热片2间隔设置，辅助散热齿5相对导热基体1凸出的高度小于散热片2相对导热基体1凸出的高度，或者辅助散热齿5相对导热基体1凸出的高度可以与散热片2相对导热基体1凸出的高度一致；在所述散热结构正常使用时，辅助散热齿5沿重力方向延伸，且辅助散热齿5位于散热流道3沿重力方向的下部。
作为本公开实施例的一种方式，参照图6和图7，在散热片2间(也就是散热流道3中)还可设有辅助散热齿5，辅助散热齿5的高度比散热片2高度小，且在待散热设备正常使用时也是沿重力方向延伸的(故辅助散热齿5也称为“矮直齿”)，并且辅助散热齿5位于散热流道3中“较宽”的下部位置。由此，辅助散热齿5可在基本不影响散热流道3中空气流动的情况(因为其所在位置散热流道3较宽)下，增大散热面积，进一步改善散热效果。
应当理解，以上辅助散热齿5不同位置的宽度也可不同，例如其纵截 面也可为“上宽下窄”的梯形。
应当理解，本公开实施例中，散热片2的各种形状、散热片2内的空腔4以及辅助散热齿5可以是相互独立的，并且可进行任意的组合。本公开实施例不限于任何具体的组合。
第二方面，本公开实施例提供一种待散热设备。
参照图8，本公开实施例的待散热设备包括发热部件和本公开实施例的任意一种散热结构，散热结构的导热基体与发热部件间形成导热通道。
本公开实施例的待散热设备包括会产生热量的发热部件(如芯片等)，而以上散热结构的导热基体与发热部件间形成导热通道，从而可将发热部件产生的热量散出。
同时，需散热设备还有预定设置方式，即，在正常使用时，待散热设备的一端可以设置成朝上(如挂装)。
在一些实施例中，待散热设备可为通信设备，例如是AAU设备、RRU设备等。
应当理解，待散热设备的形式不限于此，其也可为任何需要散热的其它设备。
在一些实施例中，待散热设备还包括外壳；发热部件设于外壳内，外壳的至少一部分可以构造成散热结构的导热基体或者与散热结构的导热基体直接接触。
作为本公开实施例的一种方式，散热结构可与待散热设备的外壳形成一体结构，即，外壳也就是散热结构的导热基体，而散热片则连接在外壳上。
应当理解，散热结构的形式不限于此。例如，散热结构也可为用于连接在待散热设备的外壳上的结构，即散热结构的导热基体可与外壳接触而形成导热通道；再如，待散热设备也可直接与某个发热部件接触而形成导热通道。
本公开已经公开了示例实施例，并且虽然采用了具体术语，但它们仅 用于并仅应当被解释为一般说明性含义，并且不用于限制的目的。在一些实例中，对本领域技术人员显而易见的是，除非另外明确指出，否则可单独使用与特定实施例相结合描述的特征、特性和/或元素，或可与其它实施例相结合描述的特征、特性和/或元件组合使用。因此，本领域技术人员将理解，在不脱离由所附的权利要求阐明的本公开的范围的情况下，可进行各种形式和细节上的改变。

Claims (11)

  1. 一种散热结构，用于待散热设备中，所述待散热设备具有发热部件，其中，所述散热结构包括导热基体和多个散热片；
    所述导热基体的至少一部分被构造成与所述待散热设备的发热部件接触；
    在所述导热基体上设置所述多个散热片，且在所述散热结构使用时，所述多个散热片排列成在与重力方向垂直的方向上在相邻的所述散热片之间形成散热流道，所述散热流道沿所述重力方向延伸，至少部分所述散热流道的宽度沿所述重力方向增加，使得所述散热流道在沿所述重力方向的最上端处的宽度小于最下端处的宽度。
  2. 根据权利要求1所述的散热结构，其中，
    所述多个散热片垂直于所述导热基体的表面；
    在所述散热结构使用时，所述多个散热片沿重力方向延伸。
  3. 根据权利要求2所述的散热结构，其中，
    至少部分所述散热片在标准平面中的截面为梯形，其中，所述标准平面平行于所述导热基体与所述散热片连接处的表面；
    在所述散热结构正常使用时，所述梯形的下底边对应所述散热片沿重力方向的最上端。
  4. 根据权利要求2所述的散热结构，其中，
    所述多个散热片包括第一散热片和第二散热片，所述第一散热片在标准平面中的截面为矩形，所述第二散热片在标准平面中的截面为梯形，所述标准平面平行于所述导热基体与所述散热片连接处的表面；
    在所述散热结构正常使用时，所述第一散热片沿重力方向位于所述第二散热片下方，所述梯形的下底边对应所述第二散热片沿重力方向的最上端。
  5. 根据权利要求1所述的散热结构，其中，
    至少一部分所述散热片在背离所述导热基体一侧具有以凹陷形式位于所述散热片内的空腔，所述散热片的外壁开设有第一开口和第二开口，所述第一开口和所述第二开口分别与所述空腔连通；
    在所述散热结构正常使用时，所述第一开口连通至所述空腔沿所述重力方向的最下端，所述第二开口连通至所述空腔沿所述重力方向的最上端。
  6. 根据权利要求5所述的散热结构，其中，
    所述空腔在标准平面中的截面为梯形，所述标准平面平行于所述导热基体与所述散热片连接处的表面；
    在所述散热结构正常使用时，所述梯形的下底边对应所述散热片沿重力方向的最上端。
  7. 根据权利要求1所述的散热结构，还包括辅助散热齿；
    所述辅助散热齿连接在所述导热基体上，且所述辅助散热齿与所述散热片间隔设置，所述辅助散热齿相对所述导热基体凸出的高度小于所述散热片相对所述导热基体凸出的高度或者所述辅助散热齿相对所述导热基体凸出的高度与所述散热片相对所述导热基体凸出的高度一致；
    在所述散热结构正常使用时，所述辅助散热齿沿重力方向延伸，且所述辅助散热齿位于所述散热流道沿重力方向的下部。
  8. 根据权利要求1所述的散热结构，其中，
    所述导热基体为板状的导热基板，所述多个散热片均设置在所述导热基板的同一侧。
  9. 一种待散热设备，包括发热部件和权利要求1至8中任意一项所述的散热结构，其中
    所述导热基体与所述发热部件间形成导热通道；
    在正常使用时，所述待散热设备的一端设置成朝上。
  10. 根据权利要求9所述的待散热设备，还包括外壳，其中
    所述发热部件设于所述外壳内，所述外壳的至少一部分构造成所述散热结构的所述导热基体。
  11. 根据权利要求9所述的待散热设备，还包括外壳，其中
    所述发热部件设于所述外壳内，所述外壳的至少一部分构造成与散热结构的导热基体直接接触。
PCT/CN2023/091738 2022-05-06 2023-04-28 散热结构和具有散热结构的待散热设备 WO2023213247A1 (zh)

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