WO2023213235A1 - 散热装置、基站设备 - Google Patents

散热装置、基站设备 Download PDF

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Publication number
WO2023213235A1
WO2023213235A1 PCT/CN2023/091497 CN2023091497W WO2023213235A1 WO 2023213235 A1 WO2023213235 A1 WO 2023213235A1 CN 2023091497 W CN2023091497 W CN 2023091497W WO 2023213235 A1 WO2023213235 A1 WO 2023213235A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
casing
enhanced
dissipation device
component
Prior art date
Application number
PCT/CN2023/091497
Other languages
English (en)
French (fr)
Inventor
王健
胡茂欣
孙伟华
尹尚豹
成妍妍
廖若辰
程飞
刘兆虎
朱月
Original Assignee
中兴通讯股份有限公司
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Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2023213235A1 publication Critical patent/WO2023213235A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/035—Cooling of active equipments, e.g. air ducts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present disclosure relates to the field of communication equipment, and in particular, to a heat dissipation device and a base station equipment including the heat dissipation device.
  • Embodiments of the present disclosure provide a heat dissipation device and a base station equipment including the heat dissipation device.
  • a heat dissipation device includes a heat dissipation body, wherein the heat dissipation device further includes an enhanced heat dissipation component.
  • the enhanced heat dissipation component includes at least one driving component and at least one vibration piece. , Each vibrating piece is connected to a corresponding driving component, and the driving component is used to vibrate under excitation conditions and drive the vibrating piece to vibrate to form airflow to assist the heat dissipation body in dissipating heat.
  • a base station equipment includes a heat dissipation device, wherein the heat dissipation device is the above-mentioned heat dissipation device provided by the present disclosure.
  • Figure 1 is a three-dimensional exploded schematic view of an embodiment of a heat dissipation device provided by the present disclosure
  • Figure 2 is a front view of an embodiment of the heat dissipation device provided by the present disclosure
  • Figure 3 is a schematic diagram showing an embodiment of the relationship between the heat dissipation body and the heat dissipation enhancement component
  • Figure 4 is a schematic diagram showing the vibration of the vibrating plate in the enhanced heat dissipation component
  • Figure 5 is a schematic three-dimensional structural diagram of an embodiment of the enhanced heat dissipation component
  • FIG. 6 is a three-dimensional exploded schematic view of another embodiment of the heat dissipation device provided by the present disclosure.
  • a heat dissipation device As a first aspect of the present disclosure, a heat dissipation device is provided. As shown in FIGS. 1 , 2 and 6 , the heat dissipation device includes a heat dissipation main body 100 , wherein the heat dissipation device further includes an enhanced heat dissipation component 200 .
  • the enhanced heat dissipation assembly 200 includes at least one driving part 210 and at least one vibrating plate 220. Each vibrating plate 220 is connected to a corresponding driving part 210.
  • the driving part 210 is used to vibrate under excitation conditions and drive the corresponding vibrating plate 220. Vibration can form an airflow that assists the heat dissipation body 100 in dissipating heat.
  • the vibration of the vibrating piece 220 can drive the air flow (i.e., the air flow described above).
  • the air flow i.e., the air flow described above.
  • the main body 100 is air-cooled), thereby achieving the purpose of cooling the electronic equipment (for example, base station equipment) provided with the heat dissipation device, and improving the heat dissipation effect.
  • the way in which the enhanced heat dissipation component 200 drives air flow is that the vibrating plate 220 vibrates. During the vibration process, the vibrating plate 220 experiences less friction (for example, friction with solids is at least partially eliminated). Therefore, when the enhanced heat dissipation component 200 is working, The noise generated due to friction is also greatly reduced, so that the enhanced heat dissipation component 200 and the heat dissipation device including the enhanced heat dissipation component 200 have the advantage of low noise.
  • the wear generated by the vibrating plate 220 is also very small, which also allows the enhanced heat dissipation component 200 to have a long service life.
  • the excitation condition is not particularly limited, as long as the driving component 210 can be made to vibrate under the excitation condition.
  • the excitation condition includes a periodically changing electric field.
  • the driving component 210 may include an electrical signal receiving part for receiving the periodically changing electric field, and a connecting part made of piezoelectric material, and the connecting part is connected to the electrical signal receiving part. The electric signal receiving part transmits the received electric field to the connecting part, and the connecting part is also connected to the vibrating piece.
  • connection part is made of piezoelectric material, and the piezoelectric material has piezoelectric effect and inverse piezoelectric effect.
  • the so-called "inverse piezoelectric effect” means that when a voltage is applied to a piezoelectric material, mechanical stress is generated. In other words, a conversion occurs between mechanical energy and electrical energy. If a periodic electrical signal is applied to a piezoelectric material, the piezoelectric material will produce mechanical vibrations. As shown in FIG.
  • the vibrating plate 220 is in a plate shape and generates transverse mechanical vibration (i.e., When the vibration direction (the direction of the double-headed arrow shown in Figure 4) is approximately the same as the thickness direction of the vibrating piece), it can drive the air flow.
  • the specific arrangement manner of the vibrating piece 220 is not particularly limited.
  • one end of the vibrating plate 220 is connected to the connecting portion, and the other end of the vibrating plate 220 is a free end.
  • the amplitude of the free end of the vibrating plate 220 is greater than the amplitude of the end of the vibrating plate 220 connected to the connecting portion, thereby driving airflow with a higher flow rate and improving the heat dissipation effect.
  • the heat dissipation device further includes a heat dissipation case 300 on which the heat dissipation main body 100 and the enhanced heat dissipation component 200 are disposed.
  • the heat dissipation device can be fixed on a corresponding installation base through the heat dissipation case 300 , and the heat dissipation main body 100 and the heat dissipation enhancement component 200 can also be assembled together through the heat dissipation case 300 .
  • the heat sink casing has a certain height.
  • the enhanced heat dissipation component 200 can be disposed at the bottom of the heat dissipation case 300.
  • the enhanced heat dissipation assembly 200 drives air flow at the bottom of the heat dissipation case 300 to form an airflow.
  • the airflow can flow from the bottom of the heat dissipation case 300 to the top of the heat dissipation case 300 to completely and thoroughly cool the heat dissipation body 100 .
  • the specific structure of the heat dissipation body 100 is not particularly limited.
  • the heat dissipation body 100 may include a plurality of heat dissipation teeth 110 (heat dissipation teeth), and the plurality of heat dissipation teeth 110 are arranged at intervals. The intervals between the heat dissipation teeth 110 form heat dissipation channels.
  • the length direction of the heat dissipation teeth 110 is consistent with the length direction of the vibration piece. That is to say, the airflow formed by the enhanced heat dissipation component 200 can directly enter the heat dissipation channel and quickly take away the heat, thereby achieving rapid cooling of the electronic device.
  • the specific structure of the heat dissipation teeth 110 is not particularly limited.
  • the heat dissipation teeth may be needle-shaped teeth or columnar teeth.
  • this disclosure does not place any special limitations on the arrangement of the heat dissipation teeth in the heat dissipation body 100 .
  • the plurality of heat dissipation teeth can be arranged in a straight tooth pattern or in a V tooth pattern.
  • the relative positional relationship between the heat dissipation main body 100 and the enhanced heat dissipation component 200 is not particularly limited, as long as the arrangement of the heat dissipation teeth 110 does not interfere with the vibration of the vibrating plate.
  • each vibrating plate 220 is disposed in a gap between two adjacent heat dissipation teeth 110 . With this arrangement, the total volume of the heat dissipation body 100 and the enhanced heat dissipation assembly 200 is reduced, which is beneficial to miniaturization of the heat dissipation device while improving the cooling effect.
  • the vibration piece 220 may be disposed in parallel with the heat dissipation teeth 110 .
  • the present disclosure is not limited to this.
  • the enhanced heat dissipation component and the heat dissipation main body are arranged in sequence along the height direction of the heat dissipation chassis.
  • the heat dissipation device also includes an enhanced heat dissipation cover 400, which is fixedly connected to the heat dissipation chassis 300.
  • the enhanced heat dissipation cover 400 is formed with a reinforced heat dissipation cover 400.
  • the heat dissipation through hole 410 and the heat dissipation enhancement assembly 200 are disposed in the space between the heat dissipation enhancement cover 400 and the heat dissipation chassis 300 .
  • the heat dissipation performance of the heat dissipation device can be improved by providing enhanced heat dissipation through holes 410 .
  • the shape, quantity, and location of the enhanced heat dissipation through holes 410 are not limited, as long as they can play a role in air circulation.
  • the heat dissipation device may also include a heat dissipation device.
  • the heat dissipation main cover 500 is fixedly connected to the heat dissipation casing 300. At least a part of the heat dissipation main body 100 is located in the space between the heat dissipation casing 300 and the heat dissipation main cover 500.
  • the heat dissipation main cover 500 is formed with Main body heat dissipation through hole 510.
  • the purpose of providing the main body heat dissipation through holes 510 is also to improve the heat dissipation performance of the heat dissipation device.
  • the specific position and number of the main body heat dissipation through holes 510 are not particularly limited, as long as they can play a role in air circulation.
  • the space between the main body heat dissipation through holes 510 and the heat dissipation teeth 110 is connected to achieve better heat dissipation effect.
  • the specific number of vibrating pieces 220 is not particularly limited.
  • the enhanced heat dissipation assembly 200 includes a plurality of vibrating pieces 220 .
  • the enhanced heat dissipation assembly may also include a plurality of driving components 210 .
  • Each vibrating piece 220 can induce airflow and improve the heat dissipation effect.
  • the enhanced heat dissipation assembly 200 also includes a setting plate 230 , and the multiple vibrating pieces 220 are spacedly arranged on the setting plate 230 , the free end of the vibrating piece 220 protrudes from the edge of the setting plate 230 , and the free ends of the plurality of vibrating pieces 220 are all facing the top of the heat dissipation case 300 .
  • the vibrating piece 220 and the driving component 210 can be assembled on the setting plate 230 in advance to obtain the enhanced heat dissipation component 200, and then the assembled enhanced heat dissipation component 200 can be assembled in the heat dissipation case 300, so that the entire heat dissipation can be achieved.
  • the assembly process of the device is easier to implement.
  • the heat dissipation casing 300 may be provided with a first positioning member, and the setting plate 230 may be provided with a second positioning member. The first positioning part and the second positioning part cooperate with each other.
  • the specific forms of the first positioning member and the second positioning member are not particularly limited, as long as rough positioning of the setting plate 230 on the heat sink casing 300 can be achieved.
  • one of the first positioning part and the second positioning part is a positioning groove
  • the other one of the first positioning part and the second positioning part is a positioning protrusion
  • the positioning protrusion can be engaged in the In the positioning groove
  • the setting plate 230 is positioned on the heat sink casing 300 .
  • a fourth positioning member can be provided on the setting plate 230 and a fifth positioning member can be provided on the heat sink casing 300.
  • the cooperation between the five positioning parts can achieve precise positioning of the setting plate 230 on the heat sink casing 300 .
  • the fourth positioning member on the setting plate 230 may be a threaded hole
  • the fifth positioning member on the heat sink casing 300 may be a through hole.
  • the heat dissipation device may also include positioning bolts, which pass through the fourth positioning member. The positioning parts are aligned with the corresponding fifth positioning parts, and then the positioning bolts are screwed in, so that the setting plate 230 can be accurately positioned on the heat sink casing.
  • the present disclosure is not limited to this, and other positioning members can also be used to position the setting plate 230 on the heat sink casing 300 .
  • each driving component 210 is electrically connected to a large board (not shown) in the heat sink 300 , to obtain the periodically changing electric field.
  • the individual drive components may also be powered by an external drive module (eg, an external power supply).
  • an external drive module eg, an external power supply
  • the specific structure of the heat dissipation casing 300 is not particularly limited.
  • the heat dissipation casing 300 includes a casing bottom plate 310 and a casing side plate 320 .
  • the casing side plate 320 is disposed at the side of the casing bottom plate 310 .
  • the casing bottom plate 310 and the enhanced heat dissipation assembly 200 A first sealing member is provided between them, and a second sealing member is provided between the case side plate 320 and the enhanced heat dissipation assembly 200 .
  • first seal and the second seal By arranging the first seal and the second seal, electromagnetic leakage can be avoided, ensuring that the driving component can obtain a relatively large vibration amplitude, and the vibrating plate can drive airflow with a higher flow rate to achieve better heat dissipation effect. At the same time, providing the first seal and the second seal can also enhance the ability of the driving component 210 to resist external electromagnetic interference.
  • a base station equipment includes a heat dissipation device, wherein the heat dissipation device is the above-mentioned heat dissipation device provided in the first aspect of the present disclosure.
  • the base station equipment includes the above-mentioned heat dissipation device with good heat dissipation effect, thereby avoiding overheating of the base station equipment and improving the performance and service life of the base station equipment.
  • Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted in a general illustrative sense only and not for purpose of limitation. In some instances, it will be apparent to those skilled in the art that features, characteristics and/or elements described in connection with a particular embodiment may be used alone, or may be used in conjunction with other embodiments, unless expressly stated otherwise. Features and/or components used in combination. Accordingly, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the scope of the present disclosure as set forth in the appended claims.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本公开提供一种散热装置，所述散热装置包括散热主体，所述散热装置还包括增强散热组件，所述增强散热组件包括至少一个驱动部件和至少一个振动片，每个所述振动片均连接有相应的驱动部件，所述驱动部件用于在激励条件下发生振动，并带动所述振动片振动，以形成气流辅助所述散热主体散热。本公开还提供一种基站设备。

Description

散热装置、基站设备
相关申请的交叉引用
本申请要求于2022年5月5日提交的中国专利申请No.202210478291.X的优先权，该中国专利申请的内容通过引用的方式整体合并于此。
技术领域
本公开涉及通信设备领域，具体地，涉及一种散热装置和一种包括该散热装置的基站设备。
背景技术
随着5G时代的来临，出现了大量5G产品。5G产品信息交换量大，功耗也相对较高，随之而来的散热问题成为制约产品性能的瓶颈。
如何为5G产品(或类似的高发热电子产品)提供一种散热性能好的散热装置，成为本领域亟待解决的技术问题。
发明内容
本公开实施例提供一种散热装置和一种包括该散热装置的基站设备。
作为本公开的第一个方面，提供一种散热装置，所述散热装置包括散热主体，其中，所述散热装置还包括增强散热组件，所述增强散热组件包括至少一个驱动部件和至少一个振动片，每个所述振动片均连接有相应的驱动部件，所述驱动部件用于在激励条件下发生振动，并带动所述振动片振动，以形成气流辅助所述散热主体散热。
作为本公开的第二个方面，提供一种基站设备，所述基站设备包括散热装置，其中，所述散热装置为本公开所提供的上述散热装置。
附图说明
图1是本公开所提供的散热装置的一种实施方式的立体分解示意图；
图2是本公开所提供的散热装置的一种实施方式的主视图；
图3是展示散热主体和增强散热组件之间关系的一种实施方式的示意图；
图4是展示增强散热组件中，振动片的振动示意图；
图5是增强散热组件的一种实施方式的立体结构示意图；
图6是本公开所提供的散热装置的另一种实施方式的立体分解示意图。
具体实施方式
为使本领域的技术人员更好地理解本公开的技术方案，下面结合附图对本公开提供的散热装置和基站设备进行详细描述。
在下文中将参考附图更充分地描述示例实施例，但是所述示例实施例可以以不同形式来 体现且不应当被解释为限于本文阐述的实施例。反之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
在不冲突的情况下，本公开各实施例、实施方式、及实施例、实施方式中的各特征可相互组合。
如本文所使用的，术语“和/或”包括一个或多个相关列举条目的任何和所有组合。
本文所使用的术语仅用于描述特定实施例，且不意欲限制本公开。如本文所使用的，单数形式“一个”和“该”也意欲包括复数形式，除非上下文另外清楚指出。还将理解的是，当本说明书中使用术语“包括”和/或“由……制成”时，指定存在所述特征、整体、步骤、操作、元件和/或组件，但不排除存在或添加一个或多个其它特征、整体、步骤、操作、元件、组件和/或其群组。
除非另外限定，否则本文所用的所有术语(包括技术和科学术语)的含义与本领域普通技术人员通常理解的含义相同。还将理解，诸如那些在常用字典中限定的那些术语应当被解释为具有与其在相关技术以及本公开的背景下的含义一致的含义，且将不解释为具有理想化或过度形式上的含义，除非本文明确如此限定。
作为本公开的第一个方面，提供一种散热装置，如图1、图2和图6所示，所述散热装置包括散热主体100，其中，所述散热装置还包括增强散热组件200，该增强散热组件200包括至少一个驱动部件210和至少一个振动片220，每个振动片220均连接有相应的驱动部件210，驱动部件210用于在激励条件下发生振动，并带动相应的振动片220振动，从而可以形成辅助散热主体100散热的气流。
振动片220振动可以带动空气流动(即，上文中所述的气流)，流动的空气经过散热主体100时，可以将散热主体100上的热量转移至外部环境中(即，增强散热组件200对散热主体100进行风冷)，从而实现对设置该散热装置的电子设备(例如，基站设备)降温的目的，提升了散热效果。
增强散热组件200带动空气流动的方式为振动片220振动，在振动片220振动的过程中受到的摩擦较小(例如，至少部分消除了与固体的摩擦)，因此，增强散热组件200在工作时因摩擦产生噪声也大幅减小，使得该增强散热组件200、以及包括该增强散热组件200的散热装置具有噪声低的优点。
进一步地，因为振动片220在振动过程中受到的摩擦力非常小，因此振动片220产生的磨损也非常小，这也使得所述增强散热组件200具有较长的使用寿命。
在本公开中，对所述激励条件不做特殊的限定，只要能够使得驱动部件210在该激励条件下振动即可。为了便于实现，作为一种可选实施方式，所述激励条件包括周期性变化的电场。相应地，驱动部件210可以包括电信号接收部和连接部，所述电信号接收部用于接收所述周期性变化的电场，连接部由压电材料制成，连接部与所述电信号接收部电连接，以使得所述电信号接收部将接收到的电场传递给所述连接部，所述连接部还与所述振动片相连。
如上文所述，所述连接部由压电材料制成，压电材料具有压电效应和逆压电效应。所谓“逆压电效应”是指，如果对压电材料施加电压，则产生机械应力。也就说，机械能与电能之间发生了转换。如果将周期性的电信号施加在压电材料上，压电材料会产生机械振动。如图4所示，在本公开的一些可选实施方式中，振动片220为片状，产生横向的机械振动(即， 振动方向(图4中所示的双向箭头的方向)与振动片的厚度方向大致相同)时能够带动空气流动。
在本公开中，对振动片220的具体设置方式不做特殊的限定。为了提高振动片220振动引起的空气流动的流速，作为一种可选实施方式，如图4和图5所示，振动片220的一端与连接部连接，振动片220的另一端为自由端。
在振动片220振动时，振动片220的自由端的振幅大于振动片220与连接部相连的一端的振幅，从而可以带动流速较高的气流，提升散热效果。
在本公开中，对散热主体100、以及增强散热组件200如何在散热装置中分布不做特殊的限定，只要增强散热组件200产生的气流可以吹向散热主体、带走散热主体产生的热量即可。作为一种可选实施方式，所述散热装置还包括散热机壳300，散热主体100和增强散热组件200均设置在散热机壳300上。
通过散热机壳300可以将散热装置固定在相应的安装基础上，并且，通过散热机壳300还可以将散热主体100和增强散热组件200组装在一起。
通常，散热机壳具有一定的高度。为了便于对散热主体100进行较为全面彻底的冷却，作为一种可选实施方式，增强散热组件200设置可以在散热机壳300的底部。增强散热组件200在散热机壳300的底部带动空气流动、形成气流，该气流可以从散热机壳300的底部流动至散热机壳300的顶部，从而对散热主体100进行全面彻底的冷却。
在本公开中，对散热主体100的具体结构也不做特殊的限定。作为一种可选实施方式，散热主体100可以包括多个散热齿110(散热齿片)，并且，多个所述散热齿110间隔设置。散热齿110之间的间隔形成为散热通道。为了便于气流快速流经散热通道，作为一种可选实施方式，所述散热齿110的长度方向与所述振动片的长度方向一致。也就是说，通过增强散热组件200形成的气流可以直接进入散热通道内，快速带走热量，进而实现对电子设备的快速降温。
在本公开中，对所述散热齿110的具体结构也不做特殊的限定。例如，所述散热齿可以是针状齿片、也可以为柱状齿片。当然，本公开对散热主体100中各散热齿的排布方式也不做特殊的限定。例如，多个散热齿可以按照直齿式进行排列、也可以按照V齿式进行排列。
在本公开中，对散热主体100和增强散热组件200的相对位置关系不做特殊的限定，只要散热齿110的设置不对振动片的振动造成干涉即可。在图1中所示的实施方式中，每个振动片220设置在相邻两个所述散热齿110之间的间隔中。以这种布置方式，减小了散热主体100和增强散热组件200的总体积，有利于在提升冷却效果的前提下实现散热装置的小型化。在本公开中，振动片220可以与散热齿110平行设置。
当然，本公开并不限于此，在图3中所示的实施方式中，所述增强散热组件和所述散热主体沿所述散热机壳的高度方向依次排列。
为了保护增强散热组件200，作为一种可选实施方式，所述散热装置还包括增强散热盖板400，该增强散热盖板400与散热机壳300固定连接，增强散热盖板400上形成有增强散热通孔410，增强散热组件200设置在增强散热盖板400与散热机壳300之间的空间中。通过设置增强散热通孔410可以提高散热装置的散热性能。在本公开中，对增强散热通孔410的形状、数量、设置位置均不做限定，只要能起到空气流通的作用即可。
类似地，为了保护散热主体100，作为一种可选实施方式，所述散热装置还可以包括散 热主体盖板500，散热主体盖板500与散热机壳300固定连接，散热主体100的至少一部分位于散热机壳300与散热主体盖板500之间的空间中，散热主体盖板500上形成有主体散热通孔510。与增强散热通孔410类似，设置主体散热通孔510的作用也在于提高散热装置的散热性能。在本公开中，对主体散热通孔510的具体位置、及数量也不做特殊的限定，只要能够起到空气流通的作用即可。作为一种可选实施方式，主体散热通孔510与散热齿110之间的间隔相连通，以实现更好的散热效果。
在本公开中，对振动片220的具体数量不做特殊的限定。为了提升散热效果，作为一种可选实施方式，所述增强散热组件200包括多个振动片220，相应地，增强散热组件还可以包括多个驱动部件210。每个振动片220均能够引起气流，提升散热效果。
为了便于在散热装置中设置多个振动片220和多个驱动部件210，作为一种可选实施方式，增强散热组件200还包括设置板230，多个振动片220间隔地设置在设置板230上，振动片220的自由端凸出于设置板230的边缘，且多个振动片220的自由端均朝向散热机壳300的顶部。在本公开中，可以预先将振动片220、驱动部件210组装在设置板230上，获得增强散热组件200，再将组装完毕的增强散热组件200组装在散热机壳300中，从而可以使得整个散热装置的组装过程更加容易实现。
为了便于增强散热组件200在散热机壳300上进行定位，作为一种可选实施方式，散热机壳300上可以设置有第一定位件，设置板230上可以设置有第二定位件，所述第一定位件与所述第二定位件互相配合。
在本公开中，对第一定位件和第二定位件的具体形式不做特殊的限定，只要能够实现设置板230在散热机壳300上的粗定位。例如，第一定位件和第二定位件中的一者为定位凹槽，第一定位件和第二定位件中的另一者为定位凸起，所述定位凸起可以卡合在所述定位凹槽中，实现设置板230在散热机壳300上的定位。
为了实现设置板230上的精确定位，作为一种可选实施方式，可以在设置板230上设置第四定位件、并在散热机壳300上设置第五定位件，通过第四定位件和第五定位件之间的配合，可以实现设置板230在散热机壳300上的精确定位。
作为一种可选实施方式，设置板230上的第四定位件为可以螺纹孔，散热机壳300上的第五定位件可以为通孔，所述散热装置还可以包括定位螺栓，通过第四定位件与相应的第五定位件对准，然后拧入定位螺栓，可以实现设置板230在散热机壳上的精确定位。
当然，本公开并不限于此，还可以通过其他定位件实现设置板230在散热机壳300上的定位。
在本公开中，对如何为驱动部供电不做特殊的限定，为了简化整体结构，作为一种可选实施方式，各个驱动部件210与散热机壳300内的大板(未示出)电连接，以获得所述周期性变化的电场。
当然，本公开并不限于此。也可以通过外部驱动模块(例如，外部电源)向各个驱动部件供电。
在本公开中，对散热机壳300的具体结构不做特殊的限定。作为一种可选实施方式，散热机壳300包括可以机壳底板310和机壳侧板320，机壳侧板320设置在机壳底板310的侧边处，机壳底板310与增强散热组件200之间设置有第一密封件，机壳侧板320与增强散热组件200之间设置有第二密封件。
通过设置第一密封件和第二密封件可以避免产生电磁泄漏，确保驱动部件可以获得相对较大的振动幅度，并使得振动片带动流速较高的气流，实现更好的散热效果。同时，设置第一密封件和第二密封件还可以增强驱动部件210抗外部电磁干扰的能力。
作为本公开的第二个方面，提供一种基站设备，所述基站设备包括散热装置，其中，所述散热装置为本公开第一个方面所提供的上述散热装置。
所述基站设备包括上述具有良好散热效果的散热装置，从而可以避免基站设备过热，提高基站设备的使用性能以及基站设备的使用寿命。
本文已经公开了示例实施例，并且虽然采用了具体术语，但它们仅用于并仅应当被解释为一般说明性含义，并且不用于限制的目的。在一些实例中，对本领域技术人员显而易见的是，除非另外明确指出，否则可单独使用与特定实施例相结合描述的特征、特性和/或元素，或可与其它实施例相结合描述的特征、特性和/或元件组合使用。因此，本领域技术人员将理解，在不脱离由所附的权利要求阐明的本公开的范围的情况下，可进行各种形式和细节上的改变。

Claims (15)

  1. 一种散热装置，所述散热装置包括散热主体，其中，所述散热装置还包括增强散热组件，所述增强散热组件包括至少一个驱动部件和至少一个振动片，每个所述振动片均连接有相应的驱动部件，所述驱动部件用于在激励条件下发生振动，并带动所述振动片振动，以形成气流辅助所述散热主体散热。
  2. 根据权利要求1所述的散热装置，其中，所述激励条件包括周期性变化的电场，所述驱动部件包括电信号接收部和连接部，所述电信号接收部用于接收所述周期性变化的电场，所述连接部由压电材料制成，所述连接部与所述电信号接收部电连接，以使得所述电信号接收部将接收到的电场传递给所述连接部，所述连接部还与所述振动片相连。
  3. 根据权利要求2所述的散热装置，其中，所述振动片的一端与所述连接部连接，所述振动片的另一端为自由端。
  4. 根据权利要求1至3中任意一项所述的散热装置，其中，所述散热装置还包括散热机壳，所述散热主体和所述增强散热组件均设置在所述散热机壳上。
  5. 根据权利要求4所述的散热装置，其中，所述增强散热组件设置在所述散热机壳的底部。
  6. 根据权利要求1至5中任一项所述的散热装置，其中，所述散热主体包括多个散热齿，所述散热齿间隔设置，所述散热齿的长度方向与所述振动片的长度方向一致。
  7. 根据权利要求6所述的散热装置，其中，所述振动片设置在相邻两个所述散热齿之间的间隔中。
  8. 根据权利要求5所述的散热装置，其中，所述增强散热组件和所述散热主体沿所述散热机壳的高度方向依次排列。
  9. 根据权利要求4或5所述的散热装置，其中，所述散热装置还包括增强散热盖板，所述增强散热盖板与所述散热机壳固定连接，所述增强散热盖板上形成有增强散热通孔，所述增强散热组件设置在所述增强散热盖板与所述散热机壳之间的空间中。
  10. 根据权利要求4或5所述的散热装置，其中，所述散热装置包括散热主体盖板，所述散热主体盖板与所述散热机壳固定连接，所述散热主体的至少一部分位于所述散热机壳与所述散热主体盖板之间的空间中，所述散热主体盖板上形成有主体散热通孔。
  11. 根据权利要求4或5所述的散热装置，其中，所述增强散热组件包括多个所述振动 片和多个所述驱动部件，所述增强散热组件还包括设置板，所述振动片间隔地设置在所述设置板上，所述振动片的自由端凸出于所述设置板的边缘，且多个所述振动片的自由端均朝向所述散热机壳的顶部。
  12. 根据权利要求11所述的散热装置，其中，所述散热机壳上设置有第一定位件，所述设置板上设置有第二定位件，所述第一定位件与所述第二定位件互相配合。
  13. 根据权利要求4或5所述的散热装置，其中，各个所述驱动部与所述散热机壳内的大板电连接，以获得周期性变化的电场。
  14. 根据权利要求4或5所述的散热装置，其中，所述散热机壳包括机壳底板和机壳侧板，所述机壳侧板设置在所述机壳底板的侧边处，所述机壳底板与所述增强散热组件之间设置有第一密封件，所述机壳侧板与所述增强散热组件之间设置有第二密封件。
  15. 一种基站设备，所述基站设备包括散热装置，其中，所述散热装置为权利要求1至14中任意一项所述的散热装置。
PCT/CN2023/091497 2022-05-05 2023-04-28 散热装置、基站设备 WO2023213235A1 (zh)

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