WO2023210427A1 - 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法 - Google Patents

接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法 Download PDF

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WO2023210427A1
WO2023210427A1 PCT/JP2023/015341 JP2023015341W WO2023210427A1 WO 2023210427 A1 WO2023210427 A1 WO 2023210427A1 JP 2023015341 W JP2023015341 W JP 2023015341W WO 2023210427 A1 WO2023210427 A1 WO 2023210427A1
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Prior art keywords
adhesive
film
epoxy resin
mass
parts
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Ceased
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PCT/JP2023/015341
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English (en)
French (fr)
Japanese (ja)
Inventor
憲司 徳久
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to KR1020247014082A priority Critical patent/KR20240114739A/ko
Priority to CN202380014145.4A priority patent/CN118159621A/zh
Priority to EP23796170.1A priority patent/EP4516870A4/en
Priority to JP2024517213A priority patent/JPWO2023210427A1/ja
Publication of WO2023210427A1 publication Critical patent/WO2023210427A1/ja
Priority to US18/635,166 priority patent/US20240279517A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G83/00—Macromolecular compounds not provided for in groups C08G2/00 - C08G81/00
    • C08G83/007—Polyrotaxanes; Polycatenanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/08—Epoxidised polymerised polyenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Definitions

  • the present invention relates to an adhesive composition, a film adhesive, a semiconductor package using the film adhesive, and a method for manufacturing the same.
  • stacked MCPs Multi Chip Packages
  • semiconductor chips are stacked in multiple stages
  • packages are becoming more dense and highly integrated.
  • multi-layer stacking of semiconductor chips is progressing.
  • thermosetting film adhesive (die attach film, die bond film) is used for adhesion between a wiring board and a semiconductor chip and for adhesion between semiconductor chips in the manufacturing process of such a memory package.
  • die attach films are required to be made thinner.
  • heat is more likely to be generated on the surface of semiconductor elements. Therefore, in order to release heat to the outside of the package, a thermally conductive filler is added to the die attach film to achieve high thermal conductivity.
  • thermosetting film adhesive intended for so-called die attach film use
  • a composition combining a curable resin having a weight average molecular weight of less than 10,000, a curing agent, and eucryptite is known.
  • Patent Document 1 a composition combining a curable resin having a weight average molecular weight of less than 10,000, a curing agent, and eucryptite is known.
  • a semiconductor package is composed of members made of various materials, such as a substrate (semiconductor, glass), a lead frame (metal), a circuit, an adhesive layer, and a sealing layer. For this reason, the semiconductor package may warp due to the difference in the coefficient of thermal expansion of each member. This trend is becoming stronger as semiconductor packages become smaller and thinner. Further, in a multi-tiered package with a large number of laminated layers, the effect of warpage is greater than in a single-tiered semiconductor package. If a semiconductor package is warped, various problems may occur during assembly and use, such as poor connection between external terminals and a mounting board, cracks in the internal structure, and wire breakage.
  • Patent Document 1 points out the problems when using an inorganic filler as a means to reduce thermal expansion, and uses a curable resin with a specific weight average molecular weight, a curing agent, and Eucrypt as a filler. It is stated that the coefficient of thermal expansion can be reduced depending on the composition.
  • the composition described in Patent Document 1 mentioned above has manufacturing limitations in that it uses a special inorganic filler.
  • a material containing resin is used as an adhesive or a sealant, it is required to exhibit sufficient adhesion to the adherend. Conventionally, it has been known that adhesion strength decreases when a large amount of inorganic filler is contained, and it has been difficult to achieve both reduced warpage and excellent adhesive strength using methods using inorganic fillers. Ta.
  • the present invention provides a film adhesive that can effectively suppress warpage and exhibits excellent adhesive strength with an adherend, and an adhesive composition suitable for preparing this film adhesive. That is the issue.
  • Another object of the present invention is to provide a semiconductor package using the above film adhesive and a method for manufacturing the same.
  • the present inventors have conducted intensive studies in view of the above problems, and have found that when preparing a film adhesive using an adhesive composition containing an epoxy resin, an epoxy resin curing agent, and a polymer component, It has been found that the above problems can be solved by using an epoxy resin having a condensed ring skeleton as the resin and containing a specific amount of a polyrotaxane compound therein.
  • the present invention has been completed through further studies based on the above findings.
  • a method of manufacturing a semiconductor package including: [8] A semiconductor package obtained by the manufacturing method described in [7]. [9] [5] or [6] A wire bonding semiconductor package comprising a thermoset film adhesive according to [6].
  • the numerical range expressed using " ⁇ ” means a range that includes the numerical values written before and after " ⁇ " as the lower limit and upper limit.
  • the film adhesive of the present invention can suppress warpage and exhibits excellent adhesive strength with adherends.
  • the adhesive composition of the present invention is suitable for obtaining the above-mentioned film adhesive. According to the method for manufacturing a semiconductor package of the present invention, a semiconductor package that is less likely to warp and has excellent adhesion reliability can be obtained.
  • FIG. 1 is a schematic longitudinal sectional view showing a preferred embodiment of the first step of the method for manufacturing a semiconductor package of the present invention.
  • FIG. 2 is a schematic vertical sectional view showing a preferred embodiment of the second step of the method for manufacturing a semiconductor package of the present invention.
  • FIG. 3 is a schematic vertical sectional view showing a preferred embodiment of the third step of the method for manufacturing a semiconductor package of the present invention.
  • FIG. 4 is a schematic longitudinal sectional view showing a preferred embodiment of the step of connecting bonding wires in the method for manufacturing a semiconductor package of the present invention.
  • FIG. 5 is a schematic vertical cross-sectional view showing a multi-layer stacked embodiment of the semiconductor package manufacturing method of the present invention.
  • FIG. 6 is a schematic vertical cross-sectional view showing another multi-layer stacked embodiment of the method for manufacturing a semiconductor package of the present invention.
  • FIG. 7 is a schematic longitudinal sectional view showing a preferred embodiment of a semiconductor package manufactured by the semiconductor package manufacturing method of the present invention.
  • the adhesive composition of the present invention is a composition suitable for forming the film adhesive of the present invention.
  • the adhesive composition of the present invention contains an epoxy resin (A) having a condensed ring structure, an epoxy resin curing agent (B), a polyrotaxane compound (C), and a polymer component (D). Furthermore, the content of the polyrotaxane compound (C) is controlled to be 5 to 15 parts by mass relative to the total content of each of the epoxy resin (A) and the polymer component (D), which is 100 parts by mass.
  • the adhesive composition of the present invention may further contain an inorganic filler (E).
  • the adhesive composition of the present invention is less likely to warp in a laminate with an adherend, and has excellent adhesive strength to the adherend.
  • epoxy resin (A) having a fused ring structure The above-mentioned epoxy resin (A) having a condensed ring structure (hereinafter also simply referred to as epoxy resin (A)) is a thermosetting resin having an epoxy group, and has a condensed ring structure in its molecule.
  • the number of rings constituting this condensed ring structure is preferably 2 to 7, more preferably 2 to 5, even more preferably 2 to 4, even more preferably 2 or 3, and particularly preferably 2. Further, each ring constituting the condensed ring structure may have a bridged structure.
  • the number of ring members in each ring constituting the condensed ring structure is preferably a 5-membered ring and/or a 6-membered ring (for example, the dicyclopentadiene structure is a fused ring of a 5-membered ring and a 6-membered ring, and the 6-membered ring is (has a bridging structure).
  • the condensed ring structure that the epoxy resin (A) has include a dicyclopentadiene structure, a fluorene structure (preferably a fluorene bisphenol structure), a naphthalene structure (preferably including a naphthol structure and a naphthalene diol structure), and the like.
  • the epoxy resin (A) preferably contains a dicyclopentadiene-type epoxy resin and/or a naphthalene-type epoxy resin, and more preferably contains a dicyclopentadiene-type epoxy resin.
  • the epoxy equivalent of the epoxy resin (A) is preferably 500 g/eq or less.
  • the epoxy resin (A) may be liquid, solid or semi-solid.
  • liquid means that the softening point is less than 25°C
  • solid means that the softening point is 60°C or higher
  • semi-solid means that the softening point is equal to the softening point of the above liquid. (25°C or higher and lower than 60°C) between the softening point of
  • the epoxy resin (A) used in the present invention should have a softening point of 100°C or lower from the viewpoint of obtaining a film adhesive that can reach a low melt viscosity in a suitable temperature range (for example, 60 to 120°C). It is preferable that there be.
  • the softening point is a value measured by a softening point test (ring and ball method) (measurement conditions: based on JIS-K7234:1986).
  • the epoxy equivalent is preferably 150 to 450 g/eq from the viewpoint of increasing the crosslinking density of the thermoset product.
  • epoxy equivalent refers to the number of grams (g/eq) of a resin containing 1 gram equivalent of epoxy groups.
  • the weight average molecular weight of the epoxy resin (A) is usually preferably less than 10,000, more preferably 5,000 or less. There is no particular limit to the lower limit, but 300 or more is practical.
  • the weight average molecular weight is a value determined by GPC (Gel Permeation Chromatography) analysis (hereinafter, the same applies to other resins unless otherwise specified).
  • the content of the epoxy resin (A) is preferably 20 to 70 parts by mass, more preferably 30 to 60 parts by mass, and more preferably 40 to 60 parts by mass, based on 100 parts by mass of the total content of the epoxy resin (A) and the polymer component (D). 60 parts by mass is more preferred.
  • Epoxy resin curing agent (B) As the epoxy resin curing agent (B), any curing agent such as amines, acid anhydrides, polyhydric phenols, etc. can be used. In the present invention, we have developed a film adhesive that has low melt viscosity, exhibits curing properties at high temperatures exceeding a certain temperature, has fast curing properties, and has high storage stability that can be stored for long periods at room temperature. From this viewpoint, it is preferable to use a latent curing agent.
  • latent curing agents examples include dicyandiamide compounds, imidazole compounds, curing catalyst complex polyhydric phenol compounds, hydrazide compounds, boron trifluoride-amine complexes, amine imide compounds, polyamine salts, and modified products and microcapsule types of these. can be mentioned. These may be used alone or in combination of two or more. It is more preferable to use an imidazole compound from the viewpoint of having better latent properties (excellent stability at room temperature and exhibiting curability by heating) and faster curing speed.
  • the content of the epoxy resin curing agent (B) in the adhesive composition may be appropriately set depending on the type of curing agent and the reaction form.
  • the amount may be 0.5 to 100 parts by weight, 1 to 80 parts by weight, 2 to 50 parts by weight, 4 to 20 parts by weight, based on 100 parts by weight of the epoxy resin (A). It is also preferable to do so.
  • the amount of the imidazole compound is 0.5 to 10 parts by mass, and 2 to 9 parts by mass based on 100 parts by mass of the epoxy resin (A).
  • the curing time can be further shortened.
  • the content of the epoxy resin curing agent (B) By setting the content of the epoxy resin curing agent (B) to the above-mentioned preferable lower limit or more, the curing time can be further shortened.
  • the content of the epoxy resin curing agent (B) By setting the content of the epoxy resin curing agent (B) to the above-mentioned preferable upper limit or less, film-like adhesion of excess curing agent can be achieved. Remaining in the agent can be suppressed. As a result, adsorption of moisture by the residual curing agent is suppressed, and the reliability of the semiconductor device can be improved.
  • a polyrotaxane compound is a high-molecular compound having end-capping groups at both ends of a pseudopolyrotaxane in which the opening of a cyclic molecule is encapsulated in a skewered manner by a linear molecule.
  • the polyrotaxane compounds used in the present invention may be one type or two or more types.
  • linear molecule forming the polyrotaxane compound is not particularly limited as long as it can be included in the opening of the cyclic molecule in a skewered manner.
  • linear molecules include polyvinyl alcohol, polyolefin resin, polyester resin, polyvinyl chloride resin, polystyrene resin, acrylic resin, polycarbonate resin, polyurethane resin, polydienes, polyalkylene glycol, polyimide, Examples include melamine resin and epoxy resin.
  • linear molecules described in paragraph [0030] of JP-A-2016-58138 and paragraph [0026] of JP-A-2015-203037 are mentioned, and these descriptions are incorporated herein by reference. Incorporated.
  • polyethylene glycol polyisoprene, polyisobutylene, polybutadiene, polypropylene glycol, polytetrahydrofuran, polydimethylsiloxane, polyethylene, polypropylene, polyvinyl alcohol and polyvinyl methyl ether are preferred, and polyethylene glycol is more preferred.
  • the weight average molecular weight of the linear molecule is not particularly limited, but is, for example, preferably 1,000 or more, more preferably 3,000 to 100,000, and still more preferably 6,000 to 50,000.
  • cyclic molecule forming the polyrotaxane compound has a cyclic molecular structure and has an opening in the center through which the linear molecule passes.
  • cyclic molecules are not particularly limited, and include, for example, cyclodextrin, crown ether, cryptand, macrocyclic amine, calixarene, cyclophane, and the like.
  • cyclodextrin ⁇ -cyclodextrin, ⁇ -cyclodextrin, or ⁇ -cyclodextrin
  • ⁇ -cyclodextrin is preferred because it has a hydroxyl group.
  • the cyclic molecule may have a functional group, such as a hydroxyl group, a mercapto group, a carbon-carbon unsaturated group, an amino group, a nitrile group, a carboxyl group, a diazo group, an aldehyde group, an ester. These are the basics.
  • the carbon-carbon unsaturated group include a vinyl group, an acryloyl group, a methacryloyl group, and an acetylene group.
  • the terminal capping group forming the polyrotaxane compound is not particularly limited as long as it is a group that can prevent the cyclic molecule from detaching from the linear molecule by binding to the linear molecule.
  • Examples of such groups include methyl group, ethyl group, butyl group, tert-butyl group, tert-butoxycarbonyl group, benzyloxycarbonyl group, acetyl group, adamantyl group, 2,4-dinitrophenyl group, and trityl group.
  • the method of introducing an end-capping group into a linear molecule is not particularly limited, and for example, a compound having a group capable of reacting with the terminal functional group of a linear molecule and the above-mentioned end-capping group, and a linear molecule. Examples include a method of reacting (bonding) with a terminal functional group using a conventional method.
  • the polyrotaxane compound may be one formed by the above-mentioned linear molecule, cyclic molecule, and end-capping group, and the combination of the linear molecule, cyclic molecule, and end-capping group is not particularly limited.
  • a combination of polyethylene glycol as a linear molecule, cyclodextrin as a cyclic molecule, and adamantyl group as an end-capping group is preferred.
  • the polyrotaxane compound may be synthesized or a commercially available product may be used.
  • the synthesis method is not particularly limited, and for example, the methods described in International Publication No. 2005/080469A1, International Publication No. 2005-108464A1, or each publication described in paragraph [0042] of Patent Document 2 may be referred to. Can be done.
  • Commercially available polyrotaxane compounds include, for example, the "CELM (registered trademark) Super Polymer” series (manufactured by Advanced Soft Materials).
  • the content of the polyrotaxane compound (C) is preferably 5 to 15 parts by mass, more preferably 5 to 12 parts by mass, based on the total of 100 parts by mass of each content of the epoxy resin (A) and the polymer component (D). Preferably, 5 to 10 parts by mass is more preferable.
  • ⁇ Polymer component (D)> The above-mentioned polymer component (D) suppresses film tackiness (the property that the film state easily changes even with a slight temperature change) at room temperature (25°C) when forming a film-like adhesive, and provides sufficient Any component that imparts adhesiveness and film-forming properties (film-forming properties) may be used.
  • Natural rubber butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic Examples include polyimide resins, polyamide resins such as 6-nylon and 6,6-nylon, phenoxy resins, (meth)acrylic resins, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyamideimide resins, fluororesins, polyurethane resins, etc. . These polymer components (D) may be used alone or in combination of two or more. As the polymer component (D), phenoxy resins, (meth)acrylic resins, and polyurethane resins are preferred, and phenoxy resins are more preferred.
  • the weight average molecular weight of the polymer component (D) is 10,000 or more. There is no particular limit to the upper limit, but 5,000,000 or less is practical.
  • the weight average molecular weight of the polymer component (D) is a value determined in terms of polystyrene by GPC [Gel Permeation Chromatography]. Hereinafter, the value of the weight average molecular weight of the specific polymer component (D) is also the same.
  • the glass transition temperature (Tg) of the polymer component (D) is preferably less than 100°C, more preferably less than 90°C.
  • the lower limit is preferably 0°C or higher, more preferably 10°C or higher.
  • the glass transition temperature of the polymer component (D) is the glass transition temperature measured by DSC at a heating rate of 0.1° C./min.
  • the value of the glass transition temperature of the specific polymer component (D) is also synonymous.
  • a resin that can have an epoxy group such as a phenoxy resin is a resin having an epoxy equivalent of 500 g/eq or less. , those that do not apply are classified as component (D).
  • Phenoxy resin There is no particular restriction on the phenoxy resin, and a wide variety of known phenoxy resins can be used as the film component of the film adhesive. Phenoxy resin can be obtained by conventional methods. For example, phenoxy resins can be obtained by reacting bisphenols or biphenol compounds with epihalohydrins such as epichlorohydrin, or by reacting liquid epoxy resins with bisphenols or biphenol compounds.
  • the weight average molecular weight of the phenoxy resin is preferably 10,000 or more, more preferably 10,000 to 100,000. Further, the amount of epoxy groups slightly remaining in the phenoxy resin is preferably 5000 g/eq or more in terms of epoxy equivalent.
  • the glass transition temperature (Tg) of the phenoxy resin is preferably less than 100°C, more preferably less than 90°C.
  • the lower limit is preferably 0°C or higher, more preferably 10°C or higher.
  • the (meth)acrylic resin is not particularly limited, and resins made of known (meth)acrylic copolymers can be widely used as film components of film adhesives.
  • the (meth)acrylic resin include poly(meth)acrylic acid esters or derivatives thereof.
  • copolymers containing monomer components such as 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, acrylic acid, methacrylic acid, itaconic acid, glycidyl methacrylate, glycidyl acrylate, etc. Can be mentioned.
  • (meth)acrylic acid esters having a cyclic skeleton for example, (meth)acrylic acid cycloalkyl ester, (meth)acrylic acid benzyl ester, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl Copolymers using (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, imido(meth)acrylate, etc. as monomers are also preferred.
  • (meth)acrylic acid alkyl esters in which the alkyl group has 1 to 18 carbon atoms for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and butyl (meth)acrylate. , etc. are also preferable as monomer components. It may also be copolymerized with vinyl acetate, (meth)acrylonitrile, styrene, or the like. It is preferable for the (meth)acrylic resin to have a hydroxyl group in terms of compatibility with the epoxy resin.
  • the weight average molecular weight of the (meth)acrylic copolymer is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. By setting the above-mentioned weight average molecular weight within the above-mentioned preferable range, tackiness can be reduced and an increase in melt viscosity can also be suppressed.
  • the glass transition temperature of the (meth)acrylic copolymer is preferably -35°C to 50°C, more preferably -10°C to 50°C, even more preferably 0°C to 40°C, particularly preferably 0°C to 30°C. in range. By setting the glass transition temperature within the above preferable range, tackiness can be reduced and generation of voids between the semiconductor wafer and the film adhesive can be suppressed.
  • Polyurethane resin is a polymer having urethane (carbamate ester) bonds in its main chain.
  • the polyurethane resin has a structural unit derived from a polyol, a structural unit derived from a polyisocyanate, and may further have a structural unit derived from a polycarboxylic acid.
  • the polyurethane resins may be used alone or in combination of two or more.
  • the Tg of the polyurethane resin is usually 100°C or less, preferably 60°C or less, more preferably 50°C or less, and also preferably 45°C or less.
  • the weight average molecular weight of the polyurethane resin is not particularly limited, and those within the range of 5,000 to 500,000 are usually used.
  • Polyurethane resins can be synthesized by conventional methods, or can also be obtained from the market. Commercially available products that can be used as polyurethane resins include Dynaleo VA-9320M, Dynaleo VA-9310MF, and Dynaleo VA-9303MF (all manufactured by Toyochem).
  • the content of the polymer component (D) is preferably 20 to 70 parts by mass, more preferably 30 to 60 parts by mass, out of the total 100 parts by mass of each content of the epoxy resin (A) and the polymer component (D). , more preferably 40 to 60 parts by mass.
  • the content of the polymer component (D) can be 30 to 80 parts by mass, and may be 40 to 70 parts by mass, out of the total 100 parts by mass of the epoxy resin (A) and the polymer component (D). , 40 to 60 parts by mass.
  • any inorganic filler that is normally used in adhesive compositions can be used without particular limitation.
  • the inorganic filler (E) include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina (aluminum oxide), beryllium oxide, magnesium oxide, silicon carbide, silicon nitride, aluminum nitride, and boron nitride.
  • various inorganic powders such as metals such as aluminum, copper, silver, gold, nickel, chromium, lead, tin, zinc, palladium, solder, alloys, carbons such as carbon nanotubes, carbon nanofibers, and graphene. It will be done.
  • the average particle size (d50) of the inorganic filler (E) is not particularly limited, but from the viewpoint of making the film adhesive thinner, it is preferably 0.01 to 6.0 ⁇ m, preferably 0.01 to 5.0 ⁇ m, The thickness is more preferably 0.1 to 3.5 ⁇ m, and even more preferably 0.1 to 1.0 ⁇ m.
  • the average particle size (d50) is the so-called median diameter, which is the particle size when particle size distribution is measured by laser diffraction/scattering method and the cumulative distribution is 50% when the total volume of particles is 100%. means.
  • the Mohs hardness of the inorganic filler is not particularly limited, but is preferably 2 or more, more preferably 2 to 9. Mohs hardness can be measured using a Mohs hardness meter.
  • the inorganic filler (E) may include an inorganic filler with thermal conductivity (an inorganic filler with a thermal conductivity of 12 W/m ⁇ K or more), or an inorganic filler without thermal conductivity. (An inorganic filler having a thermal conductivity of less than 12 W/m ⁇ K) may also be used.
  • the thermally conductive inorganic filler (E) is a particle made of a thermally conductive material or a particle whose surface is coated with a thermally conductive material, and the thermal conductivity of these thermally conductive materials is 12 W/m. - It is preferable that it is K or more, and it is more preferable that it is 30 W/m ⁇ K or more.
  • the thermal conductivity of the thermally conductive material is equal to or higher than the preferable lower limit value, the amount of the inorganic filler (E) blended to obtain the desired thermal conductivity can be reduced, and the melting of the die attach film can be reduced.
  • the increase in viscosity is suppressed, and the ability to embed the material into the uneven portions of the substrate can be further improved when the material is pressure-bonded to the substrate. As a result, the generation of voids can be suppressed more reliably.
  • the thermal conductivity of the thermally conductive material means the thermal conductivity at 25° C., and literature values for each material can be used. Even if there is no description in the literature, for example, a value measured according to JIS R 1611:2010 for ceramics, and a value measured according to JIS H 7801:2005 for metals can be substituted.
  • thermally conductive ceramics such as alumina particles (thermal conductivity: 36 W/m ⁇ K), aluminum nitride particles (thermal conductivity: 150 to 290 W). /m ⁇ K), boron nitride particles (thermal conductivity: 60 W/m ⁇ K), zinc oxide particles (thermal conductivity: 54 W/m ⁇ K), silicon nitride particles (thermal conductivity: 27 W/m ⁇ K) , silicon carbide particles (thermal conductivity: 200 W/m ⁇ K) and magnesium oxide particles (thermal conductivity: 59 W/m ⁇ K).
  • thermally conductive ceramics such as alumina particles (thermal conductivity: 36 W/m ⁇ K), aluminum nitride particles (thermal conductivity: 150 to 290 W). /m ⁇ K), boron nitride particles (thermal conductivity: 60 W/m ⁇ K), zinc oxide particles (thermal conductivity: 54 W/m ⁇ K), silicon nitride particles (thermal conductivity: 27 W/m ⁇ K
  • examples of the inorganic filler (E) having thermal conductivity include metal particles having higher thermal conductivity than ceramics or particles whose surface is coated with metal.
  • single metal fillers such as silver (thermal conductivity: 429 W/m ⁇ K), nickel (thermal conductivity: 91 W/m ⁇ K), and gold (thermal conductivity: 329 W/m ⁇ K)
  • Preferred examples include polymer particles such as acrylic and silicone resin whose surfaces are coated with.
  • the inorganic filler (E) may be surface-treated or surface-modified, and surface-treating agents used for such surface treatment or surface modification include silane coupling agents, phosphoric acid or phosphoric acid compounds, and interface
  • surface-treating agents used for such surface treatment or surface modification include silane coupling agents, phosphoric acid or phosphoric acid compounds, and interface
  • activators include silane cups other than those described herein, for example, in the thermally conductive filler section of WO 2018/203527 or the aluminum nitride filler section of WO 2017/158994.
  • the descriptions of ring agents, phosphoric acid or phosphoric acid compounds and surfactants are applicable.
  • the inorganic filler (E) As a method for blending the inorganic filler (E) with resin components such as the epoxy resin (A), the epoxy resin curing agent (B), the polyrotaxane compound (C), and the polymer component (D), powdered inorganic
  • the method of treating the inorganic filler (E) with the silane coupling agent is not particularly limited, and may include a wet method of mixing the inorganic filler (E) and the silane coupling agent in a solvent, and a method of inorganic filling in a gas phase. Examples include a dry method of mixing material (E) and a silane coupling agent, and the above-mentioned integral blend method.
  • aluminum nitride particles contribute to high thermal conductivity, they tend to generate ammonium ions when hydrolyzed, so it is recommended that they be used in combination with phenolic resins, which have a low moisture absorption rate, or that hydrolysis be suppressed by surface modification. is preferred.
  • As a method for surface modification of aluminum nitride it is particularly preferable to provide an oxide layer of aluminum oxide on the surface layer to improve water resistance, and to perform surface treatment with phosphoric acid or a phosphoric acid compound to improve affinity with resin. .
  • a silane coupling agent has at least one hydrolyzable group such as an alkoxy group or an aryloxy group bonded to a silicon atom, and may also have an alkyl group, an alkenyl group, or an aryl group bonded to the silicon atom. good.
  • the alkyl group is preferably substituted with an amino group, an alkoxy group, an epoxy group, or a (meth)acryloyloxy group; Those substituted with an oxy group are more preferred.
  • silane coupling agent examples include 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, and 3-glycidyloxypropylmethyldimethoxysilane.
  • Silane 3-glycidyloxypropylmethyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, N-phenyl-3-aminopropyltri Examples include methoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-methacryloyloxypropylmethyldiethoxysilane, and 3-methacryloyloxypropyltriethoxysilane.
  • the silane coupling agent and surfactant are preferably contained in an amount of 0.1 to 25.0 parts by mass, and preferably 0.1 to 10.0 parts by mass, per 100 parts by mass of the inorganic filler (E). More preferably, it is contained in an amount of 0.1 to 2.0 parts by mass.
  • the shape of the inorganic filler (E) includes flakes, needles, filaments, spheres, and scales, but spherical particles are preferred from the viewpoint of high filling and fluidity.
  • the adhesive composition of the present invention contains an inorganic filler (E), the content of the inorganic filler (E) with respect to a total of 100 parts by mass of each content of the epoxy resin (A) and the polymer component (D).
  • the amount is 45 parts by weight or less. Within the above range, even if the inorganic filler (E) is contained, the adhesive strength will not be significantly reduced.
  • the adhesive composition of the present invention contains an inorganic filler (E), the content of the inorganic filler (E) with respect to a total of 100 parts by mass of each content of the epoxy resin (A) and the polymer component (D).
  • the amount is preferably 10 to 45 parts by weight, more preferably 20 to 45 parts by weight, and even more preferably 30 to 40 parts by weight.
  • the adhesive composition of the present invention contains, in addition to an epoxy resin (A), an epoxy resin curing agent (B), a polyrotaxane compound (C), a polymer component (D), and an inorganic filler (E). It may further contain an organic solvent (such as methyl ethyl ketone), an ion trapping agent, a curing catalyst, a viscosity modifier, an antioxidant, a flame retardant, a coloring agent, etc., within a range that does not impair the effect. For example, other additives of WO 2017/158994 may be included.
  • the total proportion of each content of the epoxy resin (A), the epoxy resin curing agent (B), the polyrotaxane compound (C), and the polymer component (D) in the adhesive composition of the present invention is, for example, , can be 60% by mass or more, preferably 70% by mass or more, more preferably 80% by mass or more, and can also be 90% by mass or more. Moreover, the said ratio may be 100 mass % and can also be made into 95 mass % or less.
  • the adhesive composition of the present invention contains an inorganic filler (E), the epoxy resin (A), the epoxy resin curing agent (B), the polyrotaxane compound (C), and the polymer component (D ) and the inorganic filler (E) can be, for example, 60% by mass or more, preferably 70% by mass or more, more preferably 80% by mass or more, and 90% by mass or more. It is also possible to do this. Moreover, the said ratio may be 100 mass % and can also be made into 98 mass % or less.
  • the adhesive composition of the present invention can be suitably used to obtain the film adhesive of the present invention. However, the present invention is not limited to film adhesives, and can also be suitably used to obtain liquid or paste adhesives, for example.
  • the adhesive composition of the present invention can be obtained by mixing the above-mentioned components at a temperature at which the epoxy resin (A) does not actually harden.
  • the order of mixing is not particularly limited.
  • Resin components such as the epoxy resin (A), the polyrotaxane compound (C), and the polymer component (D) may be mixed together with a solvent if necessary, and then the epoxy resin curing agent (B) may be mixed.
  • the polyrotaxane compound (C) may be mixed separately from the epoxy resin (A) and the polymer component (D), for example, the epoxy resin (A) and the polymer component (D) may be mixed together as necessary.
  • the epoxy resin curing agent (B) and the polyrotaxane compound (C) may be mixed together with a solvent.
  • mixing in the presence of the epoxy resin curing agent (B) may be carried out at a temperature at which the epoxy resin (A) does not actually harden, and in the absence of the epoxy resin curing agent (B).
  • the mixing of the resin components may be carried out at higher temperatures.
  • the order of mixing the inorganic filler (E) is not particularly limited, but it can be mixed at the same time as the epoxy resin curing agent (B).
  • the adhesive composition of the present invention is preferably stored at a temperature of 10° C. or lower before use (before forming into a film adhesive). .
  • the film adhesive of the present invention is a film adhesive obtained from the adhesive composition of the present invention. Therefore, the film adhesive of the present invention contains the above-mentioned epoxy resin (A), epoxy resin curing agent (B), polyrotaxane compound (C), and polymer component (D).
  • the film adhesive of the present invention may further contain an inorganic filler (E), and other additives other than organic solvents may be included in the adhesive composition of the present invention as other additives. may contain additives.
  • the film adhesive of the present invention is specified as follows. Contains an epoxy resin (A), an epoxy resin curing agent (B), a polyrotaxane compound (C), and a polymer component (D), A film adhesive containing 5 to 15 parts by mass of the polyrotaxane compound (C) based on a total of 100 parts by mass of the epoxy resin (A) and the polymer component (D).
  • the solvent is usually removed from the adhesive composition by drying. Therefore, the content of the solvent in the film adhesive of the present invention is 1000 ppm (ppm is based on mass) or less, and usually 0.1 to 1000 ppm.
  • the term "film” means a thin film having a thickness of 200 ⁇ m or less. The shape, size, etc. are not particularly limited and can be adjusted as appropriate depending on the manner of use.
  • the film adhesive of the present invention is in a state before curing, that is, in a B stage state.
  • the film adhesive before curing refers to an adhesive in a state before the epoxy resin (A) is thermally cured.
  • a film adhesive before thermosetting is one that has not been exposed to a temperature condition of 25°C or higher for 72 hours or more after preparation, and has not been exposed to a temperature condition of over 30°C. means a film adhesive that is not
  • the film adhesive after curing refers to an epoxy resin (A) in a thermoset state.
  • the film adhesive of the present invention can be suitably used as a die attach film in semiconductor manufacturing processes.
  • the film adhesive of the present invention is formed by preparing the adhesive composition (varnish) of the present invention, applying this composition onto a release-treated base film, and drying as necessary. can do.
  • Adhesive compositions usually contain an organic solvent.
  • the release-treated base film may be any film that functions as a cover film for the obtained film adhesive, and any known film may be used as appropriate. Examples include release-treated polypropylene (PP), release-treated polyethylene (PE), and release-treated polyethylene terephthalate (PET).
  • PP release-treated polypropylene
  • PE release-treated polyethylene
  • PET release-treated polyethylene terephthalate
  • any known method can be appropriately employed, and examples thereof include methods using a roll knife coater, a gravure coater, a die coater, a reverse coater, and the like. Drying may be performed as long as the organic solvent is removed from the adhesive composition to form a film adhesive without curing the epoxy resin (A), for example, by holding at a temperature of 80 to 150°C
  • the film adhesive of the present invention may be composed of the film adhesive of the present invention alone, or may be formed by laminating the above-mentioned release-treated base film on at least one surface of the film adhesive. It may be a form. Furthermore, it may be integrated with a dicing film to form a dicing/die attach film. Further, the film adhesive of the present invention may be in the form of a film cut out to an appropriate size, or may be in the form of a film wound into a roll.
  • the film adhesive of the present invention is preferably stored at a temperature of 10° C. or lower before use (before curing) from the viewpoint of suppressing curing of the epoxy resin (A).
  • FIG. 1 to 7 are schematic longitudinal cross-sectional views showing a preferred embodiment of each step of the method for manufacturing a semiconductor package of the present invention.
  • the film adhesive 2 (die attach film 2) of the present invention is thermocompression bonded to the surface (on which no circuit is formed) to form an adhesive layer (film adhesive 2).
  • a dicing film 3 (dicing tape 3) is provided via the adhesive 2).
  • the film adhesive 2 is shown smaller than the dicing film 3, but the sizes (areas) of both films are appropriately set depending on the purpose.
  • the thermocompression bonding is carried out at a temperature at which the epoxy resin (A) is not practically cured by heat. For example, conditions include a temperature of about 70° C. and a pressure of about 0.3 MPa.
  • a semiconductor wafer having at least one semiconductor circuit formed on its surface can be appropriately used, and examples thereof include a silicon wafer, a SiC wafer, a GaAs wafer, and a GaN wafer.
  • a known device such as a roll laminator or a manual laminator can be used as appropriate.
  • the die attach film and the dicing film are attached separately, but when the film adhesive of the present invention is in the form of a dicing/die attach film, the film adhesive and the dicing film are attached together. Can be pasted together.
  • the semiconductor wafer 1 and the adhesive layer are diced together, and the semiconductor wafer is diced onto the dicing film 3.
  • a semiconductor chip 5 with an adhesive layer is obtained, which includes a semiconductor chip 4 with a film-like adhesive layer and film-like adhesive pieces 2 in which the film-like adhesive 2 is cut into pieces.
  • the dicing device is not particularly limited, and a normal dicing device can be used as appropriate.
  • the semiconductor chip 5 with the adhesive layer is peeled off from the dicing film 3.
  • the dicing film may be cured with energy rays to reduce the adhesive strength. Peeling can be performed by picking up the semiconductor chip 5 with the adhesive layer.
  • the semiconductor chip 5 with the adhesive layer and the wiring board 6 are bonded together by thermocompression via the film adhesive piece 2, and the semiconductor chip 5 with the adhesive layer is mounted on the wiring board 6.
  • the wiring board 6 a board on which a semiconductor circuit is formed can be used as appropriate, such as a printed circuit board (PCB), various lead frames, and electronic components such as resistive elements and capacitors mounted on the board surface. Examples include substrates that have been
  • the method of mounting the semiconductor chip 5 with an adhesive layer on such a wiring board 6 is not particularly limited, and a conventional mounting method using thermocompression bonding can be adopted as appropriate.
  • thermosetting temperature is not particularly limited as long as it is above the thermosetting start temperature of the film adhesive piece 2, and is adjusted as appropriate depending on the type of epoxy resin (A) and epoxy resin curing agent (B) used. .
  • the temperature is preferably 100 to 180°C, and more preferably 140 to 180°C from the viewpoint of curing in a shorter time. If the temperature is too high, the components in the film adhesive piece 2 will tend to volatilize and foam during the curing process.
  • the time for this thermosetting treatment may be appropriately set depending on the heating temperature, and can be, for example, 10 to 120 minutes.
  • connection method is not particularly limited, and conventionally known methods such as a wire bonding method, a TAB (Tape Automated Bonding) method, etc. can be appropriately employed.
  • a plurality of semiconductor chips 4 can be stacked by thermocompression bonding and thermosetting another semiconductor chip 4 on the surface of the mounted semiconductor chip 4, and then connecting it to the wiring board 6 again using a wire bonding method.
  • the semiconductor chips are stacked while being shifted, or as shown in FIG. 6, the thickness of the film-like adhesive piece 2 from the second layer onward is increased so that the bonding wire 7 is embedded in the stack. etc.
  • the sealing resin 8 is not particularly limited, and any known sealing resin that can be used for manufacturing semiconductor packages can be used. Furthermore, the method of sealing with the sealing resin 8 is not particularly limited, and any commonly used method may be employed.
  • the semiconductor package of the present invention is manufactured by the above-described semiconductor package manufacturing method, and the semiconductor chip and the wiring board, or at least one location between the semiconductor chips, are bonded with the thermoset of the film-like adhesive of the present invention. There is.
  • the semiconductor package of the present invention is preferably a wire bonding type semiconductor package containing a thermoset of the film adhesive of the present invention.
  • Example 1 In a 1000 mL separable flask, 50 parts by mass of HP-7200 (dicyclopentadiene type epoxy resin, manufactured by DIC Corporation) was used as an epoxy resin, and YP-50 (phenoxy resin, Tg 84°C, Nippon Steel Chemical & Materials Co., Ltd.) was used as a polymer component. 50 parts by weight of MEK) and 30 parts by weight of MEK were heated and stirred at a temperature of 110° C. for 2 hours to obtain a resin varnish.
  • HP-7200 dicyclopentadiene type epoxy resin, manufactured by DIC Corporation
  • YP-50 phenoxy resin, Tg 84°C, Nippon Steel Chemical & Materials Co., Ltd.
  • this resin varnish was transferred to an 800 mL planetary mixer, and SH2400P (trade name, linear molecule: polyethylene glycol (weight average molecular weight 20,000), cyclic molecule: cyclodextrin, end-capping group: adamantyl group, ASM) was added as a polyrotaxane compound.
  • SH2400P trade name, linear molecule: polyethylene glycol (weight average molecular weight 20,000), cyclic molecule: cyclodextrin, end-capping group: adamantyl group, ASM
  • 2PHZ-PW trade name, imidazole type hardener, manufactured by Shikoku Kasei
  • a mixed varnish was obtained.
  • the obtained mixed varnish was applied onto a release-treated PET film with a thickness of 20 ⁇ m and dried by heating at 130° C. for 10 minutes to form a release film with a length of 300 mm, a width of 200 mm, and a thickness of 5 ⁇ m of film adhesive.
  • Example 2 A film adhesive with a release film was obtained in the same manner as in Example 1, except that the amount of the polyrotaxane compound used was 5 parts by mass.
  • Example 3 In Example 1, SH1300P (trade name, linear molecule: polyethylene glycol (weight average molecular weight 11,000), cyclic molecule: cyclodextrin, terminal capping group: adamantyl group, manufactured by ASM) was used instead of SH2400P when preparing the mixed varnish. A film adhesive with a release film was obtained in the same manner as in Example 1, except that 10 parts by mass of was used.
  • Example 4 A film adhesive with a release film was obtained in the same manner as in Example 1, except that 5 parts by mass of SH1300P was used in place of SH2400P when preparing the mixed varnish.
  • Example 5 A film adhesive with a release film was obtained in the same manner as in Example 1, except that 40 parts by mass of SO-C2 (trade name, silica filler, manufactured by Admatec) was added when preparing the mixed varnish. Ta.
  • SO-C2 trade name, silica filler, manufactured by Admatec
  • Example 6 A film adhesive with a release film was obtained in the same manner as in Example 2, except that 40 parts by mass of SO-C2 was added when preparing the mixed varnish.
  • Example 7 A film adhesive with a release film was obtained in the same manner as in Example 6, except that the epoxy resin was HP-4710 (trade name, naphthalene type epoxy resin, manufactured by Nippon Kayaku Co., Ltd.).
  • Example 3 A film adhesive with a release film was obtained in the same manner as in Example 1, except that the amount of polyrotaxane compound used was 3 parts by mass, and 40 parts by mass of SO-C2 was added to the mixed varnish. .
  • Example 5 In Example 1, a release film was attached in the same manner as in Example 1, except that 3 parts by mass of SH1300P was used instead of SH2400P when preparing the mixed varnish, and 40 parts by mass of silica filler SO-C2 was added to the mixed varnish. Obtained film adhesive
  • Example 7 A film adhesive with a release film was obtained in the same manner as in Example 1, except that 20 parts by mass of SH1300P was used in place of SH2400P when preparing the mixed varnish.
  • Table 1 shows the composition of the film adhesive created in each Example and Comparative Example. A blank column means that the component is not contained.
  • test piece To measure warpage, place the test piece on a surface plate with the side with the film adhesive facing up, and use a ruler to measure the height from the surface of the surface plate to the warped end of the test piece. This was done by measuring.
  • the center of the surface of the test piece is in contact with the surface plate, and the four sides of the test piece are placed above the surface plate (the side where the film adhesive is pasted on the test piece). is warped.
  • the warpage was measured at the side opposite to the side with the largest warp among the four sides of the test piece. The same measurement was performed on three specimens and the average value was determined.
  • the film adhesive with a release film obtained in each Example and Comparative Example was coated using a manual laminator (trade name: FM-114, manufactured by Technovision Co., Ltd.) under conditions of a temperature of 70°C and a pressure of 0.3 MPa. Then, it was bonded to one side of a dummy silicon wafer (8 inch size, 0.35 mm thick). Thereafter, after peeling off the release film from the film adhesive, using the same manual laminator, place a dicing tape on the surface of the film adhesive opposite to the dummy silicon wafer at room temperature and under a pressure of 0.3 MPa.
  • a manual laminator trade name: FM-114, manufactured by Technovision Co., Ltd.
  • a dicing device product name: DFD-6340, product name: DFD-6340, Dicing was performed from the dummy silicon wafer side using a dummy silicon wafer (manufactured by DISCO) to form squares of 2 mm x 2 mm in size, and the individual pieces with a film adhesive (adhesive layer) were placed on the dicing film.
  • a dummy chip semiconductor chip
  • the dummy chip with film adhesive was picked up from the dicing tape using a die bonder (product name: DB-800, manufactured by Hitachi High-Technologies Corporation), and was placed at 130° C., under a pressure of 0.1 MPa (load: 400 gf), for 0 hours.
  • the film-like adhesive side of the dummy chip with film-like adhesive and the mounting surface side of the lead frame substrate (42Alloy system, manufactured by Toppan Printing Co., Ltd.) were bonded together by thermocompression for 5 seconds.
  • the film adhesive was thermally cured by heating at 180° C. for 1 hour in a dryer.
  • a universal bond tester product name: Series 4000PXY, manufactured by Nordson Advanced Technologies
  • shear peeling force shear peeling force
  • the adhesive compositions of Comparative Examples 1 to 5 do not contain a polyrotaxane compound, or the content thereof is less than that specified in the present invention. Film adhesives formed using these adhesive compositions resulted in warping of 8 mm or more.
  • the adhesive compositions of Comparative Examples 6 and 7 have a higher content of polyrotaxane compound than specified in the present invention. Film adhesives formed using these adhesive compositions had adhesive strength of 18 MPa or less, resulting in poor adhesive strength.
  • the adhesive composition of Comparative Example 8 does not use an epoxy resin having a condensed ring structure. A film adhesive formed using this adhesive composition had an adhesive force of 15 MPa, which resulted in poor adhesive force.
  • the film adhesives formed using the adhesive compositions of Examples 1 to 7 that meet the provisions of the present invention have a warpage of 0 to 0.5 mm and a shear adhesive strength of 58 MPa or more. there were. It can be seen that by using the adhesive composition of the present invention, a package with reduced warpage can be formed without significantly impairing the adhesive strength with the adherend. Furthermore, it can be seen that even when an inorganic filler is contained, a sufficiently high adhesive force can be maintained.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
PCT/JP2023/015341 2022-04-28 2023-04-17 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法 Ceased WO2023210427A1 (ja)

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EP23796170.1A EP4516870A4 (en) 2022-04-28 2023-04-17 Adhesive composition, film-like adhesive, semiconductor package using film-like adhesive, and method for manufacturing same
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WO2025205832A1 (ja) * 2024-03-28 2025-10-02 古河電気工業株式会社 フィルム状接着剤、接着剤用組成物、ダイシング・ダイアタッチフィルム、並びに半導体パッケージ及び半導体パッケージの製造方法

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CN118159621A (zh) 2024-06-07
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