WO2023208421A1 - Composition de rebouchage bi-composant - Google Patents

Composition de rebouchage bi-composant Download PDF

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Publication number
WO2023208421A1
WO2023208421A1 PCT/EP2023/025196 EP2023025196W WO2023208421A1 WO 2023208421 A1 WO2023208421 A1 WO 2023208421A1 EP 2023025196 W EP2023025196 W EP 2023025196W WO 2023208421 A1 WO2023208421 A1 WO 2023208421A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
gap filler
filler composition
aluminium oxide
oxide powder
Prior art date
Application number
PCT/EP2023/025196
Other languages
English (en)
Inventor
Phillip James KINNER
Original Assignee
H. K. Wentworth Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by H. K. Wentworth Limited filed Critical H. K. Wentworth Limited
Publication of WO2023208421A1 publication Critical patent/WO2023208421A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Definitions

  • the present invention relates to a two-component gap filler composition, a method of applying a gap filler to an electronic component, and an electronic component
  • thermal conductive materials are matched to the thermal conductivity and thermal contact in the application.
  • aspects to be considered such as electrical insulation properties and maximum operating temperatures in which they operate.
  • the available space and the budget also play a role.
  • Most products are based on silicone elastomers, which are filled with thermally conductive
  • Liquid or paste gap fillers are available as either one-component (1 K) or two-component (2K) fillers.
  • One-part materials are highly viscous thermally conductive pastes that remain permanently liquid and behave thixotropically form-in-place. They can be applied with autodispensing equipment or by hand.
  • two-part gap fillers the two components of the thermally conductive material are stored separately and, in the case
  • US2020270499 relates to a multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure.
  • US5021494 relates to a thermal conductive silicone composition.
  • CN113897066A relates to a high thermally conductive double-component-derived thermal gel.
  • WO 2021/128273 A1 relates to a two-part silicone composition and sealant and assembly made therefrom.
  • CN 114395368 A relates to a two-component modified thermosetting silica gel and a
  • CN 114196209 A relates to an addition-curable two- component high-stability heat-conducting organic silicon composition and a preparation method thereof.
  • CN 114181656 A relates to a bonding and sealing silicone material for a two-component low-viscosity photovoltaic module and a preparation method of a bonding and sealing silicone material.
  • CN 113736266 A relates to a two-component
  • CN 113429930 A relates to an addition type two-component organic silicon pouring sealant and a preparation method thereof.
  • CN 109337644 A relates to an addition type moulding room-temperature bonding two-component pouring sealant and a preparation method thereof.
  • CN 108753246 A relates to a high thermal conductivity two-component pouring
  • CN 107964245 A relates to a dispensing gel heat conduction pad and a preparation method thereof.
  • CN 107325782 A relates to a two-component pouring sealant and a preparation method thereof.
  • the problem with many conventional two-component gap filler compositions is that as the content of the thermally conductive filler increases, the viscosity may increase to the point where application to an electronic device is hindered, meaning that gaps may remain.
  • the bond strength may be low and/or the bond strengthening time may be long. This may reduce device lifetime and/or increase the complexity of the manufacturing process.
  • the present invention seeks to tackle at least some of the problems associated with the prior art, or at least to provide a commercially acceptable alternative solution thereto.
  • the present invention provides a two-component gap filler composition
  • a first component comprising a first polysiloxane and a first aluminium oxide powder
  • a second component comprising a second polysiloxane and a second aluminium oxide powder.
  • the composition of the present invention may exhibit a lower viscosity for the same thermal conductivity. This may result in easier and faster application.
  • the composition when used as an adhesive, may exhibit improved bond strength. This may increase the reliability of a device containing a gap filler formed using the composition.
  • the composition of the present application may develop bond strength more quickly. This may be advantageous during a production process using the composition.
  • gap filler composition may encompass a thermally conductive adhesive composition for filling a gap in an electronic device between an electronic component and a housing or heat sink.
  • the first component and second component are typically different.
  • the first polysiloxane and second polysiloxane may be the same or different, but are typically different.
  • the first aluminium oxide powder and second aluminium oxide powder may be the same or
  • the first polysiloxane and/or second polysiloxane may each comprise a single polysiloxane or multiple polysiloxanes.
  • the composition typically exhibits a high electrical resistivity.
  • the composition when cured, may exhibit a volume resistivity of greater than or equal to 1 x 10 13 Q cm, preferably greater than or equal to 1 x 10 14 O cm, even more preferably greater than or equal to 1 x 10 15 Q cm.
  • the composition When cured, the composition typically exhibits a low thermal expansion coefficient, preferably less than or equal to 1 x 10' 3 m/mk, more preferably less than or equal to 1 x 10' 4 m/mk.
  • the first component and/or second component may be in the form of a paste of gel.
  • the first aluminium oxide powder and/or the second aluminium oxide powder preferably has a multi-modal particle size distribution (e.g. a bi-modal, tri-modal or quad-modal), preferably a tri-modal or quad-modal particle size distribution.
  • particle size it is meant the longest dimension of the particle. The particle size distribution, calculated on a
  • 25 volume basis may be determined by, for example, laser diffraction. Such particle size distributions may be particularly effective at providing a lower viscosity for the same thermal conductivity.
  • the particles of the first aluminium oxide powder and the second aluminium oxide powder may take the form of, for example, spheres, rods and/or plates.
  • the first aluminium oxide powder and/or the second aluminium oxide powder preferably comprises substantially spherical particles, e.g. having an aspect ratio of less than 2 and substantially non-spherical particles, e.g. having an aspect ratio of two or more.
  • aspect ratio it is meant the ratio of the longest dimension to the shortest dimension of
  • the aspect ratio will be one.
  • the substantially non-spherical particles make take the form of, for example, rods or plates.
  • the substantially spherical particles preferably have an aspect ratio of less than 1.5, more preferably less than 1.2, even more preferably about 1 ; and/or the substantially non-spherical particles preferably have an aspect ratio of three or more, more preferably four or more.
  • the substantially spherical particles preferably have a ratio of the maximum Feret diameter to the minimum Feret diameter of less than 1 .5, preferably less than 1 .2, more preferably about 1 ; and/or the substantially non-spherical particles have a ratio of the maximum Feret diameter to the minimum Feret diameter of 3 or more, preferably 4 or more.
  • the maximum and minimum Feret diameters may be determined using, for
  • Such particles may be particularly effective at providing a lower viscosity for the same thermal conductivity.
  • the first aluminium oxide powder preferably comprises from 1 to 15 wt.% substantially spherical particles based on the total weight of the first aluminium oxide powder, more
  • the second aluminium oxide powder preferably comprises from 1 to 15 wt.% substantially spherical particles based on the total weight of the second aluminium oxide powder, more preferably from 2 to 10 wt.%.
  • 25 second aluminium oxide powder are surface-treated with a surface treatment agent I silane coupling agent.
  • the surface treatment agent preferably comprises an alkylalkoxysilane, and preferably has the general formula R 1 4- x Si(OR 2 ) x , where R 1 is an alkyl group having from 1 to 20 carbon atoms, R 2 is an alkyl group having from 1 to 4 carbon atoms and x is an integer between 1 and 3.
  • the alkylalkoxysilane preferably comprises hexadecyltrimethoxysilane. The presence of such species may reduce the viscosity of the composition.
  • the first component preferably comprises from 85 to 99 wt.% of the first aluminium oxide powder, more preferably from 90 to 96 wt.% of the first aluminium oxide powder, based
  • the second component comprises from
  • the two-component gap filler composition preferably comprises from 40 to 60 wt.% of the first component and from 40 to 60 wt.% of the second component. Higher levels may result in an unfavourably high viscosity and/or an unfavourably low bond strength and/or an unfavourably long bond strength-forming time.
  • the first component and the second component are preferably stored separately. This may ensure that they do not cure during storage.
  • the first component and/or the second component preferably comprises a colorant.
  • the first component and the second component may be different colours. This may enable the first component to be a different colour to the second component. As a result, it is easier to control the relative amounts of the first component and second component in use.
  • the first component and/or the second component preferably further comprises a catalyst.
  • the catalyst preferably comprises one or both of palladium and platinum. The presence of such catalysts may serve to increase the curing rate of the composition.
  • the catalyst is present in only one of the first component and the second
  • the first component and/or the second component preferably comprises a solvent.
  • the solvent preferably comprises toluene. This may result in a more favourable viscosity, thereby enabling easier dispensing and more accurate placement.
  • the first component and/or the second component preferably further comprises a silane coupling agent.
  • the silane coupling agent preferably comprises an alklypolysiloxane, more preferably octamethyltrisiloxane.
  • the use of a silane coupling agent may reduce the viscosity of the composition for the same volume of aluminium oxide powder.
  • the first polysiloxane preferably comprises an alkenyl group-containing organopolysiloxane.
  • the second polysiloxane preferably comprises an organohydrogenpolysiloxane.
  • the first component and/or the second component preferably further comprises a hydrosilylation reaction catalyst.
  • the two-component gap filler composition preferably has a thermal conductivity of at least 2 W/mK, preferably at least 3 W/mK, more preferably at least 4 W/mK, even more preferably least 5 W/mK. This may improve the performance of a device containing a gap filler formed using the composition.
  • the composition is preferably a room temperature vulcanizing composition.
  • the present invention provides a two-component gap filler composition
  • a two-component gap filler composition comprising: a first component comprising a first polysiloxane and a first thermally conductive filler; and
  • a second component comprising a second polysiloxane and a second thermally conductive filler.
  • the first thermally conductive filler and/or the second thermally conductive filler may be in the form of a powder or fibres, preferably a powder.
  • the first thermally conductive filler and/or the second thermally conductive filler comprises one or more of metal oxides, metal hydroxides, metal nitrides, metal carbides, metal silicides and carbons, preferably metal oxide, metal nitride and carbon, more preferably aluminium oxide, boron nitride and zirconium oxide.
  • the present invention provides a gap filler comprising the two- component gap filler composition described herein in cured form.
  • the present invention provides a kit for forming a gap filler, the kit comprising: a first component comprising a first polysiloxane and a first aluminium oxide powder; and
  • a second component comprising a second polysiloxane and a second aluminium oxide powder.
  • the present invention provides a method of applying a gap filler to an electronic component, the method comprising: providing an electronic component, providing the two-component gap filler composition as described herein, contacting the first component and the second component to provide a contacted
  • the electronic component preferably comprises a printed circuit board.
  • the electronic component preferably comprises a metal housing and applying the contacted two-component gap filler composition to the electronic component comprises
  • the present invention provides a method of applying a gap filler to an electronic component, the method comprising: providing an electronic component, providing a first component comprising a first polysiloxane and a first aluminium oxide powder, providing a second component comprising a second polysiloxane and a second aluminium oxide powder,
  • the electronic component preferably comprises a printed circuit board.
  • the electronic component preferably comprises a metal housing and applying the contacted first component and second component to the electronic component comprises disposing the contacted first component and second component between the printed circuit board and the housing.
  • the first component and second component are part of the two-component gap filler composition described herein.
  • the present invention provides an electronic component comprising a gap filler formed of the two-component gap filler composition described herein.
  • the electronic component preferably comprises a printed circuit board.
  • the present invention provides an electronic component comprising a gap filler formed of the two-component gap filler composition described herein.
  • the electronic component preferably comprises a printed circuit board.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne une composition de rebouchage bi-composant comprenant : un premier composant comprenant un premier polysiloxane et une première poudre d'oxyde d'aluminium ; et un second composant comprenant un second polysiloxane et une seconde poudre d'oxyde d'aluminium.
PCT/EP2023/025196 2022-04-28 2023-04-28 Composition de rebouchage bi-composant WO2023208421A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2206192.3A GB2618768A (en) 2022-04-28 2022-04-28 Two-component gap filler composition
GB2206192.3 2022-04-28

Publications (1)

Publication Number Publication Date
WO2023208421A1 true WO2023208421A1 (fr) 2023-11-02

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ID=81943788

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2023/025196 WO2023208421A1 (fr) 2022-04-28 2023-04-28 Composition de rebouchage bi-composant

Country Status (3)

Country Link
GB (1) GB2618768A (fr)
TW (1) TW202342620A (fr)
WO (1) WO2023208421A1 (fr)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021494A (en) 1988-10-03 1991-06-04 Toshiba Silicone Co., Ltd Thermal conductive silicone composition
CN107325782A (zh) 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法
CN107964245A (zh) 2017-12-18 2018-04-27 深圳德邦界面材料有限公司 一种点胶式凝胶导热垫片及其制备方法
CN108753246A (zh) 2018-04-04 2018-11-06 苏州达同新材料有限公司 高导热双组份灌封胶
CN109337644A (zh) 2018-09-30 2019-02-15 广州机械科学研究院有限公司 一种加成型室温粘接双组份灌封胶及其制备方法
US20200270499A1 (en) 2017-07-24 2020-08-27 Dow Toray Co., Ltd. Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
WO2021128273A1 (fr) 2019-12-27 2021-07-01 3M Innovative Properties Company Composition de silicone en deux parties, produit d'étanchéité et assemblage fait à partir de ceux-ci
CN113429930A (zh) 2021-07-13 2021-09-24 深圳市新泰盈电子材料有限公司 一种加成型双组分有机硅灌封胶及其制备方法
CN113736266A (zh) 2021-09-27 2021-12-03 广州集泰化工股份有限公司 一种双组份导热凝胶及其制备方法和应用
CN113897066A (zh) 2021-11-17 2022-01-07 浙江商林科技股份有限公司 一种高导热双组分导热凝胶及其制备方法
CN114181656A (zh) 2021-12-24 2022-03-15 江苏明昊新材料科技股份有限公司 双组分低粘度光伏组件用粘接密封硅酮材料及其制备方法
CN114196209A (zh) 2021-12-07 2022-03-18 深圳联腾达科技有限公司 一种可加成固化的双组份高稳定性导热有机硅组合物及其制备方法
CN114395368A (zh) 2022-01-14 2022-04-26 东风汽车集团股份有限公司 一种双组份改性热固硅胶及其制备方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021494A (en) 1988-10-03 1991-06-04 Toshiba Silicone Co., Ltd Thermal conductive silicone composition
CN107325782A (zh) 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法
US20200270499A1 (en) 2017-07-24 2020-08-27 Dow Toray Co., Ltd. Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
CN107964245A (zh) 2017-12-18 2018-04-27 深圳德邦界面材料有限公司 一种点胶式凝胶导热垫片及其制备方法
CN108753246A (zh) 2018-04-04 2018-11-06 苏州达同新材料有限公司 高导热双组份灌封胶
CN109337644A (zh) 2018-09-30 2019-02-15 广州机械科学研究院有限公司 一种加成型室温粘接双组份灌封胶及其制备方法
WO2021128273A1 (fr) 2019-12-27 2021-07-01 3M Innovative Properties Company Composition de silicone en deux parties, produit d'étanchéité et assemblage fait à partir de ceux-ci
CN113429930A (zh) 2021-07-13 2021-09-24 深圳市新泰盈电子材料有限公司 一种加成型双组分有机硅灌封胶及其制备方法
CN113736266A (zh) 2021-09-27 2021-12-03 广州集泰化工股份有限公司 一种双组份导热凝胶及其制备方法和应用
CN113897066A (zh) 2021-11-17 2022-01-07 浙江商林科技股份有限公司 一种高导热双组分导热凝胶及其制备方法
CN114196209A (zh) 2021-12-07 2022-03-18 深圳联腾达科技有限公司 一种可加成固化的双组份高稳定性导热有机硅组合物及其制备方法
CN114181656A (zh) 2021-12-24 2022-03-15 江苏明昊新材料科技股份有限公司 双组分低粘度光伏组件用粘接密封硅酮材料及其制备方法
CN114395368A (zh) 2022-01-14 2022-04-26 东风汽车集团股份有限公司 一种双组份改性热固硅胶及其制备方法

Also Published As

Publication number Publication date
TW202342620A (zh) 2023-11-01
GB2618768A (en) 2023-11-22
GB202206192D0 (en) 2022-06-15

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