WO2023207800A1 - Plateforme de support de substrat pour encapsulation de puce sur film - Google Patents

Plateforme de support de substrat pour encapsulation de puce sur film Download PDF

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Publication number
WO2023207800A1
WO2023207800A1 PCT/CN2023/089835 CN2023089835W WO2023207800A1 WO 2023207800 A1 WO2023207800 A1 WO 2023207800A1 CN 2023089835 W CN2023089835 W CN 2023089835W WO 2023207800 A1 WO2023207800 A1 WO 2023207800A1
Authority
WO
WIPO (PCT)
Prior art keywords
channel
base
thin film
chip packaging
main
Prior art date
Application number
PCT/CN2023/089835
Other languages
English (en)
Chinese (zh)
Inventor
陈秀龙
Original Assignee
颀中科技（苏州）有限公司
合肥颀中科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 颀中科技（苏州）有限公司, 合肥颀中科技股份有限公司 filed Critical 颀中科技（苏州）有限公司
Publication of WO2023207800A1 publication Critical patent/WO2023207800A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Definitions

  • the invention relates to the technical field of thin film flip-chip packaging, and in particular to a substrate bearing platform for thin film flip-chip packaging.
  • LCD displays With the improvement of semiconductor technology, LCD displays have the advantages of low power consumption, thinness and lightness, high resolution, high color saturation, and long life. Therefore, they are widely used in mobile phones, notebook computers, or desktop computers. LCD screens, LCD TVs and other electronic products that are closely related to life.
  • the display driver IC is an indispensable and important component of the LCD display.
  • driver chips of liquid crystal display devices generally use tape automatic bonding (TAB) packaging technology for chip packaging, and chip-on-film (COF) packaging structure is one of them. Packaging structure using automatic tape and reel splicing technology.
  • TAB tape automatic bonding
  • COF chip-on-film
  • the chip packaging process of Chip-On-Film (COF) packaging structure is as follows: after completing the circuit on the flexible substrate and the bump process on the chip, the inner pins are processed by thermal compression. Bonding (ILB, inner lead bonding) creates a eutectic bond between the bumps on the chip and the inner pins on the flexible substrate to electrically connect them. Next, encapsulation resin is used to seal the circuits of the inner pins on the chip and the flexible substrate. After electrical testing, outer lead bonding (OLB, outerlead bonding) is performed. The outer pins are formed by extending outward from the inner pins on the flexible substrate. The outer pins are also thermally bonded to electrically connect the flexible substrate to a circuit substrate or other components.
  • ILB inner lead bonding
  • OLB outer lead bonding
  • a thermal head is generally used to adsorb the chip, and the chip is adsorbed to the top of the bearing platform of the flexible substrate and electrically connected to the flexible substrate adsorbed on the bearing platform.
  • the bumps on the chip with the pins on the flexible substrate in order to ensure that both The strength of the combination will have certain requirements on the flatness of the top surface of the bearing platform that absorbs and supports the flexible substrate.
  • the temperature of the thermal head is relatively high, and the heat on the hot head is easily conducted to the bearing platform, which in turn affects the bearing platform, causing the bearing platform to bend and deform, thereby causing the bearing platform to bend and deform.
  • the reduction of upper surface flatness affects product quality.
  • the object of the present invention is to provide a substrate carrying platform for thin film flip-chip packaging to solve the deficiencies in the prior art. It can minimize the impact of the coolant on the base flowing through it when it is transported in the delivery needle tube. The cooling capacity of the coolant is concentrated and released in the cooling channel, which can achieve a more uniform and effective cooling of the base.
  • the substrate carrying platform for thin film flip-chip packaging includes:
  • a base having a cooling channel and a connecting channel connected to the cooling channel;
  • Coolant transfer mechanism including:
  • a delivery needle is disposed in the connection channel, and the size of the delivery needle is smaller than the size of the connection channel to form a gap between the delivery needle and the connection channel;
  • the main conveying member is connected with the conveying needle tube;
  • a blocking member is used to block the gap.
  • the base has a length direction and a width direction
  • the cooling channel has a main channel extending along the length direction and an outlet hole connecting the main channel; the connecting channel extends along the width direction and Connected to the main channel.
  • the connecting channel is arranged between the two outlet holes and located in the middle of the two outlet holes.
  • connection channel has a connection outlet provided on the side wall of the main channel, and the connection outlet is provided on the side wall of the main channel and close to the bottom.
  • the delivery needle tube has a free end extending in the cooling channel and a fixed end opposite to the free end; the fixed end is connected to the main delivery member.
  • the free end of the delivery needle is extended to the center position of the cooling channel in the width direction.
  • the base also has a blind hole connected to the main channel, the blind hole is opposite to the connection channel, and the blind hole and the connection channel are arranged on the main channel. Opposite sides of the channel.
  • the volume of the blind hole is consistent with the volume of the gap.
  • connecting channels there are multiple connecting channels, the plurality of connecting channels are arranged side by side along the length direction, and the delivery needle is arranged in each connecting channel.
  • the blocking member is arranged outside the base and has a mounting hole that matches the delivery needle, the main delivery member is connected to the mounting hole, and the blocking member resists
  • a sealing portion is tightly attached to the side wall of the base and opposite to the gap portion, and the sealing portion is provided at the edge of the mounting hole.
  • the coolant is transported into the cooling channel through the transport needle, and a gap is formed between the transport needle and the side wall of the connecting channel. Due to the existence of the gap, a gap is actually formed.
  • the thermal layer can minimize the impact on the area of the base where the coolant flows when it is transferred in the delivery needle tube, so that the coolant's cold energy is concentrated and released in the cooling channel, which can achieve a more uniform and effective cooling of the base. This prevents the coolant from cooling the base area it flows through before flowing into the cooling channel, causing the temperature of the coolant flow area to be low, resulting in uneven cooling of the base and affecting the flatness of the upper surface of the base.
  • Figure 1 is a schematic structural diagram of a substrate bearing platform for thin film flip-chip packaging disclosed in an embodiment of the present invention
  • Figure 2 is a top view of Figure 1;
  • Figure 3 is a cross-sectional view along the AA direction in Figure 2;
  • Figure 4 is a front view of Figure 1;
  • Figure 5 is a cross-sectional view along the BB direction in Figure 4.
  • Figure 6 is a cross-sectional view along the CC direction in Figure 4.
  • Figure 7 is a cross-sectional view along the DD direction in Figure 4.
  • Figure 8 is a schematic structural diagram of a coolant transmission mechanism in a substrate carrying platform for thin film flip-chip packaging disclosed in an embodiment of the present invention
  • Figure 9 is a top view of Figure 8.
  • Figure 10 is a schematic diagram of the installation structure of the delivery needle tube and the sealing member in the substrate carrying platform for thin film flip-chip packaging disclosed in the embodiment of the present invention
  • Figure 11 is a schematic diagram of the first installation structure of the delivery needle tube on the base in the substrate carrying platform for thin film flip-chip packaging disclosed in the embodiment of the present invention
  • Figure 12 is a schematic diagram of the second installation structure of the transport needle tube on the base in the substrate carrying platform for thin film flip-chip packaging disclosed in the embodiment of the present invention
  • Figure 13 is a schematic structural diagram of the main transport member in the substrate carrying platform for thin film flip-chip packaging disclosed in the embodiment of the present invention.
  • 2-coolant transmission mechanism 21-transmission needle, 211-free end, 212-fixed end, 22-main transmission part, 220-buffer tank, 221-body part, 222-connecting pipe,
  • Embodiments of the present invention Disclosed is a substrate carrying platform for film flip-chip packaging, which absorbs and positions the flexible substrate during film flip-chip packaging and is combined with the chip adsorbed by the pressure head.
  • the indenter moves the chip to the upper side of the carrier platform, aligns the bumps on the chip with the pin positions on the flexible substrate, and connects the two using thermal compression to achieve electrical connection between the chip and the substrate.
  • the heat on the hot stamping head is relatively high.
  • the higher heat can easily affect the bearing platform, causing it to bend and deform, ultimately resulting in a reduction in the flatness of the surface of the bearing platform. , affecting product quality.
  • the substrate carrying platform for film flip-chip packaging disclosed in this embodiment is equipped with a coolant transmission mechanism 2.
  • the coolant transmission mechanism 2 can quickly cool down the substrate carrying platform, thereby effectively preventing the substrate carrying platform from being overheated. of deformation.
  • the substrate carrying platform for thin film flip-chip packaging includes: a base 1 and a coolant transmission mechanism 2; the base 1 has a cooling channel 11 and is connected to the cooling channel 11
  • the connecting channel 12 communicates with the cooling channel 11 .
  • Coolant such as cooling water or cooling air, flows from the outside into the cooling channel 11 through the coolant transmission mechanism 2, and in the process of flowing through the cooling channel 11, the base 1 is cooled.
  • the coolant transfer mechanism 2 includes a transfer needle 21, a main transfer member 22 and a blocking member 23;
  • the delivery needle 21 is disposed in the connection channel 12, and the size of the delivery needle 21 is smaller than the size of the connection channel 12 to form a gap 13 between the delivery needle 21 and the connection channel 12;
  • the main conveying member 22 is connected with the conveying needle 21, and the coolant is conveyed to the conveying needle 21 through the main conveying member 22, and is conveyed to the cooling channel 11 under the action of the conveying needle 21;
  • the blocking member 23 is used to block the gap portion 13 to prevent the gap portion 13 from communicating with the outside world, thereby preventing the coolant from leaking out from the gap portion 13 and allowing the coolant to enter the cooling channel 11 through the delivery needle tube 21 The coolant only flows along the cooling channel 11 to achieve cooling of the base 1 .
  • the coolant is transported into the cooling channel 11 through the transport needle 21, and a gap 13 is formed between the transport needle 21 and the side wall of the connecting channel 12. Due to the existence of the gap 13, the gap 13 is actually A kind of heat insulation layer is formed on the top, so that when the coolant is transported in the delivery needle tube 21, the impact on the area of the base 1 flowing through can be reduced as much as possible, so that the cold energy of the coolant is concentrated and released in the cooling channel 11, which can be realized Cool the base 1 more evenly and effectively.
  • the delivery needle 21 is used to transport the coolant.
  • the diameter of the delivery needle 21 is relatively small, and the flow rate of the coolant in the delivery needle 21 is high. The higher flow rate will also reduce the heat exchange with the base 1 flowing through the area. exchange to achieve better coolant transfer.
  • the base 1 has a length direction and a width direction, and the length direction is perpendicular to the width direction.
  • the cooling channel 11 has a main channel 111 extending along the length direction and an outlet connecting the main channel 111. Hole 112; the connecting channel 12 extends along the width direction and communicates with the main channel 111.
  • the coolant is delivered from the delivery needle 21 into the main channel 111 and flows through the main channel 111 flows out through the outlet hole 112.
  • the main channel 111 is set at the center of the base 1.
  • the upper surface of the base 1 corresponding to the main channel 111 is the area where the indenter acts on the base 1, that is, the main area where the thermal indenter affects the temperature of the base 1.
  • concentrating the temperature of the coolant in the main channel 111 can avoid affecting other areas of the base 1 .
  • two outlet holes 112 are provided, and the two outlet holes 112 are provided in the main channel 111 .
  • the connecting channel 12 is provided between the two outlet holes 112 and is located at the middle position of the two outlet holes 112, so that the coolant can flow out to both sides along an equal distance after entering the main channel 111.
  • the holes 112 flow, thereby making the cooling effect of the coolant more uniform.
  • the coolant will enter from the inlet and flow out from the outlet hole 112 on one side, and the flow path will be longer. The longer stroke will cause the cooling capacity to decrease as the cooling capacity flows backward, thus Not conducive to uniform cooling.
  • connection channels 12 there are multiple connecting channels 12, and the multiple connecting channels 12 are arranged along the length direction and arranged side by side, and the multiple connecting channels 12 are parallel to each other.
  • the cross-section of the delivery needle 21 is circular, and the cross-section of the connecting channel 12 is also circular.
  • the delivery needle 21 and the connecting channel 12 are concentrically arranged, and the main delivery member 22 is connected to multiple delivery needles 21 at the same time. .
  • connection outlet 121 is provided on the side wall of the main channel 11 and close to the bottom.
  • the main channel 11 extends along the length direction, the axial direction of the main channel 11 also extends along the length direction.
  • the main channel 11 has a top and a bottom that are oppositely arranged in the vertical direction, and two oppositely arranged ones in the width direction. side walls.
  • the connecting channel 12 runs through the side wall of the main channel 11 and is located near the bottom, so that the connecting channel 12 can be kept as far away from the upper surface of the base 1 as possible, thereby minimizing the flow through the connecting channel. 12 Effect of coolant on the temperature of the upper surface of base 1.
  • the height of the horizontal plane where the connecting channel 12 is located is lower than the height of the horizontal plane where the main channel 11 is located.
  • the horizontal plane where the connecting channel 12 is located here refers to the horizontal plane where the axis of the connecting channel 12 is located.
  • the horizontal plane where the main channel 11 is located is also the horizontal plane where the axis of the main channel is located.
  • the height of the horizontal plane where the delivery needle tube 21 is located is slightly lower than the height of the horizontal surface where the main channel 11 is located.
  • the purpose of setting up the above embodiments is to require the connecting channel 12 to deviate from the center position of the main channel 11 in the through direction, and to deviate downward from the center position of the main channel 11 in the vertical direction, so as to be as far away from the upper surface of the base 1 as possible , to reduce the impact on the upper surface of base 1.
  • the delivery needle 21 has a free end 211 extending inside the cooling channel 11 and a fixed end 212 extending outward outside the connecting channel 12;
  • the fixed end 212 is connected with the main conveying member 22 .
  • the delivery needle 21 is directly extended and disposed in the cooling channel 11 , which allows the coolant to directly enter the cooling channel 11 and better releases the coolant in the cooling channel 11 .
  • the free end 211 of the delivery needle 21 is extended to the center position of the cooling channel 11 in the width direction. .
  • the arrangement of this structure allows the coolant to enter exactly the center of the cooling channel 11 after flowing into the cooling channel 11 , so that the coolant flows more uniformly in the cooling channel 11 .
  • the gap portion 13 due to the blocking of the gap portion 13 by the blocking member 23 , one end of the gap portion 13 away from the blocking member 23 is exposed to the cooling channel 11 . Since the gap portion 13 is exposed to the cooling channel, the gap portion 13 actually forms a blind hole open to the cooling channel 11. The existence of the blind hole will affect the temperature unevenness on opposite sides of the cooling channel 11 on the base.
  • the base 1 also has a blind hole 14 connected with the main channel 111, and the blind hole 14 is connected to the main channel 111.
  • the connecting channels 12 are positioned opposite to each other, and the blind hole 14 and the connecting channel 12 are arranged on opposite sides of the main channel 111 .
  • the volume of the blind hole 14 is consistent with the volume of the gap 13 . Setting the volume of the blind hole 14 to be consistent with that of the gap portion 13 can make the volumes of coolant accumulated in the two to be the same, thereby better balancing the influence of the accumulated coolant on the temperature of the base 1 .
  • the blocking member 23 can be disposed in the gap portion 13.
  • the blocking member 23 is arranged in an annular shape.
  • the blocking member 23 is only disposed close to the edge in the gap portion 13 to ensure that the gap portion 13 is between the delivery needle tube 21 and the base 1.
  • Form a thermal insulation layer In this embodiment, the blocking member 23 is arranged in the gap Outside the gap portion 13 , the blocking member 23 covers the outwardly exposed opening of the gap portion 13 to block the gap portion 13 .
  • the blocking member 23 is provided outside the base 1 and has a mounting hole 231 adapted to the delivery needle 21.
  • the main delivery member 22 is connected to the The mounting holes 231 are connected, and the blocking member 23 is pressed against the side wall of the base 1 and has a sealing portion opposite to the gap portion 13 .
  • the sealing portion is disposed on the mounting hole 231 .
  • the edge and sealing part are arranged in an annular shape.
  • the corresponding blocking member 23 is also provided with multiple mounting holes 231 , and the delivery needles 21 are positioned in the mounting holes 231 .
  • the blocking member 23 It is pressed and fixed on the base 1 by the main conveying member 22 .
  • the main transport member 22 includes a body part 221 with a buffer tank 220 and is disposed on the body part 221 and communicates with the buffer tank 220.
  • the connecting pipe 222, the buffer groove 220 extends along the length direction and is connected with a plurality of the delivery needle tubes 21 at the same time; the buffer groove 220 is set toward the blocking member 23 and is opposite to the blocking member 23, blocking The member 23 covers and seals the opening of the buffer tank 220 .
  • the coolant After the coolant enters the buffer tank 220 from the connecting pipe 222 and is buffered in the buffer tank 220 , the coolant can enter the different delivery needle tubes 21 more evenly to be transferred to the cooling channel 11 .
  • the connecting pipe 222 has a connection outlet provided at the bottom of the buffer tank 220 , and the connection outlet is provided at the center of the buffer tank 220 . Arranging the connecting outlet of the connecting pipe 222 at the center of the buffer tank 220 allows the coolant to flow in from the center of the buffer tank 220. After flowing in, the buffer tank 220 can be affected more evenly.
  • the body part 221 is fixed on the base 1, the size of the blocking member 23 matches the size of the body part 221, and the body part 221 is fixed to the base through bolt connection. 1, and the body portion 221 presses the blocking member 23 onto the base 1 .
  • the blocking member 23 described in the embodiment is a heat insulating material, and the blocking member 23 has poor thermal conductivity.
  • the blocking member 23 may be a rubber part or a plastic part.
  • the blocking member 23 is made of heat-insulating material, which can effectively reduce the temperature difference between the two sides of the base 1 caused by the main conveying member 22 being disposed laterally on the base 1 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Package Closures (AREA)
  • Mounting Of Bearings Or Others (AREA)

Abstract

La présente invention concerne une plateforme de support de substrat pour une encapsulation de puce sur film. La plateforme de support de substrat comprend une base et un mécanisme de transport de liquide de refroidissement. La base est pourvue d'un canal de refroidissement et d'un canal de raccordement. Le mécanisme de transport de liquide de refroidissement comprend : un tube d'aiguille de transport, disposé dans le canal de raccordement, la taille du tube d'aiguille de transport étant inférieure à celle du canal de raccordement, de manière à former un espace entre le tube d'aiguille de transport et le canal de raccordement ; un élément de transport principal ; et un élément d'obturation. Dans les modes de réalisation, une couche d'isolation thermique est formée entre le tube d'aiguille de transport et une paroi latérale du canal de raccordement, de telle sorte que la base peut être refroidie de manière plus uniforme et efficace.
PCT/CN2023/089835 2022-04-27 2023-04-21 Plateforme de support de substrat pour encapsulation de puce sur film WO2023207800A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210458343.7A CN114783939A (zh) 2022-04-27 2022-04-27 一种用于薄膜覆晶封装的基板承载台
CN202210458343.7 2022-04-27

Publications (1)

Publication Number Publication Date
WO2023207800A1 true WO2023207800A1 (fr) 2023-11-02

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Application Number Title Priority Date Filing Date
PCT/CN2023/089835 WO2023207800A1 (fr) 2022-04-27 2023-04-21 Plateforme de support de substrat pour encapsulation de puce sur film

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WO (1) WO2023207800A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114783939A (zh) * 2022-04-27 2022-07-22 颀中科技（苏州）有限公司 一种用于薄膜覆晶封装的基板承载台

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1016544A (ja) * 1996-07-03 1998-01-20 Mitsubishi Heavy Ind Ltd 車両用空調装置
JPH10162992A (ja) * 1996-10-02 1998-06-19 Tokyo Electron Ltd プラズマ処理装置
CN1543272A (zh) * 2003-04-30 2004-11-03 ��ʽ���絺���������� 沉积用于有机电致发光的保护薄膜的设备和方法
CN215245967U (zh) * 2021-06-30 2021-12-21 武汉市海泰伟创科技有限公司 一种薄膜冷却装置
CN114783939A (zh) * 2022-04-27 2022-07-22 颀中科技（苏州）有限公司 一种用于薄膜覆晶封装的基板承载台
CN217234893U (zh) * 2022-04-27 2022-08-19 颀中科技（苏州）有限公司 用于薄膜覆晶封装的基板承载台

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1016544A (ja) * 1996-07-03 1998-01-20 Mitsubishi Heavy Ind Ltd 車両用空調装置
JPH10162992A (ja) * 1996-10-02 1998-06-19 Tokyo Electron Ltd プラズマ処理装置
CN1543272A (zh) * 2003-04-30 2004-11-03 ��ʽ���絺���������� 沉积用于有机电致发光的保护薄膜的设备和方法
CN215245967U (zh) * 2021-06-30 2021-12-21 武汉市海泰伟创科技有限公司 一种薄膜冷却装置
CN114783939A (zh) * 2022-04-27 2022-07-22 颀中科技（苏州）有限公司 一种用于薄膜覆晶封装的基板承载台
CN217234893U (zh) * 2022-04-27 2022-08-19 颀中科技（苏州）有限公司 用于薄膜覆晶封装的基板承载台

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