WO2023202719A1 - 驱动组件、摄像模组及多摄摄像模组 - Google Patents

驱动组件、摄像模组及多摄摄像模组 Download PDF

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Publication number
WO2023202719A1
WO2023202719A1 PCT/CN2023/090068 CN2023090068W WO2023202719A1 WO 2023202719 A1 WO2023202719 A1 WO 2023202719A1 CN 2023090068 W CN2023090068 W CN 2023090068W WO 2023202719 A1 WO2023202719 A1 WO 2023202719A1
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WO
WIPO (PCT)
Prior art keywords
chip
coil
component
shake
driving
Prior art date
Application number
PCT/CN2023/090068
Other languages
English (en)
French (fr)
Inventor
赵波杰
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202210427440.XA external-priority patent/CN116996768A/zh
Priority claimed from CN202210428489.7A external-priority patent/CN116996769A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2023202719A1 publication Critical patent/WO2023202719A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Definitions

  • the present application relates to the field of camera modules, and in particular, to a driving component, a camera module and a multi-camera module.
  • mobile electronic devices When using mobile electronic devices for photography, due to the physiological tremor of a certain frequency of the human body under normal circumstances and the jitter caused by movement, the camera effect will be reduced. Therefore, mobile electronic devices are usually equipped with anti-shake motors to drive optical lenses. And/or the movement of the photosensitive chip realizes the anti-shake function.
  • the heavier the lens the shorter the stroke that the anti-shake motor can drive the optical lens to move, affecting the anti-shake capability.
  • the heavier the optical lens the slower the anti-shake motor can drive the optical lens to move, and the longer it takes for the optical lens to reach the predetermined compensation position, which will also affect the anti-shake effect.
  • the applicant proposes a driving component that drives the photosensitive chip to move to achieve the purpose of optical anti-shake.
  • An advantage of this application is to provide a driving component, a camera module and a multi-camera camera module, wherein the driving component can realize optical anti-shake by driving the photosensitive chip to move, so as to meet the requirements of optical anti-shake on the driving stroke and drive speed requirements, and the camera module passes the drive assembly and the positional relationship of the photosensitive component is reasonably designed to meet its application requirements in mobile electronic devices.
  • An advantage of this application is to provide a driving component, a camera module and a multi-camera camera module, wherein the driving component can realize optical anti-shake by driving the photosensitive chip to move, so as to meet the requirements of optical anti-shake on the driving stroke and The requirements of the driving speed, and the camera module enables different magnetic elements to play different roles by rationally arranging the magnetic elements in the driving assembly.
  • Another advantage of the present application is to provide a driving component, a camera module and a multi-camera module, wherein the photosensitive component of the camera module is arranged eccentrically relative to the center of the driving component, so that the photosensitive component One side of the photosensitive chip is closer to the edge of the mobile electronic device to meet the shape and functional requirements of the mobile electronic device, for example, making the screen opening of the mobile electronic device corresponding to the camera module closer to the edge of the mobile electronic device, This in turn makes the screen of the mobile electronic device more complete.
  • the present application provides a driving assembly, which includes:
  • the chip anti-shake movable part is movably received in the receiving cavity, the chip anti-shake movable part includes a chip movable carrier, the chip movable carrier is suitable for mounting a photosensitive component thereon, the The photosensitive component has a first central axis; and
  • a chip driving element used to drive the chip movable carrier of the chip anti-shake movable part to move in the receiving cavity relative to the chip fixed part;
  • the driving assembly has a second central axis, and the first central axis is offset from the second central axis.
  • the photosensitive component includes a photosensitive chip, and the central axis of the photosensitive chip is the first central axis of the photosensitive component.
  • the photosensitive assembly includes a photosensitive chip, and the photosensitive chip is arranged eccentrically with respect to the center of the driving assembly.
  • the photosensitive assembly is adapted to be installed on the chip movable carrier, wherein the chip anti-shake fixing part includes an upper cover and a base that interlock with each other to form the receiving cavity, There is a gap between the chip movable carrier and the base.
  • the driving assembly further includes a chip holding assembly, and the chip holding assembly includes at least one chip magnetic element wrapped in the chip movable carrier, wherein the chip driving The component includes a chip coil assembly disposed on the chip movable carrier, and a chip magnet assembly fixed to the upper cover and corresponding to the chip coil assembly, so that the chip magnet assembly and the at least one The magnetic attraction between the chip magnetic components causes the chip movable carrier to be suspended in the receiving cavity of the chip anti-shake fixing part.
  • the chip coil assembly includes at least one chip coil
  • the driving assembly further includes a chip anti-shake conductive part
  • the chip anti-shake conductive part includes a chip covered with the chip anti-shake
  • At least one coil conductive element in the moving carrier each of the coil conductive elements having an exposed first coil conductive end, and an exposed second coil conductive end opposite to the first coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end, wherein at least one chip coil is electrically connected to the first coil conductive end, and the third coil conductive end
  • the conductive ends of the two coils are suitable for electrically connecting to the circuit board of the photosensitive component.
  • the chip coil assembly further includes a coil circuit board disposed on the chip movable carrier, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the The coil circuit board is electrically connected to the conductive end of the first coil.
  • the chip holding assembly further includes a chip supporting assembly disposed between the chip movable carrier and the upper cover.
  • the chip supporting assembly includes a chip recessedly formed on the chip. The ball groove of the movable carrier and the balls disposed in the ball groove, wherein the balls are clamped by the magnetic attraction force between the at least one chip magnetic element and the chip magnet assembly. between the upper cover and the chip movable carrier.
  • the chip support assembly further includes a ball support piece embedded in the chip movable carrier and located at the bottom of the ball groove, and the ball is supported on the ball support piece .
  • the coil conductive element and the ball support piece do not have magnetic permeability, and the chip magnetic element has magnetic permeability.
  • the coil conductive element, the ball support piece and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.
  • the chip driving element includes a chip coil assembly disposed on the chip movable carrier, and a chip magnet assembly fixed to the upper cover and corresponding to the chip coil assembly , wherein the chip coil assembly includes at least one chip coil group, so At least one side of the chip movable carrier is not provided with the chip coil group.
  • the chip movable carrier includes a first side, a second side, a third side and a fourth side that surround each other, and the first side is opposite to the third side, so The second side and the fourth side are opposite, wherein the chip coil assembly includes a first chip coil group arranged on the first side, and is arranged on the opposite second side and the third side. The second chip coil set and the third chip coil set on the four sides.
  • the distance between the first central axis of the photosensitive chip and the third side of the movable chip carrier is smaller than the distance between the first central axis of the photosensitive chip and the movable chip carrier. The distance between the first sides of .
  • the first side and the third side extend along the X-axis direction set by the driving assembly
  • the second side and the fourth side extend along the X-axis direction set by the driving assembly.
  • the set Y-axis direction extends, and the Y-axis direction is perpendicular to the X-axis direction
  • the first chip coil group includes a first chip coil and a second chip coil arranged on the first side
  • the second chip coil group includes a third chip coil disposed on the second side
  • the third chip coil group includes a fourth chip coil disposed on the fourth side.
  • the first chip coil and the second chip coil are arranged relatively parallel along the X-axis direction, and the third chip coil and the fourth chip coil are arranged along the Y-axis direction.
  • the axis directions are relatively parallel.
  • the present application provides a driving assembly, which includes:
  • the chip anti-shake movable part is movably received in the receiving cavity, and the chip anti-shake movable part is suitable for mounting a photosensitive component thereon;
  • a chip driving element used to drive the chip anti-shake movable part to move in the receiving cavity relative to the chip fixed part
  • a chip support component including at least three support components clamped between the chip anti-shake movable part and the chip anti-shake fixed part, the at least three support components being arranged in a non-complete collinear manner; as well as
  • a chip magnetic attraction component including a first chip magnetic attraction element and a second chip magnetic attraction element disposed on the chip anti-shake movable part, wherein the first chip magnetic attraction element is adjacent to the at least three support components In the first support component, the distance between the second chip magnetic component and any one of the at least three support components is greater than the distance between the first chip magnetic component and the first support component. distance between.
  • the chip anti-shake movable part includes a chip movable carrier, and the photosensitive component is adapted to be installed on the chip movable carrier.
  • the chip movable carrier includes a first side, a second side, a third side and a fourth side that surround each other, and the first side is opposite to the third side, so The second side and the fourth side are opposite, wherein the chip support component includes a first support component, a second support component and a third support component, and the first support component is disposed on the chip movable carrier the first side, the second support component and the third support component are disposed at two corner areas of the third side of the chip movable carrier opposite to the first side, the first support component The component is arranged in the middle area of the first side.
  • the chip magnetic assembly includes a pair of the first chip magnetic elements, and the pair of the first chip magnetic elements is disposed on two opposite sides of the first support assembly. side, wherein the chip magnetic assembly includes a pair of second chip magnetic elements, one of the second chip magnetic elements is disposed in the middle area of the second side, and the other second chip magnetic element The magnetic element is disposed in the middle area of the fourth side.
  • the size of the first chip magnetic element is larger than the size of the second chip magnetic element.
  • the chip magnetic assembly also includes a pair of third chip magnetic elements, one of the third chip magnetic elements is adjacent to the second support assembly, and the other third The magnetic element is adjacent to the third support component.
  • a pair of the first chip magnetic components, a pair of the second chip magnetic components and a pair of the third chip magnetic components are covered with the movable chip. carrier.
  • each of the first support assembly, the second support assembly and the third support assembly includes a ball groove recessedly formed in the chip movable carrier. and a ball disposed in the ball groove, the ball protruding from the ball groove.
  • the movable chip carrier further includes three extension posts protrudingly formed on the upper surface of the chip carrier body, and the ball groove is recessedly formed on the upper surface of each of the extension posts. surface.
  • each of the support components further includes a ball support piece embedded in the chip movable carrier and located at the bottom of the ball groove, and the ball is supported on the ball support. piece.
  • the chip driving element includes a chip coil assembly disposed on the chip movable carrier, and a chip coil assembly fixed on the chip anti-shake fixing part and corresponding to the chip coil assembly.
  • a chip magnet assembly wherein the chip magnet assembly includes a pair of first chip magnets respectively corresponding to a pair of the first chip magnetic elements and a pair of second chip magnets respectively corresponding to a pair of the second chip magnetic elements. Two chip magnet.
  • the chip coil assembly includes at least one chip coil group, and the chip coil group is not provided on at least one side of the chip movable carrier, wherein the chip coil assembly includes a chip coil group provided on the A first chip coil group on the first side, and a second chip coil group and a third chip coil group arranged on the opposite second side and the fourth side.
  • the driving assembly further includes a chip anti-shake conductive part, and the chip anti-shake conductive part includes at least one coil conductive element wrapped in the chip anti-shake movable carrier, each One of the coil conductive elements has an exposed first coil conductive end, an exposed second coil conductive end opposite to the first coil conductive end, and extending from the first coil conductive end. a conductive extension of the coil between the conductive end of the coil and the conductive end of the second coil, wherein at least one chip coil is electrically connected to the conductive end of the first coil, and the conductive end of the second coil is adapted to be electrically connected to the conductive end of the coil. Circuit board for photosensitive components.
  • the chip coil assembly further includes a coil circuit board disposed on the chip movable carrier, the first chip coil group, the second chip coil group and the third
  • the chip coil group is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the conductive end of the first coil.
  • the coil conductive element and the ball support piece do not have magnetic permeability, and the chip magnetic element has magnetic permeability.
  • the coil conductive element, the ball support piece and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.
  • the present application also provides a camera module, which includes: the driving component as described above.
  • this application also provides a multi-camera module, which includes:
  • At least one of the first camera module and the second camera module includes the driving component as described above.
  • the first side of the driving assembly of the first camera module is not provided with a chip driver element, and the second side of the driving assembly of the second camera module is not provided with a chip driver.
  • Component wherein the first side of the driving assembly of the first camera module is adjacent to the second side of the driving assembly of the second camera module.
  • FIG. 1A illustrates an application diagram of a single-camera camera module according to an embodiment of the present application.
  • FIG. 1B illustrates an application diagram of a multi-camera module according to an embodiment of the present application.
  • Figure 2 illustrates a schematic structural diagram of a camera module according to an embodiment of the present application.
  • Figure 3 illustrates a partial structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 4 illustrates a partial exploded view of a camera module according to an embodiment of the present application.
  • FIG. 5 illustrates another partial structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 6 illustrates a partial structural diagram of a driving component of a camera module according to an embodiment of the present application.
  • FIG. 7 illustrates another partial structural diagram of a driving component of a camera module according to an embodiment of the present application.
  • FIG. 8 illustrates another partial exploded view of a camera module according to an embodiment of the present application.
  • FIG. 9 illustrates another partial structural schematic diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 10 illustrates another partial schematic diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 11 illustrates a partially disassembled schematic diagram of the driving assembly of the camera module according to an embodiment of the present application.
  • Figure 12 illustrates another partial structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 13A illustrates another partial structural diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 13B illustrates another partial structural diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 14A illustrates a schematic diagram of the structural stress analysis of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 14B illustrates another structural stress analysis diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 14C illustrates another structural stress analysis diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 15 illustrates a partial structural diagram of a driving component of a multi-camera module according to an embodiment of the present application.
  • Figure 16 illustrates a schematic structural diagram of a multi-camera module according to an embodiment of the present application.
  • Figure 17 illustrates a partial exploded view of a camera module according to an embodiment of the present application.
  • Figure 18 illustrates another partial structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 19 illustrates another partial exploded view of a camera module according to an embodiment of the present application.
  • FIG. 20 illustrates another partial structural diagram of a driving component of a camera module according to an embodiment of the present application.
  • FIG. 21 illustrates a partially disassembled schematic diagram of the driving assembly of the camera module according to an embodiment of the present application.
  • Figure 22 illustrates another partial structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 23 illustrates another partial structural diagram of the driving component of the camera module according to an embodiment of the present application.
  • Figure 24 illustrates a schematic diagram of the structural stress analysis of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 25 illustrates another structural stress analysis diagram of the driving component of the camera module according to an embodiment of the present application.
  • Figure 26 illustrates another structural stress of the driving assembly of the camera module according to the embodiment of the present application. Analysis diagram.
  • FIG. 27 illustrates a partial structural diagram of a driving component of a multi-camera module according to an embodiment of the present application.
  • this application provides a mobile electronic device equipped with at least one camera module 1 and a camera module 1 that can be applied to mobile electronic devices.
  • the camera module 1 has optical focusing. and/or optical anti-shake function, so that the camera module 1 can capture clearer images.
  • the number and specific installation locations of the camera modules 1 are not limited by this application.
  • the mobile electronic device is equipped with one camera module 1.
  • the mobile electronic device is equipped with multiple (two or more) camera modules 1 .
  • the camera module 1 can be disposed on the front of the mobile electronic device as the front camera module 1 of the mobile electronic device, or can be disposed on the back of the mobile electronic device as the front camera of the mobile electronic device. Rear camera module 1.
  • the optical lens 10 and the photosensitive chip 42 of the camera module 1 are in the camera module. 1 is arranged eccentrically in 1 so that the camera module 1 is in an eccentric state. This arrangement makes the optical lens 10 and photosensitive chip 42 of the camera module 1 closer to one side of the mobile electronic device, and thus the movement The screen opening of the electronic device is closer to one side of the mobile electronic device, such as the top side, the left side, or the right side.
  • the two optical lenses 10 and two photosensitive chips of the two camera modules 1 42 is arranged eccentrically in the dual camera module so that the two optical lenses 10 of the dual camera module are as close as possible to enhance the optical function.
  • the two camera modules 1 may have the same structure or may have different structures, which is not limited in this application.
  • this application provides a camera module with an eccentric optical lens 10 and photosensitive chip 42 1.
  • a driving motor to drive the optical lens 10 and/or the photosensitive chip 42 to move, on the one hand, it can meet the structural design requirements of mobile electronic devices, on the other hand, it can achieve the enhancement of optical performance, and realize the camera module 1 optical focus and/or optical image stabilization.
  • the camera module 1 proposed in this application will be described in detail with reference to the accompanying drawings.
  • the camera module 1 includes a photosensitive component 40, an optical lens 10 held on the photosensitive path of the photosensitive component 40, and a A driving component that drives the optical lens 10 and/or the photosensitive component 40 to move to achieve optical performance adjustment, such as optical anti-shake, optical focusing, etc.
  • the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11 .
  • the lens group 12 includes at least one optical lens.
  • the number of the at least one optical lens may be one or Multiple, not limited.
  • the driving component includes a chip driving motor 30 , and the chip driving motor 30 is suitable for driving the photosensitive component 40 to translate and/or rotate, thereby realizing the chip anti-shake function of the camera module 1 .
  • the chip drive motor 30 includes a chip anti-shake fixed part 31, a chip anti-shake movable part 33, a chip drive element 32 and a chip drive conductive part (ie, chip anti-shake conductive part 35).
  • the chip anti-shake fixed part 31 A receiving cavity is provided to accommodate the chip anti-shake movable part 33 , the chip driving element 32 and the chip anti-shake conductive part 35 .
  • the chip anti-shake conductive part 35 provides current to the chip driving element 32 , and the chip driving element 32 is used to drive the chip anti-shake movable part 33 to move relative to the chip anti-shake fixed part 31 .
  • the photosensitive component 40 is fixed to the chip anti-shake movable part 33 , so that the chip driving element 32 drives the photosensitive component 40 to move relative to the chip anti-shake fixed part 31 .
  • the driving assembly also includes a lens driving motor 20 , which is suitable for driving the optical lens 10 to translate and/or rotate, thereby realizing functions such as lens focusing and lens anti-shake of the camera module 1 .
  • the lens driving motor 20 includes a lens driving fixed part, a lens driving movable part, a lens driving element and a lens driving conductive part.
  • the lens driving fixed part has a receiving cavity to accommodate the lens driving movable part, the lens.
  • the lens driving conductive part provides driving power for the lens driving element.
  • the lens driving element is used to drive the lens driving movable part to move relative to the lens driving fixed part.
  • the optical lens 10 is fixed to the lens driving movable part, so that the lens driving element drives the optical lens 10 Driving the fixed part to move relative to the lens, for example, driving the optical lens 10 to move along its optical axis to achieve the lens focusing function; or driving the optical lens 10 to translate in a direction perpendicular to its optical axis or driving the optical lens 10 Rotate around the direction perpendicular to its optical axis to achieve lens anti-shake function.
  • the lens driving motor 20 fixes the lens driving fixing part to the chip anti-shake fixing part 31 of the chip driving motor 30 , so that the optical lens 10 is disposed on the photosensitive path of the photosensitive component 40 .
  • the camera module 1 is not provided with a lens drive motor 20, and the optical lens 10 is directly installed on the chip anti-shake fixing part 31 of the chip drive motor 30, or the optical lens 10 is The lens 10 is indirectly installed on the chip anti-shake fixing part 31 of the chip drive motor 30 through a support member, so that the optical lens 10 is disposed on the photosensitive path of the photosensitive component 40 .
  • the photosensitive component 40 includes a circuit board 41 , a photosensitive chip 42 electrically connected to the circuit board 41 and an electronic component 43 .
  • the photosensitive chip 42 is used to receive external light collected by the optical lens 10 Imaging and electrical connection with external mobile electronic devices through the circuit board 41 .
  • the electronic component 43 may be one or more of passive electronic components such as resistors and capacitors, and active electronic components such as driver chips and memory chips.
  • the electronic component 43 may be electrically It may be connected to the front side of the circuit board 41 or electrically connected to the back side of the circuit board 41 , depending on the design requirements of the camera module 1 .
  • the photosensitive chip 42 is directly or indirectly fixed to the circuit board 41.
  • the photosensitive chip 42 includes a photosensitive area and a non-photosensitive area.
  • the photosensitive chip 42 is electrically connected to the circuit board through a chip pad located in the non-photosensitive area.
  • the circuit board 41 for example, the photosensitive chip 42 can be electrically connected to the circuit board 41 through wire bonding (gold wire), welding, FC process (chip flip chip) or RDL (redistribution layer technology). .
  • the circuit board 41 includes a circuit board body 411 and a connecting strap 412 .
  • the connecting strap 412 is connected to and electrically conducts the circuit board main body 411, thereby transmitting the imaging information acquired by the photosensitive chip 42 to an external mobile electronic device through the circuit board main body 411 and the connecting strap 412.
  • the connecting strap 412 includes a first connecting strap 4121 and a second connecting strap 4122.
  • the first connecting strap 4121 and the second connecting strap 4122 are respectively connected from the main body of the circuit board.
  • the opposite sides of 411 extend outward, and are further bent upward and sideward, so that the first connection strap 4121 and the second connection strap 4122 are electrically connected.
  • the circuit board main body 411 can be kept stable during movement, further reducing the resistance when driving the circuit board 41 to move.
  • the first connection strap 4121 and the second connection strap 4122 may extend outward from adjacent two sides of the circuit board body 411 and be bent upward. There are no restrictions on this application.
  • the photosensitive component 40 further includes a filter element 44 , which is held on the photosensitive path of the photosensitive chip 42 and is used to filter the imaging light entering the photosensitive chip 42 .
  • the filter element 44 is installed and fixed on the base 45 of the photosensitive component 40 and corresponds to at least part of the photosensitive area of the photosensitive chip 42.
  • the filter element 44 can be directly attached or
  • the base 45 has a light hole, so that the light from the optical lens 10 can pass through the light hole of the base 45 and enter the photosensitive chip 42 .
  • the photosensitive component 40 can be fixed to the chip anti-shake movable part 33 of the chip drive motor 30 through the circuit board 41 (the circuit board main body 411) or the base 45, so that the photosensitive component 40 can be moved anywhere.
  • the chip anti-shake movable part 33 moves due to the movement of the chip.
  • the chip driving motor 30 includes a chip anti-shake fixed part 31 , a chip anti-shake movable part 33 , a chip driving element 32 , and a chip anti-shake conductive part 35 .
  • the chip driving element 32 is disposed on the chip anti-shake movable part 33 and the chip anti-shake fixed part 31 in a manner that connects the chip anti-shake movable part 33 and the chip anti-shake fixed part 31 respectively.
  • the chip anti-shake conductive part 35 is electrically connected to the chip driving element 32 and the photosensitive component 40, and provides driving power to the chip driving element 32 to drive the chip anti-shake movable part 33 at X Translate in the axis direction (i.e., the direction set by the X-axis) and the Y-axis direction (i.e., the direction set by the Y-axis) and/or rotate around the Z-axis direction (i.e., the direction set by the Z-axis), To achieve translational anti-shake and/or rotational anti-shake of the photosensitive component 40 .
  • the X-axis direction and the Y-axis direction are perpendicular to each other
  • the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction are located
  • the Z-axis direction is also the optical axis of the optical lens 10 direction, in other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system.
  • the XOY plane where the X-axis direction and the Y-axis direction are located is also called the plane where the horizontal direction is located.
  • the chip anti-shake fixing part 31 includes an upper cover 311 and a base 312 that are interlocked to form the receiving cavity.
  • the upper cover 311 and the The bases 312 are fixed to each other and form a receiving cavity (ie, the receiving cavity of the chip anti-shake fixed part 31 ) to accommodate the chip anti-shake movable part 33 , the chip driving element 32 , the chip anti-shake conductive part 35 and Camera module components such as the photosensitive component 40 can not only protect the above-mentioned camera module components, but also reduce dust, dirt or stray light from entering the inside of the chip drive motor 30 .
  • the upper cover 311 and the base 312 may be made of metal materials such as non-magnetic stainless steel.
  • the upper cover 311 is disposed above the base 312 , and the upper cover 311 includes a cover body 3111 with an opening in the center, and the opening corresponds to the photosensitive component 40 , so that light can enter the photosensitive component 40 through the opening for imaging.
  • the opening is circular in shape.
  • the upper cover 311 may also include a cover body peripheral side 3112 integrally extending from the cover body body 3111 toward the base 312 direction, so that the cover body peripheral side 3112 is fixedly connected to the base 312,
  • the peripheral side of the cover 3112 and the base 312 are fixed by laser welding or adhesive medium bonding.
  • the cover body peripheral side 3112 also includes at least a peripheral side recess 31121.
  • connection strap 412 outlet is formed between the upper cover 311 and the base 312 to allow the connection strap 412 of the circuit board 41 to pass through the connection strap 412.
  • the chip anti-shake fixing part 31 protrudes outward from the receiving cavity.
  • the cover body peripheral side 3112 includes two opposite peripheral side recesses 31121, and two connecting belt 412 exits are formed between the upper cover 311 and the base 312 to allow all The first connection strap 4121 and the second connection strap 4122 of the circuit board 41 extend outward from the accommodation cavity of the chip anti-shake fixing part 31 .
  • the chip anti-shake movable part 33 is movably received in the receiving cavity of the chip anti-shake fixed part 31 .
  • the chip anti-shake movable part 33 is disposed in the air or suspended in the receiving cavity of the chip anti-shake fixed part 31 , so that the chip anti-shake movable part 33 can be positioned relative to the chip.
  • the anti-shake fixing part 31 moves.
  • the chip anti-shake movable part 33 includes a chip movable carrier 331 having opposite upper and lower surfaces.
  • the chip driving element 32 is disposed between the chip movable carrier 331 and the upper cover 311.
  • the chip driving element 32 drives the chip movable carrier 331 to move relative to the chip anti-shake fixing part 31;
  • the chip movable carrier 331 is suitable for mounting the photosensitive component 40 thereon, that is, the photosensitive component 40 is suitable for being installed on the chip movable carrier 331 .
  • the photosensitive component 40 is disposed between the movable chip carrier 331 and the base 312.
  • the photosensitive component 40 is installed on the movable chip through the circuit board 41.
  • the carrier 331 and the photosensitive component 40 move along with the chip movable carrier 331 .
  • the photosensitive component 40 has a first central axis
  • the driving component has a second central axis
  • the first central axis is offset from the second central axis.
  • the central axis of the photosensitive chip 42 of the photosensitive component 40 is the first central axis of the photosensitive component 40
  • the central axis of the chip driving motor 30 is the second central axis of the driving component.
  • the chip 42 is arranged in an eccentric manner relative to the center of the driving component, that is, the photosensitive chip 42 of the photosensitive component 40 is arranged in an eccentric state in the chip driving motor 30 , that is, the photosensitive chip 42 of the photosensitive component 40
  • the central axis is set in an eccentric state, that is, the central axis of the photosensitive chip 42 is inconsistent with the central axis of the chip driving motor 30 .
  • the central axis of the photosensitive chip 42 is an axis that passes through the intersection of the diagonals of the photosensitive chip 42 when viewed from above and is parallel to the Z-axis direction;
  • the central axis of the chip driving motor 30 is an axis that passes through the chip drive when viewed from above. The intersection point of the diagonal lines of the motor 30 and an axis parallel to the Z-axis direction).
  • the chip movable carrier 331 of the chip anti-shake movable part 33 includes a chip carrier main body 3311 and a chip carrier side part 3312 that are fixed.
  • the circuit board 41 is fixed on the bottom surface of the chip carrier body 3311 (ie, the side facing the base 312).
  • the chip carrier body 3311 has a carrier body through hole 33111.
  • the carrier body through hole 33111 is not only suitable for In addition to providing a light path for the photosensitive chip 42 of the photosensitive component 40, a space for installing the electronic components 43 on the photosensitive component 40 can be provided to prevent the electronic components 43 from interfering with the chip carrier body 3311.
  • the chip carrier side portion 3312 includes a first carrier side portion 33121, a second carrier side portion 33122, a third carrier side portion 33123, and a fourth carrier side portion 33124 that integrally extend outward from the chip carrier body 3311.
  • the first carrier side portion 33121 is opposite to the third carrier side portion 33123 and adjacent to the second carrier side portion 33122 and the fourth carrier side portion 33124.
  • the second carrier side portion 33122 is adjacent to the second carrier side portion 33122 and the fourth carrier side portion 33124.
  • the fourth carrier side portions 33124 are arranged oppositely.
  • the first carrier side part 33121, the second carrier side part 33122, the third carrier side part 33123 and the fourth carrier side part 33124 are suitable as anti-collision parts when the chip carrier main body 3311 moves, This prevents the chip carrier body 3311 from directly colliding with the chip anti-shake fixing part 31 .
  • the chip carrier side 3312 (first carrier side 33121, the second carrier side 33122, the third carrier side 33123 and the fourth carrier side 33124) further extend to the side of the chip carrier main body 3311, that is, the chip carrier side 3312 extends from the chip carrier main body 3312
  • the outer peripheral edge of 3311 further extends outward, and the chip carrier side portion 3312 protrudes from the side wall of the chip carrier body 3311, so that the chip anti-shake movable portion 33 passes through the chip carrier side portion 3312 and
  • the chip anti-shake fixing part 31 collides, thereby preventing the chip carrier body 3311 on which the photosensitive component 40 is arranged from directly colliding with the chip anti-shake fixing part 31 , thereby causing damage to the photosensitive component 40 .
  • the photosensitive chip 42 is eccentrically arranged in the movable chip carrier 331 , and the distance from the center O of the photosensitive chip 42 to the two opposite sides of the movable carrier is not equal. It can also be said that the photosensitive chip 42 is closer to at least one side of the chip movable carrier 331 , that is, the photosensitive chip 42 is closer to at least one side of the chip driving motor 30 .
  • the shape of the photosensitive chip 42 of the photosensitive component 40 is a rectangular structure including long sides and wide sides.
  • the shape edges of the photosensitive component 40 can be defined with a first side, a second side,
  • the third side and the fourth side take the intersection of the diagonal lines of the photosensitive chip 42 as the central origin to establish a rectangular coordinate system.
  • the first side and the third side are parallel to the X-axis direction, and the second side and the fourth side are parallel to the Y axis.
  • the axes are parallel.
  • the chip movable carrier 331 also has a first side, a second side, a third side and a fourth side corresponding to the photosensitive component 40 .
  • the distance from the center O of the photosensitive chip 42 to the first side of the movable chip carrier 331 is H1
  • the distance from the center O of the photosensitive chip 42 to the third side of the movable chip carrier 331 is H2, H1>H2, that is, the distance between the first central axis of the photosensitive chip 42 and the third side of the chip movable carrier 331 is smaller than the distance between the first central axis of the photosensitive chip 42 and the chip movable carrier 331 .
  • the distance between the first side of the movable carrier 331 , the photosensitive chip 42 is closer to the third side of the movable chip carrier 331 , and is further away from the first side of the movable chip carrier 331 .
  • the distance between the first central axis of the photosensitive chips 42A, 42B and the third side of the chip movable carrier 331A, 331B is smaller than the distance between the first central axis of the photosensitive chips 42A, 42B and the chip movable carrier.
  • the distance between the first sides of the movable carriers 331A and 331B, the photosensitive chips 42A and 42B are closer to the third sides of the movable chip carriers 331A and 331B, and farther from the third sides of the movable chip carriers 331A and 331B.
  • the range of H1 is: 6mm-8mm
  • the range of H2 is: 3mm-4mm.
  • H1 is 7.14mm
  • H2 is 3.74mm.
  • H1 ⁇ H2 may also be satisfied, that is, the photosensitive chip 42 is closer to the third side of the movable chip carrier 331 and farther away from the movable chip carrier 331 The first side, this application does not limit this.
  • the distance from the center O of the photosensitive chip 42 to the second side of the movable chip carrier 331 is H3, and the distance from the center O of the photosensitive chip 42 to the fourth side of the movable chip carrier 331 is H4.
  • the H3 may be equal to H4, the H3 may be smaller than H4, or the H3 may be larger than H4. That is to say, the photosensitive chip 42 only needs to be closer to at least one side of the chip movable carrier 331 , which is not limited in this application.
  • the distance between the photosensitive chip 42 and the chip driving motor 30 should be short.
  • the side is arranged closer to one side of the mobile electronic device to conveniently meet the appearance and functional requirements of the mobile electronic device, for example, so that the screen opening of the mobile electronic device corresponding to the camera module 1 is closer to The edge of the mobile electronic device is moved, thereby making the screen of the mobile electronic device more complete.
  • the chip driving element 32 includes a chip magnet assembly 321 and a chip coil assembly 322 , wherein the chip coil assembly 322 is disposed on the chip movable part of the chip anti-shake movable part 33 .
  • Carrier 331 the chip magnet component 321 is fixed to the upper cover 311 of the chip anti-shake fixing part 31 and corresponds to the chip coil component 322 .
  • the chip magnet component 321 is fixed to the upper cover 311 of the chip anti-shake fixing part 31 by, for example, an adhesive medium, and the chip coil component 322 is fixed to the chip anti-shake movable part 33 .
  • Moving carrier 331, the chip magnet assembly 321 and the chip coil assembly 322 are arranged oppositely, so that the chip anti-shake movable part 33 is driven by the magnetic field force between the chip coil assembly 322 and the chip magnet assembly 321.
  • Each of the chip coil components 322 includes at least one chip coil.
  • the chip coil component 322 is not provided on at least one side of the movable chip carrier 331 .
  • the chip movable carrier 331 includes a first side, a second side, a third side and a fourth side that surround each other. The first side is opposite to the third side, and the second side and The fourth side is opposite.
  • the first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component, The Y-axis direction Perpendicular to the X-axis direction.
  • the chip coil assembly 322 includes a first chip coil group 3221 disposed on the first side, and a second chip coil group 3222 and a third chip coil group 3222 disposed on the opposite second side and the fourth side. Chip coil set 3223.
  • the first chip coil group 3221, the second chip coil group 3222 and the third chip coil group 3223 are arranged on the plane where the X-axis and the Y-axis are located, that is, the first chip coil group 3221, the third chip coil group
  • the two-chip coil group 3222 and the third chip coil group 3223 are arranged in the horizontal direction.
  • the first chip coil group 3221 is arranged along the X-axis direction
  • the second chip coil group 3222 is arranged along the Y-axis direction
  • the third chip coil group 3223 is arranged along the Y-axis direction
  • the second chip coil group 3222 It is arranged opposite to the third chip coil group 3223 along the Y-axis direction.
  • the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis.
  • the first chip coil group 3221 , the second chip coil group 3222 and the third chip coil group 3223 are arranged around three sides of the photosensitive component 40 .
  • the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. That is, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil.
  • the first chip coil group 3221 includes a first chip coil 732211 and a second chip coil 732212 disposed on the first side.
  • the first chip coil 732211 and the The second chip coil 732212 is arranged along the X-axis direction.
  • the first chip coil 732211 and the second chip coil 732212 are arranged relatively parallel along the X-axis direction;
  • the second chip coil group 3222 includes The third chip coil 732221 on the second side;
  • the third chip coil group 3223 includes a fourth chip coil 732231 disposed on the fourth side;
  • the third chip coil 732221 and the fourth chip coil 732231 are arranged relatively parallel along the Y-axis direction.
  • the first chip coil 732211 and the second chip coil 732212 are disposed on the first side or the third side of the photosensitive component 40
  • the third chip coil 732221 and the fourth chip coil 732231 They are respectively arranged on the second side and the fourth side of the photosensitive component 40 .
  • the first chip coil 732211 and the second chip coil 732212 work together to drive the chip anti-shake movable part 33 to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the third chip coil 732221 and The fourth chip coil 732231 works together to drive the chip anti-shake movable part 33 to move along the X-axis direction.
  • the sizes of the first chip coil 732211 and the second chip coil 732212 are The sizes of the third chip coil 732221 and the fourth chip coil 732231 are the same, and the sizes of the third chip coil 732221 and the fourth chip coil 732231 are smaller than those of the first chip coil 732211 and the third chip coil 732231. Dimensions of two-chip coil 732212.
  • the third chip coil 732221 and the fourth chip coil 732231 only need to drive the chip anti-shake movable part 33 to achieve translation along the X-axis direction, while the first chip coil 732211 and the second chip coil 732212 need It is necessary to drive the chip anti-shake movable part 33 to realize translation along the Y-axis direction and to drive the chip anti-shake movable part 33 to rotate around the Z-axis.
  • the chip coil assembly 322 further includes a coil circuit board 3224 disposed on the chip movable carrier 331. At least one chip coil in the chip coil assembly 322 is fixed and electrically connected to The coil circuit board 3224.
  • the first chip coil group 3221 (the first chip coil 732211, the second chip coil 732212), the second chip coil group 3222 (the third chip coil 732221) and the third chip coil group 3223 (the fourth chip coil 732231) are both fixed and electrically connected to the coil circuit board 3224, and the chip coil assembly 322 is electrically connected to the coil circuit board 3224.
  • the chip anti-shake conductive portion 35 is further electrically connected to the circuit board 41 of the photosensitive component 40 .
  • the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 may be wound-shaped coils fixedly electrically connected to the coil circuit board 3224; or, The first chip coil group 3221, the second chip coil group 3222 and the third chip coil group 3223 may be directly wound on the coil circuit board 3224; or, the first chip coil The group 3221, the second chip coil group 3222 and the third chip coil group 3223 are directly etched on the coil circuit board 3224 to form a planar coil (FP-Coil).
  • FP-Coil planar coil
  • This method can reduce the cost of the chip.
  • the height of the coil assembly 322 is thereby reduced, thereby reducing the height of the chip drive motor 30 .
  • the coil circuit board 3224 has a circuit board light hole 32241.
  • the circuit board light hole 32241 provides a light hole for the light of the optical lens 10 to enter the photosensitive component 40.
  • the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213.
  • the first chip magnet group 3211, the The second chip magnet group 3212 and the third chip magnet group 3213 are arranged on the plane where the X-axis and the Y-axis are located (that is, arranged along the horizontal direction). Further, the first chip magnet group 3211 and the first chip coil group 3221 are arranged up and down, the second chip magnet group 3212 and the second chip coil group 3222 are arranged up and down, and the third chip Magnet set 3213 is arranged vertically opposite to the third chip coil group 3223, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211 is arranged along the X-axis direction
  • the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the Y-axis direction
  • the second chip magnet group 3212 and the The third chip magnet group 3213 is arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the X-axis.
  • the upper side is the side away from the photosensitive component 40
  • the lower side is the side closer to the photosensitive component 40 .
  • the first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet.
  • the first chip magnet group 3211 includes a first chip magnet 732111 and a second chip magnet 732112.
  • the first chip magnet 732111 and the second chip magnet 732112 are along the X-axis. direction arrangement, specifically, the first chip magnet 732111 and the second chip magnet 732112 are arranged relatively parallel along the X-axis direction.
  • the second chip magnet group 3212 includes a third chip magnet 732121;
  • the third chip magnet group 3213 includes a fourth chip magnet 732131, and the third chip magnet 732121 and the fourth chip magnet 732131 are opposite along the Y-axis direction.
  • the first chip magnet group 3211 is disposed at two opposite corners (ie, corner areas) of the photosensitive component 40 along the X-axis direction
  • the second chip magnet group is disposed on two opposite sides of the photosensitive component 40 along the Y-axis direction.
  • the first chip magnet 732111 and the second chip magnet 732112 work together to drive the chip anti-shake movable part 33 to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the third chip magnet 732121 and The fourth chip magnets 732131 work together to drive the chip anti-shake movable part 33 to move along the X-axis direction.
  • the first chip magnet 732111 and the second chip magnet 732112 have the same size
  • the third chip magnet 732121 and the fourth chip magnet 732131 have the same size
  • the third chip magnet 732121 and the The size of the fourth chip magnet 732131 is smaller than the first chip magnet 732111 and the second chip magnet 732112.
  • the third chip magnet 732121 and the fourth chip magnet 732131 only need to drive the chip anti-shake movable part 33 to achieve translation along the X-axis direction, while the first chip magnet 732111 and the second chip magnet 732112 need It is necessary to drive the chip anti-shake movable part 33 to realize translation along the Y-axis direction and to drive the chip anti-shake movable part 33 to rotate around the Z-axis.
  • the first chip coil group 3221 and the first chip magnet group 3211 interact to drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the Y-axis direction and/or around the Z-axis. direction of rotation; the second chip coil group 3222 and the second chip magnet group 3212 interact, and the third chip coil group 3223 and the third chip magnet group 3213 interact to jointly drive the chip anti-shake
  • the movable part 33 further drives the photosensitive component 40 to translate in the X-axis direction.
  • the chip coil assembly 322 is not provided on at least one side of the chip movable carrier 331 .
  • the chip movable carrier 331 includes a first side, a second side, a third side and a fourth side that surround each other.
  • the first side is opposite to the third side, and the second side and The fourth side is opposite.
  • the first side and the third side extend along the X-axis direction set by the driving assembly, and the second side and the fourth side extend along the Y-axis direction set by the driving assembly,
  • the Y-axis direction is perpendicular to the X-axis direction.
  • the chip coil assembly 322 includes a first chip coil group 3221 disposed on the first side, and a second chip coil group 3222 and a third chip coil group 3222 disposed on the opposite second side and the fourth side. Chip coil set 3223.
  • the first chip coil group 3221, the second chip coil group 3222 and the third chip coil group 3223 are arranged on the plane where the X-axis and the Y-axis are located, that is, the first chip coil group 3221, the third chip coil group
  • the two-chip coil group 3222 and the third chip coil group 3223 are arranged in the horizontal direction.
  • the first chip coil group 3221 is arranged along the X-axis direction
  • the second chip coil group 3222 is arranged along the Y-axis direction
  • the third chip coil group 3223 is arranged along the Y-axis direction
  • the second chip coil group 3222 It is arranged opposite to the third chip coil group 3223 along the Y-axis direction.
  • the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis.
  • the first chip coil group 3221 , the second chip coil group 3222 and the third chip coil group 3223 are arranged around three sides of the photosensitive component 40 .
  • the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 each include at least one chip coil. That is, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil.
  • the first chip coil group 3221 includes two opposite first chip coils 832211 disposed on the first side, forming a pair of first chip coils 832211, and a pair of first chip coils 832211.
  • the first chip coils 832211 are arranged along the X-axis direction.
  • a pair of the first chip coils 832211 are arranged along the are arranged parallel to the
  • the second chip coil 832212 on the second side is opposite to another second chip coil 832212, forming a pair of second chip coils 832212; the pair of second chip coils 832212 are arranged relatively parallel along the Y-axis direction.
  • the pair of first chip coils 832211 are disposed on the first side or the third side of the photosensitive component 40
  • the two second chip coils 832212 of the pair of second chip coils 832212 are respectively disposed on the first side or the third side of the photosensitive component 40 .
  • the second side and the fourth side of the photosensitive component 40 are respectively disposed on the first side or the third side of the photosensitive component 40 .
  • the pair of first chip coils 832211 work together to drive the chip anti-shake movable part 33 to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the pair of second chip coils 832212 work together to drive the chip
  • the anti-shake movable portion 33 moves in the X-axis direction.
  • the size of the pair of first chip coils 832211 is the same, the size of the pair of second chip coils 832212 is the same, and the size of the second chip coil 832212 is smaller than the size of the first chip coil 832211.
  • the second chip coil 832212 only needs to drive the chip anti-shake movable part 33 to achieve translation along the X-axis direction, while the first chip coil 832211 needs to drive both the chip anti-shake movable part 33 to achieve translation along the Y axis.
  • the anti-shake movable part 33 of the chip must be driven to rotate around the Z-axis.
  • the chip coil assembly 322 further includes a coil circuit board 3224 disposed on the chip movable carrier 331. At least one chip coil in the chip coil assembly 322 is fixed and electrically connected to The coil circuit board 3224.
  • the first chip coil group 3221 (a pair of the first chip coils 832211), the second chip coil group 3222 (one of the second chip coils 832212) and the The third chip coil group 3223 (one of the second chip coils 832212) is fixed and electrically connected to the coil circuit board 3224, and the chip coil assembly 322 is electrically connected to the chip anti-corrosion device through the coil circuit board 3224.
  • the conductive portion 35 is thereby further electrically connected to the circuit board 41 of the photosensitive component 40 .
  • the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 may be wound and formed coils fixedly electrically connected to the coil circuit board 3224; or, The first chip coil group 3221, the second chip coil group 3222 and the third chip coil group 3223 may be directly wound on the coil circuit board 3224; or, the first chip coil The group 3221, the second chip coil group 3222 and the third chip coil group 3223 are directly etched on the coil circuit board 3224 to form a planar coil (FP-Coil). This method can reduce the cost of the chip. the height of the coil assembly 322, thereby reducing the chip drive motor 30 high.
  • the coil circuit board 3224 has a circuit board light hole 32241.
  • the circuit board light hole 32241 provides a light hole for the light of the optical lens 10 to enter the photosensitive component 40.
  • the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213.
  • the first chip magnet group 3211, the The second chip magnet group 3212 and the third chip magnet group 3213 are arranged on the plane where the X-axis and the Y-axis are located (that is, arranged along the horizontal direction).
  • first chip magnet group 3211 and the first chip coil group 3221 are arranged up and down
  • the second chip magnet group 3212 and the second chip coil group 3222 are arranged up and down
  • the magnet group 3213 and the third chip coil group 3223 are arranged vertically and oppositely, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211 is arranged along the X-axis direction
  • the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the Y-axis direction
  • the second chip magnet group 3212 and the The third chip magnet group 3213 is arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the Y-axis.
  • the upper side is the side away from the photosensitive component 40
  • the lower side is the side closer to the photosensitive component 40 .
  • the first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet.
  • the first chip magnet group 3211 includes two opposite first chip magnets 832111, forming a pair of first chip magnets 832111.
  • the pair of first chip magnets 832111 are along the Arranged in the axial direction, specifically, the two first chip magnets 832111 are arranged in parallel along the X-axis direction.
  • the second chip magnet group 3212 includes a second chip magnet 832112;
  • the third chip magnet group 3213 includes a second chip magnet 832112, forming a pair of second chip magnets 832112, and a pair of the second chip magnets 832112.
  • the first chip magnet group 3211 is disposed at two opposite corners (ie, corner areas) of the photosensitive component 40 along the X-axis direction
  • the second chip magnet group is disposed on two opposite sides of the photosensitive component 40 along the Y-axis direction.
  • the pair of first chip magnets 832111 work together to drive the chip anti-shake movable part 33 to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the pair of second chip magnet groups 3212 work together to drive the The chip anti-shake movable part 33 moves in the X-axis direction.
  • a pair of the first chip magnets 832111 have the same size, and a pair of the second core magnets 832111 have the same size.
  • the size of the sheet magnet group 3212 is the same, and the size of the second chip magnet group 3212 is smaller than that of the first chip magnet 832111. This is because the second chip magnet group 3212 only needs to drive the chip anti-shake movable part 33 to achieve translation along the X-axis direction, while the first chip magnet 832111 needs to drive both the chip anti-shake movable part 33 to achieve translation along the X-axis. To translate in the Y-axis direction, the anti-shake movable part 33 of the chip must be driven to rotate around the Z-axis.
  • the first chip coil group 3221 and the first chip magnet group 3211 interact to drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the Y-axis direction and/or around the Z-axis. direction of rotation; the second chip coil group 3222 and the second chip magnet group 3212 interact, and the third chip coil group 3223 and the third chip magnet group 3213 interact to jointly drive the chip anti-shake
  • the movable part 33 further drives the photosensitive component 40 to translate in the X-axis direction.
  • the chip driving element 32 is not provided on at least one side of the chip driving motor 30 to provide a larger spatial location for the eccentric arrangement of the photosensitive chip 42 . That is, the photosensitive chip 42 may be disposed close to the side of the chip driving motor 30 where the chip driving element 32 is not provided, so that the central axis of the photosensitive chip 42 is inconsistent with the central axis of the chip driving motor 30 . Furthermore, when the eccentric photosensitive chip 42 described in this application is used in the camera module 1, the chip driving motor 30 is not provided with a chip driving element 32 on at least one side of the chip driving motor 30, which can avoid the impact of magnetic interference problems on the camera module 1. The selection of the lens drive motor 20 coordination scheme is described below.
  • the chip magnet assembly 321 and the chip coil assembly 322 are centrally arranged on three sides of the photosensitive chip 42, and no chip is provided on one side of the photosensitive chip 42 except for the three sides.
  • the driving element 32 is arranged in such a way that the central axis of the photosensitive chip 42 is arranged on the chip movable carrier 331 in an eccentric state, and the center O of the photosensitive chip 42 is closer to the chip movable carrier 331
  • the chip driver element 32 is not provided on one side.
  • the first chip magnet group 3211 and the first chip coil group 3221 are disposed on the first side of the photosensitive chip 42, and the second chip magnet group 3212 and the second chip coil
  • the group 3222, the third chip magnet group 3213, and the third chip coil group 3223 are arranged on the second side and the fourth side of the photosensitive chip 42.
  • This arrangement makes the center O of the photosensitive chip 42 close to the photosensitive chip 42.
  • the first side of the chip movable carrier 331 that is, the central axis of the photosensitive chip 42 is inconsistent with the central axis of the chip driving motor 30 .
  • the chip magnet assembly 321 further includes a A magnetic conductive member (not shown in the figure) between a chip magnet group 3211, the second chip magnet group 3212, the third chip magnet group 3213 and the upper cover 311.
  • the first chip magnet group 3211, the second chip magnet group 3212 and the third chip magnet group 3213 are indirectly fixed to the upper cover 311 through the magnetic conductive member, which is suitable for strengthening
  • the magnetic field force of the chip magnet assembly 321 is directed toward the coil magnet assembly, thereby enhancing the driving force of the chip driving element 32 .
  • the chip drive motor 30 also includes a chip position sensing component 36 and a chip holding component 34.
  • the chip position sensing component 36 is used to obtain the position or movement information of the photosensitive component 40.
  • the chip holding component 34 is adapted to allow the chip movable carrier 331 to be suspended in the receiving cavity of the chip anti-shake fixing part 31 , so that the photosensitive component 40 can be held by the chip holding component 34 is suspended in the chip anti-shake fixing part 31 .
  • the chip position sensing component 36 is fixed to the chip movable carrier 331 , so that when the chip movable carrier 331 moves, the chip position sensing component 36 is adapted to pass through Obtain the magnetic field change of the chip magnet assembly 321 to obtain the position information of the chip movable carrier 331.
  • the chip position sensing component 36 includes at least one position sensing element, and the number of the position sensing elements is not limited by this application.
  • the chip position sensing component 36 includes a first position sensing element 361, a second position sensing element 362 and a third position sensing element 363, so as to sense the chip position.
  • the position information of the three movements of the movable carrier 331 translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction.
  • the first position sensing element 361, the second position sensing element 362 and the third position sensing element 363 are Hall elements; in other embodiments of this application, the first position sensing element 361, the second position sensing element 362 and the third position sensing element 363 are Hall elements.
  • the first position sensing element 361, the second position sensing element 362 and the third position sensing element 363 are driver chips containing a position sensing function.
  • a sensing element groove 33114 is formed on the chip carrier body 3311 (as shown in FIG. 6 ), and the chip position sensing component 36 is disposed in the sensing element groove 33114 , thereby preventing the height of the chip position sensing component 36 from being too high, and the chip position sensing component 36 is electrically connected to the circuit board 41 of the photosensitive component 40, at the position set by the chip movable carrier 331 In the height (Z-axis) direction, the chip position sensing element is disposed between the chip coil assembly 322 and the circuit board 41 .
  • the chip position sensing component 36 is accommodated in the sensing element groove 33114 and does not protrude from the sensing element groove 33114.
  • the chip holding component 34 includes a chip supporting component 341 and a chip magnetic suction component 342 which are disposed between the chip movable carrier 331 and the upper cover 311.
  • the chip magnetic suction component 342 is fixed to the chip anti-corrosion component.
  • the chip movable carrier 331 of the shake movable part 33 is in such a state that the magnetic attraction force between the chip magnetic attraction component 342 and the chip magnet component 321 causes the chip anti-shake movable part 33 to be attracted to the upper cover 311 .
  • the chip support component 341 is disposed between the upper cover 311 of the chip anti-shake fixed part 31 and the chip movable carrier 331 of the chip anti-shake movable part 33.
  • the chip support component 341 is clamped by the upper cover 311 and the chip movable carrier 331.
  • the chip movable carrier 331 and the upper cover 311 are There is a gap between them, thereby reducing the resistance of the chip anti-shake movable part 33 during movement.
  • the chip support component 341 includes at least three support components that are clamped between the chip anti-shake movable part 33 and the chip anti-shake fixed part 31 , and each group of support components
  • the assembly includes a ball groove 3412 recessedly formed in the chip movable carrier 331 and balls 3411 disposed in the ball groove 3412, as shown in FIGS. 10 to 12 .
  • the number of balls 3411 and rolling grooves is not limited to this application.
  • the chip support component 341 includes three support components, and each support component includes at least one ball 3411 and at least one Ball groove 3412, that is to say, the chip support assembly 341 includes at least three balls 3411 disposed between the chip movable carrier 331 and the upper cover 311.
  • the chip support assembly 341 also includes at least three ball grooves 3412 corresponding to at least three balls 3411.
  • at least three ball grooves 3412 are formed on the chip movable carrier 331.
  • the ball grooves The depth of the ball 3412 is smaller than the diameter of the ball 3411 , and at least a part of the ball 3411 can protrude from the ball groove 3412 so that the ball 3411 can maintain frictional contact with the upper cover 311 .
  • the movable chip carrier 331 further includes an extension column 3313 protrudingly formed on the upper surface of the chip carrier body 3311 , and the ball groove 3412 is recessedly formed on the upper surface of the extension column 3313 .
  • the chip movable carrier 331 includes at least three extension columns 3313 formed on the chip carrier body 3311, and at least three of the extension columns 3313 protrude from the upper surface of the chip carrier body 3311. On the surface, at least three ball grooves 3412 are formed on at least three extending posts 3313 .
  • the chip support component 341 is disposed between the extension column 3313 and the upper cover 311, so that a certain gap is maintained between the movable chip carrier 331 and the upper cover 311, and the gap does not change with the chip.
  • the movement of the movable carrier 331 changes.
  • the chip movable carrier 331 includes three extension posts 3313 formed on the chip carrier body 3311, and the chip support assembly 341 includes three tops formed by the extension posts 3313.
  • the at least three support components are arranged in an incomplete collinear manner.
  • the three extension pillars 3313 are distributed at two adjacent corners of the chip carrier body 3311 and on the side opposite to the side where the adjacent corners are connected, that is, the three balls 3411 are in the form of The triangular layout is distributed to form a stable support for the chip movable carrier 331 .
  • the chip support assembly 341 further includes a ball support piece 3413 embedded in the chip movable carrier 331 and located at the bottom of the ball groove 3412 .
  • the ball 3411 is supported on the ball support. Film 3413.
  • the chip support assembly 341 further includes at least three ball support pieces 3413.
  • the ball support pieces 3413 are fixed to the chip movable carrier 331 and serve as the bottom surface of the ball groove 3412, so
  • the ball supporting piece 3413 can be made of metal such as stainless steel, thereby providing a smoother supporting surface for the ball 3411 and reducing the friction of the rolling ball 3411.
  • the chip support assembly 341 includes three ball support pieces 3413.
  • Each ball support piece 3413 is fixed in the extension column 3313 of the chip movable carrier 331 through insert molding and is exposed. Its upper surface serves as the bottom surface of each ball groove 3412.
  • the ball support piece 3413 includes a support piece main body 34131 and a support piece connecting portion 34132.
  • the support piece main body 34131 and the support piece connecting portion 34132 are integrated.
  • Extended, the upper surface of the support piece main body 34131 is exposed and serves as the bottom surface of the ball groove 3412.
  • the support piece connecting portion 34132 is used to maintain the ball support piece 3413 in the movable position of the chip during the insert molding process.
  • the support piece connecting portion 34132 can be connected to the supporting piece connecting portions 34132 of other ball supporting pieces 3413 or connected to other supporting components for supporting the supporting piece connecting portion 34132.
  • the supporting piece connecting portion 34132 is cut, and a part of the supporting piece connecting portion 34132 can be exposed on the chip movable carrier 331 .
  • the ball support piece 3413 includes a support piece main body 34131 located at the bottom of the ball groove 3412 and extending from the support piece main body 34131 to the outside of the chip movable carrier 331 The support piece connection part 34132.
  • the chip magnetic assembly The component 342 includes at least one chip magnetic element 3421.
  • the chip magnetic element 3421 is wrapped in the chip movable carrier 331 of the chip anti-shake movable part 33, so as to pass through the chip magnet assembly 321 and the chip magnet assembly 321.
  • the magnetic attraction between at least one chip magnetic element 3421 causes the chip movable carrier 331 to be suspended in the receiving cavity of the chip anti-shake fixing part 31 .
  • at least one of the chip magnetic components 3421 is embedded in the chip movable carrier 331 of the chip anti-shake movable part 33 through an insert molding process.
  • the element 3421 is arranged opposite to the chip magnet assembly 321 to generate a magnetic attraction force between at least one of the chip magnet assembly 3421 and the chip magnet assembly 321.
  • the chip support assembly is caused by the magnetic attraction force.
  • 341 is clamped between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33.
  • the ball 3411 is clamped between the upper cover 311 and the chip movable carrier 331; on the other hand, after the chip movable carrier 331 moves, the chip is moved by the magnetic attraction force.
  • the movable carrier 331 is maintained in a position, where the position may be an initial position before the chip movable carrier 331 is driven.
  • the chip magnetic element 3421 is made of a material with magnetic permeability, which is suitable for generating magnetic attraction with a magnet.
  • the chip magnetic element 3421 includes a magnetic element main body 34211 and a magnetic element connection part 34212.
  • the magnetic element main body 34211 and the magnetic element connection part 34212 extend integrally.
  • the magnetic element connection part 34212 is used for To maintain the position of the chip magnetic element 3421 in the chip movable carrier 331 during the insert molding process, the magnetic element connecting portion 34212 can be connected to the magnetic element connecting portion 34212 of other chip magnetic elements 3421 or Connect other supporting components for supporting the magnetic element connecting portion 34212.
  • the magnetic element connecting portion 34212 is cut, and a part of the magnetic element connecting portion 34212 can be exposed. outside the chip movable carrier 331.
  • the chip magnetic element 3421 includes a magnetic element body 34211 wrapped in the chip movable carrier 331 and extending from the magnetic element body 34211 to The magnetic element connection portion 34212 outside the chip movable carrier 331.
  • the upper surface of the chip magnetic component 3421 is exposed and not wrapped by the chip movable carrier 331; in other embodiments of the present application, the upper surface of the chip magnetic component 3421 is exposed.
  • the surface can also be wrapped by the chip movable carrier 331, and the application is not limited thereto.
  • the chip magnetic The suction component 342 includes a first chip magnetic suction component 3422 and a second chip magnetic suction component 3423, wherein the first chip magnetic suction component 3422 and the second chip magnetic suction component 3423 are reasonably arranged so that the The first chip magnetic component 3422 and the second chip magnetic component 3423 play different main roles.
  • the three balls 3411 are arranged in a triangular shape, and the first chip magnetic assembly 3422 is disposed at the corner of the triangular plane (i.e., the corner area).
  • the component 3422 is disposed close to the ball 3411.
  • the main function of the first chip magnetic component 3422 is to generate magnetic attraction along the Z-axis direction with the chip magnet component 321, so that the chip support component 341 is clamped in Between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33; the second chip magnetic component 3423 is disposed at the edge of the triangular plane, that is, the second chip magnetic component 3423 is The distance of the ball 3411 is farther than the distance from the first chip magnetic component 3422 to the ball 3411.
  • the main function of the second chip magnetic component 3423 is to move the chip movable carrier 331 , and the chip magnet group generates a magnetic attraction force having a certain angle with the Z-axis direction.
  • the main function of this magnetic attraction force is to return the chip movable carrier 331 to a position.
  • the main functions of the first chip magnetic component 3422 and the second chip magnetic component 3423 described in this application are different, which does not mean that the first chip magnetic component 3422 and the second chip magnetic component 3423 will not have other functions.
  • the first chip magnetic attraction component 3422 will also have the function of returning the chip movable carrier 331 to a position through the action of magnetic attraction after the chip movable carrier 331 moves.
  • the two-chip magnetic attraction component 3423 also has the function of clamping the chip support component 341 between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33 through the effect of magnetic attraction.
  • the first chip magnetic component 3422 and the second chip magnetic component 3423 cooperate with each other and work together on the chip movable carrier 331. However, due to the positions of the first chip magnetic component 3422 and the second chip magnetic component 3423, The difference makes the main functions of the two different.
  • the number of the first chip magnetic components 3422 is 4, including the first chip magnetic component 734221, the second chip magnetic component 734222, the third chip magnetic component 734223 and the third chip magnetic component 734222.
  • Four-chip magnetic component 734224 The first chip magnetic element 734221 and the first chip magnet 732111 are arranged oppositely along the height direction set by the chip movable carrier 331, and the second chip magnetic element 734222 and the second chip magnet 732112 are arranged oppositely along the height direction set by the chip movable carrier 331, and the third chip magnetic element 734223 and the third chip magnet 732121 are oppositely arranged along the height direction set by the chip movable carrier 331.
  • the chip magnet assembly 321 and the first chip magnetic assembly 3422 in this application are arranged oppositely along the height direction set by the chip movable carrier 331 .
  • the opposite directions do not need to be completely opposite, that is to say, the projection of the chip magnet component 321 and the projection of the first chip magnetic component 3422 only need to overlap at least partially.
  • the first chip magnetic element 734221 and the second chip magnetic element 734222 are disposed on the first side of the chip movable carrier 331, and the third chip magnetic element 734223 and the fourth chip magnetic element Components 734224 are respectively disposed on the second side and the fourth side of the chip movable carrier 331 . It can also be said that the first chip magnetic element 734221, the second chip magnetic element 734222, the third chip magnetic element 734223 and the fourth chip magnetic element 734224 are arranged according to the position of the ball 3411.
  • first chip magnetic element 734221 and the second chip magnetic element 734222 are arranged close to the ball 3411 along the X-axis direction.
  • the first chip magnetic element 734221 and the second chip magnetic element 734222 are respectively Disposed on both sides of the two balls 3411;
  • the third chip magnetic component 734223 and the fourth chip magnetic component 734224 are disposed close to the ball 3411 along the Y-axis direction, and
  • the third chip magnetic component 734223 and the fourth chip magnetic element 734224 are respectively disposed on one side of one of the balls 3411. Since the first chip magnetic component 3422 is closer to the ball 3411, the magnetic attraction force generated between it and the chip magnet component 321 to clamp the chip support component 341 is more obvious.
  • the number of the second magnetic chip components 3423 is 2, including the fifth chip magnetic component 734231 and the sixth chip magnetic component 734232, where the fifth chip magnetic component
  • the element 734231 and the third chip magnet 732121 are arranged oppositely along the height direction set by the chip movable carrier 331.
  • the sixth chip magnetic element 734232 and the fourth chip magnet 732131 are movable along the chip.
  • the set height directions of the carrier 331 are relatively arranged.
  • the fifth chip magnetic element 734231 is disposed between the first chip magnet 732111 and the third chip magnet 32131
  • the sixth chip magnetic element 734232 is disposed between the first chip magnet 732111 and the third chip magnet 32131.
  • the fifth chip magnetic element 734231 is disposed on the second side of the chip movable carrier 331
  • the sixth chip magnetic element 734232 is disposed on the fourth side of the chip movable carrier 331 .
  • This arrangement allows a magnetic attraction force with a certain angle to the Z-axis direction to be generated between the second chip magnetic attraction group and the chip magnet assembly 321 after the chip movable carrier 331 moves. The effect causes the chip movable carrier 331 to return to a position.
  • a magnetic attraction force is also generated between the first chip magnetic component 3422 and the chip magnet component 321, causing the chip movable carrier 331 to return to a position.
  • the magnetic attraction force generated between the second chip magnetic attraction component 3423 and the chip magnet component 321 may be a force opposite to the moving direction of the chip movable carrier 331.
  • the magnetic attraction force at this time is The reset force causes the chip movable carrier 331 to return to a position; the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can also cause the chip movable carrier 331 to move Forces in the same direction, the magnetic attraction force at this time is external attraction force.
  • the external attraction force is the same as the external attraction force.
  • the reset force of the circuit board 41 is slightly offset to compensate for the thrust force of the chip movable carrier 331 during the edge stroke.
  • the chip magnetic assembly 342 includes a first chip magnetic assembly 3422 and a second chip magnetic assembly 3423, wherein by The first chip magnetic component 3422 and the second chip magnetic component 3423 are properly arranged so that the first chip magnetic component 3422 and the second chip magnetic component 3423 play different main roles.
  • the three balls 3411 are arranged in a triangular shape, and the first chip magnetic assembly 3422 is disposed at the corner of the triangular plane (i.e., the corner area).
  • the component 3422 is disposed close to the ball 3411.
  • the main function of the first chip magnetic component 3422 is to generate magnetic attraction along the Z-axis direction with the chip magnet component 321, so that the chip support component 341 is clamped in Between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33; the second chip magnetic component 3423 is disposed at the edge of the triangular plane, that is, the second chip magnetic component 3423 is The distance of the ball 3411 is farther than the distance from the first chip magnetic component 3422 to the ball 3411.
  • the main function of the second chip magnetic component 3423 is to move the chip movable carrier 331 , and the chip magnet group generates a magnetic attraction force with a certain angle with the Z-axis direction.
  • the main function of this magnetic attraction force is to return the chip movable carrier 331 to a position.
  • the main functions of the first chip magnetic component 3422 and the second chip magnetic component 3423 described in this application are different, which does not mean that the first chip magnetic component 3422 and the second chip magnetic component 3423 will not have other functions.
  • the first chip magnetic attraction component 3422 will also have the function of returning the chip movable carrier 331 to a position through the action of magnetic attraction after the chip movable carrier 331 moves.
  • the two-chip magnetic attraction component 3423 also has the function of clamping the chip support component 341 between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33 through the effect of magnetic attraction. No.
  • a chip magnetic component 3422 and a second chip magnetic component 3423 cooperate with each other and work together on the chip movable carrier 331. However, due to the different positions of the first chip magnetic component 3422 and the second chip magnetic component 3423 , making the main functions of the two different.
  • the first chip magnetic component 3422 includes at least one first chip magnetic component 834221
  • the second chip magnetic component 3423 includes at least one second chip magnetic component 834231.
  • the element 834221 is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic component 834231 and any one of the at least three support components is greater than the first chip magnetic component. The distance between element 834221 and the first support component.
  • the number of the first chip magnetic components 3422 is four, and the number of the second chip magnetic components 3423 is two.
  • the first chip magnetic assembly 3422 includes two opposing first chip magnetic components 834221 and two opposing third chip magnetic components 834222, forming a pair of first chip magnetic components 834221 and a pair of third chip components. Magnetic component 834222.
  • the second magnetic chip assembly 3423 includes two second magnetic chip components 834231, forming a pair of second magnetic chip components 834231.
  • the pair of first chip magnetic components 834221 and the pair of first chip magnets 832111 are arranged oppositely along the height direction set by the chip movable carrier 331, and the pair of second chip magnetic components 834231 and The pair of second chip magnets 832112 are arranged oppositely along the height direction set by the chip movable carrier 331 . That is, the pair of first chip magnetic elements 834221 corresponds to the pair of first chip magnets 832111 in the height direction set by the chip movable carrier 331, and the pair of second chip magnetic elements The element 834231 corresponds to the pair of second chip magnets 832112 in the height direction set by the chip movable carrier 331 .
  • the chip magnet assembly 321 and the first chip magnetic assembly 3422 do not need to be completely facing each other when they are arranged oppositely along the height direction set by the chip movable carrier 331 . That is to say, the chip magnet assembly 321 does not need to be completely opposite. It suffices that the projection of the component 321 overlaps with the projection of the first chip magnetic component 3422 at least partially.
  • a pair of the first chip magnetic components 834221 is disposed on the first side of the movable chip carrier 331, located on opposite sides of the first support component, and a pair of third chip magnetic components 834222 is disposed on the first side of the movable chip carrier 331.
  • a pair of first chip magnetic components 834221 is disposed close to the ball 3411 along the X-axis direction, and a pair of first chip magnetic components 834221 is disposed on both sides of the two balls 3411 respectively;
  • a pair of third chip magnetic components 834222 are disposed close to the ball 3411 along the Y-axis direction, and the third chip magnetic components 834222 are respectively disposed on one side of one of the ball 3411. Since the first chip magnetic component 3422 is closer to the ball 3411, the magnetic attraction force generated between it and the chip magnet component 321 to clamp the chip support component 341 is more obvious.
  • the size of the first chip magnetic component 834221 and the size of the third chip magnetic component 834222 are larger than the size of the second chip magnetic component 834231. This is because the main function of the first chip magnetic element 834221 and the third chip magnetic element 834222 is to clamp the ball 3411, which also plays a role in resetting the chip movable carrier 331, so The second chip magnetic element 834231 and its corresponding chip magnet element only need to generate a reset force to reset the chip movable carrier 331 .
  • a pair of the second chip magnetic components 834231 and the second chip magnet 832112 are arranged oppositely along the height direction set by the chip movable carrier 331 .
  • a pair of second chip magnetic elements 834231 are disposed between a pair of first chip magnets 832111 and a pair of third chip magnets 32131.
  • one of the pair of second chip magnetic components 834231 is disposed in the middle area of the second side of the movable chip carrier 331
  • the other second chip magnetic component 834231 It is arranged in the middle area of the fourth side of the chip movable carrier 331 .
  • This arrangement allows a magnetic attraction force at a certain angle with the Z-axis direction to be generated between the second chip magnetic attraction component 3423 and the chip magnet component 321 after the chip movable carrier 331 moves.
  • the function of the chip movable carrier 331 returns to a position.
  • a magnetic attraction force will also be generated between the first chip magnetic component 3422 and the chip magnet component 321, causing the chip movable carrier 331 to return to a position.
  • the magnetic attraction force generated between the second chip magnetic attraction component 3423 and the chip magnet component 321 may be a force opposite to the moving direction of the chip movable carrier 331.
  • the magnetic attraction force at this time is The reset force causes the chip movable carrier 331 to return to a position; the magnetic attraction force generated between the second chip magnetic component 3423 and the chip magnet component 321 can also cause the chip movable carrier 331 to move Forces in the same direction, the magnetic attraction force at this time is external attraction force, this is because When the chip movable carrier 331 moves, the circuit board 41 of the photosensitive component 40 will also generate a certain reset force.
  • the external suction force slightly offsets the reset force of the circuit board 41 to compensate for the movable chip.
  • the thrust of the moving carrier 331 during the edge stroke is the force opposite to the moving direction of the chip movable carrier 331.
  • the chip magnetic assembly 342 includes six chip magnetic elements 3421, and each two of the chip magnetic elements 3421 have the same shape, thereby providing uniform and stable magnetic attraction.
  • the chip movable carrier 331 is smoothly attracted to the upper cover 311 .
  • the chip movable carrier 331 can be integrally formed with the ball support piece 3413 and the chip magnetic element 3421 by insert molding through an injection molding process to reduce the number of parts of the chip drive motor 30.
  • the chip anti-shake conductive part 35 may also be embedded in the chip anti-shake movable part 33 by insert molding.
  • the present application embeds the chip anti-shake conductive part 35 into the chip anti-shake movable part 33 by, for example, insert molding to provide a chip anti-shake movable part 33 with a conductive function, so that the chip coil
  • the component 322 may be electrically connected to the circuit board 41 through the chip anti-shake movable part 33 .
  • the chip anti-shake conductive part 35 is embedded in the chip anti-shake movable part 33 through insert molding, the chip anti-shake movable part 33 is suitable for providing two flat mounting surfaces for installation and fixation.
  • the chip coil assembly 322 and the circuit board 41 can also reduce the number of components of the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the chip anti-shake conductive portion 35 .
  • FIG. 11 and FIG. 13B show the embedded structure of the chip anti-shake movable part 33 and the chip anti-shake conductive part 35 .
  • the chip anti-shake conductive part 35 includes at least one coil conductive component 351.
  • the chip anti-shake conductive part 35 includes multiple (two or more) coil conductive components 3511, and a plurality of so-called coil conductive components 3511.
  • the coil conductive element 3511 is embedded in the chip movable carrier 331 by, for example, insert molding. That is, the coil conductive element 3511 is wrapped in the chip anti-shake movable carrier, so that A plurality of the coil conductive elements 3511 may electrically connect the chip coil assembly 322 and the circuit board 41 .
  • the number of the coil conductive elements 3511 in the coil conductive component 351 is related to the required number of circuits in the chip coil component 322.
  • the coil conductive component 351 includes 6 coil conductive elements 3511.
  • Each of the coil conductive elements 3511 has an exposed first coil conductive end 35111, an exposed second coil conductive end 35113 opposite to the first coil conductive end 35111, and extends and is electrically conductive
  • the coil between the first coil conductive end 35111 and the second coil conductive end 35113 Conductive extension part 35112.
  • the first coil conductive end part 35111 is positioned higher than the second coil conductive end part 35113.
  • the coil conductive extension part 35112 extends downward from the first coil conductive end part 35111 to The second coil conductive end 35113.
  • the chip movable carrier 331 does not cover the upper surface of the first coil conductive end portion 35111, and the first coil conductive end portion 35111 The upper surface is exposed for electrical connection with the chip coil assembly 322.
  • the chip movable carrier 331 does not cover the lower surface of the second coil conductive end 35113.
  • the lower surface of the second coil conductive end 35113 Exposed for electrical connection with the circuit board 41 , thereby electrically connecting the chip coil component 322 and the circuit board 41 .
  • the first coil conductive end 35111 of at least part of all the coil conductive elements 3511 is exposed to the upper surface of the chip movable carrier 331, and the second coil The conductive end portion 35113 is exposed to the lower surface of the chip movable carrier 331 .
  • At least one chip coil in the chip coil assembly 322 is electrically connected to the first coil conductive end 35111 through the coil circuit board 3224, and the second coil is electrically connected to the first coil conductive end 35111.
  • the conductive end portion 35113 is suitable for electrically connecting to the circuit board 41 of the photosensitive component 40, in this way, electrical conduction between the chip coil assembly 322 and the circuit board 41 is achieved.
  • the first coil conductive end 35111 of the coil conductive element 3511 forms part of the upper conductive part 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the third coil conductive element 3511
  • the two coil conductive end portions 35113 form a part of the lower conductive portion 33113 of the chip carrier body 3311 of the movable chip carrier 331 .
  • the upper conductive part 33112 includes a first coil conductive end part 35111
  • the lower conductive part 33113 includes a second coil conductive end part 35113.
  • the coil conductive component 3511 also includes a coil conductive connection part 35114.
  • the coil conductive connection part 35114 The coil conductive connection portions 35114 of other coil conductive elements 3511 may be connected or other support components for supporting the coil conductive connection portions 35114 may be connected.
  • the coil conductive element 3511 further includes a conductive element formed from the first coil conductive end 35111, the second coil conductive end 35113 and the coil conductive extension 35112.
  • the coil conducts electricity
  • the main body extends to the coil conductive connection portion 35114 outside the chip movable carrier 331 .
  • the first coil conductive end portion 35111, the second coil conductive end portion 35113, the coil conductive extension portion 35112 and the coil conductive connection portion 35114 are integrally formed of conductive material.
  • the coil conductive element 3511 is not provided with the coil conductive connection part 35114, and the first coil conductive end part 35111, the second coil conductive end part 35113 and the coil conductive
  • the extension part 35112 is integrally formed of conductive material.
  • the chip anti-shake conductive part 35 may also include a sensing element conductive component (not shown in the figure).
  • the sensing element conductive component includes a movable component covered by the chip.
  • At least one sensing element in the carrier 331 is a conductive element.
  • Each of the sensing element conductive elements includes a first sensing element conductive end portion exposed to the upper surface of the chip movable carrier 331 , exposed to the lower surface of the chip movable carrier 331 and connected to the The conductive end of the first sensing element is opposite to the conductive end of the second sensing element, and a sensing element extending between the conductive end of the first sensing element and the conductive end of the second sensing element A conductive extension, wherein the conductive end of the first sensing element is electrically connected to the position sensing element, the conductive end of the second sensing element is suitable for electrical connection to the circuit board 41, and the third sensing element conductive end is adapted to be electrically connected to the circuit board 41.
  • the conductive end of a sensing element is lower than the conductive end of the first coil 35111 in the height direction set by the chip movable carrier 331 .
  • the conductive elements are embedded in the chip movable carrier 331 by insert molding through the injection molding process, and are integrally formed with the chip movable carrier 331, thereby reducing the number of parts of the chip drive motor 30, and thus The structure and assembly complexity of the chip drive motor 30 are simplified.
  • the chip magnetic assembly 342 (including the chip magnetic element 3421) needs to be made of a material with magnetic permeability, and the ball support piece 3413 and the chip anti-shake conductive part 35 (including the coil
  • the conductive element 3511, the sensing element (conductive element) needs to be made of non-magnetic conductive materials. Therefore, in the insert molding process, the chip magnetic assembly 342 is the same layer of material tape, and the ball support piece 3413
  • the chip anti-shake conductive part 35 is another layer of material tape. Therefore, after it is made, the height of the magnetic element connecting part 34212 of at least one chip magnetic element 3421 of the chip magnetic assembly 342 is equal to the height of the magnetic element connecting part 34212 of the chip magnetic element 3421 .
  • the heights of the support connection portion of the ball support piece 3413 and the coil conductive connection portion 35114 of the chip anti-shake conductive portion 35 are inconsistent. That is to say, the chip anti-shake guide The coil conductive element 3511 and the ball support piece 3413 of the electrical part 35 do not have magnetic permeability, and the chip magnetic element 3421 of the magnetic assembly has magnetic permeability. The magnetic element connection part 34212 and the coil conductive connection part 35114, The support piece connecting portion 34132 has differences in the height direction set by the chip movable carrier 331 .
  • solder (such as solder) is provided on the upper conductive portion 33112 of the chip movable carrier 331 to be electrically connected to the pad on the back of the coil circuit board 3224 of the chip coil assembly 322 , the coil circuit board 3224 and the chip movable carrier 331 are bonded and fixed by providing an adhesive medium between the chip movable carrier 331 and the coil circuit board 3224; An adhesive medium is provided between the circuit boards 41 to bond and fix the chip movable carrier 331 and the circuit board 41, and then the lower conductive portion 33113 on the back of the chip movable carrier 331 and the circuit board are soldered.
  • the side surfaces of the circuit board body 411 of 41 are electrically conductive.
  • This application further provides a driving method for the chip drive motor 30:
  • 14A to 14C respectively show the current direction and force direction of each chip anti-shake coil when the chip anti-shake movable part 33 translates along the X-axis direction or the Y-axis direction and rotates around the Z-axis direction.
  • the third chip coil 732221 and the fourth chip coil 732231 are connected in series.
  • the chip movable carrier 331 is driven to translate along the -X-axis direction
  • the third chip coil 732221 passes through Clockwise current flows into the fourth chip coil 732231, and counterclockwise current flows through the fourth chip coil 732231.
  • the third chip coil 732221 and the fourth chip coil 732231 are driven by electromagnetic force, so that the chip with the photosensitive component 40
  • the movable carrier 331 moves in the -X-axis direction for compensation.
  • the arrow I represents the direction of the current
  • F represents the force of the coil.
  • the chip movable carrier 331 When the chip movable carrier 331 translates along the -X-axis direction, the magnitude of the current passing through the third chip coil 732221 and the fourth chip coil 732231 is the same. The forces are the same in magnitude and direction. On the contrary, when the third chip coil 732221 is supplied with counterclockwise current and the fourth chip coil 732231 is supplied with clockwise current, the chip movable carrier 331 with the photosensitive component 40 moves along the +X axis Directional translation to compensate.
  • the first chip coil 732211 and the second chip coil 732212 are energized separately.
  • the chip movable carrier 331 is driven to translate along the +Y-axis direction
  • the first chip coil 732211 is energized.
  • the second chip coil 732212 receives a clockwise current, and the first chip coil 732211 and the second chip coil 732212 receive electricity.
  • the magnetic force drives the chip movable carrier 331 with the photosensitive component 40 to move along the +Y-axis direction for compensation.
  • the arrow I indicates the direction of the current, and F indicates the force on the coil.
  • the chip movable carrier 331 When the chip movable carrier 331 translates along the +Y-axis direction, the magnitude of the current passing through the first chip coil 732211 and the second chip coil 732212 is the same. The forces are the same in magnitude and direction. On the contrary, when the first chip coil 732211 is supplied with a counterclockwise current and the second chip coil 732212 is supplied with a counterclockwise current, the chip movable carrier 331 with the photosensitive component 40 moves along the -Y axis. Directional translation to compensate.
  • the first chip coil 732211 and the second chip coil 732212 are energized separately.
  • the chip movable carrier 331 is driven to rotate clockwise around the Z-axis direction
  • the first chip coil 732211 is supplied with counterclockwise current
  • the second chip coil 732212 is supplied with clockwise current.
  • the first chip coil 732211 is driven by the electromagnetic force in the -Y direction
  • the second chip coil 732212 is driven by the +Y direction.
  • the electromagnetic force in the Z-axis direction causes the chip movable carrier 331 to receive a torsional force, causing the chip movable carrier 331 with the photosensitive component 40 to rotate and move clockwise around the Z-axis to compensate.
  • the arrow I indicates the direction of the current
  • F indicates the force on the coil.
  • 24 to 26 respectively show the current direction and force direction of each chip anti-shake coil when the chip anti-shake movable part 33 translates along the X-axis direction or the Y-axis direction and rotates around the Z-axis direction.
  • the third chip coil 832221 and the fourth chip coil 832231 are connected in series.
  • the third chip coil 832221 passes through Clockwise current flows into the fourth chip coil 832231, and counterclockwise current flows through the fourth chip coil 832231.
  • the third chip coil 832221 and the fourth chip coil 832231 are driven by electromagnetic force, so that the chip with the photosensitive component 40
  • the movable carrier 331 moves in the -X-axis direction for compensation.
  • the arrow I represents the direction of the current
  • F represents the force of the coil.
  • the chip movable carrier 331 When the chip movable carrier 331 translates along the -X-axis direction, the magnitude of the current passing through the third chip coil 832221 and the fourth chip coil 832231 is the same. The forces are the same in magnitude and direction. On the contrary, when the third chip coil 832221 When a counterclockwise current is supplied to the fourth chip coil 832231 and a clockwise current is supplied to the fourth chip coil 832231, the chip movable carrier 331 with the photosensitive component 40 is translated along the +X-axis direction to compensate.
  • the first chip coil 832211 and the second chip coil 832212 are energized separately.
  • the chip movable carrier 331 is driven to translate along the +Y-axis direction, the first chip coil 832211 is energized.
  • a clockwise current is supplied to the second chip coil 832212, and a clockwise current is supplied to the second chip coil 832212.
  • the first chip coil 832211 and the second chip coil 832212 are driven by electromagnetic force, so that the photosensitive component 40 is
  • the chip movable carrier 331 moves in the +Y-axis direction for compensation.
  • the arrow I indicates the direction of the current, and F indicates the force on the coil.
  • the chip movable carrier 331 When the chip movable carrier 331 translates along the +Y-axis direction, the magnitude of the current passing through the first chip coil 832211 and the second chip coil 832212 is the same. The forces are the same in magnitude and direction. On the contrary, when the first chip coil 832211 is supplied with a counterclockwise current and the second chip coil 832212 is supplied with a counterclockwise current, the chip movable carrier 331 with the photosensitive component 40 moves along the -Y axis. Directional translation to compensate.
  • the first chip coil 832211 and the second chip coil 832212 are energized separately.
  • the chip movable carrier 331 is driven to rotate clockwise around the Z-axis direction
  • the first chip coil 832211 is supplied with counterclockwise current
  • the second chip coil 832212 is supplied with clockwise current.
  • the first chip coil 832211 is driven by the electromagnetic force in the -Y direction
  • the second chip coil 832212 is driven by the +Y direction.
  • the electromagnetic force in the Z-axis direction causes the chip movable carrier 331 to receive a torsional force, causing the chip movable carrier 331 with the photosensitive component 40 to rotate and move clockwise around the Z-axis to compensate.
  • the arrow I indicates the direction of the current
  • F indicates the force on the coil.
  • the first position sensing element 361 senses obvious changes in the magnetic field and feeds back the changes in the magnetic field; when the chip anti-shake When the movable part 33 moves along the Y-axis direction and rotates around the Z-axis direction, there is no obvious change in the magnetic field sensed by the first position sensing element 361, and the second position sensing element 362 and the third position sensing element 363 sense Significant magnetic field changes.
  • the driving assembly and camera module 1 based on the embodiment of the present application have been clarified, wherein the camera module 1 enables different magnetic elements to play a role by rationally arranging the magnetic elements in the driving assembly. Different functions; and the photosensitive component 40 of the camera module 1 is arranged in an eccentric manner relative to the center of the driving component, so that one side of the photosensitive chip 42 of the photosensitive component 40 is closer to the edge of the mobile electronic device, so as to Meet the form and function requirements of mobile electronic devices.
  • the present application further provides a dual-camera module using the aforementioned photosensitive chip.
  • the dual-camera module includes two single-camera modules arranged side by side (No. A camera module 1A, a second camera module 1B).
  • the specific structure and function of at least one of the first camera module 1A and the second camera module 1B is the same as the specific structure and function of the camera module shown in FIGS. 2 to 14C and 17 to 25. Functionality is consistent.
  • the specific structures and functions of the first camera module 1A and the second camera module 1B are the same as those shown in FIGS. 2 to 14C and 17 to 25 The specific structure and function are consistent.
  • the first camera module 1A includes a first optical lens 10A, a first photosensitive component 40A and a first driving component
  • the second camera module 1B includes a second optical lens 10B, a second photosensitive component 40B and A second driving component, wherein the first optical lens 10A and the second optical lens 10B are respectively held on the photosensitive paths of the first photosensitive component 40A and the second photosensitive component 40B, and the first
  • the first driving component of the camera module 1A is used to drive the first photosensitive component 40A and/or the first optical lens 10A to move to achieve optical performance adjustment
  • the second driving component of the second camera module 1A is used to drive the movement of the first photosensitive component 40A and/or the first optical lens 10A.
  • first photosensitive component 40B and/or the second optical lens 10B Driving the first photosensitive component 40B and/or the second optical lens 10B to move to achieve optical performance adjustment, such as optical anti-shake, optical focusing, etc.
  • optical performance adjustment such as optical anti-shake, optical focusing, etc.
  • the first camera module 1A and the second camera module 1B of the dual-camera module are connected to each other through a bracket (not shown).
  • the first optical lens 10A includes a first lens barrel 11A and a first lens group 12A installed in the first lens barrel 11A.
  • the first lens group 12A includes at least one optical lens.
  • the second optical lens 10B includes a second lens barrel 11B and a second lens group 12B installed in the second lens barrel 11B.
  • the second lens group 12B includes at least one optical lens.
  • the number of the optical lenses can be One or more, not limited.
  • the first driving component includes a chip driving motor 30A
  • the second driving component includes a chip driving motor 30B
  • the first chip driving motor 30A and the second chip driving motor 30B They are respectively adapted to drive the first photosensitive component 40A and the second photosensitive component 40B to translate and/or rotate, thereby realizing the chip anti-shake function of the first camera module 1A and the second camera module 1B.
  • the first chip driving motor 30A includes a first chip anti-shake fixed part 31A, a first chip anti-shake movable part 33A, a first chip driving element 32A, and a first chip driving conductive part (ie, the first chip anti-shake Conductive part 35A)
  • the second chip driving motor 30B includes a second chip anti-shake fixed part 31B, a second chip anti-shake movable part 33B, a second chip driving element 32B, and a second chip driving conductive part (i.e., The second chip anti-shake conductive part 35B).
  • the first chip anti-shake fixed part 31A has a receiving cavity to accommodate the first chip anti-shake movable part 33A, the first chip driving element 32A and the first chip anti-shake conductive part 35A.
  • the second chip anti-shake fixed part 31B has a receiving cavity to accommodate the second chip anti-shake movable part 33B, the second chip driving element 32B and the second chip anti-shake conductive part 35B.
  • the first chip anti-shake conductive part 35A and the second chip anti-shake conductive part 35B respectively provide current for the first chip driving element 32A and the second chip driving element 32B.
  • the first chip driving element 32A is used to drive the first chip anti-shake movable part 33A to move relative to the first chip anti-shake fixed part 31A
  • the second chip driving element 32B is used to drive the second chip anti-shake movable part 33B. Move relative to the second chip anti-shake fixing part 31B.
  • the first photosensitive component 40A and the second photosensitive component 40B are respectively fixed to the first chip anti-shake movable part 33A and the second chip anti-shake movable part 33B, so that the first chip anti-shake movable part 33B
  • the shake movable part 33A and the second chip anti-shake movable part 33B respectively drive the first photosensitive component 40A and the second photosensitive component 40B relative to the first chip anti-shake fixed part 31A and the second
  • the chip anti-shake fixing part 31B moves.
  • the first driving component of the first camera module 1A further includes a first lens driving motor 20A
  • the second driving component of the second camera module 1B further includes a second lens driving motor 20B.
  • the first lens driving motor 20A is adapted to drive the first optical lens 10A to translate and/or rotate
  • the second lens drive motor 20B is adapted to drive the second optical lens 10B to translate and/or rotate, thereby achieving
  • the first camera module 1A and the second camera module 1B have lens focusing, lens anti-shake and other functions.
  • the first lens driving motor 20A includes a first lens driving fixed part, a first lens driving movable part, a first lens driving element and a first lens driving conductive part.
  • the first lens driving fixed part has a receiving cavity to Accommodating the first lens driving movable part, the first lens driving element and the first lens driving conductive part, the first lens driving conductive part provides driving power for the first lens driving element, the first lens driving element is The lens driving element is used to drive the first lens driving movable part to move relative to the first lens driving fixed part.
  • the second lens drive motor 20B It includes a second lens driving fixed part, a second lens driving movable part, a second lens driving element and a second lens driving conductive part, and the second lens driving fixed part has a receiving cavity to accommodate the second lens driving movable part.
  • the moving part, the second lens driving element and the second lens driving conductive part, the second lens driving conductive part provides driving power for the second lens driving element, the second lens driving element is used to drive the The second lens driving movable part moves relative to the second lens driving fixed part.
  • the first optical lens 10A and the second optical lens 10B are respectively fixed to the first lens driving movable part and the second lens driving movable part, so that the first lens driving element drives the first lens driving element.
  • the optical lens 10A moves relative to the first lens driving fixing part
  • the second lens driving element drives the second optical lens 10B to move relative to the second lens driving fixing part, for example, driving the first optical lens 10A and the second optical lens 10B move along its optical axis to achieve the lens focusing function; or drive the first optical lens 10A and the second optical lens 10B to translate in a direction perpendicular to its optical axis or drive the first optical lens 10A , the second optical lens 10B rotates around a direction perpendicular to its optical axis to achieve the lens anti-shake function.
  • the first lens driving motor 20A fixes the first lens driving fixing part to the chip anti-shake fixing part 31A of the first chip driving motor 30A, so that the first optical lens 10A is disposed on the first On the photosensitive path of the photosensitive component 40A.
  • the second lens driving motor 20B fixes the second lens driving fixing part to the chip anti-shake fixing part 31B of the second chip driving motor 30B, so that the second optical lens 10B is disposed on the second On the photosensitive path of the photosensitive component 40B.
  • the first lens driving motor 20A and/or the second lens driving motor 20B are not provided in the multi-camera module, and the first optical lens 10A and/or the second optical lens 10B Directly installed on the first chip anti-shake fixing part 31A of the first chip drive motor 30A and/or the second chip anti-shake fixing part 31B of the second chip drive motor 30B, or the first optical lens 10A And/or the second optical lens 10B is indirectly mounted to the first chip anti-shake fixing part 31A of the first chip drive motor 30A and/or the second chip anti-shake fixing part of the second chip drive motor 30B through a support member. 31B, so that the first optical lens 10A is disposed on the photosensitive path of the first photosensitive component 40A, and the second optical lens 10B is disposed on the photosensitive path of the second photosensitive component 40B.
  • the first photosensitive component 40A includes a first circuit board 41A, a first photosensitive chip 42A electrically connected to the first circuit board 41A, and a first electronic component 43A.
  • the second photosensitive component 40B includes a second circuit board 41B. , the second photosensitive chip 42B and the second photosensitive chip 42B that are electrically connected to the second circuit board 41B.
  • the first photosensitive chip 42A is used to receive the external light collected by the first optical lens 10A for imaging and is electrically connected to an external mobile electronic device through the first circuit board 41A.
  • the second photosensitive chip 42B is used to receive the external light.
  • the external light collected by the second optical lens 10B is imaged and electrically connected to an external mobile electronic device through the second circuit board 41B.
  • the first electronic component 43A and the second electronic component 43B may be one of passive electronic components such as resistors and capacitors, and active electronic components such as driver chips and memory chips, or Various, the first electronic component 43A and the second electronic component 43B can be electrically connected to the front surfaces of the first circuit board 41A and the second circuit board 41B, or can be electrically connected to the first circuit.
  • the back surfaces of the board 41A and the second circuit board 41B are determined according to the design requirements of the first camera module 1A and the second camera module 1B.
  • the first photosensitive chip 42A is directly or indirectly fixed to the first circuit board 41A.
  • the first photosensitive chip 42A includes a photosensitive area and a non-photosensitive area.
  • the first photosensitive chip 42A is located in the non-photosensitive area.
  • the chip pad is electrically connected to the first circuit board 41A.
  • the first photosensitive chip 42A can be wire bonded (gold wire), soldered, FC process (chip flip chip) or RDL (redistribution layer). Technology) or other means are electrically connected to the first circuit board 41A.
  • the second photosensitive chip 42B is directly or indirectly fixed to the second circuit board 41B.
  • the second photosensitive chip 42B includes a photosensitive area and a non-photosensitive area.
  • the second photosensitive chip 42B is located in the non-photosensitive area.
  • the chip pad is electrically connected to the second circuit board 41B.
  • the second photosensitive chip 42B can be wire bonded (gold wire), soldered, FC process (chip flip chip) or RDL (redistribution layer). Technology) or other means are electrically connected to the second circuit board 41B.
  • the first circuit board 41A includes a circuit board main body 411A and a connecting strap 412A
  • the second circuit board 41B includes a circuit board main body 411B and a connecting strap 412B.
  • the connecting strip 412A of the first circuit board 41A is connected to and electrically conducts the circuit board main body 411A, thereby transmitting the imaging information acquired by the first photosensitive chip 42A to the outside through the circuit board main body 411A and the connecting strip 412A.
  • Mobile electronic device transmission is
  • the connecting strip 412B of the second circuit board 41B is connected to and electrically conducts the circuit board main body 411B, so that the imaging information acquired by the second photosensitive chip 42B is transmitted to the outside through the circuit board main body 411B and the connecting strip 412B. Mobile electronic device transmission.
  • the connecting strap 412A of the first circuit board 41A includes a first connecting strap 4121A and a second connecting strap 4122A.
  • the first connecting strap 4121A and the second connecting strap 4122A are respectively Extend outward from opposite sides of the circuit board body 411A, and Further bend upward and sideways to electrically connect the first connection strap 4121 and the second connection strap 4122A. This arrangement can keep the circuit board body 411A stable during movement. Further reduce the resistance when driving the first circuit board 41A to move.
  • the connection strap 412B of the second circuit board 41B includes a first connection strap 4121B and a second connection strap 4122B.
  • the first connection strap 4121B and the second connection strap 4122B are respectively Extend outward from the opposite sides of the circuit board body 411B, and further bend upward and sideward, so that the first connection strap 4121 and the second connection strap 4122B are electrically connected.
  • the arrangement can make the circuit board main body 411B remain stable during movement, further reducing the resistance when driving the second circuit board 41B to move.
  • the first connection strap 4121A and the second connection strap 4122A of the first circuit board 41A may extend outward from adjacent two sides of the circuit board main body 411A. and bent upward.
  • the first connecting strap 4121B and the second connecting strap 4122B of the second circuit board 41B can extend outward from adjacent two sides of the circuit board main body 411B and be bent upward. This application There are no restrictions on this.
  • the first photosensitive component 40A further includes a first filter element 44A.
  • the first filter element 44A is held on the photosensitive path of the first photosensitive chip 42A, and is used to filter the light entering the first photosensitive chip 42A.
  • the imaging light is filtered.
  • the second photosensitive component 40B further includes a second filter element 44B.
  • the second filter element 44B is held on the photosensitive path of the second photosensitive chip 42B and is used to filter the light entering the second photosensitive chip 42B.
  • the imaging light is filtered.
  • the first filter element 44A is installed and fixed on the first base 45A of the first photosensitive component 40A and corresponds to at least part of the photosensitive area of the first photosensitive chip 42A.
  • a filter element 44A can be attached directly or invertedly to the first base 45A.
  • the first base 45A has a light hole, so that the light from the first optical lens 10A can pass through the first base 45A.
  • the light hole enters the first photosensitive chip 42A.
  • the second filter element 44B is installed and fixed on the second base 45B of the second photosensitive component 40B and corresponds to at least part of the photosensitive area of the second photosensitive chip 42B.
  • the second filter element 44B can be The second base 45B has a light hole, so that the light from the second optical lens 10B can pass through the light hole of the second base 45B and enter the second base 45B. Two photosensitive chips 42B.
  • the first photosensitive component 40A can be fixed to the first chip driving motor 30A through the first circuit board 41A (the first circuit board body 411A) or the first base 45A.
  • a chip anti-shake movable part 33A so that the first photosensitive component 40A moves with the movement of the first chip anti-shake movable part 33A.
  • the second photosensitive component 40B can be fixed to the second chip anti-shake movable part of the second chip drive motor 30B through the second circuit board body 411B or the second base 45B of the second circuit board 41B. part 33B, so that the second photosensitive component 40B moves with the movement of the second chip anti-shake movable part 33B.
  • the first photosensitive chip 42A and the second photosensitive chip 42B are respectively in the two single-camera camera modules of the dual-camera module (the first camera module 1A and the second camera module 1A).
  • the camera module 1B) is eccentrically arranged, that is, the central axis of the first photosensitive chip 42A is inconsistent with the central axis of the first chip driving motor 30A, and the central axis of the second photosensitive chip 42B is inconsistent with the central axis of the second photosensitive chip 42B.
  • the central axes of the second chip drive motor 30B are inconsistent.
  • the side with the shortest distance from the first photosensitive chip 42A to the first chip movable carrier 331A and the side with the shortest distance from the second photosensitive chip 42B to the second chip movable carrier 331B are close to each other. , that is, the side of the photosensitive chip 42A close to the movable chip carrier 331A and the side of the photosensitive chip 42B close to the movable chip carrier 331B are adjacently arranged, and then the first optical lens 10A It is arranged closer to the second optical lens 10B to enhance the optical performance of the dual-camera module.
  • the first chip driving element 32A is disposed between the first chip anti-shake movable part 33A and the first chip anti-shake fixed part 31A, and the first chip anti-shake conductive part 35A is electrically connected to the first chip anti-shake movable part 33A.
  • the first chip driving element 32A and the first photosensitive component 40A are provided with driving power for the first chip driving element 32A to drive the first chip anti-shake movable portion 33A in the X-axis direction (i.e., X axis) and Y-axis direction (i.e., the direction set by the Y-axis) and/or rotate around the Z-axis direction (i.e., the direction set by the Z-axis) to achieve the first Translational anti-shake and/or rotational anti-shake of the photosensitive component 40A.
  • the second chip driving element 32B is disposed between the second chip anti-shake movable part 33B and the second chip anti-shake fixed part 31B, and the second chip anti-shake conductive part 35B is electrically connected to each other.
  • the second chip driving element 32B and the second photosensitive component 40B are provided with driving power for the second chip driving element 32B to drive the second chip anti-shake movable portion 33B in the X-axis direction (i.e., X axis) and Y-axis direction (i.e., the direction set by the Y-axis) and/or rotate around the Z-axis direction (i.e., the direction set by the Z-axis) to realize the second Translational anti-shake and/or rotational anti-shake of the photosensitive component 40B.
  • the X-axis direction and the Y-axis direction are perpendicular to each other
  • the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction are located
  • the Z-axis direction is also the first optical axis direction.
  • the directions of the optical axes of the lens 10A and the second optical lens 10B, in other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system.
  • the XOY plane where the X-axis direction and the Y-axis direction are located is also called the horizontal direction. flat.
  • the first chip anti-shake fixing part 31A includes an upper cover 311A and a base 312A that are interlocked to form the receiving cavity
  • the second chip anti-shake fixing part 31B includes an interlocking
  • the upper cover 311B and the base 312B are combined to form the receiving cavity.
  • the upper cover 311A and the base 312A are fixed to each other and form a receiving cavity (ie, the receiving cavity of the first chip anti-shake fixed part 31A) to accommodate the first chip anti-shake movable part 33A and the second chip anti-shake movable part 33A.
  • a chip driving element 32A, the first chip anti-shake conductive part 35A and the first photosensitive component 40A and other camera module components, the upper cover 311B and the base 312B are fixed to each other and form a receiving cavity (ie, the The receiving cavity of the second chip anti-shake fixed part 31B) accommodates the second chip anti-shake movable part 33B, the second chip driving element 32B, the second chip anti-shake conductive part 35B and the second chip anti-shake movable part 33B.
  • the two photosensitive components 40B and other camera module components can not only protect the above-mentioned camera module components, but also reduce dust, dirt or stray light from entering the inside of the first chip drive motor 30A and the second chip drive motor 30B.
  • the materials of the upper covers 311A and 311B and the bases 312A and 312B may be metal materials such as non-magnetic stainless steel.
  • the upper cover 311A of the first chip anti-shake fixing part 31A is disposed above the base 312A
  • the upper cover 311B of the second chip anti-shake fixing part 31B is disposed above the base 312A. above the base 312B.
  • the upper cover 311A of the first chip anti-shake fixing part 31A includes a cover body 3111A with an opening in the center. The opening corresponds to the first photosensitive component 40A, so that light can enter the first photosensitive component 40A through the opening. Photosensitive component 40A for imaging.
  • the upper cover 311B of the second chip anti-shake fixing part 31B includes a cover body 3111B with an opening in the center.
  • the opening corresponds to the second photosensitive component 40B, so that light can enter the second photosensitive component 40B through the opening.
  • the opening is circular in shape.
  • the upper cover 311A of the first chip anti-shake fixing part 31A may also include a cover peripheral side 3112A integrally extending from the cover main body 3111A toward the base 312A direction, so that the cover peripheral side 3112A is fixedly connected to the base 312A.
  • the upper cover 311B of the second chip anti-shake fixing part 31B may also include a cover peripheral side 3112B extending integrally from the cover body 3111B toward the base 312B direction, so as to pass through
  • the cover peripheral side 3112B is fixedly connected to the base 312B, for example, by laser welding or adhesive medium bonding to fix the cover peripheral sides 3112A, 3112B and the base 312A, 312B.
  • the first chip anti-shake fixing part 31A The cover body peripheral side 3112A also includes at least a peripheral side recess 31121A.
  • connection strap 412A outlet is formed between the upper cover 311A and the base 312A to allow the connection strap 412A of the first circuit board 41A to pass from The first chip anti-shake fixing part 31A protrudes outward from the receiving cavity.
  • the cover circumference 3112B of the second chip anti-shake fixing part 31B also includes at least a circumferential recess 31121B.
  • at least one connection belt 412B outlet is formed between the upper cover 311B and the base 312B to allow the The connecting strap 412B of the second circuit board 41B extends outward from the receiving cavity of the second chip anti-shake fixing part 31B.
  • the circumferential side 3112A of the cover body of the first chip anti-shake fixing part 31A includes two circumferential recesses 31121A arranged oppositely, and two circumferential side recesses 31121A are formed between the upper cover 311A and the base 312A.
  • a connection strap 412A has an outlet to allow the first connection strap 4121A and the second connection strap 4122A of the first circuit board 41A to protrude outward from the accommodation cavity of the first chip anti-shake fixing part 31A.
  • the cover peripheral side 3112B of the second chip anti-shake fixing part 31B includes two opposite peripheral recesses 31121B, and two connecting belt 412B exits are formed between the upper cover 311B and the base 312B to allow all The first connection strap 4121B and the second connection strap 4122B of the second circuit board 41B extend outward from the accommodation cavity of the second chip anti-shake fixing part 31B.
  • the first chip anti-shake movable part 33A is movably received in the receiving cavity of the first chip anti-shake fixed part 31A
  • the second chip anti-shake movable part 33B It is movably received in the receiving cavity of the second chip anti-shake fixing part 31B.
  • the first chip anti-shake movable part 33A is suspended in the receiving cavity of the first chip anti-shake fixed part 31A, so that the first chip anti-shake movable part 33A can be positioned relative to the first chip anti-shake fixed part 31A.
  • the first chip anti-shake fixing part 31A is movable, and the second chip anti-shake movable part 33B is suspended in the receiving cavity of the second chip anti-shake fixing part 31B, so that the second chip The anti-shake movable part 33B is movable relative to the second chip anti-shake fixed part 31B.
  • the first chip anti-shake movable part 33A includes a chip movable carrier 331A having opposite upper and lower surfaces.
  • the first chip driving element 32A is disposed between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A.
  • the first chip driving element 32A drives the chip to move The carrier 331A moves relative to the first chip anti-shake fixing part 31A.
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A is suitable for mounting the first photosensitive component 40A thereon, that is, the first photosensitive component 40A is suitable for being installed on the first chip anti-shake
  • the chip movable carrier 331A of the movable part 33A is suitable for mounting the first photosensitive component 40A thereon, that is, the first photosensitive component 40A is suitable for being installed on the first chip anti-shake
  • the chip movable carrier 331A of the movable part 33A is suitable for mounting the first photosensitive component 40A thereon,
  • the first chip anti-shake movable part 33A is provided between the chip movable carrier 331A and the base 312A.
  • a photosensitive component 40A, the first photosensitive component 40A is installed on the chip movable carrier 331A of the first chip anti-shake movable part 33A through the first circuit board 41A, and then the first photosensitive component 40A follows The chip movable carrier 331A moves along the first chip anti-shake movable part 33A.
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A and the base 312A there is a gap between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the base 312A, and the bottom surface of the first photosensitive component 40A (ie, the first photosensitive
  • the first photosensitive component 40A there is also a certain air gap between the side of the component 40A (close to the base 312A) and the base 312A.
  • the driving force requirement of a chip driving element 32A in other words, the first photosensitive component 40A is suspended above the base 312A of the first chip anti-shake movable part 33A.
  • the second chip anti-shake movable part 33B includes a chip movable carrier 331B having opposite upper and lower surfaces.
  • the second chip driving element 32B is disposed between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the upper cover 311B.
  • the second chip driving element 32B drives the chip to move The carrier 331B moves relative to the second chip anti-shake fixing part 31B.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B is suitable for mounting the second photosensitive component 40B thereon, that is, the second photosensitive component 40B is suitable for being installed on the second chip anti-shake
  • the chip movable carrier 331B of the movable part 33B is suitable for mounting the second photosensitive component 40B thereon, that is, the second photosensitive component 40B is suitable for being installed on the second chip anti-shake
  • the chip movable carrier 331B of the movable part 33B is suitable for mounting the second photosensitive component 40B thereon,
  • the second photosensitive component 40B is disposed between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the base 312B.
  • the second photosensitive component 40B The second circuit board 41B is mounted on the chip movable carrier 331B of the second chip anti-shake movable part 33B, and then the second photosensitive component 40B follows the second chip anti-shake movable part 33B.
  • the chip movable carrier 331B moves.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B and the base 312B there is a gap between the chip movable carrier 331B of the second chip anti-shake movable part 33B and the base 312B, and the bottom surface of the second photosensitive component 40B (ie, the second photosensitive There is also a certain air gap between the component 40B (the side close to the base 312B) and the base 312B. In this way, the movement of the second photosensitive component 40B is not easily hindered by the base 312B, which reduces the The driving force requirement of the two-chip driving element 32B, in other words, the second photosensitive component 40B is suspended above the base 312B of the second chip anti-shake movable part 33B.
  • the dual-camera module at least one side (for example, the first side) of the driving component (ie, the first driving component) of the first camera module 1A is not provided with a first Chip driving element 32A, the second chip driving element 32B is not provided on at least one side (for example, the second side) of the driving component (ie, the second driving component) of the second camera module 1B, wherein the first The side of the driving assembly of the camera module 1A that is not provided with the chip driving element 32A (for example, the first side) adjacent to the side (for example, the second side) on which the chip driving element 32B is not provided in the driving assembly of the second camera module 1B.
  • the first chip driving element 32A is not provided on the first side of the first chip driving motor 30A (ie, the first side of the driving assembly of the first camera module 1A), and the second chip driving motor The second side of 30B (that is, the second side of the driving assembly of the second camera module 1B) is not provided with the second chip driving element 32B.
  • the second side of the chip drive motor 30B is adjacent because the first chip drive does not need to be provided on the first side of the first chip drive motor 30A and the second side of the second chip drive motor 30B that are adjacent to each other.
  • the component 32A and the second chip drive component 32B, the first photosensitive chip 42A and the second photosensitive chip 40B are on the first side of the first chip drive motor 30A and the second chip drive motor 30B.
  • the second side has a larger placement space, which allows the first photosensitive chip 42A to be closer to the first side of the first chip driving motor 30A where the first chip driving element 32A is not located, so The second photosensitive chip 40B can be closer to the side of the second side of the second chip driving motor 30B where the second chip driving element 32B is not provided, thereby reaching the first photosensitive chip 42A and the second The effect of the eccentric setting of the photosensitive chip 40B.
  • the first side of 30A without the first chip driving element 32A and the second side of the second chip driving motor 30Bd are arranged close to each other.
  • This arrangement makes the first camera module of the dual-camera module set There are no chip driving components (ie, the first chip driving component 32A and the second chip driving component 32B) adjacent to the group 1A and the second camera module 1B to avoid the influence of magnetic interference.
  • the first photosensitive component 40A has a first central axis
  • the first driving component has a second central axis
  • the first central axis is offset from the second central axis.
  • the central axis of the first photosensitive chip 42A of the first photosensitive component 40A is the first central axis of the first photosensitive component 40A
  • the central axis of the first chip driving motor 30A is the first driving motor.
  • the first photosensitive chip 42A is arranged eccentrically relative to the center of the first driving component, that is, the photosensitive chip 42A of the first photosensitive component 40A is driven by the first chip.
  • the motor 30A is set in an eccentric state, and the central axis of the first photosensitive chip 42A of the first photosensitive component 40A is set in an eccentric state, that is, the first photosensitive chip
  • the central axis of 42A is inconsistent with the central axis of the first chip drive motor 30A.
  • the central axis of the first photosensitive chip 42A is an axis that passes through the intersection of the diagonals of the first photosensitive chip 42A and is parallel to the Z-axis direction when viewed from above; the central axis of the first chip driving motor 30A is an axis that is parallel to the Z-axis direction when viewed from above) is an axis that passes through the intersection of the diagonals of the first chip drive motor 30A and is parallel to the Z-axis direction).
  • the second photosensitive component 40B has a first central axis
  • the second driving component has a second central axis
  • the first central axis is offset from the second central axis.
  • the central axis of the second photosensitive chip 42B of the second photosensitive component 40B is the first central axis of the second photosensitive component 40B
  • the central axis of the second chip driving motor 30B is the second driving motor.
  • the second central axis of the component, the second photosensitive chip 42B is arranged eccentrically relative to the center of the second driving component, that is, the photosensitive chip 42B of the second photosensitive component 40B is driven by the second chip.
  • the motor 30B is set in an eccentric state, and the central axis of the second photosensitive chip 42B of the second photosensitive component 40B is set in an eccentric state. That is, the central axis of the second photosensitive chip 42B is in contact with the second chip driving motor 30B.
  • the central axis is inconsistent.
  • the central axis of the second photosensitive chip 42B is an axis that passes through the intersection of the diagonals of the second photosensitive chip 42B and is parallel to the Z-axis direction when viewed from above;
  • the central axis of the second chip driving motor 30B is an axis that is parallel to the Z-axis direction when viewed from above
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A includes a fixed chip carrier body 3311A and a chip carrier side part 3312B.
  • the first circuit board 41A is fixed to the bottom surface (that is, toward the base 312A side) of the chip carrier body 3311A of the first chip anti-shake movable part 33A.
  • the first chip anti-shake movable part 33A The chip carrier body 3311A has a carrier body through hole 33111A, 33111B.
  • the carrier body through hole 33111A is not only suitable for providing a light path for the first photosensitive chip 42A of the first photosensitive component 40A, but also can provide the first photosensitive chip 42A.
  • the installation space of the first electronic component 43A on the photosensitive assembly 40A prevents the first electronic component 43A and the first chip carrier body 3311A from interfering with each other.
  • the chip carrier side portion 3312A of the first chip anti-shake movable portion 33A includes a first carrier side portion 33121A, a second carrier side portion 33122A, and a third carrier side portion integrally extending outward from the chip carrier body 3311A. 33123A and fourth carrier side 33124.
  • the first carrier side part 33121A of the first chip anti-shake movable part 33A is arranged opposite to the third carrier side part 33123A and is connected with the second carrier side parts 33122A, 33122B and the fourth carrier side part 33124A.
  • the four-carrier side part 33124A is suitable as an anti-collision component when the chip carrier body 3311A is moving, to prevent the chip carrier body 3311A of the first chip anti-shake movable part 33A from directly contacting the first chip anti-shake fixed part 31A. collide with each other.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B includes a fixed chip carrier body 3311B and a chip carrier side part 3312B.
  • the second circuit board 41B is fixed to the bottom surface (that is, toward the base 312B side) of the chip carrier body 3311B of the second chip anti-shake movable part 33B.
  • the second chip anti-shake movable part 33B The chip carrier body 3311B has a carrier body through hole 33111B, 33111B.
  • the carrier body through hole 33111B is not only suitable for providing a light path for the second photosensitive chip 42B of the second photosensitive component 40B, but also can provide the second photosensitive chip 42B.
  • the installation space for the second electronic component 43B on the photosensitive component 40B prevents the second electronic component 43B and the second chip carrier body 3311B from interfering with each other.
  • the chip carrier side portion 3312B of the second chip anti-shake movable portion 33B includes a first carrier side portion 33121B, a second carrier side portion 33122B, and a third carrier side portion integrally extending outward from the chip carrier body 3311B. 33123B and fourth carrier side 33124.
  • the second carrier side portion 33121B of the first chip anti-shake movable portion 33B is opposite to the third carrier side portion 33123B and adjacent to the second carrier side portion 33122B and the fourth carrier side portion 33124B.
  • the second carrier side portion 33122B and the fourth carrier side portion 33124B are arranged opposite to each other.
  • the first carrier side part 33121B, the second carrier side part 33122B, the third carrier side part 33123B and the fourth carrier side part 33124B are suitable as anti-collision parts when the chip carrier main body 3311B moves. , to prevent the chip carrier body 3311B of the second chip anti-shake movable part 33B from directly colliding with the second chip anti-shake fixed part 31B.
  • the chip carrier side portion 3312A (the first carrier side portion 33121A, the second carrier side portion 33122A, the third carrier side portion 33123A and the fourth carrier side portion 33123A) of the first chip anti-shake movable portion 33A
  • the carrier side portion 33124A further extends toward the side of the chip carrier body 3311A, that is, the chip carrier side portion 3312A further extends outward from the outer peripheral edge of the chip carrier body 3311A, and the chip carrier side portion 3312A protrudes from
  • the side wall of the chip carrier body 3311A causes the first chip anti-shake movable part 33A to collide with the first chip anti-shake fixed part 31A through the chip carrier side part 3312A during movement, thus preventing the installation of The chip carrier body 3311A of the first photosensitive component 40A directly collides with the first chip anti-shake fixing part 31A, thereby causing damage to the first photosensitive component 40A.
  • the chip carrier side part 3312B (the first carrier side part 33121B, the second carrier side part 33122B, the third carrier side part 3312B) of the second chip anti-shake movable part 33B 33123B and the fourth carrier side 33124B) further extend toward the side of the chip carrier main body 3311B, that is, the chip carrier side 3312B further extends outward from the outer peripheral edge of the chip carrier main body 3311B, and the chip carrier side
  • the part 3312B protrudes from the side wall of the chip carrier body 3311B, so that the second chip anti-shake movable part 33B collides with the second chip anti-shake fixed part 31B through the chip carrier side part 3312B during movement. , thereby avoiding direct collision between the chip carrier body 3311B on which the second photosensitive component 40B is disposed and the second chip anti-shake fixing portion 31B, thereby causing damage to the second photosensitive component 40B.
  • the first photosensitive chip 42A is eccentrically arranged in the chip movable carrier 331A, from the center O A of the first photosensitive chip 42A to the chip movable carrier 331 of the first chip anti-shake movable part 33A.
  • the distance between two opposite sides is not equal.
  • the first photosensitive chip 42A is closer to at least one side of the chip movable carrier 331A of the first chip anti-shake movable portion 33A, that is, the first photosensitive chip 42A is closer to the second photosensitive chip 42A.
  • a chip drives at least one side of the motor 30A.
  • the first photosensitive chip 42A of the first photosensitive component 40A has an outer shape of a rectangular structure including long sides and wide sides.
  • the outer shape edge of the first photosensitive component 40A can be defined with a first The first side, the second side, the third side and the fourth side take the intersection of the diagonal lines of the first photosensitive chip 42A as the central origin to establish a rectangular coordinate system.
  • the first side and the third side are parallel to the X-axis direction.
  • the second side and the fourth side are parallel to the Y-axis direction.
  • the first chip anti-shake movable part 33A and the chip movable carrier 331A also have a first side, a second side, a third side and a fourth side corresponding to the first photosensitive component 40A.
  • the second photosensitive chip 42B is eccentrically arranged in the chip movable carrier 331B, from the center O B of the second photosensitive chip 42B to the chip movable carrier 331 of the second chip anti-shake movable part 33B.
  • the distance between two opposite sides is not equal. It can also be said that the second photosensitive chip 42B is closer to at least one side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, that is, the second photosensitive chip 42B is closer to the second photosensitive chip 42B.
  • the two chips drive at least one side of the motor 30B.
  • the second photosensitive chip 42B of the second photosensitive component 40B has an outer shape of a rectangular structure including long sides and wide sides.
  • the outer shape edge of the second photosensitive component 40B can be defined with a first
  • the first side, the second side, the third side and the fourth side take the intersection of the diagonal lines of the second photosensitive chip 42B as the central origin to establish a rectangular coordinate system.
  • the first side and the third side are parallel to the X-axis direction.
  • the second side and the fourth side are parallel to the Y-axis direction.
  • the second chip anti-shake movable part 33B and the chip movable carrier 331B also have a first side, a second side, a third side and a fourth side corresponding to the second photosensitive component 40B.
  • the side of the first camera module 1A adjacent to the third side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is the first side of the first camera module 1A, adjacent to The side of the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is the second side of the first camera module 1A, adjacent to the first chip anti-shake movable part 33A.
  • the fourth side of the chip movable carrier 331A of the first chip anti-shake movable portion 33A is the third side of the first camera module 1A, and the third side of the chip movable carrier 331A is adjacent to the first chip anti-shake movable portion 33A.
  • One side of the two sides is the fourth side of the first camera module 1A.
  • the side of the second camera module 1B adjacent to the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B is the first side of the second camera module 1B, adjacent to
  • the side of the third side of the chip movable carrier 331B of the second chip anti-shake movable part 33B is the second side of the first camera module 1B, adjacent to the second chip anti-shake movable part 33B.
  • the second side of the chip movable carrier 331B of the part 33B is the third side of the first camera module 1B, and the third side of the chip movable carrier 331B is adjacent to the second chip anti-shake movable part 33B.
  • One of the four sides is the fourth side of the second camera module 1B.
  • the distance from the center OA of the first photosensitive chip 42A to the first side of the movable chip carrier 331A is H1 A
  • the distance from the center OA of the first photosensitive chip 42A to the first side of the movable chip carrier 331A is H1 A
  • the distance between the three sides is H2 A , H1 A > H2 A , that is, the distance between the first central axis of the first photosensitive chip 42A and the third side of the chip movable carrier 331A is smaller than the first photosensitive chip 42A.
  • the distance between the first central axis of the chip 42A and the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A, the first photosensitive chip 42A is closer to the first chip anti-shake movable part 33A
  • the third side of the chip movable carrier 331A of the shake movable part 33A is far away from the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the distance from the center OB of the second photosensitive chip 42B to the first side of the movable chip carrier 331B is H1 B
  • the distance from the center OB of the second photosensitive chip 42B to the first side of the movable chip carrier 331B is H1 B .
  • the distance between the three sides is H2 B , H1 B > H2 B , that is, the distance between the first central axis of the second photosensitive chip 42B and the third side of the chip movable carrier 331B is smaller than the distance between the first central axis of the second photosensitive chip 42B and the third side of the movable chip carrier 331B.
  • the distance between the first central axis of the chip 42B and the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, the second photosensitive chip 42B is closer to the second chip anti-shake movable part 33B
  • the third side of the chip movable carrier 331B of the shake movable part 33B is far away from the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the range of H1 A and H1 B is: 6mm-8mm, and the range of H2 A and H2 B is: 3mm-4mm.
  • H1 A and H1 B are 7.14mm
  • H2 A and H2 B are 3.74mm. .
  • the third side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is in contact with the second chip anti-shake
  • the third side of the chip movable carrier 331B of the movable part 33B is adjacent to the first side of the chip movable carrier 331A of the first chip anti-shake movable part 33A and the second chip anti-shake movable part 33B.
  • the first sides of the chip movable carrier 331B are away from each other, as shown in Figures 15 and 16.
  • H1 A ⁇ H2 A and H1 B ⁇ H2 B may also be satisfied, that is, the first photosensitive chip 42A is closer to the chip of the first chip anti-shake movable part 33A.
  • the third side of the movable carrier 331A is far away from the first side of the chip movable carrier 331A, and the second photosensitive chip 42B is closer to the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the third side is far away from the first side of the chip movable carrier 331B, and this application does not limit this.
  • the distance from the center O A of the first photosensitive chip 42A to the second side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is H3 A .
  • the center O A of the first photosensitive chip 42A The distance to the fourth side of the chip movable carrier 331A of the first chip anti-shake movable part 33A is H4 A .
  • the H3 A may be equal to H4 A .
  • the H3 A may be smaller than H4 A .
  • the H3 A It can also be larger than H4 A. That is to say, the first photosensitive chip 42A only needs to be closer to at least one side of the chip movable carrier 331A of the first chip anti-shake movable part 33A, which is not limited in this application.
  • the distance from the center O B of the second photosensitive chip 42B to the second side of the chip movable carrier 331B of the second chip anti-shake movable part 33B is H3 B .
  • the center O B of the second photosensitive chip 42B The distance to the fourth side of the chip movable carrier 331B of the second chip anti-shake movable part 33B is H4 B , the H3 B may be equal to H4 B , the H3 B may be smaller than H4 B , the H3 B It can also be larger than H4 B. That is to say, the second photosensitive chip 42B only needs to be closer to at least one side of the chip movable carrier 331B of the second chip anti-shake movable part 33B, which is not limited in this application.
  • the first chip driving element 32A includes a chip magnet assembly 321A and a chip coil assembly 322A, wherein the chip coil assembly 322A of the first chip anti-shake movable part 33A is disposed on the chip movable carrier 331A.
  • the chip magnet assembly 321A of the first chip driving element 32A is fixed to the upper cover 311A of the first chip anti-shake fixing part 31A and corresponds to the chip coil assembly 322A.
  • the chip magnet assembly 321A of the first chip anti-shake fixing part 31A is fixed to the upper cover 311A of the first chip anti-shake fixing part 31A by, for example, an adhesive medium, and the first chip driving element 32A
  • the chip coil assembly 322A is fixed to the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the chip magnet assembly 321A of the first chip driving element 32A is disposed opposite to the chip coil assembly 322A, so that the chip coil assembly 322A can pass through the chip coil assembly 322A.
  • the magnetic field force between the chip coil assembly 322A and the chip magnet assembly 321A drives the first chip anti-shake movable part 33A to move relative to the first chip anti-shake fixed part 31A.
  • all The chip magnet assembly 321A of the first chip driving element 32A is a stator, and the chip coil assembly 322A of the first chip driving element 32A is a mover.
  • This arrangement can make the first chip anti-shake movable part 33A The movement of the chip movable carrier 331A will not be affected by magnetic interference, thereby avoiding affecting the chip anti-shake effect.
  • the second chip driving element 32B includes a chip magnet assembly 321B and a chip coil assembly 322B, wherein the chip coil assembly 322B of the second chip anti-shake movable part 33B is disposed on the chip movable carrier 331B.
  • the chip magnet assembly 321B of the second chip driving element 32B is fixed to the upper cover 311B of the second chip anti-shake fixing part 31B and corresponds to the chip coil assembly 322B.
  • the chip magnet assembly 321B of the second chip anti-shake fixing part 31B is fixed to the upper cover 311B of the second chip anti-shake fixing part 31B by, for example, an adhesive medium.
  • the chip coil assembly 322B is fixed to the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the chip magnet assembly 321B of the second chip driving element 32B is disposed opposite to the chip coil assembly 322B, so that the chip coil assembly 322B can pass through the chip coil assembly 322B.
  • the magnetic field force between the chip coil assembly 322B and the chip magnet assembly 321B drives the second chip anti-shake movable part 33B to move relative to the second chip anti-shake fixed part 31B. That is to say, in this application, the chip magnet assembly 321B of the second chip driving element 32B is a stator, and the chip coil assembly 322B of the second chip driving element 32B is a mover. This arrangement can make the second chip driving element 32B a stator.
  • the movement of the chip movable carrier 331B of the two-chip anti-shake movable part 33B will not be affected by magnetic interference, thereby avoiding affecting the chip anti-shake effect.
  • the chip coil assembly 322A of each first chip driving element 32A includes at least one chip coil.
  • the chip coil assembly 322A is not provided on at least one side of the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A includes a first side, a second side, a third side and a fourth side that surround each other.
  • the first side and the third side are Three sides are opposite, and the second side and the fourth side are opposite.
  • the first side and the third side extend along the X-axis direction set by the driving assembly, and the second side and the fourth side extend along the Y-axis direction set by the driving assembly,
  • the Y-axis direction is perpendicular to the X-axis direction.
  • the chip coil assembly 322A of the first chip driving element 32A includes a first chip coil group 3221A disposed on the first side, and a second chip coil assembly 3221A disposed on the opposite second side and the fourth side.
  • the chip coil group 3222A and the third chip coil group 3223A are examples of the first chip driving element 32A.
  • Each of the first The chip coil assembly 322B of the two-chip driving element 32B includes at least one chip coil.
  • the chip coil component 322B is not provided on at least one side of the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B includes a first side, a second side, a third side and a fourth side that surround each other. The first side and the third side Three sides are opposite, and the second side and the fourth side are opposite.
  • the first side and the third side extend along the X-axis direction set by the driving component, and the second side and the fourth side extend along the Y-axis direction set by the driving component,
  • the Y-axis direction is perpendicular to the X-axis direction.
  • the chip coil assembly 322B of the second chip driving element 32B includes a first chip coil group 3221B disposed on the first side, and a second chip coil assembly 3221B disposed on the opposite second side and the fourth side. Chip coil set 3222B and third chip coil set 33223B.
  • the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A are arranged on the plane where the X-axis and the Y-axis are located, that is, the first chip
  • the coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A are arranged in a horizontal direction.
  • the first chip coil group 3221A of the first chip driving element 32A is arranged along the X-axis direction
  • the second chip coil group 3222A is arranged along the Y-axis direction
  • the third chip coil group 3223A is arranged along the Y-axis direction, so
  • the second chip coil group 3222A and the third chip coil group 3223A are arranged opposite to each other along the Y-axis direction.
  • the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A are symmetrical with respect to the Y axis.
  • the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A are arranged around three sides of the first photosensitive component 40A.
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B are arranged on the plane where the X-axis and the Y-axis are located, that is, the first chip The coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B are arranged in the horizontal direction.
  • the first chip coil group 3221B of the second chip driving element 32B is arranged along the X-axis direction
  • the second chip coil group 3222B is arranged along the Y-axis direction
  • the third chip coil group 33223B is arranged along the Y-axis direction, so
  • the second chip coil group 3222B and the third chip coil group 33223B are arranged opposite to each other along the Y-axis direction.
  • the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B are symmetrical with respect to the Y-axis.
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B surround the second inductor.
  • the optical component 40B is arranged on three sides.
  • the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driving element 32A each include at least one chip coil. That is, the first chip coil group 3221A of the first chip driving element 32A includes at least one chip coil, the second chip coil group 3222A includes at least one chip coil, and the third chip coil group 3223A includes at least one chip coil. Coil.
  • the first chip coil group 3221A of the first chip driving element 32A includes a first chip coil 732211A and a second chip coil 732212A disposed on the first side.
  • One chip coil 732211A and the second chip coil 732212A are arranged along the X-axis direction.
  • the first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A are arranged relatively parallel along the X-axis direction;
  • the second chip coil group 3222A includes The third chip coil 732221A on two sides;
  • the third chip coil group 3223A includes a fourth chip coil 732231A arranged on the fourth side;
  • the third chip coil 732221A and the fourth chip coil 732231A are along the Y axis The directions are set relatively parallel.
  • first chip coil 732211A and the second chip coil 732212A of the first chip driving element 32A are disposed on the first side or the third side of the first photosensitive component 40A, and the third chip coil 732221A and the fourth chip coil 732231A are respectively disposed on the second side and the fourth side of the first photosensitive component 40A.
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B each include at least one chip coil. That is, the first chip coil group 3221B of the second chip driving element 32B includes at least one chip coil, the second chip coil group 3222B includes at least one chip coil, and the third chip coil group 33223B includes at least one chip coil. Coil.
  • the first chip coil group 3221B of the second chip driving element 32B includes a first chip coil 732211B and a second chip coil 732212B disposed on the first side.
  • One chip coil 732211B and the second chip coil 732212B are arranged along the X-axis direction.
  • the first chip coil 732211B and the second chip coil 732212B of the second chip driving element 32B are arranged relatively parallel along the X-axis direction;
  • the second chip coil group 3222B includes a The third chip coil 732221B on two sides;
  • the third chip coil group 33223B includes a fourth chip coil 732231B arranged on the fourth side;
  • the third chip coil 732221B and the fourth chip coil 732231B are along the Y-axis The directions are set relatively parallel.
  • the first chip coil 732211B and the second chip coil 732212B of the two-chip driving element 32B are disposed on the first side or the third side of the second photosensitive component 40B, and the third chip coil 732221B and the fourth chip The coils 732231B are respectively disposed on the second side and the fourth side of the second photosensitive component 40B.
  • the first chip coil 732211A of the first chip driving element 32A and the second chip coil 732212A work together to drive the first chip anti-shake movable part 33A to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the third chip coil 732221A and the fourth chip coil 732231A work together to drive the first chip anti-shake movable part 33A to move in the X-axis direction.
  • the first chip coil 732211B of the second chip driving element 32B and the second chip coil 732212B work together to drive the second chip anti-shake movable part 33B to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the third chip coil 732221B and the fourth chip coil 732231B work together to drive the second chip anti-shake movable part 33B to move in the X-axis direction.
  • the first chip coil 732211A of the first chip driving element 32A has the same size as the second chip coil 732212A
  • the third chip coil 732221A and the fourth chip coil 732231A have the same size.
  • the sizes of the third chip coil 732221A and the fourth chip coil 732231A are smaller than the sizes of the first chip coil 732211A and the second chip coil 732212A.
  • the third chip coil 732221A and the fourth chip coil 732231A of the first chip driving element 32A only need to drive the first chip anti-shake movable part 33 to achieve translation along the X-axis direction, and the The first chip coil 732211A and the second chip coil 732212A of a chip driving element 32A need to both drive the first chip anti-shake movable part 33 to achieve translation along the Y-axis direction, and also drive the first chip anti-shake movable part 33 Part 33 realizes rotation around the Z-axis.
  • the first chip coil 732211B of the second chip driving element 32B has the same size as the second chip coil 732212B
  • the third chip coil 732221B and the fourth chip coil 732231B have the same size
  • the The sizes of the third chip coil 732221B and the fourth chip coil 732231B are smaller than the sizes of the first chip coil 732211B and the second chip coil 732212B.
  • the third chip coil 732221B and the fourth chip coil 732231B of the second chip driving element 32B only need to drive the first chip anti-shake movable part 33 to achieve translation along the X-axis direction
  • the The first chip coil 732211B and the second chip coil 732212B of the two-chip driving element 32B need to not only drive the first chip anti-shake movable part 33 to achieve translation along the Y-axis direction, but also drive the first chip anti-shake movable part 33 Part 33 realizes rotation around the Z axis change.
  • the chip coil assembly 322A of the first chip driving element 32A further includes a coil circuit board 3224A disposed on the chip movable carrier 331A, and at least one chip in the chip coil assembly 322A The coil is secured and electrically connected to the coil circuit board 3224A.
  • the first chip coil group 3221A (the first chip coil 732211A, the second chip coil 732212A), the second chip coil group 3222A of the first chip driving element 32A (The third chip coil 732221A) and the third chip coil group 3223A (the fourth chip coil 732231A) are both fixed and electrically connected to the coil circuit board 3224A, and the chip coil assembly 322A passes through the coil
  • the circuit board 3224A is electrically connected to the first chip anti-shake conductive portion 35A and is further electrically connected to the first circuit board 41A of the first photosensitive component 40A.
  • the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A of the first chip driving element 32A may be wound and formed coils fixedly electrically connected to the Coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A may be directly wound on the coil circuit board 3224A; or , the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 3223A are directly etched on the coil circuit board 3224A to form a planar coil (FP-Coil),
  • This method can reduce the height of the chip coil assembly 322A of the first chip driving element 32A, thereby reducing the height of the chip driving motor 30A.
  • the coil circuit board 3224A of the first chip driving element 32A has a circuit board light hole 32241A, and the circuit board light hole 32241A allows the light of the first optical lens 10A to enter the first photosensitive component. 40A a light hole.
  • the chip coil assembly 322B of the second chip driving component 32B further includes a coil circuit board 3224B disposed on the chip movable carrier 331B, and at least one chip in the chip coil assembly 322B The coil is fixed and electrically connected to the coil circuit board 3224B.
  • the first chip coil group 3221B (the first chip coil 732211B, the second chip coil 732212B), the second chip coil group 3222B of the second chip driving element 32B (The third chip coil 732221B) and the third chip coil group 33223B (the fourth chip coil 732231B) are both fixed and electrically connected to the coil circuit board 3224B, and the chip coil assembly 322B passes through the coil
  • the circuit board 3224B is electrically connected to the second chip anti-shake conductive portion 35B and is further electrically connected to the second circuit board 41B of the second photosensitive component 40B.
  • the first chip coil group of the second chip driving element 32B 3221B, the second chip coil group 3222B and the third chip coil group 33223B may be wound and formed coils fixedly electrically connected to the coil circuit board 3224B; or, the first chip coil group 3221B, the The second chip coil group 3222B and the third chip coil group 33223B may be directly wound on the coil circuit board 3224B; or, the first chip coil group 3221B and the second chip coil group 3222B and the third chip coil group 33223B are etched directly on the coil circuit board 3224B to form a planar coil (FP-Coil).
  • This method can reduce the chip coil assembly 322B of the second chip driving element 32B. height, thereby reducing the height of the chip drive motor 30B.
  • the coil circuit board 3224B of the second chip driving element 32B has a circuit board light hole 32241B.
  • the circuit board light hole 32241B allows the light of the second optical lens 10B to enter the second photosensitive component.
  • 40B is a light hole.
  • the chip magnet assembly 321A of the first chip driving element 32A includes a first chip magnet group 3211A, a second chip magnet group 3212A, and a third chip magnet group 3213A.
  • a chip magnet group 3211A, the second chip magnet group 3212A and the third chip magnet group 3213A are arranged on the plane where the X-axis and the Y-axis are located (that is, arranged along the horizontal direction).
  • the first chip magnet group 3211A of the first chip driving element 32A and the first chip coil group 3221A are arranged vertically opposite to each other
  • the second chip magnet group 3212A and the second chip coil group 3222A are arranged vertically opposite to each other.
  • the third chip magnet group 3213A and the third chip coil group 3223A are arranged vertically and oppositely, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211A of the first chip driving element 32A is arranged along the X-axis direction
  • the second chip magnet group 3212A and the third chip magnet group 3213A are arranged along the Y-axis direction
  • the second chip magnet group 3211A is arranged along the Y-axis direction.
  • the chip magnet group 3212A and the third chip magnet group 3213A are arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212A and the third chip magnet group 3213A are symmetrical with respect to the Y-axis.
  • the upper side is the side away from the first photosensitive component 40A
  • the lower side is the side closer to the first photosensitive component 40A.
  • the chip magnet assembly 321B of the second chip driving element 32B includes a first chip magnet group 3211B, a second chip magnet group 3212B, and a third chip magnet group 3213B.
  • the first chip magnet group 3211B, the second chip magnet group The group 3212B and the third chip magnet group 3213B are arranged on the plane where the X-axis and the Y-axis are located (that is, arranged along the horizontal direction). Further, the first chip magnet group 3211B of the second chip driving element 32B and the first chip coil group 3221B are arranged vertically opposite to each other, and the second chip magnet group 3212B and the second chip coil group 3222B are arranged vertically opposite to each other.
  • the third chip magnet group 3213B and the third chip coil group 33223B are arranged vertically and oppositely, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211B of the second chip driving element 32B is arranged along the X-axis direction
  • the second chip magnet group 3212B and the third chip magnet group 3213B are arranged along the Y-axis direction
  • the second chip magnet group 3211B is arranged along the Y-axis direction.
  • the chip magnet group 3212B and the third chip magnet group 3213B are arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212B and the third chip magnet group 3213B are symmetrical with respect to the Y-axis.
  • the upper side is the side away from the second photosensitive component 40B
  • the lower side is the side closer to the second photosensitive component 40B.
  • the first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driving element 32A each include at least one chip magnet.
  • the first chip magnet group 3211A of the first chip driving element 32A includes a first chip magnet 732111A and a second chip magnet 732112A.
  • the two chip magnets 732112A are arranged along the X-axis direction.
  • the first chip magnet 732111A and the second chip magnet 732112A are arranged relatively parallel along the X-axis direction.
  • the second chip magnet group 3212A of the first chip driving element 32A includes a third chip magnet 732121A; the third chip magnet group 3213A includes a fourth chip magnet 732131A, the third chip magnet 732121A and the fourth chip
  • the magnets 732131A are arranged relatively parallel along the Y-axis direction. More specifically, in the embodiment of the present application, the first chip magnet group 3211A of the first chip driving element 32A is disposed at two opposite corners of the first photosensitive component 40A along the X-axis direction (ie, the corner area), the second chip magnet group 3212A and the third chip magnet group 3213A are disposed at two opposite sides of the first photosensitive component 40A along the Y-axis direction.
  • the first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driving element 32B each include at least one chip magnet.
  • the first chip magnet group 3211B of the second chip driving element 32B includes a first chip magnet 732111B and a second chip magnet 732112B, and the first chip magnet 732111B and the third chip magnet 732111B.
  • the two chip magnets 732112B are arranged along the X-axis direction.
  • the first chip magnet 732111B and the second chip magnet 732112B are arranged relatively parallel along the X-axis direction.
  • the second chip magnet group 3212B of the second chip driving element 32B includes a third chip magnet 732121B; the third chip magnet group 3213B includes a fourth chip magnet 732131B, the third chip magnet 732121B and the fourth chip Magnet 732131B along Y axis
  • the directions are set relatively parallel. More specifically, in the embodiment of the present application, the first chip magnet group 3211B of the second chip driving element 32B is disposed at two opposite corners of the second photosensitive component 40B along the X-axis direction (ie, the corner area), the second chip magnet group 3212B and the third chip magnet group 3213B are disposed at two opposite sides of the second photosensitive component 40B along the Y-axis direction.
  • the first chip magnet 732111A and the second chip magnet 732112A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the third chip magnet 732121A and the fourth chip magnet 732131A work together to drive the first chip anti-shake movable part 33A to move in the X-axis direction.
  • the first chip magnet 732111B and the second chip magnet 732112B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move in the Y-axis direction and/or rotate around the Z-axis direction
  • the third chip magnet 732121B and the fourth chip magnet 732131B work together to drive the second chip anti-shake movable part 33B to move in the X-axis direction.
  • the first chip magnet 732111A and the second chip magnet 732112A of the first chip driving element 32A have the same size
  • the third chip magnet 732121A and the fourth chip magnet 732131A have the same size
  • the third chip magnet 732111A has the same size.
  • the three-chip magnet 732121A and the fourth chip magnet 732131A are smaller in size than the first chip magnet 732111A and the second chip magnet 732112A.
  • the third chip magnet 732121A and the fourth chip magnet 732131A only need to drive the first chip anti-shake movable part 33A to achieve translation along the X-axis direction, while the first chip magnet 732111A and the second chip magnet 732111A
  • the chip magnet 732112A needs to drive the first chip anti-shake movable part 33A to translate along the Y-axis direction, and also drive the first chip anti-shake movable part 33A to rotate around the Z-axis.
  • the first chip magnet 732111B and the second chip magnet 732112B of the second chip driving element 32B have the same size
  • the third chip magnet 732121B and the fourth chip magnet 732131B have the same size
  • the third chip magnet 732111B has the same size.
  • the three-chip magnet 732121B and the fourth chip magnet 732131B are smaller in size than the first chip magnet 732111B and the second chip magnet 732112B.
  • the third chip magnet 732121B and the fourth chip magnet 732131B only need to drive the second chip anti-shake movable part 33B to achieve translation along the X-axis direction, while the first chip magnet 732111B and the second The chip magnet 732112B needs to drive the second chip anti-shake movable part 33B to translate along the Y-axis direction, and also drive the second chip anti-shake movable part 33B to rotate around the Z-axis.
  • the first chip coil group 3221A of the first chip driving element 32A interacts with the first chip magnet group 3211A to drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to move.
  • Translation in the Y-axis direction and/or rotation around the Z-axis direction; the second chip coil group 3222A and the second chip magnet group 3212A interact, the third chip coil group 3223A and the third chip magnet group 3213A interact with each other to jointly drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to translate in the X-axis direction.
  • the first chip coil group 3221B of the second chip driving element 32B interacts with the first chip magnet group 3211B to drive the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to move Translation in the Y-axis direction and/or rotation around the Z-axis direction; the second chip coil group 3222B and the second chip magnet group 3212B interact, the third chip coil group 33223B and the third chip magnet group 3213B interact with each other to jointly drive the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to translate in the X-axis direction.
  • the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 3223A of the first chip driving element 32A each include at least one chip coil. That is, the first chip coil group 3221A of the first chip driving element 32A includes at least one chip coil, the second chip coil group 3222A includes at least one chip coil, and the third chip coil group 3223A includes at least one chip coil. Coil.
  • the first chip coil group 3221A of the first chip driving element 32A includes two opposite first chip coils 832211A disposed on the first side, forming a pair of first chip coils 832211A.
  • Chip coil 832211A a pair of first chip coils 832211A are arranged along the X-axis direction. Specifically, the pair of first chip coils 832211A of the first chip driving element 32A are arranged in parallel along the X-axis direction; the second chip coil group 3222A includes a second chip coil group 3222A arranged on the second side. Chip coil 832212A; the third chip coil group 3223A includes another second chip coil 832212A disposed on the fourth side opposite to the second chip coil 832212A disposed on the second side, forming a pair of second chip coils 832212A. Chip coil 832212A; a pair of second chip coils 832212A are arranged relatively parallel along the Y-axis direction.
  • the pair of first chip coils 832211A of the first chip driving element 32A are disposed on the first side or the third side of the first photosensitive component 40A, and the pair of second chip coils 832212A.
  • the two second chip coils 832212A are respectively disposed on the second side and the fourth side of the first photosensitive component 40A.
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 3223B of the second chip driving element 32B each include at least one chip coil.
  • the first chip coil group 3221B of the second chip driving component 32B includes at least one chip coil
  • the second chip coil group 3222B includes at least one chip coil
  • the third chip coil group 3223B includes at least one chip coil.
  • the first chip coil group 3221B of the second chip driving element 32B includes two opposite first chip coils 832211B disposed on the first side, forming a pair of first chip coils 832211B.
  • Chip coil 832211B a pair of first chip coils 832211B are arranged along the X-axis direction. Specifically, the pair of first chip coils 832211B of the second chip driving element 32B are arranged in parallel along the X-axis direction; the second chip coil group 3222B includes a second chip coil group 3222B arranged on the second side. Chip coil 832212B; the third chip coil group 3223B includes another second chip coil 832212B disposed on the fourth side opposite to the second chip coil 832212B disposed on the second side, forming a pair of second chip coils 832212B. Chip coil 832212B; a pair of second chip coils 832212B are arranged relatively parallel along the Y-axis direction.
  • the pair of first chip coils 832211B of the second chip driving element 32B are disposed on the first side or the third side of the second photosensitive component 40B, and in the pair of second chip coils 832212B The two second chip coils 832212B are respectively disposed on the second side and the fourth side of the second photosensitive component 40B.
  • the pair of first chip coils 832211A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move in the Y-axis direction and/or rotate around the Z-axis direction.
  • the second chip coils 832212A work together to drive the first chip anti-shake movable part 33A to move in the X-axis direction.
  • the pair of first chip coils 832211B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move in the Y-axis direction and/or rotate around the Z-axis direction.
  • the second chip coils 832212B work together to drive the second chip anti-shake movable part 33B to move in the X-axis direction.
  • the size of the pair of first chip coils 832211A of the first chip driving element 32A is the same, the size of the pair of second chip coils 832212A is the same, and the size of the second chip coil 832212A is smaller than the size of the pair.
  • Dimensions of the first chip coil 832211A This is because the second chip coil 832212A of the first chip driving element 32A only needs to drive the first chip anti-shake movable part 33A to achieve translation along the X-axis direction, while the first chip coil 832211A needs to both
  • the first chip anti-shake movable part 33A is driven to realize translation along the Y-axis direction, and the first chip anti-shake movable part 33A is driven to realize rotation around the Z-axis.
  • the size of the pair of first chip coils 832211B of the second chip driving element 32B is approximately the same.
  • the size of the pair of second chip coils 832212B is the same, and the size of the second chip coil 832212B is smaller than the size of the first chip coil 832211B.
  • the second chip coil 832212B of the second chip driving element 32B only needs to drive the second chip anti-shake movable part 33B to achieve translation along the X-axis direction, while the first chip coil 832211B needs to both
  • the second chip anti-shake movable part 33B is driven to realize translation along the Y-axis direction, and the second chip anti-shake movable part 33B is driven to realize rotation around the Z-axis.
  • the chip coil assembly 322A of the first chip driving element 32A further includes a coil circuit board 3224A disposed on the chip movable carrier 331A of the first chip anti-shake movable part 33A, At least one chip coil in the chip coil assembly 322A is fixed and electrically connected to the coil circuit board 3224A.
  • the first chip coil group 3221A (a pair of the first chip coils 832211A) of the first chip driving element 32A
  • the second chip coil group 3222A (a pair of the second chip coils 832211A)
  • the chip coil 832212A) and the third chip coil group 3223A are both fixed and electrically connected to the coil circuit board 3224A
  • the chip coil assembly 322A is electrically connected through the coil circuit board 3224A.
  • the first circuit board 41A is connected to the first chip anti-shake conductive portion 35A and is further electrically connected to the first photosensitive component 40A.
  • the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 33223A of the first chip driving element 32A may be wound and formed coils fixedly electrically connected to the Coil circuit board 3224A; or, the first chip coil group 3221A, the second chip coil group 3222A, and the third chip coil group 33223A may be directly wound on the coil circuit board 3224A; or , the first chip coil group 3221A, the second chip coil group 3222A and the third chip coil group 33223A are directly etched on the coil circuit board 3224A to form a planar coil (FP-Coil),
  • This method can reduce the height of the chip coil assembly 322A of the first chip driving element 32A, thereby reducing the height of the first chip driving motor 30A.
  • the coil circuit board 3224A of the first chip driving element 32A has a circuit board light hole 32241A, and the circuit board light hole 32241A allows the light of the first optical lens 10A to enter the first photosensitive component. 40A a light hole.
  • the chip coil assembly 322B of the second chip driving element 32B also includes a coil circuit board 3224B disposed on the chip movable carrier 331B of the second chip anti-shake movable part 33B. At least one of the chip coil assembly 322B The chip coil is fixed and electrically connected to the coil circuit board 3224B.
  • the first core of the second chip driving element 32B Chip coil group 3221B (a pair of the first chip coil 832211B), the second chip coil group 3222B (a pair of the second chip coil 832212B) and the third chip coil group 3223B (a pair of the second chip coil 832212B)
  • the coils 832212B) are all fixed and electrically connected to the coil circuit board 3224B.
  • the chip coil component 322B is electrically connected to the second chip anti-shake conductive part 35B through the coil circuit board 3224B and is further electrically connected to the third chip anti-shake conductive part 35B.
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B of the second chip driving element 32B may be wound and formed coils fixedly electrically connected to the Coil circuit board 3224B;
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B may be directly wound on the coil circuit board 3224B; or
  • the first chip coil group 3221B, the second chip coil group 3222B and the third chip coil group 33223B are directly etched on the coil circuit board 3224B to form a planar coil (FP-Coil),
  • This method can reduce the height of the chip coil assembly 322B of the second chip driving element 32B, thereby reducing the height of the second chip driving motor 30B.
  • the coil circuit board 3224B of the second chip driving element 32B has a circuit board light hole 32241B.
  • the circuit board light hole 32241B allows the light of the second optical lens 10B to enter the second photosensitive component.
  • 40B is a light hole.
  • the chip magnet assembly 321A of the first chip driving element 32A includes a first chip magnet group 3211A, a second chip magnet group 3212A, and a third chip magnet group 3213A.
  • a chip magnet group 3211A, the second chip magnet group 3212A and the third chip magnet group 3213A are arranged on the plane where the X-axis and the Y-axis are located (that is, arranged along the horizontal direction).
  • the first chip magnet group 3211A of the first chip driving element 32A and the first chip coil group 3221A are arranged vertically opposite to each other
  • the second chip magnet group 3212A and the second chip coil group 3222A are arranged vertically opposite to each other.
  • the third chip magnet group 3213A and the third chip coil group 33223A are arranged vertically and oppositely, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211A of the first chip driving element 32A is arranged along the X-axis direction
  • the second chip magnet group 3212A and the third chip magnet group 3213A are arranged along the Y-axis direction
  • the second chip magnet group 3211A is arranged along the Y-axis direction.
  • the chip magnet group 3212A and the third chip magnet group 3213A are arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212A and the third chip magnet group 3213A are symmetrical with respect to the Y-axis.
  • the upper side is the side away from the first photosensitive component 40A
  • the lower side is the side closer to the first photosensitive component 40A.
  • the chip magnet assembly 321B of the second chip driving element 32B includes a first chip magnet group. 3211B, the second chip magnet group 3212B and the third chip magnet group 3213B.
  • the first chip magnet group 3211B, the second chip magnet group 3212B and the third chip magnet group 3213B are arranged at the X-axis and Y-axis. on a flat surface (that is, set along the horizontal direction). Further, the first chip magnet group 3211B of the second chip driving element 32B and the first chip coil group 3221B are arranged vertically opposite to each other, and the second chip magnet group 3212B and the second chip coil group 3222B are arranged vertically opposite to each other.
  • the third chip magnet group 3213B and the third chip coil group 33223B are arranged vertically and oppositely, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211B of the second chip driving element 32B is arranged along the X-axis direction
  • the second chip magnet group 3212B and the third chip magnet group 3213B are arranged along the Y-axis direction
  • the second chip magnet group 3211B is arranged along the Y-axis direction.
  • the chip magnet group 3212B and the third chip magnet group 3213B are arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212B and the third chip magnet group 3213B are symmetrical with respect to the Y-axis.
  • the upper side is the side away from the second photosensitive component 40B
  • the lower side is the side closer to the second photosensitive component 40B.
  • the first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet group 3213A of the first chip driving element 32A each include at least one chip magnet.
  • the first chip magnet group 3211A of the first chip driving element 32A includes two opposite first chip magnets 832111A, forming a pair of first chip magnets 832111A, and a pair of the first chip magnets 832111A.
  • the first chip magnets 832111A are arranged along the X-axis direction.
  • the two first chip magnets 832111A are arranged in parallel along the X-axis direction.
  • the second chip magnet group 3212A of the first chip driving element 32A includes a second chip magnet 832112A; the third chip magnet group 3213A includes a second chip magnet 832112A, forming a pair of second chip magnets 832112A.
  • the second chip magnet 832112A is arranged relatively parallel along the Y-axis direction. More specifically, in the embodiment of the present application, the first chip magnet group 3211A of the first chip driving element 32A is disposed at two opposite corners of the first photosensitive component 40A along the X-axis direction (ie, the corner area), the second chip magnet group 3212A and the third chip magnet group 3213A are disposed at two opposite sides of the first photosensitive component 40A along the Y-axis direction.
  • the first chip magnet group 3211B, the second chip magnet group 3212B, and the third chip magnet group 3213B of the second chip driving element 32B each include at least one chip magnet.
  • the first chip magnet group 3211B of the second chip driving element 32B includes two opposite first chip magnets 832111B, forming a pair of first chip magnets 832111B, and a pair of the first chip magnets 832111B.
  • the first chip magnet 832111B is arranged along the X-axis direction, specifically, two The first chip magnet 832111B is arranged in parallel along the X-axis direction.
  • the second chip magnet group 3212B of the second chip driving element 32B includes a second chip magnet 832112B; the third chip magnet group 3213B includes a second chip magnet 832112B, forming a pair of second chip magnets 832112B.
  • the second chip magnet 832112B is arranged relatively parallel along the Y-axis direction. More specifically, in the embodiment of the present application, the first chip magnet group 3211B of the second chip driving element 32B is disposed at two opposite corners of the second photosensitive component 40B along the X-axis direction (ie, the corner area), the second chip magnet group 3212B and the third chip magnet group 3213B are disposed at two opposite sides of the second photosensitive component 40B along the Y-axis direction.
  • the pair of first chip magnets 832111A of the first chip driving element 32A work together to drive the first chip anti-shake movable part 33A to move in the Y-axis direction and/or rotate around the Z-axis direction.
  • the second chip magnet group 3212A works together to drive the first chip anti-shake movable part 33A to move along the X-axis direction.
  • the pair of first chip magnets 832111B of the second chip driving element 32B work together to drive the second chip anti-shake movable part 33B to move in the Y-axis direction and/or rotate around the Z-axis direction.
  • the second chip magnet group 3212B works together to drive the second chip anti-shake movable part 33B to move along the X-axis direction.
  • the size of the pair of first chip magnets 832111A of the first chip driving element 32A is the same, the size of the pair of second chip magnet groups 3212A is the same, and the size of the second chip magnet group 3212A is smaller than the size of the pair.
  • the first chip magnet 832111A This is because the second chip magnet group 3212A of the first chip driving element 32A only needs to drive the first chip anti-shake movable part 33A to achieve translation along the X-axis direction, while the first chip magnet 832111A needs The first chip anti-shake movable part 33A is driven to realize translation along the Y-axis direction, and the first chip anti-shake movable part 33A is driven to realize rotation around the Z-axis.
  • the size of the pair of first chip magnets 832111B of the second chip driving element 32B is the same, the size of the pair of second chip magnet groups 3212B is the same, and the size of the second chip magnet group 3212B is smaller than the size of the first chip magnet group 3212B.
  • Chip Magnet 832111B This is because the second chip magnet group 3212B of the second chip driving element 32B only needs to drive the second chip anti-shake movable part 33B to achieve translation along the X-axis direction, while the first chip magnet 832111B needs The second chip anti-shake movable part 33B is driven to realize translation along the Y-axis direction, and the second chip anti-shake movable part 33B is driven to realize rotation around the Z-axis.
  • the first chip magnet 832111B of the second chip driving element 32B and the third The two chip magnets 832112B have the same size
  • the third chip magnet 832121B and the fourth chip magnet 832131B have the same size
  • the sizes of the third chip magnet 832121B and the fourth chip magnet 832131B are smaller than the first chip magnet. 832111B, the second chip magnet 832112B.
  • the third chip magnet 832121B and the fourth chip magnet 832131B only need to drive the second chip anti-shake movable part 33B to achieve translation along the X-axis direction, while the first chip magnet 832111B and the second chip magnet 832111B
  • the chip magnet 832112B needs to drive the second chip anti-shake movable part 33B to translate along the Y-axis direction, and also drive the second chip anti-shake movable part 33B to rotate around the Z-axis.
  • the first chip coil group 3221A of the first chip driving element 32A interacts with the first chip magnet group 3211A to drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to move.
  • Translation in the Y-axis direction and/or rotation around the Z-axis direction; the second chip coil group 3222A and the second chip magnet group 3212A interact, the third chip coil group 33223A and the third chip magnet group 3213A interact with each other to jointly drive the first chip anti-shake movable part 33A, thereby driving the first photosensitive component 40A to translate in the X-axis direction.
  • the first chip coil group 3221B of the second chip driving element 32B interacts with the first chip magnet group 3211B to drive the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to move Translation in the Y-axis direction and/or rotation around the Z-axis direction; the second chip coil group 3222B and the second chip magnet group 3212B interact, the third chip coil group 33223B and the third chip magnet group 3213B interact with each other to jointly drive the second chip anti-shake movable part 33B, thereby driving the second photosensitive component 40B to translate in the X-axis direction.
  • the first chip driving element 32A is not provided on at least one side of the first chip driving motor 30A to provide a larger spatial location for the eccentric arrangement of the first photosensitive chip 42A. That is, the first photosensitive chip 42A may be disposed close to the side of the first chip driving motor 30A where the first chip driving element 32A is not provided, so that the central axis of the first photosensitive chip 42A is aligned with the The central axis of the first chip drive motor 30A is inconsistent.
  • the second chip driving element 32B is not provided on at least one side of the second chip driving motor 30B to provide a larger spatial location for the eccentric arrangement of the second photosensitive chip 42B. That is, the second photosensitive chip 42B may be disposed close to the side of the second chip driving motor 30B where the second chip driving element 32B is not provided, so that the central axis of the second photosensitive chip 42B is aligned with the The central axes of the second chip drive motor 30B are inconsistent.
  • the first chip driving element 32A is not provided on at least one side of the first chip driving motor 30A
  • the second chip driving motor 30B At least one side of the first chip drive motor 30A is not provided with the second chip drive element 32B, and the side of the first chip drive motor 30A that is not provided with the first chip drive element 32A and the second chip drive motor 30B is not provided with the second chip driver.
  • One side of the component 32B is disposed adjacently, that is, the side of the first chip drive motor 30A where the first chip drive component 32A is not disposed and the side of the second chip drive motor 30B where the second chip is not disposed.
  • One side of the driving element 32B is arranged close to each other. This arrangement ensures that the first chip driver is not provided adjacent to the first camera module 1A and the second camera module 1B of the dual-camera module.
  • the component 32A and/or the second chip drives the component 32B to avoid magnetic interference problems affecting the selection of the cooperation scheme of the first lens drive motor 20A and the second lens drive motor 20B.
  • the chip magnet assembly 321A and the chip coil assembly 322A of the first chip driving element 32A are centrally arranged on three sides of the first photosensitive chip 42A.
  • the first photosensitive chip 42A The first chip driving element 32A is not provided on one side except three sides. This arrangement makes the central axis of the first photosensitive chip 42A eccentrically arranged on the first chip anti-shake movable part 33A.
  • the center O of the first photosensitive chip 42A is closer to the side of the movable chip carrier 331A where the first chip driving element 32A is not provided.
  • the first chip magnet group 3211A and the first chip coil group 3221A of the first chip driving element 32A are disposed on the third side and the fourth side of the first photosensitive chip 42A
  • the second chip magnet group 3212A, the second chip coil group 3222A, the third chip magnet group 3213A, and the third chip coil group 3223A are disposed on the second side of the first photosensitive chip 42A.
  • This arrangement makes The center O of the first photosensitive chip 42A is close to the first side of the movable chip carrier 331A, that is, the central axis of the first photosensitive chip 42A is inconsistent with the central axis of the first chip driving motor 30A.
  • the chip magnet assembly 321B and the chip coil assembly 322B of the second chip driving element 32B are centrally arranged on three sides of the second photosensitive chip 42B.
  • the second photosensitive chip 42B is not provided with a third chip on one side except the three sides.
  • the two-chip driving element 32B is arranged in such a manner that the central axis of the second photosensitive chip 42B is arranged in an eccentric state on the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the center O of the chip 42B is closer to the side of the chip movable carrier 331B where the second chip driving element 32B is not disposed.
  • the first chip magnet group 3211B of the second chip driving element 32B and the first chip coil group 3221B is disposed on the third side and the fourth side of the second photosensitive chip 42B, the second chip magnet group 3212B, the second chip coil group 3222B and the third chip magnet group 3213B,
  • the third chip coil group 33223B is arranged on the second side of the second photosensitive chip 42B. This arrangement makes the center O of the second photosensitive chip 42B close to the first side of the movable chip carrier 331B, that is, , the central axis of the second photosensitive chip 42B is inconsistent with the central axis of the second chip driving motor 30B.
  • the chip magnet assembly 321A of the first chip driving element 32A also includes a chip magnet set in the first chip magnet group 3211A, the second chip magnet group 3212A, and the third chip magnet.
  • a magnetically permeable member (not shown in the figure) between the group 3213A and the upper cover 311A of the first chip anti-shake fixing part 31A.
  • the first chip magnet group 3211A, the second chip magnet group 3212A and the third chip magnet group 3213A of the first chip driving element 32A are indirectly fixed to the first chip anti-shake through the magnetic conductive member.
  • the magnetic conductive member of the upper cover 311A of the fixed part 31A is adapted to enhance the magnetic field force of the chip magnet assembly 321A toward the chip coil assembly 322A, thereby enhancing the driving force of the first chip driving element 32A.
  • the chip magnet assembly 321B of the second chip driving element 32B also includes the first chip magnet group 3211B, the second chip magnet group 3212B, the third chip magnet group 3213B and the second chip magnet assembly.
  • a magnetic conductive member (not shown in the figure) is provided between the upper cover 311B of the fixing part 31B.
  • the first chip magnet group 3211B, the second chip magnet group 3212B and the third chip magnet group 3213B of the second chip driving element 32B are indirectly fixed to the second chip anti-shake through the magnetic conductive member.
  • the magnetic conductive member of the upper cover 311B of the fixed part 31B is suitable for enhancing the magnetic field force of the chip magnet assembly 321B toward the chip coil assembly 322B, thereby enhancing the driving force of the second chip driving element 32B.
  • the first chip driving motor 30A further includes a first chip position sensing component 36A and a first chip holding component 34A.
  • the first chip position sensing component 36A is used to obtain the The position or motion information of the first photosensitive component 40A
  • the first chip holding component 34A is adapted to allow the chip movable carrier 331A to be suspended in the receiving cavity of the first chip anti-shake fixing part 31A, In this way, the first photosensitive component 40A can be suspended in the first chip anti-shake fixing part 31A by the first chip holding component 34A.
  • the second chip driving motor 30B also includes a second chip position sensing component 36B and a second chip holding component 34B.
  • the second chip position sensing component 36B is used to obtain the position or movement of the second photosensitive component 40B.
  • the second chip holding assembly 34B is adapted to enable the
  • the chip movable carrier 331B is suspended in the receiving cavity of the second chip anti-shake fixing part 31B, so that the second photosensitive component 40B can be suspended by the second chip holding component 34B. in the second chip anti-shake fixing part 31B.
  • the first chip position sensing component 36A is fixed to the chip movable carrier 331A, so that when the chip movable carrier 331A moves, the first chip position sensing component 36A is adapted to obtain the first chip position sensing component 36A.
  • the change in the magnetic field of the chip magnet assembly 321A of the chip anti-shake movable part 33A obtains the position information of the chip movable carrier 331A.
  • the second chip position sensing component 36B is fixed to the chip movable carrier 331B, so that when the chip movable carrier 331B moves, the second chip position sensing component 36B is adapted to obtain the second chip position sensing component 36B.
  • the change in the magnetic field of the chip magnet assembly 321B of the chip anti-shake movable part 33B obtains the position information of the chip movable carrier 331B.
  • the first chip position sensing component 36A includes at least one position sensing element, and the number of the position sensing elements is not limited by this application.
  • the first chip position sensing component 36A includes a first position sensing element 361A, a second position sensing element 362A and a third position sensing element 363A, so as to sense the
  • the position information of the chip movable carrier 331A of the first chip anti-shake movable part 33A includes three types of movements: translation in the X-axis direction, translation in the Y-axis direction, and rotation around the Z-axis direction.
  • the first position sensing element 361A, the second position sensing element 362A and the third position sensing element 363A of the first chip position sensing component 36A are Hall elements; In other embodiments of the present application, the first position sensing element 361A, the second position sensing element 362A and the third position sensing element 363A are driver chips containing position sensing functions.
  • the second chip position sensing component 36B includes at least one position sensing element, and the number of the position sensing elements is not limited by this application.
  • the second chip position sensing component 36B includes a first position sensing element 361B, a second position sensing element 362B and a third position sensing element 363B, so as to sense the
  • the position information of the three movements of the chip movable carrier 331B of the second chip anti-shake movable part 33B is translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction.
  • the first position sensing element 361B, the second position sensing element 362B and the third position sensing element 363B of the second chip position sensing component 36B are Hall elements; In other embodiments of the present application, the first position sensing element 361B, the second position sensing element 362B and the third position sensing element 363B are driver chips containing a position sensing function.
  • a sensing element groove 33114A is formed on the chip carrier body 3311A of the first chip anti-shake movable part 33A, and the first chip position sensing component 36A is disposed on the sensing element.
  • the height of the first chip position sensing component 36A is prevented from being too high, and the first chip position sensing component 36A is electrically connected to the first circuit board 41A of the first photosensitive component 40A.
  • the first chip position sensing component 36A is disposed on the first chip driver Component 32A is between the chip coil assembly 322A and the first circuit board 41A.
  • the first chip position sensing component 36A is accommodated in the sensing element groove 33114A of the first chip anti-shake movable part 33A and does not protrude from the sensing element groove 33114A.
  • a sensing element groove 33114B is formed on the chip carrier body 3311B of the second chip anti-shake movable part 33B, and the second chip position sensing component 36B is disposed in the sensing element groove 33114B to prevent The height of the second chip position sensing component 36B is too high, and the second chip position sensing component 36B is electrically connected to the second circuit board 41B of the second photosensitive component 40B.
  • the second chip position sensing component 36B is disposed between the chip coil component 322B and the chip coil component 322B of the second chip driving element 32B. between the second circuit boards 41B.
  • the second chip position sensing component 36B is accommodated in the sensing element groove 33114B of the second chip anti-shake movable part 33B and does not protrude from the sensing element groove 33114B.
  • the first chip holding component 34A includes a chip supporting component 341A and a chip magnetic component 342A that are disposed between the chip movable carrier 331A of the first chip anti-shake movable part 33A and the upper cover 311A, so The chip magnetic attraction component 342A is fixed to the chip movable carrier 331A of the first chip anti-shake movable part 33A. In this way, the magnetic attraction force between the chip magnetic attraction component 342A and the chip magnet component 321A makes the chip magnetic attraction component 342A.
  • the first chip anti-shake movable part 33A is attracted to the upper cover 311A.
  • the chip support component 341A of the first chip holding component 34A is disposed between the upper cover 311A of the first chip anti-shake fixed part 31A and the chip movable carrier 331A of the first chip anti-shake movable part 33A, Under the action of the magnetic attraction force between the chip magnetic attraction component 342A and the chip magnet component 321A, the chip support component 341A is clamped by the upper cover 311A and the chip movable carrier 331A, and the chip A gap is maintained between the movable carrier 331A and the upper cover 311A, thereby reducing the resistance of the first chip anti-shake movable part 33A during movement.
  • the second chip holding component 34B includes an anti-shake movable portion 33B disposed on the second chip.
  • the chip support component 341B and the chip magnetic suction component 342B are between the chip movable carrier 331B and the upper cover 311B.
  • the chip magnetic suction component 342B is fixed to the chip movable part of the second chip anti-shake movable part 33B. Carrier 331B, in this way, the magnetic attraction force between the chip magnetic attraction component 342B and the chip magnet component 321B causes the second chip anti-shake movable part 33B to be attracted to the upper cover 311B.
  • the chip support component 341B of the second chip holding component 34B is disposed between the upper cover 311B of the second chip anti-shake fixed part 31B and the chip movable carrier 331B of the second chip anti-shake movable part 33B, Under the action of the magnetic attraction force between the chip magnetic attraction component 342B and the chip magnet component 321B, the chip support component 341B is clamped by the upper cover 311B and the chip movable carrier 331B. A gap is maintained between the movable carrier 331B and the upper cover 311B, thereby reducing the resistance of the second chip anti-shake movable part 33B during movement.
  • the chip support component 341A of the first chip holding component 34A is clamped and disposed between the first chip anti-shake movable part 33A and the first chip anti-shake fixed part 31A. of at least three supporting components. That is, the chip supporting component 341A of the first chip holding component 34A includes a first chip sandwiched between the first chip anti-shake movable part 33A and the first chip anti-shake fixed part 31A. a support component, a second support component and a third support component. Each set of the first support component, the second support component and the third support component includes a ball recessed in the chip movable carrier 331A of the first chip anti-shake movable part 33A. groove 3412A and the ball 3411A provided in the ball groove 3412A.
  • the chip supporting component 341B of the second chip holding component 34B is sandwiched between at least three supporting components disposed between the second chip anti-shake movable part 33B and the second chip anti-shake fixed part 31B. That is, the chip supporting component 341B of the second chip holding component 34B includes a first chip sandwiched between the second chip anti-shake movable part 33B and the second chip anti-shake fixed part 31B. a support component, a second support component and a third support component. Each set of the first support component, the second support component and the third support component includes balls recessedly formed on the chip movable carrier 331B of the second chip anti-shake movable part 33B. groove 3412B and the ball 3411B disposed in the ball groove 3412B.
  • the at least three support components are arranged in an incomplete collinear manner.
  • the first support component, the second support component and the third support component are distributed in a triangular layout.
  • the first support component is arranged on the chip movable carrier.
  • the second support component and the third support component are disposed at two corner areas of the third side of the chip movable carrier that is opposite to the first side.
  • the first supporting component is disposed in the middle area of the first side to support the chip movable carrier 331A of the first chip anti-shake movable part 33A and the first chip anti-shake movable part.
  • the chip movable carrier 331B of 33B forms a stable support.
  • the chip supporting component 341A of the first chip holding component 34A includes three Support components, each support component includes at least one ball 3411A and at least one ball groove 3412A. That is to say, the chip support component 341A includes at least three chip movable components disposed on the first chip anti-shake movable part 33A. In order to limit the movement range of the ball 3411A between the carrier 331A and the upper cover 311A, the chip support assembly 341A also includes at least three ball grooves 3412A corresponding to at least three of the ball 3411A.
  • At least three ball grooves 3412A are formed on the chip movable carrier 331A, the depth of the ball grooves 3412A is less than the diameter of the ball 3411A, and at least a part of the ball 3411A can protrude from the ball groove. 3412A, so that the ball 3411A can maintain frictional contact with the upper cover 311A.
  • the chip supporting component 341B of the second chip holding component 34B is sandwiched between at least three supporting components disposed between the second chip anti-shake movable part 33B and the second chip anti-shake fixed part 31B. That is, the chip supporting component 341B of the second chip holding component 34B includes a first chip sandwiched between the second chip anti-shake movable part 33B and the second chip anti-shake fixed part 31B. a support component, a second support component and a third support component. Each set of the first support component, the second support component and the third support component includes balls recessedly formed on the chip movable carrier 331B of the second chip anti-shake movable part 33B. groove 3412B and the ball 3411B disposed in the ball groove 3412B.
  • the chip supporting component 341B of the second chip holding component 34B includes three Support components, each support component includes at least one ball 3411B and at least one ball groove 3412B. That is to say, the chip support component 341B includes at least three chip movable components disposed on the second chip anti-shake movable part 33B. In order to limit the movement range of the ball 3411B between the carrier 331B and the upper cover 311B, the chip support assembly 341B also includes at least three ball grooves 3412B corresponding to at least three of the ball 3411B.
  • At least three ball grooves 3412B are formed on the chip movable carrier 331B, the depth of the ball grooves 3412B is smaller than the diameter of the ball 3411B, and at least a part of the ball 3411B can protrude from the ball groove. 3412B, So that the ball 3411B can maintain frictional contact with the upper cover 311B.
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A also includes an extension column 3313A protrudingly formed on the upper surface of the chip carrier body 3311A, and the ball groove 3412A is recessedly formed in the chip carrier body 3311A.
  • the chip movable carrier 331A includes at least three extension posts 3313A formed on the chip carrier body 3311A, and at least three extension posts 3313A protrude from the top of the chip carrier body 3311A. On the surface, at least three ball grooves 3412A are formed on at least three extension posts 3313A.
  • the chip support component 341A of the first chip holding component 34A is disposed between the extension column 3313A of the first chip anti-shake movable part 33A and the upper cover 311A, so that the first chip anti-shake movable part A certain gap is maintained between the chip movable carrier 331A of the part 33A and the upper cover 311A, and the gap does not change with the movement of the chip movable carrier 331A.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B also includes an extension column 3313B protrudingly formed on the upper surface of the chip carrier body 3311B, and the ball groove 3412B is recessed in the extension column.
  • the chip movable carrier 331B includes at least three extension posts 3313B formed on the chip carrier body 3311B, and at least three extension posts 3313B protrude from the upper surface of the chip carrier body 3311B. On the surface, at least three ball grooves 3412B are formed on at least three extension posts 3313B.
  • the chip support component 341B of the second chip holding component 34B is disposed between the extension post 3313B of the second chip anti-shake movable part 33B and the upper cover 311B, so that the second chip anti-shake movable part 33B A certain gap is maintained between the chip movable carrier 331B of the part 33B and the upper cover 311B, and the gap does not change with the movement of the chip movable carrier 331B.
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A includes three extension columns 3313A formed on the chip carrier body 3311A, and the first chip holding component
  • the 34A chip support assembly 341A includes three ball grooves 3412A formed by the concave top surface of the extension column 3313A and three balls 3411A disposed between the three ball grooves 3412A and the upper cover 311A.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B includes three extension columns 3313B formed on the chip carrier body 3311B, and the chip support component 341B of the second chip holding component 34B includes three Three ball grooves 3412B are formed by the concave top surface of the extension column 3313B and three balls 3411B are provided between the three ball grooves 3412B and the upper cover 311B.
  • At least three support components of the first chip holding component 34A are arranged in an incomplete collinear manner.
  • the three extension columns 3313A of the first chip anti-shake movable part 33A are distributed at two adjacent corners of the chip carrier body 3311A, and are opposite to the side where the adjacent corners are connected.
  • three balls 3411A are arranged in a triangular shape to form a stable support for the chip movable carrier 331A.
  • At least three supporting components of the second chip holding component 34B are arranged in a non-complete collinear manner.
  • the three extension columns 3313B of the second chip anti-shake movable part 33B are distributed at two adjacent corners of the chip carrier body 3311B, and are opposite to the side where the adjacent corners are connected.
  • three balls 3411B are arranged in a triangular shape to form a stable support for the chip movable carrier 331B.
  • the chip support component 341A of the first chip holding component 34A also includes a ball support piece 3413A embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A and located at the bottom of the ball groove 3412A. , the ball 3411A is supported on the ball supporting piece 3413A.
  • the chip support component 341A of the first chip holding component 34A further includes at least three ball support pieces 3413A, and the ball support pieces 3413A are fixed to the first chip anti-shake movable part 33A.
  • the chip movable carrier 331A serves as the bottom surface of the ball groove 3412A.
  • the ball support piece 3413A can be made of metal such as stainless steel, thereby providing a smoother support surface for the ball 3411A and reducing the friction of the rolling ball 3411A.
  • the chip support component 341A of the first chip holding component 34A includes three ball support pieces 3413A, and each ball support piece 3413A is fixed to the first chip anti-shake by insert molding.
  • the upper surface of the extended column 3313A of the chip movable carrier 331A of the movable part 33A is exposed as the bottom surface of each ball groove 3412A.
  • the ball support piece 3413A includes a support piece main body 34131A and a support piece connecting part 34132A.
  • the main body 34131A of the support piece and the connecting portion 34132A of the supporting piece extend integrally.
  • the upper surface of the main body 34131A of the supporting piece is exposed and serves as the bottom surface of the ball groove 3412A.
  • the connecting portion 34132A of the supporting piece is used to maintain the position during the insert molding process.
  • the position of the ball support piece 3413A in the chip movable carrier 331A, the support piece connection portion 34132A can be connected to the support piece connection portion 34132A of other ball support pieces 3413A or connected to other support piece connection portions for supporting the support piece Support parts for 34132A.
  • the ball support piece 3413A of the first chip holding assembly 34A includes a support piece main body 34131A located at the bottom of the ball groove 3412A and extending from the support piece main body 34131A to the ball groove 3412A.
  • the support piece connecting portion 34132A outside the chip movable carrier 331A of the first chip anti-shake movable portion 33A.
  • the chip support component 341B of the second chip holding component 34B also includes a ball support piece 3413B embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B and located at the bottom of the ball groove 3412B. , the ball 3411B is supported on the ball supporting piece 3413B.
  • the chip support component 341B of the second chip holding component 34B further includes at least three ball support pieces 3413B, and the ball support pieces 3413B are fixed to the second chip anti-shake movable part 33B.
  • the chip movable carrier 331B serves as the bottom surface of the ball groove 3412B.
  • the ball support piece 3413B can be made of metal such as stainless steel, thereby providing a smoother support surface for the ball 3411B and reducing the friction of the rolling ball 3411B.
  • the chip support component 341B of the second chip holding component 34B includes three ball support pieces 3413B, and each ball support piece 3413B is fixed to the second chip anti-shake by insert molding.
  • the upper surface of the extension column 3313B of the chip movable carrier 331B of the movable part 33B is exposed as the bottom surface of each ball groove 3412B.
  • the ball support piece 3413B includes a support piece main body 34131B and a support piece connecting part 34132B.
  • the main body 34131B of the support piece and the connecting portion 34132B of the supporting piece extend integrally.
  • the upper surface of the main body 34131B of the supporting piece is exposed and serves as the bottom surface of the ball groove 3412B.
  • the connecting portion 34132B of the supporting piece is used to maintain the position during the insert molding process.
  • the position of the ball support piece 3413B in the chip movable carrier 331B, the support piece connection portion 34132B can be connected to the support piece connection portion 34132B of other ball support pieces 3413B or to other support piece connection portions for supporting the support piece. Support parts for 34132B.
  • the ball support piece 3413B of the second chip holding assembly 34B After the ball supporting piece 3413B of the second chip holding assembly 34B is formed in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an insert molding process, the supporting piece connecting part 34132B is cut , a part of the support piece connecting portion 34132B may be exposed outside the chip movable carrier 331B. That is, in some embodiments of the present application, the ball support piece 3413B of the second chip holding assembly 34B includes a support piece main body 34131B located at the bottom of the ball groove 3412B and extending from the support piece main body 34131B to the ball groove 3412B. The support piece connecting portion 34132B outside the chip movable carrier 331B of the second chip anti-shake movable portion 33B.
  • the chip magnetic assembly 342A of the first chip holding assembly 34A includes at least one chip magnetic element 3421A, and the chip magnetic element 3421A is wrapped Covered in the chip movable carrier 331A of the first chip anti-shake movable part 33A, so as to pass the magnetic field between the chip magnet assembly 321A of the first chip driving element 32A and the at least one chip magnetic element 3421A.
  • the suction force causes the chip movable carrier 331A to be suspended in the receiving cavity of the first chip anti-shake fixing part 31A.
  • At least one of the chip magnetic elements 3421A of the first chip holding assembly 34A is embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A through an insert molding process. Inside, at least one of the chip magnetic elements 3421A and the chip magnet assembly 321A are arranged opposite to generate a magnetic attraction force between at least one of the chip magnetic elements 3421A and the chip magnet assembly 321A. On the one hand, through magnetic The suction force causes the chip supporting component 341A of the first chip holding component 34A to be clamped between the first chip anti-shake fixed part 31A and the first chip anti-shake movable part 33A.
  • the ball 3411A is clamped by the magnetic attraction between at least one chip magnetic element 3421A of the first chip holding component 34A and the chip magnet component 321A of the first chip anti-shake movable part 33A. between the upper cover 311A and the chip movable carrier 331A; on the other hand, after the chip movable carrier 331A moves, the chip movable carrier 331A is held in one position by the action of magnetic attraction, where , this position may be the initial position before the chip movable carrier 331A is driven.
  • the chip magnetic element 3421A of the first chip holding component 34A is made of a material with magnetic permeability, which is suitable for generating magnetic attraction with the magnet.
  • the chip magnetic attraction component 342B of the second chip holding component 34B includes at least one chip magnetic attraction element 3421B.
  • the chip magnetic attraction element 3421B is wrapped in the chip movable carrier of the second chip anti-shake movable part 33B. 331B, the chip movable carrier 331B is suspended in the second chip through the magnetic attraction between the chip magnet assembly 321B of the second chip driving element 32B and the at least one chip magnetic element 3421B.
  • the chip magnetic elements 3421B of the second chip holding assembly 34B is embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an insert molding process.
  • At least one of the chip magnetic elements 3421B and the chip magnet assembly 321B are arranged opposite to generate a magnetic attraction force between at least one of the chip magnetic elements 3421B and the chip magnet assembly 321B.
  • the suction force causes the chip supporting component 341B of the second chip holding component 34B to be clamped between the second chip anti-shake fixed part 31B and the second chip anti-shake movable part 33B.
  • the ball 3411B is clamped by the magnetic attraction force between at least one chip magnetic element 3421B of the second chip holding component 34B and the chip magnet component 321B of the second chip anti-shake movable part 33B.
  • the chip magnetic element 3421B of the second chip holding assembly 34B is made of a material with magnetic permeability, which is suitable for generating magnetic attraction with the magnet.
  • the chip magnetic element 3421A of the first chip holding assembly 34A includes a magnetic element main body 34211A and a magnetic element connecting portion 34212A.
  • the magnetic element main body 34211A and the magnetic element connecting portion 34212A extend integrally.
  • the magnetic element connection part 34212A is used to maintain the position of the chip magnetic element 3421A in the chip movable carrier 331A of the first chip anti-shake movable part 33A during the insert molding process.
  • the magnetic element connection part 34212A can be connected to the magnetic component connection portion 34212A of other chip magnetic components 3421A or to other support components for supporting the magnetic component connection portion 34212A.
  • the magnetic element connection is cut part 34212A.
  • a part of the magnetic element connecting part 34212A may be exposed outside the chip movable carrier 331A. That is, in some embodiments of the present application, the chip magnetic element 3421A of the first chip holding component 34A includes a chip wrapped in the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the magnetic element main body 34211A and the magnetic element connecting portion 34212A extending from the magnetic element main body 34211A to the outside of the chip movable carrier 331A.
  • the chip magnetic element 3421B of the second chip holding assembly 34B includes a magnetic element main body 34211B and a magnetic element connecting portion 34212B.
  • the magnetic element main body 34211B and the magnetic element connecting portion 34212B extend integrally.
  • the magnetic element connection part 34212B is used to maintain the position of the chip magnetic element 3421B in the chip movable carrier 331B of the second chip anti-shake movable part 33B during the insert molding process.
  • the magnetic element connection part 34212B can be connected to the magnetic component connection portion 34212B of other chip magnetic components 3421B or to other support components for supporting the magnetic component connection portion 34212B.
  • the magnetic element connection is cut part 34212B.
  • a part of the magnetic element connecting part 34212B may be exposed outside the chip movable carrier 331B. That is, in some embodiments of the present application, the chip magnetic element 3421B of the second chip holding assembly 34B is included in the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the magnetic element main body 34211B and the magnetic element connecting portion 34212B extending from the magnetic element main body 34211B to the outside of the chip movable carrier 331B.
  • the upper surface of the chip magnetic element 3421A of the first chip holding component 34A is exposed and is not wrapped by the chip movable carrier 331A of the first chip anti-shake movable part 33A; in other embodiments of the present application, the upper surface of the chip magnetic component 3421A can also be wrapped by the chip movable carrier 331A, and the present application is not limited thereto.
  • the upper surface of the chip magnetic element 3421B of the second chip holding assembly 34B is exposed and not wrapped by the chip movable carrier 331B of the second chip anti-shake movable part 33B; in other embodiments of the present application, The upper surface of the chip magnetic element 3421B can also be wrapped by the chip movable carrier 331B, and the application is not limited thereto.
  • the chip magnetic suction component 342A of the first chip holding component 34A includes a first chip magnetic suction component 3422A and a second chip magnetic suction component 3423A, wherein, by attaching the first chip magnetic suction component 3423A,
  • the rational arrangement of the chip magnetic component 3422A and the second chip magnetic component 3423A enables the first chip magnetic component 3422A and the second chip magnetic component 3423A to play different main roles.
  • the three balls 3411A of the first chip holding component 34A are arranged in a triangular shape, and the first chip magnetic component 3422A is disposed at the corner of the triangular plane (i.e., the corner area).
  • the first chip magnet assembly 3422A is disposed close to the ball 3411A.
  • the main function of the first chip magnet assembly 3422A is to generate a magnetic field along the Z-axis direction with the chip magnet assembly 321A of the first chip driving element 32A.
  • the magnetic attraction force causes the chip support component 341A to be clamped between the first chip anti-shake fixed part 31A and the first chip anti-shake movable part 33A; the second chip magnetic attraction component 3423A is disposed on At the edge of the triangular plane, that is, the distance from the second chip magnetic component 3423A to the ball 3411A is farther than the distance from the first chip magnetic component 3422A to the ball 3411A.
  • the second chip The main function of the magnetic attraction component 3423A is to generate a magnetic attraction force with a certain angle with the Z-axis direction with the chip magnet group after the chip movable carrier 331A moves.
  • the main function of the magnetic attraction force is to make the chip moveable.
  • the moving carrier 331A returns to a position.
  • the main functions of the first chip magnetic suction component 3422A and the second chip magnetic suction component 3423A of the first chip holding component 34A described in this application are different, which does not mean that the first chip magnetic suction component 3422A and the second chip magnetic suction component 3422A have different main functions.
  • Suction assembly 3423A will have no other functions.
  • the first chip magnetic attraction component 3422A of the first chip holding component 34A will also have the effect of magnetic attraction after the chip movable carrier 331A of the first chip anti-shake movable part 33A moves.
  • the chip movable carrier 331A has the function of returning to a position, and the second chip magnetic attraction component 3423A will also have the function of magnetic attraction so that the chip support component 341A is clamped between the first chip anti-shake fixing part 31A and the third chip anti-shake fixing part 31A.
  • the function between the chip anti-shake movable part 33A, the first chip magnetic component 3422A and the second chip magnetic component 3423A cooperate with each other and work together on the chip movable carrier 331A, but due to the first The positions of the chip magnetic component 3422A and the second chip magnetic component 3423A are different, so that their main functions are different.
  • the chip magnetic suction component 342B of the second chip holding component 34B includes a first chip magnetic suction component 3422B and a second chip magnetic suction component 3423B, wherein the first chip magnetic suction component 3422B and the second chip magnetic suction component are
  • the rational arrangement of the magnetic components 3423B allows the first chip magnetic component 3422B and the second chip magnetic component 3423B to play different main roles. Looking at its surface along the Z-axis direction, the three balls 3411B of the second chip holding component 34B are arranged in a triangular shape, and the first chip magnetic component 3422B is disposed at the corner of the triangular plane (i.e., the corner area). The first chip magnet assembly 3422B is disposed close to the ball 3411B.
  • the main function of the first chip magnet assembly 3422B is to generate a magnetic field along the Z-axis direction with the chip magnet assembly 321B of the second chip driving element 32B.
  • the magnetic attraction force causes the chip support component 341B to be clamped between the second chip anti-shake fixed part 31B and the second chip anti-shake movable part 33B; the second chip magnetic attraction component 3423B is disposed on At the edge of the triangular plane, that is, the distance from the second chip magnetic component 3423B to the ball 3411B is farther than the distance from the first chip magnetic component 3422B to the ball 3411B.
  • the second chip The main function of the magnetic attraction component 3423B is to generate a magnetic attraction force with a certain angle with the Z-axis direction with the chip magnet group after the chip movable carrier 331B moves.
  • the main function of the magnetic attraction force is to make the chip moveable.
  • the moving carrier 331B returns to a position.
  • the main functions of the first chip magnetic suction component 3422B and the second chip magnetic suction component 3423B of the second chip holding component 34B described in this application are different, which does not mean that the first chip magnetic suction component 3422B and the second chip magnetic suction component 3422B have different main functions.
  • Suction assembly 3423B will not have other functions.
  • the first chip magnetic attraction component 3422B of the second chip holding component 34B will also have the effect of magnetic attraction after the chip movable carrier 331B of the second chip anti-shake movable part 33B moves.
  • the chip movable carrier 331B has the function of returning to a position
  • the second chip magnetic attraction component 3423B also has the function of magnetic attraction so that the chip support component 341B is clamped on the second chip anti-shake fixing
  • the function between the part 31B and the second chip anti-shake movable part 33B, the first chip magnetic component 3422B and the second chip magnetic component 3423B cooperate with each other and work together on the chip movable carrier 331B, However, because the first chip magnetic component The positions of 3422B and the second chip magnetic component 3423B are different, so that their main functions are different.
  • the number of the first chip magnetic components 3422A of the first chip holding component 34A is 4, including the first chip magnetic component 734221A, the second chip magnetic component 734222A, the third The chip magnetic component 734223A and the fourth chip magnetic component 734224A.
  • the first chip magnetic element 734221A of the first chip holding assembly 34A and the first chip magnet 732111A of the first chip driving element 32A are located along the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the second chip magnetic element 734222A and the second chip magnet 732112A are arranged oppositely along the set height direction of the chip movable carrier 331A.
  • the third chip magnetic element 734223A and the third chip magnet 732121A are arranged oppositely along the height direction set by the chip movable carrier 331A, and the fourth chip magnetic element 734224A and the fourth chip magnet 732131A are arranged along the chip movable carrier
  • the chip magnet assembly 321A and the first chip magnetic assembly 3422A in this application do not need to be completely opposite to each other in the height direction set by the chip movable carrier 331A. Directly facing each other, that is to say, the projection of the chip magnet component 321A and the projection of the first chip magnetic component 3422A only need to overlap at least partially.
  • the number of the first chip magnetic components 3422B of the second chip holding component 34B is 4, including the first chip magnetic component 734221B, the second chip magnetic component 734222B, the third chip magnetic component 734223B and the fourth chip magnetic component.
  • Suction element 734224B The first chip magnetic element 734221B of the second chip holding assembly 34B and the first chip magnet 732111B of the second chip driving element 32B are located along the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the second chip magnetic element 734222B and the second chip magnet 732112B are arranged oppositely along the set height direction of the chip movable carrier 331B.
  • the third chip magnetic element 734223B and the third chip magnet 732121B are arranged oppositely along the height direction set by the chip movable carrier 331B.
  • the fourth chip magnetic element 734224B and the fourth chip magnet 732131B are arranged along the chip movable carrier.
  • the chip magnet assembly 321A and the first chip magnetic assembly 3422A in this application do not need to be completely opposite to each other in the height direction set by the chip movable carrier 331B. Directly facing each other, that is to say, the projection of the chip magnet component 321B and the projection of the first chip magnetic attraction component 3422B only partially overlap.
  • the first chip magnetic element 734221A and the second chip magnetic element 734222A of the first chip holding assembly 34A are disposed on the chip movable carrier of the first chip anti-shake movable portion 33A.
  • the third chip magnetic element 734223A and the fourth chip magnetic element 734224A are respectively disposed on the second side and the fourth side of the chip movable carrier 331A. It can also be said that the first chip magnetic element 734221A, the second chip magnetic element 734222A, the third chip magnetic element 734223A and the fourth chip magnetic element 734224A of the first chip holding assembly 34A are based on the position of the ball 3411A. Set according to the location.
  • the first chip magnetic element 734221B and the second chip magnetic element 734222B of the second chip holding assembly 34B are disposed on the first side of the chip movable carrier 331B of the second chip anti-shake movable part 33B,
  • the third chip magnetic component 734223B and the fourth chip magnetic component 734224B are respectively disposed on the second side and the fourth side of the chip movable carrier 331B. It can also be said that the first chip magnetic element 734221B, the second chip magnetic element 734222B, the third chip magnetic element 734223B and the fourth chip magnetic element 734224B of the second chip holding assembly 34B are according to the shape of the ball 3411B. Set according to the location.
  • first chip magnetic element 734221A and the second chip magnetic element 734222A of the first chip holding assembly 34A are disposed close to the ball 3411A along the X-axis direction.
  • Two-chip magnetic components 734222A are respectively disposed on both sides of the two balls 3411A;
  • the third-chip magnetic component 734223A and the fourth-chip magnetic component 734224A are disposed close to the ball 3411A along the Y-axis direction.
  • the third chip magnetic component 734223A and the fourth chip magnetic component 734224A are respectively disposed on one side of one of the ball 3411A. Since the first chip magnetic component 3422A of the first chip holding component 34A is closer to the ball 3411A, the chip support is clamped by the chip magnet component 321A of the first chip driving component 32A. The magnetic attraction of component 341A is more obvious.
  • the first chip magnetic element 734221B and the second chip magnetic element 734222B of the second chip holding assembly 34B are arranged close to the ball 3411B along the X-axis direction.
  • Suction elements 734222B are respectively disposed on both sides of the two balls 3411B;
  • the third chip magnetic suction component 734223B and the fourth chip magnetic suction component 734224B are disposed close to the ball 3411B along the Y-axis direction.
  • the third chip The magnetic element 734223B and the fourth chip magnetic element 734224B are respectively disposed on one side of one of the ball 3411B. Since the first chip magnetic component 3422B of the second chip holding component 34B is closer to the ball 3411B, the chip support is clamped by the first chip magnet component 3422B of the second chip driving component 32B. The magnetic attraction of component 341B is more obvious.
  • the second chip of the first chip holding assembly 34A The number of magnetic components 3423A is 2, including a fifth chip magnetic component 734231A and a sixth chip magnetic component 734232A, wherein the fifth chip magnetic component 734231A and the third chip of the first chip driving component 32A
  • the magnet 732121A is arranged oppositely along the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the sixth chip magnetic element 734232A and the fourth chip magnet 732131A are arranged along the chip.
  • the height directions set by the movable carrier 331A are opposite to each other.
  • the fifth chip magnetic element 734231A of the first chip holding component 34A is disposed between the first chip magnet 732111A and the third chip magnet 32131 of the first chip driving element 32A.
  • the sixth magnetic element is disposed between the second chip magnet 732112A and the fourth chip magnet 32121. It can also be said that the fifth chip magnetic element 734231A of the first chip holding component 34A is disposed on the second side of the chip movable carrier 331A of the first chip driving element 32A, and the sixth chip magnetic element 734232A It is arranged on the fourth side of the chip movable carrier 331A.
  • This arrangement allows the second chip magnetic assembly 3423A and the chip magnet assembly 321A of the first chip driving element 32A to move after the chip movable carrier 331A of the first chip anti-shake movable part 33A moves.
  • a magnetic attraction force will also be generated between the first chip magnetic component 3422A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving component 32A. , causing the chip movable carrier 331A of the first chip anti-shake movable part 33A to return to a position.
  • the number of second chip magnetic components 3423B of the second chip holding component 34B is 2, including a fifth chip magnetic component 734231B and a sixth chip magnetic component 734232B, wherein the fifth chip magnetic component 734231B and The third chip magnet 732121B of the second chip driving element 32B is arranged oppositely along the height direction set by the chip movable carrier 331B of the second chip anti-shake movable part 33B, and the sixth chip magnetic element 734232B It is arranged opposite to the fourth chip magnet 732131B along the height direction set by the chip movable carrier 331B.
  • the fifth chip magnetic element 734231B of the second chip holding component 34B is disposed between the first chip magnet 732111B and the third chip magnet 32131 of the second chip driving element 32B.
  • the sixth magnetic element is disposed between the second chip magnet 732112B and the fourth chip magnet 32121. It can also be said that the fifth chip magnetic element 734231B of the second chip holding component 34B is disposed on the second side of the chip movable carrier 331B of the second chip driving element 32B, and the sixth chip magnetic element 734232B disposed on the chip movable carrier The fourth side of 331B.
  • This arrangement allows the second chip magnetic assembly 3423B and the chip magnet assembly 321B of the second chip driving element 32B to move after the chip movable carrier 331B of the second chip anti-shake movable part 33B moves.
  • a magnetic attraction force will also be generated between the first chip magnetic component 3422B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving component 32B. , causing the chip movable carrier 331B of the second chip anti-shake movable part 33B to return to a position.
  • the first chip magnetic component 3422A of the first chip holding component 34A includes at least one first chip magnetic component 834221A
  • the second chip magnetic component 3423A includes at least one second chip magnetic component 834231A
  • a chip magnetic element 834221A is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic component 834231A and any one of the at least three support components is greater than the distance between the second chip magnetic component 834231A and any one of the at least three support components.
  • the first chip magnetic component 3422B of the second chip holding component 34B includes at least one first chip magnetic component 834221B
  • the second chip magnetic component 3423B includes at least one second chip magnetic component 834231B.
  • a chip magnetic element 834221B is adjacent to the first support component among the at least three support components, and the distance between the second chip magnetic component 834231B and any one of the at least three support components is greater than the third support component. The distance between a chip magnetic component 834221B and the first supporting component.
  • the number of the first chip magnetic components 3422A of the first chip holding component 34A is 4, and the number of the second chip magnetic components 3423A is 2.
  • the first chip magnetic assembly 3422A of the first chip holding assembly 34A includes two opposing first chip magnetic elements 834221A and two opposing third chip magnetic elements 834222A, forming a pair of first chip magnetic elements.
  • the second magnetic chip assembly 3423A includes two second magnetic chip components 834231A, forming a pair of second magnetic chip components 834231A.
  • the number of the first chip magnetic components 3422B of the second chip holding component 34B is four, and the number of the second chip magnetic components 3423B is two.
  • the first chip magnetic assembly 3422B of the second chip holding assembly 34B includes two opposing first chip magnetic components 834221B and two opposing third chip magnetic components 834222B, forming a pair of first chip magnetic components.
  • the second magnetic chip component 3423B includes two second magnetic chip components 834231B, forming a pair of second magnetic chip components 834231B.
  • the pair of first chip magnetic attraction elements 834221A of the first chip holding assembly 34A and the pair of first chip magnets 832111A of the first chip driving element 32A are positioned along the chip of the one chip anti-shake movable part 33A
  • the pair of second chip magnetic elements 834231A and the pair of second chip magnets 832112A are arranged oppositely along the height direction set by the movable carrier 331A. . That is, the pair of first chip magnetic elements 834221A of the first chip holding assembly 34A correspond in the height direction set by the chip movable carrier 331A of the one chip anti-shake movable part 33A.
  • the pair of second chip magnetic elements 834231A correspond to the pair of second chip magnets 832112A in the height direction set by the chip movable carrier 331A.
  • the chip magnet assembly 321A and the first chip magnetic attraction assembly 3422A do not need to be completely opposite to each other in the height direction set by the chip movable carrier 331A. That is to say, the chip magnet assembly 321A does not need to be completely opposite.
  • the projection of the component 321A only needs to overlap at least partially with the projection of the first chip magnetic component 3422A.
  • the pair of first chip magnetic elements 834221B of the second chip holding assembly 34B and the pair of first chip magnets 832111B of the second chip driving element 32B are positioned along the chip of the one chip anti-shake movable part 33B
  • the pair of second chip magnetic elements 834231B and the pair of second chip magnets 832112B are arranged oppositely along the height direction set by the movable carrier 331B. . That is, the pair of first chip magnetic elements 834221B of the second chip holding component 34B correspond in the height direction set by the chip movable carrier 331B of the one chip anti-shake movable part 33B.
  • the pair of second chip magnetic elements 834231B correspond to the pair of second chip magnets 832112B in the height direction set by the chip movable carrier 331B.
  • the chip magnet assembly 321B and the first chip magnetic assembly 3422B do not need to be completely opposite to each other in the height direction set by the chip movable carrier 331B. That is to say, the chip magnets do not need to be completely opposite.
  • the projection of the component 321B only needs to overlap at least partially with the projection of the first chip magnetic component 3422B.
  • the pair of first chip magnetic elements 834221A of the first chip holding assembly 34A are disposed on the first side of the movable chip carrier 331A, located on opposite sides of the first supporting assembly.
  • the third chip magnetic element 834222A is disposed on the third chip movable carrier 331A.
  • one third chip magnetic element 834222A is adjacent to the second support component, and the other third chip magnetic element 834222A is adjacent to the third support component. It can also be said that the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A are arranged according to the position of the ball 3411A of the supporting assembly.
  • the pair of first chip magnetic elements 834221B of the second chip holding component 34B are disposed on the first side of the movable chip carrier 331B, located on opposite sides of the first supporting component.
  • the third chip magnetic element 834222B is disposed on the second side and the fourth side of the movable chip carrier 331B.
  • One of the third chip magnetic element 834222B is adjacent to the second support component, and the other third chip magnetic element 834222B is disposed on the second side and the fourth side of the movable chip carrier 331B.
  • Element 834222B is adjacent to the third support component. It can also be said that the first chip magnetic element 834221B and the third chip magnetic element 834222B of the second chip holding assembly 34B are arranged according to the position of the ball 3411B of the supporting assembly.
  • the pair of first chip magnetic elements 834221A of the first chip holding assembly 34A are disposed close to the ball 3411A along the X-axis direction, and the pair of first chip magnetic elements 834221A are respectively disposed on both sides.
  • a pair of third chip magnetic components 834222A are disposed close to the ball 3411A along the Y-axis direction, and the third chip magnetic components 834222A are respectively disposed on one of the ball 3411A. side. Since the first chip magnetic component 3422A of the first chip holding component 34A is closer to the ball 3411A, the chip support is clamped by the chip magnet component 321A of the first chip driving component 32A. The magnetic attraction of components 341A and 341B is more obvious.
  • the pair of first chip magnetic components 834221B of the second chip holding assembly 34B are disposed close to the ball 3411B along the X-axis direction, and the pair of first chip magnetic components 834221B are respectively disposed on the two On both sides of the ball 3411B; a pair of third chip magnetic components 834222B are disposed close to the ball 3411B along the Y-axis direction, and the third chip magnetic components 834222B are respectively disposed on one side of one of the ball 3411B. . Since the first chip magnetic component 3422B of the second chip holding component 34B is closer to the ball 3411B, the chip support is clamped by the first chip magnet component 3422B of the second chip driving component 32B. The magnetic attraction of components 341B and 341B is more obvious.
  • the size of the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A are larger than the size of the second chip magnetic element 834231A. This is because the main functions of the first chip magnetic element 834221A and the third chip magnetic element 834222A of the first chip holding assembly 34A are Clamping the ball 3411, it also plays a role in resetting the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the second chip magnetic element 834231A and its corresponding chip magnet element It is sufficient to generate a reset force to reset the chip movable carrier 331A.
  • the size of the first chip magnetic element 834221B and the third chip magnetic element 834222B of the second chip holding assembly 34B are larger than the size of the second chip magnetic element 834231B. This is because the main function of the first chip magnetic element 834221B and the third chip magnetic element 834222B of the second chip holding assembly 34B is to clamp the ball 3411, which also serves to hold the second chip For the purpose of resetting the chip movable carrier 331B of the anti-shake movable part 33B, the second chip magnetic element 834231B and its corresponding chip magnet element only generate a reset force to reset the chip movable carrier 331B.
  • the pair of second chip magnetic elements 834231A of the first chip holding component 34A and the second chip magnet 832112 of the first chip driving element 32A are arranged along the first chip anti-shake
  • the chip movable carrier 331A of the movable part 33A is arranged to face each other in the set height direction.
  • the pair of second chip magnetic elements 834231A of the first chip holding component 34A are disposed on the pair of first chip magnets 832111A and 832111A of the first chip driving element 32A. Between a pair of third chip magnets 32131.
  • one of the pair of second chip magnetic elements 834231A of the first chip holding assembly 34A is disposed on the chip of the first chip anti-shake movable part 33A.
  • another second chip magnetic element 834231A is disposed in the middle area of the fourth side of the movable chip carrier 331A.
  • the chip magnet assembly 321A of the chip driving element 32A generates a magnetic attraction force at a certain angle with the Z-axis direction, and the magnetic attraction force causes the chip movable carrier 331A to return to a position.
  • a magnetic attraction force will also be generated between the first chip magnetic component 3422A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving component 32A. , causing the chip movable carrier 331A of the first chip anti-shake movable part 33A to return to a position.
  • the pair of second chip magnetic elements 834231B of the second chip holding assembly 34B and the second chip magnet 832112 of the second chip driving element 32B can be positioned along the chip of the second chip anti-shake movable part 33B.
  • the set height directions of the moving carrier 331B are relatively arranged.
  • a pair of second chips of the second chip holding assembly 34B magnetically attract
  • the element 834231B is disposed between a pair of first chip magnets 832111B and a pair of third chip magnets 32131 of the second chip driving element 32B.
  • one of the pair of second chip magnetic elements 834231B of the second chip holding assembly 34B is disposed on the chip of the second chip anti-shake movable part 33B.
  • another second chip magnetic element 834231B is disposed in the middle area of the fourth side of the movable chip carrier 331B.
  • the chip magnet assembly 321B of the chip driving element 32B generates a magnetic attraction force at a certain angle with the Z-axis direction, and the magnetic attraction force causes the chip movable carrier 331B to return to a position.
  • a magnetic attraction force will also be generated between the first chip magnetic component 3422B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving component 32B. , causing the chip movable carrier 331B of the second chip anti-shake movable part 33B to return to a position.
  • the magnetic attraction force generated between the second chip magnetic component 3423A of the first chip holding component 34A and the chip magnet component 321A of the first chip driving component 32A may be the same as that of the first chip.
  • the force in the opposite direction of movement of the chip movable carrier 331A of the anti-shake movable part 33A, and the magnetic attraction force at this time is a reset force, causing the chip movable carrier 331A to return to a position;
  • the second chip magnetic component 3423A and The magnetic attraction force generated between the chip magnet components 321A can also be the force in the same direction as the moving direction of the chip movable carrier 331A.
  • the magnetic attraction force at this time is an external attraction force.
  • the first circuit board 41A of the first photosensitive component 40A will also generate a certain reset force.
  • the external suction force slightly offsets the reset force of the first circuit board 41A to compensate for the chip movable carrier 331A. Thrust at edge travel.
  • the magnetic attraction force generated between the second chip magnetic attraction component 3423B of the second chip holding component 34B and the chip magnet component 321B of the second chip driving element 32B may be in contact with the second chip anti-shake movable part 33B.
  • the force in the opposite direction of movement of the chip movable carrier 331B, the magnetic attraction force at this time is a reset force, causing the chip movable carrier 331B to return to a position; the second chip magnetic attraction component 3423B and the chip magnet component 321B
  • the magnetic attraction force generated between them can also be a force in the same direction as the moving direction of the chip movable carrier 331B.
  • the magnetic attraction force at this time is an external attraction force.
  • the second The second circuit board 41B of the photosensitive assembly 40B will also generate a certain reset force.
  • the external suction force slightly offsets the reset force of the second circuit board 41B to compensate for the thrust force of the chip movable carrier 331B during the edge stroke.
  • the chip magnetic attraction component 342A of the first chip holding component 34A includes six chip magnetic attraction elements 3421A, and each two of the chip magnetic attraction elements 3421A have the same shape, thereby providing uniform,
  • the stable magnetic attraction force causes the chip movable carrier 331A of the first chip anti-shake movable part 33A to be smoothly attracted to the upper cover 311A of the first chip anti-shake fixed part 31A.
  • the chip magnetic suction component 342B of the second chip holding component 34B includes six chip magnetic suction components 3421B, and each two chip magnetic suction components 3421B have the same shape, thereby providing a uniform and stable magnetic suction force, so that the second chip magnetic suction component 3421B has the same shape.
  • the chip movable carrier 331B of the two-chip anti-shake movable part 33B is smoothly attracted to the upper cover 311B of the second chip anti-shake fixed part 31B.
  • the chip movable carrier 331A of the first chip anti-shake movable part 33A can be insert-molded with the ball support piece 3413A of the first chip holding assembly 34A and the chip through an injection molding process.
  • the magnetic element 3421A is integrally formed to reduce the number of parts of the first chip drive motor 30A.
  • the first chip anti-shake conductive part 35A can also be embedded in the first chip anti-shake movable part 33A through insert molding.
  • the chip movable carrier 331B of the second chip anti-shake movable part 33B can be integrated with the ball support piece 3413B of the second chip holding assembly 34B and the chip magnetic element 3421B by insert molding through an injection molding process.
  • the second chip anti-shake conductive part 35B can also be embedded in the second chip anti-shake movable part 33B through insert molding.
  • the present application embeds the first chip anti-shake conductive part 35A into the first chip anti-shake movable part 33A through, for example, insert molding to provide a first chip anti-shake movable part 33A with a conductive function. , so that the chip coil component 322A of the first chip driving element 32A can be electrically connected to the first circuit board 41A through the first chip anti-shake movable part 33A. Moreover, since the first chip anti-shake conductive part 35A is embedded in the first chip anti-shake movable part 33A through insert molding, the first chip anti-shake movable part 33A is suitable for providing two flat The mounting surface is used to install and fix the chip coil assembly 322A of the first chip driving element 32A and the first circuit board 41A. It can also reduce the number of components of the chip anti-shake motor and reduce the assembly of the chip anti-shake motor. complexity, and protect the first chip anti-shake conductive part 35A.
  • the second chip anti-shake conductive part 35B is embedded into the second chip anti-shake movable part 33B through, for example, insert molding to provide a second chip anti-shake movable part 33B with a conductive function, so that The chip coil assembly 322B of the second chip driving element 32B can be configured by the The second chip anti-shake movable part 33B is electrically connected to the second circuit board 41B.
  • the second chip anti-shake conductive part 35B is embedded in the second chip anti-shake movable part 33B through insert molding, the second chip anti-shake movable part 33B is suitable for providing two flat
  • the mounting surface is used to install and fix the chip coil assembly 322B of the second chip driving element 32B and the second circuit board 41B. It can also reduce the number of components of the chip anti-shake motor and reduce the assembly of the chip anti-shake motor. level of complexity, and protects the anti-shake conductive portion 35B of the second chip.
  • the first chip anti-shake movable part 33A and the first chip anti-shake conductive part 35A form an embedded structure.
  • the first chip anti-shake conductive part 35A includes at least one coil conductive component 351A.
  • the first chip anti-shake conductive part 35A includes multiple (two or more) coil conductive components 3511A.
  • a plurality of the coil conductive elements 3511A are embedded in the chip movable carrier 331A by, for example, insert molding, that is, the coil conductive elements 3511A are covered in the chip anti-shake movable carrier within, so that a plurality of the coil conductive elements 3511A can electrically connect the chip coil assembly 322A and the first circuit board 41A.
  • the second chip anti-shake movable part 33B and the second chip anti-shake conductive part 35B form an embedded structure.
  • the second chip anti-shake conductive part 35B includes at least one coil conductive component 351B.
  • the second chip anti-shake conductive part 35B includes multiple (two or more) coil conductive components 3511B.
  • a plurality of the coil conductive elements 3511B are embedded in the chip movable carrier 331B by, for example, insert molding, that is, the coil conductive elements 3511B are covered in the chip anti-shake movable carrier within, so that a plurality of the coil conductive elements 3511B can electrically connect the chip coil assembly 322B and the second circuit board 41B.
  • the number of the coil conductive elements 3511A in the coil conductive component 351A of the first chip anti-shake conductive part 35A is related to the required number of circuits in the chip coil component 322A of the first chip driving element 32A.
  • the coil conductive component 351A of the first chip anti-shake conductive part 35A includes six coil conductive elements 3511A.
  • Each coil conductive element 3511A of the first chip anti-shake conductive part 35A has an exposed first coil conductive end 35111A, and an exposed second coil opposite to the first coil conductive end 35111A.
  • the conductive end portion 35113A, and the coil conductive extension portion 35112A extending and electrically connected between the first coil conductive end portion 35111A and the second coil conductive end portion 35113A, the first coil conductive end portion 35111A Positioned higher than the second coil conductive end 35113A, the coil conductive extension 35112A extends downwardly from the first coil conductive end 35111A to the second line Loop conductive end 35113A.
  • the coil conductive element 3511A of the first chip anti-shake conductive part 35A is embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A, the chip movable carrier 331A does not cover the first chip anti-shake movable part 33A.
  • the upper surface of the coil conductive end 35111A, the upper surface of the first coil conductive end 35111A is exposed, and is used to electrically connect with the chip coil assembly 322A of the first chip driving element 32A.
  • the first chip anti-shake can
  • the chip movable carrier 331A of the movable part 33A does not cover the lower surface of the second coil conductive end 35113A, and the lower surface of the second coil conductive end 35113A is exposed for electrical connection with the first circuit board 41A. , thereby electrically connecting the chip coil assembly 322A and the first circuit board 41A.
  • the first coil conductive end portions 35111A of at least some of the coil conductive elements 3511A of the first chip anti-shake conductive portion 35A are exposed to the first chip anti-shake
  • the second coil conductive end portion 35113A is exposed to the upper surface of the chip movable carrier 331A of the movable part 33A and is exposed to the lower surface of the chip movable carrier 331A.
  • At least one chip coil in the chip coil assembly 322A of the first chip driving element 32A is electrically connected to the first coil conductive end 35111A of the first chip anti-shake conductive part 35A through the coil circuit board 3224A.
  • the second coil conductive end 35113A is suitable for electrically connecting to the first circuit board 41A of the first photosensitive component 40A. In this way, the chip coil assembly 322A is realized. and the first circuit board 41A.
  • the number of the coil conductive elements 3511B in the coil conductive component 351B of the second chip anti-shake conductive part 35B is related to the required number of circuits of the chip coil component 322B of the second chip driving element 32B.
  • the coil conductive component 351B of the second chip anti-shake conductive part 35B includes six coil conductive elements 3511B.
  • Each coil conductive element 3511B of the second chip anti-shake conductive part 35B has an exposed first coil conductive end 35111B, and an exposed second coil opposite to the first coil conductive end 35111B.
  • the conductive end portion 35113B, and the coil conductive extension portion 35112B extending and electrically connected between the first coil conductive end portion 35111B and the second coil conductive end portion 35113B, the first coil conductive end portion 35111B
  • the position is higher than the second coil conductive end portion 35113B, and the coil conductive extension portion 35112B extends downwardly from the first coil conductive end portion 35111B to the second coil conductive end portion 35113B.
  • the chip movable carrier 331B does not cover the first The upper surface of the coil conductive end 35111B, the upper surface of the first coil conductive end 35111B is exposed, for chip lines with the second chip driving element 32B
  • the coil component 322B is electrically connected, the chip movable carrier 331B of the second chip anti-shake movable part 33B does not cover the lower surface of the second coil conductive end 35113B, and the lower surface of the second coil conductive end 35113B Exposed for electrical connection with the second circuit board 41B, thereby electrically connecting the chip coil assembly 322B and the second circuit board 41B.
  • At least some of the first coil conductive ends 35111B of all coil conductive elements 3511B of the second chip anti-shake conductive part 35B are exposed to the second chip anti-shake
  • the second coil conductive end portion 35113B is exposed to the upper surface of the chip movable carrier 331B of the movable part 33B and the lower surface of the chip movable carrier 331B.
  • At least one chip coil in the chip coil assembly 322B of the second chip driving element 32B is electrically connected to the first coil conductive end portion 35111B of the second chip anti-shake conductive portion 35B through the coil circuit board 3224B.
  • the second coil conductive end 35113B is suitable for electrically connecting to the second circuit board 41B of the second photosensitive component 40B. In this way, the chip coil assembly 322B is realized. and the second circuit board 41B.
  • the first coil conductive end 35111A of the coil conductive element 3511A of the first chip anti-shake conductive part 35A constitutes the chip of the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • a portion of the upper conductive portion 33112A of the carrier body 3311A, and the second coil conductive end portion 35113A of the coil conductive element 3511A constitute a portion of the lower conductive portion 33113A of the chip carrier body 3311A of the movable chip carrier 331A.
  • the upper conductive part 33112A of the first chip anti-shake movable part 33A includes the first coil conductive end part 35111A
  • the lower conductive part 33113A includes the second coil conductive end part 35113A.
  • the first coil conductive end 35111B of the coil conductive element 3511B of the second chip anti-shake conductive part 35B constitutes the upper conductive part of the chip carrier body 3311B of the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the second coil conductive end 35113B of the coil conductive element 3511B forms a part of the lower conductive part 33113B of the chip carrier body 3311B of the movable chip carrier 331B.
  • the upper conductive part 33112B of the second chip anti-shake movable part 33B includes the first coil conductive end part 35111B
  • the lower conductive part 33113B includes the second coil conductive end part 35113B.
  • the The coil conductive element 3511A also includes a coil conductive connection portion 35114A, which can connect the coil conductive connections of other coil conductive elements 3511A. part 35114A or connected to other support components for supporting the coil conductive connection part 35114A.
  • the coil conductive connection is cut part 35114A, and a part of the coil conductive connection part 35114A is exposed outside the chip movable carrier 331A. That is, in some embodiments of the present application, the coil conductive element 3511A of the first chip anti-shake conductive part 35A further includes a conductive end portion 35111A of the first coil and a conductive end portion 35113A of the second coil.
  • the coil conductive main body formed with the coil conductive extension part 35112A extends to the coil conductive connection part 35114A outside the chip movable carrier 331A of the first chip anti-shake movable part 33A.
  • the coil conductive component 3511B also includes a coil conductive connection portion 35114B, which can be connected to the coil conductive connection portions 35114B of other coil conductive elements 3511B or to other support components for supporting the coil conductive connection portion 35114B.
  • the coil conductive connection is cut part 35114B, and a part of the coil conductive connection part 35114B is exposed outside the chip movable carrier 331B. That is, in some embodiments of the present application, the coil conductive element 3511B of the second chip anti-shake conductive part 35B further includes a conductive end portion 35111B of the first coil and a conductive end portion 35113B of the second coil.
  • the coil conductive main body formed with the coil conductive extension part 35112B extends to the coil conductive connection part 35114B outside the chip movable carrier 331B of the second chip anti-shake movable part 33B.
  • the first coil conductive end portion 35111A, the second coil conductive end portion 35113A, the coil conductive extension portion 35112A and the coil conductive connection portion of the first chip anti-shake conductive portion 35A 35114A is made of conductive material.
  • the coil conductive element 3511A of the first chip anti-shake conductive part 35A is not provided with the coil conductive connection part 35114A, and then the first coil conductive end part 35111A, the second coil The conductive end portion 35113A and the coil conductive extension portion 35112A are integrally formed of conductive material.
  • the first coil conductive end portion 35111B, the second coil conductive end portion 35113B, the coil conductive extension portion 35112B and the coil conductive connection portion of the second chip anti-shake conductive portion 35B 35114B is made of conductive material.
  • the coil conductive element 3511B of the second chip anti-shake conductive part 35B is not provided with the coil conductive connection part 35114B, and further the first coil conductive end part 35111B, the second coil
  • the conductive end portion 35113B and the coil conductive extension portion 35112B are integrally formed of conductive material.
  • the first chip anti-shake conductive part 35A may also include a sensing element conductive component.
  • the sensing element conductive component includes a component that is covered with the first chip anti-shake movable part.
  • At least one sensing element in the chip 33A movable carrier 331A is a conductive element.
  • Each of the sensing element conductive elements includes a first sensing element conductive end portion exposed on the upper surface of the chip movable carrier 331A of the first chip anti-shake movable portion 33A, and a first sensing element conductive end portion exposed on the chip movable portion 33A.
  • the conductive end of the first sensing element is lower than the first coil of the first chip anti-shake conductive part 35A in the height direction set by the chip movable carrier 331A. Conductive end 35111A.
  • the second chip anti-shake conductive part 35B may also include a sensing element conductive component.
  • the sensing element conductive component includes a chip wrapped in the chip movable carrier 331B of the second chip anti-shake movable part 33B. At least one sensing element is a conductive element.
  • Each of the sensing element conductive elements includes a first sensing element conductive end portion exposed to the upper surface of the chip movable carrier 331B of the second chip anti-shake movable portion 33B, and a first sensing element conductive end portion exposed to the chip movable portion 33B.
  • the conductive end of the first sensing element is lower than the first coil of the second chip anti-shake conductive part 35B in the height direction set by the chip movable carrier 331B. Conductive end 35111B.
  • the ball support piece 3413A of the first chip holding assembly 34A, the chip magnetic assembly 342A (including the chip magnetic element 3421A) and the first chip anti-shake conductive portion 35A ( Including coil conductive elements 3511A, sensing element conductive elements) are embedded in the chip movable carrier 331A of the first chip anti-shake movable part 33A through an injection molding process, and are connected with the chip movable
  • the carrier 331A is integrally formed, reducing the first core
  • the number of components of the first chip drive motor 30A is reduced, thereby simplifying the structure and assembly complexity of the first chip drive motor 30A.
  • the ball support piece 3413B of the second chip holding assembly 34B, the chip magnetic assembly 342B (including the chip magnetic element 3421B) and the second chip anti-shake conductive part 35B (including the coil conductive element 3511B, the sensing element Conductive elements) are embedded in the chip movable carrier 331B of the second chip anti-shake movable part 33B through an injection molding process, and are integrally formed with the chip movable carrier 331B, thus reducing the size of the chip movable carrier 331B.
  • the number of parts of the second chip drive motor 30B is reduced, thereby simplifying the structure and assembly complexity of the second chip drive motor 30B.
  • the chip magnetic assembly 342A (including the chip magnetic element 3421A) of the first chip holding assembly 34A needs to be made of a material with magnetic permeability, and the ball support piece 3413A and the first The chip anti-shake conductive part 35A (including the coil conductive element 3511A and the sensing element conductive element) needs to be made of material without magnetic permeability. Therefore, during the insert molding process, the chip magnet of the first chip holding component 34A
  • the suction component 342A is the same layer of material tape, and the ball support piece 3413A and the first chip anti-shake conductive part 35A are another layer of material tape.
  • the first chip holding component 34A The height of the magnetic element connection portion 34212A of at least one chip magnetic element 3421A of the chip magnetic assembly 342A is consistent with the support connection portion of the ball support piece 3413A and the coil conductive connection portion 35114A of the first chip anti-shake conductive portion 35A.
  • the height is inconsistent. That is, the coil conductive element 3511A of the first chip anti-shake conductive part 35A and the ball support piece 3413A of the first chip holding assembly 34A do not have magnetic permeability, and the chip magnetic attraction element 3421A of the magnetic attraction assembly has conductivity.
  • the magnetic element connection part 34212A, the coil conductive connection part 35114A, and the support piece connection part 34132A are in the height direction set by the chip movable carrier 331A of the first chip anti-shake movable part 33A There are differences on.
  • the chip magnetic assembly 342B (including the chip magnetic element 3421B) of the second chip holding assembly 34B needs to be made of magnetically permeable material, and the ball support piece 3413B and the second chip anti-shake conductive part 35B (including the coil conductive element 3511B and the sensing element conductive element) need to be made of materials that do not have magnetic permeability. Therefore, in the insert molding process, the chip magnetic attraction component 342B of the second chip holding component 34B is the same layer.
  • the ball supporting piece 3413B and the second chip anti-shake conductive part 35B are another layer of material tape.
  • the chip magnetic attraction component 342B of the second chip holding component 34B The height of the magnetic element connection portion 34212B of at least one chip magnetic element 3421B is inconsistent with the height of the support connection portion of the ball support piece 3413B and the coil conductive connection portion 35114B of the second chip anti-shake conductive portion 35B.
  • the coil conductive element 3511B of the second chip anti-shake conductive part 35B and the ball support piece 3413B of the second chip holding assembly 34B do not have magnetic permeability, and the chip magnetic attraction element 3421B of the magnetic attraction assembly has magnetic permeability, so
  • the magnetic element connection part 34212B, the coil conductive connection part 35114B, and the support piece connection part 34132B have differences in the height direction set by the chip movable carrier 331B of the second chip anti-shake movable part 33B. .
  • the installation and power supply method of the chip movable carrier 331A of the first chip anti-shake movable part 33A will be described.
  • solder such as solder
  • the pads on the back side of the coil circuit board 3224A of the chip coil assembly 322A are electrically connected through the chip movable carrier 331A of the first chip anti-shake movable part 33A and the coil circuit board of the first chip driving element 32A.
  • An adhesive medium is provided between 3224A to bond and fix the coil circuit board 3224A and the chip movable carrier 331A; an adhesive medium is provided between the chip movable carrier 331A and the first circuit board 41A to bond and fix it.
  • the chip movable carrier 331A and the first circuit board 41A are then electrically connected through solder to the lower conductive portion 33113A on the back of the chip movable carrier 331A and the side surface of the circuit board body 411A of the first circuit board 41A. .
  • solder for example, solder
  • the pads on the back side of the coil circuit board 3224B of the chip coil assembly 322B are electrically connected through the chip movable carrier 331B of the second chip anti-shake movable part 33B and the coil circuit board of the second chip driving element 32B.
  • An adhesive medium is provided between 3224B to bond and fix the coil circuit board 3224B and the chip movable carrier 331B; an adhesive medium is provided between the chip movable carrier 331B and the second circuit board 41B to bond and fix it.
  • the chip movable carrier 331B and the second circuit board 41B are then electrically connected with the lower conductive portion 33113B on the back of the chip movable carrier 331B and the side surface of the circuit board body 411B of the second circuit board 41B through solder. .
  • the multi-camera camera module based on the embodiments of the present application has been clarified, in which the driving component and the photosensitive component of at least one camera module in the multi-camera camera module are arranged in an eccentric manner, so that the photosensitive component One side of the photosensitive chip is closer to the edge of the mobile electronic device to meet the form and functional requirements of the mobile electronic device.

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Abstract

公开了一种驱动组件、摄像模组及多摄摄像模组，其中，所述摄像模组的感光组件相对于用于驱动感光组件的驱动组件的中心呈偏心的方式设置，使得所述感光组件的感光芯片的一侧更加靠近移动电子设备的边缘，以满足移动电子设备的外形和功能需求，例如，使得移动电子设备的对应于所述摄像模组的屏幕开孔更靠近移动电子设备的边缘，进而使得移动电子设备的屏幕更加完整。

Description

驱动组件、摄像模组及多摄摄像模组 技术领域
本申请涉及摄像模组领域，尤其涉及一种驱动组件、摄像模组及多摄摄像模组。
背景技术
随着移动电子设备的普及，被应用于移动电子设备的用于帮助使用者获取影像的摄像模组的相关技术得到了迅猛的发展和进步。目前在市场中，消费者对于配置于移动电子设备(例如，智能手机)的摄像模组的功能要求越来越高和多样化，例如，防抖功能。
在使用移动电子设备进行摄像时，由于人体在正常情况下存在的一定频率的生理震颤和由于运动产生的抖动，会导致摄像效果下降，因此，移动电子设备通常配有防抖马达以驱动光学镜头和/或感光芯片移动实现防抖功能。
而随着对摄像模组的成像质量要求越来越高，光学镜头的体积和重量越来越大，对防抖马达的驱动力要求也越来越高。而当前移动电子设备对摄像模组的体积也有很大的限制，防抖马达的占用体积随着镜头的增大而相应地增加。换句话说，在光学镜头向更大体积、更大重量发展的趋势下，防抖马达所能提供的驱动力却难以相应地增加。
在驱动力受限的前提下，镜头越重，防抖马达能够驱动光学镜头移动的行程越短，影响防抖能力。另一方面，光学镜头越重，防抖马达能够驱动光学镜头移动的速度也越慢，光学镜头到达预定的补偿位置的时间也越长，这也会影响防抖效果。
为克服上述缺陷，本申请人提出一种驱动组件，通过驱动感光芯片移动，达到光学防抖的目的。
发明内容
本申请的一优势在于提供了一种驱动组件、摄像模组及多摄摄像模组，其中，所述驱动组件能够通过驱动感光芯片移动来实现光学防抖，以满足光学防抖对驱动行程和驱动速度的需求，且所述摄像模组通过对所述驱动组件 和所述感光组件的位置关系的合理设计来满足其在移动电子设备的应用需求。
本申请的一优势在于提供了一种驱动组件、摄像模组及多摄摄像模组，其中，所述驱动组件能够通过驱动感光芯片移动来实现光学防抖，以满足光学防抖对驱动行程和驱动速度的需求，且所述摄像模组通过对其驱动组件中的磁吸元件的合理布设使得不同的磁吸元件能够发挥的不同作用。
本申请的另一优势在于提供了一种驱动组件、摄像模组及多摄摄像模组，其中，摄像模组的感光组件相对于驱动组件的中心呈偏心的方式设置，使得所述感光组件的感光芯片的一侧更加靠近移动电子设备的边缘，以满足移动电子设备的外形和功能需求，例如，使得移动电子设备的对应于所述摄像模组的屏幕开孔更靠近移动电子设备的边缘，进而使得移动电子设备的屏幕更加完整。
通过下面的描述，本申请的其它优势和特征将会变得显而易见，并可以通过权利要求书中特别指出的手段和组合得到实现。
为实现上述至少一优势，根据本申请的一个方面，本申请提供一种驱动组件，其包括：
具有收容腔的芯片防抖固定部；
被可移动地收容于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括芯片可动载体，所述芯片可动载体适于安装感光组件于其上，所述感光组件具有第一中心轴线；以及
用于驱动所述芯片防抖可动部的芯片可动载体相对于所述芯片固定部在所述收容腔内进行移动的芯片驱动元件；
其中，所述驱动组件具有第二中心轴线，所述第一中心轴线与所述第二中心轴线相偏移。
在根据本申请的驱动组件中，所述感光组件包括感光芯片，所述感光芯片的中心轴线为所述感光组件的第一中心轴线。
在根据本申请的驱动组件中，所述感光组件包括感光芯片，所述感光芯片相对于所述驱动组件的中心呈偏心的方式设置。
在根据本申请的驱动组件中，所述感光组件适于被安装于所述芯片可动载体，其中，所述芯片防抖固定部包括相互扣合以形成所述收容腔的上盖和基底，所述芯片可动载体与所述基底之间具有间隙。
在根据本申请的驱动组件中，所述驱动组件还包括芯片保持组件，所述芯片保持组件包括被包覆于所述芯片可动载体内的至少一芯片磁吸元件，其中，所述芯片驱动元件包括被设置于所述芯片可动载体的芯片线圈组件，以及，被固定于所述上盖且对应于所述芯片线圈组件的芯片磁石组件，以通过所述芯片磁石组件与所述至少一芯片磁吸元件之间的磁吸力使得所述芯片可动载体被悬空地设置于所述芯片防抖固定部的收容腔内。
在根据本申请的驱动组件中，所述芯片线圈组件包括至少一芯片线圈，所述驱动组件还包括芯片防抖导电部，所述芯片防抖导电部包括被包覆于所述芯片防抖可动载体内的至少一线圈导电元件，每一所述线圈导电元件具有被暴露的第一线圈导电端部、与所述第一线圈导电端部相对的且被暴露的第二线圈导电端部，以及，延伸于所述第一线圈导电端部和所述第二线圈导电端部之间的线圈导电延伸部，其中，至少一芯片线圈电连接于所述第一线圈导电端部，所述第二线圈导电端部适于电连接所述感光组件的线路板。
在根据本申请的驱动组件中，所述芯片线圈组件还包括被设置于所述芯片可动载体的线圈电路板，所述至少一芯片线圈被固定且电连接于所述线圈电路板，所述线圈电路板电连接于所述第一线圈导电端部。
在根据本申请的驱动组件中，所述芯片保持组件还包括被设置于所述芯片可动载体和所述上盖之间的芯片支撑组件，所述芯片支撑组件包括凹陷地形成于所述芯片可动载体的滚珠槽以及被设置于所述滚珠槽内的滚珠，其中，通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力，所述滚珠被夹持于所述上盖和所述芯片可动载体之间。
在根据本申请的驱动组件中，所述芯片支撑组件还包括内嵌于所述芯片可动载体内且位于所述滚珠槽的底部的滚珠支撑片，所述滚珠被支持于所述滚珠支撑片。
在根据本申请的驱动组件中，所述线圈导电元件和所述滚珠支撑片不具有导磁性，所述芯片磁吸元件具有导磁性。
在根据本申请的驱动组件中，所述线圈导电元件、所述滚珠支撑片和所述芯片磁吸元件通过注塑工艺与所述芯片可动载体一体成型。
在根据本申请的驱动组件中，所述芯片驱动元件包括被设置于所述芯片可动载体的芯片线圈组件，以及，被固定于所述上盖且对应于所述芯片线圈组件的芯片磁石组件，其中，所述芯片线圈组件包括至少一芯片线圈组，所 述芯片可动载体的至少一条边没有设置所述芯片线圈组。
在根据本申请的驱动组件中，所述芯片可动载体包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对，其中，所述芯片线圈组件包括设置于所述第一边的第一芯片线圈组，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组和第三芯片线圈组。
在根据本申请的驱动组件中，所述感光芯片的第一中心轴线与所述芯片可动载体的第三边之间的距离小于所述感光芯片的第一中心轴线与所述芯片可动载体的第一边之间的距离。
在根据本申请的驱动组件中，所述第一边和所述第三边沿着所述驱动组件所设定的X轴方向延伸，所述第二边和所述第四边沿着所述驱动组件所设定的Y轴方向延伸，所述Y轴方向垂直于所述X轴方向，其中，所述第一芯片线圈组包括设置于所述第一边的第一芯片线圈和第二芯片线圈，所述第二芯片线圈组包括设置于所述第二边的第三芯片线圈，所述第三芯片线圈组包括设置于所述第四边的第四芯片线圈。
在根据本申请的驱动组件中，所述第一芯片线圈和所述第二芯片线圈沿所述X轴方向相对平行地设置，所述第三芯片线圈和所述第四芯片线圈沿所述Y轴方向相对平行地设置。
根据本申请的一个方面，本申请提供一种驱动组件，其包括：
具有收容腔的芯片防抖固定部；
被可移动地收容于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部适于安装感光组件于其上；
用于驱动所述芯片防抖可动部相对于所述芯片固定部在所述收容腔内进行移动的芯片驱动元件；
芯片支撑组件，包括被夹持地设置于所述芯片防抖可动部和所述芯片防抖固定部之间的至少三支撑组件，所述至少三支撑组件以不完全共线的方式布设；以及
芯片磁吸组件，包括被设置于所述芯片防抖可动部的第一芯片磁吸元件和第二芯片磁吸元件，其中，所述第一芯片磁吸元件邻近于所述至少三支撑组件中的第一支撑组件，所述第二芯片磁吸元件与所述至少三支撑组件中任一支撑组件之间的距离大于所述第一芯片磁吸元件与所述第一支撑组件之 间的距离。
在根据本申请的驱动组件中，所述芯片防抖可动部包括芯片可动载体，所述感光组件适于被安装于所述芯片可动载体。
在根据本申请的驱动组件中，所述芯片可动载体包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对，其中，所述芯片支撑组件包括第一支撑组件、第二支撑组件和第三支撑组件，所述第一支撑组件被设置于所述芯片可动载体的第一边，所述第二支撑组件和所述第三支撑组件被设置于所述芯片可动载体的与所述第一边相对的第三边的两个转角区域，所述第一支撑组件被设置于所述第一边的中间区域。
在根据本申请的驱动组件中，所述芯片磁吸组件包括一对所述第一芯片磁吸元件，一对所述第一芯片磁吸元件被设置于所述第一支撑组件的相对的两侧，其中，所述芯片磁吸组件包括一对所述第二芯片磁吸元件，一个所述第二芯片磁吸元件被设置于所述第二边的中间区域，另一个所述第二芯片磁吸元件被设置于所述第四边的中间区域。
在根据本申请的驱动组件中，所述第一芯片磁吸元件的尺寸大于所述第二芯片磁吸元件的尺寸。
在根据本申请的驱动组件中，所述芯片磁吸组件还包括一对第三芯片磁吸元件，一个所述第三芯片磁吸元件邻近于所述第二支撑组件，另一个所述第三磁吸元件邻近于所述第三支撑组件。
在根据本申请的驱动组件中，一对所述第一芯片磁吸元件、一对所述第二芯片磁吸元件和一对所述第三芯片磁吸元件被包覆于所述芯片可动载体。
在根据本申请的驱动组件中，所述第一支撑组件、所述第二支撑组件和所述第三支撑组件中每一所述支撑组件包括凹陷地形成于所述芯片可动载体的滚珠槽和设置于所述滚珠槽内的滚珠，所述滚珠突出于所述滚珠槽。
在根据本申请的驱动组件中，所述芯片可动载体还包括突出地形成于所述芯片载体主体的上表面的三个延伸柱，所述滚珠槽凹陷地形成于各个所述延伸柱的上表面。
在根据本申请的驱动组件中，每一所述支撑组件还包括内嵌于所述芯片可动载体内且位于所述滚珠槽的底部的滚珠支撑片，所述滚珠被支持于所述滚珠支撑片。
在根据本申请的驱动组件中，所述芯片驱动元件包括被设置于所述芯片可动载体的芯片线圈组件，以及，被固定于所述芯片防抖固定部且对应于所述芯片线圈组件的芯片磁石组件，其中，所述芯片磁石组件包括分别对应于一对所述第一芯片磁吸元件的一对第一芯片磁石以及分别对应于一对所述第二芯片磁吸元件的一对第二芯片磁石。
在根据本申请的驱动组件中，所述芯片线圈组件包括至少一芯片线圈组，所述芯片可动载体的至少一条边没有设置所述芯片线圈组，其中，所述芯片线圈组件包括设置于所述第一边的第一芯片线圈组，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组和第三芯片线圈组。
在根据本申请的驱动组件中，所述驱动组件还包括芯片防抖导电部，所述芯片防抖导电部包括被包覆于所述芯片防抖可动载体内的至少一线圈导电元件，每一所述线圈导电元件具有被暴露的第一线圈导电端部、与所述第一线圈导电端部相对的且被暴露的第二线圈导电端部，以及，延伸于所述第一线圈导电端部和所述第二线圈导电端部之间的线圈导电延伸部，其中，至少一芯片线圈电连接于所述第一线圈导电端部，所述第二线圈导电端部适于电连接所述感光组件的线路板。
在根据本申请的驱动组件中，所述芯片线圈组件还包括被设置于所述芯片可动载体的线圈电路板，所述第一芯片线圈组、所述第二芯片线圈组和所述第三芯片线圈组被固定且电连接于所述线圈电路板，所述线圈电路板电连接于所述第一线圈导电端部。
在根据本申请的驱动组件中，所述线圈导电元件和所述滚珠支撑片不具有导磁性，所述芯片磁吸元件具有导磁性。
在根据本申请的驱动组件中，所述所述线圈导电元件、所述滚珠支撑片和所述芯片磁吸元件通过注塑工艺与所述芯片可动载体一体成型。
根据本申请的另一个方面，本申请还提供了一种摄像模组，其包括：如上所述的驱动组件。
根据本申请的又一个方面，本申请还提供了一种多摄摄像模组，其包括：
第一摄像模组；以及
第二摄像模组；
其中，所述第一摄像模组和所述第二摄像模组中至少一个摄像模组包括如上所述的驱动组件。
在根据本申请的多摄摄像模组中，所述第一摄像模组的驱动组件的第一侧没有设置芯片驱动元件，所述第二摄像模组的驱动组件的第二侧没有设置芯片驱动元件，其中，所述第一摄像模组的驱动组件的第一侧和所述第二摄像模组的驱动组件的第二侧相邻。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1A图示了根据本申请实施例的单摄摄像模组的应用示意图。
图1B图示了根据本申请实施例的多摄摄像模组的应用示意图。
图2图示了根据本申请实施例的摄像模组的结构示意图。
图3图示了根据本申请实施例的摄像模组的局部结构示意图。
图4图示了根据本申请实施例的摄像模组的局部爆炸示意图。
图5图示了根据本申请实施例的摄像模组的另一局部结构示意图。
图6图示了根据本申请实施例的摄像模组的驱动组件的局部结构示意图。
图7图示了根据本申请实施例的摄像模组的驱动组件的另一局部结构示意图。
图8图示了根据本申请实施例的摄像模组的另一局部爆炸示意图。
图9图示了根据本申请实施例的摄像模组的驱动组件的又一局部结构示意图。
图10图示了根据本申请实施例的摄像模组的驱动组件的又一局部示意图。
图11图示了根据本申请实施例的摄像模组的驱动组件的局部拆解示意图。
图12图示了根据本申请实施例的摄像模组的又一局部结构示意图。
图13A图示了根据本申请实施例的摄像模组的驱动组件的又一局部结构示意图。
图13B图示了根据本申请实施例的摄像模组的驱动组件的又一局部结构示意图。
图14A图示了根据本申请实施例的摄像模组的驱动组件的结构受力分析示意图。
图14B图示了根据本申请实施例的摄像模组的驱动组件的另一结构受力分析示意图。
图14C图示了根据本申请实施例的摄像模组的驱动组件的又一结构受力分析示意图。
图15图示了根据本申请实施例的多摄摄像模组的驱动组件的局部结构示意图。
图16图示了根据本申请实施例的多摄摄像模组的结构示意图。
图17图示了根据本申请实施例的摄像模组的局部爆炸示意图。
图18图示了根据本申请实施例的摄像模组的另一局部结构示意图。
图19图示了根据本申请实施例的摄像模组的另一局部爆炸示意图。
图20图示了根据本申请实施例的摄像模组的驱动组件的又一局部结构示意图。
图21图示了根据本申请实施例的摄像模组的驱动组件的局部拆解示意图。
图22图示了根据本申请实施例的摄像模组的又一局部结构示意图。
图23图示了根据本申请实施例的摄像模组的驱动组件的又一局部结构示意图。
图24图示了根据本申请实施例的摄像模组的驱动组件的结构受力分析示意图。
图25图示了根据本申请实施例的摄像模组的驱动组件的另一结构受力分析示意图。
图26图示了根据本申请实施例的摄像模组的驱动组件的又一结构受力 分析示意图。
图27图示了根据本申请实施例的多摄摄像模组的驱动组件的局部结构示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
示例性电子设备
如图1A和图1B所示，本申请提供一种安装有至少一个摄像模组1的移动电子设备和一种可应用于移动电子设备的摄像模组1，所述摄像模组1具备光学对焦和/或光学防抖功能，以使得摄像模组1能够拍摄更为清晰的图像。所述摄像模组1的数量和具体安装位置并不为本申请所局限，例如，在本申请的一实施方式中，所述移动电子设备安装有一个摄像模组1，在另一实施方式中，所述移动电子设备安装有多个(两个及以上)摄像模组1。所述摄像模组1可设置于所述移动电子设备的正面，作为所述移动电子设备的前置摄像模组1，也可设置于所述移动电子设备的背面，作为所述移动电子设备的后置摄像模组1。
在本申请一实施方式中，当所述移动电子设备的正面和/或背面仅设有一个摄像模组1时，所述摄像模组1的光学镜头10和感光芯片42在所述摄像模组1中偏心地设置，以使得所述摄像模组1处于偏心状态，这种设置方式使得摄像模组1的光学镜头10和感光芯片42更靠近于所述移动电子设备的一边，进而所述移动电子设备的屏幕开口更靠近于所述移动电子设备的一侧，如顶侧、左侧或右侧。
在本申请另一实施方式中，当在所述移动电子设备的正面和/或背面设置两个摄像模组1时，两个所述摄像模组1的两个光学镜头10和两个感光芯片42在双摄模组中偏心地设置，以使得双摄模组的两个光学镜头10尽量靠近，以加强光学功能。两个所述摄像模组1可以具有相同的结构，也可以具有不同的结构，本申请对此不做限制。
综上所述，本申请提供一种光学镜头10和感光芯片42偏心的摄像模组 1，结合一种驱动马达，以驱动光学镜头10和/或感光芯片42移动，一方面能够满足移动电子设备的结构设计需求，另一方面能够实现光学性能的加强，实现所述摄像模组1的光学对焦和/或光学防抖功能。下面，将参考附图对本申请提出的摄像模组1进行详细描述。
示例性摄像模组
如图2所示，根据本申请实施例的摄像模组1被阐明，所述摄像模组1包括感光组件40、被保持于所述感光组件40的感光路径上的光学镜头10，以及用于驱动所述光学镜头10和/或所述感光组件40移动以实现光学性能调整的驱动组件，例如，光学防抖、光学对焦等。
相应地，所述光学镜头10包括镜筒11和被安装于所述镜筒11内的镜片组12，所述镜片组12包括至少一光学镜片，所述至少一光学镜片的数量可以为一个或者多个，并不受限。
所述驱动组件包括芯片驱动马达30，所述芯片驱动马达30适于驱动所述感光组件40平移和/或旋转，从而实现所述摄像模组1的芯片防抖功能。所述芯片驱动马达30包括芯片防抖固定部31、芯片防抖可动部33、芯片驱动元件32以及芯片驱动导电部(即，芯片防抖导电部35)，所述芯片防抖固定部31具有一收容腔以容纳所述芯片防抖可动部33、所述芯片驱动元件32以及所述芯片防抖导电部35。所述芯片防抖导电部35为所述芯片驱动元件32提供电流，所述芯片驱动元件32用于驱动所述芯片防抖可动部33相对所述芯片防抖固定部31运动。所述感光组件40与所述芯片防抖可动部33相固定，从而所述芯片驱动元件32驱动所述感光组件40相对所述芯片防抖固定部31运动。
所述驱动组件还包括镜头驱动马达20，所述镜头驱动马达20适于驱动所述光学镜头10平移和/或旋转，从而实现所述摄像模组1的镜头对焦、镜头防抖等功能。所述镜头驱动马达20包括镜头驱动固定部、镜头驱动可动部、镜头驱动元件以及镜头驱动导电部，所述镜头驱动固定部具有一容纳腔以容纳所述镜头驱动可动部、所述镜头驱动元件以及镜头驱动导电部，所述镜头驱动导电部为所述镜头驱动元件提供驱动电源，所述镜头驱动元件用于驱动所述镜头驱动可动部相对所述镜头驱动固定部运动。所述光学镜头10与所述镜头驱动可动部相固定，从而所述镜头驱动元件驱动所述光学镜头10 相对所述镜头驱动固定部运动，例如，驱动所述光学镜头10沿其光轴移动实现镜头对焦功能；或者，驱动所述光学镜头10沿垂直其光轴的方向平移或驱动所述光学镜头10绕垂直其光轴的方向旋转实现镜头防抖功能。所述镜头驱动马达20将所述镜头驱动固定部固定于所述芯片驱动马达30的芯片防抖固定部31，从而使所述光学镜头10设置于所述感光组件40的感光路径上。
在本申请的一个实施方式中，所述摄像模组1中没有设置镜头驱动马达20，所述光学镜头10直接安装于所述芯片驱动马达30的芯片防抖固定部31，或者，所述光学镜头10通过支持件间接安装于所述芯片驱动马达30的芯片防抖固定部31，从而使所述光学镜头10设置于所述感光组件40的感光路径上。
如图2所示，所述感光组件40包括线路板41、电连接于所述线路板41的感光芯片42和电子元件43，所述感光芯片42用于接收所述光学镜头10采集的外界光线成像并通过所述线路板41与外部移动电子设备电连接。在本申请的一个实施例中，所述电子元件43可以是电阻、电容等无源电子器件和驱动芯片、存储芯片等有源电子器件中的一种或者多种，所述电子元件43可以电连接于所述线路板41的正面，也可以电连接于所述线路板41的背面，视所述摄像模组1的设计需求决定。
所述感光芯片42直接或者间接地固定于所述线路板41，所述感光芯片42包括感光区和非感光区，所述感光芯片42通过位于所述非感光区的芯片焊盘电连接于所述线路板41，例如，所述感光芯片42可以通过引线键合(打金线)、焊接、FC工艺(芯片倒装)或者RDL(再布线层技术)等方式电连接于所述线路板41。
在本申请的一个实施例中，所述线路板41包括线路板主体411以及连接带412。所述连接带412连接并电导通所述线路板主体411，从而将所述感光芯片42获取的成像信息通过所述线路板主体411和所述连接带412向外部移动电子设备传输。
在本申请的一个具体实施例中，所述连接带412包括第一连接带4121和第二连接带4122，所述第一连接带4121和所述第二连接带4122分别从所述线路板主体411的相对的两侧向外延伸，并进一步向上弯折及向侧部弯折，以使得所述第一连接带4121和所述第二连接带4122电连接，这种设置方式 可以使得所述线路板主体411在移动过程中保持平稳，进一步地减小驱动所述线路板41移动时的阻力。当然，在本申请的另一具体示例中，所述第一连接带4121和所述第二连接带4122可以从所述线路板主体411的相邻的两侧向外延伸并向上弯折，本申请对此不做限制。
所述感光组件40进一步包括滤光元件44，所述滤光元件44被保持于所述感光芯片42的感光路径上，用于对进入所述感光芯片42的成像光线进行过滤。在一个具体的示例中，所述滤光元件44被安装固定于所述感光组件40的底座45且对应于所述感光芯片42的至少部分感光区域，所述滤光元件44可以被正贴或者倒贴于所述底座45，所述底座45具有一通光孔，从而所述光学镜头10的光线可以穿过所述底座45的通光孔入射所述感光芯片42。
所述感光组件40可以通过所述线路板41(所述线路板主体411)或者所述底座45固定于所述芯片驱动马达30的芯片防抖可动部33，从而所述感光组件40随所述芯片防抖可动部33的运动而运动。
示例性芯片驱动马达
图3至图13示出了本申请芯片驱动马达30的一个实施例。所述芯片驱动马达30包括芯片防抖固定部31、芯片防抖可动部33、芯片驱动元件32，以及，芯片防抖导电部35。
所述芯片驱动元件32以分别连接所述芯片防抖可动部33和所述芯片防抖固定部31的方式被设置于所述芯片防抖可动部33与所述芯片防抖固定部31之间，所述芯片防抖导电部35电连接所述芯片驱动元件32和所述感光组件40，并为所述芯片驱动元件32提供驱动电源以驱动所述芯片防抖可动部33在X轴方向(即，X轴所设定的方向)和Y轴方向(即，Y轴所设定的方向)上平移和/或绕Z轴方向(即，Z轴所设定的方向)旋转，以实现所述感光组件40的平移防抖和/或旋转防抖。值得一提的是，在本申请实施例中，X轴方向和Y轴方向相互垂直，Z轴方向垂直于X轴方向和Y轴方向所在平面，Z轴方向也是所述光学镜头10的光轴的方向，换言之，X轴、Y轴和Z轴构成了三维立体坐标系，X轴方向和Y轴方向所在的XOY平面也称为水平方向所在平面。
如图3至图4所示，在本申请的一个实施例中，所述芯片防抖固定部31包括相互扣合以形成所述收容腔的上盖311和基底312。所述上盖311和所 述基底312相互固定并形成收容腔(即，所述芯片防抖固定部31的收容腔)容置所述芯片防抖可动部33、所述芯片驱动元件32、芯片防抖导电部35以及感光组件40等摄像模组部件，不仅可以保护上述摄像模组部件，还可以减少灰尘、脏污或杂散光进入所述芯片驱动马达30的内部。在本申请的一个具体示例中，所述上盖311和所述基底312的材质可以为诸如无磁不锈钢等金属材料。
具体地，在本申请实施例中，所述上盖311设置于所述基底312的上方，所述上盖311包括中心具有一开口的盖体主体3111，所述开口对应于所述感光组件40，以使得光线能够通过所述开口进入所述感光组件40以进行成像。优选地，所述开口呈圆形形状。进一步地，所述上盖311还可以包括自所述盖体主体3111一体向所述基底312方向延伸的盖体周侧3112，从而通过所述盖体周侧3112固定连接于所述基底312，例如，通过激光熔接或者粘合介质粘接的方式固定所述盖体周侧3112与所述基底312。所述盖体周侧3112还包括至少一周侧凹部31121，这样，所述上盖311与所述基底312之间形成至少一连接带412出口，以允许所述线路板41的连接带412从所述芯片防抖固定部31的容纳腔内向外伸出。在本申请的一个具体示例中，所述盖体周侧3112包括相对设置的两个周侧凹部31121，所述上盖311与所述基底312之间形成两个连接带412出口，以允许所述线路板41的第一连接带4121和第二连接带4122从所述芯片防抖固定部31的容纳腔内向外伸出。
在本申请实施例中，所述芯片防抖可动部33被可移动地收容于所述芯片防抖固定部31的收容腔内。具体地，所述芯片防抖可动部33被悬空或悬持地设置于所述芯片防抖固定部31的收容腔内，以使得所述芯片防抖可动部33可相对于所述芯片防抖固定部31活动。
如图4至图6所示，所述芯片防抖可动部33包括具有相对的上表面和下表面的芯片可动载体331。所述芯片可动载体331与所述上盖311之间设有所述芯片驱动元件32，所述芯片驱动元件32驱动所述芯片可动载体331相对所述芯片防抖固定部31运动；所述芯片可动载体331适于安装感光组件40于其上，即，所述感光组件40适于被安装于所述芯片可动载体331。在本申请的一个实施方式中，所述芯片可动载体331与所述基底312之间设有所述感光组件40，所述感光组件40通过所述线路板41被安装于所述芯片可动载体331，进而所述感光组件40随着所述芯片可动载体331移动。在本 申请的实施例中，所述芯片可动载体331与所述基底312之间具有间隙，所述感光组件40的底面(即，所述感光组件40靠近所述基底312的一侧)与所述基底312之间也存在一定的空气间隙，这样，所述感光组件40的运动不易被所述基底312阻碍，减小芯片驱动元件32的驱动力需求，换言之，所述感光组件40悬持在所述基底312的上方。
特别地，在本申请实施例中，所述感光组件40具有第一中心轴线，所述驱动组件具有第二中心轴线，所述第一中心轴线与所述第二中心轴线相偏移。具体地，所述感光组件40的感光芯片42的中心轴线为所述感光组件40的第一中心轴线，所述芯片驱动马达30的中心轴线为所述驱动组件的第二中心轴线，所述感光芯片42相对于所述驱动组件的中心呈偏心的方式设置，即，所述感光组件40的感光芯片42在所述芯片驱动马达30中呈偏心状态设置，即所述感光组件40的感光芯片42的中心轴偏心状态设置，也就是，所述感光芯片42的中心轴与所述芯片驱动马达30的中心轴不一致。(所述感光芯片42的中心轴为俯视时经过所述感光芯片42的对角线的交点且与Z轴方向平行的轴；所述芯片驱动马达30的中心轴为俯视时经过所述芯片驱动马达30的对角线的交点且与Z轴方向平行的轴)。
如图6所示，所述芯片防抖可动部33的芯片可动载体331包括相固定的芯片载体主体3311和芯片载体侧部3312。所述线路板41固定于所述芯片载体主体3311的底面(即，朝向所述基底312一侧)，所述芯片载体主体3311具有一载体主体通孔33111，所述载体主体通孔33111不仅适于提供所述感光组件40的感光芯片42一通光路径还可以提供所述感光组件40上的电子元件43安装空间，防止所述电子元件43与所述芯片载体主体3311相互干涉。所述芯片载体侧部3312包括从所述芯片载体主体3311一体向外延伸的第一载体侧部33121、第二载体侧部33122、第三载体侧部33123和第四载体侧部33124。所述第一载体侧部33121与所述第三载体侧部33123相对设置并与所述第二载体侧部33122和所述第四载体侧部33124相邻，所述第二载体侧部33122与所述第四载体侧部33124相对设置。所述第一载体侧部33121、所述第二载体侧部33122所述第三载体侧部33123和所述第四载体侧部33124适于作为所述芯片载体主体3311运动时的防撞部件，避免所述芯片载体主体3311直接与所述芯片防抖固定部31相撞击。
在本申请的一个实施例中，所述芯片载体侧部3312(第一载体侧部 33121、第二载体侧部33122、第三载体侧部33123和第四载体侧部33124)进一步向所述芯片载体主体3311的侧面延伸，即，所述芯片载体侧部3312从所述芯片载体主体3311的外周缘进一步向外延伸，所述芯片载体侧部3312突出于所述芯片载体主体3311的侧壁，使得所述芯片防抖可动部33移动过程中通过所述芯片载体侧部3312与所述芯片防抖固定部31发生碰撞，进而避免设置所述感光组件40的芯片载体主体3311与所述芯片防抖固定部31直接发生碰撞，进而造成所述感光组件40损坏。
如图7所示，所述感光芯片42在所述芯片可动载体331中偏心地设置，所述感光芯片42的中心O到所述可动载体的两相对边的距离不相等。也可以说，所述感光芯片42更靠近于所述芯片可动载体331的至少一边，即，所述感光芯片42更靠近于所述芯片驱动马达30的至少一侧。在本申请一具体示例中，所述感光组件40的感光芯片42的外形为包含有长边和宽边的矩形结构，所述感光组件40的外形边缘可以定义有第一边、第二边、第三边及第四边，以所述感光芯片42对角线的交点为中心原点，建立直角坐标系，第一边和第三边与X轴方向平行，第二边与第四边与Y轴方向平行。相应地，所述芯片可动载体331也具有与所述感光组件40相对应的第一边、第二边、第三边及第四边。
其中，所述感光芯片42的中心O到所述芯片可动载体331的第一边的距离为H1，所述感光芯片42的中心O到所述芯片可动载体331的第三边的距离为H2，H1＞H2，即，所述感光芯片42的第一中心轴线与所述芯片可动载体331的第三边之间的距离小于所述感光芯片42的第一中心轴线与所述芯片可动载体331的第一边之间的距离，所述感光芯片42更靠近于所述芯片可动载体331的第三边，远离于所述芯片可动载体331的第一边。即，所述感光芯片42A、42B的第一中心轴线与所述芯片可动载体331A、331B的第三边之间的距离小于所述感光芯片42A、42B的第一中心轴线与所述芯片可动载体331A、331B的第一边之间的距离，所述感光芯片42A、42B更靠近于所述芯片可动载体331A、331B的第三边，远离于所述芯片可动载体331A、331B的第一边。例如，所述H1的范围为：6mm-8mm，H2的范围为：3mm-4mm，优选的，H1为7.14mm，H2为3.74mm。
当然，在本申请其他实施例中，也可以为H1＜H2，即，所述感光芯片42更靠近于所述芯片可动载体331的第三边，远离于所述芯片可动载体331 的第一边，本申请对此不做限制。
所述感光芯片42的中心O到所述芯片可动载体331的第二边的距离为H3，所述感光芯片42的中心O到所述芯片可动载体331的第四边的距离为H4，所述H3可以等于H4，所述H3可以小于H4，所述H3也可以大于H4。也就是说所述感光芯片42更靠近于所述芯片可动载体331的至少一边即可，本申请对此不做限制。
当本申请中所述偏心的感光芯片42应用于单摄摄像模组1时，尤其是应用于前摄摄像模组1时，将所述感光芯片42到所述芯片驱动马达30距离短的一侧更靠近于所述移动电子设备的一边设置，以方便满足所述移动电子设备的外形和功能需求，例如，使得所述移动电子设备的对应于所述摄像模组1的屏幕开孔更靠近移动电子设备的边缘，进而使得所述移动电子设备的屏幕更加完整。
如图5和图8所示，所述芯片驱动元件32包括芯片磁石组件321和芯片线圈组件322，其中，所述芯片线圈组件322被设置于所述芯片防抖可动部33的芯片可动载体331，所述芯片磁石组件321被固定于所述芯片防抖固定部31的上盖311且对应于所述芯片线圈组件322。所述芯片磁石组件321通过例如粘合介质粘接的方式固定于所述芯片防抖固定部31的上盖311，所述芯片线圈组件322固定于所述芯片防抖可动部33的芯片可动载体331，所述芯片磁石组件321与所述芯片线圈组件322相对设置，从而通过所述芯片线圈组件322与所述芯片磁石组件321之间的磁场力驱动所述芯片防抖可动部33相对所述芯片防抖固定部31运动。也就是说，本申请中，所述芯片磁石组件321为定子，所述芯片线圈组件322为动子，这种设置方式可以使得所述芯片可动载体331的移动不会受到磁干扰的影响，进而避免影响到芯片防抖效果。
进一步地，对芯片驱动元件32的具体结构进行说明，每一所述芯片线圈组件322包括至少一芯片线圈。参考图4所示，在本申请的一个实施方式中，所述芯片可动载体331的至少一条边没有设置所述芯片线圈组件322。具体地，所述芯片可动载体331包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对。所述第一边和所述第三边沿着所述驱动组件所设定的X轴方向延伸，所述第二边和所述第四边沿着所述驱动组件所设定的Y轴方向延伸，所述Y轴方向 垂直于所述X轴方向。所述芯片线圈组件322包括设置于所述第一边的第一芯片线圈组3221，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组3222和第三芯片线圈组3223。
所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223设置于X轴和Y轴所在平面，即，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223沿水平方向设置。所述第一芯片线圈组3221沿X轴方向设置，所述第二芯片线圈组3222沿Y轴方向设置，所述第三芯片线圈组3223沿Y轴方向设置，所述第二芯片线圈组3222与所述第三芯片线圈组3223沿Y轴方向相对设置。进一步地，所述第二芯片线圈组3222与所述第三芯片线圈组3223相对于Y轴对称。所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223围绕所述感光组件40的三边设置。
所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223分别包括至少一个芯片线圈。也就是，所述第一芯片线圈组3221包括至少一芯片线圈，所述第二芯片线圈组3222包括至少一芯片线圈，所述第三芯片线圈组3223包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第一芯片线圈组3221包括设置于所述第一边的第一芯片线圈732211和第二芯片线圈732212，所述第一芯片线圈732211和所述第二芯片线圈732212沿X轴方向排列，具体地，所述第一芯片线圈732211和所述第二芯片线圈732212沿所述X轴方向相对平行地设置；所述第二芯片线圈组3222包括设置于所述第二边的第三芯片线圈732221；所述第三芯片线圈组3223包括设置于所述第四边的第四芯片线圈732231；所述第三芯片线圈732221和所述第四芯片线圈732231沿Y轴方向相对平行地设置。也可以说，所述第一芯片线圈732211和所述第二芯片线圈732212设置于所述感光组件40的第一边或第三边，所述第三芯片线圈732221和所述第四芯片线圈732231分别设置于所述感光组件40的第二边和第四边。
所述第一芯片线圈732211与所述第二芯片线圈732212共同作用驱动所述芯片防抖可动部33沿Y轴方向移动和/或绕Z轴方向旋转，所述第三芯片线圈732221、所述第四芯片线圈732231共同作用驱动所述芯片防抖可动部33沿X轴方向移动。
优选地，所述第一芯片线圈732211与所述第二芯片线圈732212的尺寸 相同，所述第三芯片线圈732221、所述第四芯片线圈732231的尺寸相同，所述第三芯片线圈732221与所述第四芯片线圈732231的尺寸小于所述第一芯片线圈732211、所述第二芯片线圈732212的尺寸。这是由于所述第三芯片线圈732221与第四芯片线圈732231仅需要驱动芯片防抖可动部33实现沿X轴方向平移即可，而所述第一芯片线圈732211和第二芯片线圈732212需要既驱动芯片防抖可动部33实现沿Y轴方向平移，又要驱动芯片防抖可动部33实现绕Z轴旋转。
在本申请的一个实施例中，所述芯片线圈组件322还包括被设置于所述芯片可动载体331的线圈电路板3224，所述芯片线圈组件322中至少一芯片线圈被固定且电连接于所述线圈电路板3224。在本申请的一个具体示例中，所述第一芯片线圈组3221(所述第一芯片线圈732211、所述第二芯片线圈732212)、所述第二芯片线圈组3222(所述第三芯片线圈732221)和所述第三芯片线圈组3223(所述第四芯片线圈732231)均固定并电连接于所述线圈电路板3224，所述芯片线圈组件322通过所述线圈电路板3224电连接于所述芯片防抖导电部35从而进一步电连接于所述感光组件40的线路板41。具体地，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223可以是绕制成型的线圈固定电连接于所述线圈电路板3224；或者，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223可以是直接在所述线圈电路板3224上绕制成型；或者，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223是直接在所述线圈电路板3224上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述芯片线圈组件322的高度，从而降低所述芯片驱动马达30的高度。进一步地，所述线圈电路板3224具有一电路板通光孔32241，所述电路板通光孔32241提供所述光学镜头10的光线入射所述感光组件40一通光孔。
相应地，在本申请的一个实施例中，所述芯片磁石组件321包括第一芯片磁石组3211、第二芯片磁石组3212和第三芯片磁石组3213，所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步地，所述第一芯片磁石组3211与所述第一芯片线圈组3221上下相对设置，所述第二芯片磁石组3212与所述第二芯片线圈组3222上下相对设置，所述第三芯片磁石组 3213与所述第三芯片线圈组3223上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第一芯片磁石组3211沿X轴方向设置，所述第二芯片磁石组3212和所述第三芯片磁石组3213沿Y轴方向设置，所述第二芯片磁石组3212与所述第三芯片磁石组3213沿Y轴方向相对设置，所述第二芯片磁石组3212与所述第三芯片磁石组3213相对于X轴对称。在本申请中，上方为远离所述感光组件40的一侧，下方为靠近所述感光组件40的一侧。
所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第一芯片磁石组3211包括第一芯片磁石732111和第二芯片磁石732112，所述第一芯片磁石732111和所述第二芯片磁石732112沿X轴方向排列，具体地，所述第一芯片磁石732111和所述第二芯片磁石732112沿X轴方向相对平行地设置。所述第二芯片磁石组3212包括第三芯片磁石732121；所述第三芯片磁石组3213包括第四芯片磁石732131，所述第三芯片磁石732121和所述第四芯片磁石732131沿Y轴方向相对平行地设置。更具体地，在本申请实施例中，所述第一芯片磁石组3211设置于所述感光组件40的沿X轴方向的相对的两角处(即，转角区域)，所述第二芯片磁石组3212和所述第三芯片磁石组3213设置于所述感光组件40的沿Y轴方向的相对的两边处。
所述第一芯片磁石732111和所述第二芯片磁石732112共同作用驱动所述芯片防抖可动部33沿Y轴方向移动和/或绕Z轴方向旋转，所述第三芯片磁石732121、所述第四芯片磁石732131共同作用驱动所述芯片防抖可动部33沿X轴方向移动。
优选地，所述第一芯片磁石732111和所述第二芯片磁石732112的尺寸相同，所述第三芯片磁石732121、所述第四芯片磁石732131尺寸相同，所述第三芯片磁石732121和所述第四芯片磁石732131的尺寸小于所述第一芯片磁石732111、所述第二芯片磁石732112。这是由于所述第三芯片磁石732121与第四芯片磁石732131仅需要驱动芯片防抖可动部33实现沿X轴方向平移即可，而所述第一芯片磁石732111和第二芯片磁石732112需要既驱动芯片防抖可动部33实现沿Y轴方向平移，又要驱动芯片防抖可动部33实现绕Z轴旋转。
所述第一芯片线圈组3221和所述第一芯片磁石组3211相互作用，带动所述芯片防抖可动部33，进而带动所述感光组件40在Y轴方向上平移和/或绕Z轴方向旋转；所述第二芯片线圈组3222和所述第二芯片磁石组3212相互作用、所述第三芯片线圈组3223和所述第三芯片磁石组3213相互作用，共同带动所述芯片防抖可动部33，进而带动所述感光组件40在X轴方向上平移。
参考图17所示，在本申请的一个实施方式中，所述芯片可动载体331的至少一条边没有设置所述芯片线圈组件322。具体地，所述芯片可动载体331包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对。所述第一边和所述第三边沿着所述驱动组件所设定的X轴方向延伸，所述第二边和所述第四边沿着所述驱动组件所设定的Y轴方向延伸，所述Y轴方向垂直于所述X轴方向。所述芯片线圈组件322包括设置于所述第一边的第一芯片线圈组3221，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组3222和第三芯片线圈组3223。
所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223设置于X轴和Y轴所在平面，即，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223沿水平方向设置。所述第一芯片线圈组3221沿X轴方向设置，所述第二芯片线圈组3222沿Y轴方向设置，所述第三芯片线圈组3223沿Y轴方向设置，所述第二芯片线圈组3222与所述第三芯片线圈组3223沿Y轴方向相对设置。进一步地，所述第二芯片线圈组3222与所述第三芯片线圈组3223相对于Y轴对称。所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223围绕所述感光组件40的三边设置。
所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223分别包括至少一个芯片线圈。也就是，所述第一芯片线圈组3221包括至少一芯片线圈，所述第二芯片线圈组3222包括至少一芯片线圈，所述第三芯片线圈组3223包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第一芯片线圈组3221包括设置于所述第一边的两个相对的第一芯片线圈832211，形成一对第一芯片线圈832211，一对所述第一芯片线圈832211沿X轴方向排列，具体地，一对所述第一芯片线圈832211沿所述 X轴方向平行地设置；所述第二芯片线圈组3222包括设置于所述第二边的第二芯片线圈832212；所述第三芯片线圈组3223包括设置于所述第四边的与设置于所述第二边的第二芯片线圈832212相对的另一第二芯片线圈832212，形成一对第二芯片线圈832212；一对所述第二芯片线圈832212沿Y轴方向相对平行地设置。也可以说，一对所述第一芯片线圈832211设置于所述感光组件40的第一边或第三边，一对所述第二芯片线圈832212中的两个第二芯片线圈832212分别设置于所述感光组件40的第二边和第四边。
一对所述第一芯片线圈832211共同作用驱动所述芯片防抖可动部33沿Y轴方向移动和/或绕Z轴方向旋转，一对所述第二芯片线圈832212共同作用驱动所述芯片防抖可动部33沿X轴方向移动。
优选地，一对所述第一芯片线圈832211的尺寸相同，一对所述第二芯片线圈832212的尺寸相同，所述第二芯片线圈832212的尺寸小于所述第一芯片线圈832211的尺寸。这是由于所述第二芯片线圈832212仅需要驱动芯片防抖可动部33实现沿X轴方向平移即可，而所述第一芯片线圈832211需要既驱动芯片防抖可动部33实现沿Y轴方向平移，又要驱动芯片防抖可动部33实现绕Z轴旋转。
在本申请的一个实施例中，所述芯片线圈组件322还包括被设置于所述芯片可动载体331的线圈电路板3224，所述芯片线圈组件322中至少一芯片线圈被固定且电连接于所述线圈电路板3224。在本申请的一个具体示例中，所述第一芯片线圈组3221(一对所述第一芯片线圈832211)、所述第二芯片线圈组3222(一个所述第二芯片线圈832212)和所述第三芯片线圈组3223(一个所述第二芯片线圈832212)均被固定且电连接于所述线圈电路板3224，所述芯片线圈组件322通过所述线圈电路板3224电连接于所述芯片防抖导电部35从而进一步电连接于所述感光组件40的线路板41。具体地，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223可以是绕制成型的线圈固定电连接于所述线圈电路板3224；或者，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223可以是直接在所述线圈电路板3224上绕制成型；或者，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223是直接在所述线圈电路板3224上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述芯片线圈组件322的高度，从而降低所述芯片驱动马达30的 高度。进一步地，所述线圈电路板3224具有一电路板通光孔32241，所述电路板通光孔32241提供所述光学镜头10的光线入射所述感光组件40一通光孔。
相应地，在本申请的一个实施例中，所述芯片磁石组件321包括第一芯片磁石组3211、第二芯片磁石组3212和第三芯片磁石组3213，所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步地，所述第一芯片磁石组3211与所述第一芯片线圈组3221上下相对设置，所述第二芯片磁石组3212与所述第二芯片线圈组3222上下相对设置，所述第三芯片磁石组3213与所述第三芯片线圈组3223上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第一芯片磁石组3211沿X轴方向设置，所述第二芯片磁石组3212和所述第三芯片磁石组3213沿Y轴方向设置，所述第二芯片磁石组3212与所述第三芯片磁石组3213沿Y轴方向相对设置，所述第二芯片磁石组3212与所述第三芯片磁石组3213相对于Y轴对称。在本申请中，上方为远离所述感光组件40的一侧，下方为靠近所述感光组件40的一侧。
所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第一芯片磁石组3211包括两个相对的第一芯片磁石832111，形成一对第一芯片磁石832111，一对所述第一芯片磁石832111沿X轴方向排列，具体地，两个所述第一芯片磁石832111沿X轴方向平行地设置。所述第二芯片磁石组3212包括一个第二芯片磁石832112；所述第三芯片磁石组3213包括一个第二芯片磁石832112，形成一对第二芯片磁石832112，一对所述第二芯片磁石832112沿Y轴方向相对平行地设置。更具体地，在本申请实施例中，所述第一芯片磁石组3211设置于所述感光组件40的沿X轴方向的相对的两角处(即，转角区域)，所述第二芯片磁石组3212和所述第三芯片磁石组3213设置于所述感光组件40的沿Y轴方向的相对的两边处。
一对所述第一芯片磁石832111共同作用驱动所述芯片防抖可动部33沿Y轴方向移动和/或绕Z轴方向旋转，一对所述第二芯片磁石组3212共同作用驱动所述芯片防抖可动部33沿X轴方向移动。
优选地，一对所述第一芯片磁石832111的尺寸相同，一对所述第二芯 片磁石组3212尺寸相同，所述第二芯片磁石组3212的尺寸小于所述第一芯片磁石832111。这是由于所述第二芯片磁石组3212仅需要驱动芯片防抖可动部33实现沿X轴方向平移即可，而所述第一芯片磁石832111需要既驱动芯片防抖可动部33实现沿Y轴方向平移，又要驱动芯片防抖可动部33实现绕Z轴旋转。
所述第一芯片线圈组3221和所述第一芯片磁石组3211相互作用，带动所述芯片防抖可动部33，进而带动所述感光组件40在Y轴方向上平移和/或绕Z轴方向旋转；所述第二芯片线圈组3222和所述第二芯片磁石组3212相互作用、所述第三芯片线圈组3223和所述第三芯片磁石组3213相互作用，共同带动所述芯片防抖可动部33，进而带动所述感光组件40在X轴方向上平移。
如图9所示，在本申请一实施例中，所述芯片驱动马达30的至少一侧不设置有芯片驱动元件32，以为所述感光芯片42的偏心设置提供更大的空间位置。即，所述感光芯片42可以靠近于所述芯片驱动马达30上不设置有芯片驱动元件32的一侧设置，以使得所述感光芯片42的中心轴与所述芯片驱动马达30的中心轴不一致。进一步地，当本申请中所述偏心的感光芯片42应用于摄像模组1时，所述芯片驱动马达30的至少一侧不设置有芯片驱动元件32的设置方式，可以避免磁干扰问题影响所述镜头驱动马达20配合方案的选型。
具体地，在本申请一实施例中，所述芯片磁石组件321和芯片线圈组件322集中设置于所述感光芯片42的三边，所述感光芯片42的除三边外的一边没有设置有芯片驱动元件32，这种设置方式使得所述感光芯片42的中心轴以偏心的状态设置于所述芯片可动载体331，所述感光芯片42的中心O更靠近于所述芯片可动载体331上没有设置所述芯片驱动元件32的一边。例如，在本申请一具体示例中，所述第一芯片磁石组3211和第一芯片线圈组3221设置于所述感光芯片42的第一边，所述第二芯片磁石组3212、第二芯片线圈组3222和所述第三芯片磁石组3213、第三芯片线圈组3223设置于所述感光芯片42的第二边和第四边，这种设置方式使得所述感光芯片42的中心O靠近于所述芯片可动载体331的第一边，即，所述感光芯片42的中心轴与所述芯片驱动马达30的中心轴不一致。
在本申请的一个实施例中，所述芯片磁石组件321还包括设置于所述第 一芯片磁石组3211、所述第二芯片磁石组3212、所述第三芯片磁石组3213和所述上盖311之间的导磁构件(图中未示出)。所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213通过所述导磁构件被间接固定于所述上盖311，所述导磁构件适于增强所述芯片磁石组件321朝向所述线圈磁石组件方向的磁场力，从而增强所述芯片驱动元件32的驱动力。
在本申请的一个实施例中，所述芯片驱动马达30还包括芯片位置感测组件36和芯片保持组件34，所述芯片位置感测组件36用于获取所述感光组件40的位置或者运动信息，所述芯片保持组件34适于使得所述芯片可动载体331被悬空地设置于所述芯片防抖固定部31的收容腔内，这样，所述感光组件40可以被所述芯片保持组件34被悬持于所述芯片防抖固定部31中。
如图7和图8所示，所述芯片位置感测组件36固定于所述芯片可动载体331，从而当所述芯片可动载体331运动时，所述芯片位置感测组件36适于通过获取芯片磁石组件321的磁场变化获取所述芯片可动载体331的位置信息。
芯片位置感测组件36包括至少一位置感测元件，所述位置感测元件的数量并不为本申请所局限。在本申请的一个具体示例中，所述芯片位置感测组件36包括第一位置感测元件361、第二位置感测元件362和第三位置感测元件363，从而用于感测所述芯片可动载体331沿X轴方向平移、沿Y轴方向平移和绕Z轴方向旋转三种移动的位置信息。在本申请实施例中，所述第一位置感测元件361、所述第二位置感测元件362和所述第三位置感测元件363为霍尔元件；在本申请其他实施例中，所述第一位置感测元件361、所述第二位置感测元件362和所述第三位置感测元件363为含有位置感测功能的驱动芯片。
在本申请一具体示例中，所述芯片载体主体3311上形成有感测元件凹槽33114(如图6所示)，所述芯片位置感测组件36设置于所述感测元件凹槽33114中，进而防止所述芯片位置感测组件36的高度过高，而所述芯片位置感测组件36电连接于所述感光组件40的线路板41，在所述芯片可动载体331所设定的高度(Z轴)方向上，所述芯片位置感测元件被设置在所述芯片线圈组件322和所述线路板41之间。优选地，所述芯片位置感测组件36容置于所述感测元件凹槽33114中，不突出于所述感测元件凹槽33114。
所述芯片保持组件34包括被设置于所述芯片可动载体331和所述上盖311之间的芯片支撑组件341和芯片磁吸组件342，所述芯片磁吸组件342固定于所述芯片防抖可动部33的芯片可动载体331，这样，所述芯片磁吸组件342与所述芯片磁石组件321之间的磁吸力使所述芯片防抖可动部33吸附向所述上盖311。所述芯片支撑组件341设置于所述芯片防抖固定部31的上盖311与所述芯片防抖可动部33的芯片可动载体331之间，在所述芯片磁吸组件342与所述芯片磁石组件321之间的磁吸力的作用下，所述芯片支撑组件341被所述上盖311和所述芯片可动载体331夹持，所述芯片可动载体331与所述上盖311之间保持间隙，从而减小所述芯片防抖可动部33在运动时的阻力。
在本申请实施例中，所述芯片支撑组件341包括被夹持地设置于所述芯片防抖可动部33和所述芯片防抖固定部31之间的至少三支撑组件，每一组支撑组件包括凹陷地形成于所述芯片可动载体331的滚珠槽3412以及被设置于所述滚珠槽3412内的滚珠3411，如图10至图12所示。所述滚珠3411和滚槽的数量并不为本申请所局限，在本申请的一个实施例中，所述芯片支撑组件341包括三个支撑组件，每个支撑组件包括至少一滚珠3411和至少一滚珠槽3412，也就是说，所述芯片支撑组件341包括至少三个设置于所述芯片可动载体331和所述上盖311之间的滚珠3411，为限制所述滚珠3411的移动范围，所述芯片支撑组件341还包括至少三个与至少三个所述滚珠3411相对应的滚珠槽3412，优选地，至少三个所述滚珠槽3412形成于所述芯片可动载体331，所述滚珠槽3412的深度小于所述滚珠3411的直径，所述滚珠3411的至少一部分可以突出于所述滚珠槽3412，以使得所述滚珠3411可以与所述上盖311保持摩擦接触。
进一步地，所述芯片可动载体331还包括突出地形成于所述芯片载体主体3311的上表面的延伸柱3313，所述滚珠槽3412凹陷地形成于所述延伸柱3313的上表面。在本申请的一个实施例中，所述芯片可动载体331包括形成于所述芯片载体主体3311上的至少三延伸柱3313，至少三所述延伸柱3313突出于所述芯片载体主体3311的上表面，至少三所述滚珠槽3412形成于至少三所述延伸柱3313。所述芯片支撑组件341设置于所述延伸柱3313与所述上盖311之间，以使得所述芯片可动载体331与所述上盖311之间保持一定的间隙，该间隙不随所述芯片可动载体331的移动而发生改变。
在本申请的一个具体示例中，所述芯片可动载体331包括形成于所述芯片载体主体3311上的三个延伸柱3313，所述芯片支撑组件341包括三个由所述延伸柱3313的顶面下凹形成的三个滚珠槽3412和设置于三个所述滚珠槽3412和所述上盖311之间的三个滚珠3411。
特别地，在本申请实施例中，所述至少三支撑组件以不完全共线的方式布设。相应地，在上述具体示例中，三个所述延伸柱3313分布在所述芯片载体主体3311两个相邻角，以及与相邻角连线所在边相对的边上，即三个滚珠3411呈三角形的布设形态分布，以对所述芯片可动载体331形成平稳的支撑。
进一步参照图12，所述芯片支撑组件341还包括内嵌于所述芯片可动载体331内且位于所述滚珠槽3412的底部的滚珠支撑片3413，所述滚珠3411被支持于所述滚珠支撑片3413。在本申请的一个实施例中，所述芯片支撑组件341还包括至少三滚珠支撑片3413，所述滚珠支撑片3413固定于所述芯片可动载体331并作为所述滚珠槽3412的底面，所述滚珠支撑片3413可以是不锈钢等金属材质，进而提供所述滚珠3411一更平滑的支撑面，减小滚珠3411滚动的摩擦力。在本申请的具体示例中，所述芯片支撑组件341包括三个滚珠支撑片3413，每个滚珠支撑片3413通过嵌件成型的方式固定于所述芯片可动载体331的延伸柱3313中并裸露其上表面作为每个滚珠槽3412的底面，进一步参照图13A，所述滚珠支撑片3413包括支撑片主体34131和支撑片连接部34132，所述支撑片主体34131和所述支撑片连接部34132一体延伸，所述支撑片主体34131的上表面裸露并作为所述滚珠槽3412的底面，所述支撑片连接部34132用于在嵌件成型工艺中保持所述滚珠支撑片3413在所述芯片可动载体331中的位置，所述支撑片连接部34132可以连接其他滚珠支撑片3413的支撑片连接部34132或者连接其他用于支撑所述支撑片连接部34132的支持部件。在所述滚珠支撑片3413通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述支撑片连接部34132，所述支撑片连接部34132的一部分可以裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述滚珠支撑片3413包括位于所述滚珠槽3412的底部的支撑片主体34131和从所述支撑片主体34131延伸至所述芯片可动载体331外的支撑片连接部34132。
如图11和图13A所示，在本申请的一些实施方式中，所述芯片磁吸组 件342包括至少一个芯片磁吸元件3421，所述芯片磁吸元件3421被包覆于所述芯片防抖可动部33的芯片可动载体331内，以通过所述芯片磁石组件321与所述至少一芯片磁吸元件3421之间的磁吸力使得所述芯片可动载体331被悬持地设置于所述芯片防抖固定部31的收容腔内。在本申请的一个具体示例中，至少一个所述芯片磁吸元件3421通过嵌件成型工艺内嵌于所述芯片防抖可动部33的芯片可动载体331内，至少一个所述芯片磁吸元件3421与所述芯片磁石组件321相对设置，以在至少一个所述芯片磁吸元件3421与所述芯片磁石组件321之间产生磁吸力，一方面，通过磁吸力的作用使得所述芯片支撑组件341被夹持在所述芯片防抖固定部31和所述芯片防抖可动部33之间，具体地，通过所述至少一芯片磁吸元件3421与所述芯片磁石组件321之间的磁吸力，所述滚珠3411被夹持于所述上盖311和所述芯片可动载体331之间；另一方面，在所述芯片可动载体331移动后，通过磁吸力的作用使得所述芯片可动载体331保持于一位置，其中，该位置可以为所述芯片可动载体331被驱动前的初始位置。所述芯片磁吸元件3421由具有导磁性质的材料制成，其适于与磁石之间产生磁吸力。
所述芯片磁吸元件3421包括磁吸元件主体34211和磁吸元件连接部34212，所述磁吸元件主体34211和所述磁吸元件连接部34212一体延伸，所述磁吸元件连接部34212用于在嵌件成型工艺中保持所述芯片磁吸元件3421在所述芯片可动载体331中的位置，所述磁吸元件连接部34212可以连接其他芯片磁吸元件3421的磁吸元件连接部34212或者连接其他用于支撑所述磁吸元件连接部34212的支持部件。在所述芯片磁吸元件3421通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述磁吸元件连接部34212，所述磁吸元件连接部34212的一部分可以裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述芯片磁吸元件3421包括被包覆于所述芯片可动载体331内的磁吸元件主体34211和从所述磁吸元件主体34211延伸至所述芯片可动载体331外的磁吸元件连接部34212。
在本申请的一个实施例中，所述芯片磁吸元件3421的上表面裸露，未被所述芯片可动载体331包裹；在本申请的其他实施例中，所述芯片磁吸元件3421的上表面也可以被所述芯片可动载体331包裹，本申请并不为此所限。
特别地，在本申请一个实施例中，如图11和图13A所示，所述芯片磁 吸组件342包括第一芯片磁吸组件3422和第二芯片磁吸组件3423，其中，通过对所述第一芯片磁吸组件3422和所述第二芯片磁吸组件3423的合理布设，使得所述第一芯片磁吸组件3422和所述第二芯片磁吸组件3423发挥的主要作用不同。沿Z轴方向看其表面，所述三颗滚珠3411呈三角形的布设形态，所述第一芯片磁吸组件3422设置于三角形平面的角处(即，转角区域)，所述第一芯片磁吸组件3422靠近于所述滚珠3411设置，所述第一芯片磁吸组件3422的主要作用在于与所述芯片磁石组件321产生沿Z轴方向的磁吸力，使得所述芯片支撑组件341被夹持在所述芯片防抖固定部31和所述芯片防抖可动部33之间；所述第二芯片磁吸组件3423设置于三角形平面的边处，即，所述第二芯片磁吸组件3423到所述滚珠3411的距离相对于所述第一芯片磁吸组件3422到所述滚珠3411的距离更远，所述第二芯片磁吸组件3423的主要作用在于在所述芯片可动载体331移动后，与所述芯片磁石组产生与Z轴方向具有一定夹角的磁吸力，该磁吸力的主要作用是使得所述芯片可动载体331回复于一位置。当然，本申请中所述第一芯片磁吸组件3422与第二芯片磁吸组件3423的主要功能不同，不等于所述第一芯片磁吸组件3422与第二芯片磁吸组件3423不会具有其他功能。也就是说，所述第一芯片磁吸组件3422也会具有在所述芯片可动载体331移动后，通过磁吸力的作用使得所述芯片可动载体331回复于一位置的功能，所述第二芯片磁吸组件3423也会具有通过磁吸力的作用使得所述芯片支撑组件341被夹持在所述芯片防抖固定部31和所述芯片防抖可动部33之间的功能，所述第一芯片磁吸组件3422与第二芯片磁吸组件3423相互配合，共同作用于所述芯片可动载体331，但由于所述第一芯片磁吸组件3422与第二芯片磁吸组件3423的位置不同，使得二者的主要作用不相同。
具体地，在本申请实施例中，所述第一芯片磁吸组件3422的数量为4，包括第一芯片磁吸元件734221、第二芯片磁吸元件734222、第三芯片磁吸元件734223和第四芯片磁吸元件734224。所述第一芯片磁吸元件734221与所述第一芯片磁石732111沿所述芯片可动载体331所设定的高度方向相对设置，所述第二芯片磁吸元件734222与所述第二芯片磁石732112沿所述芯片可动载体331所设定的高度方向相对设置，所述第三芯片磁吸元件734223与所述第三芯片磁石732121沿所述芯片可动载体331所设定的高度方向相对设置，所述第四芯片磁吸元件734224与所述第四芯片磁石732131 沿所述芯片可动载体331所设定的高度方向相对设置，本申请中所述芯片磁石组件321与所述第一芯片磁吸组件3422在沿所述芯片可动载体331所设定的高度方向相对设置并不需要完全正对，也就是说所述芯片磁石组件321的投影与所述第一芯片磁吸组件3422的投影至少一部分重叠即可。
所述第一芯片磁吸元件734221和所述第二芯片磁吸元件734222设置于所述芯片可动载体331的第一边，所述第三芯片磁吸元件734223和所述第四芯片磁吸元件734224分别设置于所述芯片可动载体331的第二边和第四边。也可以说，所述第一芯片磁吸元件734221、第二芯片磁吸元件734222、第三芯片磁吸元件734223和第四芯片磁吸元件734224根据所述滚珠3411的位置而进行设置。
进一步地，所述第一芯片磁吸元件734221和第二芯片磁吸元件734222沿X轴方向靠近于所述滚珠3411设置，所述第一芯片磁吸元件734221和第二芯片磁吸元件734222分别设置于两颗所述滚珠3411的两侧；所述第三芯片磁吸元件734223和第四芯片磁吸元件734224沿Y轴方向靠近于所述滚珠3411设置，所述第三芯片磁吸元件734223和第四芯片磁吸元件734224分别设置于一颗所述滚珠3411的一侧。由于所述第一芯片磁吸组件3422距离所述滚珠3411更靠近，其与所述芯片磁石组件321之间产生的夹持所述芯片支撑组件341磁吸力更加明显。
更具体地，在本申请实施例中，所述第二芯片磁吸组件3423的数量为2，包括第五芯片磁吸元件734231和第六芯片磁吸元件734232，其中所述第五芯片磁吸元件734231与所述第三芯片磁石732121沿所述芯片可动载体331所设定的高度方向相对设置，所述第六芯片磁吸元件734232与所述第四芯片磁石732131沿所述芯片可动载体331所设定的高度方向相对设置。进一步地，在本申请一具体示例中，所述第五芯片磁吸元件734231设置于第一芯片磁石732111和第三芯片磁石32131之间，所述第六芯片磁吸元件734232设置于所述第二芯片磁石732112和第四芯片磁石32121之间。也可以说，所述第五芯片磁吸元件734231设置于所述芯片可动载体331的第二边，所述第六芯片磁吸元件734232设置于所述芯片可动载体331的第四边。这种设置方式，使得在所述芯片可动载体331移动后，所述第二芯片磁吸组与所述芯片磁石组件321之间产生与Z轴方向具有一定夹角的磁吸力，磁吸力的作用使得所述芯片可动载体331回复于一位置。当然，可以理解的是，在这 一过程中，所述第一芯片磁吸组件3422与所述芯片磁石组件321之间也会产生磁吸力，使得所述芯片可动载体331回复于一位置。
值得一提的是，所述第二芯片磁吸组件3423与所述芯片磁石组件321之间产生的磁吸力可以是与所述芯片可动载体331移动方向相反的力，此时的磁吸力为复位力，使得所述芯片可动载体331回复于一位置；所述第二芯片磁吸组件3423与所述芯片磁石组件321之间产生的磁吸力也可以是与所述芯片可动载体331移动方向相同的力，此时的磁吸力为外吸力，这是由于当所述芯片可动载体331移动后，所述感光组件40的线路板41也会产生一定的复位力，所述外吸力与所述线路板41的复位力稍微抵消，以补偿所述芯片可动载体331在边缘行程的推力。
特别地，在本申请一个实施例中，如图21和图23所示，所述芯片磁吸组件342包括第一芯片磁吸组件3422和第二芯片磁吸组件3423，其中，通过对所述第一芯片磁吸组件3422和所述第二芯片磁吸组件3423的合理布设，使得所述第一芯片磁吸组件3422和所述第二芯片磁吸组件3423发挥的主要作用不同。沿Z轴方向看其表面，所述三颗滚珠3411呈三角形的布设形态，所述第一芯片磁吸组件3422设置于三角形平面的角处(即，转角区域)，所述第一芯片磁吸组件3422靠近于所述滚珠3411设置，所述第一芯片磁吸组件3422的主要作用在于与所述芯片磁石组件321产生沿Z轴方向的磁吸力，使得所述芯片支撑组件341被夹持在所述芯片防抖固定部31和所述芯片防抖可动部33之间；所述第二芯片磁吸组件3423设置于三角形平面的边处，即，所述第二芯片磁吸组件3423到所述滚珠3411的距离相对于所述第一芯片磁吸组件3422到所述滚珠3411的距离更远，所述第二芯片磁吸组件3423的主要作用在于在所述芯片可动载体331移动后，与所述芯片磁石组产生与Z轴方向具有一定夹角的磁吸力，该磁吸力的主要作用是使得所述芯片可动载体331回复于一位置。当然，本申请中所述第一芯片磁吸组件3422与第二芯片磁吸组件3423的主要功能不同，不等于所述第一芯片磁吸组件3422与第二芯片磁吸组件3423不会具有其他功能。也就是说，所述第一芯片磁吸组件3422也会具有在所述芯片可动载体331移动后，通过磁吸力的作用使得所述芯片可动载体331回复于一位置的功能，所述第二芯片磁吸组件3423也会具有通过磁吸力的作用使得所述芯片支撑组件341被夹持在所述芯片防抖固定部31和所述芯片防抖可动部33之间的功能，所述第 一芯片磁吸组件3422与第二芯片磁吸组件3423相互配合，共同作用于所述芯片可动载体331，但由于所述第一芯片磁吸组件3422与第二芯片磁吸组件3423的位置不同，使得二者的主要作用不相同。
具体地，所述第一芯片磁吸组件3422包括至少一第一芯片磁吸元件834221，所述第二芯片磁吸组件3423包括至少一第二芯片磁吸元件834231，所述第一芯片磁吸元件834221邻近于所述至少三支撑组件中的第一支撑组件，所述第二芯片磁吸元件834231与所述至少三支撑组件中任一支撑组件之间的距离大于所述第一芯片磁吸元件834221与所述第一支撑组件之间的距离。
在本申请实施例中，所述第一芯片磁吸组件3422的数量为4，所述第二芯片磁吸组件3423的数量为2。所述第一芯片磁吸组件3422包括两个相对的第一芯片磁吸元件834221和两个相对的第三芯片磁吸元件834222，形成一对第一芯片磁吸元件834221和一对第三芯片磁吸元件834222，所述第二芯片磁吸组件3423包括两个第二芯片磁吸元件834231，形成一对第二芯片磁吸元件834231。
一对所述第一芯片磁吸元件834221与一对所述第一芯片磁石832111沿所述芯片可动载体331所设定的高度方向相对设置，一对所述第二芯片磁吸元件834231与一对所述第二芯片磁石832112沿所述芯片可动载体331所设定的高度方向相对设置。也就是，一对所述第一芯片磁吸元件834221在所述芯片可动载体331所设定的高度方向上对应于一对所述第一芯片磁石832111，一对所述第二芯片磁吸元件834231在所述芯片可动载体331所设定的高度方向上对应于一对所述第二芯片磁石832112。本申请中所述芯片磁石组件321与所述第一芯片磁吸组件3422在沿所述芯片可动载体331所设定的高度方向相对设置并不需要完全正对，也就是说所述芯片磁石组件321的投影与所述第一芯片磁吸组件3422的投影至少一部分重叠即可。
一对所述第一芯片磁吸元件834221被设置于所述芯片可动载体331的第一边，位于所述第一支撑组件的相对的两侧，一对第三芯片磁吸元件834222设置于所述芯片可动载体331的第二边和第四边，其中一个第三芯片磁吸元件834222邻近于所述第二支撑组件，另一个第三芯片磁吸元件834222邻近于所述第三支撑组件。也可以说，所述第一芯片磁吸元件834221和第三芯片磁吸元件834222根据所述支撑组件的滚珠3411的位置而进行设 置。
进一步地，一对所述第一芯片磁吸元件834221沿X轴方向靠近于所述滚珠3411设置，一对所述第一芯片磁吸元件834221分别设置于两颗所述滚珠3411的两侧；一对所述第三芯片磁吸元件834222沿Y轴方向靠近于所述滚珠3411设置，所述第三芯片磁吸元件834222分别设置于一颗所述滚珠3411的一侧。由于所述第一芯片磁吸组件3422距离所述滚珠3411更靠近，其与所述芯片磁石组件321之间产生的夹持所述芯片支撑组件341磁吸力更加明显。
值得一提的是，所述第一芯片磁吸元件834221的尺寸和所述第三芯片磁吸元件834222的尺寸大于所述第二芯片磁吸元件834231的尺寸。这是由于所述第一芯片磁吸元件834221和所述第三芯片磁吸元件834222的主要功能在于夹持所述滚珠3411，其也起到使所述芯片可动载体331复位的作用，所述第二芯片磁吸元件834231与和其对应的芯片磁石元件仅产生使所述芯片可动载体331复位的复位力即可。
在本申请实施例中，一对所述第二芯片磁吸元件834231与所述第二芯片磁石832112沿所述芯片可动载体331所设定的高度方向相对设置。进一步地，在本申请一具体示例中，一对所述第二芯片磁吸元件834231设置于一对第一芯片磁石832111和一对第三芯片磁石32131之间。具体地，一对所述第二芯片磁吸元件834231中一个第二芯片磁吸元件834231被设置于所述芯片可动载体331的第二边的中间区域，另一个第二芯片磁吸元件834231被设置于所述芯片可动载体331的第四边的中间区域。这种设置方式，使得在所述芯片可动载体331移动后，所述第二芯片磁吸组件3423与所述芯片磁石组件321之间产生与Z轴方向具有一定夹角的磁吸力，磁吸力的作用使得所述芯片可动载体331回复于一位置。当然，可以理解的是，在这一过程中，所述第一芯片磁吸组件3422与所述芯片磁石组件321之间也会产生磁吸力，使得所述芯片可动载体331回复于一位置。
值得一提的是，所述第二芯片磁吸组件3423与所述芯片磁石组件321之间产生的磁吸力可以是与所述芯片可动载体331移动方向相反的力，此时的磁吸力为复位力，使得所述芯片可动载体331回复于一位置；所述第二芯片磁吸组件3423与所述芯片磁石组件321之间产生的磁吸力也可以是与所述芯片可动载体331移动方向相同的力，此时的磁吸力为外吸力，这是由于 当所述芯片可动载体331移动后，所述感光组件40的线路板41也会产生一定的复位力，所述外吸力与所述线路板41的复位力稍微抵消，以补偿所述芯片可动载体331在边缘行程的推力。
在本申请的一个具体示例中，所述芯片磁吸组件342包括六个芯片磁吸元件3421，每两个所述芯片磁吸元件3421的形状相同，从而提供均匀、稳定的磁吸力，使所述芯片可动载体331被平稳的吸附向所述上盖311。
在本申请中，所述芯片可动载体331可以通过注塑工艺以嵌件成型的方式与所述滚珠支撑片3413、所述芯片磁吸元件3421一体成型，以减少芯片驱动马达30的部品数量，所述芯片防抖导电部35也可以通过嵌件成型的方式嵌入所述芯片防抖可动部33。
因此，本申请将所述芯片防抖导电部35通过例如嵌件成型的方式嵌入所述芯片防抖可动部33，提供一具有导电功能的芯片防抖可动部33，使得所述芯片线圈组件322可以通过所述芯片防抖可动部33与所述线路板41电连接。并且，由于所述芯片防抖导电部35通过嵌件成型的方式嵌入所述芯片防抖可动部33，所述芯片防抖可动部33适于提供两个平整的安装面用于安装固定所述芯片线圈组件322和所述线路板41，还能够减少所述芯片防抖马达的部件数量，减少所述芯片防抖马达的组装复杂程度，并保护芯片防抖导电部35。
具体地，图11和图13B示出了所述芯片防抖可动部33与所述芯片防抖导电部35的嵌入结构。所述芯片防抖导电部35包括至少一线圈导电组件351，在本申请的一个实施方式中，所述芯片防抖导电部35包括多个(两个及以上)线圈导电元件3511，多个所述线圈导电元件3511通过例如嵌件成型(Insert Molding)的方式嵌入于所述芯片可动载体331，即，所述线圈导电元件3511被包覆于所述芯片防抖可动载体内，以使得多个所述线圈导电元件3511可以电连接所述芯片线圈组件322和所述线路板41。
所述线圈导电组件351中所述线圈导电元件3511的数量与所述芯片线圈组件322所述需要的电路数量有关，参照图13B，在本申请的一个具体示例中，所述线圈导电组件351包括6个线圈导电元件3511。每一所述线圈导电元件3511具有被暴露的第一线圈导电端部35111、与所述第一线圈导电端部35111相对的且被暴露的第二线圈导电端部35113，以及，延伸并电导通于所述第一线圈导电端部35111和所述第二线圈导电端部35113之间的线圈 导电延伸部35112，所述第一线圈导电端部35111的位置高于所述第二线圈导电端部35113，所述线圈导电延伸部35112从所述第一线圈导电端部35111向下延伸至所述第二线圈导电端部35113。当所述线圈导电元件3511嵌入所述芯片可动载体331中时，所述芯片可动载体331不覆盖所述第一线圈导电端部35111的上表面，所述第一线圈导电端部35111的上表面裸露，用于与所述芯片线圈组件322电连接，所述芯片可动载体331不覆盖所述第二线圈导电端部35113的下表面，所述第二线圈导电端部35113的下表面裸露，用于与所述线路板41电连接，进而电导通所述芯片线圈组件322和所述线路板41。在本申请的一些实施方式中，所有所述线圈导电元件3511中至少部分线圈导电元件3511的第一线圈导电端部35111被暴露于所述芯片可动载体331的上表面，所述第二线圈导电端部35113被暴露于所述芯片可动载体331的下表面。所述芯片线圈组件322中至少一芯片线圈通过所述线圈电路板3224电连接于所述第一线圈导电端部35111的方式电连接于所述第一线圈导电端部35111，所述第二线圈导电端部35113适于电连接所述感光组件40的线路板41，通过这样的方式来实现所述芯片线圈组件322和所述线路板41之间的电导通。
在本申请实施例中，所述线圈导电元件3511的第一线圈导电端部35111组成所述芯片可动载体331的芯片载体主体3311的上导电部33112的一部分，所述线圈导电元件3511的第二线圈导电端部35113组成所述芯片可动载体331的芯片载体主体3311的下导电部33113的一部分。换言之，所述上导电部33112包括第一线圈导电端部35111，所述下导电部33113包括第二线圈导电端部35113。
进一步地，为了在嵌件成型工艺中保持所述线圈导电组件351在所述芯片可动载体331中的位置，所述线圈导电元件3511还包括线圈导电连接部35114，所述线圈导电连接部35114可以连接其他线圈导电元件3511的线圈导电连接部35114或者连接其他用于支撑所述线圈导电连接部35114的支持部件。在所述线圈导电组件351通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述线圈导电连接部35114，所述线圈导电连接部35114的一部分裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述线圈导电元件3511进一步包括从由所述第一线圈导电端部35111、所述第二线圈导电端部35113和所述线圈导电延伸部35112形成的线圈导电 主体延伸至所述芯片可动载体331外的线圈导电连接部35114。
在本申请的一个实施例中，所述第一线圈导电端部35111、第二线圈导电端部35113、所述线圈导电延伸部35112和所述线圈导电连接部35114由导电材质一体成型而成。在本申请的另一个实施例中，所述线圈导电元件3511未设有所述线圈导电连接部35114，进而所述第一线圈导电端部35111、第二线圈导电端部35113和所述线圈导电延伸部35112由导电材质一体成型而成。
在本申请的一个实施例中，所述芯片防抖导电部35还可以包括感测元件导电组件(图中未示出)，所述感测元件导电组件包括被包覆于所述芯片可动载体331内的至少一感测元件导电元件。每一所述感测元件导电元件包括被暴露于所述芯片可动载体331的上表面的第一感测元件导电端部、被暴露于所述芯片可动载体331的下表面且与所述第一感测元件导电端部相对的第二感测元件导电端部，以及，延伸于所述第一感测元件导电端部和所述第二感测元件导电端部之间的感测元件导电延伸部，其中，所述第一感测元件导电端部电连接于所述位置感测元件，所述第二感测元件导电端部适于电连接于所述线路板41，所述第一感测元件导电端部在所述芯片可动载体331所设定的高度方向上低于所述第一线圈导电端部35111。
在本申请的一个实施例中，所述滚珠支撑片3413、所述芯片磁吸组件342(包括芯片磁吸元件3421)和所述芯片防抖导电部35(包括线圈导电元件3511、感测元件导电元件)均通过注塑工艺以嵌件成型的方式嵌合在所述芯片可动载体331中，与所述芯片可动载体331一体成型，减小了所述芯片驱动马达30的部品数量，进而简化了所述芯片驱动马达30的结构和组装复杂度。
值得一提的是，所述芯片磁吸组件342(包括芯片磁吸元件3421)需要由具有导磁性的材料制成，而所述滚珠支撑片3413和所述芯片防抖导电部35(包括线圈导电元件3511、感测元件导电元件)需要由不具有导磁性的材料制成，因此，在嵌件成型工艺中，所述芯片磁吸组件342是同一层料带，而所述滚珠支撑片3413和所述芯片防抖导电部35是另一层料带，因此，在制成后，所述芯片磁吸组件342的至少一芯片磁吸元件3421的磁吸元件连接部34212的高度与所述滚珠支撑片3413的支撑连接部和所述芯片防抖导电部35的线圈导电连接部35114的高度不一致。也就是，所述芯片防抖导 电部35的线圈导电元件3511和滚珠支撑片3413不具有导磁性，所述磁吸组件的芯片磁吸元件3421具有导磁性，所述磁吸元件连接部34212与所述线圈导电连接部35114、所述支撑片连接部34132在所述芯片可动载体331所设定的高度方向上存在差异。
进一步地，对所述芯片可动载体331的安装及通电方式进行说明。在本申请的一个实施例中，通过在所述芯片可动载体331的上导电部33112上设置焊料(例如焊锡)与所述芯片线圈组件322的线圈电路板3224的背面上的焊盘电导通，通过在所述芯片可动载体331和所述线圈电路板3224之间设置黏合介质粘接固定所述线圈电路板3224和所述芯片可动载体331；通过在所述芯片可动载体331和所述线路板41之间设置黏合介质粘接固定所述芯片可动载体331和所述线路板41，而后通过在焊料将所述芯片可动载体331背面的下导电部33113和所述线路板41的线路板主体411的侧面电导通。
本申请进一步还提供一种芯片驱动马达30的驱动方法：
图14A至图14C分别示出了芯片防抖可动部33沿X轴方向平移或Y轴方向平移以及绕Z轴方向旋转时，各芯片防抖线圈的电流方向以及受力方向。
如图14A所示，所述第三芯片线圈732221和所述第四芯片线圈732231串联，当所述芯片可动载体331被驱动沿-X轴方向平移时，所述第三芯片线圈732221通入顺时针方向的电流，所述第四芯片线圈732231通入逆时针方向的电流，所述第三芯片线圈732221和第四芯片线圈732231受到电磁力的驱动，使得带有所述感光组件40的芯片可动载体331沿-X轴方向移动以进行补偿。其中，箭头I表示电流方向，F表示线圈的受力情况。在所述芯片可动载体331沿-X轴方向平移时，通过所述第三芯片线圈732221和第四芯片线圈732231的电流大小相同，所述第三芯片线圈732221和第四芯片线圈732231的受力大小相同，方向一致。反之，当所述第三芯片线圈732221通入逆时针方向的电流，所述第四芯片线圈732231通入顺时针方向的电流，带有所述感光组件40的芯片可动载体331沿+X轴方向平移进行补偿。
如图14B所示，所述第一芯片线圈732211和所述第二芯片线圈732212单独通电，当所述芯片可动载体331被驱动沿+Y轴方向平移时，所述第一芯片线圈732211通入顺时针方向的电流，所述第二芯片线圈732212通入顺时针方向的电流，所述第一芯片线圈732211和第二芯片线圈732212受到电 磁力的驱动，使得带有所述感光组件40的芯片可动载体331沿+Y轴方向移动以进行补偿。箭头I表示电流方向，F表示线圈的受力情况。在所述芯片可动载体331沿+Y轴方向平移时，通过所述第一芯片线圈732211和第二芯片线圈732212的电流大小相同，所述第一芯片线圈732211和第二芯片线圈732212的受力大小相同，方向一致。反之，当所述第一芯片线圈732211通入逆时针方向的电流，所述第二芯片线圈732212通入逆时针方向的电流，带有所述感光组件40的芯片可动载体331沿-Y轴方向平移进行补偿。
如图14C所示，所述第一芯片线圈732211和所述第二芯片线圈732212单独通电，当所述芯片可动载体331被驱动绕Z轴方向顺时针旋转运动时，所述第一芯片线圈732211通入逆时针方向的电流，所述第二芯片线圈732212通入顺时针方向的电流，所述第一芯片线圈732211受到-Y方向的电磁力驱动，所述第二芯片线圈732212受到+Y方向的电磁力驱动，进而使得所述芯片可动载体331受到扭转力，使得带有所述感光组件40的芯片可动载体331绕Z轴顺时针方向旋转移动以进行补偿。箭头I表示电流方向，F表示线圈的受力情况。在所述芯片可动载体331沿+Y轴方向平移时，通过所述第一芯片线圈732211和第二芯片线圈732212的电流大小相同，所述第一芯片线圈732211和第二芯片线圈732212的受力大小相同，方向相反。反之，当所述第一芯片线圈732211通入顺时针方向的电流，所述第二芯片线圈732212通入逆时针方向的电流，带有所述感光组件40的芯片可动载体331绕Z轴逆时针方向旋转运动进行补偿。
图24至图26分别示出了芯片防抖可动部33沿X轴方向平移或Y轴方向平移以及绕Z轴方向旋转时，各芯片防抖线圈的电流方向以及受力方向。
如图24所示，所述第三芯片线圈832221和所述第四芯片线圈832231串联，当所述芯片可动载体331被驱动沿-X轴方向平移时，所述第三芯片线圈832221通入顺时针方向的电流，所述第四芯片线圈832231通入逆时针方向的电流，所述第三芯片线圈832221和第四芯片线圈832231受到电磁力的驱动，使得带有所述感光组件40的芯片可动载体331沿-X轴方向移动以进行补偿。其中，箭头I表示电流方向，F表示线圈的受力情况。在所述芯片可动载体331沿-X轴方向平移时，通过所述第三芯片线圈832221和第四芯片线圈832231的电流大小相同，所述第三芯片线圈832221和第四芯片线圈832231的受力大小相同，方向一致。反之，当所述第三芯片线圈832221 通入逆时针方向的电流，所述第四芯片线圈832231通入顺时针方向的电流，带有所述感光组件40的芯片可动载体331沿+X轴方向平移进行补偿。
如图25所示，所述第一芯片线圈832211和所述第二芯片线圈832212单独通电，当所述芯片可动载体331被驱动沿+Y轴方向平移时，所述第一芯片线圈832211通入顺时针方向的电流，所述第二芯片线圈832212通入顺时针方向的电流，所述第一芯片线圈832211和第二芯片线圈832212受到电磁力的驱动，使得带有所述感光组件40的芯片可动载体331沿+Y轴方向移动以进行补偿。箭头I表示电流方向，F表示线圈的受力情况。在所述芯片可动载体331沿+Y轴方向平移时，通过所述第一芯片线圈832211和第二芯片线圈832212的电流大小相同，所述第一芯片线圈832211和第二芯片线圈832212的受力大小相同，方向一致。反之，当所述第一芯片线圈832211通入逆时针方向的电流，所述第二芯片线圈832212通入逆时针方向的电流，带有所述感光组件40的芯片可动载体331沿-Y轴方向平移进行补偿。
如图26所示，所述第一芯片线圈832211和所述第二芯片线圈832212单独通电，当所述芯片可动载体331被驱动绕Z轴方向顺时针旋转运动时，所述第一芯片线圈832211通入逆时针方向的电流，所述第二芯片线圈832212通入顺时针方向的电流，所述第一芯片线圈832211受到-Y方向的电磁力驱动，所述第二芯片线圈832212受到+Y方向的电磁力驱动，进而使得所述芯片可动载体331受到扭转力，使得带有所述感光组件40的芯片可动载体331绕Z轴顺时针方向旋转移动以进行补偿。箭头I表示电流方向，F表示线圈的受力情况。在所述芯片可动载体331沿+Y轴方向平移时，通过所述第一芯片线圈832211和第二芯片线圈832212的电流大小相同，所述第一芯片线圈832211和第二芯片线圈832212的受力大小相同，方向相反。反之，当所述第一芯片线圈832211通入顺时针方向的电流，所述第二芯片线圈832212通入逆时针方向的电流，带有所述感光组件40的芯片可动载体331绕Z轴逆时针方向旋转运动进行补偿。
进一步地，在本申请实施例中，当芯片防抖可动部33沿X轴方向移动时，第一位置感测元件361感测到明显磁场变化，并对磁场变化进行反馈；当芯片防抖可动部33沿Y轴方向移动和绕Z轴方向旋转时，第一位置感测元件361的感测无明显磁场变化，第二位置感测元件362和第三位置感测元件363感测到明显磁场变化。
综上所述，基于本申请实施例的驱动组件和摄像模组1被阐明，其中，所述摄像模组1通过对其驱动组件中的磁吸元件的合理布设使得不同的磁吸元件能够发挥的不同作用；且所述摄像模组1的的感光组件40相对于驱动组件的中心呈偏心的方式设置，使得所述感光组件40的感光芯片42的一侧更加靠近移动电子设备的边缘，以满足移动电子设备的外形和功能需求。
示例性多摄摄像模组
如图15、图16和图27所示，本申请进一步还提供一种应用前述感光芯片的双摄摄像模组，所述双摄摄像模组包括两个并排设置的单摄摄像模组(第一摄像模组1A、第二摄像模组1B)。所述第一摄像模组1A和所述第二摄像模组1B中至少一个摄像模组的具体结构和功能与参考图2至图14C和图17至25所示意的摄像模组的具体结构和功能一致。在本申请的一实施例中，所述第一摄像模组1A和所述第二摄像模组1B具体结构和功能均与参考图2至图14C、图17至图25所示意的摄像模组的具体结构和功能一致。
具体地，所述第一摄像模组1A包括第一光学镜头10A、第一感光组件40A和第一驱动组件，所述第二摄像模组1B包括第二光学镜头10B、第二感光组件40B和第二驱动组件，其中，所述第一光学镜头10A和所述第二光学镜头10B分别被保持于所述第一感光组件40A和所述第二感光组件40B的感光路径上，所述第一摄像模组1A的第一驱动组件用于驱动所述第一感光组件40A和/或所述第一光学镜头10A移动以实现光学性能调整，所述第二摄像模组1A的第二驱动组件用于驱动所述第一感光组件40B和/或所述第二光学镜头10B移动以实现光学性能调整，例如，光学防抖、光学对焦等。可以理解的是，在本申请一个实施例中，所述双摄摄像模组的第一摄像模组1A和所述第二摄像模组1B之间通过一支架(未示出)相互连接。
相应地，所述第一光学镜头10A包括第一镜筒11A和被安装于所述第一镜筒11A内的第一镜片组12A，所述第一镜片组12A包括至少一光学镜片，所述第二光学镜头10B包括第二镜筒11B和被安装于所述第二镜筒11B内的第二镜片组12B，所述第二镜片组12B包括至少一光学镜片，所述光学镜片的数量可以为一个或者多个，并不受限。
所述第一驱动组件包括芯片驱动马达30A，所述第二驱动组件包括芯片驱动马达30B，所述第一芯片驱动马达30A和所述第二芯片驱动马达30B 分别适于驱动所述第一感光组件40A和第二感光组件40B平移和/或旋转，从而实现所述第一摄像模组1A和所述第二摄像模组1B的芯片防抖功能。所述第一芯片驱动马达30A包括第一芯片防抖固定部31A、第一芯片防抖可动部33A、第一芯片驱动元件32A、以及第一芯片驱动导电部(即，第一芯片防抖导电部35A)，所述第二芯片驱动马达30B包括第二芯片防抖固定部31B、第二芯片防抖可动部33B、第二芯片驱动元件32B、以及第二芯片驱动导电部(即，第二芯片防抖导电部35B)。所述第一芯片防抖固定部31A具有一收容腔以容纳所述第一芯片防抖可动部33A、所述第一芯片驱动元件32A以及所述第一芯片防抖导电部35A，所述第二芯片防抖固定部31B具有一收容腔以容纳所述第二芯片防抖可动部33B、所述第二芯片驱动元件32B以及所述第二芯片防抖导电部35B。所述第一芯片防抖导电部35A和所述第二芯片防抖导电部35B分别为所述第一芯片驱动元件32A和所述第二芯片驱动元件32B提供电流，所述第一芯片驱动元件32A用于驱动所述第一芯片防抖可动部33A相对所述第一芯片防抖固定部31A运动，所述第二芯片驱动元件32B用于驱动所述第二芯片防抖可动部33B相对所述第二芯片防抖固定部31B运动。所述第一感光组件40A和所述第二感光组件40B分别与所述第一芯片防抖可动部33A和所述第二芯片防抖可动部33B相固定，从而所述第一芯片防抖可动部33A和所述第二芯片防抖可动部33B分别驱动所述第一感光组件40A和所述第二感光组件40B相对所述第一芯片防抖固定部31A和所述第二芯片防抖固定部31B运动。
所述第一摄像模组1A的所述第一驱动组件还包括第一镜头驱动马达20A，所述第二摄像模组1B的所述第二驱动组件还包括第二镜头驱动马达20B。所述第一镜头驱动马达20A适于驱动所述第一光学镜头10A平移和/或旋转，所述第二镜头驱动马达20B适于驱动所述第二光学镜头10B平移和/或旋转，从而实现所述第一摄像模组1A和第二摄像模组1B的镜头对焦、镜头防抖等功能。所述第一镜头驱动马达20A包括第一镜头驱动固定部、第一镜头驱动可动部、第一镜头驱动元件以及第一镜头驱动导电部，所述第一镜头驱动固定部具有一容纳腔以容纳所述第一镜头驱动可动部、所述第一镜头驱动元件以及第一镜头驱动导电部，所述第一镜头驱动导电部为所述第一镜头驱动元件提供驱动电源，所述第一镜头驱动元件用于驱动所述第一镜头驱动可动部相对所述第一镜头驱动固定部运动。所述第二镜头驱动马达20B 包括第二镜头驱动固定部、第二镜头驱动可动部、第二镜头驱动元件以及第二镜头驱动导电部，所述第二镜头驱动固定部具有一容纳腔以容纳所述第二镜头驱动可动部、所述第二镜头驱动元件以及第二镜头驱动导电部，所述第二镜头驱动导电部为所述第二镜头驱动元件提供驱动电源，所述第二镜头驱动元件用于驱动所述第二镜头驱动可动部相对所述第二镜头驱动固定部运动。
所述第一光学镜头10A和所述第二光学镜头10B分别与所述第一镜头驱动可动部和第二镜头驱动可动部相固定，从而所述第一镜头驱动元件驱动所述第一光学镜头10A相对所述第一镜头驱动固定部运动，所述第二镜头驱动元件驱动所述第二光学镜头10B相对于所述第二镜头驱动固定部运动，例如，驱动所述第一光学镜头10A、第二光学镜头10B沿其光轴移动实现镜头对焦功能；或者，驱动所述第一光学镜头10A、第二光学镜头10B沿垂直其光轴的方向平移或驱动所述第一光学镜头10A、第二光学镜头10B绕垂直其光轴的方向旋转实现镜头防抖功能。所述第一镜头驱动马达20A将所述第一镜头驱动固定部固定于所述第一芯片驱动马达30A的芯片防抖固定部31A，从而使所述第一光学镜头10A设置于所述第一感光组件40A的感光路径上。所述第二镜头驱动马达20B将所述第二镜头驱动固定部固定于所述第二芯片驱动马达30B的芯片防抖固定部31B，从而使所述第二光学镜头10B设置于所述第二感光组件40B的感光路径上。
在本申请的一个实施方式中，所述多摄摄像模组中没有设置第一镜头驱动马达20A和/或第二镜头驱动马达20B，所述第一光学镜头10A和/或第二光学镜头10B直接安装于所述第一芯片驱动马达30A的第一芯片防抖固定部31A和/或所述第二芯片驱动马达30B的第二芯片防抖固定部31B，或者，所述第一光学镜头10A和/或第二光学镜头10B通过支持件间接安装于所述第一芯片驱动马达30A的第一芯片防抖固定部31A和/或所述第二芯片驱动马达30B的第二芯片防抖固定部31B，从而使所述第一光学镜头10A设置于所述第一感光组件40A的感光路径上，所述第二光学镜头10B设置于所述第二感光组件40B的感光路径上。
所述第一感光组件40A包括第一线路板41A、电连接于所述第一线路板41A的第一感光芯片42A和第一电子元件43A，所述第二感光组件40B包括第二线路板41B、电连接于所述第二线路板41B的第二感光芯片42B和第 二电子元件43B。所述第一感光芯片42A用于接收所述第一光学镜头10A采集的外界光线成像并通过所述第一线路板41A与外部移动电子设备电连接，所述第二感光芯片42B用于接收所述第二光学镜头10B采集的外界光线成像并通过所述第二线路板41B与外部移动电子设备电连接。在本申请的一个实施例中，所述第一电子元件43A和所述第二电子元件43B可以是电阻、电容等无源电子器件和驱动芯片、存储芯片等有源电子器件中的一种或者多种，所述第一电子元件43A和所述第二电子元件43B可以电连接于所述第一线路板41A和所述第二线路板41B的正面，也可以电连接于所述第一线路板41A和所述第二线路板41B的背面，视所述第一摄像模组1A和所述第二摄像模组1B的设计需求决定。
所述第一感光芯片42A直接或者间接地固定于所述第一线路板41A，所述第一感光芯片42A包括感光区和非感光区，所述第一感光芯片42A通过位于所述非感光区的芯片焊盘电连接于所述第一线路板41A，例如，所述第一感光芯片42A可以通过引线键合(打金线)、焊接、FC工艺(芯片倒装)或者RDL(再布线层技术)等方式电连接于所述第一线路板41A。所述第二感光芯片42B直接或者间接地固定于所述第二线路板41B，所述第二感光芯片42B包括感光区和非感光区，所述第二感光芯片42B通过位于所述非感光区的芯片焊盘电连接于所述第二线路板41B，例如，所述第二感光芯片42B可以通过引线键合(打金线)、焊接、FC工艺(芯片倒装)或者RDL(再布线层技术)等方式电连接于所述第二线路板41B。
在本申请的一个实施例中，所述第一线路板41A包括线路板主体411A和连接带412A，所述第二线路板41B包括线路板主体411B和连接带412B。所述第一线路板41A的连接带412A连接并电导通所述线路板主体411A，从而将所述第一感光芯片42A获取的成像信息通过所述线路板主体411A和所述连接带412A向外部移动电子设备传输。所述第二线路板41B的连接带412B连接并电导通所述线路板主体411B，从而将所述第二感光芯片42B获取的成像信息通过所述线路板主体411B和所述连接带412B向外部移动电子设备传输。
在本申请的一个具体实施例中，所述第一线路板41A的连接带412A包括第一连接带4121A和第二连接带4122A，所述第一连接带4121A和所述第二连接带4122A分别从所述线路板主体411A的相对的两侧向外延伸，并 进一步向上弯折及向侧部弯折，以使得所述第一连接带4121和所述第二连接带4122A电连接，这种设置方式可以使得所述线路板主体411A在移动过程中保持平稳，进一步地减小驱动所述第一线路板41A移动时的阻力。在本申请的一个具体实施例中，所述第二线路板41B的连接带412B包括第一连接带4121B和第二连接带4122B，所述第一连接带4121B和所述第二连接带4122B分别从所述线路板主体411B的相对的两侧向外延伸，并进一步向上弯折及向侧部弯折，以使得所述第一连接带4121和所述第二连接带4122B电连接，这种设置方式可以使得所述线路板主体411B在移动过程中保持平稳，进一步地减小驱动所述第二线路板41B移动时的阻力。当然，在本申请的另一具体示例中，所述第一线路板41A的第一连接带4121A和所述第二连接带4122A可以从所述线路板主体411A的相邻的两侧向外延伸并向上弯折，所述第二线路板41B的第一连接带4121B和所述第二连接带4122B可以从所述线路板主体411B的相邻的两侧向外延伸并向上弯折，本申请对此不做限制。
所述第一感光组件40A进一步包括第一滤光元件44A，所述第一滤光元件44A被保持于所述第一感光芯片42A的感光路径上，用于对进入所述第一感光芯片42A的成像光线进行过滤。所述第二感光组件40B进一步包括第二滤光元件44B，所述第二滤光元件44B被保持于所述第二感光芯片42B的感光路径上，用于对进入所述第二感光芯片42B的成像光线进行过滤。在一个具体的示例中，所述第一滤光元件44A被安装固定于所述第一感光组件40A的第一底座45A且对应于所述第一感光芯片42A的至少部分感光区域，所述第一滤光元件44A可以被正贴或者倒贴于所述第一底座45A，所述第一底座45A具有一通光孔，从而所述第一光学镜头10A的光线可以穿过所述第一底座45A的通光孔入射所述第一感光芯片42A。所述第二滤光元件44B被安装固定于所述第二感光组件40B的第二底座45B且对应于所述第二感光芯片42B的至少部分感光区域，所述第二滤光元件44B可以被正贴或者倒贴于所述第二底座45B，所述第二底座45B具有一通光孔，从而所述第二光学镜头10B的光线可以穿过所述第二底座45B的通光孔入射所述第二感光芯片42B。
所述第一感光组件40A可以通过所述第一线路板41A(所述第一线路板主体411A)或者所述第一底座45A固定于所述第一芯片驱动马达30A的第 一芯片防抖可动部33A，从而所述第一感光组件40A随所述第一芯片防抖可动部33A的运动而运动。所述第二感光组件40B可以通过所述第二线路板41B的所述第二线路板主体411B或者所述第二底座45B固定于所述第二芯片驱动马达30B的第二芯片防抖可动部33B，从而所述第二感光组件40B随所述第二芯片防抖可动部33B的运动而运动。
在本申请一个实施例中，所述第一感光芯片42A和所述第二感光芯片42B分别在所述双摄摄像模组的两个单摄摄像模组(第一摄像模组1A和第二摄像模组1B)中被偏心的设置，即，所述第一感光芯片42A的中心轴与所述第一芯片驱动马达30A的中心轴不一致，所述第二感光芯片42B的中心轴与所述第二芯片驱动马达30B的中心轴不一致。具体地，所述第一感光芯片42A至所述第一芯片可动载体331A距离短的一侧与所述第二感光芯片42B至所述第二芯片可动载体331B距离最短的一侧相互靠近，即，所述感光芯片42A靠近于所述芯片可动载体331A的一侧与所述感光芯片42B靠近于所述芯片可动载体331B的一侧相邻设置，进而所述第一光学镜头10A和所述第二光学镜头10B更加靠近地设置，以增强所述双摄摄像模组的光学性能。
所述第一芯片驱动元件32A被设置于所述第一芯片防抖可动部33A、与所述第一芯片防抖固定部31A之间，所述第一芯片防抖导电部35A电连接所述第一芯片驱动元件32A和所述第一感光组件40A，并为所述第一芯片驱动元件32A提供驱动电源以驱动所述第一芯片防抖可动部33A在X轴方向(即，X轴所设定的方向)和Y轴方向(即，Y轴所设定的方向)上平移和/或绕Z轴方向(即，Z轴所设定的方向)旋转，以实现所述第一感光组件40A的平移防抖和/或旋转防抖。所述第二芯片驱动元件32B被设置于所述第二芯片防抖可动部33B、与所述第二芯片防抖固定部31B之间，所述第二芯片防抖导电部35B电连接所述第二芯片驱动元件32B和所述第二感光组件40B，并为所述第二芯片驱动元件32B提供驱动电源以驱动所述第二芯片防抖可动部33B在X轴方向(即，X轴所设定的方向)和Y轴方向(即，Y轴所设定的方向)上平移和/或绕Z轴方向(即，Z轴所设定的方向)旋转，以实现所述第二感光组件40B的平移防抖和/或旋转防抖。
值得一提的是，在本申请实施例中，X轴方向和Y轴方向相互垂直，Z轴方向垂直于X轴方向和Y轴方向所在平面，Z轴方向也是所述第一光学 镜头10A和所述第二光学镜头10B的光轴的方向，换言之，X轴、Y轴和Z轴构成了三维立体坐标系，X轴方向和Y轴方向所在的XOY平面也称为水平方向所在平面。
在本申请的一个实施例中，所述第一芯片防抖固定部31A包括相互扣合以形成所述收容腔的上盖311A和基底312A，所述第二芯片防抖固定部31B包括相互扣合以形成所述收容腔的上盖311B和基底312B。所述上盖311A和所述基底312A相互固定并形成收容腔(即，所述第一芯片防抖固定部31A的收容腔)容置所述第一芯片防抖可动部33A、所述第一芯片驱动元件32A、所述第一芯片防抖导电部35A以及所述第一感光组件40A等摄像模组部件，所述上盖311B和所述基底312B相互固定并形成收容腔(即，所述第二芯片防抖固定部31B的收容腔)容置所述第二芯片防抖可动部33B、所述第二芯片驱动元件32B、所述第二芯片防抖导电部35B以及所述第二感光组件40B等摄像模组部件，不仅可以保护上述摄像模组部件，还可以减少灰尘、脏污或杂散光进入所述第一芯片驱动马达30A和所述第二芯片驱动马达30B的内部。在本申请的一个具体示例中，所述上盖311A，311B和所述基底312A，312B的材质可以为诸如无磁不锈钢等金属材料。
具体地，在本申请实施例中，所述第一芯片防抖固定部31A的上盖311A设置于所述基底312A的上方，所述第二芯片防抖固定部31B的上盖311B设置于所述基底312B的上方。所述第一芯片防抖固定部31A的上盖311A包括中心具有一开口的盖体主体3111A，该开口对应于所述第一感光组件40A，以使得光线能够通过所述开口进入所述第一感光组件40A以进行成像。所述第二芯片防抖固定部31B的上盖311B包括中心具有一开口的盖体主体3111B，该开口对应于所述第二感光组件40B，以使得光线能够通过所述开口进入所述第二感光组件40B以进行成像。优选地，所述开口呈圆形形状。进一步地，所述第一芯片防抖固定部31A的上盖311A还可以包括自所述盖体主体3111A一体向所述基底312A方向延伸的盖体周侧3112A，从而通过所述盖体周侧3112A固定连接于所述基底312A，所述第二芯片防抖固定部31B的上盖311B还可以包括自所述盖体主体3111B一体向所述基底312B方向延伸的盖体周侧3112B，从而通过所述盖体周侧3112B固定连接于所述基底312B，例如，通过激光熔接或者粘合介质粘接的方式固定所述盖体周侧3112A，3112B与所述基底312A，312B。所述第一芯片防抖固定部31A 的盖体周侧3112A还包括至少一周侧凹部31121A，这样，所述上盖311A与所述基底312A之间形成至少一连接带412A出口，以允许所述第一线路板41A的连接带412A从所述第一芯片防抖固定部31A的容纳腔内向外伸出。所述第二芯片防抖固定部31B的盖体周侧3112B还包括至少一周侧凹部31121B，这样，所述上盖311B与所述基底312B之间形成至少一连接带412B出口，以允许所述第二线路板41B的连接带412B从所述第二芯片防抖固定部31B的容纳腔内向外伸出。在本申请的一个具体示例中，所述第一芯片防抖固定部31A的盖体周侧3112A包括相对设置的两个周侧凹部31121A，所述上盖311A与所述基底312A之间形成两个连接带412A出口，以允许所述第一线路板41A的第一连接带4121A和第二连接带4122A从所述第一芯片防抖固定部31A的容纳腔内向外伸出。所述第二芯片防抖固定部31B的盖体周侧3112B包括相对设置的两个周侧凹部31121B，所述上盖311B与所述基底312B之间形成两个连接带412B出口，以允许所述第二线路板41B的第一连接带4121B和第二连接带4122B从所述第二芯片防抖固定部31B的容纳腔内向外伸出。
在本申请实施例中，所述第一芯片防抖可动部33A被可移动地收容于所述第一芯片防抖固定部31A的收容腔内，所述第二芯片防抖可动部33B被可移动地收容于所述第二芯片防抖固定部31B的收容腔内。具体地，所述第一芯片防抖可动部33A被悬空地设置于所述第一芯片防抖固定部31A的收容腔内，以使得所述第一芯片防抖可动部33A可相对于所述第一芯片防抖固定部31A活动，所述第二芯片防抖可动部33B被悬空地设置于所述第二芯片防抖固定部31B的收容腔内，以使得所述第二芯片防抖可动部33B可相对于所述第二芯片防抖固定部31B活动。
所述第一芯片防抖可动部33A包括具有相对的上表面和下表面的芯片可动载体331A。所述第一芯片防抖可动部33A的芯片可动载体331A与所述上盖311A之间设有所述第一芯片驱动元件32A，所述第一芯片驱动元件32A驱动所述芯片可动载体331A相对所述第一芯片防抖固定部31A运动。所述第一芯片防抖可动部33A的芯片可动载体331A适于安装第一感光组件40A于其上，即，所述第一感光组件40A适于被安装于所述第一芯片防抖可动部33A的芯片可动载体331A。在本申请的一个实施方式中，所述第一芯片防抖可动部33A的芯片可动载体331A与所述基底312A之间设有所述第 一感光组件40A，所述第一感光组件40A通过所述第一线路板41A被安装于所述第一芯片防抖可动部33A的芯片可动载体331A，进而所述第一感光组件40A随着所述第一芯片防抖可动部33A的芯片可动载体331A移动。在本申请的实施例中，所述第一芯片防抖可动部33A的芯片可动载体331A与基底312A之间具有间隙，所述第一感光组件40A的底面(即，所述第一感光组件40A靠近所述基底312A的一侧)与所述基底312A，之间也存在一定的空气间隙，这样，所述第一感光组件40A的运动不易被所述基底312A阻碍，减小所述第一芯片驱动元件32A的驱动力需求，换言之，所述第一感光组件40A悬持在所述第一芯片防抖可动部33A的基底312A的上方。
所述第二芯片防抖可动部33B包括具有相对的上表面和下表面的芯片可动载体331B。所述第二芯片防抖可动部33B的芯片可动载体331B与所述上盖311B之间设有所述第二芯片驱动元件32B，所述第二芯片驱动元件32B驱动所述芯片可动载体331B相对所述第二芯片防抖固定部31B运动。所述第二芯片防抖可动部33B的芯片可动载体331B适于安装第二感光组件40B于其上，即，所述第二感光组件40B适于被安装于所述第二芯片防抖可动部33B的芯片可动载体331B。在本申请的一个实施方式中，所述第二芯片防抖可动部33B的芯片可动载体331B与所述基底312B之间设有所述第二感光组件40B，所述第二感光组件40B通过所述第二线路板41B被安装于所述第二芯片防抖可动部33B的芯片可动载体331B，进而所述第二感光组件40B随着所述第二芯片防抖可动部33B的芯片可动载体331B移动。在本申请的实施例中，所述第二芯片防抖可动部33B的芯片可动载体331B与基底312B之间具有间隙，所述第二感光组件40B的底面(即，所述第二感光组件40B靠近所述基底312B的一侧)与所述基底312B，之间也存在一定的空气间隙，这样，所述第二感光组件40B的运动不易被所述基底312B阻碍，减小所述第二芯片驱动元件32B的驱动力需求，换言之，所述第二感光组件40B悬持在所述第二芯片防抖可动部33B的基底312B的上方。
值得一提的是，在所述双摄摄像模组中，所述第一摄像模组1A的驱动组件(即，第一驱动组件)的至少一侧(例如，第一侧)没有设置第一芯片驱动元件32A，所述第二摄像模组1B的驱动组件(即，第二驱动组件)的至少一侧(例如，第二侧)没有设置第二芯片驱动元件32B，其中，所述第一摄像模组1A的驱动组件中没有设置芯片驱动元件32A的一侧(例如，第一 侧)和所述第二摄像模组1B的驱动组件中没有设置芯片驱动元件32B的一侧(例如，第二侧)相邻。
具体地，所述第一芯片驱动马达30A的第一侧(即，所述第一摄像模组1A的驱动组件的第一侧)没有设置第一芯片驱动元件32A，所述第二芯片驱动马达30B的第二侧(即，所述第二摄像模组1B的驱动组件的第二侧)没有设置第二芯片驱动元件32B，所述第一芯片驱动马达30A的第一侧和所述第二芯片驱动马达30B的第二侧相邻，因为在相互邻近的所述第一芯片驱动马达30A的第一侧和所述第二芯片驱动马达30B的第二侧不需设置所述第一芯片驱动元件32A和所述第二芯片驱动元件32B，所述第一感光芯片42A和所述第二感光芯片40B在所述第一芯片驱动马达30A的第一侧和所述第二芯片驱动马达30B的第二侧具有更大的安置空间，这使得所述第一感光芯片42A可以更加靠近所述第一芯片驱动马达30A的没有设置所述第一芯片驱动元件32A的第一侧所在的边，所述第二感光芯片40B可以更加靠近所述第二芯片驱动马达30B的没有设置所述第二芯片驱动元件32B的第二侧所在的边，进而达到所述第一感光芯片42A和所述第二感光芯片40B偏心设置的效果。
将所述第一芯片驱动马达30A的没有设置所述第一芯片驱动元件32A的第一侧和所述第二芯片驱动马达30Bd的第二侧相邻设置，即，所述第一芯片驱动马达30A的没有设置所述第一芯片驱动元件32A的第一侧和所述第二芯片驱动马达30Bd的第二侧相互靠近设置，这种设置方式使得所述双摄摄像模组的第一摄像模组1A和第二摄像模组1B相邻处没有设置有芯片驱动元件(即，第一芯片驱动元件32A和第二芯片驱动组件32B)，以避免产生磁干扰的影响。
具体地，所述第一感光组件40A具有第一中心轴线，所述第一驱动组件具有第二中心轴线，所述第一中心轴线与所述第二中心轴线相偏移。具体地，所述第一感光组件40A的第一感光芯片42A的中心轴线为所述第一感光组件40A的第一中心轴线，所述第一芯片驱动马达30A的中心轴线为所述第一驱动组件的第二中心轴线，所述第一感光芯片42A相对于所述第一驱动组件的中心呈偏心的方式设置，即，所述第一感光组件40A的感光芯片42A在所述第一芯片驱动马达30A中呈偏心状态设置，所述第一感光组件40A的第一感光芯片42A的中心轴偏心状态设置，也就是，所述第一感光芯片 42A的中心轴与所述第一芯片驱动马达30A的中心轴不一致。(所述第一感光芯片42A的中心轴为俯视时经过所述第一感光芯片42A的对角线的交点且与Z轴方向平行的轴；所述第一芯片驱动马达30A的中心轴为俯视时经过所述第一芯片驱动马达30A的对角线的交点且与Z轴方向平行的轴)。
所述第二感光组件40B具有第一中心轴线，所述第二驱动组件具有第二中心轴线，所述第一中心轴线与所述第二中心轴线相偏移。具体地，所述第二感光组件40B的第二感光芯片42B的中心轴线为所述第二感光组件40B的第一中心轴线，所述第二芯片驱动马达30B的中心轴线为所述第二驱动组件的第二中心轴线，所述第二感光芯片42B相对于所述第二驱动组件的中心呈偏心的方式设置，即，所述第二感光组件40B的感光芯片42B在所述第二芯片驱动马达30B中呈偏心状态设置，所述第二感光组件40B的第二感光芯片42B的中心轴偏心状态设置，也就是，所述第二感光芯片42B的中心轴与所述第二芯片驱动马达30B的中心轴不一致。(所述第二感光芯片42B的中心轴为俯视时经过所述第二感光芯片42B的对角线的交点且与Z轴方向平行的轴；所述第二芯片驱动马达30B的中心轴为俯视时经过所述第二芯片驱动马达30B的对角线的交点且与Z轴方向平行的轴)。
所述第一芯片防抖可动部33A的芯片可动载体331A包括相固定的芯片载体主体3311A和芯片载体侧部3312B。所述第一线路板41A固定于所述第一芯片防抖可动部33A的芯片载体主体3311A的底面(即，朝向所述基底312A一侧)，所述第一芯片防抖可动部33A的芯片载体主体3311A具有一载体主体通孔33111A、33111B，所述载体主体通孔33111A不仅适于提供所述第一感光组件40A的第一感光芯片42A一通光路径，还可以提供所述第一感光组件40A上的第一电子元件43A安装空间，防止所述第一电子元件43A与所述第一芯片载体主体3311A相互干涉。所述第一芯片防抖可动部33A的芯片载体侧部3312A包括从所述芯片载体主体3311A、一体向外延伸的第一载体侧部33121A、第二载体侧部33122A、第三载体侧部33123A和第四载体侧部33124。所述第一芯片防抖可动部33A的第一载体侧部33121A与所述第三载体侧部33123A相对设置并与所述第二载体侧部33122A、33122B和所述第四载体侧部33124A、33124B相邻，所述第二载体侧部33122A与所述第四载体侧部33124A相对设置。所述第一载体侧部33121A、所述第二载体侧部33122A、所述第三载体侧部33123A和所述第 四载体侧部33124A适于作为所述芯片载体主体3311A运动时的防撞部件，避免所述第一芯片防抖可动部33A的芯片载体主体3311A直接与所述第一芯片防抖固定部31A相撞击。
所述第二芯片防抖可动部33B的芯片可动载体331B包括相固定的芯片载体主体3311B和芯片载体侧部3312B。所述第二线路板41B固定于所述第二芯片防抖可动部33B的芯片载体主体3311B的底面(即，朝向所述基底312B一侧)，所述第二芯片防抖可动部33B的芯片载体主体3311B具有一载体主体通孔33111B、33111B，所述载体主体通孔33111B不仅适于提供所述第二感光组件40B的第二感光芯片42B一通光路径，还可以提供所述第二感光组件40B上的第二电子元件43B安装空间，防止所述第二电子元件43B与所述第二芯片载体主体3311B相互干涉。所述第二芯片防抖可动部33B的芯片载体侧部3312B包括从所述芯片载体主体3311B、一体向外延伸的第一载体侧部33121B、第二载体侧部33122B、第三载体侧部33123B和第四载体侧部33124。所述第一芯片防抖可动部33B的第二载体侧部33121B与所述第三载体侧部33123B相对设置并与所述第二载体侧部33122B和所述第四载体侧部33124B相邻，所述第二载体侧部33122B与所述第四载体侧部33124B相对设置。所述第一载体侧部33121B、所述第二载体侧部33122B、所述第三载体侧部33123B和所述第四载体侧部33124B适于作为所述芯片载体主体3311B运动时的防撞部件，避免所述第二芯片防抖可动部33B的芯片载体主体3311B直接与所述第二芯片防抖固定部31B相撞击。
在本申请的一个实施例中，所述第一芯片防抖可动部33A的芯片载体侧部3312A(第一载体侧部33121A、第二载体侧部33122A、第三载体侧部33123A和第四载体侧部33124A)进一步向所述芯片载体主体3311A的侧面延伸，即，所述芯片载体侧部3312A从所述芯片载体主体3311A的外周缘进一步向外延伸，所述芯片载体侧部3312A突出于所述芯片载体主体3311A的侧壁，使得所述第一芯片防抖可动部33A移动过程中通过所述芯片载体侧部3312A与所述第一芯片防抖固定部31A发生碰撞，进而避免设置所述第一感光组件40A的芯片载体主体3311A与所述第一芯片防抖固定部31A直接发生碰撞，进而造成所述第一感光组件40A损坏。
在本申请的一个实施例中，所述第二芯片防抖可动部33B的芯片载体侧部3312B(第一载体侧部33121B、第二载体侧部33122B、第三载体侧部 33123B和第四载体侧部33124B)进一步向所述芯片载体主体3311B的侧面延伸，即，所述芯片载体侧部3312B从所述芯片载体主体3311B的外周缘进一步向外延伸，所述芯片载体侧部3312B突出于所述芯片载体主体3311B的侧壁，使得所述第二芯片防抖可动部33B移动过程中通过所述芯片载体侧部3312B与所述第二芯片防抖固定部31B发生碰撞，进而避免设置所述第二感光组件40B的芯片载体主体3311B与所述第二芯片防抖固定部31B直接发生碰撞，进而造成所述第二感光组件40B损坏。
所述第一感光芯片42A在所述芯片可动载体331A中偏心地设置，所述第一感光芯片42A的中心OA到所述第一芯片防抖可动部33A的芯片可动载体331的两相对边的距离不相等。也可以说，所述第一感光芯片42A更靠近于所述第一芯片防抖可动部33A的芯片可动载体331A的至少一边，即，所述第一感光芯片42A更靠近于所述第一芯片驱动马达30A的至少一侧。在本申请一具体示例中，所述第一感光组件40A的第一感光芯片42A的外形为包含有长边和宽边的矩形结构，所述第一感光组件40A的外形边缘可以定义有第一边、第二边、第三边及第四边，以所述第一感光芯片42A对角线的交点为中心原点，建立直角坐标系，第一边和第三边与X轴方向平行，第二边与第四边与Y轴方向平行。相应地，所述第一芯片防抖可动部33A芯片可动载体331A也具有与所述第一感光组件40A相对应的第一边、第二边、第三边及第四边。
所述第二感光芯片42B在所述芯片可动载体331B中偏心地设置，所述第二感光芯片42B的中心OB到所述第二芯片防抖可动部33B的芯片可动载体331的两相对边的距离不相等。也可以说，所述第二感光芯片42B更靠近于所述第二芯片防抖可动部33B的芯片可动载体331B的至少一边，即，所述第二感光芯片42B更靠近于所述第二芯片驱动马达30B的至少一侧。在本申请一具体示例中，所述第二感光组件40B的第二感光芯片42B的外形为包含有长边和宽边的矩形结构，所述第二感光组件40B的外形边缘可以定义有第一边、第二边、第三边及第四边，以所述第二感光芯片42B对角线的交点为中心原点，建立直角坐标系，第一边和第三边与X轴方向平行，第二边与第四边与Y轴方向平行。相应地，所述第二芯片防抖可动部33B芯片可动载体331B也具有与所述第二感光组件40B相对应的第一边、第二边、第三边及第四边。
所述第一摄像模组1A的邻近于所述第一芯片防抖可动部33A的芯片可动载体331A的第三边的一侧为所述第一摄像模组1A的第一侧，邻近于所述第一芯片防抖可动部33A的芯片可动载体331A的第一边的一侧为所述第一摄像模组1A的第二侧，邻近于所述第一芯片防抖可动部33A的芯片可动载体331A的第四边的一侧为所述第一摄像模组1A的第三侧，邻近于所述第一芯片防抖可动部33A的芯片可动载体331A的第二边的一侧为所述第一摄像模组1A的第四侧。所述第二摄像模组1B的邻近于所述第二芯片防抖可动部33B的芯片可动载体331B的第一边的一侧为所述第二摄像模组1B的第一侧，邻近于所述第二芯片防抖可动部33B的芯片可动载体331B的第三边的一侧为所述第一摄像模组1B的第二侧，邻近于所述第二芯片防抖可动部33B的芯片可动载体331B的第二边的一侧为所述第一摄像模组1B的第三侧，邻近于所述第二芯片防抖可动部33B的芯片可动载体331B的第四边的一侧为所述第二摄像模组1B的第四侧。
所述第一感光芯片42A的中心OA到所述芯片可动载体331A的第一边的距离为H1A，所述第一感光芯片42A的中心OA到所述芯片可动载体331A的第三边的距离为H2A，H1A＞H2A，即，所述第一感光芯片42A的第一中心轴线与所述芯片可动载体331A的第三边之间的距离小于所述第一感光芯片42A的第一中心轴线与所述第一芯片防抖可动部33A的芯片可动载体331A的第一边之间的距离，所述第一感光芯片42A更靠近于所述第一芯片防抖可动部33A的芯片可动载体331A的第三边，远离于所述第一芯片防抖可动部33A的芯片可动载体331A的第一边。所述第二感光芯片42B的中心OB到所述芯片可动载体331B的第一边的距离为H1B，所述第二感光芯片42B的中心OB到所述芯片可动载体331B的第三边的距离为H2B，H1B＞H2B，即，所述第二感光芯片42B的第一中心轴线与所述芯片可动载体331B的第三边之间的距离小于所述第二感光芯片42B的第一中心轴线与所述第二芯片防抖可动部33B的芯片可动载体331B的第一边之间的距离，所述第二感光芯片42B更靠近于所述第二芯片防抖可动部33B的芯片可动载体331B的第三边，远离于所述第二芯片防抖可动部33B的芯片可动载体331B的第一边。例如，所述H1A、H1B的范围为：6mm-8mm，H2A、H2B的范围为：3mm-4mm，优选的，H1A、H1B为7.14mm，H2A、H2B为3.74mm。所述第一芯片防抖可动部33A的芯片可动载体331A的第三边与所述第二芯片防抖 可动部33B的芯片可动载体331B的第三边相邻，所述第一芯片防抖可动部33A的芯片可动载体331A的第一边与所述第二芯片防抖可动部33B的芯片可动载体331B的第一边相互远离，如图15和图16所示。
当然，在本申请其他实施例中，也可以为H1A＜H2A，H1B＜H2B，即，所述第一感光芯片42A更靠近于所述第一芯片防抖可动部33A的芯片可动载体331A的第三边，远离于所述芯片可动载体331A的第一边，所述第二感光芯片42B更靠近于所述第二芯片防抖可动部33B的芯片可动载体331B的第三边，远离于所述芯片可动载体331B的第一边，本申请对此不做限制。
所述第一感光芯片42A的中心OA到所述第一芯片防抖可动部33A的芯片可动载体331A的第二边的距离为H3A，所述第一感光芯片42A的中心OA到所述第一芯片防抖可动部33A的芯片可动载体331A的第四边的距离为H4A，所述H3A可以等于H4A，所述H3A可以小于H4A，所述H3A也可以大于H4A。也就是说，所述第一感光芯片42A更靠近于所述第一芯片防抖可动部33A的芯片可动载体331A的至少一边即可，本申请对此不做限制。
所述第二感光芯片42B的中心OB到所述第二芯片防抖可动部33B的芯片可动载体331B的第二边的距离为H3B，所述第二感光芯片42B的中心OB到所述第二芯片防抖可动部33B的芯片可动载体331B的第四边的距离为H4B，所述H3B可以等于H4B，所述H3B可以小于H4B，所述H3B也可以大于H4B。也就是说，所述第二感光芯片42B更靠近于所述第二芯片防抖可动部33B的芯片可动载体331B的至少一边即可，本申请对此不做限制。
所述第一芯片驱动元件32A包括芯片磁石组件321A和芯片线圈组件322A，其中，所述第一芯片防抖可动部33A的芯片线圈组件322A被设置于所述芯片可动载体331A，所述第一芯片驱动元件32A的芯片磁石组件321A被固定于所述第一芯片防抖固定部31A的上盖311A且对应于所述芯片线圈组件322A。所述第一芯片防抖固定部31A的芯片磁石组件321A通过例如粘合介质粘接的方式固定于所述第一芯片防抖固定部31A的上盖311A，所述第一芯片驱动元件32A的芯片线圈组件322A固定于所述第一芯片防抖可动部33A的芯片可动载体331A，所述第一芯片驱动元件32A的芯片磁石组件321A与所述芯片线圈组件322A相对设置，从而通过所述芯片线圈组件322A与所述芯片磁石组件321A之间的磁场力驱动所述第一芯片防抖可动部33A相对所述第一芯片防抖固定部31A运动。也就是说，本申请中，所 述第一芯片驱动元件32A的芯片磁石组件321A为定子，所述第一芯片驱动元件32A的芯片线圈组件322A为动子，这种设置方式可以使得所述第一芯片防抖可动部33A的芯片可动载体331A的移动不会受到磁干扰的影响，进而避免影响到芯片防抖效果。
所述第二芯片驱动元件32B包括芯片磁石组件321B和芯片线圈组件322B，其中，所述第二芯片防抖可动部33B的芯片线圈组件322B被设置于所述芯片可动载体331B，所述第二芯片驱动元件32B的芯片磁石组件321B被固定于所述第二芯片防抖固定部31B的上盖311B且对应于所述芯片线圈组件322B。所述第二芯片防抖固定部31B的芯片磁石组件321B通过例如粘合介质粘接的方式固定于所述第二芯片防抖固定部31B的上盖311B，所述第二芯片驱动元件32B的芯片线圈组件322B固定于所述第二芯片防抖可动部33B的芯片可动载体331B，所述第二芯片驱动元件32B的芯片磁石组件321B与所述芯片线圈组件322B相对设置，从而通过所述芯片线圈组件322B与所述芯片磁石组件321B之间的磁场力驱动所述第二芯片防抖可动部33B相对所述第二芯片防抖固定部31B运动。也就是说，本申请中，所述第二芯片驱动元件32B的芯片磁石组件321B为定子，所述第二芯片驱动元件32B的芯片线圈组件322B为动子，这种设置方式可以使得所述第二芯片防抖可动部33B的芯片可动载体331B的移动不会受到磁干扰的影响，进而避免影响到芯片防抖效果。
进一步地，对第一芯片驱动元件32A的具体结构进行说明，每一所述第一芯片驱动元件32A的芯片线圈组件322A包括至少一芯片线圈。在本申请的一个实施方式中，所述第一芯片防抖可动部33A的芯片可动载体331A的至少一条边没有设置所述芯片线圈组件322A。具体地，所述第一芯片防抖可动部33A的芯片可动载体331A包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对。所述第一边和所述第三边沿着所述驱动组件所设定的X轴方向延伸，所述第二边和所述第四边沿着所述驱动组件所设定的Y轴方向延伸，所述Y轴方向垂直于所述X轴方向。所述第一芯片驱动元件32A的芯片线圈组件322A包括设置于所述第一边的第一芯片线圈组3221A，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组3222A和第三芯片线圈组3223A。
进一步地，对第二芯片驱动元件32B的具体结构进行说明，每一所述第 二芯片驱动元件32B的芯片线圈组件322B包括至少一芯片线圈。在本申请的一个实施方式中，所述第二芯片防抖可动部33B的芯片可动载体331B的至少一条边没有设置所述芯片线圈组件322B。具体地，所述第二芯片防抖可动部33B的芯片可动载体331B包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对。所述第一边和所述第三边沿着所述驱动组件所设定的X轴方向延伸，所述第二边和所述第四边沿着所述驱动组件所设定的Y轴方向延伸，所述Y轴方向垂直于所述X轴方向。所述第二芯片驱动元件32B的芯片线圈组件322B包括设置于所述第一边的第一芯片线圈组3221B，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组3222B和第三芯片线圈组33223B。
所述第一芯片驱动元件32A的第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A设置于X轴和Y轴所在平面，即，所述第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A沿水平方向设置。所述第一芯片驱动元件32A的第一芯片线圈组3221A沿X轴方向设置，所述第二芯片线圈组3222A沿Y轴方向设置，所述第三芯片线圈组3223A沿Y轴方向设置，所述第二芯片线圈组3222A与所述第三芯片线圈组3223A沿Y轴方向相对设置。进一步地，所述第一芯片驱动元件32A的第二芯片线圈组3222A与所述第三芯片线圈组3223A相对于Y轴对称。所述第一芯片驱动元件32A的第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A围绕所述第一感光组件40A的三边设置。
所述第二芯片驱动元件32B的第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B设置于X轴和Y轴所在平面，即，所述第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B沿水平方向设置。所述第二芯片驱动元件32B的第一芯片线圈组3221B沿X轴方向设置，所述第二芯片线圈组3222B沿Y轴方向设置，所述第三芯片线圈组33223B沿Y轴方向设置，所述第二芯片线圈组3222B与所述第三芯片线圈组33223B沿Y轴方向相对设置。进一步地，所述第二芯片驱动元件32B的第二芯片线圈组3222B与所述第三芯片线圈组33223B相对于Y轴对称。所述第二芯片驱动元件32B的第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B围绕所述第二感 光组件40B的三边设置。
所述第一芯片驱动元件32A的第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A分别包括至少一个芯片线圈。也就是，所述第一芯片驱动元件32A的第一芯片线圈组3221A包括至少一芯片线圈，所述第二芯片线圈组3222A包括至少一芯片线圈，所述第三芯片线圈组3223A包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第一芯片驱动元件32A的第一芯片线圈组3221A包括设置于所述第一边的第一芯片线圈732211A和第二芯片线圈732212A，所述第一芯片线圈732211A和所述第二芯片线圈732212A沿X轴方向排列。具体地，所述第一芯片驱动元件32A的第一芯片线圈732211A和所述第二芯片线圈732212A沿所述X轴方向相对平行地设置；所述第二芯片线圈组3222A包括设置于所述第二边的第三芯片线圈732221A；所述第三芯片线圈组3223A包括设置于所述第四边的第四芯片线圈732231A；所述第三芯片线圈732221A和所述第四芯片线圈732231A沿Y轴方向相对平行地设置。也可以说，所述第一芯片驱动元件32A的第一芯片线圈732211A和所述第二芯片线圈732212A设置于所述第一感光组件40A的第一边或第三边，所述第三芯片线圈732221A和所述第四芯片线圈732231A分别设置于所述第一感光组件40A的第二边和第四边。
所述第二芯片驱动元件32B的第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B分别包括至少一个芯片线圈。也就是，所述第二芯片驱动元件32B的第一芯片线圈组3221B包括至少一芯片线圈，所述第二芯片线圈组3222B包括至少一芯片线圈，所述第三芯片线圈组33223B包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第二芯片驱动元件32B的第一芯片线圈组3221B包括设置于所述第一边的第一芯片线圈732211B和第二芯片线圈732212B，所述第一芯片线圈732211B和所述第二芯片线圈732212B沿X轴方向排列。具体地，所述第二芯片驱动元件32B的第一芯片线圈732211B和所述第二芯片线圈732212B沿所述X轴方向相对平行地设置；所述第二芯片线圈组3222B包括设置于所述第二边的第三芯片线圈732221B；所述第三芯片线圈组33223B包括设置于所述第四边的第四芯片线圈732231B；所述第三芯片线圈732221B和所述第四芯片线圈732231B沿Y轴方向相对平行地设置。也可以说，所述第 二芯片驱动元件32B的第一芯片线圈732211B和所述第二芯片线圈732212B设置于所述第二感光组件40B的第一边或第三边，所述第三芯片线圈732221B和所述第四芯片线圈732231B分别设置于所述第二感光组件40B的第二边和第四边。
所述第一芯片驱动元件32A的第一芯片线圈732211A与所述第二芯片线圈732212A共同作用驱动所述第一芯片防抖可动部33A沿Y轴方向移动和/或绕Z轴方向旋转，所述第三芯片线圈732221A、所述第四芯片线圈732231A共同作用驱动所述第一芯片防抖可动部33A沿X轴方向移动。
所述第二芯片驱动元件32B的第一芯片线圈732211B与所述第二芯片线圈732212B共同作用驱动所述第二芯片防抖可动部33B沿Y轴方向移动和/或绕Z轴方向旋转，所述第三芯片线圈732221B、所述第四芯片线圈732231B共同作用驱动所述第二芯片防抖可动部33B沿X轴方向移动。
优选地，所述第一芯片驱动元件32A的第一芯片线圈732211A与所述第二芯片线圈732212A的尺寸相同，所述第三芯片线圈732221A、所述第四芯片线圈732231A的尺寸相同，所述第三芯片线圈732221A与所述第四芯片线圈732231A的尺寸小于所述第一芯片线圈732211A、所述第二芯片线圈732212A的尺寸。这是由于第一芯片驱动元件32A的所述第三芯片线圈732221A与第四芯片线圈732231A仅需要驱动所述第一芯片防抖可动部33实现沿X轴方向平移即可，而所述第一芯片驱动元件32A的第一芯片线圈732211A和第二芯片线圈732212A需要既驱动所述第一芯片防抖可动部33实现沿Y轴方向平移，又要驱动所述第一芯片防抖可动部33实现绕Z轴旋转。
优选地，所述第二芯片驱动元件32B的第一芯片线圈732211B与所述第二芯片线圈732212B的尺寸相同，所述第三芯片线圈732221B、所述第四芯片线圈732231B的尺寸相同，所述第三芯片线圈732221B与所述第四芯片线圈732231B的尺寸小于所述第一芯片线圈732211B、所述第二芯片线圈732212B的尺寸。这是由于第二芯片驱动元件32B的所述第三芯片线圈732221B与第四芯片线圈732231B仅需要驱动所述第一芯片防抖可动部33实现沿X轴方向平移即可，而所述第二芯片驱动元件32B的第一芯片线圈732211B和第二芯片线圈732212B需要既驱动所述第一芯片防抖可动部33实现沿Y轴方向平移，又要驱动所述第一芯片防抖可动部33实现绕Z轴旋 转。
在本申请的一个实施例中，所述第一芯片驱动元件32A的芯片线圈组件322A还包括被设置于所述芯片可动载体331A的线圈电路板3224A，所述芯片线圈组件322A中至少一芯片线圈被固定且电连接于所述线圈电路板3224A。在本申请的一个具体示例中，所述第一芯片驱动元件32A的第一芯片线圈组3221A(所述第一芯片线圈732211A、所述第二芯片线圈732212A)、所述第二芯片线圈组3222A(所述第三芯片线圈732221A)和所述第三芯片线圈组3223A(所述第四芯片线圈732231A)均固定并电连接于所述线圈电路板3224A，所述芯片线圈组件322A通过所述线圈电路板3224A电连接于所述第一芯片防抖导电部35A从而进一步电连接于所述第一感光组件40A的第一线路板41A。具体地，所述第一芯片驱动元件32A的第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A可以是绕制成型的线圈固定电连接于所述线圈电路板3224A；或者，所述第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A可以是直接在所述线圈电路板3224A上绕制成型；或者，所述第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A是直接在所述线圈电路板3224A上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述第一芯片驱动元件32A的芯片线圈组件322A的高度，从而降低所述芯片驱动马达30A的高度。进一步地，所述第一芯片驱动元件32A的线圈电路板3224A具有一电路板通光孔32241A，所述电路板通光孔32241A提供所述第一光学镜头10A的光线入射所述第一感光组件40A一通光孔。
在本申请的一个实施例中，所述第二芯片驱动元件32B的芯片线圈组件322B还包括被设置于所述芯片可动载体331B的线圈电路板3224B，所述芯片线圈组件322B中至少一芯片线圈被固定且电连接于所述线圈电路板3224B。在本申请的一个具体示例中，所述第二芯片驱动元件32B的第一芯片线圈组3221B(所述第一芯片线圈732211B、所述第二芯片线圈732212B)、所述第二芯片线圈组3222B(所述第三芯片线圈732221B)和所述第三芯片线圈组33223B(所述第四芯片线圈732231B)均固定并电连接于所述线圈电路板3224B，所述芯片线圈组件322B通过所述线圈电路板3224B电连接于所述第二芯片防抖导电部35B从而进一步电连接于所述第二感光组件40B的第二线路板41B。具体地，所述第二芯片驱动元件32B的第一芯片线圈组 3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B可以是绕制成型的线圈固定电连接于所述线圈电路板3224B；或者，所述第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B可以是直接在所述线圈电路板3224B上绕制成型；或者，所述第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B是直接在所述线圈电路板3224B上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述第二芯片驱动元件32B的芯片线圈组件322B的高度，从而降低所述芯片驱动马达30B的高度。进一步地，所述第二芯片驱动元件32B的线圈电路板3224B具有一电路板通光孔32241B，所述电路板通光孔32241B提供所述第二光学镜头10B的光线入射所述第二感光组件40B一通光孔。
相应地，在本申请的一个实施例中，所述第一芯片驱动元件32A的芯片磁石组件321A包括第一芯片磁石组3211A、第二芯片磁石组3212A和第三芯片磁石组3213A，所述第一芯片磁石组3211A、所述第二芯片磁石组3212A和所述第三芯片磁石组3213A设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步地，所述第一芯片驱动元件32A的第一芯片磁石组3211A与所述第一芯片线圈组3221A上下相对设置，所述第二芯片磁石组3212A与所述第二芯片线圈组3222A上下相对设置，所述第三芯片磁石组3213A与所述第三芯片线圈组3223A上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第一芯片驱动元件32A的第一芯片磁石组3211A沿X轴方向设置，所述第二芯片磁石组3212A和所述第三芯片磁石组3213A沿Y轴方向设置，所述第二芯片磁石组3212A与所述第三芯片磁石组3213A沿Y轴方向相对设置，所述第二芯片磁石组3212A与所述第三芯片磁石组3213A相对于Y轴对称。在本申请中，上方为远离所述第一感光组件40A的一侧，下方为靠近所述第一感光组件40A的一侧。
所述第二芯片驱动元件32B的芯片磁石组件321B包括第一芯片磁石组3211B、第二芯片磁石组3212B和第三芯片磁石组3213B，所述第一芯片磁石组3211B、所述第二芯片磁石组3212B和所述第三芯片磁石组3213B设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步地，所述第二芯片驱动元件32B的第一芯片磁石组3211B与所述第一芯片线圈组3221B上下相对设置，所述第二芯片磁石组3212B与所述第二芯片线圈组3222B上 下相对设置，所述第三芯片磁石组3213B与所述第三芯片线圈组33223B上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第二芯片驱动元件32B的第一芯片磁石组3211B沿X轴方向设置，所述第二芯片磁石组3212B和所述第三芯片磁石组3213B沿Y轴方向设置，所述第二芯片磁石组3212B与所述第三芯片磁石组3213B沿Y轴方向相对设置，所述第二芯片磁石组3212B与所述第三芯片磁石组3213B相对于Y轴对称。在本申请中，上方为远离所述第二感光组件40B的一侧，下方为靠近所述第二感光组件40B的一侧。
所述第一芯片驱动元件32A的第一芯片磁石组3211A、所述第二芯片磁石组3212A和所述第三芯片磁石组3213A分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第一芯片驱动元件32A的第一芯片磁石组3211A包括第一芯片磁石732111A和第二芯片磁石732112A，所述第一芯片磁石732111A和所述第二芯片磁石732112A沿X轴方向排列，具体地，所述第一芯片磁石732111A和所述第二芯片磁石732112A沿X轴方向相对平行地设置。所述第一芯片驱动元件32A的第二芯片磁石组3212A包括第三芯片磁石732121A；所述第三芯片磁石组3213A包括第四芯片磁石732131A，所述第三芯片磁石732121A和所述第四芯片磁石732131A沿Y轴方向相对平行地设置。更具体地，在本申请实施例中，所述第一芯片驱动元件32A的第一芯片磁石组3211A设置于所述第一感光组件40A的沿X轴方向的相对的两角处(即，转角区域)，所述第二芯片磁石组3212A和所述第三芯片磁石组3213A设置于所述第一感光组件40A的沿Y轴方向的相对的两边处。
所述第二芯片驱动元件32B的第一芯片磁石组3211B、所述第二芯片磁石组3212B和所述第三芯片磁石组3213B分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第二芯片驱动元件32B的第一芯片磁石组3211B包括第一芯片磁石732111B和第二芯片磁石732112B，所述第一芯片磁石732111B和所述第二芯片磁石732112B沿X轴方向排列，具体地，所述第一芯片磁石732111B和所述第二芯片磁石732112B沿X轴方向相对平行地设置。所述第二芯片驱动元件32B的第二芯片磁石组3212B包括第三芯片磁石732121B；所述第三芯片磁石组3213B包括第四芯片磁石732131B，所述第三芯片磁石732121B和所述第四芯片磁石732131B沿Y轴 方向相对平行地设置。更具体地，在本申请实施例中，所述第二芯片驱动元件32B的第一芯片磁石组3211B设置于所述第二感光组件40B的沿X轴方向的相对的两角处(即，转角区域)，所述第二芯片磁石组3212B和所述第三芯片磁石组3213B设置于所述第二感光组件40B的沿Y轴方向的相对的两边处。
所述第一芯片驱动元件32A的第一芯片磁石732111A和所述第二芯片磁石732112A共同作用驱动所述第一芯片防抖可动部33A沿Y轴方向移动和/或绕Z轴方向旋转，所述第三芯片磁石732121A、所述第四芯片磁石732131A共同作用驱动所述第一芯片防抖可动部33A沿X轴方向移动。
所述第二芯片驱动元件32B的第一芯片磁石732111B和所述第二芯片磁石732112B共同作用驱动所述第二芯片防抖可动部33B沿Y轴方向移动和/或绕Z轴方向旋转，所述第三芯片磁石732121B、所述第四芯片磁石732131B共同作用驱动所述第二芯片防抖可动部33B沿X轴方向移动。
优选地，所述第一芯片驱动元件32A的第一芯片磁石732111A和所述第二芯片磁石732112A的尺寸相同，所述第三芯片磁石732121A、所述第四芯片磁石732131A尺寸相同，所述第三芯片磁石732121A和所述第四芯片磁石732131A的尺寸小于所述第一芯片磁石732111A、所述第二芯片磁石732112A。这是由于所述第三芯片磁石732121A与第四芯片磁石732131A仅需要驱动所述第一芯片防抖可动部33A实现沿X轴方向平移即可，而所述第一芯片磁石732111A和第二芯片磁石732112A需要既驱动所述第一芯片防抖可动部33A实现沿Y轴方向平移，又要驱动所述第一芯片防抖可动部33A实现绕Z轴旋转。
优选地，所述第二芯片驱动元件32B的第一芯片磁石732111B和所述第二芯片磁石732112B的尺寸相同，所述第三芯片磁石732121B、所述第四芯片磁石732131B尺寸相同，所述第三芯片磁石732121B和所述第四芯片磁石732131B的尺寸小于所述第一芯片磁石732111B、所述第二芯片磁石732112B。这是由于所述第三芯片磁石732121B与第四芯片磁石732131B仅需要驱动所述第二芯片防抖可动部33B实现沿X轴方向平移即可，而所述第一芯片磁石732111B和第二芯片磁石732112B需要既驱动所述第二芯片防抖可动部33B实现沿Y轴方向平移，又要驱动所述第二芯片防抖可动部33B实现绕Z轴旋转。
所述第一芯片驱动元件32A的第一芯片线圈组3221A和所述第一芯片磁石组3211A相互作用，带动所述第一芯片防抖可动部33A，进而带动所述第一感光组件40A在Y轴方向上平移和/或绕Z轴方向旋转；所述第二芯片线圈组3222A和所述第二芯片磁石组3212A相互作用、所述第三芯片线圈组3223A和所述第三芯片磁石组3213A相互作用，共同带动所述第一芯片防抖可动部33A，进而带动所述第一感光组件40A在X轴方向上平移。
所述第二芯片驱动元件32B的第一芯片线圈组3221B和所述第一芯片磁石组3211B相互作用，带动所述第二芯片防抖可动部33B，进而带动所述第二感光组件40B在Y轴方向上平移和/或绕Z轴方向旋转；所述第二芯片线圈组3222B和所述第二芯片磁石组3212B相互作用、所述第三芯片线圈组33223B和所述第三芯片磁石组3213B相互作用，共同带动所述第二芯片防抖可动部33B，进而带动所述第二感光组件40B在X轴方向上平移。
所述第一芯片驱动元件32A的第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组3223A分别包括至少一个芯片线圈。也就是，所述第一芯片驱动元件32A的第一芯片线圈组3221A包括至少一芯片线圈，所述第二芯片线圈组3222A包括至少一芯片线圈，所述第三芯片线圈组3223A包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第一芯片驱动元件32A的第一芯片线圈组3221A包括设置于所述第一边的两个相对的第一芯片线圈832211A，形成一对第一芯片线圈832211A，一对所述第一芯片线圈832211A沿X轴方向排列。具体地，所述第一芯片驱动元件32A的一对所述第一芯片线圈832211A沿所述X轴方向平行地设置；所述第二芯片线圈组3222A包括设置于所述第二边的第二芯片线圈832212A；所述第三芯片线圈组3223A包括设置于所述第四边的与设置于所述第二边的第二芯片线圈832212A相对的另一第二芯片线圈832212A，形成一对第二芯片线圈832212A；一对所述第二芯片线圈832212A沿Y轴方向相对平行地设置。也可以说，所述第一芯片驱动元件32A的一对所述第一芯片线圈832211A设置于所述第一感光组件40A的第一边或第三边，一对所述第二芯片线圈832212A中的两个第二芯片线圈832212A分别设置于所述第一感光组件40A的第二边和第四边。
所述第二芯片驱动元件32B的第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组3223B分别包括至少一个芯片线圈。也 就是，所述第二芯片驱动元件32B的第一芯片线圈组3221B包括至少一芯片线圈，所述第二芯片线圈组3222B包括至少一芯片线圈，所述第三芯片线圈组3223B包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第二芯片驱动元件32B的第一芯片线圈组3221B包括设置于所述第一边的两个相对的第一芯片线圈832211B，形成一对第一芯片线圈832211B，一对所述第一芯片线圈832211B沿X轴方向排列。具体地，所述第二芯片驱动元件32B的一对所述第一芯片线圈832211B沿所述X轴方向平行地设置；所述第二芯片线圈组3222B包括设置于所述第二边的第二芯片线圈832212B；所述第三芯片线圈组3223B包括设置于所述第四边的与设置于所述第二边的第二芯片线圈832212B相对的另一第二芯片线圈832212B，形成一对第二芯片线圈832212B；一对所述第二芯片线圈832212B沿Y轴方向相对平行地设置。也可以说，所述第二芯片驱动元件32B的一对所述第一芯片线圈832211B设置于所述第二感光组件40B的第一边或第三边，一对所述第二芯片线圈832212B中的两个第二芯片线圈832212B分别设置于所述第二感光组件40B的第二边和第四边。
所述第一芯片驱动元件32A的一对所述第一芯片线圈832211A共同作用驱动所述第一芯片防抖可动部33A沿Y轴方向移动和/或绕Z轴方向旋转，一对所述第二芯片线圈832212A共同作用驱动所述第一芯片防抖可动部33A沿X轴方向移动。
所述第二芯片驱动元件32B的一对所述第一芯片线圈832211B共同作用驱动所述第二芯片防抖可动部33B沿Y轴方向移动和/或绕Z轴方向旋转，一对所述第二芯片线圈832212B共同作用驱动所述第二芯片防抖可动部33B沿X轴方向移动。
优选地，所述第一芯片驱动元件32A的一对所述第一芯片线圈832211A的尺寸相同，一对所述第二芯片线圈832212A的尺寸相同，所述第二芯片线圈832212A的尺寸小于所述第一芯片线圈832211A的尺寸。这是由于所述第一芯片驱动元件32A的第二芯片线圈832212A仅需要驱动所述第一芯片防抖可动部33A实现沿X轴方向平移即可，而所述第一芯片线圈832211A需要既驱动所述第一芯片防抖可动部33A实现沿Y轴方向平移，又要驱动所述第一芯片防抖可动部33A实现绕Z轴旋转。
所述第二芯片驱动元件32B的一对所述第一芯片线圈832211B的尺寸相 同，一对所述第二芯片线圈832212B的尺寸相同，所述第二芯片线圈832212B的尺寸小于所述第一芯片线圈832211B的尺寸。这是由于所述第二芯片驱动元件32B的第二芯片线圈832212B仅需要驱动所述第二芯片防抖可动部33B实现沿X轴方向平移即可，而所述第一芯片线圈832211B需要既驱动所述第二芯片防抖可动部33B实现沿Y轴方向平移，又要驱动所述第二芯片防抖可动部33B实现绕Z轴旋转。
在本申请的一个实施例中，所述第一芯片驱动元件32A的芯片线圈组件322A还包括被设置于所述第一芯片防抖可动部33A的芯片可动载体331A的线圈电路板3224A，所述芯片线圈组件322A中至少一芯片线圈被固定且电连接于所述线圈电路板3224A。在本申请的一个具体示例中，所述第一芯片驱动元件32A的第一芯片线圈组3221A(一对所述第一芯片线圈832211A)、所述第二芯片线圈组3222A(一个所述第二芯片线圈832212A)和所述第三芯片线圈组3223A(一个所述第二芯片线圈832212A)均固定并电连接于所述线圈电路板3224A，所述芯片线圈组件322A通过所述线圈电路板3224A电连接于所述第一芯片防抖导电部35A从而进一步电连接于所述第一感光组件40A的第一线路板41A。具体地，所述第一芯片驱动元件32A的第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组33223A可以是绕制成型的线圈固定电连接于所述线圈电路板3224A；或者，所述第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组33223A可以是直接在所述线圈电路板3224A上绕制成型；或者，所述第一芯片线圈组3221A、所述第二芯片线圈组3222A和所述第三芯片线圈组33223A是直接在所述线圈电路板3224A上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述第一芯片驱动元件32A的芯片线圈组件322A的高度，从而降低所述第一芯片驱动马达30A的高度。进一步地，所述第一芯片驱动元件32A的线圈电路板3224A具有一电路板通光孔32241A，所述电路板通光孔32241A提供所述第一光学镜头10A的光线入射所述第一感光组件40A一通光孔。
所述第二芯片驱动元件32B的芯片线圈组件322B还包括被设置于所述第二芯片防抖可动部33B的芯片可动载体331B的线圈电路板3224B，所述芯片线圈组件322B中至少一芯片线圈被固定且电连接于所述线圈电路板3224B。在本申请的一个具体示例中，所述第二芯片驱动元件32B的第一芯 片线圈组3221B(一对所述第一芯片线圈832211B)、所述第二芯片线圈组3222B(一个所述第二芯片线圈832212B)和所述第三芯片线圈组3223B(一个所述第二芯片线圈832212B)均固定并电连接于所述线圈电路板3224B，所述芯片线圈组件322B通过所述线圈电路板3224B电连接于所述第二芯片防抖导电部35B从而进一步电连接于所述第二感光组件40B的第二线路板41B。具体地，所述第二芯片驱动元件32B的第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B可以是绕制成型的线圈固定电连接于所述线圈电路板3224B；或者，所述第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B可以是直接在所述线圈电路板3224B上绕制成型；或者，所述第一芯片线圈组3221B、所述第二芯片线圈组3222B和所述第三芯片线圈组33223B是直接在所述线圈电路板3224B上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述第二芯片驱动元件32B的芯片线圈组件322B的高度，从而降低所述第二芯片驱动马达30B的高度。进一步地，所述第二芯片驱动元件32B的线圈电路板3224B具有一电路板通光孔32241B，所述电路板通光孔32241B提供所述第二光学镜头10B的光线入射所述第二感光组件40B一通光孔。
相应地，在本申请的一个实施例中，所述第一芯片驱动元件32A的芯片磁石组件321A包括第一芯片磁石组3211A、第二芯片磁石组3212A和第三芯片磁石组3213A，所述第一芯片磁石组3211A、所述第二芯片磁石组3212A和所述第三芯片磁石组3213A设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步地，所述第一芯片驱动元件32A的第一芯片磁石组3211A与所述第一芯片线圈组3221A上下相对设置，所述第二芯片磁石组3212A与所述第二芯片线圈组3222A上下相对设置，所述第三芯片磁石组3213A与所述第三芯片线圈组33223A上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第一芯片驱动元件32A的第一芯片磁石组3211A沿X轴方向设置，所述第二芯片磁石组3212A和所述第三芯片磁石组3213A沿Y轴方向设置，所述第二芯片磁石组3212A与所述第三芯片磁石组3213A沿Y轴方向相对设置，所述第二芯片磁石组3212A与所述第三芯片磁石组3213A相对于Y轴对称。在本申请中，上方为远离所述第一感光组件40A的一侧，下方为靠近所述第一感光组件40A的一侧。
所述第二芯片驱动元件32B的芯片磁石组件321B包括第一芯片磁石组 3211B、第二芯片磁石组3212B和第三芯片磁石组3213B，所述第一芯片磁石组3211B、所述第二芯片磁石组3212B和所述第三芯片磁石组3213B设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步地，所述第二芯片驱动元件32B的第一芯片磁石组3211B与所述第一芯片线圈组3221B上下相对设置，所述第二芯片磁石组3212B与所述第二芯片线圈组3222B上下相对设置，所述第三芯片磁石组3213B与所述第三芯片线圈组33223B上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第二芯片驱动元件32B的第一芯片磁石组3211B沿X轴方向设置，所述第二芯片磁石组3212B和所述第三芯片磁石组3213B沿Y轴方向设置，所述第二芯片磁石组3212B与所述第三芯片磁石组3213B沿Y轴方向相对设置，所述第二芯片磁石组3212B与所述第三芯片磁石组3213B相对于Y轴对称。在本申请中，上方为远离所述第二感光组件40B的一侧，下方为靠近所述第二感光组件40B的一侧。
所述第一芯片驱动元件32A的第一芯片磁石组3211A、所述第二芯片磁石组3212A和所述第三芯片磁石组3213A分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第一芯片驱动元件32A的第一芯片磁石组3211A包括两个相对的第一芯片磁石832111A，形成一对第一芯片磁石832111A，一对所述第一芯片磁石832111A沿X轴方向排列，具体地，两个所述第一芯片磁石832111A沿X轴方向平行地设置。所述第一芯片驱动元件32A的第二芯片磁石组3212A包括一个第二芯片磁石832112A；所述第三芯片磁石组3213A包括一个第二芯片磁石832112A，形成一对第二芯片磁石832112A，一对所述第二芯片磁石832112A沿Y轴方向相对平行地设置。更具体地，在本申请实施例中，所述第一芯片驱动元件32A的第一芯片磁石组3211A设置于所述第一感光组件40A的沿X轴方向的相对的两角处(即，转角区域)，所述第二芯片磁石组3212A和所述第三芯片磁石组3213A设置于所述第一感光组件40A的沿Y轴方向的相对的两边处。
所述第二芯片驱动元件32B的第一芯片磁石组3211B、所述第二芯片磁石组3212B和所述第三芯片磁石组3213B分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第二芯片驱动元件32B的第一芯片磁石组3211B包括两个相对的第一芯片磁石832111B，形成一对第一芯片磁石832111B，一对所述第一芯片磁石832111B沿X轴方向排列，具体地，两个 所述第一芯片磁石832111B沿X轴方向平行地设置。所述第二芯片驱动元件32B的第二芯片磁石组3212B包括一个第二芯片磁石832112B；所述第三芯片磁石组3213B包括一个第二芯片磁石832112B，形成一对第二芯片磁石832112B，一对所述第二芯片磁石832112B沿Y轴方向相对平行地设置。更具体地，在本申请实施例中，所述第二芯片驱动元件32B的第一芯片磁石组3211B设置于所述第二感光组件40B的沿X轴方向的相对的两角处(即，转角区域)，所述第二芯片磁石组3212B和所述第三芯片磁石组3213B设置于所述第二感光组件40B的沿Y轴方向的相对的两边处。
所述第一芯片驱动元件32A的一对所述第一芯片磁石832111A共同作用驱动所述第一芯片防抖可动部33A沿Y轴方向移动和/或绕Z轴方向旋转，一对所述第二芯片磁石组3212A共同作用驱动所述第一芯片防抖可动部33A沿X轴方向移动。
所述第二芯片驱动元件32B的一对所述第一芯片磁石832111B共同作用驱动所述第二芯片防抖可动部33B沿Y轴方向移动和/或绕Z轴方向旋转，一对所述第二芯片磁石组3212B共同作用驱动所述第二芯片防抖可动部33B沿X轴方向移动。
优选地，所述第一芯片驱动元件32A的一对所述第一芯片磁石832111A的尺寸相同，一对所述第二芯片磁石组3212A尺寸相同，所述第二芯片磁石组3212A的尺寸小于所述第一芯片磁石832111A。这是由于所述第一芯片驱动元件32A的第二芯片磁石组3212A仅需要驱动所述第一芯片防抖可动部33A实现沿X轴方向平移即可，而所述第一芯片磁石832111A需要既驱动所述第一芯片防抖可动部33A实现沿Y轴方向平移，又要驱动所述第一芯片防抖可动部33A实现绕Z轴旋转。
所述第二芯片驱动元件32B的一对所述第一芯片磁石832111B的尺寸相同，一对所述第二芯片磁石组3212B尺寸相同，所述第二芯片磁石组3212B的尺寸小于所述第一芯片磁石832111B。这是由于所述第二芯片驱动元件32B的第二芯片磁石组3212B仅需要驱动所述第二芯片防抖可动部33B实现沿X轴方向平移即可，而所述第一芯片磁石832111B需要既驱动所述第二芯片防抖可动部33B实现沿Y轴方向平移，又要驱动所述第二芯片防抖可动部33B实现绕Z轴旋转。
优选地，所述第二芯片驱动元件32B的第一芯片磁石832111B和所述第 二芯片磁石832112B的尺寸相同，所述第三芯片磁石832121B、所述第四芯片磁石832131B尺寸相同，所述第三芯片磁石832121B和所述第四芯片磁石832131B的尺寸小于所述第一芯片磁石832111B、所述第二芯片磁石832112B。这是由于所述第三芯片磁石832121B与第四芯片磁石832131B仅需要驱动所述第二芯片防抖可动部33B实现沿X轴方向平移即可，而所述第一芯片磁石832111B和第二芯片磁石832112B需要既驱动所述第二芯片防抖可动部33B实现沿Y轴方向平移，又要驱动所述第二芯片防抖可动部33B实现绕Z轴旋转。
所述第一芯片驱动元件32A的第一芯片线圈组3221A和所述第一芯片磁石组3211A相互作用，带动所述第一芯片防抖可动部33A，进而带动所述第一感光组件40A在Y轴方向上平移和/或绕Z轴方向旋转；所述第二芯片线圈组3222A和所述第二芯片磁石组3212A相互作用、所述第三芯片线圈组33223A和所述第三芯片磁石组3213A相互作用，共同带动所述第一芯片防抖可动部33A，进而带动所述第一感光组件40A在X轴方向上平移。
所述第二芯片驱动元件32B的第一芯片线圈组3221B和所述第一芯片磁石组3211B相互作用，带动所述第二芯片防抖可动部33B，进而带动所述第二感光组件40B在Y轴方向上平移和/或绕Z轴方向旋转；所述第二芯片线圈组3222B和所述第二芯片磁石组3212B相互作用、所述第三芯片线圈组33223B和所述第三芯片磁石组3213B相互作用，共同带动所述第二芯片防抖可动部33B，进而带动所述第二感光组件40B在X轴方向上平移。
在本申请一实施例中，所述第一芯片驱动马达30A的至少一侧不设置有第一芯片驱动元件32A，以为所述第一感光芯片42A的偏心设置提供更大的空间位置。即，所述第一感光芯片42A可以靠近于所述第一芯片驱动马达30A上不设置有第一芯片驱动元件32A的一侧设置，以使得所述第一感光芯片42A的中心轴与所述第一芯片驱动马达30A的中心轴不一致。
在本申请一实施例中，所述第二芯片驱动马达30B的至少一侧不设置有第二芯片驱动元件32B，以为所述第二感光芯片42B的偏心设置提供更大的空间位置。即，所述第二感光芯片42B可以靠近于所述第二芯片驱动马达30B上不设置有第二芯片驱动元件32B的一侧设置，以使得所述第二感光芯片42B的中心轴与所述第二芯片驱动马达30B的中心轴不一致。
进一步地，当本申请中偏心设置的第一感光芯片42A应用于第一摄像模 组1A，偏心设置的第二感光芯片42B应用于第二摄像模组1B时，所述第一芯片驱动马达30A的至少一侧没有设置第一芯片驱动元件32A，所述第二芯片驱动马达30B的至少一侧没有设置第二芯片驱动元件32B，且所述第一芯片驱动马达30A中没有设置第一芯片驱动元件32A的一侧与所述第二芯片驱动马达30B中没有设置第二芯片驱动元件32B的一侧相邻设置，即，所述第一芯片驱动马达30A中没有设置所述第一芯片驱动元件32A的一侧与所述第二芯片驱动马达30B中没有设置所述第二芯片驱动元件32B的一侧相互靠近设置，这种设置方式使得所述双摄摄像模组的所述第一摄像模组1A和所述第二摄像模组1B的相邻处不设置第一芯片驱动元件32A和/或第二芯片驱动元件32B，以避免磁干扰问题影响所述第一镜头驱动马达20A和第二镜头驱动马达20B的配合方案的选型。
具体地，在本申请一实施例中，所述第一芯片驱动元件32A的芯片磁石组件321A和芯片线圈组件322A集中设置于所述第一感光芯片42A的三边，所述第一感光芯片42A的除三边外的一边没有设置有第一芯片驱动元件32A，这种设置方式使得所述第一感光芯片42A的中心轴以偏心的状态设置于所述第一芯片防抖可动部33A的芯片可动载体331A，所述第一感光芯片42A的中心O更靠近于所述芯片可动载体331A上没有设置所述第一芯片驱动元件32A的一边。例如，在本申请一具体示例中，所述第一芯片驱动元件32A的第一芯片磁石组3211A和第一芯片线圈组3221A设置于所述第一感光芯片42A的第三边和第四边，所述第二芯片磁石组3212A、第二芯片线圈组3222A和所述第三芯片磁石组3213A、第三芯片线圈组3223A设置于所述第一感光芯片42A的第二边，这种设置方式使得所述第一感光芯片42A的中心O靠近于所述芯片可动载体331A的第一边，即，所述第一感光芯片42A的中心轴与所述第一芯片驱动马达30A的中心轴不一致。
所述第二芯片驱动元件32B的芯片磁石组件321B和芯片线圈组件322B集中设置于所述第二感光芯片42B的三边，所述第二感光芯片42B的除三边外的一边没有设置有第二芯片驱动元件32B，这种设置方式使得所述第二感光芯片42B的中心轴以偏心的状态设置于所述第二芯片防抖可动部33B的芯片可动载体331B，所述第二感光芯片42B的中心O更靠近于所述芯片可动载体331B上没有设置所述第二芯片驱动元件32B的一边。例如，在本申请一具体示例中，所述第二芯片驱动元件32B的第一芯片磁石组3211B 和第一芯片线圈组3221B设置于所述第二感光芯片42B的第三边和第四边，所述第二芯片磁石组3212B、第二芯片线圈组3222B和所述第三芯片磁石组3213B、第三芯片线圈组33223B设置于所述第二感光芯片42B的第二边，这种设置方式使得所述第二感光芯片42B的中心O靠近于所述芯片可动载体331B的第一边，即，所述第二感光芯片42B的中心轴与所述第二芯片驱动马达30B的中心轴不一致。
在本申请的一个实施例中，所述第一芯片驱动元件32A的芯片磁石组件321A还包括设置于所述第一芯片磁石组3211A、所述第二芯片磁石组3212A、所述第三芯片磁石组3213A和所述第一芯片防抖固定部31A的上盖311A之间的导磁构件(图中未示出)。所述第一芯片驱动元件32A的第一芯片磁石组3211A、所述第二芯片磁石组3212A和所述第三芯片磁石组3213A通过所述导磁构件被间接固定于所述第一芯片防抖固定部31A的上盖311A，所述导磁构件适于增强所述芯片磁石组件321A朝向所述芯片线圈组件322A方向的磁场力，从而增强所述第一芯片驱动元件32A的驱动力。
所述第二芯片驱动元件32B的芯片磁石组件321B还包括设置于所述第一芯片磁石组3211B、所述第二芯片磁石组3212B、所述第三芯片磁石组3213B和所述第二芯片防抖固定部31B的上盖311B之间的导磁构件(图中未示出)。所述第二芯片驱动元件32B的第一芯片磁石组3211B、所述第二芯片磁石组3212B和所述第三芯片磁石组3213B通过所述导磁构件被间接固定于所述第二芯片防抖固定部31B的上盖311B，所述导磁构件适于增强所述芯片磁石组件321B朝向所述芯片线圈组件322B方向的磁场力，从而增强所述第二芯片驱动元件32B的驱动力。
在本申请的一个实施例中，所述第一芯片驱动马达30A还包括第一芯片位置感测组件36A和第一芯片保持组件34A，所述第一芯片位置感测组件36A用于获取所述第一感光组件40A的位置或者运动信息，所述第一芯片保持组件34A适于使得所述芯片可动载体331A被悬持地设置于所述第一芯片防抖固定部31A的收容腔内，这样，所述第一感光组件40A可以被所述第一芯片保持组件34A被悬持于所述第一芯片防抖固定部31A中。
所述第二芯片驱动马达30B还包括第二芯片位置感测组件36B和第二芯片保持组件34B，所述第二芯片位置感测组件36B用于获取所述第二感光组件40B的位置或者运动信息，所述第二芯片保持组件34B适于使得所述 芯片可动载体331B被悬持地设置于所述第二芯片防抖固定部31B的收容腔内，这样，所述第二感光组件40B可以被所述第二芯片保持组件34B被悬持于所述第二芯片防抖固定部31B中。
所述第一芯片位置感测组件36A固定于所述芯片可动载体331A，从而当所述芯片可动载体331A运动时，所述第一芯片位置感测组件36A适于通过获取所述第一芯片防抖可动部33A的芯片磁石组件321A的磁场变化获取所述芯片可动载体331A的位置信息。
所述第二芯片位置感测组件36B固定于所述芯片可动载体331B，从而当所述芯片可动载体331B运动时，所述第二芯片位置感测组件36B适于通过获取所述第二芯片防抖可动部33B的芯片磁石组件321B的磁场变化获取所述芯片可动载体331B的位置信息。
所述第一芯片位置感测组件36A包括至少一位置感测元件，所述位置感测元件的数量并不为本申请所局限。在本申请的一个具体示例中，所述第一芯片位置感测组件36A包括第一位置感测元件361A、第二位置感测元件362A和第三位置感测元件363A，从而用于感测所述第一芯片防抖可动部33A的芯片可动载体331A沿X轴方向平移、沿Y轴方向平移和绕Z轴方向旋转三种移动的位置信息。在本申请实施例中，所述第一芯片位置感测组件36A的第一位置感测元件361A、所述第二位置感测元件362A和所述第三位置感测元件363A为霍尔元件；在本申请其他实施例中，所述第一位置感测元件361A、所述第二位置感测元件362A和所述第三位置感测元件363A为含有位置感测功能的驱动芯片。
所述第二芯片位置感测组件36B包括至少一位置感测元件，所述位置感测元件的数量并不为本申请所局限。在本申请的一个具体示例中，所述第二芯片位置感测组件36B包括第一位置感测元件361B、第二位置感测元件362B和第三位置感测元件363B，从而用于感测所述第二芯片防抖可动部33B的芯片可动载体331B沿X轴方向平移、沿Y轴方向平移和绕Z轴方向旋转三种移动的位置信息。在本申请实施例中，所述第二芯片位置感测组件36B的第一位置感测元件361B、所述第二位置感测元件362B和所述第三位置感测元件363B为霍尔元件；在本申请其他实施例中，所述第一位置感测元件361B、所述第二位置感测元件362B和所述第三位置感测元件363B为含有位置感测功能的驱动芯片。
在本申请一具体示例中，所述第一芯片防抖可动部33A的芯片载体主体3311A上形成有感测元件凹槽33114A，所述第一芯片位置感测组件36A设置于所述感测元件凹槽33114A中，进而防止所述第一芯片位置感测组件36A的高度过高，而所述第一芯片位置感测组件36A电连接于所述第一感光组件40A的第一线路板41A，在所述第一芯片防抖可动部33A的芯片可动载体331A所设定的高度(Z轴)方向上，所述第一芯片位置感测组件36A被设置在所述第一芯片驱动元件32A的芯片线圈组件322A和所述第一线路板41A之间。优选地，所述第一芯片位置感测组件36A容置于所述第一芯片防抖可动部33A的感测元件凹槽33114A中，不突出于所述感测元件凹槽33114A。
所述第二芯片防抖可动部33B的芯片载体主体3311B上形成有感测元件凹槽33114B，所述第二芯片位置感测组件36B设置于所述感测元件凹槽33114B中，进而防止所述第二芯片位置感测组件36B的高度过高，而所述第二芯片位置感测组件36B电连接于所述第二感光组件40B的第二线路板41B，在所述第二芯片防抖可动部33B的芯片可动载体331B所设定的高度(Z轴)方向上，所述第二芯片位置感测组件36B被设置在所述第二芯片驱动元件32B的芯片线圈组件322B和所述第二线路板41B之间。优选地，所述第二芯片位置感测组件36B容置于所述第二芯片防抖可动部33B的感测元件凹槽33114B中，不突出于所述感测元件凹槽33114B。
所述第一芯片保持组件34A包括被设置于所述第一芯片防抖可动部33A的芯片可动载体331A和所述上盖311A之间的芯片支撑组件341A和芯片磁吸组件342A，所述芯片磁吸组件342A固定于所述第一芯片防抖可动部33A的芯片可动载体331A，这样，所述芯片磁吸组件342A与所述芯片磁石组件321A之间的磁吸力使所述第一芯片防抖可动部33A吸附向所述上盖311A。所述第一芯片保持组件34A的芯片支撑组件341A设置于所述第一芯片防抖固定部31A的上盖311A与所述第一芯片防抖可动部33A的芯片可动载体331A之间，在所述芯片磁吸组件342A与所述芯片磁石组件321A之间的磁吸力的作用下，所述芯片支撑组件341A被所述上盖311A和所述芯片可动载体331A夹持，所述芯片可动载体331A与所述上盖311A之间保持间隙，从而减小所述第一芯片防抖可动部33A在运动时的阻力。
所述第二芯片保持组件34B包括被设置于所述第二芯片防抖可动部33B 的芯片可动载体331B和所述上盖311B之间的芯片支撑组件341B和芯片磁吸组件342B，所述芯片磁吸组件342B固定于所述第二芯片防抖可动部33B的芯片可动载体331B，这样，所述芯片磁吸组件342B与所述芯片磁石组件321B之间的磁吸力使所述第二芯片防抖可动部33B吸附向所述上盖311B。所述第二芯片保持组件34B的芯片支撑组件341B设置于所述第二芯片防抖固定部31B的上盖311B与所述第二芯片防抖可动部33B的芯片可动载体331B之间，在所述芯片磁吸组件342B与所述芯片磁石组件321B之间的磁吸力的作用下，所述芯片支撑组件341B被所述上盖311B和所述芯片可动载体331B夹持，所述芯片可动载体331B与所述上盖311B之间保持间隙，从而减小所述第二芯片防抖可动部33B在运动时的阻力。
在本申请实施例中，所述第一芯片保持组件34A的芯片支撑组件341A被夹持地设置于所述第一芯片防抖可动部33A和所述第一芯片防抖固定部31A之间的至少三支撑组件。也就是，所述第一芯片保持组件34A的芯片支撑组件341A包括被夹持地设置于所述第一芯片防抖可动部33A和所述第一芯片防抖固定部31A之间的第一支撑组件、第二支撑组件和第三支撑组件。所述第一支撑组件、所述第二支撑组件和所述第三支撑组件中每一组支撑组件包括凹陷地形成于所述第一芯片防抖可动部33A的芯片可动载体331A的滚珠槽3412A以及被设置于所述滚珠槽3412A内的滚珠3411A。
所述第二芯片保持组件34B的芯片支撑组件341B被夹持地设置于所述第二芯片防抖可动部33B和所述第二芯片防抖固定部31B之间的至少三支撑组件。也就是，所述第二芯片保持组件34B的芯片支撑组件341B包括被夹持地设置于所述第二芯片防抖可动部33B和所述第二芯片防抖固定部31B之间的第一支撑组件、第二支撑组件和第三支撑组件。所述第一支撑组件、所述第二支撑组件和所述第三支撑组件中每一组支撑组件包括凹陷地形成于所述第二芯片防抖可动部33B的芯片可动载体331B的滚珠槽3412B以及被设置于所述滚珠槽3412B内的滚珠3411B。
特别地，在本申请实施例中，所述至少三支撑组件以不完全共线的方式布设。在本申请的一个具体示例中，所述第一支撑组件、所述第二支撑组件和所述第三支撑组件呈三角形的布设形态分布所述第一支撑组件被设置于所述芯片可动载体的第一边，所述第二支撑组件和所述第三支撑组件被设置于所述芯片可动载体的与所述第一边相对的第三边的两个转角区域。优选 地，所述第一支撑组件被设置于所述第一边的中间区域，以对所述第一芯片防抖可动部33A的芯片可动载体331A和所述第一芯片防抖可动部33B的芯片可动载体331B形成平稳的支撑。
所述第一芯片保持组件34A的滚珠3411A和滚珠槽3412A的数量并不为本申请所局限，在本申请的一个实施例中，所述第一芯片保持组件34A的芯片支撑组件341A包括三个支撑组件，每个支撑组件包括至少一滚珠3411A和至少一滚珠槽3412A，也就是说，所述芯片支撑组件341A包括至少三个设置于所述第一芯片防抖可动部33A的芯片可动载体331A和所述上盖311A之间的滚珠3411A，为限制所述滚珠3411A的移动范围，所述芯片支撑组件341A还包括至少三个与至少三个所述滚珠3411A相对应的滚珠槽3412A，优选地，至少三个所述滚珠槽3412A形成于所述芯片可动载体331A，所述滚珠槽3412A的深度小于所述滚珠3411A的直径，所述滚珠3411A的至少一部分可以突出于所述滚珠槽3412A，以使得所述滚珠3411A可以与所述上盖311A保持摩擦接触。
所述第二芯片保持组件34B的芯片支撑组件341B被夹持地设置于所述第二芯片防抖可动部33B和所述第二芯片防抖固定部31B之间的至少三支撑组件。也就是，所述第二芯片保持组件34B的芯片支撑组件341B包括被夹持地设置于所述第二芯片防抖可动部33B和所述第二芯片防抖固定部31B之间的第一支撑组件、第二支撑组件和第三支撑组件。所述第一支撑组件、所述第二支撑组件和所述第三支撑组件中每一组支撑组件包括凹陷地形成于所述第二芯片防抖可动部33B的芯片可动载体331B的滚珠槽3412B以及被设置于所述滚珠槽3412B内的滚珠3411B。所述第二芯片保持组件34B的滚珠3411B和滚珠槽3412B的数量并不为本申请所局限，在本申请的一个实施例中，所述第二芯片保持组件34B的芯片支撑组件341B包括三个支撑组件，每个支撑组件包括至少一滚珠3411B和至少一滚珠槽3412B，也就是说，所述芯片支撑组件341B包括至少三个设置于所述第二芯片防抖可动部33B的芯片可动载体331B和所述上盖311B之间的滚珠3411B，为限制所述滚珠3411B的移动范围，所述芯片支撑组件341B还包括至少三个与至少三个所述滚珠3411B相对应的滚珠槽3412B，优选地，至少三个所述滚珠槽3412B形成于所述芯片可动载体331B，所述滚珠槽3412B的深度小于所述滚珠3411B的直径，所述滚珠3411B的至少一部分可以突出于所述滚珠槽3412B， 以使得所述滚珠3411B可以与所述上盖311B保持摩擦接触。
进一步地，所述第一芯片防抖可动部33A的芯片可动载体331A还包括突出地形成于所述芯片载体主体3311A的上表面的延伸柱3313A，所述滚珠槽3412A凹陷地形成于所述延伸柱3313A的上表面。在本申请的一个实施例中，所述芯片可动载体331A包括形成于所述芯片载体主体3311A上的至少三延伸柱3313A，至少三所述延伸柱3313A突出于所述芯片载体主体3311A的上表面，至少三所述滚珠槽3412A形成于至少三所述延伸柱3313A。所述第一芯片保持组件34A的芯片支撑组件341A设置于所述第一芯片防抖可动部33A的延伸柱3313A与所述上盖311A之间，以使得所述第一芯片防抖可动部33A的芯片可动载体331A与所述上盖311A之间保持一定的间隙，该间隙不随所述芯片可动载体331A的移动而发生改变。
所述第二芯片防抖可动部33B的芯片可动载体331B还包括突出地形成于所述芯片载体主体3311B的上表面的延伸柱3313B，所述滚珠槽3412B凹陷地形成于所述延伸柱3313B的上表面。在本申请的一个实施例中，所述芯片可动载体331B包括形成于所述芯片载体主体3311B上的至少三延伸柱3313B，至少三所述延伸柱3313B突出于所述芯片载体主体3311B的上表面，至少三所述滚珠槽3412B形成于至少三所述延伸柱3313B。所述第二芯片保持组件34B的芯片支撑组件341B设置于所述第二芯片防抖可动部33B的延伸柱3313B与所述上盖311B之间，以使得所述第二芯片防抖可动部33B的芯片可动载体331B与所述上盖311B之间保持一定的间隙，该间隙不随所述芯片可动载体331B的移动而发生改变。
在本申请的一个具体示例中，所述第一芯片防抖可动部33A的芯片可动载体331A包括形成于所述芯片载体主体3311A上的三个延伸柱3313A，所述第一芯片保持组件34A的芯片支撑组件341A包括三个由所述延伸柱3313A的顶面下凹形成的三个滚珠槽3412A和设置于三个所述滚珠槽3412A和所述上盖311A之间的三个滚珠3411A。
所述第二芯片防抖可动部33B的芯片可动载体331B包括形成于所述芯片载体主体3311B上的三个延伸柱3313B，所述第二芯片保持组件34B的芯片支撑组件341B包括三个由所述延伸柱3313B的顶面下凹形成的三个滚珠槽3412B和设置于三个所述滚珠槽3412B和所述上盖311B之间的三个滚珠3411B。
特别地，在本申请实施例中，所述第一芯片保持组件34A的至少三支撑组件以不完全共线的方式布设。相应地，在上述具体示例中，第一芯片防抖可动部33A的三个所述延伸柱3313A分布在所述芯片载体主体3311A两个相邻角，以及与相邻角连线所在边相对的边上，即三个滚珠3411A呈三角形的布设形态，以对所述芯片可动载体331A形成平稳的支撑。所述第二芯片保持组件34B的至少三支撑组件以不完全共线的方式布设。相应地，在上述具体示例中，第二芯片防抖可动部33B的三个所述延伸柱3313B分布在所述芯片载体主体3311B两个相邻角，以及与相邻角连线所在边相对的边上，即三个滚珠3411B呈三角形的布设形态，以对所述芯片可动载体331B形成平稳的支撑。
所述第一芯片保持组件34A的芯片支撑组件341A还包括内嵌于所述第一芯片防抖可动部33A的芯片可动载体331A内且位于所述滚珠槽3412A的底部的滚珠支撑片3413A，所述滚珠3411A被支持于所述滚珠支撑片3413A。在本申请的一个实施例中，所述第一芯片保持组件34A的芯片支撑组件341A还包括至少三滚珠支撑片3413A，所述滚珠支撑片3413A固定于所述第一芯片防抖可动部33A的芯片可动载体331A并作为所述滚珠槽3412A的底面，所述滚珠支撑片3413A可以是不锈钢等金属材质，进而提供所述滚珠3411A一更平滑的支撑面，减小滚珠3411A滚动的摩擦力。在本申请的具体示例中，所述第一芯片保持组件34A的芯片支撑组件341A包括三个滚珠支撑片3413A，每个滚珠支撑片3413A通过嵌件成型的方式固定于所述第一芯片防抖可动部33A的芯片可动载体331A的延伸柱3313A中并裸露其上表面作为每个滚珠槽3412A的底面，所述滚珠支撑片3413A包括支撑片主体34131A和支撑片连接部34132A，所述支撑片主体34131A和所述支撑片连接部34132A一体延伸，所述支撑片主体34131A的上表面裸露并作为所述滚珠槽3412A的底面，所述支撑片连接部34132A用于在嵌件成型工艺中保持所述滚珠支撑片3413A在所述芯片可动载体331A中的位置，所述支撑片连接部34132A可以连接其他滚珠支撑片3413A的支撑片连接部34132A或者连接其他用于支撑所述支撑片连接部34132A的支持部件。在所述第一芯片保持组件34A的滚珠支撑片3413A通过嵌件成型工艺形成在所述第一芯片防抖可动部33A的芯片可动载体331A中后，剪切所述支撑片连接部34132A，所述支撑片连接部34132A的一部分可以裸露在所述芯片可动载体 331A之外。也就是，在本申请的一些实施方式中，所述第一芯片保持组件34A的滚珠支撑片3413A包括位于所述滚珠槽3412A的底部的支撑片主体34131A和从所述支撑片主体34131A延伸至所述第一芯片防抖可动部33A的芯片可动载体331A外的支撑片连接部34132A。
所述第二芯片保持组件34B的芯片支撑组件341B还包括内嵌于所述第二芯片防抖可动部33B的芯片可动载体331B内且位于所述滚珠槽3412B的底部的滚珠支撑片3413B，所述滚珠3411B被支持于所述滚珠支撑片3413B。在本申请的一个实施例中，所述第二芯片保持组件34B的芯片支撑组件341B还包括至少三滚珠支撑片3413B，所述滚珠支撑片3413B固定于所述第二芯片防抖可动部33B的芯片可动载体331B并作为所述滚珠槽3412B的底面，所述滚珠支撑片3413B可以是不锈钢等金属材质，进而提供所述滚珠3411B一更平滑的支撑面，减小滚珠3411B滚动的摩擦力。在本申请的具体示例中，所述第二芯片保持组件34B的芯片支撑组件341B包括三个滚珠支撑片3413B，每个滚珠支撑片3413B通过嵌件成型的方式固定于所述第二芯片防抖可动部33B的芯片可动载体331B的延伸柱3313B中并裸露其上表面作为每个滚珠槽3412B的底面，所述滚珠支撑片3413B包括支撑片主体34131B和支撑片连接部34132B，所述支撑片主体34131B和所述支撑片连接部34132B一体延伸，所述支撑片主体34131B的上表面裸露并作为所述滚珠槽3412B的底面，所述支撑片连接部34132B用于在嵌件成型工艺中保持所述滚珠支撑片3413B在所述芯片可动载体331B中的位置，所述支撑片连接部34132B可以连接其他滚珠支撑片3413B的支撑片连接部34132B或者连接其他用于支撑所述支撑片连接部34132B的支持部件。在所述第二芯片保持组件34B的滚珠支撑片3413B通过嵌件成型工艺形成在所述第二芯片防抖可动部33B的芯片可动载体331B中后，剪切所述支撑片连接部34132B，所述支撑片连接部34132B的一部分可以裸露在所述芯片可动载体331B之外。也就是，在本申请的一些实施方式中，所述第二芯片保持组件34B的滚珠支撑片3413B包括位于所述滚珠槽3412B的底部的支撑片主体34131B和从所述支撑片主体34131B延伸至所述第二芯片防抖可动部33B的芯片可动载体331B外的支撑片连接部34132B。
在本申请的一些实施方式中，所述第一芯片保持组件34A的芯片磁吸组件342A包括至少一个芯片磁吸元件3421A，所述芯片磁吸元件3421A被包 覆于所述第一芯片防抖可动部33A的芯片可动载体331A内，以通过所述第一芯片驱动元件32A的芯片磁石组件321A与所述至少一芯片磁吸元件3421A之间的磁吸力使得所述芯片可动载体331A被悬空地设置于所述第一芯片防抖固定部31A的收容腔内。在本申请的一个具体示例中，第一芯片保持组件34A的至少一个所述芯片磁吸元件3421A通过嵌件成型工艺内嵌于所述第一芯片防抖可动部33A的芯片可动载体331A内，至少一个所述芯片磁吸元件3421A与所述芯片磁石组件321A相对设置，以在至少一个所述芯片磁吸元件3421A与所述芯片磁石组件321A之间产生磁吸力，一方面，通过磁吸力的作用使得所述第一芯片保持组件34A的芯片支撑组件341A被夹持在所述第一芯片防抖固定部31A和所述第一芯片防抖可动部33A之间。具体地，通过所述第一芯片保持组件34A的至少一芯片磁吸元件3421A与所述第一芯片防抖可动部33A芯片磁石组件321A之间的磁吸力，所述滚珠3411A被夹持于所述上盖311A和所述芯片可动载体331A之间；另一方面，在所述芯片可动载体331A移动后，通过磁吸力的作用使得所述芯片可动载体331A保持于一位置，其中，该位置可以为所述芯片可动载体331A被驱动前的初始位置。所述第一芯片保持组件34A的芯片磁吸元件3421A由具有导磁性质的材料制成，其适于与磁石之间产生磁吸力。
所述第二芯片保持组件34B的芯片磁吸组件342B包括至少一个芯片磁吸元件3421B，所述芯片磁吸元件3421B被包覆于所述第二芯片防抖可动部33B的芯片可动载体331B内，以通过所述第二芯片驱动元件32B的芯片磁石组件321B与所述至少一芯片磁吸元件3421B之间的磁吸力使得所述芯片可动载体331B被悬空地设置于所述第二芯片防抖固定部31B的收容腔内。在本申请的一个具体示例中，第二芯片保持组件34B的至少一个所述芯片磁吸元件3421B通过嵌件成型工艺内嵌于所述第二芯片防抖可动部33B的芯片可动载体331B内，至少一个所述芯片磁吸元件3421B与所述芯片磁石组件321B相对设置，以在至少一个所述芯片磁吸元件3421B与所述芯片磁石组件321B之间产生磁吸力，一方面，通过磁吸力的作用使得所述第二芯片保持组件34B的芯片支撑组件341B被夹持在所述第二芯片防抖固定部31B和所述第二芯片防抖可动部33B之间。具体地，通过所述第二芯片保持组件34B的至少一芯片磁吸元件3421B与所述第二芯片防抖可动部33B芯片磁石组件321B之间的磁吸力，所述滚珠3411B被夹持于所述上盖311B和所述 芯片可动载体331B之间；另一方面，在所述芯片可动载体331B移动后，通过磁吸力的作用使得所述芯片可动载体331B保持于一位置，其中，该位置可以为所述芯片可动载体331B被驱动前的初始位置。所述第二芯片保持组件34B的芯片磁吸元件3421B由具有导磁性质的材料制成，其适于与磁石之间产生磁吸力。
所述第一芯片保持组件34A的芯片磁吸元件3421A包括磁吸元件主体34211A和磁吸元件连接部34212A，所述磁吸元件主体34211A和所述磁吸元件连接部34212A一体延伸，所述磁吸元件连接部34212A用于在嵌件成型工艺中保持所述芯片磁吸元件3421A在所述第一芯片防抖可动部33A的芯片可动载体331A中的位置，所述磁吸元件连接部34212A可以连接其他芯片磁吸元件3421A的磁吸元件连接部34212A或者连接其他用于支撑所述磁吸元件连接部34212A的支持部件。在所述第一芯片保持组件34A的芯片磁吸元件3421A通过嵌件成型工艺形成在所述第一芯片防抖可动部33A的芯片可动载体331A中后，剪切所述磁吸元件连接部34212A，所述磁吸元件连接部34212A的一部分可以裸露在所述芯片可动载体331A之外。也就是，在本申请的一些实施方式中，所述第一芯片保持组件34A的芯片磁吸元件3421A包括被包覆于所述第一芯片防抖可动部33A的芯片可动载体331A内的磁吸元件主体34211A和从所述磁吸元件主体34211A延伸至所述芯片可动载体331A外的磁吸元件连接部34212A。
所述第二芯片保持组件34B的芯片磁吸元件3421B包括磁吸元件主体34211B和磁吸元件连接部34212B，所述磁吸元件主体34211B和所述磁吸元件连接部34212B一体延伸，所述磁吸元件连接部34212B用于在嵌件成型工艺中保持所述芯片磁吸元件3421B在所述第二芯片防抖可动部33B的芯片可动载体331B中的位置，所述磁吸元件连接部34212B可以连接其他芯片磁吸元件3421B的磁吸元件连接部34212B或者连接其他用于支撑所述磁吸元件连接部34212B的支持部件。在所述第二芯片保持组件34B的芯片磁吸元件3421B通过嵌件成型工艺形成在所述第二芯片防抖可动部33B的芯片可动载体331B中后，剪切所述磁吸元件连接部34212B，所述磁吸元件连接部34212B的一部分可以裸露在所述芯片可动载体331B之外。也就是，在本申请的一些实施方式中，所述第二芯片保持组件34B的芯片磁吸元件3421B包括被包覆于所述第二芯片防抖可动部33B的芯片可动载体331B内 的磁吸元件主体34211B和从所述磁吸元件主体34211B延伸至所述芯片可动载体331B外的磁吸元件连接部34212B。
在本申请的一个实施例中，所述第一芯片保持组件34A的芯片磁吸元件3421A的上表面裸露，未被所述第一芯片防抖可动部33A的芯片可动载体331A包裹；在本申请的其他实施例中，所述芯片磁吸元件3421A的上表面也可以被所述芯片可动载体331A包裹，本申请并不为此所限。
所述第二芯片保持组件34B的芯片磁吸元件3421B的上表面裸露，未被所述第二芯片防抖可动部33B的芯片可动载体331B包裹；在本申请的其他实施例中，所述芯片磁吸元件3421B的上表面也可以被所述芯片可动载体331B包裹，本申请并不为此所限。
特别地，在本申请一个实施例中，所述第一芯片保持组件34A的芯片磁吸组件342A包括第一芯片磁吸组件3422A和第二芯片磁吸组件3423A，其中，通过对所述第一芯片磁吸组件3422A和所述第二芯片磁吸组件3423A的合理布设，使得所述第一芯片磁吸组件3422A和所述第二芯片磁吸组件3423A发挥的主要作用不同。沿Z轴方向看其表面，所述第一芯片保持组件34A的三颗滚珠3411A呈三角形的布设形态，所述第一芯片磁吸组件3422A设置于三角形平面的角处(即，转角区域)，所述第一芯片磁吸组件3422A靠近于所述滚珠3411A设置，所述第一芯片磁吸组件3422A的主要作用在于与所述第一芯片驱动元件32A的芯片磁石组件321A产生沿Z轴方向的磁吸力，使得所述芯片支撑组件341A被夹持在所述第一芯片防抖固定部31A和所述第一芯片防抖可动部33A之间；所述第二芯片磁吸组件3423A设置于三角形平面的边处，即，所述第二芯片磁吸组件3423A到所述滚珠3411A的距离相对于所述第一芯片磁吸组件3422A到所述滚珠3411A的距离更远，所述第二芯片磁吸组件3423A的主要作用在于在所述芯片可动载体331A移动后，与所述芯片磁石组产生与Z轴方向具有一定夹角的磁吸力，该磁吸力的主要作用是使得所述芯片可动载体331A回复于一位置。当然，本申请中所述第一芯片保持组件34A的第一芯片磁吸组件3422A与第二芯片磁吸组件3423A的主要功能不同，不等于所述第一芯片磁吸组件3422A与第二芯片磁吸组件3423A不会具有其他功能。也就是说，所述第一芯片保持组件34A的第一芯片磁吸组件3422A也会具有在所述第一芯片防抖可动部33A的芯片可动载体331A移动后，通过磁吸力的作用使得所述芯片可动载体 331A回复于一位置的功能，所述第二芯片磁吸组件3423A也会具有通过磁吸力的作用使得所述芯片支撑组件341A被夹持在所述第一芯片防抖固定部31A和所述第一芯片防抖可动部33A之间的功能，所述第一芯片磁吸组件3422A与第二芯片磁吸组件3423A相互配合，共同作用于所述芯片可动载体331A，但由于所述第一芯片磁吸组件3422A与第二芯片磁吸组件3423A的位置不同，使得二者的主要作用不相同。
所述第二芯片保持组件34B的芯片磁吸组件342B包括第一芯片磁吸组件3422B和第二芯片磁吸组件3423B，其中，通过对所述第一芯片磁吸组件3422B和所述第二芯片磁吸组件3423B的合理布设，使得所述第一芯片磁吸组件3422B和所述第二芯片磁吸组件3423B发挥的主要作用不同。沿Z轴方向看其表面，所述第二芯片保持组件34B的三颗滚珠3411B呈三角形的布设形态，所述第一芯片磁吸组件3422B设置于三角形平面的角处(即，转角区域)，所述第一芯片磁吸组件3422B靠近于所述滚珠3411B设置，所述第一芯片磁吸组件3422B的主要作用在于与所述第二芯片驱动元件32B的芯片磁石组件321B产生沿Z轴方向的磁吸力，使得所述芯片支撑组件341B被夹持在所述第二芯片防抖固定部31B和所述第二芯片防抖可动部33B之间；所述第二芯片磁吸组件3423B设置于三角形平面的边处，即，所述第二芯片磁吸组件3423B到所述滚珠3411B的距离相对于所述第一芯片磁吸组件3422B到所述滚珠3411B的距离更远，所述第二芯片磁吸组件3423B的主要作用在于在所述芯片可动载体331B移动后，与所述芯片磁石组产生与Z轴方向具有一定夹角的磁吸力，该磁吸力的主要作用是使得所述芯片可动载体331B回复于一位置。当然，本申请中所述第二芯片保持组件34B的第一芯片磁吸组件3422B与第二芯片磁吸组件3423B的主要功能不同，不等于所述第一芯片磁吸组件3422B与第二芯片磁吸组件3423B不会具有其他功能。也就是说，所述第二芯片保持组件34B的第一芯片磁吸组件3422B也会具有在所述第二芯片防抖可动部33B的芯片可动载体331B移动后，通过磁吸力的作用使得所述芯片可动载体331B回复于一位置的功能，所述第二芯片磁吸组件3423B也会具有通过磁吸力的作用使得所述芯片支撑组件341B被夹持在所述第二芯片防抖固定部31B和所述第二芯片防抖可动部33B之间的功能，所述第一芯片磁吸组件3422B与第二芯片磁吸组件3423B相互配合，共同作用于所述芯片可动载体331B，但由于所述第一芯片磁吸组件 3422B与第二芯片磁吸组件3423B的位置不同，使得二者的主要作用不相同。
具体地，在本申请实施例中，所述第一芯片保持组件34A的第一芯片磁吸组件3422A的数量为4，包括第一芯片磁吸元件734221A、第二芯片磁吸元件734222A、第三芯片磁吸元件734223A和第四芯片磁吸元件734224A。所述第一芯片保持组件34A的第一芯片磁吸元件734221A与所述第一芯片驱动元件32A的第一芯片磁石732111A沿所述第一芯片防抖可动部33A的芯片可动载体331A所设定的高度方向相对设置，所述第二芯片磁吸元件734222A与所述第二芯片磁石732112A沿所述芯片可动载体331A所设定的高度方向相对设置，所述第三芯片磁吸元件734223A与所述第三芯片磁石732121A沿所述芯片可动载体331A所设定的高度方向相对设置，所述第四芯片磁吸元件734224A与所述第四芯片磁石732131A沿所述芯片可动载体331A所设定的高度方向相对设置，本申请中所述芯片磁石组件321A与所述第一芯片磁吸组件3422A在沿所述芯片可动载体331A所设定的高度方向相对设置并不需要完全正对，也就是说所述芯片磁石组件321A的投影与所述第一芯片磁吸组件3422A的投影至少一部分重叠即可。
所述第二芯片保持组件34B的第一芯片磁吸组件3422B的数量为4，包括第一芯片磁吸元件734221B、第二芯片磁吸元件734222B、第三芯片磁吸元件734223B和第四芯片磁吸元件734224B。所述第二芯片保持组件34B的第一芯片磁吸元件734221B与所述第二芯片驱动元件32B的第一芯片磁石732111B沿所述第二芯片防抖可动部33B的芯片可动载体331B所设定的高度方向相对设置，所述第二芯片磁吸元件734222B与所述第二芯片磁石732112B沿所述芯片可动载体331B所设定的高度方向相对设置，所述第三芯片磁吸元件734223B与所述第三芯片磁石732121B沿所述芯片可动载体331B所设定的高度方向相对设置，所述第四芯片磁吸元件734224B与所述第四芯片磁石732131B沿所述芯片可动载体331B所设定的高度方向相对设置，本申请中所述芯片磁石组件321A与所述第一芯片磁吸组件3422A在沿所述芯片可动载体331B所设定的高度方向相对设置并不需要完全正对，也就是说所述芯片磁石组件321B的投影与所述第一芯片磁吸组件3422B的投影至少一部分重叠即可。
所述第一芯片保持组件34A的第一芯片磁吸元件734221A和所述第二芯片磁吸元件734222A设置于所述第一芯片防抖可动部33A的芯片可动载 体331A的第一边，所述第三芯片磁吸元件734223A和所述第四芯片磁吸元件734224A分别设置于所述芯片可动载体331A的第二边和第四边。也可以说，所述第一芯片保持组件34A的第一芯片磁吸元件734221A、第二芯片磁吸元件734222A、第三芯片磁吸元件734223A和第四芯片磁吸元件734224A根据所述滚珠3411A的位置而进行设置。
所述第二芯片保持组件34B的第一芯片磁吸元件734221B和所述第二芯片磁吸元件734222B设置于所述第二芯片防抖可动部33B的芯片可动载体331B的第一边，所述第三芯片磁吸元件734223B和所述第四芯片磁吸元件734224B分别设置于所述芯片可动载体331B的第二边和第四边。也可以说，所述第二芯片保持组件34B的第一芯片磁吸元件734221B、第二芯片磁吸元件734222B、第三芯片磁吸元件734223B和第四芯片磁吸元件734224B根据所述滚珠3411B的位置而进行设置。
进一步地，所述第一芯片保持组件34A的第一芯片磁吸元件734221A和第二芯片磁吸元件734222A沿X轴方向靠近于所述滚珠3411A设置，所述第一芯片磁吸元件734221A和第二芯片磁吸元件734222A分别设置于两颗所述滚珠3411A的两侧；所述第三芯片磁吸元件734223A和第四芯片磁吸元件734224A沿Y轴方向靠近于所述滚珠3411A设置，所述第三芯片磁吸元件734223A和第四芯片磁吸元件734224A分别设置于一颗所述滚珠3411A的一侧。由于所述第一芯片保持组件34A的第一芯片磁吸组件3422A距离所述滚珠3411A更靠近，其与所述第一芯片驱动元件32A的芯片磁石组件321A之间产生的夹持所述芯片支撑组件341A磁吸力更加明显。
所述第二芯片保持组件34B的第一芯片磁吸元件734221B和第二芯片磁吸元件734222B沿X轴方向靠近于所述滚珠3411B设置，所述第一芯片磁吸元件734221B和第二芯片磁吸元件734222B分别设置于两颗所述滚珠3411B的两侧；所述第三芯片磁吸元件734223B和第四芯片磁吸元件734224B沿Y轴方向靠近于所述滚珠3411B设置，所述第三芯片磁吸元件734223B和第四芯片磁吸元件734224B分别设置于一颗所述滚珠3411B的一侧。由于所述第二芯片保持组件34B的第一芯片磁吸组件3422B距离所述滚珠3411B更靠近，其与所述第二芯片驱动元件32B的芯片磁石组件321B之间产生的夹持所述芯片支撑组件341B磁吸力更加明显。
更具体地，在本申请实施例中，所述第一芯片保持组件34A的第二芯片 磁吸组件3423A的数量为2，包括第五芯片磁吸元件734231A和第六芯片磁吸元件734232A，其中，所述第五芯片磁吸元件734231A与所述第一芯片驱动元件32A的第三芯片磁石732121A沿所述第一芯片防抖可动部33A的芯片可动载体331A所设定的高度方向相对设置，所述第六芯片磁吸元件734232A与所述第四芯片磁石732131A沿所述芯片可动载体331A所设定的高度方向相对设置。进一步地，在本申请一具体示例中，所述第一芯片保持组件34A的第五芯片磁吸元件734231A设置于所述第一芯片驱动元件32A的第一芯片磁石732111A和第三芯片磁石32131之间，所述第六磁吸元件设置于所述第二芯片磁石732112A和第四芯片磁石32121之间。也可以说，所述第一芯片保持组件34A的第五芯片磁吸元件734231A设置于所述第一芯片驱动元件32A的芯片可动载体331A的第二边，所述第六芯片磁吸元件734232A设置于所述芯片可动载体331A的第四边。这种设置方式，使得在所述第一芯片防抖可动部33A的芯片可动载体331A移动后，所述第二芯片磁吸组件3423A与所述第一芯片驱动元件32A的芯片磁石组件321A之间产生与Z轴方向具有一定夹角的磁吸力，磁吸力的作用使得所述芯片可动载体331A回复于一位置。当然，可以理解的是，在这一过程中，所述第一芯片保持组件34A的第一芯片磁吸组件3422A与所述第一芯片驱动元件32A的芯片磁石组件321A之间也会产生磁吸力，使得所述第一芯片防抖可动部33A的芯片可动载体331A回复于一位置。
所述第二芯片保持组件34B的第二芯片磁吸组件3423B的数量为2，包括第五芯片磁吸元件734231B和第六芯片磁吸元件734232B，其中，所述第五芯片磁吸元件734231B与所述第二芯片驱动元件32B的第三芯片磁石732121B沿所述第二芯片防抖可动部33B的芯片可动载体331B所设定的高度方向相对设置，所述第六芯片磁吸元件734232B与所述第四芯片磁石732131B沿所述芯片可动载体331B所设定的高度方向相对设置。进一步地，在本申请一具体示例中，所述第二芯片保持组件34B的第五芯片磁吸元件734231B设置于所述第二芯片驱动元件32B的第一芯片磁石732111B和第三芯片磁石32131之间，所述第六磁吸元件设置于所述第二芯片磁石732112B和第四芯片磁石32121之间。也可以说，所述第二芯片保持组件34B的第五芯片磁吸元件734231B设置于所述第二芯片驱动元件32B的芯片可动载体331B的第二边，所述第六芯片磁吸元件734232B设置于所述芯片可动载体 331B的第四边。这种设置方式，使得在所述第二芯片防抖可动部33B的芯片可动载体331B移动后，所述第二芯片磁吸组件3423B与所述第二芯片驱动元件32B的芯片磁石组件321B之间产生与Z轴方向具有一定夹角的磁吸力，磁吸力的作用使得所述芯片可动载体331B回复于一位置。当然，可以理解的是，在这一过程中，所述第二芯片保持组件34B的第一芯片磁吸组件3422B与所述第二芯片驱动元件32B的芯片磁石组件321B之间也会产生磁吸力，使得所述第二芯片防抖可动部33B的芯片可动载体331B回复于一位置。
所述第一芯片保持组件34A的第一芯片磁吸组件3422A包括至少一第一芯片磁吸元件834221A，所述第二芯片磁吸组件3423A包括至少一第二芯片磁吸元件834231A，所述第一芯片磁吸元件834221A邻近于所述至少三支撑组件中的第一支撑组件，所述第二芯片磁吸元件834231A与所述至少三支撑组件中任一支撑组件之间的距离大于所述第一芯片磁吸元件834221A与所述第一支撑组件之间的距离。
所述第二芯片保持组件34B的第一芯片磁吸组件3422B包括至少一第一芯片磁吸元件834221B，所述第二芯片磁吸组件3423B包括至少一第二芯片磁吸元件834231B，所述第一芯片磁吸元件834221B邻近于所述至少三支撑组件中的第一支撑组件，所述第二芯片磁吸元件834231B与所述至少三支撑组件中任一支撑组件之间的距离大于所述第一芯片磁吸元件834221B与所述第一支撑组件之间的距离。
在本申请实施例中，所述第一芯片保持组件34A的第一芯片磁吸组件3422A的数量为4，所述第二芯片磁吸组件3423A的数量为2。所述第一芯片保持组件34A的所述第一芯片磁吸组件3422A包括两个相对的第一芯片磁吸元件834221A和两个相对的第三芯片磁吸元件834222A，形成一对第一芯片磁吸元件834221A和一对第三芯片磁吸元件834222A，所述第二芯片磁吸组件3423A包括两个第二芯片磁吸元件834231A，形成一对第二芯片磁吸元件834231A。
所述第二芯片保持组件34B的第一芯片磁吸组件3422B的数量为4，所述第二芯片磁吸组件3423B的数量为2。所述第二芯片保持组件34B的所述第一芯片磁吸组件3422B包括两个相对的第一芯片磁吸元件834221B和两个相对的第三芯片磁吸元件834222B，形成一对第一芯片磁吸元件834221B 和一对第三芯片磁吸元件834222B，所述第二芯片磁吸组件3423B包括两个第二芯片磁吸元件834231B，形成一对第二芯片磁吸元件834231B。
所述第一芯片保持组件34A的一对所述第一芯片磁吸元件834221A与一对所述第一芯片驱动元件32A的第一芯片磁石832111A沿所述一芯片防抖可动部33A的芯片可动载体331A所设定的高度方向相对设置，一对所述第二芯片磁吸元件834231A与一对所述第二芯片磁石832112A沿所述芯片可动载体331A所设定的高度方向相对设置。也就是，所述第一芯片保持组件34A的一对所述第一芯片磁吸元件834221A在所述所述一芯片防抖可动部33A的芯片可动载体331A所设定的高度方向上对应于一对所述第一芯片磁石832111A，一对所述第二芯片磁吸元件834231A在所述芯片可动载体331A所设定的高度方向上对应于一对所述第二芯片磁石832112A。本申请中所述芯片磁石组件321A与所述第一芯片磁吸组件3422A在沿所述芯片可动载体331A所设定的高度方向相对设置并不需要完全正对，也就是说所述芯片磁石组件321A的投影与所述第一芯片磁吸组件3422A的投影至少一部分重叠即可。
所述第二芯片保持组件34B的一对所述第一芯片磁吸元件834221B与一对所述第二芯片驱动元件32B的第一芯片磁石832111B沿所述一芯片防抖可动部33B的芯片可动载体331B所设定的高度方向相对设置，一对所述第二芯片磁吸元件834231B与一对所述第二芯片磁石832112B沿所述芯片可动载体331B所设定的高度方向相对设置。也就是，所述第二芯片保持组件34B的一对所述第一芯片磁吸元件834221B在所述所述一芯片防抖可动部33B的芯片可动载体331B所设定的高度方向上对应于一对所述第一芯片磁石832111B，一对所述第二芯片磁吸元件834231B在所述芯片可动载体331B所设定的高度方向上对应于一对所述第二芯片磁石832112B。本申请中所述芯片磁石组件321B与所述第一芯片磁吸组件3422B在沿所述芯片可动载体331B所设定的高度方向相对设置并不需要完全正对，也就是说所述芯片磁石组件321B的投影与所述第一芯片磁吸组件3422B的投影至少一部分重叠即可。
所述第一芯片保持组件34A的一对所述第一芯片磁吸元件834221A被设置于所述芯片可动载体331A的第一边，位于所述第一支撑组件的相对的两侧，一对第三芯片磁吸元件834222A设置于所述芯片可动载体331A的第 二边和第四边，其中一个第三芯片磁吸元件834222A邻近于所述第二支撑组件，另一个第三芯片磁吸元件834222A邻近于所述第三支撑组件。也可以说，所述第一芯片保持组件34A的第一芯片磁吸元件834221A和第三芯片磁吸元件834222A根据所述支撑组件的滚珠3411A的位置而进行设置。
所述第二芯片保持组件34B的一对所述第一芯片磁吸元件834221B被设置于所述芯片可动载体331B的第一边，位于所述第一支撑组件的相对的两侧，一对第三芯片磁吸元件834222B设置于所述芯片可动载体331B的第二边和第四边，其中一个第三芯片磁吸元件834222B邻近于所述第二支撑组件，另一个第三芯片磁吸元件834222B邻近于所述第三支撑组件。也可以说，所述第二芯片保持组件34B的第一芯片磁吸元件834221B和第三芯片磁吸元件834222B根据所述支撑组件的滚珠3411B的位置而进行设置。
进一步地，所述第一芯片保持组件34A的一对所述第一芯片磁吸元件834221A沿X轴方向靠近于所述滚珠3411A设置，一对所述第一芯片磁吸元件834221A分别设置于两颗所述滚珠3411A的两侧；一对所述第三芯片磁吸元件834222A沿Y轴方向靠近于所述滚珠3411A设置，所述第三芯片磁吸元件834222A分别设置于一颗所述滚珠3411A的一侧。由于所述第一芯片保持组件34A的第一芯片磁吸组件3422A距离所述滚珠3411A更靠近，其与所述第一芯片驱动元件32A的芯片磁石组件321A之间产生的夹持所述芯片支撑组件341A、341B磁吸力更加明显。
所述第二芯片保持组件34B的一对所述第一芯片磁吸元件834221B沿X轴方向靠近于所述滚珠3411B设置，一对所述第一芯片磁吸元件834221B分别设置于两颗所述滚珠3411B的两侧；一对所述第三芯片磁吸元件834222B沿Y轴方向靠近于所述滚珠3411B设置，所述第三芯片磁吸元件834222B分别设置于一颗所述滚珠3411B的一侧。由于所述第二芯片保持组件34B的第一芯片磁吸组件3422B距离所述滚珠3411B更靠近，其与所述第二芯片驱动元件32B的芯片磁石组件321B之间产生的夹持所述芯片支撑组件341B、341B磁吸力更加明显。
值得一提的是，所述第一芯片保持组件34A的第一芯片磁吸元件834221A的尺寸和所述第三芯片磁吸元件834222A的尺寸大于所述第二芯片磁吸元件834231A的尺寸。这是由于所述第一芯片保持组件34A的第一芯片磁吸元件834221A和所述第三芯片磁吸元件834222A的主要功能在于 夹持所述滚珠3411，其也起到使所述第一芯片防抖可动部33A的芯片可动载体331A复位的作用，所述第二芯片磁吸元件834231A与和其对应的芯片磁石元件仅产生使所述芯片可动载体331A复位的复位力即可。
所述第二芯片保持组件34B的第一芯片磁吸元件834221B的尺寸和所述第三芯片磁吸元件834222B的尺寸大于所述第二芯片磁吸元件834231B的尺寸。这是由于所述第二芯片保持组件34B的第一芯片磁吸元件834221B和所述第三芯片磁吸元件834222B的主要功能在于夹持所述滚珠3411，其也起到使所述第二芯片防抖可动部33B的芯片可动载体331B复位的作用，所述第二芯片磁吸元件834231B与和其对应的芯片磁石元件仅产生使所述芯片可动载体331B复位的复位力即可。
在本申请实施例中，所述第一芯片保持组件34A的一对所述第二芯片磁吸元件834231A与所述第一芯片驱动元件32A的第二芯片磁石832112沿所述第一芯片防抖可动部33A的芯片可动载体331A所设定的高度方向相对设置。进一步地，在本申请一具体示例中，所述第一芯片保持组件34A的一对所述第二芯片磁吸元件834231A设置于所述第一芯片驱动元件32A的一对第一芯片磁石832111A和一对第三芯片磁石32131之间。也可以说，所述第一芯片保持组件34A的一对所述第二芯片磁吸元件834231A中一个第二芯片磁吸元件834231A被设置于所述第一芯片防抖可动部33A的芯片可动载体331A的第二边的中间区域，另一个第二芯片磁吸元件834231A被设置于所述芯片可动载体331A的第四边的中间区域。这种设置方式，使得在所述第一芯片防抖可动部33A的芯片可动载体331A移动后，所述所述第一芯片保持组件34A的第二芯片磁吸组件3423A与所述第一芯片驱动元件32A的芯片磁石组件321A之间产生与Z轴方向具有一定夹角的磁吸力，磁吸力的作用使得所述芯片可动载体331A回复于一位置。当然，可以理解的是，在这一过程中，所述第一芯片保持组件34A的第一芯片磁吸组件3422A与所述第一芯片驱动元件32A的芯片磁石组件321A之间也会产生磁吸力，使得所述第一芯片防抖可动部33A的芯片可动载体331A回复于一位置。
所述第二芯片保持组件34B的一对所述第二芯片磁吸元件834231B与所述第二芯片驱动元件32B的第二芯片磁石832112沿所述第二芯片防抖可动部33B的芯片可动载体331B所设定的高度方向相对设置。进一步地，在本申请一具体示例中，所述第二芯片保持组件34B的一对所述第二芯片磁吸 元件834231B设置于所述第二芯片驱动元件32B的一对第一芯片磁石832111B和一对第三芯片磁石32131之间。也可以说，所述第二芯片保持组件34B的一对所述第二芯片磁吸元件834231B中一个第二芯片磁吸元件834231B被设置于所述第二芯片防抖可动部33B的芯片可动载体331B的第二边的中间区域，另一个第二芯片磁吸元件834231B被设置于所述芯片可动载体331B的第四边的中间区域。这种设置方式，使得在所述第二芯片防抖可动部33B的芯片可动载体331B移动后，所述所述第二芯片保持组件34B的第二芯片磁吸组件3423B与所述第二芯片驱动元件32B的芯片磁石组件321B之间产生与Z轴方向具有一定夹角的磁吸力，磁吸力的作用使得所述芯片可动载体331B回复于一位置。当然，可以理解的是，在这一过程中，所述第二芯片保持组件34B的第一芯片磁吸组件3422B与所述第二芯片驱动元件32B的芯片磁石组件321B之间也会产生磁吸力，使得所述第二芯片防抖可动部33B的芯片可动载体331B回复于一位置。
值得一提的是，所述第一芯片保持组件34A的第二芯片磁吸组件3423A与所述第一芯片驱动元件32A的芯片磁石组件321A之间产生的磁吸力可以是与所述第一芯片防抖可动部33A的芯片可动载体331A移动方向相反的力，此时的磁吸力为复位力，使得所述芯片可动载体331A回复于一位置；所述第二芯片磁吸组件3423A与所述芯片磁石组件321A之间产生的磁吸力也可以是与所述芯片可动载体331A移动方向相同的力，此时的磁吸力为外吸力，这是由于当所述芯片可动载体331A移动后，所述第一感光组件40A的第一线路板41A也会产生一定的复位力，所述外吸力与所述第一线路板41A的复位力稍微抵消，以补偿所述芯片可动载体331A在边缘行程的推力。
所述第二芯片保持组件34B的第二芯片磁吸组件3423B与所述第二芯片驱动元件32B的芯片磁石组件321B之间产生的磁吸力可以是与所述第二芯片防抖可动部33B的芯片可动载体331B移动方向相反的力，此时的磁吸力为复位力，使得所述芯片可动载体331B回复于一位置；所述第二芯片磁吸组件3423B与所述芯片磁石组件321B之间产生的磁吸力也可以是与所述芯片可动载体331B移动方向相同的力，此时的磁吸力为外吸力，这是由于当所述芯片可动载体331B移动后，所述第二感光组件40B的第二线路板41B也会产生一定的复位力，所述外吸力与所述第二线路板41B的复位力稍微抵消，以补偿所述芯片可动载体331B在边缘行程的推力。
在本申请的一个具体示例中，所述第一芯片保持组件34A的芯片磁吸组件342A包括六个芯片磁吸元件3421A，每两个所述芯片磁吸元件3421A的形状相同，从而提供均匀、稳定的磁吸力，使所述第一芯片防抖可动部33A的芯片可动载体331A被平稳的吸附向所述第一芯片防抖固定部31A上盖311A。
所述第二芯片保持组件34B的芯片磁吸组件342B包括六个芯片磁吸元件3421B，每两个所述芯片磁吸元件3421B的形状相同，从而提供均匀、稳定的磁吸力，使所述第二芯片防抖可动部33B的芯片可动载体331B被平稳的吸附向所述第二芯片防抖固定部31B上盖311B。
在本申请中，所述第一芯片防抖可动部33A的芯片可动载体331A可以通过注塑工艺以嵌件成型的方式与所述第一芯片保持组件34A的滚珠支撑片3413A、所述芯片磁吸元件3421A一体成型，以减少第一芯片驱动马达30A的部品数量，所述第一芯片防抖导电部35A也可以通过嵌件成型的方式嵌入所述第一芯片防抖可动部33A。
所述第二芯片防抖可动部33B的芯片可动载体331B可以通过注塑工艺以嵌件成型的方式与所述第二芯片保持组件34B的滚珠支撑片3413B、所述芯片磁吸元件3421B一体成型，以减少第二芯片驱动马达30B的部品数量，所述第二芯片防抖导电部35B也可以通过嵌件成型的方式嵌入所述第二芯片防抖可动部33B。
因此，本申请将所述第一芯片防抖导电部35A通过例如嵌件成型的方式嵌入所述第一芯片防抖可动部33A，提供一具有导电功能的第一芯片防抖可动部33A，使得所述第一芯片驱动元件32A的芯片线圈组件322A可以通过所述第一芯片防抖可动部33A与所述第一线路板41A电连接。并且，由于所述第一芯片防抖导电部35A通过嵌件成型的方式嵌入所述第一芯片防抖可动部33A，所述第一芯片防抖可动部33A适于提供两个平整的安装面用于安装固定所述第一芯片驱动元件32A的芯片线圈组件322A和所述第一线路板41A，还能够减少所述芯片防抖马达的部件数量，减少所述芯片防抖马达的组装复杂程度，并保护第一芯片防抖导电部35A。
本申请将所述第二芯片防抖导电部35B通过例如嵌件成型的方式嵌入所述第二芯片防抖可动部33B，提供一具有导电功能的第二芯片防抖可动部33B，使得所述第二芯片驱动元件32B的芯片线圈组件322B可以通过所述 第二芯片防抖可动部33B与所述第二线路板41B电连接。并且，由于所述第二芯片防抖导电部35B通过嵌件成型的方式嵌入所述第二芯片防抖可动部33B，所述第二芯片防抖可动部33B适于提供两个平整的安装面用于安装固定所述第二芯片驱动元件32B的芯片线圈组件322B和所述第二线路板41B，还能够减少所述芯片防抖马达的部件数量，减少所述芯片防抖马达的组装复杂程度，并保护第二芯片防抖导电部35B。
具体地，所述第一芯片防抖可动部33A与所述第一芯片防抖导电部35A形成嵌入结构。所述第一芯片防抖导电部35A包括至少一线圈导电组件351A，在本申请的一个实施方式中，所述第一芯片防抖导电部35A包括多个(两个及以上)线圈导电元件3511A，多个所述线圈导电元件3511A通过例如嵌件成型(Insert Molding)的方式嵌入于所述芯片可动载体331A，即，所述线圈导电元件3511A被包覆于所述芯片防抖可动载体内，以使得多个所述线圈导电元件3511A可以电连接所述芯片线圈组件322A和所述第一线路板41A。
所述第二芯片防抖可动部33B与所述第二芯片防抖导电部35B形成嵌入结构。所述第二芯片防抖导电部35B包括至少一线圈导电组件351B，在本申请的一个实施方式中，所述第二芯片防抖导电部35B包括多个(两个及以上)线圈导电元件3511B，多个所述线圈导电元件3511B通过例如嵌件成型(Insert Molding)的方式嵌入于所述芯片可动载体331B，即，所述线圈导电元件3511B被包覆于所述芯片防抖可动载体内，以使得多个所述线圈导电元件3511B可以电连接所述芯片线圈组件322B和所述第二线路板41B。
所述第一芯片防抖导电部35A的线圈导电组件351A中所述线圈导电元件3511A的数量与所述第一芯片驱动元件32A的芯片线圈组件322A所述需要的电路数量有关，在本申请的一个具体示例中，所述第一芯片防抖导电部35A的线圈导电组件351A包括6个线圈导电元件3511A。所述第一芯片防抖导电部35A的每一所述线圈导电元件3511A具有被暴露的第一线圈导电端部35111A、与所述第一线圈导电端部35111A相对的且被暴露的第二线圈导电端部35113A，以及，延伸并电导通于所述第一线圈导电端部35111A和所述第二线圈导电端部35113A之间的线圈导电延伸部35112A，所述第一线圈导电端部35111A的位置高于所述第二线圈导电端部35113A，所述线圈导电延伸部35112A从所述第一线圈导电端部35111A向下延伸至所述第二线 圈导电端部35113A。当所述第一芯片防抖导电部35A的线圈导电元件3511A嵌入所述第一芯片防抖可动部33A的芯片可动载体331A中时，所述芯片可动载体331A不覆盖所述第一线圈导电端部35111A的上表面，所述第一线圈导电端部35111A的上表面裸露，用于与所述第一芯片驱动元件32A的芯片线圈组件322A电连接，所述第一芯片防抖可动部33A的芯片可动载体331A不覆盖所述第二线圈导电端部35113A的下表面，所述第二线圈导电端部35113A的下表面裸露，用于与所述第一线路板41A电连接，进而电导通所述芯片线圈组件322A和所述第一线路板41A。在本申请的一些实施方式中，所述第一芯片防抖导电部35A的所有线圈导电元件3511A中至少部分线圈导电元件3511A的第一线圈导电端部35111A被暴露于所述第一芯片防抖可动部33A的芯片可动载体331A的上表面，所述第二线圈导电端部35113A被暴露于所述芯片可动载体331A的下表面。所述第一芯片驱动元件32A的芯片线圈组件322A中至少一芯片线圈通过所述线圈电路板3224A电连接于所述第一芯片防抖导电部35A的第一线圈导电端部35111A的方式电连接于所述第一线圈导电端部35111A，所述第二线圈导电端部35113A适于电连接所述第一感光组件40A的第一线路板41A，通过这样的方式来实现所述芯片线圈组件322A和所述第一线路板41A之间的电导通。
所述第二芯片防抖导电部35B的线圈导电组件351B中所述线圈导电元件3511B的数量与所述第二芯片驱动元件32B的芯片线圈组件322B所述需要的电路数量有关，在本申请的一个具体示例中，所述第二芯片防抖导电部35B的线圈导电组件351B包括6个线圈导电元件3511B。所述第二芯片防抖导电部35B的每一所述线圈导电元件3511B具有被暴露的第一线圈导电端部35111B、与所述第一线圈导电端部35111B相对的且被暴露的第二线圈导电端部35113B，以及，延伸并电导通于所述第一线圈导电端部35111B和所述第二线圈导电端部35113B之间的线圈导电延伸部35112B，所述第一线圈导电端部35111B的位置高于所述第二线圈导电端部35113B，所述线圈导电延伸部35112B从所述第一线圈导电端部35111B向下延伸至所述第二线圈导电端部35113B。当所述第二芯片防抖导电部35B的线圈导电元件3511B嵌入所述第二芯片防抖可动部33B的芯片可动载体331B中时，所述芯片可动载体331B不覆盖所述第一线圈导电端部35111B的上表面，所述第一线圈导电端部35111B的上表面裸露，用于与所述第二芯片驱动元件32B的芯片线 圈组件322B电连接，所述第二芯片防抖可动部33B的芯片可动载体331B不覆盖所述第二线圈导电端部35113B的下表面，所述第二线圈导电端部35113B的下表面裸露，用于与所述第二线路板41B电连接，进而电导通所述芯片线圈组件322B和所述第二线路板41B。在本申请的一些实施方式中，所述第二芯片防抖导电部35B的所有线圈导电元件3511B中至少部分线圈导电元件3511B的第一线圈导电端部35111B被暴露于所述第二芯片防抖可动部33B的芯片可动载体331B的上表面，所述第二线圈导电端部35113B被暴露于所述芯片可动载体331B的下表面。所述第二芯片驱动元件32B的芯片线圈组件322B中至少一芯片线圈通过所述线圈电路板3224B电连接于所述第二芯片防抖导电部35B的第一线圈导电端部35111B的方式电连接于所述第一线圈导电端部35111B，所述第二线圈导电端部35113B适于电连接所述第二感光组件40B的第二线路板41B，通过这样的方式来实现所述芯片线圈组件322B和所述第二线路板41B之间的电导通。
在本申请实施例中，所述第一芯片防抖导电部35A的线圈导电元件3511A的第一线圈导电端部35111A组成所述第一芯片防抖可动部33A的芯片可动载体331A的芯片载体主体3311A的上导电部33112A的一部分，所述线圈导电元件3511A的第二线圈导电端部35113A组成所述芯片可动载体331A的芯片载体主体3311A的下导电部33113A的一部分。换言之，所述第一芯片防抖可动部33A的上导电部33112A包括第一线圈导电端部35111A，所述下导电部33113A包括第二线圈导电端部35113A。
所述第二芯片防抖导电部35B的线圈导电元件3511B的第一线圈导电端部35111B组成所述第二芯片防抖可动部33B的芯片可动载体331B的芯片载体主体3311B的上导电部33112B的一部分，所述线圈导电元件3511B的第二线圈导电端部35113B组成所述芯片可动载体331B的芯片载体主体3311B的下导电部33113B的一部分。换言之，所述第二芯片防抖可动部33B的上导电部33112B包括第一线圈导电端部35111B，所述下导电部33113B包括第二线圈导电端部35113B。
进一步地，为了在嵌件成型工艺中保持所述第一芯片防抖导电部35A的线圈导电组件351A在所述第一芯片防抖可动部33A的芯片可动载体331A中的位置，所述线圈导电元件3511A还包括线圈导电连接部35114A，所述线圈导电连接部35114A可以连接其他线圈导电元件3511A的线圈导电连接 部35114A或者连接其他用于支撑所述线圈导电连接部35114A的支持部件。在所述第一芯片防抖导电部35A的线圈导电组件351A通过嵌件成型工艺形成在所述第一芯片防抖可动部33A的芯片可动载体331A中后，剪切所述线圈导电连接部35114A，所述线圈导电连接部35114A的一部分裸露在所述芯片可动载体331A之外。也就是，在本申请的一些实施方式中，所述第一芯片防抖导电部35A的线圈导电元件3511A进一步包括从由所述第一线圈导电端部35111A、所述第二线圈导电端部35113A和所述线圈导电延伸部35112A形成的线圈导电主体延伸至所述第一芯片防抖可动部33A的芯片可动载体331A外的线圈导电连接部35114A。
为了在嵌件成型工艺中保持所述第二芯片防抖导电部35B的线圈导电组件351B在所述第二芯片防抖可动部33B的芯片可动载体331B中的位置，所述线圈导电元件3511B还包括线圈导电连接部35114B，所述线圈导电连接部35114B可以连接其他线圈导电元件3511B的线圈导电连接部35114B或者连接其他用于支撑所述线圈导电连接部35114B的支持部件。在所述第二芯片防抖导电部35B的线圈导电组件351B通过嵌件成型工艺形成在所述第二芯片防抖可动部33B的芯片可动载体331B中后，剪切所述线圈导电连接部35114B，所述线圈导电连接部35114B的一部分裸露在所述芯片可动载体331B之外。也就是，在本申请的一些实施方式中，所述第二芯片防抖导电部35B的线圈导电元件3511B进一步包括从由所述第一线圈导电端部35111B、所述第二线圈导电端部35113B和所述线圈导电延伸部35112B形成的线圈导电主体延伸至所述第二芯片防抖可动部33B的芯片可动载体331B外的线圈导电连接部35114B。
在本申请的一个实施例中，所述第一芯片防抖导电部35A的第一线圈导电端部35111A、第二线圈导电端部35113A、所述线圈导电延伸部35112A和所述线圈导电连接部35114A由导电材质一体成型而成。在本申请的另一个实施例中，所述第一芯片防抖导电部35A的线圈导电元件3511A未设有所述线圈导电连接部35114A，进而所述第一线圈导电端部35111A、第二线圈导电端部35113A和所述线圈导电延伸部35112A由导电材质一体成型而成。
所述第二芯片防抖导电部35B的第一线圈导电端部35111B、第二线圈导电端部35113B、所述线圈导电延伸部35112B和所述线圈导电连接部 35114B由导电材质一体成型而成。在本申请的另一个实施例中，所述第二芯片防抖导电部35B的线圈导电元件3511B未设有所述线圈导电连接部35114B，进而所述第一线圈导电端部35111B、第二线圈导电端部35113B和所述线圈导电延伸部35112B由导电材质一体成型而成。
在本申请的一个实施例中，所述第一芯片防抖导电部35A还可以包括感测元件导电组件，所述感测元件导电组件包括被包覆于所述第一芯片防抖可动部33A的芯片可动载体331A内的至少一感测元件导电元件。每一所述感测元件导电元件包括被暴露于所述第一芯片防抖可动部33A的芯片可动载体331A的上表面的第一感测元件导电端部、被暴露于所述芯片可动载体331A的下表面且与所述第一感测元件导电端部相对的第二感测元件导电端部，以及，延伸于所述第一感测元件导电端部和所述第二感测元件导电端部之间的感测元件导电延伸部，其中，所述第一感测元件导电端部电连接于所述位置感测元件，所述第二感测元件导电端部适于电连接于所述第一线路板41A，所述第一感测元件导电端部在所述芯片可动载体331A所设定的高度方向上低于所述第一芯片防抖导电部35A的第一线圈导电端部35111A。
所述第二芯片防抖导电部35B还可以包括感测元件导电组件，所述感测元件导电组件包括被包覆于所述第二芯片防抖可动部33B的芯片可动载体331B内的至少一感测元件导电元件。每一所述感测元件导电元件包括被暴露于所述第二芯片防抖可动部33B的芯片可动载体331B的上表面的第一感测元件导电端部、被暴露于所述芯片可动载体331B的下表面且与所述第一感测元件导电端部相对的第二感测元件导电端部，以及，延伸于所述第一感测元件导电端部和所述第二感测元件导电端部之间的感测元件导电延伸部，其中，所述第一感测元件导电端部电连接于所述位置感测元件，所述第二感测元件导电端部适于电连接于所述第二线路板41B，所述第一感测元件导电端部在所述芯片可动载体331B所设定的高度方向上低于所述第二芯片防抖导电部35B的第一线圈导电端部35111B。
在本申请的一个实施例中，所述第一芯片保持组件34A的滚珠支撑片3413A、所述芯片磁吸组件342A(包括芯片磁吸元件3421A)和所述第一芯片防抖导电部35A(包括线圈导电元件3511A、感测元件导电元件)均通过注塑工艺以嵌件成型的方式嵌合在所述第一芯片防抖可动部33A的芯片可动载体331A中，与所述芯片可动载体331A一体成型，减小了所述第一芯 片驱动马达30A的部品数量，进而简化了所述第一芯片驱动马达30A的结构和组装复杂度。
所述第二芯片保持组件34B的滚珠支撑片3413B、所述芯片磁吸组件342B(包括芯片磁吸元件3421B)和所述第二芯片防抖导电部35B(包括线圈导电元件3511B、感测元件导电元件)均通过注塑工艺以嵌件成型的方式嵌合在所述第二芯片防抖可动部33B的芯片可动载体331B中，与所述芯片可动载体331B一体成型，减小了所述第二芯片驱动马达30B的部品数量，进而简化了所述第二芯片驱动马达30B的结构和组装复杂度。
值得一提的是，所述第一芯片保持组件34A的芯片磁吸组件342A(包括芯片磁吸元件3421A)需要由具有导磁性的材料制成，而所述滚珠支撑片3413A和所述第一芯片防抖导电部35A(包括线圈导电元件3511A、感测元件导电元件)需要由不具有导磁性的材料制成，因此，在嵌件成型工艺中，所述第一芯片保持组件34A的芯片磁吸组件342A是同一层料带，而所述滚珠支撑片3413A和所述第一芯片防抖导电部35A是另一层料带，因此，在制成后，所述第一芯片保持组件34A的芯片磁吸组件342A的至少一芯片磁吸元件3421A的磁吸元件连接部34212A的高度与所述滚珠支撑片3413A的支撑连接部和所述第一芯片防抖导电部35A的线圈导电连接部35114A的高度不一致。也就是，所述第一芯片防抖导电部35A的线圈导电元件3511A和所述第一芯片保持组件34A的滚珠支撑片3413A不具有导磁性，所述磁吸组件的芯片磁吸元件3421A具有导磁性，所述磁吸元件连接部34212A与所述线圈导电连接部35114A、所述支撑片连接部34132A在所述第一芯片防抖可动部33A的芯片可动载体331A所设定的高度方向上存在差异。
所述第二芯片保持组件34B的芯片磁吸组件342B(包括芯片磁吸元件3421B)需要由具有导磁性的材料制成，而所述滚珠支撑片3413B和所述第二芯片防抖导电部35B(包括线圈导电元件3511B、感测元件导电元件)需要由不具有导磁性的材料制成，因此，在嵌件成型工艺中，所述第二芯片保持组件34B的芯片磁吸组件342B是同一层料带，而所述滚珠支撑片3413B和所述第二芯片防抖导电部35B是另一层料带，因此，在制成后，所述第二芯片保持组件34B的芯片磁吸组件342B的至少一芯片磁吸元件3421B的磁吸元件连接部34212B的高度与所述滚珠支撑片3413B的支撑连接部和所述第二芯片防抖导电部35B的线圈导电连接部35114B的高度不一致。也就是， 所述第二芯片防抖导电部35B的线圈导电元件3511B和所述第二芯片保持组件34B的滚珠支撑片3413B不具有导磁性，所述磁吸组件的芯片磁吸元件3421B具有导磁性，所述磁吸元件连接部34212B与所述线圈导电连接部35114B、所述支撑片连接部34132B在所述第二芯片防抖可动部33B的芯片可动载体331B所设定的高度方向上存在差异。
进一步地，对所述第一芯片防抖可动部33A的芯片可动载体331A的安装及通电方式进行说明。在本申请的一个实施例中，通过在所述第一芯片防抖可动部33A的芯片可动载体331A的上导电部33112A上设置焊料(例如焊锡)与所述第一芯片驱动元件32A的芯片线圈组件322A的线圈电路板3224A的背面上的焊盘电导通，通过在所述第一芯片防抖可动部33A的芯片可动载体331A和所述第一芯片驱动元件32A的线圈电路板3224A之间设置黏合介质粘接固定所述线圈电路板3224A和所述芯片可动载体331A；通过在所述芯片可动载体331A和所述第一线路板41A之间设置黏合介质粘接固定所述芯片可动载体331A和所述第一线路板41A，而后通过在焊料将所述芯片可动载体331A背面的下导电部33113A和所述第一线路板41A的线路板主体411A的侧面电导通。
对所述第二芯片防抖可动部33B的芯片可动载体331B的安装及通电方式进行说明。在本申请的一个实施例中，通过在所述第二芯片防抖可动部33B的芯片可动载体331B的上导电部33112B上设置焊料(例如焊锡)与所述第二芯片驱动元件32B的芯片线圈组件322B的线圈电路板3224B的背面上的焊盘电导通，通过在所述第二芯片防抖可动部33B的芯片可动载体331B和所述第二芯片驱动元件32B的线圈电路板3224B之间设置黏合介质粘接固定所述线圈电路板3224B和所述芯片可动载体331B；通过在所述芯片可动载体331B和所述第二线路板41B之间设置黏合介质粘接固定所述芯片可动载体331B和所述第二线路板41B，而后通过在焊料将所述芯片可动载体331B背面的下导电部33113B和所述第二线路板41B的线路板主体411B的侧面电导通。
综上所述，基于本申请实施例的多摄摄像模组被阐明，其中，多摄摄像模组中至少一个摄像模组的驱动组件与感光组件以偏心的方式设置，使得所述感光组件的感光芯片的一侧更加靠近移动电子设备的边缘，以满足移动电子设备的外形和功能需求。
本领域的技术人员应理解，上述描述及附图中所示的本申请的实施例只作为举例而并不限制本申请。本申请的目的已经完整并有效地实现。本申请的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本申请的实施方式可以有任何变形或修改。

Claims (38)

  1. 一种驱动组件，其特征在于，包括：
    具有收容腔的芯片防抖固定部；
    被可移动地收容于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部包括芯片可动载体，所述芯片可动载体适于安装感光组件于其上，所述感光组件具有第一中心轴线；以及
    用于驱动所述芯片防抖可动部的芯片可动载体相对于所述芯片固定部在所述收容腔内进行移动的芯片驱动元件；
    其中，所述驱动组件具有第二中心轴线，所述第一中心轴线与所述第二中心轴线相偏移。
  2. 根据权利要求1所述的驱动组件，其中，所述感光组件包括感光芯片，所述感光芯片的中心轴线为所述感光组件的第一中心轴线。
  3. 根据权利要求1所述的驱动组件，其中，所述感光组件包括感光芯片，所述感光芯片相对于所述驱动组件的中心呈偏心的方式设置。
  4. 根据权利要求2所述的驱动组件，其中，所述感光组件适于被安装于所述芯片可动载体，其中，所述芯片防抖固定部包括相互扣合以形成所述收容腔的上盖和基底，所述芯片可动载体与所述基底之间具有间隙。
  5. 根据权利要求4所述的驱动组件，其中，所述驱动组件还包括芯片保持组件，所述芯片保持组件包括被包覆于所述芯片可动载体内的至少一芯片磁吸元件，其中，所述芯片驱动元件包括被设置于所述芯片可动载体的芯片线圈组件，以及，被固定于所述上盖且对应于所述芯片线圈组件的芯片磁石组件，以通过所述芯片磁石组件与所述至少一芯片磁吸元件之间的磁吸力使得所述芯片可动载体被悬空地设置于所述芯片防抖固定部的收容腔内。
  6. 根据权利要求5所述的驱动组件，其中，所述芯片线圈组件包括至少一芯片线圈，所述驱动组件还包括芯片防抖导电部，所述芯片防抖导电部 包括被包覆于所述芯片防抖可动载体内的至少一线圈导电元件，每一所述线圈导电元件具有被暴露的第一线圈导电端部、与所述第一线圈导电端部相对的且被暴露的第二线圈导电端部，以及，延伸于所述第一线圈导电端部和所述第二线圈导电端部之间的线圈导电延伸部，其中，至少一芯片线圈电连接于所述第一线圈导电端部，所述第二线圈导电端部适于电连接所述感光组件的线路板。
  7. 根据权利要求6所述的驱动组件，其中，所述芯片线圈组件还包括被设置于所述芯片可动载体的线圈电路板，所述至少一芯片线圈被固定且电连接于所述线圈电路板，所述线圈电路板电连接于所述第一线圈导电端部。
  8. 根据权利要求5所述的驱动组件，其中，所述芯片保持组件还包括被设置于所述芯片可动载体和所述上盖之间的芯片支撑组件，所述芯片支撑组件包括凹陷地形成于所述芯片可动载体的滚珠槽以及被设置于所述滚珠槽内的滚珠，其中，通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力，所述滚珠被夹持于所述上盖和所述芯片可动载体之间。
  9. 根据权利要求8所述的驱动组件，其中，所述芯片支撑组件还包括内嵌于所述芯片可动载体内且位于所述滚珠槽的底部的滚珠支撑片，所述滚珠被支持于所述滚珠支撑片。
  10. 根据权利要求9所述的驱动组件，其中，所述线圈导电元件和所述滚珠支撑片不具有导磁性，所述芯片磁吸元件具有导磁性。
  11. 根据权利要求10所述的驱动组件，其中，所述线圈导电元件、所述滚珠支撑片和所述芯片磁吸元件通过注塑工艺与所述芯片可动载体一体成型。
  12. 根据权利要求1所述的驱动组件，其中，所述芯片驱动元件包括被设置于所述芯片可动载体的芯片线圈组件，以及，被固定于所述上盖且对应于所述芯片线圈组件的芯片磁石组件，其中，所述芯片线圈组件包括至少一 芯片线圈组，所述芯片可动载体的至少一条边没有设置所述芯片线圈组。
  13. 根据权利要求12所述的驱动组件，其中，所述芯片可动载体包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对，其中，所述芯片线圈组件包括设置于所述第一边的第一芯片线圈组，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组和第三芯片线圈组。
  14. 根据权利要求13所述的驱动组件，其中，所述感光芯片的第一中心轴线与所述芯片可动载体的第三边之间的距离小于所述感光芯片的第一中心轴线与所述芯片可动载体的第一边之间的距离。
  15. 根据权利要求14所述的驱动组件，其中，所述第一边和所述第三边沿着所述驱动组件所设定的X轴方向延伸，所述第二边和所述第四边沿着所述驱动组件所设定的Y轴方向延伸，所述Y轴方向垂直于所述X轴方向，其中，所述第一芯片线圈组包括设置于所述第一边的第一芯片线圈和第二芯片线圈，所述第二芯片线圈组包括设置于所述第二边的第三芯片线圈，所述第三芯片线圈组包括设置于所述第四边的第四芯片线圈。
  16. 根据权利要求15所述的驱动组件，其中，所述第一芯片线圈和所述第二芯片线圈沿所述X轴方向相对平行地设置，所述第三芯片线圈和所述第四芯片线圈沿所述Y轴方向相对平行地设置。
  17. 一种摄像模组，其特征在于，包括：如权利要求1至16任一所述的驱动组件。
  18. 一种多摄摄像模组，其特征在于，包括：
    第一摄像模组；以及
    第二摄像模组；
    其中，所述第一摄像模组和所述第二摄像模组中至少一个摄像模组包括如权利要求1-16任一所述的驱动组件。
  19. 根据权利要求18所述的多摄摄像模组，其中，所述第一摄像模组的驱动组件的第一侧没有设置芯片驱动元件，所述第二摄像模组的驱动组件的第二侧没有设置芯片驱动元件，其中，所述第一摄像模组的驱动组件的第一侧和所述第二摄像模组的驱动组件的第二侧相邻。
  20. 一种驱动组件，其特征在于，包括：
    具有收容腔的芯片防抖固定部；
    被可移动地收容于所述收容腔内的芯片防抖可动部，所述芯片防抖可动部适于安装感光组件于其上；
    用于驱动所述芯片防抖可动部相对于所述芯片固定部在所述收容腔内进行移动的芯片驱动元件；
    芯片支撑组件，包括被夹持地设置于所述芯片防抖可动部和所述芯片防抖固定部之间的至少三支撑组件，所述至少三支撑组件以不完全共线的方式布设；以及
    芯片磁吸组件，包括被设置于所述芯片防抖可动部的第一芯片磁吸元件和第二芯片磁吸元件，其中，所述第一芯片磁吸元件邻近于所述至少三支撑组件中的第一支撑组件，所述第二芯片磁吸元件与所述至少三支撑组件中任一支撑组件之间的距离大于所述第一芯片磁吸元件与所述第一支撑组件之间的距离。
  21. 根据权利要求20所述的驱动组件，其中，所述芯片防抖可动部包括芯片可动载体，所述感光组件适于被安装于所述芯片可动载体。
  22. 根据权利要求21所述的驱动组件，其中，所述芯片可动载体包括相互围合的第一边、第二边、第三边和第四边，所述第一边与所述第三边相对，所述第二边和所述第四边相对，其中，所述芯片支撑组件包括第一支撑组件、第二支撑组件和第三支撑组件，所述第一支撑组件被设置于所述芯片可动载体的第一边，所述第二支撑组件和所述第三支撑组件被设置于所述芯片可动载体的与所述第一边相对的第三边的两个转角区域，所述第一支撑组件被设置于所述第一边的中间区域。
  23. 根据权利要求21所述的驱动组件，其中，所述芯片磁吸组件包括一对所述第一芯片磁吸元件，一对所述第一芯片磁吸元件被设置于所述第一支撑组件的相对的两侧，其中，所述芯片磁吸组件包括一对所述第二芯片磁吸元件，一个所述第二芯片磁吸元件被设置于所述第二边的中间区域，另一个所述第二芯片磁吸元件被设置于所述第四边的中间区域。
  24. 根据权利要求23所述的驱动组件，其中，所述第一芯片磁吸元件的尺寸大于所述第二芯片磁吸元件的尺寸。
  25. 根据权利要求23所述的驱动组件，其中，所述芯片磁吸组件还包括一对第三芯片磁吸元件，一个所述第三芯片磁吸元件邻近于所述第二支撑组件，另一个所述第三磁吸元件邻近于所述第三支撑组件。
  26. 根据权利要求25所述的驱动组件，其中，一对所述第一芯片磁吸元件、一对所述第二芯片磁吸元件和一对所述第三芯片磁吸元件被包覆于所述芯片可动载体。
  27. 根据权利要求22所述的驱动组件，其中，所述第一支撑组件、所述第二支撑组件和所述第三支撑组件中每一所述支撑组件包括凹陷地形成于所述芯片可动载体的滚珠槽和设置于所述滚珠槽内的滚珠，所述滚珠突出于所述滚珠槽。
  28. 根据权利要求27所述的驱动组件，其中，所述芯片可动载体还包括突出地形成于所述芯片载体主体的上表面的三个延伸柱，所述滚珠槽凹陷地形成于各个所述延伸柱的上表面。
  29. 根据权利要求27所述的驱动组件，其中，每一所述支撑组件还包括内嵌于所述芯片可动载体内且位于所述滚珠槽的底部的滚珠支撑片，所述滚珠被支持于所述滚珠支撑片。
  30. 根据权利要求26所述的驱动组件，其中，所述芯片驱动元件包括被设置于所述芯片可动载体的芯片线圈组件，以及，被固定于所述芯片防抖固定部且对应于所述芯片线圈组件的芯片磁石组件，其中，所述芯片磁石组件包括分别对应于一对所述第一芯片磁吸元件的一对第一芯片磁石以及分别对应于一对所述第二芯片磁吸元件的一对第二芯片磁石。
  31. 根据权利要求30所述的驱动组件，其中，所述芯片线圈组件包括至少一芯片线圈组，所述芯片可动载体的至少一条边没有设置所述芯片线圈组，其中，所述芯片线圈组件包括设置于所述第一边的第一芯片线圈组，以及，被设置于相对的所述第二边和所述第四边的第二芯片线圈组和第三芯片线圈组。
  32. 根据权利要求31所述的驱动组件，其中，所述驱动组件还包括芯片防抖导电部，所述芯片防抖导电部包括被包覆于所述芯片防抖可动载体内的至少一线圈导电元件，每一所述线圈导电元件具有被暴露的第一线圈导电端部、与所述第一线圈导电端部相对的且被暴露的第二线圈导电端部，以及，延伸于所述第一线圈导电端部和所述第二线圈导电端部之间的线圈导电延伸部，其中，至少一芯片线圈电连接于所述第一线圈导电端部，所述第二线圈导电端部适于电连接所述感光组件的线路板。
  33. 根据权利要求32所述的驱动组件，其中，所述芯片线圈组件还包括被设置于所述芯片可动载体的线圈电路板，所述第一芯片线圈组、所述第二芯片线圈组和所述第三芯片线圈组被固定且电连接于所述线圈电路板，所述线圈电路板电连接于所述第一线圈导电端部。
  34. 根据权利要求33所述的驱动组件，其中，所述线圈导电元件和所述滚珠支撑片不具有导磁性，所述芯片磁吸元件具有导磁性。
  35. 根据权利要求34所述的驱动组件，其中，所述所述线圈导电元件、所述滚珠支撑片和所述芯片磁吸元件通过注塑工艺与所述芯片可动载体一体成型。
  36. 一种摄像模组，其特征在于，包括：如权利要求20至35任一所述的驱动组件。
  37. 一种多摄摄像模组，其特征在于，包括：
    第一摄像模组；以及
    第二摄像模组；
    其中，所述第一摄像模组和所述第二摄像模组中至少一个摄像模组包括如权利要求20-35任一所述的驱动组件。
  38. 根据权利要求37所述的多摄摄像模组，其中，所述第一摄像模组的驱动组件的第一侧没有设置芯片驱动元件，所述第二摄像模组的驱动组件的第二侧没有设置芯片驱动元件，其中，所述第一摄像模组的驱动组件的第一侧和所述第二摄像模组的驱动组件的第二侧相邻。
PCT/CN2023/090068 2022-04-22 2023-04-23 驱动组件、摄像模组及多摄摄像模组 WO2023202719A1 (zh)

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US20190289180A1 (en) * 2018-03-14 2019-09-19 O-Film Image Technology (Guangzhou) Co.,Ltd. Imaging module and circuit board mechanism thereof
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CN112804415A (zh) * 2019-11-14 2021-05-14 南昌欧菲光电技术有限公司 摄像头模组及移动终端
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US20190289180A1 (en) * 2018-03-14 2019-09-19 O-Film Image Technology (Guangzhou) Co.,Ltd. Imaging module and circuit board mechanism thereof
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