WO2023197996A1 - 驱动组件和摄像模组 - Google Patents

驱动组件和摄像模组 Download PDF

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Publication number
WO2023197996A1
WO2023197996A1 PCT/CN2023/087312 CN2023087312W WO2023197996A1 WO 2023197996 A1 WO2023197996 A1 WO 2023197996A1 CN 2023087312 W CN2023087312 W CN 2023087312W WO 2023197996 A1 WO2023197996 A1 WO 2023197996A1
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WO
WIPO (PCT)
Prior art keywords
chip
coil
conductive
shake
sensing element
Prior art date
Application number
PCT/CN2023/087312
Other languages
English (en)
French (fr)
Inventor
赵波杰
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2023197996A1 publication Critical patent/WO2023197996A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations

Definitions

  • the present application relates to the field of camera modules, and in particular, to a driving component and a camera module.
  • mobile electronic devices When using mobile electronic devices for photography, due to the physiological tremor of a certain frequency of the human body under normal circumstances and the jitter caused by movement, the camera effect will be reduced. Therefore, mobile electronic devices are usually equipped with anti-shake motors to drive optical lenses. And/or the movement of the photosensitive chip realizes the anti-shake function.
  • the heavier the lens the shorter the stroke that the anti-shake motor can drive the optical lens to move, affecting the anti-shake capability.
  • the heavier the optical lens the slower the anti-shake motor can drive the optical lens to move, and the longer it takes for the optical lens to reach the predetermined compensation position, which will also affect the anti-shake effect.
  • the applicant proposes a driving component that drives the photosensitive chip to move to achieve the purpose of optical anti-shake.
  • An advantage of this application is to provide a driving component and a camera module, wherein the driving component can realize optical anti-shake by driving the photosensitive chip to move, so as to meet the requirements of optical anti-shake for driving stroke and driving speed, and
  • the driving assembly combines multiple components in an integrated manner, which can reduce the structural complexity of the driving assembly and simplify the assembly process.
  • Another advantage of the present application is to provide a driving assembly and a camera module, in which multiple parts of the driving assembly are integrally molded through an injection molding process, which can improve the stability of the positional relationship between the various parts, thereby improving the driving The overall structural stability of the component.
  • the present application provides a driving assembly, which includes:
  • a chip driving element used to drive the chip anti-shake movable part to move relative to the chip anti-shake fixed part in the receiving cavity, wherein the chip driving element includes a chip disposed on the chip anti-shake movable part. a chip coil assembly of the moving part, and a chip magnet assembly fixed to the chip anti-shake fixing part and corresponding to the chip coil assembly, wherein the chip coil assembly includes at least one chip coil;
  • the chip anti-shake conductive part includes at least one coil conductive element covered in the chip anti-shake movable part.
  • Each of the coil conductive elements has an exposed first coil conductive end and the first coil an opposite and exposed second coil conductive end, and a coil conductive extension extending between the first coil conductive end and the second coil conductive end, wherein at least one chip
  • the coil is electrically connected to the first coil conductive end, and the second coil conductive end is suitable for electrical connection to the circuit board.
  • the chip anti-shake movable part includes a chip movable carrier having opposite upper surfaces and lower surfaces, wherein the first coil of the coil conductive element is conductive The end portion is exposed to the upper surface of the chip movable carrier, and the second coil conductive end portion of the coil conductive element is exposed to the lower surface of the chip movable carrier.
  • the chip coil assembly includes a coil circuit board disposed on the chip movable carrier, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil The circuit board is electrically connected to the conductive end of the first coil.
  • the chip anti-shake fixing part includes an upper cover and a base that are interlocked to form the receiving cavity, and the chip magnet assembly is fixed to the upper cover.
  • the driving assembly further includes a chip holding assembly, and the chip holding assembly includes at least one chip magnetic element wrapped in the chip anti-shake movable part, The chip anti-shake movable part is suspended in the receiving cavity of the chip anti-shake fixed part by the magnetic attraction force between the at least one chip magnetic element and the chip magnet assembly.
  • the driving assembly further includes a chip holding assembly.
  • the chip holding assembly includes at least one chip magnetic element embedded in the chip movable carrier to pass the at least one chip.
  • the magnetic attraction between the magnetic element and the chip magnet assembly causes the chip movable carrier to be attracted to the upper cover.
  • the chip holding assembly further includes a chip supporting assembly disposed between the chip movable carrier and the upper cover.
  • the chip supporting assembly includes a chip recessedly formed on the chip. The ball groove of the movable carrier and the balls disposed in the ball groove, wherein the balls are clamped by the magnetic attraction force between the at least one chip magnetic element and the chip magnet assembly. between the upper cover and the chip movable carrier.
  • the chip support assembly further includes a ball support piece embedded in the chip movable carrier and located at the bottom of the ball groove, and the ball is supported on the ball support piece .
  • the chip movable carrier includes a chip carrier body and a chip carrier side portion extending downward from the periphery of the chip carrier body, wherein the chip movable carrier further includes a protrudingly formed
  • the ball groove is recessed on the extension post on the upper surface of the chip carrier body.
  • the driving assembly further includes a chip position sensing assembly, the chip position sensing assembly includes at least one position sensing element, and the chip anti-shake conductive part also includes a At least one sensing element conductive element in the chip movable carrier, each of the sensing element conductive elements includes a first sensing element conductive end portion exposed to the upper surface of the chip movable carrier, and The second sensing element conductive end portion is on the lower surface of the chip movable carrier and is opposite to the first sensing element conductive end portion, and extends between the first sensing element conductive end portion and the third sensing element conductive end portion.
  • the conductive end of the first sensing element is lower than the conductive end of the first coil in a height direction set by the chip movable carrier.
  • the sensing element conductive element, the coil conductive element and the ball support piece do not have magnetic permeability, and the chip magnetic attraction element has magnetic permeability.
  • the chip magnetic element includes a magnetic element body wrapped in the chip movable carrier and a magnetic element body extending from the magnetic element body to outside the chip movable carrier.
  • the sensing element conductive element further includes a sensing element formed from the first sensing element conductive end, the second sensing element conductive end and the sensing element conductive extension.
  • the conductive body extends to the conductive connection portion of the sensing element outside the movable carrier of the chip
  • the coil conductive element further includes a conductive end portion of the first coil, a conductive end portion of the second coil and a conductive end portion of the coil.
  • the conductive main body of the coil formed by the extension portion extends to the conductive connecting portion of the coil outside the movable carrier of the chip.
  • the ball supporting piece includes a supporting piece main body located at the bottom of the ball groove and extending from the supporting piece main body to the The support piece connection part outside the chip movable carrier, the magnetic element connection part and the sensing element conductive connection part, the coil conductive connection part, the support piece connection part are located on the chip movable carrier There are differences in certain height directions.
  • the sensing element conductive connection portion and the coil conductive connection portion are consistent in a height direction set by the chip movable carrier.
  • the sensing element conductive element, the coil conductive element, the ball support piece and the chip magnetic element are integrally formed with the chip movable carrier through an injection molding process.
  • the chip coil assembly includes a first chip coil group, a second chip coil group and a third chip coil group, the first chip coil group includes at least one of the chip coils, and the The second chip coil group includes at least one of the chip coils, and the third chip coil group includes at least one of the chip coils, wherein the second chip coil group and the third chip coil group are arranged along the driving assembly.
  • the first chip coil group is arranged along the Y-axis direction set by the driving component, and the X-axis direction is perpendicular to the Y-axis direction.
  • this application also provides a camera module, which includes:
  • a photosensitive component including a circuit board and a photosensitive chip electrically connected to the circuit board;
  • Figure 1 illustrates a schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 2 illustrates a partial schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 3A illustrates a partial exploded view of a camera module according to an embodiment of the present application.
  • FIG. 3B illustrates another partial exploded view of a camera module according to an embodiment of the present application.
  • FIG. 4A illustrates a partial structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 4B illustrates an enlarged schematic diagram of a partial structure of a camera module according to an embodiment of the present application.
  • FIG. 4C illustrates a partial structural cross-sectional view of a camera module according to an embodiment of the present application.
  • FIG. 5 illustrates a partially disassembled schematic diagram of a camera module according to an embodiment of the present application.
  • FIG. 6A illustrates a partial schematic diagram of a driving component of a camera module according to an embodiment of the present application.
  • FIG. 6B illustrates a partially disassembled schematic diagram of the driving assembly of the camera module according to an embodiment of the present application.
  • FIG. 6C illustrates a partial structural diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 6D illustrates another partial structural diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 6E illustrates another partial structural diagram of the driving component of the camera module according to an embodiment of the present application.
  • FIG. 7 illustrates another partial structural diagram of a camera module according to an embodiment of the present application.
  • mobile electronic devices When using mobile electronic devices for photography, due to the physiological tremor of a certain frequency of the human body under normal circumstances and the jitter caused by movement, the camera effect will be reduced. Therefore, mobile electronic devices are usually equipped with anti-shake motors to drive optical lenses. And/or the movement of the photosensitive chip realizes the anti-shake function.
  • the heavier the lens the shorter the stroke that the anti-shake motor can drive the optical lens to move, affecting the anti-shake capability.
  • the heavier the optical lens the slower the anti-shake motor can drive the optical lens to move, and the longer it takes for the optical lens to reach the predetermined compensation position, which will also affect the anti-shake effect.
  • optical image stabilization can be achieved by driving a photosensitive chip.
  • the photosensitive chip is also developing in the direction of large size, the weight of the photosensitive chip is much lighter than the weight of the optical lens. Therefore, the photosensitive chip can be driven to meet the driving stroke and driving speed requirements of optical anti-shake.
  • the assembly process is complicated and requires high dimensional accuracy and positioning accuracy of each component.
  • the drive motor used to drive the photosensitive component achieves electrical conduction through the electrical connection structure between it and the circuit board in the photosensitive component.
  • processes such as slotting are performed on the components of the drive motor to enable electrical connection.
  • the structure passes through the slot between the circuit board and the drive motor and is electrically connected between the photosensitive component and the drive motor.
  • slotting plan corresponding positions and sizes of the various components around the slot are proposed. requirements.
  • this application proposes that the conductive structure and other components can be integrated through the driving assembly to combine multiple components together by integral molding, so as to reduce the structural complexity of the driving assembly and simplify the assembly process. And in this way, the conductive structure and other parts can be determined The positional relationship between the components is improved, and the stability of the positional relationship between the components is improved, thereby improving the overall structural stability of the driving assembly used to drive the photosensitive chip.
  • a camera module 1 which includes a photosensitive component 40 , an optical lens 10 held on the photosensitive path of the photosensitive component 40 , and a device for driving the optical lens. 10 and/or the photosensitive component 40 moves to realize the driving component of optical performance adjustment, for example, optical anti-shake, optical focus, etc.
  • the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11 .
  • the lens group 12 includes at least one optical lens.
  • the number of the at least one optical lens may be one or Multiple, not limited.
  • the driving component includes a chip driving motor 30 , and the chip driving motor 30 is suitable for driving the photosensitive component 40 to translate and/or rotate, thereby realizing the chip anti-shake function of the camera module 1 .
  • the chip drive motor 30 includes a chip anti-shake fixed part 31, a chip anti-shake movable part 33, a chip driving element 32 and a chip anti-shake conductive part 35.
  • the chip anti-shake fixed part 31 has a receiving cavity to accommodate the chip anti-shake fixed part 31.
  • the chip anti-shake conductive part 35 provides current to the chip driving element 32, and the chip driving element 32 is used to drive
  • the chip anti-shake movable part 33 moves relative to the chip anti-shake fixed part 31 within the receiving cavity of the chip anti-shake fixed part 31 .
  • the photosensitive component 40 is fixed to the chip anti-shake movable part 33 , so that the chip driving element 32 drives the photosensitive component 40 to move relative to the chip anti-shake fixed part 31 .
  • the driving assembly also includes a lens driving motor 20 , which is suitable for driving the optical lens 10 to translate and/or rotate, thereby realizing functions such as lens focusing and lens anti-shake of the camera module 1 .
  • the lens driving motor 20 includes a lens driving fixed part, a lens driving movable part, a lens driving element and a lens driving conductive part.
  • the lens driving fixed part has a receiving cavity to accommodate the lens driving movable part, the lens.
  • a driving element and a lens driving conductive part, the lens driving conductive part provides driving power for the lens driving element, and the lens driving element drives the lens driving movable part to move relative to the lens driving fixed part.
  • the optical lens 10 is fixed to the lens driving movable part, so that the lens driving element drives the optical lens 10 to move relative to the lens driving fixed part, for example, drives the optical lens 10 to move along its optical axis. Realize the lens focusing function; or drive the optical lens 10 to translate or drive in the direction perpendicular to its optical axis.
  • the optical lens 10 is rotated in a direction perpendicular to its optical axis to achieve the lens anti-shake function.
  • the lens driving motor 20 is fixed to the chip anti-shake fixing part 31 of the chip driving motor 30 through the lens driving fixing part, so that the optical lens 10 is disposed on the photosensitive path of the photosensitive component 40 .
  • the camera module 1 is not provided with a lens drive motor 20, and the optical lens 10 is directly installed on the chip anti-shake fixing part 31 of the chip drive motor 30, or the optical lens 10 is The lens 10 is indirectly installed on the chip anti-shake fixing part 31 of the chip drive motor 30 through a support member, so that the optical lens 10 is disposed on the photosensitive path of the photosensitive component 40 .
  • the photosensitive component 40 includes a circuit board 41 and a photosensitive chip 42 electrically connected to the circuit board 41 and an electronic component 43.
  • the photosensitive chip 42 is used to receive the external light collected by the optical lens 10 and image it through the circuit.
  • Board 41 is electrically connected to external mobile electronic devices.
  • the electronic component 43 may be one or more of passive electronic components such as resistors and capacitors, and active electronic components such as driver chips and memory chips.
  • the electronic component 43 may be electrically It may be connected to the front side of the circuit board 41 or electrically connected to the back side of the circuit board 41 , depending on the design requirements of the camera module 1 .
  • the photosensitive chip 42 is directly or indirectly fixed to the circuit board 41.
  • the photosensitive chip 42 includes a photosensitive area and a non-photosensitive area.
  • the photosensitive chip 42 is electrically connected to the circuit board through a chip pad located in the non-photosensitive area.
  • the circuit board 41 for example, the photosensitive chip 42 can be electrically connected to the circuit board 41 through wire bonding (gold wire), welding, FC process (chip flip chip) or RDL (redistribution layer technology). .
  • the circuit board 41 includes a circuit board body 411 , a connecting strap 412 and a reinforcing plate 413 .
  • the connecting strap 412 is connected to and electrically conducts the circuit board main body 411, thereby transmitting the imaging information acquired by the photosensitive chip 42 to an external mobile electronic device through the circuit board main body 411 and the connecting strap 412.
  • the reinforcing plate 413 can be fixed on the back of the circuit board main body 411, thereby increasing the structural strength of the circuit board main body 411.
  • the circuit board main body 411 includes a circuit board through hole 4111 in the middle.
  • the reinforcing plate 413 is fixed to the bottom surface of the circuit board main body 411 by, for example, bonding.
  • the main body 411 forms an installation cavity to accommodate the photosensitive chip 42 , thereby avoiding the influence of the thickness of the circuit board main body 411 on the thickness of the photosensitive component 40 and reducing the height of the camera module 1 .
  • the connecting strap 412 includes a first connecting strap 4121 and a second connecting strap 4122.
  • the first connecting strap 4121 and the second connecting strap 4122 are respectively connected from the main body of the circuit board.
  • the opposite sides of 411 extend outward and can be further bent upward. This arrangement can keep the circuit board body 411 stable during movement and further reduce the resistance when driving the circuit board 41 to move.
  • the first connection strap 4121 and the second connection strap 4122 may extend outward from adjacent two sides of the circuit board body 411 and be bent upward. There are no restrictions on this application.
  • the photosensitive component 40 further includes a filter element 44 , which is held on the photosensitive path of the photosensitive chip 42 and is used to filter the imaging light entering the photosensitive chip 42 .
  • the filter element 44 is installed and fixed on the base 45 of the photosensitive component 40 and corresponds to at least the photosensitive area of the photosensitive chip 42.
  • the filter element 44 can be attached frontally or backwards.
  • the base 45 has a light hole, so that the light from the optical lens 10 can pass through the light hole of the base 45 and enter the photosensitive chip 42 .
  • the photosensitive component 40 can be fixed to the chip anti-shake movable part 33 of the chip drive motor 30 through the circuit board 41 (the circuit board main body 411) or the base 45, so that the photosensitive component 40 can be moved anywhere.
  • the chip anti-shake movable part 33 moves due to the movement of the chip.
  • FIGS 2 to 7 show an embodiment of the chip drive motor 30 of the present application.
  • the chip drive motor 30 includes a chip anti-shake fixed part 31, a chip anti-shake movable part 33, a chip driving element 32 and a chip anti-shake conductive part. Department 35.
  • the chip driving element 32 is disposed on the chip anti-shake movable part 33 and the chip anti-shake fixed part 31 in a manner that connects the chip anti-shake movable part 33 and the chip anti-shake fixed part 31 respectively.
  • the chip anti-shake conductive part 35 is electrically connected to the chip driving element 32 and the photosensitive component 40 , and provides driving power to the chip driving element 32 to drive the chip anti-shake movable part 33 along the X-axis. direction (i.e., the direction set by the Realizing translational anti-shake and/or rotational anti-shake of the photosensitive component 40 .
  • the X-axis direction and the Y-axis direction are perpendicular to each other
  • the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction are located
  • the Z-axis direction is also the optical axis of the optical lens 10 direction, in other words, the X-axis
  • the Y-axis and the Z-axis form a three-dimensional coordinate system.
  • the XOY plane where the X-axis direction and the Y-axis direction are located is also called the plane where the horizontal direction is located.
  • the chip anti-shake fixing part 31 includes an upper cover 311 and a base 312 that are interlocked to form a receiving cavity. That is, the chip anti-shake fixing part 31 includes an upper cover 311 and a base 312 that are interlocked with each other. The upper cover 311 and the base 312 are fixed to each other and form the accommodation cavity (that is, the accommodation cavity of the chip anti-shake fixed part 31) to accommodate the chip anti-shake movable part 33 and the chip driving element. 32.
  • the chip anti-shake conductive part 35 and the photosensitive component 40 and other camera module components can not only protect the above-mentioned camera module components, but also reduce dust, dirt or stray light from entering the inside of the chip drive motor 30 .
  • the material of the upper cover 311 and the base 312 may be a metal material such as non-magnetic stainless steel.
  • the upper cover 311 is disposed above the base 312 , and the upper cover 311 includes a cover body 3111 with an opening in the center, and the opening corresponds to the photosensitive component 40 , so that light can enter the photosensitive component 40 through the opening for imaging.
  • the opening has a circular shape.
  • the upper cover 311 may also include a cover peripheral side 3112 integrally extending from the cover main body 3111 toward the base 312 direction, so that the cover peripheral side 3112 is fixedly connected to the base 312,
  • the peripheral side of the cover 3112 and the base 312 are fixed by laser welding or adhesive medium bonding.
  • the cover body peripheral side 3112 also includes at least a peripheral side recess 31121.
  • connection strip 412 outlet is formed between the upper cover 311 and the base 312 to provide the connection strip 412 of the circuit board 41 from the chip.
  • the anti-shake fixing part 31 protrudes outward from the accommodation cavity.
  • the circumferential side 3112 of the cover body includes two opposite circumferential recessed portions 31121.
  • the upper cover 311 and the base 312 There are two connecting straps 412 formed therebetween to provide the first connecting strap 4121 and the second connecting strap 4122 of the circuit board 41 to protrude outward from the receiving cavity of the chip anti-shake fixing part 31 .
  • Figure 4A is a schematic cross-sectional view along the dotted line AA in Figure 2.
  • Figure 4B is an enlarged schematic view of the circular area A in Figure 4A.
  • the chip anti-shake movable portion 33 includes a chip movable carrier 331.
  • the chip movable carrier 331 has opposite upper and lower surfaces.
  • the chip driving element 32 is disposed between the chip movable carrier 331 and the upper cover 311.
  • the chip driving element 32 drives the chip movable carrier 331 to move relative to the chip anti-shake fixing part 31;
  • the photosensitive component 40 is disposed between the chip movable carrier 331 and the substrate 312.
  • the light component 40 is installed on the chip movable carrier 331 through the circuit board 41 , and the photosensitive component 40 moves along with the chip movable carrier 331 .
  • the chip anti-shake movable part 33 is suspended in the receiving cavity of the chip anti-shake fixed part 31 , so that the chip anti-shake movable part 33 can be positioned relative to the chip anti-shake fixed part 31 .
  • the chip anti-shake fixing part 31 moves.
  • the chip movable carrier 331 of the chip anti-shake movable part 33 includes a fixed chip carrier body 3311 and a chip carrier side portion 3312 extending downward from the periphery of the chip carrier body 3311 .
  • the circuit board 41 is fixed on the bottom surface of the chip carrier body 3311 (that is, the side facing the base 312).
  • the chip carrier body 3311 has a carrier body through hole 33111, and the carrier body through hole 33111 is suitable for providing
  • the photosensitive chip 42 of the photosensitive component 40 has a light path and can also provide an installation space for the electronic components 43 on the photosensitive component 40 to prevent the electronic components 43 and the chip carrier body 3311 from interfering with each other.
  • the chip carrier side portion 3312 includes a first carrier side portion 33121, a second carrier side portion 33122, a third carrier side portion 33123, and a fourth carrier side portion 33124 that integrally extend outward from the chip carrier body 3311.
  • the first carrier side portion 33121 is opposite to the second carrier side portion 33122 and adjacent to the third carrier side portion 33123 and the fourth carrier side portion 33124.
  • the third carrier side portion 33123 is adjacent to the third carrier side portion 33123 and the fourth carrier side portion 33124.
  • the fourth carrier side portions 33124 are arranged oppositely.
  • the first carrier side part 33121, the second carrier side part 33122, the third carrier side part 33123 and the fourth carrier side part 33124 are suitable to become anti-collision parts when the chip carrier main body 3311 moves, This prevents the chip carrier body 3311 from directly colliding with the chip anti-shake fixing part 31 .
  • the chip carrier side portion 3312 (the first carrier side portion 33121, the second carrier side portion 33122, the third carrier side portion 33123 and the fourth carrier side portion 33124) is further toward the substrate. Extending in the 312 direction, the chip carrier side portion 3312 is lower than the bottom surface of the chip carrier main body 3311, so that when the circuit board 41 is mounted and fixed to the bottom surface of the chip carrier main body 3311 through an adhesive medium, the chip carrier side portion 3312
  • the space formed between the part 3312 and the chip carrier body 3311 can accommodate partially overflowed adhesive medium, reducing the probability of the adhesive medium overflowing to the outside of the chip carrier side part 3312, and the chip carrier side part 3312 moves toward described
  • the direction extension of the base 312 can also increase the side area of the movable chip carrier 331 , so that the impact area between the movable chip carrier 331 and the chip anti-shake fixing part 31 is increased. Further, in order to allow the connecting belt 412 to extend outward, the first carrier side part 33121 and the second
  • the chip driving element 32 includes a chip magnet assembly 321 and a chip coil assembly 322 .
  • the chip coil assembly 322 is provided on the chip anti-shake movable part 33 .
  • the chip magnet assembly 321 is fixed to the chip anti-shake fixing part 31 and corresponds to the chip coil component 322 .
  • the chip magnet component 321 is fixed to the upper cover 311 of the chip anti-shake fixing part 31 by, for example, an adhesive medium, and the chip coil component 322 is fixed to the chip anti-shake movable part 33 .
  • Moving carrier 331, the chip magnet assembly 321 and the chip coil assembly 322 are arranged oppositely, so that the chip anti-shake movable part 33 is driven by the magnetic field force between the chip coil assembly 322 and the chip magnet assembly 321. Move relative to the chip anti-shake fixing part 31 .
  • each of the chip coil groups includes at least one chip coil.
  • the chip coil assembly 322 includes a first chip coil group 3221, a second chip coil group 3222, and a third chip coil group 3223.
  • the second chip coil group 3222 and the third chip coil group 3223 are arranged on the plane where the X-axis and the Y-axis are located, that is, the first chip coil group 3221, the second chip coil group 3222 and the The third chip coil group 3223 is arranged in the horizontal direction.
  • the first chip coil group 3221 is arranged along the Y-axis direction
  • the second chip coil group 3222 is arranged along the X-axis direction
  • the third chip coil group 3223 is arranged along the X-axis direction
  • the second chip coil group 3222 The second chip coil group 3223 is arranged opposite to the third chip coil group 3223 along the Y-axis direction.
  • the second chip coil group 3222 and the third chip coil group 3223 are symmetrical with respect to the Y-axis.
  • the first chip coil group 3221 , the second chip coil group 3222 and the third chip coil group 3223 are arranged around the photosensitive component 40 .
  • the shape of the photosensitive chip 42 of the photosensitive component 40 is a rectangular structure including long sides and wide sides.
  • the shape edges of the photosensitive component 40 can be defined with a first side, a second side, a third side and a fourth side. Taking the center of the photosensitive chip 42 as the origin, a rectangular coordinate system is established.
  • the first side and the second side are parallel to the X-axis direction
  • the third side and the fourth side are parallel to the Y-axis direction.
  • the first chip coil group 3221, the second chip coil group 3222 and the third chip The coil groups 3223 each include at least one chip coil. That is, the first chip coil group 3221 includes at least one chip coil, the second chip coil group 3222 includes at least one chip coil, and the third chip coil group 3223 includes at least one chip coil.
  • the first chip coil group 3221 includes a first chip coil 32211 and a second chip coil 32212, and the first chip coil 32211 and the second chip coil 32212 are along the Y axis.
  • the directions are relatively parallel; the second chip coil group 3222 includes a third chip coil 32221 and a fourth chip coil 32222, and the third chip coil 32221 and the fourth chip coil 32222 are relatively parallel along the X-axis direction; so
  • the third chip coil group 3223 includes a fifth chip coil 32231 and a sixth chip coil 32232.
  • the fifth chip coil 32231 and the sixth chip coil 32232 are arranged relatively parallel along the X-axis direction;
  • the third chip coil 32221 and the fifth chip coil 32231 are arranged along the X-axis direction;
  • the fourth chip coil 32222 and the sixth chip coil 32232 are arranged along the X-axis direction.
  • first chip coil 32211 and the second chip coil 32212 are respectively disposed on the third side and the fourth side of the photosensitive component 40.
  • the first chip coil 32211 and the second chip coil 32212 are respectively arranged parallel to the third side and the fourth side;
  • the third chip coil 32221 and the fifth chip coil 32231 are arranged on the second side of the photosensitive component 40, the third chip coil 32221 and the The fifth chip coil 32231 is arranged parallel to the second side;
  • the fourth chip coil 32222 and the sixth chip coil 32232 are arranged on the first side of the photosensitive component 40, and the fourth chip coil 32222 and the third
  • the six-chip coil 32232 is arranged parallel to the first side.
  • the first chip coil 32211 and the second chip coil 32212 work together to drive the chip anti-shake movable part 33 to move in the X-axis direction.
  • the third chip coil 32221, the fourth chip coil 32222, and The fifth chip coil 32231 and the sixth chip coil 32232 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and/or rotate around the Z-axis direction.
  • the first chip coil 32211 and the second chip coil 32212 have the same size, and the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231 and the sixth chip coil 32221 are of the same size.
  • the size of the chip coil 32232 is the same, and the size of the first chip coil 32211 and the second chip coil 32212 is larger than that of the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231 and all The size of the sixth chip coil 32232.
  • the chip coil assembly 322 also includes a coil circuit board 3224. At least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224.
  • the first chip coil group 3221 (the first chip coil 32211, the second chip coil 32212), the second chip coil group 3222 (the third chip coil 32221, the fourth chip coil 32222) and the third chip coil group 3223 (the fifth chip coil 32231, the sixth chip coil 32232) are all fixed and electrically connected to the coil circuit board 3224, so
  • the chip coil component 322 is electrically connected to the chip anti-shake conductive portion 35 through the coil circuit board 3224 and is further electrically connected to the circuit board 41 of the photosensitive component 40 .
  • the first chip coil group 3221, the second chip coil group 3222, and the third chip coil group 3223 may be wound and formed coils fixedly electrically connected to the coil circuit board 3224; or, The first chip coil group 3221, the second chip coil group 3222 and the third chip coil group 3223 may be directly wound on the coil circuit board 3224; or, the first chip coil The group 3221, the second chip coil group 3222 and the third chip coil group 3223 are directly etched on the coil circuit board 3224 to form a planar coil (FP-Coil).
  • FP-Coil planar coil
  • the coil circuit board 3224 has a circuit board light hole 32241.
  • the circuit board light hole 32241 provides a light hole for light from the optical lens 10 to enter the photosensitive component 40.
  • FIG. 4C which is a schematic cross-sectional view along the dotted line BB in FIG. 2
  • the coil circuit board 3224 also includes at least one positioning hole 32242 , and the at least one positioning hole 32242 is connected with the chip carrier body 3311 At least one positioning post 33115 cooperates so that the coil circuit board 3224 can be accurately positioned and installed on the chip carrier body 3311.
  • the coil circuit board 3224 includes two positioning holes 32242, and the chip carrier body 3311 includes two positioning posts 33115 integrally protruding outward from the chip carrier body 3311.
  • the positioning holes 32242 are respectively sleeved on the two positioning posts 33115, so that the coil circuit board 3224 is accurately positioned on the chip carrier body 3311.
  • the chip magnet assembly 321 includes a first chip magnet group 3211, a second chip magnet group 3212, and a third chip magnet group 3213.
  • the first chip magnet group 3211, the The second chip magnet group 3212 and the third chip magnet group 3213 are arranged on the plane where the X-axis and the Y-axis are located (that is, arranged along the horizontal direction).
  • first chip magnet group 3211 and the first chip coil group 3221 are arranged vertically opposite
  • the second chip magnet group 3212 and the second chip coil group 3222 are arranged vertically opposite
  • the third core The sheet magnet group 3213 and the third chip coil group 3223 are arranged vertically and oppositely, so that each chip coil is located in the magnetic field of the corresponding chip magnet.
  • the first chip magnet group 3211 is arranged along the Y-axis direction
  • the second chip magnet group 3212 and the third chip magnet group 3213 are arranged along the X-axis direction
  • the second chip magnet group 3212 and the The third chip magnet group 3213 is arranged oppositely along the Y-axis direction
  • the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the Y-axis.
  • the upper side is the side away from the photosensitive component 40
  • the lower side is the side closer to the photosensitive component 40 .
  • the first chip magnet group 3211, the second chip magnet group 3212, and the third chip magnet group 3213 each include at least one chip magnet.
  • the first chip magnet group 3211 includes a first chip magnet 32111 and a second chip magnet 32112.
  • the first chip magnet 32111 and the second chip magnet 32112 are along the Y-axis. The directions are arranged relatively parallel;
  • the second chip magnet group 3212 includes a third chip magnet 32121 and a fourth chip magnet 32122, and the third chip magnet 32121 and the fourth chip magnet 32122 are arranged relatively parallel along the X-axis direction; so
  • the third chip magnet group 3213 includes a fifth chip magnet 32131 and a sixth chip magnet 32132.
  • the fifth chip magnet 32131 and the sixth chip magnet 32132 are arranged relatively parallel along the X-axis direction; the third chip magnet 32121 and the fifth chip magnet 32131 are arranged along the X-axis direction; the fourth chip magnet 32122 and the sixth chip magnet 32132 are arranged along the X-axis direction. More specifically, in this embodiment of the present application, the first chip magnet group 3211 is disposed at two opposite sides of the photosensitive component 40 along the Y-axis direction, and the second chip magnet group 3212 and the third Chip magnet groups 3213 are disposed at four corners of the photosensitive component 40 along the X-axis direction.
  • the first chip magnet 32111 and the second chip magnet 32112 work together to drive the chip anti-shake movable part 33 to move in the X-axis direction.
  • the third chip magnet 32121, the fourth chip magnet 32122, The fifth chip magnet 32131 and the sixth chip magnet 32132 work together to drive the chip anti-shake movable part 33 to move along the Y-axis direction and/or rotate around the Z-axis direction.
  • the first chip magnet 32111 and the second chip magnet 32112 have the same size, and the third chip magnet 32121, the fourth chip magnet 32122, the fifth chip magnet 32131 and the sixth chip magnet are The size of the chip magnet 32132 is the same, and the size of the first chip magnet 32111 and the second chip magnet 32112 is larger than that of the third chip magnet 32121, the fourth chip magnet 32122, the fifth chip magnet 32131 and the The sixth chip magnet 32132 feet inch.
  • the first chip coil group 3221 and the first chip magnet group 3211 interact to drive the chip anti-shake movable part 33, thereby driving the photosensitive component 40 to translate in the X-axis direction;
  • the second chip The coil group 3222 interacts with the second chip magnet group 3212, and the third chip coil group 3223 interacts with the third chip magnet group 3213 to jointly drive the chip anti-shake movable part 33, thereby driving all
  • the photosensitive component 40 translates in the Y-axis direction and/or rotates around the Z-axis direction.
  • the chip magnet assembly 321 further includes components provided on the first chip magnet group 3211, the second chip magnet group 3212, the third chip magnet group 3213 and the upper cover.
  • the first chip magnet group 3211, the second chip magnet group 3212 and the third chip magnet group 3213 are indirectly fixed to the upper cover through the magnetic conductive member 3214. 311.
  • the magnetic conductive member 3214 is suitable for enhancing the magnetic field force in the direction in which the chip magnet assembly 321 faces the coil magnet assembly, thereby enhancing the driving force of the chip driving element 32.
  • the magnetic conductive member 3214 includes six magnetic conductive units, and the six magnetic conductive units are respectively disposed between the first chip magnet 32111 and the upper cover 311.
  • the magnetic conductive unit wraps the chip magnet in a "U" shape close to the top surface of the upper cover 311 and The two sides with the largest area of the chip magnet.
  • the magnetic conductive unit may only wrap the top surface of the chip magnet near the upper cover 311, or may include the top surface of the chip magnet near the upper cover 311 and four chip magnets. On the other hand, this application is not limited to this.
  • the chip drive motor 30 also includes a chip position sensing component 36 and a chip holding component 34.
  • the chip position sensing component 36 is used to obtain the position or movement information of the photosensitive component 40.
  • the chip holding component 34 is adapted to cause the chip movable carrier 331 to be suspended in the chip anti-shake fixing part 31, so that the photosensitive component 40 can be suspended by the chip holding component 34. in the chip anti-shake fixing part 31.
  • the chip position sensing component 36 is fixed to the chip movable carrier 331 .
  • the chip position sensing component 36 is adapted to obtain the position information of the chip movable carrier 331 by obtaining changes in the magnetic field of the chip magnet component 321 . interest.
  • the position sensing element includes at least one position sensing element, and the number of the position sensing elements is not limited by this application.
  • the chip position sensing component 36 includes a first position sensing element 361, a second position sensing element 362 and a third position sensing element 363, so as to sense the chip position.
  • the position information of the three movements of the movable carrier 331 translation along the X-axis direction, translation along the Y-axis direction, and rotation around the Z-axis direction.
  • the first position sensing element 361, the second position sensing element 362 and the third position sensing element 363 are Hall elements; in other embodiments of this application, the first position sensing element 361, the second position sensing element 362 and the third position sensing element 363 are Hall elements.
  • the first position sensing element 361, the second position sensing element 362 and the third position sensing element 363 are driver chips containing a position sensing function.
  • the chip holding component 34 includes a chip supporting component 341 and a chip magnetic attraction component 342 .
  • the chip support component 341 is disposed between the chip movable carrier 331 and the upper cover 311, and the chip magnetic attraction component 342 is fixed to the chip movable carrier 331 of the chip anti-shake movable part 33, In this way, the magnetic attraction force between the chip magnetic attraction component 342 and the chip magnet component 321 causes the chip anti-shake movable part 33 to be attracted to the upper cover 311 .
  • the chip support component 341 is disposed between the upper cover 311 of the chip anti-shake fixed part 31 and the chip movable carrier 331 of the chip anti-shake movable part 33.
  • the chip support component 341 is clamped by the upper cover 311 and the chip movable carrier 331.
  • the chip movable carrier 331 and the upper cover 311 are There is a gap between them, thereby reducing the resistance of the chip anti-shake movable part 33 during movement.
  • the chip support component 341 includes a ball groove 3412 recessedly formed in the chip movable carrier 331 and a ball 3411 disposed in the ball groove 3412 .
  • the number of the balls 3411 and the ball grooves 3412 is not limited by the present application.
  • the chip support assembly 341 includes at least three disposed on the chip movable carrier 331 and the upper
  • the chip support assembly 341 also includes at least three ball grooves 3412 corresponding to at least three of the balls 3411.
  • at least three The ball groove 3412 is formed on the chip movable carrier 331.
  • the depth of the ball groove 3412 is less than the diameter of the ball 3411. At least a part of the ball 3411 can protrude from the ball groove 3412, so that the The ball 3411 can maintain frictional contact with the upper cover 311 .
  • the chip movable carrier 331 also includes a protrudingly formed on the main body of the chip carrier.
  • the ball groove 3412 is recessedly formed on the upper surface of the extension post 3313 of the extension post 3313 of the body 3311.
  • the chip movable carrier 331 includes at least three extension columns 3313 formed on the chip carrier body 3311, and at least three of the extension columns 3313 protrude from the upper surface of the chip carrier body 3311. On the surface, at least three ball grooves 3412 are formed on at least three extending posts 3313 .
  • the chip support component 341 is disposed between the extension column 3313 and the upper cover 311, so that a certain gap is maintained between the movable chip carrier 331 and the upper cover 311, and the gap does not change with the chip.
  • the movement of the movable carrier 331 changes.
  • the chip movable carrier 331 includes four extension posts 3313 formed on the chip carrier body 3311, and the chip support assembly 341 includes four tops formed by the extension posts 3313.
  • the four extension posts 3313 are distributed on the longer two sides of the chip carrier body 3311, thereby reducing the size of the chip carrier body 3311.
  • the chip support assembly 341 also includes a ball support piece 3413 embedded in the chip movable carrier 331 and located at the bottom of the ball groove 3412.
  • the ball 3411 is supported on the ball groove 3412.
  • the ball support piece 3413 further includes at least three ball support pieces 3413.
  • the ball support pieces 3413 are fixed to the chip movable carrier 331 and serve as the bottom surface of the ball groove 3412, so
  • the ball supporting piece 3413 can be made of metal such as stainless steel, thereby providing a smoother supporting surface for the ball 3411 and reducing the friction of the rolling ball 3411.
  • the chip support assembly 341 includes four ball support pieces 3413.
  • Each ball support piece 3413 is fixed in the extension column 3313 of the chip movable carrier 331 through insert molding and is exposed. Its upper surface serves as the bottom surface of each ball groove 3412.
  • the ball support piece 3413 includes a support piece main body 34131 and a support piece connecting portion 34132.
  • the support piece main body 34131 and the support piece connecting portion 34132 are integrated. Extending, the upper surface of the support piece main body 34131 is exposed and serves as the bottom surface of the ball groove 3412 .
  • the support piece connection part 34132 is used to maintain the position of the ball support piece 3413 in the chip movable carrier 331 during the insert molding process.
  • the support piece connection part 34132 can connect the supports of other ball support pieces 3413
  • the piece connecting portion 34132 may be connected to other supporting components for supporting the supporting piece connecting portion 34132.
  • the Support piece connecting portion 34132 After the ball support piece 3413 is formed in the chip movable carrier 331 through an insert molding process, the Support piece connecting portion 34132, a part of the supporting piece connecting portion 34132 may be exposed outside the chip movable carrier 331. That is, in some embodiments of the present application, the ball support piece 3413 includes a support piece main body 34131 located at the bottom of the ball groove 3412 and extending from the support piece main body 34131 to the outside of the chip movable carrier 331 The support piece connection part 34132.
  • the chip magnetic assembly 342 includes at least one chip magnetic element 3421.
  • the chip magnetic attraction component 3421 is wrapped in the chip anti-shake movable part 33, so that the chip is anti-shake through the magnetic attraction force between the at least one chip magnetic attraction component 3421 and the chip magnet assembly 321.
  • the shake movable part 33 is suspended in the receiving cavity of the chip anti-shake fixing part 31 .
  • at least one of the chip magnetic components 3421 is embedded in the chip movable carrier 331 of the chip anti-shake movable part 33 through an insert molding process.
  • the element 3421 is disposed opposite to the chip magnet assembly 321 to generate a magnetic attraction force along the Z-axis direction between at least one of the chip magnet assembly 3421 and the chip magnet assembly 321, and then through the at least one chip magnet assembly
  • the magnetic attraction force between the component 3421 and the chip magnet assembly 321 causes the chip movable carrier 331 of the chip anti-shake movable part 33 to be attracted to the upper cover 311 .
  • the ball 3411 is clamped between the upper cover 311 and the chip movable carrier 331, so that the The chip support assembly 341 is clamped between the chip anti-shake fixed part 31 and the chip anti-shake movable part 33 .
  • the chip magnetic element 3421 is made of a material with magnetic permeability, which is suitable for generating magnetic attraction between the magnet and the magnet.
  • the chip magnetic element 3421 includes a magnetic element main body 34211 and a magnetic element connection part 34212.
  • the magnetic element main body 34211 and the magnetic element connection part 34212 extend integrally.
  • the magnetic element connection part 34212 is used for To maintain the position of the chip magnetic element 3421 in the chip movable carrier 331 during the insert molding process, the magnetic element connecting portion 34212 can be connected to the magnetic element connecting portion 34212 of other chip magnetic elements 3421 or Connect other supporting components for supporting the magnetic element connecting portion 34212.
  • the magnetic element connecting portion 34212 is cut, and a part of the magnetic element connecting portion 34212 can be exposed. outside the chip movable carrier 331.
  • the chip magnetic element 3421 includes a magnetic element body 34211 wrapped in the chip movable carrier 331 and extending from the magnetic element body 34211 to The magnetic element connection part outside the chip movable carrier 331 34212.
  • the upper surface of the chip magnetic element 3421 is exposed and not wrapped by the chip movable carrier 331, as shown in Figure 6A; in other embodiments of the present application, the The upper surface of the chip magnetic component 3421 can also be wrapped by the chip movable carrier 331, and the application is not limited thereto.
  • the chip magnetic assembly 342 includes eight chip magnetic elements 3421, and each two of the chip magnetic elements 3421 are disposed on both sides of the ball 3411, and each of the The chip magnetic elements 3421 on both sides of the ball 3411 have the same shape, thereby providing uniform and stable magnetic attraction, so that the chip movable carrier 331 can be smoothly attracted to the upper cover 311 .
  • the chip movable carrier 331 can be insert-molded with the ball support piece 3413 and can be insert-molded with the chip magnetic element 3421.
  • the chip The anti-shake conductive part 35 may also be embedded in the chip anti-shake movable part 33 by insert molding.
  • the present application embeds the chip anti-shake conductive part 35 into the chip anti-shake movable part 33 by, for example, insert molding to provide a chip anti-shake movable part 33 with a conductive function, so that the chip coil
  • the component 322 may be electrically connected to the circuit board 41 through the chip anti-shake movable part 33 .
  • the chip anti-shake conductive part 35 is embedded in the chip anti-shake movable part 33 through insert molding, the chip anti-shake movable part 33 is suitable for providing two flat mounting surfaces for mounting and fixing.
  • the chip coil assembly 322 and the circuit board 41 can also reduce the number of components of the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the chip anti-shake conductive portion 35 .
  • FIGS. 6A to 6B show the embedded structure of the chip anti-shake movable part 33 and the chip anti-shake conductive part 35 .
  • the chip anti-shake conductive part 35 includes a coil conductive component 351 and a sensing element conductive component 352.
  • the coil conductive component 351 includes at least one coil conductive element 3511 wrapped in the chip anti-shake movable part 33 .
  • the coil conductive component 351 includes multiple (two or more) coil conductive elements 3511, as shown in Figure 6C.
  • the plurality of coil conductive elements 3511 are embedded in the chip movable carrier 331 by insert molding, for example, through an injection molding process.
  • the plurality of coil conductive elements 3511 can be electrically connected to the chip coil assembly 322 and the circuit board 41.
  • the sensing element conductive component 352 includes at least one sensing element conductive component 3521 wrapped in the chip movable carrier 331 .
  • the sensing element conductive component 352 includes multiple (two or more) sensing element conductive elements 3521.
  • the plurality of sensing element conductive elements 3521 are embedded in the chip movable carrier 331 by insert molding, for example, through an injection molding process.
  • the sensing element conductive element 3521 can electrically connect the chip position sensing component 36 and the circuit board 41 .
  • the number of the coil conductive elements 3511 in the coil conductive component 351 is related to the required number of circuits of the chip coil component 322.
  • the coil conductive component 351 includes 6 coil conductive components. Element 3511.
  • Each of the coil conductive elements 3511 has an exposed first coil conductive end 35111, an exposed second coil conductive end 35113 opposite to the first coil conductive end 35111, and extends and is electrically conductive
  • the coil conductive extension 35112 between the first coil conductive end 35111 and the second coil conductive end 35113, the first coil conductive end 35111 is located higher than the second coil conductive end 35113.
  • the coil conductive extension 35112 extends downward from the first coil conductive end 35111 to the second coil conductive end 35113.
  • the chip movable carrier 331 When the coil conductive element 3511 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first coil conductive end portion 35111, and the first coil conductive end portion 35111 The upper surface is exposed for electrical connection with the chip coil assembly 322. The chip movable carrier 331 does not cover the lower surface of the second coil conductive end 35113. The lower surface of the second coil conductive end 35113 Exposed for electrical connection with the circuit board 41 , thereby electrically connecting the chip coil component 322 and the circuit board 41 .
  • the first coil conductive end 35111 of at least part of all the coil conductive elements 3511 is exposed to the upper surface of the chip movable carrier 331, and the second coil The conductive end portion 35113 is exposed to the lower surface of the chip movable carrier 331 .
  • the coil circuit board 3224 of the chip coil assembly 322 is electrically connected to the first coil conductive end 35111, and the second coil conductive end 35113 is suitable for electrical connection to the circuit board 41. In this way, the chip is implemented There is electrical conduction between the coil assembly 322 and the circuit board 41 .
  • the first coil conductive end 35111 of the coil conductive element 3511 forms part of the upper conductive part 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the third coil conductive element 3511
  • the two coil conductive end portions 35113 form a part of the lower conductive portion 33113 of the chip carrier body 3311 of the movable chip carrier 331 .
  • the upper conductive part 33112 includes a first coil conductive end part 35111
  • the lower conductive part 33113 includes a second coil conductive end part 35113.
  • the coil conductive component 3511 also includes a coil conductive connection part 35114.
  • the coil conductive connection part 35114 The coil conductive connection portions 35114 of other coil conductive elements 3511 may be connected or other support components for supporting the coil conductive connection portions 35114 may be connected.
  • the coil conductive element 3511 further includes a conductive element formed from the first coil conductive end 35111, the second coil conductive end 35113 and the coil conductive extension 35112.
  • the coil conductive body extends to the coil conductive connection portion 35114 outside the chip movable carrier 331 .
  • the first coil conductive end portion 35111, the second coil conductive end portion 35113, the coil conductive extension portion 35112 and the coil conductive connection portion 35114 are integrally formed of conductive material.
  • the coil conductive element 3511 is not provided with the coil conductive connection part 35114, and the first coil conductive end part 35111, the second coil conductive end part 35113 and the coil conductive
  • the extension part 35112 is integrally formed of conductive material.
  • the number of sensing element conductive elements 3521 in the sensing element conductive component 352 is related to the number of circuits required by the chip position sensing component 36 .
  • the sensing element conductive element 3521 includes a first sensing element conductive end portion 35211 and a second sensing element conductive end portion opposite to the first sensing element conductive end portion 35211. 35213, and a sensing element conductive extension 35212 that extends and is electrically connected between the first sensing element conductive end 35211 and the second sensing element conductive end 35213.
  • the chip movable carrier 331 When the sensing element conductive element 3521 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first sensing element conductive end 35211, and the first sensing element The upper surface of the conductive end portion 35211 of the element is used to electrically connect with the chip position sensing component 36.
  • the movable chip carrier 331 does not cover the lower surface of the conductive end portion 35213 of the second sensing element.
  • the lower surface of the sensing element conductive end 35213 is exposed for electrical connection with the circuit board 41 , thereby electrically connecting the sensing element conductive component 352 and the circuit board 41 .
  • the first sensing element conductive end 35211 of at least part of all the sensing element conductive elements 3521 is exposed to the chip On the upper surface of the movable carrier 331 , the conductive end portion 35213 of the second sensing element is exposed to the lower surface of the chip movable carrier 331 .
  • the conductive end portion 35211 of the first sensing element is electrically connected to the position sensing element, and the conductive end portion 35213 of the second sensing element is adapted to be electrically connected to the circuit board 41. In this way, the above-mentioned steps are achieved. There is electrical conduction between the conductive component 352 of the sensing element and the circuit board 41 .
  • the number can be one or more and is not limited.
  • the first sensing element conductive end portion 35211 of the sensing element conductive element 3521 forms part of the upper conductive portion 33112 of the chip carrier body 3311 of the movable chip carrier 331, and the second sensing element conductive end portion 35213 A part of the lower conductive portion 33113 of the chip carrier body 3311 forming the movable chip carrier 331 .
  • the upper conductive part 33112 includes a first coil conductive end 35111 and a first sensing element conductive end 35211
  • the lower conductive part 33113 includes a second coil conductive end 35113 and a second sensing element conductive end. 35213.
  • the position of the conductive end 35211 of the first sensing element is lower than the position of the conductive end 35111 of the first coil. More specifically, the first sensing element conductive end 35211 is lower than the first coil conductive end 35111 in the height direction set by the chip movable carrier 331 . In this way, the height of the position sensing element can be reduced, and may not even protrude from the upper surface of the chip movable carrier 331 .
  • a sensing element groove 33114 is formed on the chip carrier body 3311, and the chip position sensing component 36 is disposed in the sensing element groove 33114, thereby preventing the chip position sensing component 36 from being
  • the height is too high, and the conductive end portion 35211 of the first sensing element is electrically connected to the bottom surface of the chip position sensing component 36. Therefore, the position of the conductive end portion 35211 of the first sensing element is set lower than the The position sensing element is disposed between the chip coil assembly 322 and the circuit board 41 in the height (Z-axis) direction of the position of the first coil conductive end 35111 .
  • the chip position sensing component 36 is accommodated in the sensing element groove 33114 and does not protrude from the sensing element groove 33114.
  • the sensing element conductive component 352 also includes a sensing element conductive connection part 35214, the sensing element is conductive
  • the connection portion 35214 can be connected to the sensing element conductive connection portion 35214 of other sensing element conductive elements 3521 or to other conductive elements for supporting the sensing element. Support component for electrical connection 35214.
  • the sensing element conductive element 3521 further includes a conductive end of the first sensing element, a conductive end of the second sensing element and a conductive end of the sensing element.
  • the conductive body of the sensing element formed by the extension portion 35212 extends to the conductive connection portion 35214 of the sensing element outside the movable chip carrier 331 .
  • the first sensing element conductive end 35211, the sensing element conductive extension 35212, the second sensing element conductive end 35213 and the sensing element are conductively connected.
  • Part 35214 is integrally formed of conductive material.
  • the sensing element conductive element 3521 is not provided with the sensing element conductive connection portion 35214, and the first sensing element conductive end portion 35211, the sensing element conductive The extension part 35212 and the conductive end part 35213 of the second sensing element are integrally formed of conductive material.
  • the coil conductive component 351 and the sensing element conductive component 352 are made of the same conductive material and are insert-molded together in the chip movable carrier 331. Therefore, the The coil conductive connection portions 35114 of the plurality of coil conductive elements 3511 of the coil conductive assembly 351 and the sensing element conductive connection portions 35214 of the plurality of sensing element conductive elements 3521 of the sensing element conductive assembly 352 may be located at the same height. That is, the sensing element conductive connection portion 35214 and the coil conductive connection portion 35114 are consistent in the height direction set by the chip movable carrier 331 .
  • the ball support piece 3413, the chip magnetic assembly 342 (including the magnetic element) and the chip anti-shake conductive part 35 are embedded in the chip movable carrier 331 by insert molding through an injection molding process, and are integrally formed with the chip movable carrier 331, thus reducing the number of parts of the chip drive motor 30. quantity, thereby simplifying the structure and assembly complexity of the chip drive motor 30 .
  • the chip magnetic component 342 needs to be made of a material with magnetic permeability
  • the ball support piece 3413 and the chip anti-shake conductive part 35 (including the sensing element conductive component 352 and The coil conductive component 351) needs to be made of material without magnetic permeability.
  • the chip magnetic component 342 is the same layer of material tape, and the ball support piece 3413 and the The chip anti-shake conductive part 35 is another layer of material tape, so after it is made, the The height of the magnetic element connection portion 34212 of at least one chip magnetic element 3421 of the chip magnetic attraction assembly 342 is consistent with the support connection portion of the ball support piece 3413 and the coil conductive connection portion 35114 of the chip anti-shake conductive portion 35 and the inductance. The height of the conductive connection portion 35214 of the measuring element is inconsistent.
  • the sensing element conductive element 3521, the coil conductive element 3511 and the ball support piece 3413 of the chip anti-shake conductive part 35 do not have magnetic permeability, and the chip magnetic attraction element 3421 of the magnetic attraction assembly has magnetic permeability.
  • the magnetic element connection part 34212, the sensing element conductive connection part 35214, the coil conductive connection part 35114, and the support piece connection part 34132 are in the height direction set by the chip movable carrier 331 has a difference.
  • solder (such as solder) is provided on the upper conductive portion 33112 of the chip movable carrier 331 to be electrically connected to the pad on the back of the coil circuit board 3224 of the chip coil assembly 322 , the coil circuit board 3224 and the chip movable carrier 331 are bonded and fixed by providing an adhesive medium between the chip movable carrier 331 and the coil circuit board 3224; An adhesive medium is provided between the chip movable carrier 331 and the circuit board 41 to bond and fix the chip movable carrier 331 and the circuit board 41 . As shown in FIG.
  • the driving assembly and the camera module 1 based on the embodiments of the present application have been clarified, wherein the driving assembly combines multiple components through integral molding, which can reduce the structural complexity of the driving assembly and simplify the assembly process. .

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Abstract

公开了一种驱动组件和摄像模组，其中，所述驱动组件包括具有收容腔的芯片防抖固定部、被悬持地设置于所述收容腔内的芯片防抖可动部、用于驱动所述芯片防抖可动部相对于所述芯片防抖固定部在所述收容腔内进行移动的芯片驱动元件和用于导通所述驱动元件和所述摄像模组的线路板的芯片防抖导电部，其中，所述芯片防抖导电部通过注塑工艺以嵌件成型的方式嵌合在所述芯片防抖可动部的芯片可动载体中，与所述芯片可动载体一体成型，减小了所述驱动组件的部品数量，进而简化了所述驱动组件的结构和组装复杂度。

Description

驱动组件和摄像模组 技术领域
本申请涉及摄像模组领域，尤其涉及一种驱动组件和摄像模组。
背景技术
随着移动电子设备的普及，被应用于移动电子设备的用于帮助使用者获取影像的摄像模组的相关技术得到了迅猛的发展和进步。目前在市场中，消费者对于配置于移动电子设备(例如，智能手机)的摄像模组的功能要求越来越高和多样化，例如，防抖功能。
在使用移动电子设备进行摄像时，由于人体在正常情况下存在的一定频率的生理震颤和由于运动产生的抖动，会导致摄像效果下降，因此，移动电子设备通常配有防抖马达以驱动光学镜头和/或感光芯片移动实现防抖功能。
而随着对摄像模组的成像质量要求越来越高，光学镜头的体积和重量越来越大，对防抖马达的驱动力要求也越来越高。而当前移动电子设备对摄像模组的体积也有很大的限制，防抖马达的占用体积随着镜头的增大而相应的增加。换句话说，在光学镜头向更大体积、更大重量发展的趋势下，防抖马达所能提供的驱动力却难以相应地增加。
在驱动力受限的前提下，镜头越重，防抖马达能够驱动光学镜头移动的行程越短，影响防抖能力。另一方面，光学镜头越重，防抖马达能够驱动光学镜头移动的速度也越慢，光学镜头到达预定的补偿位置的时间也越长，这也会影响防抖效果。
为克服上述缺陷，本申请人提出一种驱动组件，通过驱动感光芯片移动，达到光学防抖的目的。
发明内容
本申请的一优势在于提供了一种驱动组件和摄像模组，其中，所述驱动组件能够通过驱动感光芯片移动来实现光学防抖，以满足光学防抖对驱动行程和驱动速度的需求，且所述驱动组件通过一体成型的方式将多个部件结合在一起，可降低驱动组件的结构复杂度，简化组装工艺。
本申请的另一优势在于提供了一种驱动组件和摄像模组，其中，所述驱动组件的多个部件通过注塑工艺一体成型，可提高各个部件之间的位置关系的稳定性，进而提高驱动组件整体的结构稳定性。
通过下面的描述，本申请的其它优势和特征将会变得显而易见，并可以通过权利要求书中特别指出的手段和组合得到实现。
为实现上述至少一优势，根据本申请的一个方面，本申请提供一种驱动组件，其包括：
具有收容腔的芯片防抖固定部；
被悬持地设置于所述收容腔内的芯片防抖可动部；
用于驱动所述芯片防抖可动部相对于所述芯片防抖固定部在所述收容腔内进行移动的芯片驱动元件，其中，所述芯片驱动元件包括被设置于所述芯片防抖可动部的芯片线圈组件，以及，被固定于所述芯片防抖固定部且对应于所述芯片线圈组件的芯片磁石组件，其中，所述芯片线圈组件包括至少一芯片线圈；以及
芯片防抖导电部，包括被包覆于所述芯片防抖可动部内的至少一线圈导电元件，每一所述线圈导电元件具有被暴露的第一线圈导电端部、与所述第一线圈导电端部相对的且被暴露的第二线圈导电端部，以及，延伸于所述第一线圈导电端部和所述第二线圈导电端部之间的线圈导电延伸部，其中，至少一芯片线圈电连接于所述第一线圈导电端部，所述第二线圈导电端部适于电连接线路板。
在根据本申请的驱动组件中，所述芯片防抖可动部包括芯片可动载体，所述芯片可动载体具有相对的上表面和下表面，其中，所述线圈导电元件的第一线圈导电端部被暴露于所述芯片可动载体的上表面，所述线圈导电元件的第二线圈导电端部被暴露于所述芯片可动载体的下表面。
在根据本申请的驱动组件中，所述芯片线圈组件包括被设置于所述芯片可动载体的线圈电路板，所述至少一芯片线圈被固定且电连接于所述线圈电路板，所述线圈电路板电连接于所述第一线圈导电端部。
在根据本申请的驱动组件中，所述芯片防抖固定部包括相互扣合以形成所述收容腔的上盖和基底，所述芯片磁石组件被固定于所述上盖。
在根据本申请的驱动组件中，所述驱动组件还包括芯片保持组件，所述芯片保持组件包括被包覆于所述芯片防抖可动部内的至少一芯片磁吸元件， 以通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力使得所述芯片防抖可动部被悬持地设置于所述芯片防抖固定部的收容腔内。
在根据本申请的驱动组件中，所述驱动组件还包括芯片保持组件，所述芯片保持组件包括内嵌于所述芯片可动载体内的至少一芯片磁吸元件，以通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力使得所述芯片可动载体吸附向所述上盖。
在根据本申请的驱动组件中，所述芯片保持组件还包括被设置于所述芯片可动载体和所述上盖之间的芯片支撑组件，所述芯片支撑组件包括凹陷地形成于所述芯片可动载体的滚珠槽以及被设置于所述滚珠槽内的滚珠，其中，通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力，所述滚珠被夹持于所述上盖和所述芯片可动载体之间。
在根据本申请的驱动组件中，所述芯片支撑组件还包括内嵌于所述芯片可动载体内且位于所述滚珠槽的底部的滚珠支撑片，所述滚珠被支持于所述滚珠支撑片。
在根据本申请的驱动组件中，所述芯片可动载体包括芯片载体主体和自所述芯片载体主体的周缘往下延伸的芯片载体侧部，其中，所述芯片可动载体还包括突出地形成于所述芯片载体主体的上表面的延伸柱，所述滚珠槽凹陷地形成于所述延伸柱的上表面。
在根据本申请的驱动组件中，所述驱动组件还包括芯片位置感测组件，所述芯片位置感测组件包括至少一位置感测元件，所述芯片防抖导电部还包括被包覆于所述芯片可动载体内的至少一感测元件导电元件，每一所述感测元件导电元件包括被暴露于所述芯片可动载体的上表面的第一感测元件导电端部、被暴露于所述芯片可动载体的下表面且与所述第一感测元件导电端部相对的第二感测元件导电端部，以及，延伸于所述第一感测元件导电端部和所述第二感测元件导电端部之间的感测元件导电延伸部，其中，所述第一感测元件导电端部电连接于所述位置感测元件，所述第二感测元件导电端部适于电连接于所述线路板。
在根据本申请的驱动组件中，所述第一感测元件导电端部在所述芯片可动载体所设定的高度方向上低于所述第一线圈导电端部。
在根据本申请的驱动组件中，所述感测元件导电元件、所述线圈导电元件和所述滚珠支撑片不具有导磁性，所述芯片磁吸元件具有导磁性。
在根据本申请的驱动组件中，所述芯片磁吸元件包括被包覆于所述芯片可动载体内的磁吸元件主体和从所述磁吸元件主体延伸至所述芯片可动载体外的磁吸元件连接部，所述感测元件导电元件进一步包括从由所述第一感测元件导电端、所述第二感测元件导电端和所述感测元件导电延伸部形成的感测元件导电主体延伸至所述芯片可动载体外的感测元件导电连接部，所述线圈导电元件进一步包括从由所述第一线圈导电端部、所述第二线圈导电端部和所述线圈导电延伸部形成的线圈导电主体延伸至所述芯片可动载体外的线圈导电连接部，所述滚珠支撑片包括位于所述滚珠槽的底部的支撑片主体和从所述支撑片主体延伸至所述芯片可动载体外的支撑片连接部，所述磁吸元件连接部与所述感测元件导电连接部、所述线圈导电连接部、所述支撑片连接部在所述芯片可动载体所设定的高度方向上存在差异。
在根据本申请的驱动组件中，所述感测元件导电连接部和所述线圈导电连接部在所述芯片可动载体所设定的高度方向上一致。
在根据本申请的驱动组件中，所述感测元件导电元件、所述线圈导电元件、所述滚珠支撑片和所述芯片磁吸元件通过注塑工艺与所述芯片可动载体一体成型。
在根据本申请的驱动组件中，所述芯片线圈组件包括第一芯片线圈组、第二芯片线圈组和第三芯片线圈组，所述第一芯片线圈组包括至少一所述芯片线圈，所述第二芯片线圈组包括至少一所述芯片线圈，所述第三芯片线圈组包括至少一所述芯片线圈，其中，所述第二芯片线圈组和第三芯片线圈组沿着所述驱动组件所设定的X轴方向设置，所述第一芯片线圈组沿着所述驱动组件所设定的Y轴方向设置，所述X轴方向垂直于所述Y轴方向。
根据本申请的另一个方面，本申请还提供了一种摄像模组，其包括：
光学镜头；
感光组件，包括线路板和电连接于所述线路板的感光芯片；以及
如上所述的驱动组件，其中，所述感光组件被安装于所述驱动组件的芯片可动载体。
通过对随后的描述和附图的理解，本申请进一步的目的和优势将得以充分体现。
本申请的这些和其它目的、特点和优势，通过下述的详细说明，附图和权利要求得以充分体现。
附图说明
通过结合附图对本申请实施例进行更详细的描述，本申请的上述以及其他目的、特征和优势将变得更加明显。附图用来提供对本申请实施例的进一步理解，并且构成说明书的一部分，与本申请实施例一起用于解释本申请，并不构成对本申请的限制。在附图中，相同的参考标号通常代表相同部件或步骤。
图1图示了根据本申请实施例的摄像模组的示意图。
图2图示了根据本申请实施例的摄像模组的局部示意图。
图3A图示了根据本申请实施例的摄像模组的局部爆炸示意图。
图3B图示了根据本申请实施例的摄像模组的另一局部爆炸示意图。
图4A图示了根据本申请实施例的摄像模组的局部结构示意图。
图4B图示了根据本申请实施例的摄像模组的局部结构放大示意图。
图4C图示了根据本申请实施例的摄像模组的局部结构剖面示意图。
图5图示了根据本申请实施例的摄像模组的局部拆解示意图。
图6A图示了根据本申请实施例的摄像模组的驱动组件的局部示意图。
图6B图示了根据本申请实施例的摄像模组的驱动组件的局部拆解示意图。
图6C图示了根据本申请实施例的摄像模组的驱动组件的局部结构示意图。
图6D图示了根据本申请实施例的摄像模组的驱动组件的另一局部结构示意图。
图6E图示了根据本申请实施例的摄像模组的驱动组件的又一局部结构示意图。
图7图示了根据本申请实施例的摄像模组的另一局部结构示意图。
具体实施方式
下面，将参考附图详细地描述根据本申请的示例实施例。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是本申请的全部实施例，应理解，本申请不受这里描述的示例实施例的限制。
申请概述
如前所述，随着移动电子设备的普及，被应用于移动电子设备的用于帮助使用者获取影像的摄像模组的相关技术得到了迅猛的发展和进步。目前在市场中，消费者对于配置于移动电子设备(例如，智能手机)的摄像模组的功能要求越来越高和多样化，例如，防抖功能。
在使用移动电子设备进行摄像时，由于人体在正常情况下存在的一定频率的生理震颤和由于运动产生的抖动，会导致摄像效果下降，因此，移动电子设备通常配有防抖马达以驱动光学镜头和/或感光芯片移动实现防抖功能。
而随着对摄像模组的成像质量要求越来越高，光学镜头的体积和重量越来越大，对防抖马达的驱动力要求也越来越高。而当前移动电子设备对摄像模组的体积也有很大的限制，防抖马达的占用体积随着镜头的增大而相应的增加。换句话说，在光学镜头向更大体积、更大重量发展的趋势下，防抖马达所能提供的驱动力却难以相应地增加。
在驱动力受限的前提下，镜头越重，防抖马达能够驱动光学镜头移动的行程越短，影响防抖能力。另一方面，光学镜头越重，防抖马达能够驱动光学镜头移动的速度也越慢，光学镜头到达预定的补偿位置的时间也越长，这也会影响防抖效果。
在现有的解决方案中提出可以通过驱动感光芯片来实现光学防抖。具体地，尽管感光芯片也向着大尺寸的方向发展，然而，感光芯片的重量远轻于光学镜头的重量，因此，可以通过驱动感光芯片以满足光学防抖对驱动行程和驱动速度的需求。
进一步地，在现有的通过驱动感光芯片来实现光学防抖的技术方案中，组装工序复杂，对各个部件的尺寸精度、定位精度要求较高。例如，用于驱动感光组件的驱动马达通过其与感光组件中的线路板之间电连接结构实现电导通，为此，一些设计方案中，对驱动马达的部件进行开槽等工序以使得电连接结构穿过所述线路板和驱动马达之间的槽体电连接于所述感光组件和驱动马达之间，并且，在开槽方案中，对槽体周围的各个部件的位置、尺寸均提出相应的要求。
基于此，本申请提出可以通过集成的方式将导电结构和其他部件通过所述驱动组件通过一体成型的方式将多个部件结合在一起，以降低驱动组件的结构复杂度，简化组装工艺。且通过这样的方式可以确定导电结构与其他部 件之间的位置关系，提高各个部件之间的位置关系的稳定性，进而提高用于驱动感光芯片的驱动组件的整体结构稳定性。
示例性摄像模组
如图1所示，根据本申请实施例的摄像模组1被阐明，其包括感光组件40、被保持于所述感光组件40的感光路径上的光学镜头10，以及用于驱动所述光学镜头10和/或所述感光组件40移动以实现光学性能调整的驱动组件，例如，光学防抖、光学对焦等。
相应地，所述光学镜头10包括镜筒11和被安装于所述镜筒11内的镜片组12，所述镜片组12包括至少一光学镜片，所述至少一光学镜片的数量可以为一个或者多个，并不受限。
所述驱动组件包括芯片驱动马达30，所述芯片驱动马达30适于驱动所述感光组件40平移和/或旋转，从而实现所述摄像模组1的芯片防抖功能。
所述芯片驱动马达30包括芯片防抖固定部31、芯片防抖可动部33、芯片驱动元件32以及芯片防抖导电部35，所述芯片防抖固定部31具有一容纳腔以容纳所述芯片防抖可动部33、所述芯片驱动元件32以及所述芯片防抖导电部35，所述芯片防抖导电部35提供所述芯片驱动元件32电流，所述芯片驱动元件32用于驱动所述芯片防抖可动部33相对所述芯片防抖固定部31在所述芯片防抖固定部31的收容腔内进行移动。所述感光组件40与所述芯片防抖可动部33相固定，从而所述芯片驱动元件32驱动所述感光组件40相对所述芯片防抖固定部31运动。
所述驱动组件还包括镜头驱动马达20，所述镜头驱动马达20适于驱动所述光学镜头10平移和/或旋转，从而实现所述摄像模组1的镜头对焦、镜头防抖等功能。所述镜头驱动马达20包括镜头驱动固定部、镜头驱动可动部、镜头驱动元件以及镜头驱动导电部，所述镜头驱动固定部具有一容纳腔以容纳所述镜头驱动可动部、所述镜头驱动元件以及镜头驱动导电部，所述镜头驱动导电部提供所述镜头驱动元件驱动电源，所述镜头驱动元件驱动所述镜头驱动可动部相对所述镜头驱动固定部运动。所述光学镜头10与所述镜头驱动可动部相固定，从而所述镜头驱动元件驱动所述光学镜头10相对所述镜头驱动固定部运动，例如，驱动所述光学镜头10沿其光轴移动实现镜头对焦功能；或者，驱动所述光学镜头10沿垂直其光轴的方向平移或驱 动所述光学镜头10绕垂直其光轴的方向旋转实现镜头防抖功能。所述镜头驱动马达20通过所述镜头驱动固定部固定于所述芯片驱动马达30的芯片防抖固定部31，从而使所述光学镜头10设置于所述感光组件40的感光路径上。
在本申请的一个实施方式中，所述摄像模组1中没有设置镜头驱动马达20，所述光学镜头10直接安装于所述芯片驱动马达30的芯片防抖固定部31，或者，所述光学镜头10通过支持件间接安装于所述芯片驱动马达30的芯片防抖固定部31，从而使所述光学镜头10设置于所述感光组件40的感光路径上。
所述感光组件40包括线路板41及电连接于所述线路板41的感光芯片42以及电子元件43，所述感光芯片42用于接收所述光学镜头10采集的外界光线成像并通过所述线路板41与外部移动电子设备电连接。在本申请的一个实施例中，所述电子元件43可以是电阻、电容等无源电子器件和驱动芯片、存储芯片等有源电子器件中的一种或者多种，所述电子元件43可以电连接于所述线路板41的正面，也可以电连接于所述线路板41的背面，视所述摄像模组1的设计需求决定。
所述感光芯片42直接或者间接地固定于所述线路板41，所述感光芯片42包括感光区和非感光区，所述感光芯片42通过位于所述非感光区的芯片焊盘电连接于所述线路板41，例如，所述感光芯片42可以通过引线键合(打金线)、焊接、FC工艺(芯片倒装)或者RDL(再布线层技术)等方式电连接于所述线路板41。
在本申请的一个实施例中，所述线路板41包括线路板主体411、连接带412以及补强板413。所述连接带412连接并电导通所述线路板主体411，从而将所述感光芯片42获取的成像信息通过所述线路板主体411和所述连接带412向外部移动电子设备传输。所述补强板413可以固定于所述线路板主体411的背面，从而增加所述线路板主体411的结构强度。所述线路板主体411包括一位于中间的线路板通孔4111，所述线路板主体411的底面通过例如粘接的方式固定所述补强板413，所述补强板413与所述线路板主体411形成一安装腔容纳所述感光芯片42，从而避免了所述线路板主体411的厚度对所述感光组件40厚度的影响，降低了所述摄像模组1高度。
在本申请的一个具体实施例中，所述连接带412包括第一连接带4121和第二连接带4122，所述第一连接带4121和所述第二连接带4122分别从所述线路板主体411的相对的两侧向外延伸，并可以进一步向上弯折，这种设置方式可以使得所述线路板主体411在移动过程中保持平稳，进一步减小驱动所述线路板41移动时的阻力。当然，在本申请的另一具体示例中，所述第一连接带4121和所述第二连接带4122可以从所述线路板主体411的相邻的两侧向外延伸并向上弯折，本申请对此不做限制。
所述感光组件40进一步包括滤光元件44，所述滤光元件44被保持于所述感光芯片42的感光路径上，用于对进入所述感光芯片42的成像光线进行过滤。在一个具体的示例中，所述滤光元件44被安装固定于所述感光组件40的底座45且对应于所述感光芯片42的至少感光区域，所述滤光元件44可以被正贴或者倒贴于所述底座45，所述底座45具有一通光孔，从而所述光学镜头10的光线可以穿过所述底座45的通光孔入射所述感光芯片42。
所述感光组件40可以通过所述线路板41(所述线路板主体411)或者所述底座45固定于所述芯片驱动马达30的芯片防抖可动部33，从而所述感光组件40随所述芯片防抖可动部33的运动而运动。
示例性芯片驱动马达
图2至图7示出了本申请芯片驱动马达30的一个实施例，所述芯片驱动马达30包括芯片防抖固定部31、芯片防抖可动部33、芯片驱动元件32以及芯片防抖导电部35。
所述芯片驱动元件32以分别连接所述芯片防抖可动部33和所述芯片防抖固定部31的方式被设置于所述芯片防抖可动部33与所述芯片防抖固定部31之间，所述芯片防抖导电部35电连接所述芯片驱动元件32和所述感光组件40，并提供所述芯片驱动元件32驱动电源以驱动所述芯片防抖可动部33在X轴方向(即，X轴所设定的方向)和Y轴方向(即，Y轴所设定的方向)上平移和/或绕Z轴方向(即，Z轴所设定的方向)旋转，以实现所述感光组件40的平移防抖和/或旋转防抖。值得一提的是，在本申请实施例中，X轴方向和Y轴方向相互垂直，Z轴方向垂直于X轴方向和Y轴方向所在平面，Z轴方向也是所述光学镜头10的光轴的方向，换言之，X轴、 Y轴和Z轴构成了三维立体坐标系，X轴方向和Y轴方向所在的XOY平面也称为水平方向所在平面。
如图2至图3B所示，在本申请的一个实施例中，所述芯片防抖固定部31包括相互扣合以形成收容腔的上盖311和基底312。也就是，所述芯片防抖固定部31包括相互扣合的上盖311和基底312。所述上盖311和所述基底312相互固定并形成所述容纳腔(也即所述芯片防抖固定部31的容纳腔)容置所述芯片防抖可动部33、所述芯片驱动元件32、芯片防抖导电部35以及感光组件40等摄像模组部件，不仅可以保护上述摄像模组部件，还可以减少灰尘、脏污或杂散光进入所述芯片驱动马达30的内部。在本申请的一个具体示例中，所述上盖311和所述基底312的材质可以为例如无磁不锈钢等金属材料。
具体地，在本申请实施例中，所述上盖311设置于所述基底312的上方，所述上盖311包括中心具有一开口的盖体主体3111，所述开口对应于所述感光组件40，以使得光线能够通过所述开口进入所述感光组件40以进行成像，优选地，所述开口呈圆形形状。进一步的，所述上盖311还可以包括自所述盖体主体3111一体向所述基底312方向延伸的盖体周侧3112，从而通过所述盖体周侧3112固定连接于所述基底312，例如，通过激光熔接或者粘合介质粘接的方式固定所述盖体周侧3112与所述基底312。所述盖体周侧3112还包括至少一周侧凹部31121，这样，所述上盖311与所述基底312之间形成至少一连接带412出口提供所述线路板41的连接带412从所述芯片防抖固定部31的容纳腔内向外伸出，在本申请的一个具体示例中，所述盖体周侧3112包括相对设置的两个周侧凹部31121，所述上盖311与所述基底312之间形成两个连接带412出口提供所述线路板41的第一连接带4121和第二连接带4122从所述芯片防抖固定部31的容纳腔内向外伸出。
图4A为沿图2中虚线AA的剖面示意图，图4B为图4A中圆形区域A的放大示意图，如图3A至图4B所示，所述芯片防抖可动部33包括芯片可动载体331，所述芯片可动载体331具有相对的上表面和下表面。所述芯片可动载体331与所述上盖311之间设有所述芯片驱动元件32，所述芯片驱动元件32驱动所述芯片可动载体331相对所述芯片防抖固定部31运动；所述芯片可动载体331与所述基底312之间设有所述感光组件40，所述感 光组件40通过所述线路板41被安装于所述芯片可动载体331，进而所述感光组件40随着所述芯片可动载体331移动。在本申请的实施例中，所述感光组件40的底面(即所述感光组件40靠近所述基底312的一侧)与所述基底312之间存在一定的空气间隙，这样，所述感光组件40的运动不易被所述基底312阻碍，减小芯片驱动元件32的驱动力需求，换言之，所述感光组件40悬持在所述基底312的上方。
在本申请实施例中，所述芯片防抖可动部33被悬持地设置于所述芯片防抖固定部31的收容腔内，以使得所述芯片防抖可动部33可相对于所述芯片防抖固定部31活动。
如图6A所示，所述芯片防抖可动部33的芯片可动载体331包括相固定的芯片载体主体3311和自所述芯片载体主体3311的周缘往下延伸的芯片载体侧部3312。所述线路板41固定于所述芯片载体主体3311的底面(即朝向所述基底312一侧)，所述芯片载体主体3311具有一载体主体通孔33111，所述载体主体通孔33111适于提供所述感光组件40的感光芯片42一通光路径并还可以提供所述感光组件40上的电子元件43安装空间，防止所述电子元件43与所述芯片载体主体3311相互干涉。所述芯片载体侧部3312包括从所述芯片载体主体3311一体向外延伸的第一载体侧部33121、第二载体侧部33122、第三载体侧部33123和第四载体侧部33124。所述第一载体侧部33121与所述第二载体侧部33122相对设置并与所述第三载体侧部33123和所述第四载体侧部33124相邻，所述第三载体侧部33123与所述第四载体侧部33124相对设置。所述第一载体侧部33121、所述第二载体侧部33122所述第三载体侧部33123和所述第四载体侧部33124适于成为所述芯片载体主体3311运动时的防撞部件，避免所述芯片载体主体3311直接与所述芯片防抖固定部31相撞击。
在本申请的一个实施例中，所述芯片载体侧部3312(第一载体侧部33121、第二载体侧部33122、第三载体侧部33123和第四载体侧部33124)进一步向所述基底312方向延伸，所述芯片载体侧部3312低于所述芯片载体主体3311的底面，从而使得所述线路板41通过粘合介质贴装固定于芯片载体主体3311的底面时，所述芯片载体侧部3312与所述芯片载体主体3311之间形成的空间可以容纳部分溢出的粘合介质，减少粘合介质溢出至所述芯片载体侧部3312的外侧的几率，并且所述芯片载体侧部3312向所述 基底312方向延伸还可以增加所述芯片可动载体331的侧面面积，使得所述芯片可动载体331与所述芯片防抖固定部31之间的撞击面积增加。进一步地，为使所述连接带412可以向外伸出，所述第一载体侧部33121和所述第二载体侧部33122分别具有一连接带避让凹槽33125，提供所述第一连接带4121和所述第二连接带4122向外延伸的通道。
如图5所示，所述芯片驱动元件32包括芯片磁石组件321和芯片线圈组件322，其中，所述芯片线圈组件322被设置于所述芯片防抖可动部33，所述芯片磁石组件321被固定于所述芯片防抖固定部31且对应于所述芯片线圈组件322。所述芯片磁石组件321通过例如粘合介质粘接的方式固定于所述芯片防抖固定部31的上盖311，所述芯片线圈组件322固定于所述芯片防抖可动部33的芯片可动载体331，所述芯片磁石组件321与所述芯片线圈组件322相对设置，从而通过所述芯片线圈组件322与所述芯片磁石组件321之间的磁场力驱动所述芯片防抖可动部33相对所述芯片防抖固定部31运动。
进一步地，对芯片驱动元件32的具体结构进行说明，每一所述芯片线圈组包括至少一芯片线圈。参考图5所示，在本申请的一个实施方式中，所述芯片线圈组件322包括第一芯片线圈组3221、第二芯片线圈组3222和第三芯片线圈组3223，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223设置于X轴和Y轴所在平面，即所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223沿水平方向设置。所述第一芯片线圈组3221沿Y轴方向设置，所述第二芯片线圈组3222沿X轴方向设置，所述第三芯片线圈组3223沿X轴方向设置，所述第二芯片线圈组3222与所述第三芯片线圈组3223沿Y轴方向相对设置，进一步地，所述第二芯片线圈组3222与所述第三芯片线圈组3223相对于Y轴对称。所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223围绕感光组件40的四周设置。
所述感光组件40的感光芯片42的外形为包含有长边和宽边的矩形结构，所述感光组件40的外形边缘可以定义有第一边、第二边、第三边及第四边，以所述感光芯片42的中心为原点，建立直角坐标系，第一边和第二边与X轴方向平行，第三边与第四边与Y轴方向平行。
所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片 线圈组3223分别包括至少一个芯片线圈。也就是，所述第一芯片线圈组3221包括至少一芯片线圈，所述第二芯片线圈组3222包括至少一芯片线圈，所述第三芯片线圈组3223包括至少一芯片线圈。例如，在本申请的一个具体示例中，所述第一芯片线圈组3221包括第一芯片线圈32211和第二芯片线圈32212，所述第一芯片线圈32211和所述第二芯片线圈32212沿Y轴方向相对平行设置；所述第二芯片线圈组3222包括第三芯片线圈32221和第四芯片线圈32222，所述第三芯片线圈32221和所述第四芯片线圈32222沿X轴方向相对平行设置；所述第三芯片线圈组3223包括第五芯片线圈32231和第六芯片线圈32232，所述第五芯片线圈32231和所述第六芯片线圈32232沿X轴方向相对平行设置；所述第三芯片线圈32221和所述第五芯片线圈32231沿X轴方向排列；所述第四芯片线圈32222和所述第六芯片线圈32232沿X轴方向排列。也可以说，所述第一芯片线圈32211和所述第二芯片线圈32212分别设置于所述感光组件40的第三边和第四边，所述第一芯片线圈32211和所述第二芯片线圈32212分别与第三边和第四边平行设置；所述第三芯片线圈32221和所述第五芯片线圈32231设置于所述感光组件40的第二边，所述第三芯片线圈32221和所述第五芯片线圈32231与第二边平行设置；所述第四芯片线圈32222和所述第六芯片线圈32232设置于所述感光组件40的第一边，所述第四芯片线圈32222和所述第六芯片线圈32232与第一边平行设置。
所述第一芯片线圈32211与所述第二芯片线圈32212共同作用驱动所述芯片防抖可动部33沿X轴方向移动，所述第三芯片线圈32221、所述第四芯片线圈32222、所述第五芯片线圈32231和所述第六芯片线圈32232共同作用驱动所述芯片防抖可动部33沿Y轴方向移动和/或绕Z轴方向旋转。
优选地，所述第一芯片线圈32211与所述第二芯片线圈32212的尺寸相同，所述第三芯片线圈32221、所述第四芯片线圈32222、所述第五芯片线圈32231和所述第六芯片线圈32232的尺寸相同，所述第一芯片线圈32211与所述第二芯片线圈32212的尺寸大于所述第三芯片线圈32221、所述第四芯片线圈32222、所述第五芯片线圈32231和所述第六芯片线圈32232的尺寸。
在本申请的一个实施例中，所述芯片线圈组件322还包括线圈电路板 3224，所述芯片线圈组件322中至少一芯片线圈被固定且电连接于所述线圈电路板3224。在本申请的一个具体示例中，所述第一芯片线圈组3221(所述第一芯片线圈32211、所述第二芯片线圈32212)、所述第二芯片线圈组3222(所述第三芯片线圈32221、所述第四芯片线圈32222)和所述第三芯片线圈组3223(所述第五芯片线圈32231、所述第六芯片线圈32232)均固定并电连接于所述线圈电路板3224，所述芯片线圈组件322通过所述线圈电路板3224电连接于所述芯片防抖导电部35从而进一步电连接于所述感光组件40的线路板41。具体地，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223可以是绕制成型的线圈固定电连接于所述线圈电路板3224；或者，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223可以是直接在所述线圈电路板3224上绕制成型；或者，所述第一芯片线圈组3221、所述第二芯片线圈组3222和所述第三芯片线圈组3223是直接在所述线圈电路板3224上蚀刻而成，形成平面线圈(FP-Coil)，该方式可以降低所述芯片线圈组件322的高度，从而降低所述芯片驱动马达30的高度。
所述线圈电路板3224具有一电路板通光孔32241，所述电路板通光孔32241提供所述光学镜头10的光线入射所述感光组件40一通光孔。进一步如图4C所示，图4C为沿图2中虚线BB的剖面示意图，所述线圈电路板3224还包括至少一定位孔32242，所述至少一定位孔32242与所述芯片载体主体3311上的至少一定位柱33115相配合，使所述线圈电路板3224可以精准定位并安装于所述芯片载体主体3311上。在本申请的一个具体示例中，所述线圈电路板3224包括两个定位孔32242，所述芯片载体主体3311上包括两个从所述芯片载体主体3311一体向外突出的定位柱33115，两个所述定位孔32242分别套接于两个所述定位柱33115，从而使所述线圈电路板3224精确定位于所述芯片载体主体3311。
相应的，在本申请的一个实施例中，所述芯片磁石组件321包括第一芯片磁石组3211、第二芯片磁石组3212和第三芯片磁石组3213，所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213设置于X轴和Y轴所在平面上(即沿水平方向设置)。进一步的，所述第一芯片磁石组3211与所述第一芯片线圈组3221上下相对设置，所述第二芯片磁石组3212与所述第二芯片线圈组3222上下相对设置，所述第三芯 片磁石组3213与所述第三芯片线圈组3223上下相对设置，使得各芯片线圈位于对应芯片磁石的磁场中。这样，所述第一芯片磁石组3211沿Y轴方向设置，所述第二芯片磁石组3212和所述第三芯片磁石组3213沿X轴方向设置，所述第二芯片磁石组3212与所述第三芯片磁石组3213沿Y轴方向相对设置，所述第二芯片磁石组3212与所述第三芯片磁石组3213相对于Y轴对称。在本申请中，上方为远离所述感光组件40的一侧，下方为靠近所述感光组件40的一侧。
所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213分别包括至少一个芯片磁石。例如，在本申请的一个具体示例中，所述第一芯片磁石组3211包括第一芯片磁石32111和第二芯片磁石32112，所述第一芯片磁石32111和所述第二芯片磁石32112沿Y轴方向相对平行设置；所述第二芯片磁石组3212包括第三芯片磁石32121和第四芯片磁石32122，所述第三芯片磁石32121和所述第四芯片磁石32122沿X轴方向相对平行设置；所述第三芯片磁石组3213包括第五芯片磁石32131和第六芯片磁石32132，所述第五芯片磁石32131和所述第六芯片磁石32132沿X轴方向相对平行设置；所述第三芯片磁石32121和所述第五芯片磁石32131沿X轴方向排列；所述第四芯片磁石32122和所述第六芯片磁石32132沿X轴方向排列。更具体地，在本申请实施例中，所述第一芯片磁石组3211设置于所述感光组件40的沿Y轴方向的相对的两边处，所述第二芯片磁石组3212和所述第三芯片磁石组3213设置于所述感光组件40的沿X轴方向的四角处。
所述第一芯片磁石32111和所述第二芯片磁石32112共同作用驱动所述芯片防抖可动部33沿X轴方向移动，所述第三芯片磁石32121、所述第四芯片磁石32122、所述第五芯片磁石32131和所述第六芯片磁石32132共同作用驱动所述芯片防抖可动部33沿Y轴方向移动和/或绕Z轴方向旋转。
优选地，所述第一芯片磁石32111和所述第二芯片磁石32112的尺寸相同，所述第三芯片磁石32121、所述第四芯片磁石32122、所述第五芯片磁石32131和所述第六芯片磁石32132尺寸相同，所述第一芯片磁石32111和所述第二芯片磁石32112的尺寸大于所述第三芯片磁石32121、所述第四芯片磁石32122、所述第五芯片磁石32131和所述第六芯片磁石32132尺 寸。
所述第一芯片线圈组3221和所述第一芯片磁石组3211相互作用，带动所述芯片防抖可动部33，进而带动所述感光组件40在X轴方向上平移；所述第二芯片线圈组3222和所述第二芯片磁石组3212相互作用、所述第三芯片线圈组3223和所述第三芯片磁石组3213相互作用，共同带动所述芯片防抖可动部33，进而带动所述感光组件40在Y轴方向上平移和/或绕Z轴方向旋转。
在本申请的一个实施例中，所述芯片磁石组件321还包括设置于所述第一芯片磁石组3211、所述第二芯片磁石组3212、所述第三芯片磁石组3213和所述上盖311之间的导磁构件3214，所述第一芯片磁石组3211、所述第二芯片磁石组3212和所述第三芯片磁石组3213通过所述导磁构件3214被间接固定于所述上盖311，所述导磁构件3214适于增强所述芯片磁石组件321面对所述线圈磁石组件方向的磁场力，从而增强所述芯片驱动元件32的驱动力。在本申请的一个具体示例中，所述导磁构件3214包括六个导磁单元，六个所述导磁单元分别设置于所述第一芯片磁石32111与所述上盖311之间、所述第二芯片磁石32112与所述上盖311之间、所述第三芯片磁石32121与所述上盖311之间、所述第四芯片磁石32122与所述上盖311之间、所述第五芯片磁石32131与所述上盖311之间、所述第六芯片磁石32132与所述上盖311之间，所述导磁单元呈“U”包裹芯片磁石靠近所述上盖311的顶面和芯片磁石面积最大的两个侧面。在本申请的其他实施例中，所述导磁单元也可以仅包裹芯片磁石靠近所述上盖311的顶面，也可以包括芯片磁石靠近所述上盖311的顶面和芯片磁石的四个侧面，本申请并不为此所限。
在本申请的一个实施例中，所述芯片驱动马达30还包括芯片位置感测组件36和芯片保持组件34，所述芯片位置感测组件36用于获取所述感光组件40的位置或者运动信息，所述芯片保持组件34适于使所述芯片可动载体331被悬持于所述芯片防抖固定部31中，这样，所述感光组件40可以被所述芯片保持组件34悬持于所述芯片防抖固定部31中。
如图6A所示，所述芯片位置感测组件36固定于所述芯片可动载体331。当所述芯片可动载体331运动时，所述芯片位置感测组件36适于通过获取芯片磁石组件321的磁场变化获取所述芯片可动载体331的位置信 息。
所述位置感测元件包括至少一位置感测元件，所述位置感测元件的数量并不为本申请所局限。在本申请的一个具体示例中，所述芯片位置感测组件36包括第一位置感测元件361、第二位置感测元件362和第三位置感测元件363，从而用于感测所述芯片可动载体331沿X轴方向平移、沿Y轴方向平移和绕Z轴方向旋转三种移动的位置信息。在本申请实施例中，所述第一位置感测元件361、所述第二位置感测元件362和所述第三位置感测元件363为霍尔元件；在本申请其他实施例中，所述第一位置感测元件361、所述第二位置感测元件362和所述第三位置感测元件363为含有位置感测功能的驱动芯片。
如图6B所示，所述芯片保持组件34包括芯片支撑组件341和芯片磁吸组件342。所述芯片支撑组件341被设置于所述芯片可动载体331和所述上盖311之间，所述芯片磁吸组件342固定于所述芯片防抖可动部33的芯片可动载体331，这样，所述芯片磁吸组件342与所述芯片磁石组件321之间的磁吸力使所述芯片防抖可动部33吸附向所述上盖311。所述芯片支撑组件341设置于所述芯片防抖固定部31的上盖311与所述芯片防抖可动部33的芯片可动载体331之间，在所述芯片磁吸组件342与所述芯片磁石组件321之间的磁吸力的作用下，所述芯片支撑组件341被所述上盖311和所述芯片可动载体331夹持，所述芯片可动载体331与所述上盖311之间保持间隙，从而减小所述芯片防抖可动部33在运动时的阻力。
在本申请实施例中，所述芯片支撑组件341包括凹陷地形成于所述芯片可动载体331的滚珠槽3412以及被设置于所述滚珠槽3412内的滚珠3411。所述滚珠3411和滚珠槽3412的数量并不为本申请所局限，在本申请的一个实施例中，所述芯片支撑组件341包括至少三个设置于所述芯片可动载体331和所述上盖311之间的滚珠3411，为限制所述滚珠3411的移动范围，所述芯片支撑组件341还包括至少三个与至少三个所述滚珠3411相对应的滚珠槽3412，优选地，至少三个所述滚珠槽3412形成于所述芯片可动载体331，所述滚珠槽3412的深度小于所述滚珠3411的直径，所述滚珠3411的至少一部分可以突出于所述滚珠槽3412，以使得所述滚珠3411可以与所述上盖311保持摩擦接触。
进一步地，所述芯片可动载体331还包括突出地形成于所述芯片载体主 体3311的上表面的延伸柱3313，所述滚珠槽3412凹陷地形成于所述延伸柱3313的上表面。在本申请的一个实施例中，所述芯片可动载体331包括形成于所述芯片载体主体3311上的至少三延伸柱3313，至少三所述延伸柱3313突出于所述芯片载体主体3311的上表面，至少三所述滚珠槽3412形成于至少三所述延伸柱3313。所述芯片支撑组件341设置于所述延伸柱3313与所述上盖311之间，以使得所述芯片可动载体331与所述上盖311之间保持一定的间隙，该间隙不随所述芯片可动载体331的移动而发生改变。
在本申请的一个具体示例中，所述芯片可动载体331包括形成于所述芯片载体主体3311上的四个延伸柱3313，所述芯片支撑组件341包括四个由所述延伸柱3313的顶面下凹形成的四个滚珠槽3412和设置于四个所述滚珠槽3412和所述上盖311之间的四个滚珠3411。四个所述延伸柱3313分布在所述芯片载体主体3311较长的两侧上，从而减小所述芯片载体主体3311的尺寸。
进一步参照图4A和图4B，所述芯片支撑组件341还包括内嵌于所述芯片可动载体331内且位于所述滚珠槽3412的底部的滚珠支撑片3413，所述滚珠3411被支持于所述滚珠支撑片3413。在本申请的一个实施例中，所述芯片支撑组件341还包括至少三滚珠支撑片3413，所述滚珠支撑片3413固定于所述芯片可动载体331并作为所述滚珠槽3412的底面，所述滚珠支撑片3413可以是不锈钢等金属材质，进而提供所述滚珠3411一更平滑的支撑面，减小滚珠3411滚动的摩擦力。在本申请的具体示例中，所述芯片支撑组件341包括四个滚珠支撑片3413，每个滚珠支撑片3413通过嵌件成型的方式固定于所述芯片可动载体331的延伸柱3313中并裸露其上表面作为每个滚珠槽3412的底面，进一步参照图6E，所述滚珠支撑片3413包括支撑片主体34131和支撑片连接部34132，所述支撑片主体34131和所述支撑片连接部34132一体延伸，所述支撑片主体34131的上表面裸露并作为所述滚珠槽3412的底面。所述支撑片连接部34132用于在嵌件成型工艺中保持所述滚珠支撑片3413在所述芯片可动载体331中的位置，所述支撑片连接部34132可以连接其他滚珠支撑片3413的支撑片连接部34132或者连接其他用于支撑所述支撑片连接部34132的支持部件。在所述滚珠支撑片3413通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述 支撑片连接部34132，所述支撑片连接部34132的一部分可以裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述滚珠支撑片3413包括位于所述滚珠槽3412的底部的支撑片主体34131和从所述支撑片主体34131延伸至所述芯片可动载体331外的支撑片连接部34132。
如图6A、图6B和图6E所示，在本申请的一些实施方式中，所述芯片磁吸组件342包括至少一个芯片磁吸元件3421。所述芯片磁吸元件3421被包覆于所述芯片防抖可动部33内，以通过所述至少一芯片磁吸元件3421与所述芯片磁石组件321之间的磁吸力使得所述芯片防抖可动部33被悬持地设置于所述芯片防抖固定部31的收容腔内。在本申请的一个具体示例中，至少一个所述芯片磁吸元件3421通过嵌件成型工艺内嵌于所述芯片防抖可动部33的芯片可动载体331内，至少一个所述芯片磁吸元件3421与所述芯片磁石组件321相对设置，以在至少一个所述芯片磁吸元件3421与所述芯片磁石组件321之间产生沿Z轴方向的磁吸力，进而通过所述至少一芯片磁吸元件3421与所述芯片磁石组件321之间的磁吸力使得所述芯片防抖可动部33的芯片可动载体331吸附向所述上盖311。且通过所述至少一芯片磁吸元件3421与所述芯片磁石组件321之间的磁吸力，所述滚珠3411被夹持于所述上盖311和所述芯片可动载体331之间，使得所述芯片支撑组件341被夹持在所述芯片防抖固定部31和所述芯片防抖可动部33之间。所述芯片磁吸元件3421有具有导磁性质的材料制成，其适于与磁石之间产生磁吸力。
所述芯片磁吸元件3421包括磁吸元件主体34211和磁吸元件连接部34212，所述磁吸元件主体34211和所述磁吸元件连接部34212一体延伸，所述磁吸元件连接部34212用于在嵌件成型工艺中保持所述芯片磁吸元件3421在所述芯片可动载体331中的位置，所述磁吸元件连接部34212可以连接其他芯片磁吸元件3421的磁吸元件连接部34212或者连接其他用于支撑所述磁吸元件连接部34212的支持部件。在所述芯片磁吸元件3421通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述磁吸元件连接部34212，所述磁吸元件连接部34212的一部分可以裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述芯片磁吸元件3421包括被包覆于所述芯片可动载体331内的磁吸元件主体34211和从所述磁吸元件主体34211延伸至所述芯片可动载体331外的磁吸元件连接部 34212。
在本申请的一个实施例中，所述芯片磁吸元件3421的上表面裸露，未被所述芯片可动载体331包裹，如图6A中所示；在本申请的其他实施例中，所述芯片磁吸元件3421的上表面也可以被所述芯片可动载体331包裹，本申请并不为此所限。
在本申请的一个具体示例中，所述芯片磁吸组件342包括八个芯片磁吸元件3421，每两个所述芯片磁吸元件3421设置于所述滚珠3411的两侧，且每个所述滚珠3411的两侧的芯片磁吸元件3421形状相同，从而提供均匀、稳定的磁吸力，使所述芯片可动载体331被平稳的吸附向所述上盖311。
在本申请中，所述芯片可动载体331可以与所述滚珠支撑片3413嵌件成型，可以与所述芯片磁吸元件3421嵌件成型，为减少芯片驱动马达30的部品数量，所述芯片防抖导电部35也可以通过嵌件成型的方式嵌入所述芯片防抖可动部33。
因此，本申请将所述芯片防抖导电部35通过例如嵌件成型的方式嵌入所述芯片防抖可动部33，提供一具有导电功能的芯片防抖可动部33，使得所述芯片线圈组件322可以通过所述芯片防抖可动部33与所述线路板41电连接。并且由于所述芯片防抖导电部35通过嵌件成型的方式嵌入所述芯片防抖可动部33，所述芯片防抖可动部33适于提供两个平整的安装面用于安装固定所述芯片线圈组件322和所述线路板41，且还能够减少所述芯片防抖马达的部件数量，减少所述芯片防抖马达的组装复杂程度，并保护芯片防抖导电部35。
具体地，图6A至图6B示出了所述芯片防抖可动部33与所述芯片防抖导电部35的嵌入结构。所述芯片防抖导电部35包括线圈导电组件351和感测元件导电组件352。所述线圈导电组件351包括被包覆于所述芯片防抖可动部33内的至少一线圈导电元件3511。在本申请的一个实施例中，所述线圈导电组件351包括多个(两个及两个以上)线圈导电元件3511，如图6C所示。多个所述线圈导电元件3511通过例如注塑(Insert Molding)工艺，以嵌件成型的方式嵌入于所述芯片可动载体331，多个所述线圈导电元件3511可以电连接所述芯片线圈组件322和所述线路板41。所述感测元件导电组件352包括被包覆于所述芯片可动载体331内的至少一感测元件导电元件3521。在本申请的一个实施例中，所述感测元件导电组件352包括多 个(两个及两个以上)感测元件导电元件3521，多个所述感测元件导电元件3521通过例如注塑工艺，以嵌件成型的方式嵌入于所述芯片可动载体331，多个所述感测元件导电元件3521可以电连接所述芯片位置感测组件36和所述线路板41。
所述线圈导电组件351中所述线圈导电元件3511的数量与所述芯片线圈组件322所述需要的电路数量有关，在本申请的一个具体示例中，所述线圈导电组件351包括6个线圈导电元件3511。每一所述线圈导电元件3511具有被暴露的第一线圈导电端部35111、与所述第一线圈导电端部35111相对的且被暴露的第二线圈导电端部35113，以及，延伸并电导通于所述第一线圈导电端部35111和所述第二线圈导电端部35113之间的线圈导电延伸部35112，所述第一线圈导电端部35111的位置高于所述第二线圈导电端部35113，所述线圈导电延伸部35112从所述第一线圈导电端部35111向下延伸至所述第二线圈导电端部35113。当所述线圈导电元件3511嵌入所述芯片可动载体331中时，所述芯片可动载体331不覆盖所述第一线圈导电端部35111的上表面，所述第一线圈导电端部35111的上表面裸露，用于与所述芯片线圈组件322电连接，所述芯片可动载体331不覆盖所述第二线圈导电端部35113的下表面，所述第二线圈导电端部35113的下表面裸露，用于与所述线路板41电连接，进而电导通所述芯片线圈组件322和所述线路板41。在本申请的一些实施方式中，所有所述线圈导电元件3511中至少部分线圈导电元件3511的第一线圈导电端部35111被暴露于所述芯片可动载体331的上表面，所述第二线圈导电端部35113被暴露于所述芯片可动载体331的下表面。所述芯片线圈组件322的线圈电路板3224电连接于所述第一线圈导电端部35111，所述第二线圈导电端部35113适于电连接线路板41，通过这样的方式来实现所述芯片线圈组件322和所述线路板41之间的电导通。
在本申请实施例中，所述线圈导电元件3511的第一线圈导电端部35111组成所述芯片可动载体331的芯片载体主体3311的上导电部33112的一部分，所述线圈导电元件3511的第二线圈导电端部35113组成所述芯片可动载体331的芯片载体主体3311的下导电部33113的一部分。换言之，所述上导电部33112包括第一线圈导电端部35111，所述下导电部33113包括第二线圈导电端部35113。
进一步地，为了在嵌件成型工艺中保持所述线圈导电组件351在所述芯片可动载体331中的位置，所述线圈导电元件3511还包括线圈导电连接部35114，所述线圈导电连接部35114可以连接其他线圈导电元件3511的线圈导电连接部35114或者连接其他用于支撑所述线圈导电连接部35114的支持部件。在所述线圈导电组件351通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述线圈导电连接部35114，所述线圈导电连接部35114的一部分裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述线圈导电元件3511进一步包括从由所述第一线圈导电端部35111、所述第二线圈导电端部35113和所述线圈导电延伸部35112形成的线圈导电主体延伸至所述芯片可动载体331外的线圈导电连接部35114。
在本申请的一个实施例中，所述第一线圈导电端部35111、第二线圈导电端部35113、所述线圈导电延伸部35112和所述线圈导电连接部35114由导电材质一体成型而成。在本申请的另一个实施例中，所述线圈导电元件3511未设有所述线圈导电连接部35114，进而所述第一线圈导电端部35111、第二线圈导电端部35113和所述线圈导电延伸部35112由导电材质一体成型而成。
参照图6A、图6B及图6D，所述感测元件导电组件352中的感测元件导电元件3521的数量与所述芯片位置感测组件36所需要的电路数量有关。在本申请的一个具体示例中，所述感测元件导电元件3521包括第一感测元件导电端部35211、与所述第一感测元件导电端部35211相对的第二感测元件导电端部35213，以及，延伸并电导通于所述第一感测元件导电端部35211和所述第二感测元件导电端部35213之间的感测元件导电延伸部35212。当所述感测元件导电元件3521嵌入所述芯片可动载体331中时，所述芯片可动载体331不覆盖所述第一感测元件导电端部35211的上表面，所述第一感测元件导电端部35211的上表面用于与所述芯片位置感测组件36电连接，所述芯片可动载体331不覆盖所述第二感测元件导电端部35213的下表面，所述第二感测元件导电端部35213的下表面裸露，用于与所述线路板41电连接，进而电导通所述感测元件导电组件352和所述线路板41。在本申请的一些实施方式中，所有所述感测元件导电元件3521中至少部分感测元件导电元件3521的第一感测元件导电端部35211被暴露于所述芯片 可动载体331的上表面，所述第二感测元件导电端部35213被暴露于所述芯片可动载体331的下表面。所述第一感测元件导电端部35211电连接于所述位置感测元件，所述第二感测元件导电端部35213适于电连接于所述线路板41，通过这样的方式来实现所述感测元件导电组件352和所述线路板41之间的电导通。
值得注意的是，在一个所述感测元件导电元件3521中，所述第一感测元件导电端部35211、所述第二感测元件导电端部35213和所述感测元件导电延伸部35212的数量可以为一个或者更多个，并不作为限制。
所述感测元件导电元件3521的第一感测元件导电端部35211组成所述芯片可动载体331的芯片载体主体3311的上导电部33112的一部分，所述第二感测元件导电端部35213组成所述芯片可动载体331的芯片载体主体3311的下导电部33113的一部分。换言之，所述上导电部33112包括第一线圈导电端部35111和第一感测元件导电端部35211，所述下导电部33113包括第二线圈导电端部35113和第二感测元件导电端部35213。
在本申请的一些实施例中，所述第一感测元件导电端部35211的位置低于所述第一线圈导电端部35111的位置。更明确地，所述第一感测元件导电端部35211在所述芯片可动载体331所设定的高度方向上低于所述第一线圈导电端部35111。这样，所述位置感测元件的高度可以被降低，甚至可以不突出于所述芯片可动载体331的上表面。具体地，所述芯片载体主体3311上形成有感测元件凹槽33114，所述芯片位置感测组件36设置于所述感测元件凹槽33114中，进而防止所述芯片位置感测组件36的高度过高，而所述第一感测元件导电端部35211与所述芯片位置感测组件36的底面电连接，因此，设置所述第一感测元件导电端部35211的位置低于所述第一线圈导电端部35111的位置，在高度(Z轴)方向上，所述位置感测元件被设置在所述芯片线圈组件322和所述线路板41之间。优选地，所述芯片位置感测组件36容置于所述感测元件凹槽33114中，不突出于所述感测元件凹槽33114。
为了在嵌件成型工艺中保持感测元件导电组件352在所述芯片可动载体331中的位置，所述感测元件导电组件352还包括感测元件导电连接部35214，所述感测元件导电连接部35214可以连接其他感测元件导电元件3521的感测元件导电连接部35214或者连接其他用于支撑所述感测元件导 电连接部35214的支持部件。在所述感测元件导电组件352通过嵌件成型工艺形成在所述芯片可动载体331中后，剪切所述感测元件导电连接部35214，所述感测元件导电连接部35214的一部分裸露在所述芯片可动载体331之外。也就是，在本申请的一些实施方式中，所述感测元件导电元件3521进一步包括从由所述第一感测元件导电端、所述第二感测元件导电端和所述感测元件导电延伸部35212形成的感测元件导电主体延伸至所述芯片可动载体331外的感测元件导电连接部35214。
在本申请的一个实施例中，所述第一感测元件导电端部35211、所述感测元件导电延伸部35212、所述第二感测元件导电端部35213和所述感测元件导电连接部35214由导电材质一体成型而成。在本申请的另一个实施例中，所述感测元件导电元件3521未设有所述感测元件导电连接部35214，进而所述第一感测元件导电端部35211、所述感测元件导电延伸部35212和所述第二感测元件导电端部35213由导电材质一体成型而成。
在本申请的一个实施例中，所述线圈导电组件351和所述感测元件导电组件352由相同的导电材质组成，且一起嵌件成型在所述芯片可动载体331中，因此，所述线圈导电组件351的多个线圈导电元件3511的线圈导电连接部35114和所述感测元件导电组件352的多个感测元件导电元件3521的感测元件导电连接部35214可以位于同一高度。也就是，所述感测元件导电连接部35214和所述线圈导电连接部35114在所述芯片可动载体331所设定的高度方向上一致。
在本申请的一个实施例中，所述滚珠支撑片3413、所述芯片磁吸组件342(包括所述磁吸元件)和所述芯片防抖导电部35(包括感测元件导电元件3521、所述线圈导电元件3511)均通过注塑工艺以嵌件成型的方式嵌合在所述芯片可动载体331中，与所述芯片可动载体331一体成型，减小了所述芯片驱动马达30的部品数量，进而简化了所述芯片驱动马达30的结构和组装复杂度。
值得一提的是，所述芯片磁吸组件342需要由具有导磁性的材料制成，而所述滚珠支撑片3413和所述芯片防抖导电部35(包括所述感测元件导电组件352和所述线圈导电组件351)需要由不具有导磁性的材料制成，因此，在嵌件成型工艺中，所述芯片磁吸组件342是同一层料带，而所述滚珠支撑片3413和所述芯片防抖导电部35是另一层料带，因此，在制成后，所述 芯片磁吸组件342的至少一芯片磁吸元件3421的磁吸元件连接部34212的高度与所述滚珠支撑片3413的支撑连接部和所述芯片防抖导电部35的线圈导电连接部35114和感测元件导电连接部35214的高度不一致。由此可见，所述芯片防抖导电部35的感测元件导电元件3521、线圈导电元件3511和所述滚珠支撑片3413不具有导磁性，所述磁吸组件的芯片磁吸元件3421具有导磁性，所述磁吸元件连接部34212与所述感测元件导电连接部35214、所述线圈导电连接部35114、所述支撑片连接部34132在所述芯片可动载体331所设定的高度方向上存在差异。
进一步地，对所述芯片可动载体331的安装及通电方式进行说明。在本申请的一个实施例中，通过在所述芯片可动载体331的上导电部33112上设置焊料(例如焊锡)与所述芯片线圈组件322的线圈电路板3224的背面上的焊盘电导通，通过在所述芯片可动载体331和所述线圈电路板3224之间设置粘合介质粘接固定所述线圈电路板3224和所述芯片可动载体331；通过在所述芯片可动载体331和所述线路板41之间设置粘合介质粘接固定所述芯片可动载体331和所述线路板41。如图7所示，所述芯片可动载体331的下导电部33113的至少一部分裸露，而后通过在焊料将所述芯片可动载体331背面的下导电部33113和所述线路板41的线路板主体411的侧面电导通。
综上，基于本申请实施例的驱动组件和摄像模组1被阐明，其中，所述驱动组件通过一体成型的方式将多个部件结合在一起，可降低驱动组件的结构复杂度，简化组装工艺。
本领域的技术人员应理解，上述描述及附图中所示的本申请的实施例只作为举例而并不限制本申请。本申请的目的已经完整并有效地实现。本申请的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本申请的实施方式可以有任何变形或修改。

Claims (17)

  1. 一种驱动组件，其特征在于，包括：
    具有收容腔的芯片防抖固定部；
    被悬持地设置于所述收容腔内的芯片防抖可动部；
    用于驱动所述芯片防抖可动部相对于所述芯片防抖固定部在所述收容腔内进行移动的芯片驱动元件，其中，所述芯片驱动元件包括被设置于所述芯片防抖可动部的芯片线圈组件，以及，被固定于所述芯片防抖固定部且对应于所述芯片线圈组件的芯片磁石组件，其中，所述芯片线圈组件包括至少一芯片线圈；以及
    芯片防抖导电部，包括被包覆于所述芯片防抖可动部内的至少一线圈导电元件，每一所述线圈导电元件具有被暴露的第一线圈导电端部、与所述第一线圈导电端部相对的且被暴露的第二线圈导电端部，以及，延伸于所述第一线圈导电端部和所述第二线圈导电端部之间的线圈导电延伸部，其中，至少一芯片线圈电连接于所述第一线圈导电端部，所述第二线圈导电端部适于电连接线路板。
  2. 根据权利要求1所述的驱动组件，其中，所述芯片防抖可动部包括芯片可动载体，所述芯片可动载体具有相对的上表面和下表面，其中，所述线圈导电元件的第一线圈导电端部被暴露于所述芯片可动载体的上表面，所述线圈导电元件的第二线圈导电端部被暴露于所述芯片可动载体的下表面。
  3. 根据权利要求2所述的驱动组件，其中，所述芯片线圈组件包括被设置于所述芯片可动载体的线圈电路板，所述至少一芯片线圈被固定且电连接于所述线圈电路板，所述线圈电路板电连接于所述第一线圈导电端部。
  4. 根据权利要求3所述的驱动组件，其中，所述芯片防抖固定部包括相互扣合以形成所述收容腔的上盖和基底，所述芯片磁石组件被固定于所述上盖。
  5. 根据权利要求1所述的驱动组件，其中，所述驱动组件还包括芯片 保持组件，所述芯片保持组件包括被包覆于所述芯片防抖可动部内的至少一芯片磁吸元件，以通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力使得所述芯片防抖可动部被悬持地设置于所述芯片防抖固定部的收容腔内。
  6. 根据权利要求4所述的驱动组件，其中，所述驱动组件还包括芯片保持组件，所述芯片保持组件包括内嵌于所述芯片可动载体内的至少一芯片磁吸元件，以通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力使得所述芯片可动载体吸附向所述上盖。
  7. 根据权利要求6所述的驱动组件，其中，所述芯片保持组件还包括被设置于所述芯片可动载体和所述上盖之间的芯片支撑组件，所述芯片支撑组件包括凹陷地形成于所述芯片可动载体的滚珠槽以及被设置于所述滚珠槽内的滚珠，其中，通过所述至少一芯片磁吸元件与所述芯片磁石组件之间的磁吸力，所述滚珠被夹持于所述上盖和所述芯片可动载体之间。
  8. 根据权利要求7所述的驱动组件，其中，所述芯片支撑组件还包括内嵌于所述芯片可动载体内且位于所述滚珠槽的底部的滚珠支撑片，所述滚珠被支持于所述滚珠支撑片。
  9. 根据权利要求8所述的驱动组件，其中，所述芯片可动载体包括芯片载体主体和自所述芯片载体主体的周缘往下延伸的芯片载体侧部，其中，所述芯片可动载体还包括突出地形成于所述芯片载体主体的上表面的延伸柱，所述滚珠槽凹陷地形成于所述延伸柱的上表面。
  10. 根据权利要求8所述的驱动组件，其中，所述驱动组件还包括芯片位置感测组件，所述芯片位置感测组件包括至少一位置感测元件，所述芯片防抖导电部还包括被包覆于所述芯片可动载体内的至少一感测元件导电元件，每一所述感测元件导电元件包括被暴露于所述芯片可动载体的上表面的第一感测元件导电端部、被暴露于所述芯片可动载体的下表面且与所述第一感测元件导电端部相对的第二感测元件导电端部，以及，延伸于所述第一感 测元件导电端部和所述第二感测元件导电端部之间的感测元件导电延伸部，其中，所述第一感测元件导电端部电连接于所述位置感测元件，所述第二感测元件导电端部适于电连接于所述线路板。
  11. 根据权利要求10所述的驱动组件，其中，所述第一感测元件导电端部在所述芯片可动载体所设定的高度方向上低于所述第一线圈导电端部。
  12. 根据权利要求10所述的驱动组件，其中，所述感测元件导电元件、所述线圈导电元件和所述滚珠支撑片不具有导磁性，所述芯片磁吸元件具有导磁性。
  13. 根据权利要求11所述的驱动组件，其中，所述芯片磁吸元件包括被包覆于所述芯片可动载体内的磁吸元件主体和从所述磁吸元件主体延伸至所述芯片可动载体外的磁吸元件连接部，所述感测元件导电元件进一步包括从由所述第一感测元件导电端、所述第二感测元件导电端和所述感测元件导电延伸部形成的感测元件导电主体延伸至所述芯片可动载体外的感测元件导电连接部，所述线圈导电元件进一步包括从由所述第一线圈导电端部、所述第二线圈导电端部和所述线圈导电延伸部形成的线圈导电主体延伸至所述芯片可动载体外的线圈导电连接部，所述滚珠支撑片包括位于所述滚珠槽的底部的支撑片主体和从所述支撑片主体延伸至所述芯片可动载体外的支撑片连接部，所述磁吸元件连接部与所述感测元件导电连接部、所述线圈导电连接部、所述支撑片连接部在所述芯片可动载体所设定的高度方向上存在差异。
  14. 根据权利要求13所述的驱动组件，其中，所述感测元件导电连接部和所述线圈导电连接部在所述芯片可动载体所设定的高度方向上一致。
  15. 根据权利要求13所述的驱动组件，其中，所述感测元件导电元件、所述线圈导电元件、所述滚珠支撑片和所述芯片磁吸元件通过注塑工艺与所述芯片可动载体一体成型。
  16. 根据权利要求4所述的驱动组件，其中，所述芯片线圈组件包括第一芯片线圈组、第二芯片线圈组和第三芯片线圈组，所述第一芯片线圈组包括至少一所述芯片线圈，所述第二芯片线圈组包括至少一所述芯片线圈，所述第三芯片线圈组包括至少一所述芯片线圈，其中，所述第二芯片线圈组和第三芯片线圈组沿着所述驱动组件所设定的X轴方向设置，所述第一芯片线圈组沿着所述驱动组件所设定的Y轴方向设置，所述X轴方向垂直于所述Y轴方向。
  17. 一种摄像模组，其特征在于，包括：
    光学镜头；
    感光组件，包括线路板和电连接于所述线路板的感光芯片；以及
    如权利要求1至16任一所述的驱动组件，其中，所述感光组件被安装于所述驱动组件的芯片可动载体。
PCT/CN2023/087312 2022-04-14 2023-04-10 驱动组件和摄像模组 WO2023197996A1 (zh)

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