WO2023202307A1

WO2023202307A1 - Rear-section laser integration device for miniled chip high-end laser scribing machine

Info

Publication number: WO2023202307A1
Application number: PCT/CN2023/082875
Authority: WO
Inventors: 蒋习锋
Original assignee: 济南金威刻科技发展有限公司
Priority date: 2022-04-18
Filing date: 2023-03-21
Publication date: 2023-10-26
Also published as: ZA202308437B; CN114850694A

Abstract

A rear-section laser integration device for a miniLED chip high-end laser scribing machine. The rear-section laser integration device comprises a laser integration machine (1), wherein a conveying belt (2) is arranged on an inner side of the laser integration machine; a surface of the conveying belt is provided with an integration apparatus; the integration apparatus comprises an integration plate (3); a lower side of the integration plate is arranged on an upper side of the conveying belt; and the lower side of the integration plate is slidably connected to a bottom plate (4). The rear-section laser integration device for a miniLED chip high-end laser scribing machine guarantees that an integration plate can cope with a smooth effect during integration of slices of different radiuses and guarantees the usage flexibility of the integration plate, thereby improving the simple and convenient adjustment method for the integration plate during integration of the slices of different radiuses, reducing the complexity that different integration boxes need to be replaced during traditional integration of slices of different radiuses, reducing the material waste when integration boxes of different models are used for backup, and then improving the usage efficiency of the integration plate during integration of the slices of different radiuses.

Description

MiniLED chip high-end laser dicing machine back-end laser integration equipment

This invention claims the priority of the Chinese patent application submitted to the China Patent Office on April 18, 2022, with the application number 202210404834.3 and the invention name "MiniLED chip high-end laser dicing machine back-end laser integration equipment", the entire content of which is incorporated by reference. incorporated in the present invention.

Technical field

The invention relates to the technical field of MiniLED chip integration, and in particular to laser integration equipment in the back section of a high-end laser dicing machine for MiniLED chips.

Background technique

Laser scribing uses a high-energy laser beam to irradiate the surface of the workpiece to locally melt and vaporize the irradiated area, thereby achieving the purpose of scribing. Because the laser is focused by a special optical system to become a very small light spot with high energy density, its processing is non-contact, there is no mechanical stamping force on the workpiece itself, and the workpiece is easily deformed. It has minimal thermal impact and high scoring accuracy, and is widely used in cutting and scribing solar panels and thin metal sheets.

After reviewing the literature, it is known that for most of the existing high-end laser dicing machines for MiniLED chips, after slicing, the back-end laser integration equipment will integrate and place the dicing through the mechanical arm. Although most of the existing integrators can Place the materials flatly, but the consolidation boxes used for integration have the same radius. When the cutting radius changes, the corresponding consolidation box needs to be replaced. This method not only causes the problem of finding the consolidation box for replacement. Low efficiency will also lead to disadvantages such as waste of resources caused by excessive backup of the integration box.

Contents of the invention

The purpose of the present invention is to solve at least one of the technical problems existing in the prior art by providing laser integration equipment in the back section of a high-end laser dicing machine for MiniLED chips, which can solve the problem that when the cutting radius of the integrated box changes due to the same radius, It is necessary to replace the corresponding integrated box for use. This This approach not only results in inefficiency in finding consolidation boxes for replacement, but also causes a waste of resources caused by too many backup consolidation boxes.

In order to achieve the above object, the present invention provides the following technical solution: MiniLED chip high-end laser dicing machine rear section laser integration equipment, including a laser integration machine, the inside of the laser integration machine is provided with a conveyor belt, and the surface of the conveyor belt is provided with an integration device , the integration device includes an integration plate, the lower side of the integration plate is set on the upper side of the conveyor belt, the lower side of the integration plate is slidingly connected to a bottom plate, a limit groove is provided on the surface of the bottom plate, the inner wall of the limit groove is slidingly connected to the limit plate, and the limit plate is The upper side of the position plate is fixedly connected to the lower side of the integration plate. An inner groove is provided inside the bottom plate. An inner column is provided on the inner wall of the inner groove. The surface of the inner column is slidingly connected to the surface of the limiting plate.

Preferably, the shapes of the limiting plate and the limiting groove are cross-shaped.

Preferably, the inside of the limiting plate is slidingly connected to a limiting rod, and the left and right ends of the limiting rod are fixedly connected to the inner wall of the limiting groove. The surface of the limiting rod is slidably sleeved with a spring, and the left and right ends of the spring are respectively Fixedly connected to the inner wall of the limiting groove and the surface of the limiting plate.

Preferably, the shape of the inner column is a truncated cone, and the lower side of the limiting plate is inclined.

Preferably, a docking plate is fixedly connected to the surface of the bottom plate, and a clamping groove is provided on the surface of the docking plate.

Preferably, the upper side of the conveyor belt is provided with a placement groove, and the surface of the conveyor belt is provided with a docking groove that communicates with the placement groove.

Preferably, a positioning groove interconnected with the placement groove and the docking groove is provided inside the conveyor belt, and the inner wall of the positioning groove is fixedly connected with a clamping column.

Preferably, a material chute is provided on the upper side of the conveyor belt.

Preferably, a screw rod is fixedly connected to the lower side of the inner column, and the surface of the screw rod is threadedly connected to the inside of the bottom plate.

Compared with the prior art, the beneficial effects of the present invention are:

(1) After the laser integration equipment in the back section of the MiniLED chip high-end laser dicing machine, the operator controls the inner column to drive the integration plate on the limit plate to change its position. At this time, the integration plate can be placed on the bottom The upper side of the board shrinks and expands in radius, thereby ensuring the flat effect of the integrated board when integrating scribes with different radii, ensuring the flexibility of use of the integrated board, and improving the simplicity of the integrated board when integrating dicing with different radii. The adjustment method greatly reduces the tediousness of replacing different integration boxes during traditional scribing integration with different radii, reduces the waste of materials when different types of integration boxes are used for backup, and greatly guarantees the use of integration boards for scribing integration with different radii. efficiency.

(2) When the operator rotates the inner column on the screw to move the laser integration equipment in the rear section of the MiniLED chip high-end laser dicing machine, the inner column can squeeze the limit plate, and the limit plate and the limit plate are connected The cross limit between the grooves ensures the stability of the movement of the inner column when squeezing the limit plate, thereby ensuring the stability after the limit plate drives the integrated plate to change its position.

(3) The laser integration equipment in the back section of the MiniLED chip high-end laser dicing machine uses the operator to control the screw to drive the inner column to rotate. Through the mutual contact between the truncated cone shape of the inner column and the inclined shape of the limit plate, the inner column is ensured The convenience of pushing the limit plate to move ensures the convenience of movement between the inner column and the limit plate.

(4) When the laser integration equipment in the rear section of the MiniLED chip high-end laser dicing machine is controlled and adjusted by the operator, the integrated plate drives the bottom plate into the inner wall of the placement slot, and then enters the inner wall of the docking slot on the conveyor belt through the docking plate on the bottom plate. Finally, at this time, the base plate is rotated through the integration plate, so that the docking plate on the base plate enters the inner wall of the positioning slot, and then the slot on the docking plate and the clamping column on the positioning slot form a matching docking. This way ensures that the integration plate passes through the base plate The convenience of docking with the conveyor belt improves the tediousness of traditional integrated boards that require fixed components for clamping and fixing, thereby ensuring the ease of installation and separation between the integrated boards and the conveyor belt.

(5) The laser integration equipment at the rear of the MiniLED chip high-end laser dicing machine has a starting chute on the bottom plate, so that when the dicing integrated on the inside of the integrated board is taken out, the external robot arm can be used to pass through the picking chute. On the inner wall, the dicing on the inside of the integrated plate is taken out, thereby ensuring the ease of picking up the integrated dicing.

Description of the drawings

The present invention will be further described below in conjunction with the accompanying drawings and examples:

Figure 1 is a schematic structural diagram of the laser integration equipment in the rear section of the high-end laser dicing machine for MiniLED chips of the present invention;

Figure 2 is a schematic diagram of the bottom plate structure of the present invention;

Figure 3 is an enlarged structural schematic diagram of position A in Figure 2 of the present invention;

Figure 4 is a schematic diagram of the planar structure of the bottom plate of the present invention;

Figure 5 is a schematic diagram of the division structure of the bottom plate and the conveyor belt of the present invention.

Reference signs: 1 laser integration machine, 2 conveyor belt, 3 integration plate, 4 base plate, 5 limit plate, 6 limit groove, 7 limit rod, 8 spring, 9 inner groove, 10 inner column, 11 screw, 12 Butt plate, 13 clamping slots, 14 placement slots, 15 docking slots, 16 positioning slots, 17 clamping columns, 18 lifting slots.

Detailed ways

This section will describe the specific embodiments of the present invention in detail. The preferred embodiments of the present invention are shown in the accompanying drawings. The function of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand the present invention. Each technical feature and overall technical solution of the invention shall not be construed as limiting the scope of protection of the invention.

In the description of the present invention, it should be understood that orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or position relationships shown in the drawings and are only In order to facilitate the description of the present invention and simplify the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present invention, greater than, less than, more than, etc. are understood to exclude the original number, and above, below, within, etc. are understood to include the original number. If there is a description of first and second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the order of indicated technical features. relation.

In the description of the present invention, unless otherwise expressly limited, words such as setting, installation, connection, etc. shall be used as With a broad understanding, those skilled in the art can reasonably determine the specific meaning of the above words in the present invention in combination with the specific content of the technical solution.

Example 1:

Please refer to Figures 1-4. The present invention provides a technical solution: the laser integration equipment in the rear section of a high-end laser dicing machine for MiniLED chips includes a laser integration machine 1. A conveyor belt 2 is provided inside the laser integration machine 1. The conveyor belt 2 An integration device is provided on the surface. The integration device includes an integration plate 3. The lower side of the integration plate 3 is arranged on the upper side of the conveyor belt 2. The lower side of the integration plate 3 is slidably connected to a base plate 4. The surface of the base plate 4 is provided with a limiting groove 6. The inner wall of the limit groove 6 is slidingly connected to the limit plate 5. The upper side of the limit plate 5 is fixedly connected to the lower side of the integration plate 3. The inside of the limit plate 5 is slidably connected to the limit rod 7. The left and right sides of the limit rod 7 are Both ends are fixedly connected to the inner wall of the limit groove 6. The surface of the limit rod 7 is slidably sleeved with a spring 8. The left and right ends of the spring 8 are fixedly connected to the inner wall of the limit groove 6 and the surface of the limit plate 5 respectively. The shapes of the positioning plate 5 and the limiting groove 6 are both cross-shaped. An inner groove 9 is provided inside the bottom plate 4. An inner column 10 is provided on the inner wall of the inner groove 9. The surface of the inner column 10 is slidingly connected to the surface of the limiting plate 5. , the shape of the inner column 10 is a truncated cone, the lower side of the limiting plate 5 is inclined, the lower side of the inner column 10 is fixedly connected with a screw 11, the surface of the screw 11 is threadedly connected to the inside of the base plate 4, and the operator controls the screw 11 drives the inner column 10 to rotate, and the truncated cone shape of the inner column 10 and the inclined shape of the limit plate 5 are in contact with each other, ensuring the convenience of the inner column 10 pushing the limit plate 5 to move, and ensuring that the inner column 10 and the limit plate 5 are in contact with each other. Ease of movement between position boards 5.

Further, when the operator rotates the inner column 10 on the screw 11 to move, the inner column 10 can squeeze the limit plate 5, and through the cross limit between the limit plate 5 and the limit groove 6, This ensures the stability of the movement of the inner column 10 when squeezing the limiting plate 5, thereby ensuring the stability after the limiting plate 5 drives the integrated plate 3 to change its position.

Furthermore, after the operator controls the inner column 10 to drive the integrated plate 3 on the limiting plate 5 to change its position, the integrated plate 3 can contract and expand in radius on the upper side of the bottom plate 4, thereby ensuring that the integrated plate 3. It can deal with the smoothing effect when integrating dicing with different radii, ensuring the integration The flexibility of use of the board 3 improves the easy adjustment method of the integrated board 3 when integrating dicing with different radii, greatly reducing the tediousness of replacing different integration boxes when integrating dicing with different radii in the traditional way, and reducing the need for different types of integration boxes. The waste of materials during backup greatly ensures the efficiency of use of the integration plate 3 for scribing and integrating different radii.

Embodiment 2;

Please refer to Figure 5. On the basis of the first embodiment, a docking plate 12 is fixedly connected to the surface of the bottom plate 4. A clamping slot 13 is provided on the surface of the docking plate 12. A placement slot 14 is provided on the upper side of the conveyor belt 2. The conveyor belt 2 The surface of the conveyor belt 2 is provided with a docking groove 15 that is interconnected with the placement groove 14. The interior of the conveyor belt 2 is provided with a positioning groove 16 that is interconnected with the placement groove 14 and the docking groove 15. The inner wall of the positioning groove 16 is fixedly connected with a clamping post 17. Through When the operator controls the adjusted integration plate 3 to drive the base plate 4 into the inner wall of the placement slot 14, and then enters the inner wall of the docking slot 15 on the conveyor belt 2 through the docking plate 12 on the base plate 4, the base plate 4 is rotated by the integration plate 3 at this time. Then, the docking plate 12 on the base plate 4 enters the inner wall of the positioning slot 16, and then the slot 13 on the docking plate 12 and the clamping column 17 on the positioning slot 16 form a fitting connection. This way ensures that the integration plate 3 is connected to the positioning slot 16 through the base plate 4. The convenience of docking between the conveyor belts 2 improves the tediousness of the traditional integrated plate 3 that requires fixed components for clamping and fixing, thereby ensuring the ease of installation and separation between the integrated plate 3 and the conveyor belt 2 .

Embodiment 3;

Please refer to Figure 2. Based on the first and second embodiments, a starting chute 18 is provided on the upper side of the conveyor belt 2. By setting the starting chute 18 on the bottom plate 4, the integrated scribing on the inside of the integrating plate 3 can be performed. When picking up, the external robot arm is used to pass through the inner wall of the picking chute 18 to pick up the dicing inside the integrated plate 3, thereby ensuring the ease of picking up the integrated dicing.

Working principle: MiniLED chip high-end laser dicing machine rear section laser integration equipment, when the operator rotates the inner column 10 on the screw 11, the inner column 10 can squeeze the limit plate 5, and through the limit plate 5 The cross limiter between the limiter groove 6 and the inner column 10 ensures the stability of the movement of the inner column 10 when squeezing the limiter plate 5. The operator controls the inner column 10 to drive the integrated plate 3 on the limiter plate 5 to adjust the position. After the change, the integrating plate 3 can contract and expand the radius on the upper side of the bottom plate 4. After entering the inner wall of the docking groove 15 on the conveyor belt 2 through the docking plate 12 on the bottom plate 4, the integrating plate 3 can then Rotate the bottom plate 4 so that the docking plate 12 on the bottom plate 4 enters the inner wall of the positioning slot 16 , and then the slot 13 on the docking plate 12 and the clamping post 17 on the positioning slot 16 form a matching connection.

The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the technical field, various modifications can be made without departing from the purpose of the present invention. kind of change.

Claims

The laser integration equipment in the back section of the high-end laser dicing machine for MiniLED chips includes a laser integration machine (1), which is characterized in that: a conveyor belt (2) is provided inside the laser integration machine (1), and the surface of the conveyor belt (2) An integration device is provided. The integration device includes an integration plate (3). The lower side of the integration plate (3) is arranged on the upper side of the conveyor belt (2). The lower side of the integration plate (3) is slidably connected to a bottom plate (4). The bottom plate A limiting groove (6) is provided on the surface of (4). The inner wall of the limiting groove (6) is slidingly connected to the limiting plate (5). The upper side of the limiting plate (5) is fixedly connected to the lower side of the integration plate (3). , an inner groove (9) is provided inside the bottom plate (4), and an inner column (10) is provided on the inner wall of the inner groove (9). The surface of the inner column (10) is slidingly connected to the surface of the limiting plate (5).
The laser integration equipment in the rear section of a high-end laser dicing machine for Mini LED chips according to claim 1, characterized in that: the shapes of the limiting plate (5) and the limiting groove (6) are cross-shaped.
The laser integration equipment in the rear section of the high-end laser dicing machine for MiniLED chips according to claim 1, characterized in that: the inside of the limit plate (5) is slidingly connected to the limit rod (7), and the limit rod (7) The left and right ends are fixedly connected to the inner wall of the limit groove (6). The surface of the limit rod (7) is slidably connected with a spring (8). The left and right ends of the spring (8) are respectively fixedly connected to the limit groove (6). ) and the surface of the limiting plate (5).
The laser integration equipment for the rear section of a high-end laser dicing machine for Mini LED chips according to claim 1, characterized in that: the shape of the inner column (10) is a truncated cone, and the lower side of the limiting plate (5) is inclined.
The laser integration equipment for the rear section of a high-end laser dicing machine for MiniLED chips according to claim 1, characterized in that: a docking plate (12) is fixedly connected to the surface of the base plate (4), and a docking plate (12) is provided on the surface. Card slot (13).
The laser integration equipment in the rear section of the high-end laser dicing machine for MiniLED chips according to claim 1, characterized in that: a placement groove (14) is provided on the upper side of the conveyor belt (2), and a placement groove (14) is provided on the surface of the conveyor belt (2). There is a docking groove (15) interconnected with the placing groove (14).
MiniLED chip high-end laser dicing machine rear section laser integration device according to claim 1 The equipment is characterized in that: the conveyor belt (2) is provided with a positioning groove (16) interconnected with the placement groove (14) and the docking groove (15), and the inner wall of the positioning groove (16) is fixedly connected with a clamping column (17).
The laser integration equipment in the rear section of the high-end laser dicing machine for MiniLED chips according to claim 1, characterized in that: a starting chute (18) is provided on the upper side of the conveyor belt (2).
The laser integration equipment for the rear section of a high-end laser dicing machine for MiniLED chips according to claim 1, characterized in that: a screw (11) is fixedly connected to the lower side of the inner column (10), and the surface of the screw (11) is threaded. Inside the base plate (4).