WO2023202174A1 - 一种pcb板及其制作方法 - Google Patents

一种pcb板及其制作方法 Download PDF

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Publication number
WO2023202174A1
WO2023202174A1 PCT/CN2023/072376 CN2023072376W WO2023202174A1 WO 2023202174 A1 WO2023202174 A1 WO 2023202174A1 CN 2023072376 W CN2023072376 W CN 2023072376W WO 2023202174 A1 WO2023202174 A1 WO 2023202174A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
metal substrate
circuit layer
connector
pcb board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/072376
Other languages
English (en)
French (fr)
Inventor
李锦乐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen TCL New Technology Co Ltd
Original Assignee
Shenzhen TCL New Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen TCL New Technology Co Ltd filed Critical Shenzhen TCL New Technology Co Ltd
Priority to US18/857,820 priority Critical patent/US20250267790A1/en
Publication of WO2023202174A1 publication Critical patent/WO2023202174A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of PCB boards, and in particular, to a PCB board and a manufacturing method thereof.
  • wave soldering is when molten solder forms a solder wave to solder components; reflow soldering is when high-temperature hot air forms reflow molten solder to solder components.
  • LEDs used in lighting, TV backlight and other fields generally use aluminum substrate PCB as the mounting carrier.
  • the circuit design becomes more and more complex, and the circuits on the PCB board become more and more complex, requiring the use of optical copper wire jumpers.
  • Connection while the jumper connection of optical copper wires requires wave soldering, the jumper wires of optical copper wires can simplify the layout and routing on the PCB board.
  • aluminum substrate PCBs that can only undergo reflow soldering cannot ensure reliable contact between optical copper wires and aluminum substrates.
  • An embodiment of the present application provides a PCB board, including:
  • An insulating layer is provided on one side of the metal substrate, and the insulating layer is provided with perforations;
  • the circuit layer is provided on the side of the insulating layer facing away from the metal substrate;
  • the connector is disposed in the through hole to electrically connect the metal substrate and the circuit layer.
  • a first hole is provided on the circuit layer, the first hole and the through-hole are interconnected, the connector is disposed in the first hole, and one end of the connector is in contact with the metal substrate, and the other end of the connector is in contact with Connected to the circuit layer to electrically connect the metal substrate and the circuit layer.
  • the first hole is a first blind hole, and the opening direction of the first blind hole is toward the insulating layer.
  • the first hole is a first through hole.
  • a hole diameter of the first through hole is larger than a hole diameter of the through hole.
  • a second hole is provided on the metal substrate, the second hole and the through-hole are interconnected, the connecting member is disposed in the second hole, and one end of the connecting member contacts the metal substrate, and the other end of the connecting member contacts Connected to the circuit layer to electrically connect the metal substrate and the circuit layer.
  • the second hole is a second blind hole, and the opening direction of the second blind hole is toward the insulating layer.
  • the second hole is a second through hole.
  • a hole diameter of the second through hole is larger than a hole diameter of the through hole.
  • the connecting member is a metal rivet.
  • the metal rivet includes a nail head and a nail shank.
  • the metal rivet is disposed in the through hole.
  • the nail head abuts the circuit layer.
  • the nail shank abuts the metal substrate to electrically connect the metal substrate and the metal substrate. circuit layer.
  • the surface where the nail head contacts the circuit layer is a slope, and the thickness of the nail head gradually decreases from close to the nail shaft toward away from the nail shaft.
  • the connector is made of the same material as the metal substrate.
  • the connector is integrally formed with the metal substrate.
  • the embodiment of the present disclosure provides a method for manufacturing a PCB board.
  • the method includes:
  • An insulating layer is provided on the metal substrate, and perforations are provided on the insulating layer;
  • a connecting piece is provided in the through hole, and the connecting piece is in contact with the metal substrate;
  • a circuit layer is provided on the side of the insulating layer facing away from the metal substrate.
  • the circuit layer is in contact with the connector to electrically connect the metal substrate and the circuit layer.
  • a first hole is provided on the circuit layer, the first hole and the through-hole are interconnected, the connector is disposed in the first hole, and one end of the connector is in contact with the metal substrate, and the connector is The other end is in contact with the circuit layer to electrically connect the metal substrate and the circuit layer.
  • the first hole is a first blind hole, and the opening direction of the first blind hole is toward the insulating layer.
  • the first hole is a first through hole.
  • a second hole is provided on the metal substrate, the second hole and the through hole are connected to each other, the connecting member is disposed in the second hole, and one end of the connecting member is in contact with the metal substrate, and the connecting member is The other end is in contact with the circuit layer to electrically connect the metal substrate and the circuit layer.
  • the second hole is a second blind hole, and the opening direction of the second blind hole is toward the insulating layer.
  • the embodiment of the present disclosure provides a method for manufacturing a PCB board.
  • the method includes:
  • the metal substrate, insulation layer and circuit layer are sequentially pressed to form a metal substrate PCB;
  • the connecting piece is placed into the through hole, and the connecting piece is in contact with the metal substrate and the circuit layer to electrically connect the metal substrate and the circuit layer.
  • the size of the connecting piece is slightly larger than the aperture of the perforation.
  • the connecting piece and the perforation fit in an interference fit, and the perforation can firmly block the connecting piece, ensuring that the connecting piece is inserted into the perforation. stability in. Therefore, the PCB board provided by the embodiment of the present application ensures reliable and stable connection between the circuit layer and the metal substrate, and is conducive to realizing relatively complex circuit layout of the metal substrate PCB.
  • FIG. 1 is a schematic structural diagram of a PCB board when perforations are provided on the insulating layer according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a PCB board when through holes are opened on the circuit layer according to the embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a PCB board when blind holes are opened on the metal substrate according to the embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of the PCB board when through holes are provided on the PCB board according to the embodiment of the present application.
  • FIG. 5 is another structural schematic diagram of the PCB board when through holes are provided on the PCB board according to the embodiment of the present application.
  • FIG. 6 is another structural schematic diagram of the PCB board when through holes are provided on the PCB board according to the embodiment of the present application.
  • the PCB board 100 may be, for example, a PCB board 100 of an LED (light-emitting diode, light-emitting diode) backlight board.
  • LED light-emitting diode, light-emitting diode
  • FIG. 1 is a schematic structural diagram of the PCB board 100 when the insulating layer 120 is provided with perforations according to an embodiment of the present application.
  • the PCB board 100 includes a metal substrate 110, an insulation layer 120, a circuit layer 130 and connectors 140.
  • the PCB board 100 uses a metal base material as a substrate, and metal has good thermal conductivity. Therefore, the PCB board 100 using a metal base material as a base plate has a good heat dissipation effect.
  • the metal substrate may be an aluminum substrate; it may be a copper substrate, etc.
  • the insulating layer 120 is provided on one side of the metal substrate 110 .
  • the insulating layer 120 may be composed of an epoxy glass cloth adhesive sheet, a highly thermally conductive epoxy resin or other resin, or a polyolefin resin or polyimide resin glass cloth adhesive sheet.
  • the user can select a suitable material as the insulating layer 120 according to the application scenario of the PCB board 100, and there is no limitation here.
  • the insulating layer 120 is provided with perforations.
  • the location, shape, quantity, and size of the perforations can be selected and set according to the actual application scenario, and there are no specific limitations here.
  • the perforations can be set in the middle; they can also be set at the four corners.
  • the perforation may be a circular hole; it may also be a square hole or other shapes.
  • the number of perforations may be one; it may be four; it may be six, etc.
  • a circuit layer 130 is provided on a side of the insulating layer 120 away from the metal substrate 110 .
  • the circuit layer 130 may be a copper foil layer; an aluminum foil layer; an aluminum alloy foil layer; or a copper alloy foil layer, etc.
  • the circuit layer 130 is a copper foil layer as an example, but the copper foil layer cannot be regarded as limiting the embodiment of the present application.
  • the connector 140 is disposed in the through hole to electrically connect the metal substrate 110 and the circuit layer 130 .
  • the connector 140 is made of conductive materials.
  • the connector 140 can be made of metal elements, such as copper, aluminum, etc.; or it can be made of alloys, such as aluminum alloy, iron, copper alloy. etc.; it can also be made of composite metal.
  • the structural size of the connector 140 is very important, because its structural size not only affects the reliability of the electrical connection between the metal substrate 110 and the circuit layer 130, but also affects the reliability and automation performance in the production process. .
  • the size of the connecting piece 140 should be slightly larger than the diameter of the perforation. When the connecting piece 140 is placed in the perforation, the connecting piece 140 interferes with the perforation, and the perforation can block the connecting piece 140 well. This is to prevent the connecting member 140 from moving within the through hole, resulting in incomplete contact between the connecting member 140 and the metal substrate 110 and the circuit layer 130 , so that the connecting member 140 cannot electrically connect the metal substrate 110 and the circuit layer 130 .
  • the connector 140 is placed in the perforation, and the metal substrate 110 and the circuit layer 130 are electrically connected through interference connection between the connector 140 and the perforation, ensuring that the connector 140
  • the reliable connection with the metal substrate 110 is conducive to realizing the more complex circuit layout of the metal substrate PCB.
  • the circuit layer 130 is provided with a first hole, the first hole and the through-hole are interconnected, the connector 140 is disposed in the first hole, and one end of the connector 140 is in contact with On the metal substrate 110, the other end of the connector 140 is in contact with the circuit layer 130 to electrically connect the metal substrate 110 and the circuit layer 130.
  • the first hole is a first blind hole, and the opening direction of the first blind hole is toward the insulating layer 120 .
  • the length of the connecting member 140 is longer than the depth of the perforation. After the connecting member 140 is placed in the through hole, the length of the connecting member 140 extends out of the through hole and extends into the first blind hole. In order to avoid unstable contact between the connector 140 and the circuit layer 130, the metal substrate 110 and the circuit layer 130 will not be electrically connected.
  • the size of the connector 140 should be slightly larger than the diameter of the first blind hole, so that the portion of the connector 140 that extends into the first blind hole is an interference fit with the first blind hole, which can effectively ensure that the connector 140 and the circuit layer 130 reliability of the connection.
  • the first hole is set as the first blind hole because the design of the first blind hole can prevent the connector 140 from protruding to the outer surface of the circuit layer 130 and abutting the outer surface of the circuit layer 130 .
  • the length of the connector 140 can be greatly reduced, the materials used for the connector 140 can be reduced, and the manufacturing cost of the PCB board 100 can be effectively saved.
  • the first hole is a first through hole.
  • providing the first through hole on the circuit layer 130 is more convenient for operation. For example, when opening a through hole, it is only necessary to penetrate the through hole through the circuit layer 130 . On the other hand, by opening a first through hole on the circuit layer 130, the contact between the connector 140 and the metal substrate 110 can be accurately observed through the first through hole.
  • the diameter of the first through hole is larger than the diameter of the through hole.
  • the first through hole and the through hole are combined to form a “T”-shaped hole.
  • the existence of the “T”-shaped hole can bury the connector 140 in the “T”-shaped hole, making the surface of the PCB board 100 smooth and beautiful.
  • the metal substrate 110 is provided with a second hole, the second hole and the through hole are interconnected, the connector 140 is disposed in the second hole, and one end of the connector 140 is in contact with On the metal substrate 110, the other end of the connector 140 is in contact with the circuit layer 130 to electrically connect the metal substrate 110 and the circuit layer 130.
  • the second hole is a second blind hole, and the opening direction of the second blind hole is toward the insulating layer 120 .
  • the length of the connecting member 140 is longer than the depth of the perforation. After the connecting member 140 is placed in the through hole, the length of the connecting member 140 extends out of the through hole and extends into the second blind hole. In order to avoid the instability of the contact between the connector 140 and the metal substrate 110, the metal substrate 110 and the circuit layer 130 will not be electrically connected.
  • the size of the connecting piece 140 should be slightly larger than the diameter of the second blind hole, so that the part of the connecting piece 140 that extends into the second blind hole has an interference fit with the second blind hole, which can effectively ensure that the connecting piece 140 and the metal substrate 110 reliability of the connection.
  • the second hole is set as a second blind hole because the design of the second blind hole can prevent the connector 140 from protruding to the outer surface of the metal substrate 110 and abutting against the outer surface of the metal substrate 110 .
  • the length of the connector 140 can be greatly reduced, the materials used for the connector 140 can be reduced, and the manufacturing cost of the PCB board 100 can be effectively saved.
  • the second hole is a second through hole.
  • providing the second through hole on the metal substrate 110 is more convenient for operation. For example, when opening a through hole, it is only necessary to penetrate the through hole through the metal substrate 110 . On the other hand, by opening a second through hole on the metal substrate 110, the contact between the connector 140 and the circuit layer 130 can be accurately observed through the second through hole.
  • the diameter of the second through hole is larger than the diameter of the through hole.
  • the second through hole and the perforation are combined to form a “T”-shaped hole.
  • the existence of the “T”-shaped hole can bury the connector 140 in the “T”-shaped hole, making the surface of the PCB board 100 smooth and beautiful.
  • the connector 140 is a metal rivet.
  • the metal rivet includes a nail head and a nail shaft.
  • the metal rivet is disposed in the through hole.
  • the nail head is in contact with the circuit layer 130 .
  • the nail shaft is in contact with the metal substrate 110 to electrically connect it.
  • the metal substrate 110 and the circuit layer 130 are connected.
  • the metal rivets may be made of copper; they may also be made of aluminum; they may also be made of alloy materials such as copper alloy and aluminum alloy. Since metal has better thermal conductivity, the metal rivets can also dissipate heat, so that the PCB board 100 has better heat dissipation performance.
  • the head of the metal rivet is circular. It is conceivable that the head of the metal rivet can also be in other shapes, such as square, etc. But it is understandable that round nail heads are more conducive to industrialization. However, it should be noted that no matter what shape the nail head of the metal rivet is, it is only necessary to ensure the flatness of the contact surface between the nail head and the circuit layer 130 to ensure as much contact as possible between the metal rivet and the circuit layer 130 , ensuring the reliability of electrical connection between the circuit layer 130 and the metal substrate 110 .
  • the surface where the nail head contacts the circuit layer 130 is a slope, and the thickness of the nail head gradually decreases from close to the nail shaft toward away from the nail shaft.
  • the bevel can increase the contact area between the metal rivet and the circuit layer 130, ensuring the electrical connection between the circuit layer 130 and the metal substrate 110.
  • the bevel of the nail head facilitates further burying the metal rivet in the hole, which is beneficial to reducing the height difference between the metal rivet and the circuit layer 130, effectively increasing the smoothness of the surface of the PCB board 100 properties, which can make the PCB board 100 more beautiful.
  • the connector 140 is made of the same material as the metal substrate 110 , and the connector 140 is integrally formed with the metal substrate 110 .
  • the surface of the press block in contact with the punched out part of the PCB board 100 is a flat surface
  • the surface in contact with the metal substrate 110 of the punched out part of the PCB board 100 and the circuit layer 130 is a flat surface
  • the press block When the surface of the block that contacts the portion of the punched-out PCB board 100 is a tapered surface, the surface that contacts the metal substrate 110 of the portion of the punched-out PCB board 100 and the circuit layer 130 is an inclined surface.
  • the embodiment of the present disclosure provides a method for manufacturing a PCB board 100, which is suitable for the PCB board 100 of the above embodiment.
  • the method includes:
  • An insulating layer 120 is provided on the metal substrate 110, and the insulating layer 120 is provided with perforations;
  • a connecting piece 140 is provided in the through hole, and the connecting piece 140 is in contact with the metal substrate 110;
  • a circuit layer 130 is provided on a side of the insulating layer 120 away from the metal substrate 110 .
  • the circuit layer 130 is in contact with the connector 140 to electrically connect the metal substrate 110 and the circuit layer 130 .
  • the embodiment of the present disclosure provides a method of manufacturing a PCB board 100, which is suitable for the PCB board 100 of the above embodiment.
  • the method includes
  • the metal substrate 110, the insulating layer 120 and the circuit layer 130 are sequentially pressed together to form a metal substrate PCB;
  • the connector 140 is placed into the through hole, and the connector 140 is in contact with the metal substrate 110 and the circuit layer 130 to electrically connect the metal substrate 110 and the circuit layer 130 .
  • the specific operation of sequentially laminating the metal substrate 110, the insulating layer 120 and the circuit layer 130 to form the metal substrate PCB is as follows: pasting the metal substrate 110 on one surface of the insulating layer 120 with an adhesive, Then, a layer of circuit layer 130 is covered with an adhesive on the other surface of the insulating layer 120 , and the metal substrate 110 , the insulating layer 120 and the circuit layer 130 that are pasted together by the adhesive are then subjected to a lamination process, so that the metal substrate 110 , the insulation layer 120 and the circuit layer 130 are more closely connected to form a preliminary metal substrate PCB.
  • the perforation may penetrate the insulating layer 120 and the circuit layer 130 without passing through the metal substrate 110; for example, the perforation may penetrate the insulating layer 120 and the circuit layer 130 and pass through the metal substrate 110 to form a blind hole on the metal substrate 110; for example, the perforation may Penetrate the insulating layer 120 and the metal substrate 110 without passing through the circuit layer 130; for example, the perforation can penetrate the insulating layer 120 and the metal substrate 110, pass through the circuit layer 130, and form a blind hole on the circuit layer 130; for example, the perforation can penetrate the insulating layer 120 and the circuit layer 130, passing through the metal substrate 110, and forming a through hole on the metal substrate 110.
  • the through hole penetrates through the metal substrate 110
  • the connecting member 140 is placed into the hole.
  • the connecting member 140 is interference-fitted with the hole. Therefore, when initially placing the connector 140 into the through hole, it is necessary to apply force to the connector 140 and squeeze the connector 140 downward, so that the connector 140 abuts the circuit layer 130 and is also in contact with the metal substrate 110. Finally, The metal substrate 110 and the circuit layer 130 are electrically connected.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

本申请公开了一种PCB板，包括：金属基板；绝缘层，设置于金属基板一侧，绝缘层上设置有穿孔；电路层，设置于绝缘层背离金属基板的一侧；连接件，设置于穿孔中，以电性连通金属基板与电路层。

Description

一种PCB板及其制作方法
本申请要求于2022年04月18日提交中国专利局、申请号为202210402742.1、发明名称为“一种PCB板及其制作方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及PCB板领域，尤其涉及一种PCB板及其制作方法。
 背景技术
在PCB板的贴片过程中，通常需要进行波峰焊和回流焊中的一种或两种焊接工艺。其中，波峰焊是熔融的焊锡形成焊料波峰对元件进行焊接；回流焊是高温热风形成回流熔化焊锡对元件进行焊接。
在普通的PCB单面板中，是用胶水把小型的贴片元件贴到铜皮面，接上光铜线，安装插件元件后一起过波峰焊。然而，铝基板PCB没有插件元件，全部元件都贴片安装在铜皮面上，接上光铜线，然后一起过回流焊。
 技术问题
目前，在照明、电视背光等领域中应用的LED普通是使用铝基板PCB作为安装载体。尤其是在电视背光领域中，随着采用的灯珠数量越来越多，分布更为密集，使得电路设计越来越复杂，PCB板上的线路越来越复杂，需要使用光铜线跨线连接，而光铜线的跨线连接需要使用波峰焊，光铜线的跨线可以简化PCB板上的排版走线。但是，由于大元件贴片的安装不能经过波峰焊，因此只能经过回流焊的铝基板PCB无法保证光铜线和铝基板可靠接触。
 技术解决方案
本申请实施例提供一种PCB板，包括：
金属基板；
绝缘层，设置于金属基板一侧，绝缘层上设置有穿孔；
电路层，设置于绝缘层背离金属基板的一侧；
连接件，设置于穿孔中，以电性连通金属基板与电路层。
在一些实施例中，电路层上设置有第一孔，第一孔与穿孔相互连通，连接件设置于第一孔中，且连接件的一端抵接在金属基板上，连接件的另一端抵接在电路层上以电性连通金属基板与电路层。
在一些实施例中，第一孔为第一盲孔，第一盲孔的开孔方向朝向绝缘层。
在一些实施例中，第一孔为第一通孔。
在一些实施例中，第一通孔的孔径大于穿孔的孔径。
在一些实施例中，金属基板上设置有第二孔，第二孔与穿孔相互连通，连接件设置于第二孔中，且连接件的一端抵接在金属基板上，连接件的另一端抵接在电路层上以电性连通金属基板与电路层。
在一些实施例中，第二孔为第二盲孔，第二盲孔的开孔方向朝向绝缘层。
在一些实施例中，第二孔为第二通孔。
在一些实施例中，第二通孔的孔径大于穿孔的孔径。
在一些实施例中，连接件为金属铆钉，金属铆钉包括钉头和钉杆，金属铆钉设置在穿孔内，钉头与电路层相抵接，钉杆与金属基板相抵接以电性连通金属基板和电路层。
在一些实施例中，钉头与电路层相抵接的面为斜面，且钉头的厚度由靠近钉杆朝向远离钉杆逐渐递减。
在一些实施例中，连接件的材料与金属基板的材料相同。
在一些实施例中，连接件与金属基板一体成型。
作为本公开实施例的第二个方面，本公开实施例提供一种PCB板的制作方法，方法包括：
提供一金属基板；
在金属基板上设置绝缘层，绝缘层上设置有穿孔；
在穿孔中设置连接件，连接件与金属基板抵接；
在绝缘层背离金属基板的一侧设置电路层，电路层与连接件抵接，以电性连通金属基板和电路层。
在一些实施例的制作方法中，电路层上设置有第一孔，第一孔与穿孔相互连通，连接件设置于第一孔中，且连接件的一端抵接在金属基板上，连接件的另一端抵接在电路层上以电性连通金属基板与电路层。
在一些实施例的制作方法中，第一孔为第一盲孔，第一盲孔的开孔方向朝向绝缘层。
在一些实施例的制作方法中，第一孔为第一通孔。
在一些实施例的制作方法中，金属基板上设置有第二孔，第二孔与穿孔相互连通，连接件设置于第二孔中，且连接件的一端抵接在金属基板上，连接件的另一端抵接在电路层上以电性连通金属基板与电路层。
在一些实施例的制作方法中，第二孔为第二盲孔，第二盲孔的开孔方向朝向绝缘层。
作为本公开实施例的第三个方面，本公开实施例提供一种PCB板的制作方法，方法包括：
将金属基板、绝缘层以及电路层依次压合形成金属基板PCB；
开设穿孔，穿孔至少贯穿绝缘层；
将连接件放置入穿孔中，连接件与金属基板、电路层均抵接，以电性连通金属基板和电路层。
 有益效果
本申请实施例中，通过连接件抵接电路层以及连接件与金属基板相接触，实现了金属基板与电路层之间可靠的电气连接。此外，在本申请实施例中，连接件的大小略大于穿孔的孔径，连接件置于穿孔中时，连接件与穿孔过盈配合，穿孔能够牢固地卡住连接件，确保了连接件在穿孔中的稳定性。故而，本申请实施例提供的PCB板保证了电路层与金属基板的可靠与稳定连接，有利于实现金属基板PCB较为复杂的线路排版。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其有益效果显而易见。
图1为本申请实施例提供的绝缘层上设穿孔时的PCB板的结构示意图。
图2为本申请实施例提供的电路层上开设通孔时的PCB板的结构示意图。
图3为本申请实施例提供的金属基板上开设盲孔时的PCB板的结构示意图。
图4为本申请实施例提供的PCB板上开设通孔时的PCB板的结构示意图。
图5为本申请实施例提供的PCB板上开设通孔时的PCB板的另一结构示意图。
图6为本申请实施例提供的PCB板上开设通孔时的PCB板的又一结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种PCB板100，该PCB板100例如可以为LED（light-emitting diode，发光二极管）背光板的PCB板100。
请参考图1，图1为本申请实施例提供的绝缘层120上设穿孔时的PCB板100的结构示意图。
PCB板100包括金属基板110、绝缘层120、电路层130和连接件140。
其中，PCB板100以金属基材作为基板，金属具有良好的导热性，因此，以金属基材作为基板的PCB板100具有良好的散热效果。例如，金属基板可以是铝基板；可以是铜基板等。
金属基板110的一侧面上设置有绝缘层120。绝缘层120可以由环氧玻璃布粘结片构成，也可以由高导热的环氧树脂或其它树脂构成，还可以是由聚烯烃树脂或聚酰亚胺树脂玻璃布粘结片构成。使用者可以根据PCB板100的应用场景选择相适应的材料作为绝缘层120，此处不做限制。
并且，如图1所示，绝缘层120上设置有穿孔。穿孔的位置、形状、数量、大小可以根据实际应用场景进行选择设置，此处不作出具体限定。例如，穿孔可以设置在中间；也可以设置在四角等位置。例如，穿孔可以是圆形孔；也可以是方形孔等形状。例如，穿孔的数量可以是一个；也可以是四个；还可以是六个等。
绝缘层120背离金属基板110的一侧设置有电路层130。电路层130可以是铜箔层；可以是铝箔层；可以是铝合金箔层；还可以是铜合金箔层等。在本实施例中，电路层130是以铜箔层为例，但是并不能将铜箔层作为是本申请实施例的限定。
连接件140设置于穿孔中，以电性连通金属基板110与电路层130。可以理解的是，连接件140是由导电材料制备而成的，例如连接件140可以是由金属元素制作而成，比如铜、铝等；还是合金制作而成，比如铝合金、铁、铜合金等；还可以是由复合金属制作而成。
另外，需要说明的是，连接件140的结构大小很重要，因为其结构大小不仅影响金属基板110与电路层130之间电性连接的可靠性，也将影响生产过程中的可靠性与自动化性能。为了保证连接件140能够稳定的抵接金属基板110和电路层130以电性连通金属基板110和电路层130。因此，连接件140的大小应略大于穿孔的孔径，当连接件140放置于穿孔中时，连接件140与穿孔过盈配合，穿孔能够很好的卡住连接件140。避免连接件140在穿孔内移动而导致连接件140与金属基板110以及电路层130抵接的不完全，从而使得连接件140无法以电性连通金属基板110和电路层130。
在本实施例中，在绝缘层120上设置穿孔后，将连接件140放置在穿孔中，通过连接件140与穿孔过盈连接以电性连通金属基板110和电路层130，保证了连接件140与金属基板110的可靠连接，有利于实现金属基板PCB较为复杂的线路排版
在一种实施方式中，如图2所示，电路层130上设置有第一孔，第一孔与穿孔相互连通，连接件140设置于第一孔中，且连接件140的一端抵接在金属基板110上，连接件140的另一端抵接在电路层130上以电性连通金属基板110和电路层130。
在一种实施方式中，第一孔为第一盲孔，第一盲孔的开孔方向朝向绝缘层120。可以理解的是，连接件140的长度长于穿孔的深度。当将连接件140放置于穿孔后，连接件140伸出穿孔的长度部分伸入进第一盲孔内。为了避免连接件140与电路层130之间抵接的不稳定，导致金属基板110和电路层130之间无法电性连通。连接件140的大小应略大于第一盲孔的孔径，使得连接件140伸入进第一盲孔内的部分与第一盲孔过盈配合，能够有效的确保了连接件140与电路层130之间抵接的可靠性。
另外，将第一孔设置成第一盲孔，是因为第一盲孔的设计可以使得连接件140不需要伸出到电路层130的外表面与电路层130的外表面相抵接。如此设计，可以大大的缩小了连接件140的长度，减少了连接件140的使用材料，有效的节约了PCB板100的制作成本。
在一种实施方式中，如图2所示，第一孔为第一通孔。在实际应用中，在电路层130上设置第一通孔，一方面更加利于操作，例如在开设穿孔时，只需要将穿孔贯穿电路层130即可。另一方面，在电路层130上开设第一通孔，可以通过第一通孔准确的观察连接件140与金属基板110之间的接触情况。
在一种实施方式中，如图5所示，第一通孔的孔径大于穿孔的孔径。此时，第一通孔和穿孔相结合形成“T”形孔，“T”形孔的存在可以将连接件140埋设在“T”形孔中，可以使得PCB板100的表面平整美观。
在一种实施方式中，如图3所示，金属基板110上设置有第二孔，第二孔与穿孔相互连通，连接件140设置于第二孔中，且连接件140的一端抵接在金属基板110上，连接件140的另一端抵接在电路层130上以电性连通金属基板110和电路层130。
在一种实施方式中，如图3所示，第二孔为第二盲孔，第二盲孔的开孔方向朝向绝缘层120。可以理解的是，连接件140的长度长于穿孔的深度。当将连接件140放置于穿孔后，连接件140伸出穿孔的长度部分伸入进第二盲孔内。为了避免连接件140与金属基板110之间抵接的不稳定，导致金属基板110和电路层130之间无法电性连通。连接件140的大小应略大于第二盲孔的孔径，使得连接件140伸入进第二盲孔内的部分与第二盲孔过盈配合，能够有效的确保了连接件140与金属基板110之间抵接的可靠性。
另外，将第二孔设置成第二盲孔，是因为第二盲孔的设计可以使得连接件140不需要伸出到金属基板110的外表面与金属基板110的外表面相抵接。如此设计，可以大大的缩小了连接件140的长度，减少了连接件140的使用材料，有效的节约了PCB板100的制作成本。
在一种实施方式中，如图4和图5所示，第二孔为第二通孔。在实际应用中，在金属基板110上设置第二通孔，一方面更加利于操作，例如在开设穿孔时，只需要将穿孔贯穿金属基板110即可。另一方面，在金属基板110上开设第二通孔，可以通过第二通孔准确的观察连接件140与电路层130之间的接触情况。
在一种实施方式中，第二通孔的孔径大于穿孔的孔径。此时，第二通孔和穿孔相结合形成“T”形孔，“T”形孔的存在可以将连接件140埋设在“T”形孔中，可以使得PCB板100的表面平整美观。
在一种实施方式中，连接件140为金属铆钉，金属铆钉包括钉头和钉杆，金属铆钉设置在穿孔内，钉头与电路层130相抵接，钉杆与金属基板110相抵接以电性连通金属基板110和电路层130。
在本实施例中，金属铆钉可以是由铜制作而成；还可以是铝制作而成；还可以是铜合金、铝合金等合金材料制作而成。由于金属的导热性能较佳，因此，金属铆钉还能够将热量导出，使得PCB板100具有较佳的散热性能。
另外，在本实施例中，金属铆钉的钉头为圆形。可以想到的是，金属铆钉的钉头还可以是其他形状，如方形等。但可以理解的是圆形钉头更加有利于产业化。但是需要注意的是，无论金属铆钉的钉头是何种形状，只需要保证钉头与电路层130相接触的面的平整性即可，确保金属铆钉与电路层130之间尽可能多的接触，保证电路层130与金属基板110之间的电性连通的可靠性。
在一种实施方式中，如图6所示，钉头与电路层130相接触的表面为斜面，且钉头的厚度由靠近钉杆朝向远离钉杆逐渐递减。
在本实施例中，通过将钉头与电路层130相接触的表面为斜面，一方面斜面可以增加金属铆钉与电路层130之间的接触面积，保证电路层130与金属基板110之间的电性连通的可靠性；另一方面，钉头的斜面方便将金属铆钉进一步的埋设中穿孔中，有利于降低金属铆钉与电路层130之间的高度差，有效的增加了PCB板100表面的平整性，可以使得PCB板100更加美观。
在一种实施方式中，连接件140是由与金属基板110相同的材料制备而成，且连接件140与金属基板110一体成型。
具体操作如下：
在PCB板100上需要进行电气连接的位置的两侧各放置一个固定件，固定件放置在电路层130上；然后在对应位置的金属基板110的下方放置一个顶块；压住固定件后，对顶块施加作用力，使得顶块将PCB板100上需要进行电气连接的位置处的PCB板100冲出一部分，使得冲出的PCB板100的部分的金属基板110的高度高于电路层130；最后保持顶块不动，移开固定件，在冲出的PCB板100的部分的上端放置一个压块，对压块施加作用力后，挤压冲出的PCB板100的部分，使得冲出的PCB板100的部分的金属基板110变形朝向两侧移动，最终使得冲出的PCB板100的部分的金属基板110与电路层130相接触形成电性连通。
另外，根据实际需要选择相适应的压块。例如，压块与冲出的PCB板100的部分相接触的面为平整面的时候，冲出的PCB板100的部分的金属基板110与电路层130相接触的面则为平面；例如，压块与冲出的PCB板100的部分相接触的面为锥面的时候，则冲出的PCB板100的部分的金属基板110与电路层130相接触的面则为斜面。
作为本公开实施例的第二个方面，本公开实施例提供一种PCB板100的制作方法，适用于上述实施例的PCB板100，方法包括：
提供一金属基板110；
在金属基板110上设置绝缘层120，绝缘层120上设置有穿孔；
在穿孔中设置连接件140，连接件140与金属基板110抵接；
在绝缘层120背离金属基板110的一侧设置电路层130，电路层130与连接件140抵接，以电性连通金属基板110和电路层130。
作为本公开实施例的第三个方面，本公开实施例提供一种PCB板100的制作方法，适用于上述实施例的PCB板100，方法包括
将金属基板110、绝缘层120以及电路层130依次压合形成金属基板PCB；
开设穿孔，穿孔至少贯穿绝缘层120；
将连接件140放置入穿孔中，连接件140与金属基板110、电路层130均抵接，以电性连通金属基板110和电路层130。
首先，将金属基板110、绝缘层120以及电路层130依次压合形成金属基板PCB的具体操作为：在绝缘层120的一表面通过粘接剂将金属基板110粘贴在绝缘层120的表面上，然后在绝缘层120的另一表面通过粘接剂覆盖一层电路层130，将通过粘接剂粘贴在一起的金属基板110、绝缘层120以及电路层130再经过压合工艺，使得金属基板110、绝缘层120以及电路层130之间的连接更紧密形成初步的金属基板PCB。
其次，在金属基板PCB上需要电气连接的位置通过工具（根据使用者的操作习惯选择合适的工具，不作具体要求）钻出穿孔或者冲出穿孔，穿孔至少贯穿绝缘层120。例如，穿孔可以贯穿绝缘层120和电路层130，不经过金属基板110；例如，穿孔可以贯穿绝缘层120和电路层130，经过金属基板110，在金属基板110上形成盲孔；例如，穿孔可以贯穿绝缘层120和金属基板110，不经过电路层130；例如，穿孔可以贯穿绝缘层120和金属基板110，经过电路层130，在电路层130上形成盲孔；例如，穿孔可以贯穿绝缘层120和电路层130，经过金属基板110，在金属基板110上形成通孔，此时，穿孔同时贯穿金属基板110、绝缘层120和电路层130。
最后，将连接件140放置入穿孔中，由于要确保连接件140的稳定性，因此连接件140与穿孔时过盈配合。所以将连接件140初步放入穿孔时，还需要对连接件140施加力，向下挤压连接件140，使得连接件140抵接电路层130的同时，还与金属基板110相接触，最终以电性连通金属基板110和电路层130。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本申请实施例所提供的贴胶设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种PCB板，其中，包括：
    金属基板；
    绝缘层，设置于所述金属基板一侧，所述绝缘层上设置有穿孔；
    电路层，设置于所述绝缘层背离所述金属基板的一侧；
    连接件，设置于所述穿孔中，以电性连通所述金属基板与所述电路层。
  2. 根据权利要求1所述的PCB板，其中，所述电路层上设置有第一孔，所述第一孔与所述穿孔相互连通，所述连接件设置于所述第一孔中，且所述连接件的一端抵接在所述金属基板上，所述连接件的另一端抵接在所述电路层上以电性连通所述金属基板与所述电路层。
  3. 根据权利要求2所述的PCB板，其中，所述第一孔为第一盲孔，所述第一盲孔的开孔方向朝向所述绝缘层。
  4. 根据权利要求2所述的PCB板，其中，所述第一孔为第一通孔。
  5. 根据权利要求4所述的PCB板，其中，所述第一通孔的孔径大于所述穿孔的孔径。
  6. 根据权利要求1所述的PCB板，其中，所述金属基板上设置有第二孔，所述第二孔与所述穿孔相互连通，所述连接件设置于所述第二孔中，且所述连接件的一端抵接在所述金属基板上，所述连接件的另一端抵接在所述电路层上以电性连通所述金属基板与所述电路层。
  7. 根据权利要求6所述的PCB板，其中，所述第二孔为第二盲孔，所述第二盲孔的开孔方向朝向所述绝缘层。
  8. 根据权利要求6所述的PCB板，其中，所述第二孔为第二通孔。
  9. 根据权利要求8所述的PCB板，其中，所述第二通孔的孔径大于所述穿孔的孔径。
  10. 根据权利要求1至9任一权利要求所述的PCB板，其中，所述连接件为金属铆钉，所述金属铆钉包括钉头和钉杆，所述金属铆钉设置在所述穿孔内，所述钉头与所述电路层相抵接，所述钉杆与所述金属基板相抵接以电性连通所述金属基板和所述电路层。
  11. 根据权利要求10所述的PCB板，其中，所述钉头与所述电路层相抵接的面为斜面，且所述钉头的厚度由靠近所述钉杆朝向远离所述钉杆逐渐递减。
  12. 根据权利要求1所述的PCB板，其中，所述连接件的材料与所述金属基板的材料相同。
  13. 根据权利要求12所述的PCB板，其中，所述连接件与所述金属基板一体成型。
  14. 一种PCB的制作方法，用于制备PCB板，其中，所述方法包括：
    提供一金属基板；
    在所述金属基板上设置绝缘层，所述绝缘层上设置有穿孔；
    在所述穿孔中设置连接件，所述连接件与所述金属基板抵接；
    在所述绝缘层背离所述金属基板的一侧设置电路层，所述电路层与所述连接件抵接，以电性连通所述金属基板和所述电路层。
  15. 根据权利要求14所述的PCB的制作方法中，其中，所述电路层上设置有第一孔，所述第一孔与所述穿孔相互连通，所述连接件设置于所述第一孔中，且所述连接件的一端抵接在所述金属基板上，所述连接件的另一端抵接在所述电路层上以电性连通所述金属基板与所述电路层。
  16. 根据权利要求15所述的PCB的制作方法中，其中，所述第一孔为第一盲孔，所述第一盲孔的开孔方向朝向所述绝缘层。
  17. 根据权利要求15所述的PCB的制作方法中，其中，所述第一孔为第一通孔。
  18. 根据权利要求14所述的PCB的制作方法中，其中，所述金属基板上设置有第二孔，所述第二孔与所述穿孔相互连通，所述连接件设置于所述第二孔中，且所述连接件的一端抵接在所述金属基板上，所述连接件的另一端抵接在所述电路层上以电性连通所述金属基板与所述电路层。
  19. 根据权利要求17所述的PCB的制作方法中，其中，所述第二孔为第二盲孔，所述第二盲孔的开孔方向朝向所述绝缘层。
  20. 一种PCB的制作方法，用于制备PCB板，其中，所述方法包括：
    将金属基板、绝缘层以及电路层依次压合形成金属基板PCB；
    开设穿孔，所述穿孔至少贯穿所述绝缘层；
    将连接件放置入所述穿孔中，所述连接件与所述金属基板、所述电路层均抵接，以电性连通所述金属基板和所述电路层。
PCT/CN2023/072376 2022-04-18 2023-01-16 一种pcb板及其制作方法 Ceased WO2023202174A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578927A (zh) * 2007-01-19 2009-11-11 住友电气工业株式会社 印刷布线板及其制造方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置
CN102811554A (zh) * 2011-06-02 2012-12-05 熊大曦 大功率电子器件模组用基板及其制备方法
CN106376176A (zh) * 2016-09-14 2017-02-01 广东达进电子科技有限公司 电路板及其制作方法
CN115134998A (zh) * 2022-04-18 2022-09-30 深圳Tcl新技术有限公司 一种pcb板及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578927A (zh) * 2007-01-19 2009-11-11 住友电气工业株式会社 印刷布线板及其制造方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置
CN102811554A (zh) * 2011-06-02 2012-12-05 熊大曦 大功率电子器件模组用基板及其制备方法
CN106376176A (zh) * 2016-09-14 2017-02-01 广东达进电子科技有限公司 电路板及其制作方法
CN115134998A (zh) * 2022-04-18 2022-09-30 深圳Tcl新技术有限公司 一种pcb板及其制作方法

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