WO2023202118A1 - 一种晶圆载台装置 - Google Patents

一种晶圆载台装置 Download PDF

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Publication number
WO2023202118A1
WO2023202118A1 PCT/CN2022/139932 CN2022139932W WO2023202118A1 WO 2023202118 A1 WO2023202118 A1 WO 2023202118A1 CN 2022139932 W CN2022139932 W CN 2022139932W WO 2023202118 A1 WO2023202118 A1 WO 2023202118A1
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Prior art keywords
shaft
stage device
wafer stage
assembly
cover
Prior art date
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PCT/CN2022/139932
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English (en)
French (fr)
Inventor
桑康
胡冬冬
陈龙保
刘朋飞
王铖熠
程实然
郭颂
许开东
Original Assignee
江苏鲁汶仪器股份有限公司
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Publication of WO2023202118A1 publication Critical patent/WO2023202118A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the technical field of wafer manufacturing, and specifically to a wafer stage device.
  • Ion beam etching and ion beam deposition are two common wafer processing processes.
  • ion beam etching uses ions with a certain energy to bombard the surface of the material to cause material atoms to sputter, thereby achieving the purpose of etching.
  • It is a purely physical process;
  • ion beam deposition uses an ion source to ion the material for deposition.
  • It is a vapor deposition method that deposits a film layer on the surface of the wafer under the action of an electric field. The purpose is to change the surface properties of the workpiece.
  • the ion source is generally in a fixed position, and the processing position is adjusted by rotating the wafer, and the entire processing process is in a vacuum environment.
  • a stage device for supporting the wafer in the prior art which can provide a driving force to meet the movement form required for wafer processing.
  • the existing stage devices mostly use dedicated vacuum drive components.
  • the entire equipment is configured and exposed to the vacuum environment, which is costly and not conducive to product maintenance.
  • the equipment takes up a large space, especially the wafer axis. The upward one takes up more space.
  • the purpose of this application is to provide a wafer stage device that can be easily assembled and maintained, has a high degree of integration, can be smaller in size, and can occupy less space.
  • a wafer stage device including: a housing assembly connected to the atmospheric environment, the housing assembly including a support plate; a rotating stage assembly for supporting the wafer; a magnetic fluid
  • the shaft includes an inner shaft and an outer shaft. Magnetic fluid is arranged between the inner shaft and the outer shaft.
  • the outer shaft is sealed and assembled on the support plate.
  • the inner shaft has a third shaft extending into the housing assembly. One end and a second end extending out of the housing assembly, the second end being connected to the rotary table assembly; a driving assembly located in the housing assembly, the driving assembly having a driving shaft, The driving shaft is arranged parallel to the inner shaft, and the driving shaft is drivingly connected to the first end.
  • the housing assembly can isolate the external vacuum environment from the internal atmospheric environment, and the driving assembly can be integrally assembled in the housing assembly.
  • the driving assembly only needs to use conventional components, the cost can be lower, and assembly can be facilitated. and maintenance;
  • the magnetic fluid shaft includes a rotationally sealed inner shaft and an outer shaft, which can transmit the power of the driving assembly to the rotary table assembly while isolating the internal and external environment, so as to drive the wafer to rotate through the rotary table assembly; at the same time, the magnetic The outer shaft and drive components of the fluid shaft are assembled on the housing component, so the overall integration level can be higher and the volume can be smaller.
  • the inner shaft and the driving shaft are arranged in parallel, and the driving assembly can be located on the radial side of the magnetic fluid axis, which is beneficial to reducing the axial space occupied by the stage device.
  • the rotary table assembly includes a support table and a crimping part, and the crimping part is used to press the wafer against the support table.
  • the rotary table assembly further includes a rotary body, the rotary body includes the crimping part, the force transmission component and the guide rod, the crimping part and the force transmission component are respectively located on the support table.
  • the guide rod passes through the support platform, and the two ends of the guide rod are connected to the crimping part and the force transmission component respectively.
  • the force transmission component includes an inner fixing piece, an outer fixing piece and a bearing, the outer fixing piece is connected to the outer ring of the bearing, the inner fixing piece is connected to the inner ring of the bearing;
  • the guide rod and the lifting body one is connected to the inner fixing part, and the other is connected to the outer fixing part.
  • the inner fixing part includes an inner cylinder part and a first blocking part, and the first blocking part is installed on the inner cylinder part, or the first blocking part and the inner cylinder part are integrated.
  • the inner ring outer sleeve is installed on the inner cylinder part, and the first stop part is used to axially stop one axial end of the inner ring.
  • the outer fixing member includes an outer cylinder part and a second blocking part, and the second blocking part is installed on the outer cylinder part, or the second blocking part and the outer cylinder part are integrated. structure, the outer cylinder part is mounted on the outer ring, and the second stop part is used to axially stop the outer ring.
  • the inner fixing member further includes an inner baffle fixed to the inner cylinder portion for axially stopping the other axial end of the inner ring.
  • the rotating body further includes a guide sleeve, the guide sleeve is installed on the support platform, and the guide rod is inserted into the guide sleeve.
  • a lifting assembly is also included, the lifting assembly includes a main body part and a lifting body, the main body part is located in the housing assembly, the lifting body is slidingly sealed with the support plate or the outer shaft, and The lifting body can interact with the force transmission component.
  • the lifting body and the force transmission component are fixedly connected.
  • the main body part further includes a cylinder and a lifting plate, the cylinder has a piston rod, the piston rod is connected to the lifting plate, and a plurality of the lifting bodies are installed on the lifting plate.
  • mounting seats are provided at both axial ends of the bellows.
  • the main body part includes a bellows, and the bellows outer cover is installed on the lifting body.
  • a dust cover is also included, and the dust cover is installed on the support platform and connected to the housing assembly.
  • a swivel joint is also included, the swivel joint being mounted on the inner shaft.
  • a slip ring is also included, and the slip ring is installed on the inner shaft.
  • the housing assembly further includes a first cover, which is sealingly installed on the support plate and forms a first space enclosed with the support plate.
  • the housing assembly further includes a second cover, the first cover is provided with a first gap, the second cover is sealingly installed on the first cover and can cover the first gap. , the second cover and the first cover enclose a second space, and the slip ring can extend into the second space from the first gap.
  • the housing assembly further includes a third cover
  • the support plate is provided with a second gap
  • the third cover is sealingly installed on the support plate and can cover the second gap, so
  • the third cover and the support plate enclose a third space
  • the driving assembly is installed on the support plate and partially extends into the third space.
  • it also includes a cylindrical revolution shaft, which is installed on the third cover and can communicate with the third space.
  • Figure 1 is a schematic structural diagram of a specific implementation of the wafer stage device provided by the present application.
  • Figure 2 is an installation structural diagram of the wafer stage device in Figure 1 in a vacuum chamber
  • Figure 3 is a schematic structural diagram of the rotating body
  • Figure 4 is a cross-sectional view of the force transmission component
  • Figure 5 is a schematic structural diagram of the lifting assembly
  • Figure 6 is a connection structural diagram of the lifting body, magnetic fluid shaft and force transmission components
  • Figure 7 is a schematic structural diagram of the driving assembly.
  • Rotary table assembly 21 support table, 22 rotating main body, 221 crimping part, 222 force transmission part, 222a internal fixing part, 222a-1 inner cylinder part, 222a-2 first blocking part, 222a-3 inner baffle, 222b external fixing piece, 222b-1 outer cylinder, 222b-2 second stopper, 222c bearing, 223 guide rod, 224 guide sleeve;
  • 5 lifting assembly 51 main part, 511 cylinder, 512 sensor, 513 lifting plate, 514 bellows, 515 first mounting base, 516 second mounting base, 52 lifting body;
  • A is the first space
  • B is the second space
  • C is the third space
  • D is the first vacuum space
  • E is the second vacuum space.
  • Magnetic fluid also known as magnetic liquid or ferrofluid, is a colloidal material composed of solid and liquid two phases.
  • the solid phase mainly refers to magnetic solid nanoparticles
  • the liquid phase refers to a liquid that can carry solid magnetic nanoparticles.
  • Magnetic fluid has It has the fluidity, lubrication and sealing properties of the liquid carrier, as well as the strong magnetism and other properties of the solid nanoparticles.
  • Magnetic fluid seal uses permanent magnets to fix the magnetic fluid between the inner shaft and the outer shaft. Since the gap between the inner shaft and the outer shaft is very small and the magnetic field intensity is particularly strong, it can withstand larger forces along the axis. Thrust to achieve sealing effect.
  • the inner shaft, the outer shaft and the magnetic fluid disposed between them can be collectively referred to as the magnetic fluid axis.
  • stage device As mentioned in the background art section, the driving components used in existing stage devices are mostly vacuum driven components.
  • the stage device is assembled as a whole and exposed to a vacuum environment, which is costly and is not conducive to product assembly and maintenance. It takes up a lot of space.
  • embodiments of the present application provide a wafer stage device, which isolates the internal space (atmospheric environment) of the housing assembly from the external space (vacuum environment) by providing a housing assembly.
  • the driving assembly can be provided on the housing assembly.
  • the driving assembly can be located in the atmospheric environment. In this way, the driving assembly only needs to use conventional components, the cost is lower, and the difficulty of assembly and maintenance can be lowered.
  • Figure 1 is a schematic structural diagram of a specific implementation of the wafer stage device provided by the present application.
  • Figure 2 is an installation structural diagram of the wafer stage device in Figure 1 in a vacuum chamber.
  • Figure 3 is a schematic structural diagram of the rotating body
  • Figure 4 is a cross-sectional view of the force transmission component
  • Figure 5 is a schematic structural diagram of the lifting component
  • Figure 6 is a structural diagram of the connection between the lifting body, the magnetic fluid shaft and the force transmission component
  • Figure 7 is the drive Schematic diagram of the component structure.
  • the present application provides a wafer stage device, including: a housing assembly 1.
  • the internal space of the housing assembly 1 is connected to the atmospheric environment. That is to say, the housing assembly 1
  • the internal space is an atmospheric environment.
  • the housing assembly 1 includes a support plate 11; a rotating stage assembly 2 for supporting the wafer; a magnetic fluid shaft 3 including an inner shaft 31 and an outer shaft 32.
  • the inner shaft 31 and the outer shaft 32 can face each other. Rotation, a magnetic fluid 33 is provided between the inner shaft 31 and the outer shaft 32 to achieve sealing between the inner shaft 31 and the outer shaft 32.
  • the outer shaft 32 is sealed and assembled (the specific sealing method may be to provide a sealing ring or a sealing gasket. etc.) on the support plate 11 as a fixed axis.
  • the inner shaft 31 has a first end extending into the housing assembly 1 and a second end extending out of the housing assembly 1. The second end is connected to the rotary table assembly 2 Connected; the driving assembly 4 is located in the housing assembly 1.
  • the driving assembly 4 has a driving shaft (not shown in the figure). The driving shaft is arranged parallel to the inner shaft 31, and the driving shaft is drivingly connected to the first end for driving The inner shaft 31 rotates.
  • the housing assembly 1 can isolate the external vacuum environment from the internal atmospheric environment, and the driving assembly 4 can be integrally assembled in the housing assembly 1.
  • the driving assembly 4 only needs to use conventional components, and the cost can be lowered.
  • the magnetic fluid shaft 3 includes a rotationally sealed inner shaft 31 and an outer shaft 32, which can transmit the power of the driving assembly 4 to the rotary table assembly 2 under the condition of isolating the internal and external environment, so as to pass through the rotary table assembly 2 to drive the wafer to rotate; at the same time, the outer shaft 32 of the magnetic fluid shaft 3 and the driving component 4 are assembled in the housing component 1, so the overall integration level can be higher and the volume can be smaller.
  • the inner shaft 31 and the driving shaft are arranged in parallel, and the driving assembly 4 can be located on the radial side of the magnetic fluid axis 3, which is beneficial to reducing the axial space occupied by the stage device.
  • the embodiments of the present application do not limit the specific structures of the housing assembly 1, the rotary table assembly 2 and the driving assembly 4. In practical applications, those skilled in the art can design according to specific needs, as long as they can meet the requirements of use. .
  • the following embodiments of the present application will also exemplify the structures of each of the above components one by one.
  • the rotating stage assembly 2 is used to support the wafer to facilitate processing of the wafer.
  • the processing process includes but is not limited to the ion beam etching and ion beam deposition mentioned in the background art.
  • the rotary table assembly 2 may include a support table 21 and a crimping part 221 , where the support table 21 is used to directly support the wafer, and the crimping part 221 is used to directly support the wafer. Clamp the wafer to ensure the reliability of wafer fixation.
  • the crimping part 221 may be an integral annular component, or may include several separate parts distributed in the circumferential direction.
  • the rotary table assembly 2 may also include a rotary body 22 , and the rotary body 22 may include the aforementioned crimping part 221 , force transmission component 222 and guide rod 223 .
  • the crimping part 221 and the force transmission component 222 can be respectively located on both axial sides of the support platform 21, and the guide rod 223 is slidably assembled on the support platform 21. That is to say, the guide rod 223 can slide relative to the support platform 21. Both ends of the guide rod 223 can be connected to the crimping portion 221 and the force transmission component 222 respectively, so that the rotating body 22 and the support platform 21 can form an integral component, which can improve the integration level.
  • the support platform 21 may be provided with a through hole (not shown in the figure), and the guide rod 223 may be inserted into the through hole to realize sliding of the guide rod 223 relative to the support platform 21 .
  • the rotating body 22 can also include a guide sleeve 224.
  • the guide sleeve 224 can be installed on the support platform 21. Specifically, it can be installed on the axial side of the support platform 21 or inside the support platform 21.
  • the guide rod 223 can also be inserted into the support platform 21. Connected to guide sleeve 224.
  • the guide sleeve 224 is a special guide accessory with higher guide accuracy and is more conducive to ensuring the sliding direction of the guide rod 223. It can be understood that the guide sleeve 224 may not exist. In this case, the guide rod 223 may be guided through the through hole.
  • the lifting assembly 5 includes a main body part 51 and a lifting body 52 .
  • the main part 51 can also be located in the housing assembly 1, so that the lifting assembly 5 is basically located in the atmospheric environment.
  • the lifting assembly 5 can also use conventional components to facilitate assembly and maintenance.
  • the lifting body 52 can be slidably sealed with the support plate 11 or the outer shaft 32 so as not to affect the isolation between the atmospheric environment and the vacuum environment.
  • the lifting body 52 can be connected to the force transmission component 222 to drive the rotating body 22 to lift.
  • the lifting body 52 can drive the crimping part 221 to lift through the force transmission component 222 and the guide rod 223.
  • the wafer can be placed conveniently.
  • the crimping part 221 is relatively close to the support table 21 , the wafer can be pressed and fixed.
  • the pressing and fixing of the wafer by the crimping part 221 can rely on its own gravity or the force of the lifting component 5, which is specifically related to the connection method of the lifting body 52 and the force transmission component 222. .
  • the lifting body 52 and the force transmission component 222 are fixedly connected (the connection method is not limited)
  • the pressing portion 221 can press the wafer under the action of the lifting assembly 5 .
  • the lifting body 52 and the force transmission member 222 are only in abutting contact, that is to say, when the lifting body 52 can only generate a lifting force on the crimping portion 221 but cannot generate a downward pulling force, the crimping portion 221 can be on its own.
  • the wafer is compressed under the action of gravity.
  • the force transmission component 222 may include an inner fixing part 222a, an outer fixing part 222b and a bearing 222c.
  • the outer fixing part 222b is connected to the outer ring of the bearing 222c
  • the inner fixing part 222a is connected to the inner ring of the bearing 222c; in the bearing 222c
  • the outer fixing part 222b and the inner fixing part 222a can rotate relatively.
  • the guide rod 223 and the lifting body 52 one can be connected to the inner fixing part 222a, and the other can be connected to the outer fixing part 222b to overcome the rotational interference problem existing between the lifting body 52 and the guide rod 223.
  • the application embodiment is mainly explained by taking the guide rod 223 connected to the outer fixing part 222b and the lifting body 52 connected to the inner fixing part 222a as an example.
  • the structural forms of the inner fixing part 222a and the outer fixing part 222b can be diverse, as long as the connection reliability between the inner fixing part 222a, the outer fixing part 222b and the bearing 222c can be ensured.
  • the inner fixing member 222a may include an inner cylinder part 222a-1 and a first blocking part 222a-2.
  • the first blocking part 222a-2 may be installed on the inner cylinder part.
  • the inner ring of the bearing 222c can be mounted on the inner cylinder part 222a-1, and the first blocking part 222a-2 It can be used to axially stop the axial end of the inner ring (the lower end in Figure 4);
  • the outer fixing part 222b can include an outer cylinder part 222b-1 and a second stopper part 222b-2.
  • the second stopper part 222b-2 It can be installed on the outer cylinder part 222b-1, or the second stopper part 222b-2 and the outer cylinder part 222b-1 can be an integrated structure, and the outer cylinder part 222b-1 can be installed on the outer ring of the bearing 222c.
  • the stop portion 222b-2 is used to axially stop the outer ring; in this way, the bearing 222c can be installed and fixed more stably.
  • the inner fixing member 222a can also include an inner baffle 222a-3, and the inner baffle 222a-3 can be fixed to the inner cylinder portion 222a-1.
  • the specific fixing method can be screw connection, clamping, riveting, welding, etc., It is used to provide axial stop to the other axial end of the inner ring of bearing 222c. Please continue to refer to Figure 4.
  • the inner baffle 222a-3 can be located inside the second baffle 222b-2, and the installation structure is compact.
  • the embodiment of the present application does not limit the specific structural form of the lifting component 5.
  • the lifting assembly 5 can use driving elements such as cylinders and hydraulic cylinders that can directly output linear displacement.
  • the aforementioned lifting body 52 can be the piston rod of these driving elements; or the lifting assembly 5 can also use a motor, etc.
  • a displacement conversion mechanism in the form of a gear rack and pinion mechanism, a screw mechanism, etc. is also needed to convert the directly output rotational displacement into the required linear displacement.
  • the aforementioned lifting body 52 can be a rack.
  • the lifting assembly 5 can use a standard cylinder.
  • the main part 51 can include a cylinder 511 , a piston rod (not labeled in the figure) and a lifting plate 513 .
  • the piston rod can telescope within the cylinder 511 , thereby
  • the lifting plate 513 is driven to lift, and the aforementioned lifting body 52 can be installed on the lifting plate 513 .
  • the lifting plate 513 is equivalent to a transitional connection piece, on which multiple lifting bodies 52 can be installed (two lifting bodies 52 in the drawing), and multi-point driving can be achieved through one cylinder. In this way, on the one hand , can reduce the number of cylinders used to save costs, and can avoid the problem of inconsistent movements caused by using multiple cylinders.
  • multi-point drive is also more conducive to ensuring the stability of the lifting of the force transmission component 222.
  • the cylinder 511 is also provided with a sensor 512 for monitoring the stroke of the cylinder 511 in order to control the cylinder 511.
  • the main part 51 can also include a first mounting base 515 and a second mounting base 516.
  • the first mounting base 515 can be installed on the lifting plate 513, and the lifting body 52 can be installed on the first mounting base.
  • the base 515 and the second mounting base 516 can be wrapped around the lifting body 52 , and the second mounting base 516 can be fixedly connected to the outer shaft 32 .
  • a bellows 514 may also be provided.
  • the bellows 514 may be wrapped around the lifting body 52 , and one end of the bellows 514 may be connected to the second mounting base 516 , and the other end may be connected to the first mounting base 515 .
  • the arrangement of the bellows 514 can be used to isolate the vacuum environment from the atmospheric environment, and the bellows 514 has a certain elastic deformation ability. When the cylinder is inflated to drive the rotating body 22 upward, the bellows 514 can be compressed, and when the cylinder is deflated, the bellows 514 can be used to isolate the vacuum environment from the atmospheric environment. , the elastic force of the bellows 514 can also be released to drive the crimping portion 221 to quickly reset. Moreover, the bellows 514 can also be used to limit the stroke of the cylinder 511.
  • the sliding seal method is not limited to the bellows 514, and can also be implemented by providing an annular seal in the form of a sealing ring or the like.
  • the driving component 4 may be a motor 41, and the rotating shaft of the motor 41 may be directly connected to the inner shaft 31 for rotation.
  • the rotating shaft of the motor 41 is a driving shaft.
  • the driving assembly 4 may also include a reducer 42 to adjust the transmission ratio.
  • the output shaft of the reducer 42 is the drive shaft.
  • the driving component 4 can be installed on the supporting platform 21 through the fixing plate 43. In this way, in the wafer stage device provided in this application, the magnetic fluid axis 3, the driving component 4 and the lifting component 5 are all installed on the supporting platform 21, which is compact. Sexuality can be greatly improved.
  • the transmission connection between the drive shaft and the inner shaft 31 includes but is not limited to gears, sprockets and pulleys.
  • a pulley transmission is used between the drive shaft and the inner shaft 31 .
  • the drive shaft can be equipped with a driving wheel 44
  • the inner shaft 31 can be equipped with a driven wheel 45 .
  • the jacket is equipped with a timing belt 46.
  • the wafer stage device provided in this application may also include a rotary joint 7 , and the rotary joint 7 is installed on the inner shaft 31 .
  • Helium gas, coolant, etc. can be delivered to the inner shaft 31 through the rotary joint 7 .
  • the wafer stage device may also include a slip ring 8, which may be installed on the inner shaft 31 for transporting cables such as wires and signal wires.
  • the housing assembly 1 can also include a first cover 12 and a second cover 13.
  • the first cover 12 can be installed in a sealed manner (the specific sealing method can be to provide a sealing ring, sealing gasket, etc.) on the support plate 11, the first cover shell 12 and the support plate 11 can be enclosed to form the first space A; the first cover shell 12 can be provided with a first gap 121, and the second cover shell 13 can be sealed and installed on the first gap 121.
  • a cover 12 can cover the first notch 121; the second cover 13 and the first cover 12 can enclose a second space B, and the slip ring 8 can extend into the second space B from the first notch 121. In this way, when the slip ring 8 and its nearby components need to be inspected and replaced, the second cover 13 can be directly removed without dismantling the first cover 12, making the equipment inspection and maintenance more convenient.
  • the housing assembly 1 can also include a third cover 14.
  • the support plate 11 can be provided with a second gap 111.
  • the third cover 14 can be installed in a sealed manner (the specific sealing method can be to provide a sealing ring, a sealing gasket, etc.) on the support plate 11 and can cover the second gap 111; the third cover 14 and the support plate 11 can be enclosed to form a third space C, and the driving assembly 4 can be installed on the support plate 11 and can partially extend into the third space C.
  • the motor 41 of the driving assembly 4 may extend into the third space C.
  • the revolving shaft 9 may be installed on the third cover 14.
  • the third cover 14 may be provided with a third notch 141, and the internal space of the revolving shaft 9 may pass through the third notch. 141 is connected to the third space C.
  • the form of the driving structure connected to the revolution shaft 9 is not limited here. In specific practice, the revolution shaft 9 can be rotated first to adjust the use angle of the stage device; and then the lifting assembly 5 is controlled to lift to perform the loading and pressing operations of the wafer; and then the driving assembly 4 The supporting platform 21 is controlled to rotate.
  • the shell assembly 1 isolates the first space A, the second space B and the third space C. These three spaces can all be connected to the outside world through the revolution axis, thereby forming an atmosphere.
  • the magnetic fluid shaft 3, drive component 4, lifting component 5, rotary joint 7, and slip ring 8 of the carrier device are basically located in the atmospheric environment. Only the rotary stage component 2 of the carrier device is located in a vacuum environment.
  • a dust cover 6 may also be included.
  • the dust cover 6 may be installed on the support platform 21 and connected to the housing assembly 1 to reduce the possibility of dust falling into the force transmission component 222 and the magnetic fluid shaft 3 .
  • the dust cover 6 is provided to divide the vacuum environment into a first vacuum space D and a second vacuum space E.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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Abstract

一种晶圆载台装置，包括：与大气环境相连通的壳体组件，所述壳体组件包括支撑板；旋转台组件，用于支撑晶圆；磁流体轴，包括内轴和外轴，所述内轴和外轴之间设置有磁流体，所述外轴密封装配于所述支撑板，所述内轴具有伸入所述壳体组件内的第一端部和伸出所述壳体组件外的第二端部，所述第二端部与所述旋转台组件相连；驱动组件，位于所述壳体组件内，所述驱动组件具有驱动轴，所述驱动轴与所述内轴平行设置，且所述驱动轴与所述第一端部传动连接。上述晶圆载台装置可以方便装配和维护，且具备较高的集成度，体积可以较小，占用空间可以较少。

Description

一种晶圆载台装置
本申请要求于2022年04月20日提交中国专利局、申请号为202210417216.2、发明名称为“一种晶圆载台装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及晶圆制造技术领域，具体涉及一种晶圆载台装置。
背景技术
离子束刻蚀和离子束沉积是两种常见的晶圆加工工艺。其中，离子束刻蚀是利用具有一定能量的离子轰击材料表面，使材料原子发生溅射，从而达到刻蚀目的，属于纯物理过程；离子束沉积则是利用离子源将用作沉积的材料离子化，在电场作用下射向晶圆表面沉积成膜层，目的是改变工件表面性能，属气相沉积方法。
在工艺过程中，离子源一般是处于固定位置，然后通过旋转晶圆来调整加工位置，并且整个加工过程均是在真空环境中。为此，现有技术中存在用于支撑晶圆的载台装置，其能够提供驱动力，以满足晶圆加工所需要的运动形式。
但是，现有的载台装置多使用专用的真空驱动部件，设备整体配置并暴露在真空环境中，成本较高，也不利于产品维护；并且，设备的占用空间较大，尤其是晶圆轴向上的占用空间较大。
发明内容
本申请的目的是提供一种晶圆载台装置，可以方便装配和维护，且具备较高的集成度，体积可以较小，占用空间可以较少。
为解决上述技术问题，本申请提供一种晶圆载台装置，包括：与大气环境相连通的壳体组件，所述壳体组件包括支撑板；旋转台组件，用于支撑晶圆；磁流体轴，包括内轴和外轴，所述内轴和外轴之间设置有磁流体， 所述外轴密封装配于所述支撑板，所述内轴具有伸入所述壳体组件内的第一端部和伸出所述壳体组件外的第二端部，所述第二端部与所述旋转台组件相连；驱动组件，位于所述壳体组件内，所述驱动组件具有驱动轴，所述驱动轴与所述内轴平行设置，且所述驱动轴与所述第一端部传动连接。
采用上述方案，壳体组件可以实现外部真空环境与内部大气环境的隔离，驱动组件可以整体装配在壳体组件内，这样，驱动组件只需要采用常规部件即可，成本可以较低，能够方便装配和维护；磁流体轴包括转动密封的内轴和外轴，可以在隔离内外环境的条件下将驱动组件的动力传动至旋转台组件，以通过旋转台组件来带动晶圆进行转动；同时，磁流体轴的外轴以及驱动组件均是装配于壳体组件，整体的集成度也可以较高，体积可以较小。
并且，在本申请实施例中，内轴和驱动轴为平行设置，驱动组件可以位于磁流体轴的径向一侧，有利于缩减载台装置的轴向占用空间。
可选地，所述旋转台组件包括支撑台和压接部，所述压接部用于将所述晶圆压紧于所述支撑台。
可选地，所述旋转台组件还包括旋转主体，所述旋转主体包括所述压接部、传力部件和导向杆，所述压接部和所述传力部件分别位于所述支撑台的轴向两侧，所述导向杆穿过所述支撑台，且所述导向杆的两端分别与所述压接部、所述传力部件相连。
可选地，所述传力部件包括内固定件、外固定件和轴承，所述外固定件与所述轴承的外圈相连，所述内固定件与所述轴承的内圈相连；所述导向杆和所述升降体中，一者与所述内固定件相连，另一者与所述外固定件相连。
可选地，所述内固定件包括内筒部和第一挡部，所述第一挡部安装于所述内筒部，或者，所述第一挡部与所述内筒部为一体式结构，所述内圈外套安装于所述内筒部，所述第一挡部用于对所述内圈的轴向一端进行轴向止挡。
可选地，所述外固定件包括外筒部和第二挡部，所述第二挡部安装于所述外筒部，或者，所述第二挡部与所述外筒部为一体式结构，所述外筒部外套安装于所述外圈，所述第二挡部用于对所述外圈进行轴向止挡。
可选地，所述内固定件还包括内挡板，所述内挡板固定于所述内筒部，用于对所述内圈的轴向另一端进行轴向止挡。
可选地，所述旋转主体还包括导向套，所述导向套安装于所述支撑台，所述导向杆插接于所述导向套。
可选地，还包括升降组件，所述升降组件包括主体部分和升降体，所述主体部分位于所述壳体组件内，所述升降体与所述支撑板或者所述外轴滑动密封，且所述升降体能够与所述传力部件相作用。
可选地，所述升降体和所述传力部件固定连接。
可选地，所述主体部分还包括气缸和升降板，所述气缸具有活塞杆，所述活塞杆与所述升降板相连，所述升降板安装有若干所述升降体。
可选地，所述波纹管的轴向两端均设置有安装座。
可选地，所述主体部分包括波纹管，所述波纹管外套安装于所述升降体。
可选地，还包括防尘罩，所述防尘罩安装于所述支撑台，并与所述壳体组件相连。
可选地，还包括旋转接头，所述旋转接头安装于所述内轴。
可选地，还包括滑环，所述滑环安装于所述内轴。
可选地，所述壳体组件还包括第一罩壳，所述第一罩壳密封安装于所述支撑板，并与所述支撑板围合形成第一空间。
可选地，所述壳体组件还包括第二罩壳，所述第一罩壳设置有第一缺口，所述第二罩壳密封安装于第一罩壳，并能够覆盖所述第一缺口，所述第二罩壳和所述第一罩壳围合形成第二空间，所述滑环能够自所述第一缺口伸入所述第二空间。
可选地，所述壳体组件还包括第三罩壳，所述支撑板设置有第二缺口，所述第三罩壳密封安装于所述支撑板，并能够覆盖所述第二缺口，所述第三罩壳和所述支撑板围合形成第三空间，所述驱动组件安装于所述支撑板，并局部伸入所述第三空间。
可选地，还包括筒状的公转轴，所述公转轴安装于所述第三罩壳，并能够和所述第三空间相连通。
附图说明
图1为本申请所提供晶圆载台装置的一种具体实施方式的结构示意图；
图2为图1中晶圆载台装置在真空室内的安装结构图；
图3为旋转主体的结构示意图；
图4为传力部件的剖面图；
图5为升降组件的结构示意图；
图6为升降体、磁流体轴和传力部件的连接结构图；
图7为驱动组件的结构示意图。
图1-图7中的附图标记说明如下：
1壳体组件、11支撑板、111第二缺口、12第一罩壳、121第一缺口、13第二罩壳、14第三罩壳、141第三缺口；
2旋转台组件、21支撑台、22旋转主体、221压接部、222传力部件、222a内固定件、222a-1内筒部、222a-2第一挡部、222a-3内挡板、222b外固定件、222b-1外筒部、222b-2第二挡部、222c轴承、223导向杆、224导向套；
3磁流体轴、31内轴、32外轴、33磁流体；
4驱动组件、41电机、42减速器、43固定板、44主动轮、45从动轮、46同步带；
5升降组件、51主体部分、511缸体、512传感器、513升降板、514波纹管、515第一安装座、516第二安装座、52升降体；
6防尘罩；
7旋转接头；
8滑环；
9公转轴；
10真空室；
A第一空间、B第二空间、C第三空间、D第一真空空间、E第二真空空间。
具体实施方式
为了使本领域的技术人员更好地理解本申请的技术方案，下面结合附图和具体实施例对本申请作进一步的详细说明。
本文中所述“若干”是指数量不确定的多个，通常为两个以上；且当采用“若干”表示某几个部件的数量时，并不表示这些部件在数量上的相互关系。
本文中所述“第一”、“第二”等词，仅是为了便于描述结构和/或功能相同或者相类似的两个以上的结构或者部件，并不表示对于顺序和/或重要性的某种特殊限定。
磁流体又称为磁性液体或铁磁流体，其是一种固液两相组成的胶体材料，固相主要指磁性固体纳米颗粒，液相是指能够承载固体磁性纳米颗粒的液体，磁流体具有液态载体的流动性、润滑性、密封性，同时具有固体纳米颗粒的强磁性及其它特性。
磁流体密封就是用永久磁铁将磁流体固定在内轴和外轴之间，由于内轴和外轴之间的空隙很小，且其磁场强度特别大，从而能承受较大的沿轴线方向的推力，以达到密封的效果。内轴、外轴以及设置在二者之间的磁流体可以合称为磁流体轴。
如背景技术部分所述，现有载台装置中所使用驱动部件多为真空驱动部件，载台装置是整体装配并暴露在真空环境中，成本较高，且不利于产品的装配和维护，并且占用空间较大。
为此，本申请实施例提供一种晶圆载台装置，其通过设置壳体组件将壳体组件内部空间(大气环境)和外部空间(真空环境)相隔离，驱动组件可以设置在壳体组件内，也就是说，驱动组件可以是位于大气环境下，这样，驱动组件只需要采用常规部件即可，成本较低，装配以及维护难度均可以较低。
具体请参考图1-图7，图1为本申请所提供晶圆载台装置的一种具体实施方式的结构示意图，图2为图1中晶圆载台装置在真空室内的安装结构图，图3为旋转主体的结构示意图，图4为传力部件的剖面图，图5为升降组件的结构示意图，图6为升降体、磁流体轴和传力部件的连接结构图，图7为驱动组件的结构示意图。
如图1和图2所示，本申请提供一种晶圆载台装置，包括：壳体组件1，该壳体组件1的内部空间与大气环境相连通，也就是说，该壳体组件1的内部空间为大气环境，壳体组件1包括支撑板11；旋转台组件2，用于支撑晶圆；磁流体轴3，包括内轴31和外轴32，内轴31和外轴32能够相对转动，内轴31和外轴32之间设置有磁流体33，用于实现内轴31和外轴32之间的密封，外轴32密封装配(具体的密封方式可以是设置密封圈、密封垫等)于支撑板11，以作为定轴，内轴31具有伸入壳体组件1内的第一端部和伸出壳体组件1外的第二端部，第二端部与旋转台组件2相连；驱动组件4，位于壳体组件1内，驱动组件4具有驱动轴(图中未示出)，驱动轴与内轴31平行设置，且驱动轴与第一端部传动连接，用于带动内轴31进行转动。
采用上述方案，壳体组件1可以实现外部真空环境与内部大气环境的隔离，驱动组件4可以整体装配在壳体组件1内，这样，驱动组件4只需要采用常规部件即可，成本可以较低，能够方便装配和维护；磁流体轴3包括转动密封的内轴31和外轴32，可以在隔离内外环境的条件下将驱动组件4的动力传动至旋转台组件2，以通过旋转台组件2来带动晶圆进行转动；同时，磁流体轴3的外轴32以及驱动组件4均是装配于壳体组件1，整体的集成度也可以较高，体积可以较小。
并且，在本申请实施例中，内轴31和驱动轴为平行设置，驱动组件4可以位于磁流体轴3的径向一侧，有利于缩减载台装置的轴向占用空间。
这里，本申请实施例并不限定壳体组件1、旋转台组件2以及驱动组件4的具体结构，在实际应用中，本领域技术人员可以根据具体需要进行设计，只要能够满足使用的要求即可。以下本申请实施例也将逐一对上述各组件的结构进行示例性的说明。
旋转台组件2用于支撑晶圆，以便于对晶圆进行加工，加工的工艺包括但不限于背景技术中所提及的离子束刻蚀和离子束沉积。结合图1和图3，在附图的实施方式中，旋转台组件2可以包括支撑台21和压接部221，其中，支撑台21用于直接对晶圆进行支撑，压接部221用于对晶圆进行压紧，以保证晶圆固定的可靠性。压接部221可以为一体式的环形部件，也可以包括若干在周向上分布的分体。
旋转台组件2还可以包括旋转主体22，旋转主体22可以包括前述的压接部221、传力部件222和导向杆223。其中，压接部221和传力部件222可以分别位于支撑台21的轴向两侧，导向杆223可滑动地装配于支撑台21，也就是说，导向杆223可以相对支撑台21进行滑动，导向杆223的两端可以分别与压接部221、传力部件222相连，以使得旋转主体22与支撑台21可以构成一个整体部件，能够提高集成度。
支撑台21可以设置有过孔(图中未示出)，导向杆223可以穿插在过孔中，用于实现导向杆223相对支撑台21的滑动。
在此基础上，旋转主体22还可以包括导向套224，导向套224可以安装于支撑台21，具体可以是安装于支撑台21的轴向一侧或者支撑台21内，导向杆223还可以插接于导向套224。导向套224为专用导向配件，导向精度更高，更有利于保证导向杆223的滑动方向。可以理解的是，导向套224也可以不存在，此时，导向杆223可以是通过过孔进行导向。
进一步地，还可以包括升降组件5，升降组件5包括主体部分51和升降体52。主体部分51也可以位于壳体组件1内，这样，升降组件5基本也是位于大气环境中，升降组件5也可以采用常规部件，以便于装配和维护。升降体52则可以与支撑板11或者外轴32滑动密封，以不影响大气环境和真空环境的隔离，且升降体52能够与传力部件222相连，以便驱使旋转主体22进行升降。
在主体部分51的作用下，升降体52可以通过传力部件222、导向杆223带动压接部221进行升降。当压接部221相对地远离支撑台21时，可以方便晶圆的放置，而当压接部221相对地靠近支撑台21时，则可以实现对于晶圆的压紧固定。
需要指出的是，压接部221对于晶圆的压紧固定可以是依靠自身的重力，也可以是依靠升降组件5的作用力，这具体和升降体52与传力部件222的连接方式存在关联。在升降体52与传力部件222为固定连接(连接方式不作限定)时，压接部221可以在升降组件5的作用下对晶圆进行压紧。在升降体52与传力部件222仅为抵接接触时，也就是说，升降体52仅能够对压接部221产生顶升力、但不能够产生下拉力时，压接部221可以是在自身重力的作用下对晶圆进行压紧。
以升降体52和传力部件222固定连接作为示例。结合图4，传力部件222可以包括内固定件222a、外固定件222b和轴承222c，外固定件222b与轴承222c的外圈相连，内固定件222a与轴承222c的内圈相连；在轴承222c的作用下，外固定件222b和内固定件222a可以相对地转动。导向杆223和升降体52中，一者可以与内固定件222a相连，另一者可以与外固定件222b相连，以克服升降体52与导向杆223之间所存在的转动干涉问题，以下本申请实施例主要是以导向杆223与外固定件222b相连、升降体52与内固定件222a相连为例进行说明。
内固定件222a、外固定件222b的结构形式可以是多样的，只要能够保证内固定件222a、外固定件222b与轴承222c之间的连接可靠性即可。在一些可选的实施方式中，仍如图4所示，内固定件222a可以包括内筒部222a-1和第一挡部222a-2，第一挡部222a-2可以安装于内筒部222a-1，或者，第一挡部222a-2与内筒部222a-1可以为一体式结构，轴承222c的内圈可以外套安装于内筒部222a-1，第一挡部222a-2则可用于对内圈的轴向一端(图4中为下端)进行轴向止挡；外固定件222b可以包括外筒部222b-1和第二挡部222b-2，第二挡部222b-2可以安装于外筒部222b-1，或者，第二挡部222b-2与外筒部222b-1可以为一体式结构，外筒部222b-1可以外套安装于轴承222c的外圈，第二挡部222b-2用于对外圈进行轴向止挡；如此，即可以较为稳定地实现对于轴承222c的安装固定。
进一步地，内固定件222a还可以包括内挡板222a-3，内挡板222a-3可以固定于内筒部222a-1，具体的固定方式可以为螺钉连接、卡接、铆接、焊接等，用于对轴承222c内圈的轴向另一端进行轴向止挡。请继续参考图4，内挡板222a-3可以是位于第二挡部222b-2的内侧，安装结构紧凑。
这里，本申请实施例并不限定升降组件5的具体结构形式，在实际应用中，本领域技术人员可以根据需要进行选择。例如，该升降组件5可以采用气缸、液压油缸等能够直接输出直线位移的驱动元件，此时，前述的升降体52可以为这些驱动元件的活塞杆；或者，该升降组件5也可以采用电机等能够直接输出旋转位移的驱动元件，此时，还需要搭配齿轮齿条机构、丝杠机构等形式的位移转换机构，以将直接输出的旋转位移转换为所需要的直线位移，以采用齿轮齿条机构作为示例，前述的升降体52则可以 为齿条。
在图5的实施方式中，升降组件5可以采用标准气缸，主体部分51可以包括缸体511、活塞杆(图中未标注)和升降板513，活塞杆能够在缸体511内进行伸缩，从而带动升降板513进行升降，前述的升降体52可以安装于升降板513。采用这种结构，升降板513相当于过渡连接件，其上可以安装多根升降体52(附图中为两根升降体52)，进而可以通过一个气缸来实现多点驱动，如此，一方面，可以减少气缸的使用数量，以节约成本，并可避免使用多个气缸时所造成的动作不一致的问题，另一方面，多点驱动也更有利于保证传力部件222升降的稳定性。
缸体511还设置有传感器512，用于监控气缸511的行程，以便对气缸511进行控制。
请继续参考图5，并结合图6，主体部分51还可以包括第一安装座515和第二安装座516，第一安装座515可以安装于升降板513，升降体52可以安装于第一安装座515，第二安装座516可以外套于升降体52，且第二安装座516可以与外轴32固定连接。
进一步地，还可以设置有波纹管514，波纹管514可以外套于升降体52，其一端可以与第二安装座516相连，另一端可以与第一安装座515相连。波纹管514的设置可用于隔离真空环境和大气环境，并且，波纹管514具有一定的弹性变形能力，在气缸充气时以驱使旋转主体22向上升起时，波纹管514可以被压缩，在气缸泄气时，波纹管514的弹性力还可以释放，以驱使压接部221快速地进行复位。并且，波纹管514还可以用于对气缸511的行程进行限定。
可以理解的是，滑动密封的方式并不局限于波纹管514，也可以是通过设置密封圈等形式的环形密封件来实现。
驱动组件4具体可以是采用电机41，电机41的转轴可以直接与内轴31进行转动连接，此时，电机41的转轴为驱动轴。或者，如图7所示，驱动组件4也可以包括减速器42，以便调整传动比，此时，减速器42的输出轴为驱动轴。驱动组件4可以是通过固定板43安装于支撑台21，这样，在本申请所提供晶圆载台装置中，磁流体轴3、驱动组件4以及升降组件5均是安装于支撑台21，紧凑性可以大幅提高。
驱动轴与内轴31之间的传动连接方式包括但不限于齿轮、链轮和带轮。在图7的实施方式中，驱动轴与内轴31之间采用带轮传动，驱动轴可以安装有主动轮44，内轴31可以安装有从动轮45，主动轮44和从动轮45之间可以外套安装有同步带46。
本申请所提供晶圆载台装置还可以包括旋转接头7，旋转接头7安装于内轴31。通过该旋转接头7可以向内轴31输送氦气、冷却液等。进一步地，该晶圆载台装置还可以包括滑环8，滑环8可以安装于内轴31，用于输送电线、信号线等线缆。
仍如图1所示，并结合图2，壳体组件1还可以包括第一罩壳12和第二罩壳13，第一罩壳12可以密封安装(具体的密封方式可以是设置密封圈、密封垫等)于支撑板11，第一罩壳12与支撑板11可以围合形成第一空间A；第一罩壳12可以设置有第一缺口121，第二罩壳13可以密封安装于第一罩壳12，并能够覆盖第一缺口121；第二罩壳13和第一罩壳12可以围合形成第二空间B，滑环8能够自第一缺口121伸入第二空间B。这样，在需要对滑环8及其附近的零部件进行检修更换时，直接拆除第二罩壳13即可，而无需对第一罩壳12进行拆除，设备的检修维护可以更为便捷。
进一步地，壳体组件1还可以包括第三罩壳14，支撑板11可以设置有第二缺口111，第三罩壳14可以密封安装(具体的密封方式可以是设置密封圈、密封垫等)于支撑板11，并能够覆盖第二缺口111；第三罩壳14和支撑板11可以围合形成第三空间C，驱动组件4可以安装于支撑板11，并可局部伸入第三空间C，结合图7，驱动组件4中具体可以是电机41伸入至第三空间C。
进一步地，还可以包括筒状的公转轴9，公转轴9可以安装于第三罩壳14，第三罩壳14可以设置有第三缺口141，公转轴9的内部空间可以通过该第三缺口141和第三空间C相连通。公转轴9所连接驱动结构的形式在此不作限定。在具体实践中，可以先驱使公转轴9进行转动，以调整载台装置的使用角度；然后再控制升降组件5进行升降，以执行晶圆的装片和压片操作；然后再通过驱动组件4控制支撑台21进行旋转。
结合图2，在真空室10中，壳体组件1隔离出了第一空间A、第二空 间B以及第三空间C，这三个空间均可以通过公转轴与外界相连通，进而可以形成大气环境，载台装置的磁流体轴3、驱动组件4、升降组件5、旋转接头7、滑环8基本均是位于大气环境中，载台装置中只有旋转台组件2是位于真空环境中。
进一步地，还可以包括防尘罩6，防尘罩6可以安装于支撑台21，并与壳体组件1相连，以减少灰尘等落入传力部件222以及磁流体轴3的可能性。防尘罩6的设置将真空环境分隔为第一真空空间D和第二真空空间E。
以上仅是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种晶圆载台装置，其特征在于，包括：
    与大气环境相连通的壳体组件(1)，所述壳体组件(1)包括支撑板(11)；
    旋转台组件(2)，用于支撑晶圆；
    磁流体轴(3)，包括内轴(31)和外轴(32)，所述内轴(31)和外轴(32)之间设置有磁流体(33)，所述外轴(32)密封装配于所述支撑板(11)，所述内轴(31)具有伸入所述壳体组件(1)内的第一端部和伸出所述壳体组件(1)外的第二端部，所述第二端部与所述旋转台组件(2)相连；
    驱动组件(4)，位于所述壳体组件(1)内，所述驱动组件(4)具有驱动轴，所述驱动轴与所述内轴(31)平行设置，且所述驱动轴与所述第一端部传动连接。
  2. 根据权利要求1所述晶圆载台装置，其特征在于，所述旋转台组件(2)包括支撑台(21)和压接部(221)，所述压接部(221)用于将所述晶圆压紧于所述支撑台(21)。
  3. 根据权利要求2所述晶圆载台装置，其特征在于，所述旋转台组件(2)还包括旋转主体(22)，所述旋转主体(22)包括所述压接部(221)、传力部件(222)和导向杆(223)，所述压接部(221)和所述传力部件(222)分别位于所述支撑台(21)的轴向两侧，所述导向杆(223)穿过所述支撑台(21)，且所述导向杆(223)的两端分别与所述压接部(221)、所述传力部件(222)相连。
  4. 根据权利要求3所述晶圆载台装置，其特征在于，所述传力部件(222)包括内固定件(222a)、外固定件(222b)和轴承(222c)，所述外固定件(222b)与所述轴承(222c)的外圈相连，所述内固定件(222a)与所述轴承(222c)的内圈相连；
    所述导向杆(223)和所述升降体(52)中，一者与所述内固定件(222a)相连，另一者与所述外固定件(222b)相连。
  5. 根据权利要求4所述晶圆载台装置，其特征在于，所述内固定件(222a)包括内筒部(222a-1)和第一挡部(222a-2)，所述第一挡部(222a-2)安装于所述内筒部(222a-1)，或者，所述第一挡部(222a-2)与所述内筒 部(222a-1)为一体式结构，所述内圈外套安装于所述内筒部(222a-1)，所述第一挡部(222a-2)用于对所述内圈的轴向一端进行轴向止挡。
  6. 根据权利要求4所述晶圆载台装置，其特征在于，所述外固定件(222b)包括外筒部(222b-1)和第二挡部(222b-2)，所述第二挡部(222b-2)安装于所述外筒部(222b-1)，或者，所述第二挡部(222b-2)与所述外筒部(222b-1)为一体式结构，所述外筒部(222b-1)外套安装于所述外圈，所述第二挡部(222b-2)用于对所述外圈进行轴向止挡。
  7. 根据权利要求5所述晶圆载台装置，其特征在于，所述内固定件(222a)还包括内挡板(222a-3)，所述内挡板(222a-3)固定于所述内筒部(222a-1)，用于对所述内圈的轴向另一端进行轴向止挡。
  8. 根据权利要求3所述晶圆载台装置，其特征在于，所述旋转主体(22)还包括导向套(224)，所述导向套(224)安装于所述支撑台(21)，所述导向杆(223)插接于所述导向套(224)。
  9. 根据权利要求3所述晶圆载台装置，其特征在于，还包括升降组件(5)，所述升降组件(5)包括主体部分(51)和升降体(52)，所述主体部分(51)位于所述壳体组件(1)内，所述升降体(52)与所述支撑板(11)或者所述外轴(32)滑动密封，且所述升降体(52)能够和所述传力部件(222)相作用。
  10. 根据权利要求9所述晶圆载台装置，其特征在于，所述升降体(52)和所述传力部件(222)固定连接。
  11. 根据权利要求9所述晶圆载台装置，其特征在于，所述主体部分(51)包括波纹管(514)，所述波纹管(514)外套安装于所述升降体(52)。
  12. 根据权利要求11所述晶圆载台装置，其特征在于，所述波纹管(514)的轴向两端均设置有安装座。
  13. 根据权利要求9所述晶圆载台装置，其特征在于，所述主体部分(51)还包括气缸和升降板(513)，所述气缸具有活塞杆，所述活塞杆与所述升降板(513)相连，所述升降板(513)安装有若干所述升降体(52)。
  14. 根据权利要求2所述晶圆载台装置，其特征在于，还包括防尘罩(6)，所述防尘罩(6)安装于所述支撑台(21)，并与所述壳体组件(1)相连。
  15. 根据权利要求1-14中任一项所述晶圆载台装置，其特征在于，还 包括旋转接头(7)，所述旋转接头(7)安装于所述内轴(31)。
  16. 根据权利要求1-14中任一项所述晶圆载台装置，其特征在于，还包括滑环(8)，所述滑环(8)安装于所述内轴(31)。
  17. 根据权利要求16所述晶圆载台装置，其特征在于，所述壳体组件(1)还包括第一罩壳(12)，所述第一罩壳(12)密封安装于所述支撑板(11)，并与所述支撑板(11)围合形成第一空间(A)。
  18. 根据权利要求17所述晶圆载台装置，其特征在于，所述壳体组件(1)还包括第二罩壳(13)，所述第一罩壳(12)设置有第一缺口(121)，所述第二罩壳(13)密封安装于第一罩壳(12)，并能够覆盖所述第一缺口(121)，所述第二罩壳(13)和所述第一罩壳(12)围合形成第二空间(B)，所述滑环(8)能够自所述第一缺口(121)伸入所述第二空间(B)。
  19. 根据权利要求1-14中任一项所述晶圆载台装置，其特征在于，所述壳体组件(1)还包括第三罩壳(14)，所述支撑板(11)设置有第二缺口(111)，所述第三罩壳(14)密封安装于所述支撑板(11)，并能够覆盖所述第二缺口(111)，所述第三罩壳(14)和所述支撑板(11)围合形成第三空间(C)，所述驱动组件(4)安装于所述支撑板(11)，并局部伸入所述第三空间(C)。
  20. 根据权利要求19所述晶圆载台装置，其特征在于，还包括筒状的公转轴(9)，所述公转轴(9)安装于所述第三罩壳(14)，并能够和所述第三空间(C)相连通。
PCT/CN2022/139932 2022-04-20 2022-12-19 一种晶圆载台装置 WO2023202118A1 (zh)

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