WO2023202119A1 - 一种晶圆载台装置 - Google Patents

一种晶圆载台装置 Download PDF

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Publication number
WO2023202119A1
WO2023202119A1 PCT/CN2022/139933 CN2022139933W WO2023202119A1 WO 2023202119 A1 WO2023202119 A1 WO 2023202119A1 CN 2022139933 W CN2022139933 W CN 2022139933W WO 2023202119 A1 WO2023202119 A1 WO 2023202119A1
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WIPO (PCT)
Prior art keywords
assembly
wafer stage
stage device
shaft
lifting
Prior art date
Application number
PCT/CN2022/139933
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English (en)
French (fr)
Inventor
桑康
胡冬冬
陈龙保
刘朋飞
王铖熠
程实然
郭颂
许开东
Original Assignee
江苏鲁汶仪器股份有限公司
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Publication of WO2023202119A1 publication Critical patent/WO2023202119A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the technical field of wafer manufacturing, and specifically to a wafer stage device.
  • Ion beam etching and ion beam deposition are two common wafer processing processes.
  • ion beam etching uses ions with a certain energy to bombard the surface of the material to cause material atoms to sputter, thereby achieving the purpose of etching.
  • It is a purely physical process;
  • ion beam deposition uses an ion source to ion the material for deposition.
  • It is a vapor deposition method that deposits a film layer on the surface of the wafer under the action of an electric field. The purpose is to change the surface properties of the workpiece.
  • the ion source is generally in a fixed position, and the processing position is adjusted by rotating the wafer, and the entire processing process is in a vacuum environment.
  • a stage device for supporting the wafer in the prior art which can provide a driving force to meet the movement form required for wafer processing.
  • a lifting component needs to be set up to control the displacement of the crimping part.
  • the lifting components used in existing stage devices are generally dedicated vacuum components. The entire equipment is configured and exposed to a vacuum environment, which is costly and is not conducive to product maintenance.
  • the purpose of this application is to provide a wafer stage device that can be easily assembled and maintained, has a high degree of integration, can be smaller in size, can occupy less space, and is equipped with shielding components that can shield the wafer. Or avoid it.
  • the present application provides a wafer stage device, including: a housing component connected to the atmospheric environment, including a support plate; a rotating stage component including a support platform and a crimping part, the crimping part Used to press the wafer against the support table;
  • the first magnetic fluid shaft includes a first inner shaft and a first outer shaft that are rotatably sealed, and the first outer shaft is sealed and assembled to the support plate, so The first inner shaft has a first end extending into the housing assembly and a second end extending out of the housing assembly, and the second end is connected to the rotary table assembly; a lifting assembly,
  • the lifting assembly includes a main body part and a lifting body, the main body part is located in the housing assembly, the lifting body is slidingly sealed with the support plate or the first outer shaft, and the lifting body can be connected with the
  • the crimping part interacts;
  • the shielding assembly includes a baffle, the baffle is configured to be rotatably assembled to the support plate, so as to rotate to the first
  • the shell component can isolate the external vacuum environment from the internal atmospheric environment.
  • the main part of the lifting component can be assembled entirely within the housing component. In this way, the lifting component only needs to use conventional components, and the cost can be lower.
  • the first magnetic fluid shaft includes a first inner shaft and a first outer shaft that are rotationally sealed.
  • the first outer shaft can be sealed and assembled on the support plate to cooperate with the shell assembly to isolate the internal and external environment;
  • the lifting body can be connected with the
  • the support plate or outer shaft sliding seal can transmit the power of the lifting assembly to the crimping part while isolating the internal and external environment, so as to drive the crimping part relatively close to or away from the support table, thus enabling easy loading and pressing of tablets. .
  • the blocking component can block or avoid the rotating table component.
  • the baffle can be opposite to the rotary table assembly to shield the wafer located on the rotary table assembly, which can effectively block the damage to the wafer by the ion beam and help extend the life of the support table. service life.
  • the baffle Under the sheltered second station, the baffle can be staggered from the rotary table assembly to expose the wafer, so that the wafer can be processed conveniently.
  • the rotary table assembly further includes a rotary body, the rotary body includes the crimping part, the force transmission component and the guide rod, the crimping part and the force transmission component are respectively located on the support table.
  • the guide rod is slidably assembled on the support platform, and the two ends of the guide rod are connected to the crimping part and the force transmission component respectively, and the lifting body can be connected with the Force transmission components interact.
  • the force transmission component is annular.
  • an elastic component is also included, and the elastic component is disposed between the support platform and the force transmission component.
  • the elastic component is a spring
  • the spring jacket is assembled on the guide rod.
  • the support platform is provided with a guide sleeve, and the guide rod is inserted through the guide sleeve.
  • the guide sleeve is embedded in the support platform.
  • the force transmission component is further provided with an ejector pin, the ejector pin and the guide rod are located on the same side of the force transmission component, and the size of the ejector pin is smaller than the guide rod.
  • the lifting assembly further includes an abutment portion, the abutment portion is located outside the housing assembly, and the abutment portion is connected to the lifting body.
  • both the crimping portion and the abutting portion are annular.
  • the main body part includes a bellows, and the bellows outer cover is installed on the lifting body.
  • the main body part further includes a cylinder and a lifting plate, the cylinder has a piston rod, the piston rod is connected to the lifting plate, and a plurality of the lifting bodies are installed on the lifting plate.
  • a first drive assembly is also included, the first drive assembly is located in the housing assembly, the first drive assembly has a first drive shaft, the first drive shaft is connected to the first inner shaft Transmission connection.
  • the first drive shaft and the first inner shaft are arranged in parallel.
  • a second magnetic fluid shaft is also included, the second magnetic fluid shaft includes a second inner shaft and a second outer shaft of a rotary seal, the second outer shaft is sealed and assembled to the support plate, and the third The two inner shafts have a third end extending into the housing assembly and a fourth end extending out of the housing assembly, and the fourth end is connected to the baffle.
  • a second drive assembly is also included, the second drive assembly is located in the housing assembly, the second drive assembly has a second drive shaft, the second drive shaft is connected to the third end portion Transmission connection.
  • the second drive shaft and the second inner shaft are coaxially arranged.
  • a connecting portion is also included, and the fourth end portion is connected to the baffle through the connecting portion.
  • the housing assembly further includes a first cover and a second cover, the first cover is installed on the support plate, and the second cover is installed on the support plate and the third cover. Two covers.
  • a revolving shaft is also included, and the revolving shaft is connected to the second cover.
  • Figure 1 is a schematic structural diagram of a specific implementation of the wafer stage device provided by the present application.
  • Figure 2 is a schematic structural diagram of the lifting assembly
  • Figure 3 is a schematic structural diagram of the rotating body.
  • 5 lifting assembly 51 main part, 511 cylinder, 512 piston rod, 513 lifting plate, 514 bellows, 52 lifting body, 53 top;
  • Magnetic fluid also known as magnetic liquid or ferrofluid, is a colloidal material composed of solid and liquid two phases.
  • the solid phase mainly refers to magnetic solid nanoparticles
  • the liquid phase refers to a liquid that can carry solid magnetic nanoparticles.
  • Magnetic fluid has It has the fluidity, lubrication and sealing properties of the liquid carrier, as well as the strong magnetism and other properties of the solid nanoparticles.
  • Magnetic fluid seal uses permanent magnets to fix the magnetic fluid between the inner shaft and the outer shaft. Since the gap between the inner shaft and the outer shaft is very small and the magnetic field intensity is particularly strong, it can withstand larger forces along the axis. Thrust to achieve sealing effect.
  • the inner shaft, the outer shaft and the magnetic fluid disposed between them can be collectively referred to as the magnetic fluid axis.
  • the lifting components used in existing stage devices are mostly dedicated vacuum components.
  • the entire equipment is configured and exposed to a vacuum environment, which causes high costs and is not conducive to product assembly and maintenance.
  • embodiments of the present application provide a wafer stage device, which isolates the internal space (atmospheric environment) of the housing assembly from the external space (vacuum environment) by providing a housing assembly.
  • the main part of the lifting assembly can be disposed on In the shell assembly, that is to say, the lifting assembly can basically be located in the atmospheric environment. In this way, the lifting assembly only needs to use conventional components, the cost is lower, and the difficulty of assembly and maintenance can be reduced.
  • FIG. 1 is a schematic structural diagram of a specific implementation of the wafer stage device provided by the present application.
  • FIG. 2 is a schematic structural diagram of the lifting component.
  • FIG. 3 is a schematic structural diagram of the rotating body.
  • this application provides a wafer stage device, including: a housing assembly 1, the internal space of the housing assembly 1 is connected with the atmospheric environment, that is to say, the internal space of the housing assembly 1
  • the housing assembly 1 includes a support plate 11
  • the rotating stage assembly 2 includes a support platform 21 and a crimping part 221, where the support platform 21 is used to support the wafer, and the crimping part 221 is used to press the wafer.
  • the pressing portion 221 can be an integrated annular structure, or can include several split bodies distributed in the circumferential direction;
  • the first magnetic fluid axis 3 includes a first
  • the inner shaft 31 and the first outer shaft 32 are provided with magnetic fluid (not shown in the figure) to achieve rotational sealing between the two.
  • the first outer shaft 32 is sealed and assembled (the specific sealing method may be to provide a seal ring, sealing gasket, etc.) on the support plate 11 as a fixed axis.
  • the first inner shaft 31 has a first end extending into the housing assembly 1 and a second end extending out of the housing assembly 1.
  • the lifting assembly 5 includes a main body part 51 and a lifting body 52.
  • the main body part 51 is located in the housing assembly 1.
  • the lifting body 52 is slidingly sealed with the support plate 11 or the first outer shaft 32. To isolate the internal and external environment, and the lifting body 52 can interact with the crimping part 221 to drive the crimping part 221 to move.
  • the housing assembly 1 can isolate the external vacuum environment from the internal atmospheric environment.
  • the main part 51 of the lifting assembly 5 can be integrally assembled in the housing assembly 1.
  • the lifting assembly 5 only needs to use conventional components. , the cost can be lower, and assembly and maintenance can be facilitated;
  • the first magnetic fluid shaft 3 includes a rotationally sealed first inner shaft 31 and a first outer shaft 32, and the first outer shaft 32 can be sealed and assembled on the support plate 11 to match the shell.
  • the body assembly 1 isolates the internal and external environment; the lifting body 52 can be slidably sealed with the support plate 11 or the outer shaft 32, and can transmit the power of the lifting assembly 5 to the crimping part 221 under the condition of isolating the internal and external environment, so as to drive the crimping part 221 to face each other. to be closer to or farther away from the support table 21, so that tablet loading and tablet pressing can be realized conveniently.
  • the first magnetic fluid shaft 3 and the lifting component 5 are both assembled in the housing component 1, so the overall integration level can be higher and the volume can be smaller.
  • the embodiment of the present application does not limit the specific structural form of the lifting component 5.
  • the lifting assembly 5 can use driving elements such as cylinders and hydraulic cylinders that can directly output linear displacement.
  • the aforementioned lifting body 52 can be the piston rod of these driving elements; or the lifting assembly 5 can also use a motor, etc.
  • a displacement conversion mechanism in the form of a gear rack and pinion mechanism, a screw mechanism, etc. is also needed to convert the directly output rotational displacement into the required linear displacement.
  • the aforementioned lifting body 52 can be a rack.
  • the lifting assembly 5 can use a standard cylinder, and the main part 51 can include a cylinder 511 and a lifting plate 513.
  • the cylinder 511 has a piston rod 512, and the piston rod 512 can be telescopic, thereby driving the lifting plate 513 to lift.
  • the aforementioned lifting body 52 can be installed on the lifting plate 513 .
  • the lifting plate 513 is equivalent to a transitional connector, and multiple lifting bodies 52 can be installed on it, so that multi-point driving can be achieved through one cylinder 511. In this way, on the one hand, the number of cylinders 511 used can be reduced. This can save costs and avoid the problem of inconsistent movements caused by using multiple cylinders 511.
  • multi-point driving is also more conducive to ensuring the stability of the lifting and lowering of the crimping part 221.
  • the main body part 51 can also include a bellows 514, one end of the bellows 514 can be connected to the lifting plate 513, and the other end of the bellows 514 can be connected to the support plate 11 (when the lifting body 52 extends from the first outer shaft 32 The other end of the bellows 514 can also be connected to the first outer shaft 32), and the bellows 514 can be mounted on the lifting body 52 to realize the connection between the lifting body 52 and the support plate 11 (or the first outer shaft 32). sealing assembly.
  • the bellows 514 has a certain elastic deformation ability. When the cylinder 511 is inflated to drive the crimping part 221 upward, the bellows 514 can be compressed.
  • the elastic force of the bellows 514 can be released. , to facilitate the quick reset of the crimping part 221.
  • the bellows 514 can also be used to limit the stroke of the cylinder 511.
  • the sliding seal method is not limited to the bellows 514, and can also be implemented by providing an annular seal in the form of a sealing ring or the like.
  • the lifting body 52 may be directly connected to the crimping part 221 , or the lifting body 52 may be indirectly connected to the crimping part 221 through other components, which is specifically related to the structural form of the rotary table assembly 2 .
  • the rotary table assembly 2 may further include a rotating body 22
  • the rotating body 22 may include a crimping part 221 , a force transmission component 222 and a guide rod 223 .
  • the crimping part 221 and the force transmission component 222 can be located on both axial sides of the support platform 21 respectively, and the guide rod 223 is slidably assembled on the support platform 21 , that is to say, the guide rod 223 can slide relative to the support platform 21 .
  • Both ends of the guide rod 223 can be connected to the crimping portion 221 and the force transmission component 222 respectively, so that the rotating body 22 and the support platform 21 can form an integral component, thereby improving the integration level.
  • the lifting body 52 can interact with the force transmission component 222 .
  • the support platform 21 may be provided with a through hole, and the guide rod 223 may be inserted into the through hole to realize sliding of the guide rod 223 relative to the support platform 21 .
  • the rotating body 22 can also include a guide sleeve 224, which can be installed on the support platform 21, specifically on the axial side of the support platform 21 or within the support platform 21; the guide rod 223 can also be plugged into the guide.
  • the guide sleeve 224 is a special guide accessory, which has higher guiding accuracy and is more conducive to ensuring the sliding direction of the guide rod 223. It is a preferred solution in the embodiment of the present application.
  • the crimping part 221 may rely on its own gravity for crimping and fixing the wafer.
  • an elastic member 225 may also be configured, and the elastic member 225 may be provided between the support platform 21 and the force transmission member 222 .
  • the elastic component 225 can be compressed to accumulate elastic force; when the lifting force generated by the lifting component 5 When disappearing, the elastic force accumulated in the elastic component 225 can be released, which can drive the crimping part 221 to quickly reset; and the elastic component 225 can also improve the reliability of the crimping part 221 for wafer crimping and fixing.
  • the embodiment of the present application does not limit the specific structural form of the elastic component 225.
  • the elastic component 225 can be an elastomer made of rubber material with certain elastic properties, or the elastic component 225 can also be a spring, a bellows, etc.
  • the elastic component 225 can be a spring, and the spring can be assembled on the guide rod 223; in this embodiment, the guide rod 223 can also realize the diameter of the spring.
  • Directional positioning can avoid radial movement of the spring during use to a large extent, which can improve the stability of the spring.
  • the force transmission component 222 may also be provided with an ejector pin 226, and the ejector pin 226 and the guide rod 223 may be located on the same side of the force transmission component 222; and the axial dimension of the ejector pin 226 may be smaller than the guide rod 223, so that the guide rod 223 The support height is higher than the ejector pin 226.
  • the guide rod 223 can first drive the crimping part 221 away from the support table 21, and then the ejector pin 226 starts to contact the wafer and drives the wafer away.
  • Support table 21 when the force transmission component 222 is driven to drive the guide rod 223 and the ejection pin 226 to descend, the ejection pin 226 can first place the wafer stably on the support table 21, and then the crimping part 221 will be pressed against the wafer; With such an arrangement, interference problems between the wafer and the crimping part 221 during their operation can be better avoided.
  • the lifting assembly 5 may also include a top 53.
  • the top 53 may be located outside the housing assembly 1, and the top 53 is connected to the lifting body 52.
  • the lifting body 52 may be connected to the transmission through the top 53. Force components 222 act on each other.
  • the structural form of the contact portion 227 is not limited as long as it can interact with the force transmission component 222 .
  • the contact portion 227 can be an integral annular piece; or the contact portion 227 can also be a split structure, and can include several divisions distributed along the circumferential direction, and the number of each division can be the same as the number of the lifting body 52 . The number is consistent, and each branch can be installed on each lifting body 52 in one-to-one correspondence.
  • the contact portion 227 here refers to the top portion 53 .
  • the abutment portion 53 can also limit the stroke of the lifting assembly 5 by contacting the support plate 11 (or the first outer shaft 32 ).
  • the wafer stage device provided in this application may also include a first driving component 4.
  • the first driving component 4 may also be located in the housing component 1, and the first driving component 4 may have a first driving shaft 42,
  • the first driving shaft 42 can be transmission connected with the first inner shaft 31 to drive the first inner shaft 31 to rotate, and can then transmit the rotational driving force to the support table 21 to drive the wafer to rotate.
  • the first driving component 4 is also in the atmospheric environment. In this way, the first driving component 4 only needs to use conventional components, the cost can be lowered, and assembly and maintenance can be facilitated.
  • the transmission connection method between the first drive shaft 42 and the first inner shaft 31 is not limited, as long as the rotational driving force of the first drive shaft 42 can be transmitted to the first inner shaft 31 .
  • the first driving shaft 42 and the first inner shaft 31 may be coaxially arranged, and in this case, they may be connected by means of a coupling or other components.
  • the first driving shaft 42 and the first inner shaft 31 may be parallel to each other.
  • the first driving assembly 4 may be located on one radial side of the first magnetic fluid shaft 3, It is also beneficial to reduce the axial space occupied by the stage device; the transmission connection method between the first drive shaft 42 and the first inner shaft 31 includes but is not limited to gear transmission, sprocket transmission and pulley transmission; with pulley transmission as the For example, with reference to FIG.
  • the first drive shaft 42 can be equipped with a driving wheel 43
  • the first inner shaft 31 can be equipped with a driven wheel 45
  • the synchronous belt 45 can be assembled around the driving wheel 43 and the driven wheel 44 so as to connect the driving wheel 43
  • the driving force is transmitted to the driven wheel 44, and by adjusting the radial dimensions of the driving wheel 43 and the driven wheel 44, the transmission ratio between the first driving shaft 42 and the first inner shaft 31 can also be adjusted.
  • the above-mentioned wafer stage device may further include a shielding assembly 6 , and the shielding assembly 6 may include a baffle 61 configured to be rotatably assembled to the support plate 11 .
  • the baffle 61 has a first station and a second station.
  • the baffle 61 can be opposite to the rotary table assembly 2 to block the wafer located on the rotary table assembly 2, which can effectively block the damage to the wafer by the ion beam and facilitate the extension of the support table. 21 lifespan.
  • the baffle 61 can be staggered from the rotary table assembly 2 to expose the wafer, so that the wafer can be processed conveniently.
  • the action of the baffle 61 can be manually controlled, that is, the operator can manually drive the baffle 61 to rotate and switch between the first station and the second station. In this way, the structure of the equipment can be relatively simple.
  • the wafer stage device provided by the present application may also include: a second magnetic fluid axis 7 , which is similar in structure to the first magnetic fluid axis 3 .
  • the second magnetic fluid axis 7 may include a second inner axis. 71 and the second outer shaft 72, a magnetic fluid is provided between them to achieve rotational sealing.
  • the second outer shaft 72 can be sealed and assembled on the support plate 11 to serve as a fixed axis.
  • the second inner shaft 71 has a structure extending into the housing assembly 1 The third end inside and the fourth end extending out of the housing assembly 1; the fourth end can be connected to the baffle 61, and the two can be directly connected, or a connecting portion can also be provided on the baffle 61 62, the fourth end can be connected to the connecting portion 62; the second driving component 8 can be located in the housing component 1, the second driving component 8 can have a second driving shaft 82, and the second driving shaft 82 can be connected with the third The end portion is driven and connected to drive the baffle 61 to rotate through the third end portion.
  • the second driving component 8 is also arranged in the atmospheric environment, and the second driving component 8 only needs to use conventional components, which can reduce costs and facilitate product assembly and maintenance; the second magnetic fluid axis 7 can The internal and external environments are isolated to transmit the driving force of the second driving component 8 to the shielding component 6 .
  • the embodiment of the present application does not limit the structural form of the second driving component 8.
  • the second driving component 8 can use a motor, a rotary cylinder, etc. as a driving element; taking the rotary cylinder as an example, with reference to Figure 1, the second driving component 8 can include a rotary cylinder 81, which can have a second drive shaft 82, and a second The driving shaft 82 can be transmission connected with the second inner shaft 71.
  • the transmission is realized by setting the coupling 83.
  • the rotary cylinder 81 can realize the reciprocating rotation of the baffle 61 at a set angle.
  • the housing assembly 1 may include a support plate 11 , a first cover 12 and a second cover 13 , and the second cover 13 may be provided with a gap for communicating with the external environment; and , the second cover 13 can also be connected to a revolution shaft (not shown in the figure).
  • the revolution shaft can drive the wafer stage device to rotate as a whole, so as to adjust the support direction of the support table 21 .

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Abstract

一种晶圆载台装置，包括：与大气环境相连通的壳体组件，包括支撑板；旋转台组件，包括支撑台和压接部，压接部用于将晶圆压紧于支撑台；第一磁流体轴，包括转动密封的第一内轴和第一外轴，第一外轴密封装配于支撑板，第一内轴具有伸入壳体组件内的第一端部和伸出壳体组件外的第二端部，第二端部与旋转台组件相连；升降组件，升降组件包括主体部分和升降体，主体部分位于壳体组件内，升降体与支撑板或者第一外轴滑动密封，且升降体能够与压接部相作用；遮挡组件，包括挡板，挡板被配置为可转动地装配于支撑板，以在转动至与旋转台组件相对的第一工位和与旋转台组件相错开的第二工位之间进行切换。

Description

一种晶圆载台装置
本申请要求于2022年04月20日提交中国专利局、申请号为202210415919.1、发明名称为“一种晶圆载台装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及晶圆制造技术领域，具体涉及一种晶圆载台装置。
背景技术
离子束刻蚀和离子束沉积是两种常见的晶圆加工工艺。其中，离子束刻蚀是利用具有一定能量的离子轰击材料表面，使材料原子发生溅射，从而达到刻蚀目的，属于纯物理过程；离子束沉积则是利用离子源将用作沉积的材料离子化，在电场作用下射向晶圆表面沉积成膜层，目的是改变工件表面性能，属气相沉积方法。
在工艺过程中，离子源一般是处于固定位置，然后通过旋转晶圆来调整加工位置，并且整个加工过程均是在真空环境中。为此，现有技术中存在用于支撑晶圆的载台装置，其能够提供驱动力，以满足晶圆加工所需要的运动形式。
在晶圆加工时，存在对于晶圆进行压接的压接部，为了方便压片和取片，需要设置升降组件以去控制压接部进行位移。但是，现有的载台装置所使用升降组件普遍是专用的真空部件，设备整体配置并暴露在真空环境中，成本较高，也不利于产品维护。
发明内容
本申请的目的是提供一种晶圆载台装置，可以方便装配和维护，且具有较高的集成度，体积可以较小，占用空间可以较少，所配置遮挡部件可以实现对于晶圆的遮挡或者避让。
为解决上述技术问题，本申请提供一种晶圆载台装置，包括：与大气 环境相连通的壳体组件，包括支撑板；旋转台组件，包括支撑台和压接部，所述压接部用于将所述晶圆压紧于所述支撑台；第一磁流体轴，包括转动密封的第一内轴和第一外轴，所述第一外轴密封装配于所述支撑板，所述第一内轴具有伸入所述壳体组件内的第一端部和伸出所述壳体组件外的第二端部，所述第二端部与所述旋转台组件相连；升降组件，所述升降组件包括主体部分和升降体，所述主体部分位于所述壳体组件内，所述升降体与所述支撑板或者所述第一外轴滑动密封，且所述升降体能够与所述压接部相作用；遮挡组件，包括挡板，所述挡板被配置为可转动地装配于所述支撑板，以在转动至与所述旋转台组件相对的第一工位和与所述旋转台组件相错开的第二工位之间进行切换。
采用这种方案，壳体组件可以实现外部真空环境与内部大气环境的隔离，升降组件的主体部分可以整体装配在壳体组件内，这样，升降组件只需要采用常规部件即可，成本可以较低，能够方便装配和维护；第一磁流体轴包括转动密封的第一内轴和第一外轴，第一外轴可以密封装配于支撑板，以配合壳体组件隔离内外环境；升降体可以与支撑板或者外轴滑动密封，能够在隔离内外环境的条件下将升降组件的动力传递至压接部，以便驱使压接部相对地靠近或者远离支撑台，进而可以方便地实现装片和压片。
并且，遮挡组件可以实现对于旋转台组件的遮挡或者避让。在遮挡的第一工位下，挡板可以与旋转台组件相对，以对位于旋转台组件的晶圆进行遮挡，能够有效地阻挡离子束流对于晶圆的损坏，并有利于延长支撑台的使用寿命。在避让的第二工位下，挡板可以与旋转台组件相错开，以暴露晶圆，进而可以方便地对晶圆进行加工。
可选地，所述旋转台组件还包括旋转主体，所述旋转主体包括所述压接部、传力部件和导向杆，所述压接部和所述传力部件分别位于所述支撑台的轴向两侧，所述导向杆可滑动地装配于所述支撑台，且所述导向杆的两端分别与所述压接部、所述传力部件相连，所述升降体能够与所述传力部件相作用。
可选地，所述传力部件呈环形。
可选地，还包括弹性部件，所述弹性部件设置在所述支撑台和所述传力部件之间。
可选地，所述弹性部件为弹簧，所述弹簧外套装配于所述导向杆。
可选地，所述支撑台设置有导向套，所述导向杆穿插于所述导向套。
可选地，所述导向套内嵌于所述支撑台。
可选地，所述传力部件还设置有顶针，所述顶针和所述导向杆位于所述传力部件的同一侧，且所述顶针的尺寸小于所述导向杆。
可选地，所述升降组件还包括抵顶部，所述抵顶部位于所述壳体组件的外侧，且所述抵顶部与所述升降体相连。
可选地，所述压接部和所述抵接部均为环形。
可选地，所述主体部分包括波纹管，所述波纹管外套安装于所述升降体。
可选地，所述主体部分还包括气缸和升降板，所述气缸具有活塞杆，所述活塞杆与所述升降板相连，所述升降板安装有若干所述升降体。
可选地，还包括第一驱动组件，所述第一驱动组件位于所述壳体组件内，所述第一驱动组件具有第一驱动轴，所述第一驱动轴与所述第一内轴传动连接。
可选地，所述第一驱动轴和所述第一内轴平行设置。
可选地，还包括第二磁流体轴，所述第二磁流体轴包括转动密封的第二内轴和第二外轴，所述第二外轴密封装配于所述支撑板，所述第二内轴具有伸入所述壳体组件内的第三端部和伸出所述壳体组件外的第四端部，所述第四端部和所述挡板相连。
可选地，还包括第二驱动组件，所述第二驱动组件位于所述壳体组件内，所述第二驱动组件具有第二驱动轴，所述第二驱动轴与所述第三端部传动连接。
可选地，所述第二驱动轴和所述第二内轴同轴设置。
可选地，还包括连接部，所述第四端部通过所述连接部和所述挡板相连。
可选地，所述壳体组件还包括第一罩壳和第二罩壳，所述第一罩壳安装于所述支撑板，所述第二罩壳安装于所述支撑板和所述第二罩壳。
可选地，还包括公转轴，所述公转轴和所述第二罩壳相连。
附图说明
图1为本申请所提供晶圆载台装置的一种具体实施方式的结构示意图；
图2为升降组件的结构示意图；
图3为旋转主体的结构示意图。
图1-图3中的附图标记说明如下：
1壳体组件、11支撑板、12第一罩壳、13第二罩壳；
2旋转台组件、21支撑台、22旋转主体、221压接部、222传力部件、223导向杆、224导向套、225弹性部件、226顶针；
3第一磁流体轴、31第一内轴、32第一外轴；
4第一驱动组件、41电机、42第一驱动轴、43主动轮、44从动轮、45同步带；
5升降组件、51主体部分、511气缸、512活塞杆、513升降板、514波纹管、52升降体、53抵顶部；
6遮挡组件、61挡板、62连接部；
7第二磁流体轴、71第二内轴、72第二外轴；
8第二驱动组件、81回转气缸、82第二驱动轴、83联轴器。
具体实施方式
为了使本领域的技术人员更好地理解本申请的技术方案，下面结合附图和具体实施例对本申请作进一步的详细说明。
本文中所述“若干”是指数量不确定的多个，通常为两个以上；且当采用“若干”表示某几个部件的数量时，并不表示这些部件在数量上的相互关系。
本文中所述“第一”、“第二”等词，仅是为了便于描述结构和/或功能相同或者相类似的两个以上的结构或者部件，并不表示对于顺序和/或重要性的某种特殊限定。
磁流体又称为磁性液体或铁磁流体，其是一种固液两相组成的胶体材 料，固相主要指磁性固体纳米颗粒，液相是指能够承载固体磁性纳米颗粒的液体，磁流体具有液态载体的流动性、润滑性、密封性，同时具有固体纳米颗粒的强磁性及其它特性。
磁流体密封就是用永久磁铁将磁流体固定在内轴和外轴之间，由于内轴和外轴之间的空隙很小，且其磁场强度特别大，从而能承受较大的沿轴线方向的推力，以达到密封的效果。内轴、外轴以及设置在二者之间的磁流体可以合称为磁流体轴。
如背景技术部分所述，现有载台装置所使用升降组件多为专用真空部件，设备整体配置并暴露在真空环境中，成本较高，不利于产品的装配和维护。
为此，本申请实施例提供一种晶圆载台装置，其通过设置壳体组件将壳体组件内部空间(大气环境)和外部空间(真空环境)相隔离，升降组件的主体部分可以设置在壳体组件内，也就是说，升降组件基本可以全部位于大气环境下，这样，升降组件只需要采用常规部件即可，成本较低，装配以及维护难度均可以降低。
具体请参照图1-图3，图1为本申请所提供晶圆载台装置的一种具体实施方式的结构示意图，图2为升降组件的结构示意图，图3为旋转主体的结构示意图。
如图1所示，本申请提供一种晶圆载台装置，包括：壳体组件1，该壳体组件1的内部空间与大气环境相连通，也就是说，该壳体组件1的内部空间为大气环境，壳体组件1包括支撑板11；旋转台组件2，包括支撑台21和压接部221，其中，支撑台21用于对晶圆进行支撑，压接部221用于将晶圆压紧于支撑台21，以保证晶圆固定的可靠性，压接部221可以为一体式的环形结构，也可以包括在周向上分布的若干分体；第一磁流体轴3，包括第一内轴31和第一外轴32，二者之间设置有磁流体(图中未示出)用于实现二者的转动密封，第一外轴32密封装配(具体的密封方式可以是设置密封圈、密封垫等)于支撑板11，以作为定轴，第一内轴31具有伸入壳体组件1内的第一端部和伸出壳体组件1外的第二端部，第二端部与旋转台组件2相连；升降组件5，升降组件5包括主体部分51和升降体52，主体部分51位于壳体组件1内，升降体52与支撑板11或者第一 外轴32滑动密封，以隔离内外环境，且升降体52能够与压接部221相作用，以便驱使压接部221进行动作。
采用这种方案，壳体组件1可以实现外部真空环境与内部大气环境的隔离，升降组件5的主体部分51可以整体装配在壳体组件1内，这样，升降组件5只需要采用常规部件即可，成本可以较低，能够方便装配和维护；第一磁流体轴3包括转动密封的第一内轴31和第一外轴32，第一外轴32可以密封装配于支撑板11，以配合壳体组件1隔离内外环境；升降体52可以与支撑板11或者外轴32滑动密封，能够在隔离内外环境的条件下将升降组件5的动力传递至压接部221，以便驱使压接部221相对地靠近或者远离支撑台21，进而可以方便地实现装片和压片。
上述的方案中，第一磁流体轴3、升降组件5均是装配于壳体组件1，整体的集成度可以较高，体积可以较小。
这里，本申请实施例并不限定升降组件5的具体结构形式，在实际应用中，本领域技术人员可以根据需要进行选择。例如，该升降组件5可以采用气缸、液压油缸等能够直接输出直线位移的驱动元件，此时，前述的升降体52可以为这些驱动元件的活塞杆；或者，该升降组件5也可以采用电机等能够直接输出旋转位移的驱动元件，此时，还需要搭配齿轮齿条机构、丝杠机构等形式的位移转换机构，以将直接输出的旋转位移转换为所需要的直线位移，以采用齿轮齿条机构作为示例，前述的升降体52则可以为齿条。
在图2的实施方式中，升降组件5可以采用标准气缸，主体部分51可以包括气缸511和升降板513，气缸511具有活塞杆512，活塞杆512能够进行伸缩，从而带动升降板513进行升降，前述的升降体52可以安装于升降板513。采用这种结构，升降板513相当于过渡连接件，其上可以安装有多根升降体52，进而可以通过一个气缸511来实现多点驱动，如此，一方面，可以减少气缸511的使用数量，以节约成本，并可避免使用多个气缸511时所造成的动作不一致的问题，另一方面，多点驱动也更有利于保证压接部221升降的稳定性。
需要指出的是，通过升降板513进行过渡连接以实现一个气缸511产生多个驱动点的方案仅是本申请实施例的一种优选方案，但并不表示在具 体实践中就只能使用一个气缸511，实际上，气缸511的数量也可以是多个，以便产生更大的驱动力。
进一步地，主体部分51还可以包括波纹管514，波纹管514的一端可以与升降板513相连，波纹管514的另一端可以与支撑板11相连(在升降体52自第一外轴32伸出时，波纹管514的另一端也可以是与第一外轴32相连)，且波纹管514可以外套安装于升降体52，用于实现升降体52与支撑板11(或者第一外轴32)的密封装配。同时，波纹管514具有一定的弹性变形能力，在气缸511充气时以驱使压接部221向上升起时，波纹管514可以被压缩，在气缸511泄气时，波纹管514的弹性力还可以释放，以利于压接部221的快速复位。并且，波纹管514还可以用于对气缸511的行程进行限定。
可以理解的是，滑动密封的方式并不局限于波纹管514，也可以是通过设置密封圈等形式的环形密封件来实现。
升降体52可以直接与压接部221相连，或者，升降体52也可以是通过其他部件间接地与压接部221相连，这具体与旋转台组件2的结构形式存在关联。
在附图的实施方式中，如图1和图3所示，旋转台组件2还可以包括旋转主体22，旋转主体22可以包括压接部221、传力部件222和导向杆223。压接部221和传力部件222可以分别位于支撑台21的轴向两侧，导向杆223可滑动地装配于支撑台21，也就是说，导向杆223可以相对支撑台21进行滑动。导向杆223的两端可以分别与压接部221、传力部件222相连，以使得旋转主体22与支撑台21可以构成一个整体部件，进而可以提高集成度。升降体52能够与传力部件222相作用。
支撑台21可以设置有过孔，导向杆223可以穿插在过孔中，用于实现导向杆223相对支撑台21的滑动。或者，旋转主体22还可以包括导向套224，导向套224可以安装于支撑台21，具体可以是安装于支撑台21的轴向一侧或者支撑台21内；导向杆223还可以插接于导向套224；导向套224为专用导向配件，导向精度更高，更有利于保证导向杆223的滑动方向，为本申请实施例的一种优选方案。
压接部221对于晶圆的压接固定可以是依靠自身的重力。
或者，还可以配置有弹性部件225，弹性部件225可以设置在支撑台21和传力部件222之间。这样，当升降组件5对传力部件222产生顶升力，以驱使压接部221相对地远离支撑台21时，弹性部件225可以被压缩，以蓄积弹性力；当升降组件5所产生的顶升力消失时，弹性部件225所蓄积的弹性力可以释放，能够驱使压接部221进行快速复位；并且，弹性部件225还可以提高压接部221对于晶圆压接固定的可靠性。
这里，本申请实施例并不限定弹性部件225的具体结构形式，在实际应用中，本领域技术人员可以根据实际需要进行设置，只要能够满足使用的要求即可。举例说明，该弹性部件225可以为具有一定弹性性能的橡胶材料制备的弹性体，或者，该弹性部件225还可以为弹簧、波纹管等。在附图的实施方式中，如图1和图3所示，该弹性部件225可以为弹簧，弹簧可以外套装配于导向杆223；这种实施方式下，导向杆223还可以实现对于弹簧的径向定位，以较大程度地避免弹簧在使用过程中的径向窜动，能够提高弹簧的稳定性。
进一步地，传力部件222还可以设置有顶针226，顶针226和导向杆223可以位于传力部件222的同一侧；并且，顶针226的轴向尺寸可以小于导向杆223，这样，导向杆223的支撑高度高于顶针226。
在传力部件222受驱带动导向杆223和顶针226进行顶升时，导向杆223可以先带动压接部221远离支撑台21，然后顶针226才开始与晶圆相接触、并驱使晶圆远离支撑台21；在传力部件222受驱带动导向杆223和顶针226进行下降时，顶针226可以先将晶圆稳定地放置于支撑台21，然后压接部221才会压紧于晶圆；如此设置，可以较好地避免晶圆和压接部221动作过程中的干涉问题。
请继续参考图1，升降组件5还可以包括抵顶部53，抵顶部53可以位于壳体组件1的外侧，且抵顶部53与升降体52相连；升降体52具体可以是通过抵顶部53与传力部件222相作用。
抵接部227的结构形式可以不作限定，只要其能够与传力部件222相作用即可。例如，抵接部227可以为一体式的环形件；或者，抵接部227也可以为分体式结构，并可以包括沿周向分布的若干分部，各分部的数量可以与升降体52的数量相一致，且各分部可以一一对应地安装于各升降体 52。这里的抵接部227即是指抵顶部53。
抵顶部53除了可以与传力部件222相作用外，其也可以通过与支撑板11(或者第一外轴32)的抵接来限制升降组件5的行程。
进一步地，本申请所提供晶圆载台装置还可以包括第一驱动组件4，第一驱动组件4也可以位于壳体组件1内，并且，第一驱动组件4可以具有第一驱动轴42，第一驱动轴42可以与第一内轴31传动连接，用于驱使第一内轴31进行转动，进而可以将旋转驱动力传递至支撑台21，以带动晶圆进行旋转。采用这种方案，第一驱动组件4也是在大气环境中，这样，第一驱动组件4只需要采用常规部件即可，成本也可以较低，并可以方便装配和维护。
第一驱动轴42和第一内轴31的传动连接方式可以不作限定，只要能够将第一驱动轴42的旋转驱动力传递至第一内轴31即可。在一些实施方式中，第一驱动轴42和第一内轴31可以同轴设置，此时，二者之间可以借助联轴器等部件进行连接。在另一些实施方式中，如图1所示，第一驱动轴42和第一内轴31可以相互平行，此时，第一驱动组件4可以位于第一磁流体轴3的径向一侧，还有利于缩减载台装置的轴向占用空间；第一驱动轴42和第一内轴31之间的传动连接方式包括但不限于齿轮传动、链轮传动和带轮传动；以带轮传动为例，结合图1，第一驱动轴42可以安装有主动轮43，第一内轴31可以安装有从动轮45，同步带45可以外套装配于主动轮43和从动轮44，以便将主动轮43的驱动力传递至从动轮44，并且，通过调整主动轮43和从动轮44的径向尺寸，还可以调整第一驱动轴42和第一内轴31之间的传动比。
进一步地，上述晶圆载台装置还可以包括遮挡组件6，遮挡组件6可以包括挡板61，挡板61被配置为可转动地装配于支撑板11。
挡板61具有第一工位和第二工位。在第一工位下，挡板61可以与旋转台组件2相对，以对位于旋转台组件2的晶圆进行遮挡，能够有效地阻挡离子束流对于晶圆的损坏，并有利于延长支撑台21的使用寿命。在第二工位下，挡板61可以与旋转台组件2相错开，以暴露晶圆，进而可以方便地对晶圆进行加工。
挡板61的动作可以是依靠手动控制，即可以由操作人员手动驱使挡板 61在第一工位和第二工位之间进行旋转切换，这样，设备的结构形式可以相对简单。
或者，也可以设置专用的驱动结构，以自动地驱使挡板61在第一工位和第二工位之间进行旋转切换，这样，设备的自动化程度可以较高。这种实施方式下，本申请所提供晶圆载台装置还可以包括：第二磁流体轴7，与第一磁流体轴3的结构相类似，第二磁流体轴7可以包括第二内轴71和第二外轴72，二者之间通过设置磁流体实现转动密封，第二外轴72可以密封装配于支撑板11，以作为定轴，第二内轴71具有伸入壳体组件1内的第三端部和伸出壳体组件1外的第四端部；第四端部可以和挡板61相连，二者之间可以为直接相连，或者，也可以在挡板61设置连接部62，第四端部可以与该连接部62相连；第二驱动组件8，可以位于壳体组件1内，第二驱动组件8可以具有第二驱动轴82，第二驱动轴82可以与第三端部传动连接，以通过第三端部来带动挡板61进行旋转。
采用这种方案，第二驱动组件8也是设置在大气环境中，第二驱动组件8也只需要采用常规部件，进而可以降低成本，并利于产品的装配和维护；第二磁流体轴7则可以隔离内外环境，以将第二驱动组件8的驱动力传递至遮挡组件6。
这里，本申请实施例并不限定第二驱动组件8的结构形式，具体实践中，本领域技术人员可以根据实际需要进行设置，只要能够满足使用的要求即可。例如，第二驱动组件8可以采用电机、回转气缸等作为驱动元件；以回转气缸为例，结合图1，第二驱动组件8可以包括回转气缸81，其可以具有第二驱动轴82，第二驱动轴82可以与第二内轴71传动连接，具体的传动连接方式可以参照前述第一驱动轴42和第一内轴31处的描述，附图中具体是通过设置联轴器83来实现传动，回转气缸81可以实现挡板61在设定角度的往复转动。
同样地，本申请实施例也不限定壳体组件1的结构形式，只要能够实现相应的技术效果即可。在图1所示出的实施方式中，壳体组件1可以包括支撑板11、第一罩壳12和第二罩壳13，第二罩壳13可以设置有缺口，用于连通外部环境；并且，第二罩壳13还可以连接有公转轴(图中未示出)，在具体应用中，可以通过公转轴带动晶圆载台装置进行整体旋转，以便调 整支撑台21的支撑方向。
以上仅是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种晶圆载台装置，其特征在于，包括：
    与大气环境相连通的壳体组件(1)，包括支撑板(11)；
    旋转台组件(2)，包括支撑台(21)和压接部(221)，所述压接部(221)用于将所述晶圆压紧于所述支撑台(21)；
    第一磁流体轴(3)，包括转动密封的第一内轴(31)和第一外轴(32)，所述第一外轴(32)密封装配于所述支撑板(11)，所述第一内轴(31)具有伸入所述壳体组件(1)内的第一端部和伸出所述壳体组件(1)外的第二端部，所述第二端部与所述旋转台组件(2)相连；
    升降组件(5)，所述升降组件(5)包括主体部分(51)和升降体(52)，所述主体部分(51)位于所述壳体组件(1)内，所述升降体(52)与所述支撑板(11)或者所述第一外轴(32)滑动密封，且所述升降体(52)能够与所述压接部(221)相作用；
    遮挡组件(6)，包括挡板(61)，所述挡板(61)被配置为可转动地装配于所述支撑板(11)，以在转动至与所述旋转台组件(2)相对的第一工位和与所述旋转台组件(2)相错开的第二工位之间进行切换。
  2. 根据权利要求1所述晶圆载台装置，其特征在于，所述旋转台组件(2)还包括旋转主体(22)，所述旋转主体(22)包括所述压接部(221)、传力部件(222)和导向杆(223)，所述压接部(221)和所述传力部件(222)分别位于所述支撑台(21)的轴向两侧，所述导向杆(223)可滑动地装配于所述支撑台(21)，且所述导向杆(223)的两端分别与所述压接部(221)、所述传力部件(222)相连，所述升降体(52)能够与所述传力部件(222)相作用。
  3. 根据权利要求2所述晶圆载台装置，其特征在于，所述传力部件(222)呈环形。
  4. 根据权利要求2所述晶圆载台装置，其特征在于，还包括弹性部件(225)，所述弹性部件(225)设置在所述支撑台(21)和所述传力部件(222)之间。
  5. 根据权利要求4所述晶圆载台装置，其特征在于，所述弹性部件(225) 为弹簧，所述弹簧外套装配于所述导向杆(223)。
  6. 根据权利要求2所述晶圆载台装置，其特征在于，所述支撑台(21)设置有导向套(224)，所述导向杆(223)穿插于所述导向套(224)。
  7. 根据权利要求6所述晶圆载台装置，其特征在于，所述导向套(224)内嵌于所述支撑台(21)。
  8. 根据权利要求2所述晶圆载台装置，其特征在于，所述传力部件(222)还设置有顶针(226)，所述顶针(226)和所述导向杆(223)位于所述传力部件(222)的同一侧，且所述顶针(226)的尺寸小于所述导向杆(223)。
  9. 根据权利要求2所述晶圆载台装置，其特征在于，所述升降组件(5)还包括抵顶部(53)，所述抵顶部(53)位于所述壳体组件(1)的外侧，且所述抵顶部(53)与所述升降体(52)相连。
  10. 根据权利要求9所述晶圆载台装置，其特征在于，所述压接部(221)和所述抵接部(53)均为环形。
  11. 根据权利要求1-10中任一项所述晶圆载台装置，其特征在于，所述主体部分(51)包括波纹管(514)，所述波纹管(514)外套安装于所述升降体(52)。
  12. 根据权利要求1-10中任一项所述晶圆载台装置，其特征在于，所述主体部分(51)还包括气缸(511)和升降板(513)，所述气缸(511)具有活塞杆(512)，所述活塞杆(512)与所述升降板(513)相连，所述升降板(513)安装有若干所述升降体(52)。
  13. 根据权利要求1-10中任一项所述晶圆载台装置，其特征在于，还包括第一驱动组件(4)，所述第一驱动组件(4)位于所述壳体组件(1)内，所述第一驱动组件(4)具有第一驱动轴(42)，所述第一驱动轴(42)与所述第一内轴(31)传动连接。
  14. 根据权利要求13所述晶圆载台装置，其特征在于，所述第一驱动轴(42)和所述第一内轴(31)平行设置。
  15. 根据权利要求1-10中任一项所述晶圆载台装置，其特征在于，还包括第二磁流体轴(7)，所述第二磁流体轴包括转动密封的第二内轴(71)和第二外轴(72)，所述第二外轴(72)密封装配于所述支撑板(11)，所述第二内轴(71)具有伸入所述壳体组件(1)内的第三端部和伸出所述壳 体组件(1)外的第四端部，所述第四端部和所述挡板(61)相连。
  16. 根据权利要求15所述晶圆载台装置，其特征在于，还包括第二驱动组件(8)，所述第二驱动组件(8)位于所述壳体组件(1)内，所述第二驱动组件(8)具有第二驱动轴(82)，所述第二驱动轴(82)与所述第三端部传动连接。
  17. 根据权利要求16所述晶圆载台装置，其特征在于，所述第二驱动轴(82)和所述第二内轴(71)同轴设置。
  18. 根据权利要求16所述晶圆载台装置，其特征在于，还包括连接部(62)，所述第四端部通过所述连接部(62)和所述挡板(61)相连。
  19. 根据权利要求1-10中任一项所述晶圆载台装置，其特征在于，所述壳体组件(1)还包括第一罩壳(12)和第二罩壳(13)，所述第一罩壳(12)安装于所述支撑板(11)，所述第二罩壳(13)安装于所述支撑板(11)和所述第二罩壳(13)。
  20. 根据权利要求19所述晶圆载台装置，其特征在于，还包括公转轴，所述公转轴和所述第二罩壳(13)相连。
PCT/CN2022/139933 2022-04-20 2022-12-19 一种晶圆载台装置 WO2023202119A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117286570A (zh) * 2023-11-24 2023-12-26 浙江求是创芯半导体设备有限公司 一种外延设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160225656A1 (en) * 2015-02-03 2016-08-04 Applied Materials, Inc. Wafer processing system with chuck assembly maintenance module
CN109950121A (zh) * 2019-04-15 2019-06-28 江苏鲁汶仪器有限公司 一种通电离子源挡板
CN112845289A (zh) * 2020-12-30 2021-05-28 大族激光科技产业集团股份有限公司 一种晶圆自动加工装置
CN114156196A (zh) * 2020-09-07 2022-03-08 江苏鲁汶仪器有限公司 一种离子束刻蚀机及其升降旋转台装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160225656A1 (en) * 2015-02-03 2016-08-04 Applied Materials, Inc. Wafer processing system with chuck assembly maintenance module
CN109950121A (zh) * 2019-04-15 2019-06-28 江苏鲁汶仪器有限公司 一种通电离子源挡板
CN114156196A (zh) * 2020-09-07 2022-03-08 江苏鲁汶仪器有限公司 一种离子束刻蚀机及其升降旋转台装置
CN112845289A (zh) * 2020-12-30 2021-05-28 大族激光科技产业集团股份有限公司 一种晶圆自动加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117286570A (zh) * 2023-11-24 2023-12-26 浙江求是创芯半导体设备有限公司 一种外延设备
CN117286570B (zh) * 2023-11-24 2024-02-20 浙江求是创芯半导体设备有限公司 一种外延设备

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